Laser processing device

Abstract

A laser processing apparatus is provided. In order to suppress interference between a member for supporting a housing and a workpiece while the housing and the workpiece are brought close to each other, the laser processing apparatus includes a laser scanning section that deflects a laser to be emitted toward an irradiation region in accordance with a predetermined processing setting, and a housing that accommodates the laser scanning section. In the housing, an exit window that transmits the laser emitted toward the irradiation region via the laser scanning section is formed, and a top surface that is arranged to face the exit window and is attached to an attachment target position is formed.

Description

[0001] This application is a divisional application of the patent application filed on November 10, 2022, with application number 202211404947.X and the invention title "Laser Processing Apparatus". Technical Field

[0002] The technology disclosed in this article relates to a laser processing apparatus. Background Technology

[0003] JP 2019-104047 A discloses an example of a laser processing apparatus.

[0004] Specifically, the laser processing equipment according to JP 2019-104047 A includes: a laser deflection unit (laser scanning unit) that deflects the laser; a housing that houses the laser deflection unit; and an exit window that is formed on the lower surface of the housing and transmits the laser deflected by the laser deflection unit.

[0005] Incidentally, in laser processing equipment disclosed in JP 2019-104047 A, there is a situation where the distance from the exit window to the workpiece (workpiece distance) is set as an indicator, which indicates the installation situation in which the preferred processing result is obtained.

[0006] Furthermore, in cases where an exit window is formed on the lower surface of the housing, as in the laser processing equipment according to JP 2019-104047 A, it is conventionally known to adjust the height position of the exit window by supporting the lower surface of the housing from below with a predetermined member for supporting the housing (hereinafter referred to as "support member") and adjusting the height of the support member in order to achieve the workpiece distance.

[0007] On the other hand, it is conceivable to position the workpiece, corresponding to the distance between the workpiece and the laser processing apparatus, closer to the lower surface of the housing in the height direction, in order to reduce the installation space of the laser processing apparatus. However, when the workpiece is positioned close to the lower surface of the housing, there is an interference problem between the support members and the workpiece. Summary of the Invention

[0008] The technology disclosed herein is made in view of this purpose, and its aim is to suppress interference between the components used to support the housing and the workpiece while bringing the housing and the workpiece close to each other.

[0009] According to one embodiment of this disclosure, a laser processing apparatus is provided, which is attached to an attachment target location and irradiates an irradiation area with a laser to process a workpiece. The laser processing apparatus includes: a laser deflector that deflects the laser beam toward the irradiation area according to a predetermined processing setting; and a housing that houses the laser deflector.

[0010] Furthermore, according to one embodiment of the present disclosure, an exit window for transmitting laser light emitted toward the irradiation area via a laser deflector is formed in the housing, and an attachment surface is arranged to face the exit window and attached to the attachment target location.

[0011] According to one embodiment, in the housing according to that embodiment, the attachment surface is formed on the opposite side of the exit window. Since the housing is constructed such that not an outer surface on which the exit window is formed, but rather its attachment surface facing the opposite side, is attached to the attachment target location, the housing can be supported for suspension from the attachment target location. This eliminates the need to insert a support member between the housing and the workpiece, thereby allowing the housing and the workpiece to be brought close to each other.

[0012] At this point, the component used to support the housing (the support component) is located on the opposite side of the exit window, similar to the attachment target position, thus allowing for sufficient separation from the workpiece. This enables the support component to suppress interference with the workpiece while bringing the housing and workpiece closer together.

[0013] In another embodiment of this disclosure, the housing may accommodate: a solid-state laser crystal that generates laser light based on excitation light; and a support plate that extends along a direction from the attachment surface toward the exit window and supports the solid-state laser crystal, and the support plate may be attached to the housing without being integral with the attachment surface.

[0014] According to the other embodiment, the effects of twisting, vibration, etc., generated on the attachment surface at the attachment target location on the solid-state laser crystal can be suppressed. Therefore, laser generation can be advantageously achieved even when the housing is configured to support the attachment target location.

[0015] In another embodiment of this disclosure, the attachment surface may be provided with an attachment portion capable of attaching the attachment surface to the attachment target location.

[0016] According to yet another embodiment, since the support member located at the attachment target position and the attachment surface of the housing are connected to each other via an attachment portion rather than directly, the housing can be attached to the support member, which can take various forms, without requiring the design of the housing's own structure. This is advantageous in facilitating the replacement of various processing devices with the laser processing apparatus according to this disclosure in production lines assuming the use of various processing devices.

[0017] In another embodiment of this disclosure, the housing may include: an exiting surface on which an exiting window is formed; and an open surface that surrounds the laser deflection portion together with the attachment surface and the exiting surface, and is at least partially open to communicate with the exiting window, and the open surface may be provided with a cover member capable of opening and closing the open surface.

[0018] According to yet another embodiment, the open surface (rather than the exit surface facing the workpiece and the attachment surface attached to the attachment target location) is configured to be openable and closable, allowing access to the exit window without causing interference with the workpiece, support members, etc. Therefore, the maintainability of the laser processing apparatus can be improved.

[0019] In another embodiment of this disclosure, the housing may include a connecting surface facing the opposite side of the open surface and surrounding the laser deflection portion together with the open surface, the attachment surface and the emission surface, and a cable for supplying power to the housing may be connected to the connecting surface.

[0020] According to yet another embodiment, the open surface of the cover member and the connecting surface to which the cable is connected are located on opposite sides. Interference between the cover member and the cable is suppressed when the cover member is opened, closed, attached, or removed. Therefore, the maintainability of the laser processing apparatus can be improved.

[0021] In another embodiment of this disclosure, the workpiece can be conveyed along a predetermined conveying direction, the irradiation area can have a constant size in the conveying direction, and the laser spot diameter on the workpiece can be set such that the focal depth of the laser corresponds to the longest part of the laser optical path length in the irradiation area and the shortest part of the laser optical path length in the irradiation area.

[0022] In another embodiment of this disclosure, the path corresponding to the irradiation area in the movement path of the workpiece may include portions having different distances from the exit window.

[0023] In another embodiment of this disclosure, the workpiece can be conveyed along a predetermined conveying direction, the size of the irradiation area in the conveying direction can be 120 mm or more, the laser deflection part can include a first mirror to deflect the laser to irradiate the irradiation area, the first mirror can be arranged to extend out of the projection window and face the workpiece, the relative position of the workpiece with respect to the housing can be set such that the distance from the first mirror to the workpiece is 150 mm or less, and the laser spot diameter on the workpiece at the relative position can be 60 μm or more.

[0024] Typically, the difference in optical path length between the central portion and the ends of the irradiated area increases with the size of the irradiated area. In this case, in order to adopt a structure that allows for the difference in optical path length without providing a separate mechanism for adjusting the laser focus, a laser with a predetermined focal depth or greater is required.

[0025] Based on findings obtained from in-depth research by the inventors of this application, in the layout provided as described in yet another embodiment, sufficient depth of focus can be ensured by setting the laser spot diameter on the workpiece to 60 μm or larger.

[0026] In another embodiment of this disclosure, a laser processing apparatus is provided, which is supported by a support member and emits a laser toward an irradiation area configured according to a printing area to process a workpiece. The support member is connectable to a connecting surface in a generally cuboid printing apparatus, which includes a printing surface and a connecting surface different from the printing surface, with a printing portion exposed on the printing surface that contacts the printing area on the workpiece. The laser processing apparatus includes: a laser deflector that deflects the laser toward the irradiation area according to a predetermined processing configuration; and a housing that houses the laser deflector.

[0027] Furthermore, according to yet another embodiment of the present disclosure, an exit window for transmitting laser light emitted toward the irradiation area via a laser deflector and an attachment surface connected to a support member are formed in the housing.

[0028] According to yet another embodiment, in the housing according to yet another embodiment, an exit window corresponding to the printing section in the generally rectangular parallelepiped printing apparatus and an attachment surface corresponding to the connecting surface in the printing apparatus are formed. Here, a support member is configured to connect to the attachment surface, such that the housing can be supported by the support member from the side or above. Therefore, compared to a configuration that supports the housing from below, the housing and the workpiece can be brought closer together.

[0029] At this point, the support member is located on the side or above the housing to support the housing, thereby allowing for sufficient separation from the workpiece. This enables the support member to suppress interference with the workpiece while bringing the housing and workpiece closer together.

[0030] In another embodiment of this disclosure, the workpiece may be a workpiece conveyed in a state of being placed around a conveyor roller, and the conveyor roller may be arranged to overlap with the irradiation area.

[0031] In another embodiment of this disclosure, the workpiece can be conveyed along a predetermined conveying direction, the size of the irradiation area in the conveying direction can be 120 mm or larger, the output of the laser through the exit window can be set to 2 W or smaller, and the laser spot diameter on the irradiation area can be set to 60 μm or larger.

[0032] Based on findings obtained from in-depth research by the inventors of this application, it is possible to reduce the size of the housing while ensuring sufficient depth of focus by adopting the construction of yet another embodiment.

[0033] As described above, according to this disclosure, interference between the components used to support the housing and the workpiece can be suppressed while bringing the housing and the workpiece close to each other. Attached Figure Description

[0034] Figure 1 This is a diagram illustrating the overall structure of a laser processing system;

[0035] Figure 2 This is a block diagram illustrating the schematic structure of a laser processing device;

[0036] Figure 3A This is a three-dimensional view illustrating the appearance of the marking machine head;

[0037] Figure 3B This is a three-dimensional view illustrating the appearance of the marking machine head;

[0038] Figure 4 This is a side view of the marking machine head;

[0039] Figure 5 This is a perspective view illustrating the state of removing the cover component from the marking head;

[0040] Figure 6 This is a rear view of the marking machine head;

[0041] Figure 7 This is a diagram illustrating the cable connection structure in the marking head;

[0042] Figure 8 This is a three-dimensional diagram illustrating the housing structure of the marking head;

[0043] Figure 9 This is a three-dimensional diagram illustrating the housing structure of the marking head;

[0044] Figure 10 It is a schematic cross-sectional view illustrating the internal structure of the marking machine head;

[0045] Figure 11 This is a schematic longitudinal sectional view illustrating the internal structure of the marking machine head;

[0046] Figure 12 This is a schematic side view illustrating the main parts of the plate housing;

[0047] Figure 13 This is a schematic side view illustrating the main parts of the crystal housing;

[0048] Figure 14 It is a three-dimensional view that schematically illustrates the main parts of the mirror housing;

[0049] Figure 15 It is a three-dimensional diagram used to describe the laser deflection performed by the laser scanning unit;

[0050] Figure 16 It is a three-dimensional diagram used to describe the laser deflection performed by the laser scanning unit;

[0051] Figure 17A This is a schematic diagram used to illustrate the replacement of the printing device and the marking head;

[0052] Figure 17B It is a three-dimensional diagram used to describe the attachment of the marking head to the support components;

[0053] Figure 18 It is a drawing used to describe the various dimensions of the marking machine head and support components;

[0054] Figure 19 This is a flowchart illustrating the basic control process of a laser processing device;

[0055] Figure 20 It is a block diagram used to describe the circuit structure related to the power supply section;

[0056] Figure 21 This is a flowchart illustrating a specific example of the control process related to the power supply section;

[0057] Figure 22 This is a perspective view illustrating modifications to the attachment surface and attachment portion; and

[0058] Figure 23 This is a schematic diagram illustrating another modification to the attachment surface. Detailed Implementation

[0059] In the following description, embodiments of the present disclosure will be described with reference to the accompanying drawings. Note that the following description is given by way of example.

[0060] That is, in this specification, a laser marking machine is described as an example of a laser processing apparatus, but the technology disclosed herein can be applied to general laser-using equipment, regardless of the names of the laser processing apparatus and the laser marking machine.

[0061] Additionally, printing will be described in this specification as a typical example of processing, but the technique can be used for various types of processing using lasers, such as image marking, and is not limited to printing.

[0062] <Overall Structure>

[0063] Figure 1 This is a diagram illustrating the overall structure of the laser processing system S, and Figure 2 This is a schematic diagram illustrating the structure of the laser processing device L in the laser processing system S. Additionally, Figure 17A This is a diagram illustrating the replacement of the printing device 1001 and the marking head 1. Figure 17B It is a perspective view used to describe the attachment of the marking head 1 to the support component.

[0064] Figure 1 The illustrated laser processing system S includes a laser processing apparatus L and external devices 400 connected thereto. Among these devices, Figure 1 and Figure 2 The illustrated laser processing apparatus L is configured to perform processing on the workpiece W corresponding to a predetermined processing pattern Pp by irradiating a predetermined irradiation area R1 with a laser.

[0065] Note that the irradiation area R1 mentioned in this article is a region set on the surface of the workpiece W. This irradiation area R1 can take various forms depending on the relative positional relationship between the laser processing device L and the workpiece W, the specifications of the laser processing device L, and the movement path of the workpiece W. For example... Figure 1 As shown, the irradiation area R1 is configured as a rectangular area in this embodiment.

[0066] Specifically, the laser processing apparatus L according to this embodiment can emit a laser with a wavelength around 350 nm as the laser for processing the workpiece W. This wavelength is included in the ultraviolet wavelength range. Therefore, in the following description, the laser used for processing the workpiece W is sometimes referred to as a "UV laser" to distinguish it from other lasers such as near-infrared lasers. Note that lasers other than ultraviolet light, such as infrared light, can also be used to process the workpiece W.

[0067] The following describes a situation where a workpiece W made of a sheet-like film is set as the object to be processed, and the film contains a UV reaction layer that chemically reacts with a UV laser.

[0068] However, in the laser processing apparatus L according to this disclosure, the workpiece W that can be used as the object to be processed is not limited to a film containing a UV reaction layer. A film that chemically reacts with a laser having a wavelength other than ultraviolet light can be used, or a workpiece W made of various materials such as paper and synthetic resin can be used as the object to be processed.

[0069] Furthermore, while the laser processing apparatus L according to this embodiment is configured to perform so-called two-dimensional printing by utilizing a laser to perform a two-dimensional scan, since the laser processing apparatus L is configured to have a deep depth of focus as described later, it can also perform so-called three-dimensional printing. Therefore, the laser processing apparatus L can even process workpieces W that are conveyed along a three-dimensional moving path, as described later. Figure 18 As shown.

[0070] like Figure 1 and Figure 2 For example, the laser processing apparatus L according to this embodiment includes a marking head 1, a marking machine controller 100, a cable 200, and an operation terminal 300.

[0071] The marking machine controller 100 can receive settings related to the processing pattern, supply power to the outside, and is configured as a controller for controlling the marking machine head 1.

[0072] On the other hand, the marking head 1 can be controlled by the marking machine controller 100 to irradiate the irradiation area R1 with a laser.

[0073] In this embodiment, the marking head 1 and the marking machine controller 100 are separate from each other and connected by a cable 200. The cable 200 includes at least electrical wiring that transmits power from the interior of the marking machine controller 100 (specifically, the power supply unit 104, which will be described later) to the outside. Specifically, the cable 200 according to this embodiment is constructed by bundling electrical wiring for transmitting power with signal wiring for transmitting and receiving analog signals, digital signals, etc.

[0074] According to this embodiment, the marking head 1 is mounted on a processing equipment 500 for processing a workpiece W made of a sheet film. For example... Figure 17A and Figure 17B For example, the processing equipment 500 includes a support member 501 that supports the marking head 1 and a conveyor roller 502 around which the workpiece W is placed.

[0075] Additionally, the processing equipment 500 includes: two track members 503l and 503r, which slidably support the marking head 1 via a support member 501; two fixing members 505 and 506, the ends of the two track members 503l and 503r respectively attached to the two fixing members 505 and 506; and a first driven roller 504l and a second driven roller 504r, which are driven when the workpiece W is conveyed by the drive of the conveyor roller 502, such as... Figure 17B , Figure 18 Examples are provided. In this case, the workpiece W is preferably placed around the conveyor roller 502 such that the contact length between the conveyor roller 502 and the workpiece W is longer than the contact length between the first driven roller 504l and the workpiece W, and also longer than the contact length between the second driven roller 504r and the workpiece W. Then, when the conveyor roller 502 conveys the workpiece W, it is less likely that the workpiece W will slide on the conveyor roller 502. Note that the term "contact length" as used herein refers to the length observed in a cross-section orthogonal to the rotation axes of the conveyor roller 502, the first driven roller 504l, and the second driven roller 504r.

[0076] Thus, according to this embodiment, the workpiece W can be a workpiece conveyed while placed around the conveyor roller 502, and for example, the conveyor roller 502 used at this time can be arranged to overlap with the irradiation area R1 in the vertical direction (the Z direction, which will be described later), such as... Figure 1 , Figure 17A The image below and Figure 18 Example.

[0077] The support member 501 can attach the housing 10 of the laser processing device L, especially the marking head 1, to a predetermined attachment target position, such as... Figure 17A Example. Although Figure 1 , Figure 17A and Figure 17B An example is shown of a support member 501 configured to suspend the housing 10 from above, but the housing 10 can be supported from another direction, such as the side, as will be described later.

[0078] On the other hand, the conveyor roller 502 is formed as a cylinder having a central axis extending laterally along the workpiece W. In this case, the workpiece W is conveyed longitudinally (as described later in the left-right direction) along a predetermined movement path by the rotation of the conveyor roller 502.

[0079] Here, the processing equipment 500 according to this embodiment is shared between the marking head 1 and the printing device 1001 according to this embodiment. The printing device 1001 performs printing using a method other than laser marking, such as... Figure 17A The above and below images are examples.

[0080] That is, the marking head 1 (instead of the printing device 1001) according to this embodiment can be attached to the support member 501 of the processing equipment 500 which is configured to attach the printing device 1001.

[0081] Examples of printing devices 1001 that can be replaced by marking head 1 include thermal transfer overprinting (TTO) machines, but other printing devices 1001 may also be used.

[0082] As a printing device 1001 that can be replaced by the marking head 1, for example, any printing device provided with a housing 1010, which is formed in a generally cuboid shape and includes a printing surface 1010d obtained by exposing a printing part 1006 in contact with the printing area on the workpiece W and a connection surface 1010u that is different from the printing surface 1010d and can be connected to the support member 501.

[0083] In this configuration, the marking head 1 is supported by a support member 501 that can be connected to the connecting surface 1010u, as shown below. Figure 17A The printing device 1001 illustrated in the upper and lower figures is similar. The marking head 1 supported thereon is irradiated with a laser to an irradiation area R1 that corresponds to the printing area (the area that contacts the printing part 1006 in the printing device 1001), thereby processing the workpiece W.

