A smart IC carrier board handling device and its handling method

Abstract

This invention discloses an intelligent IC carrier board handling device and its handling method, belonging to the field of IC carrier board handling technology. The intelligent IC carrier board handling device and its handling method include a handling table, a lateral moving frame sleeved at the lateral driving end of a driving device, a suction cup handling assembly connected to the output end of a cylinder, and an electrostatic elimination assembly fixedly welded to the top of a cover plate. Multiple slots contain movable circular sleeves one, two, three, and a movable cylinder, which are slidably connected to each other. This device can flexibly adjust the suction area of ​​the handling suction cups. Furthermore, when facing IC carrier boards with uneven surfaces, it can adaptively adjust to tightly fit the top of the carrier board. The device also has a buffer retraction protection function; in the event of an unexpected air shortage or malfunction, spring one drives the movable circular sleeves and movable cylinder to retract, preventing damage to the suction cup device from impact. Additionally, excess compressed air generated during injection into the slots can be introduced into a hollow rod through an exhaust guide box, where it generates charge through a discharge electrode to neutralize static electricity on the IC carrier board surface.

Description

Technical Field

[0001] This invention relates to the field of IC carrier board handling technology, specifically to an intelligent IC carrier board handling device and its handling method. Background Technology

[0002] Intelligent IC substrates are fundamental components that play a crucial role in modern electronics manufacturing. Typically made of specific insulating materials, they feature precise and complex circuit wiring structures. Their primary function is to provide electrical connections and physical support for integrated circuit (IC) chips. Through the circuitry on the substrate, the chips are precisely connected to external circuit systems, enabling stable and efficient signal and power transmission, thereby ensuring the normal operation of the entire electronic device. Intelligent IC substrates are widely used in various electronic products such as smartphones, tablets, high-performance computers, and artificial intelligence devices. Their performance directly affects important indicators such as the electronic device's processing speed, data processing capabilities, signal transmission stability, and the miniaturization and integration of the product. They are one of the core supporting components for achieving the intelligent, high-performance, and miniaturized development of electronic products.

[0003] The intelligent IC carrier board handling device is an advanced automated equipment applied in semiconductor manufacturing and related fields. It mainly consists of a robotic arm, a drive system, a control system, a vision recognition system, and a gripping mechanism. By integrating advanced intelligent control algorithms and sensor technology, it can accurately identify and locate IC carrier boards. Using the robotic arm and gripping mechanism, it can quickly and stably grasp the IC carrier boards and transport them from one workstation to another according to a preset path and instructions. During the handling process, it can also monitor and adjust the handling status in real time to ensure the handling accuracy and quality of the IC carrier boards. It features high efficiency, precision, flexibility, and automated operation, which can effectively improve production efficiency, reduce labor costs, and enhance the reliability and consistency of the production process. It is widely used in IC packaging and testing, chip manufacturing, and other production processes.

[0004] Existing smart IC carrier board handling devices typically consist of a drive unit, a control system, and a suction cup picking and handling mechanism. In practical applications, they generally rely on vision sensors, drive units, and suction cup picking and handling mechanisms to achieve the handling and placement of smart IC carrier boards. However, in long-term practical use, these handling devices have revealed a series of significant shortcomings:

[0005] Firstly, in semiconductor manufacturing, IC substrates come in various sizes. If the suction cup components of the handling device cannot be flexibly adjusted, problems will arise. For example, in consumer electronics chip manufacturing, small-sized IC substrates are often used for mobile phone chip packaging. If large-sized suction cups are used for handling, the suction force will be dispersed, potentially grabbing multiple substrates by mistake, causing chip damage and production chaos, affecting production efficiency and product quality. In server chip manufacturing, IC substrates are usually large in area. If small-sized suction cups are used, they cannot cover a sufficient area, easily leading to unstable adhesion and dropping. To overcome these problems, existing intelligent IC substrate handling devices often require personnel to stop the machine and replace the suction cup components for different sizes of IC substrates to ensure stability during handling. However, this undoubtedly has a significant impact on actual production efficiency and is very labor-intensive, placing a heavy workload on the staff.

[0006] Secondly, throughout the entire production cycle, from the initial manufacturing stage to the transportation and distribution process, and then to the pre-processing stage, IC substrates are highly susceptible to surface irregularities such as bumps or depressions due to various process conditions, transportation environments, and processing operations. Taking IC substrates for automotive electronic chips as an example, given the complex and ever-changing operating environment of automobiles, which faces harsh conditions such as high and low temperatures, vibration, and electromagnetic interference, extremely high requirements are placed on the reliability of the chips. This makes the manufacturing process of IC substrates for automotive electronic chips more complex and refined than that in other fields, and correspondingly, the probability of surface irregularities is also relatively higher. The suction cup assembly is relatively high. When the handling device is handling carriers with uneven surfaces, if the suction cup assembly lacks adaptive adjustment function, it is very likely to cause irreparable damage to the carrier due to hard impact when it comes into contact with the raised parts of the carrier surface, directly leading to product scrap. When it encounters the concave parts, the suction cup cannot fit tightly into the concave area, resulting in insufficient suction force. The carrier is very easy to fall off during the handling process. This will not only cause damage to the IC carrier itself, but the frequent falling accidents will also interfere with the normal production process, increase production costs, and bring many difficult problems to the handling work, seriously affecting the continuity and stability of production.

[0007] Thirdly, in the highly automated and continuously operating environment of semiconductor manufacturing workshops, unexpected situations are difficult to completely avoid. Among them, unexpected gas supply interruptions or system failures are relatively common problems. Once such a situation occurs, if the handling device lacks an effective protection mechanism, the suction cup assembly performing the handling task will descend rapidly due to the loss of control of the cylinder, and then violently impact the collection rack or carrier placement rack. The impact force generated by this impact will not only cause structural damage to the carrier placement rack and collection rack, but more seriously, it will cause devastating damage to the smart IC carriers placed on them, resulting in the scrapping of a large number of chips. At the same time, the suction cup device itself is also very likely to be damaged by the impact and need to be repaired or replaced. In large-scale integrated circuit manufacturing enterprises, the production capacity of a production line can reach thousands of IC carriers per hour. The economic losses caused by an impact damage accident due to equipment failure will be extremely huge, including not only the cost of a large number of scrapped chips, but also the cost of equipment repair. This undoubtedly brings great trouble to actual use.

