Ultraviolet alkaline developing resin curing oven

The UV alkaline developing resin curing furnace with multi-angle UV lamp irradiation and adjustable temperature inner cavity structure solves the problem of uniform curing of complex curved or multi-sided circuit boards, thereby improving production efficiency and product precision.

CN120659244APending Publication Date: 2025-09-16MAOMING GREEN CHEMICAL RESEARCH INSTITUTE +2
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Patent Information

Application Number
CN202510927930.X
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-07-07
Publication Date
2025-09-16

AI Technical Summary

Technical Problem

Existing developing resin curing devices are difficult to achieve uniform curing on complex curved surfaces or multi-sided resins, and cannot meet the manufacturing requirements of special circuit boards.

Method used

A UV alkaline developing resin curing furnace was designed, which uses multi-angle UV lamp irradiation combined with a reflective layer and a temperature-adjustable inner cavity structure to ensure uniform curing of the resin on complex curved surfaces or multi-sided circuit boards.

Benefits of technology

It achieves uniform curing of complex curved surfaces or multi-sided circuit boards, improves production efficiency and product precision, and adapts to the optimal curing temperature requirements of different resins.

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Abstract

The invention discloses an ultraviolet alkaline developing resin curing oven, and particularly relates to the technical field of resin curing, the ultraviolet alkaline developing resin curing oven comprises a bottom plate, the bottom plate extends upwards to form two vertical optical shafts, the two optical shafts are jointly and fixedly connected with a lower hemispherical shell, and the two optical shafts are jointly and slidably connected with an upper hemispherical shell matched with the lower hemispherical shell; a lifting assembly used for lifting the upper hemispherical shell is installed on the cross rod, an inner cavity formed by the upper hemispherical shell and the lower hemispherical shell is communicated with a first ventilation pipe and a second ventilation pipe, ultraviolet lamp beads are evenly distributed on the spherical wall of the inner cavity formed by the upper hemispherical shell and the lower hemispherical shell, and the first ventilation pipe is communicated with a switcher; the first ventilation pipe is communicated with the round pipe at one end of the switcher, the second ventilation pipe is communicated with the round pipe at one end of the switcher, the two ends of the switcher are in sliding connection with switching bases respectively, the two switching bases are jointly and fixedly connected with a temperature adjusting box, and the circuit board manufacturing method is suitable for manufacturing special circuit boards with complex curved surfaces or multiple surfaces.
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Description

Technical Field

[0001] The invention belongs to the technical field of resin curing, and in particular relates to an ultraviolet alkaline developing resin curing furnace. Background Art

[0002] UV-alkaline-developable resins are special photosensitive materials that undergo chemical changes under ultraviolet light and develop specific patterns during subsequent alkaline solution treatment. These resins typically contain photoinitiators that decompose under ultraviolet (UV) light and produce free radicals or acids, which promote crosslinking or decomposition reactions in the resin, forming areas that are etch-resistant or soluble in alkaline solutions. UV-alkaline-developable resins are used in the photolithography process in printed circuit boards (PCBs), forming precise circuit patterns through UV exposure and alkaline solution development, supporting microfabrication and high-density interconnect board manufacturing. They can also serve as a protective layer, providing electrical insulation and mechanical protection, simplifying the production process, and improving efficiency and product precision.

[0003] Existing UV curing devices for developing resins typically use flat-panel UV curing lamps to cure flat-panel circuit boards. These devices have limited irradiation angles, making it difficult to cure complex curved or multi-sided surfaces with the same desired effect in the same time. This makes them unsuitable for manufacturing specialized circuit boards with complex curved or multi-sided surfaces (often used in art production). Therefore, a new UV alkaline developing resin curing oven is needed. Summary of the Invention

[0004] In order to solve the above problems, the present invention discloses an ultraviolet alkaline developing resin curing furnace.

