Electronic equipment protective shell

Abstract

The invention provides an electronic equipment protection shell, and relates to the technical field of heat dissipation, and the electronic equipment protection shell comprises a shell and a piezoelectric jet heat dissipation device. The shell is used for being embedded into electronic equipment and comprises a bottom plate and a frame surrounding the bottom plate. The piezoelectric jet flow heat dissipation device is movably connected with the bottom plate and comprises a jet flow hole; wherein the base plate is internally provided with a circuit driving plate, the circuit driving plate is electrically connected with the piezoelectric jet flow heat dissipation device, and the circuit driving plate is configured to drive the piezoelectric jet flow heat dissipation device to spray fluid from the jet flow hole so as to cool the electronic equipment.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of heat dissipation technology, and in particular, to a protective case for an electronic device. Background Art

[0002] As consumer electronics products (such as laptops, high-performance smartphones, and tablets) evolve toward thinner, lighter, and more powerful performance, their power consumption and heat generation are rapidly increasing. Heat dissipation has become a key bottleneck restricting device performance, user experience, and product reliability. For some high-performance products, passive cooling is no longer sufficient, so active cooling is being used to address overheating of core components like the CPU. Summary of the Invention

[0003] The embodiment of the present application provides an electronic device protective case, aiming to solve the problem of how to reduce the heat dissipation efficiency of the electronic device.

[0004] An embodiment of the present application provides an electronic device protective case, the electronic device protective case comprising:

[0005] A housing for embedding an electronic device, comprising a base plate and a frame surrounding the base plate;

[0006] A piezoelectric jet heat dissipation device, movably connected to the bottom plate, comprising a jet hole;

[0007] A circuit driving board is provided in the base plate, the circuit driving board is electrically connected to the piezoelectric jet heat dissipation device, and the circuit driving board is configured to drive the piezoelectric jet heat dissipation device to eject fluid from the jet hole to cool the electronic device.

[0008] In some electronic device protective cases provided in embodiments of the present application, the electronic device protective case further includes an external power supply, which is disposed within the base plate and electrically connected to the circuit driving board.

[0009] In some electronic device protective cases provided in embodiments of the present application, the orthographic projections of the external power supply and the circuit driving board on the bottom plate do not overlap with each other.

[0010] In some electronic device protective cases provided in embodiments of the present application, the electronic device protective case further includes a power interface, which is electrically connected to the circuit driving board and the electronic device respectively, and the electronic device is configured to supply power to the circuit driving board through the power interface.

[0011] In some electronic device protective cases provided by embodiments of the present application, the electronic device protective case includes a bracket, the bracket is movably connected to the bottom plate, and the bracket is configured to be retractable or unfolded;

[0012] The piezoelectric jet heat dissipation device is arranged on a side of the bracket close to the bottom plate, and the jet hole is arranged toward the bottom plate.

[0013] In some electronic device protective cases provided by embodiments of the present application, the case includes a switch structure electrically connected to the circuit driving board;

[0014] When the bracket is unfolded, the switch structure is configured to control the circuit driving board to drive the piezoelectric jet heat dissipation device to eject fluid from the jet hole to cool the electronic device.

[0015] In some electronic device protective cases provided in embodiments of the present application, the bracket is connected to the base plate via a rotating member, and the rotating member is configured to enable the bracket to support the electronic device in a first direction and a second direction, where the first direction and the second direction intersect.

[0016] In some electronic device protective cases provided in embodiments of the present application, the bracket and the base plate are connected via a rotating shaft.

[0017] In some electronic device protective cases provided by embodiments of the present application, the bottom plate includes a groove, the piezoelectric jet heat dissipation device is movably connected to a sidewall of the groove, and the jet hole is arranged toward the electronic device;

[0018] The piezoelectric jet heat dissipation device is configured to be embedded in the groove or supported from the groove.

[0019] In some electronic device protective cases provided by embodiments of the present application, the case includes a switch structure electrically connected to the circuit driving board;

[0020] When the piezoelectric jet heat sink is supported from the groove, the switch structure is configured to control the circuit driving board to drive the piezoelectric jet heat sink to eject fluid from the jet hole to cool the electronic device.

[0021] In some electronic device protective cases provided in embodiments of the present application, the piezoelectric jet heat dissipation device is connected to the side wall of the groove via a press-and-pop structure.

[0022] In some electronic device protective cases provided by embodiments of the present application, the bottom plate includes an insulating material, and the insulating material wraps the circuit driving board;

[0023] The driving circuit board includes an electrically connected boost circuit and a conversion circuit, wherein the boost circuit is configured to increase the amplitude of the power supply voltage and transmit it to the conversion circuit, and the conversion circuit is configured to convert the square wave signal output by the boost circuit into a sine wave signal and transmit it to the piezoelectric jet heat dissipation device.

[0024] In some electronic device protective cases provided in the embodiments of the present application, the piezoelectric jet heat dissipation device includes:

[0025] a frame, comprising the jet hole;

[0026] a diaphragm layer connected to the frame and configured to form a cavity with the frame;

[0027] A piezoelectric actuator assembly connected to the circuit drive board and the diaphragm layer;

[0028] The jet hole connects the interior of the cavity with the exterior, and the piezoelectric actuator assembly is configured to drive the diaphragm layer to vibrate and cause the fluid in the cavity to be ejected from the jet hole.

