Power storage device and method for manufacturing power storage device

Abstract

The invention relates to a power storage device and a manufacturing method of the power storage device. A case (10) of a power storage device (100) disclosed herein includes a sealing plate (14), an electrode terminal (20), and a seal (30). The electrode terminal has a shaft portion (22) and a plate portion (24). The plate part is provided with a connecting surface (24a) exposed outside the housing, a back surface (24b) opposite to the connecting surface, and a side surface (24c) continuous with the connecting surface and the back surface. The sealing member is provided with: a base section (32) that covers the back surface of the plate section and the sealing plate; a side surface protection section (36) that is continuous with the base section and covers the side surface of the plate section; and a locking section (39) that is continuous with the upper end of the side surface protection section and covers the peripheral edge section (24a1) of the connecting surface. In the electricity storage device (100) with the structure, the clamping part of the sealing piece can limit the rising of the electrode terminal, so that the sealing piece can be prevented from being damaged, and the electrode terminal can be prevented from falling off.

Description

Technical Field

[0001] The present disclosure relates to an electric storage device and a method for manufacturing the electric storage device. Background Art

[0002] Energy storage devices such as secondary batteries are used as power sources for various electrical products. These devices include an electrode assembly and a housing that houses the electrode assembly. The housing, for example, includes a box-shaped housing body with an opening and a sealing plate that closes the opening. The housing also includes electrode terminals for connection to external conductive components (such as busbars) and a sealant that insulates the electrode terminals from the housing.

[0003] An example of such an electrical storage device is disclosed in Japanese patent application publication No. 2016-058215. A through-hole is formed in the cover body (sealing plate) described in the document. Furthermore, the terminal portion (electrode terminal) is arranged so as to pass through the through-hole of the cover body. Furthermore, a resin component (sealant) seals the gap between the terminal portion and the cover body and fixes the terminal portion relative to the cover body. In addition, the terminal portion has an outer configuration portion that is configured on the outer side of the cover body. Furthermore, the resin component described in the above patent document covers the periphery of the outer configuration portion.

[0004] Patent Document 1: Japanese Patent Application Publication No. 2016-058215

[0005] Furthermore, portable power supplies such as power storage devices are often mounted on mobile devices such as mobile terminals and vehicles. The vibrations of these mobile devices can exert stress on the electrode terminals of the power storage devices. In such cases, if strong stress is applied in the direction of lifting the electrode terminals, this can damage the seals and cause the electrode terminals to detach. Summary of the Invention

[0006] In order to solve the above-mentioned problems, a method for manufacturing an electric storage device having the following structure (hereinafter also simply referred to as a “manufacturing method”) is provided.

[0007] The energy storage device disclosed herein includes an electrode body and a housing for accommodating the electrode body. The housing includes a housing component having a through-hole, an electrode terminal inserted into the through-hole, and a sealant as a resin component that seals the through-hole and is integrated with the housing component and the electrode terminal. In addition, the electrode terminal includes a shaft portion inserted into the through-hole and a plate portion arranged along the housing component. In addition, the plate portion of the electrode terminal includes a connection surface exposed to the outside of the housing, a back surface on the side opposite to the connection surface, and a side surface continuous with the connection surface and the back surface. Furthermore, the sealant includes a base portion covering the back surface of the plate portion, a side protection portion continuous with the base portion and covering the side surface of the plate portion, and a locking portion continuous with the upper end of the side protection portion and covering at least a portion of the upper surface of the peripheral portion of the connection surface.

[0008] The seal of the electrical storage device disclosed herein includes a base portion that is integrated with the outer shell component. The seal includes a locking portion that is continuously formed with the base portion via a side protection portion. Moreover, the locking portion covers the connection surface of the plate portion of the electrode terminal. In other words, the seal of the electrical storage device disclosed herein is integrated with the outer shell component and covers the connection surface (upper surface) of the electrode terminal. This can limit the rise of the electrode terminal, thereby preventing damage to the seal and detachment of the electrode terminal.

[0009] Furthermore, the locking portion of the electrical storage device disclosed herein covers at least a portion of the peripheral edge of the connection surface of the plate portion of the electrode terminal. This allows the central portion of the connection surface of the electrode terminal to be exposed externally, thereby enabling the electrode terminal to be properly connected to an external conductive component (such as a bus bar). BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 It is a perspective view schematically showing the electric storage device according to the first embodiment.

[0011] Figure 2 It is an enlarged cross-sectional view schematically showing the structure near the electrode terminals of the electrical storage device according to the first embodiment.

[0012] Figure 3 It is schematically represented Figure 1 An enlarged plan view of the structure near the electrode terminals of the electrical storage device shown.

[0013] Figure 4 It is a perspective view schematically showing a sealing plate of the electrical storage device according to the first embodiment.

[0014] Figure 5 It is a perspective view schematically showing an electrode terminal of the electric storage device according to the first embodiment.

[0015] Figure 6 This is a flowchart illustrating the manufacturing method according to the first embodiment.

[0016] Figure 7 It is a perspective view schematically showing the inserting step of the manufacturing method according to the first embodiment.

[0017] Figure 8 It is a cross-sectional view schematically showing the housing step of the manufacturing method according to the first embodiment.

[0018] Figure 9 It is a cross-sectional view schematically showing the injection step of the manufacturing method according to the first embodiment.

[0019] Figure 10It is an enlarged cross-sectional view schematically showing the injection step of the manufacturing method according to the first embodiment.

[0020] Figure 11 It is an enlarged plan view schematically showing the structure near the electrode terminals of an electrical storage device according to another embodiment.

[0021] Figure 12 It is an enlarged plan view schematically showing the structure near the electrode terminals of an electrical storage device according to another embodiment.

