Power supply

Abstract

The invention discloses a power supply which comprises a circuit board, a heat dissipation shell and a plurality of heating assemblies. Each heating assembly comprises a heat conduction iron core and a magnetic coil. The heat conduction iron core is in thermal contact with the heat dissipation shell. The magnetic coil is arranged on the heat conduction iron core and is electrically connected to the circuit board. And the magnetic coils of the plurality of heating components are coaxially arranged and are connected in series through a circuit board.

Description

Technical Field

[0001] The present invention relates to a power supply, and in particular to a power supply comprising a plurality of coaxially arranged magnetic coils. Background Art

[0002] Generally speaking, a computer consists of a case, a power supply, a motherboard, a central processing unit (CPU), a graphics card, and expansion cards. The power supply and motherboard are installed inside the case, and the power supply converts external AC power into DC power and provides DC voltage to the motherboard.

[0003] When a power supply provides DC voltage to a motherboard, it generates a significant amount of heat. Typically, manufacturers install heat sinks to dissipate this heat. However, current PSUs lack the precision to control inductance, resulting in unstable output current. This reduces the PSU's heat dissipation efficiency and, in turn, shortens its lifespan. Therefore, improving PSU heat dissipation efficiency to extend its lifespan is a challenge that developers must address. Summary of the Invention

[0004] The present invention provides a power supply, so as to improve the heat dissipation efficiency of the power supply and extend the service life of the power supply.

[0005] A power supply disclosed in one embodiment of the present invention includes a circuit board, a heat dissipation housing, and multiple heating elements. Each of these heating elements includes a heat-conducting core and a magnetic coil. The heat-conducting core is in thermal contact with the heat dissipation housing. The magnetic coil is disposed on the heat-conducting core and electrically connected to the circuit board. The magnetic coils of these heating elements are coaxially arranged and connected in series via the circuit board.

[0006] In the above-mentioned power supply, the heat-conducting iron cores and the magnetic coils are disposed in the heat dissipation housing.

[0007] In the above-mentioned power supply, the heat dissipation housing includes a bottom plate, a plurality of side plates and a top plate. The side plates are connected to each other, and the bottom plate and the top plate are respectively connected to opposite sides of the side plates.

[0008] In the power supply, each of the side panels includes a first base and a first fin portion disposed on the first base; the top panel includes a second base and a second fin portion disposed on the second base.

[0009] The power supply mentioned above further includes a plurality of first fasteners, a plurality of second fasteners and a plurality of third fasteners. The side panels are fixed to each other via the first fasteners, the side panels are fixed to the bottom panel via the second fasteners, and the top panel is fixed to the side panels via the third fasteners.

[0010] In the power supply described above, each of the heat-conducting cores includes a first heat-conducting portion, a second heat-conducting portion, a first column, and a second column. The first heat-conducting portion is connected to the second heat-conducting portion. The first column is disposed on the first heat-conducting portion. The second column is disposed on the second heat-conducting portion. The first column and the second column are connected. Each of the magnetic coils is disposed on the first column and the second column and is located between the first heat-conducting portion and the second heat-conducting portion.

[0011] In the power supply device, the thickness of each of the first heat-conducting portions is different from the thickness of each of the second heat-conducting portions.

[0012] In the above-mentioned power supply, the magnetic coils are composed of flat copper wires.

[0013] In the power supply mentioned above, the thickness of one turn of the magnetic coils is 0.3 mm, and the line width of the magnetic coils is 6 mm.

[0014] In the power supply mentioned above, each of the magnetic coils has 47 turns.

[0015] According to the power supply of the above embodiment, because the magnetic coils of the heating components are arranged coaxially and connected in series, the power supply can store more electrical energy and distribute current through the circuit board. This improves the accuracy of the power supply's inductance control, resulting in a more stable current output by the power supply. This improves the power supply's heat dissipation efficiency and extends its service life.

[0016] The above description of the content of the present invention and the following description of the embodiments are used to demonstrate and explain the principles of the present invention, and to provide further explanation of the scope of the patent application of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 FIG. 4 is a perspective schematic diagram of a power supply according to an embodiment of the present invention.

