Integrated experiment equipment for testing durability of high-power chip

Abstract

The invention relates to high-power chip durability test integrated experimental equipment which comprises a bearing device, the bearing device comprises a profile frame, a bottom supporting steel plate is arranged in the profile frame, and the profile frame is divided into parallel detection stations by the bottom supporting steel plate; an execution device frame, a sliding tray device, a detection circuit device, a chip, an execution device and a push rod sliding block device are arranged in each detection station; the execution device frame is located on one side of the bottom supporting steel plate, the sliding tray device is slidably connected into the execution device frame, and the push rod sliding block device is slidably connected into the execution device frame and used for pushing the execution device to vertically move. The execution device comprises a cold plate, and a cooling device is connected to the cold plate; the cooling device comprises a liquid cooling machine, a cavity formed in the cold plate and a heat conduction plate connected to the bottom of the cold plate, and a water inlet pipe and a water outlet pipe are fixedly connected to the liquid cooling machine. The high-power chip cooling device has the effects of rapidly cooling a high-power chip and reducing damage or burning of the chip.

Description

Technical Field

[0001] The present application relates to the technical field of high-power chip testing equipment, and in particular to an integrated experimental device for high-power chip durability testing. Background Art

[0002] With the development of technology, the application of high-power chips is becoming more and more extensive. Before high-power chips are put into use, it is particularly necessary to verify the reliability of high-power chips to ensure the reliability of chip use.

[0003] During testing, the test equipment is equipped with a power supply unit to provide stable and adjustable high-power output to meet the chip's power supply requirements under different operating conditions. For example, when testing high-power communication chips, the chip must be able to output voltages of tens or even hundreds of volts, and the current output must reach the ampere level to ensure that the chip can operate under various conditions, including rated power and over-rated power. This results in a large amount of heat generated during the high-power chip durability test.

[0004] High-power chips generate a lot of heat when working. If they are in a high-temperature state for a long time, it is very easy to cause physical or chemical damage inside the chip. Therefore, the chip needs to be cooled to avoid premature damage due to overheating, ensure that the test can be carried out in an orderly manner according to the expected duration, and accurately obtain the durability-related data of the chip during long-term operation.

[0005] For traditional chip testing equipment: most of them are designed for low-power chip testing and cannot meet the heat exchange requirements of high-power testing. Current testing equipment generally uses air cooling for cooling. Once the temperature is abnormal during the experimental operation, air cooling cannot ensure rapid cooling, which can easily damage or burn the chip. Summary of the Invention

[0006] In order to quickly cool down high-power chips and reduce chip damage or burning, the present application provides an integrated experimental device for high-power chip durability testing.

[0007] The present application provides a high-power chip durability test integrated experimental equipment that adopts the following technical solutions: An integrated experimental device for high-power chip durability testing includes a carrying device, which includes a profile frame, a plurality of bottom support steel plates arranged in the profile frame, and the bottom support steel plates are arranged horizontally to divide the profile frame into a plurality of parallel detection stations; each of the detection stations is provided with an execution device frame, a sliding tray device, a detection circuit device, a chip, an execution device and a push rod slider device; the execution device frame is located on one side of the bottom support steel plate, the sliding tray device is slidably connected to the execution device frame, the sliding tray device can slide outward from one side of the execution device frame, and the detection circuit device is arranged on the sliding tray device. The chip is placed on the detection circuit device, the actuator is connected to the inner top of the actuator frame, and the push rod slider device is slidably connected to the actuator frame to push the actuator to move vertically; the actuator includes a cold plate, and a cooling device is connected to the cold plate; the cooling device includes a liquid cooler, a cavity opened in the cold plate, and a heat conduction plate connected to the bottom of the cold plate. The liquid cooler is fixedly connected with a water inlet pipe and a water outlet pipe, and the ends of the water inlet pipe and the water outlet pipe away from the liquid cooler are both connected to the cavity. The water outlet pipe is used to guide the cooling liquid in the liquid cooler into the cavity, and the water inlet pipe is used to guide the cooling liquid after heat exchange in the cavity back to the liquid cooler for cooling.

[0008] By adopting the above technical solution, when the user uses and tests the chip, the chip is placed on the detection circuit device, and the sliding tray device is pushed to slide into the execution device frame, so that the chip slides to the bottom of the cold plate. The push rod slider device is slidably connected to the execution device frame to push the execution device to move vertically until the heat conduction plate abuts against the chip. The heat conduction plate transfers the heat of the chip upward, the water outlet pipe guides the cooling liquid in the liquid cooler into the cavity, and the water inlet pipe guides the cooling liquid after heat exchange in the cavity back to the liquid cooler for cooling, thereby achieving rapid cooling of the chip.

[0009] Optionally, the actuator includes a cold plate upper plate connected to the cold plate, a spring column mounting plate is connected above the cold plate upper plate, lower spring columns are symmetrically provided on both sides of the spring column mounting plate, an upper spring column is provided on the inner top wall of the actuator frame, and a spring is connected between the upper spring column and the lower spring column; a guide column is fixedly connected to the top of the spring column mounting plate, a linear flange bearing is provided on the inner top wall of the actuator frame, the guide column is slidably connected in the linear flange bearing, and a bearing assembly is provided on the top of the spring column mounting plate to cooperate with the push rod slider device to push the spring column mounting plate downward.

[0010] By adopting the above technical solution, when the user uses it, the push rod slider device slides into the actuator frame, pushing the bearing assembly to move, and then pushing the spring column mounting plate to move downward, driving the cold plate and the heat conduction plate to move downward. The downward movement of the cold plate stretches the spring, and the tension of the spring makes it easy to drive the cold plate and the heat conduction plate to reset upward. The guide column slides in the linear flange bearing, guiding and limiting the downward movement of the cold plate, making the cold plate more stable during vertical movement.