[0084] On the other hand, the operating terminal 300 includes, for example, a central processing unit (CPU) and a memory, and is connected to the marking machine controller 100 so as to be able to send and receive electrical signals in a wired or wireless manner.

[0085] The operation terminal 300 is configured to set various processing conditions (also called printing conditions), such as printing settings, and to display information related to the processing of workpiece W to the user. The operation terminal 300 includes a display unit 301 configured to display information to the user, an operation unit 302 configured to receive operation input from the user, and a storage device 303 configured to store various types of information.

[0086] For example, the display unit 301 can be configured using a liquid crystal display (LCD) or an organic EL panel. The operation unit 302 can be configured using a keyboard and a pointing device. Here, the pointing device includes a mouse, joystick, etc. Instead of a pointing device, the operation unit 302 can be configured using a touch panel console, for example, directly connected to the marking machine controller 100.

[0087] The operation terminal 300 configured as described above can set processing conditions in laser processing based on operation input from the user. The processing conditions include one or more of the following: the content of the string and graphic to be printed on the workpiece W (processing pattern Pp), the target output of the laser (laser power), and the scanning speed of the laser on the workpiece W (scanning speed).

[0088] The processing conditions set by the operation terminal 300 are output to the marking machine controller 100 and stored in the storage unit 102 of the marking machine controller 100. The storage device 303 in the operation terminal 300 can store processing conditions as needed.

[0089] Note that, for example, the operating terminal 300 can be integrated into the marking machine controller 100.

[0090] External device 400 is connected to marking machine controller 100 as needed. Figure 1 and Figure 2 In the illustrated example, a conveyor speed sensor 401 and a programmable logic controller (PLC) 402 are provided as external devices 400.

[0091] The conveyor speed sensor 401 is configured, for example, using a rotary encoder, and can detect the conveyor speed of the workpiece W. The conveyor speed sensor 401 outputs a signal (detection signal) indicating the detection result to the marking machine controller 100. The marking machine controller 100 controls the two-dimensional scanning of the laser, etc., based on the detection signal input from the conveyor speed sensor 401.

[0092] The PLC 402 is configured, for example, using a microprocessor, and can input control signals to the marking machine controller 100. The PLC 402 is used to control the laser processing system S according to a predetermined sequence.

[0093] In addition to the aforementioned equipment and devices, devices configured to perform operations and controls, computers configured to perform various other processes, storage devices, peripheral devices, etc., may also be connected to the laser processing device L in a wired or wireless manner.

[0094] The hardware configuration of each of the marking head 1 and the marking machine controller 100 will be described in detail below, followed by an overview of the control of the marking head 1 by the marking machine controller 100.

[0095] <Marking Machine Controller 100>

[0096] like Figure 2 For example, the marking machine controller 100 includes: a receiving unit 101 that receives settings (processing settings) related to processing conditions including the processing pattern; a storage unit 102 that stores the processing conditions; a control unit 103 that controls the marking machine head 1 based on the processing conditions; and a power supply unit 104 that supplies power to the marking machine head 1.

[0097] (Receiving Unit 101)

[0098] The receiving unit 101 is configured to receive processing conditions input through the operation terminal 300 and output the received processing conditions to the storage unit 102 and / or the control unit 103.

[0099] Specifically, according to this embodiment, the receiving unit 101 is electrically connected to the operation terminal 300, and can display a setting screen (not shown) for setting various processing conditions on the display unit 301 in the operation terminal 300. The receiving unit 101 can reflect the content input through the setting screen in each processing condition, and output the reflected processing conditions to the storage unit 102 and / or the control unit 103.

[0100] (Storage Department 102)

[0101] The storage unit 102 is configured to temporarily or continuously store the processing conditions received by the receiving unit 101, and output the stored processing conditions to the control unit 103, the display unit 301, etc. if necessary.

[0102] Specifically, the storage unit 102 according to this embodiment is configured using non-volatile memory such as a hard disk drive (HDD) or a solid-state drive (SSD), and can temporarily or continuously store data indicating processing conditions.

[0103] (Control Department 103)

[0104] The control unit 103 is configured to perform machining on the workpiece W in accordance with the machining conditions by controlling the power supply unit 104, the laser output unit 4, the laser scanning unit 5, etc. based on the machining conditions.

[0105] Specifically, the control unit 103 according to this embodiment includes a processor, a volatile memory, an input / output bus, etc. The control unit 103 generates control signals based on processing conditions read from the storage unit 102 or directly input from the receiving unit 101, and outputs the generated control signals to various parts of the laser processing apparatus L to control the processing of the workpiece W.

[0106] For example, when the processing of workpiece W begins, the control unit 103 reads the target output as a processing condition from the storage unit 102 and inputs the control signal generated in relation to the target output to the power supply unit 104, thereby controlling the generation of laser excitation light.

[0107] (Power Supply Section 104)

[0108] The power supply unit 104 supplies drive current to the excitation light generation unit 2 based on the control signal output from the control unit 103. Although not described in detail, the power supply unit 104 determines the drive current based on the target output input from the control unit 103 and supplies the determined drive current to the excitation light generation unit 2. The power supply unit 104 supplies power to the excitation light generation unit 2 and can be configured using a DC power supply 104a or the like, as described later. Figure 20 Example. Details of the power supply section 104 will be described later.

[0109] Note that the excitation light generating unit 2, which uses an excitation light source such as a laser diode, is configured to be built into the marking head 1, rather than into the marking machine controller 100 in this embodiment. Power supplied from the power supply unit 104 is supplied to the excitation light generating unit 2 via cable 200.

[0110] <Marking Machine Head 1>

[0111] Figure 3A and Figure 3B This is a perspective view illustrating the appearance of the marking head 1. Figure 4 This is a side view of the marking head 1. Figure 5 This is a perspective view illustrating the state in which the cover component 13 is removed from the marking head 1. Figure 6 This is a rear view of the marking head 1.

[0112] in addition, Figure 7 This diagram illustrates the connection structure of the cable 200 in the marking head 1. Figure 8 and Figure 9 This is a perspective view illustrating the housing structure of the marking head 1. Additionally, Figure 10 This is a schematic cross-sectional view illustrating the internal structure of the marking head 1. Figure 11 This is a schematic longitudinal sectional view illustrating the internal structure of the marking head 1. Figure 10 The cross section and along Figure 11The cross sections cut by line AA are roughly the same.

[0113] in addition, Figure 11 This is a schematic longitudinal sectional view illustrating the internal structure of the marking head 1. Figure 12 This is a schematic side view illustrating the main parts of the plate housing H13. Figure 13 This is a schematic side view illustrating the main part of the crystal housing H12.

[0114] in addition, Figure 14 This is a perspective view schematically illustrating the main parts of the mirror housing H11. Figure 15 and Figure 16 It is a three-dimensional diagram used to describe the laser deflection performed by the laser scanning unit.

[0115] (Schematic diagram of the marking head 1)

[0116] like Figure 2 For example, as a main component, the marking head 1 includes an excitation light generating unit 2, an excitation light guiding unit 3 as a light guiding optical system, a laser output unit 4, and a laser scanning unit 5 as a laser deflection unit.

[0117] As will be described in detail later, the excitation light generating unit 2 generates excitation light for exciting a laser based on electricity supplied via cable 200. The excitation light guiding unit 3 guides the excitation light generated by the excitation light generating unit 2 and inputs the excitation light to the laser output unit 4. The laser output unit 4 includes a solid-state laser crystal 41 that generates a laser based on the excitation light guided by the excitation light guiding unit 3.

[0118] Additionally, the laser scanning unit 5 includes: a first scanner 51 that drives a first mirror 51a to emit a laser generated by a solid-state laser crystal 41 toward a desired position in the irradiation area R1; and a first control board 53 that controls the first scanner 51.

[0119] More specifically, the laser scanning unit 5 according to this embodiment is configured using a so-called dual-axis (X-axis and Y-axis) electrical scanner, and in addition to the first scanner 51 which is the Y scanner, it also includes a second scanner 52 which is the X scanner and a second control board 54 which controls the second scanner 52.

[0120] The laser scanning unit 5 controls the first scanner 51 via the first control board 53 and the second scanner 52 via the second control board 54, thereby driving the first mirror 51a of the first scanner 51 and the second mirror 52a of the second scanner 52.

[0121] At this time, the laser scanning unit 5, which is the laser deflection unit, drives the first mirror 51a and the second mirror 52a according to the predetermined processing settings (the settings related to the processing pattern Pp) so that the laser generated by the laser output unit 4 is deflected so that it is emitted toward the desired position in the irradiation area R1.

[0122] The marking head 1 also includes a housing 10, which houses the aforementioned components, namely, the excitation light generating unit 2, the excitation light guiding unit 3, the laser output unit 4, and the laser scanning unit 5. An exit window 6 is formed in the housing 10 to transmit the laser light deflected by the first mirror 51a of the laser scanning unit 5 (i.e., the laser light emitted towards the irradiation area R1 via the laser scanning unit 5).

[0123] The following sections will describe the external structure of the marking head 1 (specifically, the structure of the six surfaces of the housing 10) and the internal structure of the marking head 1 in sequence.

[0124] (Outer surface of housing 10)

[0125] like Figure 3A For example, the housing 10 of the marking head 1 is constructed in a generally rectangular shape, with a left-right orientation ( Figure 3A Compared to the direction from the left and front sides when viewing the housing 10 from the front, to the right and depth sides when viewed similarly from the front, the generally rectangular shape in the front-rear direction ( Figure 3A It has a longer dimension in the direction from the right and front sides to the left and depth sides. Note that "left and right" in this specification corresponds to left and right when viewed from the perspective of a user facing the housing 10.

[0126] In the following text, the front-to-back direction of the housing 10 is considered the X direction, the left-to-right direction is considered the Y direction, and the height direction is considered the Z direction. Specifically, Figure 3A The plane of the diagram is considered to be in the +X direction in the depth side along the X direction, and... Figure 3A The front side of the plane in the diagram is considered as the -X direction. Similarly, Figure 3A The plane of the diagram is considered to be in the +Y direction on the front side in the Y direction, and... Figure 3A The depth side of the plane in the graph is considered as the -Y direction. Similarly, Figure 3A The plane of the graph is considered to be above the -Z direction on the Z-axis, and... Figure 3A The lower side of the plane in the diagram is considered to be the +Z direction.

[0127] For convenience, the definition based on the shape of the housing 10 has been illustrated here, but the definition based on the operating direction and positional relationship of the various components housed in the housing 10 can also be used in place of these definitions or in conjunction with these definitions.

[0128] For example, the first direction, which is the deflection direction of the first mirror 51a, can be defined as the Y direction, and the second direction, which is the deflection direction of the second mirror 52a, can be defined as the X direction. Note that in this embodiment, the direction of scanning the irradiation position in the irradiation area R1 by the driving mirror is indicated by the deflection direction of the mirror included in and driven by the laser scanning unit 5. That is, when the first mirror 51a is driven to rotate, the irradiation position in the irradiation area R1 is scanned along the Y direction. In addition, when the second mirror 52a is driven to rotate, the irradiation position in the irradiation area R1 is scanned along the X direction. Similarly, the direction from the marking head 1 toward the irradiation area R1 (more specifically, as the irradiation direction from the exit window 6 toward the irradiation area R1) can be regarded as the Z direction. The irradiation direction can be the direction from the first mirror 51a toward the irradiation area R1. Note that in this embodiment, "the direction from the specific member toward the irradiation area R1" refers to one of the directions in the axial direction in which the specific member and the irradiation area R1 face each other. "The direction from the specific member toward the irradiation area R1" is not the direction of light travel from the specific member toward the irradiation area R1. Therefore, the irradiation position in the irradiation area R1 (i.e., the direction of light travel toward the irradiation area R1) is changed by rotating the first mirror 51a and the second mirror 52a, but the irradiation direction in this embodiment does not change with the change of the direction of light travel.

[0129] In the following description, a description will be given that assumes the definition of the shape of the housing 10 is consistent with the definition of the deflection direction and illumination direction based on the first mirror 51a and the second mirror 52a.

[0130] like Figures 3A to 7 For example, the housing 10 has a bottom surface 10d on which the exit window 6 is formed, and a top surface 10u facing the bottom surface 10d and the exit window 6. For example, the bottom surface 10d faces the +Z direction, the top surface 10u faces the -Z direction, and both are composed of one or more plate-like members having thickness in the Z direction. Note that the term "facing" as used herein refers to a conceptual orientation when the housing 10 is considered as a conceptual cuboid.

[0131] The housing 10 also includes a front surface 10f, a rear surface 10b, a left side surface 10l, and a right side surface 10r that surround the excitation light generating part 2, the excitation light guiding part 3, the laser output part 4, and the laser scanning part 5 together with the bottom surface 10d and the top surface 10u.

[0132] The front surface 10f, rear surface 10b, left side surface 10l, and right side surface 10r all face a direction orthogonal to the top surface 10u and bottom surface 10d (i.e., along the XY plane). For example, the front surface 10f faces the -X direction, the rear surface 10b faces the +X direction, and both are composed of one or more plate-like members with thickness in the X direction. Similarly, for example, the left side surface 10l faces the +Y direction, the right side surface 10r faces the -Y direction, and both are composed of one or more plate-like members with thickness in the Y direction.

[0133] In the following description, the six surfaces of the housing 10 will be described sequentially. Note that the term "surface" in the bottom surface 10d, top surface 10u, front surface 10f, rear surface 10b, left side surface 10l, and right side surface 10r also includes plate-like members with a predetermined thickness. Furthermore, these six surfaces are classified for convenience only and do not need to be separate from each other. For example, at least one of the left side surface 10l and the right side surface 10r and at least a portion of the bottom surface 10d (particularly the non-offset portion 18, which will be described later) may be integral.

[0134] -Top surface 10u-

[0135] like Figure 3A For example, the top surface 10u, one of the six surfaces constituting the housing 10, is formed into a rectangular plate shape, extending along the X and Y directions, with its dimension in the X direction being longer than its dimension in the Y direction. According to this embodiment, the top surface 10u is configured to connect to the support member and attach to the aforementioned attachment target location. In this case, the plate thickness of the top surface 10u is greater than the plate thickness of the left side surface 10l and the right side surface 10r.

[0136] Furthermore, the top surface 10u, serving as the attachment surface, is provided with an attachment portion 7 that can be attached to the attachment target location. The attachment portion 7 is constructed as a plate-like member, extending in directions substantially parallel to the top surface 10u (X and Y directions), and having thickness in a direction orthogonal to the top surface 10u (Z direction). The attachment portion 7 is placed on the top surface 10u and fastened to the top surface 10u, for example, by fasteners 7b (such as bolts). Figure 10 For example, as described above, the plate thickness of the top surface 10u is greater than that of the left side surface 10l, right side surface 10r, etc. The greater plate thickness of the top surface 10u is advantageous in ensuring the insertion allowance of the fastener 7b.

[0137] A fastening hole 7a is provided on the upper surface of the attachment portion 7, corresponding to the support member 501 arranged at the attachment target position. With the support member 501 placed on the attachment portion 7, the support member 501 can be attached to the attachment portion 7 by fastening the fastening hole 7a with a fastener such as a bolt. Therefore, the top surface 10u is attached to the attachment target position via the attachment portion 7, and the housing 10 is suspended from the support member 501.

[0138] -Bottom 10d-

[0139] like Figure 4 For example, the bottom surface 10d of the six surfaces is arranged on the opposite side of the top surface 10u, and the laser scanning unit 5 is inserted therebetween. Figure 5 For example, the bottom surface 10d is formed into a curved shape, which extends along the X direction and has a central portion in the Y direction that is concave toward the -Z side.

[0140] Specifically, such as Figure 5 and Figure 10 For example, the bottom surface 10d according to this embodiment includes an offset portion 16a located in the central part in the Y direction and offset towards the -Z side, and non-offset portions 18 located at both ends in the Y direction and protruding more towards the +Z side than the offset portion 16a. Both the offset portion 16a and the non-offset portion 18 are formed to extend flatly along the X direction.

[0141] Specifically, according to this embodiment, the bottom surface 10d has a groove with a trapezoidal cross-section, which has an offset portion 16a as the upper side and its diameter increases towards the +Z side. An exit window 6 is disposed in the offset portion 16a as the upper side. According to this embodiment, the bottom surface 10d is constructed as an exit surface, and the exit window 6 is formed on this exit surface. Details of the exit window 6 will be described later.

[0142] On the other hand, the non-offset portion 18 is formed from the portion corresponding to the hypotenuse of the trapezoidal shape to the +Z side end of the bottom surface 10d. According to this embodiment, the non-offset portion 18 includes: a first plate-like member 18l located on the +Y side of the offset portion 16a; and a second plate-like member 18r located on the -Y side of the offset portion 16a.

[0143] The first plate-shaped member 18l is formed as follows: Figure 10 The illustrated thin plate shape has an inverted L-shape when viewed from the -X side. Here, "inverted L-shape" refers to the shape obtained by inverting the L-shape relative to an axis of symmetry extending in the Z direction. A first plate-like member 18l is arranged on the opposite side of the second plate-like member 18r, with an offset portion 16a inserted therebetween. The vertical edge portion of the inverted L-shape in the first plate-like member 18l forms the hypotenuse on the +Y side of the trapezoidal shape, and the horizontal edge portion of the inverted L-shape forms the +Z side end on the +Y side.

[0144] The second plate-shaped member 18r is formed as follows: Figure 10 The illustrated thin plate shape has an L-shape when viewed from the -X side. A second plate-shaped member 18r is arranged on the opposite side of the first plate-shaped member 18l, with an offset portion 16a inserted therebetween. The vertical edge portion of the L-shape of the second plate-shaped member 18r forms a trapezoidal sloping side on the -Y side, and the horizontal edge portion of the L-shape forms the +Z side end on the -Y side.

[0145] Additionally, the first plate-shaped member 18l, together with the lower half of the left side face 10l, covers the projection window 6 from the +Y side, as shown below. Figure 10 For example. On the other hand, the second plate-shaped member 18r, together with the lower half of the right side surface 10r, covers the projection window 6 from the -Y side. In this way, the first plate-shaped member 18l and the second plate-shaped member 18r, together with the lower half of the left side surface 10l and the lower half of the right side surface 10r, form a skirt-shaped cover (skirt portion).

[0146] -Front surface 10f-

[0147] like Figure 3B and Figure 5 For example, the front surface 10f of the six surfaces is formed as a plate extending along the Y and Z directions, and is provided with an indicator 11, two vents 12 and 12 and a slot 10c.

