Large radiating fin semiconductor power discrete device

Abstract

The invention relates to the technical field of semiconductor power devices, in particular to a large-cooling-fin semiconductor power discrete device which comprises a shell, limiting pieces symmetrically and fixedly connected to the inner bottom of the shell, a discrete device arranged between the two sets of limiting pieces and a pin electrically connected to one side of the discrete device. A copper-based main body part is fixedly connected to the side, away from the containing groove, of the shell, and array fins are fixedly arranged on the outer surface of the copper-based main body part. A device side wall fixing assembly is arranged at the inner bottom of the shell; the top of the shell is detachably connected with a top fixing assembly. The heat generated by the discrete device is actively dissipated through the copper-based main body part and the array fins, and the heat generated by the discrete device is passively dissipated through the heat dissipation holes; through the use of the device side wall fixing assembly, a closed hydraulic / pneumatic system is formed, under the action of the gravity of the discrete device, the side wall of the discrete device is fixed, and the device top fixing assembly fixes the top of the matched device while packaging the matched device.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor power devices, and in particular to a large heat sink semiconductor power discrete device. Background Art

[0002] With the continuous development of electronic devices, the performance requirements for semiconductor power discrete devices are becoming increasingly higher. In practical applications, semiconductor power discrete devices generate a large amount of heat during operation. If this heat cannot be dissipated promptly and effectively, the device temperature will rise, which will in turn affect the performance and reliability of the device and may even cause damage to the device.

[0003] After searching, publication number CN113380717A discloses a large heat sink semiconductor power discrete device, whose structure includes a fixing device, a packaging cover, a plastic package shell, and pins, and the discrete device is installed inside the installation cavity.

[0004] During use, the above device secures and clamps the discrete device through the fixing components on both sides of the frame, and protects the bottom of the discrete device through the patch to prevent wear on the bottom of the discrete device. The pins of the discrete device extend through the pin member, and the pin member positions and protects the pins to prevent them from colliding with the edge of the plastic package during use and bending. This improves the use effect of the discrete device. However, in actual use, there are still the following areas for improvement: The lack of auxiliary heat dissipation structure results in the need to improve the heat dissipation effect; The fixing operation of discrete components is complicated, resulting in a need to improve installation efficiency.

[0005] Therefore, those skilled in the art provide a large heat sink semiconductor power discrete device to solve the problems raised in the above background technology. Summary of the Invention

[0006] In order to solve the above technical problems, the present invention provides a large heat sink semiconductor power discrete device. The device comprises a housing, stoppers symmetrically fixed to the bottom of the housing, a discrete device disposed between two groups of the stoppers, and pins electrically connected to one side of the discrete device. Support blocks are fixed to the four corners of the lower end of the housing. A placement groove is provided on one side of the housing, a lower limiting groove is provided on the inner bottom of the placement groove, a lower sealing gasket is fixedly connected to the interior of the lower limiting groove, and the pin is inserted into the limiting groove; A copper-based main body is fixedly connected to one side of the housing away from the placement slot, and an array of fins is fixedly provided on the outer surface of the copper-based main body; The inner bottom of the housing is provided with a device side wall fixing assembly for elastically clamping the two sides of the discrete device; The top of the housing is a detachable connector component that is used to press down the upper surface of the discrete component.

[0007] Preferably: the device side wall fixing assembly includes a main pipe fixedly connected to the bottom inner side of the shell, a first spring vertically fixedly connected to the bottom inner side of the main pipe, a first rubber pad fixedly connected to the upper end of the first spring, a first extrusion piece fixedly connected to the upper end of the first rubber pad, and a first extrusion plate fixedly connected to the upper end of the first extrusion piece. A first sliding hole is opened at the upper end of the main pipe, the first extrusion piece is slidingly connected to the inside of the first sliding hole, and a first sealing gasket is fixedly connected to the inner wall of the first sliding hole. The device side wall fixing assembly also includes two sets of fixing mechanisms symmetrically arranged on both sides of the main pipe.

