A positioning jig for a CMP polishing apparatus

Abstract

The application discloses a positioning clamp for CMP polishing equipment and relates to the technical field of wafer processing clamps.The positioning clamp comprises an outer shell, a supporting disc, a suction assembly, a positioning assembly and a driving assembly, wherein the outer shell is a cylindrical shell; the supporting disc is fixedly installed on the upper edge of the outer shell and is used for supporting a wafer; the suction assembly comprises a plurality of suction members used for sucking the wafer, and the suction members are movably arranged in installation cavities formed on the supporting disc; the positioning assembly comprises a plurality of guide grooves formed on the supporting disc, a positioning rod is slidably arranged in the guide grooves, and the positioning assembly further comprises a control member used for controlling synchronous movement of the plurality of positioning rods.The positioning assembly is arranged to align and position the wafer, and downward pressure is applied to the wafer, so that the wafer is attached to the suction disc for suction, the stability of the wafer is improved, the wafer is effectively prevented from being displaced or shaken during the processing, meanwhile, the positioning rod is far away from the wafer, the polishing surface of the wafer is fully exposed, and the wafer surface is favorably polished.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer processing fixtures, in particular to a positioning fixture for CMP polishing equipment. Background Art

[0002] CMP (Chemical Mechanical Polishing) is a technology used to flatten the surfaces of semiconductors and other materials. It achieves surface flatness through a combination of chemical and mechanical processes. Compared to the previously commonly used mechanical polishing, CMP can flatten silicon wafer surfaces. It also offers the advantages of low processing costs and simplicity, making it the most common technology for flattening semiconductor surfaces.

[0003] When polishing wafers, in order to ensure the stability of the wafers and improve the polishing effect, a positioning fixture is required. In order to adapt to wafers of different specifications, existing adjustable positioning fixtures usually use a clamp that can move laterally to position the wafer laterally, and ensure the stability of the wafer by combining with longitudinal pressure. However, since the wafers are thin slices cut from silicon crystal rods, they are relatively thin, and the material itself is brittle, the wafers are easily deformed or even broken when clamped from the side. In addition, when pressed longitudinally, the clamp will inevitably block the polished surface of the wafer, affecting the processing effect. Summary of the Invention

[0004] The purpose of the present invention is to solve the problem that the lateral clamping of the existing fixture is easy to damage the wafer and block the polishing surface of the wafer, and to propose a positioning fixture for CMP polishing equipment.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] A positioning fixture for CMP polishing equipment includes a housing, a support plate, an adsorption component, a positioning component, and a drive component, wherein:

[0007] The shell is a cylindrical shell;

[0008] The support plate is fixedly mounted on the upper edge of the housing and is used to support the wafer;

[0009] The adsorption assembly includes a plurality of adsorption members for adsorbing wafers, and the adsorption members are movably arranged in a mounting cavity opened on the support plate;

[0010] The positioning assembly includes a plurality of guide grooves formed on the support plate, wherein positioning rods are slidably arranged in the guide grooves, and further includes a control member for controlling the synchronous movement of the plurality of positioning rods;

[0011] The driving component is used to control the adsorption component and the positioning component to position and fix the wafer.

[0012] Preferably, the adsorption component includes an air cylinder, a suction cup connected to the interior of the air cylinder is provided on the top of the air cylinder, a sealing plug is provided in the air cylinder for sealing and sliding, and a pull rod is fixedly provided at the bottom of the sealing plug.

[0013] Preferably, the mounting cavity includes a sliding part and a limiting part, the air cylinder is slidably connected to the sliding part, a limiting plate is fixedly provided on the outer peripheral surface of the air cylinder, a compression spring is provided between the limiting plate and the limiting part, and when the limiting plate is located at the upper limit position of the limiting part, the suction cup extends beyond the top surface of the support plate.

[0014] Preferably, the driving assembly includes a motor fixedly arranged in the outer shell, the output shaft of the motor is vertically upward and fixedly installed with a driving rod, the driving rod is rotatably connected to the support plate, a connecting plate is threadedly connected to the driving rod, and the bottom ends of multiple pull rods are fixedly connected to the connecting plate.

[0015] Preferably, the positioning rod comprises a rod body passing through the guide groove, and a chuck is mounted on the portion of the rod body extending beyond the support plate, wherein the chuck is in an inverted cone shape.

[0016] Preferably, the guide groove is arc-shaped, a clamping groove is provided in the guide groove, and a clamping block adapted to the clamping groove is provided on the outer wall of the rod body.