[0005] To achieve the above object, the technical solution of the present invention is as follows:

[0006] A UV alkaline developing resin curing furnace comprises a base plate, wherein the base plate has two vertical optical axes extending upward, the two optical axes are fixedly connected to a lower hemispherical shell, and the two optical axes are slidably connected to an upper hemispherical shell adapted to the lower hemispherical shell, the tops of the two optical axes are fixedly connected to a cross bar, and the cross bar is equipped with a lifting assembly for lifting the upper hemispherical shell, the inner cavity formed by the upper and lower hemispherical shells is connected to a first ventilation pipe and a second ventilation pipe, and the inner cavity wall formed by the upper and lower hemispherical shells is provided with uniformly distributed UV lamp beads, the first ventilation pipe is connected to a switch, the first ventilation pipe is connected to a circular pipe at one end of the switch, and the second ventilation pipe is connected to a circular pipe at one end of the switch. At one end of the circular tube, both ends of the switch are respectively slidably connected to a switching seat, and the two switching seats are commonly fixedly connected to a temperature control box. One end of the temperature control box is provided with two independent isolation chambers, and the temperature control chamber at the other end of the temperature control box is provided with a semiconductor refrigeration plate that divides the temperature control chamber into a cold chamber and a hot chamber. Fans are installed at the partition through holes between the isolation chamber and the cold chamber, and fans are also installed at the partition through holes between the isolation chamber and the hot chamber. Two end through holes are provided at both ends of the temperature control box, the end through hole of the hot chamber is coaxial with the end through hole of one of the isolation chambers, and the end through hole of the cold chamber is coaxial with the end through hole of the other isolation chamber, and the two adjacent end through holes are respectively coaxial with the two end rounded corners of the same switching seat.

[0007] As a preferred technical solution of the present invention, each optical axis is slidably sleeved with a pressure spring, the top of each pressure spring is pressed against the crossbar, and the bottom of each pressure spring is pressed against the upper hemispherical shell.

[0008] As a preferred technical solution of the present invention, the lifting assembly includes a rotating shaft rotatably connected to the cross rod, the rotating shaft is coaxially fixed with a reel and a ratchet, the cross rod is rotatably connected to a pawl adapted to the ratchet, the pawl is connected to a leaf spring that presses the acute-angle end of the pawl toward the ratchet, the reel is wound with a pull rope, and the free end of the pull rope is fixedly connected to the upper hemispherical shell.

[0009] As a preferred technical solution of the present invention, the crossbar is rotatably connected to a straight plate extrusion rod, and the straight plate extrusion head of the straight plate extrusion rod is arranged on the side of the pawl where the leaf spring is not arranged.

[0010] As a preferred technical solution of the present invention, the cross bar is provided with an acute-angle notch for installing the pawl and the leaf spring.

[0011] As a preferred technical solution of the present invention, a plurality of fins extending from both the cold end and the hot end of the semiconductor refrigeration plate are in the same direction as the airflow.

[0012] As a preferred technical solution of the present invention, when the circular tube at the end of the switch is coaxial with the rounded corner of one end of the switch seat, the circular tube is coaxially aligned with one of the end through holes of the temperature control box, and the blades on both sides of the circular tube cannot cover the adjacent end through holes.

[0013] As a preferred technical solution of the present invention, the upper hemispherical shell and the lower hemispherical shell are both provided with cavities, and the two cavities are respectively connected to the first ventilation pipe and the second ventilation pipe, and the cavities of the upper hemispherical shell and the lower hemispherical shell are both connected to the inner cavity through a number of through holes evenly distributed on the inner cavity wall.

[0014] As a preferred technical solution of the present invention, the bottom of the lower hemispherical shell is threadedly connected to a bracket, and the bracket is installed with a temperature sensor.

[0015] As a preferred technical solution of the present invention, the inner cavity wall formed by the upper hemispherical shell and the lower hemispherical shell is coated with a reflective layer.