[0011] Optionally, the bearing assembly includes a top bearing seat base plate connected to the spring column mounting plate, the top of the bearing seat base plate is connected to the bearing seat, and a bearing is rotatably connected inside the bearing seat; the push rod slider device includes a push rod slider, the bottom of the push rod slider is connected to the track plate, the bottom of the track plate is provided with an inclined surface, the inclined surface is inclined upward from the side close to the push rod, and the inclined surface abuts against the bearing; a push rod seat is hinged on the track plate, a push rod is connected to the push rod seat, and two limit slots are provided at the bottom of the push rod, and a push rod baffle is provided on the inner top wall of the actuator frame, and the push rod passes through the push rod baffle.

[0012] By adopting the above technical solution, when the user uses it, he pushes the push rod upward to separate the limit slot from the push rod baffle, pushes the push rod into the actuator frame, and the inclined surface at the bottom of the track plate pushes the bearing downward, thereby pushing the spring column mounting plate, the upper plate of the cold plate and the cold plate downward, so that the heat conduction plate at the bottom of the cold plate abuts against the chip to cool the chip.

[0013] Optionally, a pulley is provided on the top of the push rod slider, and a top slide rail is provided on the inner top wall of the execution device frame, and the pulley is slidably connected to the top slide rail.

[0014] By adopting the above technical solution, when the user uses it, he pushes the push rod into the frame of the actuator, the pulley slides at the top in the slide rail, and the push rod pushes the track plate to slide inward, which can change the sliding into rolling and achieve a labor-saving effect.

[0015] Optionally, multiple partitions are fixedly connected in the cavity, and the partitions divide the cavity into multiple cooling chambers. The water inlet pipe and the water outlet pipe both extend into the cavity. Multiple feed branches are fixedly connected to the water inlet pipe, and the water inlet pipes are located on both sides of the cooling chamber that are symmetrical. The bottom of the feed branch extends into the cooling chamber. A solenoid valve is fixedly connected to each feed branch pipe. A discharge chamber is provided at the top of the cooling chamber. Multiple discharge branches are fixedly connected to the water outlet pipe, and the bottom of the discharge branch extends into the discharge chamber.

[0016] By adopting the above technical solution, when the user uses it, multiple cooling chambers are set up through partitions, and the solenoid valve is used to control the liquid inlet speed of the coolant. Independent cooling units or control partitions can be set for different functional modules and heat-generating areas on the chip. The cooling intensity can be accurately adjusted according to the real-time heat conditions of each area. By adjusting the local coolant flow, it can effectively deal with the problem of uneven heating inside the chip, ensuring that each area can maintain a suitable operating temperature, effectively improving the performance stability and service life of the chip.

[0017] Optionally, the bottom of the heat conduction plate is coated with thermal grease, a silicone grease loading rack is slidably connected to the bottom support steel plate, a plurality of coating plates are arranged on the top of the silicone grease loading rack, a cylinder is connected to the side of the silicone grease loading rack away from the sliding tray device, the cylinder body of the cylinder is fixedly connected to the bottom support steel plate, the end of the piston rod of the cylinder is fixedly connected to the silicone grease loading rack, a receiving box is fixedly connected to the cylinder body of the cylinder, the receiving box is used to hold thermal grease, a plurality of material guide pipes are fixedly connected to the receiving box, the material guide pipes are respectively connected to the coating plates, and the material guide pipes guide the thermal grease in the receiving box to the coating plate.

[0018] By adopting the above technical solution, when the user uses it, when the sliding tray device slides outward, the piston rod of the cylinder extends, pushing the coating plate to slide over the bottom of the heat conducting plate, and applying thermal grease to the bottom of the heat conducting plate. Thermal grease is a paste-like thermal interface material with good thermal conductivity. It is mainly used to fill the tiny gap between the chip and the heat conducting plate to ensure that heat can be transferred efficiently.

[0019] Optionally, a receiving box is provided on the side of the silicone grease feeding rack close to the sliding tray device, a buffer column is slidably connected in the material receiving box, a buffer spring is provided on the outer sleeve of the buffer column, a scraper is fixedly connected to the top of the buffer column, and the scraping blade of the scraper is tilted upward. The scraping blade can abut against the bottom of the heat conduction plate and scrape off the thermal grease on the bottom of the heat conduction plate; the silicone grease feeding rack is located on the side of the material receiving box away from the sliding tray device to rotate the brush.

[0020] By adopting the above technical solution, when the user uses it, the piston rod of the cylinder extends and pushes the scraper to abut the bottom of the heat conduction plate. The scraper cleans the silicone on the bottom of the heat conduction plate, and the brush cleans the debris remaining on the bottom of the heat conduction plate. Then, the coating plate coats the thermal grease on the bottom of the heat conduction plate, realizing automatic replacement of the thermal grease.

[0021] Optionally, the side wall of the execution device frame is provided with an electromagnet adsorption module and a laser position detection module, and the side wall of the profile frame is provided with a control module, and the control module is respectively connected to the laser position detection module and the electromagnet adsorption module.

[0022] By adopting the above technical solution, when the user uses it, the control module can accurately display that the electromagnet adsorption module can accurately locate the position of the sliding tray device, and transmit the information of whether the sliding tray is fixed to the control module, and display it through the control module. Similarly, the laser position detection module can detect the position of the chip and send the information of whether the position of the chip is accurate to the display module. The display module can display whether the position of the sliding tray device is fixed and whether the position of the chip is correctly placed before the detection, which can improve the accuracy of the detection data. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the present application; Figure 2 is a cross-sectional view of an embodiment of the present application; Figure 3 It is a structural schematic diagram of the carrying device; Figure 4 It is a structural diagram of the actuator frame, the sliding tray device, the actuator and the push rod slider device; Figure 5 It is a structural diagram of the execution device framework; Figure 6 It is a structural schematic diagram of a sliding tray device; Figure 7 It is a structural diagram of the execution device; Figure 8 It is an axonometric view of the push rod and slider device; Figure 9 It is a structural diagram of the push rod and slider device; Figure 10 It is a schematic diagram of the structure of the cooling device, the carrying device, the execution device and the push rod and slider device; Figure 11 It is a cross-sectional view of the water inlet pipe, water outlet pipe, cold plate and heating plate; Figure 12 It is a schematic diagram of the structure of the cooling device, the execution device and the push rod slider device; Figure 13 It is a structural diagram of the operating system of the operation interface.