[0022] Description of Reference Numerals

[0023] 10…housing; 12…housing body; 14…sealing plate; 20…electrode terminal; 22…shaft portion; 24…plate portion; 30…seal; 32…base portion; 34…internal insulating portion; 36…side protecting portion; 38…external insulating portion; 39…locking portion; 40…electrode body; 100…electrical storage device; M…mold; Mc…internal cavity; Mc0…resin shielding portion; Mc1…first filling space; Mc2…second filling space; Mc3…resin flow path; Mc4…fourth filling space; Mcs…cavity surface. DETAILED DESCRIPTION

[0024] Hereinafter, the implementation mode of the technology disclosed herein will be described with reference to the accompanying drawings. In addition, matters other than those specifically mentioned in this specification and required for the implementation of the technology disclosed this time (for example, detailed materials of the electrode body and electrolyte, etc.) should be understood as design matters of a person skilled in the art in this field based on the prior art. The technology disclosed here can be implemented based on the contents disclosed in this specification and the technical common sense in this field. In addition, the expression "A to B" indicating the range in this specification includes the meaning of "greater than A" and "less than B" in addition to the meaning of "greater than A and less than B".

[0025] In this specification, the term "electrical storage device" encompasses devices that generate charge and discharge reactions by transferring charge carriers between a pair of electrodes (a positive electrode and a negative electrode). Specifically, the electrical storage devices described in the technology disclosed herein include not only secondary batteries such as lithium-ion batteries, nickel-metal hydride batteries, and nickel-cadmium batteries, but also capacitors such as lithium-ion capacitors and electric double-layer capacitors.

[0026] <First embodiment>

[0027] A.Electrical storage equipment

[0028] Hereinafter, one embodiment of the method for manufacturing the electrical storage device disclosed herein will be described with reference to the drawings. Figure 1 It is a perspective view schematically showing the electric storage device according to the first embodiment. Figure 2 It is schematically represented Figure 1 An enlarged cross-sectional view of the structure near the electrode terminals of the electrical storage device shown. Figure 3 It is schematically represented Figure 1 An enlarged plan view of the structure near the electrode terminals of the electrical storage device shown. Figure 4 It is a perspective view schematically showing a sealing plate of the electrical storage device according to the first embodiment. Figure 5 It is a perspective view schematically showing an electrode terminal of the electric storage device according to the first embodiment.

[0029] In the drawings referenced in this specification, the reference symbols L, R, F, Rr, U, and D represent left, right, front, rear, top, and bottom, respectively. Furthermore, the reference symbols X, Y, and Z represent the width, depth, and height of the electrical storage device, respectively. However, these directions are merely defined for ease of explanation and do not limit the arrangement of the components in the technology disclosed herein.

[0030] like Figure 1 and Figure 2 As shown, the electrical storage device 100 according to the present embodiment includes an electrode body 40 and a case 10 that houses the electrode body 40 .

[0031] 1. Electrode body

[0032] The electrode body 40 is the power generation element of the electrical storage device 100. Any electrode body used in conventional electrical storage devices can be used without particular limitation, so a detailed description is omitted. Furthermore, although not shown, an electrolyte is also contained within the housing 10. The composition of this electrolyte is also not particularly limited, so a detailed description is omitted.

[0033] 2. Housing

[0034] The housing 10 is a container for accommodating the electrode body 40. The housing 10 in this embodiment includes a housing body 12 and a sealing plate 14. The housing body 12 is a box-shaped body with an upper surface opening. Specifically, the housing body 12 includes a bottom 12b which is a long rectangular plate-like component, a pair of first side walls 12c extending upward U from the long side of the bottom 12b (along the side in the width direction X), and a pair of second side walls 12d extending upward U from the short side of the bottom 12b (along the side in the depth direction Y). Moreover, on the upper surface of the housing body 12, an upper surface opening is formed which is surrounded by the upper ends of the first side wall 12c and the second side wall 12d. On the other hand, the sealing plate 14 is a rectangular plate-like component that blocks the upper surface opening of the housing body 12. Specifically, the sealing plate 14 is a long plate-like component extending in the width direction X. The sealing plate 14 is embedded in the upper end portion of the housing body 12. The outer shell body 12 and the sealing plate 14 are joined at their boundaries by laser welding or the like. Furthermore, the outer shell 10 (the outer shell body 12 and the sealing plate 14) is preferably a metal component having a certain strength or greater. Examples of materials for the outer shell 10 include metal materials such as aluminum and aluminum alloys.

[0035] Furthermore, the case 10 in this embodiment includes a case member, an electrode terminal 20, and a sealing member 30. Each configuration will be described below.

[0036] (1) Housing components

[0037] In this specification, the term "housing member" refers to a member on which electrode terminals and seals are mounted, among the multiple members constituting the housing of the electrical storage device. Figure 1 In the illustrated electrical storage device 100, electrode terminals 20 and a sealant 30 are attached to a sealing plate 14. In this configuration, the sealing plate 14 becomes a housing component. However, the housing component is not limited to the sealing plate. For example, if the electrode terminals and a sealant are attached to the housing body, the housing body becomes the housing component.

[0038] like Figure 4 As shown in FIG. 1 , the outer shell member (sealing plate 14 ) of the electrical storage device 100 has through-holes 14 a . The through-holes 14 a are formed at both ends of the sealing plate 14 in the width direction X, respectively. Figure 4 The through hole 14a is a rectangular opening in a top view. The planar shape of the through hole 14a is not particularly limited as long as the electrode terminal 20 described later can be inserted. As another example of the planar shape of the through hole 14a, a circular shape, an elliptical shape, etc. can be cited. In addition, an outer groove 14d surrounding the through hole 14a is formed on the outer side surface 14b of the sealing plate 14. Similarly, an inner groove 14e surrounding the through hole 14a is also formed on the inner side surface 14c of the sealing plate 14 (see Figure 2 ).like Figure 2As shown, a portion of the sealing material 30 flows into the outer groove 14d and the inner groove 14e. This can improve the adhesion between the sealing plate 14 and the sealing material 30.

