Clip non-contact conveying device for semiconductor packaging

Abstract

The invention discloses a Clip non-contact conveying device for semiconductor packaging, and relates to the technical field of semiconductor packaging, the Clip non-contact conveying device comprises a fixed seat, a reel and a driving motor, the reel is installed on one side of the fixed seat and driven by the driving motor to unwind a Clip material belt, and the Clip non-contact conveying device further comprises a non-contact supporting mechanism arranged below a Clip material belt conveying path. The device comprises a base plate, a bottom frame, a fixing frame and an air floatation supporting assembly. In the semiconductor packaging field in the prior art, in the copper Clip tape conveying process, due to the fact that the rotating speed of a reel is mismatched with the material drawing speed, a material tape droops, and due to rigid friction between a traditional contact type limiting structure and the material tape, the surface of the material is abraded and damaged, and foreign matter pollution and accumulation are caused. According to the invention, through the non-contact design, the friction damage and pollution risk of a traditional tray or a supporting roller are avoided, the problems of abrasion and pollution of a traditional contact type limiting structure are solved, and the reliability and yield of semiconductor packaging are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and in particular to a clip non-contact transmission device for semiconductor packaging. Background Art

[0002] Semiconductor packaging is the complete process of cutting tested wafers into individual chips and processing them into chips that can be installed and used.

[0003] In the field of semiconductor packaging, copper clips are usually mass-produced and transported in the form of tape to meet the needs of automated packaging. When the clip reel speed is too high or the material pulling speed is slow, the continuously output linear clip material is likely to sag. To prevent excessive sagging of the tape, a conventional practice is to set a limiting structure underneath it, such as a tray or support roller. However, such structures usually maintain rigid contact with the tape. When the clip tape passes through traditional guide rollers and trays, the friction between the guide rollers and the copper clip will cause wear on the copper clip, affecting quality.

[0004] In response to the above technical problems, the present invention discloses a clip non-contact transmission device for semiconductor packaging. The present invention has the advantages of avoiding the friction damage and contamination risks of traditional trays or support rollers through non-contact design, solving the wear and contamination problems of traditional contact limiting structures, and improving the reliability and yield of semiconductor packaging. Summary of the Invention

[0005] The purpose of the present invention is to overcome the shortcomings of the existing technology and provide a non-contact transmission device for semiconductor packaging clips to solve the technical problems in the existing technology in the field of semiconductor packaging. During the copper clip tape transmission process, the mismatch between the reel rotation speed and the material pulling speed causes the tape to sag, and the traditional contact limiting structure (such as a tray, support roller) and the rigid friction between the tape causes wear and damage on the material surface and accumulation of foreign matter contamination. The present invention has the advantages of avoiding the friction damage and contamination risks of traditional trays or support rollers through non-contact design, solving the wear and contamination problems of traditional contact limiting structures, and improving the reliability and yield of semiconductor packaging.

[0006] The present invention is achieved through the following technical solutions: The present invention discloses a non-contact conveying device for semiconductor package clips, comprising a fixed seat, a reel, and a drive motor. The reel is mounted on one side of the fixed seat and driven by the drive motor to unwind the clip tape. The device also comprises a non-contact support mechanism provided below the clip tape conveying path, comprising a substrate, a base frame, a fixed frame, and an air-floating support assembly. The air-floating support assembly includes multiple nozzles that spray air toward the bottom surface of the Clip material strip to form a non-contact supporting air film layer, and a droop monitoring unit. The nozzles are arranged on a fixed frame through mounting blocks with the nozzles facing upward. The droop monitoring unit indirectly monitors the drooping of the material strip by sensing the displacement of the nozzles and outputs a signal. The droop monitoring unit feeds back the nozzle displacement signal to the central controller in real time, and the controller directly instructs the drive motor to adjust the speed.

[0007] Furthermore, the fixing frame is composed of two fixing rods parallel to the conveying direction and multiple mounting rods perpendicular to the fixing rods to form an orthogonal grid structure, and the nozzles are evenly arranged along the conveying length direction of the material belt to form a distributed air floating support surface.

[0008] Furthermore, a connecting pipe is connected to the bottom of the nozzle, which is communicated with the inner cavity of the nozzle, and the connecting pipe is longitudinally slidably penetrated in the mounting block.

[0009] Furthermore, a linear bearing is built into the sliding hole inside the mounting block, and the connecting pipe is longitudinally reciprocatingly slidably passed through the linear bearing.

[0010] Furthermore, the sag monitoring part includes a trigger ring and an inductive trigger component. The trigger ring is fixed to the outer wall of the connecting pipe, and the inductive trigger component is located below the trigger ring. There is a preset safety distance between the two.