[0024] Explanation of reference numerals: 1. Carrying device; 1-1. Forma wheel; 1-2. Screw; 1-3. Counterweight; 1-4. Counterweight fixing angle piece; 1-5. Profile frame; 1-6. Profile embedded part; 1-7. Back steel guard plate; 1-8. Acrylic guard plate; 1-9. Guard plate spacing fixing block; 1-10. Bottom support steel plate; 1-11. Power supply support steel plate; 1-12. Top support steel plate; 1-13. Top steel guard plate; 2. Actuator frame; 2-1. Bottom plate; 2-2. Bottom slide rail; 2-3. Electromagnet fixing seat; 2-4. Limit baffle; 2-5. Left side plate; 2-6. Right side plate; 2-7. Side plate connecting shaft; 2-8. Top plate; 2-9. Top slide rail; 2-10. Upper spring column; 2-11, linear flange bearing; 2-12, push rod baffle; 2-13, locating pin; 3, sliding tray device; 3-1, sliding base plate; 3-2, sliding slider; 3-3, manual toggle clamp; 3-4, square handle; 3-5, magnetic plate; 4, detection circuit device; 5, chip; 6, lighting device; 7, actuator; 7-1, cold plate; 7-2, cold plate connecting shaft; 7-3, locating sleeve; 7-4, indexing pin; 7-5, cold plate upper plate; 7-6, pressure sensor; 7-7, fixing pin; 7-8, spring column mounting plate; 7-9, lower spring column; 7-10, guide column; 7-11, fine-tuning lifting platform; 7-12, bearing seat base plate; 7-13, bearing seat; 7-14, bearing; 7-15, hinge pin; 7-16, elastic retaining ring; 8, push rod slider device; 8-1, push rod slider; 8-2, track plate; 8-3, push rod seat; 8-4, push rod; 8-5, straight rod hinge pin; 8-6, positioning retaining ring; 8-7, ball handle; 8-8, pulley; 8-9, limit slot; 8-10, inclined plane; 9, spring; 10, socket module; 11, power distribution module; 12, control module; 13, power supply module; 14, grating protection module; 15, laser position detection module; 16, electromagnet adsorption module; 17, PDU socket strip; 18, three-color warning light; 19, cooling device; 1 9-1, liquid cooler; 19-2, water inlet pipe; 19-3, water outlet pipe; 19-4, cavity; 19-5, heat transfer plate; 19-6, partition; 19-7, cooling chamber; 19-8, feed pipe; 19-9, feed branch pipe; 19-10, solenoid valve; 19-11, discharge chamber; 19-12, discharge branch pipe; 19-13, silicone grease loading rack; 19-14, coating plate; 19-15, cylinder; 19-16, containing box; 19-17, material guide pipe; 19-18, material receiving box; 19-19, buffer column; 19-20, scraper; 19-21, buffer spring; 19-22, brush. DETAILED DESCRIPTION

[0025] The following is combined with Figure 1-13 This application is described in further detail.

[0026] In this application, unless otherwise expressly specified or limited, terms such as "installed," "connected," "connect," and "fixed" should be understood in a broad sense. For example, they may refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection, or communication; direct connection or indirect connection through an intermediate medium; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0027] In this application, unless otherwise expressly specified and limited, a first feature "above" or "below" a second feature may be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in an appropriate manner in any one or more embodiments or examples.

[0028] The present application discloses an integrated experimental device for high-power chip durability testing. Figure 1 and Figure 2 , including a carrying device 1, the carrying device 1 includes a profile frame 1-5, a plurality of bottom support steel plates 1-10 are arranged in the profile frame 1-5, the bottom support steel plates 1-10 are arranged horizontally, and the bottom support steel plates 1-10 divide the profile frame 1-5 into a plurality of parallel detection stations, so that the experimental equipment has the ability of batch detection and improves the experimental efficiency; each detection station is provided with an execution device frame 2, a sliding tray device 3, a detection circuit device 4, a chip 5, a lighting device 6, an execution device 7, a push rod slider device 8, and a spring 9; wherein, the execution device frame 2 is located on one side of the bottom support steel plate 1-10, the sliding tray device 3 is slidably connected to the execution device frame 2, and the sliding tray device 3 can slide outward from the side of the execution device frame 2 away from the bottom support steel plate 1-10, the detection circuit device 4 is arranged on the sliding tray device 3, and the chip 5 is placed on the detection circuit device 4. The lighting device 6 is arranged at the inner top of the execution device frame 2, the execution device 7 is connected to the inner top of the execution device frame 2 through a spring 9, the execution device 7 is connected to the cooling device 19, and the push rod slider device 8 is slidably connected in the execution device frame 2, which is used to push the execution device 7 to move downward to cool the chip 5.

[0029] A socket module 10, a power distribution module 11 and a three-color warning light 18 are provided near the top of the profile frame 1-5. A control module 12 and a grating protection module 14 are provided on the side wall of the profile frame 1-5. A power module 13 and a PDU strip 17 are provided on the bottom supporting steel plate 1-10. The PDU strip 17 provides power distribution for the power module 13.

[0030] In addition, the side wall of the execution device frame 2 is provided with an electromagnet adsorption module 16 and a laser position detection module 15. The electromagnet adsorption module 16 is used to adsorb and fix the sliding tray device 3, and the laser position detection module 15 is used to detect whether the position of the chip is placed correctly and send a signal to the control module.

