Molded electronic component having metal ring embedded in molding compound

Abstract

A molded electronic component includes a molding compound, a die assembly, a plurality of metal rings, and a metal body. The die assembly includes a semiconductor die attached to a substrate. The die assembly is at least partially embedded in the molding compound. A plurality of metal loops are embedded in the molding compound and attached to the die assembly. The metal body is partially embedded in the molding compound and has a first surface exposed from the molding compound. Wherein the metal body is attached to each of the plurality of metal rings at a second surface of the metal body opposite the first surface.

Description

Background Art

[0001] Molded electronic components offer many advantages, such as the ability to incorporate complex chip layouts (e.g., system-in-package (SiP) designs) and provide these as single components that can be built into modules, systems, and other assemblies. A molded electronic component includes one or more semiconductor dies disposed on one or more substrates (such as a lead frame) and embedded in a molding compound. External component terminals may be disposed on one or more surfaces of the molding compound by a metal body (e.g., a copper or aluminum clip) that is electrically coupled to the terminals of the semiconductor die and / or substrate by bonding wires, metal ribbons, or other members. As the layout complexity of these molded electronic components increases and their size decreases, proper alignment of the component terminals may become increasingly critical to ensuring that the molded electronic components can be reliably integrated into modules, systems, assemblies, and the like, and may be associated with tighter alignment tolerances that increase manufacturing complexity and / or cost.

[0002] Therefore, a solution is needed to increase the alignment tolerance of component terminals when manufacturing molded electronic components. Summary of the Invention

[0003] According to an embodiment of a molded electronic component, the molded electronic component includes: a mold compound; a die assembly including a semiconductor die attached to a substrate, the die assembly being at least partially embedded in the mold compound; a plurality of metal rings embedded in the mold compound and attached to the die assembly; and a metal body partially embedded in the mold compound and having a first surface exposed from the mold compound, wherein the metal body is attached to each of the plurality of metal rings at a second surface of the metal body opposite the first surface.

[0004] According to an embodiment of a power electronic assembly, the power electronic assembly includes: a printed circuit board; a molded electronic component, which is embedded in the printed circuit board and includes: a molding compound; a die assembly, which includes a semiconductor die attached to a substrate, the die assembly being at least partially embedded in the molding compound; a plurality of metal rings, which are embedded in the molding compound and attached to the die assembly; and a metal body, which is partially embedded in the molding compound and has a first surface exposed from the molding compound, wherein the metal body is attached to each of the plurality of metal rings at a second surface of the metal body opposite to the first surface; and an electronic device, which is electrically connected to the molded electronic component through the printed circuit board.

[0005] According to a method of manufacturing a molded electronic component, the method of manufacturing a molded electronic component includes: attaching a semiconductor die to a substrate to form a die assembly; attaching a plurality of metal rings to the die assembly; attaching a first surface of a metal body to each of the plurality of metal rings; enclosing the die assembly, the plurality of metal rings, and the metal body in a mold so that the mold presses the metal bodies and the die assembly toward each other and compresses the plurality of metal rings; and injecting a liquefied molding compound into the mold.

[0006] Those skilled in the art will recognize additional features and advantages upon reading the following detailed description, and upon viewing the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] The elements of the drawings are not necessarily drawn to scale relative to each other. Like reference numerals indicate corresponding similar components. The features of the various illustrated embodiments may be combined unless they exclude each other. The embodiments are depicted in the drawings and described in detail in the following description.

[0008] Figure 1A A perspective view of a molded electronic component according to an embodiment is shown.

[0009] Figure 1B A perspective view of a molded electronic component according to an embodiment is shown.

[0010] Figure 2 A side cross-sectional view of a molded electronic component according to an embodiment is shown.

[0011] Figure 3 A side cross-sectional view of a molded electronic component according to an embodiment is shown.

[0012] Figure 4 A side cross-sectional view of a molded electronic component according to an embodiment is shown.

[0013] Figure 5 A side cross-sectional view of a molded electronic component according to an embodiment is shown.

[0014] Figure 6 A side cross-sectional view of a molded electronic component according to an embodiment is shown.

[0015] Figure 7 A side cross-sectional view of a molded electronic component according to an embodiment is shown.

[0016] Figure 8 A side cross-sectional view of a molded electronic component according to an embodiment is shown.

[0017] Figures 9A to 9G A method of manufacturing a molded electronic component according to an embodiment is shown. DETAILED DESCRIPTION

[0018] A molded electronic component, such as a molded power semiconductor component, is described herein that has a higher tolerance for misalignment of component terminals during manufacturing than other similar molded electronic components. The higher tolerance is achieved by attaching and electrically coupling component terminals, such as provided by a metal body such as a clip, to a die assembly of the molded electronic component using a metal ring. The metal ring can be formed from a conductive wire such as a bonding wire, a metal ribbon, a fiber, or another elongated electrical conductor. The metal ring can be attached to a semiconductor die of the die assembly, a pad or trace on a substrate (e.g., a lead frame) of the die assembly, leads, and / or other features of the die assembly of the molded electronic component.

