Anti-skid production system and anti-skid conveying method for lamination of multi-layer circuit board

Abstract

The invention discloses an anti-skid production system and an anti-skid conveying method for multilayer circuit board lamination, and relates to the field of multilayer circuit board lamination, connecting holes are formed in the four side edges of a copper foil and the four side edges of a prepreg, after multilayer circuit boards are stacked, the connecting holes of the copper foil are coaxial with the connecting holes of the prepreg, and the connecting holes of the copper foil are coaxial with the connecting holes of the prepreg. An anti-skid structure is arranged on the multilayer circuit board and comprises an upper limiting disc, a connecting column and a lower limiting disc, the upper limiting disc and the connecting column are connected into a T shape, and the connecting column sequentially penetrates through the connecting holes of the multilayer circuit board to be connected with the lower limiting disc so that the multilayer circuit board can be limited between the upper limiting disc and the lower limiting disc; the inner-layer chip in the multilayer circuit board is limited by the connecting column, and the upper limiting disc and the lower limiting disc are respectively in contact with the copper foils on the top surface and the bottom surface of the multilayer circuit board, so that the multilayer circuit board is limited and assembled together, the problem that the board layers slip off in the conveying process is effectively ensured, and the production qualification rate of the yield is improved.

Description

Technical Field

[0001] The present invention relates to the field of multi-layer circuit board lamination, and in particular to an anti-skid production system and an anti-skid conveying method for multi-layer circuit board lamination. Background Art

[0002] Amidst the rapid advancements in modern electronic technology, electronic devices are rapidly advancing towards miniaturization, lightweighting, high performance, and multifunctionality. To meet this trend, multilayer circuit boards have emerged and become a core component of electronic devices. Multilayer circuit boards are constructed by stacking and laminating multiple inner-layer circuit boards, prepregs, and outer-layer circuit boards in an orderly fashion. The lamination process plays a crucial role in this process. Lamination of multilayer circuit boards allows for the stacking of more circuit layers within a limited space, significantly increasing the wiring density of the circuit board and enabling a high degree of integration in electronic devices. The basic structure of a multilayer circuit board consists primarily of inner-layer circuit boards (inner-layer chips), prepregs, and outer-layer circuit boards (copper foil). The inner-layer circuit board is the core conductive layer of the multilayer circuit board and is typically made of copper-clad laminate. A fine circuit pattern is formed on the copper foil surface through an etching process, fulfilling the critical tasks of signal transmission and electrical connection. The prepreg, also known as prepreg, is primarily composed of resin and reinforcing materials (such as fiberglass cloth) and exhibits a certain degree of flexibility in its unlaminated state. During the lamination process, the resin gradually melts due to heat, filling the gaps between the inner and outer layers and bonding the layers together, serving both insulation and bonding purposes. The outer layers are also based on copper-clad laminates, with one or both sides specially treated for mounting electronic components and providing solder points for component pins. These surfaces are connected to the inner layers through vias, ensuring the electrical integrity of the entire board.

[0003] During the transportation process of multi-layer circuit boards before they are pressed together, there is a problem of slipping between the board layers. Multi-layer circuit boards are stacked with multiple layers of structures such as multiple inner boards, semi-cured sheets and outer boards. During the transportation process, due to factors such as vibration, acceleration, and deceleration, there is a lack of sufficient friction and stable fixing methods between the board layers, which makes it very easy for them to slip. The paper "Research on the Transmission Stability of Multi-layer Circuit Boards in Electronic Product Manufacturing" points out that this slipping between the board layers will not only destroy the original stacking order and alignment accuracy, but may also cause problems such as line scratches and component damage. Once the board layers are displaced during transportation, the difficulty of fitting between the layers in the subsequent pressing process will increase significantly. Even if they are barely pressed together, a series of quality problems will be caused due to the initial position deviation, such as poor line connection, signal transmission interference, etc., which will seriously reduce the product qualification rate and production efficiency. Summary of the Invention

[0004] The purpose of the present invention is to overcome the deficiencies of the prior art and to provide an anti-skid production system and an anti-skid conveying method for laminating multi-layer circuit boards, so as to solve the deficiencies of the prior art.