[0031] See also Figure 3 , wherein, a Forma wheel 1-1 is provided at the bottom of the profile frame 1-5, and a screw 1-2 is connected to the Forma wheel 1-1. The Forma wheel 1-1 is threadedly connected to the bottom of the profile frame 1-5 through the screw 1-2. The setting of the Forma wheel 1-1 facilitates the movement of the experimental equipment, enables the experimental equipment to be flexibly arranged, and is more convenient and quick to operate; the bottom support steel plate 1-10 is fixed to the inside of the profile frame 1-5 through the profile embedded parts 1-6 and screws, the power support steel plate 1-11 is fixed to the bottom support steel plate 1-10 through screws, and a counterweight block 1 is provided on the bottom support steel plate 1-10 -3, the counterweight block 1-3 is fixedly connected to the bottom supporting steel plate 1-10 through the counterweight fixing angle piece 1-4; an acrylic guard plate 1-8 is provided on the side of the profile frame 1-5, and the acrylic guard plate 1-8 is fixed by the guard plate spacer fixing block and screws; a top supporting steel plate 1-12 and a top steel guard plate 1-13 are provided on the top of the profile frame 1-5, and the top supporting steel plate 1-12 and the top steel guard plate 1-13 are fixed by the profile embedded parts 1-6 and screws, and a back steel guard plate 1-7 is provided on the top layer of the profile frame 1-5, and the back steel guard plate 1-7 is fixed by the profile embedded parts 1-6 and screws.

[0032] Reference Figure 4 and Figure 5 The execution device frame 2 includes a bottom plate 2-1, a left side plate 2-5, a right side plate 2-6 and a top plate 2-8. The left side plate 2-5, the right side plate 2-6, the top plate 2-8 and the bottom plate 2-1 are all connected and fixed by screws and positioning pins 2-13; wherein, bottom slide rails 2-2 are provided on both sides of the bottom plate 2-1, and the sliding tray device 3 includes a sliding bottom plate 3-12-1, and sliding sliders 3-2 are provided on both sides of the sliding bottom plate 3-12-1. The sliding sliders 3-2 are slidably connected to the bottom slide rails 2-2; a limit baffle 2-4 is provided on the bottom plate 2-1.

[0033] The left side plate 2-5 is fixedly connected with an electromagnet fixing seat 2-3, which is used to install the electromagnet adsorption module 16. The left side plate 2-5 is provided with a side plate connecting shaft 2-7. , the side plate connecting shaft 2-7 is connected to the left plate 2-5 and the right plate 2-6 by screws; a top slide rail 2-9 is provided at the bottom of the top plate 2-8, and the top slide rail 2-9 is fixed to the bottom of the top plate 2-8 by screws. The top slide rail 2-9 is used to guide and limit the sliding of the push rod slider device 8, and a push rod baffle 2-12 is provided at the bottom of the top plate 2-8. The push rod baffle 2-12 is fixed to the bottom surface of the top plate 2-8 flush with the front surface by screws, and the push rod baffle 2-12 is used to limit the push rod slider device 8; an upper spring column 2-10 is provided on the inner top wall of the top plate 2-8, and the upper spring column 2-10 is tightened and fixed to the bottom of the top plate 2-8 by threads, and the upper spring column 2-10 is used to connect and fix with the end of the spring 9; a linear flange bearing 2-11 is provided on the inner top wall of the top plate 2-8, and the linear flange bearing 2-11 is fixed to the top of the top plate 2-8 by screws.

[0034] Reference Figure 6 The sliding tray device 3 also includes a quick clamp 3-3, a square handle 3-4, a magnetic plate 3-5 and screws. The quick clamp 3-3 is fixed to the sliding base plate 3-12-1 by screws; the square handle 3-4 is fixed to the front of the sliding base plate 3-12-1 by screws to facilitate pulling the sliding tray device 3 to slide; the magnetic plate 3-5 is fixed to the back of the sliding base plate 3-12-1 by screws.

[0035] Reference Figure 7 and Figure 8 The actuator 7 includes a cold plate 7-1, a cold plate connecting shaft 7-2, a positioning sleeve 7-3, an indexing pin 7-4, a cold plate upper plate 7-5, a pressure sensor 7-6, a fixing pin 7-7, a spring column mounting plate 7-9, a lower spring column 7-9, a guide column 7-10, a fine-tuning lifting platform 7-11, a bearing seat base plate 7-12, a bearing seat 7-13, a bearing 7-14, a hinge pin 7-15, and an elastic retaining ring 7-16.

[0036] Among them, the cold plate connecting shaft 7-2 is threadedly connected to the top of the cold plate 7-1, and the positioning sleeve 7-3 is fixed to the bottom of the cold plate upper plate 7-5 through tolerance fitting. The cold plate connecting shaft 7-2 and the positioning sleeve 7-3 are interference fitted to realize the fixed connection between the cold plate 7-1 and the cold plate upper plate 7-5, and the cold plate 7-1 and the cold plate upper plate 7-5 are connected and fixed; the indexing pin 7-4 is fixed to the front and left and right sides of the cold plate upper plate 7-5 through threads and self-provided nuts, the pressure sensor 7-6 is fixed to the middle of the cold plate upper plate 7-5 and the spring column mounting plate 7-9 by screws, the cold plate upper plate 7-5 and the spring column mounting plate 7-9 are connected and fixed by the fixing pin 7-7, the spring 9 column 2-10 is threadedly connected to the spring column mounting plate 7-9, and the two ends of the spring 9 are respectively fixedly connected to the lower spring column 7-9 and the upper spring column 2-10; fine-tuning lifting platform 7-11 The guide column 7-10 is fixed to the spring column mounting plate 7-9 by screws, the bearing seat base plate 7-12 is fixed to the fine-tuning lifting platform 7-11 by screws, the bearing seat 7-13 is fixed to the bearing seat base plate 7-12 by screws, and the bearing 7-14 is assembled with the bearing seat 7-13 by hinge pin 7-15 and elastic retaining ring 7-16. The guide column 7-10 is slidably connected to the linear flange bearing 2-11.

[0037] Reference Figure 9 The push rod slider device 8 includes a push rod slider 8-1, a track plate 8-2, a push rod seat 8-3, a push rod 8-4, a straight rod hinge pin 8-5, a positioning retaining ring 8-6, a ball handle 8-7, a pulley 8-8, a limit slot 8-9, and an inclined surface 8-10.

