Thin plate residual stress testing device and thin plate residual stress testing method

Abstract

The invention provides a thin plate residual stress testing device and a thin plate residual stress testing method. The thin plate residual stress testing device comprises a clamping and supporting assembly, a cutting assembly and a laser testing assembly, the clamping and supporting assembly comprises at least one clamping and testing structure, and each clamping and testing structure comprises a testing table, a first clamping part, a second clamping part and a bottom supporting part; a test cavity is formed in the test bed, a test inlet communicated with the test cavity is further formed in the test bed, and at least one part of the first clamping part, at least one part of the second clamping part and at least one part of the bottom supporting part are arranged in the test cavity; a to-be-detected thin plate enters the test cavity from the test inlet in the length direction, and the bottom supporting part is used for supporting the bottom of the to-be-detected thin plate; and the cutting assembly is used for cutting grooves with different depths in the to-be-detected thin plate. According to the invention, the problems of low test efficiency, complex structure and high equipment cost of a thin plate residual stress test device in the prior art are solved, and full-automatic detection can be realized.

Description

Technical Field

[0001] The present invention relates to the technical field of thin plate internal residual stress testing, and in particular to a thin plate residual stress testing device and a thin plate residual stress testing method. Background Art

[0002] Thin sheet materials (both metal and non-metal) are increasingly used in applications such as aircraft skins, automotive panels, silicon steel sheets, and PCB substrates. However, the presence of residual stress within thin sheets poses a significant challenge, hindering their processing accuracy and performance. Residual stress, typically generated during material processing (such as cold rolling, heat treatment, and welding), can cause sheet warping during subsequent sheet removal processes like machining, milling, and etching, further impacting the dimensional accuracy and process quality of the finished product.

[0003] At present, the main methods for testing residual stress inside thin plates include X-ray diffraction, neutron diffraction, laser diffraction, etc. These methods mainly focus on testing residual stress on the surface or near-surface area of ​​thin plates. There is a lack of effective means for testing full-thickness residual stress, especially for quantitative evaluation of residual stress fluctuations between different batches of materials. The existing X-ray diffraction and neutron diffraction methods can test residual stress inside materials, but the equipment is expensive, the operation is complicated, and the test accuracy is limited by the thickness and surface roughness of the material. Although the laser diffraction method has the advantages of being non-contact and fast, it can only test surface residual stress and has limited effect on testing full-thickness residual stress.

[0004] In addition, the existing technology lacks high-efficiency testing equipment for testing the residual stress of thin plates. Some integrated testing equipment is usually complex in structure, cumbersome to operate, and difficult to achieve full automation, resulting in low testing efficiency and difficulty in meeting the needs of industrial large-scale testing.

[0005] Therefore, the existing testing devices for residual stress inside thin plates have the following major disadvantages: 1. Low testing efficiency: The existing testing equipment has a complex structure and cumbersome operation, making it difficult to achieve fully automated testing and unsuitable for industrial large-scale testing; 2. High equipment cost: The equipment required for some testing methods is expensive and complex to operate, resulting in high testing costs; 3. Lack of integrated design: The existing testing equipment makes it difficult to achieve precise control of cutting parameters, and there is a lack of cooling and debris collection systems during the test process, which affects test accuracy and equipment maintenance. Summary of the Invention

[0006] The present invention provides a thin plate residual stress testing device and a thin plate residual stress testing method, which at least solve the problems of low testing efficiency, complex structure and high equipment cost of the thin plate residual stress testing device in the prior art.

[0007] In order to solve the above problems, according to one aspect of the present invention, a thin plate residual stress testing device is provided, comprising: a clamping support assembly, a cutting assembly and a laser testing assembly; the clamping support assembly comprises at least one clamping test structure, the clamping test structure comprises a test bench, a first clamping part, a second clamping part and a bottom supporting part; the test bench has a test cavity inside, and the test bench also has a test inlet connected to the test cavity, the first clamping part, the second clamping part and at least a part of the bottom supporting part are respectively arranged in the test cavity, and the first clamping part is arranged at the test inlet; the thin plate to be tested enters the test cavity from the test inlet along its length direction, and the two ends of the thin plate to be tested along its length direction are respectively a first end and a second end, the first end is close to the test inlet, and the bottom supporting part is used to support the bottom of the thin plate to be tested; the first clamping part is used to fix the first end; the second clamping part is used to fix the second end; the cutting assembly is used to cut grooves of different depths on the thin plate to be tested; the laser testing assembly is used to detect the warping deformation of the thin plate to be tested.

[0008] Furthermore, before grooving the thin plate to be tested, the second clamping part clamps the second end, the first clamping part separates from the first end, and the bottom supporting part separates from the bottom of the thin plate to be tested, so that the first end of the thin plate to be tested is suspended in the air, and the laser testing component detects the warping deformation of the thin plate to be tested at this time to obtain initial deformation data; when grooving the thin plate to be tested, the second clamping part clamps the second end, the first clamping part fixes the first end, and the bottom supporting part supports the bottom of the thin plate to be tested; after grooving the thin plate to be tested is completed once, the second clamping part clamps the second end, the first clamping part separates from the first end, and the bottom supporting part separates from the bottom of the thin plate to be tested, so that the first end of the thin plate to be tested after cutting is suspended in the air, and the laser testing component detects the warping deformation of the thin plate to be tested at this time to obtain a cutting deformation data; based on the initial deformation data and multiple cutting deformation data obtained after grooving multiple times at different depths, the residual stress inside the thin plate to be tested is calculated.

[0009] Furthermore, the second clamping part includes a pressure head and a second limit plate; the second limit plate is fixedly arranged on the test bench, and the second limit plate has a second limit groove arranged in the vertical direction, and a part of the pressure head is slidably limited with the inner wall of the second limit groove; when there are multiple clamping test structures, the clamping support assembly also includes a second driving part, and the second driving part is simultaneously connected to the pressure heads of multiple clamping test structures to drive multiple pressure heads to reciprocate in the vertical direction at the same time, so as to approach or move away from the second end at the same time.

[0010] Furthermore, the second driving unit includes two electric pull rods and a pressure plate. The two electric pull rods are respectively connected to the two ends of the pressure plate to simultaneously drive the pressure plate to move up and down; the pressure plate is respectively connected to the pressure heads of multiple clamping test structures to drive multiple pressure heads to reciprocate in the vertical direction at the same time.

[0011] Furthermore, the first clamping part includes an upper push rod, a first driving part and a first limit plate, the first limit plate is fixedly arranged on the test bench and is located at the upper part of the test inlet; the first limit plate has a first limit groove arranged in the vertical direction, and a part of the upper push rod is slidably limited with the inner wall of the first limit groove; the first driving part is driven and connected to the upper push rod, and the first driving part is used to drive the upper push rod to reciprocate in the vertical direction to approach or move away from the first end.

[0012] Furthermore, the bottom support part includes a bottom support plate and a bottom driving part; the bottom support plate is slidingly limited with the inner wall of the test chamber; the bottom driving part is drivingly connected to the bottom support plate, and the bottom driving part is used to drive the bottom support plate to move up and down to approach or move away from the bottom of the thin plate to be tested; wherein, the upper push rod, the bottom support plate, and the thin plate to be tested are respectively projected to the same horizontal plane in the vertical direction, and the projection of the upper push rod is located within the projection of the bottom support plate, so that the upper push rod and the bottom support plate jointly clamp and fix the thin plate to be tested, and at least half of the projection of the thin plate to be tested coincides with the projection of the bottom support plate, and the overlapping part of the projection is the suspended part on the thin plate to be tested, and the laser testing component detects the warping deformation of the suspended part.

[0013] Furthermore, the cutting assembly includes a support frame, a horizontal slide rail structure, a vertical slide rail structure and a cutting part; the support frame is fixedly arranged, the horizontal slide rail structure is fixedly arranged on the support frame, and the vertical slide rail structure can be horizontally movably arranged on the horizontal slide rail structure; the cutting part can be raised and lowered on the vertical slide rail structure; the cutting part is used to cut grooves on the thin plate to be inspected.