[0008] Fourth, due to their intricate internal circuit structure and highly sensitive electronic components, intelligent IC substrates have extremely low tolerance to static electricity. During handling, frequent contact and friction with various components of the handling device can easily lead to static electricity buildup. Taking the manufacturing of IC substrates for computer CPU chips as an example, in the precision semiconductor manufacturing environment, the energy carried by static electricity, though seemingly small, is enough to alter the electrical performance of the chip's internal circuitry. Once this happens, the chip's performance will significantly decline, or even become unusable. For instance, in the critical chip packaging process, if the static electricity on the IC substrate surface is not eliminated in a timely and effective manner, the instantaneous high voltage generated by the static discharge during subsequent electrical connections with the chip may break down the extremely small and delicate circuitry inside the chip, causing the chip to completely lose its function. This not only wastes raw materials and increases production costs but also seriously affects the product's production cycle and delivery schedule. Summary of the Invention

[0009] The present invention aims to provide a smart IC carrier board handling device and its handling method, including a handling table, a placement slot on the top of the handling table, a driving device on the top of the handling table, a transverse moving frame sleeved on the transverse driving end of the driving device, a cylinder on the top of the transverse moving frame, a connecting plate one and a connecting plate two respectively on the outer walls of the two sides of the transverse moving frame, a solenoid valve group one and a solenoid valve group two respectively fixedly connected to the top of the connecting plate one and the connecting plate two, a high-voltage power supply at the bottom of the connecting plate one, a suction cup handling assembly connected to the output end of the cylinder, the suction cup handling assembly including a support plate, the top of the support plate being screwed to the cylinder output end, a fixing cylinder on the outer wall of the support plate, and the top of the fixing cylinder... The part is provided with a cover plate, and a connecting shell is fixedly installed on the top of the cover plate. Metal connecting pipes are movably sleeved inside the multiple connecting shells. An air extraction box is fixedly connected to the top of the multiple metal connecting pipes. An electrostatic elimination component is also fixedly welded to the top of the cover plate. The electrostatic elimination component includes an exhaust guide box. The bottom of the exhaust guide box is welded to the top of the cover plate. A connecting cylinder is provided at the bottom of the cover plate. A groove is formed between the multiple connecting cylinders. Movable sleeve one, movable sleeve two, movable sleeve three and movable cylinder are slidably connected inside the multiple grooves. Movable sleeve one, movable sleeve two and movable sleeve three have cavity one and cavity two inside. Limiting rings are fixedly connected to the outer circumference of movable sleeve one, movable sleeve two, movable sleeve three and movable cylinder.

[0010] Preferably, the plurality of connecting shells and the plurality of vacuum boxes correspond to each other, the plurality of connecting shells and the plurality of vacuum boxes are fan-shaped in size and shape, and the central connecting shell and vacuum box of the cover plate are cylindrical.

[0011] Preferably, the ends of the plurality of metal connecting pipes extend into the plurality of grooves and connect to the outer wall of the top of the movable sleeve 1, movable sleeve 2, movable sleeve 3 and movable cylinder, and communicate with the cavity 1 inside the movable sleeve and the cavity inside the movable cylinder.

[0012] Preferably, the top of the cover plate is provided with an exhaust hole, and the plurality of exhaust holes correspond to the plurality of grooves, and the plurality of exhaust holes are located inside the exhaust guide box.

[0013] Preferably, a hollow rod is connected to the end of the exhaust guide box, a through opening is provided on the outer wall of the hollow rod, a discharge electrode is provided at the top of the hollow rod, and the discharge electrode is electrically connected to the high-voltage power supply.

[0014] Preferably, the outer wall of the hollow rod pressure relief valve is connected to an exhaust arc plate pressure relief valve, the outer wall of the hollow rod is connected to an exhaust arc plate, one side of the exhaust arc plate is an inclined surface, and an exhaust port is opened on the inclined outer wall.

[0015] Preferably, a spring is provided inside the plurality of grooves, and the plurality of springs are respectively sleeved on the outer wall of the circumference of the plurality of connecting cylinders. The ends of the plurality of springs are fixedly welded to the bottom of the cover plate, and the ends of the plurality of springs are fixedly welded to the outer wall of the movable sleeve 1, movable sleeve 2, movable sleeve 3 and the end of the movable cylinder.

[0016] Preferably, springs and mounting cylinders are welded to the inner walls of the cavities inside the plurality of movable sleeves one, two, and three. Suction cups are welded to the ends of the plurality of springs two. The plurality of suction cups are respectively sleeved on the outer circumference of the corresponding mounting cylinders. The plurality of mounting cylinders communicate with the cavity one. The top of the mounting cylinders is provided with the same suction cup.

[0017] Preferably, the output end of the first solenoid valve assembly is connected to an air pipe, and the ends of the multiple air pipes are connected to the top of the multiple air extraction boxes. The output end of the second solenoid valve assembly is connected to an air pipe, and the ends of the multiple air pipes are connected to the outer wall of the connecting shell. The multiple connecting shells correspond to the multiple slots respectively.

[0018] A method for handling a smart IC carrier board, and a method for handling a smart IC carrier board using a handling device, comprising the following specific steps:

[0019] S1: Handling preparation: When in use, the carrier placement rack and collection rack carrying multiple smart IC carrier boards can be placed in multiple placement slots respectively, and then the de-drive device can be used to move and transport multiple smart IC carrier boards.

[0020] S2: Suction Cup Assembly Size Adjustment: Before handling, the system inside the handling platform can be controlled to activate solenoid valve group one to select the air intake for multiple connecting shells. For example, when handling a smaller smart IC carrier board, the operator injects external compressed gas into solenoid valve group one via the control system command. Solenoid valve group one will precisely select the connecting shell at the center of the cover plate to inject gas according to the signal from the control system. At this time, the compressed gas enters the groove at the center of the bottom of the cover plate. Due to the gas pressure, spring one inside the groove is stretched and begins to deform. The stretching of spring one drives the movable cylinder in the central area to push outward and extend to the outside. Then, the control system controls solenoid valve group two to perform a suction operation on the corresponding suction box. The suction box is connected to the movable cylinder. Through the suction action of the suction box, a negative pressure environment is quickly formed inside the movable cylinder. The suction force generated by this negative pressure environment is sufficient to firmly grasp the smaller smart IC carrier board. Then, the drive device starts to work, transporting the grasped smart IC carrier board to the designated position. During the process, the cylinder plays a crucial role, primarily controlling the gripping, lifting, lowering, and placement of the smart IC carrier board. This ensures a smooth and accurate transport process. When handling larger smart IC carrier boards, the control system stops supplying gas to the central connecting shell. The gas inside the central slot is then slowly discharged through the exhaust port. As the gas is discharged, spring one, deprived of gas pressure support, begins to retract. This retraction causes the connected movable cylinder to retract back into the corresponding central slot. The control system then selects and supplies air to other designated connecting shells. The further the air is injected into the outer connecting shells, the more suction cups participate in the adsorption, and the larger their diameters become, resulting in a larger gripping area. This method allows for better adaptation to gripping IC carrier boards of various sizes without changing the suction cup device, significantly improving the versatility and stability of the transport device. It also reduces the risk of accidental drops when using smaller suction cups and the problem of incorrectly gripping multiple IC carrier boards when using larger suction cups.