[0038] The push rod slider 8-1 is fixed to the track plate 8-2 by screws, and the pulley 8-8 is fixed to the top of the push rod slider 8-1. The pulley 8-8 is slidably connected to the top slide rail 2-9 at the bottom of the top plate 2-8. The push rod 8-4 is fixed to the push rod seat 8-3 by screws. The push rod seat 8-3 is connected to the track plate 8-2 through a straight rod hinge pin 8-5 and a positioning retaining ring 8-6. A slope 8-10 is provided at the bottom of the track plate 8-2. The slope 8-10 is inclined upward from the side close to the push rod 8-4, and the slope 8-10 abuts against the bearing 7-14; the ball handle 8-7 is threadedly connected to the push rod 8-4, and the push rod 8-4 penetrates into the push rod baffle 2-12. Two limit slots 8-9 are provided at the bottom of the push rod 8-4 for locking the starting position of the push rod slider 8-1 on the push rod baffle 2-12. The push rod 8-4 is pushed to slide inward, the pulley 8-8 slides in the top slide rail 2-9, the push rod 8-4 pushes the track plate 8-2 to slide inward, and the inclined surface 8-10 at the bottom of the track plate 8-2 pushes the bearing 7-14 to move downward, thereby pushing the spring column mounting plate 7-9, the cold plate upper plate 7-5 and the cold plate 7-1 to move downward, so that the bottom of the cold plate 7-1 abuts against the chip 5 to cool the chip 5.

[0039] Reference Figure 10 and Figure 11 The cooling device 19 includes a liquid cooler 19-1, to which an inlet pipe 19-2 and an outlet pipe 19-3 are fixedly connected. The outlet pipe 19-3 is used to discharge the cooling liquid in the liquid cooler 19-1, and the inlet pipe 19-2 is used to guide the cooling liquid after heat exchange back into the liquid cooler 19-1. The cooling device 19 also includes a cavity 19-4 opened in the cold plate 7-1 and a heat conducting plate 19-5 connected to the bottom of the cold plate 7-1. A plurality of partitions 19-6 are fixedly connected in the cavity 19-4. The partitions 19-6 divide the cavity 19-4 into multiple cooling chambers 19-7. Independent cooling units or control partitions can be set for different functional modules and heat-generating areas on the chip 5. The cooling intensity can be accurately adjusted according to the real-time heat conditions of each area. By adjusting the local coolant flow rate, the problem of uneven heating inside the chip 5 can be effectively addressed, ensuring that each area can maintain a suitable operating temperature, effectively improving the performance stability and service life of the chip 5.

[0040] The water inlet pipe 19-2 and the water outlet pipe 19-3 both extend into the cavity 19-4. A plurality of feed branch pipes 19-9 are fixedly connected to the water inlet pipe 19-2. The water inlet pipe 19-2 is located on both sides of the cooling cavity 19-7. The bottom of the feed branch pipe 19-9 extends into the cooling cavity 19-7. A solenoid valve 19-10 is fixedly connected to each feed branch pipe 19-9. The solenoid valve 19-10 is used to control the inlet speed of the coolant; a discharge cavity 19-11 is provided at the top of the cooling cavity 19-7. The discharge cavity 19-11 is located in the middle of the cooling cavity 19-7. A plurality of feed branch pipes 19-9 are fixedly connected to the water outlet pipe 19-3. The discharge branch pipe 19-12, the bottom of the discharge branch pipe 19-12 extends into the discharge cavity 19-11; slide the chip 5 to the bottom of the cold plate 7-1, push the push rod 8-4, the push rod 8-4 pushes the track plate 8-2 to slide inward, the inclined surface 8-10 at the bottom of the track plate 8-2 pushes the bearing 7-14 to move downward, and then pushes the cold plate 7-1 to move downward until the bottom of the heat conducting plate 19-5 abuts against the chip 5, and the chip 5 is cooled. The heat conducting plate 19-5 transfers the heat of the chip 5 upward, and the coolant in the cooling cavity 19-7 at the top of the cold plate 7-1 exchanges heat to achieve cooling of the chip 5.

[0041] Reference Figure 10 and Figure 12In order to improve the heat conduction effect of the heat conducting plate 19-5, the bottom of the heat conducting plate 19-5 is coated with thermal grease. Thermal grease is a paste-like thermal interface material with good thermal conductivity. It is mainly used to fill the tiny gap between the chip 5 and the heat conducting plate 19-5 to ensure that heat can be transferred efficiently. A silicone grease loading rack 19-13 is slidingly connected to the bottom supporting steel plate 1-10. A plurality of coating plates 19-14 are arranged on the top of the silicone grease loading rack 19-13. The figure shows that there are three coating plates 19-14, but it is not limited to three. The number of coating plates 19-14 can be set according to demand; the silicone grease loading rack 19-13 is connected to the side away from the sliding tray device 3 with a cylinder 19-15. The cylinder body of the cylinder 19-15 is fixedly connected to the bottom supporting steel plate 1-10, and the piston rod end of the cylinder 19-15 is fixedly connected to the silicone grease loading rack 19-13. -15 has a accommodating box 19-16 fixedly connected to its cylinder body, which is used to hold thermal grease. A plurality of guide tubes 19-17 are fixedly connected to the accommodating box 19-16, which are respectively connected to the coating plate 19-14. The guide tubes 19-17 guide the thermal grease in the accommodating box 19-16 to the coating plate 19-14. When the sliding tray device 3 slides outward, the piston rod of the cylinder 19-15 extends, pushing the coating plate 19-14 to slide across the bottom of the thermal conductive plate 19-5, and coating the thermal grease on the bottom of the thermal conductive plate 19-5.