[0014] Furthermore, the thin plate residual stress testing device also includes a base, and the clamping support assembly and the support frame are respectively fixedly arranged on the base; the cutting assembly also includes a tool setter, which is arranged on the base with adjustable height. By adjusting the top height of the tool setter, the top height of the tool setter is made consistent with the bottom height of the fixed thin plate to be tested. After the cutting part contacts the top of the tool setter, the cutting part obtains the vertical limit coordinate value. When the cutting part cuts a groove, the groove cutting depth of the cutting part on the thin plate to be tested is obtained according to the vertical limit coordinate value and the vertical displacement data of the cutting part; and / or, the cutting part includes a cutting motor and a milling cutter, and the cutting motor is fixedly arranged on the vertical slide rail structure to follow the movement of the vertical slide rail structure; the cutting motor and the milling cutter are detachably driven and connected to drive the milling cutter to cut grooves on the thin plate to be tested.

[0015] Furthermore, the laser testing assembly includes multiple laser displacement sensors, at least one laser displacement sensor is arranged in a test cavity of a test bench, and the laser displacement sensor is used to detect the warping deformation of the thin plate to be tested located in the test cavity; when there are multiple clamping test structures, at least one laser displacement sensor is set on the test bench of each clamping test structure; and / or, the first clamping part includes a first limit plate, the first limit plate has a laser hole, and the test laser emitted by the laser displacement sensor is irradiated on the thin plate to be tested through the laser hole to perform warping deformation detection.

[0016] Furthermore, the thin plate residual stress testing device also includes a base and a plurality of adjustment feet, and the clamping support assembly and the cutting assembly are respectively fixedly arranged on the base; the plurality of adjustment feet are spaced apart at the bottom of the base to jointly support the base; the base is leveled by adjusting the adjustment feet; and / or, the thin plate residual stress testing device also includes a debris collection assembly, the debris collection assembly includes a debris collection box and a vacuum cleaner, the debris collection box is connected to the test chamber, and is used to collect debris generated when the cutting assembly cuts grooves; the debris collection box is provided with a debris discharge port, and the vacuum cleaner is connected to the inside of the debris collection box through the debris discharge port, and the vacuum cleaner sucks up the debris collected in the debris collection box through the debris discharge port to clean the debris collection box.

[0017] Furthermore, the thin plate residual stress testing device also includes a central controller, which is electrically connected to the clamping support assembly, the cutting assembly and the laser testing assembly, respectively, to control the clamping support assembly, the cutting assembly and the laser testing assembly to work together; the thin plate residual stress testing device also includes a control box, the central controller is arranged in the control box, and the control box has ventilation holes and harness holes, the ventilation holes are used to ventilate and dissipate heat inside the control box; the harness holes are used to pass the harness connected to the central controller; the central controller calculates the residual stress inside the thin plate to be tested based on the initial deformation data and multiple cutting deformation data obtained after multiple groovings of different depths; the thin plate residual stress testing device also includes a touch display and a master control button, the touch display is electrically connected to the central controller for displaying information and touch; the master control button is electrically connected to the central controller for controlling the thin plate residual stress testing device to be turned on or off; and / or, the thin plate residual stress testing device also includes a base and a protective shell, the clamping support assembly, the cutting assembly and the laser testing assembly are respectively arranged inside the protective shell; the protective shell is arranged on the base.

[0018] According to another aspect of the present invention, a method for testing residual stress of a thin plate is provided, which is applied to the above-mentioned thin plate residual stress testing device, and the method for testing residual stress of a thin plate also includes the following steps: S1, clamping and fixing the second end, and leaving the first end suspended in the air, detecting the warping deformation of the thin plate to be tested at this time, and obtaining initial deformation data; S2, clamping and fixing the second end and the first end, and supporting the bottom of the thin plate to be tested, and then completing a groove cutting on the thin plate to be tested with a set depth and a set length. After the groove cutting is completed, clamping the second end, and leaving the first end suspended in the air, detecting the warping deformation of the thin plate to be tested at this time, and obtaining a cutting deformation data; S3, repeating step S2 multiple times to obtain multiple cutting deformation data corresponding to multiple grooves of different depths, respectively; according to the initial deformation data and the multiple cutting deformation data, calculating the residual stress distribution inside the thin plate to be tested at different depths, and realizing the residual stress test of the thin plate to be tested from the upper surface to the inside along its thickness direction.

[0019] Applying the technical solution of the present invention, the present invention provides a thin plate residual stress testing device, including: a clamping support assembly, a cutting assembly and a laser testing assembly; the clamping support assembly includes at least one clamping test structure, the clamping test structure includes a test bench, a first clamping part, a second clamping part and a bottom supporting part; the test bench has a test cavity inside, and the test bench also has a test inlet connected to the test cavity, the first clamping part, the second clamping part and at least a part of the bottom supporting part are respectively arranged in the test cavity, and the first clamping part is arranged at the test inlet; the thin plate to be tested enters the test cavity from the test inlet along its length direction, and the two ends of the thin plate to be tested along its length direction are respectively the first end and the second end, the first end is close to the test inlet, and the bottom supporting part is used to support the bottom of the thin plate to be tested; the first clamping part is used to fix the first end; the second clamping part is used to fix the second end; the cutting assembly is used to cut grooves of different depths on the thin plate to be tested; the laser testing assembly is used to detect the warping deformation of the thin plate to be tested.

[0020] The present invention realizes the fixation, cutting and internal residual stress detection of the thin plate to be detected with a simple structure by setting a clamping support component, a cutting component and a laser testing component to work together; the present invention realizes the efficient automatic measurement of the internal residual stress of the thin plate to be detected based on the detection principle of the grooving method and combined with relevant structures, and gradually releases the internal stress of the material by cutting a series of grooves on the thin plate to be detected, measures the warping deformation caused by the stress release, and then calculates the residual stress inside the thin plate to be detected based on the initial deformation data and multiple cutting deformation data obtained after multiple groovings of different depths. Based on different grooving depths, lengths and widths, and according to the relationship between the plate thickness, grooving depth and warping deformation, quantitative characterization of the residual stress from the surface to the core of the thin plate is realized, and then quantitative testing of the residual stress from the surface to the inside of the thin plate to be detected is realized. The thin plate residual stress testing device proposed in the present invention can not only test surface residual stress, but also test residual stress throughout the thickness direction. The present invention can quickly assess the magnitude of residual stress within the thin plate to be tested, as well as the fluctuation of residual stress between different batches of materials, thereby achieving effective monitoring of residual stress in multiple batches of thin plates, helping to establish thin plate residual stress control standards and improve the uniformity of residual stress in thin plate materials. The present invention has a simple structure and low cost, making it easy to assemble and subsequently maintain. It solves the problems of low testing efficiency, complex structure, and high equipment cost in the thin plate residual stress testing device of the prior art. It can achieve fully automated testing, improve the testing efficiency of large batches of thin plates, effectively meet the needs of industrial large-scale thin plate residual stress testing, and is suitable for large-scale promotion and use. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The accompanying drawings, which constitute part of this application, are intended to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are intended to explain the present invention and do not constitute an undue limitation of the present invention. In the accompanying drawings:

[0022] Figure 1 A schematic diagram of a portion of the structure of a thin plate residual stress testing device provided by an embodiment of the present invention after removing the protective shell is shown;

[0023] Figure 2 A schematic diagram of the external structure of a thin plate residual stress testing device provided by an embodiment of the present invention is shown;

[0024] Figure 3 A schematic diagram of a portion of the structure of a thin plate residual stress testing device provided by an embodiment of the present invention at a main viewing angle is shown;

[0025] Figure 4 A schematic diagram of a portion of the structure of the thin plate residual stress testing device provided by an embodiment of the present invention, after removing the protective shell, is shown in the main viewing angle;