[0039] (2) Electrode terminals

[0040] The electrode terminal 20 is a conductive member inserted into the through hole 14a. Figure 5 As shown, the electrode terminal 20 in this embodiment is a long member extending in the height direction Z. The electrode terminal 20 includes a shaft portion 22 and a plate portion 24 .

[0041] The shaft portion 22 is a portion that is inserted into the through hole 14a. Figure 2 and Figure 5 As shown, the shaft portion 22 in this embodiment is a long, plate-like member extending in the height direction Z. Furthermore, the shaft portion 22 is housed within the housing 10. Furthermore, the lower end of the shaft portion 22 is connected to the electrode body 40 (not shown). Furthermore, the shape of the shaft portion 22 is not limited to a plate-like shape; it may also be a columnar shape (cylindrical, prismatic, etc.).

[0042] The plate portion 24 is a portion arranged along the outer shell member (sealing plate 14). Figure 5 As shown, the plate portion 24 in this embodiment extends continuously in the width direction X from the upper end portion 22a of the shaft portion 22. The plate portion 24 is formed by bending the front end of a long plate-shaped conductive component. In addition, the plate portion 24 is formed into a planar roughly rectangular shape in a manner corresponding to the roughly rectangular through-hole 14a. In this way, the planar shape of the plate portion is preferably a shape corresponding to the planar shape of the through-hole. Thereby, the filling of the resin in the injection process S40 described later becomes easy. Among them, the planar shape of the plate portion is not limited to a roughly rectangular shape. For example, when the planar shape of the through-hole is circular, the planar shape of the plate portion can also be circular. In addition, the electrode terminal may not be a continuous integral component of the shaft portion and the plate portion. For example, the shaft portion and the plate portion may be made separately, and the electrode terminal may be constructed by combining the two.

[0043] In addition, the plate portion 24 includes a connecting surface 24a, a back surface 24b, and a side surface 24c. Figure 2As shown, the connection surface 24a of the plate portion 24 is exposed to the outside of the housing 10. Thus, an external conductive component such as a bus bar can be connected to the plate portion 24 of the electrode terminal 20. In addition, the back surface 24b of the plate portion 24 is the surface on the side opposite to the connection surface 24a. The back surface 24b is covered by the base portion 32 of the seal 30 described later. In addition, the side surface 24c is a surface continuous with the connection surface 24a and the back surface 24b. The side surface 24c is covered by the side protection portion 36 of the seal 30. In addition, the insertion height of the electrode terminal 20 is preferably adjusted in such a manner that the back surface 24b of the plate portion 24 is arranged at a position U above the outer side surface 14b of the sealing plate 14. Thus, the base portion 32 and the external insulating portion 38 of the seal 30 are appropriately formed, so that the components can be fixed more stably.

[0044] (3) Seals

[0045] The seal 30 is a resin component that seals the through hole 14a of the housing component (sealing plate 14). The seal 30 is integrated with the sealing plate 14 and the electrode terminal 20. In addition, "integration" in this specification means that the metal component (sealing plate, electrode terminal, etc.) and the resin component (seal, etc.) are fixed together. The seal 30 in this embodiment has a base portion 32, a side protection portion 36 and a locking portion 39. In addition, Figure 2 The seal 30 shown further includes an internal insulating portion 34 and an external insulating portion 38. Each structure will be described below.

[0046] (a) Base

[0047] The base portion 32 is a resin component that covers the back surface 24b of the plate portion 24 and the outer shell member (sealing plate 14). Specifically, the base portion 32 is a resin component that fills the through hole 14a of the sealing plate 14. The base portion 32 is connected to the back surface 24b of the plate portion 24, the outer surface of the through hole 14a, and the upper end portion 22a of the shaft portion 22 (see Figure 5 ) are integrated. Thus, the base portion 32 is fixed to the electrode terminal 20 and the sealing plate 14.

[0048] (b) Internal insulation

[0049] Next, the internal insulating portion 34 is a resin member extending along the inner side surface 14c of the sealing plate 14. The internal insulating portion 34 extends continuously from the base portion 32 toward the radially outer side (for example, Figure 2 The internal insulating portion 34 extends in the depth direction (Y) of the housing 10. This internal insulating portion 34 prevents contact between the sealing plate 14 and the electrode body 40 when the electrode body 40 moves up and down within the housing 10 due to vibration or the like. Furthermore, a portion of the internal insulating portion 34 flows into the internal groove 14e of the sealing plate 14. This prevents movement of the seal 30 in the planar directions (width direction X and depth direction Y).

[0050] (c) External insulation

[0051] The external insulating portion 38 is a resin member extending along the outer side surface 14b of the sealing plate 14. Similar to the internal insulating portion 34, the external insulating portion 38 is also continuous from the base portion 32 toward the radially outer side (for example, Figure 2 The external insulating portion 38 extends in the depth direction Y). The external insulating portion 38 has the function of suppressing conduction between the plate portion 24 of the electrode terminal 20 and the outer shell 10 (sealing plate 14). Specifically, if the outer side surface 14b of the sealing plate 14 is exposed around the plate portion 24, when conductive foreign matter (metal powder, liquid, etc.) adheres to the plate portion 24, the electrode terminal 20 and the outer shell 10 may be conductive. Therefore, it is preferable to form the external insulating portion 38 around the plate portion 24. In addition, a portion of the external insulating portion 38 flows into the external groove 14d of the sealing plate 14. Thus, the movement of the seal 30 in the planar direction (width direction X and depth direction Y) can be more appropriately suppressed. In addition, in the storage battery device 100 involved in this embodiment, a shell component (sealing plate 14) is sandwiched between the internal insulating portion 34 and the external insulating portion 38. Thus, it is more appropriate to prevent the seal 30 from moving up and down relative to the sealing plate 14.