[0042] In order to facilitate the cleaning and replacement of the thermal grease at the bottom of the heat conducting plate 19-5, a material receiving box 19-18 is provided on the side of the silicone grease feeding rack 19-13 close to the sliding tray device 3, and a buffer column 19-19 is slidably connected in the material receiving box 19-18. The outer jacket of the buffer column 19-19 is provided with a buffer spring 19-21, and the top of the buffer column 19-19 is fixedly connected with a scraper 19-20. The scraping blade of the scraper 19-20 is tilted upward, and the scraping blade can abut against the bottom of the heat conducting plate 19-5 and scrape off the thermal grease at the bottom of the heat conducting plate 19-5. The large thermal grease scraped off falls into the material receiving box 19-18; the silicone grease feeding rack 19-13 is located on the side of the material receiving box 19-18 away from the sliding tray device 3 and rotates the brush 19-22. The brush 19-22 is used to clean the silicone grease at the bottom of the heat conducting plate 19-5 for the second time. The piston rod of the cylinder 19-15 extends, pushing the scraper 19-20 against the bottom of the heat conducting plate 19-5. The scraper 19-20 cleans the silicone at the bottom of the heat conducting plate 19-5, and the brush 19-22 cleans the debris remaining at the bottom of the heat conducting plate 19-5. Then, the coating plate 19-14 coats the thermal grease on the bottom of the heat conducting plate 19-5 to realize automatic replacement of the thermal grease.

[0043] After the thermal grease is applied, manually pull the push rod 8-4 outward to disengage the limit slot 8-9 on the push rod 8-4 from the push rod baffle 2-12. The tension of the spring 9 automatically drives the cold plate 7-1 to reset upward, and then drives the heat conducting plate 19-5 to move upward to prevent the brush 19-22 and the scraper 19-20 from scraping off the new thermal grease when they are retracted.

[0044] Reference Figure 2 and Figure 13 The control module 12 is respectively connected to the detection circuit device 4, the chip 5, the lighting device 6, the execution device 7, the socket module 10, the power distribution module 11, the power module 13, the grating protection module 14, the laser position detection module 15, the electromagnet adsorption module 16, the PDU socket 17, the three-color warning light 18, and the cooling device 19.

[0045] The control module 12 includes an operation interface U1 , which allows operators to more intuitively monitor and operate the status of key components in real time.

[0046] The operation interface U1 includes the initial interface U1-1, the initial interface status display U1-2, the operation layer interface U1-3, the setting interface U1-4, the data setting interface U1-5, the event page U1-6, and the alarm page U1-7.

[0047] Among them, the initial interface U1-1 includes: start execution confirmation switch U1-1-1, liquid cooler 19-1 working status indication U1-1-2, interface button U1-1-3, water leakage detection U1-1-4, function button U1-1-5, and alarm U1-1-6.

[0048] Start execution confirmation switch U1-1-1: used to press and hold this confirmation switch for 1s after the chipset and substrate have been fixed, the corresponding operation layer test is in place, and the action is ready. At this time, the switch state changes from OFF to ON, and the test of this layer starts to be executed; Liquid cooler 19-1 working status indicator U1-1-2: used when the refrigeration system is normally started and working, this indicator light is displayed, when the liquid cooler is shut down or a fault occurs, it is displayed and flashes; Interface button U1-1-3: used to control pressing buttons on each layer, used to control entry into the specific operation interface of the corresponding test layer; Function button U1-1-5: used for Chinese and English language switching - by clicking the button, language switching, recording operator-related action operation execution and event prompts, function switching and data parameter setting of the relevant layer of the tooling, to improve practicality; Alarm button U1-1-6: used for alarm display of execution and operation errors associated with the tooling, and alarm elimination operations.

[0049] The initial interface status displays U1-2, which is used to indicate alarms generated during operation. A flashing warning sign is set for each corresponding layer on the left side of the main interface. Users can click the corresponding layer interface button to enter that interface for confirmation, or enter the alarm page to confirm and process information. For example, if a certain position is disabled by switching the interface function button, a red STOP sign will appear on the right side of the corresponding layer on the main interface, indicating that all functions on that layer are disabled. For example, a rain sensor is installed at the cold plate position on each layer. The rain sensor can detect whether the cold plate pipeline is leaking or seeping in real time. When the rain sensor detects a leak, it sends an alarm signal, and the indicator light on the corresponding layer of the main interface leak detection flashes yellow as a warning. At the same time, the external alarm light and alarm sound are controlled to light up. This facilitates the operator to check and eliminate hidden dangers, and restore normal operation after confirming the fault information.

[0050] The operation layer interface U1-3 is used to enter the specific operation interface of the layer by clicking the interface button of the corresponding layer; it includes: light curtain signal U1-3-1, electromagnet signal U1-3-2, laser positioning signal U1-3-3 and pressure plate pressure signal U1-3-4.

[0051] Light curtain signal U1-3-1: When the light curtain protector is triggered and the light curtain reset switch is turned on, the light curtain signal indicator lights up. The light curtain reset switch can be used to reset the triggered light curtain signal. When the light curtain is triggered, click the light curtain reset switch to send a reset signal to eliminate the alarm; Electromagnet signal U1-3-2: When the electromagnet is energized and attracted, it fixes the sliding tray device 3 in the actuator frame 2 and lights up the signal indicator light; the sliding tray device 3 is fixed by operating the electromagnet attraction / release switch.

[0052] Laser positioning signal U1-3-3: The laser ranging signal light is on only when the chipset is fixed in the correct position and the test sliding tray device 3 is pushed under the execution device 7; at this time, the actual positioning data value is displayed in the laser ranging data box. If the data in the display box overflows, it means that the chipset test bench is out of the measurement range.

[0053] Platen pressure signal U1-3-4: This indicator lights up when the chipset platen pressure is within the set range. The platen pressure data display box on the right shows the real-time pressure value. Note: Before each pressurization, it is recommended to reset the initial pressure value to zero. To do this, lightly press the value in the platen pressure display box. Wait until the data sensor is reset to zero and the display returns to 0.00 kg.

[0054] Setting interface U1-4: This interface can be entered by clicking the setting button on the right side of the main interface; setting interface U1-4 includes platform switching U1-4-1, laser positioning data setting U1-4-2, and pressure plate pressure data setting U1-4-3.