[0148] like Figure 3B and Figure 5 For example, the indicator 11 is located on the upper side and near the right end of the front surface 10f, and includes three lights 11a, 11b and 11c arranged side by side along the Y direction (only when...). Figure 5 (Example shown). Each of the three lights 11a, 11b and 11c includes a light-emitting diode (LED) electrically connected to the marking machine controller 100. In the following text, the three lights 11a, 11b and 11c are referred to as the first light 11a, the second light 11b and the third light 11c from the +Y side.

[0149] The first light 11a uses, for example, a blue LED configuration and is illuminated in blue in conjunction with a key switch (not shown) located in the laser processing unit L. Note that the "key switch" mentioned herein refers to a switch operated by a key managed by a safety manager or similar personnel. By inserting the key into the laser processing unit L and turning the key in a predetermined direction, the system switches between a "closed" state corresponding to a power-off state, a "power-on" state corresponding to a power-on state and prohibiting laser emission, and a "laser-on" state corresponding to a power-on state and allowing laser emission.

[0150] On the other hand, the second lamp 11b is configured to switch its light emission color to either green or orange, and to switch the light emission color according to various states other than the state of the key switch. Additionally, the third lamp 11c is configured to switch its light emission color to any one of green, orange, and red, and to switch the light emission color according to various states other than the state of the key switch.

[0151] Each of the first lamp 11a, the second lamp 11b, and the third lamp 11c is electrically connected to the marking machine controller 100 and is configured to illuminate in response to a control signal input from the control unit 103. Details of the control of the indicator 11 will be described later.

[0152] like Figure 3B and Figure 5 For example, one of the two vents 12 is located near the upper and left ends of the lower side of the front surface 10f, and the other of the two vents 12 is located near the upper and right ends of the lower side of the front surface 10f. Both vents 12 penetrate the front surface 10f in the thickness direction and are each in communication with the second receiving portion H2, which will be described later.

[0153] like Figure 3B and Figure 5 For example, the slot 10c is formed by cutting off the portion including the lower end of the front surface 10f, and is connected to the front end (the end on the X-direction side) of the offset portion 16a. The slot 10c is arranged in the Y direction between the two vent holes 12 and 12.

[0154] Specifically, the slot 10c is formed in a generally trapezoidal shape, with its diameter increasing in a tapered shape in the +Z direction, so as to have a cross-section that is substantially consistent with the trapezoidal cross-section having the offset portion 16a as the upper side. According to this embodiment, the front surface 10f is configured as a user access surface (open surface) by providing the slot 10c in the lower half, which is at least partially open to allow access to the exit window 6 via the offset portion 16a.

[0155] -Detail 1 of the front surface 10f (dust collector and camera)-

[0156] In addition to maintenance operations of the outlet window 6 (e.g., cleaning operations performed by inserting a cleaning tool from the slot 10c), the slot 10c according to this embodiment can also be used for various other purposes.

[0157] Typically, smoke is generated when a workpiece W, such as a film, is irradiated with a UV laser. Therefore, a dust collector separate from the marking head 1 can be connected to the front surface 10f to draw out the smoke through the slot 10c. Note that the dust collector can be built into the marking head 1, rather than being attached to the marking head 1, such as by connecting it to the front surface 10f.

[0158] Furthermore, after irradiating a workpiece W, such as a film, with a UV laser to perform the printing process, a camera can be built into or attached externally to the marking head 1 to inspect the printed content. This camera can be attached, for example, to the notch 10c or to the offset portion 16a. In the former case, a reflector can be provided around the exit window 6 to capture as much of the image of the irradiated area R1 as possible from directly above (-Z side). Additionally, illumination can be provided around the camera or the exit window 6 to obtain the brightest possible image.

[0159] -Detail 2 of front surface 10f (cover component 13 and opening / closing sensor)

[0160] Furthermore, a cover member 13 capable of opening and closing the front surface 10f is attached to the front surface 10f, which serves as an open surface. The cover member 13 includes: a first cover portion 13a fixed to the upper half of the front surface 10f; a second cover portion 13b pivotable to open and close the lower half of the front surface 10f (particularly the open portion formed by the slot 10c); and a hinge mechanism 13c connecting the first cover portion 13a and the second cover portion 13b (see [link to previous section]). Figure 3A and Figure 3B ).

[0161] The first cover portion 13a is formed as a rectangular plate covering the upper half of the front surface 10f, and has a through hole (its reference numerals omitted) formed at approximately the same location as the indicator 11. The first cover portion 13a is secured to the upper half of the front surface 10f by fasteners such as screws.

[0162] The second cover portion 13b is formed as a rectangular plate capable of covering the lower half of the front surface 10f (particularly the slot 10c), and has a through hole (its reference numerals omitted) formed at approximately the same position as the two vent holes 12 and 12. The second cover portion 13b is supported to the first cover portion 13a via a hinge mechanism 13c.

[0163] The hinge mechanism 13c is located at the central portion of the front surface 10f in the Z direction and pivotally connects the upper edge portion of the second cover portion 13b to the lower edge portion of the first cover portion 13a.

[0164] With the first cover portion 13a fixed to the front surface 10f, the hinge mechanism 13c allows the second cover portion 13b to swing about a rotation axis extending in the Y direction (see...). Figure 3A and Figure 3BWhen the second cover portion 13b swings in the opening direction, the slot 10c of the front surface 10f can be exposed. Since the slot 10c is exposed, various types of maintenance, such as cleaning of the exit window 6, can be performed through the offset portion 16a connected to the slot 10c.

[0165] Note that the cover member 13 is not necessary. The front surface 10f can be exposed without the cover member 13.

[0166] Additionally, although not illustrated, an opening / closing sensor for sensing the opening and closing of the cover member 13 may be provided on at least one of the cover member 13 (particularly the second cover portion 13b) and the front surface 10f (particularly the peripheral portion of the slot 10c on the front surface 10f).

[0167] As such an opening and closing sensor, a magnetic sensor can be used, for example, comprising a magnet disposed on one of the second cover portion 13b and the front surface 10f and a magnetic sensor (e.g., a Hall element) disposed on the other of the second cover portion 13b and the front surface 10f. Note that the magnetic sensor is merely an example, and optical sensors, mechanical sensors, etc., can also be used.

[0168] This magnetic sensor is electrically connected to the circuit board in the marking machine controller 100 and / or the marking head 1, and can output a sensing signal indicating the open or closed state of the cover member 13, particularly the second cover portion 13b, to the marking machine controller 100 and / or the circuit board.

[0169] Because of the opening / closing sensor, the open or closed state of the cover member 13 can be sensed, and various types of control based on the open or closed state can be performed. As an example, according to this embodiment, the marking machine controller 100 performs an emergency stop to laser emission when the cover member 13 is opened during laser emission. Subsequently, the cover member 13 is closed to perform an emergency stop release operation via the operation unit 302, allowing laser emission to resume.

[0170] Note that when the cover member 13 is considered an outer surface of the housing 10, it is visually identifiable by the user when the marking head 1, etc., is attached. In this case, for example, as... Figure 3A For example, a first mark M1, which can be used as a marker, can be added to the second cover portion 13b of the cover member 13.

[0171] The first mark M1 includes: a first center line M11, which indicates the center of the irradiated area R1 (the intersection of the diagonals of the irradiated area R1); a +Y edge M12, which indicates the edge on the +Y side of the irradiated area R1; and a -Y edge M13, which indicates the edge on the -Y side of the irradiated area R1.

[0172] Note that the cover member 13 is not required. When the front surface 10f is considered as the outer surface of the housing 10 without the cover member 13, the first mark M1 can be added to the front surface 10f.

[0173] -Rear surface 10b-

[0174] like Figure 3B and Figure 5 For example, the rear surface 10b of the six surfaces is arranged on the opposite side of the front surface 10f, with the laser scanning unit 5 inserted therebetween, and the rear surface is formed as a plate extending along the Y and Z directions. According to this embodiment, the rear surface 10b can be regarded as an outer surface of the housing 10 (different from the outer surface of the cover member 13), and forms a connecting surface to which the cable 200 that supplies power to the housing 10 is connected. The rear surface 10b, as the connecting surface, together with the front surface 10f, as the open surface, the top surface 10u, as the attachment surface, and the bottom surface 10d, as the emission surface, surround the laser scanning unit 5, which is a laser deflection unit.

[0175] Furthermore, the rear surface 10b, which serves as the connection surface, is provided with a connection cover 14 that covers the connection portion between the rear surface 10b and the cable 200, such as... Figure 7 Example. The connecting cover 14 adjusts the extension direction Ae of the cable 200 so that the cable 200 is led out in the in-plane direction (Y and Z directions) of the rear surface 10b, and more specifically, in the direction (Y direction) that intersects the irradiation direction (Z direction) in the in-plane direction (Y and Z directions).

[0176] In other words, the connecting cover 14 is configured to lead out the cable 200 in a direction orthogonal to the X direction (Y or Z direction), the X direction being the direction connecting the front surface 10f and the rear surface 10b.

[0177] Specifically, the connecting cover 14 according to this embodiment includes: a surrounding portion 14a that surrounds the connecting terminal of the marking head 1 relative to the cable 200; a cover 14b that closes the surrounding portion 14a; a sealing member 14c that liquid-tightly seals the space between the surrounding portion 14a and the cover 14b; and a wire diameter conversion connector 14d that adjusts the wire diameter of the cable 200.

[0178] The surrounding portion 14a is formed to surround the connector that opens from the side to the rear surface 10b (in the Y and Z directions). Specifically, according to this embodiment, the surrounding portion 14a is formed into a thin rectangular box shape that opens in the +X direction.

[0179] Furthermore, considering the surrounding portion 14a as a thin box, two openings (denoted as shown in the figures) communicating with different connection terminals are formed on the bottom surface 14e. Additionally, among the multiple sidewalls constituting the surrounding portion 14a, the left sidewall 14f facing the +Y side is provided with a first through hole 14g penetrating the left sidewall 14f along the Y direction, which is the extending direction Ae. When the cable 200 is inserted through the first through hole 14g, its extending direction Ae is adjusted.

[0180] A wire diameter conversion connector 14d is disposed inside the surrounding portion 14a and housed within a receiving space defined by the surrounding portion 14a and the cover 14b. Here, the cable 200 according to this embodiment includes: a first cable portion 201 extending from the marking machine controller 100 and connected to the wire diameter conversion connector 14d; and a second cable portion 202 extending from the wire diameter conversion connector 14d and connected to the connection terminal of the marking machine head 1. The wire diameter of the second cable portion 202 is set to be smaller than that of the first cable portion 201 to fit the connection terminal of the marking machine head 1.

[0181] That is, in this embodiment, the cable 200 is connected to the marking head 1 after the wire diameter has been converted by the wire diameter conversion connector 14d.

[0182] Typically, the cable length of the cable 200 needs to be adjusted depending on the installation environment of the marking head 1. In cases where a longer cable 200 than usual is used, a voltage drop issue arises compared to a relatively short cable. Therefore, using a cable 200 with a larger wire diameter is considered as a countermeasure.

[0183] In this way, the wire diameter of the cable 200 can be changed according to the installation environment of the marking head 1. Therefore, it is conceivable to use the wire diameter conversion connector 14d as described above. However, there is a problem: by simply using the wire diameter conversion connector 14d, the connection between the first cable portion 201 and the wire diameter conversion connector 14d, as well as the connection between the second cable portion 202 and the wire diameter conversion connector 14d, may get wet with water.

[0184] In this respect, such as Figure 7 For example, the wire diameter conversion connector 14d is housed within the connection cover 14, preventing the aforementioned connection parts from getting wet. Therefore, the marking head 1 can be adapted to a wider range of installation environments.

[0185] -Left side 10l-

[0186] like Figure 3A , Figure 3B and Figure 10For example, the left side 10l of the six surfaces is arranged on the +Y side relative to the laser scanning unit 5 and is formed as a plate extending along the Z and X directions.

[0187] Note that when the left side 10l is considered an outer surface of the housing 10, it is visually recognized by the user when the marking head 1 is attached. For example... Figure 3A For example, a second marker M2 can be added to the left side 10l as a marker.

[0188] The second mark M2 includes: a second center line M21, which indicates the center of the irradiated area R1 (the intersection of the diagonals of the irradiated area R1); a +X edge M22, which indicates the edge on the +X side of the irradiated area R1; and a -X edge M23, which indicates the edge on the -X side of the irradiated area R1.

[0189] -Right side 10r-

[0190] like Figure 4 , Figure 5 and Figure 10 For example, the right side 10r of the six surfaces is arranged on the -Y side relative to the laser scanning unit 5, and is formed into a plate extending along the Z and X directions. The right side 10r is arranged on the opposite side of the left side 10l, and the laser scanning unit 5 is inserted therebetween.

[0191] Note that, in the case where the right side 10r is considered an outer surface of the housing 10, a third mark M3, configured similarly to the second mark M2, can be added to the right side 10r.

[0192] The third mark M3 includes: a third center line M31, which indicates the center of the irradiated area R1 (the intersection of the diagonals of the irradiated area R1); a +X edge M32, which indicates the edge on the +X side of the irradiated area R1; and a -X edge M33, which indicates the edge on the -X side of the irradiated area R1.

[0193] Note that the configuration including both the second marker M2 and the third marker M3 is not necessary, and only one of the second marker M2 and the third marker M3 can be provided.

[0194] (Internal space of housing 10)

[0195] The housing 10 defines an internal space surrounded by six surfaces: a bottom surface 10d, a top surface 10u, a front surface 10f, a rear surface 10b, a left side surface 10l, and a right side surface 10r. The internal space is divided into multiple receiving sections by plate-like members arranged in the housing 10.

[0196] As such plate-shaped components, the marking head 1 according to this embodiment includes a first base plate 15, a second base plate 16, and a third base plate 17. In this embodiment, the first base plate 15, the second base plate 16, and the third base plate 17 are separated from each other. In addition, the first base plate 15 is configured as a support plate among these plate-shaped components capable of supporting the solid-state laser crystal 41.

[0197] The construction of each plate-shaped component will be described in turn below.

[0198] -First base plate 15-

[0199] like Figure 8 , Figure 9 and Figure 10 For example, the first base plate 15 is constructed as a metal plate-like member extending in the X direction and is housed in the housing 10 (in other words, surrounded by the six surfaces of the housing 10). The thickness of the first base plate 15 is set to be at least greater than the thickness of the left side 10l and the right side 10r of the six surfaces of the housing 10.

[0200] Specifically, the first base plate 15 according to this embodiment has an inverted L-shape when viewed from the -X side. Here, "inverted L-shape" refers to the shape obtained by inverting the L-shape relative to an axis of symmetry extending in the Z direction. In the following text, the portion of the first base plate 15 corresponding to the vertical edge of the inverted L-shape is referred to as the vertical edge portion 15a, and the portion corresponding to the horizontal edge of the inverted L-shape is referred to as the horizontal edge portion 15b.

[0201] The first base plate 15 is arranged in the Y direction between the left side 10l and the right side 10r, and is also arranged on the +Y side of the second base plate 16. The first base plate 15 is arranged on the +Y side of the third base plate 17, with the second base plate 16 inserted therebetween.

[0202] Here, a sealing member (not shown) that liquid-tightly seals the gap between the first base plate 15 and the left side surface 10l is provided between the left end (the end on the +Y side) of the horizontal side portion 15b and the left side surface 10l of the housing 10.

[0203] The first base plate 15 is arranged in the Z direction below the top surface 10u.

[0204] Here, as Figure 10 The enclosure portion C1 is illustrated, with the upper end (the end on the -Z side) of the vertical edge portion 15a facing the top surface 10u with a predetermined gap. Therefore, the first base plate 15 is in a state that is not integral with the top surface 10u of the housing 10 (a state that allows the first base plate 15 to be displaced relative to the top surface 10u).

[0205] Note that when any of the six surfaces of the housing 10 other than the top surface 10u is an attachment surface, a gap can be provided between the outer surface used as an attachment surface and the first base plate 15, instead of a gap between the top surface 10u and the vertical side portion 15a. For example, when the left side surface 10l of the housing 10 is an attachment surface, a gap can be provided between the left end of the horizontal side portion 15b and the left side surface 10l.

[0206] The first base plate 15 is arranged in the X direction between the front surface 10f and the rear surface 10b. For example... Figure 11 For example, the first base plate 15 is fixed to the front surface 10f by the front surface side fastener 15c and to the rear surface 10b by the rear surface side fastener 15d.

[0207] That is, the first bottom plate 15, which serves as a support plate, is attached to the housing 10 via the front surface 10f and the rear surface 10b without being integrated with the top surface 10u, which serves as the attachment surface.

[0208] Next, when describing the vertical edge portion 15a in detail, according to this embodiment, the vertical edge portion 15a is formed as a thick plate shape extending along the Z and X directions, which are the irradiation directions. For example... Figure 11 For example, at least two through holes 15e and 15f are formed in the vertical side portion 15a.

[0209] Of the two through holes 15e and 15f, the second through hole 15e, located on the +X side, is used for optical coupling of the excitation light guide 3 and the laser output 4. The second through hole 15e forms a first entrance window 91 that allows excitation light to enter the laser output 4 from the excitation light guide 3.

[0210] Of the two through holes 15e and 15f, the third through hole 15f, located on the -X side, is used for optical coupling of the laser output section 4 and the laser scanning section 5. An optical component 15h, such as glass, that transmits laser light is mounted in the third through hole 15f. The third through hole 15f and the optical component 15h, together with the fifth through hole 50b (described later), form a second entrance window 92 that allows laser light to enter the laser scanning section 5 from the laser output section 4.

[0211] Additionally, on the left and right sides of the vertical side portion 15a, a separating surface 15g is formed on the left side facing the +Y side, which defines the crystal receiving portion H12, which will be described later. Various optical components, including the solid-state laser crystal 41, are fastened to the separating surface 15g.

[0212] Additionally, on the left and right sides of the vertical side portion 15a, the right side facing the -Y side supports the first housing 50 from the left, defining the mirror receiving portion H11, which will be described later. The right side may define a portion of the mirror receiving portion H11, rather than supporting the first housing 50 via the right side of the vertical side portion 15a.

[0213] Next, when describing the horizontal edge portion 15b in detail, according to this embodiment, the horizontal edge portion 15b is formed as a thick plate shape extending along the X and Y directions. For example... Figure 10 For example, a first heat sink 81 is provided on the lower surface of the horizontal edge portion 15b, which is a heat sink according to this embodiment.

[0214] The first heat sink 81 includes a plurality of fins protruding in the +Z direction. These fins are arranged side by side in the Y direction. Each fin is formed to extend along the X direction. The first heat sink 81 is thermally coupled to the components of the laser output section 4 (e.g., solid-state laser crystal 41) via a first base plate 15.