[0052] (d) Side protection

[0053] The side protection portion 36 is continuous with the base portion 32 and is a resin component that covers the side surface 24c of the plate portion 24. Specifically, the side protection portion 36 extends from the base portion 32 toward the upper U in a manner along the side surface 24c of the plate portion 24. Moreover, the side protection portion 36 is integrated with the side surface 24c of the plate portion 24. The side protection portion 36 is the same as the above-mentioned external insulating portion 38 and has the function of suppressing conduction between the electrode terminal 20 and the sealing plate 14 via conductive foreign matter. In addition, the side protection portion 36 can also limit the movement of the electrode terminal 20 in the planar direction (width direction X and depth direction Y). This can also help to suppress damage to the seal 30 caused by vibration of the electrode terminal 20.

[0054] (e) Locking part

[0055] The locking portion 39 is continuous with the upper end of the side protection portion 36 and is a resin component that covers at least a portion of the peripheral portion 24a1 of the connecting surface 24a. Specifically, the side protection portion 36 in this embodiment is erected at a position U above the peripheral portion 24a1 of the connecting surface 24a of the plate portion 24. Moreover, the locking portion 39 extends in the horizontal direction (width direction X and / or depth direction Y) in a manner that covers the peripheral portion 24a1 of the connecting surface 24a from the upper end of the side protection portion 36. Moreover, the locking portion 39 is integrated with the peripheral portion 24a1 of the connecting surface 24a. According to the locking portion 39 constructed in this way, the rise of the electrode terminal 20 can be restricted, thereby preventing the seal 30 from being damaged or the electrode terminal 20 from being detached. This will be described in detail below.

[0056] First, as described above, the base portion 32 of the seal 30 is integrated with the sealing plate 14. On the other hand, the locking portion 39 covers the connection surface 24a of the plate portion 24 of the electrode terminal 20. Moreover, the base portion 32 and the locking portion 39 are continuously molded via the side protection portion 36. That is, the seal 30 in this embodiment is fixedly combined with the sealing plate 14 at the base portion 32, and has the locking portion 39 covering the connection surface 24a (upper surface) of the electrode terminal 20. Thus, the electrode terminal 20 is fixed to the sealing plate 14 via the seal 30, so that even if the storage device 100 vibrates, the rise of the electrode terminal 20 is restricted. As a result, it is possible to prevent the seal 30 from being damaged or the electrode terminal 20 from being detached.

[0057] Furthermore, the locking portion 39 in this embodiment covers at least a portion of the peripheral edge of the connection surface 24a of the plate portion 24 of the electrode terminal 20. This prevents the sealant 30, which functions as an insulator, from covering the central portion 24a2 of the connection surface 24a, thereby allowing the central portion 24a2 of the connection surface 24a to be exposed to the outside. As a result, a sufficient connection area between the electrode terminal 20 and external conductive components (such as busbars) can be ensured.

[0058] In addition, if Figure 3 As shown, the locking portion 39 in this embodiment continuously covers the entire circumference of the peripheral edge portion 24a1 of the connecting surface 24a of the plate portion 24. According to this structure, the entire circumference of the peripheral edge portion 24a1 of the connecting surface 24a is locked by the locking portion 39, so that the rise of the electrode terminal 20 can be more reliably restricted. In addition, it is preferable to set the width w1 of the locking portion 39 in a plan view in consideration of restricting the rise of the electrode terminal 20 and ensuring the area of ​​the central portion 24a2 of the connecting surface 24a (see Figure 3 For example, the width w1 of the locking portion 39 is set to 2 mm to 5 mm (preferably 3 mm to 4 mm).

[0059] In addition, if Figure 3As shown, in the electrode terminal 20 of this embodiment, a recessed portion 24e is formed between the central portion 24a2 of the connecting surface 24a and the locking portion 39. This structure prevents the central portion 24a2 of the connecting surface 24a from being covered with resin during molding of the seal 30, as will be described in detail later. This eliminates the need to remove resin adhering to the central portion 24a2 of the connecting surface 24a, thereby improving the manufacturing efficiency of the electrical storage device 100.

[0060] In addition, if Figure 2 As shown, in the storage device 100 involved in this embodiment, the height position of the locking portion 39 of the seal 30 is below the height position of the central portion 24a2 of the connection surface 24a. According to this structure, the electrode terminal 20 and the external conductive component can be connected more easily. Specifically, in the connection between the electrode terminal 20 and the external conductive component, the central portion 24a2 of the connection surface 24a of the electrode terminal 20 is sometimes brought into surface contact with the plate-shaped external conductive component. At this time, if the locking portion 39 is arranged at a position U above the central portion 24a2 of the connection surface 24a, the locking portion 39 interferes, so that the surface contact between the electrode terminal 20 and the external conductive component becomes difficult. In contrast, if the locking portion 39 is arranged at a position D below the central portion 24a2 of the connection surface 24a, the electrode terminal 20 and the external conductive component can be easily brought into surface contact. In addition, in Figure 2 In the embodiment, the locking portion 39 is arranged at a position D below the central portion 24a2 of the connecting surface 24a. However, the height of the locking portion 39 may be the same as the height of the central portion 24a2 of the connecting surface 24a. In this case, the electrode terminal 20 can also be easily brought into contact with the external conductive member.

[0061] Furthermore, in this embodiment, a cutout 24f is formed in the peripheral edge 24a1 of the connecting surface 24a. Consequently, the peripheral edge 24a1 of the connecting surface 24a is positioned below D relative to the rest of the connecting surface 24a (central portion 24a2). Furthermore, by forming the retaining portion 39 so as to cover the cutout 24f, the height of the retaining portion 39 of the seal 30 can be set below the height of the central portion 24a2 of the connecting surface 24a.

[0062] 2. Method for manufacturing an electricity storage device

[0063] Next, a method of manufacturing the electrical storage device 100 having the above-described configuration will be described. Figure 6 1 is a flowchart illustrating the manufacturing method involved in the first embodiment. Figure 6 As shown, the manufacturing method according to this embodiment includes a preparation step S10, an insertion step S20, a housing step S30, and an injection step S40. Each step will be described below.