[0029] In some electronic device protective cases provided by embodiments of the present application, the frame includes a connected fixing frame, a supporting frame, and a hole plate, the diaphragm layer is located between the fixing frame and the supporting frame, the hole plate is located on a side of the supporting frame away from the diaphragm layer, and the hole plate is provided with a plurality of the jet holes;

[0030] Wherein, the diaphragm layer, the supporting frame and the orifice plate are configured to form the cavity.

[0031] In some electronic device protective cases provided in embodiments of the present application, the piezoelectric jet heat dissipation device further includes an intermediate layer, which is located between the piezoelectric actuator assembly and the diaphragm layer.

[0032] Beneficial effects:

[0033] An embodiment of the present application provides an electronic device protective case, which includes: a shell and a piezoelectric jet heat dissipation device; the shell is used to embed the electronic device, and includes a base plate and a frame surrounding the base plate; the piezoelectric jet heat dissipation device is movably connected to the base plate and includes a jet hole; wherein a circuit driving board is provided in the base plate, the circuit driving board is electrically connected to the piezoelectric jet heat dissipation device, and the circuit driving board is configured to drive the piezoelectric jet heat dissipation device to eject fluid from the jet hole to cool the electronic device.

[0034] This application sets a piezoelectric jet heat sink in the electronic device protective case, and drives the piezoelectric jet heat sink through the circuit driving board in the bottom plate to eject fluid (such as airflow) from the jet hole. After the airflow flows out, it sucks in the surrounding fluid to form an efficient heat dissipation effect. While the jet hole ejects fluid, the external fluid will continuously replenish the piezoelectric jet heat sink from the side of the jet hole. When the electronic device is embedded in the electronic device protective case, the piezoelectric jet heat sink set in the electronic device protective case can effectively reduce the heat dissipated by the electronic device, thereby improving the heat dissipation problem of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments of the present application. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0036] Figure 1 A three-dimensional schematic diagram of a piezoelectric jet heat dissipation device provided in an embodiment of the present application;

[0037] Figure 2 A schematic structural diagram of a first electronic device protective case provided in an embodiment of the present application with its bracket retracted;

[0038] Figure 3 A schematic structural diagram of a first electronic device protective case provided in an embodiment of the present application with a piezoelectric jet heat dissipation device deployed;

[0039] Figure 4 A schematic structural diagram of a second electronic device protective case provided by an embodiment of the present application with the piezoelectric jet heat dissipation device retracted;

[0040] Figure 5 A schematic structural diagram of a second electronic device protective case provided in an embodiment of the present application with a piezoelectric jet heat dissipation device deployed;

[0041] Figure 6 A schematic structural diagram of a third electronic device protective case provided by an embodiment of the present application with the piezoelectric jet heat dissipation device retracted;

[0042] Figure 7 A schematic structural diagram of a third electronic device protective case provided in an embodiment of the present application with a piezoelectric jet heat dissipation device deployed;

[0043] Figure 8 for Figure 7 Schematic diagram of the fluid ejection direction of a medium-voltage electrofluidic cooling device;

[0044] Figure 9 A schematic diagram of a first electrical connection structure of an electronic device protective case provided in an embodiment of the present application;

[0045] Figure 10 A schematic diagram of a second electrical connection structure of an electronic device protective case provided in an embodiment of the present application;

[0046] Figure 11 A schematic diagram of a cross-sectional structure of a piezoelectric jet heat dissipation device;

[0047] Figure 12 Schematic diagram of another cross-sectional structure of a piezoelectric jet heat dissipation device;

[0048] Figure 13 for Figure 1 The three-dimensional assembly diagram of the piezoelectric jet heat dissipation device shown. DETAILED DESCRIPTION

[0049] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0050] As the performance of consumer electronics continues to improve, so too does the power consumption involved. This is driven by increases in computing power and visual quality. A related issue is heat dissipation, as the vast majority of energy consumed is ultimately dissipated as heat. However, given a constant heat dissipation area, increasing heat removal can only be achieved by increasing the heat transfer coefficient and increasing the temperature differential. Increasing the temperature differential increases the temperature of the consumer electronics, significantly impacting their lifespan. Therefore, increasing the heat transfer coefficient has become the primary convective cooling solution.

[0051] The current mainstream solution for improving convective heat transfer efficiency is air cooling, which removes heat by adding fans. However, in many cases, such as mobile phones and televisions, adding fans is not an option due to noise and bulk issues. Many current consumer electronics still rely primarily on natural convection for heat dissipation, but natural convection has very low heat transfer efficiency and can only remove a limited amount of heat.

[0052] In view of this, the embodiment of the present application provides an electronic device protective case, such as Figures 2 to 8 As shown, the electronic device protective case includes:

[0053] The housing 1 is used for embedding the electronic device, and comprises a base plate 11 and a frame 12 surrounding the base plate 11;

[0054] The piezoelectric jet heat dissipation device 3 is movably connected to the bottom plate 11 and includes a jet hole;

[0055] Among them, a circuit driving board 2 is set in the base plate 11, and the circuit driving board 2 is electrically connected to the piezoelectric jet heat dissipation device 3. The circuit driving board 2 is configured to drive the piezoelectric jet heat dissipation device 3 to eject fluid from the jet hole to cool the electronic equipment.