[0018] Figure 2 for Figure 1 A three-dimensional schematic diagram of a power supply with the circuit board omitted.

[0019] Figure 3 for Figure 1 Schematic diagram of the power supply omitting the circuit board.

[0020] Figure 4 for Figure 1 Exploded diagram of the heat generating components of a power supply.

[0021] Figure 5 for Figure 1 A schematic cross-sectional view of a power supply with the circuit board omitted.

[0022] Figure 6 for Figure 1 A schematic cross-sectional view of a heating component of a power supply.

[0023] Figure 7 for Figure 1 Schematic plan view of the magnetic coil of the power supply.

[0024] Figure 8 for Figure 1 A schematic side view of a magnetic coil of a power supply.

[0025] Wherein, the reference numerals:

[0026] 10: Power supply

[0027] 11: Circuit Board

[0028] 12: Heat dissipation housing

[0029] 121: Bottom plate

[0030] 122: Side panel

[0031] 1221: First base

[0032] 1222: first fin portion

[0033] 123: Top plate

[0034] 1231: Second base

[0035] 1232: second fin portion

[0036] 13: Heating components

[0037] 131: Thermal Conductive Core

[0038] 1311: first heat conducting part

[0039] 1312: Second heat conducting part

[0040] 1313: First Column

[0041] 1314: Second Column

[0042] 132: Magnetic coil

[0043] 14: First fastener

[0044] 15: Second fastener

[0045] 16: Third fastener

[0046] 17: Heat transfer fluid

[0047] T1~T3:Thickness

[0048] W: Line width DETAILED DESCRIPTION

[0049] See also Figures 1 to 3 . Figure 1 FIG. 4 is a perspective schematic diagram of a power supply according to an embodiment of the present invention. Figure 2 for Figure 1 A three-dimensional schematic diagram of a power supply with the circuit board omitted. Figure 3 for Figure 1 Schematic diagram of the power supply omitting the circuit board.

[0050] The power supply 10 of this embodiment includes a circuit board 11, a heat dissipation housing 12, and a plurality of heating elements 13. The circuit board 11 is provided with electronic components (not shown) such as capacitors, inductors, and transformers, but is not limited thereto.

[0051] The heat dissipation housing 12 dissipates heat, for example, through an external fan (not shown), and includes a bottom plate 121, a plurality of side plates 122, and a top plate 123. These side plates 122 are connected, and the bottom plate 121 and the top plate 123 are respectively connected to opposite sides of these side plates 122. Each of these side plates 122 includes a first base 1221 and a first fin portion 1222. The first fin portion 1222 is disposed on the first base 1221. The top plate 123 includes a second base 1231 and a second fin portion 1232. The second fin portion 1232 is disposed on the second base 1231. The heat dissipation housing 12 is, for example, made of an aluminum alloy, and the first fin portion 1222 and the second fin portion 1232 are, for example, made by aluminum extrusion. By providing the first fin portion 1222 and the second fin portion 1232, the heat dissipation efficiency of the power supply 10 can be improved.

[0052] Please also refer to Figures 4 to 8 . Figure 4 for Figure 1 Exploded diagram of the heat generating components of a power supply. Figure 5 for Figure 1 A schematic cross-sectional view of a power supply with the circuit board omitted. Figure 6 for Figure 1 A schematic cross-sectional view of a heating component of a power supply. Figure 7 for Figure 1 Schematic plan view of the magnetic coil of the power supply. Figure 8for Figure 1 A schematic side view of a magnetic coil of a power supply.

[0053] These heating components 13 may function as a power factor correction (PFC) circuit. A PFC circuit improves power utilization by correcting the power factor of a circuit. The closer the power factor is to 1, the higher the power utilization.

[0054] Each of these heat-generating components 13 is used to supply power to the circuit board 11 and includes a heat-conducting core 131 and a magnetic coil 132. These heat-conducting cores 131 and these magnetic coils 132 are disposed within the heat dissipation housing 12, and these heat-conducting cores 131 are in thermal contact with the heat dissipation housing 12. Each of these heat-conducting cores 131 includes a first heat-conducting portion 1311, a second heat-conducting portion 1312, a first column 1313, and a second column 1314. The first heat-conducting portion 1311 is connected to the second heat-conducting portion 1312. The first column 1313 is disposed on the first heat-conducting portion 1311. The second column 1314 is disposed on the second heat-conducting portion 1312. The first column 1313 is connected to the second column 1314. The thickness T1 of the first heat-conducting portion 1311 and the thickness T2 of the second heat-conducting portion 1312 are, for example, different.

