Wafer drying device

Abstract

The wafer drying device comprises a water collecting base, the water collecting base is provided with a containing cavity, and a fixing sleeve is arranged in the containing cavity; the lifting seat is arranged on the periphery of the fixed sleeve in a sleeving mode, the lifting seat is arranged in a sliding mode relative to the fixed sleeve, a closed space is formed between the lifting seat and the fixed sleeve, and the closed space is externally connected with an air source so that the lifting seat can ascend and descend under the action of air pressure change in the closed space; and the waterproof cover is fixedly connected with the lifting seat and ascends and descends along with the lifting seat. The wafer drying device can control air pressure change through an external air source to achieve lifting, the number of mechanical parts is reduced, the problem of shaking during lifting is effectively solved, motion precision is improved, liquid is prevented from splashing to pollute equipment, meanwhile, due to the integrated design of the air pressure driving mechanism, space occupation in the vertical direction is remarkably reduced, and the service life is prolonged. And the equipment installation height requirement is reduced.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a wafer drying device. Background Art

[0002] In semiconductor manufacturing, the cleaning and drying process after the chemical-mechanical polishing (CMP) process is crucial to chip yield. Currently, wafer drying equipment is primarily divided into two types: vertical and horizontal. Horizontal drying technology achieves surface drying by securing the wafer to a rotating table, rotating it at high speed while spraying it with deionized water and purging with gas.

[0003] In existing technical solutions, the wafer relies on a clamping mechanism to provide stable support during high-speed rotation, thereby overcoming centrifugal force and preventing the wafer from being thrown off the turntable. At the same time, to facilitate wafer loading and unloading operations by the robot, the clamping mechanism must be released promptly during wafer placement. Furthermore, to prevent liquid from splashing onto the wafer surface during high-speed rotation and contaminating the equipment, a water shield higher than the wafer is required. This shield must be lowered during wafer placement to prevent interference with the robot's movement.

[0004] However, the current design uses dual drive components to drive the water shield to rise and fall. Since there are only two support points, the water shield shakes when it moves. At the same time, this structure occupies a large space in the box and has high requirements for the installation height of the equipment, which increases the complexity of the equipment structure and the number of parts, which not only increases the manufacturing cost, but also reduces the equipment's operating stability and maintenance convenience. Summary of the Invention

[0005] The present application discloses a wafer drying device that can simplify the drive structure, reduce the number of parts, lower manufacturing costs and failure rates, and improve the convenience of equipment maintenance.

[0006] In order to achieve the above objectives, the present application discloses a wafer drying device, comprising: A water collecting seat, the water collecting seat having an accommodating cavity, wherein a fixing sleeve is provided in the accommodating cavity; A lifting seat, the lifting seat being sleeved on the outer circumference of the fixed sleeve and slidably arranged relative to the fixed sleeve, forming a closed space between the lifting seat and the fixed sleeve, and the closed space being connected to an external air source so that the lifting seat can be raised and lowered by changes in air pressure in the closed space; A waterproof cover is fixedly connected to the lifting seat so as to rise and fall with the lifting seat.

[0007] In one possible implementation, the lifting seat includes a sliding sleeve, an inner wall of the sliding sleeve has a first annular groove, and / or an outer wall of the fixed sleeve has a second annular groove, so that the enclosed space is formed between the sliding sleeve and the fixed sleeve.

[0008] In one possible implementation, the inner wall of the sliding sleeve has a first annular groove, the outer wall of the fixed sleeve has a second annular groove, the inner wall of the sliding sleeve is located above the first annular groove and is provided with a first sealing ring, the outer wall of the fixed sleeve is located below the second annular groove and is provided with a second sealing ring, the first sealing ring, the second sealing ring, the first annular groove and the second annular groove together form the enclosed space.

[0009] In a possible implementation, the enclosed space is configured such that the lifting seat can move in a direction away from the water collecting seat when the air pressure in the enclosed space increases.

[0010] In a possible implementation, a first restoring member is provided between the lifting seat and the water collecting seat, and the first restoring member is used to provide a restoring force for the lifting seat to move toward the water collecting seat.

[0011] In one possible implementation, a guide hole is provided on the lifting seat, and the wafer drying device further includes a guide member, which is passed through the guide hole so that the lifting seat moves under the resetting force of the first resetting member.

[0012] In a possible implementation, the lifting seat is provided with a lifting flange, and a flange hole of the lifting flange is formed as the guide hole; The guide member is a limit screw, which passes through the flange hole of the lifting flange and is fixed to the bottom of the water collecting seat. The limit screw is provided with a limit sleeve with an opening facing downward. The first reset member is a first spring, which is sleeved on the limit screw and partially located in the limit sleeve. One end of the first spring abuts against the lifting flange, and the other end of the first spring abuts against the bottom wall of the limit sleeve.

[0013] In a possible implementation, the lifting seat further includes a support arm provided on the outer periphery of the sliding sleeve, and the waterproof cover is fixed to the support arm via a connecting member.

[0014] In one possible implementation, there are multiple support arms, and the multiple support arms are evenly arranged around the outer circumference of the sliding sleeve. The support arm is provided with a mounting groove, and the bottom edge of the waterproof cover is inserted into the mounting groove. The side wall of the waterproof cover is provided with a plug-in hole, and the connecting piece is fixed to the support arm and plugged into the plug-in hole to fix the waterproof cover and the support arm.

[0015] In a possible implementation, the cover body of the waterproof cover is a cylindrical structure with openings at both ends, and the upper diameter of the cylindrical structure gradually decreases relative to the lower diameter.

[0016] In a possible implementation, the water collecting seat includes an outer cylinder, and the outer diameter of the waterproof cover is smaller than the inner diameter of the outer cylinder of the water collecting seat.