[0005] The objective of the present invention is achieved through the following technical solutions: a non-slip conveying method for laminating multi-layer circuit boards, characterized in that connection holes are provided on the four side edges of the copper foil and the four side edges of the semi-cured sheet. After the multi-layer circuit boards are stacked, the connection holes of the copper foil are coaxial with the connection holes of the semi-cured sheet, and then an anti-slip structure is provided on the multi-layer circuit boards, the anti-slip structure comprising an upper limit plate, a connecting column and a lower limit plate, the upper limit plate and the connecting column being connected to form a T-shape, the connecting column passing through the connection holes of the multi-layer circuit board in turn to connect to the lower limit plate, so that the multi-layer circuit board is restricted between the upper limit plate and the lower limit plate, and the inner layer chips in the multi-layer circuit board are restricted by the connecting column.

[0006] Furthermore, an inner cavity is provided in the connecting column, and a sliding groove is provided on the side wall of the connecting column, and the sliding groove is connected to the inner cavity. A limit block is slidingly arranged in the sliding groove, and the limit block moves in the horizontal direction. One end of the limit block extends to the inner cavity and is provided with a wedge-shaped surface. The lower limit plate is fixed with a top shaft near one end of the connecting column, and a notch connected to the inner cavity is provided at the bottom of the connecting column. The cross-sectional shape of the notch is rectangular, and the wedge-shaped surface is located on the moving path of the top shaft.

[0007] Furthermore, a rubber plug is fixed in the inner cavity, and a through hole is opened on the rubber plug for the top shaft to pass through. A plurality of pins are fixed to one end of the lower limit plate close to the connecting column. When the lower limit plate contacts the connecting column, the pins are inserted into the rubber plug.

[0008] Furthermore, the end of the connecting post away from the upper limit plate is tapered, and the diameter gradually decreases in the direction approaching the lower limit plate, and a limiting ring is coaxially fixed to the end of the lower limit plate close to the connecting post.

[0009] Furthermore, an elastic layer is fixed to the inner wall of the notch, the limiting block squeezes the elastic layer to interference fit the slide groove, and an elastic buffer block is fixed to the end of the limiting block away from the connecting column.

[0010] A non-slip production system for laminating multi-layer circuit boards is produced by using the above-mentioned non-slip conveying method for laminating multi-layer circuit boards, including a stacking workbench, wherein the top surface of the stacking workbench is provided with a plurality of positioning grooves, and the plurality of positioning grooves are arranged in a rectangular array, and the connecting columns are placed in the positioning grooves, and the top of the stacking workbench is provided with a stepped tooling window along its own height direction, the size of the stepped tooling window is smaller than the size of the copper foil, and a material tray is provided in the stepped tooling window, and the top surface of the material tray is provided with a plurality of tooling slots in a rectangular array, the lower limit plate is placed in the tooling slot, the material tray has the freedom to move along the length and width directions of the stacking workbench, and four groups of jacking assemblies are provided below the material tray, and the four groups of jacking assemblies correspond one-to-one to the four connecting holes of the copper foil, and the jacking assembly includes a jacking column, which has the freedom to move along the height direction of the stacking workbench, and the jacking column penetrates the tooling slot and cooperates with the circular groove at the bottom of the lower limit plate.

[0011] Furthermore, two groups of horizontal linear drive modules are installed at intervals in the stepped tooling window, and the two ends of the longitudinal linear drive module are respectively installed on the slides of the two groups of horizontal linear drive modules. The material tray is installed on the slide of the longitudinal linear drive module by screws. The side wall of the stacking workbench is provided with a loading window connected to the stepped tooling window, and the jacking assembly also includes a vertically installed cylinder, and the telescopic shaft of the cylinder is connected to the jacking column.

[0012] Furthermore, it also includes a gantry conveying mechanism, which includes a lifting column, a crossbeam, a first slide and a second slide. The lifting columns are provided on both sides of the stacking workbench, and the two ends of the crossbeam are respectively connected to the two lifting columns. The first linear module and the second linear module are installed on the crossbeam. The first slide is installed on the slide of the first linear module. Four negative pressure suction cups are installed on the bottom of the first slide. The second slide is installed on the slide of the second linear module. The second slide is installed on the slide of the second linear module. A negative pressure tube is installed on the second slide.

[0013] Furthermore, a third linear module is arranged on both sides of the stacking workbench, and the lifting column includes a horizontal sliding column and a vertical sliding column. The horizontal sliding column is installed on the slide seat of the third linear module, and the vertical sliding column slides through the top of the horizontal sliding column. The end of the vertical sliding column away from the horizontal sliding column is connected to the crossbeam, and a lifting cylinder is vertically installed on the horizontal sliding column, and the telescopic shaft of the lifting cylinder is connected to the vertical sliding column.

[0014] Furthermore, it also includes a limiting conveyor belt, the input end of which is close to the stacking workbench, and two conveying limiting plates are provided on the limiting conveyor belt, which form a channel for conveying multi-layer circuit boards.