[0215] Note that in Figure 10 In the illustrated example, the horizontal side portion 15b and the first heat sink 81 are integral, but the horizontal side portion 15b and the first heat sink 81 can be separate, and are not limited thereto.

[0216] -Second base plate 16-

[0217] like Figure 8 , Figure 9 and Figure 10 For example, the second base plate 16 is constructed as a metal plate-like member extending in the X direction and defines a portion of the six surfaces of the housing 10, particularly the offset portion 16a of the bottom surface 10d.

[0218] Specifically, the second base plate 16 according to this embodiment is formed in a Z-shape when viewed from the -Y side. When the second base plate 16 is considered to be Z-shaped, the upper edge corresponds to the offset portion 16a in this embodiment. In the X direction, when the second base plate 16 is considered to be Z-shaped, the length of the offset portion 16a, which is the upper edge, is set to be longer than the length of the bottom edge.

[0219] The second base plate 16 is arranged in the Y direction between the left side 10l and the right side 10r, and more specifically, between the first base plate 15 and the third base plate 17. The second base plate 16 is supported by the first base plate 15 and the third base plate 17 by fasteners such as screws (not shown).

[0220] The second base plate 16 is arranged below the top surface 10u in the Z direction. The second base plate 16 is arranged on the -Z side of the horizontal edge portion 15b of the first base plate 15. Specifically, when the vertical edge portion 15a of the first base plate 15 is divided into two parts in the Z direction, the offset portion 16a, which is the upper side of the Z-shape, is arranged in the second base plate 16 at a Z position that is approximately the same as the +Z side portion (lower part). In addition, the portion of the second base plate 16 corresponding to the bottom edge of the Z-shape is arranged at a Z position that is approximately the same as the +Z side end (lower end) of the left side surface 10l and the right side surface 10r.

[0221] Here, a sealing member (not shown) is provided between the +Y side end (left end) of the offset portion 16a in the second base plate 16 and the right side surface of the vertical edge portion 15a in the first base plate 15 to liquid-tightly seal the gap between the offset portion 16a and the right side surface.

[0222] Similarly, a sealing member (not shown) is provided between the -Y side end (right end) of the offset portion 16a and the left side surface to liquid-tightly seal the gap between the offset portion 16a and the left side surface of the vertical edge portion 17a of the third base plate 17.

[0223] The second base plate 16 is arranged in the X direction between the front surface 10f and the rear surface 10b. The second base plate 16 is fixed to the front surface 10f and the rear surface 10b via the first base plate 15 and the third base plate 17. The second base plate 16 can be directly fastened to the front surface 10f and the rear surface 10b.

[0224] Next, when describing the offset portion 16a in detail, according to this embodiment, the offset portion 16a is formed as a thick plate shape extending along the X and Y directions. Furthermore, when the offset portion 16a is divided into two parts in the X direction, the exit window 6 according to this embodiment is formed in the +X side portion (the rear part in the front-rear direction).

[0225] The exit window 6 includes: an exit hole 61 that penetrates the +X side portion of the offset portion 16a; a cover glass 62 fitted into the exit hole 61; and a sealing member (not shown) that liquid-tightly seals the gap between the exit hole 61 and the cover glass 62 (see [link to documentation]). Figure 10 The cover glass 62 is configured as an optical component that transmits the laser deflected by the laser scanning unit 5 and directs it toward the irradiation area R1. The cover glass 62 may be formed into a rectangular shape corresponding to the shape of the irradiation area R1, for example, a rectangular shape that is approximately similar to the irradiation area R1 but smaller in size.

[0226] In addition, such as Figure 8 , Figure 9 and Figure 10 For example, the upper surface facing the -Z side between the upper and lower surfaces of the offset portion 16a supports the first housing 50 from below. More specifically, the first housing 50 can be fastened to the upper surface of the offset portion 16a, and the first housing 50 can be fixed relative to the second base plate 16 by this fastening. The upper surface may define a portion of the mirror receiving portion H11, rather than supporting the first housing 50 through the upper surface of the offset portion 16a.

[0227] -Third base plate 17-

[0228] like Figure 8 , Figure 9 and Figure 10 For example, the third base plate 17 is constructed as a metal plate-like member extending in the X direction and is housed in the housing 10 (in other words, surrounded by the six surfaces of the housing 10). The thickness of the third base plate 17 is set to be at least greater than the thickness of the left side 10l and the right side 10r of the six surfaces of the housing 10.

[0229] Specifically, the third base plate 17 according to this embodiment has an L-shape when viewed from the -X side. In the following text, the portion of the third base plate 17 corresponding to the vertical edge of the L-shape is referred to as the vertical edge portion 17a, and the portion corresponding to the horizontal edge of the L-shape is referred to as the horizontal edge portion 17b.

[0230] The third base plate 17 is arranged in the Y direction between the left side 10l and the right side 10r, and is located on the -Y side of the second base plate 16. The third base plate 17 is located on the -Y side of the first base plate 15, and the second base plate 16 is inserted therebetween.

[0231] Here, a sealing member (not shown) is provided between the right end (the end on the +Y side) of the horizontal edge portion 17b of the third base plate 17 and the right side surface 10r to liquid-tightly seal the gap between the third base plate 17 and the right side surface 10r of the housing 10.

[0232] The third base plate 17 is arranged in the Z direction below the top surface 10u.

[0233] The third base plate 17 is arranged in the X direction between the front surface 10f and the rear surface 10b. The third base plate 17 is fixed to the front surface 10f and the rear surface 10b by fasteners (not shown).

[0234] Next, when describing the vertical edge portion 17a of the third base plate 17 in detail, according to this embodiment, the vertical edge portion 17a is formed as a thick plate shape extending along the -Z direction and the X direction, which are the irradiation directions. In the Z direction, the dimension of the vertical edge portion 17a of the third base plate 17 is shorter than the dimension of the vertical edge portion 15a of the first base plate 15. The vertical edge portion 17a supports the second base plate 16 from the -Y side.

[0235] Next, when describing the horizontal edge portion 17b of the third base plate 17 in detail, according to this embodiment, the horizontal edge portion 17b is formed into a thick plate shape extending along the X and Y directions. Various components can be attached to the horizontal edge portion 17b. Components attached to the horizontal edge portion 17b include the first control plate 53 of the laser scanning unit 5. Additionally, as... Figure 10 For example, a second heat sink 82, which serves as a heat sink according to this embodiment, is provided on the lower surface of the horizontal side portion 15b facing the -Z side.

[0236] The second heat sink 82 includes a plurality of fins protruding in the +Z direction. These fins are arranged side by side in the Y direction. Each fin is formed to extend along the X direction. The second heat sink 82 is thermally coupled to the components of the excitation light generating unit 2 (e.g., the excitation light source 21) via the third base plate 17.

[0237] That is, in this embodiment, the first heat sink 81 for cooling the laser output section 4 and the second heat sink 82 for cooling the excitation light generation section 2 are configured separately.

[0238] Note that in Figure 10 In the illustrated example, the horizontal side portion 17b and the second heat sink 82 are integral, but the horizontal side portion 17b and the second heat sink 82 can be separate, and are not limited to this.

[0239] Furthermore, when the first base plate 15 and the third base plate 17 are separated as in this embodiment, the first heat sink 81 disposed on the first base plate 15 and the second heat sink 82 disposed on the third base plate 17 are separated from each other. However, this disclosure is not limited to this configuration, and the first heat sink 81 and the second heat sink 82 may be integrated.

[0240] (Outlines of the first receiving part H1 and the second receiving part H2)

[0241] As described above, the internal space of the housing 10 is divided into multiple accommodating sections by the first base plate 15, the second base plate 16 and the third base plate 17.

[0242] As such a receiving portion, the housing 10 according to this embodiment has a first receiving portion H1 provided with a cover glass 62 as an optical component, and a second receiving portion H2 obtained by forming at least a portion of the periphery of the cover glass 62 to protrude from the cover glass 62 toward the irradiation area R1 (see [link]). Figure 10 (The dashed line SI in the middle).

[0243] The first receiving portion H1 and the second receiving portion H2 are arranged side by side along the irradiation direction (-Z direction), with the first receiving portion H1 arranged on one side (-Z side) of the irradiation direction and the second receiving portion H2 arranged on the other side (+Z side) of the irradiation direction. The boundary between the first receiving portion H1 and the second receiving portion H2 is defined by the first base plate 15, the second base plate 16 and the third base plate 17.

[0244] The first accommodating portion H1 accommodates optical components related to the generation of excitation light, the generation of laser light, and the deflection of laser light. Specifically, according to this embodiment, the first accommodating portion H1 accommodates the excitation light generating portion 2, the excitation light guiding portion 3, the laser output portion 4, and the laser scanning portion 5.

[0245] exist Figure 10In the illustrated example, the first receiving portion H1 is constructed as a space surrounded by a portion of the top surface 10u, the upper part of the front surface 10f, the lower part of the rear surface 10b, the upper part of the left side surface 10l, the upper part of the right side surface 10r, and the bottom surface 10d, which is constructed by the second base plate 16, the first base plate 15, and the third base plate 17.

[0246] On the other hand, the second receiving portion H2 houses cooling components related to the cooling of the optical components housed in the first receiving portion H1. Specifically, according to this embodiment, the second receiving portion H2 houses a first heat sink 81 and a second heat sink 82 thermally coupled to the optical components housed in the first receiving portion H1, a first blower fan 83 serving as a blower to blow air onto the first heat sink 81, and a second blower fan 84 serving as a blower to blow air onto the second heat sink 82.

[0247] exist Figure 10 In the illustrative example, the second receiving portion H2 is constructed as a space surrounded by the lower portion of the front surface 10f, the lower portion of the rear surface 10b, the lower portion of the left side surface 10l, the lower portion of the right side surface 10r, the portion of the bottom surface 10d constructed using the non-offset portion 18 excluding the offset portion 16a, the first bottom plate 15, and the third bottom plate 17.

[0248] Furthermore, in both the first receiving portion H1 and the second receiving portion H2, at least the first receiving portion H1 is configured to meet the IP standard defined by the International Electrotechnical Commission (IEC). Therefore, the marking head 1 can be cleaned with water without wetting the optical components, such as the solid-state laser crystal 41 and the first mirror 51a. This contributes to improving the ease of cleaning the marking head 1.

[0249] Furthermore, the housing 10 forming the first receiving portion H1 and the second receiving portion H2 may also have an external shape that makes it less likely for water to accumulate during washing with water. This external shape can be achieved, for example, by tilting the top surface 10u relative to the XY plane. This external shape helps to improve the hygienic properties of the marking head 1.

[0250] At this point, as described above, the front surface 10f is configured to open and close via the cover member 13, making it easy to wipe after washing with water (especially wiping the periphery of the exit window 6). This helps improve the maintainability of the marking head 1.

[0251] (Details of the first accommodating section H1)

[0252] Here, in the first receiving portion H1 and the second receiving portion H2 described above, the first receiving portion H1 is further divided into three receiving portions arranged side by side in a direction orthogonal to the irradiation direction (X direction or Y direction) (e.g., Y direction). Specifically, the housing 10 according to this embodiment includes a mirror receiving portion H11, a crystal receiving portion H12, and a plate receiving portion H13.

[0253] The mirror receiving portion H11 houses the first mirror 51a and the second mirror 52a in the laser scanning unit 5. According to this embodiment, the mirror receiving portion H11 is defined by a first housing 50 capable of hermetically sealing the first mirror 51a and the second mirror 52a. The first housing 50 can be defined using the offset portion 16a as described above. When the first housing 50 is defined using the offset portion 16a, it is preferable to provide a buffer material between the offset portion 16a and the first housing 50. The offset portion 16a is part of the bottom surface 10d, and is therefore susceptible to torsion, vibration, etc., and the buffer material can prevent the first housing and the components housed within the first housing by the buffer material from being affected by such external influences. Alternatively, the mirror receiving portion H11 can be defined using a first base plate 15, similar to the crystal receiving portion H12 described later.

[0254] Here, the first outer casing 50 is formed as a box with an opening facing the -Z side. The first outer casing 50 is held by the first base plate 15.

[0255] The dimensions of the first housing 50 in the X direction are approximately the same as those of the offset portion 16a in the X direction. Similarly, the dimensions of the first housing 50 in the Y direction are approximately the same as those of the offset portion 16a in the Y direction.

[0256] The -Z side opening of the first outer casing 50 can be, for example, Figure 10 The cover 59 is exemplified as a closure. For example, the opening of the first housing 50 may be sealed by the top surface 10u, rather than by the cover 59. When the opening of the first housing 50 is sealed by the top surface 10u, a cushioning material is preferably disposed between the top surface 10u and the first housing 50. Thus, the effects of torsion, vibration, etc., generated on the top surface 10u can be prevented from reaching the first housing 50 and the components housed within the first housing.

[0257] Additionally, at least four through holes 50a, 50b, 50c, and 50d are formed in the first housing 50. Among the four through holes 50a, 50b, 50c, and 50d, the fourth through hole 50a, formed in the left side wall portion of the first housing 50, communicates with the third through hole 15f of the first base plate 15 through the assembly of the marking head 1, and together with the third through hole 15f and the optical component 15h assembled in the third through hole 15f, forms the second entrance window 92.

[0258] On the other hand, among the four through holes 50a, 50b, 50c, and 50d, when the first housing 50, including the offset portion 16a, is divided into two parts in the X direction, a fifth through hole 50b formed at the bottom of the first housing 50 is arranged on the +X side. A defocusing lens 57, serving as an optical element, is disposed in the fifth through hole 50b. The defocusing lens 57 will be described later.

[0259] Furthermore, among the four through holes 50a, 50b, 50c, and 50d, when the first housing 50, including the offset portion 16a, is divided into two parts in the X direction, the sixth through hole 50c, formed in the right side wall portion (the wall portion located on the -Y side) of the first housing 50, is arranged on the +X side. The second motor 52b, constituting the second scanner 52, can be inserted into and fixed to the sixth through hole 50c.

[0260] Furthermore, among the four through holes 50a, 50b, 50c, and 50d, when the first housing 50, including the offset portion 16a, is divided into two parts in the X direction, the seventh through hole 50d, formed in the rear wall portion (the wall portion located on the +X side) of the first housing 50, is arranged on the +X side. In the Z direction, the seventh through hole 50d is arranged on the +Z side of the sixth through hole 50c. Additionally, in the Y direction, the center of the seventh through hole 50d (the center of a circle when the seventh through hole 50d is considered to have a circular cross-section) is arranged at approximately the same position as the optical axis of the cover glass 62. The first motor 51b constituting the first scanner 51 can be inserted into and fixed to the seventh through hole 50d.

[0261] The crystal receiving portion H12 is defined by a support plate (first base plate 15) having a partition surface 15g extending along the irradiation direction, and is arranged on the opposite side (+Y side in the illustrated example) of the mirror receiving portion H11 relative to the partition surface 15g to receive a solid-state laser crystal 41. The crystal receiving portion H12 receives optical components constituting the laser output portion 4, such as the solid-state laser crystal 41. The crystal receiving portion H12 is defined by a second housing 40 capable of hermetically sealing these optical components. According to this embodiment, the crystal receiving portion H12 can receive a nonlinear optical crystal 45 in a sealed state.

[0262] Here, the second outer casing 40 is formed as a box with an opening facing the -Y side. The second outer casing 40 is attached to the vertical edge portion 15a of the first base plate 15 and is supported from the -Y side by the partition surface 15g of the vertical edge portion 15a. The -Y side opening of the second outer casing 40 can be closed by the partition surface 15g.

[0263] Furthermore, the internal space of the crystal housing H12 can be divided into a Q-switch housing H121 and a wavelength conversion unit H122 arranged side-by-side in the X direction. The Q-switch housing H121 is the space for housing the Q-switch 43. The wavelength conversion unit H122 is the space for housing the nonlinear optical crystal 35.

[0264] Here, the Q-switch housing H121 and the wavelength conversion unit H122 are arranged side by side along the X direction, and both are configured as spaces surrounded by the second housing 40 and the separating surface 15g. More specifically, the second housing 40 is composed of a box-shaped body corresponding to the Q-switch housing H121 and a box-shaped body corresponding to the wavelength conversion unit H122, and each of the Q-switch housing H121 and the wavelength conversion unit H122 is a space surrounded by each of the box-shaped bodies and the separating surface 15g. The Q-switch housing H121 and the wavelength conversion unit H122 are optically coupled by an optical component (not shown). Since the Q-switch housing H121 and the wavelength conversion unit H122 are configured as separate spaces in this way, the possibility of a decrease in laser output due to impurities generated in the Q-switch 43 (described later) adhering to the wavelength conversion element 45 (described later) is reduced.

[0265] The plate receiving portion H13 is arranged on the opposite side of the crystal receiving portion H11 relative to the mirror receiving portion H12, and accommodates the first control plate 53. According to this embodiment, the plate receiving portion H13 is defined as the space inside the first receiving portion H1 excluding the mirror receiving portion H11 and the crystal receiving portion H12.

[0266] That is, in this embodiment, the statement "the predetermined component is housed in the mirror housing H11" indicates that the component is surrounded by the first housing 50 on six sides, and the statement "the predetermined component is housed in the crystal housing H12" indicates that the component is surrounded by the second housing 40 and the separating surface 15g on six sides.

[0267] On the other hand, the statement "the predetermined component is housed in the plate housing H13" only indicates that the component is arranged in the space of the housing 10 other than the mirror housing H11 and the crystal housing H12. Of course, the present invention is not limited to this structure, and a housing dedicated to the plate housing H13 (the so-called third housing) can be provided in a similar manner to the first housing 50 and the second housing 40.

[0268] (Details of the second accommodating section H2)

[0269] Meanwhile, the second receiving portion H2 is defined as the +Z side portion of the housing 10 by the first plate-shaped member 18l and the second plate-shaped member 18r, which are plate-shaped members. The second receiving portion H2 has two spaces that are spaced apart in a direction orthogonal to the irradiation direction (e.g., the direction in which the mirror receiving portion H11, the crystal receiving portion H12, and the plate receiving portion H13 are arranged (Y direction)).

[0270] As these two spaces, the second accommodating portion H2 according to this embodiment includes a crystal-side accommodating portion H21 and a light source-side accommodating portion H22. Here, since the crystal-side accommodating portion H21 and the light source-side accommodating portion H22 are arranged to be spaced apart from each other in the Y direction, a space that does not belong to the second accommodating portion H2 is defined between the crystal-side accommodating portion H21 and the light source-side accommodating portion H22.