[0017] Compared with the prior art, the present invention has the following advantages: In the wafer drying device provided in the present application, a fixed sleeve is built into the accommodating cavity of the water collection seat, providing stable axial guidance for the lifting seat and ensuring the accuracy of the lifting movement. The lifting seat is mounted on the outer periphery of the fixed sleeve and slides relative to the fixed sleeve, forming a closed space between the two. The air pressure changes in the closed space are controlled by an external air source to achieve lifting and lowering. The waterproof cover is fixed to the lifting seat and rises and falls synchronously with the lifting seat. Compared with the traditional dual-drive drive method, this simplifies the drive structure, reduces the number of mechanical components, effectively eliminates the problem of shaking during lifting and lowering, improves the movement accuracy of the waterproof cover, and prevents liquid splashing and contaminating the equipment. At the same time, the integrated design of the pneumatic drive mechanism significantly reduces the vertical space occupied, reduces the equipment installation height requirement, and can also reduce manufacturing costs and failure rates, and improve the convenience of equipment maintenance. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0019] Figure 1 A schematic structural diagram of a wafer drying device provided by an embodiment of the present invention; Figure 2 A schematic structural diagram of a lifting base of a wafer drying device provided by an embodiment of the present invention; Figure 3 A cross-sectional view of a lifting base of a wafer drying device provided by an embodiment of the present invention; Figure 4 A schematic structural diagram of a water collecting seat of a wafer drying device provided by an embodiment of the present invention; Figure 5 A cross-sectional view of a water collecting seat of a wafer drying device provided by an embodiment of the present invention; Figure 6 A schematic structural diagram of a waterproof cover for a wafer drying device provided by an embodiment of the present invention; Figure 7A front view of a waterproof cover for a wafer drying device provided by an embodiment of the present invention; Figure 8 A cross-sectional view of a wafer drying device provided by an embodiment of the present invention; Figure 9 A partial cross-sectional view of a wafer drying device provided by an embodiment of the present invention; Figure 10 A schematic structural diagram of a wafer base of a wafer drying device provided by an embodiment of the present invention; Figure 11 A schematic structural diagram of a clamping member of a wafer drying device provided by an embodiment of the present invention; Figure 12 A schematic structural diagram of a clamping member of a wafer drying device in an unlocked position provided by an embodiment of the present invention; Figure 13 A schematic structural diagram of a clamping member in a clamping position of a wafer drying device provided by an embodiment of the present invention.

[0020] Description of reference numerals: 10 - water collecting seat; 11 - accommodating chamber; 12 - fixing sleeve; 121 - second annular groove; 122 - second sealing ring; 20 - lift base; 21 - enclosed space; 22 - sliding sleeve; 221 - first ring groove; 222 - first sealing ring; 223 - threaded hole; 224 - external connector; 23 - guide hole; 231 - flange hole; 24 - lift flange; 25 - support arm; 251 - mounting slot; 30 - Clamping assembly; 31 - Support member; 311 - Rotating disk; 3111 - Extension portion; 31111 - Driver mounting hole; 31111a - Stepped surface; 31112 - Ejector pin; 311121 - Ejector pin head; 312 - Rotating axis; 313 - Protective cover; 32 - Clamping member; 321 - Clamping claw; 3211 - Clamping surface; 322 - Compensating hole; 33 - Wafer holder; 331 - Assembly groove; 332 - Boss; 3321 - Drain groove; 333 - Guide post; 334 - Inclined surface; 335 - Abutment portion; 40- waterproof cover; 41- plug hole; 42- unlocking part; 50-first return member; 51-first spring; 60-guide; 61-limiting screw; 611-limiting sleeve; 70-connector; 80-clamping drive member; 81-second spring; 90-detection sensor; 91-transmitter. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0022] In this application, the terms "installed," "disposed," "provided with," "connected," and "connected" should be interpreted broadly. For example, they can refer to fixed connections, removable connections, or integral structures; mechanical connections or electrical connections; direct connections, indirect connections through an intermediary, or internal communication between two devices, elements, or components. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0023] Furthermore, the terms "first," "second," and the like are primarily used to distinguish different devices, elements, or components (which may or may not be the same in type and configuration) and are not intended to indicate or imply the relative importance or quantity of the devices, elements, or components indicated. Unless otherwise specified, "plurality" means two or more.

[0024] In semiconductor manufacturing, the cleaning and drying process after the chemical-mechanical polishing (CMP) process is crucial to chip yield. Currently, wafer drying equipment is primarily divided into two types: vertical and horizontal. Horizontal drying technology achieves surface drying by securing the wafer to a rotating table, rotating it at high speed while spraying it with deionized water and purging with gas.

[0025] In existing technical solutions, the wafer relies on a clamping mechanism to provide stable support during high-speed rotation, thereby overcoming centrifugal force and preventing the wafer from being thrown off the turntable. At the same time, to facilitate wafer loading and unloading operations by the robot, the clamping mechanism must be released promptly during wafer placement. Furthermore, to prevent liquid from splashing onto the wafer surface during high-speed rotation and contaminating the equipment, a water shield higher than the wafer is required. This shield must be lowered during wafer placement to prevent interference with the robot's movement.

[0026] However, the current design uses dual drive components to drive the water shield to rise and fall. Since there are only two support points, the water shield shakes when it moves. At the same time, this structure occupies a large space in the box and has high requirements for the installation height of the equipment, which increases the complexity of the equipment structure and the number of parts, which not only increases the manufacturing cost, but also reduces the equipment's operating stability and maintenance convenience.

[0027] In view of this, some embodiments of the present application provide a wafer drying device that can achieve lifting and lowering by controlling air pressure changes through an external air source, reducing the number of mechanical components, effectively eliminating the shaking problem during lifting and lowering, improving movement accuracy, and avoiding liquid splashing and contaminating the equipment. At the same time, the integrated design of the air pressure drive mechanism significantly reduces the vertical space occupancy and reduces the equipment installation height requirements.

[0028] The present application is described in detail below through specific embodiments: The wafer drying device of the embodiment of the present application is as follows Figures 1 to 13 As shown, a wafer drying device includes: The water collecting seat 10 has an accommodating cavity 11, and a fixing sleeve 12 is provided in the accommodating cavity 11; The lifting seat 20 is sleeved on the outer periphery of the fixed sleeve 12 and is slidably arranged relative to the fixed sleeve 12. A closed space 21 is formed between the lifting seat 20 and the fixed sleeve 12. The closed space 21 is connected to an external air source so that the lifting seat 20 can be raised and lowered under the action of changes in air pressure in the closed space 21; The waterproof cover 40 is fixedly connected to the lifting base 20 so as to rise and fall with the lifting base 20 .

[0029] In the wafer drying device provided in the embodiments of the present application, a water collection base 10 is provided with a chamber 11. A fixed sleeve 12 is installed within chamber 11, forming the device's basic support structure. Fixed sleeve 12 provides axial guidance for a lift base 20. The lift base 20 is sleeved around the outer periphery of fixed sleeve 12, forming a sealed space 21 with the fixed sleeve 12. The lift base 20 is driven up and down by controlling air pressure changes via an external air source. When air pressure increases, the pressure within sealed space 21 pushes the lift base 20 upward. When air pressure decreases, the lift base 20 descends due to gravity or a reset mechanism.

[0030] Therefore, the fixed sleeve 12 guides the lift and pneumatically drives it evenly, replacing the traditional dual-drive mechanism with pneumatic drive. This reduces the number of mechanical components and improves motion smoothness. This eliminates the need for two-point support in the dual-drive mechanism, eliminates side-to-side sway during lifting, improves the movement precision of the waterproof cover 40, and prevents liquid splashing and contamination of the equipment. The pneumatic drive mechanism is integrated between the fixed sleeve 12 and the lift base 20, resulting in a compact structure, reduced vertical space usage, and lowered installation height requirements.