[0026] Figure 5 A schematic diagram of a portion of the structure of a thin plate residual stress testing device provided by an embodiment of the present invention, with the protective housing removed, is shown in a side view;

[0027] Figure 6 A partial structural schematic diagram of a clamping test structure provided by an embodiment of the present invention is shown;

[0028] Figure 7 A schematic diagram of a portion of the structure of a clamping test structure provided by an embodiment of the present invention at a main viewing angle is shown;

[0029] Figure 8 A schematic diagram of the internal structure of a clamping test structure provided by an embodiment of the present invention is shown from a side view;

[0030] Figure 9 A schematic diagram of the internal structure of the clamping test structure provided by an embodiment of the present invention after a thin plate to be tested is placed therein is shown from a side view;

[0031] Figure 10 A schematic diagram of the internal structure of the clamping test structure provided by an embodiment of the present invention when detecting initial deformation data at a side view angle is shown;

[0032] Figure 11 A schematic diagram of the internal structure of the clamping test structure provided by an embodiment of the present invention when the thin plate to be tested is completely compressed and fixed from a side view angle is shown;

[0033] Figure 12 A schematic diagram of the internal structure of the clamping test structure provided by an embodiment of the present invention when cutting a thin plate to be tested at a side view angle is shown;

[0034] Figure 13 A schematic diagram of the internal structure of the clamping test structure provided by an embodiment of the present invention when detecting cutting deformation data after cutting is completed at a side view angle is shown;

[0035] Figure 14 The figure shows the internal structure of the clamping test structure provided by the embodiment of the present invention when the thin plate to be tested is released after cutting is completed at a side view angle.

[0036] The above drawings include the following reference numerals:

[0037] 10. Clamping support assembly; 11. Clamping test structure; 12. Test bench; 121. Test chamber; 122. Test inlet; 13. First clamping section; 131. Upper ejector pin; 132. First drive section; 133. First stop plate; 14. Second clamping section; 141. Press head; 142. Second stop plate; 15. Bottom support section; 151. Bottom support plate; 152. Bottom drive section; 16. Second drive section; 161. Electric pull rod; 162. Press plate;

[0038] 20. Cutting assembly; 21. Support frame; 22. Horizontal slide rail structure; 23. Vertical slide rail structure; 24. Cutting unit; 241. Cutting motor; 242. Milling cutter; 25. Tool setter;

[0039] 30. Laser test assembly; 31. Laser displacement sensor;

[0040] 40. Thin plate to be tested; 41. First end; 42. Second end;

[0041] 50. Base;

[0042] 60. Adjust the footing;

[0043] 70. Debris collection assembly; 71. Debris collection box; 711. Debris discharge port;

[0044] 80. Control box; 81. Ventilation hole; 82. Wiring harness hole;

[0045] 90. Touch screen display; 100. Master control button; 110. Protective housing. DETAILED DESCRIPTION

[0046] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, rather than all the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is in no way intended to limit the present invention and its application or use. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0047] like Figures 1 to 14As shown, an embodiment of the present invention provides a thin plate residual stress testing device, comprising: a clamping support assembly 10, a cutting assembly 20 and a laser testing assembly 30; the clamping support assembly 10 includes at least one clamping test structure 11, the clamping test structure 11 includes a test bench 12, a first clamping portion 13, a second clamping portion 14 and a bottom support portion 15; the test bench 12 has a test cavity 121 inside, and the test bench 12 also has a test inlet 122 connected to the test cavity 121, at least a portion of the first clamping portion 13, the second clamping portion 14 and the bottom support portion 15 are respectively arranged in the test cavity 121, and the second clamping portion 13, the second clamping portion 14 and the bottom support portion 15 are respectively arranged in the test cavity 121. A clamping portion 13 is provided at the test inlet 122; the thin plate 40 to be tested enters the test cavity 121 from the test inlet 122 along its length direction, and the two ends of the thin plate 40 to be tested along its length direction are respectively a first end 41 and a second end 42, the first end 41 is close to the test inlet 122, and the bottom support portion 15 is used to support the bottom of the thin plate 40 to be tested; the first clamping portion 13 is used to fix the first end 41; the second clamping portion 14 is used to fix the second end 42; the cutting assembly 20 is used to perform grooves of different depths on the thin plate 40 to be tested; the laser testing assembly 30 is used to detect the warping deformation of the thin plate 40 to be tested.

[0048] The present invention sets a clamping support component 10, a cutting component 20 and a laser testing component 30 to work together, and uses a simple structure to realize the fixation, cutting and internal residual stress detection of the thin plate 40 to be detected; the present invention is based on the detection principle of the grooving method and combines relevant structures to realize efficient automatic measurement of the internal residual stress of the thin plate 40 to be detected, and gradually releases the internal stress of the material by cutting a series of grooves on the thin plate 40 to be detected, and measures the warping deformation caused by the stress release. Then, based on the initial deformation data and multiple cutting deformation data obtained after multiple groovings of different depths, the residual stress inside the thin plate 40 to be detected is calculated. Based on different grooving depths, lengths and widths, and according to the relationship between the plate thickness, grooving depth and warping deformation, the quantitative characterization of the residual stress from the surface to the core of the thin plate is realized, and then the quantitative test of the residual stress from the surface to the inside of the thin plate 40 to be detected is realized. The thin plate residual stress testing device proposed in the present invention can not only test surface residual stress, but also test residual stress throughout the thickness direction. The present invention can quickly assess the magnitude of residual stress within the thin plate 40 to be tested, as well as the fluctuation of residual stress between different batches of materials, thereby achieving effective monitoring of residual stress in multiple batches of thin plates, helping to establish thin plate residual stress control standards and improve the uniformity of residual stress in thin plate materials. The present invention has a simple structure and low cost, making it easy to assemble and subsequently maintain. It solves the problems of low testing efficiency, complex structure, and high equipment cost in the thin plate residual stress testing device of the prior art. It can achieve fully automated testing, improve the testing efficiency of large batches of thin plates, effectively meet the needs of industrial large-scale thin plate residual stress testing, and is suitable for large-scale promotion and use.

[0049] Specifically, before the thin plate 40 to be tested is grooved, the second clamping portion 14 clamps the second end 42, the first clamping portion 13 is separated from the first end 41, and the bottom support portion 15 is separated from the bottom of the thin plate 40 to be tested, so that the first end 41 of the thin plate 40 to be tested is suspended in the air, and the laser testing assembly 30 detects the warping deformation of the thin plate 40 to be tested at this time to obtain initial deformation data; when the thin plate 40 to be tested is grooved, the second clamping portion 14 clamps the second end 42, the first clamping portion 13 fixes the first end 41, and the bottom support portion 15 supports the thin plate 40 to be tested. Bottom; after the thin plate 40 to be tested is grooved once, the second clamping portion 14 clamps the second end 42, the first clamping portion 13 is separated from the first end 41, and the bottom supporting portion 15 is separated from the bottom of the thin plate 40 to be tested, so that the first end 41 of the thin plate 40 to be tested after cutting is suspended, and the laser testing component 30 detects the warping deformation of the thin plate 40 to be tested at this time to obtain a cutting deformation data; based on the initial deformation data and multiple cutting deformation data obtained after multiple grooves of different depths, the residual stress inside the thin plate 40 to be tested is calculated.

[0050] Through the coordinated action of the clamping support assembly 10, the cutting assembly 20 and the laser testing assembly 30, an accurate test of the residual stress inside the thin plate is achieved; the clamping support assembly 10 ensures the stable fixation of the thin plate during the test, the cutting assembly 20 can perform precise grooving operations, and the laser testing assembly 30 can monitor the warping deformation of the thin plate in real time, providing accurate data for subsequent stress calculations. Based on the principle of the grooving method, by grooving at different depths of the thin plate, the warping changes of the thin plate before and after grooving are observed and measured, thereby calculating the distribution of internal residual stress. The above technical solution can realize efficient and automatic measurement of residual stress inside the thin plate, solves the problems of low test efficiency and complex structure in the existing technology, and improves the accuracy and efficiency of the test. In other embodiments, the test accuracy can be further improved by optimizing the cutting parameters of the cutting assembly 20, such as cutting speed and cutting path.