[0017] Preferably, the control member includes a mounting ring and a pressure rod evenly distributed on the outer circumference of the mounting ring, a pressure groove is provided on the pressure rod, the rod body extends into the pressure groove and abuts against the inner wall of the pressure groove, and a damping structure is provided between the mounting ring and the driving rod.

[0018] Preferably, the damping structure comprises a friction ring fixedly provided with an inner wall of a mounting ring, the friction ring is rotatably connected to the driving rod, and a plurality of friction stripes are evenly distributed on the inner wall of the friction ring.

[0019] Preferably, a plurality of anti-slip strips are provided on the top of the support plate, and the anti-slip strips are staggered to form a mesh structure.

[0020] Compared with the prior art, the present invention has the following advantages:

[0021] 1. The present invention sets a positioning component and uses the positioning rod to move synchronously to align and position the wafer, and applies downward pressure to the wafer so that the wafer and the suction cup are adhered and adsorbed. The driving rod is driven to rotate by the driving component to move the pull rod downward, thereby increasing the adsorption force of the suction cup and improving the stability of the wafer, effectively preventing the wafer from shifting or shaking during processing. At the same time, the positioning rod is kept away from the wafer, so that the polished surface of the wafer is fully exposed, which is conducive to fully polishing the wafer surface and improving work efficiency.

[0022] 2. When the traditional suction cup is fixed, contact space with the contact object must be reserved. Therefore, when the wafer is adsorbed, the wafer cannot be directly supported on the support plate, resulting in uneven support force. The present invention provides a movable adsorption part. After the suction cup and the wafer are adsorbed, the adsorption part is driven to move into the installation cavity by moving the sealing plug and hidden in the installation cavity, ensuring that the wafer can fully contact the top surface of the support plate to reduce the uneven support force, ensure that the wafer maintains a stable support state during the processing, and is conducive to improving the processing accuracy and quality. In addition, the surface of the support plate is provided with a mesh-structured anti-slip strip, which can effectively reduce the swing or displacement of the wafer during the polishing process, ensure the stability of the wafer during polishing, and is conducive to improving the polishing accuracy and consistency. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a schematic diagram of the overall structure of a positioning fixture for CMP polishing equipment proposed by the present invention;

[0024] Figure 2 This is a schematic diagram of the internal structure of a positioning fixture for CMP polishing equipment proposed by the present invention;

[0025] Figure 3 This is a schematic cross-sectional view of a positioning fixture for CMP polishing equipment proposed by the present invention;

[0026] Figure 4 This is a schematic structural diagram of an adsorption component in a positioning fixture for a CMP polishing device proposed by the present invention;

[0027] Figure 5 This is a structural schematic diagram of a positioning fixture adsorption component and wafer adsorption state 1 for a CMP polishing equipment proposed by the present invention;

[0028] Figure 6 This is a schematic structural diagram of a second state of adsorption of a positioning fixture adsorption member and a wafer for a CMP polishing device proposed by the present invention;

[0029] Figure 7 This is a schematic top view of the structure of a positioning fixture for CMP polishing equipment proposed by the present invention;

[0030] Figure 8 This is a schematic structural diagram of a positioning rod in a positioning fixture for CMP polishing equipment proposed by the present invention;

[0031] Figure 9 This is a schematic diagram of the force analysis structure of the positioning rod and wafer of a positioning fixture for CMP polishing equipment proposed by the present invention;

[0032] Figure 10 This is a schematic structural diagram of a control component in a positioning fixture for CMP polishing equipment proposed by the present invention.

[0033] In the figure: 1. Shell; 2. Support plate; 21. Mounting cavity; 211. Sliding part; 212. Limiting part; 22. Anti-slip strip; 3. Adsorption assembly; 31. Adsorption part; 311. Air cylinder; 312. Suction cup; 313. Sealing plug; 314. Pull rod; 315. Limiting plate; 316. Compression spring; 4. Positioning assembly; 41. Guide groove; 42. Positioning rod; 421. Rod body; 422. Chuck; 423. Block; 43. Control part; 431. Mounting ring; 432. Pressure rod; 433. Pressure groove; 434. Friction ring; 435. Friction stripe; 5. Wafer; 6. Drive assembly; 61. Motor; 62. Drive rod; 63. Connecting plate. DETAILED DESCRIPTION

[0034] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0035] In the description of the present invention, it should be understood that the terms "up", "down", "front", "back", "left", "right", "top", "bottom", "inside" and "outside" indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they should not be understood as limiting the present invention.

