Antenna device, manufacturing method of antenna device and electronic equipment
By using tin-bismuth alloy solder to directly connect the transparent antenna and feeder at low temperature, the problems of complex traditional connection process and large signal loss are solved, and simplified connection and low-loss transmission between the transparent antenna and feeder are achieved.
Patent Information
- Application Number
- CN202510911348.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-02
- Publication Date
- 2025-09-16
AI Technical Summary
The connection process of traditional transparent antennas and feeders is complicated, the signal transmission process suffers from large losses, and the transparent base material with poor temperature resistance is prone to deformation.
Tin-bismuth alloy is used as solder, and the welding temperature is controlled below 140°C. The feed line is directly connected to the transparent antenna, avoiding the use of FPC and ACF. The low melting point characteristics of tin-bismuth alloy are used to make it suitable for transparent substrates with poor temperature resistance.
The connection process between the transparent antenna and the feeder is simplified, the loss during signal transmission is reduced, and the deformation of the transparent substrate is avoided.
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Figure CN120657436A_ABST
Abstract
Description
Technical Field
[0001] The embodiments of the present application relate to the technical field of transparent antennas, and in particular to an antenna device, a method for manufacturing an antenna device, and an electronic device. Background Art
[0002] A transparent antenna is an electromagnetic radiation device with high optical transmittance (typically >80%). It is transparent or translucent in the visible light band and can transmit or receive radio signals. Transparent antennas are widely used in electronic devices such as smartphones, tablets, and wearables. Transparent antennas in electronic devices connect to other components of the device, such as the motherboard's RF chip, via feeders to enable signal transmission.
[0003] A transparent antenna typically consists of a transparent substrate and a transparent radiating element mounted on the substrate. The transparent substrate can be made of a transparent material such as cycloolefin polymer (COP). Due to the poor temperature resistance of transparent materials like COP, traditional transparent antennas primarily use a flexible printed circuit (FPC) as the connecting medium between the transparent radiating element and the feeder. One end of the FPC is bonded to the transparent substrate using anisotropic conductive film (ACF), while the other end is soldered to the feeder. In this method, the introduction of the FPC and ACF not only increases signal loss during transmission but also complicates the connection process between the transparent antenna and the feeder. Summary of the Invention
[0004] The embodiments of the present application provide a wire device, a method for manufacturing an antenna device, and an electronic device, which can simplify the connection process between a transparent antenna and a feeder and reduce signal loss during transmission.
[0005] In order to solve the above technical problems, the embodiments of the present application provide the following technical solutions: In a first aspect of the present application, an antenna device is provided, comprising: A transparent antenna comprising a transparent substrate, a transparent radiation unit disposed on the transparent substrate, and a feeder connection portion, wherein the transparent radiation unit is connected to the feeder connection portion; a feeder; and solder, wherein one end of the feeder is soldered to the feeder connection portion via the solder; wherein the solder comprises, by weight percentage, 22%-62% tin and 38%-78% bismuth.
[0006] In an embodiment of the present application, one end of the feeder is soldered to the transparent antenna by solder, wherein the solder is a tin-bismuth alloy, and in terms of weight, the tin-bismuth alloy specifically includes 22%-62% tin and 38%-78% bismuth. In an embodiment of the present application, metallic bismuth with a low melting point is added to metallic tin, and the melting point of the resulting tin-bismuth alloy is lower than 200°C, for example, lower than 140°C. Using the tin-bismuth alloy as solder can reduce the welding temperature of the feeder and the transparent antenna to below 140°C. Therefore, the tin-bismuth alloy is suitable for welding the feeder on a transparent substrate such as COP with poor temperature resistance. In addition, the embodiment of the present application directly solders one end of the feeder to the transparent antenna by using the tin-bismuth alloy without the use of FPC and ACF, which not only reduces the signal loss during transmission, but also simplifies the connection process between the transparent antenna and the feeder.
[0007] In some embodiments, the transparent radiation unit is a transparent conductive grid, and the feed line connection portion is solid copper.
[0008] In some embodiments, the melting point of the solder is lower than the glass transition temperature of the transparent substrate.
[0009] In some embodiments, the melting point of the solder is lower than 150°C.