[0271] According to this embodiment, the first plate-shaped member 18l and the second plate-shaped member 18r are configured to define, in addition to defining a second receiving portion H2 as a space for accommodating members, a space that includes the optical path (the optical path on the +Z side) closer to the irradiation area R1 in the optical path connecting the first mirror 51a, which serves as a scanning mirror, and the laser beam connecting the irradiation area R1. Hereinafter, this space is referred to as the "optical path defining portion," and is indicated by reference numeral H3. According to this embodiment, the optical path defining portion H3 is configured as a space surrounded by the first plate-shaped member 18l, the second plate-shaped member 18r, and the cover glass 62 on the +Y side, -Y side, and -Z side.

[0272] Note that the optical path limiting portion H3 is configured as a space with an opening at the lower end on the +Z side in the illustrated example, but is not limited to this configuration. The +Z side end of the optical path limiting portion H3 may be covered by an optical component such as glass. The optical component covering the +Z side end of the optical path limiting portion H3 may be provided in place of the cover glass 62, or may be used in combination with the cover glass 62.

[0273] Furthermore, in the two spaces constituting the second receiving portion H2, the crystal-side receiving portion H21 houses the first heat sink 81 and the first blower fan 83. The first heat sink 81 and the first blower fan 83 are arranged side by side in the X direction.

[0274] Although overlapping with the above description, according to this embodiment, the first heat sink 81 is thermally coupled to at least one optical component attached to the first base plate 15 in the optical component constituting the laser output section 4.

[0275] On the other hand, such as Figure 13 For example, a first blower fan 83 is arranged on the +X side of the first heat sink 81. The first blower fan 83 is configured using a so-called axial fan and generates airflow through the first heat sink 81 according to a control signal received from the marking machine controller 100. The first blower fan 83 can be arranged on the -X side of the first heat sink 81. Since in this embodiment, the power and signals for driving the first blower fan are supplied via cable 200 (the connection portion of which is covered by a connection cover 14 located on the +X side), if the first blower fan 83 is arranged on the +X side of the first heat sink 81, the space required for wiring is reduced, which is beneficial for reducing the size of the marking machine head 1.

[0276] The airflow generated by the first blower fan 83 flows into the crystal-side receiving portion H21 from the vent 12 provided in the front surface 10f of the housing 10, such as... Figure 13 Arrow Al1 in the diagram illustrates this. The incoming airflow then flows along the X direction from the -X side towards the +X side, thus passing through the first radiator 81 and the first blower fan 83. The airflow passing through the first blower fan 83 exits from an exhaust port located in the rear surface 10b of the housing 10, as shown... Figure 13 The arrow Al2 in the image is an example.

[0277] Here, a first rectifier plate 85, which regulates the direction of airflow, is attached to the rear surface 10b of the housing 10 (see also...). Figure 6 The first rectifier plate 85 guides the airflow direction from the rear surface 10b to the opposite side (-Z side) in the direction from the housing 10 toward the workpiece W, as shown. Figure 13 Arrow Al3 in the diagram illustrates this. Therefore, it is advantageous in preventing collisions between the exhaust air and the workpiece W and in stabilizing the orientation of the workpiece W.

[0278] The light source side accommodating part H22 accommodates the second heat sink 82 and the second blower fan 84. The second heat sink 82 and the second blower fan 84 are arranged side by side in the X direction.

[0279] According to this embodiment, the second heat sink 82 is at least thermally coupled to the excitation light source 21 attached to the third base plate 17 in the optical component housed in the plate housing portion H13.

[0280] On the other hand, such as Figure 12 For example, the second blower fan 84 is arranged on the +X side of the second heat sink 82. The second blower fan 84 is configured as an axial fan, similar to the first blower fan 83, and generates airflow through the second heat sink 82 according to a control signal received from the marking machine controller 100. The second blower fan 84 can be arranged on the -X side of the second heat sink 82. Since in this embodiment, the power and signals for driving the first blower fan are supplied via cable 200 (the connection portion of which is covered by a connection cover 14 located on the +X side), if the first blower fan 83 is arranged on the +X side of the second heat sink 82, the space required for wiring is reduced, which is beneficial for reducing the size of the marking head 1.

[0281] The airflow generated by the second blower fan 84 flows into the light source side receiving portion H22 from the vent 12 provided in the front surface 10f of the housing 10, such as Figure 12 Arrow Ar1 is illustrated in the diagram. The incoming airflow then flows along the X direction from the -X side towards the +X side, thus passing through the second radiator 82 and the second blower fan 84. The airflow passing through the second blower fan 84 exits from an exhaust port located in the rear surface 10b of the housing 10, as shown... Figure 12 The arrow Ar2 in the image is an example.

[0282] Here, a second rectifier plate 86, which regulates the direction of airflow, is attached to the rear surface 10b of the housing 10 (see also...). Figure 6 The second rectifier plate 86 changes the flow direction of the airflow exiting the rear surface 10b to the opposite side (-Z side) from the housing 10 toward the workpiece W, as shown. Figure 12 Arrow Ar3 in the diagram illustrates this. Therefore, it is advantageous in preventing collisions between the exhaust air and the workpiece W and in stabilizing the orientation of the workpiece W.

[0283] In the following text, the structure of the excitation light generating part 2, excitation light guiding part 3, laser output part 4, laser scanning part 5, etc., provided in the first receiving part H1 and the second receiving part H2 will be described in detail with reference to the relative positional relationship in the housing 10.

[0284] (Excitation light generation section 2)

[0285] The excitation light generating unit 2 includes: an excitation light source 21, which generates laser excitation light (excitation light) based on the power (drive current) supplied from the power supply unit 104; a metal plate 22, which supports the excitation light source 21; a temperature control unit 23, which adjusts the temperature of the excitation light source 21; and a light source control board 24, which supports the excitation light source 21 based on the control signal input from the marking machine controller 100.

[0286] The excitation light source 21, metal plate 22, temperature control unit 23, and light source control plate 24 constituting the excitation light generating unit 2 are all housed in the plate housing portion H13. Therefore, the excitation light generating unit 2, especially the excitation light source 21, is arranged on the opposite side of the laser output unit 4, with the mirror housing portion H11 inserted between them. Thus, the excitation light generating unit 2 and the laser output unit 4 can be separated as much as possible.

[0287] -Metal Plate 22-

[0288] Metal plate 22 is constructed as a thin, plate-like component made of metal. For example... Figure 11 and Figure 12 For example, when the third base plate 17 is divided into three parts in the X direction (i.e., the +X side part, the central part, and the -X side part), the metal plate 22 is placed on the -X side part. The metal plate 22 is fastened to the upper surface of the third base plate 17 (more specifically, the upper surface of the horizontal edge portion 17b of the third base plate 17) and is thermally coupled to the second heat sink 82 via the third base plate 17.

[0289] In addition, the excitation light source 21 is placed on the upper surface of the metal plate 22, and the temperature control unit 23 with a plate shape is sandwiched between the lower surface of the metal plate 22 and the third base plate 17.

[0290] -Excitation source 21-

[0291] The excitation light source 21 is configured to receive power supplied from the power supply unit 104 via the cable 200 and generate excitation light corresponding to that power. The output of the excitation light generated by the excitation light source 21 increases with the increase of the drive current.

[0292] According to this embodiment, the excitation light source 21 is configured using a laser diode (LD). The laser oscillating from the excitation light source 21 is collected by a focusing lens (not shown) or the like and output as laser excitation light (excitation light). The excitation light source 21 is optically coupled to an optical cable 31 forming the excitation light guide section 3. The laser excitation light output from the excitation light source 21 is guided to the excitation light guide section 3 via the optical cable 31.

[0293] Furthermore, the excitation light source 21 is formed into a rectangular thin plate shape and is fixed to the upper surface of the metal plate 22 with its thickness direction along the Z direction, such as... Figure 11 and Figure 12 For example, when the third base plate 17 is divided into three parts in the X direction, the excitation light source 21 is arranged on the -X side portion, similar to the metal plate 22. With this arrangement, according to this embodiment, the excitation light source 21 is positioned close to the upstream end of the airflow generated by the second blower fan 84 (the -X side end separated from the second blower fan 84), rather than the downstream end of the airflow (the +X side end adjacent to the second blower fan 84).

[0294] In addition, one side of the excitation light source 21 is tilted towards the +X and +Y sides, and the upstream end of the optical cable 31 is connected to the tilted side.

[0295] -Temperature Control Unit 23-

[0296] The temperature control unit 23 is configured to adjust the temperature of the excitation light source 21 to fall within a predetermined temperature range. Here, the temperature range (predetermined temperature range) achieved by the temperature control unit 23 is set based on the protection environment of the marking head 1, preferably set to be higher than the protection environment of the marking head 1, and more preferably set to 40°C or higher and 60°C or lower.

[0297] Specifically, according to this embodiment, the temperature control unit 23 is configured using a Peltier element of approximately thin plate shape and sandwiched between the upper surface of the third base plate 17 (more specifically, the upper surface of the horizontal edge portion 17b) and the lower surface of the metal plate 22. The temperature control unit 23 dissipates heat from the metal plate 22. A wiring harness (not shown) for supplying current to the temperature control unit 23 is connected to a side portion of the temperature control unit 23. The temperature control unit 23 absorbs heat from the surface on the side of the metal plate 22 by means of the current supplied via the wiring harness, and generates heat from the surface on the side of the third base plate 17.

[0298] -Light source control board 24-

[0299] The light source control board 24 is electrically connected to the marking machine controller 100 and controls the power supplied from the power supply unit 104 to the excitation light source 21.

[0300] According to this embodiment, the light source control board 24 is configured using a circuit board having a generally rectangular thin plate shape. The light source control board 24 is arranged in an orientation in which both the front and rear surfaces extend along the Z and X directions, and is fastened from the -Y side to, for example, the vertical edge portion 17a of the third base plate 17 (the fastening structure of which is not shown).

[0301] Light source control board 24 is also like Figure 12 It is exemplarily arranged on the -Z side of the excitation source 21 in the Z direction and electrically connected to the excitation source 21 by wiring (not shown).

[0302] (Excitation light guide 3)

[0303] The excitation light guiding section 3, which is a light guiding optical system, includes an optical cable 31 that optically couples the excitation light source 21 and the solid-state laser crystal 41 in the laser output section 4, and an optical fiber guide 32 that is configured to wrap the optical cable 31 with a predetermined bending radius. Both the optical cable 31 and the optical fiber guide 32 are housed in the plate receiving section H13 in the housing 10.

[0304] -Fiber Optic Cable 31-

[0305] The optical cable 31 is constructed using so-called optical fibers, with one end (when viewed along the direction of light propagation) connected to the excitation light source 21, and the other end (located on the opposite side of said one end in the direction of light propagation) connected to the first incident window 91.

[0306] The other end of the optical cable 31 is optically coupled to the solid-state laser crystal 41 via the first entrance window 91 and the first deflection mirror 42, which will be described later. In addition, at least a portion of the middle section connecting the one end and the other end of the optical cable 31 is wound around the optical fiber guide 32.

[0307] The optical cable 31 can guide the excitation light generated in the excitation source 21 to the solid-state laser crystal 41.

[0308] -Fiber Optic Guide 32-

[0309] The fiber optic guide 32 is configured to wrap around the optical cable 31 with a predetermined bending radius. The bending radius of the fiber optic guide 32 is set to be equal to or greater than the minimum bending radius of the optical cable 31.

[0310] Specifically, according to this embodiment, the fiber optic guide 32 is formed into a generally cylindrical spool shape capable of winding the optical cable 31 several times. The fiber optic guide 32 is arranged with the central axis of the cylindrical shape along the Y direction and is attached to the vertical edge portion 17a of the third base plate 17 from the -Y side.

[0311] In addition, such as Figure 12 For example, the fiber optic guide 32 is arranged from the front end of the light source control board 24 to the rear end of the second control board 54. Figure 11 For example, the fiber optic guide 32 is arranged in the Y direction on the +Y side of the light source control board 24 and the second control board 54, and on the -Y side of the right side wall portion of the first housing 50.

[0312] (Laser output unit 4)

[0313] The laser output section 4 includes: a first deflecting mirror 42 that bends the optical path of the excitation light; a solid-state laser crystal 41 that generates a fundamental wave based on the excitation light; a Q-switch 43 that performs pulsed oscillation of the fundamental wave based on a control signal input from the marking machine controller 100; and a first reflecting mirror 44 that reflects the fundamental wave. These optical components are hermetically housed in a Q-switch housing H12, which is obtained by dividing the crystal housing H121 into two parts. Note that at least the solid-state laser crystal 41 of these optical components may also be housed in a wavelength conversion section H122.

[0314] The laser output unit 4 further includes: a nonlinear optical crystal 45 that receives the laser (fundamental wave) generated by the solid-state laser crystal 41 and converts the wavelength of the laser to a shorter wavelength side; a second reflector 46 that, together with the first reflector 44, forms a resonant optical path; a laser separation unit 47 that separates the laser whose wavelength has been converted to the shorter wavelength side from the resonant optical path; and a second deflecting mirror 48 that bends the optical path of the laser separated by the laser separation unit 47. These optical components are hermetically housed in a wavelength conversion unit H12 obtained by dividing the crystal housing H122 into two parts.

[0315] Specifically, the laser output unit 4 according to this embodiment is configured as a so-called intracavity laser oscillator. That is, the Q switch 43, the first deflecting mirror 42, the solid-state laser crystal 41, the first separator 47a constituting the laser separation unit 47, the second wavelength conversion element 45b which is a nonlinear optical crystal 45, and the first wavelength conversion element 45a which is a nonlinear optical crystal 45 are arranged in sequence along the path from the first reflector 44 to the second reflector 46. In other words, the first reflector 44, the second reflector 46, and the components between the first reflector 44 and the second reflector 46 constitute a resonant unit, and the first wavelength conversion element 45a and the second wavelength conversion element 45b are arranged inside the resonant unit. In this embodiment, the laser output unit 4 is configured as an intracavity laser oscillator, but it can be an external cavity laser oscillator, in which the nonlinear optical crystal 45 is not located between the first reflector 44 and the second reflector 46.

[0316] Here, the first deflecting mirror 42 is arranged to guide the optical axis (the optical axis extending along the Y direction) of the excitation light guided by the excitation light guide 3 and passing through the first incident window 91. Figure 11 (The reference numeral A1 in the attached figure indicates) and as shown in the figure below Figure 11 and Figure 12 The optical axis (the optical axis extending along the X direction) of the resonant optical path, indicated by reference numeral A2 in the attached figure, is merged.

[0317] Additionally, for example, the first separator 47a is arranged to separate the laser including the third harmonic from the resonant optical path connecting the first reflector 44 and the second reflector 46. That is, the laser output unit 4 converts the wavelength of the laser containing photons excited and emitted from the solid-state laser crystal 41 to a shorter wavelength side, while amplifying the laser through multiple reflections between the first reflector 44 and the second reflector 46. The amplified laser is thus separated by the laser separator 47 and output from the laser output unit 4.

[0318] Additionally, the laser output section 4 includes a Q-switch driver 49, which drives the Q-switch 43, which is a component disposed outside the crystal housing H12. Figure 13 For example, the Q switch driver 49 is attached to the +X side portion obtained by dividing the top surface 10u into two parts in the X direction. The Q switch driver 49 is also arranged on the +Y side of the vertical edge portion 15a of the first base plate 15.

[0319] Note that the Q switch driver 49 can be attached to the left side 10l, rear surface 10b, etc. of the housing 10. The Q switch driver 49 can be attached to a plate-like member that forms the outer surface of the housing 10.

[0320] -First reflecting mirror 44-

[0321] The first reflector 44 is housed in the Q-switch receiving portion H121 and is configured to reflect at least the fundamental frequency. The first reflector 44, together with the second reflector 46, constitutes a resonator. Note that, according to this embodiment, the first reflector 44 is configured as a total reflection mirror that reflects the fundamental frequency.

[0322] In addition, according to this embodiment, the first reflector 44 is attached to the partition surface 15g of the defined crystal receiving portion H12 and is thermally coupled to the first heat sink 81 via the first base plate 15.

[0323] -Second reflecting mirror 46-

[0324] The second reflector 46 is housed in the wavelength conversion section H122 and is configured to reflect at least the fundamental wave. The second reflector 46, together with the first reflector 44, constitutes a resonator. Note that, according to this embodiment, the second reflector 46 is configured as a total reflection mirror, which, in addition to reflecting the fundamental wave, also reflects the second harmonic with a wavelength higher than the fundamental wave and the third harmonic with a wavelength higher than the second harmonic.

[0325] Furthermore, according to this embodiment, the second reflector 46 is attached to the separating surface 15g in a similar manner to the first reflector 44, and is thermally coupled to the first heat sink 81 via the first base plate 15. Thus, the first reflector 44 and the second reflector 46, which serve as the two ends of the resonant optical path, are preferably positioned by the same first base plate 15 so as to form the resonant optical path with high accuracy as described above.

[0326] -Q switch 43-

[0327] The Q switch 43 is housed in the Q switch housing H121 and is configured to perform pulse oscillation of the fundamental wave generated by the solid-state laser crystal 41. Specifically, the Q switch 43 is arranged on the optical axis of the resonant optical path (the optical path of the resonator) and inserted between the solid-state laser crystal 41 and the first reflector 44.

[0328] According to this embodiment, the Q-switch 43 is a so-called active Q-switch that operates based on an RF signal applied from the Q-switch driver 49. That is, if the Q-switch 43 is temporarily turned on, the laser incident on the Q-switch 43 is deflected and separated from the resonant optical path. In this case, multiple reflections of the laser are limited, thus promoting the generation of the inverse distribution in the solid-state laser crystal 41.

[0329] Furthermore, if the Q-switch 43 switches from the on state to the off state for a predetermined period of time, the laser undergoes multiple reflections without being separated by the Q-switch 43, and is amplified through these multiple reflections. In this case, the high-output laser is pulsed and oscillated.

[0330] In addition, according to this embodiment, the Q switch 43 is attached to the partition surface 15g in a similar manner to the first reflector 44, and is thermally coupled to the first heat sink 81 via the first base plate 15.

[0331] -Q Switch Driver 49-

[0332] The Q-switch driver 49 is housed inside the housing 10 and outside the crystal housing H12, and generates an RF signal to be applied to the Q-switch 43 based on a control signal input from the marking machine controller 100.

[0333] Q switch driver 49 is attached to top surface 10u via a metal support plate and is thermally coupled to housing 10 via the support plate and top surface 10u.