[0016] The beneficial effects of the present invention are:

[0017] First, the present application is provided with UV lamp beads to illuminate the object to be light-cured from multiple angles, and the UV light reflected by the reflective layer further reduces the blind angle of illumination, which is suitable for the manufacture of special circuit boards with complex curved surfaces or multiple surfaces, ensuring that the liquid resin on the outer surface of the special circuit board has the same curing effect on the resin in the same time;

[0018] 2. The present application is provided with a temperature regulating box connected to the curing cavity, which can heat up and cool down the curing cavity, adapting to the curing needs of UV-curable resins with different optimal curing temperatures and having strong versatility. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 Schematic diagram of the overall structure of an embodiment of the present invention;

[0020] Figure 2 This is an exploded view of the lower hemispherical shell, upper hemispherical shell, bracket, temperature sensor and UV lamp beads according to an embodiment of the present invention;

[0021] Figure 3 is a cross-sectional view of the lower hemispherical shell of an embodiment of the present invention;

[0022] Figure 4 This is a schematic structural diagram of a crossbar and a lifting assembly according to an embodiment of the present invention;

[0023] Figure 5 This is a schematic diagram of the lifting assembly structure without the pull rope according to an embodiment of the present invention;

[0024] Figure 6 This is a schematic structural diagram of a crossbar, ratchet, pawl, leaf spring, and straight plate extrusion rod according to an embodiment of the present invention;

[0025] Figure 7 A cross-sectional view of a temperature control box, a switching seat, a switch, a fan, and a semiconductor refrigeration chip according to an embodiment of the present invention;

[0026] Figure 8 This is a structural diagram of a switching seat and a switch according to an embodiment of the present invention.

[0027] List of Figure Symbols:

[0028] 1. Base plate; 2. Optical axis; 3. Lower hemispherical shell; 4. Upper hemispherical shell; 5. Pressure spring; 6. Crossbar;

[0029] 7. Lifting assembly; 701. Rotating shaft; 702. Reel; 703. Ratchet; 704. Pawl; 705. Leaf spring; 706. Straight plate extrusion rod; 707. Pull rope;

[0030] 8. First ventilation pipe; 9. Second ventilation pipe; 10. Temperature control box; 11. Switching seat; 12. Switcher; 13. Fan; 14. Semiconductor cooling plate; 15. Bracket; 16. Temperature sensor; 17. UV lamp beads. DETAILED DESCRIPTION

[0031] The present invention will be further explained below with reference to the accompanying drawings and specific embodiments. It should be understood that the following specific embodiments are only used to illustrate the present invention and are not used to limit the scope of the present invention.

[0032] See also Figure 1-8 A UV alkaline developing resin curing furnace comprises a base plate 1 with two vertical optical axes 2 extending upward therefrom. The two optical axes 2 are fixedly connected to a lower hemispherical shell 3 and slidably connected to an upper hemispherical shell 4 that mates with the lower hemispherical shell 3. A crossbar 6 is fixedly connected to the tops of the two optical axes 2, and the crossbar 6 is equipped with a lifting assembly 7 for lifting the upper hemispherical shell 4. Each optical axis 2 is slidably fitted with a pressure spring 5, the top of each pressure spring 5 abutting the crossbar 6, and the bottom of each pressure spring 5 abutting the upper hemispherical shell 4. The inner cavity formed by the upper and lower hemispherical shells 4 and 3 is connected to a first vent pipe 8 and a second vent pipe 9, and the inner wall of the cavity formed by the upper and lower hemispherical shells 4 and 3 is provided with uniformly distributed UV lamp beads 17. A bracket 15 is threadedly connected to the bottom of the lower hemispherical shell 3, and the bracket 15 is equipped with a temperature sensor 16. The bracket 15 can be replaced according to the shape of the object being cured. The temperature sensor 16 is sleeved on the rod of the bracket 15. A signal line (not shown in the drawings) of the temperature sensor 16 passes through the lower hemispherical shell 3 and is electrically connected to an external control board.