[0055] The magnetic coils 132 are disposed between the first column 1313 and the second column 1314 of the heat-conducting core 131 and are located between the first heat-conducting portion 1311 and the second heat-conducting portion 1312. The magnetic coils 132 are electrically connected to the circuit board 11. The magnetic coils 132 are, for example, coaxially arranged and connected in series via the circuit board 11. The magnetic coils 132 are, for example, made of flat copper wire. Furthermore, the thickness T3 of one turn of the magnetic coils 132 is, for example, 0.3 mm, the wire width W of the magnetic coils 132 is, for example, 6 mm, and the number of turns of each magnetic coil 132 is, for example, 47, to achieve the required inductance of the heating element 13. For example, the inductance of a single heating element 13 is approximately 350 microhenries (μH), and the inductance of two heating elements 13 including two magnetic coils 132 connected in series is approximately 700 μH, and so on.

[0056] In this embodiment, because the magnetic coils 132 of the heating elements 13 are coaxially arranged so that the magnetic coils 132 are connected in series, the power supply 10 can store more electrical energy and distribute current through the circuit board. This improves the accuracy of the power supply 10 in controlling the inductance, making the current output by the power supply 10 more stable. This improves the heat dissipation efficiency of the power supply 10 and extends the service life of the power supply 10.

[0057] In addition, since these magnetic coils 132 are made of flat copper wires, the skin effect can be reduced to reduce copper loss and reduce the temperature increase of these heating components 13 in thermal contact with the heat dissipation housing 12, so that the heat dissipation element, such as an external fan, does not need to dissipate heat from these heat dissipation housings 12 at a high speed. In this way, the heat dissipation efficiency of the power supply 10 can be further improved. Among them, the so-called skin effect is a phenomenon in which the current inside the conductor is unevenly distributed when there is alternating current or an alternating electromagnetic field in the conductor, so that the current in the conductor is concentrated on the surface of the conductor, and almost no current flows through the center part of the conductor. The skin effect causes the current to produce a thermal effect only on the surface of the conductor and produce higher copper loss. In addition, the so-called copper loss refers to the heat generated by the current flowing through the wire, such as in a transformer or other electronic device, that is, a kind of energy loss.

[0058] In this embodiment, the power supply 10 may further include a plurality of first fasteners 14, a plurality of second fasteners 15, and a plurality of third fasteners 16. These first fasteners 14, the second fasteners 15, and the third fasteners 16 may be, for example, screws. The side panels 122 are secured to each other via the first fasteners 14. The side panels 122 are secured to the bottom panel 121 via the second fasteners 15. The top panel 123 is secured to the side panels 122 via the third fasteners 16.

[0059] In this embodiment, the power supply 10 may further include a heat-conducting fluid 17. The heat-conducting fluid 17 may be, for example, FS198BL1 thermally conductive silicone or wax, and the thermal conductivity of the heat-conducting fluid 17 may be, for example, 2 W·m-1·K-1. Furthermore, the heat-conducting fluid 17 may be, for example, a black liquid.

[0060] When the user wishes to fill the heat dissipation housing 12 with the thermally conductive fluid 17, they first secure the top plate 123 to the side plates 122 using the third fasteners 16. At this point, since the side plates 122 are not yet secured to the bottom plate 121, the bottom of the heat dissipation housing 12 is not yet sealed. Next, the thermally conductive fluid 17 is injected into the heat dissipation housing 12 from the bottom. The amount of thermally conductive fluid 17 injected is, for example, approximately 7 grams. Next, the side plates 122, with the top plate 123 attached, are secured to the bottom plate 121 using the second fasteners 15, sealing the bottom of the heat dissipation housing 12 and preventing the thermally conductive fluid 17 from leaking out. This completes the installation of the thermally conductive fluid 17. The presence of the thermally conductive fluid 17 further transfers heat generated by the heating element 13 to the heat dissipation housing 12, allowing the heat conductive core 131 and magnetic coil 132 of the heating element 13 to achieve thermal equilibrium, thereby improving the heat dissipation efficiency of the heating element 13.