[0031] Among them, the enclosed space 21 is connected to the external gas source through an air circuit, and a solenoid valve is arranged in series on the gas circuit. The solenoid valve may include an on-off valve, an air intake speed regulating valve and an exhaust speed regulating valve, etc. The gas source provides compressed gas (dry air or nitrogen can be used), and other components such as a safety valve and a pressure air device can also be connected in series on the gas circuit.

[0032] The lifting base 20 is slidably arranged relative to the fixed sleeve 12 along a first direction so that the lifting base 20 can be lifted and lowered along the first direction. In the figure, the X direction is the first direction, which is also the vertical direction in this embodiment.

[0033] In some embodiments, as Figure 1 As shown, the wafer drying device also includes a clamping assembly 30, which includes a support member 31 and a clamping member 32 that are interconnected. The support member 31 is rotatably set on the fixed sleeve 12 and is used to place the wafer. The clamping member 32 is rotatably set on the support member 31 and can move between a clamping position for clamping the wafer and an unlocking position for detaching from the wafer.

[0034] The waterproof cover 40 is located on the outer periphery of the clamping assembly 30 . When the waterproof cover 40 abuts against the clamping member 32 , the clamping member 32 is in an unlocked position, or when the waterproof cover 40 is separated from the clamping member 32 , the clamping member 32 is in a clamping position.

[0035] The fixed sleeve 12 serves as the mounting base for the clamping assembly 30, ensuring central stability during wafer rotation. The support member 31 is rotatably mounted on the fixed sleeve 12, providing a support surface for the wafer. Its center serves as the center of rotation, ensuring balance during high-speed wafer rotation. The clamping member 32 is movably connected to the support member 31, allowing it to move between a "clamping position" (holding the wafer securely) and an "unlocking position" (releasing the wafer). Furthermore, the clamping and releasing of the clamping member 32 are linked to the raising and lowering of the waterproof cover 40. The waterproof cover 40 is fixed to the outer periphery of the lifting platform 20 and rises and falls synchronously with the lifting platform 20. When the waterproof cover 40 descends to abut against the clamping member 32, it locks the clamping member 32 into the unlocked position. When the support member 31 is activated to rotate to dry the wafer, the waterproof cover 40 rises and disengages from the clamping member 32, placing the clamping member 32 in the clamping position, securing the wafer securely and ensuring a secure hold.

[0036] Furthermore, the lifting and lowering of the waterproof cover 40 and the unlocking of the clamp 32 are controlled by a single pneumatic pressure source, eliminating independent drivers and controllers, reducing the number of parts and lowering manufacturing costs. Furthermore, a single pneumatic drive replaces the coordinated operation of multiple drivers, eliminating vulnerable components such as solenoid valves and air pipes, reducing failure rates and maintenance time. Furthermore, the mechanical linkage between the waterproof cover 40 and the clamp 32 ensures synchronized operation, avoiding the timing deviations that can occur with traditional independent drives and reducing the rate of wafer clamping defects.

[0037] In one possible implementation, Figures 2 to 5 As shown, the lifting seat 20 includes a sliding sleeve 22 , the inner wall of the sliding sleeve 22 has a first annular groove 221 , the outer wall of the fixed sleeve 12 has a second annular groove 121 , and the first annular groove 221 and the second annular groove 121 are arranged opposite to each other to form a closed space 21 .

[0038] As a result, the inner wall of the sliding sleeve 22 of the lifting seat 20 is provided with a first annular groove 221, while the outer wall of the fixed sleeve 12 is correspondingly provided with a second annular groove 121. The two annular grooves are arranged opposite each other, forming an annular, enclosed space 21. When compressed gas is introduced into the enclosed space 21 from an external gas source, the gas pressure acts evenly on the inner wall of the sliding sleeve 22. Due to the presence of the first annular groove 221, the gas pressure effectively propels the sliding sleeve 22 upward axially along the fixed sleeve 12. When the gas pressure decreases, the sliding sleeve 22 descends along the fixed sleeve 12 under its own weight or the action of a return spring, achieving the lifting and lowering motion of the lifting seat 20.

[0039] An annular groove is a portion of a shaft or sleeve part where the diameter is reduced. The first annular groove 221 is located on the inner wall of the sliding sleeve 22 and is an annular concave shape. The second annular groove 121 is located on the outer wall of the fixed sleeve 12 and is also an annular concave shape. When assembled, the two grooves face each other, forming a closed, annular space 21. This space acts like an air chamber, containing compressed gas.

[0040] Compared to traditional dual-drive structures, the drive mechanism is integrated between the annular grooves of the fixed sleeve 12 and the sliding sleeve 22, eliminating the need for complex drive components, connecting rods, and other components, thus reducing the number of parts. This not only reduces the manufacturing cost of the equipment but also reduces the number of failure points caused by component wear. Furthermore, the pneumatic drive system, combined with the annular grooves, provides uniform driving force, reducing the amplitude of the movement of the lifting platform 20 and significantly improving the movement accuracy of the waterproof cover 40. This effectively prevents liquid splashing and contamination of the equipment, ensuring a clean wafer drying environment.

[0041] In some embodiments, as Figure 8 and Figure 9 As shown, the inner wall of the sliding sleeve 22 is located above the first annular groove 221 and is provided with a first sealing ring 222, and the outer wall of the fixed sleeve 12 is located below the second annular groove 121 and is provided with a second sealing ring 122. The first sealing ring 222, the second sealing ring 122, the first annular groove 221 and the second annular groove 121 together form a closed space 21.

[0042] The first sealing ring 222 and the second sealing ring 122 are respectively positioned above the first annular groove 221 and below the second annular groove 121. Together, they form a sealed barrier, maintaining the integrity of the enclosed space 21 and reducing the risk of gas leakage. During the wafer drying process, the equipment may experience complex operating conditions such as temperature fluctuations and vibrations. The sealing rings have a certain degree of elasticity, providing a buffer during the raising and lowering of the sliding sleeve 22. The first sealing ring 222 and the second sealing ring 122 can reduce radial vibration between the sliding sleeve 22 and the fixed sleeve 12, improving the motion accuracy of the lifting base 20, reducing mechanical impact, and extending the service life of the fixed sleeve 12 and sliding sleeve 22. Furthermore, when the wafer drying device is in operation, liquid splashes. The enclosed space 21 formed by the sealing ring and the annular groove effectively prevents liquid from entering the pneumatic drive system.