[0036] Reference Figure 1-10 A positioning fixture for CMP polishing equipment includes a shell 1, a support plate 2, an adsorption component 3, a positioning component 4 and a drive component 6. A wafer 5 is placed on the support plate 2. The drive component 6 is used to control the adsorption component 3 and the positioning component 4. The wafer 5 is positioned by the positioning component 4 so that the wafer 5 is centered and aligned, and the wafer 5 is adsorbed and fixed by the adsorption component 3. Finally, the drive component 6 is reversely controlled to make the positioning component 4 open outward to expose the polishing surface of the wafer 5, while increasing the adsorption force of the adsorption component 3 to improve the stability of the wafer 5.

[0037] The outer shell 1 is a cylindrical shell, which is installed under the polishing head of the polishing equipment. The support plate 2 is fixedly installed on the upper edge of the outer shell 1 to support the wafer 5. The wafer 5 is placed on the support plate 2 and polished by the polishing equipment.

[0038] The adsorption assembly 3 includes a plurality of adsorption members 31 for adsorbing the wafer 5. The adsorption members 31 are used to adsorb and fix the back side of the wafer 5 so that the wafer 5 is tightly attached to the support plate 2 during polishing to ensure the stability of the wafer 5. Since the wafer 5 is a circular thin sheet with a brittle texture, the traditional positioning fixture fixes the wafer 5 from the side. The contact area between the clamping block and the wafer 5 is small, and the clamping is unstable. The clamping block needs to extend beyond the polishing surface of the wafer 5 and apply downward pressure, which will not only block the polishing surface of the wafer 5 and affect the polishing effect, but may even damage the wafer 5 due to the lateral clamping force, causing the edge of the wafer 5 to collapse. The positioning fixture improves the stability of the wafer 5 through the adsorption force of the adsorption assembly 3. Stability, effectively preventing the wafer 5 from shifting or shaking during processing, and at the same time fully exposing the polished surface of the wafer 5, which is conducive to fully polishing the surface of the wafer 5, improving work efficiency, and avoiding the edge collapse of the wafer 5. The adsorption part 31 is movably arranged in the installation cavity 21 opened on the support plate 2, and the adsorption part 31 can move in the installation cavity 21. When adsorbing the wafer 5, the adsorption part 31 is extended out of the installation cavity 21, so that the adsorption part 31 has enough contact space with the surface of the wafer 5, and after the adsorption is completed, the adsorption part 31 is retracted into the installation cavity 21, so that the wafer 5 can fit tightly with the supporting surface of the support plate 2 to ensure support stability.

[0039] Referring to the figure, the adsorption part 31 includes an air cylinder 311, and a suction cup 312 connected to the inside of the air cylinder 311 is provided on the top of the air cylinder 311. The suction cup 312 is an elastic rubber suction cup. When the air pressure in the air cylinder 311 remains unchanged, the wafer 5 is pressed flat on the suction cup 312, which will cause the suction cup 312 to deform and discharge a small amount of gas to suck the wafer 5. A sealing plug 313 is provided in the air cylinder 311 for sealing and sliding. After the suction cup 312 is adsorbed on the wafer 5, a closed space is formed in the air cylinder 311. When the sealing plug 313 is driven away from the wafer 5, the air pressure in the air cylinder 311 will be reduced, thereby increasing the adsorption force of the suction cup 312 on the wafer 5. A pull rod 314 is fixedly provided at the bottom of the sealing plug 313. The pull rod 314 is used to control the movement of the sealing plug 313, thereby controlling the air pressure in the air cylinder 311.

[0040] When the locking plate 315 is unlocked, the locking plate 312 is unlocked and the locking plate 313 is unlocked, so that the locking plate 313 can be unlocked when the locking plate 315 is unlocked. This suction cup 312 extends beyond the surface of the support plate 2, which makes it easier for the suction cup 312 to be adsorbed. Since the compression spring 316 has a large elastic force, the suction cup 312 can be deformed and adsorbed with the suction cup 312 when the wafer 5 squeezes the suction cup 312. Since the deformation of the suction cup 312 after the adsorption is completed is not controllable, the deformation of the suction cup 312 may cause the wafer 5 to be skewed. Therefore, the sealing plug 313 is driven downward by the pull rod 314 to increase the adsorption force of the suction cup 312. After the sealing plug 313 moves to the extreme position, the sealing plug 313 will drive the air cylinder 311 and the suction cup 312 to move downward as a whole, so that the compression spring 316 is compressed, and the suction cup 312 adsorbs the wafer 5 and moves it into the installation cavity 21 until the wafer 5 is fully supported on the surface of the support plate 2, ensuring that the wafer 5 is evenly supported and improving the accuracy of the polishing process.