[0019] In some examples, using a metal ring to attach component terminals to a die assembly of a molded electronic component can increase the vertical alignment tolerance of the component terminals during the manufacture of the molded electronic component. Specifically, the metal ring is flexible, and a vertical force (such as a force applied to the component terminals by one or more surfaces of a molding tool before dispensing liquefied molding compound to form the molding compound of the molded electronic component) can compress the metal ring in a manner that aligns the component terminals parallel to the surfaces of the molding tool and to each other, and any gaps between the component terminals and the surfaces of the molding tool can be eliminated. The liquefied molding compound can then be dispensed to form the molding compound, while the component terminals are aligned under the force of the surfaces of the molding tool so that the surfaces of the component terminals are flush with the surface of the molding compound. That is, any vertical misalignment of the component terminals that existed before the molding compound was formed can be reduced or eliminated during the formation of the molding compound, thereby potentially enabling component designs with higher complexity and / or finer critical dimensions without significantly increasing manufacturing complexity and / or cost.

[0020] Exemplary embodiments of a molded electronic component and a method of manufacturing the molded electronic component are described next with reference to the accompanying drawings.

[0021] Figure 1A A perspective view of a molded electronic component 100 according to an embodiment is shown.

[0022] The molded electronic component 100 includes a die assembly 120 at least partially embedded in a molding compound 110. The molding compound is a plastic encapsulant typically formed from an organic resin such as an epoxy resin. The plastic encapsulant may include fillers such as non-melting inorganic materials. Catalysts may be used to accelerate the curing reaction of the organic resin. Other materials, such as flame retardants, adhesion promoters, ion traps, stress release agents, colorants, etc., may be appropriately added to the plastic encapsulant. The molding compound may be formed by injection molding, compression molding, film-assisted molding (FAM), reaction injection molding (RIM), resin transfer molding (RTM), blow molding, etc. Figure 1AOnly the outline of the mold compound 110 is shown in FIG. 1 so that the portion embedded in the mold compound 110 is visible.

[0023] The die assembly 120 includes one or more semiconductor dies (chips) 130 attached to a substrate 140. The semiconductor die 130 may include one or more devices, including transistors, diodes, resistors, capacitors, and / or other types of active or passive devices. In one embodiment, the semiconductor die 130 is a vertical power transistor die. For a vertical power transistor die, the primary current flow path is between the front side and the back side of the die 130 (along the Figure 1A The primary current flow path is along the front side of the die 130 (along the z-direction). For example, the drain pad may be located on the back side of the die, with the gate and source pads (and optionally one or more sense pads) located on the front side of the die. Alternatively, the semiconductor die 130 may be a lateral power transistor die. For a lateral power transistor die, the primary current flow path is along the front side of the die 130 (along the z-direction). Figure 1A x or y direction in .

[0024] In one embodiment, semiconductor die 130 is a SiC power MOSFET (metal oxide semiconductor field effect transistor) die. Alternatively, semiconductor die 130 may be a Si power MOSFET die, a HEMT (high electron mobility transistor) die, an IGBT (insulated gate bipolar transistor) die, a JFET (junction field effect transistor) die, or the like.

[0025] Semiconductor die 130 and / or its component devices may be arranged to form all or part of a power electronic circuit, such as a DC / AC inverter, a DC / DC converter, an AC / DC converter, a DC / AC converter, an AC / AC converter, a multiphase inverter, an H-bridge, a motor drive, etc. In some examples, the power electronic circuit including semiconductor die 130 is a half-bridge or full-bridge circuit. Substrate 140 may be a printed circuit board (PCB), a lead frame, or other substrate, such as an insulated metal substrate (IMS), a DCB (direct copper bonding) substrate, an AMB (active metal brazing), etc.

[0026] According to an embodiment, molded electronic component 100 includes a plurality of metal rings 150 embedded in mold compound 110 and attached to die assembly 120. The plurality of metal rings 150 can be attached to semiconductor die 130 (e.g., contact pads of semiconductor die 130), substrate 140 (e.g., contact pads, traces, etc. of substrate 140), and / or another feature of molded electronic component 100 (e.g., lead terminals). The plurality of metal rings 150 can be formed from a wire such as a bonding wire, a metal ribbon, a fiber, and / or another elongated electrical conductor. The wire, metal ribbon, fiber, and / or another elongated electrical conductor can include copper, aluminum, another metal or metal alloy, and / or another suitable conductive material.