[0010] In some embodiments, the surface of the feeder connection portion is further provided with a surface treatment layer, and the feeder is welded to the surface treatment layer; wherein the surface treatment layer includes at least one of an organic film layer, a gold plating layer, a nickel plating layer and a tin plating layer.
[0011] In the second aspect of the present application, a method for manufacturing the antenna device as described in the first aspect is also provided, the method comprising: obtaining a transparent antenna, the transparent antenna comprising a transparent substrate and a transparent radiation unit and a feeder connection portion arranged on the transparent substrate, the transparent radiation unit being connected to the feeder connection portion; using solder to solder one end of the feeder to the feeder connection portion; wherein, in terms of weight percentage, the solder comprises 22%-62% tin and 38%-78% bismuth.
[0012] In some embodiments, soldering one end of the feeder to the feeder connection portion using solder includes: heating the solder to a soldering temperature so that the solder solders one end of the feeder to the feeder connection portion; wherein the soldering temperature is 0°C-50°C higher than the melting point of the solder.
[0013] In some embodiments, the soldering temperature is 10° C. to 30° C. higher than the melting point of the solder.
[0014] In some embodiments, before heating the solder to the soldering temperature, the method further includes: heating the solder to a pre-soldering temperature; wherein the pre-soldering temperature is 0° C.-50° C. lower than the melting point of the solder.
[0015] In a third aspect of the present application, an electronic device is further provided, which includes the antenna device described in the first aspect.
[0016] It should be understood that the contents described in the Summary of the Invention are not intended to define the key or important features of the present disclosure, nor are they intended to limit the scope of the present disclosure. Other features of the present disclosure will become readily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] To more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. Those skilled in the art can also derive other drawings based on these drawings without inventive effort.
[0018] Figure 1 is a schematic structural diagram of an antenna device provided in some embodiments of the present application; Figure 2 is a schematic structural diagram of a transparent antenna provided in some embodiments of the present application; Figure 3 is a schematic structural diagram of an antenna device provided in some other embodiments of the present application; Figure 4 is a schematic structural diagram of an electronic device provided by some embodiments of the present application; Figure 5 It is a flowchart of a method for manufacturing an antenna device provided in some embodiments of the present application. DETAILED DESCRIPTION
[0019] The principles and spirit of the present disclosure will be described below with reference to several exemplary embodiments shown in the accompanying drawings. It should be understood that the description of these specific embodiments is only intended to enable those skilled in the art to better understand and implement the present disclosure, and is not intended to limit the scope of the present disclosure in any way. In the following description and claims, unless otherwise defined, all technical and scientific terms used herein have the same meanings as commonly understood by those of ordinary skill in the art.
[0020] As used herein, the term "including" and similar terms should be understood as open inclusion, i.e., "including but not limited to." The term "based on" should be understood as "based at least in part on." The term "one embodiment" or "the embodiment" should be understood as "at least one embodiment." The terms "first," "second," etc. may refer to different or the same objects and are only used to distinguish the objects referred to, and do not imply a specific spatial order, temporal order, order of importance, etc. of the objects referred to.
[0021] For example, Figure 1 The schematic diagram of the structure of the antenna device provided by some embodiments of the present application is presented; please refer to Figure 1 The antenna device 100 includes a transparent antenna 110 and a feeder line 130. The transparent antenna 110 is soldered to one end of the feeder line 130 via solder 120. The antenna device 100 is fed by directly soldering the transparent antenna 110 and the feeder line 130 via solder 120. The other end of the feeder line 130 is connected to other components of the electronic device, such as the RF chip on the motherboard, to achieve signal transmission. For example, the feeder line 130 can transmit signals received by the transparent antenna 110 to the motherboard, or it can transmit signals from the motherboard to the transparent antenna 110 for transmission.