[0061] In this embodiment, the number of the heating components 13 is multiple, but not limited to this. In other implementations, the number of the heating component can also be only one.

[0062] In this embodiment, the thickness T1 of the first heat conducting portion 1311 is different from the thickness T2 of the second heat conducting portion 1312 , but the present invention is not limited thereto. In other embodiments, the thickness of the first heat conducting portion and the thickness of the second heat conducting portion may also be the same.

[0063] In this embodiment, the power supply 10 is fixed to the bottom plate 121, the side plates 122, and the top plate 123 by the first fasteners 14, the second fasteners 15, and the third fasteners 16, but the present invention is not limited thereto. In other embodiments, the power supply may also be fixed to the bottom plate, the side plates, and the top plate by other fixing methods.

[0064] According to the power supply of the above embodiment, because the magnetic coils of the heating components are arranged coaxially and connected in series, the power supply can store more electrical energy and distribute current through the circuit board. This improves the accuracy of the power supply's inductance control, resulting in a more stable current output by the power supply. This improves the power supply's heat dissipation efficiency and extends its service life.

[0065] Furthermore, because these magnetic coils are constructed from flat copper wire, they can reduce the skin effect, thereby lowering copper losses and minimizing the temperature rise of heat-generating components in thermal contact with the heat dissipation housing. This eliminates the need for heat dissipation components, such as external fans, to operate at high speeds to dissipate heat from the heat dissipation housing. This further improves the power supply's heat dissipation efficiency.

[0066] Although the present invention is disclosed above with reference to the aforementioned embodiments, they are not intended to limit the present invention. Any person skilled in the art may make slight changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be determined by the scope of protection of the appended claims.

Claims

1. A power supply, characterized in that: Include: a circuit board; a heat dissipation housing; and A plurality of heat generating components, each of the heat generating components comprising: a heat-conducting iron core in thermal contact with the heat-dissipating housing; and A magnetic coil is arranged on the heat-conducting iron core and electrically connected to the circuit board. The magnetic coils of the heating components are coaxially arranged and connected in series through the circuit board.

2. The power supply according to claim 1, wherein: The heat-conducting iron cores and the magnetic coils are arranged in the heat dissipation shell.

3. The power supply according to claim 1, wherein: The heat dissipation housing includes a bottom plate, a plurality of side plates and a top plate. The side plates are connected to each other, and the bottom plate and the top plate are respectively connected to opposite sides of the side plates.

4. The power supply according to claim 3, wherein: Each of the side plates includes a first base and a first fin portion, wherein the first fin portion is disposed on the first base; the top plate includes a second base and a second fin portion, wherein the second fin portion is disposed on the second base.

5. The power supply according to claim 3, wherein: The side panels are fixed to each other via the first fasteners, the side panels are fixed to the bottom panel via the second fasteners, and the top panel is fixed to the side panels via the third fasteners.

6. The power supply according to claim 1, wherein: Each of the heat-conducting cores includes a first heat-conducting portion, a second heat-conducting portion, a first column, and a second column. The first heat-conducting portion is connected to the second heat-conducting portion. The first column is disposed on the first heat-conducting portion. The second column is disposed on the second heat-conducting portion. The first column is connected to the second column. Each of the magnetic coils is disposed on the first column and the second column and is located between the first heat-conducting portion and the second heat-conducting portion.

7. The power supply according to claim 6, wherein: The thickness of each of the first heat conducting portions is different from the thickness of each of the second heat conducting portions.

8. The power supply according to claim 1, wherein: The magnetic coils are made of flat copper wires.

9. The power supply according to claim 1, wherein: The thickness of one turn of the magnetic coils is 0.3 mm, and the line width of the magnetic coils is 6 mm.

10. The power supply according to claim 1, wherein: Each of the magnetic coils has 47 turns.

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