[0021] S3: Flexible Adaptive Adjustment: When using movable sleeve one, movable sleeve two, or movable sleeve three to pick up and transport IC carriers of various sizes and sizes, in order to ensure stable picking and gripping even when facing IC carriers with certain protrusions or depressions on the surface, the transport device has a flexible adaptive adjustment function. When the cylinder drives the suction cup assembly to descend and approach the IC carrier, the suction cup cylinder will be subjected to different degrees of force due to the unevenness of the IC carrier surface. At this time, spring two comes into play. It has good elasticity and can adjust according to the force applied to the suction cup cylinder. The suction cup assembly adaptively adjusts its force. When encountering a protruding part, the second spring is compressed, allowing the suction cup to retract upwards a certain distance to avoid a hard collision with the protruding part. When encountering a recessed part, the second spring extends, allowing the suction cup to extend downwards to better fit the recessed part. This adaptive adjustment method allows the suction cup assembly to fit more tightly against the top outer wall of the smart IC carrier board, providing a more stable suction force, ensuring the flexibility and reliability of the handling process, and reducing the problem of the suction effect being affected by the presence of depressions or protrusions on the surface of the IC carrier board.

[0022] S4: Buffer Retraction Protection: To cope with unexpected situations that may occur with the equipment, such as unexpected gas supply interruption or system failure, the handling device is designed with a buffer retraction protection function. This fully protects the intelligent IC carrier board and suction cup device on the collection rack or carrier board placement rack, avoiding damage and cost losses caused by unexpected downtime. When an unexpected gas supply interruption or system failure occurs, the compressed gas supply will suddenly stop. At this time, the air inside the designated tank will rapidly escape through the exhaust port, and the gas pressure will drop sharply. Since spring one was in a stretched state during the previous operation, when the gas pressure disappears, spring one will quickly restore its elastic deformation, generating a retraction force. This retraction force will cause the designated movable sleeve one, movable sleeve two, movable sleeve three, or movable cylinder that are in use to quickly retract into their respective tanks. This rapid retraction action effectively reduces the impact caused by the cylinder rapidly descending and contacting the collection rack or carrier placement rack due to unexpected machine stoppage. There is a certain distance between the end of the cylinder's stroke and the collection rack or carrier placement rack. Only when the designated movable sleeves (one, two, three) and the movable cylinder are pushed out by compressed gas can they contact the IC carrier. When all three movable sleeves and the movable cylinder retract, the suction cup cylinder and the fixed cylinder cannot touch the collection rack, carrier placement rack, or IC carrier when the cylinder descends to its limit position. This avoids the suction cup device falling and impacting due to machine malfunction, thus fully protecting the collection rack, carrier placement rack, smart IC carrier, and suction cup device, and reducing cost losses caused by impact damage.

[0023] S5: Static Electricity Elimination Blowing: During the compressed air injection process into the designated tank, to reduce the accumulation of static electricity on the surface of the smart IC carrier board and ensure the safety of its working environment, the handling device is equipped with a static electricity elimination blowing function. When compressed air is injected into the designated tank, excess air is generated. This excess air is discharged through the exhaust port set at the top and then enters the exhaust guide box. The exhaust guide box guides the airflow, orderly introducing the discharged air into the hollow rod. The hollow rod is equipped with discharge electrodes. When the air enters the hollow rod, the discharge electrodes generate positive and negative charges. These positive and negative charges interact with the discharged gas to form a uniform guided airflow. This guided airflow blows evenly and gently towards the top of the carrier board placement rack and collection rack, blowing on the surface of the smart IC carrier board. In this way, the static electricity on the surface of the smart IC carrier board can be effectively neutralized, reducing the accumulation of static electricity, ensuring a safe working environment for the smart IC carrier board, and reducing the impact of static electricity on its performance and lifespan.

[0024] Compared with the prior art, the beneficial effects of this invention are: in actual use, the device can flexibly change the area picked up and transported by the suction cup. Specifically, before transporting, the control system inside the transport platform can be used to activate the solenoid valve group to select the air intake for multiple connecting shells. For example, when transporting a small-sized smart IC carrier board, the operator injects external compressed gas into the solenoid valve group through the control system command. The solenoid valve group will then accurately select the connecting shell at the center of the cover plate according to the signal from the control system. Initiating gas injection, compressed gas enters the groove at the center of the bottom of the cover plate. Due to the gas pressure, spring one inside the groove is stretched and deforms. The stretching of spring one causes the movable cylinder in the central area to push outward and extend to the outside. Then, the control system controls solenoid valve group two to perform a suction operation on the corresponding suction box. The suction box is connected to the movable cylinder. Through the suction action of the suction box, a negative pressure environment is quickly formed inside the movable cylinder. The suction force generated by this negative pressure environment is sufficient to firmly grasp the small smart IC carrier board. Subsequently, the drive device starts working and moves the grasped smart IC carrier board. During the transport to the designated location, the cylinder plays a crucial role. It primarily controls the gripping, lifting, lowering, and placement of the smart IC carrier board, ensuring a smooth and accurate transport process. When transporting larger smart IC carrier boards, the control system stops supplying gas to the connecting shell at the center. At this time, the gas inside the central slot is slowly discharged through the vent. As the gas is discharged, spring one, deprived of gas pressure support, begins to retract. This retraction of spring one causes its connected movable cylinder to retract back into the corresponding central slot. Then, the control system selects and supplies gas to other designated connecting shells again. The more air is injected into the outer shell, the more suction cups participate in the adsorption, and the larger their diameter becomes, resulting in a larger adsorption and gripping area. Therefore, by controlling the air intake, this device can flexibly adjust the size of the suction cup assembly, change the number and diameter of the suction cups involved in the adsorption, adapt to the functions of IC carrier boards of different sizes, improve versatility and stability, reduce the risk of accidental drops when handling IC carrier boards with smaller suction cups, and reduce the trouble of mistakenly gripping multiple IC carrier boards when using larger suction cups. It can also reduce the labor burden caused by manually changing multiple suction cup devices.

[0025] Furthermore, during use, when employing movable sleeve one, movable sleeve two, or movable sleeve three to pick up and transport various large and sized IC carrier boards, the transport device features a flexible adaptive adjustment function to ensure stable suction and gripping even when facing IC carrier boards with certain protrusions or depressions on the surface. When the cylinder drives the suction cup assembly to descend and approach the IC carrier board, the suction cup cylinder will be subjected to varying degrees of force due to the potential unevenness of the IC carrier board surface. At this time, spring two comes into play. It has good elasticity and can adaptively adjust according to the force applied to the suction cup cylinder. When encountering a protrusion, spring two will be compressed, allowing the suction cup cylinder to retract upward a certain distance to avoid a hard collision with the protrusion. When encountering a depression, spring two will extend, allowing the suction cup cylinder to extend downward to better fit the depression. This adaptive adjustment method allows the suction cup assembly to fit more tightly against the top outer wall of the smart IC carrier board, providing a more stable suction force, ensuring the flexibility and reliability of the transport process, and reducing the problem of the suction effect being affected by the presence of depressions or protrusions on the IC carrier board surface.