[0015] The beneficial effects of the present invention are:

[0016] 1. The upper limit plate, connecting column and lower limit plate are connected to form an I-shaped structure. The connecting column passes through the connecting hole. The upper limit plate and the lower limit plate contact the copper foil on the top and bottom surfaces of the multi-layer circuit board respectively, thereby limiting the multi-layer circuit board together, effectively ensuring that the board layers will not slip during transportation, so that the board layers can be accurately stacked and transported to the pressing station, thereby improving the production qualification rate.

[0017] 2. After the lower limit plate is connected to the connecting column, the top shaft will squeeze the wedge surface to make the limit block slide out of the slide groove, so that the elastic buffer block of the limit block contacts the inner chip, completing the limit of the inner chip and avoiding the position of the inner chip from shifting during the conveying process.

[0018] 3. The production system can automatically limit the position of multi-layer circuit boards before transportation, which improves production efficiency and reduces labor costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic diagram of the assembly of an anti-slip structure in an anti-slip conveying method for laminating multi-layer circuit boards according to the present invention;

[0020] Figure 2 for Figure 1 Enlarged view of point A in the middle;

[0021] Figure 3 This is a schematic diagram of the structure of a non-slip production system for laminating multi-layer circuit boards according to the present invention. Figure 1 ;

[0022] Figure 4 This is a schematic diagram of the structure of the stacking workbench in the anti-slip production system for laminating multi-layer circuit boards of the present invention. Figure 1 ;

[0023] Figure 5 This is a schematic diagram of the structure of the stacking workbench in the anti-slip production system for laminating multi-layer circuit boards of the present invention. Figure 2 ;

[0024] Figure 6 This is a schematic diagram of the structure of a non-slip production system for laminating multi-layer circuit boards according to the present invention. Figure 2 ;

[0025] Figure 7 This is a schematic diagram of the structure of a non-slip production system for laminating multi-layer circuit boards according to the present invention. Figure 3 ;

[0026] In the figure, 1-upper limit plate, 2-connecting column, 3-lower limit plate, 4-inner cavity, 5-slide groove, 6-limit block, 7-wedge surface, 8-top shaft, 9-notch, 10-rubber plug, 11-through hole, 12-pin, 13-limiting ring, 14-elastic layer, 15-elastic buffer block, 16-stacking workbench, 17-positioning groove, 18-step tooling window, 19-material tray, 20-tooling groove, 21-lifting column, 22-circular groove, 23-horizontal linear drive module, 24-longitudinal linear drive module, 25-cylinder, 26-lifting column , 27-crossbeam, 28-first skateboard, 29-second skateboard, 30-first linear module, 31-negative pressure suction cup, 32-second linear module, 33-negative pressure tube, 34-third linear module, 35-horizontal sliding column, 36-vertical sliding column, 37-lifting cylinder, 38-limiting conveyor belt, 39-conveyor limiting plate, 40-base, 41-disassembly frame, 42-horizontal cylinder, 43-horizontal mounting plate, 44-clamping cylinder, 45-clamping plate, 46-lifting and disassembly plate, 47-disassembly cylinder, 48-screw, 49-servo. DETAILED DESCRIPTION

[0027] The technical solution of the present invention will be further described in detail below with reference to the accompanying drawings, but the protection scope of the present invention is not limited to the following.

[0028] Example 1

[0029] like Figures 1 to 7As shown, a non-slip conveying method for laminating multi-layer circuit boards is provided, wherein connecting holes are provided on the four sides of the copper foil and the four sides of the prepreg. After the multi-layer circuit boards are stacked, the connecting holes of the copper foil are coaxial with the connecting holes of the prepreg. Then, an anti-slip structure is provided on the multi-layer circuit boards, and the anti-slip structure comprises an upper limit plate 1, a connecting column 2 and a lower limit plate 3. The upper limit plate 1 and the connecting column 2 are connected to form a T shape. The connecting column 2 passes through the connecting holes of the multi-layer circuit board in turn and connects to the lower limit plate 3, so that the multi-layer circuit board is restricted between the upper limit plate 1 and the lower limit plate 3, and the inner layer chip in the multi-layer circuit board is restricted by the connecting column 2. The copper foil, the prepreg, the inner layer chip, the prepreg and the copper foil are stacked together in turn, and pressed. The multi-layer circuit board is formed by laminating. The precise stacking between the board layers directly affects the subsequent pressing effect. When the board layers are stacked and then transported to the pressing station, the board layers are prone to slide against each other and offset. For this reason, after the board layers are stacked, the connecting column 2 is passed through the connecting hole on the copper foil and the semi-cured sheet, so that the upper limit disk 1 contacts the copper foil of the upper layer, and then the lower limit disk 3 is connected to the connecting column 2, so that the lower limit disk 3 contacts the copper foil of the lower layer. The cooperation between the upper limit disk 1 and the lower limit disk 3 is used to limit the sliding of the board layers in the vertical direction, and the connecting column 2 is used to limit the sliding of the board layers in the horizontal direction, which effectively ensures that the board layers will not slide apart during transportation, so that the board layers can be accurately stacked and transported to the pressing station, thereby improving the production qualification rate.