[0033] Both the upper hemispherical shell 4 and the lower hemispherical shell 3 are provided with cavities, which are connected to the first and second vent tubes 8 and 9, respectively. These cavities are connected to the inner cavity via several evenly distributed through-holes in the inner cavity wall. One of the first and second vent tubes 8 and 9 serves as the air supply pipe, while the other serves as the exhaust pipe. The joint of the upper hemispherical shell 4 is equipped with a raised ring, and the lower hemispherical shell 3 is provided with a groove for the raised ring. The inner cavity wall formed by the upper hemispherical shell 4 and the lower hemispherical shell 3 is coated with a reflective layer.

[0034] The first ventilation pipe 8 is connected to the switch 12, and the first ventilation pipe 8 is connected to the circular tube at one end of the switch 12, and the second ventilation pipe 9 is connected to the circular tube at one end of the switch 12. The two ends of the switch 12 are connected by a vertically arched rod. The two ends of the switch 12 are respectively slidably connected to the switching seat 11, and the two switching seats 11 are fixedly connected to the temperature control box 10. One end of the temperature control box 10 is provided with two independent isolation chambers, and the temperature control chamber at the other end of the temperature control box 10 is provided with a semiconductor refrigeration plate 14 that divides the temperature control chamber into a cold chamber and a hot chamber. A fan 13 is installed at the partition through hole between the isolation chamber and the cold chamber, and a fan 13 is also installed at the partition through hole between the isolation chamber and the hot chamber. Two end through holes are provided at both ends of the temperature control box 10. The end through hole of the hot chamber is coaxial with the end through hole of one of the isolation chambers, and the end through hole of the cold chamber is coaxial with the end through hole of the other isolation chamber. The two adjacent end through holes are respectively coaxial with the two end rounded corners of the same switching seat 11.

[0035] When the round tube at the end of the switch 12 is coaxial with one of the rounded corners of the switch seat 11, the round tube is coaxially aligned with one of the end through holes of the thermostat 10, and the blades on both sides of the round tube cannot cover the adjacent end through holes. The switch seat 11 is provided with notches at both ends for the blades to pass through.

[0036] A plurality of fins extending from both the cold end and the hot end of the semiconductor refrigeration plate 14 are in the same direction as the airflow. The fins on both sides of the semiconductor refrigeration plate 14 extend into the cold cavity and the hot cavity of the temperature regulating box 10 respectively.

[0037] Lifting assembly 7 includes a rotating shaft 701 rotatably connected to crossbar 6, with a coaxial turntable mounted on one end. A reel 702 and ratchet 703 are coaxially mounted on shaft 701. A pawl 704, adapted for ratchet 703, is rotatably connected to crossbar 6. Pawl 704 is connected to a leaf spring 705 that presses the acute-angled end of pawl 704 toward ratchet 703. A pull cord 707 is wound around reel 702, the free end of which is fixedly connected to upper hemispherical shell 4.

[0038] The crossbar 6 is rotatably connected to a straight-plate squeezing rod 706, and the straight-plate squeezing head of the straight-plate squeezing rod 706 is located on the side of the pawl 704 where the leaf spring 705 is not located. When the straight-plate squeezing rod 706 is rotated, the straight-plate squeezing head rotates and squeezes the pawl 704, causing the acute-angled end of the pawl 704 to disengage from the ratchet 703, allowing the ratchet 703 to rotate freely, allowing the reel 702 to release the pull rope 707.

[0039] The crossbar 6 is provided with an acute-angled notch for mounting the pawl 704 and the leaf spring 705. The acute-angled notch of the crossbar 6 is provided with a rotating shaft rotatably connected to the rounded end of the pawl 704.

[0040] Working principle:

[0041] When placing the object to be photocured, first rotate the turntable of the rotating shaft 701, and the reel 702 rotates to wind the pull rope 707, and the pull rope 707 pulls the upper hemispherical shell 4 and the lower hemispherical shell 3 apart. Since the pawl 704 controls the unidirectional rotation of the ratchet 703, when the turntable of the rotating shaft 701 stops rotating, the upper hemispherical shell 4 is fixed on the top of the optical axis 2, and then a suitable bracket 15 is installed on the inner wall of the lower hemispherical shell 3 (the temperature sensor 16 is now mounted on the rod of the bracket 15). The object to be photocured (a special circuit board with complex curved surfaces or multiple surfaces) is placed on the bracket 15, and the object is as close as possible to the top of the optical axis 2. At the center of the lower hemispherical shell 3, the straight extrusion rod 706 is then rotated, and the straight extrusion head rotates to squeeze the pawl 704, and the acute-angled end of the pawl 704 disengages from the ratchet 703, allowing the ratchet 703 to rotate freely and the reel 702 to release the pull rope 707. Under the elastic force of the pressure spring 5, the upper hemispherical shell 4 moves downward and is assembled with the lower hemispherical shell 3 (at the same time, the turntable of the rotating shaft 701 is held and slowly released to rotate the rotating shaft 701). Then the ultraviolet lamp beads 17 are turned on to irradiate the object to be photocured from multiple angles, and the ultraviolet light reflected by the reflective layer further reduces the blind spots of light exposure;

[0042] While the resin is being cured by ultraviolet light, the semiconductor refrigeration chip 14 and the fan 13 in the temperature regulating box 10 are powered on and started. When the inner cavity formed by the upper hemispherical shell 4 and the lower hemispherical shell 3 needs to be cooled, the switch 12 is moved so that the round tube at one end is aligned with the end through hole of the cold cavity, and the round tube at the other end of the switch 12 is moved to align with the end through hole of the isolation cavity coaxial with the end through hole of the cold cavity, so that the cold air in the cold cavity first enters the cavity of the upper hemispherical shell 4 or the lower hemispherical shell 3 through the air delivery pipe and then disperses into the inner cavity through the several through holes of the inner cavity wall. Then the air in the inner cavity is discharged into the cavity of the upper hemispherical shell 4 or the lower hemispherical shell 3 through the several through holes of the inner cavity wall, so that the air in the inner cavity enters the cold cavity through the exhaust pipe for circulation. The air in the hot cavity directly exchanges with the atmosphere to cool down; when the inner cavity formed by the upper hemispherical shell 4 and the lower hemispherical shell 3 needs to be heated, the switch 12 is moved so that one end of the circular tube is aligned with the end through hole of the hot cavity, and the other end of the circular tube is moved to align with the end through hole of the isolation cavity coaxial with the end through hole of the hot cavity. This allows the hot air in the hot cavity to first enter the cavity of the upper hemispherical shell 4 or the lower hemispherical shell 3 through the air pipe and then disperse into the inner cavity through the multiple through holes in the inner cavity wall. The air in the inner cavity is then discharged into the cavity of the upper hemispherical shell 4 or the lower hemispherical shell 3 through the multiple through holes in the inner cavity wall, so that the air in the inner cavity enters the hot cavity through the exhaust pipe for circulation. At this time, the air in the cold cavity directly exchanges with the atmosphere to heat up. Since the optimal curing temperatures of different UV-curable resins vary slightly, a semiconductor refrigeration plate 14 is used to adjust the temperature within a small range.

[0043] This application is only suitable for the manual production of small batches of special electric plates.

[0044] It should be noted that the above content merely illustrates the technical idea of ​​the present invention and cannot be used to limit the scope of protection of the present invention. For ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications all fall within the scope of protection of the claims of the present invention.