[0027] The molded electronic component 100 includes a metal body 160 (eg, a copper or aluminum clip) partially embedded in the mold compound 110. Each metal body 160 has a first surface 160 exposed from the mold compound 110. S1 The metal body 160 is connected to the first surface 160 of the corresponding metal body 160. S1 The metal bodies 160 are attached to each of the plurality of metal rings 150 at a second surface of the opposed respective metal bodies 160. The metal bodies 160 can be attached to each of the plurality of metal rings 150 by a laser weld joint, an adhesive, a glue, a solder joint, and / or other attachment means. The plurality of metal rings 150 electrically couples each of the metal bodies 160 to a feature of the die assembly 120 (e.g., the semiconductor die 130, a trace of the substrate 140 electrically coupled to the semiconductor die 130), wherein one or more of the metal bodies 160 form a component terminal (e.g., a source terminal, an emitter terminal, a drain terminal, a collector terminal, a gate terminal, an anode terminal, a cathode terminal, etc.) of the molded electronic component 100.

[0028] In some examples, attaching the metal body 160 to the die assembly 120 using a plurality of metal rings 150 as described herein can increase the vertical alignment tolerance of the metal body 160 during the manufacture of the molded electronic component 100. Specifically, the plurality of metal rings 150 are flexible, and vertical forces (such as those applied to the metal body 160 by one or more surfaces of a molding tool before dispensing liquefied molding compound to form the molding compound 110) can compress the plurality of metal rings 150 in a manner that aligns the metal body 160 parallel to the surfaces of the molding tool and to each other, and can eliminate any gaps between the metal body 160 and the surfaces of the molding tool. The metal rings 150 can also be not only flexible but also resilient, such that they act as springs against the vertical forces applied, for example, by the molding tool. This can ensure that the metal rings 150 remain in contact with the metal body 160 throughout the formation of the molding compound 110. The liquefied molding compound may then be dispensed to form the molding compound 110 while the metal body 160 is aligned under the force of the surface of the molding tool, thereby molding the first surface 160 of the metal body 160 of the electronic component 100. S1 flush with the surface of the mold compound 110. That is, any vertical misalignment of the metal body 160 that exists prior to forming the mold compound 110 may be reduced or eliminated during formation of the mold compound 110, potentially enabling component designs with higher complexity and / or finer critical dimensions.

[0029] Figure 1B Shown Figure 1AA perspective view of a molded electronic component 100 is shown in FIG. 1 , wherein the mold compound 110 and the metal body 160 are omitted to illustrate the arrangement of the plurality of metal rings 150 . Figure 1B In the example, on the surface 120 of the die assembly 120 S 1 , a plurality of metal rings 150 are arranged in a plurality of rows 151 of metal rings 150. Some of the plurality of metal rings 150 are arranged on semiconductor die 130, while other metal rings of the plurality of metal rings 150 are arranged on substrate 140. Other arrangements of the plurality of metal rings 150 are contemplated (e.g., a clustered arrangement, a radial arrangement, a linear arrangement, an arrangement in which all of the plurality of metal rings 150 are arranged on semiconductor die 130 or substrate 140, etc.).

[0030] Figure 2 A side cross-sectional view of a molded electronic component 100 according to an embodiment is shown. Figure 2 One example of the molded electronic component 100 of FIG. 1 is shown and may include features of other examples described herein.

[0031] Figure 2 The plurality of metal rings 150 of the molded electronic component 100 includes a first plurality of metal rings 1501 and a second plurality of metal rings 1502, each of which is embedded in the mold compound 110 and attached to the die assembly 120. In this example, the first plurality of metal rings 1501 is attached to the semiconductor die 130, and the second plurality of metal rings 1502 is attached to the substrate 140. Other arrangements are contemplated, such as arrangements in which both the first plurality of metal rings 1501 and the second plurality of metal rings 1502 are attached to the semiconductor die 130 and / or the substrate 140.

[0032] First plurality of metal rings 1501 is formed from an elongated electrical conductor 1521 that is attached to die assembly 120 at a plurality of locations 153 along a length L of elongated electrical conductor 1521. Second plurality of metal rings 1502 is formed from discrete segments 154 of elongated electrical conductor 1522. Each segment 154 of elongated electrical conductor 1522 includes a first end 1541 and a second end 1542 that are attached to die assembly 120 at a plurality of locations, such as by wire bonding or solder. In this example, segments 154 are attached to substrate 140. In other examples, one or both of first end 1541 and second end 1542 of one or more of segments 154 can be attached to semiconductor die 130. Each of elongated electrical conductors 1521 and 1522 can be a conductive wire such as a bonding wire, a metal ribbon, a fiber, or another elongated electrical conductor.

[0033] In this example, the metal body 160 is located between the metal body 160 and the first surface 160. S1 The opposite second surface 160S2 The metal body 160 is attached to each of the first plurality of metal rings 1501 and the second plurality of metal rings 1502. The metal body 160 can be attached to each of the first plurality of metal rings 1501 and the second plurality of metal rings 1502 by a laser weld joint, an adhesive, glue, a weld joint and / or another attachment method.