[0056] Piezoelectric jet cooling devices are an active cooling technology based on the combination of the piezoelectric effect and fluid mechanics. They achieve efficient thermal management by driving high-frequency vibrations in piezoelectric materials to generate directional airflow. The piezoelectric effect refers to the incomplete symmetry of the molecular or crystal structure within a piezoelectric material. When mechanical force is applied, the electric dipole moment of the crystal lattice changes, generating an electric charge on the material's surface. Conversely, applying an electric field can also cause the material to deform (the inverse piezoelectric effect).

[0057] The driving mechanism of a piezoelectric jet cooling device is as follows: a piezoelectric material (such as piezoelectric ceramic) undergoes periodic deformation under the action of an alternating electric field, driving a diaphragm or cantilever beam to vibrate at high frequencies, compressing the cavity fluid (such as gas) to form a pulsed jet. This process requires no mechanical rotating parts and achieves the conversion of electrical energy to mechanical energy to fluid kinetic energy.

[0058] It should be noted that the above-mentioned fluid may be air, but the embodiments of the present disclosure include but are not limited to this, and the above-mentioned fluid may be other gases or liquids.

[0059] Combine Figure 11 As shown, when the piezoelectric synthetic jet heat sink 3 is operating, the fluid in the cavity of the piezoelectric synthetic jet heat sink 3 is continuously ejected, thereby forming a continuous fluid jet. When the fluid is air, the piezoelectric synthetic jet device can generate a wind. It should be noted that when the piezoelectric synthetic jet device is operating, the fluid can flow into the cavity through the edge of the jet hole, replenishing the fluid in the cavity.

[0060] The housing 1 is used to embed an electronic device to protect it. When the electronic device is embedded in the housing 1, the bottom plate 11 in the housing 1 is arranged parallel to and in direct contact with the back plate of the electronic device, and the frame 12 surrounds the electronic device.

[0061] Among them, the side of the bottom plate 11 that is not in contact with the back plate of the electronic device includes but is not limited to structures such as support parts, decorative parts, and ventilation holes, and the frame 12 includes but is not limited to key protection structures and open hole structures (for example, the open hole structure can correspond to a USB interface, used to set speakers and other devices).

[0062] In addition, "movable connection" refers to a connection method that allows relative movement between the connected parts. The movable connection between the piezoelectric jet heat sink 3 and the base plate 11 includes but is not limited to: bearing connection, hinge connection, ball hinge / ball joint connection, etc.

[0063] For high-performance smartphones, the peak power consumption of flagship system-on-chips (SoCs) reaches 10-15W. Prolonged high loads (such as gaming and AI computing) can cause the phone's body temperature to exceed 45°C, leading to issues such as frequency throttling and overheating. If these issues are not addressed promptly, they can significantly reduce phone performance and battery life, diminishing product impact and user experience. Therefore, heat dissipation is crucial in the increasingly competitive high-performance phone market. Traditional passive cooling methods (such as graphite sheets and vapor chambers) have almost reached their limits. Some manufacturers have also experimented with active cooling using micro fans, but these have the disadvantages of increased phone thickness and noise levels (>35dB). Piezoelectric jet cooling devices, as active cooling devices, are known for their ultra-thinness, high airflow, small footprint, low weight, and low noise. By integrating a piezoelectric jet cooling device into a phone case, the device, when in operation, blows directly onto the back of the phone, effectively cooling the phone.

[0064] This application sets a piezoelectric jet heat sink in the electronic device protective case, and drives the piezoelectric jet heat sink through the circuit driving board in the bottom plate to eject fluid (such as airflow) from the jet hole. After the airflow flows out, it sucks in the surrounding fluid to form an efficient heat dissipation effect. While the jet hole ejects fluid, the external fluid will continuously replenish the piezoelectric jet heat sink from the side of the jet hole. When the electronic device is embedded in the electronic device protective case, the piezoelectric jet heat sink set in the electronic device protective case can effectively reduce the heat dissipated by the electronic device, thereby improving the heat dissipation problem of the electronic device.

[0065] In some electronic device protective cases provided in the embodiments of the present application, such as Figure 9 As shown, the electronic device protective shell further includes an external power supply 5 , which is disposed in the bottom plate 11 and electrically connected to the circuit driving board 2 .

[0066] In an exemplary embodiment, the external power source 5 may include an external power circuit or a battery.

[0067] For example, the battery may be a button cell, a rechargeable battery, or the like.

[0068] In some electronic device protective cases provided in the embodiments of the present application, the orthographic projections of the external power supply 5 and the circuit driving board 2 on the bottom plate 11 do not overlap with each other.

[0069] In the present application, the circuit driving board 2 can be powered by an external power supply 5, so that the circuit driving board 2 can control and drive the piezoelectric jet heat dissipation device 3 to eject fluid from the jet hole to cool the electronic equipment.

[0070] In addition, by arranging that the orthographic projections of the external power supply 5 and the circuit driving board 2 on the base plate 11 do not overlap with each other, the flattened area of ​​the external power supply 5 and the circuit driving board 2 on the base plate 11 can be increased as much as possible, the thickness of the shell can be reduced, and the dexterity of the shell can be increased.