[0064] (1) Preparation step S10

[0065] In this step, a housing member having a through hole 14a is prepared. As described above, the housing member in this embodiment is the sealing plate 14 (see Figure 4 Since the detailed structure of the sealing plate 14 has been described above, repeated description will be omitted.

[0066] (2) Insertion step S20

[0067] Figure 7 1 is a perspective view schematically showing the insertion process of the manufacturing method according to the first embodiment. Figure 7 As shown, in the insertion step S20, the electrode terminal 20 is inserted into the through-hole 14a. Specifically, the shaft portion 22 of the electrode terminal 20 is inserted into the through-hole 14a of the sealing plate 14. At this time, the insertion position of the electrode terminal 20 in the height direction Z is adjusted so that the plate portion 24 of the electrode terminal 20 is positioned above the upper side 14b of the sealing plate 14. Furthermore, the insertion position of the electrode terminal 20 in the planar direction (width direction X and depth direction Y) is adjusted so that the substantially rectangular plate portion 24 covers the upper side U of the substantially rectangular through-hole 14a.

[0068] In addition, if Figure 5 and Figure 7 As shown, the electrode terminal 20 in this embodiment includes a recessed portion 24e. The recessed portion 24e is a groove recessed from the connecting surface 24a, formed between the central portion 24a2 and the peripheral portion 24a1 of the connecting surface 24a. Furthermore, the recessed portion 24e in this embodiment is an annular recessed portion formed along the peripheral portion 24a1 of the connecting surface 24a. This structure of the recessed portion 24e prevents the resin R from invading the area inside the recessed portion 24e (the central portion 24a2 of the connecting surface 24a) during the injection step S40 described later.

[0069] The electrode terminal 20 in this embodiment also includes a cutout portion 24f. The cutout portion 24f is formed by cutting away the peripheral edge portion 24a1 of the connecting surface 24a. This allows the peripheral edge portion 24a1 of the connecting surface 24a to be positioned below the central portion 24a2 by a distance D. By forming the locking portion 39 to cover the cutout portion 24f, the locking portion 39 can be easily positioned below the central portion 24a2 of the connecting surface 24a.

[0070] (3) Accommodation step S30

[0071] Figure 8 1 is a cross-sectional view schematically showing the accommodating step of the manufacturing method according to the first embodiment. Figure 8As shown, in the housing step S30, the housing member (sealing plate 14) and the electrode terminal 20 are arranged in the internal cavity Mc of the mold M. Specifically, the internal cavity Mc of the mold M accommodates the periphery of the through hole 14a of the sealing plate 14, the entire plate portion 24, and the upper end portion 22a of the shaft portion 22. On the other hand, although not shown in the figure, the lower end portion 22b of the shaft portion 22 (see Figure 5 ), the central portion 14f in the width direction X of the sealing plate 14 (refer to Figure 6 ) is not housed in the internal cavity Mc but is exposed outside the mold M. Furthermore, in the housing step S30 of this embodiment, the vertical positions of the electrode terminal 20 and the sealing plate 14 are reversed. This positions the back surface 24b of the plate portion 24 and the inner surface 14c of the sealing plate 14 at the upper side U. In this case, at the initial stage of the injection step S40, described later, when the temperatures of the electrode terminal 20 and the mold M are relatively low, the resin R easily flows into the resin flow path Mc3. As a result, the resin R can be more effectively prevented from entering the resin shielding portion Mc0.

[0072] In addition, the mold M used in this process is made of a high-strength metal material such as stainless steel, mold steel, or maraging steel. This can suppress deformation and damage to the mold M in the injection step S40. In addition, a cavity surface Mcs corresponding to the shape of the seal 30 to be molded is formed inside the mold M. The "internal cavity Mc of the mold M" in this specification refers to the space surrounded by the cavity surface Mcs of the mold M. Moreover, the cavity surface Mcs in this embodiment has the following first surface M1 to fourth surface M4.

[0073] (a) Surface 1 M1

[0074] like Figure 8 As shown, the cavity surface Mcs of the mold M in this embodiment is in surface contact with the connecting surface 24a of the plate portion 24. The cavity surface Mcs in surface contact with the connecting surface 24a is referred to as the "first surface M1". By making the first surface M1 in surface contact with the connecting surface 24a, it is possible to prevent the resin from adhering to the connecting surface 24a. In addition, in this specification, the area where the connecting surface 24a is in surface contact with the first surface M1 is referred to as the "resin shielding portion Mc0". In this embodiment, a cutout portion 24f is formed in the peripheral portion 24a1 of the connecting surface 24a. Therefore, a gap S is formed between the peripheral portion 24a1 of the connecting surface 24a and the first surface M1. The gap S is connected to the resin flow path Mc3 described later.

[0075] In this embodiment, a protrusion M1a is provided that protrudes upward (U) from the first surface M1. This protrusion M1a is formed at a position that is inserted into the recess 24e of the connecting surface 24a of the electrode terminal 20. This protrusion M1a is a wedge-shaped protrusion with a triangular cross-section. In the accommodation step S30, the accommodation position of the electrode terminal 20 is adjusted so that the inclined surface of this wedge-shaped protrusion M1a contacts the inclined surface of the recess 24e.