[0034] Figure 3 A side cross-sectional view of a molded electronic component 100 according to an embodiment is shown. Figure 3 One example of the molded electronic component 100 of FIG. 1 is shown and may include features of other examples described herein.

[0035] exist Figure 3 In the example of molded electronic component 100, each of the plurality of metal rings 150 is attached to die assembly 120 at a location on contact pad 132 (e.g., metal pad) of semiconductor die 130. Contact pad 132 forms terminal 135 of semiconductor die 130. First surface 160 of metal body 160 exposed from mold compound 110 is S1 By attaching to the second surface 160 of the metal body 160 S2 The plurality of metal rings 150 redistribute the terminals 135 of the semiconductor die 130 into the terminals 105 of the molded electronic component 100. The metal body 160 may be larger, for example, having a larger surface area than the contact pads 132, such as Figure 3 As shown. This can be advantageous because the resulting molded electronic component has an increased contact surface that facilitates connection and assembly. In examples where semiconductor die 130 includes a transistor (e.g., a MOSFET, an IGBT), the terminal 135 formed by contact pad 132 can be a load terminal of semiconductor die 130, such as a source terminal, a drain terminal, an emitter terminal, or a collector terminal, or another terminal of the transistor, such as a gate terminal.

[0036] Figure 4 A side cross-sectional view of a molded electronic component 100 according to an embodiment is shown. Figure 4 One example of the molded electronic component 100 of FIG. 1 is shown and may include features of other examples described herein.

[0037] Figure 4 Each of the plurality of metal rings 150 of the molded electronic component 100 is attached to the die assembly at a location on the substrate 140. The back side 130 of the semiconductor die 130 BThe terminal 137 on the substrate 140 is attached to the substrate 140 so that the substrate 140 is at the same electrical potential as the terminal 137. The terminal 137 can be electrically coupled to the plurality of metal rings 150, for example, by a trace, a pad, or another layer of the substrate 140 to which the plurality of metal rings 150 are attached. The first surface 160 of the metal body 160 exposed from the mold compound 110 S1 By attaching to the second surface 160 of the metal body 160 S2 The plurality of metal rings 150 redistribute the terminals 137 as the terminals 107 of the molded electronic component 100. In examples where the semiconductor die 130 includes a transistor (e.g., a MOSFET, an IGBT), the terminals 137 of the semiconductor die 130 may be a load terminal, such as a source terminal, a drain terminal, an emitter terminal, or a collector terminal, or another terminal of the transistor, such as a gate terminal.

[0038] Figure 5 A side cross-sectional view of a molded electronic component 100 according to an embodiment is shown. Figure 5 One example of the molded electronic component 100 of FIG. 1 is shown and may include features of other examples described herein.

[0039] Figure 5 The plurality of metal rings 150 of the molded electronic component 100 includes a first plurality of metal rings 1501 and a second plurality of metal rings 1502 . The first plurality of metal rings 1501 and the second plurality of metal rings 1502 are each embedded in the mold compound 110 and attached to the die assembly 120 .

[0040] Each metal ring in the first plurality of metal rings 1501 is attached to the die assembly 120 at a first terminal 235 of the die assembly 120. Each metal ring in the second plurality of metal rings 1502 is attached to the die assembly 120 at a second terminal 237 of the die assembly 120. In this example, the first terminal 235 of the die assembly 120 is a terminal of the semiconductor die 130. The first terminal 235 can be, for example, a load terminal of the semiconductor die 130 formed by the contact pad 132 of the semiconductor die 130. The second terminal 237 of the die assembly 120 is a terminal on the substrate 140. The second terminal 237 can be, for example, a load terminal such as Figure 4 The first and second terminals 235, 237 of the die assembly 120 are similar to the redistributed load terminals of the semiconductor die 130. Other arrangements of the first and second terminals 235, 237 of the die assembly 120 are contemplated, such as an arrangement in which the first and second terminals 235, 237 are both terminals of the semiconductor die 130, and an arrangement in which the first and second terminals 235, 237 are both terminals on the substrate 140.

[0041] Figure 5The molded electronic component 100 includes a first metal body 1601 and a second metal body 1602 each partially embedded in a mold compound 110. Each of the first metal body 1601 and the second metal body 1602 of FIG. 1 can be the metal body 160 of FIG. 1 or any other example described herein. The first metal body 1601 and the second metal body 1602 each have a first surface 160 exposed from the mold compound 110. 1,S1 and 160 2,S1 The first metal body 1601 is in contact with the first surface 160 of the first metal body 1601. 1,S1 The second surface 160 of the first metal body 1601 is opposite to 1,S2 The second metal body 1602 is attached to each metal ring in the first plurality of metal rings 1501. 2,S1 The second surface 160 of the second metal body 1602 is opposite 2,S2 Attached to each of the second plurality of metal rings 1502.