[0071] In some electronic device protective cases provided in the embodiments of the present application, such as Figure 10 As shown, the electronic device protective shell also includes a power interface (such as a USB interface), which is electrically connected to the circuit driving board 2 and the electronic device respectively, and the electronic device is configured to supply power to the circuit driving board 2 through the power interface.

[0072] The electronic device may be a mobile phone, a tablet computer, a laptop computer, or other electronic devices. The embodiments of the present application are described by taking the mobile phone as an example.

[0073] The charging interface of the electronic device itself is connected to the power interface of the electronic device protective shell to achieve the purpose of reverse powering of the circuit driving board 2 in the electronic device protective shell by the electronic device. In this way, the external power supply setting can be omitted, thereby simplifying the design of the shell and reducing the thickness of the shell.

[0074] In some electronic device protective cases provided in the embodiments of the present application, such as Figures 2 to 5 As shown, the electronic device protective case includes a bracket 4, which is movably connected to the base plate 11, and the bracket 4 is configured to be able to be folded or unfolded; the piezoelectric jet heat dissipation device 3 is arranged on the side of the bracket 4 close to the base plate 11, and the jet hole is arranged toward the base plate 11.

[0075] Figure 2 and Figure 3 Provided is a schematic diagram of a bracket capable of supporting an electronic device (such as a mobile phone) horizontally in folded and unfolded states. Figure 4 and Figure 5 Provided is a schematic diagram of a bracket capable of vertically supporting an electronic device (such as a mobile phone) in folded and unfolded states.

[0076] like Figure 3 and Figure 5 As shown, the bracket 4 is configured to be able to be deployed; Figure 2 and Figure 4 As shown, the bracket 4 is configured to be retractable.

[0077] In an embodiment of the present application, the piezoelectric jet heat dissipation device 3 is arranged on the side of the bracket 4 close to the base plate 11, and the jet hole is arranged toward the base plate 11. In this way, when the piezoelectric jet heat dissipation device 3 is running, there is a gap between the piezoelectric jet heat dissipation device 3 and the base plate 11, so that the jet hole of the piezoelectric jet heat dissipation device 3 can spray and inhale fluid to achieve normal operation.

[0078] In some embodiments, the position of the piezoelectric jet heat dissipation device 3 corresponding to the bottom plate 11 can be hollowed out so that when the electronic device is embedded in the protective shell, there is no other structure between the piezoelectric jet heat dissipation device 3 and the electronic device, thereby improving the heat dissipation effect of the electronic device.

[0079] In some electronic device protective cases provided in the embodiments of the present application, the housing 1 includes a switch structure, which is electrically connected to the circuit driving board 2; Figure 3 and Figure 5 As shown, when the bracket 4 is unfolded, the switch structure is configured to control the circuit driving board 2 to drive the piezoelectric jet heat dissipation device 3 to spray fluid from the jet hole to cool the electronic equipment.

[0080] Exemplarily, the switch structure can be set on the frame 12, and the switch structure is electrically connected to the circuit driving board 2 in the base plate 11. When necessary, the user can control the circuit driving board 2 through the switch structure to drive the piezoelectric jet heat dissipation device 3 to spray fluid from the jet hole.

[0081] It should be noted that when the bracket 4 is extended, there is sufficient space between the electrofluidic heat dissipation device 3 and the electronic device, which facilitates the ejection and absorption of fluid by the electrofluidic heat dissipation device 3. Of course, when the bracket 4 is retracted, the switch structure can also be used to control the circuit drive board 2 to drive the piezoelectric jet heat dissipation device 3 to eject fluid from the jet hole. However, the fluid flow effect in this case is not good, and the heat dissipation effect is worse than when the electrofluidic heat dissipation device 3 is supported by the bracket 4.

[0082] In some electronic device protective cases provided in embodiments of the present application, the bracket 4 is connected to the base plate 11 via a rotating member, and the rotating member is configured so that the bracket 4 can provide support for the electronic device in a first direction and a second direction, and the first direction and the second direction intersect.

[0083] For example, the first direction and the second direction may be substantially perpendicular.

[0084] It can be understood that the bracket 4 and the bottom plate 11 are connected by a rotating member, which can enable the electronic device to achieve the following Figure 3 The horizontal support effect shown can also achieve Figure 5 The vertical support effect is shown.

[0085] In some electronic device protective cases provided in the embodiments of the present application, such as Figures 2 to 5 As shown, the bracket 4 and the base plate 11 are connected via a rotating shaft.

[0086] Combine Figures 2 to 5 As shown, the support effect of the electronic device when supported by the bracket can be controlled by setting the position of the rotating shaft, for example, Figure 4 and Figure 5 As shown, when the extension direction of the rotating shaft is perpendicular to the vertical direction (for example, the extension direction of the rotating shaft is perpendicular to the long side of the mobile phone), the bracket 4 can achieve a supporting effect on the electronic device in the vertical direction; when the extension direction of the rotating shaft is perpendicular to the horizontal direction (for example, the extension direction of the rotating shaft is parallel to the long side of the mobile phone), the bracket 4 can achieve a supporting effect on the electronic device in the horizontal direction.

[0087] In some electronic device protective cases provided in the embodiments of the present application, such as Figures 6 to 8 As shown, the base plate 11 includes a groove C, the piezoelectric jet heat dissipation device 3 is movably connected to the side wall of the groove C, and the jet hole is set toward the electronic device; the piezoelectric jet heat dissipation device 3 is configured to be able to be embedded in the groove C or supported from the groove C.