[0055] The station switching U1-4-1 is used to enable / disable the station switch to temporarily disable the layers that are not in use. The disabled layers will not participate in the system control and alarm functions, and the target layer can be detected separately.

[0056] Laser positioning data setting U1-4-2: It is used to enter the setting interface of the laser positioning data range of the layer by clicking the corresponding layer data button.

[0057] Platen pressure data setting U1-4-3: It is used to enter the setting interface of the platen pressure data range of the layer by clicking the corresponding layer data button.

[0058] Data Setting Interface U1-5: Click the corresponding layer's Data Setting button to enter the Data Range Setting Interface. Click the Settings button below or the X key in the upper right corner to return to set the data ranges for each test. Data Setting Interface U1-5 includes the Laser Ranging Positioning Data Interface U1-5-1 and the Platen Pressure Data Setting Interface U1-5-2.

[0059] The laser ranging positioning data interface U1-5-1 includes: distance detection data, distance target data, distance upper limit value, and distance lower limit value; Distance detection data U1-5-2 displays the real-time measured distance. This distance is a specific distance from the detection point to chip 5 and is used to verify that the chip is correctly positioned. Data overflow occurs when the data exceeds the measurement range (2147483647mm). Distance target data is used to input this value based on the results of normal operational measurements. Note: This value cannot exceed the upper-lower limit setting range. If it does, the value returns to the limit. The upper limit value of the distance is used to set the upper deviation of the alarm range; during operation, an alarm is generated if the measured distance exceeds this value. The lower limit value of the distance is used to set the lower deviation of the alarm range; during operation, an alarm is generated if the measured distance exceeds this value.

[0060] Pressure plate pressure data setting interface U1-5-2; includes: pressure detection data, pressure target data, pressure upper limit value, pressure lower limit value; pressure detection data is used to display the real-time measured distance, and the pressure sensor measures the pressure range of 0-30Kg; pressure target data is used to input the value according to the normal execution of operating specifications. Note: the value cannot exceed the upper limit value-lower limit value setting range. If it exceeds, it will return to the limit value; the pressure upper limit value is used to set the upper limit deviation value of the alarm range; during the execution of work, an alarm will be generated after the measured pressure exceeds this value; the pressure lower limit value is used to set the lower limit deviation value of the alarm range; during the execution of work, an alarm will be generated after the measured pressure exceeds this value.

[0061] Event page U1-6: Click the Event button on the right side of the main interface to enter the Event page. Click the Main button to return. Through the information on this page, you can view the relevant execution records of user settings and operations, helping users to record memos. Alarm page: Click the Alarm button on the right side of the main interface to enter the Alarm page. Click the Main button to return to this page.

[0062] Event page U1-6 includes: real-time alarm information U1-6-1 and historical alarm information U1-6-2. Real-time alarm information U1-6-1 is used to list relevant information about device alarms in a table on this page. By viewing the information line, you can understand the fault alarm information in real time. After the fault is eliminated, clicking the alarm confirmation button will eliminate the relevant alarm, the external alarm light (red) and the alarm sound. Historical alarm information U1-6-2 On the alarm page, click the historical alarm button in the upper left corner to enter the historical alarm record page; click the alarm ** button below or the X in the upper right corner to return, and the relevant information of the device's historical alarms will be listed in the table on this page. By checking the information rows, you can understand the fault alarm information history; by clicking the clear historical alarm button, you can delete the relevant alarm history records that are no longer being checked, but the information rows that are still alarming will not be cleared.

[0063] The implementation principle of an integrated experimental device for durability testing of a high-power chip in an embodiment of the present application is as follows: various detection parameters are set on the operating module in advance, and then the chip 5 is placed on the sliding tray device 3, and the square handle 3-4 is pushed to slide the sliding tray device 3 to the bottom of the execution device frame 2, and the push rod 8-4 is pushed inward to slide, and the pulley 8-8 slides in the top slide rail 2-9, and the push rod 8-4 pushes the track plate 8-2 to slide inward, and the inclined surface 8-10 at the bottom of the track plate 8-2 pushes the bearing 7-14 to move downward, and then pushes the spring column mounting plate 7-9, the cold plate upper plate 7-5 and the cold plate 7-1 to move downward, so that the bottom heat conduction plate of the cold plate 7-1 abuts against the chip 5; at the same time, the water outlet pipe 19-3 of the liquid cooler 19-1 guides the coolant into the cooling chamber 19-7, and the heat conduction plate 19-5 transfers the heat of the chip 5 upward, and the coolant in the cooling chamber 19-7 exchanges heat to achieve cooling of the chip 5.

[0064] The above are all preferred embodiments of the present application, and are not intended to limit the scope of protection of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.

Claims

1. An integrated experimental device for high-power chip durability testing, characterized by: The invention comprises a carrying device (1), wherein the carrying device (1) comprises a profile frame (1-5), wherein a plurality of bottom support steel plates (1-10) are arranged in the profile frame (1-5), and wherein the bottom support steel plates (1-10) are arranged horizontally to separate the profile frame (1-5) into a plurality of mutually parallel detection stations; wherein each of the detection stations is provided with an execution device frame (2), a sliding tray device (3), a detection circuit device (4), a chip (5), an execution device (7), and a push rod slider device (8); The execution device frame (2) is located on one side of the bottom support steel plate (1-10), the sliding tray device (3) is slidably connected to the execution device frame (2), the sliding tray device (3) can slide outward from one side of the execution device frame (2), the detection circuit device (4) is arranged on the sliding tray device (3), the chip (5) is placed on the detection circuit device (4), the execution device (7) is connected to the inner top of the execution device frame (2), and the push rod slider device (8) is slidably connected to the execution device frame (2) for pushing the execution device (7) to move vertically; The execution device (7) includes a cold plate (7-1), and a cooling device (19) is connected to the cold plate (7-1); The cooling device (19) includes a liquid cooler (19-1), a cavity (19-4) opened in the cold plate (7-1), and a heat conduction plate (19-5) connected to the bottom of the cold plate (7-1). A water inlet pipe (19-2) and a water outlet pipe (19-3) are fixedly connected to the liquid cooler (19-1). The ends of the water inlet pipe (19-2) and the water outlet pipe (19-3) away from the liquid cooler (19-1) are both connected to the cavity (19-4). The water outlet pipe (19-3) is used to guide the cooling liquid in the liquid cooler (19-1) into the cavity (19-4). The water inlet pipe (19-2) is used to guide the cooling liquid after heat exchange in the cavity (19-4) back to the liquid cooler (19-1) for cooling.