[0026] To address potential unforeseen circumstances such as unexpected gas supply interruptions or system malfunctions, the handling device is designed with a buffer retraction protection function. This fully protects the intelligent IC carrier board and suction cup device on the collection rack or carrier placement rack, preventing damage and cost losses due to unexpected shutdowns. When an unexpected gas supply interruption or system malfunction occurs, the compressed gas supply will suddenly stop. At this time, the air inside the designated tank will rapidly escape through the exhaust port, causing a sharp drop in gas pressure. Since spring one was under tension during previous operation, it will quickly recover its elastic deformation after the gas pressure disappears, generating a retraction force. This retraction force will cause the designated movable sleeves (one, two, three, or the movable cylinder) currently in use to quickly retract into their respective tanks. This rapid retraction effectively reduces the risk of the cylinder rapidly descending and contacting the collection rack or carrier placement rack due to unexpected shutdowns. The impact of the cylinder is such that there is a certain distance between the end of its stroke and the collection rack or carrier plate placement rack. Only when the cylinder is pushed out by the compressed gas can it contact the IC carrier plate. When the cylinder and the movable sleeves are retracted, the suction cup and the fixed cylinder cannot touch the collection rack, carrier plate placement rack or IC carrier plate when the cylinder descends to the limit position. This avoids the suction cup device falling and impacting due to machine failure, thus fully protecting the collection rack, carrier plate placement rack, smart IC carrier plate and suction cup device, reducing the cost loss caused by impact damage. It can also provide active protection function in the event of equipment failure by using compressed gas to drive the flexible adjustment of the suction cup selection and reduce the occurrence of safety hazards.

[0027] Furthermore, during the compressed air injection process into the designated tank, to reduce the accumulation of static electricity on the surface of the smart IC carrier board and ensure the safety of its working environment, the handling device is equipped with a static elimination blowing function. When compressed air is injected into the designated tank, excess air is generated. This excess air is discharged through the exhaust port set at the top and then enters the exhaust guide box. The exhaust guide box plays the role of guiding the airflow, orderly introducing the discharged air into the hollow rod. The hollow rod is equipped with discharge electrodes. When the air enters the hollow rod, the discharge electrodes generate positive and negative charges. These positive and negative charges interact with the discharged gas to form a uniform guiding airflow. This guiding airflow blows evenly and gently towards the top of the carrier board placement rack and collection rack, blowing on the surface of the smart IC carrier board. In this way, the static electricity on the surface of the smart IC carrier board can be effectively neutralized, reducing the accumulation of static electricity, ensuring a safe working environment for the smart IC carrier board, reducing the impact of static electricity on its performance and lifespan, and making full use of the compressed gas. Furthermore, by using this flexible suction cup method, the outflowing gas can be fully utilized. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0029] Figure 2 This is a schematic diagram of the transverse moving frame structure of the present invention;

[0030] Figure 3 This is a schematic diagram of the fixed cylinder structure of the present invention;

[0031] Figure 4 This is a schematic diagram of the exhaust guide box structure of the present invention;

[0032] Figure 5 This is a schematic diagram of the internal cross-sectional structure of the fixed cylinder of the present invention;

[0033] Figure 6 This is a schematic diagram of the structure of the suction cup component of the present invention;

[0034] Figure 7 This is a schematic diagram of the suction cup cylinder mounting structure of the present invention;

[0035] Figure 8 This is a schematic diagram of the rear view of the movable circular sleeve structure of the present invention;

[0036] Explanation of the numbers in the diagram: 100, Transport platform; 110, Card slot; 120, Drive unit; 200, Lateral moving frame; 210, Cylinder; 220, Connecting plate one; 230, High-voltage power supply; 240, Solenoid valve assembly one; 250, Connecting plate two; 260, Solenoid valve assembly two; 300, Support plate; 310, Fixing cylinder; 320, Cover plate; 321, Connecting shell; 322, Metal connecting pipe; 323, Vacuum box; 324, Exhaust port; 330, Exhaust guide box. 331. Hollow rod; 332. Through-hole; 333. Discharge electrode; 334. Exhaust arc plate; 340. Connecting cylinder; 350. Spring 1; 400. Movable sleeve 1; 410. Limiting ring; 420. Cavity 1; 430. Cavity 2; 440. Suction cup cylinder; 441. Spring 2; 442. Mounting cylinder; 500. Movable sleeve 2; 600. Movable sleeve 3; 700. Movable cylinder. Detailed Implementation

[0037] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0038] Please see Figure 1-8 The present invention provides a technical solution:

[0039] A smart IC carrier board handling device and its handling method include a handling table 100, a card slot 110 is provided on the top of the handling table 100, and a driving device 120 is also provided on the top of the handling table 100.

[0040] In some embodiments: the transport table 100 and the drive device 120 are existing technologies. For specific principles, please refer to the Hello chip transporter. They are existing technologies and need not be elaborated further.

[0041] The drive device 120 is sleeved with a transverse moving frame 200 at its transverse drive end. A cylinder 210 is provided on the top of the transverse moving frame 200. A connecting plate 220 and a connecting plate 250 are respectively provided on the outer walls of both sides of the transverse moving frame 200. A solenoid valve assembly 240 and a solenoid valve assembly 260 are respectively fixedly connected to the top of the connecting plate 220 and the connecting plate 250.

[0042] In some embodiments: Solenoid valve assembly 240 and solenoid valve assembly 260 are existing mature technologies. Solenoid valve assembly 240 is connected to an external vacuum pump through a pipeline. With the help of precise commands issued by the external control system, solenoid valve assembly 240 can achieve highly selective operation and can accurately select one of the multiple connecting shells 321 for evacuation operation. It is worth mentioning that the multiple connecting shells 321 have significant differences in size, exhibiting a distribution pattern where the connecting shells 321 closer to the outside are larger. Furthermore, through the coordinated operation of the external control system and the solenoid valve assembly 240, the negative pressure generated during the evacuation of different connecting shells 321 can be flexibly adjusted. When handling smaller IC carriers, the evacuation of the relatively smaller connecting shells 321 located in the central area can be precisely controlled. Based on the characteristics of the carrier and handling requirements, the negative pressure can be adjusted to an appropriate value to ensure sufficient and stable adsorption force for the small carrier, preventing the carrier from falling due to insufficient suction. Conversely, when handling larger IC carriers, the larger connecting shells 321 on the outer side can be selected for evacuation, while simultaneously increasing the negative pressure intensity to cover a larger area of ​​the carrier, ensuring the stability of the carrier during handling. This achieves efficient and reliable handling of IC carriers of various sizes.