Claims

1. A UV alkaline developing resin curing furnace, comprising a bottom plate (1), characterized in that: The bottom plate (1) is provided with two vertical optical axes (2) extending upwards, the two optical axes (2) are fixedly connected to a lower hemispherical shell (3), and the two optical axes (2) are slidably connected to an upper hemispherical shell (4) adapted to the lower hemispherical shell (3), the tops of the two optical axes (2) are fixedly connected to a crossbar (6), and the crossbar (6) is provided with a lifting assembly (7) for lifting the upper hemispherical shell (4), the inner cavity formed by the upper hemispherical shell (4) and the lower hemispherical shell (3) is connected to a first ventilation pipe (8) and a second ventilation pipe (9), and the inner cavity wall formed by the upper hemispherical shell (4) and the lower hemispherical shell (3) is provided with uniformly distributed ultraviolet lamp beads (17), the first ventilation pipe (8) is connected to a switch (12), the first ventilation pipe (8) is connected to one end of the circular tube of the switch (12), and the second ventilation pipe (9) is connected to the switch (12). At one end of the circular tube of the switch (12), the two ends of the switch (12) are respectively slidably connected to a switching seat (11), and the two switching seats (11) are fixedly connected to a temperature control box (10). One end of the temperature control box (10) is provided with two independent isolation chambers, and the temperature control chamber at the other end of the temperature control box (10) is provided with a semiconductor refrigeration plate (14) for dividing the temperature control chamber into a cold chamber and a hot chamber. A fan (13) is installed at the partition through hole between the isolation chamber and the cold chamber, and a fan (13) is also installed at the partition through hole between the isolation chamber and the hot chamber. Two end through holes are provided at both ends of the temperature control box (10), the end through hole of the hot chamber is coaxial with the end through hole of one of the isolation chambers, and the end through hole of the cold chamber is coaxial with the end through hole of the other isolation chamber, and the two adjacent end through holes are coaxial with the rounded corners at both ends of the same switching seat (11).

2. The UV alkaline developing resin curing furnace according to claim 1, characterized in that: Each optical axis (2) is slidably sleeved with a pressure spring (5), the top of each pressure spring (5) is pressed against the crossbar (6), and the bottom of each pressure spring (5) is pressed against the upper hemispherical shell (4).

3. The UV alkaline developing resin curing furnace according to claim 1, characterized in that: The lifting assembly (7) comprises a rotating shaft (701) rotatably connected to the crossbar (6); a reel (702) and a ratchet (703) are coaxially fixedly sleeved on the rotating shaft (701); a pawl (704) adapted to the ratchet (703) is rotatably connected to the crossbar (6); the pawl (704) is connected to a leaf spring (705) for pressing the acute-angle end of the pawl (704) toward the ratchet (703); a pull rope (707) is wound around the reel (702), and the free end of the pull rope (707) is fixedly connected to the upper hemispherical shell (4).

4. The UV alkaline developing resin curing furnace according to claim 3, characterized in that: The crossbar (6) is rotatably connected to a straight plate extrusion rod (706), and a straight plate-shaped extrusion head of the straight plate extrusion rod (706) is arranged on a side of the pawl (704) where no leaf spring (705) is arranged.

5. The UV alkaline developing resin curing furnace according to claim 3, characterized in that: The crossbar (6) is provided with an acute-angle notch for mounting a pawl (704) and a leaf spring (705).

6. The UV alkaline developing resin curing furnace according to claim 1, characterized in that: A plurality of fins extending from both the cold end and the hot end of the semiconductor refrigeration plate (14) are arranged in the same direction as the air flow.

7. The UV alkaline developing resin curing furnace according to claim 1, characterized in that: When the round tube at the end of the switch (12) is coaxial with one of the rounded corners of the switch seat (11), the round tube is coaxially aligned with one of the end through holes of the temperature control box (10), and the blades on both sides of the round tube cannot cover the adjacent end through holes.

8. The UV alkaline developing resin curing furnace according to claim 1, characterized in that: The upper hemispherical shell (4) and the lower hemispherical shell (3) are both provided with cavities, and the two cavities are respectively connected to the first ventilation pipe (8) and the second ventilation pipe (9), and the cavities of the upper hemispherical shell (4) and the lower hemispherical shell (3) are both connected to the inner cavity through a plurality of through holes evenly distributed on the inner cavity wall.

9. The UV alkaline developing resin curing furnace according to claim 1, characterized in that: The bottom of the lower hemispherical shell (3) is threadedly connected to a bracket (15), and a temperature sensor (16) is installed on the bracket (15).

10. The UV alkaline developing resin curing furnace according to claim 1, characterized in that: The inner cavity wall formed by the upper hemispherical shell (4) and the lower hemispherical shell (3) is coated with a reflective layer.