[0043] The sealing ring can be a lip seal or an O-ring, which is not limited in this application. After the two annular grooves are arranged relative to each other, a sealing element is installed on the contact surface to ensure the tightness of the space. The sealing element is installed in the sealing groove of the annular groove. The depth and width of the sealing groove are precisely designed according to the specifications of the sealing ring to ensure that the sealing ring can achieve a reliable seal under compression and prevent air pressure leakage from affecting the driving effect of the lifting base 20.

[0044] In some embodiments, as Figure 8 and Figure 9 As shown, the enclosed space 21 is configured such that the lifting seat 20 can move in a first direction away from the water collecting seat 10 when the air pressure in the enclosed space 21 increases.

[0045] When an external gas source injects compressed gas into the enclosed space 21, the gas pressure will evenly act on the area below the first annular groove 221 on the inner wall of the sliding sleeve 22. Since the first annular groove 221 changes the force-bearing area of ​​the inner wall of the sliding sleeve 22, the gas pressure can be converted into an upward driving force, pushing the lifting seat 20 to move in the first direction (away from the water collecting seat 10). When the gas pressure in the enclosed space 21 decreases, the lifting seat 20 falls downward along the fixed sleeve 12 under the action of its own gravity or the return spring.

[0046] The lifting platform 20 rises in a first direction, driving the waterproof cover 40 to quickly cover the periphery of the wafer. It can also quickly return to a position where the wafer protrudes from the waterproof cover 40, facilitating wafer loading and unloading operations by the robot, significantly reducing loading and unloading time and significantly improving production efficiency. At the same time, this makes the device structure more reasonable and compact, and also avoids the risk of interference between the waterproof cover 40 and the water collection base 10, reducing the probability of wafer collision damage.

[0047] In some embodiments, as Figure 8 and Figure 9As shown, a first restoring member 50 is provided between the lifting seat 20 and the water collecting seat 10 , and the first restoring member 50 is used to provide a restoring force for the lifting seat 20 to move toward the water collecting seat 10 along a first direction.

[0048] A first return element 50 is disposed between the lift base 20 and the water collection base 10. When the enclosed space 21 is inflated, causing the lift base 20 to rise, the spring is compressed and stores elastic potential energy. When the air pressure decreases, the first return element 50 releases this energy, pushing the lift base 20 back down smoothly in the first direction toward the water collection base 10. During the return process, the return force of the first return element 50 complements the air pressure, ensuring reliable return of the lift base 20 even in the event of an air source failure or sudden loss of pressure, thereby improving the success rate of the return.

[0049] Moreover, the buffering effect of the first reset member 50 reduces the hard collision between the lifting seat 20 and the water collecting seat 10, reduces the wear rate of the first sealing ring 222 and the second sealing ring 122, reduces the vibration amplitude of the equipment, and ensures the reliability of the lifting of the lifting seat 20.

[0050] In other embodiments, no reset member may be provided between the lifting seat 20 and the water collecting seat 10 , and the lifting seat 20 can be directly reset and lowered under the action of gravity.

[0051] In some embodiments, as Figure 2 and Figure 9 As shown, a guide hole 23 is provided on the lifting base 20 , and the wafer drying device further includes a guide member 60 , which is passed through the guide hole 23 so that the lifting base 20 moves along the first direction under the restoring force of the first restoring member 50 .

[0052] The guide member 60 forms a clearance fit with the guide hole 23, restricting the freedom of movement of the lift 20 to a first direction. This ensures that the lift 20 moves in an absolutely straight line during the ascent and repositioning process, preventing wafer position shifts caused by deflection. The rigid support provided by the guide member 60 effectively suppresses vibration and shaking during the repositioning process. For example, when the first resetting member 50 releases energy, an unguided structure may generate vibration due to inertia. However, the guide structure constrains lateral displacement, keeping the amplitude within a reasonable range and ensuring process stability.

[0053] In some embodiments, as Figure 2 As shown, a lifting flange 24 is provided on the lifting seat 20 , and a flange hole 231 of the lifting flange 24 is formed as a guide hole 23 .

[0054] like Figure 8 and Figure 9As shown, the guide member 60 is a limit screw 61, which passes through the flange hole 231 of the lifting flange 24 and is fixed to the bottom of the water collecting seat 10. The limit screw 61 is provided with a limit sleeve 611 with an opening facing downward. The first reset member 50 is a first spring 51, which is sleeved on the limit screw 61 and partially located in the limit sleeve 611. One end of the first spring 51 abuts against the lifting flange 24, and the other end of the first spring 51 abuts against the bottom wall of the limit sleeve 611.

[0055] Thus, the flange hole 231 of the lifting flange 24 directly serves as the guide hole 23. The limit screw 61 not only serves as the guide member 60 (constraining the movement of the lifting base 20 along the screw axis) but also secures it to the water collecting base 10 via threads, achieving both positioning and connection. Furthermore, because the lifting flange 24 has multiple flange holes 231, evenly spaced around the center, each flange hole 231 corresponds to a limit screw 61, making the structure more stable and the lifting and lowering of the lifting base 20 more reliable.

[0056] The limiting sleeve 611 is coaxially arranged with the limiting screw 61, and the first spring 51 is sleeved on the limiting screw 61 and embedded in the limiting sleeve 611. The radial constraint of the limiting sleeve 611 on the first spring 51 can suppress the lateral bending of the first spring 51 when it is compressed, shorten the reset force transmission path to a straight distance, avoid the torque loss caused by eccentric transmission, reduce the shaking amplitude of the lifting seat 20 during the reset process, improve energy utilization, maintain movement stability, and also protect the first spring 51.

[0057] In some embodiments, as Figure 1 and Figure 8 As shown, the lifting seat 20 further includes a support arm 25 provided on the outer periphery of the sliding sleeve 22 , and the waterproof cover 40 is fixed on the support arm 25 .

[0058] The support arm 25 is arranged on the outer periphery of the sliding sleeve 22, so that the installation position of the waterproof cover 40 is away from the movement trajectory of the lifting seat 20, ensuring that the waterproof cover 40 maintains a safe distance from the guide mechanism when it is raised and lowered with the support arm 25, avoiding scratches or jamming caused by movement interference, and improving movement reliability.

[0059] The support arm 25 utilizes a cantilever structure, distributing the weight of the waterproof cover 40 circumferentially around the sliding sleeve 22. This effectively controls the eccentric load on the lift base 20 and prevents any impact on the verticality of the lift. Once secured by the support arm 25, the waterproof cover 40 completely covers key components, including the sliding sleeve 22, guide member 60, and return spring, forming a protective structure that provides lateral protection.