[0042] The first surface 160 of the first metal body 1601 exposed from the mold compound 110 1,S1 The first terminals 235 of the die assembly 120 are redistributed as the first terminals 205 of the molded electronic component 100. The first surface 160 of the second metal body 1602 exposed from the mold compound 110 2,S1 The second terminals 237 of the die assembly 120 are redistributed as the second terminals 207 of the molded electronic component 100 .

[0043] Figure 6 A side cross-sectional view of a molded electronic component 100 according to an embodiment is shown. Figure 6 One example of the molded electronic component 100 of FIG. 1 is shown and may include features of other examples described herein.

[0044] exist Figure 6In an example, molded electronic component die assembly 120 includes a second semiconductor die 230. Semiconductor die 230 may include one or more devices, including transistors, diodes, resistors, capacitors, and / or other types of active or passive devices. Examples of transistors in second semiconductor die 230 may include MOSFETs, IGBTs, and / or BJTs, among others. Semiconductor die 230 and / or its component devices may be arranged to form all or part of a power electronics circuit, such as a DC / AC inverter, a DC / DC converter, an AC / DC converter, a DC / AC converter, an AC / AC converter, a multiphase inverter, an H-bridge, a motor drive, and the like. In some examples, the power electronics circuit including semiconductor die 230 is a half-bridge or full-bridge circuit. In some examples, semiconductor die 130 and second semiconductor die 230 form all or part of a power electronics circuit. In this example, while second semiconductor die 230 is attached to the same substrate as semiconductor die 130, examples are contemplated in which semiconductor die 130 and second semiconductor die 230 are attached to different substrates.

[0045] In this example, the second terminal 237 of the die assembly 120 to which each of the second plurality of metal rings 1502 is attached is a terminal of the second semiconductor die 230. The second terminal 237 may be, for example, a load terminal of the second semiconductor die 230 formed by the contact pad 232 of the second semiconductor die 230. The first surface 160 of the second metal body 1602 exposed from the mold compound 110 2,S1 The second terminals 237 of the second semiconductor die 230 of the die assembly 120 are redistributed as the second terminals 207 of the molded electronic component 100 .

[0046] Figure 7 A side cross-sectional view of a molded electronic component according to an embodiment is shown. Figure 7 One example of the molded electronic component 100 of FIG. 1 is shown and may include features of other examples described herein.

[0047] Figure 7 The molded electronic component 100 includes a second die assembly 220 including a second semiconductor die 230 (eg, a second semiconductor die 230 attached to a second substrate 240). Figure 6 The second substrate 240 may be a printed circuit board (PCB), a lead frame, or other substrates, such as an insulated metal substrate (IMS), a DCB (direct copper bonding) substrate, an AMB (active metal brazing), etc.

[0048] The second plurality of metal rings 1502 are attached to the second die assembly 220 at the terminals 337 of the second die assembly 220. The first surface 160 of the second metal body 1602 exposed from the mold compound 110 is 2,S1 The terminals 337 of the die assembly 220 are redistributed as the second terminals 307 of the molded electronic component 110. Figure 6 An example of the second terminal 237, Figure 7 The terminals 337 of the second semiconductor die assembly 220 may be load terminals of the second semiconductor die 230 formed by the contact pads 232 . In other examples, the terminals 337 of the second die assembly 220 may be on the second substrate 240 .

[0049] Figure 8 A side cross-sectional view of a power electronics assembly 10 according to an embodiment is shown. The power electronics assembly 10 includes a printed circuit board 12, a molded electronic component 100, and electronic components 14 (e.g., a controller, another component such as a molded or frame-based electronic component, a gate driver, a chip, etc.). The molded electronic component 100 is embedded in the printed circuit board 12. The electronic components 14 are electrically connected to the molded electronic component 100 through the printed circuit board 12 (e.g., through metal traces 16). Figure 8 The molded electronic component 100 shown is Figure 3 The molded electronic component 100 may be any of the molded electronic components 100 described herein.

[0050] Figures 9A to 9G A method of manufacturing a molded electronic component according to an embodiment is shown. Figures 9A to 9G The method can be referred to Figures 1A to 8 An example of a molded electronic component is described below.