[0008] Preferably: the fixing mechanism includes a branch pipe fixedly connected to the outside of the lower end of the main pipe, a second spring fixedly connected to the inner wall of the upper end of the branch pipe, a second rubber pad fixedly connected to one side of the second spring, a second extrusion piece fixedly connected to one side of the second rubber pad, and a second extrusion plate fixedly connected to one side of the second extrusion piece. A second sliding hole is opened on one side of the upper end of the branch pipe, the second extrusion piece is slidably connected to the inside of the second sliding hole, and a second sealing gasket is fixedly connected to the inner wall of the second sliding hole.

[0009] Preferably, the outer side of the main pipe is fixedly connected with an inlet and outlet pipe with a control valve.

[0010] Preferably: the top fixing assembly of the device includes a cover plate detachably connected to the upper end of the shell, and a placement plate fixedly connected to the lower end of one side of the cover plate, the lower end of the placement plate is provided with an upper limit groove, the top of the pin is limited in the upper limit groove, and the interior of the upper limit groove is fixedly connected with an upper sealing gasket.

[0011] Preferably, both sides of the placement plate are fixedly connected with installation limit members, both sides of the placement slot are provided with installation limit slots, and the installation limit members are cooperatedly arranged inside the installation limit slots.

[0012] Preferably: a first fixed internal threaded hole is opened at the four corners of the upper end of the shell, and a second fixed internal threaded hole is opened at the four corners of the upper end of the cover plate. The interiors of the four groups of the second fixed internal threaded holes are threadedly connected with bolts, and the bolts fix the cover plate to the upper end of the shell through the first fixed internal threaded holes and the second fixed internal threaded holes.

[0013] Preferably, four groups of limiting holes are opened at the upper end of the shell, four groups of limiting posts are fixed to the lower end of the cover plate, and the limiting posts are slidably fitted inside the limiting holes.

[0014] Preferably, two groups of upper pressure rubber pads are fixedly connected to the lower end of the cover plate, and multiple groups of anti-slip particles are fixedly connected to the lower ends of the two groups of upper pressure rubber pads.

[0015] Preferably, a plurality of heat dissipation holes are provided at the lower end of the shell and inside the cover plate, the heat dissipation holes are arranged in a truncated cone shape, and dustproof nets are fixedly connected inside the plurality of heat dissipation holes.

[0016] Technical effects and advantages of the present invention: The present invention is easy to use and has increased practicability when in use.

[0017] The copper-based main body and array fins actively dissipate heat generated during the operation of the discrete device. The frustum-shaped heat dissipation holes facilitate passive heat dissipation during the operation of the discrete device. The combination of the two improves the heat dissipation efficiency during the operation of the discrete device, thereby extending the service life of the discrete device. By using the device side wall fixing components, a closed hydraulic / pneumatic system is formed. Under the action of the gravity of the discrete device, the side wall of the discrete device is fixed. In conjunction with the device top fixing components, the top of the device is fixed while the matching device is packaged. The fixing operation is simple and the installation efficiency is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic structural diagram of a large heat sink semiconductor power discrete device provided in an embodiment of the present application; Figure 2 This is a side and rear view of a large heat sink semiconductor power discrete device provided by an embodiment of the present application; Figure 3 is a cross-sectional view of a large heat sink semiconductor power discrete device provided in an embodiment of the present application; Figure 4 This is a schematic diagram of the positions of the housing and discrete components in a large heat sink semiconductor power discrete component provided by an embodiment of the present application; Figure 5 This is a schematic diagram of the internal structure of the housing of a large heat sink semiconductor power discrete device provided in an embodiment of the present application. Figure 1 ; Figure 6 This is a schematic diagram of the internal structure of the housing of a large heat sink semiconductor power discrete device provided in an embodiment of the present application. Figure 2 ; Figure 7 This is a side cross-sectional view of the housing of a large heat sink semiconductor power discrete device provided in an embodiment of the present application. Figure 1 ; Figure 8 This is a side cross-sectional view of the housing of a large heat sink semiconductor power discrete device provided in an embodiment of the present application. Figure 2 ; Figure 9 This is a schematic structural diagram of a top fixing assembly of a device in a large heat sink semiconductor power discrete device provided by an embodiment of the present application; Figure 10 This is a side elevation view of a top fixing assembly of a device in a large heat sink semiconductor power discrete device provided by an embodiment of the present application; In the picture: 1. Housing; 2. Support block; 3. Device top fixing assembly; 4. Discrete device; 5. Pin; 6. Limit hole; 7. First fixed internal thread hole; 8. Limit piece; 9. Device side wall fixing assembly; 10. Main pipe; 11. First spring; 12. First rubber pad; 13. First extrusion piece; 14. First extrusion plate; 15. Branch pipe; 16. Second spring; 17. Second rubber pad; 18. Second extrusion piece; 19. Second extrusion plate; 20. Placement groove; 21. Lower limit groove; 22. Lower sealing gasket; 23. Installation limit groove; 24. Cover plate; 25. Placement plate; 26. Upper limit groove; 27. Upper sealing gasket; 28. Installation limit piece; 29. ​​Limit column; 30. Second fixed internal thread hole; 31. Bolt; 32. Upper pressure rubber pad; 33. Heat dissipation hole; 34. Copper base body; 35. Array fin. DETAILED DESCRIPTION