[0060] In some embodiments, as Figure 1As shown, there are multiple support arms 25 , which are evenly arranged around the outer circumference of the sliding sleeve 22 . The support arms 25 are provided with mounting grooves 251 , and the side wall of the waterproof cover 40 is provided with plug-in holes 41 .

[0061] like Figure 8 As shown, the wafer drying device also includes a connector 70 , the bottom edge of the waterproof cover 40 is inserted into the mounting groove 251 , the connector 70 is fixed to the support arm 25 , and is inserted into the plug hole 41 to fix the waterproof cover 40 and the support arm 25 .

[0062] Multiple support arms 25 are arranged around the circumference of the sliding sleeve 22, evenly transferring the weight of the waterproof cover 40 to the sliding sleeve 22 through the support arms 25, preventing deflection of the lifting base 20 caused by a single point of force. The support arms 25 and the sliding sleeve 22 form an annular support framework. When the waterproof cover 40 is subjected to an external impact, the impact force is dispersed through the multiple support arms 25, preventing localized deformation.

[0063] The bottom edge of the waterproof cover 40 is inserted into the mounting slot 251 for pre-positioning. The waterproof cover 40 also features a socket 41, forming a connection point. Connectors 70 are then inserted through these sockets to secure the cover. The connectors 70 can then be secured to the support arms 25 using screws or other fasteners, achieving a secure, yet removable, position. As the lift base 20 moves up and down, the multiple support arms 25 simultaneously drive the waterproof cover 40. Because the support arms 25 are arranged circumferentially around the sliding sleeve 22 and each support arm 25 is equipped with a connector 70, the waterproof cover 40 prevents tilting, ensuring a stable and sealed structure.

[0064] The number of the support arms 25 may be two, three, four, or other numbers, which is not limited in this application. A plurality of support arms 25 may be arranged around the outer periphery of the sliding sleeve 22 .

[0065] In some embodiments, as Figure 6 and Figure 7 As shown, the cover body of the waterproof cover 40 is a cylindrical structure with two ends open, and the upper diameter of the cylindrical structure gradually decreases relative to the lower diameter.

[0066] Specifically, the water shield is cylindrical, and the diameter of the upper section gradually decreases at a certain arc to form a curved surface. When the liquid flying outward from the wafer surface hits the inner surface of the water shield, the direction of the liquid rebound is obliquely downward, preventing the liquid from rebounding back to the wafer surface. In addition, a hydrophobic material can be sprayed on the upper inner surface area of ​​the waterproof shield 40. When the liquid is thrown to the inner surface of the water shield, the liquid can fall down quickly without aggregation. The inner wall of the waterproof shield 40 guides the airflow and liquid to diffuse evenly in the radial direction, avoiding vortices caused by sudden changes in the cross section, causing condensed water or splashing droplets to slide quickly along the wall.

[0067] In some embodiments, as Figure 1 and Figure 8 As shown, the water collecting seat 10 includes an outer cylinder, the outer diameter of the waterproof cover 40 is smaller than the inner diameter of the outer cylinder of the water collecting seat 10, and the gap between the waterproof cover 40 and the water collecting seat 10 is 5mm~10mm.

[0068] Since the waterproof cover 40 needs to be raised and lowered inside the water collecting seat 10, the outer diameter of the waterproof cover 40 is smaller than the inner diameter of the outer cylinder of the water collecting seat 10, so that the waterproof cover 40 can move freely up and down inside the outer cylinder of the water collecting seat 10. However, if the gap between the waterproof cover 40 and the water collecting seat 10 is too large, it will affect the ventilation effect inside the water collecting seat 10. The ventilation inside the water collecting seat 10 is made to draw as much clean air as possible from the top of the wafer into the space between the wafer and the waterproof cover, so as to prevent the atomized liquid generated by liquid splashing from moving upward with the air flow and falling above the wafer.

[0069] Therefore, the gap between the waterproof cover 40 and the water collecting seat 10 is 5mm~10mm. Within this range, radial movement space is provided for the waterproof cover 40 to avoid rigid contact with the outer cylinder of the water collecting seat 10, ensuring smooth lifting and lowering movement. At the same time, it prevents excessive diffusion of the exhaust airflow. The negative pressure difference formed during exhaust causes the air to flow from the outside to the inside of the gap, forming a self-seal, and external dust-containing gas cannot enter the interior of the waterproof cover 40 through the gap.

[0070] The gap between the waterproof cover 40 and the water collecting seat 10 may be 5 mm, 7.5 mm or 10 mm, which is not limited in this application.

[0071] In some embodiments, as Figure 8 and Figure 9 As shown, the support member 31 includes a rotating disk 311 and a rotating shaft 312 arranged at the bottom of the rotating disk 311. The rotating disk 311 is used to place the wafer. The rotating shaft 312 is rotatably assembled in the fixed sleeve 12. The bottom of the rotating disk 311 is located at the upper periphery of the rotating shaft 312 and is provided with a protective cover 313. The bottom of the protective cover 313 is lower than the top of the sliding sleeve 22.

[0072] During the high-speed rotation and drying process of the wafer, deionized water and chemical liquid will be thrown out along the edge of the rotating disk 311. The bottom of the protective cover 313 is lower than the top of the sliding sleeve 22, forming a labyrinth sealing structure, which effectively prevents the splashing liquid from entering the interior of the fixed sleeve 12. A bearing seat is provided in the fixed sleeve 12, and the rotating shaft 312 is assembled on the bearing seat through the bearing rotation, which reduces the erosion of the bearing grease by the liquid, reduces the risk of bearing corrosion, and extends the life of the transmission system.

[0073] The relative motion between the rotating shaft 312 and the fixed sleeve 12 can generate friction particles. The protective cover 313 acts as a physical barrier, preventing these particles from rising with the airflow and contaminating the wafer surface. This reduces the particle defect rate on the wafer surface and improves chip manufacturing yield. During high-speed rotation, the protective cover 313 guides the airflow along its outer surface, forming an annular airflow barrier that reduces turbulence beneath the wafer, prevents liquid residue caused by airflow disturbances, and improves drying uniformity.

[0074] In some embodiments, as Figure 1 and Figure 9 As shown, the rotating disk 311 is provided with a plurality of extensions 3111 along the circumference of its rotation center, each extension 3111 is provided with a wafer seat 33 for placing wafers, and there are a plurality of clamping members 32 which are movably arranged on the corresponding wafer seats 33 .

[0075] The rotating disk 311 is driven by the rotating shaft 312 to achieve circular motion. Multiple extension parts 3111 are arranged circumferentially. A wafer seat 33 is set at the end of each extension part 3111 to form a multi-station layout. Multiple wafer seats 33 are used to support wafers at the same time. Each wafer seat 33 is equipped with a clamping part 32, which can clamp and release the wafer radially from multiple directions.