[0088] Figure 6 A schematic diagram of a state in which a piezoelectric jet heat dissipation device 3 is embedded in a groove C is provided. At this time, the piezoelectric jet heat dissipation device 3 is arranged flush with the surface of the base plate 11 .

[0089] The piezoelectric jet heat dissipation device 3 is arranged flush with the surface of the base plate 11, including: one side of the piezoelectric jet heat dissipation device 3 is arranged flush with the surface of the base plate 11 away from the electronic device, and / or the other side of the piezoelectric jet heat dissipation device 3 is arranged flush with the surface of the base plate 11 contacting the electronic device.

[0090] Figure 7 A schematic diagram of the state of the piezoelectric jet heat dissipation device 3 being supported from the groove C is provided. When the piezoelectric jet heat dissipation device 3 is supported from the groove C, an angle is formed between the piezoelectric jet heat dissipation device 3 and the base plate 11, and the angle is an acute angle.

[0091] Exemplarily, the groove C may penetrate the bottom plate 11 so that when the electronic device is embedded in the electronic device protective shell, no other structure is provided between the piezoelectric jet heat dissipation device 3 and the electronic device.

[0092] In some electronic device protective cases provided in the embodiments of the present application, the shell 1 includes a switch structure, which is electrically connected to the circuit driving board 2; when the piezoelectric jet heat dissipation device 3 is supported from the groove C, the switch structure is configured to control the circuit driving board 2 to drive the piezoelectric jet heat dissipation device 3 to eject fluid from the jet hole to cool the electronic device.

[0093] Exemplarily, the switch structure can be set on the frame 12, and the switch structure is electrically connected to the circuit driving board 2 in the base plate 11. When necessary, the user can control the circuit driving board 2 through the switch structure to drive the piezoelectric jet heat dissipation device 3 to spray fluid from the jet hole.

[0094] It should be noted that when the electrofluidic heat sink 3 is supported from the groove C, there is sufficient space between the electrofluidic heat sink 3 and the electronic device, which is conducive to the ejection and absorption of fluid by the electrofluidic heat sink 3. Of course, when the piezoelectric jet heat sink 3 is embedded in the groove C, the switch structure can also be used to control the circuit driving board 2 to drive the piezoelectric jet heat sink 3 to eject fluid from the jet hole. However, the fluid circulation effect in this case is not good, and the heat dissipation effect is worse than when the electrofluidic heat sink 3 is supported from the groove C.

[0095] In some electronic device protective cases provided in the embodiments of the present application, such as Figures 6 to 8 As shown, the piezoelectric jet heat dissipation device 3 is connected to the side wall of the groove C through a press-and-pop structure.

[0096] The press-and-pop structure enables the piezoelectric jet heat sink 3 to pop out from the groove C after being pressed, that is, to be propped up from the groove C.

[0097] like Figure 8 As shown, when the piezoelectric jet heat dissipation device 3 is supported from the groove C, the switch structure controls the circuit driving board 2 to drive the piezoelectric jet heat dissipation device 3 to eject fluid from the jet hole. Figure 8 The arrows indicate the direction of fluid spraying. The piezoelectric jet heat sink 3 pops up (stretches) toward the side away from the electronic device, and the jet holes spray fluid toward one side of the back plate of the electronic device, thereby achieving cooling of the electronic device.

[0098] In some electronic device protective cases provided in the embodiments of the present application, the bottom plate 11 includes an insulating material (insulating layer), and the insulating material (insulating layer) wraps the circuit driving board 2;

[0099] like Figure 9 and Figure 10 As shown, the driving circuit board 2 includes an electrically connected boost circuit and a conversion circuit. The boost circuit is configured to increase the amplitude of the power supply voltage and transmit it to the conversion circuit. The conversion circuit is configured to convert the square wave signal output by the boost circuit into a sinusoidal wave signal and transmit it to the piezoelectric jet heat dissipation device.

[0100] Exemplarily, the boost unit is used to boost an input DC signal (eg, approximately 3.7V) to a required voltage amplitude, which can be adjusted according to specific device performance.

[0101] For example, the voltage amplitude currently matched with the piezoelectric jet heat sink 3 is 80Vpp, and of course the amplitude can be increased or decreased as needed. The input end of the boost unit is electrically connected to a power supply device: for example, the input end of the boost unit can be electrically connected to an external power source (such as a portable rechargeable lithium battery); or the input end of the boost unit can be connected to an electronic device through a power interface (such as a USB interface).

[0102] In addition, the actual input electrical signal is a sine wave signal, so the square wave electrical signal generated by the boost unit needs to be converted into a sine wave through a conversion circuit before being transmitted to the piezoelectric jet heat sink 3 .

[0103] It's important to note that VPP (Voltage Peak-Peak) refers to the peak-to-peak voltage, which describes the range of signal value variation. The peak value is the maximum value relative to the zero scale, and can be positive or negative. The peak-to-peak value, on the other hand, is the difference between the maximum and minimum values, and is only positive.