[0019] The present invention will be described in further detail below with reference to the accompanying drawings and specific embodiments. The embodiments of the present invention are provided for purposes of illustration and description and are not intended to be exhaustive or to limit the invention to the disclosed forms. Many modifications and variations will be apparent to those skilled in the art. The embodiments are chosen and described to better illustrate the principles of the invention and its practical application, and to enable those skilled in the art to understand the invention and design various embodiments with various modifications suitable for specific applications. Example

[0020] See also Figures 1 to 10 In this embodiment, a large heat sink semiconductor power discrete device is provided, comprising a housing 1, stoppers 8 symmetrically fixed to the bottom of the housing 1, a discrete device 4 disposed between two sets of stoppers 8, and pins 5 electrically connected to one side of the discrete device 4. Support blocks 2 are fixed to the four corners of the lower end of the housing 1. A placement groove 20 is provided on one side of the housing 1, and a lower limiting groove 21 is provided at the inner bottom of the placement groove 20. A lower sealing gasket 22 is fixedly connected to the interior of the lower limiting groove 21, and the pin 5 is inserted into the limiting groove 21; A copper-based main body 34 is fixedly connected to one side of the housing 1 away from the placement slot 20. An array of fins 35 is fixedly provided on the outer surface of the copper-based main body 34. The copper base is highly efficient in heat conduction, and the fins increase the heat dissipation area, quickly dissipating heat from the device and preventing performance degradation caused by heat accumulation. The inner bottom of the housing 1 is provided with a device side wall fixing assembly 9 for elastically clamping both sides of the discrete device 4; The top fixing assembly 3 of the detachable connector component on the top of the housing 1 is used to press down the upper surface of the discrete component 4.

[0021] The limiter 8 constrains the horizontal displacement of the discrete device 4 to prevent the device from shifting due to vibration and ensure that the pins are accurately aligned with the lower limit slot 21 ; the discrete device 4 is a core electronic component, such as a power semiconductor.

[0022] The device side wall fixing assembly 9 includes a main pipe 10 fixedly connected to the inner bottom of the shell 1, a first spring 11 vertically fixedly connected to the inner bottom of the main pipe 10, a first rubber pad 12 fixedly connected to the upper end of the first spring 11, a first extrusion member 13 fixedly connected to the upper end of the first rubber pad 12, and a first extrusion disk 14 fixedly connected to the upper end of the first extrusion member 13. A first sliding hole is opened at the upper end of the main pipe 10, and the first extrusion member 13 is slidably connected to the inside of the first sliding hole. A first sealing gasket is fixedly connected to the inner wall of the first sliding hole. The device side wall fixing assembly 9 also includes two sets of fixing mechanisms symmetrically arranged on both sides of the main pipe 10.