[0051] like Figure 1 、 Figure 6 and Figure 8 As shown, the second clamping part 14 includes a pressure head 141 and a second limiting plate 142; the second limiting plate 142 is fixedly arranged on the test bench 12, and the second limiting plate 142 has a second limiting groove arranged in the vertical direction, and a part of the pressure head 141 is slidably limited with the inner wall of the second limiting groove; when there are multiple clamping test structures 11, the clamping support assembly 10 also includes a second driving part 16, and the second driving part 16 is simultaneously driven and connected to the pressure heads 141 of multiple clamping test structures 11 to drive the multiple pressure heads 141 to reciprocate in the vertical direction at the same time, so as to approach or move away from the second end 42 at the same time.

[0052] By providing the second limiting plate 142 and the second driving unit 16, the second ends 42 of the plurality of thin plates can be fixed and released synchronously, thereby improving the batch processing capacity of the test. The second limiting groove on the second limiting plate 142 ensures the precise movement of the pressure head 141 in the vertical direction, while the second driving unit 16 realizes the unified control of the plurality of pressure heads 141, thereby ensuring the consistency and accuracy of the test. This arrangement makes the test process more efficient, and can process multiple thin plates at the same time, greatly improving the test efficiency. In other embodiments, by increasing the driving capacity of the first driving unit 132, faster fixing and release of the first end 41 can be achieved, thereby further improving the test speed.

[0053] like Figure 1 and Figure 4 As shown, the second driving unit 16 includes two electric pull rods 161 and a pressure plate 162. The two electric pull rods 161 are respectively connected to the two ends of the pressure plate 162 to simultaneously drive the pressure plate 162 to move up and down; the pressure plate 162 is respectively connected to the pressure heads 141 of multiple clamping test structures 11 to drive multiple pressure heads 141 to reciprocate in the vertical direction at the same time.

[0054] The combined use of the electric pull rod 161 and the pressure plate 162 realizes the synchronous control of multiple pressure heads 141, ensuring stability and consistency during the test process. The electric pull rod 161 can ensure the smooth lifting and lowering of the pressure plate 162 through precise motor control, thereby driving the synchronous movement of multiple pressure heads 141 and avoiding errors caused by manual operation. The above technical solution improves the degree of automation of the test, reduces manual intervention, and makes the test process more efficient and accurate. In other embodiments, a hydraulic drive system can also be used instead of the electric pull rod 161 to provide greater driving force, which is suitable for testing thicker or harder sheet materials.

[0055] like Figure 1 、 Figure 5 、 Figure 6 、 Figure 7 and Figure 8 As shown, the first clamping part 13 includes an upper push rod 131, a first driving part 132 and a first limiting plate 133. The first limiting plate 133 is fixedly arranged on the test bench 12 and is located at the upper part of the test inlet 122; the first limiting plate 133 has a first limiting groove arranged in the vertical direction, and a part of the upper push rod 131 is slidably limited with the inner wall of the first limiting groove; the first driving part 132 is drivingly connected to the upper push rod 131, and the first driving part 132 is used to drive the upper push rod 131 to reciprocate in the vertical direction to approach or move away from the first end 41.

[0056] The design of the first clamping portion 13 ensures the precise fixation and release of the first end 41 of the thin plate, thereby improving the accuracy of the test. The cooperation between the upper push rod 131 and the first limiting groove limits the movement direction of the upper push rod 131, ensuring its stable movement in the vertical direction, while the first driving portion 132 provides the power for the movement of the upper push rod 131, thereby achieving precise control of the first end 41. The above design ensures the stable fixation of the thin plate during the test, avoids test errors caused by loose fixation, and improves the reliability of the test. In other embodiments, the movement accuracy of the upper push rod 131 can be further improved by increasing the driving accuracy of the first driving portion 132, which is suitable for occasions with higher requirements for test accuracy.

[0057] like Figure 7 、 Figure 8 and Figure 9 As shown, the bottom support portion 15 includes a bottom support plate 151 and a bottom driving portion 152; the bottom support plate 151 is slidingly limited with the inner wall of the test chamber 121; the bottom driving portion 152 is drivingly connected to the bottom support plate 151, and the bottom driving portion 152 is used to drive the bottom support plate 151 to move up and down to approach or move away from the bottom of the thin plate 40 to be tested; wherein, the upper push rod 131, the bottom support plate 151, and the thin plate 40 to be tested are respectively projected to the same horizontal plane in the vertical direction, and the projection of the upper push rod 131 is located within the projection of the bottom support plate 151, so that the upper push rod 131 and the bottom support plate 151 jointly clamp and fix the thin plate 40 to be tested, and at least half of the projection of the thin plate 40 to be tested coincides with the projection of the bottom support plate 151, and the overlapping part of the projection is the suspended part on the thin plate 40 to be tested, and the laser testing assembly 30 detects the warping deformation of the suspended part.

[0058] The design of the bottom support portion 15 ensures stable support for the bottom of the thin plate, while enabling precise control of the bottom support. The bottom support plate 151 cooperates with the sliding limiter on the inner wall of the test chamber 121 to ensure its stable movement in the vertical direction, while the bottom drive portion 152 provides the power for the movement of the bottom support plate 151, thereby achieving precise control of the bottom support. The above technical solution ensures stable support for the bottom of the thin plate during the test, avoids cutting errors caused by unstable bottom support, and thereby improves the accuracy and reliability of the test. In other embodiments, the performance of the bottom support portion 15 can be further improved by optimizing the driving speed and stability of the bottom drive portion 152, which is suitable for occasions with higher requirements for test speed and accuracy.

[0059] like Figure 1 、 Figure 4 and Figure 5As shown, the cutting assembly 20 includes a support frame 21, a horizontal slide rail structure 22, a vertical slide rail structure 23 and a cutting part 24; the support frame 21 is fixedly arranged, the horizontal slide rail structure 22 is fixedly arranged on the support frame 21, and the vertical slide rail structure 23 can be horizontally movably arranged on the horizontal slide rail structure 22; the cutting part 24 can be raised and lowered on the vertical slide rail structure 23; the cutting part 24 is used to cut grooves on the thin plate 40 to be inspected.

[0060] The design of the cutting assembly 20 ensures precision and stability during the grooving process. The combination of the support frame 21, the horizontal slide structure 22, and the vertical slide structure 23 provides a precise motion trajectory for the cutting unit 24, ensuring accurate grooving depth and position. This arrangement enables precise testing of residual stress within the sheet metal, improving both accuracy and reliability. In other embodiments, the cutting parameters of the cutting unit 24, such as cutting speed and the cooling system, can be optimized to further enhance testing accuracy and improve the lifespan of the equipment.

[0061] like Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 and Figure 5 As shown, the thin plate residual stress testing device also includes a base 50, and the clamping support assembly 10 and the support frame 21 are respectively fixedly arranged on the base 50; the cutting assembly 20 also includes a tool setter 25, and the tool setter 25 is arranged on the base 50 with an adjustable height. By adjusting the top height of the tool setter 25, the top height of the tool setter 25 is made consistent with the bottom height of the fixed thin plate 40 to be tested. After the cutting part 24 contacts the top of the tool setter 25, the cutting part 24 obtains the vertical limit coordinate value When the cutting part 24 cuts the groove, the cutting depth of the cutting part 24 on the thin plate 40 to be detected is obtained according to the vertical limit coordinate value and the displacement data of the cutting part 24 in the vertical direction; and / or, the cutting part 24 includes a cutting motor 241 and a milling cutter 242, and the cutting motor 241 is fixedly arranged on the vertical slide rail structure 23 to move with the vertical slide rail structure 23; the cutting motor 241 and the milling cutter 242 are detachably driven and connected to drive the milling cutter 242 to cut the groove on the thin plate 40 to be detected.