[0051] Figure 9A Semiconductor die 130 is shown attached to substrate 140 to form die assembly 120 . Figure 9B A plurality of metal rings 150 are shown attached to the die assembly 120. The metal rings 150 are shown with exaggerated height variations in the z-direction. Figure 9C The second surface 160 of the metal body 160 is shown S2 Attached to each of the plurality of metal rings 150 . Figure 9C Also shown is the vertical misalignment of the metal body 160 in the z-direction due to the height variation of the metal ring 150. A vertical force (e.g., in the z-direction) may be applied to the metal body 160 at this and / or later times to compress the metal ring 150 and align the metal body 160. Figure 9C Also shown is a laser 250 used to attach the metal body 160 to the metal ring 150 using a laser weld joint 155 . Figure 9DA top view showing the laser weld joint 155 perpendicular to the metal ring 150 is shown. Figure 9E The die assembly 120, the plurality of metal rings 150, and the metal body 160 are shown in a closed mold 210. The mold 210 presses the metal body 160 and the die assembly 120 toward each other, compressing the plurality of metal rings 150 so that the metal body 160 is aligned with the surface 210 of the mold 210. S parallel alignment and parallel alignment with each other, and eliminate the surface 160 of the metal body 160 S1 The surface 210 of the mold 210 S The pressure applied by the mold 210 to the metal body 160 (eg, in the z-direction) compresses the metal ring 150, thereby reducing or even eliminating height variations. Figure 9F The metal body 160 is shown on the surface 210 of the mold 210. S The liquefied molding compound 111 is injected into the mold 210 in an aligned manner under the action of the force. Figure 9G The molded electronic component 100 is shown after being removed from the mold 210. The surface 160 of the metal body 160 S1 The surface 110 of the molding compound 110 S That is, when forming the molding compound (e.g., Figure 9C The vertical misalignment of the metal body that existed before during the formation of the mold compound (e.g., Figure 9E and 9F (in) reduce or eliminate.

[0052] Although the present disclosure is not limited in this regard, the following numbered examples illustrate one or more aspects of the present disclosure.

[0053] Embodiment 1: A molded electronic component comprises: a molding compound; a die assembly comprising a semiconductor die attached to a substrate, the die assembly being at least partially embedded in the molding compound; a plurality of metal rings embedded in the molding compound and attached to the die assembly; and a metal body partially embedded in the molding compound and having a first surface exposed from the molding compound, wherein the metal body is attached to each of the plurality of metal rings at a second surface of the metal body opposite the first surface.

[0054] Example 2: A molded electronic component according to Example 1, wherein each of the plurality of metal rings is attached to the die assembly at a location on a contact pad of the semiconductor die, wherein the contact pad forms a load terminal of the semiconductor die, and wherein the first surface of the metal body exposed from the molding compound redistributes the load terminal of the semiconductor die as a terminal of the molded electronic component.

[0055] Example 3: The molded electronic component of Example 1, wherein each of the plurality of metal rings is attached to the die assembly at a location on the substrate, wherein a load terminal on the back side of the semiconductor die is attached to the substrate such that the substrate is at the same electrical potential as the load terminal, and wherein the first surface of the metal body exposed from the molding compound redistributes the load terminal as a terminal of the molded electronic component.

[0056] Embodiment 4: The molded electronic component of any of Examples 1 to 3, wherein at least some of the plurality of metal rings are formed from bond wires attached to the die assembly at multiple locations along the length of the bond wires.

[0057] Embodiment 5: The molded electronic component of any of Examples 1 to 4, wherein at least some of the plurality of metal rings are formed from discrete segments of bond wire, each segment including a first end and a second end attached to the die assembly at multiple locations.

[0058] Embodiment 6: The molded electronic component of any of Examples 1 to 5, wherein at least some of the plurality of metal rings are formed from a metal ribbon attached to the die assembly at multiple locations along the length of the metal ribbon.

[0059] Embodiment 7: The molded electronic component of any of Examples 1 to 6, wherein the metal body is attached to each of the plurality of metal rings by one of a laser weld joint, an adhesive, or a solder joint.

[0060] Embodiment 8: The molded electronic component of any of Examples 1 to 7, wherein the plurality of metal rings are arranged in a plurality of rows of metal rings on the surface of the die assembly.

[0061] Embodiment 9: The molded electronic component of any of Examples 1 to 8, wherein the plurality of metal rings is a first plurality of metal rings, and wherein the molded electronic component further comprises a second plurality of metal rings embedded in the mold compound and attached to the die assembly.

[0062] Embodiment 10: The molded electronic component of Example 9, wherein the metal body is attached to each of the second plurality of metal rings at a second surface of the metal body opposite the first surface.

[0063] Example 11: A molded electronic component according to Example 9, wherein the metal body is a first metal body, and wherein the molded electronic component further comprises a second metal body partially embedded in the molding compound and having a first surface exposed from the molding compound, wherein the second metal body is attached to each of the second plurality of metal rings at a second surface of the second metal body opposite to the first surface of the second metal body.

[0064] Example 12: The molded electronic component of Example 11, wherein each of the first plurality of metal rings is attached to the die assembly at a first load terminal of the die assembly, wherein the first surface of the first metal body exposed from the molding compound redistributes the first load terminal of the die assembly as a first terminal of the molded electronic component, wherein each of the second plurality of metal rings is attached to the die assembly at a second load terminal of the die assembly, and wherein the first surface of the second metal body exposed from the molding compound redistributes the second load terminal of the die assembly as a second terminal of the molded electronic component.

[0065] Example 13: The molded electronic component of Example 12, wherein the first load terminal of the die assembly is a load terminal of the semiconductor die.

[0066] Embodiment 14: The molded electronic component of Examples 12 or 13, wherein the second load terminal of the die assembly is a load terminal on the substrate.