[0023] The fixing mechanism includes a branch pipe 15 fixedly connected to the outside of the lower end of the main pipe 10, a second spring 16 fixedly connected to the inner wall of the upper end of the branch pipe 15, a second rubber pad 17 fixedly connected to one side of the second spring 16, a second extrusion member 18 fixedly connected to one side of the second rubber pad 17, and a second extrusion disk 19 fixedly connected to one side of the second extrusion member 18. A second sliding hole is opened on one side of the upper end of the branch pipe 15, and the second extrusion member 18 is slidably connected to the interior of the second sliding hole. A second sealing gasket is fixedly connected to the inner wall of the second sliding hole. An inlet and outlet pipe with a control valve is fixedly connected to the outside of the main pipe 10 for injecting gas or liquid into the interior of the main pipe 10. The device top fixing assembly 3 includes a cover plate 24 detachably connected to the upper end of the shell 1, and a placement plate 25 fixedly connected to the lower end of one side of the cover plate 24. An upper limit groove 26 is opened at the lower end of the placement plate 25, and the top of the pin 5 is limited in the upper limit groove 26. The interior of the upper limit groove 26 is fixedly connected to an upper sealing gasket 27.

[0024] Both sides of the placement plate 25 are fixedly connected with installation limit members 28 , and both sides of the placement groove 20 are provided with installation limit grooves 23 . The installation limit members 28 are cooperated and arranged inside the installation limit grooves 23 to guide the cover plate 24 .

[0025] A first fixed internal threaded hole 7 is provided at the four corners of the upper end of the shell 1, and a second fixed internal threaded hole 30 is provided at the four corners of the upper end of the cover plate 24. The interiors of the four groups of second fixed internal threaded holes 30 are threadedly connected with bolts 31. The bolts 31 fix the cover plate 24 to the upper end of the shell 1 through the first fixed internal threaded holes 7 and the second fixed internal threaded holes 30, thereby fixing the cover plate 24 to the shell 1.

[0026] Four groups of limiting holes 6 are opened at the upper end of the housing 1 , and four groups of limiting posts 29 are fixed to the lower end of the cover plate 24 . The limiting posts 29 are slidably fitted inside the limiting holes 6 to guide the cover plate 24 .

[0027] Two groups of upper pressing rubber pads 32 are fixedly connected to the lower end of the cover plate 24 . The lower ends of the two groups of upper pressing rubber pads 32 are fixedly connected to multiple groups of anti-skid particles to limit the upper end of the discrete device 4 .

[0028] Several groups of heat dissipation holes 33 are provided at the lower end of the housing 1 and inside the cover plate 24. The heat dissipation holes 33 are arranged in a truncated cone shape. Dustproof nets are fixedly connected to the inside of the several groups of heat dissipation holes 33. The heat dissipation holes 33 promote air circulation, take into account both convection heat dissipation and particle protection, and extend the life of the device.

[0029] When using the present invention, First, open the control valve and inject liquid or gas into the interior of the main pipe 10 through the inlet and outlet pipes. The gas and liquid fill the space between the main pipe 10 at the lower end of the first rubber pad 12 and the branch pipes 15 outside the second rubber pad 17, that is, fill the closed cavity of the main pipe 10 and the branch pipes 15 on both sides. Close the control valve to establish the pressure transmission medium. After closing the valve, a closed hydraulic / pneumatic system is formed. The discrete device 4 is then placed between the two sets of limiters 8. During the descending process of the discrete device 4, the first extrusion plate 14 is squeezed. The first extrusion plate 14 drives the first rubber pad 12 to squeeze the first spring 11 through the first extrusion member 13. The first spring 11 pushes the gas or liquid inside the main pipe 10 into the inside of the branch pipe 15. Under the push of the gas or liquid, the second rubber pad 17 pushes the second extrusion plate 19 through the second extrusion member 18 to fix the side wall of the discrete device 4. At this time, the pin 5 on one side of the discrete device 4 enters the inside of the lower limit groove 21, completing the preliminary placement of the discrete device 4; the vertical pressure is automatically converted into a bidirectional horizontal clamping force to adapt to devices of different sizes; the spring + fluid dual-stage buffering prevents hard impact damage to the device.