[0030] Example 2

[0031] In actual production, in order to ensure that the semi-cured sheet can completely cover the contact area between the inner chip and the copper foil after melting, the size of the semi-cured sheet is larger than the size of the inner chip, and the copper foil needs to take on the excess semi-cured sheet. Therefore, the size of the copper foil is larger than the size of the semi-cured sheet, so that the excess semi-cured sheet after melting flows to the edge of the copper foil. After lamination, the excess part of the copper foil is removed by the gong frame process, so that the excess semi-cured sheet and the excess part of the copper foil are cut off. The connecting holes are opened in the area that needs to be cut off and are cut off together in the gong frame process, so that the additional connecting holes do not affect the multi-layer circuit board. Since the size of the inner chip is smaller than the size of the semi-cured sheet, the connecting column 2 cannot contact the side wall of the inner chip for limiting. For this reason, based on Example 1, as Figure 1 and Figure 2As shown, an inner cavity 4 is provided in the connecting column 2, and a slide groove 5 is provided on the side wall of the connecting column 2. The slide groove 5 is connected to the inner cavity 4. A limit block 6 is slidingly arranged in the slide groove 5, and the limit block 6 moves in the horizontal direction. One end of the limit block 6 extends to the inner cavity 4 and is provided with a wedge-shaped surface 7. A top shaft 8 is fixed to one end of the lower limit plate 3 close to the connecting column 2. A notch 9 connected to the inner cavity 4 is provided at the bottom of the connecting column 2. The cross-sectional shape of the notch 9 is rectangular, and the wedge-shaped surface 7 is located on the moving path of the top shaft 8. When the lower limit plate 3 is connected to the connecting column 2, the top shaft 8 penetrates into the inner cavity 4 and squeezes the wedge-shaped surface 7 of the limit block 6. Under the action of the wedge surface 7, the limit block 6 moves outward close to the inner chip, so that the limit block 6 contacts the inner chip to complete the limiting of the inner chip, so that there will be no sliding offset problem between the various board layers.

[0032] Further, if Figure 2 As shown, an elastic layer 14 is fixed to the inner wall of the slot 9, and the limit block 6 squeezes the elastic layer 14 to fit the slide groove 5. An elastic buffer block 15 is fixed to the end of the limit block 6 away from the connecting column 2. After the stacked multi-layer circuit boards are transported to the pressing station, the lower limit plate 3 is removed, and the anti-slip structure can be removed. Then the limit block 6 is pressed inward to reset the limit block 6. The elastic layer 14 creates a large friction force between the limit block 6 and the connecting column 2. Under normal circumstances, the limit block 6 will not fall off the connecting column 2, thereby realizing the recycling of the anti-slip structure. Secondly, in order to prevent the limit block 6 from crushing the inner chip, an elastic buffer block 15 is provided. The elastic buffer block 15 contacts the inner chip for limiting, thereby achieving a limiting effect while preventing the inner chip from being crushed.

[0033] Example 3

[0034] In order to facilitate the disassembly and assembly of the lower limit plate 3, based on the second embodiment, Figure 1 and Figure 2As shown, a rubber plug 10 is fixed in the inner cavity 4, and a through hole 11 is opened on the rubber plug 10 for the top shaft 8 to pass through. A plurality of pins 12 are fixed to the end of the lower limit plate 3 close to the connecting column 2. When the lower limit plate 3 contacts the connecting column 2, the pins 12 are inserted into the rubber plug 10. The end of the connecting column 2 away from the upper limit plate 1 is tapered, and the diameter gradually decreases in the direction close to the lower limit plate 3. A limiting ring 13 is coaxially fixed to the end of the lower limit plate 3 close to the connecting column 2. In the process of inserting the connecting column 2 into the connecting hole, the plate layer is guided by the tapered end of the connecting column 2, and the plate layer can also be fine-tuned when connecting the anti-slip structure. The position between the boards is determined so that the board layers are accurately stacked together. Then, the lower limit disk 3 is connected to the connecting column 2. The lower limit disk 3 drives the pin 12 and the top shaft 8 to move close to the upper limit disk 1, so that the top shaft 8 squeezes the wedge surface 7 to drive the limit block 6 to move, and the pin 12 is inserted into the rubber plug 10. When the connecting column 2 contacts the lower limit disk 3, the lower limit disk 3 is connected in place. At this time, the limiting ring 13 contacts the copper foil of the lower layer, and the pin 12 is inserted into the rubber plug 10. The pin 12 is stuck under the elastic action of the rubber plug 10, completing the connection between the connecting column 2 and the lower limit disk 3. The lower limit disk 3 is connected by friction, which is convenient for disassembly and assembly.