[0334] -First deflector 42-

[0335] The first deflecting mirror 42 is housed in the Q-switch housing H121 and is arranged in the X direction between the Q-switch 43 and the solid-state laser crystal 41. According to this embodiment, the first deflecting mirror 42 is configured using a so-called beam splitter. The first deflecting mirror 42 reflects all the excitation light incident from the first entrance window 91 toward the +Y side so that it propagates along the X direction. On the other hand, the first deflecting mirror 42 transmits the fundamental wave propagating along the X direction without reflecting it. The fundamental wave transmitted through the first deflecting mirror 42 reaches the first reflecting mirror 44 via the Q-switch 43.

[0336] In addition, according to this embodiment, the first deflecting mirror 42 and the first reflecting mirror 44 are similarly attached to the separating surface 15g and thermally coupled to the first heat sink 81 via the first base plate 15.

[0337] -Solid-state laser crystal 41-

[0338] A solid-state laser crystal 41 is housed within a Q-switch housing H121 and is made of a laser medium capable of forming an inverse distribution. The solid-state laser crystal 41 is configured to perform stimulated emission corresponding to the incident laser excitation light when the laser excitation light is incident on its end face. The wavelength (so-called fundamental wavelength) of the photons emitted by stimulated emission increases or decreases depending on the specific configuration of the solid-state laser crystal 41, and in this embodiment is within the infrared range of approximately 1 μm.

[0339] In this embodiment, rod-shaped Nd:YVO4 (yttrium vanadate) is used as the laser medium constituting the solid-state laser crystal 41. Laser excitation light is incident from one end face of the rod-shaped solid-state laser crystal 41, and a laser beam with a fundamental wavelength (the so-called fundamental wave) is emitted from the other end face (a so-called unidirectional excitation scheme via end face pumping). In this embodiment, the fundamental wavelength is set to 1064 nm. On the other hand, the wavelength of the excitation light is set near the center wavelength of the absorption spectrum of Nd:YVO4 to promote stimulated emission. However, other laser media, such as rare-earth-doped YAG, YLF, and GdVO4, can be used, and this example is not limited to this one. Various solid-state laser media can be used depending on the application of the laser processing apparatus L.

[0340] In addition, according to this embodiment, the solid-state laser crystal 41 is attached to the separation surface 15g in a similar manner to the first reflector 44, and is thermally coupled to the first heat sink 81 via the first base plate 15.

[0341] -Nonlinear Optical Crystal 45-

[0342] The nonlinear optical crystal 45 is configured by combining a first wavelength conversion element 45a that receives the fundamental wave generated by the solid-state laser crystal 41 and generates a second harmonic with a wavelength higher than that of the fundamental wave, and a second wavelength conversion element 45b that generates a third harmonic with a wavelength higher than that of the second harmonic. Both the first wavelength conversion element 45a and the second wavelength conversion element 45b are housed in the wavelength conversion section H122.

[0343] The first wavelength conversion element 45a is a nonlinear optical crystal capable of generating a second harmonic, and is configured to double the frequency of the fundamental wave when the fundamental wave is incident and emit the fundamental wave as a second harmonic (second harmonic generation: SHG). That is, the wavelength of the laser generated when the fundamental wave is incident on the first wavelength conversion element 45a is in the visible light region of about 500 nm. In particular, in this embodiment, the wavelength of the second harmonic is set to 532 nm.

[0344] Typically, the conversion efficiency of the first wavelength conversion element 45a is less than 100%. Therefore, when the fundamental wave is incident on the first wavelength conversion element 45a, a laser beam consisting of a mixture of the fundamental wave and the second harmonic is emitted.

[0345] Note that in this embodiment, LBO (LiB3O3) is used as the first wavelength conversion element 45a. However, various organic nonlinear optical materials, inorganic nonlinear optical materials, etc., can be used as the first wavelength conversion element 45a, and are not limited to this example.

[0346] The second wavelength conversion element 45b is a nonlinear optical crystal capable of generating a third harmonic, and is configured to convert the fundamental and second harmonics into a third harmonic with a frequency three times that of the fundamental frequency when the fundamental and second harmonics are incident (specifically, when the propagation directions of the fundamental and second harmonics are the same), and to emit the third harmonic (third harmonic generation: THG). That is, the wavelength of the laser generated when the fundamental and second harmonics are incident on the second wavelength conversion element 45b is in the ultraviolet region of about 350 nm (specifically, near the boundary between the visible and ultraviolet regions). In particular, in this embodiment, the wavelength of the third harmonic is set to 355 nm.

[0347] Typically, the conversion efficiency of the second wavelength conversion element 45b is less than 100%. Therefore, when the fundamental wave and the second harmonic are incident on the first wavelength conversion element 45a, a laser beam consisting of a mixture of the fundamental wave, the second harmonic, and the third harmonic is emitted.

[0348] Note that in this embodiment, LBO (LiB3O3) is used as the second wavelength conversion element 45b. However, various organic nonlinear optical materials, inorganic nonlinear optical materials, etc., can be used as the second wavelength conversion element 45b, and are not limited to this example.

[0349] In addition, according to this embodiment, the nonlinear optical crystal 45 is attached to the partition surface 15g in a similar manner to the first reflector 44, and is thermally coupled to the first heat sink 81 via the first base plate 15.

[0350] -Laser Separation Section 47-

[0351] The laser separation unit 47 is housed in the wavelength conversion unit H122 and is configured to separate the third harmonic from the resonant optical path of the laser to generate a UV laser for laser processing.

[0352] The laser separation unit 47 includes multiple optical components. Specifically, according to this embodiment, the laser separation unit 47 includes: a first separator 47a for extracting the second and third harmonics from the laser; a concave lens 47b for adjusting the beam diameter of the laser including the second and third harmonics; and a second separator 47c for extracting the third harmonic from the laser.

[0353] The first splitter 47a is a so-called beam splitter and is configured to transmit the fundamental wave and reflect the second and third harmonics. The first splitter 47a is arranged to intersect the optical axis of the resonant optical path connecting the first reflector 44 and the second reflector 46, and is in an orientation tilted approximately 45 degrees relative to the optical axis. The laser reflected by the first splitter 47a propagates towards the -Z side.

[0354] The concave lens 47b is configured to transmit the laser reflected by the first splitter 47a, i.e., the laser separated from the resonant optical path, thereby expanding the beam diameter of the transmitted laser. In this embodiment, the concave lens 47b is inserted between the first splitter 47a and the second splitter 47c, but is not limited to this arrangement.

[0355] The second splitter 47c is a beam splitter similar to the first splitter 47a, and is configured to transmit the second harmonic and reflect the third harmonic. The second splitter 47c is arranged to intersect the optical axis of the laser beam that has passed through the concave lens 47b, and is tilted at approximately 45 degrees relative to the optical axis. The laser beam reflected by the second splitter 47c propagates towards the -X side.

[0356] Furthermore, the optical components constituting the laser separation section 47 are attached to the separation surface 15g in a similar manner to the first reflector 44, and are thermally coupled to the first heat sink 81 via the first base plate 15 (see also...). Figure 10 ).

[0357] Thus, preferably, the first reflector 44, the second reflector 46, the Q switch 43, the first deflector 42, the solid-state laser crystal 41, the nonlinear optical crystal 45, and the laser separation unit 47 are all positioned by the same first base plate 15 so as to generate laser with high accuracy in the optical path.

[0358] -Second deflector 48-

[0359] The second deflecting mirror 48 is housed in the wavelength conversion section H122 and is arranged on the -X side of the other optical components housed in the crystal housing section H12. According to this embodiment, the second deflecting mirror 48 is configured using a so-called beam splitter. The second deflecting mirror 48 reflects the laser light that passes through the second splitter 47c and propagates towards the -X side. The laser light reflected by the second deflecting mirror 48 is deflected to propagate towards the -Y side.

[0360] Furthermore, according to this embodiment, the second deflecting mirror 48 is attached to the separating surface 15g in a similar manner to the first reflecting mirror 44, and is thermally coupled to the first heat sink 81 via the first base plate 15. In this way, the second deflecting mirror 48, which emits laser light from the laser output section 4 to the outside, is preferably positioned via the first base plate 15 in a similar manner to the first reflecting mirror 44, so as to improve the accuracy of the position of the generated laser light output.

[0361] Finally, the laser beam deflected by the second deflector 48 passes through the second entrance window 92 and enters the first housing 50 from the laser output section 4. Figure 11 For example, the laser entering the first housing 50 propagates toward the -Y side and reaches the third deflector 56 of the laser scanning unit 5.

[0362] (Laser scanning unit 5)

[0363] In addition to the first scanner 51 and the second scanner 52, the first control board 53 and the second control board 54 mentioned above, the laser scanning unit 5 also includes an intermediate deflection unit 55, a third deflection mirror 56, a defocusing lens 57 as an optical element, and a first housing 50 that at least accommodates the first mirror 51a of the first scanner 51 and the second mirror 52a of the second scanner 52.

[0364] In the following text, these components will be described in the order in which the laser arrives during laser oscillation.

[0365] -Third deflector 56-

[0366] like Figure 11 For example, a third deflector 56 is housed in a first housing 50 and is arranged side-by-side with the second deflector 48 and the second entrance window 92 along the Y direction, and is located on the -Y side of these components. The third deflector 56 is arranged in the Y direction between the second entrance window 92 and the light source control plate 24 (in other words, on the -Y side of the second entrance window 92 and on the +Y side of the light source control plate 24).

[0367] The third deflecting mirror 56 is configured, for example, as a total internal reflection mirror, to receive the laser light entering the first housing 50 and propagating towards the -Y side, and to reflect the laser light towards the +X side. The laser light reflected by the third deflecting mirror 56 reaches the second mirror 52a of the second scanner 52. Note that the third deflecting mirror 56 can be configured using a mirror that partially transmits the laser light, instead of using a total internal reflection mirror. In this case, the output of the laser light entering the first housing 50 from the laser output section 4 can be detected using the partially transmitted laser light.

[0368] -Second Scanner 52-

[0369] like Figure 14 , Figure 15 and Figure 16 For example, the second scanner 52 includes a second mirror 52a that scans a laser in a predetermined second direction and a second motor 52b that rotatably supports the second mirror 52a. The second mirror 52a is housed in a mirror housing portion H11, and most of the second motor 52b is housed in a plate housing portion H13.

[0370] The second mirror 52a is configured as a so-called galvanometer mirror. The second mirror 52a is via... Figure 11 The exemplified third deflector 56 receives the laser generated by the solid-state laser crystal 41. The second mirror 52a reflects the received laser toward the +Z side to deflect the laser. When the second mirror 52a rotates, it scans the irradiation position of the laser in the irradiation area R1 in the second direction.

[0371] Here, the second direction, which is the deflection direction of the second mirror 52a, is a direction orthogonal to both the first direction, which is the deflection direction of the first mirror 51a, which is the first scanner 51, and the -Z direction, which is the irradiation direction, and in this embodiment, it is set to be consistent with the X direction.

[0372] Specifically, the second mirror 52a is a total internal reflection mirror with a generally rectangular plate shape, and is housed within the mirror housing H11 with its distal end supported by the rotation axis of the second motor 52b. The second mirror 52a rotates integrally with the axis of the second motor 52b and is configured to rotate about a predetermined second rotation axis Ac2 via the second motor 52b. The deflection of the second mirror 52a and the irradiation position of the laser in the second direction are determined based on the rotation angle of the second mirror 52a about the second rotation axis Ac2.

[0373] Here, as Figure 14 and Figure 15 For example, the second rotation axis Ac2, which is the rotation center of the second mirror 52a, extends orthogonally to the first rotation axis Ac1, which is the rotation center of the first mirror 51a, and the Z direction, which is the irradiation direction, and in this embodiment, it is set to extend along the Y direction.

[0374] The second mirror 52a is also arranged side by side with the third deflecting mirror 56 along the X direction, and is located on the +X side of the third deflecting mirror 56. The second mirror 52a is further located on the -Y side of the first mirror 51a and the defocusing lens 57 in the Y direction, and on the -Z side of the first mirror 51a and the defocusing lens 57 in the Z direction.

[0375] The second motor 52b is a current motor configured as a DC motor or the like, and is formed in a generally cylindrical shape with the second rotation axis Ac2 as its central axis. The distal end (+Y side end) of the second motor 52b in the direction of the second rotation axis Ac2 (Y direction) is inserted into the sixth through hole 50c of the first housing 50. On the other hand, the other end located on the opposite side of the distal end in the direction of the second rotation axis Ac2 (the -Y side end of the second motor 52b) protrudes from the sixth through hole 50c and is exposed inside the plate receiving portion H13.

[0376] The second scanner 52 reflects the laser through the second mirror 52a. The laser reflected by the second mirror 52a is emitted from the exit window 6 via the intermediate deflection part 55, the first mirror 51a, and the defocusing lens 57. At this time, the second scanner 52 can use the laser to scan the irradiated area R1 in the second direction (X direction) by adjusting the reflection angle of the laser by the second motor 52b.

[0377] -Middle deflection section 55-

[0378] like Figure 14 , Figure 15 and Figure 16 For example, the intermediate deflection section 55 includes an intermediate mirror 55a that relays the laser between the second mirror 52a and the first mirror 51a, and a base 55b that supports the intermediate mirror 55a. Both the intermediate mirror 55a and the base 55b are housed in the mirror receiving section H11.

[0379] Intermediate mirror 55a is configured, for example, using a total reflection mirror. Intermediate mirror 55a allows laser light reflected by second mirror 52a to enter and be reflected towards first mirror 51a.

[0380] Intermediate mirror 55a is also arranged side-by-side with second mirror 52a along the Z direction and located on the +Z side of second mirror 52a. Intermediate mirror 55a is further arranged side-by-side with first mirror 51a along the Y direction and located on the -Y side of first mirror 51a.

[0381] Intermediate mirror 55a receives the laser light reflected by second mirror 52a and propagating towards the +Z side, and reflects the laser light towards the +Y side. The laser light reflected by intermediate mirror 55a reaches first mirror 51a of first scanner 51.

[0382] A base 55b is disposed at the bottom of the first housing 50 and supports the intermediate mirror 55a from the +Z side. According to this embodiment, the base 55b supports the intermediate mirror 55a so as to guide the mirror surface toward the +Y and -Z sides.

[0383] -First Scanner 51-

[0384] like Figure 14 , Figure 15 and Figure 16 For example, the first scanner 51 includes a first mirror 51a that scans a laser in a predetermined first direction and a first motor 51b that rotatably supports the first mirror 51a. The first mirror 51a is housed in a mirror housing portion H11, and most of the first motor 51b is housed in a plate housing portion H13.

[0385] The first mirror 51a is configured as a so-called galvanometer mirror. The first mirror 51a receives the laser reflected by the intermediate mirror 55a. The first mirror 51a reflects the received laser toward the +Z side to deflect the laser. When the first mirror 51a rotates, it scans the irradiation position of the laser in the irradiation area R1 in a first direction.

[0386] Here, the first direction, which is the deflection direction of the first mirror 51a, is a direction orthogonal to both the second direction mentioned above and the Z direction, which is the illumination direction, such as... Figure 14 and Figure 15 For example, and in this embodiment it is set to be aligned with the Y direction.

[0387] Note that the first direction and the second direction are not limited to the configuration of this embodiment. The first direction may be consistent with the X direction, the second direction may be consistent with the Y direction, or the first direction and the second direction may be tilted relative to the X direction and the Y direction, respectively.

[0388] Specifically, the first mirror 51a is a total internal reflection mirror having a generally rectangular plate shape, and is housed within the mirror housing H11 with its distal end supported by the rotation axis of the first motor 51b. The first mirror 51a rotates integrally with the axis of the first motor 51b and is configured to rotate about a predetermined first rotation axis Ac1 via the first motor 51b. The deflection amount of the first mirror 51a and the irradiation position of the laser in the first direction are determined based on the rotation angle of the first mirror 51a about the first rotation axis Ac1.

[0389] Here, the first rotation axis Ac1, which serves as the rotation center of the first mirror 51a, extends orthogonally to the second rotation axis Ac2, which serves as the rotation center of the second mirror 52a, and to the -Z direction, which serves as the irradiation direction, and in this embodiment, it is set to extend along the X direction.

[0390] With this configuration, both the first rotation axis Ac1 and the second rotation axis Ac2 extend in a direction different from the irradiation direction (e.g., a direction orthogonal to the irradiation direction (X or Y direction)). Note that the orthogonality of the first rotation axis Ac1 and the second rotation axis Ac2 to the irradiation direction is not necessary, and an inclination angle of up to, for example, 20 degrees relative to the X or Y direction can be provided.

[0391] In addition, in this embodiment, the first rotation axis Ac1 is offset to the +Z side relative to the second rotation axis Ac2, but according to the structure of the intermediate mirror 55a, the first rotation axis Ac1 and the second rotation axis Ac2 can be arranged on the same plane.

[0392] The first mirror 51a is also arranged side-by-side with the intermediate mirror 55a along the Y direction and is located on the +Y side of the intermediate mirror 55a. The first mirror 51a is further arranged side-by-side with the cover glass 62 and the defocusing lens 57 along the Z direction and is located on the -Z side of the defocusing lens 57. As a result of this configuration, according to this embodiment, the first mirror 51a is arranged to face the workpiece W and the irradiation area R1, with the exit window 6 inserted therebetween. The first mirror 51a is located directly above the exit window 6, and no other reflector is inserted between the first mirror 51a and the exit window 6. Although in this embodiment, for ease of description, the first mirror 51a is defined under the assumption that no reflector is inserted between the first mirror 51a and the exit window 6, the insertion of a specific reflector between the first mirror and the exit window 6 is not excluded. In the case where a reflector is inserted between the first mirror 51a and the exit window 6, the mirror that scans the irradiation position in the irradiation area R1 immediately before reaching the irradiation area R1 is considered the first mirror 51a. Note that due to the rotation of the second mirror 52a and the first mirror 51a, the area through which the laser passes expands between the first mirror 51a and the exit window 6. Therefore, the inserted reflector has a size sufficient to cover the area through which the laser passes. Thus, it is preferable that the reflector is not inserted between the first mirror 51a and the exit window 6 to reduce the size of the marking head 1.

[0393] The first motor 51b is a current motor configured as a DC motor or the like, and is formed in a generally cylindrical shape with the first rotation axis Ac1 as its central axis. The distal end (-X side end) of the first motor 51b in the direction of the first rotation axis Ac1 (X direction) is inserted into the seventh through hole 50d of the first housing 50. On the other hand, the other end located on the opposite side of the distal end in the direction of the first rotation axis Ac1 (the +Y side end of the first motor 51b) protrudes from the seventh through hole 50d and is exposed inside the plate receiving portion H13.