[0030] Then, the cover plate 24 is placed on the upper end of the housing 1, and the installation limit piece 28 enters the installation limit groove 23 for preliminary limit, and then the limit column 29 enters the limit hole 6 for secondary limit, realizing double guidance to ensure that the cover plate 24 does not deviate. The upper limit groove 26 is engaged with the upper end of the pin 5. The lower sealing gasket 22 and the upper limit groove 26 fix and protect the pin 5, completely isolating it from external moisture / dust and improving corrosion resistance. Finally, the cover plate 24 is fixed to the upper end of the discrete device 4 by passing the bolt 31 through the second fixing internal threaded hole 30 and the first fixing internal threaded hole 7. At this time, the upper pressing rubber pad 32 presses the discrete device 4 to fix the longitudinal position of the discrete device 4. During operation, the heat dissipation holes 33 of the truncated cone-shaped structure assist the discrete device 4 in dissipating heat, while the copper-based main body 34 and the array fins 35 assist in dissipating heat.

[0031] The heat generated by the discrete device 4 is transferred to the housing 1, and then to the copper-based main body 34. The copper-based main body 34 has high thermal conductivity, and then to the array fins 35. The array fins 35 increase the convection area, and the air is forced to convectionally dissipate heat, thus achieving active heat dissipation. The frustum-shaped heat dissipation holes 33 form a chimney effect, accelerating the upward discharge of hot air; the dustproof net blocks the intrusion of pollutants, achieving passive heat dissipation.

[0032] The electrical components appearing in this article are all electrically connected to an external main controller and 220V AC power, and the main controller can be a conventional known device that controls a computer, etc. The specific implementation method of this disclosure omits the detailed description of known functions and known components. To ensure the compatibility of the equipment, the operating methods used are consistent with the parameters of marketed equipment.

[0033] In the scheme, unless otherwise clearly stipulated and limited, the terms "install", "set", "connect", "fix", "screw" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two elements or the interaction relationship between two elements. Unless otherwise clearly defined, ordinary technicians in this field can understand the specific meanings of the above terms in this scheme according to the specific circumstances.

[0034] Obviously, the embodiments described are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field and related fields without making creative efforts should fall within the scope of protection of the present invention. Structures, devices, and operating methods not specifically described and explained in the present invention shall be implemented in accordance with conventional means in the field unless otherwise specified or limited.

Claims

1. A large heat sink semiconductor power discrete device, comprising a housing (1), a stopper (8) symmetrically fixed to the bottom of the housing (1), a discrete device (4) disposed between two groups of the stopper (8), and a pin (5) electrically connected to one side of the discrete device (4), wherein support blocks (2) are fixed at the four corners of the lower end of the housing (1), and the device is characterized in that: A placement groove (20) is provided on one side of the housing (1), a lower limiting groove (21) is provided on the inner bottom of the placement groove (20), a lower sealing gasket (22) is fixedly connected to the interior of the lower limiting groove (21), and the pin (5) is inserted into the limiting groove (21); A copper-based main body (34) is fixedly connected to one side of the housing (1) away from the placement slot (20), and an array of fins (35) is fixedly provided on the outer surface of the copper-based main body (34); The inner bottom of the housing (1) is provided with a device side wall fixing assembly (9) for elastically clamping two sides of the discrete device (4); The top fixing assembly (3) of the detachable connector device on the top of the housing (1) is used to press down the upper surface of the discrete device (4).