[0076] In addition, if Figure 8 As shown, it is preferred that the dimension L1 of the first surface M1 in the depth direction Y is longer than the dimension LT of the plate portion 24 in the depth direction Y. Thus, it becomes easy to make the connecting surface 24a of the plate portion 24 come into surface contact with the first surface M1. Specifically, when the dimension LT of the plate portion 24 is approximately the same as the dimension L1 of the first surface M1, there is a risk that the plate portion 24 will hang over the third surface M3 of the mold M. In this case, a gap is generated in the resin shielding portion Mc0, and thus the possibility of the resin adhering to the connecting surface 24a becomes higher. In contrast, if the first surface M1 is made wider than the plate portion 24, the surface contact between the first surface M1 and the connecting surface 24a becomes easier, and thus it is possible to more appropriately prevent the resin from adhering to the connecting surface 24a. For example, the difference (L1-LT) between the dimension L1 of the first surface M1 and the dimension LT of the plate portion 24 is preferably 0.001 mm or more, more preferably 0.005 mm or more, and particularly preferably 0.01 mm or more. On the other hand, if the difference (L1-LT) between the dimension L1 of the first surface M1 and the dimension LT of the plate portion 24 is too large, the resin is likely to reach the front end Mc3a of the resin flow path Mc3 described later. From this point of view, the difference (L1-LT) between the dimension L1 of the first surface M1 and the dimension LT of the plate portion 24 is preferably 0.2 mm or less, more preferably 0.15 mm or less, and particularly preferably 0.1 mm or less.

[0077] (b) Surface 2 M2

[0078] The second surface M2 is a cavity surface Mcs that is spaced apart from the back surface 24b of the plate portion 24. A space is formed between the second surface M2 and the back surface 24b to be filled with resin in the injection step S40. In the following description, this space is referred to as the "first filling space Mc1." The resin filled into the first filling space Mc1 becomes the base portion 32 of the seal 30 (see Figure 2 ).

[0079] In addition, the dimension L2 of the second surface M2 in the depth direction Y is longer than the dimension LT of the plate portion 24 in the depth direction Y. Furthermore, both ends of the second surface M2 in the depth direction Y extend beyond the plate portion 24 and face the inner side surface 14c of the sealing plate 14. Hereinafter, the space where both ends of the second surface M2 face the inner side surface 14c of the sealing plate 14 is referred to as the "second filling space Mc2." The resin filled in this second filling space Mc2 becomes the internal insulating portion 34 of the seal 30 (see FIG. 1 ). Figure 2 ). In addition, the second surface M2 of the mold M extends to a position farther outward (front F and rear Rr) than the internal groove 14e of the sealing plate 14. As a result, the internal insulating portion 34 is formed in a manner covering the internal groove 14e. Thus, the adhesion between the seal 30 and the sealing plate 14 can be improved. In addition, after entering the internal groove 14e, the resin supplied to the second filling space Mc2 reaches the contact surface Ma between the inner side surface 14c of the sealing plate 14 and the mold M. Thus, it is possible to prevent a large amount of resin from being rapidly supplied to the contact surface Ma, thereby suppressing the leakage of resin to the outside of the mold M.

[0080] (c) Surface 3 M3

[0081] The third surface M3 is a cavity surface Mcs that is spaced apart from the side surface 24c of the plate portion 24. In the accommodation step S30, a resin flow path Mc3 is formed between the side surface 24c of the plate portion 24 and the third surface M3 of the mold M. Resin flows into the resin flow path Mc3 via the first filling space Mc1. The resin filled in the resin flow path Mc3 becomes the side protection portion 36 (see FIG. 3 ) that covers the side surface 24c of the plate portion 24. Figure 2 ). Furthermore, the front end Mc3a of the resin flow path Mc3 communicates with the gap S between the peripheral edge 24a1 of the connecting surface 24a and the first surface M1. Furthermore, in this embodiment, the cavity surface Mcs (i.e., the third surface M3) forming the resin flow path Mc3 is continuous along the circumference of the side surface 24c of the plate portion 24. As a result, in the manufactured electrical storage device 100, the side protection portion 36 is formed to continuously cover the side surface 24c of the plate portion 24.

[0082] (d) M4 on the 4th side

[0083] Next, the fourth surface M4 is the cavity surface Mcs that faces the outer side surface 14b of the sealing plate 14 with a gap therebetween. The space where the fourth surface M4 of the mold M faces the outer side surface 14b of the sealing plate 14 is referred to as the "fourth filling space Mc4." The resin filled in the fourth filling space Mc4 becomes the outer insulating portion 38 of the seal 30 (see Figure 2 ). In addition, the fourth surface M4 of the mold M extends to a position outside the outer groove 14d of the outer side surface 14b of the sealing plate 14. As a result, an internal insulating portion 34 covering the outer groove 14d is formed. This can improve the adhesion between the seal 30 and the sealing plate 14. In addition, similar to the above-mentioned internal groove 14e, the external groove 14d also has the function of suppressing resin leakage from the contact surface Mb between the outer side surface 14b of the sealing plate 14 and the mold M.

[0084] (4) Injection Step S40

[0085] Figure 91 is a cross-sectional view schematically showing the injection step of the manufacturing method according to the first embodiment. Figure 9 As shown, in this step, resin R is injected into the internal cavity Mc of the mold M. This allows the outer shell member (sealing plate 14) and the seal 30 (see FIG. 1 ) that seals the through hole 14a to be aligned. Figure 2 ) is integrally molded. Furthermore, the seal 30 is also integrated with the electrode terminal 20 (specifically, the plate portion 24 and the upper end portion 22a of the shaft portion 22) inserted into the through-hole 14a. The resin R filled in this step can be a thermoplastic resin such as polyethylene, polyamide, polypropylene, or polyvinyl chloride. By injecting these thermoplastic resins into the internal cavity Mc and cooling them, the seal 30 can be easily formed.

[0086] The injection of resin R in this process will be described below. The mold M in this embodiment has an injection hole Ms that passes through the mold M. The injection hole Ms is formed on the second surface M2 in a manner opposite to the back surface 24b of the plate portion 24. In addition, the injection hole Ms is connected to a resin supply source (not shown) via a delivery pipe P. The resin R supplied from the resin supply source is injected into the internal cavity Mc of the mold M via the delivery pipe P and the injection hole Ms. Moreover, the injected resin R is first filled into the first filling space Mc1, which is the space with the largest volume. Then, the resin R is supplied to the second filling space Mc2, the resin flow path Mc3, the fourth filling space Mc4, etc. via the first filling space Mc1. In this way, it is possible to prevent a large amount of resin R from being rapidly supplied to a relatively narrow space, thereby suppressing resin leakage and poor molding. In particular, by supplying the resin R to the resin flow path Mc3 via the first filling space Mc1, the supply speed of the resin R toward the front end Mc3a of the resin flow path Mc3 is reduced. This can more preferably suppress the intrusion of the resin R into the resin shielding portion Mc0.