[0067] Embodiment 15: The molded electronic component of Example 12 or 13, wherein the semiconductor die is a first semiconductor die, wherein the die assembly further comprises a second semiconductor die attached to the same or a different substrate, and wherein the second load terminal is a load terminal of the second semiconductor die.

[0068] Example 16: A molded electronic component according to any one of Examples 1 to 8, wherein the tube core assembly is a first tube core assembly, wherein the metal body is a first metal body, wherein the plurality of metal rings is a first plurality of metal rings, and wherein the molded electronic component further comprises: a second tube core assembly, wherein the second tube core assembly comprises a second semiconductor tube core attached to a second substrate; a second metal body, wherein the second metal body is partially embedded in the molding compound and has a first surface exposed from the molding compound; and a second plurality of metal rings, wherein the second plurality of metal rings are embedded in the molding compound and attached to the second tube core assembly, wherein the second metal body is attached to each of the second plurality of metal rings at a second surface of the second metal body opposite to the first surface of the second metal body.

[0069] Example 17: The molded electronic component of Example 16, wherein each of the first plurality of metal rings is attached to the first die assembly at a first load terminal of the die assembly, wherein the first surface of the first metal body exposed from the molding compound redistributes the first load terminal of the first die assembly as a first terminal of the molded electronic component, wherein each of the second plurality of metal rings is attached to the second die assembly at a second load terminal of the second die assembly, and wherein the first surface of the second metal body exposed from the molding compound redistributes the second load terminal of the second die assembly as a second terminal of the molded electronic component.

[0070] Embodiment 18: A power electronic assembly comprising: a printed circuit board; a molded electronic component embedded in the printed circuit board and comprising: a molding compound; a die assembly comprising a semiconductor die attached to a substrate, the die assembly being at least partially embedded in the molding compound; a plurality of metal rings embedded in the molding compound and attached to the die assembly; and a metal body partially embedded in the molding compound and having a first surface exposed from the molding compound, wherein the metal body is attached to each of the plurality of metal rings at a second surface of the metal body opposite to the first surface; and an electronic device electrically connected to the molded electronic component through the printed circuit board.

[0071] Embodiment 19: A method for manufacturing a molded electronic component, the method comprising: attaching a semiconductor die to a substrate to form a die assembly; attaching a plurality of metal rings to the die assembly; attaching a first surface of a metal body to each of the plurality of metal rings; enclosing the die assembly, the plurality of metal rings, and the metal body in a mold so that the mold presses the metal body and the die assembly toward each other and compresses the plurality of metal rings; and injecting a liquefied molding compound into the mold.

[0072] Terms such as "first", "second", etc. are used to describe various elements, regions, sections, etc., and are not intended to be limiting. Throughout the specification, the same terms refer to the same elements.

[0073] As used herein, the terms "having," "containing," "including," "comprising," and the like are open-ended terms that indicate the presence of stated elements or features, but do not preclude additional elements or features. The articles "a," "an," and "the" are intended to include the plural as well as the singular, unless the context clearly indicates otherwise.

[0074] Unless expressly stated otherwise, the expression "and / or" should be interpreted as including all possible combinations, both conjunctive and disjunctive. For example, the expression "A and / or B" should be interpreted as meaning only A, only B, or both A and B. Unless expressly stated otherwise, the expression "at least one of" should be interpreted in the same manner as "and / or." For example, the expression "at least one of A and B" should be interpreted as meaning only A, only B, or both A and B.

[0075] It will be understood that the features of the various embodiments described herein may be combined with each other, unless specifically stated otherwise.

[0076] Although specific embodiments have been shown and described herein, it will be understood by those skilled in the art that various alternative and / or equivalent implementations may be substituted for the specific embodiments shown and described without departing from the scope of the present invention. This application is intended to cover any modifications or variations of the specific embodiments discussed herein. Accordingly, the present invention is limited only by the claims and their equivalents.

Claims

1. A molded electronic component comprising: molding compounds; a die assembly comprising a semiconductor die attached to a substrate, the die assembly being at least partially embedded in the mold compound; a plurality of metal rings embedded in the mold compound and attached to the die assembly; as well as a metal body partially embedded in the mold compound and having a first surface exposed from the mold compound, The metal body is attached to each of the plurality of metal rings at a second surface of the metal body opposite to the first surface.

2. The molded electronic component according to claim 1, in, each of the plurality of metal rings is attached to the die assembly at a location over a contact pad of the semiconductor die, wherein the contact pads form load terminals of the semiconductor die, and wherein the first surface of the metal body exposed from the molding compound redistributes the load terminals of the semiconductor die into terminals of the molded electronic component.

3. The molded electronic component according to claim 2, in, The metal body has a surface area greater than the contact pads of the semiconductor die.