[0062] The combined use of the tool setter 25 and the cutting part 24 ensures the precise control of the cutting depth and improves the accuracy of the test. The top height adjustment of the tool setter 25 and the acquisition of the vertical limit coordinate value of the cutting part 24 provide a benchmark for the control of the cutting depth, while the combined use of the cutting motor 241 and the milling cutter 242 achieves precise cutting of thin plates. In terms of effect, the above technical solution ensures the precise control of the cutting depth, avoids the test error caused by inaccurate cutting depth, and improves the accuracy and reliability of the test. In other embodiments, the performance of the cutting part 24 can be further improved by increasing the driving accuracy of the cutting motor 241, which is suitable for occasions with higher requirements for test accuracy.

[0063] like Figures 8 to 14 As shown, the laser testing assembly 30 includes multiple laser displacement sensors 31, at least one laser displacement sensor 31 is arranged in a test cavity 121 of a test bench 12, and the laser displacement sensor 31 is used to detect the warping deformation of the thin plate 40 to be tested located in the test cavity 121; when there are multiple clamping test structures 11, at least one laser displacement sensor 31 is set on the test bench 12 of each clamping test structure 11; and / or, the first clamping part 13 includes a first limiting plate 133, and the first limiting plate 133 has a laser hole. The test laser emitted by the laser displacement sensor 31 is irradiated on the thin plate 40 to be tested through the laser hole to perform warping deformation detection.

[0064] The design of the laser test assembly 30 ensures accurate measurement of the warping deformation of the thin plate. The use of the laser displacement sensor 31 makes it possible to monitor the warping deformation of the thin plate in real time, while the laser hole on the first limit plate 133 ensures accurate irradiation of the test laser, thereby improving the accuracy and reliability of the test. This arrangement ensures accurate measurement of the warping deformation of the thin plate, avoids test errors caused by inaccurate measurements, and improves the accuracy and reliability of the test. In other embodiments, the accuracy and reliability of the measurement can be further improved by increasing the number and accuracy of the laser displacement sensors 31, which is suitable for occasions with higher requirements for test accuracy.

[0065] like Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 and Figure 5As shown, the thin plate residual stress testing device also includes a base 50 and a plurality of adjustment feet 60, the clamping support assembly 10 and the cutting assembly 20 are respectively fixedly arranged on the base 50; the plurality of adjustment feet 60 are spaced apart at the bottom of the base 50 to jointly support the base 50; the base 50 is leveled by adjusting the adjustment feet 60; and / or, the thin plate residual stress testing device also includes a debris collection assembly 70, the debris collection assembly 70 includes a debris collection box 71 and a vacuum cleaner, the debris collection box 71 is connected to the test chamber 121, and is used to collect debris generated when the cutting assembly 20 cuts grooves; the debris collection box 71 has a debris discharge port 711, and the vacuum cleaner is connected to the inside of the debris collection box 71 through the debris discharge port 711, and the vacuum cleaner sucks the debris collected in the debris collection box 71 through the debris discharge port 711 to clean the debris collection box 71.

[0066] The use of the adjustable feet 60 and the debris collection assembly 70 improves the stability and cleanliness of the equipment and ensures a clean and tidy test environment. The use of the adjustable feet 60 can ensure the levelness and stability of the base 50, while the use of the debris collection assembly 70 can effectively collect and clean the debris generated during the cutting process, avoiding the impact of the debris on the test results. In terms of effect, the above technical solution improves the stability and cleanliness of the equipment, avoids test errors caused by unstable equipment or untidy test environment, and improves the accuracy and reliability of the test. In other embodiments, the performance of the equipment can be further improved by increasing the adjustment accuracy of the adjustable feet 60 and the cleaning efficiency of the debris collection assembly 70, which is suitable for occasions with higher requirements for the test environment.

[0067] like Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 and Figure 5As shown, the thin plate residual stress testing device also includes a central controller, which is electrically connected to the clamping support assembly 10, the cutting assembly 20 and the laser testing assembly 30 respectively to control the clamping support assembly 10, the cutting assembly 20 and the laser testing assembly 30 to work together; the thin plate residual stress testing device also includes a control box 80, the central controller is arranged in the control box 80, and the control box 80 has ventilation holes 81 and harness holes 82. The ventilation holes 81 are used to ventilate and dissipate heat inside the control box 80; the harness holes 82 are used to pass the harness connected to the central controller; the central controller is configured to perform a plurality of cutting operations according to the initial deformation data and multiple cutting operations of different depths. The multiple cutting deformation data obtained are used to calculate the residual stress inside the thin plate 40 to be tested; the thin plate residual stress testing device also includes a touch display screen 90 and a master control button 100, the touch display screen 90 is electrically connected to the central controller for displaying information and touch; the master control button 100 is electrically connected to the central controller for controlling the thin plate residual stress testing device to be turned on or off; and / or, the thin plate residual stress testing device also includes a base 50 and a protective shell 110, the clamping support assembly 10, the cutting assembly 20 and the laser testing assembly 30 are respectively arranged inside the protective shell 110; the protective shell 110 is arranged on the base 50.

[0068] The use of the central controller and the control box 80 realizes the automatic control and data processing of the equipment, and improves the efficiency and accuracy of the test. The central controller realizes the precise control of the test process and the real-time processing of data through the electrical connection with the clamping support assembly 10, the cutting assembly 20 and the laser test assembly 30, while the use of the touch screen 90 and the master control button 100 provides the operator with an intuitive operation interface, simplifying the operation process. The above technical solution realizes the automatic control and data processing of the equipment, avoids the test errors caused by manual operation, and improves the efficiency and accuracy of the test. In other embodiments, the performance of the equipment can be further improved by increasing the data processing capacity and control accuracy of the central controller, which is suitable for occasions with higher requirements for test efficiency and accuracy.

[0069] The present invention also provides a method for testing residual stress of a thin plate, which is applied to the above-mentioned thin plate residual stress testing device, and the thin plate residual stress testing method also includes the following steps: S1, clamping and fixing the second end 42, and allowing the first end 41 to be suspended in the air, detecting the warping deformation of the thin plate 40 to be tested at this time, and obtaining initial deformation data; S2, clamping and fixing the second end 42 and the first end 41, and supporting the bottom of the thin plate 40 to be tested, and then completing a groove on the thin plate 40 to be tested with a set depth and a set length. After the groove is completed, clamping the second end 42, and allowing the first end 41 to be suspended in the air, detecting the warping deformation of the thin plate 40 to be tested at this time, and obtaining a cutting deformation data; S3, repeating step S2 multiple times to obtain multiple cutting deformation data corresponding to multiple grooves of different depths, respectively, and calculating the residual stress distribution inside the thin plate 40 to be tested at different depths based on the initial deformation data and the multiple cutting deformation data, thereby realizing residual stress testing of the thin plate 40 to be tested from the upper surface to the inside along its thickness direction.

[0070] The testing method proposed in the present invention realizes a comprehensive test of the residual stress inside the thin plate through precise clamping, cutting and measuring steps. By cutting grooves at different depths in the thin plate, observing and measuring the warping changes of the thin plate before and after the cutting, the residual stress at the cutting position is calculated according to the stress release model of the elastic theory or plasticity theory, thereby determining the residual stress distribution at different depths. In terms of effect, the above-mentioned testing method can provide residual stress distribution information from the surface to the core of the thin plate, which is very important for understanding the performance of the thin plate material during the manufacturing and processing process, and helps to improve the processing technology, reduce or control the residual stress in the thin plate material, and improve product quality. In other embodiments, the efficiency and accuracy of the test can be further improved by optimizing the order and parameters of the test steps, which is suitable for occasions with higher requirements for test speed and accuracy.