[0394] The first scanner 51 reflects the laser through the first mirror 51a. The laser reflected by the first mirror 51a passes through the defocusing lens 57 and is emitted from the exit window 6. At this time, the first scanner 51 can use the laser to scan the irradiated area R1 in the first direction (Y direction) by adjusting the reflection angle of the laser by the first motor 51b.

[0395] -Defocusing Lens 57-

[0396] The defocusing lens 57 is configured to transmit the laser light deflected by the first mirror 51a and diffuse the laser light in an outward direction orthogonal to the illumination direction. When the Z direction is the illumination direction as in this embodiment, the outward direction, which serves as the diffusion direction, is along the XY plane.

[0397] Specifically, the defocusing lens 57 may include, for example, a biconcave lens. In this case, the defocusing lens 57 is fitted into the fifth through-hole 50b with its central axis along the Z direction.

[0398] The defocusing lens 57 is also arranged in a straight line connecting the central portion of the first mirror 51a and the cover glass 62 in the exit window 6. The defocusing lens 57 is arranged in the Z direction between the first mirror 51a and the cover glass 62 (in other words, on the +Z side of the first mirror 51a and the -Z side of the cover glass 62).

[0399] The defocusing lens 57 is further arranged such that the optical axis of the defocusing lens 57 is coaxial with the optical axis of the cover glass 62. In the following text, the optical axes of the defocusing lens 57 and the cover glass 62 are collectively referred to as the "laser emission axis," which is indicated by reference numeral A1 in the accompanying drawings (see also [reference 1]). Figure 4 The laser emission axis A1 is configured to extend along the Z direction and be offset toward the +Y side relative to the second mirror 52a and the intermediate mirror 55a, and intersect the mirror surface of the first mirror 51a.

[0400] Note that the configuration of the defocusing lens 57 as an optical element is not limited to using a single biconcave lens. Multiple lenses can be used to configure the optical element, or lenses other than a biconcave lens can be used. Furthermore, the laser scanning unit 5 can be configured without using the defocusing lens 57.

[0401] -Second Control Panel 54-

[0402] The second control board 54 is electrically connected to the marking machine controller 100 and the second scanner 52, and is configured to control the second scanner 52. More specifically, the second control board 54 can control the rotation angle of the second mirror 52a by driving the second motor 52b according to the control signal input from the marking machine controller 100.

[0403] According to this embodiment, the second control board 54 is configured using a circuit board having a generally rectangular thin plate shape. The second control board 54 is received in the board receiving portion H13 with both its front and rear surfaces extending along the Z and X directions, and is fastened, for example, from the -Y side to the vertical edge portion 17a of the third base plate 17.

[0404] like Figure 12 For example, the second control board 54 is arranged on the +X side of the light source control board 24 in the X direction and on the -Y side of the first housing 50 and the light source control board 24 in the Y direction. The second control board 54 is also electrically connected to the second motor 52b via wiring (not shown).

[0405] -First Control Panel 53-

[0406] The first control board 53 is electrically connected to the marking machine controller 100 and the first scanner 51, and is configured to control the first scanner 51. More specifically, the first control board 53 can control the rotation angle of the first mirror 51a by driving the first motor 51b according to the control signal input from the marking machine controller 100.

[0407] According to this embodiment, the first control board 53 is configured using a circuit board having a generally rectangular thin plate shape. The first control board 53 is received in the board receiving portion H13 with both its front and rear surfaces extending along the Z and X directions, and is fastened, for example, from the -Y side to the vertical edge portion 17a of the third base plate 17.

[0408] like Figure 12 For example, the first control board 53 is also arranged side by side with the second control board 54 along the X direction, and is located on the +X side of the light source control board 24 and the second control board 54. The first control board 53 is also electrically connected to the first motor 51b via wiring (not shown).

[0409] <Main Operation and Main Machining of Laser Processing Unit L>

[0410] Figure 19 This is a flowchart illustrating the basic control process of the laser processing apparatus L. References will be made below. Figure 19 Describe the main operation and main processing of the laser processing device L.

[0411] First of all, Figure 19 In step S1, an input is received of the machining pattern Pp to be printed on the setting plane R2, which is displayed on the display unit 301. This input is received by the receiving unit 101 and read by the control unit 103. The control unit 103 generates printing data based on the input machining pattern Pp. The printing data includes the laser trajectory (so-called scan line) on the workpiece W set according to the machining pattern Pp.

[0412] In the subsequent step S2, the control unit 103 sets the voltage (power supply voltage) required to be supplied to the excitation light source 21. (See later...) Figure 20 and Figure 21 Describe the details of this setting.

[0413] In the subsequent step S3, the control unit 103 inputs a control signal to the light source control board 24, etc., so that power is supplied to the excitation light source 21. Therefore, excitation light is generated in the excitation light generation unit 2, and the excitation light is input to the laser output unit 4.

[0414] In the subsequent step S4, when the control unit 103 inputs a control signal to the Q-switch driver 49, it controls the Q-switch 43 to turn on and off, causing the UV laser to pulsate. The laser is output from the laser output unit 4 and input to the laser scanning unit 5.

[0415] In the subsequent step S5, the control unit 103 inputs control signals to the first control board 53, the second control board 54, etc., to perform a two-dimensional scan using a UV laser. The two-dimensional scan mentioned herein refers to the laser irradiation position moving in a two-dimensional direction (i.e., along the XY plane in this embodiment). Note that the shape of the workpiece W irradiated by the laser is not limited to a two-dimensional shape along the XY plane, but can be a three-dimensional shape with different positions in the Z direction (a shape with varying height in the Z direction).

[0416] At this time, the UV laser deflected by the second mirror 52a is reflected by the intermediate mirror 55a, and then deflected again by the first mirror 51a in the laser scanning unit 5. Figure 10 and Figure 18 For example, the UV laser deflected by the first mirror 51a sequentially passes through the defocusing lens 57 and the cover glass 62, and then passes through the aforementioned optical path limiting part H3, thereby being emitted towards the outside of the housing 10. The UV laser emitted towards the outside of the housing 10 is emitted towards the irradiation area R1 provided on the workpiece W. The UV laser emitted onto the workpiece W performs a two-dimensional scan in the irradiation area R1 in order to delineate scan lines according to the printing data.

[0417] <Countermeasures for Heating in Excitation Light Source 21>

[0418] Figure 20 It is a block diagram used to describe the circuit structure according to the power supply unit 104, and Figure 21 This is a flowchart illustrating the control process according to the power supply unit 104. As described herein, the excitation light source 21 is configured to supply power from the power supply unit 104, which serves as the power source.

[0419] Specifically, the power supply unit 104 according to this embodiment includes: a DC power supply 104a, which converts externally supplied AC power into DC power and outputs DC power; and a DC / DC converter 104b, which performs DC / DC conversion on the power output from the DC power supply 104a, such as... Figure 20 For example, the power converted by the DC / DC converter 104b (specifically, DC power) is input to the excitation light source 21 configured using an LD.

[0420] Here, a relay 25 is inserted between the DC / DC converter 104b and the excitation light source 21. The relay 25 opens and closes the electrical contact between the DC / DC converter 104b and the excitation light source 21.

[0421] The relay 25 can be configured using, for example, a field-effect transistor (FET). The relay 25 according to this embodiment includes an FET and opens and closes electrical contacts based on control signals input from the PLC 902 or control unit 103 via the light source control board 24.

[0422] Traditionally, the output voltage from the DC / DC converter 104b to the excitation source 21 is a fixed value, relayed through a relay. Furthermore, variations in the forward voltage (so-called Vf) of the excitation source 21 cause heating in the relay 25. Note that the cause of Vf variation could be, for example, a change in the quality of the excitation source 21 itself, and the Vf required to output a specific laser varies. Therefore, to ensure minimum laser output even under worst-case conditions, a margin needs to be provided for the output of the DC / DC converter 104b (in other words, the output voltage of the DC / DC converter 104b is set large).

[0423] However, with this conventional configuration, the heat generated in the relay 25 tends to increase. This leads to an increase in the size of heat-generating structures such as heat sinks, which may cause problems when the excitation light source 21 is built into the marking head 1.

[0424] Therefore, according to this embodiment, the control unit 103 controls the output voltage that is output from the power supply unit 104, which serves as a power source, and input to the excitation light source 21. Therefore, in this embodiment, the control unit 103 and the DC / DC converter 104b are electrically connected, as shown below. Figure 20 For example, the output (output voltage) from the DC / DC converter 104b is adjusted based on the control signal output from the control unit 103.

[0425] Furthermore, according to this embodiment, the control unit 103 detects a voltage drop occurring in the relay 25 and controls the output voltage based on the detected voltage drop. Specifically, the control unit 103 controls the output voltage such that the detected voltage drop becomes a predetermined value. Therefore, as Figure 20For example, in this embodiment, a first monitoring circuit 26 for monitoring the voltage on the upstream side of the relay 25 and a second monitoring circuit 27 for monitoring the voltage on the downstream side of the relay 25 are provided. The control unit 103 can estimate the voltage drop generated in the relay 25 by calculating the difference between the voltage monitored by the first monitoring circuit 26 and the voltage monitored by the second monitoring circuit 27.

[0426] Furthermore, the "predetermined value" used as a criterion for determining the voltage drop can be set, for example, to 2.5V, while 1 ampere has already flowed through the excitation source 21. Note that the preset value is stored in advance in the storage unit 102 and is configured to be read by the control unit 103 when needed.

[0427] As described above, when the predetermined value is set to 2.5V, the control unit 103 adjusts the output voltage of the DC / DC converter 104b so that the voltage drop generated in the relay 25 becomes 2.5V. With this configuration, it is not necessary to provide a margin for the output voltage of the DC / DC converter 104b, thereby suppressing the output voltage and suppressing the heat generated in the relay 25.

[0428] Figure 21 This is a flowchart illustrating the control process related to the power supply unit 104. This control process can be, for example, in... Figure 19 The process is executed in step S2 during the control process.

[0429] First of all, Figure 21 In step S101, the control unit 103 inputs a control signal to the relay 25 via the light source control board 24 to electrically connect the DC / DC converter 104b and the excitation light source 21. Further, the control unit 103 inputs a control signal to the power supply unit 104 and supplies the output voltage of the DC / DC converter 104b to the excitation light source 21 via the relay 25.

[0430] In the subsequent step S102, the control unit 103 detects the voltage drop generated in the relay 25 based on the detection signals of the first monitoring circuit 26 and the second monitoring circuit 27.

[0431] In the subsequent step S103, the control unit 103 determines whether the voltage drop detected in step S102 matches the predetermined value set as described above. If it is determined not to, the control unit 103 advances the control process to step S105, adjusts the output voltage from the DC / DC converter 104, and returns to step S101. That is, the control unit 103 is configured to repeat the processing according to steps S101 to S103 and step S105 until the voltage drop matches the predetermined value. Note that in this embodiment, the control unit 103 determines whether the voltage drop generated in the relay 25 matches the predetermined value ( Figure 21Step S103 in the above steps is not limited to this. For example, it can be determined whether the voltage drop falls within a specific range above and below a predetermined value. In short, the control unit 103 can control the output voltage based on the detected voltage drop.

[0432] On the other hand, when the determination in step S103 is yes, the control unit 103 advances the control process to step S104 and ends the adjustment of the output of the DC / DC converter 104 (output determination). In this case, the control unit 103 ends... Figure 21 The process is illustrated in the example, and the control process is made from Figure 19 Proceed from step S2 to step S3. Perform the same follow-up processing as described above.

[0433] <Light control of indicator 11>

[0434] As described above, the first lamp 11a, the second lamp 11b, and the third lamp 11c constituting the indicator 11 are illuminated according to control signals input from the marking machine controller 100. For example, the first lamp 11a illuminates when the marking head 1 is powered on. On the other hand, the second lamp 11b illuminates according to the standard requirements of the UV laser, and the third lamp 11c illuminates according to the state of the laser processing device L (such as the irradiation state of the UV laser and whether an error has occurred in the marking head 1). Details of the light states are illustrated in Table 1.

[0435] Specifically, when the key switch is in the "off" state (KSW: off), the marking machine controller 100 turns off all the first lamp 11a, the second lamp 11b and the third lamp 11c.

[0436] When the key switch is in the "power on" state (KSW: power on), the marking machine controller 100 only makes the first lamp 11a emit blue light, and turns off the second lamp 11b and the third lamp 11c.

[0437] When the key switch is in the "laser on" state (laser on (KSW)), the marking machine controller 100 causes the first lamp 11a to emit blue light and the second lamp 11b to emit green light, while keeping the third lamp 11c off.

[0438] When the marking head 1 is ready to emit UV laser (ready state), the marking machine controller 100 causes the first lamp 11a to emit blue light, and the second lamp 11b and the third lamp 11c to emit green light.

[0439] While emitting UV laser from the marking head 1 (during laser irradiation), the marking machine controller 100 causes the first lamp 11a to emit blue light, the second lamp 11b to emit yellow light, and the third lamp 11c to emit green light.

[0440] When a warning (warning error) occurs in the laser processing unit L that requires notification to the user, the marking machine controller 100 causes the first lamp 11a to emit blue light, the second lamp 11b to emit green light, and the third lamp 11c to emit orange light.

[0441] When any abnormality (abnormal error) occurs in the laser processing device L, the marking machine controller 100 causes the first lamp 11a to emit blue light, the second lamp 11b to emit green light, and the third lamp 11c to emit red light.

[0442] When the laser processing device L is in an interlocked state (e.g., when the safety junction box is closed), the marking machine controller 100 causes the first lamp 11a to emit blue light, turns off the second lamp 11b, and causes the third lamp 11c to emit red light.

[0443] In this way, by controlling the light status of the indicator 11 set on the front surface 10f of the housing 10, the user can intuitively and visually identify the status of the laser processing device L.

[0444] Table 1

[0445]

[0446] <Setup of processing equipment 500 and marking head 1>

[0447] Figure 18 This is a drawing used to describe the various dimensions of the marking head 1 and the support member 501. For example... Figure 17A and Figure 17B For example, the marking head 1 is attached to the support member 501 of the processing equipment 500 by replacing it with a printing device 1001 such as TTO. The marking head 1 attached to the support member 501 uses a UV laser to irradiate a workpiece W made of a sheet film to induce a chemical reaction in the UV reactive layer contained in the workpiece W, thereby performing printing on the workpiece W.

[0448] The processing equipment 500 and the marking head 1 according to this embodiment are configured to suit this mode of use. Hereinafter, the configurations related to the processing equipment 500 and the marking head 1, as well as the relative positional relationship between the processing equipment 500 and the marking head 1, will be described sequentially.

[0449] First, in addition to the conveyor roller 502 driven to convey the workpiece W, the processing equipment 500 according to this embodiment also includes: a first driven roller 504l, which is arranged on the +Y side of the conveyor roller 502, and the workpiece W is placed around the first driven roller from the +Z side; and a second driven roller 504r, which is arranged on the -Y side of the conveyor roller 502, and the workpiece W is placed around the second driven roller from the -Z side.

[0450] The conveyor roller 504, which serves as the drive roller, conveys the workpiece W along the Y direction, which is the conveying direction At, at a speed greater than or equal to 1500 mm / s and less than or equal to 2000 mm / s. The workpiece W conveyed by the conveyor roller 504 moves along a movement path defined by the conveyor roller 502, the first driven roller 504l, and the second driven roller 504r.

[0451] Here, the path of the workpiece W corresponding to the irradiation area R1 includes portions with different distances from the exit window 6. That is, the path of the workpiece W is configured to have different heights within the irradiation area R1, such as... Figure 18 Example.

[0452] Furthermore, the first driven roller 504l, which is directly above and closest to the conveyor roller 502, and the second driven roller 504r, which is directly below and closest to the conveyor roller 502, are both driven rollers that rotate as the workpiece W is conveyed. The rollers directly above and below the conveyor roller 502 are not limited to driven rollers, but are preferably rollers in which the amount of sliding of the workpiece W relative to the conveyor roller 502 is large, even when driven by a separately provided drive source. For example, if the material has a large frictional force relative to the workpiece W, the amount of sliding is small. Additionally, when the surfaces of each roller are made of the same material, the amount of sliding decreases as the amount of contact with the workpiece W increases. When the upper and lower rollers are constructed using a driven roller or a roller with a large amount of sliding relative to the conveyor roller 502, the amount of movement of the workpiece W relative to the rotation of the conveyor roller 502 is almost error-free. Therefore, by performing printing control based on the rotation of the conveyor roller 502, printing quality can be improved. In particular, compared to TTO, the marking head 1 of this embodiment performs printing on the workpiece W in a non-contact manner, whereby the printing position is likely to deviate when sliding occurs in the conveyor roller 502. Therefore, the marking head 1 is preferably arranged in the irradiation area R1 such that it is positioned relative to the conveyor roller with a small amount of sliding relative to the roller immediately before and after the irradiation area R1.

[0453] Here, the area in the movement path of the workpiece W that is irradiated by a UV laser corresponding to the irradiation area R1 is arranged to be further separated from the cover glass 62, which is an optical component, in the protruding direction of the second receiving part H2 than from the end of the second receiving part H2 in the protruding direction.

[0454] In this embodiment, the protruding direction of the second receiving portion H2 is aligned with the irradiation direction of the UV laser (i.e., the +Z direction). Furthermore, in this embodiment, the end of the second receiving portion H2 in the protruding direction corresponds to the +Z side end of the housing 10.

[0455] That is, the area irradiated by the UV laser in the movement path of the workpiece W is arranged on the +Z side of the +Z side end of the housing 10. In other words, the area irradiated by the UV laser in the movement path of the workpiece W does not enter the optical path limiting part H3 (arranged on the +Z side of the optical path limiting part H3). According to this configuration, the workpiece W can be easily inserted into the movement path from the front side of the movement path. Therefore, it is easy to place the workpiece W into the movement path.

[0456] In addition, such as Figure 18 For example, the vertex 502a of the conveyor roller 502 on the cover glass 62 side (-Z side) is offset relative to the center line (laser emission axis A1) of the central portion penetrating the cover glass 62 in the conveying direction At that is approximately consistent with the Y direction, either upstream (+Y side) or downstream (-Y side) (in the illustrated example, offset towards the +Y side).

[0457] That is, the center line Ar, which passes through the rotation axis of the conveyor roller 502 and extends in the Z direction, is offset upstream or downstream relative to the laser emission axis Al. In other words, the laser emission axis Al extending in the Z direction and the rotation axis of the conveyor roller 502 extending in the X direction are arranged so that they do not intersect each other.