[0087] Here, in this embodiment, a resin flow path Mc3 is formed between the side surface 24c of the plate portion 24 and the third surface M3 of the mold M. Moreover, the resin flow path Mc3 is connected to the gap S between the peripheral edge portion 24a1 of the connecting surface 24a and the first surface M1 of the mold M. Therefore, the resin R supplied in the injection step S40 is filled in the gap S through the resin flow path Mc3. Specifically, Figure 10 As shown, the resin R flowing into the resin flow path Mc3 flows into the slit S via the front end Mc3a of the resin flow path Mc3. As a result, the peripheral edge portion 24a1 of the connecting surface 24a is covered with the resin R. Then, as the resin R solidifies, the locking portion 39 covering the peripheral edge portion 24a1 of the connecting surface 24a is formed.

[0088] In addition, as described above, in the manufacturing method involved in this embodiment, the accommodation position of the electrode terminal 20 is adjusted in such a way that the inclined surface of the wedge-shaped protrusion M1a contacts the inclined surface of the recess 24e. As a result, it is possible to prevent the resin R from invading the position inside the protrusion M1a. As a result, it is possible to prevent the resin R from adhering to the central portion 24a2 of the connecting surface 24a. In addition, according to this manufacturing method, as Figure 2 As shown, a portion of the recess 24 e of the electrode terminal 20 is covered by the locking portion 39 .

[0089] In addition, it is preferable to form a roughened surface portion Rs on the surface of the sealing plate 14 and the electrode terminal 20 that contacts the resin R. This can improve the adhesion with the cured seal 30. For example, Figures 4 and 5 and Figure 7 As shown, the roughened surface portion Rs is formed on the outer side surface 14b of the sealing plate 14, the side surface 24c of the plate portion 24, the upper end portion 22a of the shaft portion 22, and the like around the through-hole 14a. Although not shown in the figure, the roughened surface portion is also formed on the inner side surface 14c of the sealing plate 14, the back surface 24b of the plate portion 24, and the like around the through-hole 14a. Furthermore, the roughened surface portion Rs can be formed by conventionally known roughening treatments (sandblasting, chemical treatment, etc.). Furthermore, it is particularly preferred that the roughened surface portion Rs be formed on the peripheral edge portion 24a1 (typically, the notch portion 24f) of the connecting surface 24a. This further enhances the connection strength between the locking portion 39 and the electrode terminal 20.

[0090] [Other embodiments]

[0091] The above describes one embodiment of the technology disclosed herein. However, the technology disclosed herein is not limited to the above embodiment. Other embodiments of the technology disclosed herein will be described below.

[0092] like Figure 3 As shown in the figure, the locking portion 39 in the first embodiment continuously covers the peripheral portion 24a1 of the connecting surface 24a over the entire circumference. However, the locking portion 39 only needs to cover at least a portion of the peripheral portion 24a1 of the connecting surface 24a and is not limited to Figure 3 For example, Figure 11 The illustrated latching portion 39 covers only the four corners of the connecting surface 24a of the planar rectangular plate portion 24. Figure 12 The illustrated locking portion 39 covers the peripheral edge portion 24 a 1 excluding the four corners of the connecting surface 24 a . Figure 11 and Figure 12 The locking portions 39 shown can restrict the upward movement of the electrode terminal 20 and prevent the seal 30 from being damaged or the electrode terminal 20 from falling off.

[0093] In addition, Figure 3、 Figure 11 In the structure shown, a recess 24e is formed between the central portion 24a2 and the peripheral portion 24a1 of the connection surface 24a. However, in the technology disclosed herein, a recess may not be formed on the connection surface of the electrode terminal. For example, Figure 12 In the electrical storage device 100 shown, no recess is formed on the connection surface 24a of the electrode terminal 20. Figure 12 In the structure shown, the locking portion 39 is formed on the peripheral portion 24a1 of the connecting surface 24a, so that the upward movement of the electrode terminal 20 can be restricted. Figure 12 In the structure shown, no recess is formed, so there is a possibility that resin may adhere to the central portion 24a2 of the connection surface 24a after the seal 30 is formed. However, if a process (grinding, etching, etc.) is performed to remove the resin adhered to the central portion 24a2 of the connection surface 24a, an electrode terminal 20 that can be connected to an external conductive member can be obtained. In particular, from the perspective of reducing the number of steps in manufacturing and improving production efficiency, as shown in FIG. Figure 3 、 Figure 11 As shown, it is preferable to form a recessed portion 24e on the connection surface 24a of the electrode terminal 20 to suppress adhesion of the resin to the central portion 24a2 of the connection surface 24a.

[0094] In addition, if Figure 2 As shown, in the first embodiment, a cutout portion 24f is formed on the peripheral portion 24a1 of the connection surface 24a, and a stopper portion 39 is formed at a position D below the central portion 24a2 of the connection surface 24a. However, this structure is not an element that limits the technology disclosed herein. For example, even if a stopper portion is formed at a position above the central portion of the connection surface, as long as the central portion of the connection surface is exposed to the outside, it can be connected to an external conductive component. For example, if a protrusion protruding downward is formed on an external conductive component (bus bar, etc.), even if a stopper portion is arranged at a position above the central portion of the connection surface, the external conductive component can be connected to the central portion of the connection surface.