[0035] Example 4

[0036] like Figures 1 to 7As shown, a non-slip production system for laminating multi-layer circuit boards is produced by using the above-mentioned non-slip conveying method for laminating multi-layer circuit boards, including a stacking workbench 16, a top surface of the stacking workbench 1 is provided with a plurality of positioning grooves 17, the plurality of positioning grooves 17 are arranged in a rectangular array, the connecting column 2 is placed in the positioning groove 17, the top of the stacking workbench 16 is provided with a stepped tooling window 18 along its own height direction, the size of the stepped tooling window 18 is smaller than the size of the copper foil, and a material tray 19 is provided in the stepped tooling window 18, the material tray The top rectangular array of the tray 19 is provided with a number of tooling slots 20, and the lower limit tray 3 is placed in the tooling slot 20. The tray 19 has the freedom to move along the length and width directions of the stacking workbench 1. Four sets of jacking components are provided below the tray 19. The four sets of jacking components correspond to the four connection holes of the copper foil one by one. The jacking components include a jacking column 21. The jacking column 21 has the freedom to move along the height direction of the stacking workbench 1. The jacking column 21 penetrates the tooling slot 20 and cooperates with the circular slot 22 at the bottom of the lower limit tray 3 to stack the board layer. They are stacked on the stacking workbench 16 in sequence. The connection holes of the multi-layer circuit board are located in the stepped tooling window 18, which is convenient for installing the lower limit plate 3. In order to ensure that the limit block 6 can smoothly contact the inner chip, the positioning groove 17 is divided into two areas. The connection column 2 in one area is loaded into the connection hole in the length direction of the multi-layer circuit board, and the connection column 2 in the other area is loaded into the connection hole in the width direction of the multi-layer circuit board. By adjusting the placement angle of the connection column 2, when the connection column 2 penetrates the connection hole, the driving block 6 is close to the inner chip, so that the driving Block 6 can move smoothly and contact the side of the inner chip. In order to ensure that the connecting column 2 is accurately located in the positioning groove 17, a rectangular block is fixed in the positioning groove 17. The rectangular block fits the notch 9 of the connecting column 2, so that the position of the connecting column 2 can be located. After the connecting column 2 is inserted into the connecting hole, the lifting column 21 moves upward, and the lifting column 21 is inserted into the circular groove 22 to drive the lower limit plate 3 to move upward, so that the lower limit plate 3 is connected to the connecting column 2 to complete the limitation of the board layer, thereby automatically completing the installation of the anti-slip structure and improving production efficiency.