[0071] It should be noted that in one specific embodiment of the present invention, the existing slitting method is used to measure the internal residual stress of a thin plate. A series of notches are cut into the plate to gradually release the internal stress, allowing the plate's warpage caused by this stress release to be observed and measured. This method provides information on the residual stress distribution from the surface to the core of the plate, which is crucial for understanding the performance of thin plate materials during manufacturing and processing. The following is a detailed description of the internal residual stress measurement process for a thin plate in one specific embodiment of the present invention: 1. Preparation: First, the thin plate specimen must be secured to a test platform to ensure a stable position during the slitting process, preventing any external forces from interfering with the test results. In the unslitting state, a high-precision measurement tool (such as a laser displacement sensor 31) is used to measure the plate's initial deformation, including flatness and curvature, which serves as a benchmark for subsequent analysis. 2. Slitting: The slitting path and depth are designed based on the location and depth of the residual stress to be measured. The grooving depth typically begins at the surface and gradually increases toward the center, allowing for measurement of stress variations from the surface to the center. A series of grooves are cut into the sheet along a designed path using precision cutting tools (such as high-precision wire-cut machines or CNC machines). Extreme care is required during the cutting process to avoid introducing additional processing stresses or damaging the specimen. Cutting conditions must be controlled: cutting speed, cutting force, and cooling conditions must be controlled during grooving to ensure that the cutting process does not significantly affect the measurement results. 3. Deformation measurement phase: After each grooving pass, the sheet warpage is measured immediately using the same high-precision measuring tool. Deformation measurements typically include changes in thickness, curvature, and inclination. The sheet deformation after each grooving pass is recorded and used in subsequent stress calculations. 4. Data analysis phase: Analysis of sheet deformation requires applying stress release models based on elastic or plastic theory. This may involve using finite element analysis (FEA) software to simulate the grooving process. By comparing the measured deformation with the deformation predicted by the theoretical model, residual stress at the grooving location can be calculated. The magnitude and distribution of residual stress can be determined through a series of notching and deformation measurements. During the analysis process, the measurement data may need to be corrected to eliminate the effects of geometric irregularities and temperature changes in the specimen itself. 5. Result verification and application: The reliability and consistency of the measurement method are verified by repeated testing and comparison of the results of different specimens. The measurement process and data analysis method may need to be modified to improve accuracy. The measured residual stress data can be used to improve the processing technology, such as adjusting the heat treatment process and optimizing the machining parameters to reduce or control the residual stress in the thin plate material, thereby improving the performance and quality of the final product.The grooving method proposed in the embodiments of the present invention can provide intuitive information about residual stress within a material. However, it should be noted that grooving itself also introduces some localized stresses, so this must be taken into account during data analysis to ensure the accuracy of the measurement results. Furthermore, grooved specimens may not be reusable due to structural damage. Therefore, this consideration must be taken into account when selecting specimens.

[0072] The working process and principle of a specific embodiment of the present invention are now described in detail as follows:

[0073] The control component includes a control box 80, which is fixed on the base 50. A ventilation hole 81 is provided on the top of the control box 80, and a wiring harness hole 82 is provided on the side. The wiring harness hole 82 is used to connect the cables inside the control box 80 with the vertical slide rail structure 23 and the horizontal slide rail structure 22; the touch display screen 90 is embedded in the protective shell 110 to display the input parameters and test results; the cutting component 20 includes main structures such as the vertical slide rail structure 23, the horizontal slide rail structure 22, the cutting motor 241, and the milling cutter 242; the horizontal slide rail structure 22 realizes the horizontal movement function of the milling cutter 242, the vertical slide rail structure 23 realizes the vertical movement function of the milling cutter 242, and the cutting motor 241 realizes the rotary cutting of the milling cutter 242.

[0074] The upper end of the bottom driving portion 152 is hingedly connected to the bottom supporting plate 151, and the bottom supporting plate 151 can pass through the hole on the test bench 12. Under the action of the bottom driving portion 152, the bottom supporting plate 151 slides in the hole of the test bench 12; when the bottom supporting plate 151 moves upward to the maximum position, its top surface is flush with the bottom surface of the thin plate 40 to be tested.

[0075] The thin plate residual stress testing device proposed in the present invention adopts an integrated design, is easy to operate, and has high testing accuracy; it uses a laser displacement sensor 31 to accurately collect sample deformation data in real time; the overall level of the equipment is adjusted by adjusting the foot 60 to ensure the accuracy of the test; the central controller is tightly connected to the cutting assembly 20 to ensure the stability and reliability of the cutting process; the debris collection and removal structure effectively maintains the cleanliness of the working environment and increases the service life of the equipment; overall, the device can significantly improve the efficiency and accuracy of residual stress testing of thin plate materials, and has important application benefits for controlling the residual stress of thin plates and improving product quality.

[0076] like Figures 8 to 14: As shown in the figure, the cutting detection process of the thin plate 40 to be tested is shown in detail; the specific process is as follows: 1. Equipment leveling: By adjusting the four adjustment feet 60 of the present invention, the horizontal adjustment of the base 50 is achieved; 2. Tool setting: Adjust the top of the tool setting instrument 25 to be flush with the bottom of the cavity of the test bench 12 for carrying the thin plate 40 to be tested; 3. The vertical slide structure 23 drives the cutting motor 241 to move downward, and the horizontal slide structure 22 drives the cutting motor 241 to move horizontally. When the milling cutter 242 contacts the tool setting instrument 25, the initial vertical coordinate of the bottom of the cavity of the test bench 12 is obtained, that is, after the cutting part 24 contacts the top of the tool setting instrument 25, the cutting part 24 obtains the vertical limit coordinate value. When the cutting part 24 cuts the groove, the cutting depth of the cutting part 24 on the thin plate 40 to be tested is obtained according to the vertical limit coordinate value and the vertical displacement data of the cutting part 24; 4. Preparation before placing the sample: Before the thin plate 40 to be tested is placed inside the test bench 12, as shown in FIG. Figure 8 As shown, at this time, the top of the bottom support plate 151 is flush with the bottom of the cavity of the test bench 12 for supporting the thin plate 40 to be tested, the bottom of the pressure head 141 is flush with the top of the cavity 121 of the test cavity, and the upper push rod 131 is retracted and away from the bottom of the cavity; 5. Figure 9 As shown, the thin plate 40 to be tested is placed in the test chamber 121, that is, placed at the bottom of the chamber of the test table 12 for supporting the thin plate 40 to be tested; 6. Figure 10 As shown, the electric pull rod 161 moves downward, driving the pressure plate 162 and the pressure head 141 to move downward, and then the pressure head 141 contacts the thin plate 40 to be detected, and the second end 42 of the thin plate 40 to be detected is pressed and fixed; the bottom driving part 152 contracts, driving the bottom support plate 151 to move downward, so that the bottom support plate 151 is separated from the thin plate 40 to be detected, and the upper push rod 131 contracts, so that the upper push rod 131 is separated from the first end 41 of the thin plate 40 to be detected, and the laser displacement sensor 31 collects the data of the thin plate 40 to be detected in this state, and obtains the initial deformation data; 7. Figure 11 As shown, the bottom driving portion 152 extends, driving the bottom support plate 151 to move upward, so that the bottom support plate 151 contacts the lower surface of the thin plate 40 to be detected, and the upper push rod 131 extends, so that the upper push rod 131 presses the first end 41 of the thin plate 40 to be detected; 8. Figure 12 As shown, the cutting motor 241 drives the milling cutter 242 to start cutting the groove to reach the set groove depth; 9. After the groove is cut, as shown in FIG. Figure 13As shown, the bottom driving part 152 contracts and drives the bottom supporting plate 151 to move downward, so that the bottom supporting plate 151 is separated from the thin plate 40 to be detected, and the upper push rod 131 contracts, so that the upper push rod 131 is separated from the thin plate 40 to be detected. The laser displacement sensor 31 collects the distance to the thin plate 40 to be detected in this state and obtains a cutting deformation data; 10. Repeat the above process 7 to process 9 to realize the warpage collection test at different cutting depths, obtain multiple cutting deformation data, and then calculate the residual stress inside the thin plate 40 to be detected; 11. Figure 14 As shown, the electric pull rod 161 extends upward, driving the pressure plate 162 and the pressure head 141 to move upward, and then the pressure head 141 is separated from the thin plate 40 to be tested, and the bottom driving part 152 contracts, driving the bottom support plate 151 to move upward, so that the bottom support plate 151 contacts the thin plate 40 to be tested, and the upper push rod 131 contracts, so that the upper push rod 131 is separated from the thin plate 40 to be tested, and then the sample can be taken out; 12. Based on the warping deformation conditions collected by the laser displacement sensor 31 at different cutting depths and widths, quantitative testing of the residual stress of the thin plate from the surface to the core is realized.