[0041] The positioning assembly 4 includes a plurality of guide grooves 41 opened on the support plate 2, and a positioning rod 42 is slidingly arranged in the guide groove 41. The positioning rod 42 can slide in the guide groove 41. It also includes a control part 43 for controlling the synchronous movement of multiple positioning rods 42. When installing the wafer 5, the positioning rod 42 is expanded outward to the maximum position. After placing the wafer 5, the control part 43 is used to control the multiple positioning rods 42 to move synchronously toward the center of the support plate 2 until the positioning rod 42 aligns and positions the wafer 5 to the center of the support plate 2.

[0042] Referring to the figure, the positioning rod 42 includes a rod body 421 that passes through the guide groove 41. The part of the rod body 421 that extends beyond the support plate 2 is installed with a chuck 422. The chuck 422 is in an inverted cone shape. The rod body 421 drives the chuck 422 to move. The chuck 422 contacts the wafer 5 to position the wafer 5. The guide groove 41 is arc-shaped. A card slot is opened in the guide groove 41. The outer wall of the rod body 421 is provided with a card block 423 that is adapted to the card slot. The card block 423 cooperates with the card slot to limit the rod body 421, ensuring that the rod body 421 remains vertical without deflection and axial displacement.

[0043] When the mounting ring 431 is rotated, the plurality of pressure rods 432 are driven to rotate synchronously. At this time, the pressure groove 433 pushes the rod body 421 to move. Since the rod body 421 is limited by the pressure groove 433 and the guide groove 41, and the guide groove 41 is arc-shaped, the rod body 421 will move along the overlapping path of the pressure groove 433 and the guide groove 41 during the rotation process. Therefore, when the mounting ring 431 is rotated, the plurality of pressure rods 432 move synchronously, and the plurality of rod bodies 421 also open and close synchronously. Since the rod body 421 can open and close synchronously, the positioning fixture can adapt to wafers 5 of different specifications and has a wide range of applications.

[0044] Furthermore, when the control part 43 rotates to drive the positioning rod 42 to align and position the wafer 5, the chuck 422 contacts the wafer 5, and the chuck 422 is in an inverted cone shape. The position where the chuck 422 contacts the wafer 5 is the oblique circumferential surface of the chuck 422. Under the pressure of the chuck 422, in addition to applying a lateral thrust to the wafer 5 to align the wafer 5, after the wafer 5 reaches the center position of the support plate 2, multiple chucks 422 simultaneously apply downward pressure to the wafer 5, causing the wafer 5 to squeeze the suction cup 312. Therefore, the automatic alignment and adsorption fixation of the wafer 5 is realized without the need for human intervention, which improves the accuracy of the fixation of the wafer 5, simplifies the operation, and reduces human errors.

[0045] Referring to the figure, the drive assembly 6 includes a motor 61 fixedly arranged in the housing 1. The motor 61 is a servo motor, which is a prior art. The output shaft of the motor 61 is vertically upward and fixedly installed with a drive rod 62. The drive rod 62 is rotatably connected to the support plate 2. Starting the motor 61 can drive the drive rod 62 to rotate. A connecting plate 63 is threadedly connected to the drive rod 62. The bottom ends of multiple pull rods 314 are fixedly connected to the connecting plate 63. When the drive rod 62 rotates, the connecting plate 63 is displaced axially along the drive rod 62 under the action of the thread, thereby Control the synchronous movement of multiple pull rods 314 to achieve synchronous control of the internal air pressure of multiple air cylinders 311. A damping structure is set between the mounting ring 431 and the driving rod 62. Under the action of the damping structure, there is additional resistance between the mounting ring 431 and the driving rod 62. When the driving rod 62 rotates, when there is no resistance in the mounting ring 431, the mounting ring 431 rotates synchronously with the driving rod 62. When the rotation of the mounting ring 431 encounters resistance greater than the resistance of the damping structure, the mounting ring 431 stops and the driving rod 62 continues to rotate.