2. The large heat sink semiconductor power discrete device according to claim 1, characterized in that: The device side wall fixing assembly (9) includes a main pipe (10) fixedly connected to the bottom of the housing (1), a first spring (11) vertically fixedly connected to the bottom of the main pipe (10), a first rubber pad (12) fixedly connected to the upper end of the first spring (11), a first extrusion member (13) fixedly connected to the upper end of the first rubber pad (12), and a first extrusion disk (14) fixedly connected to the upper end of the first extrusion member (13). A first sliding hole is opened at the upper end of the main pipe (10), the first extrusion member (13) is slidingly connected to the inside of the first sliding hole, and a first sealing gasket is fixedly connected to the inner wall of the first sliding hole. The device side wall fixing assembly (9) also includes two sets of fixing mechanisms symmetrically arranged on both sides of the main pipe (10).

3. The large heat sink semiconductor power discrete device according to claim 2, characterized in that: The fixing mechanism comprises a branch pipe (15) fixedly connected to the outer side of the lower end of the main pipe (10), a second spring (16) fixedly connected to the inner wall of the upper end of the branch pipe (15), a second rubber pad (17) fixedly connected to one side of the second spring (16), a second extrusion member (18) fixedly connected to one side of the second rubber pad (17), and a second extrusion disk (19) fixedly connected to one side of the second extrusion member (18). A second sliding hole is opened on one side of the upper end of the branch pipe (15), the second extrusion member (18) is slidingly connected to the inside of the second sliding hole, and a second sealing pad is fixedly connected to the inner wall of the second sliding hole.

4. The large heat sink semiconductor power discrete device according to claim 2, characterized in that: The outer side of the main pipe (10) is fixedly connected with an inlet and outlet pipe with a control valve.

5. The large heat sink semiconductor power discrete device according to claim 1, characterized in that: The device top fixing assembly (3) comprises a cover plate (24) detachably connected to the upper end of the housing (1), and a placement plate (25) fixedly connected to the lower end of one side of the cover plate (24). An upper limit groove (26) is provided at the lower end of the placement plate (25). The top of the pin (5) is limited in the upper limit groove (26), and an upper sealing gasket (27) is fixedly connected to the interior of the upper limit groove (26).

6. The large heat sink semiconductor power discrete device according to claim 5, characterized in that: Both sides of the placement plate (25) are fixedly connected with mounting limit members (28), both sides of the placement slot (20) are provided with mounting limit slots (23), and the mounting limit members (28) are arranged in cooperation with the interior of the mounting limit slots (23).

7. The large heat sink semiconductor power discrete device according to claim 5, characterized in that: The four corners of the upper end of the housing (1) are each provided with a first fixed internal threaded hole (7), the four corners of the upper end of the cover plate (24) are each provided with a second fixed internal threaded hole (30), the interiors of the four groups of the second fixed internal threaded holes (30) are each threadedly connected with a bolt (31), and the bolt (31) fixes the cover plate (24) to the upper end of the housing (1) through the first fixed internal threaded hole (7) and the second fixed internal threaded hole (30).

8. The large heat sink semiconductor power discrete device according to claim 5, characterized in that: Four groups of limiting holes (6) are provided at the upper end of the housing (1), and four groups of limiting posts (29) are fixed to the lower end of the cover plate (24). The limiting posts (29) are slidably fitted inside the limiting holes (6).

9. The large heat sink semiconductor power discrete device according to claim 5, characterized in that: Two groups of upper pressing rubber pads (32) are fixedly connected to the lower end of the cover plate (24), and multiple groups of anti-skid particles are fixedly connected to the lower ends of the two groups of upper pressing rubber pads (32).

10. The large heat sink semiconductor power discrete device according to claim 5, characterized in that: A plurality of groups of heat dissipation holes (33) are provided at the lower end of the housing (1) and inside the cover plate (24). The heat dissipation holes (33) are arranged in a truncated cone shape. Dustproof nets are fixedly connected inside the plurality of groups of heat dissipation holes (33).

Images