[0077] In summary, the present invention provides a thin plate residual stress testing device and a thin plate residual stress testing method. The present invention sets a clamping support component 10, a cutting component 20 and a laser testing component 30 to work together, and uses a simple structure to realize the fixation, cutting and internal residual stress detection of the thin plate 40 to be tested; the present invention is based on the grooving detection principle and combined with related structures to realize efficient automatic measurement of the internal residual stress of the thin plate 40 to be tested, and gradually releases the internal stress of the material by cutting a series of grooves on the thin plate 40 to be tested, and measures the warping deformation caused by the stress release. Then, based on the initial deformation data and multiple cutting deformation data obtained after multiple groovings of different depths, the residual stress inside the thin plate 40 to be tested is calculated. Based on different grooving depths, lengths and widths, and according to the relationship between the plate thickness, grooving depth and warping deformation, the quantitative characterization of the residual stress from the surface to the core of the thin plate is realized, and then the quantitative test of the residual stress from the surface to the inside of the thin plate 40 to be tested is realized. The thin plate residual stress testing device proposed in the present invention can not only test surface residual stress, but also test residual stress throughout the thickness direction. The present invention can quickly assess the magnitude of residual stress within the thin plate 40 to be tested, as well as the fluctuation of residual stress between different batches of materials, thereby achieving effective monitoring of residual stress in multiple batches of thin plates, helping to establish thin plate residual stress control standards and improve the uniformity of residual stress in thin plate materials. The present invention has a simple structure and low cost, making it easy to assemble and subsequently maintain. It solves the problems of low testing efficiency, complex structure, and high equipment cost in the thin plate residual stress testing device of the prior art. It can achieve fully automated testing, improve the testing efficiency of large batches of thin plates, effectively meet the needs of industrial large-scale thin plate residual stress testing, and is suitable for large-scale promotion and use.

[0078] The technical features of the above embodiments can be combined in any manner. To simplify the description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction between the combinations of these technical features, they should be considered to be within the scope of this specification.

[0079] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of features, steps, operations, devices, components and / or combinations thereof.

[0080] Unless otherwise specifically stated, the relative arrangement of the parts and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to actual proportional relationships. The technology, methods and equipment known to those of ordinary skill in the relevant art may not be discussed in detail, but in appropriate cases, the technology, methods and equipment should be considered as a part of the specification. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a limitation. Therefore, other examples of the exemplary embodiments can have different values. It should be noted that similar numbers and letters represent similar items in the following drawings, and therefore, once an item is defined in an accompanying drawing, it does not need to be further discussed in subsequent drawings.

[0081] In the description of the present invention, it should be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "horizontal, vertical, perpendicular, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the scope of protection of the present invention; the directional words "inside and outside" refer to the inside and outside relative to the outline of each component itself.

[0082] For ease of description, spatially relative terms such as "above," "above," "on the upper surface of," and "upper" may be used herein to describe the spatial positional relationship of a device or feature to other devices or features as shown in the figures. It should be understood that spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in a drawing is inverted, a device described as "above" or "on top of" another device or structure would then be positioned as "below" or "below" the other device or structure. Thus, the exemplary term "above" can include both the "above" and "below" orientations. The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used herein should be interpreted accordingly.

[0083] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of the present invention.

[0084] The foregoing description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that various modifications and variations of the present invention are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention are intended to be within the scope of protection of the present invention.

Claims

1. A thin plate residual stress testing device, characterized in that: include: A clamping support assembly (10), a cutting assembly (20) and a laser test assembly (30); the clamping support assembly (10) includes at least one clamping test structure (11), the clamping test structure (11) includes a test bench (12), a first clamping portion (13), a second clamping portion (14) and a bottom support portion (15); the test bench (12) has a test cavity (121) inside, and the test bench (12) also has a test inlet (122) connected to the test cavity (121), the first clamping portion (13), the second clamping portion (14) and at least a portion of the bottom support portion (15) are respectively arranged in the test cavity (121), and the first clamping portion (13) is arranged at the test inlet (122) ); the thin plate (40) to be tested enters the test cavity (121) along its length direction from the test inlet (122); the two ends of the thin plate (40) to be tested along its length direction are respectively a first end (41) and a second end (42); the first end (41) is close to the test inlet (122); the bottom support portion (15) is used to support the bottom of the thin plate (40) to be tested; the first clamping portion (13) is used to fix the first end (41); the second clamping portion (14) is used to fix the second end (42); the cutting assembly (20) is used to cut grooves of different depths on the thin plate (40) to be tested; and the laser testing assembly (30) is used to detect the warping deformation of the thin plate (40) to be tested.

2. The thin plate residual stress testing device according to claim 1, characterized in that: Before the thin plate (40) to be tested is grooved, the second clamping portion (14) clamps the second end (42), the first clamping portion (13) is separated from the first end (41), and the bottom support portion (15) is separated from the bottom of the thin plate (40) to be tested, so that the first end (41) of the thin plate (40) to be tested is suspended, and the laser testing assembly (30) detects the warping deformation of the thin plate (40) to be tested at this time to obtain initial deformation data; when the thin plate (40) to be tested is grooved, the second clamping portion (14) clamps the second end (42), the first clamping portion (13) fixes the first end (41), and the bottom support portion (15) supports the thin plate (40) to be tested. The bottom of the thin plate (40) to be tested is measured; after the thin plate (40) to be tested is cut once, the second clamping part (14) clamps the second end (42), the first clamping part (13) is separated from the first end (41), and the bottom support part (15) is separated from the bottom of the thin plate (40) to be tested, so that the first end (41) of the thin plate (40) to be tested after cutting is suspended, and the laser testing component (30) detects the warping deformation of the thin plate (40) to be tested at this time to obtain a cutting deformation data; based on the initial deformation data and the multiple cutting deformation data obtained after multiple cuttings of different depths, the residual stress inside the thin plate (40) to be tested is calculated.

3. The thin plate residual stress testing device according to claim 1, characterized in that: The second clamping portion (14) includes a pressure head (141) and a second limiting plate (142); the second limiting plate (142) is fixedly arranged on the test bench (12), and the second limiting plate (142) has a second limiting groove arranged in the vertical direction, and a part of the pressure head (141) is slidably limited with the inner wall of the second limiting groove; when there are multiple clamping test structures (11), the clamping support assembly (10) further includes a second driving portion (16), and the second driving portion (16) is simultaneously connected to the pressure heads (141) of the multiple clamping test structures (11) to drive the multiple pressure heads (141) to reciprocate in the vertical direction at the same time, so as to simultaneously approach or move away from the second end (42).

4. The thin plate residual stress testing device according to claim 3, characterized in that: The second driving part (16) includes two electric pull rods (161) and a pressure plate (162), wherein the two electric pull rods (161) are respectively connected to the two ends of the pressure plate (162) to simultaneously drive the pressure plate (162) to move up and down; the pressure plate (162) is respectively connected to the pressure heads (141) of the multiple clamping test structures (11) to drive the multiple pressure heads (141) to reciprocate in the vertical direction simultaneously.