[0022] The transparent antenna 110 includes a transparent substrate 111, a feeder connection portion 112 disposed on the transparent substrate 111, and a transparent radiation unit (not shown). The feeder 130 is soldered to the feeder connection portion 112. In some embodiments, to prevent wrinkling or deformation of the transparent substrate 111 caused by the soldering process of the feeder 130, the melting point of the solder 120 is lower than the glass transition temperature of the transparent substrate 111. The type of transparent substrate 111 can be determined based on actual conditions and is not limited here. The transparent substrate 111 can be a rigid transparent dielectric substrate or a flexible transparent dielectric substrate. In some embodiments, the transparent substrate 111 can be a transparent polymer substrate, such as a polyethylene terephthalate (PET) substrate, a polycarbonate (PC) substrate, or a cycloolefin polymer (COP) substrate. These transparent substrates 111 can withstand temperatures not exceeding 200°C, while the soldering temperature of conventional solder paste typically exceeds 200°C. Therefore, if conventional solder paste is used to solder the transparent antenna 110 and the feed line 130 , the transparent substrate may be wrinkled and deformed.
[0023] In an embodiment of the present application, solder 120 is a tin-bismuth alloy, and the tin-bismuth alloy specifically comprises 22%-62% tin and 38%-78% bismuth, by weight. For example, the tin-bismuth alloy may comprise 22% tin and 78% bismuth, or alternatively, the tin-bismuth alloy may comprise 62% tin and 38% bismuth. In an embodiment of the present application, metallic bismuth, which has a relatively low melting point, is added to metallic tin, resulting in a tin-bismuth alloy having a melting point below 200°C; for example, the melting point of the tin-bismuth alloy may be below 150°C or below 140°C. Those skilled in the art can adjust the melting point of the tin-bismuth alloy by adjusting the mass ratio of metallic tin to metallic bismuth in the tin-bismuth alloy; generally, the higher the bismuth content in the tin-bismuth alloy, the lower the melting point of the tin-bismuth alloy. In the embodiment of the present application, the use of tin-bismuth alloy as the solder 120 can reduce the welding temperature of the feed line 130 and the transparent antenna 110 to below 140° C., so the tin-bismuth alloy is suitable for welding the feed line 130 on a transparent substrate 111 such as COP with poor temperature resistance.
[0024] In the prior art, an FPC is typically used as the connection medium between the transparent antenna 110 and the feeder 130. This not only requires consideration of the FPC's impedance matching, but the introduction of the FPC and ACF also increases signal loss during transmission, further complicating the connection process between the transparent antenna 110 and the feeder 130. In an embodiment of the present application, one end of the feeder 130 is directly soldered to the transparent antenna 110 using a tin-bismuth alloy, eliminating the need for an FPC and ACF for connecting the transparent antenna 110 and the feeder 130. This not only reduces signal loss during transmission, but also simplifies the connection process between the transparent antenna 110 and the feeder 130.
[0025] Specifically, if Figure 2 As shown, area a and area b are provided on the transparent substrate 111, wherein area a can be provided at the edge of the transparent substrate 111; area a is a feeder connection area for providing the feeder connection portion 112; area b is a transparent radiation unit setting area for providing the transparent radiation unit.
[0026] In some embodiments, the transparent radiation unit may be a transparent conductive mesh. The transparent conductive mesh may be made of a metal such as copper, silver, gold, and / or ITO; or a conductive organic material such as carbon nanotubes and / or carbon nanofillers such as graphene.
[0027] In some embodiments, to ensure a tighter connection between the feeder connection portion 112 and the feeder 130, the feeder connection portion 112 is made of solid copper. Solid copper refers to a continuous, gapless copper layer throughout the entire region a. Region a can be any suitable shape, such as a rectangle, a circle, or an irregular shape. Those skilled in the art can adjust the shape of region a based on actual needs.
[0028] In some embodiments, to increase the weld strength between the feed line 130 and the transparent antenna 110 and reduce the risk of the feed line 130 detaching from the feed line connection portion 112 after welding, a surface treatment layer 114 is provided on the surface of the feed line connection portion 112, to which the feed line 130 is welded. The surface treatment layer 114 comprises at least one of an organic film layer, a gold plating layer, a nickel plating layer, and a tin plating layer. When the feed line connection portion 112 is a copper layer, the organic film layer comprises a nitrogen-containing heterocyclic compound, such as a benzotriazole or imidazole derivative. The nitrogen-containing heterocyclic compound chemically bonds with the copper surface to form an organic film layer, i.e., an organic copper complex.