[0046] Specifically, after placing the wafer 5 on the support plate 2, the motor 61 is started, and the motor 61 drives the driving rod 62 to rotate, so that the positioning rod 42 is retracted toward the center of the support plate 2, and the wafer 5 is pushed toward the center of the support plate 2 for alignment and downward pressure is applied to the wafer 5, so that the wafer 5 is adsorbed on the suction cup 312. In this state, the positioning rod 42 is pressed against the side of the wafer 5 and is subjected to the resistance of the wafer 5 and is fed back to the pressing rod 432, so that the mounting ring 431 can no longer rotate, but the driving rod 62 will overcome the resistance of the damping structure and continue to rotate until the connecting plate 63 moves up to the limit position, so that the sealing plug 313 also reaches the upper limit position of the air cylinder 311, and the control motor 61 rotates in the opposite direction. At this time, the positioning rod 42 moves toward the outside of the support plate 2, exposing the polished surface of the wafer 5. The wafer 5 is adsorbed by the suction cup 312, and the positioning position remains unchanged even if the positioning rod 42 is lost. Until the positioning rod 42 moves outward to the limit position, the mounting ring 431 can no longer rotate. As the driving rod 62 overcomes the resistance of the damping structure and continues to rotate, the connecting plate 63 moves downward and drives the sealing plug 313 to move downward, so that the air pressure in the air cylinder 311 is reduced, and the adsorption force of the suction cup 312 on the wafer 5 is strengthened.

[0047] Referring to the figure, the damping structure includes a friction ring 434 fixedly provided on the inner wall of the mounting ring 431. The friction ring 434 is rotatably connected to the driving rod 62. A plurality of friction stripes 435 are evenly distributed on the inner wall of the friction ring 434. The friction stripes 435 are conducive to increasing the friction resistance between the friction ring 434 and the driving rod 62, thereby forming a damping effect between the mounting ring 431 and the driving rod 62.

[0048] A plurality of anti-slip strips 22 are arranged on the top of the support plate 2, and the anti-slip strips 22 are staggered to form a mesh structure. When the wafer 5 is polished and ground on the support plate 2, the anti-slip strips 22 with a mesh structure are arranged on the surface of the support plate 2, which can effectively reduce the swing or displacement of the wafer 5 during the polishing process, thereby ensuring the stability of the wafer 5 during polishing, and is conducive to improving the accuracy and consistency of polishing.

[0049] The specific working principle of the present invention is as follows:

[0050] When in use, start the motor 61, so that the motor 61 drives the driving rod 62 to rotate, and the driving rod 62 drives the mounting ring 431 to rotate through the friction ring 434, so that the multiple pressure rods 432 move synchronously, and the pressure groove 433 pushes the rod body 421 to move outward until the positioning rod 42 moves outward to the limit position. In this state, the suction cup 312 exceeds the plane of the supporting plate 2, and the wafer 5 is placed on the supporting plate 2 in contact with the suction cup 312. It can be adjusted and placed without needing to control the motor 61 to rotate in the opposite direction, and the motor 61 drives the driving rod 62 to rotate in the opposite direction, so that the positioning rod 432 can move synchronously. The positioning rod 42 is retracted toward the center of the support plate 2, and the position where the chuck 422 contacts the wafer 5 is the oblique circumferential surface of the chuck 422. Under the pressure of the chuck 422, in addition to applying a lateral thrust to the wafer 5 to align the wafer 5, after the wafer 5 reaches the center of the support plate 2, multiple chucks 422 simultaneously apply downward pressure to the wafer 5, causing the wafer 5 to squeeze the suction cup 312, causing the suction cup 312 to deform and be adsorbed with the suction cup 312. The positioning rod 42 is pressed against the side of the wafer 5 and is subjected to resistance from the wafer 5 and fed back to the pressure rod 432, making it impossible for the mounting ring 431 to The rotation continues, but the driving rod 62 will overcome the resistance of the damping structure and continue to rotate until the connecting plate 63 moves up to the limit position, so that the sealing plug 313 also reaches the upper limit position of the cylinder 311, completing the initial fixation, and controlling the motor 61 to change the rotation direction again. The positioning rod 42 moves toward the outside of the support plate 2, exposing the polished surface of the wafer 5. The wafer 5 is adsorbed by the suction cup 312, and the positioning position of the wafer 5 remains unchanged even if the positioning rod 42 is lost. Until the positioning rod 42 moves outward to the limit position, the mounting ring 431 can no longer rotate. The rod 62 overcomes the resistance of the damping structure and continues to rotate, the connecting plate 63 moves downward and drives the sealing plug 313 to move downward, so that the air pressure in the air cylinder 311 is reduced, and the adsorption force of the suction cup 312 on the wafer 5 is strengthened. After the sealing plug 313 moves to the extreme position, the sealing plug 313 will drive the air cylinder 311 and the suction cup 312 to move downward as a whole, so that the compression spring 316 is compressed, and the suction cup 312 adsorbs the wafer 5 and moves it into the installation cavity 21 until the wafer 5 is fully supported on the surface of the support plate 2, ensuring that the wafer 5 is evenly supported and improving the accuracy of the polishing process.