[0076] Since multiple extension portions 3111 are arranged at intervals, an open space is formed at the bottom of the wafer. Under the action of centrifugal force, the liquid can be discharged directly downward along the edge of the wafer. The heat generated by the high-speed rotation of the wafer during drying and the heat carried by the drying gas can be quickly dissipated through the open space at the bottom of the wafer.

[0077] In some embodiments, as Figure 10 As shown, a mounting groove 331 is provided on one side of the wafer base 33 away from the rotation center, and the clamping member 32 is rotatably assembled in the mounting groove 331. The clamping member 32 includes a clamping claw 321, which extends out of the mounting groove 331. Multiple clamping claws 321 are used to clamp the periphery of the wafer at the same time.

[0078] Jaws 321 simultaneously clamp at multiple points around the periphery, utilizing the principle of circumferential force balance for self-centering, ensuring the wafer is concentric with the center of rotation. Jaws 321 are connected to mounting slots 331 via a rotating shaft, allowing for quick removal and replacement without requiring complex calibration. During high-speed rotation, liquid on the surface of jaws 321 flows through the mounting slots 331, without affecting the gripping effect. Furthermore, jaws 321 extend from the mounting slots 331, with the rotating portion located within the slot, conserving space and resulting in a compact design.

[0079] In some embodiments, as Figure 10As shown, the wafer seat 33 is provided with a boss 332 , which is located in the same straight line as the clamping claw 321 along the radial direction of the rotating disk 311 . The boss 332 is provided with a plurality of horizontal hydrophobic grooves 3321 that pass through the upper surface of the boss 332 .

[0080] Placing the wafer on the boss 332 of the wafer holder 33 further reduces the contact area with the wafer, increasing the bottom space of the wafer and facilitating spin drying. The boss 332 is provided with multiple horizontal hydrophobic grooves 3321 that extend through the upper surface of the boss 332. The hydrophobic grooves 3321 can promptly drain liquid between the contact surface of the wafer and the boss 332. When the rotating disk 311 rotates at high speed, the residual liquid on the wafer surface is thrown toward the edge by centrifugal force. The hydrophobic grooves 3321 of the boss 332 serve as drainage channels, guiding the liquid to be quickly discharged radially through the groove body. The boss 332 and the clamping jaws 321 are radially collinear, forming a radial constraint force between the boss 332 support and the clamping jaws 321, suppressing radial displacement of the wafer during high-speed rotation.

[0081] In some embodiments, as Figure 10 As shown, the clamping jaw 321 has a clamping surface 3211 facing the rotation center. The clamping surface 3211 is tilted, and the upper end of the clamping surface 3211 is closer to the rotation center than the lower end of the clamping surface 3211.

[0082] The upper end of the inclined clamping surface 3211 is closer to the rotation center relative to the lower end of the clamping surface 3211, so that after the clamping claw 321 is clamped, the part of the clamping claw 321 located on the upper side of the wafer is closer to the rotation center, and the wafer can no longer move upward. When the rotating disk 311 accelerates, the wafer generates centrifugal force due to inertia, and the inclined clamping surface 3211 will be decomposed into a downward force along the inclined surface and a positive pressure squeezing the clamping surface 3211. The vertical component presses the wafer down to the boss 332, and with the support of the hydrophobic groove 3321, the axial jump of the wafer during high-speed rotation can be suppressed.

[0083] In some embodiments, as Figure 10 As shown, each wafer seat 33 is provided with two guide posts 333 , which are respectively located on both sides of the assembly groove 331 . The guide posts 333 are used to guide the wafer to be placed on the boss 332 .

[0084] Wafers are often very fragile and expensive, and any scratches, wear, or cracks on their surfaces can render them scrapped or degrade their performance. Guide pins 333 provide a clear guide path for the wafer, enabling more precise placement of the wafer on boss 332. This helps ensure the wafer is positioned correctly during processing or handling, reducing process issues or product quality degradation caused by positional deviations. Guide pins 333 prevent the wafer from colliding or rubbing against other components during placement, thereby reducing the risk of damage to the wafer surface.

[0085] In some embodiments, as Figure 10 As shown, the surface of the wafer seat 33 near the rotation center forms two inclined surfaces 334 , which are symmetrically arranged along the first direction. The connection between the two inclined surfaces 334 is closer to the rotation center than other positions of the inclined surfaces 334 .

[0086] During the semiconductor manufacturing process, residual liquid can carry impurities or contaminants. If this accumulates on the front bottom of wafer holder 33, it could contact the wafer during subsequent processing, contaminating the wafer surface and affecting wafer performance and quality. The two inclined surfaces 334 allow liquid to be ejected along the slopes during rotation, effectively preventing liquid accumulation and reducing the risk of wafer contamination, thereby improving product yield.

[0087] Moreover, if liquid accumulates at the bottom of the wafer seat 33, it may affect the stability of the wafer during rotation, causing slight changes in the position of the wafer during processing, and further affecting the stability and consistency of the process. The design of the two inclined surfaces 334 allows the liquid to be thrown out along the inclined surfaces during rotation, which can ensure that the wafer seat 33 remains in a relatively stable state during rotation, helping to improve the repeatability of the process and the consistency of product quality.

[0088] In some embodiments, as Figure 11 and Figure 12 As shown, the clamping member 32 has an abutting portion 335, and the waterproof cover 40 has an unlocking portion 42. Along the first direction, the unlocking portion 42 and the abutting portion 335 are arranged opposite to each other, and the unlocking portion 42 is located above the abutting portion 335. When the unlocking portion 42 abuts against the abutting portion 335, the unlocking portion 42 can drive the clamping member 32 to rotate so that the clamping claw 321 moves in a direction away from the rotation center.

[0089] Through the relative arrangement of the unlocking portion 42 and the abutting portion 335, the unlocking portion 42 is located above the abutting portion 335. When the two are in abutment, the downward pressure or displacement of the unlocking portion 42 can drive the clamping member 32 to rotate, so that the clamping jaws 321 are automatically opened (away from the rotation center). No additional power source is required, and the unlocking can be triggered by lowering the waterproof cover 40, reducing the complexity and cost of the automation equipment.

[0090] Because the waterproof cover 40 needs to be raised and lowered within the water collection base 10, the clamping jaws 321 must be in a clamping position when rising and open and unlocked when descending. Therefore, the raising and lowering of the waterproof cover 40 is linked to the opening and closing of the clamping jaws 321, allowing the wafer to be released and the descent of the waterproof cover 40 to be completed simultaneously. Furthermore, the unlocking portion 42 and the abutting portion 335 are arranged relative to each other along a first direction (vertical direction), occupying little radial space within the device, resulting in a compact and space-saving structure.