[0458] In other words, the laser emission axis Al is offset relative to vertex 502a towards the upstream (+Y side) or downstream (-Y side) direction At in the transmission direction (in the illustrated example, it is offset towards the -Y side). Specifically, as Figure 18 For example, in the case of a workpiece W located upstream of vertex 502a and a workpiece W located downstream, the latter workpiece W has a smaller inclination relative to a plane (XY plane) orthogonal to the laser emission axis A1. That is, the workpiece W located downstream of vertex 502a is more gently inclined than the workpiece W located upstream. According to this embodiment, the laser emission axis A1 is offset towards the side (such as the downstream workpiece W) where the inclination of the workpiece W relative to the plane orthogonal to the laser emission axis A1 is smaller in the upstream and downstream sides in the transport direction At.

[0459] Note that the size of the irradiation area R1 is set to be larger than the printable area (printing area) in the printing device 1001 before it is configured for TTO replacement. TTO brings the printing section 1006, which extends laterally on the workpiece W, into contact with the workpiece W to perform printing on the workpiece W. Therefore, even if the printing area on the workpiece W is a region with a specific length in the longitudinal direction of the workpiece W, if there is a positional relationship where the printable range of the printing section 1006 includes the printing area on the workpiece W in the lateral direction of the workpiece W, printing can be performed on the entire printing area on the workpiece W by passing the workpiece W through the printing section 1006. On the other hand, the portion irradiated by the laser at a certain moment in the marking head 1 has a certain area, but is dot-shaped. Therefore, when the printing area on the workpiece W is a region with a certain length in the longitudinal direction of the workpiece W, the irradiation area R1 irradiated by the laser preferably has a certain length (size) in the direction corresponding to the longitudinal direction of the workpiece W. Specifically, when the workpiece W is parallel to the XY plane, the size of the irradiation area R1 in the transport direction At (see Figure 17A In the accompanying drawings, reference numeral L5 is set to 120 mm or larger. Note that in this embodiment, the irradiation area R1 indicates the area on the surface of the workpiece W that can be irradiated by the first scanner 51 and the second scanner 52 with a laser.

[0460] Furthermore, when the workpiece W is parallel to the XY plane, the size of the irradiation area R1 is set such that the irradiation area R1 is covered by the bottom surface 10d of the housing 10 in the XY plane. That is, when viewed in the Z direction orthogonal to the XY plane, the entire irradiation area R1 overlaps with the bottom surface 10d, the size L5 of the irradiation area R1 in the Y direction is smaller than the size of the bottom surface 10d of the housing 10 in the Y direction, and the size L6 of the irradiation area R1 in the X direction is smaller than the size of the housing 10 in the X direction. According to this configuration, the laser used to irradiate the workpiece W is unlikely to leak into the surrounding area. In particular, when the distance from the +Z side end of the housing 10 to the workpiece W (see...) Figure 18When the distance L2 is set to be greater than or equal to 0 mm and less than or equal to 20 mm, laser leakage is reduced. Furthermore, when the workpiece W is a sheet-like workpiece W placed and conveyed around multiple conveyor rollers, the user can easily place the workpiece W on the movement path of the workpiece W by inserting it from the front side of the conveyor rollers. Therefore, when the front side of the movement path of the workpiece W is opened, the work of placing the workpiece W in the movement path becomes easier. Therefore, by opening the front side of the movement path according to the structure that accommodates the entire length of the irradiation area R1 along the X direction in the bottom surface 10d, laser leakage can be reduced while maintaining the workability of setting the workpiece W. Note that when using a structure that uses a component covering the front side of the workpiece W to reduce laser leakage, there is a possibility that when the workpiece W moves at an angle, the workpiece W may come into contact with the component, causing contamination of the workpiece W. Therefore, by opening the front side of the workpiece W, the possibility of contamination of the workpiece W is reduced.

[0461] Note that these settings are particularly effective when printing eight characters on workpiece W by irradiating each character with a UV laser for 10 ms within a 3 mm × 2 mm square. Here, the UV laser parameters are suitable for achieving a linewidth of 0.2 to 0.35 mm (corresponding to a target linewidth of 100 to 150 μm for a single scan line) through bold printing using three scan lines.

[0462] When the irradiation area R1 is set to be larger than the printable area in the TTO, printing can be performed within the irradiation area R1, while the irradiation position of the UV laser follows the movement of the workpiece W. Therefore, a printable area similar to that in the TTO can be ensured.

[0463] On the other hand, the output of the laser generated by the marking head 1 and passing through the exit window 6 is set to be greater than or equal to 1W and less than or equal to 2W. This setting is determined to achieve a reduction in the size of the marking head 1. The color development in printing during a specific time period varies depending on the power density of the emitted laser. When the laser output is greater than or equal to 1W and less than or equal to 2W, the laser spot diameter is preferably 160μm or smaller to obtain sufficient color development.

[0464] More preferably, the laser spot diameter in the irradiation area R1 is set to be greater than or equal to 60 μm and less than or equal to 80 μm. This spot diameter can be set such that the focal depth of the laser corresponds to the portion of the irradiation area R1 with the longest optical path length (the end of the irradiation area R1) and the portion of the irradiation area R1 with the shortest optical path length (the central portion of the irradiation area R1).

[0465] For example, the lower limit of the spot diameter is a setting corresponding to the number and line width of the aforementioned scan lines. In this setting, the distance from the +Z side end of the housing 10 to the workpiece W (see...) Figure 18 When the distance L2 is set to be greater than or equal to 0 mm and less than or equal to 20 mm, and the size of the irradiation area R1 is set to 120 mm or greater, it is advantageous in suppressing the influence of the optical path length difference between the central part and the end of the irradiation area R1 without adjusting the focus along the Z direction.

[0466] On the other hand, when performing coarse printing with a thickness of 200 μm (0.2 mm) or greater (such as the linewidth of 0.2 to 0.35 mm mentioned above), an upper limit on the spot diameter is advantageous. In this case, there is a problem: the processing time required for coarse printing becomes relatively long, but by setting an upper limit on the spot diameter as described above, the irradiation area R1 of the UV laser can be larger, and the irradiation time can be longer.

[0467] Note that the upper limit of the spot diameter (=80μm) is the optimal value when the UV laser is emitted parallel to the irradiation direction and the distance L2 is set to 10mm. When the distance L2 varies within the range of greater than or equal to 0mm and less than or equal to 20mm, the upper limit of the spot diameter is 120μm.

[0468] Note that when there is a problem regarding the difference in optical path length within the irradiated area R1, the depth of focus can be increased by setting the aforementioned defocusing lens 57. A greater depth of focus is advantageous in suppressing the effects of the optical path length difference.

[0469] Furthermore, in the relative position of the workpiece W with respect to the housing 10, in particular, the relative position in which printing can be performed relative to the workpiece W is set such that the distance from the first mirror 51a to the surface of the workpiece W (in particular, the distance when viewed along the irradiation direction, and corresponding to...) is... Figure 19 The sum of distances L2 and L3 is 150 mm or less.

[0470] Note that, in addition to the distances mentioned above, in this embodiment, the distance from the top surface 10u of the housing 10 to the workpiece W is set to 195 mm or less. The TTO used in the previous printing device 1001 was often used in an environment where the distance from the top surface to the workpiece W was approximately 200 mm, and could be used in an environment similar to that of the previous printing device 1001. Specifically, in this embodiment, the distance L1 from the top surface 10u of the housing 10 to the +Z side end of the bottom surface 10d is set to 165 mm. Further, the distance L2 from the +Z side end of the bottom surface 10d to the workpiece W is preferably set to 30 mm or less, more preferably to 20 mm or less.

[0471] Here, when the distance L2 is set to 30 mm or less, the regularly reflected light generated by the workpiece W from the laser used to irradiate the irradiation area R1 can be guided to the area between the first plate member 18l and the second plate member 18r (i.e., the optical path limiting part H3). This is advantageous in suppressing the leakage of regularly reflected light to the outside of the housing 10.

[0472] Furthermore, in this embodiment, the distance L3 from the first lens 51a to the +Z side end of the bottom surface 10d is set to 123 mm. Further, the distance L4 from the lower surface of the defocusing lens 57 to the +Z side end of the bottom surface 10d is set to 100 mm. Here, considering that the thickness of the defocusing lens 57 is 2 mm, the distance (not shown) from the upper surface of the defocusing lens 57 to the +Z side end of the bottom surface 10d is set to 102 mm.

[0473] Here, the distance from the top surface 10u to the first mirror 51a (=L1-L3) is 42mm, and the distance from the top surface 10u to the defocusing lens 57 (=L1-L4) is 65mm. On the other hand, when viewed from the top surface 10u, the central portion of the housing 10 in the Z direction corresponds to a position of approximately 82mm (=L1 / 2). Therefore, according to this embodiment, both the first mirror 51a and the defocusing lens 57 are located on the -Z side of the central portion of the housing 10 in the Z direction.

[0474] <Positional relationship between shell 10, support member 501 and workpiece W>

[0475] As described above, according to this embodiment, the attachment surface of the housing 10 is formed on the opposite side of the exit window 6 (see [link]). Figure 17A (See the figure below). In the housing 10, instead of the bottom surface 10d forming the exit window 6, the top surface 10u facing the opposite side is configured to be attached to the attachment target position, which serves as the attachment surface, so that the housing 10 can be supported to be suspended from the attachment target position. This eliminates the need to insert the support member 501 between the housing 10 and the workpiece W, thereby allowing the housing 10 and the workpiece W to be brought close to each other.

[0476] At this point, the support member 501 for supporting the housing 10 is located on the opposite side of the exit window 6, similar to the attachment target position, thereby allowing for complete separation from the workpiece W. This enables the suppression of interference between the support member 501 and the workpiece W while bringing the housing 10 and the workpiece W closer to each other.

[0477] In addition, such as Figure 10 , Figure 13As illustrated, a gap is provided between the first base plate 15 and the top surface 10u, which serves as the attachment surface, so that the effects of twisting, vibration, etc., generated on the attachment surface at the attachment target location on the solid-state laser crystal 41 can be suppressed. Therefore, even when the housing 10 is configured to be supported at the attachment target location, laser can be advantageously generated.

[0478] Furthermore, the support member 501 and the attachment surface are configured to be connected via the attachment portion 7, rather than as... Figure 17A The direct connection exemplified by the housing 10 allows it to be attached to the support member 501, which can take various forms, without requiring a specific structure for the housing 10 itself. This is advantageous in facilitating the replacement of various processing devices with the laser processing apparatus L according to this disclosure.

[0479] In addition, such as Figure 3A and Figure 3B As illustrated, the front surface 10f, which is an open surface (instead of the exit surface facing the workpiece W (i.e., the bottom surface 10d) and the attachment surface attached to the attachment target location (i.e., the top surface 10u)), is constructed to be openable and closable, allowing access to the exit window 6 without causing interference with the workpiece W, support member 501, etc. Therefore, the maintainability of the laser processing apparatus L can be improved.

[0480] Furthermore, since the front surface 10f, which is the open surface of the cover member 13, and the rear surface 10b, which is the connecting surface to which the cable 200 is connected, are as follows: Figure 4 The cover member 13 is positioned on opposite sides, thus suppressing interference between the cover member 13 and the cable 200 when opening, closing, attaching, or removing the cover member 13. Therefore, the maintainability of the laser processing apparatus L can be improved.

[0481] <<Other Embodiments>>

[0482] Although a second receiving portion H2 is formed in the housing 10 in the above embodiment, the second receiving portion H2 is not necessary. For example, the first heat sink 81 and the second heat sink 82 can be accommodated in the first receiving portion H1. In addition, the optical path limiting portion H3 can also be appropriately omitted.

[0483] Furthermore, in the above embodiment, the excitation light source 21 is housed in the housing 10 of the marking head 1, but this disclosure is not limited to this configuration. For example, the excitation light source 21 may be disposed in the marking machine controller 100.

[0484] Furthermore, in the above embodiment, the crystal receiving portion H12, the mirror receiving portion H11, and the plate receiving portion H13, obtained by dividing the first receiving portion H1 in the housing 10 into three parts, are arranged side by side along the Y direction orthogonal to the irradiation direction in this order. However, this disclosure is not limited to this configuration. For example, the arrangement order of the crystal receiving portion H12, the mirror receiving portion H11, and the plate receiving portion H13 can be changed, or any two of the crystal receiving portion H12, the mirror receiving portion H11, and the plate receiving portion H13 can be arranged side by side along the irradiation direction.

[0485] Furthermore, in the above embodiment, the top surface 10u of the bottom surface 10d facing upwards to form the emission window 6 of the housing 10 is designated as the attachment surface; however, this disclosure is not limited to this arrangement. Any of the six surfaces other than the bottom surface 10d facing upwards to form the emission window 6 can be considered as the attachment surface. For example, if the right side surface 10r is the attachment surface, the support member 501 supports the housing 10 to be supported from the left side.

[0486] Furthermore, of the six surfaces of the housing 10, two or more surfaces other than the bottom surface 10d can be considered as attachment surfaces. For example, if the left side surface 10l and the top surface 10u are attachment surfaces, the attachment part 7 can be attached to one of the left side surface 10l and the top surface 10u, or it can be attached to both the left side surface 10l and the top surface 10u, as shown below. Figure 22 The example is the marking head 1'.

[0487] For example, Figure 22 The attachment portion 2007 illustrated has a first portion 2007a attached to the top surface 10u and a second portion 2007b attached to the left side surface 10l, and the support member 501' also has a shape conforming to the attachment portion 2007. In this way, the attachment surface can be set according to the form of the support member 501', and the attachment portion 2007 corresponding to this setting can be used.

[0488] Furthermore, attachment 7 is not essential. For example, in Figure 23 In the housing 10” of the illustrated marking head 1”, the support member 501 can also be directly attached to the attachment surface (top surface 10u” in the illustrated example) without the intervention of the attachment portion 7. In this case, a portion of the attachment surface can be regarded as the attachment portion. In addition, a portion of the attachment surface can protrude in the direction opposite to the exit window 6, and such protrusion can be used as the attachment portion.

Claims

1. A laser processing apparatus for printing processing the sheet-like workpiece by irradiating an irradiation area formed on an irradiation area containing a UV reaction layer on a sheet-like workpiece that is longitudinally conveyed along a predetermined moving path, thereby inducing a chemical reaction in the UV reaction layer, characterized in that... The laser processing apparatus includes: A controller that stores processing conditions containing a string to be printed onto the sheet-like workpiece and outputs control signals based on those processing conditions; and The marking head, attached to the target location, is connected to the controller via a cable and irradiates the sheet-like workpiece with UV laser based on the control signal. The marking head has the following features: The excitation light generating unit generates excitation light; A laser output unit generates and outputs a UV laser based on the excitation light generated by the excitation light generation unit; A laser deflection unit having a galvanometer mirror that deflects a UV laser output from the laser output unit based on a control signal output from the controller; and The housing, which accommodates the excitation light generating unit, the laser output unit, and the laser deflecting unit, has a bottom surface through which the UV laser deflected by the laser deflecting unit passes, and a top surface opposite to the bottom surface. The galvanometer lens is positioned closer to the top surface than the center of the bottom and top surfaces of the housing, such that printing is performed within the irradiation area formed on the sheet-like workpiece located near the bottom surface of the housing. The housing includes: An exit window that transmits UV laser light irradiated toward the irradiation area through the laser deflector; An attachment surface, which is fastened to a plate-shaped support member of a processing device placed on the top surface or the attachment portion fixed to the top surface at the attachment target location, thereby attaching to the support member, and forming on the opposite side of the exit window, is configured to be replaceable with a thermal transfer industrial thermal printer attached to the support member; and An optical element is disposed between the galvanometer lens and the exit window, on the top side of the housing, closer to the center of the bottom and top surfaces, so that the UV laser deflected by the galvanometer lens diffuses outward along the irradiation area.

2. The laser processing apparatus according to claim 1, wherein, The optical element enables a deeper focal depth of the UV laser, causing a chemical reaction in the UV reaction layer at the center and ends of the irradiation area formed by the galvanometer lens in the sheet-like workpiece located near the bottom surface of the housing.

3. The laser processing apparatus according to claim 1 or 2, wherein, The diameter of the UV laser spot in the irradiation area is set to be less than 160 μm.

4. The laser processing apparatus according to claim 3, wherein, The diameter of the UV laser spot in the irradiation area is set to be between 60 μm and 80 μm.

5. The laser processing apparatus according to claim 1 or 2, wherein, The galvanometer mirror includes: a second mirror for deflecting the UV laser output from the laser output section in a second direction; and A first mirror is used to deflect the UV laser, after it has been deflected by the second mirror, in a first direction orthogonal to the second direction. The first mirror is positioned on the top side, closer to the center of the bottom and top surfaces of the housing, such that the irradiation area is formed on the sheet-like workpiece located near the bottom surface of the housing.

6. The laser processing apparatus according to claim 5, wherein, The dimension of the irradiation area formed by the second mirror in the second direction is configured to be smaller than the dimension of the bottom surface of the housing in the second direction, and, The dimension of the irradiation area formed by the first mirror in the first direction is configured to be smaller than the dimension of the bottom surface of the housing in the first direction.

7. The laser processing apparatus according to claim 1 or 2, wherein, An optical component is provided on the bottom surface of the housing, which covers the space through which the laser light path connecting the galvanometer mirror and the irradiation area passes.

8. The laser processing apparatus according to claim 1 or 2, wherein, The distance between the bottom surface of the housing and the sheet-like workpiece is set to be between 0 mm and 20 mm.

9. The laser processing apparatus according to claim 1 or 2, wherein, The housing is supported from the side or above by attaching the attachment surface to a support member for supporting the housing.

10. The laser processing apparatus according to claim 9, wherein, The housing is configured to directly attach the attachment surface to the support member.

11. The laser processing apparatus according to claim 9, wherein, The attachment surface of the housing is provided with fastening holes corresponding to the support member. The housing is attached to the support member by fastening fasteners in the fastening holes.

12. The laser processing apparatus according to claim 1 or 2, wherein, The housing includes an excitation light guiding section that guides the excitation light generated by the excitation light generating section to the laser output section.

13. The laser processing apparatus according to claim 1 or 2, wherein, The housing has: The system includes a first accommodating portion for accommodating the excitation light generating portion, a second accommodating portion for accommodating the laser deflecting portion, and a third accommodating portion for accommodating the laser output portion. The first receiving portion, the second receiving portion, and the third receiving portion are arranged sequentially along a direction orthogonal to the irradiation direction of the UV laser emitted from the exit window.

14. The laser processing apparatus according to claim 1 or 2, wherein, The sheet-like workpiece is composed of a film containing the UV reaction layer.

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