[0104] The present application provides a piezoelectric jet heat dissipation device. Figure 1 A three-dimensional schematic diagram of a piezoelectric jet heat dissipation device provided in an embodiment of the present application. Figure 13 for Figure 1 The three-dimensional assembly diagram of the piezoelectric jet heat dissipation device shown. Figure 11 A schematic diagram of a cross-sectional structure of a piezoelectric jet heat dissipation device; Figure 12 This is another schematic diagram of the cross-sectional structure of a piezoelectric jet heat dissipation device.

[0105] In some electronic device protective cases provided in the embodiments of the present application, Figure 1 、 Figure 12 and Figure 13 As shown, the piezoelectric jet heat dissipation device 3 includes:

[0106] a frame including a jet hole 36;

[0107] The diaphragm layer 33 is connected to the frame and is configured to form a cavity 37 between the diaphragm layer and the frame;

[0108] The piezoelectric actuator assembly 31 is connected to the circuit driving board 2 and the diaphragm layer 33 (for example, directly or indirectly);

[0109] The jet hole 36 connects the inside of the cavity with the outside, and the piezoelectric actuator is configured to drive the diaphragm layer to vibrate and cause the fluid in the cavity to be ejected from the jet hole.

[0110] The piezoelectric actuator component 31 (e.g., a piezoelectric ceramic sheet) is configured to drive the diaphragm layer 33 to vibrate and cause the fluid in the cavity 37 to be ejected from the jet hole 36; when the piezoelectric actuator component 31 drives the diaphragm layer 33 to vibrate at a certain frequency, the fluid in the cavity 37 can be ejected continuously, thereby forming a continuous fluid ejection. When the fluid is air, the piezoelectric synthetic jet device can form a wind. It should be noted that, in combination with Figure 11 As shown, when the piezoelectric synthetic jet device is working, the fluid can flow into the cavity through the edge of the jet hole 36 to replenish the fluid in the cavity.

[0111] The piezoelectric actuator assembly 31 may include a first electrode, a second electrode, and a piezoelectric layer located between the first electrode and the second electrode.

[0112] The piezoelectric layer can generate mechanical deformation or mechanical pressure under the driving of the electric field between the first electrode and the second electrode.

[0113] For example, the material of the piezoelectric layer can be selected from one of lead zirconium titanate (PZT), barium titanate (BT) and aluminum nitride (AlN). Of course, the embodiments of the present disclosure include but are not limited to the above, and the material of the piezoelectric layer can also be other types of piezoelectric materials.

[0114] In some examples, the cross-sectional shape of the jet hole 36 includes a circle, and the diameter of the circle ranges from 300 μm to 700 μm, for example, 300 μm, 400 μm, 500 μm, 600 μm, or 700 μm. Of course, the embodiments of the present disclosure include but are not limited to this, and the cross-sectional shape of the jet hole 36 may also be other shapes and sizes.

[0115] In some examples, the orthographic projection of the piezoelectric actuator assembly 31 on the diaphragm layer 33 falls within the area of ​​the diaphragm layer 33 , that is, the size of the piezoelectric actuator assembly 31 is smaller than the size of the diaphragm layer 33 .

[0116] In some electronic device protective cases provided in the embodiments of the present application, such as Figure 11 As shown, the frame includes a fixed frame 34 and a hole plate 35 connected to each other, and the diaphragm layer 33 is located on a side of the fixed frame 34 away from the hole plate 35 .

[0117] In some electronic device protective cases provided in the embodiments of the present application, Figure 1 、 Figure 12 and Figure 13 As shown, the frame includes a connected fixing frame 37, a supporting frame 34 and a hole plate 35, the diaphragm layer 33 is located between the fixing frame 37 and the supporting frame 34, the hole plate 35 is located on the side of the supporting frame 34 away from the diaphragm layer 33, and a plurality of jet holes 36 are provided on the hole plate 35; wherein, the diaphragm layer 33, the supporting frame 35 and the hole plate 35 are configured to form a cavity 37.

[0118] In the embodiment of the present application, by providing the fixing frame 37 , when the piezoelectric actuator assembly 31 drives the diaphragm layer 33 to vibrate, the fixing frame 37 can improve the overall stability of the piezoelectric jet heat dissipation device, thereby increasing its service life.

[0119] In some electronic device protective cases provided in the embodiments of the present application, such as Figure 12 As shown, the piezoelectric jet heat dissipation device further includes an intermediate layer 32 (eg Figure 13 The intermediate layer 32 is located between the piezoelectric actuator component 31 and the diaphragm layer 33.

[0120] Exemplarily, the orthographic projection of the intermediate layer 32 on the diaphragm layer 33 overlaps with the orthographic projection of the piezoelectric actuator assembly 31 on the diaphragm layer 33 , and the area of ​​the intermediate layer 32 is smaller than the area of ​​the diaphragm layer 33 .

[0121] The orthographic projection of the intermediate layer 32 on the diaphragm layer 33 falls within the outer contour of the area where the diaphragm layer 33 is located, that is, the size of the intermediate layer 32 is smaller than that of the diaphragm layer 33. Specifically, the area of ​​the intermediate layer 32 is smaller than that of the diaphragm layer 33.