[0091] In some embodiments, as Figure 12 and Figure 13 As shown, a clamping driving member 80 is provided between the clamping member 32 and the supporting member 31 , and the clamping driving member 80 is used to provide a force to the clamping member 32 toward the clamping position.

[0092] The clamping driver 80 continuously applies force to the clamping member 32, keeping the clamping jaws 321 in a constant position toward the center of rotation. When a wafer is placed on the boss 332, the force applied by the clamping driver 80 allows the clamping jaws 321 to cling tightly to the wafer edge. Even if there are slight dimensional tolerances within the wafer, the clamping driver 80 automatically compensates for these gaps, preventing the wafer from wobbling or falling during rotation or transport.

[0093] By providing continuous force through the clamping drive 80, the clamping member 32 can maintain a stably clamped state after the waterproof cover 40 is detached, avoiding the problem of insufficient stability caused by traditional gravity clamping relying on the gravity characteristics. When the wafer rotates at high speed, the force applied by the clamping drive 80 ensures that the clamping member 32 fits tightly to the periphery of the wafer, effectively balancing the centrifugal force, preventing the wafer from being thrown out, significantly reducing the risk of wafer damage due to unstable clamping, and ensuring the safety of the drying process.

[0094] In some embodiments, as Figure 12 and Figure 13 As shown, a driving member mounting hole 31111 is provided on the side of the extension portion 3111 away from the rotation center, a push rod 31112 is provided in the driving member mounting hole 31111, and the clamping driving member 80 is provided between the push rod 31112 and the driving member mounting hole 31111, and the reset force of the clamping driving member 80 is used to push the push rod 31112 toward the clamping member 32 to keep the clamping member 32 in the clamping position.

[0095] The clamping drive 80 maintains the clamping member 32 in the clamping position through the push rod 31112, which can ensure the position accuracy of the clamping member 32. Since the drive member mounting hole 31111 plays a positioning role on the push rod 31112, the movement direction of the push rod 31112 is stabilized, thereby ensuring that the clamping member 32 can accurately return to the preset clamping position during the resetting process, thereby improving the consistency and accuracy of wafer clamping.

[0096] The drive member mounting hole 31111 provides a stable mounting structure for the push rod 31112 and the clamping drive member 80, making the mechanical transmission of the entire clamping assembly 30 more stable. The push rod 31112 is constrained in the drive member mounting hole 31111 and is not prone to shaking or offset. It can more reliably transmit the force of the clamping drive member 80 to the clamping member 32, reducing the situation where the clamping member 32 accidentally loosens due to structural instability, and improving the stability and reliability of the equipment operation.

[0097] The clamping drive 80 automatically keeps the clamping member 32 in the clamping position, eliminating the need for the operator to manually adjust the position of the clamping member 32 after each operation, reducing manual operation steps, lowering the probability of operational errors caused by human factors, and improving the degree of automation and efficiency of the wafer loading and unloading and processing process.

[0098] In some embodiments, as Figure 12 and Figure 13 As shown, the drive member mounting hole 31111 is a stepped countersunk hole, which corresponds to the clamping member 32. The push rod 31112 has a push rod head 311121 protruding from the stepped countersunk hole. The diameter of the push rod head 311121 is larger than the outer diameter of the rod body of the push rod 31112. The clamping drive member 80 is a second spring 81, which is sleeved on the push rod 31112. One end of the second spring 81 abuts against the push rod head 311121, and the other end of the second spring 81 abuts against the stepped surface 31111a of the stepped countersunk hole.

[0099] When the unlocking portion 42 abuts the abutting portion 335, the unlocking portion 42 can drive the clamping member 32 to rotate, causing the push rod 31112 to continue to move toward the stepped countersunk hole and placing the clamping jaw 321 in the unlocked position. When the unlocking portion 42 moves away from the clamping member 32, the second spring 81 returns to its original position, and the push rod head 311121 pushes the clamping member 32 to maintain the clamping member 32 in the clamped position. The second spring 81 is sleeved on the push rod 31112 and installed using the stepped countersunk hole. This structural design makes the layout of the entire clamping mechanism more compact and takes up less space.

[0100] The stepped countersunk hole provides a precise installation position and movement guide for the push rod 31112, ensuring that the push rod 31112 can only move along the axis of the stepped countersunk hole. The stepped surface 31111a of the stepped countersunk hole provides a stable support and positioning point for the second spring 81. One end of the second spring 81 abuts the stepped surface 31111a, and the other end abuts the push rod head 311121. This allows the spring to maintain a stable posture during compression and reset, and is not prone to tilting or deflection. This ensures that the spring force can be accurately transmitted to the push rod 31112 and the clamping member 32, effectively realizing the reset function of the clamping member 32. At the same time, this structure also facilitates the installation and replacement of the spring, reducing the difficulty of equipment maintenance.

[0101] The diameter of the push rod head 311121 is larger than the outer diameter of the rod body, forming a shoulder structure that provides a mounting point for the second spring 81. When the second spring 81 is compressed and reset, the push rod head 311121 can better withstand the spring force and evenly transmit the force to the clamping member 32. Through the cooperation between the unlocking portion 42 and the abutting portion 335, when the unlocking portion 42 abuts the abutting portion 335, it can drive the clamping member 32 to rotate, causing the push rod 31112 to move into the stepped countersunk hole, thereby unlocking the clamping jaws 321. When the unlocking portion 42 moves away from the clamping member 32, the second spring 81 resets and pushes the push rod head 311121, causing the clamping member 32 to return to the clamping position, thereby achieving flexible control over the unlocking and clamping states of the clamping jaws 321.

[0102] In other embodiments, the clamping drive 80 may also be a tension spring, which is arranged between the wafer seat and the clamping member. When the clamping member 32 rotates from the clamping position to the unlocking position, the tension spring is stretched and accumulates elastic force. When the constraint is released (the waterproof cover is detached), the tension spring contracts and drives the clamping member 32 to return to the clamping position.

[0103] In some embodiments, as Figure 10 As shown, the rotation center of the clamping member 32 and the center of gravity of the clamping member 32 are located at the same position, so that the force of the clamping member 32 to clamp the wafer only comes from the action force of the clamping drive member 80, that is, when the support member 31 rotates, the force of the clamping member 32 to clamp the wafer is always stable.

[0104] During the rotation of the clamping member 32 around its rotation center, if the rotation center and the center of gravity do not coincide, the clamping member 32's own gravity will generate an additional torque. This torque may fluctuate with the rotation angle of the clamping member 32, thereby interfering with the stability of the force provided by the clamping driver 80. However, when the two positions coincide, gravity does not generate additional torque, and the force applied to the clamping member 32 during rotation is simpler. When the clamping member 32 switches to the clamping position, the force applied by the clamping driver 80 acts evenly on the periphery of the wafer, avoiding instability caused by gravitational torque interference. This reduces the risk of minor wafer displacement caused by fluctuations, especially when the wafer rotates at high speeds.