[0037] Example 5

[0038] Based on the fourth embodiment, Figures 3 to 7As shown, it also includes a limiting conveyor belt 38, the input end of the limiting conveyor belt 38 is close to the stacking workbench 16, and two conveying limiting plates 39 are provided on the limiting conveyor belt 38. The two conveying limiting plates 39 form a channel for conveying multi-layer circuit boards. The multi-layer circuit boards with anti-slip structures installed are loaded onto the limiting conveyor belt 38, and the multi-layer circuit boards are conveyed to the pressing station for pressing operation through the limiting conveyor belt 38. The multi-layer circuit boards are guided and conveyed by the conveying limiting plates 39 so that they can be accurately conveyed to the pressing station. Since the pressing equipment cannot automatically remove the anti-slip structure, an anti-slip structure disassembly device is provided at the output end of the limiting conveyor belt 38. The anti-slip structure disassembly device includes a base 40, a disassembly frame 41 and a screw disassembly assembly. The top surface of the base 40 is water-resistant. A horizontal cylinder 42 is installed horizontally, and the telescopic shaft of the horizontal cylinder 42 is connected to the disassembly frame 41. The horizontal cylinder 42 drives the disassembly frame 41 to move close to the screw and away from the limiting conveyor belt 38. Two clamping assemblies are symmetrically arranged on the end surface of the disassembly frame 41 close to the limiting conveyor belt 38. The clamping assembly includes a horizontal mounting plate 43, a clamping cylinder 44 and a clamping plate 45. The horizontal mounting plate 43 is fixedly connected to the disassembly frame 41, and the clamping cylinder 44 is vertically installed on the horizontal mounting plate 43. The telescopic shaft of the clamping cylinder 44 is connected to the clamping plate 45. The limiting conveyor belt 38 conveys the multi-layer circuit board between the two clamping plates 45. When the multi-layer circuit board contacts the disassembly frame 41, it indicates that the multi-layer circuit board is in place, and then the two clamping plates 45 move close to the multi-layer circuit board to complete the multi-layer circuit board removal. The clamping operation of the multi-layer circuit board is performed, and then the disassembly frame 41 drives the multi-layer circuit board to move away from the limiting conveyor belt 38, and then the lower limit plate 3 is removed by the screw disassembly assembly. The screw disassembly assembly includes a lifting and disassembly plate 46, a disassembly cylinder 47 and a screw 48. The disassembly cylinder 47 is vertically installed on the disassembly frame 41. The telescopic shaft of the disassembly cylinder 47 is connected to the lifting and disassembly plate 46. Four screws 48 are provided on the top of the lifting and disassembly plate 46. The four screws 48 respectively correspond to the circular grooves 22 of the four lower limit plates 3 on the multi-layer circuit board. The circular grooves 22 are internally threaded. The low end of the screw 48 is driven to connect the output shaft of the steering gear 49. The housing of the steering gear 49 is installed at the bottom of the lifting and disassembly plate 46. The disassembly cylinder 47 drives the lifting and disassembly plate 46 to move upward, so that The screw 48 is inserted into the circular groove 22, and the servo 49 drives the screw 48 to rotate, and cooperates with the linear movement of the lifting and disassembly plate 46 to make the screw 48 do a screwing motion, so that the screw 48 thread is adapted to the circular groove 22, and the screw 48 is threadedly connected to the lower limit plate 3. Then the servo 49 stops, and the disassembly cylinder 47 drives the lifting and disassembly plate 46 to move downward, thereby pulling the lower limit plate 3 out of the connecting column 2, and completing the disassembly of the four lower limit plates 3 at the same time, which improves efficiency. Then the upper limit plate 1 and the connecting column 2 are manually removed, and then the multi-layer circuit board is placed on the pressing equipment for pressing operation. Since the pressing time is long, during this time, the worker can rotate the lower limit plate 3 and remove the lower limit plate 3 on the screw 48, so that the anti-slip structure can be recycled.

[0039] Example 6

[0040] Based on Example 5, Figure 1 、 Figure 3 、 Figure 4 and Figure 5 As shown, two sets of horizontal linear drive modules 23 are installed in the step tooling window 18, and the two ends of the longitudinal linear drive module 24 are respectively installed on the slides of the two sets of horizontal linear drive modules 23. The material tray 19 is installed on the slide of the longitudinal linear drive module 24 by screws. The side wall of the stacking workbench 16 is provided with a loading window connected to the step tooling window 18. The jacking assembly also includes a vertically installed cylinder 25. The telescopic shaft of the cylinder 25 is connected to the jacking column 21, which is connected to the horizontal linear drive module 23. Drive the material tray 19 to move along the length direction of the stacking workbench 1, and drive the material tray 19 to move along the width direction of the stacking workbench 1 through the longitudinal linear drive module 24, so that the lower limit plates 3 on the material tray 19 can be transported one by one to the moving path of the jacking column 21, and the jacking column 21 is driven to move upward by the cylinder 25, thereby driving the lower limit plate 3 to move upward and connect with the connecting column 2 through the jacking column 21. After the lower limit plate 3 in the material tray 19 is loaded, the next material tray 19 is installed through the loading window.