[0029] See also Figure 4 The embodiment of the present application further provides an electronic device, which includes the antenna device 41 provided in the above embodiment. For example, the antenna device 41 may be Figure 1 and Figure 3 The antenna device 100 is provided. The specific structure of the antenna device 41 can be found in the description of the antenna device in the above antenna device product embodiment, and will not be described in detail in this application.
[0030] The present application also provides a method for manufacturing an antenna device, which is used to manufacture the antenna device provided in the above embodiments, for example Figure 1 and Figure 3 The antenna device provided. For the specific structure of the antenna device, please refer to the description of the antenna device in the above antenna device product embodiment. Figure 5 , the method comprises the following steps: Step 51: Take a transparent antenna, which includes a transparent substrate, a transparent radiation unit provided on the transparent substrate, and a feeder connection portion, wherein the transparent radiation unit is connected to the feeder connection portion.
[0031] In some embodiments, step 51 specifically includes: obtaining a transparent substrate, disposing a conductive film on the surface of the transparent substrate, and etching an antenna pattern on the conductive film using a process such as a photolithography process. The antenna pattern includes a transparent radiating portion. The conductive layer can be a metal conductive layer, such as copper, silver, gold, and / or ITO; or an organic material conductive layer, such as a carbon nanofiller such as carbon nanotubes and / or graphene. In certain embodiments of the present application, the conductive film can be formed on the surface of the transparent substrate by lamination, vapor deposition, or magnetron sputtering.
[0032] In some other embodiments, step 51 specifically includes: taking a transparent substrate, and forming a transparent antenna pattern on the transparent substrate by printing (such as printing or embossing).
[0033] In some embodiments, the antenna pattern may further include a feeder connection portion. For example, when the conductive film is a copper film, the transparent radiation portion and the feeder connection portion may be etched on the conductive film using a photolithography process or the like.
[0034] Step 52: Solder one end of the feeder to the feeder connection portion using solder; wherein the solder comprises 22%-62% tin and 38%-78% bismuth by weight.
[0035] In some embodiments, step 52 specifically includes heating the solder to a soldering temperature so that the solder solders one end of the feeder to the feeder connection portion, wherein the soldering temperature is 0°C to 50°C higher than the melting point of the solder. In other embodiments, to further improve the soldering effect, the soldering temperature is 10°C to 30°C higher than the melting point of the solder. Specifically, the solder can be heated at the soldering temperature for 5 seconds to 120 seconds.
[0036] In some embodiments, before heating the solder to the soldering temperature, the method further includes heating the solder to a pre-soldering temperature; wherein the pre-soldering temperature is 0°C to 50°C lower than the melting point of the solder. Specifically, the solder can be heated at the pre-soldering temperature for 5 seconds to 120 seconds. In this case, the solder is heated sequentially within two different temperature gradients, the pre-soldering temperature and the soldering temperature, to achieve a better soldering effect.
[0037] In some embodiments, one end of the feeder line can be soldered to the feeder line connection portion using solder through a reflow process. In the reflow process, the solder can be heated by hot air, infrared radiation, or steam.
[0038] Before soldering, the solder can be in the form of a wire or a paste. When the solder is paste, the paste can be printed on the surface of the feeder connector using a process such as screen printing. One end of the feeder is then placed on the printed paste and heated using a reflow process, or directly using a hot air gun. In the reflow process, the temperature range for heating the solder paste includes a pre-soldering temperature and a soldering temperature, set in chronological order. The pre-soldering temperature is from T-40°C to T, for a period of 5 seconds to 120 seconds; the soldering temperature is from T to T+20°C, where T represents the melting point of the solder. For example, T can be 140°C.
[0039] In some embodiments, before step 52 , the method further includes: performing surface treatment on the surface of the feeder connection portion, thereby forming a surface treatment layer on the surface of the feeder connection portion.