[0105] The clamping member 32 rotates when switching between the unlocked and clamped states. If the center of rotation deviates from the center of gravity, a significant centrifugal inertial force is generated during movement, potentially causing uneven rotation or hysteresis in the clamping member 32. When the center of rotation and the center of gravity coincide, the clamping member 32's rotational inertia is more evenly distributed, allowing it to respond more quickly to changes in external force when the waterproof cover 40 engages or disengages, reducing operational delays.

[0106] Furthermore, in some embodiments, Figure 11 As shown, a compensation hole 322 is provided on the clamping member 32 so that the rotation center of the clamping member 32 and the center of gravity of the clamping member 32 are located at the same position.

[0107] During the manufacturing process, the clamping member 32 may experience misalignment between its center of gravity and the intended rotational center due to uneven material density and structural asymmetry (such as local protrusions and holes). Compensation holes 322 can adjust the center of gravity by removing excess material from the clamping member 32. If the center of gravity is biased to one side, a compensation hole 322 can be opened on the corresponding side to reduce mass, or a hole can be opened on the opposite side to reduce weight and balance torque, ultimately ensuring that the center of gravity is precisely aligned with the rotational center.

[0108] After the center of rotation coincides with the center of gravity, the force exerted on the wafer by the clamping member 32 during rotation is smoother and the stress distribution is more uniform, which can reduce mechanical wear and fatigue damage, reduce the maintenance frequency and replacement cost of the clamping assembly 30, and ensure the dynamic balance of the clamping member 32, reduce the vibration source during rotation, and reduce the overall vibration amplitude and noise level of the equipment, providing a more stable operating environment for wafer drying, and indirectly ensuring the consistency of the drying process and the chip yield.

[0109] In some embodiments, as Figure 12 and Figure 13 As shown, the wafer drying device further includes a detection sensor 90 , and the clamping member 32 has an overlapping portion with the emitting end 91 of the detection sensor 90 when in the clamping position, and the clamping member 32 avoids the emitting end 91 of the detection sensor 90 when in the unlocking position.

[0110] By detecting the overlap and avoidance relationship between the sensor 90 and the clamping member 32 at different positions, it is possible to accurately determine whether the clamping member 32 is in the clamping position or the unlocking position, which helps to ensure that the equipment operates according to the predetermined procedure and avoid process errors or equipment damage caused by misjudgment of the clamping status.

[0111] During the wafer drying process, accurately knowing whether the wafer is clamped correctly is the key to ensuring process quality. The detection sensor 90 can provide real-time feedback on the status of the clamping member 32. Once a clamping abnormality is detected, such as the clamping member 32 is not in the correct clamping position, the equipment can immediately stop running or issue an alarm, thereby preventing the wafer from shifting or falling during the drying process, thereby improving the reliability and stability of the entire process and reducing the defective rate caused by wafer clamping problems.

[0112] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A wafer drying device, characterized in that: include: A water collecting seat, the water collecting seat having an accommodating cavity, wherein a fixing sleeve is provided in the accommodating cavity; A lifting seat, the lifting seat being sleeved on the outer circumference of the fixed sleeve and slidably arranged relative to the fixed sleeve, forming a closed space between the lifting seat and the fixed sleeve, and the closed space being connected to an external air source so that the lifting seat can be raised and lowered by changes in air pressure in the closed space; A waterproof cover is fixedly connected to the lifting seat so as to rise and fall with the lifting seat.

2. The wafer drying device according to claim 1, wherein: The lifting seat includes a sliding sleeve, the inner wall of the sliding sleeve has a first annular groove, and / or the outer wall of the fixed sleeve has a second annular groove, so that the enclosed space is formed between the sliding sleeve and the fixed sleeve.

3. The wafer drying device according to claim 2, wherein: The inner wall of the sliding sleeve has a first annular groove, and the outer wall of the fixed sleeve has a second annular groove. The inner wall of the sliding sleeve is located above the first annular groove and is provided with a first sealing ring, and the outer wall of the fixed sleeve is located below the second annular groove and is provided with a second sealing ring. The first sealing ring, the second sealing ring, the first annular groove and the second annular groove together form the enclosed space.

4. The wafer drying device according to claim 1, wherein: The enclosed space is configured such that the lifting seat can move in a direction away from the water collecting seat when the air pressure in the enclosed space increases.

5. The wafer drying device according to any one of claims 1 to 4, characterized in that: A first restoring member is provided between the lifting seat and the water collecting seat, and the first restoring member is used to provide a restoring force for the lifting seat to move toward the water collecting seat.

6. The wafer drying device according to claim 5, characterized in that: The lifting seat is provided with a guide hole, and the wafer drying device further comprises a guide member, which is passed through the guide hole so that the lifting seat moves under the resetting force of the first resetting member.

7. The wafer drying device according to claim 6, characterized in that: The lifting seat is provided with a lifting flange, and the flange hole of the lifting flange is formed as the guide hole; The guide member is a limit screw, which passes through the flange hole of the lifting flange and is fixed to the bottom of the water collecting seat. The limit screw is provided with a limit sleeve with an opening facing downward. The first reset member is a first spring, which is sleeved on the limit screw and partially located in the limit sleeve. One end of the first spring abuts against the lifting flange, and the other end of the first spring abuts against the bottom wall of the limit sleeve.

8. The wafer drying device according to claim 2 or 3, characterized in that: The lifting seat further comprises a support arm arranged on the outer periphery of the sliding sleeve, and the waterproof cover is fixed on the support arm via a connecting piece.

9. The wafer drying device according to claim 8, characterized in that: There are multiple support arms, and the multiple support arms are evenly arranged around the outer circumference of the sliding sleeve. The support arms are provided with mounting grooves, and the bottom edge of the waterproof cover is inserted into the mounting grooves. The side wall of the waterproof cover is provided with a plug-in hole. The connecting piece is fixed to the support arm and plugged into the plug-in hole to fix the waterproof cover and the support arm.

10. The wafer drying device according to any one of claims 1 to 4, characterized in that: The cover body of the waterproof cover is a cylindrical structure with two ends open, and the upper diameter of the cylindrical structure gradually decreases relative to the lower diameter.

11. The wafer drying device according to claim 10, wherein: The water collecting seat comprises an outer cylinder, and the outer diameter of the waterproof cover is smaller than the inner diameter of the outer cylinder of the water collecting seat.

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