[0122] In the piezoelectric synthetic jet device provided in the embodiments of the present disclosure, the intermediate layer 32 described above is provided between the piezoelectric actuator assembly 31 and the diaphragm layer 33. This amplifies the deformation of the diaphragm layer 33 and / or increases the vibration frequency, thereby increasing the airflow rate of the piezoelectric synthetic jet device, for example, to 0.3 CFM (cubic feet per minute). Furthermore, the intermediate layer 32 also enhances the strength of the piezoelectric synthetic jet device. Furthermore, because the piezoelectric synthetic jet device utilizes the inverse piezoelectric effect, the piezoelectric actuator assembly 31 causes the diaphragm layer 33 to deform, thereby changing the volume of the cavity 37 and thereby achieving air discharge from the jet orifice. Therefore, the piezoelectric synthetic jet device is relatively small, for example, less than 1 mm thick, and has relatively low noise, for example, less than 30 dB.

[0123] In some examples, such as Figure 12 As shown, the orthographic projection of the piezoelectric actuator assembly 31 on the diaphragm layer 33 falls within the orthographic projection of the intermediate layer 32 on the diaphragm layer 33. In other words, the size of the intermediate layer 32 is equal to or greater than the size of the piezoelectric actuator assembly 31. As a result, the piezoelectric actuator assembly 31 can drive the diaphragm layer 33 to vibrate via the intermediate layer 32, amplifying the deformation of the diaphragm layer 33 and thereby increasing the airflow of the piezoelectric synthetic jet device.

[0124] In some examples, such as Figure 1As shown, the shape of the orthographic projection of the piezoelectric actuator assembly 31 on the diaphragm layer 33 includes a polygon, such as a rectangle. Of course, the embodiments of the present disclosure include but are not limited to this, and the shape of the orthographic projection of the piezoelectric actuator assembly 31 on the diaphragm layer 33 may also be other shapes, such as a circle, an ellipse, and a star-shaped polygon (e.g., a four-pointed star, a five-pointed star, a six-pointed star, etc.).

[0125] In some examples, the thickness of the intermediate layer 32 is greater than that of the diaphragm layer 33. Thus, the intermediate layer has a relatively large mass, which can better amplify the deformation of the diaphragm layer 33, thereby increasing the air output of the piezoelectric synthetic jet device.

[0126] In some examples, the thickness of the diaphragm layer 33 may range from 0.02 mm to 0.08 mm, such as 0.05 mm. Thus, the diaphragm layer 33 has both high strength and good vibration characteristics.

[0127] In some examples, the ratio of the thickness of the intermediate layer 32 to the thickness of the diaphragm layer 33 ranges from 1.5 to 3.0, for example, 1.8, 1.9, 2.0, 2.1, and 2.2.

[0128] In some examples, the thickness of the middle layer 32 ranges from 0.065 mm to 0.15 mm, for example, 0.08 mm, 0.09 mm, 0.10 mm, 0.12 mm, etc.

[0129] For example, when the thickness of the diaphragm layer 33 is 0.05 mm, the thickness of the intermediate layer 31 may be 0.10 mm.

[0130] Exemplarily, the middle layer 32 may also be a frequency-locking layer for increasing the vibration frequency of the diaphragm layer 33 .

[0131] In some examples, the material of the frequency locking layer may be steel.

[0132] In some examples, the material of the intermediate layer 32 is the same as that of the diaphragm layer 33. Thus, the intermediate layer 32 and the diaphragm layer 33 have the same elastic modulus, density, and damping coefficient, thereby better amplifying the deformation of the diaphragm layer 33 and thereby increasing the airflow of the piezoelectric synthetic jet device. Of course, the disclosed embodiments include but are not limited to this, and the material of the intermediate layer 32 may also be similar to that of the diaphragm layer 33. It should be noted that the aforementioned similarity only relates to the elastic modulus, density, and damping coefficient.

[0133] For example, the material of the diaphragm layer 33 may be selected from one of stainless steel, alloy steel, ceramic, polyimide (PI), and polyethylene terephthalate (PET); for example, the stainless steel includes but is not limited to 304 stainless steel, and the alloy steel includes but is not limited to AISI 4340 alloy steel. For example, the material of the intermediate layer 32 may be selected from one of stainless steel, alloy steel, ceramic, polyimide (PI), and polyethylene terephthalate (PET).

[0134] For example, the material of the intermediate layer 32 may be stainless steel, and the material of the diaphragm layer 33 may be PET; in this case, since the density of the diaphragm layer 33 is less than that of the intermediate layer 32, the thickness of the intermediate layer 32 may be less than that of the diaphragm layer 33.

[0135] In some examples, the material of the housing 1 may also be selected from one of stainless steel, silicon, alloy steel, ceramic, polyimide (PI), and polyethylene terephthalate (PET). The stainless steel includes, but is not limited to, 304 stainless steel and 316 stainless steel. Of course, the embodiments of the present disclosure are not limited to these, and the material of the housing structure may also be other metal or non-metal materials.

[0136] It should be noted that when the material of the housing 1 includes a conductive material, an insulating material is provided between the conductive material of the housing and the circuit driving board 2 inside the housing to avoid short circuit.

[0137] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0138] In the description of this specification, it should be understood that the terms "center", "thickness", "up", "down", "front", "back", "horizontal", "top", "bottom", "inside", "outside", "axial", "radial", "circumferential", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0139] In this application, unless otherwise expressly specified or limited, terms such as "installed," "connected," "connect," and "fixed" should be understood in a broad sense. For example, they may refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection, or communication; direct connection or indirect connection through an intermediate medium; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0140] In this application, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0141] References herein to "one embodiment," "an embodiment," or "one or more embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present application. Furthermore, please note that instances of the phrase "in one embodiment" do not necessarily all refer to the same embodiment.