[0043] Solenoid valve assembly 260 is primarily responsible for the precise and selective input of external compressed gas. It has multiple gas delivery ends, and the gas delivery volume at each end can be finely adjusted via an external control system. In actual handling, the required ejection air pressure varies depending on the size of the suction cup component. For example, smaller suction cup components require relatively lower ejection air pressure. By adjusting solenoid valve assembly 260 through the control system to reduce the gas delivery volume at the corresponding end, the appropriate air pressure can be provided for the small suction cup component, allowing it to be smoothly ejected and stably adsorbed onto a small IC carrier. For larger suction cup components, due to their structure and adsorption area requirements, higher ejection air pressure is needed. In this case, the control system increases the gas delivery volume at the corresponding end of solenoid valve assembly 260 to ensure that the large suction cup component receives sufficient air pressure to complete the ejection action, tightly adhering to and firmly adsorbing the large IC carrier. By precisely controlling the air supply, it is possible to better adapt to the working requirements of suction cup components of different sizes, significantly improve the stability of the entire handling device when facing IC carrier boards of various sizes, and ensure the efficient and stable handling operation. All of the above are existing mature technologies.

[0044] A high-voltage power supply 230 is provided at the bottom of the connecting plate 220. A suction cup conveying assembly is connected to the output end of the cylinder 210. The suction cup conveying assembly includes a support plate 300. The top of the support plate 300 is installed at the output end of the cylinder 210 with screws. A fixing cylinder 310 is provided on the outer wall of the support plate 300. A cover plate 320 is provided on the top of the fixing cylinder 310. A connecting shell 321 is fixedly installed on the top of the cover plate 321. Metal connecting tubes 322 are movably sleeved inside the multiple connecting shells 321. A vacuum box 323 is fixedly connected to the top of the multiple metal connecting tubes 322.

[0045] In some embodiments, multiple vacuum boxes 323 can move together during the downward movement of movable sleeve 1 400, movable sleeve 2 500, movable sleeve 3 600 and movable cylinder 700, respectively. Multiple metal connecting pipes 322 are located on the outside of spring 1 350 to reduce collisions with spring 1 350 and avoid affecting the selective ejection of movable sleeve 1 400, movable sleeve 2 500, movable sleeve 3 600 and movable cylinder 700 in the later stage.

[0046] The top of the cover plate 320 is also fixedly welded with an electrostatic elimination component, which includes an exhaust guide box 330. The bottom of the exhaust guide box 330 is welded to the top of the cover plate 320. A connecting cylinder 340 is provided at the bottom of the cover plate 320, and a groove is formed between multiple connecting cylinders 340.

[0047] In some embodiments, a spring disposed inside the groove formed between the plurality of connecting cylinders 340 rests against the outer circumferential wall of the plurality of connecting cylinders 340 to reduce its influence on the air injection and the movement of the metal connecting pipe 322.

[0048] The multiple grooves are slidably connected with movable circular sleeves 400, 500, 600 and 700 respectively. The movable circular sleeves 400, 500 and 600 have cavities 420 and 430 respectively. The outer circumferential walls of the movable circular sleeves 400, 500 and 600 are fixedly connected with limit rings 410.

[0049] In some embodiments, a rubber ring may be embedded in the outer circumference of the limiting ring 410 to reduce the outflow of compressed gas from the limiting ring 410 and the inner wall of the groove.

[0050] Specifically, the multiple connecting shells 321 and the multiple air extraction boxes 323 correspond to each other, and the multiple connecting shells 321 and the multiple air extraction boxes 323 are fan-shaped in size and shape. The central connecting shell 321 and air extraction box 323 of the cover plate 320 are cylindrical.

[0051] In some embodiments, it is convenient to provide a variety of negative pressure intensities for smart IC carrier boards of various sizes, thereby improving their stability during handling.

[0052] Furthermore, the ends of the plurality of metal connecting pipes 322 extend into the plurality of grooves and connect to the top outer wall of the movable sleeve 1 400, movable sleeve 2 500, movable sleeve 3 600 and movable cylinder 700, and communicate with the cavities inside the respective cavities 1 420 and movable cylinder 700.

[0053] Furthermore, the top of the cover plate 320 is provided with an exhaust hole 324, and the plurality of exhaust holes 324 correspond to the plurality of grooves, and the plurality of exhaust holes 324 are located inside the exhaust guide box 330.

[0054] In some embodiments, the multiple exhaust holes 324 are small, which facilitates the discharge of internal compressed gas. When the gas supply stops, the designated movable sleeve 1 400, movable sleeve 2 500, movable sleeve 3 600 and movable cylinder 700 can be reset by their respective equipped springs 350. When the movable sleeve 1 400, movable sleeve 2 500, movable sleeve 3 600 or movable cylinder 700 is pneumatically lifted, some of the excess gas can be discharged through the exhaust holes 324 and enter the hollow rod 331.

[0055] In some embodiments, the exhaust port 324 is designed to balance pressure, etc. Its small diameter allows the gas to be discharged through the exhaust port at a rate that matches the gas compression and flow in the gas cylinder during normal gas injection, preventing excessive pressure difference on both sides that would make it difficult to push. When gas injection stops, the potential energy of the spring 350 will cause the designated movable sleeve 400, movable sleeve 500, movable sleeve 600, or movable cylinder 700 to retract. In the absence of new gas injection, the gas will be discharged through the exhaust port 324 and slowly retract into the corresponding groove, allowing it to flexibly push out the corresponding suction cup while also retracting and storing it, facilitating the handling of smart IC carrier boards of various sizes.

[0056] Furthermore, the exhaust guide box 330 is connected to a hollow rod 331 at its end. The hollow rod 331 has a through-hole 332 on its outer wall and a discharge electrode 333 is provided at the top of the hollow rod 331. The discharge electrode 333 is electrically connected to the high-voltage power supply 230.

[0057] In some embodiments, the discharge electrode 333 and the high-voltage power supply 230 are electrically connected. The high-voltage power supply 230 provides the necessary power support for the entire electrostatic discharge system. When it supplies power to the discharge electrode 333, the discharge electrode 333 generates a high voltage. Under this high voltage, the air around the electrode is ionized, thereby generating positive and negative charges. These positive and negative charges are fully mixed with the airflow discharged from the exhaust port 324 and introduced into the hollow rod 331 through the exhaust guide box 330. The mixed airflow carries the charge and is blown evenly and gently onto the surface of the smart IC carrier board on top of the carrier board placement rack and collection rack. Since the characteristic of electrostatics is that opposite charges attract, the airflow carrying positive and negative charges can effectively neutralize the static electricity generated on the surface of the smart IC carrier board due to friction and other reasons, thereby reducing the potential threat of static electricity to the performance and lifespan of the smart IC carrier board, ensuring that the IC carrier board can be handled and operated in a safe, low-static environment, and ensuring the smooth progress of the semiconductor manufacturing process. The above is the prior art.