[0041] Example 7

[0042] In order to realize the automation of loading and assembling the anti-skid structure, based on the sixth embodiment, Figures 3 to 7As shown, it also includes a gantry conveying mechanism, which includes a lifting column 26, a crossbeam 27, a first slide 28 and a second slide 29. Lifting columns 26 are provided on both sides of the stacking workbench 1. The two ends of the crossbeam 27 are respectively connected to two lifting columns 26. A first linear module 30 and a second linear module 32 are installed on the crossbeam 27. The first slide 28 is installed on the slide of the first linear module 30. Four negative pressure suction cups 31 are installed at the bottom of the first slide 28. The second slide 29 is installed on the slide of the second linear module 32. A negative pressure pipe 33 is installed on the second slide 29. A third linear module 34 is arranged on both sides of the stacking workbench 1. The lifting column 26 includes a horizontal sliding column 35 and a vertical sliding column 36. The horizontal sliding The column 35 is installed on the sliding seat of the third linear module 34, and the vertical sliding column 36 slides through the top of the horizontal sliding column 35. The end of the vertical sliding column 36 away from the horizontal sliding column 35 is connected to the crossbeam 27. A lifting cylinder 37 is vertically installed on the horizontal sliding column 35, and the telescopic shaft of the lifting cylinder 37 is connected to the vertical sliding column 36. A plurality of storage boxes are set within the conveying range of the gantry conveying mechanism. Copper foil, inner layer chips and prepregs are stacked in different storage boxes respectively. The various layers of the multi-layer circuit board are stacked first. At this time, the second slide 29 moves to the end of the second linear module 32 and is in a non-working state, while the negative pressure suction cup 31 is in a working state, and the lifting column 26 is driven to move by the third linear module 34, thereby bringing The first slide 28 is moved, and the first slide 28 is driven to move by the first linear module 30. The moving direction of the third linear module 34 is perpendicular to the moving direction of the first linear module 30. The vertical sliding column 36 is driven up and down by the lifting cylinder 37, thereby driving the first slide 28 to move up and down, so that the first slide 28 has the freedom of movement along the three directions of the X, Y, and Z axes in the spatial coordinate system, so that each plate layer is stacked on the stacking workbench 16 under the action of the negative pressure suction cup 31. Then, since the semi-cured sheet is flexible, in order to ensure the accurate stacking of the semi-cured sheet, four groups of negative pressure suction cups 31 are used for loading. The four groups of negative pressure suction cups 31 are respectively adsorbed on the four corners of the semi-cured sheet for loading to avoid bending of the semi-cured sheet. The bend affects the stacking accuracy. After the board layers are stacked, the first slide 28 moves to the end of the first linear module 30, so that it is in an inoperative state, and the second slide 29 moves, and the upper limit disk 1 is adsorbed in turn through the negative pressure tube 33 for loading, so that the connecting column 2 of the upper limit disk 1 is inserted into the connecting hole, and then the corresponding lifting column 21 is started to drive the lower limit disk 3 to move upward and connect with the connecting column 2. Repeat the above operation, and install the anti-slip structure in the four connecting holes in turn. Finally, the multi-layer circuit board is placed on the limiting conveyor belt 38 through the negative pressure suction cup 31, and the multi-layer circuit board is transported to the pressing station through the limiting conveyor belt 38, realizing the automatic stacking of the multi-layer circuit boards and the automatic assembly of the anti-slip structure, improving production efficiency and reducing labor costs.

Claims

1. A non-slip conveying method for laminating multi-layer circuit boards, characterized in that: Connection holes are provided on the four sides of the copper foil and the four sides of the prepreg. After the multi-layer circuit boards are stacked, the connection holes of the copper foil are coaxial with the connection holes of the prepreg. Then, an anti-slip structure is provided on the multi-layer circuit boards. The anti-slip structure comprises an upper limit plate (1), a connection column (2) and a lower limit plate (3). The upper limit plate (1) and the connection column (2) are connected to form a T shape. The connection column (2) passes through the connection holes of the multi-layer circuit board in sequence and connects to the lower limit plate (3), so that the multi-layer circuit board is restricted between the upper limit plate (1) and the lower limit plate (3), and the inner layer chip in the multi-layer circuit board is restricted by the connection column (2).

2. The anti-slip conveying method for laminating a multi-layer circuit board according to claim 1, characterized in that: An inner cavity (4) is provided in the connecting column (2), a slide groove (5) is provided on the side wall of the connecting column (2), the slide groove (5) is connected to the inner cavity (4), a limit block (6) is slidably provided in the slide groove (5), the limit block (6) moves in the horizontal direction, one end of the limit block (6) extends to the inner cavity (4) and is provided with a wedge surface (7), a top shaft (8) is fixed to one end of the lower limit plate (3) close to the connecting column (2), a notch (9) connected to the inner cavity (4) is provided at the bottom of the connecting column (2), the cross-section of the notch (9) is rectangular, and the wedge surface (7) is located on the moving path of the top shaft (8).

3. The anti-slip conveying method for laminating a multi-layer circuit board according to claim 2, characterized in that: A rubber plug (10) is fixed in the inner cavity (4), and a through hole (11) is provided on the rubber plug (10) for the top shaft (8) to pass through. A plurality of pins (12) are fixed to one end of the lower limit plate (3) close to the connecting column (2). When the lower limit plate (3) contacts the connecting column (2), the pins (12) are inserted into the rubber plug (10).

