Electronic packaging module and manufacturing method thereof

Abstract

The invention provides an electronic packaging module and a manufacturing method thereof, and the method comprises the steps: providing a flexible bearing plate, and arranging a plurality of conductive columns on the flexible bearing plate; the method further comprises the steps of providing a circuit substrate, and arranging conductive columns on the circuit substrate after the conductive columns are embedded on the flexible bearing plate. The conductive column is located between the circuit substrate and the flexible bearing plate, and the conductive column is electrically connected to the circuit substrate. After the conductive columns are arranged on the circuit substrate, a sealing layer is formed on the circuit substrate. The sealing layer is located between the circuit substrate and the flexible bearing plate, and the sealing layer surrounds the conductive columns. After the sealing layer is formed on the circuit substrate, the soft bearing plate is removed to expose the area of each conductive column.

Description

Technical Field

[0001] The invention relates to an electronic packaging module. Background Art

[0002] In a highly integrated electronic packaging module, the method of setting a conductive column (such as a conductive copper column) in the module is as follows: first, a carrier is used as a transfer carrier, and a bonding layer is preset on the carrier. Then, the conductive column is set on the carrier according to the I / O wiring design, and the conductive column is fixed to the carrier through the bonding layer on the carrier. Then, the carrier together with the conductive column is transferred to the circuit substrate using surface adhesion technology. After the conductive column is set on the circuit substrate, the viscosity of the bonding layer is reduced by heating or ultraviolet light irradiation, so that the carrier is removed from the conductive column and the conductive column is left on the circuit substrate. Then, a plastic encapsulation process is performed to plasticize the conductive column inside the sealing layer. After the plastic encapsulation process, the surface of the conductive column is exposed to the sealing layer through a grinding process to serve as a connection path between the electronic packaging module and an external device (for example, a motherboard).

[0003] However, if the height of the electronic components mounted on the same circuit substrate as the conductive pillars is greater than that of the conductive pillars, a grinding process must be performed before the plastic encapsulation process to align the ends of the conductive pillars with the top surfaces of the electronic components. Consequently, the grinding process can easily damage these electronic components, rendering the electronic packaging module inoperable. Summary of the Invention

[0004] Therefore, at least one embodiment of the present invention provides an electronic packaging module, which helps to improve the electrical yield of the packaging module.

[0005] At least one embodiment of the present invention provides a method for manufacturing the electronic packaging module.

[0006] The present invention provides a method for manufacturing an electronic packaging module, comprising providing a flexible carrier board and disposing a plurality of conductive posts on the flexible carrier board. The method further comprises providing a circuit substrate, and after disposing the conductive posts on the flexible carrier board, disposing the conductive posts on the circuit substrate. The conductive posts are positioned between the circuit substrate and the flexible carrier board, and are electrically connected to the circuit substrate. After disposing the conductive posts on the circuit substrate, a sealing layer is formed on the circuit substrate. The sealing layer is positioned between the circuit substrate and the flexible carrier board, and surrounds the conductive posts. After forming the sealing layer on the circuit substrate, the flexible carrier board is removed to expose a region of each conductive post.

[0007] The present invention also provides an electronic packaging module, comprising a circuit substrate, an electronic component, a plurality of conductive posts, and a sealing layer. The electronic component is disposed on a first surface of the circuit substrate and electrically connected to the circuit substrate, and the electronic component has a first plane spaced apart from the circuit substrate. The conductive posts are disposed on the first surface of the circuit substrate and electrically connected to the circuit substrate. The sealing layer is disposed on the first surface of the circuit substrate and covers the electronic component and the conductive posts. A second surface of the sealing layer exposes an end face of each of the conductive posts, and the first plane of the electronic component protrudes from the second surface of the sealing layer.