[0058] It is worth noting that the outer wall of the end of the hollow rod 331 is connected to an exhaust arc plate 334. One side of the outer wall of the exhaust arc plate 334 is an inclined surface, and an exhaust port is provided on the inclined outer wall to facilitate the elimination of static electricity on the smart IC carrier board, ensuring that the IC carrier board can be handled and operated in a safe and low static environment.

[0059] It is worth noting that multiple grooves are provided with springs 350 inside, and multiple springs 350 are respectively sleeved on the outer circumferential wall of multiple connecting cylinders 340. The ends of multiple springs 350 are fixedly welded to the bottom of the cover plate 320, and the ends of multiple springs 350 are fixedly welded to the outer wall of the ends of movable sleeve 400, movable sleeve 500, movable sleeve 600 and movable cylinder 700.

[0060] In addition, springs 441 and mounting cylinders 442 are welded to the inner walls of the cavity 430 inside the multiple movable sleeves 400, 500 and 600. Suction cups 440 are welded to the ends of the multiple springs 441. The multiple suction cups 440 are respectively sleeved on the outer circumference of the corresponding mounting cylinders 442. The multiple mounting cylinders 442 communicate with the cavity 420. The top of the mounting cylinders 442 is provided with the same suction cup 440.

[0061] In some embodiments, the bottom of the movable cylinder 700 is provided with a single suction cup cylinder 400, which is the same as the movable cylinder 700, because its single suction cup cylinder 400 will not cause unstable adsorption due to uneven smart IC carrier board.

[0062] In addition, the output end of the first solenoid valve assembly 240 is connected to an air pipe, and the ends of multiple air pipes are connected to the top of multiple air extraction boxes 323. The output end of the second solenoid valve assembly 260 is connected to an air pipe, and the ends of multiple air pipes are connected to the outer wall of the connecting shell 321. The multiple connecting shells 321 correspond to the multiple slots respectively.

[0063] In some embodiments: the device can be powered by an external power source, the device uses a control system installed inside the transport table 100 and is controlled by an operation panel, all of which are existing technologies.

[0064] A method for handling a smart IC carrier board, and a method for handling a smart IC carrier board using a handling device, comprising the following specific steps:

[0065] S1: Handling preparation: When in use, the carrier placement rack and collection rack carrying multiple smart IC carrier boards can be placed in the multiple placement slots 110 respectively, and then the multiple smart IC carrier boards can be moved and handled by the de-drive device 120.

[0066] S2: Suction Cup Assembly Size Adjustment: Before handling, the control system inside the handling table 100 can be used to activate the solenoid valve assembly 240 to select the air intake for multiple connecting shells 321. For example, when handling a smaller smart IC carrier board, the operator injects external compressed gas into the solenoid valve assembly 240 via the control system command. The solenoid valve assembly 240 will precisely select the connecting shell 321 at the center of the cover plate 320 to inject gas according to the signal from the control system. At this time, the compressed gas enters the groove at the center of the bottom of the cover plate 320, and is then... Under the influence of gas pressure, spring 350 inside the tank is stretched and begins to deform. This stretching of spring 350 causes the movable cylinder 700 in the central area to move outwards and extend to the outside. Then, the control system controls solenoid valve group 260 to perform a suction operation on the corresponding suction box 323. The suction box 323 is connected to the movable cylinder 700. Through the suction action of the suction box 323, a negative pressure environment is quickly formed inside the movable cylinder 700. The suction force generated by this negative pressure environment is sufficient to firmly grasp the smaller smart IC carrier board. Subsequently, the drive device 120 starts working, gripping the smart IC... The C-carrier is moved to the designated position. During this process, cylinder 210 plays a crucial role. It is mainly responsible for controlling the gripping, lifting, lowering, and placing actions of the smart IC carrier, ensuring the smoothness and accuracy of the transportation process. When a larger smart IC carrier needs to be moved, the control system stops supplying gas to the connecting shell 321 at the center position. At this time, the gas inside the central slot will be slowly discharged through the exhaust port 324. As the gas is discharged, spring 350 begins to retract due to the loss of gas pressure support. The retraction of spring 350 drives the connected movable cylinder 700 to retract to the corresponding central slot. Inside the body, the air supply to other designated connecting shells 321 is selected again through the control system. The more air is injected into the connecting shells 321 on the outside, the more suction cups 440 participate in the adsorption, and the larger their diameters become, thus increasing the adsorption and gripping area. In this way, it is possible to better adapt to the gripping of IC carrier boards of various sizes without changing the suction cup device, which greatly improves the versatility and stability of the handling device. At the same time, it reduces the risk of accidental drop when the smaller suction cups are used to handle IC carrier boards, as well as the problem of mistakenly gripping multiple IC carrier boards when the larger suction cups are used.

[0067] S3: Flexible Adaptive Adjustment: When using movable sleeve 1 (400), movable sleeve 2 (500), or movable sleeve 3 (600) to pick up and transport IC carriers of various sizes, in order to ensure stable picking and gripping even when facing IC carriers with certain protrusions or depressions on the surface, the transport device has a flexible adaptive adjustment function. When the cylinder 210 drives the suction cup assembly to descend and approach the IC carrier, the suction cup cylinder 440 will be subjected to different degrees of force due to the possible unevenness of the IC carrier surface. At this time, spring 2 (441) comes into play. It has good elasticity and can adjust according to the suction cup cylinder 440. The force applied to the suction cup 440 is adaptively adjusted. When encountering a protruding part, the second spring 441 will be compressed, allowing the suction cup 440 to retract upwards a certain distance to avoid a hard collision with the protruding part. When encountering a recessed part, the second spring 441 will extend, allowing the suction cup 440 to extend downwards to better fit the recessed part. This adaptive adjustment method allows the suction cup assembly to fit more tightly against the top outer wall of the smart IC carrier board, providing a more stable adsorption force, ensuring the flexibility and reliability of the handling process, and reducing the problem of the adsorption effect being affected by the presence of recesses or protrusions on the surface of the IC carrier board.