4. The anti-slip conveying method for laminating a multi-layer circuit board according to claim 3, characterized in that: The end of the connecting column (2) away from the upper limit plate (1) is tapered, and its diameter gradually decreases in the direction approaching the lower limit plate (3). The end of the lower limit plate (3) close to the connecting column (2) is coaxially fixed with a limit ring (13).

5. The anti-slip conveying method for laminating a multi-layer circuit board according to claim 4, characterized in that: An elastic layer (14) is fixed to the inner wall of the notch (9), the limit block (6) squeezes the elastic layer (14) to interference fit the slide groove (5), and an elastic buffer block (15) is fixed to the end of the limit block (6) away from the connecting column (2).

6. A non-slip production system for laminating multi-layer circuit boards, utilizing the non-slip conveying method for laminating multi-layer circuit boards as claimed in claim 5, characterized in that: The invention comprises a stacking workbench (16), wherein the top surface of the stacking workbench (1) is provided with a plurality of positioning grooves (17), wherein the plurality of positioning grooves (17) are arranged in a rectangular array, wherein the connecting column (2) is placed in the positioning groove (17), and the top of the stacking workbench (16) is provided with a stepped tooling window (18) along its own height direction, wherein the size of the stepped tooling window (18) is smaller than the size of the copper foil, and a material tray (19) is provided in the stepped tooling window (18), wherein the top surface of the material tray (19) is provided with a plurality of tooling grooves (20) in a rectangular array, wherein the plurality of tooling grooves (20) are arranged ... The lower limit plate (3) is placed in the tooling slot (20), and the material tray (19) has the freedom to move along the length direction and the width direction of the stacking workbench (1). Four groups of lifting components are arranged below the material tray (19), and the four groups of lifting components correspond to the four connecting holes of the copper foil one by one. The lifting components include a lifting column (21), and the lifting column (21) has the freedom to move along the height direction of the stacking workbench (1). The lifting column (21) penetrates the tooling slot (20) and cooperates with the circular groove (22) at the bottom of the lower limit plate (3).

7. The anti-slip production system for laminating multi-layer circuit boards according to claim 6, characterized in that: Two groups of transverse linear drive modules (23) are installed at intervals in the step tooling window (18), and the two ends of the longitudinal linear drive module (24) are respectively installed on the slides of the two groups of transverse linear drive modules (23). The material tray (19) is installed on the slide of the longitudinal linear drive module (24) by screws. The side wall of the stacking workbench (16) is provided with a loading window connected to the step tooling window (18). The jacking assembly also includes a vertically installed cylinder (25), and the telescopic shaft of the cylinder (25) is connected to the jacking column (21).

8. The anti-slip production system for laminating multi-layer circuit boards according to claim 6, characterized in that: The invention also includes a gantry conveying mechanism, which includes a lifting column (26), a crossbeam (27), a first slide (28) and a second slide (29). The lifting columns (26) are arranged on both sides of the stacking workbench (1). The two ends of the crossbeam (27) are respectively connected to the two lifting columns (26). A first linear module (30) and a second linear module (32) are installed on the crossbeam (27). The first slide (28) is installed on the slide seat of the first linear module (30). Four negative pressure suction cups (31) are installed on the bottom of the first slide (28). The second slide (29) is installed on the slide seat of the second linear module (32). A negative pressure tube (33) is installed on the second slide (29).

9. The anti-slip production system for laminating multi-layer circuit boards according to claim 8, characterized in that: A third linear module (34) is arranged on both sides of the stacking workbench (1), and the lifting column (26) includes a horizontal sliding column (35) and a vertical sliding column (36). The horizontal sliding column (35) is installed on the slide seat of the third linear module (34), and the vertical sliding column (36) is slidably passed through the top of the horizontal sliding column (35). The end of the vertical sliding column (36) away from the horizontal sliding column (35) is connected to the crossbeam (27). A lifting cylinder (37) is vertically installed on the horizontal sliding column (35), and the telescopic shaft of the lifting cylinder (37) is connected to the vertical sliding column (36).

10. The anti-slip production system for laminating multi-layer circuit boards according to claim 9, characterized in that: It also includes a limiting conveyor belt (38), the input end of which is close to the stacking workbench (16), and two conveying limiting plates (39) are provided on the limiting conveyor belt (38), which form a channel for conveying multi-layer circuit boards.

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