4. The molded electronic component according to claim 1, in, each of the plurality of metal rings is attached to the die assembly at a location on the substrate, wherein a load terminal on the back side of the semiconductor die is attached to the substrate such that the substrate is at the same electrical potential as the load terminal, and The first surface of the metal body exposed from the molding compound redistributes the load terminals as terminals of the molded electronic component.

5. The molded electronic component according to claim 1, wherein At least some of the plurality of metal rings are formed from the bond wire attached to the die assembly at a plurality of locations along the length of the bond wire.

6. The molded electronic component according to claim 1, wherein At least some of the plurality of metal rings are formed from discrete segments of bond wire, each segment including a first end and a second end attached to the die assembly at a plurality of locations.

7. The molded electronic component according to claim 1, wherein At least some of the plurality of metal rings are formed from a metal ribbon attached to the die assembly at a plurality of locations along a length of the metal ribbon.

8. The molded electronic component according to claim 1, wherein At least some of the plurality of metal rings are elastic.

9. The molded electronic component according to claim 1, wherein The metal body is attached to each of the plurality of metal rings by one of a laser weld joint, an adhesive, or a solder joint.

10. The molded electronic component according to claim 1, wherein The plurality of metal rings are arranged in a plurality of rows of metal rings on the surface of the die assembly.

11. The molded electronic component according to claim 1, in, The plurality of metal rings is a first plurality of metal rings, and Wherein, the molded electronic component further includes a second plurality of metal rings embedded in the molding compound and attached to the die assembly.

12. The molded electronic component according to claim 11, wherein The metal body is attached to each of the second plurality of metal rings at a second surface of the metal body opposite the first surface.

13. The molded electronic component according to claim 11, in, The metal body is a first metal body, and wherein the molded electronic component further comprises a second metal body partially embedded in the mold compound and having a first surface exposed from the mold compound, wherein the second metal body is attached to each metal ring of a second plurality of metal rings at a second surface of the second metal body opposite to the first surface of the second metal body.

14. The molded electronic component according to claim 13, in, each of the first plurality of metal rings is attached to the die assembly at a first load terminal of the die assembly, wherein the first surface of the first metal body exposed from the mold compound redistributes the first load terminals of the die assembly into first terminals of the molded electronic component, wherein each of the second plurality of metal rings is attached to the die assembly at a second load terminal of the die assembly, and The first surface of the second metal body exposed from the mold compound redistributes the second load terminal of the die assembly into a second terminal of the molded electronic component.

15. The molded electronic component according to claim 14, wherein The first load terminal of the die assembly is a load terminal of the semiconductor die.

16. The molded electronic component according to claim 14, wherein The second load terminal of the die assembly is a load terminal on the substrate.

17. The molded electronic component according to claim 14, in, the semiconductor die being a first semiconductor die, wherein the die assembly further comprises a second semiconductor die attached to the same or a different substrate, and The second load terminal is a load terminal of the second semiconductor die.

18. The molded electronic component according to claim 1, in, The die assembly is a first die assembly, wherein the metal body is a first metal body, wherein the plurality of metal rings is a first plurality of metal rings, and Wherein, the molded electronic component further comprises: a second die assembly comprising a second semiconductor die attached to a second substrate; a second metal body partially embedded in the mold compound and having a first surface exposed from the mold compound; and a second plurality of metal rings embedded in the mold compound and attached to the second die assembly, wherein the second metal body is attached to each metal ring of a second plurality of metal rings at a second surface of the second metal body opposite to the first surface of the second metal body.

19. The molded electronic component according to claim 18, in, each of the first plurality of metal rings being attached to the first die assembly at a first load terminal of the first die assembly, wherein the first surface of the first metal body exposed from the mold compound redistributes the first load terminals of the first die assembly into first terminals of the molded electronic component, wherein each of the second plurality of metal rings is attached to the second die assembly at a second load terminal of the second die assembly, and The first surface of the second metal body exposed from the mold compound redistributes the second load terminals of the second die assembly into second terminals of the molded electronic component.

20. A power electronic component comprising: printed circuit boards; A molded electronic component embedded in the printed circuit board and comprising: molding compounds; a die assembly comprising a semiconductor die attached to a substrate, the die assembly being at least partially embedded in the mold compound; a plurality of metal rings embedded in the mold compound and attached to the die assembly; and a metal body partially embedded in the mold compound and having a first surface exposed from the mold compound, wherein the metal body is attached to each of the plurality of metal rings at a second surface of the metal body opposite to the first surface; and An electronic device is electrically connected to the molded electronic assembly through the printed circuit board.

21. A method of manufacturing a molded electronic component, the method comprising: attaching a semiconductor die to a substrate to form a die assembly; attaching a plurality of metal rings to the die assembly; attaching the first surface of the metal body to each of the plurality of metal rings; enclosing the die assembly, the plurality of metal rings, and the metal body in a mold such that the mold presses the metal body and the die assembly toward each other and compresses the plurality of metal rings; as well as Liquefied molding compound is injected into the mold.

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