[0068] S4: Buffer Retraction Protection: To cope with unexpected situations such as unexpected gas supply interruption or system failure, the handling device is designed with a buffer retraction protection function to fully protect the intelligent IC carrier board and suction cup device on the collection rack or carrier board placement rack, avoiding damage and cost losses caused by unexpected shutdown. When an unexpected gas supply interruption or system failure occurs, the supply of compressed gas will suddenly stop. At this time, the air inside the designated tank will rapidly escape through the exhaust port 324, and the gas pressure will drop sharply. Since spring 350 was in a stretched state during the previous operation, when the gas pressure disappears, spring 350 will quickly restore its elastic deformation, generating a retraction force. This retraction force will drive the designated movable sleeve 400, movable sleeve 500, movable sleeve 600, or movable cylinder 700, which are currently in use, to quickly retract into their respective tanks. This rapid retraction action can... To effectively reduce the impact caused by the cylinder 210 rapidly descending and contacting the collection rack or carrier plate placement rack due to unexpected machine stoppage, the cylinder 210 has a certain distance from the collection rack or carrier plate placement rack at the end of its stroke. It can only contact the IC carrier plate by using compressed gas to drive the designated movable sleeves 400, 500, 600, and 700 out. When the movable sleeves 400, 500, 600, and 700 retract, the suction cup cylinder 440 and the fixed cylinder 310 cannot touch the collection rack, carrier plate placement rack, or IC carrier plate when the cylinder 210 descends to its limit position. This avoids the suction cup device falling and causing impact due to machine failure, thus fully protecting the collection rack, carrier plate placement rack, smart IC carrier plate, and suction cup device, and reducing cost losses caused by impact damage.

[0069] S5: Static Electricity Elimination Blowing: During the compressed air injection process into the designated tank, in order to reduce the accumulation of static electricity on the surface of the smart IC carrier board and ensure the safety of its working environment, the handling device is equipped with a static electricity elimination blowing function. When compressed air is injected into the designated tank, excess air is generated. This excess air is discharged through the exhaust port 324 set at the top and then enters the exhaust guide box 330. The exhaust guide box 330 plays the role of guiding airflow, orderly introducing the discharged air into the hollow rod 331. The hollow rod 331 is equipped with a discharge electrode 333. When air enters the hollow rod 331, the discharge electrode 333 generates positive and negative charges. These positive and negative charges interact with the discharged gas to form a uniform guiding airflow. This guiding airflow blows evenly and gently towards the top of the carrier board placement rack and collection rack, blowing on the surface of the smart IC carrier board. In this way, the static electricity on the surface of the smart IC carrier board can be effectively neutralized, the accumulation of static electricity can be reduced, the safe working environment of the smart IC carrier board can be ensured, and the impact of static electricity on its performance and lifespan can be reduced.

[0070] Working principle of this invention: In use, the carrier rack and collection rack carrying multiple smart IC carrier boards can be placed in multiple placement slots 110 respectively. Then, the drive device 120 can be used to move and transport the multiple smart IC carrier boards. Before transport, the control system inside the transport platform 100 can be activated to control the solenoid valve group 240 to select the air intake of multiple connecting shells 321. For example, when it is necessary to transport a smaller smart IC carrier board, the operator injects external compressed gas into the solenoid valve group 240 through the control system command. The solenoid valve group 240 will accurately select the connecting shell 321 at the center of the cover plate 320 to inject gas according to the signal of the control system. Compressed gas enters the groove at the center of the bottom of the cover plate 320. Due to the gas pressure, the spring 350 inside the groove is stretched and begins to deform. The stretching of the spring 350 causes the movable cylinder 700 in the central area to push outward and extend to the outside. Then, the control system controls the solenoid valve group 260 to perform a suction operation on the corresponding suction box 323. The suction box 323 is connected to the movable cylinder 700. Through the suction action of the suction box 323, a negative pressure environment is quickly formed inside the movable cylinder 700. The suction force generated by this negative pressure environment is sufficient to firmly grasp the small smart IC carrier board. Subsequently, the drive device 120 starts to work, transporting the grasped smart IC carrier board to the designated position. In this process, cylinder 210 plays a crucial role, primarily controlling the gripping, lifting, lowering, and placement of the smart IC carrier board to ensure smooth and accurate handling. When handling larger smart IC carrier boards, the control system stops supplying gas to the central connecting shell 321. At this time, the gas inside the central slot is slowly discharged through the exhaust port 324. As the gas is discharged, spring 350, deprived of gas pressure support, begins to retract. The retraction of spring 350 causes its connected movable cylinder 700 to retract into the corresponding central slot. Then, the control system again selects and supplies air to other designated connecting shells 321, increasing the amount of air injected into the outer connecting shells 321. The suction cups 440 involved in the adsorption process... The larger the quantity and the larger the diameter of the suction cup, the larger the area that can be gripped. This allows for better adaptation to gripping various sizes of IC carriers without changing the suction cup device, greatly improving the versatility and stability of the handling device. It also reduces the risk of accidental drops when using smaller suction cups to handle IC carriers, and the problem of mistakenly gripping multiple IC carriers when using larger suction cups. When using movable sleeve 1 (400), movable sleeve 2 (500), or movable sleeve 3 (600) to pick up and transport larger IC carriers of various sizes, the handling device has a flexible adaptive adjustment function to ensure stable picking up and gripping even when facing IC carriers with certain protrusions or depressions on the surface.When cylinder 210 lowers the suction cup assembly closer to the IC carrier board, the suction cup cylinder 440 will be subjected to varying degrees of force due to the potential unevenness of the IC carrier board surface. At this time, spring 441 comes into play. It has good elasticity and can adaptively adjust according to the force applied to the suction cup cylinder 440. When encountering a protrusion, spring 441 will be compressed, allowing the suction cup cylinder 440 to retract upwards a certain distance to avoid a hard collision with the protrusion. When encountering a depression, spring 441 will extend, allowing the suction cup cylinder 440 to extend downwards to better fit the depression. This adaptive adjustment method allows the suction cup assembly to fit more tightly against the top outer wall of the smart IC carrier board, providing a more stable adsorption force, ensuring the flexibility and reliability of the handling process, and reducing the problem of the adsorption effect being affected by the presence of depressions or protrusions on the IC carrier board surface. To address potential unforeseen circumstances, such as unexpected gas supply interruptions or system malfunctions, the handling device is designed with a buffer retraction protection function. This fully protects the intelligent IC carrier and suction cup devices on the collection rack or carrier placement rack, preventing damage and cost losses due to unexpected shutdowns. When an unexpected gas supply interruption or system malfunction occurs, the compressed gas supply will suddenly stop. At this time, the air inside the designated tank will rapidly escape through the exhaust port 324, causing a sharp drop in gas pressure. Since spring 350 was under tension during previous operation, it will quickly recover its elastic deformation after the gas pressure disappears, generating a retraction force. This retraction force will cause the designated movable sleeves 400, 500, 600, or 700 to quickly retract into their respective tanks. This rapid retraction effectively reduces the impact caused by the cylinder 210 rapidly descending and contacting the collection rack or carrier placement rack during an unexpected shutdown. The end of the stroke of cylinder 210 is a certain distance from the collection rack or carrier placement rack. The system utilizes compressed gas to push out designated movable sleeves 400, 500, 600, and 700, allowing the cylinder 210 to contact the IC carrier. When all three sleeves retract, the suction cup cylinder 440 and the fixed cylinder 310 must not touch the collection rack, carrier placement rack, or IC carrier when the cylinder 210 reaches its limit position. This prevents the suction cup device from falling and impacting the IC carrier due to machine malfunction. This design effectively protects the collection rack, carrier placement rack, smart IC carrier, and suction cup device, reducing cost losses due to impact damage. During compressed air injection into the designated tank, to minimize static electricity buildup on the smart IC carrier surface and ensure a safe working environment, the handling device is equipped with a static elimination blowing function. When compressed air is injected into the designated tank, excess air is generated. This excess air is discharged through the exhaust port 324 at the top and then enters the exhaust guide box 330.The exhaust guide box 330 guides the airflow, introducing the exhausted air into the hollow rod 331 in an orderly manner. A discharge electrode 333 is installed inside the hollow rod 331. When air enters the hollow rod 331, the discharge electrode 333 generates positive and negative charges. These charges interact with the exhausted gas, forming a uniform guided airflow. This guided airflow gently blows towards the top of the carrier placement rack and collection rack, agitating the surface of the smart IC carrier. In this way, static electricity on the surface of the smart IC carrier can be effectively neutralized, reducing static buildup, ensuring a safe working environment for the smart IC carrier, and minimizing the impact of static electricity on its performance and lifespan.