[0040] In some embodiments, when the feeder connection is solid copper, the surface treatment process can specifically be an organic solderability protection (OSP) process. The OSP process utilizes organic compounds (such as benzotriazole and imidazole derivatives) to chemically react with the copper surface, forming a molecular-level organic metal complex protective film. This protective film is typically 0.2μm to 0.5μm thick and is chemically stable, insulating the copper from air and moisture, preventing oxidation. The protective film is also solderable: during soldering, the protective film decomposes under the high temperature of the solder and the action of the flux, revealing a fresh copper surface and ensuring a good bond between the solder and the copper. Alternatively, the surface treatment process can be electroplating or chemical plating. Electroplating or chemical plating can deposit a uniform metal coating, such as gold, nickel, and / or tin, on the surface of the feeder connection. This metal coating protects the copper surface of the feeder connection from oxidation and provides a good solderability surface for subsequent soldering and assembly.
[0041] In an embodiment of the present application, the feeding method of the antenna device is to directly solder the transparent antenna and the feeder through solder. Specifically, one end of the feeder is soldered to the transparent antenna through solder, wherein the solder is a tin-bismuth alloy, and in terms of weight, the tin-bismuth alloy specifically includes 22%-62% tin and 38%-78% bismuth. In the embodiment of the present application, metallic bismuth with a low melting point is added to metallic tin, and the melting point of the resulting tin-bismuth alloy is lower than 200°C, for example, it can be lower than 140°C. Using the tin-bismuth alloy as solder can reduce the welding temperature of the feeder and the transparent antenna to below 140°C. Therefore, the tin-bismuth alloy is suitable for welding the feeder on a transparent substrate such as COP with poor temperature resistance. In addition, the embodiment of the present application directly solders one end of the feeder to the transparent antenna through the tin-bismuth alloy without the use of FPC and ACF, which not only reduces the signal loss during transmission, but also simplifies the connection process of the transparent antenna and the feeder.
[0042] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Under the concept of the present invention, the technical features in the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations in different aspects of the present invention as described above. For the sake of simplicity, they are not provided in detail. Although the present invention has been described in detail with reference to the above embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions described in the above embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present invention.
Claims
1. An antenna device, characterized in that: The antenna device comprises: A transparent antenna, comprising a transparent substrate, a transparent radiation unit provided on the transparent substrate, and a feeder connection portion, wherein the transparent radiation unit is connected to the feeder connection portion; feeder; Solder, one end of the feeder is soldered to the feeder connection portion via the solder; Wherein, the solder comprises 22%-62% of tin and 38%-78% of bismuth in terms of weight percentage.
2. The device according to claim 1, characterized in that The transparent radiation unit is a transparent conductive grid, and the feeder connection portion is solid copper.
3. The device according to claim 1, characterized in that The melting point of the solder is lower than the glass transition temperature of the transparent substrate.
4. The device according to claim 3, characterized in that The melting point of the solder is lower than 150°C.
5. The device according to any one of claims 1 to 4, characterized in that: The surface of the feeder connection portion is further provided with a surface treatment layer, and the feeder is welded to the surface treatment layer; Wherein, the surface treatment layer includes at least one of an organic film layer, a gold plating layer, a nickel plating layer and a tin plating layer.
6. A method for manufacturing the antenna device according to any one of claims 1 to 5, characterized in that: The method comprises: A transparent antenna is provided, wherein the transparent antenna comprises a transparent substrate, a transparent radiation unit provided on the transparent substrate, and a feeder connection portion, wherein the transparent radiation unit is connected to the feeder connection portion; Soldering one end of the feeder to the feeder connection portion using solder; Wherein, the solder comprises 22%-62% of tin and 38%-78% of bismuth in terms of weight percentage.
7. The method according to claim 6, characterized in that The method of soldering one end of the feeder to the feeder connection portion by soldering comprises: heating the solder to a soldering temperature so that the solder solders one end of the feeder to the feeder connection portion; The soldering temperature is 0° C.-50° C. higher than the melting point of the solder.
8. The method according to claim 7, characterized in that The soldering temperature is 10° C. to 30° C. higher than the melting point of the solder.
9. The method according to claim 7, characterized in that Before heating the solder to the soldering temperature, the method further comprises: heating the solder to a pre-soldering temperature; Wherein, the pre-soldering temperature is 0° C.-50° C. lower than the melting point of the solder.
10. An electronic device, characterized in that: The electronic device comprises the antenna device according to any one of claims 1 to 5.