[0095] The above describes the technology disclosed herein in detail. However, these are merely examples and do not limit the scope of the claims. The technology described in the claims includes various modifications and variations of the specific examples described above. Specifically, the technology disclosed herein includes the aspects described in Items 1 through 6 below.

[0096] [Project 1]

[0097] A storage device, wherein the storage device comprises: an electrode body; and a shell for accommodating the electrode body, the shell comprising: a shell component having a through hole; an electrode terminal inserted into the through hole; and a seal for sealing the through hole, which is a resin component integrated with the shell component and the electrode terminal, the electrode terminal comprising: a shaft portion inserted into the through hole; and a plate portion arranged along the shell component, the plate portion comprising: a connecting surface exposed to the outside of the shell; a back surface on the side opposite to the connecting surface; and a side surface continuous with the connecting surface and the back surface, the seal comprising: a base portion covering the back surface of the plate portion and the shell component; a side protecting portion continuous with the base portion and covering the side surface of the plate portion; and a locking portion continuous with the upper end of the side protecting portion and covering at least a portion of the peripheral edge of the connecting surface.

[0098] [Project 2]

[0099] The electric storage device according to Item 1, wherein the locking portion continuously covers the peripheral edge portion of the connecting surface over the entire circumference.

[0100] [Item 3]

[0101] According to the electricity storage device described in Item 1, the plate portion is a plate-shaped portion having a rectangular planar shape, and the locking portion covers upper surfaces of four corners of the connecting surface of the rectangular planar plate portion.

[0102] [Item 4]

[0103] The electrical storage device according to any one of items 1 to 3, wherein:

[0104] A recessed portion recessed from the connecting surface is formed between a central portion and a peripheral portion of the connecting surface.

[0105] [Item 5]

[0106] The electrical storage device according to any one of items 1 to 4, wherein the height position of the locking portion is lower than the height position of the center portion of the connecting surface.

[0107] [Item 6]

[0108] A method for manufacturing an electrical storage device, wherein the method for manufacturing the electrical storage device comprises: a step of preparing a shell component having a through hole; a step of inserting an electrode terminal into the through hole; a step of arranging the shell component and the electrode terminal in an internal cavity of a mold; and a step of injecting resin into the internal cavity of the mold to integrally mold the shell component and a sealant that seals the through hole, wherein the electrode terminal comprises: a shaft portion that is inserted into the through hole; and a plate portion that is arranged to extend along the shell component when the shaft portion is inserted into the through hole, the plate portion comprising: a connecting surface that is exposed on the outside of the shell component; a connecting surface that is connected to the connecting surface The back side on the opposite side of the connection surface; and the side surface, which is continuous with the above-mentioned connection surface and the above-mentioned back side, the above-mentioned mold comprises: a first surface, which is a cavity surface in contact with the central portion of the above-mentioned connection surface of the above-mentioned plate portion; and a third surface, which is a cavity surface opposite to the above-mentioned side surface of the above-mentioned plate portion with a gap therebetween. In the above-mentioned configuration process, a resin flow path is formed between the above-mentioned side surface of the above-mentioned plate portion and the above-mentioned third surface of the above-mentioned mold, and a gap connected to the above-mentioned resin flow path is formed between at least a portion of the peripheral portion of the above-mentioned connection surface of the above-mentioned plate portion and the above-mentioned first surface of the above-mentioned mold. In the above-mentioned one-piece molding process, the above-mentioned gap is filled with resin via the above-mentioned resin flow path.

Claims

1. An electric storage device, wherein: The power storage device comprises: Electrode body; and a housing accommodating the electrode body, The housing comprises: a housing component having a through hole; an electrode terminal inserted into the through hole; and a sealing member that seals the through hole and is a resin member integrated with the housing member and the electrode terminal; The electrode terminal has: a shaft portion inserted into the through hole; and The plate portion is arranged along the housing member. The plate portion comprises: a connecting surface exposed on the outside of the housing; a back surface on the side opposite to the connecting surface; and side surface, continuous with the connecting surface and the back surface, The sealing member comprises: a base portion covering the back surface of the plate portion and the housing member; a side protection portion continuous with the base portion and covering the side surface of the plate portion; and The locking portion is continuous with the upper end of the side protection portion and covers at least a portion of the peripheral edge of the connecting surface.

2. The power storage device according to claim 1, wherein The locking portion continuously covers the peripheral edge portion of the connecting surface over the entire circumference.

3. The power storage device according to claim 1, wherein The plate portion is a plate-shaped portion having a rectangular planar shape. The locking portion covers upper surfaces of four corners of the connecting surface of the planar rectangular plate portion.

4. The power storage device according to claim 1, wherein A recessed portion recessed from the connecting surface is formed between a central portion and a peripheral portion of the connecting surface.

5. The power storage device according to claim 1, wherein The height position of the locking portion is lower than the height position of the center portion of the connecting surface.

6. A method for manufacturing an electric storage device, wherein: The method for manufacturing the power storage device comprises: a step of preparing a housing component having a through hole; inserting an electrode terminal into the through hole; a step of placing the housing member and the electrode terminal in an internal cavity of a mold; and a step of injecting resin into the inner cavity of the mold to integrally mold the housing component and the seal that seals the through hole; The electrode terminal has: a shaft portion inserted into the through hole; and The plate portion is configured to extend along the housing member when the shaft portion is inserted into the through hole. The plate portion comprises: a connecting surface exposed on the outside of the housing component; a back surface on the side opposite to the connecting surface; and side surface, continuous with the connecting surface and the back surface, The mold has: The first surface is a cavity surface that is in surface contact with the central portion of the connecting surface of the plate portion; and The third surface is a cavity surface facing the side surface of the plate portion with a gap therebetween. In the arranging step, a resin flow path is formed between the side surface of the plate portion and the third surface of the mold, and a gap communicating with the resin flow path is formed between at least a portion of the peripheral edge portion of the connecting surface of the plate portion and the first surface of the mold. In the integral molding step, the gap is filled with resin via the resin flow path.

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