[0008] Based on the above, at least one embodiment of the present invention first places the conductive posts on a flexible carrier, then transposes and mounts the posts and flexible carrier onto the circuit substrate. Due to the flexible carrier's flexible nature, when the height of an electronic component mounted on the same circuit substrate surface as the conductive posts is greater than that of the posts, the surface of the electronic component facing away from the circuit substrate can cling to and embed within the flexible carrier. This eliminates the need to grind the electronic component to reduce its height to less than that of the conductive posts, thereby preventing damage to the electronic component due to grinding and improving the electrical yield of the electronic packaging module. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figures 1A to 1F A cross-sectional view illustrating a method for manufacturing an electronic packaging module according to an embodiment of the present invention;

[0010] Figure 2 A cross-sectional view of an electronic packaging module according to an embodiment of the present invention is shown;

[0011] Figures 3A to 3B A cross-sectional view illustrating a method for manufacturing an electronic packaging module according to an embodiment of the present invention;

[0012] Figure 4 A cross-sectional view of an electronic packaging module according to another embodiment of the present invention is shown.

[0013]

Explanation of symbols

[0014] 100,300: Electronic packaging module

[0015] 102: Flexible load board

[0016] 102c: Groove

[0017] 102s, 110f, 110s, 140s: surface

[0018] 104: Conductive column

[0019] 104r: Region

[0020] 104a, 104b: end face

[0021] 104s, 130s: side surface

[0022] 106,306: Welding materials

[0023] 110: Circuit substrate

[0024] 120, 130, 320: Electronic components

[0025] 120p, 130p, TRs: flat

[0026] 140,340: Sealing layer

[0027] BG: Conical bulge

[0028] 305: Motherboard

[0029] d1, d2, d3: distance

[0030] TR: tapered groove

[0031] N1: Normal

[0032] p: cutting device

[0033] r1: diameter DETAILED DESCRIPTION

[0034] At least one embodiment of the present invention discloses an electronic packaging module 100 (shown in FIG. Figure 2 ) is produced by Figures 1A to 1F A series of steps in the following are used to illustrate at least one embodiment of the present invention. First, please refer to Figure 1A A flexible carrier board 102 is provided. The flexible carrier board 102 may be made of, for example, silicone or a similar heat-resistant soft polymer material. Next, a plurality of conductive posts 104 are disposed on the flexible carrier board 102. The conductive posts 104 may be, for example, copper posts or similar metal posts.

[0035] like Figure 1AAs shown, a portion of the conductive post 104 is embedded within the flexible support 102. Specifically, the flexible support 102 may include a plurality of recesses 102c recessed into the surface 102s of the flexible support 102. Before the flexible support 102 is embedded within the conductive post 104, the diameter (not shown) of the recess 102c of the flexible support 102 is slightly smaller than the diameter r1 of the conductive post 104. Therefore, after the conductive post 104 is embedded within the recess 102c of the flexible support 102, one end of the conductive post 104 is secured to the surface 102s of the flexible support 102 by the recess 102c. In other words, each conductive post 104 includes a side surface 104s, and this side surface 104s is adjacent to the end surface 104a of the conductive post 104. After the conductive pillars 104 are disposed on the flexible supporting board 102 , the flexible supporting board 102 covers a portion of the side surface 104 s (ie, the top side surface) of the conductive pillars 104 .

[0036] It is worth noting that, in some embodiments, the groove 102c of the flexible carrier 102 can also connect two opposite sides of the flexible carrier 102. In other words, the groove 102c can be a through-hole connecting two opposite sides of the flexible carrier 102. Furthermore, the method for disposing the conductive posts 104 on the flexible carrier 102 is not limited to the above embodiment. For example, one side of a release material (not shown), such as double-sided tape, can be attached to the flexible carrier 102, and the conductive posts 104 can be attached to the other side of the release layer.