[0051] The above description is only a preferred specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any technician familiar with the technical field, within the technical scope disclosed by the present invention, who makes equivalent replacements or changes based on the technical solution and inventive concept of the present invention, should be covered by the scope of protection of the present invention.

Claims

1. A positioning fixture for a CMP polishing device, comprising a housing (1), a support plate (2), an adsorption component (3), a positioning component (4) and a drive component (6), characterized in that: in: The housing (1) is a cylindrical shell; The support plate (2) is fixedly mounted on the upper edge of the housing (1) and is used to support the wafer (5); The adsorption assembly (3) comprises a plurality of adsorption members (31) for adsorbing wafers (5), and the adsorption members (31) are movably arranged in a mounting cavity (21) provided on the support plate (2); The adsorption member (31) includes an air cylinder (311), a suction cup (312) in communication with the interior of the air cylinder (311) is provided on the top of the air cylinder (311), a sealing plug (313) is provided in a sealing and sliding manner in the air cylinder (311), and a pull rod (314) is fixedly provided on the bottom of the sealing plug (313); The mounting cavity (21) includes a sliding portion (211) and a limiting portion (212); the air cylinder (311) is slidably connected to the sliding portion (211); a limiting plate (315) is fixedly provided on the outer peripheral surface of the air cylinder (311); a compression spring (316) is provided between the limiting plate (315) and the limiting portion (212); when the limiting plate (315) is located at the upper limit position of the limiting portion (212), the suction cup (312) exceeds the top surface of the support plate (2); The positioning assembly (4) comprises a plurality of guide grooves (41) formed on the support plate (2), a positioning rod (42) being slidably disposed in the guide grooves (41), the positioning rod (42) comprising a rod body (421) penetrating the guide grooves (41), a chuck (422) being mounted on a portion of the rod body (421) extending beyond the support plate (2), and the chuck (422) being in an inverted cone shape; The driving assembly (6) is used to control the adsorption assembly (3) and the positioning assembly (4) to position and fix the wafer (5), and the driving assembly (6) includes a motor (61) fixedly arranged in the housing (1), the output shaft of the motor (61) is vertically upward and fixedly mounted with a driving rod (62), the driving rod (62) is rotatably connected to the support plate (2), a connecting plate (63) is threadedly connected to the driving rod (62), and the bottom ends of the plurality of pull rods (314) are fixedly connected to the connecting plate (63); The invention also includes a control member (43) for controlling the synchronous movement of multiple positioning rods (42), wherein the control member (43) includes a mounting ring (431) and a pressure rod (432) evenly distributed on the outer periphery of the mounting ring (431), wherein a pressure groove (433) is provided on the pressure rod (432), and the rod body (421) extends into the pressure groove (433) and abuts against the inner wall of the pressure groove (433), and a damping structure is provided between the mounting ring (431) and the driving rod (62).

2. A positioning fixture for CMP polishing equipment according to claim 1, characterized in that: The guide groove (41) is arc-shaped, a clamping groove is provided in the guide groove (41), and a clamping block (423) adapted to the clamping groove is provided on the outer wall of the rod body (421).

3. A positioning fixture for CMP polishing equipment according to claim 1, characterized in that: The damping structure comprises a friction ring (434) fixedly provided on the inner wall of the mounting ring (431), the friction ring (434) being rotatably connected to the driving rod (62), and a plurality of friction stripes (435) being evenly distributed on the inner wall of the friction ring (434).

4. A positioning fixture for CMP polishing equipment according to claim 1, characterized in that: A plurality of anti-slip strips (22) are provided on the top of the support plate (2), and the anti-slip strips (22) are staggered to form a mesh structure.

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