2. A high-power chip durability test integrated experimental equipment according to claim 1, characterized in that: The actuator (7) comprises a cold plate upper plate (7-5) connected to the upper portion of the cold plate (7-1); a spring column mounting plate (7-8) is connected to the upper portion of the cold plate upper plate (7-5); lower spring columns (7-9) are symmetrically arranged on both sides of the spring column mounting plate (7-8); an upper spring column (2-10) is arranged on the inner top wall of the actuator frame (2); and a spring (9) is connected between the upper spring column (2-10) and the lower spring column (7-9); The top of the spring column mounting plate (7-8) is fixedly connected to a guide column (7-10), the inner top wall of the actuator frame (2) is provided with a linear flange bearing (2-11), the guide column (7-10) is slidably connected in the linear flange bearing (2-11), and the top of the spring column mounting plate (7-8) is provided with a bearing assembly that cooperates with the push rod slider device (8) to push the spring column mounting plate (7-8) downward.

3. A high-power chip durability test integrated experimental equipment according to claim 2, characterized in that: The bearing assembly comprises a top bearing seat bottom plate (7-12) connected to a spring column mounting plate (7-8), a top of the bearing seat bottom plate (7-12) is connected to a bearing seat (7-13), and a bearing (7-14) is rotatably connected in the bearing seat (7-13); The push rod slider device (8) includes a push rod slider (8-1), the bottom of the push rod slider (8-1) is connected to a track plate (8-2), the bottom of the track plate (8-2) is provided with an inclined surface (8-10), the inclined surface (8-10) is inclined upward from the side close to the push rod (8-4), and the inclined surface (8-10) abuts against the bearing (7-14); a push rod seat (8-3) is hinged on the track plate (8-2), the push rod (8-4) is connected to the push rod seat (8-3), the bottom of the push rod (8-4) is provided with two limit slots (8-9), the inner top wall of the execution device frame (2) is provided with a push rod baffle (2-12), and the push rod (8-4) passes through the push rod baffle (2-12).

4. A high-power chip durability test integrated experimental equipment according to claim 3, characterized in that: A pulley (8-8) is provided on the top of the push rod slider (8-1), a top slide rail (2-9) is provided on the inner top wall of the execution device frame (2), and the pulley (8-8) is slidably connected in the top slide rail (2-9).

5. A high-power chip durability test integrated experimental equipment according to claim 1, characterized in that: A plurality of partitions (19-6) are fixedly connected in the cavity (19-4), and the partitions (19-6) divide the cavity (19-4) into a plurality of cooling cavities (19-7). The water inlet pipe (19-2) and the water outlet pipe (19-3) both extend into the cavity (19-4). A plurality of feed branch pipes (19-9) are fixedly connected to the water inlet pipe (19-2). The water inlet pipe (19-2) is symmetrically located in the cooling cavity (19-7). On both sides, the bottom of the feed branch pipe (19-9) extends into the cooling chamber (19-7), each feed branch pipe (19-9) is fixedly connected to a solenoid valve (19-10), a discharge chamber (19-11) is provided at the top of the cooling chamber (19-7), a plurality of discharge branch pipes (19-12) are fixedly connected to the water outlet pipe (19-3), and the bottom of the discharge branch pipe (19-12) extends into the discharge chamber (19-11).

6. A high-power chip durability test integrated experimental equipment according to claim 1, characterized in that: The bottom of the heat conducting plate (19-5) is coated with thermal grease, a silicone grease loading rack (19-13) is slidably connected to the bottom supporting steel plate (1-10), a plurality of coating plates (19-14) are arranged on the top of the silicone grease loading rack (19-13), a cylinder (19-15) is connected to the side of the silicone grease loading rack (19-13) away from the sliding tray device (3), the cylinder body of the cylinder (19-15) is fixedly connected to the bottom supporting steel plate (1-10), and the piston rod of the cylinder (19-15) is fixedly connected to the bottom supporting steel plate (1-10). The end portion is fixedly connected to the silicone grease loading rack (19-13); a receiving box (19-16) is fixedly connected to the cylinder body of the cylinder (19-15); the receiving box (19-16) is used to contain thermal grease; a plurality of guide tubes (19-17) are fixedly connected to the receiving box (19-16); the guide tubes (19-17) are respectively connected to the coating plate (19-14); and the guide tubes (19-17) guide the thermal grease in the receiving box (19-16) to the coating plate (19-14).

7. An integrated experimental device for high-power chip durability testing according to claim 6, characterized in that: The silicone grease loading rack (19-13) is provided with a material receiving box (19-18) on the side close to the sliding tray device (3), a buffer column (19-19) is slidably connected in the material receiving box (19-18), a buffer spring (19-21) (9) is provided on the outer shell of the buffer column (19-19), a scraper (19-20) is fixedly connected to the top of the buffer column (19-19), and the scraping blade of the scraper (19-20) is inclined upward, and the scraping blade can abut against the bottom of the heat conducting plate (19-5) and scrape off the thermal grease at the bottom of the heat conducting plate (19-5); the silicone grease loading rack (19-13) is located on the side of the material receiving box (19-18) away from the sliding tray device (3) and rotates the brush (19-22).

8. An integrated experimental device for high-power chip durability testing according to claim 1, characterized in that: The side wall of the execution device frame (2) is provided with an electromagnet adsorption module (16) and a laser position detection module (15), and the side wall of the profile frame (1-5) is provided with a control module (12), and the control module (12) is connected to the laser position detection module (15) and the electromagnet adsorption module (16) respectively.

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