[0037] Please refer to Figure 1B , providing a circuit substrate 110. Next, an electronic component 120 can be disposed on the surface 110s of the circuit substrate 110, and the electronic component 120 is electrically connected to the circuit substrate 110. The electronic component 120 has a plane 120p that is distal to the circuit substrate 110, while the conductive pillar 104 has an end surface 104a that is distal to the flexible substrate 102. The distance d1 between the plane 120p and the circuit substrate 110 is smaller than the distance d2 between the end surface 104a and the flexible substrate 102. Specifically, the plane 120p of the electronic component 120 is separated from the surface 110s of the circuit substrate 110 by a distance d1, while the end surface 104a of the conductive pillar 104 is separated from the surface 102s of the flexible substrate 102 by a distance d2, wherein the distance d1 is smaller than the distance d2. It is worth noting that although the conductive pillar 104 can be disposed on the circuit substrate 110 by pre-soldering, the distance d2 does not include the height of the pre-solder.

[0038] Alternatively, an electronic component 130 may be disposed on the surface 110s of the circuit substrate 110 and electrically connected to the circuit substrate 110. The electronic component 130 has a plane 130p distal to the circuit substrate 110, while the conductive pillar 104 has an end surface 104a distal to the flexible support 102. A distance d3 between the plane 130p and the circuit substrate 110 is greater than a distance between the end surface 104a and the flexible support 102. Specifically, a distance d3 is defined between the plane 130p of the electronic component 130 and the surface 110s of the circuit substrate 110, where the distance d3 is greater than the distance d2. Furthermore, the distance d3 may be a height after reflow. For example, if flux dipping is employed, the distance d3 does not increase after the reflow process.

[0039] In various embodiments of the present invention, the electronic component 120 may be an active component such as a transistor, while the electronic component 130 may be a passive component such as an inductor or a capacitor. However, the types of the electronic components 120 and 130 are not limited thereto. In other words, in other embodiments of the present invention, the electronic component 120 may be a passive component, while the electronic component 130 may be an active component.

[0040] Please refer to Figure 1C After the conductive posts 104 are disposed on the flexible carrier 102, the conductive posts 104 are disposed on the circuit substrate 110. The conductive posts 104 are located between the circuit substrate 110 and the flexible carrier 102 and are electrically connected to the circuit substrate 110. Specifically, the surface 102s of the flexible carrier 102 and the surface 110s of the circuit substrate 110 are disposed face to face with each other, and the conductive posts 104 are disposed on the surface 110s of the circuit substrate 110.

[0041] It is worth mentioning that the electronic components 120, the electronic components 130 and the conductive pillars 104 can be disposed on the circuit substrate 110 by surface mount technology (SMT), such as soldering. For example, the electronic components 120, the electronic components 130 and the conductive pillars 104 can be disposed on the surface 110s of the circuit substrate 110 by a plurality of soldering materials 106. These soldering materials 106 can include solders such as tin paste, copper paste, silver paste, etc., and can be disposed on the surface 110s of the circuit substrate 110 by, for example, printing or dispensing. However, the present invention is not limited to the above. In other embodiments, the electronic components 120, the electronic components 130 and the conductive pillars 104 can also be disposed on the circuit substrate 110 by adhesive materials such as conductive glue.

[0042] In addition, the circuit substrate 110 may further include at least one solder mask (not shown), which may cover the surface 110s of the circuit substrate 110 and expose the solder material 106. Figure 1C As shown, because the distance d3 between the plane 130p of the electronic component 130 and the circuit substrate 110 is greater than the distance between the end surface 104a of the conductive pillar 104 and the flexible supporting board 102, the electronic component 130 is embedded in the flexible supporting board 102. Specifically, the plane 130p of the electronic component 130 is covered by the flexible supporting board 102, and a portion of the side surface 130s (i.e., the top portion) of the electronic component 130 is also covered by the flexible supporting board 102.