[0071] The above description, in conjunction with specific embodiments, provides a further detailed explanation of the present invention. It should not be construed that the specific implementation of the present invention is limited to these descriptions. For those skilled in the art, several simple deductions or substitutions can be made without departing from the concept of the present invention, and all such deductions or substitutions should be considered to fall within the scope of protection defined by the claims submitted by the present invention.

Claims

1. A smart IC carrier board handling device, comprising a handling table (100), characterized in that: The top of the transport platform (100) is provided with a slot (110), and the top of the transport platform (100) is also provided with a drive device (120). The horizontal drive end of the drive device (120) is sleeved with a horizontal moving frame (200). The top of the horizontal moving frame (200) is provided with a cylinder (210). The outer walls on both sides of the horizontal moving frame (200) are respectively provided with a connecting plate one (220) and a connecting plate two (250). The tops of the connecting plate one (220) and the connecting plate two (250) are respectively fixedly connected with electromagnetic... Valve assembly 1 (240) and solenoid valve assembly 2 (260) are provided. A high-voltage power supply (230) is provided at the bottom of the connecting plate 1 (220). A suction cup conveying assembly is connected to the output end of the cylinder (210). The suction cup conveying assembly includes a support plate (300). The top of the support plate (300) is installed on the output end of the cylinder (210) with screws. A fixing cylinder (310) is provided on the outer wall of the support plate (300). A cover plate (320) is provided on the top of the fixing cylinder (310). The top of the cover plate (320) is fixedly installed. There is a connecting shell (321), and a plurality of metal connecting tubes (322) are movably sleeved inside the connecting shells (321). A vacuum box (323) is fixedly connected to the top of the plurality of metal connecting tubes (322). An electrostatic elimination component is also fixedly welded to the top of the cover plate (320). The electrostatic elimination component includes an exhaust guide box (330). The bottom of the exhaust guide box (330) is welded to the top of the cover plate (320). A connecting cylinder (340) is provided at the bottom of the cover plate (320). A plurality of connecting cylinders (340) are provided. A groove is formed between them, and movable circular sleeve one (400), movable circular sleeve two (500), movable circular sleeve three (600) and movable cylinder (700) are slidably connected inside the multiple grooves. Movable circular sleeve one (400), movable circular sleeve two (500) and movable circular sleeve three (600) are provided with cavity one (420) and cavity two (430) inside. Limiting rings (410) are fixedly connected to the outer circumference of movable circular sleeve one (400), movable circular sleeve two (500), movable circular sleeve three (600) and movable cylinder (700).

2. The intelligent IC carrier board handling device according to claim 1, characterized in that: The multiple connecting shells (321) and the multiple vacuum boxes (323) correspond to each other. The multiple connecting shells (321) and the multiple vacuum boxes (323) are fan-shaped in size and shape. The central connecting shell (321) and vacuum box (323) of the cover plate (320) are cylindrical.

3. The intelligent IC carrier board handling device according to claim 1, characterized in that: The ends of the plurality of metal connecting pipes (322) extend into the plurality of grooves and connect to the top outer wall of the movable sleeve one (400), movable sleeve two (500), movable sleeve three (600) and movable cylinder (700), and communicate with the cavities inside the cavity one (420) and movable cylinder (700) of their respective interiors.

4. The intelligent IC carrier board handling device according to claim 1, characterized in that: The top of the cover plate (320) is provided with an exhaust hole (324), and the multiple exhaust holes (324) correspond to multiple slots. The multiple exhaust holes (324) are located inside the exhaust guide box (330).

5. The intelligent IC carrier board handling device according to claim 1, characterized in that: The exhaust guide box (330) is connected to a hollow rod (331) at its end. A through-hole (332) is provided on the outer wall of the hollow rod (331). A discharge electrode (333) is provided on the top of the hollow rod (331). The discharge electrode (333) is electrically connected to the high-voltage power supply (230).

6. The intelligent IC carrier board handling device according to claim 5, characterized in that: The hollow rod (331) has an exhaust arc plate (334) connected to the outer wall of its end. The outer wall of the exhaust arc plate (334) is inclined and has an exhaust port.

7. The intelligent IC carrier board handling device according to claim 1, characterized in that: Multiple grooves are provided with springs (350) inside, and multiple springs (350) are respectively sleeved on the outer circumference of multiple connecting cylinders (340). The ends of multiple springs (350) are fixedly welded to the bottom of the cover plate (320), and the ends of multiple springs (350) are fixedly welded to the outer walls of the ends of movable sleeves (400), movable sleeves (500), movable sleeves (600) and movable cylinders (700).

8. The intelligent IC carrier board handling device according to claim 1, characterized in that: The inner walls of the cavity 2 (430) inside the multiple movable sleeves 1 (400), movable sleeve 2 (500) and movable sleeve 3 (600) are welded with spring 2 (441) and mounting cylinder (442). The ends of the multiple spring 2 (441) are welded with suction cylinder (440). The multiple suction cylinders (440) are respectively sleeved on the outer circumference of the corresponding mounting cylinder (442). The multiple mounting cylinders (442) are connected to the cavity 1 (420). The top of the mounting cylinder (442) is provided with the same suction cylinder (440).

9. The intelligent IC carrier board handling device according to claim 1, characterized in that: The output end of the first solenoid valve assembly (240) is connected to an air pipe, and the ends of multiple air pipes are connected to the top of multiple air extraction boxes (323). The output end of the second solenoid valve assembly (260) is connected to an air pipe, and the ends of multiple air pipes are connected to the outer wall of the connecting shell (321). The multiple connecting shells (321) correspond to the multiple slots respectively.

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