5. The thin plate residual stress testing device according to claim 1, characterized in that: The first clamping portion (13) includes an upper push rod (131), a first driving portion (132) and a first limiting plate (133), wherein the first limiting plate (133) is fixedly arranged on the test bench (12) and is located above the test inlet (122); the first limiting plate (133) has a first limiting groove arranged in a vertical direction, and a part of the upper push rod (131) is slidably limited with the inner wall of the first limiting groove; the first driving portion (132) is drivingly connected to the upper push rod (131), and the first driving portion (132) is used to drive the upper push rod (131) to reciprocate in the vertical direction to approach or move away from the first end (41).

6. The thin plate residual stress testing device according to claim 5, characterized in that: The bottom support portion (15) includes a bottom support plate (151) and a bottom drive portion (152); the bottom support plate (151) is slidably limited with the inner wall of the test chamber (121); the bottom drive portion (152) is drivingly connected to the bottom support plate (151), and the bottom drive portion (152) is used to drive the bottom support plate (151) up and down to approach or move away from the bottom of the thin plate (40) to be tested; wherein the upper push rod (131), the bottom support plate (151), the thin plate to be tested (40) are connected to the bottom support plate (151) and the bottom drive portion (152) are connected to the bottom support plate (151) and the bottom drive portion (152) are driven to move the bottom support plate (151) up and down to approach or move away from the bottom of the thin plate (40) to be tested; The thin plates (40) are respectively projected onto the same horizontal plane along the vertical direction, and the projection of the upper push rod (131) is located within the projection of the bottom support plate (151), so that the upper push rod (131) and the bottom support plate (151) jointly clamp and fix the thin plate (40) to be tested, and at least half of the projection of the thin plate (40) to be tested overlaps with the projection of the bottom support plate (151), and the overlapping portion of the projection is a suspended portion on the thin plate (40) to be tested, and the laser testing assembly (30) detects the warping deformation of the suspended portion.

7. The thin plate residual stress testing device according to claim 1, characterized in that: The cutting assembly (20) comprises a support frame (21), a horizontal slide rail structure (22), a vertical slide rail structure (23) and a cutting portion (24); the support frame (21) is fixedly arranged, the horizontal slide rail structure (22) is fixedly arranged on the support frame (21), and the vertical slide rail structure (23) is horizontally movably arranged on the horizontal slide rail structure (22); the cutting portion (24) is movably arranged on the vertical slide rail structure (23); and the cutting portion (24) is used for cutting grooves on the thin plate (40) to be inspected.

8. The thin plate residual stress testing device according to claim 7, characterized in that: The thin plate residual stress testing device further includes a base (50), and the clamping support assembly (10) and the support frame (21) are respectively fixedly arranged on the base (50); the cutting assembly (20) further includes a tool setting instrument (25), and the tool setting instrument (25) is arranged on the base (50) in an adjustable height. By adjusting the top height of the tool setting instrument (25), the top height of the tool setting instrument (25) is made consistent with the bottom height of the fixed thin plate (40) to be tested. After the cutting part (24) contacts the top of the tool setting instrument (25), the cutting part (24) obtains a vertical limit coordinate value. When the cutting portion (24) cuts a groove, the cutting depth of the cutting portion (24) on the thin plate (40) to be detected is obtained based on the vertical limit coordinate value and the displacement data of the cutting portion (24) in the vertical direction; and / or, the cutting portion (24) includes a cutting motor (241) and a milling cutter (242), and the cutting motor (241) is fixedly arranged on the vertical slide rail structure (23) to move with the vertical slide rail structure (23); the cutting motor (241) and the milling cutter (242) are detachably driven and connected to drive the milling cutter (242) to cut a groove on the thin plate (40) to be detected.

9. The thin plate residual stress testing device according to claim 1, characterized in that: The laser test assembly (30) includes a plurality of laser displacement sensors (31), at least one of the laser displacement sensors (31) is arranged in the test cavity (121) of one of the test benches (12), and the laser displacement sensor (31) is used to detect the warping deformation of the thin plate (40) to be tested located in the test cavity (121); when there are multiple clamping test structures (11), at least one laser displacement sensor (31) is arranged on the test bench (12) of each of the clamping test structures (11); and / or the first clamping portion (13) includes a first limiting plate (133), the first limiting plate (133) has a laser hole, and the test laser emitted by the laser displacement sensor (31) is irradiated on the thin plate (40) to be tested through the laser hole to perform warping deformation detection.

10. The thin plate residual stress testing device according to claim 1, characterized in that: The thin plate residual stress testing device further comprises a base (50) and a plurality of adjusting feet (60); the clamping support assembly (10) and the cutting assembly (20) are respectively fixedly arranged on the base (50); the plurality of adjusting feet (60) are arranged at intervals on the bottom of the base (50) to jointly support the base (50); and the base (50) is leveled by adjusting the adjusting feet (60); And / or, the thin plate residual stress testing device further includes a debris collection assembly (70), the debris collection assembly (70) including a debris collection box (71) and a dust collector, the debris collection box (71) being in communication with the test chamber (121) and being used to collect debris generated when the cutting assembly (20) cuts grooves; the debris collection box (71) is provided with a debris discharge port (711), the dust collector being in communication with the interior of the debris collection box (71) through the debris discharge port (711), and the dust collector sucking the debris collected in the debris collection box (71) through the debris discharge port (711) to clean the debris collection box (71).

11. The thin plate residual stress testing device according to claim 1, characterized in that: The thin plate residual stress testing device further comprises a central controller, which is electrically connected to the clamping support assembly (10), the cutting assembly (20) and the laser testing assembly (30) respectively to control the clamping support assembly (10), the cutting assembly (20) and the laser testing assembly (30) to cooperate with each other; the thin plate residual stress testing device further comprises a control box (80), the central controller is arranged in the control box (80), and the control box (80) has a ventilation hole (81) and a harness hole (82), the ventilation hole (81) is used to ventilate and dissipate heat inside the control box (80); the harness hole (82) is used to pass a harness connected to the central controller; the central controller calculates the residual stress inside the thin plate (40) to be tested based on the initial deformation data and multiple cutting deformation data obtained after multiple groovings of different depths; The thin plate residual stress testing device further comprises a touch display screen (90) and a master control button (100); the touch display screen (90) is electrically connected to the central controller and is used for displaying information and touch control; the master control button (100) is electrically connected to the central controller and is used for controlling the thin plate residual stress testing device to be turned on or off; And / or, the thin plate residual stress testing device further comprises a base (50) and a protective shell (110), the clamping support assembly (10), the cutting assembly (20) and the laser testing assembly (30) are respectively arranged inside the protective shell (110); and the protective shell (110) is arranged on the base (50).

12. A method for testing residual stress of a thin plate, characterized in that: The thin plate residual stress testing method is applied to the thin plate residual stress testing device according to any one of claims 1 to 11, and the thin plate residual stress testing method further comprises the following steps: S1, clamping and fixing the second end (42), and suspending the first end (41), detecting the warping deformation of the thin plate (40) to be detected at this time, and obtaining initial deformation data; S2, clamping and fixing the second end (42) and the first end (41), and supporting the bottom of the thin plate (40) to be tested, and then completing a groove cutting on the thin plate (40) to be tested with a set depth and a set length. After the groove cutting is completed, clamping the second end (42), and making the first end (41) suspended in the air, detecting the warping deformation of the thin plate (40) to be tested at this time, and obtaining a cutting deformation data; S3. Repeat step S2 multiple times to obtain a plurality of cutting deformation data corresponding to the multiple cutting grooves of different depths. Based on the initial deformation data and the multiple cutting deformation data, calculate the residual stress distribution inside the thin plate (40) to be tested at different depths, and realize the residual stress test of the thin plate (40) to be tested from the upper surface to the inside along the thickness direction thereof.

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