[0043] Please refer to Figure 1D After the conductive posts 104 are provided on the circuit substrate 110, a sealing layer 140 may be formed on the circuit substrate 110 by, for example, plastic encapsulation or gluing. The sealing layer 140 is located between the circuit substrate 110 and the flexible carrier 102, and the sealing layer 140 surrounds the conductive posts 104. In this embodiment, the surface 140s of the sealing layer 140 may be in contact with the surface 102s of the flexible carrier 102. However, in other embodiments, the surface 140s of the sealing layer 140 may not be in contact with the surface 102s of the flexible carrier 102, that is, there may be a gap between the surface 140s of the sealing layer 140 and the surface 102s of the flexible carrier 102. In addition, the surface 140s of the sealing layer 140 is located between the plane 120p of the electronic component 120 and the plane 130p of the electronic component 130. The material of the sealing layer 140 may include resin or similar sealing materials.

[0044] Please refer to Figure 1EAfter forming the sealing layer 140 on the circuit substrate 110, the flexible carrier 102 can be removed, for example, by peeling, to expose the region 104r of each conductive pillar 104. In other words, before removing the flexible carrier 102, the region 104r of the conductive pillar 104 is embedded in and surrounded by the flexible carrier 102. Therefore, after removing the flexible carrier 102, the region 104r of the conductive pillar 104 can be exposed to the outside world.

[0045] Please refer to Figure 1F After removing the flexible carrier 102, the region 104r of the conductive pillar 104 and a portion of the sealing layer 140 can be removed by, for example, mechanical grinding, so that the end surface 104b of the conductive pillar 104 is flush with the surface 140s of the sealing layer 140. It is worth noting that in this embodiment, the plane 130p of the electronic component 130 protrudes from the surface 140s of the sealing layer 140. However, in various embodiments of the present invention, the plane 130p of the electronic component 130 may alternatively be flush with the surface 140s of the sealing layer 140.

[0046] However, in the present invention, the end surface 104b of the conductive pillar 104 is not limited to being flush with the surface 140s of the sealing layer 140. Furthermore, although not shown in the drawings, in other embodiments, after removing the flexible carrier 102, a portion of the region 104r of the conductive pillar 104 and a portion of the sealing layer 140 may be removed by, for example, mechanical grinding, so that the end surface 104b of the conductive pillar 104 protrudes above the surface 140s of the sealing layer 140.

[0047] Next, the sealing layer 140 and the circuit substrate 110 can be cut along the gaps between the conductive pillars 104 by, for example, mechanical cutting, laser cutting, or ion beam cutting. Specifically, the cutting device p sequentially cuts the sealing layer 140 and the circuit substrate 110 from the surface 140s of the sealing layer 140 along the normal line N1 of the circuit substrate 110 to form a plurality of completely separated electronic packaging modules 100. Figure 1F The cutting device p shown can be represented by a cutting tool, a laser beam or an ion beam. Figure 2 The electronic package module 100 is shown.

[0048] Please refer to Figure 3A as well as Figure 3B In another embodiment of the present invention, the flexible carrier 102 may include a plurality of conical protrusions BG (e.g., truncated cones), and these conical protrusions BG protrude toward the conductive pillars 104. In other words, the surface 102s of the flexible carrier 102 may form a concave-convex surface. Figure 3AAs shown in FIG, a conical protrusion BG is provided corresponding to each conductive column 104. Figure 3B As shown, a sealing layer 140 is formed on a circuit substrate 110. After the flexible carrier 102 is removed (from the sealing layer 140), a plurality of tapered recesses TR (e.g., truncated cone shapes) are formed on a surface 140s of the sealing layer 140. Each tapered recess TR corresponds to a conductive pillar 104, and an end surface 104b of the conductive pillar 104 protrudes from the plane TRs of the tapered recess TR.

[0049] It is worth mentioning that in the subsequent soldering process of soldering the conductive pillar 104 to an external component (e.g., a motherboard), these tapered grooves TR can provide space for the solder material to be set, thereby increasing the covering area between the solder material and the conductive pillar 104, thereby improving the strength of the solder connection.