[0142] In the description provided herein, a large number of specific details are described. However, it is understood that the embodiments of the present application can be practiced without these specific details. In some instances, well-known methods, structures, and techniques are not shown in detail so as not to obscure the understanding of this description.

[0143] Finally, it should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "includes," or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or terminal device that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or elements that are inherent to such process, method, article, or terminal device. In the absence of further restrictions, an element defined by the phrase "comprises a ..." does not exclude the presence of additional identical elements in the process, method, article, or terminal device that includes the element.

[0144] The above is a detailed introduction to an electronic device protective case provided by the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method and core idea of ​​the present application. At the same time, for those skilled in the art, according to the idea of ​​the present application, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A protective case for an electronic device, characterized in that: The electronic device protective case comprises: A housing for embedding an electronic device, comprising a base plate and a frame surrounding the base plate; A piezoelectric jet heat dissipation device, movably connected to the bottom plate, comprising a jet hole; A circuit driving board is provided in the base plate, the circuit driving board is electrically connected to the piezoelectric jet heat dissipation device, and the circuit driving board is configured to drive the piezoelectric jet heat dissipation device to eject fluid from the jet hole to cool the electronic device.

2. The electronic device protective case according to claim 1, wherein: The electronic device protective shell further includes an external power supply, which is disposed in the bottom plate and electrically connected to the circuit driving board.

3. The electronic device protective case according to claim 2, wherein: The orthographic projections of the external power supply and the circuit driving board on the base plate do not overlap with each other.

4. The electronic device protective case according to claim 1, wherein: The electronic device protective shell further includes a power interface, which is electrically connected to the circuit driving board and the electronic device respectively, and the electronic device is configured to supply power to the circuit driving board through the power interface.

5. The electronic device protective case according to any one of claims 2 to 4, characterized in that: The electronic device protective case includes a bracket, the bracket is movably connected to the bottom plate, and the bracket is configured to be retractable or unfoldable; The piezoelectric jet heat dissipation device is arranged on a side of the bracket close to the bottom plate, and the jet hole is arranged toward the bottom plate.

6. The electronic device protective case according to claim 5, characterized in that: The housing includes a switch structure, and the switch structure is electrically connected to the circuit driving board; When the bracket is unfolded, the switch structure is configured to control the circuit driving board to drive the piezoelectric jet heat dissipation device to eject fluid from the jet hole to cool the electronic device.

7. The electronic device protective case according to claim 6, characterized in that: The bracket is connected to the base plate via a rotating member, and the rotating member is configured to enable the bracket to support the electronic device in a first direction and a second direction, wherein the first direction and the second direction intersect.

8. The electronic device protective case according to claim 6, wherein: The bracket is connected to the base plate via a rotating shaft.

9. The electronic device protective case according to any one of claims 2 to 4, characterized in that: The bottom plate includes a groove, the piezoelectric jet heat dissipation device is movably connected to the side wall of the groove, and the jet hole is arranged toward the electronic device; The piezoelectric jet heat dissipation device is configured to be embedded in the groove or supported from the groove.

10. The electronic device protective case according to claim 9, characterized in that: The housing includes a switch structure, and the switch structure is electrically connected to the circuit driving board; When the piezoelectric jet heat sink is supported from the groove, the switch structure is configured to control the circuit driving board to drive the piezoelectric jet heat sink to eject fluid from the jet hole to cool the electronic device.

11. The electronic device protective case according to claim 10, wherein: The piezoelectric jet heat dissipation device is connected to the side wall of the groove through a press-and-pop structure.

12. The electronic device protective case according to any one of claims 1 to 4, 6 to 8, and 10 to 11, characterized in that: The bottom plate includes an insulating material, and the insulating material wraps the circuit driving board; The driving circuit board includes an electrically connected boost circuit and a conversion circuit, wherein the boost circuit is configured to increase the amplitude of the power supply voltage and transmit it to the conversion circuit, and the conversion circuit is configured to convert the square wave signal output by the boost circuit into a sine wave signal and transmit it to the piezoelectric jet heat dissipation device.

13. The electronic device protective case according to claim 1, wherein: The piezoelectric jet heat dissipation device includes: a frame, comprising the jet hole; a diaphragm layer connected to the frame and configured to form a cavity with the frame; a piezoelectric actuator assembly connected to the circuit drive board and the diaphragm layer; The jet hole connects the interior of the cavity with the exterior, and the piezoelectric actuator assembly is configured to drive the diaphragm layer to vibrate and cause the fluid in the cavity to be ejected from the jet hole.

14. The electronic device protective case according to claim 13, wherein: The frame body includes a connected fixing frame, a supporting frame and a hole plate, the diaphragm layer is located between the fixing frame and the supporting frame, the hole plate is located on a side of the supporting frame away from the diaphragm layer, and a plurality of jet holes are provided on the hole plate; Wherein, the diaphragm layer, the supporting frame and the orifice plate are configured to form the cavity.

15. The electronic device protective case according to claim 14, characterized in that: The piezoelectric jet heat dissipation device further includes an intermediate layer, which is located between the piezoelectric actuator component and the diaphragm layer.

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