[0050] Please refer to Figure 4 In some embodiments of the present invention, the method for manufacturing an electronic packaging module further includes: after removing the flexible carrier board 102, placing a mainboard 305 on the conductive posts 104. The conductive posts 104 are located between the circuit substrate 110 and the mainboard 305, and the circuit substrate 110 is electrically connected to the mainboard 305 via the conductive posts 104. Specifically, the conductive posts 104 can be electrically connected to the mainboard 305 via a plurality of solder materials 306 disposed on the mainboard 305.

[0051] By including Figures 1A to 1F The manufacturing method of the electronic packaging module can be completed as follows Figure 2 The electronic package module 100 shown includes a circuit substrate 110, an electronic component 120 (and an electronic component 130), a plurality of conductive pillars 104, and a sealing layer 140. The electronic component 120 (and the electronic component 130) are disposed on a surface 110s of the circuit substrate 110 and are electrically connected to the circuit substrate 110.

[0052] It is worth noting that the number of electronic components 120 and electronic components 130 in the present invention is not limited to this embodiment, and the electronic packaging module 100 may include at least one electronic component 120 or electronic component 130. For example, in some embodiments, the circuit substrate 110 may have one electronic component 120 but no electronic component 130. Alternatively, in other embodiments, the circuit substrate 110 may have one electronic component 120 and one electronic component 130. Alternatively, the circuit substrate 110 may have one electronic component 130 but no electronic component 120.

[0053] The conductive pillars 104 are disposed on the surface 110s of the circuit substrate 110 and are electrically connected to the circuit substrate 110. The sealing layer 140 is disposed on the surface 110s of the circuit substrate 110 and covers the electronic components 120 (and the electronic components 130) and the conductive pillars 104. The surface 140s of the sealing layer 140 exposes the end face 104b of each conductive pillar 104. Figure 2 In the embodiment, the surface 140s of the sealing layer 140 is flush with the end surface 104b of the conductive pillar 104. However, in other embodiments, the end surface 104b of the conductive pillar 104 may protrude from the surface 140s of the sealing layer 140.

[0054] Figure 4 FIG. 3 is another embodiment of an electronic packaging module 300 of the present invention. The electronic packaging module 300 is similar to the electronic packaging module 100, but the difference between the two is that the electronic packaging module 300 further includes a motherboard 305, a plurality of electronic components 320, and a sealing layer 340. Figure 4 As shown, the main board 305 is disposed on the conductive pillars 104 and is electrically connected to the circuit substrate 110 through the conductive pillars 104 .

[0055] The circuit substrate 110 further has another surface 110f, and surface 110f and surface 110s are located on opposite sides of the circuit substrate 110. The electronic component 320 is disposed on surface 110f of the circuit substrate 110, and the sealing layer 340 is also disposed on surface 110f of the circuit substrate 110, covering the electronic component 320. In various embodiments of the present invention, the electronic component 320 can be a passive component such as an inductor or a capacitor, or an active component such as a transistor.

[0056] In summary, at least one embodiment of the present invention first places the conductive posts on a flexible carrier, then transposes and mounts the posts and flexible carrier together on a circuit substrate. Due to the flexible carrier's flexible nature, when the height of an electronic component mounted on the same circuit substrate surface as the conductive posts is greater than that of the posts, the surface of the electronic component facing away from the circuit substrate can cling to and embed within the flexible carrier. Consequently, there's no need to grind the electronic component to reduce its height to less than that of the conductive posts, thus preventing damage to the electronic component due to grinding and improving the electrical yield of the electronic packaging module.

[0057] Furthermore, at least one embodiment of the present invention secures the conductive posts to the flexible carrier by embedding them rather than using a bonding layer. This reduces contamination issues associated with removing the bonding layer. Furthermore, because the flexible carrier can be removed after the reflow and molding processes, the conductive posts can be continuously secured during the entire process, preventing them from tilting before the molding process and further improving the packaging yield.

[0058] Although the present invention has been disclosed above with reference to the embodiments, they are not intended to limit the present invention. Those skilled in the art may make modifications and improvements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. A method for manufacturing an electronic packaging module, characterized in that: Include: Providing a flexible supporting board; Arranging a plurality of conductive posts on the flexible supporting plate; Providing a circuit substrate; After the conductive posts are disposed on the flexible carrier, the conductive posts are disposed on the circuit substrate, wherein the conductive posts are located between the circuit substrate and the flexible carrier, and the conductive posts are electrically connected to the circuit substrate; After the conductive pillars are arranged on the circuit substrate, a sealing layer is formed on the circuit substrate, wherein the sealing layer is located between the circuit substrate and the flexible carrier and surrounds the conductive pillars; as well as After forming the sealing layer on the circuit substrate, the flexible carrier is removed to expose a region of each of the conductive pillars.

2. The method according to claim 1, wherein Also includes: After removing the flexible carrier board, the region of the conductive column and a portion of the sealing layer are removed so that an end surface of the conductive column is flush with a surface of the sealing layer.

3. The method according to claim 1, wherein Also includes: After removing the flexible carrier board, a portion of the region of the conductive layer and a portion of the sealing layer are removed, so that an end surface of the conductive column protrudes from a surface of the sealing layer.

4. The method according to claim 1, wherein Also includes: Before the conductive posts are arranged on the circuit substrate, an electronic component is arranged on the circuit substrate and electrically connected to the circuit substrate, wherein the electronic component has a plane away from the circuit substrate, and each of the conductive posts has an end surface away from the flexible carrier board, wherein the distance between the plane and the circuit substrate is less than or equal to the distance between the end surface and the flexible carrier board.

5. The method according to claim 1, wherein Also includes: Before the conductive posts are arranged on the circuit substrate, an electronic component is arranged on the circuit substrate and electrically connected to the circuit substrate, wherein the electronic component has a plane away from the circuit substrate, and each of the conductive posts has an end surface away from the flexible carrier, wherein the distance between the plane and the circuit substrate is greater than the distance between the end surface and the flexible carrier.

6. The method according to claim 5, wherein A distance between the plane of the electronic component and the end surface of the conductive column is no greater than 30 mm.

7. The method according to claim 1, wherein The flexible supporting board further comprises: A plurality of conical protrusions protrude toward the conductive pillars, wherein the conical protrusions are respectively arranged corresponding to the conductive pillars; after removing the flexible carrier board, a plurality of conical grooves are formed on a surface of the sealing layer, wherein the conical grooves respectively correspond to the conductive pillars, and an end face of the conductive pillar protrudes from a plane of the conical groove.

8. The method according to claim 1, wherein Each of the conductive posts further includes a side surface and an end surface adjacent to the side surface, wherein after the conductive posts are disposed on the flexible supporting board, the flexible supporting board covers a portion of the side surface of the conductive posts.

9. An electronic packaging module, characterized in that: Include: a circuit substrate; an electronic component disposed on a first surface of the circuit substrate and electrically connected to the circuit substrate, wherein the electronic component has a first plane away from the circuit substrate; a plurality of conductive posts disposed on the first surface of the circuit substrate and electrically connected to the circuit substrate; as well as A sealing layer is disposed on the first surface of the circuit substrate and covers the electronic component and the conductive column, wherein a second surface of the sealing layer exposes an end face of each of the conductive columns, and the first plane of the electronic component protrudes from the second surface of the sealing layer.

10. The electronic packaging module according to claim 9, wherein: A distance between the first plane of the electronic component and the second surface of the sealing layer is no greater than 30 mm.

11. The electronic packaging module according to claim 9, wherein: The sealing layer further comprises: A plurality of tapered grooves are provided, wherein the tapered grooves correspond to the conductive pillars respectively, and an end surface of the conductive pillar protrudes from a second plane of the tapered groove.

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