[0011] Furthermore, a support plate is fixed on the top of the mounting block, and the support plate includes a vertical plate and a horizontal plate. The vertical plate is fixedly connected to the top surface of the mounting block, and the horizontal plate is suspended above the mounting block and is provided with a clearance hole for the connecting pipe to pass through. A support spring is provided on the outside of the connecting pipe, and its two ends respectively abut against the top surface of the horizontal plate and the bottom surface of the abutment ring fixed to the connecting pipe.

[0012] Furthermore, the central controller executes a closed-loop control strategy configured such that when the trigger ring moves downward and triggers the induction trigger member, the central controller executes the speed regulation of the drive motor.

[0013] Furthermore, the base plate is fixed vertically to the side of the fixing seat, and the base frame is installed above the base plate and the fixing frame is lifted by the support rod, so that a pipeline layout space is formed between the fixing frame and the base plate.

[0014] Furthermore, the length direction of the mounting rod is perpendicular to the conveying direction, and the nozzles are arranged in an array with equal spacing to cover the width of the material strip.

[0015] Furthermore, the trigger ring is threadedly connected to the connecting pipe.

[0016] The present invention has the following advantages: (1) The present invention sets up a non-contact support mechanism so that the vertically injected airflow forms an air film layer, realizing completely non-contact support of the Clip material, so that the Clip material can be transported non-contactly during transportation, eliminating the disadvantages of traditional trays or support rollers, preventing physical damage, avoiding scratches on the copper strip and electrostatic breakdown caused by rigid contact, and blocking the adhesion of metal chips and dust on the surface of the material, thus solving the problems of cold solder joints and foreign body short circuits from the source and improving the packaging yield.

[0017] (2) The present invention utilizes the Bernoulli effect and the pressure difference driving mechanism to convert the air gap change caused by the sagging of the material belt into the longitudinal displacement of the connecting pipe, and then generates an electrical signal by triggering the induction trigger part through the trigger ring. The mechanical conduction of the longitudinal movement of the connecting pipe avoids the interference of dust and oil mist on the optical sensor. When the material belt sags, the driving motor is automatically triggered to adjust the speed or stop, and the working position tension is coordinated to restore stable suspension, thereby reducing the risk of material breakage. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 For the present invention Figure 1 A local enlarged structural diagram of point A; Figure 3 For the present invention Figure 2 A schematic diagram of the partially enlarged structure at point B; Figure 4 For the present invention Figure 2 A schematic diagram of the partially enlarged structure at point C; Figure 5 This is a schematic diagram of the mounting block and sliding hole structure of the present invention; Figure 6 This is a schematic diagram of the mounting block and linear bearing structure of the present invention.

[0019] In the figure: 1. fixing seat; 2. reel; 3. driving motor; 4. rotating shaft; 5. non-contact supporting mechanism; 6. sliding hole; 7. linear bearing; 8. joint part; 9. central controller; 10. connecting pipe; 11. supporting plate; 12. supporting spring; 13. abutting ring; 111. vertical plate; 112. horizontal plate; 113. clearance hole; 501. base plate; 502. base frame; 503. fixing frame; 504. air floating supporting assembly; 521. base plate; 522. fixing frame; 523. supporting rod; 531. fixing rod; 532. mounting rod; 541. mounting block; 542. nozzle; 543. droop monitoring part; 5431. trigger ring; 5432. induction trigger part. DETAILED DESCRIPTION

[0020] The following is a detailed description of an embodiment of the present invention. This embodiment is implemented based on the technical solution of the present invention, and a detailed implementation method and specific operation process are given. However, the scope of protection of the present invention is not limited to the following embodiment. In the description of the present invention, words indicating directions or positional relationships such as "front", "rear", "left", and "right" are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, it should not be understood as a limitation on the present invention.

[0021] The embodiment discloses a non-contact transfer device for clip of semiconductor package, such as Figures 1-6 As shown, it is dedicated to the Clip placement station in the semiconductor packaging production line, solving the problems of precise transmission and posture stability of copper strips online. It directly serves high-precision placement equipment and provides pollution-free material transportation guarantee for processes such as wafer-level packaging and chip-level packaging. It specifically includes a fixing base 1, which is rigidly mounted on the front-end strip processing module of the main platform of the packaging equipment through the fixing base 1; like Figure 1 As shown, a reel 2 is installed on one side of the fixed base 1, and a rotating shaft 4 is fixedly set at the center of the reel 2. The rotating shaft 4 is rotatably connected to the fixed base 1. The function of the reel 2 is to unwind the copper strip. A driving motor 3 is installed on the other side of the fixed base 1. The output end of the driving motor 3 is transmission-connected to the rotating shaft 4 of the reel 2. The driving motor 3 is used to drive the reel 2 to rotate, thereby realizing the unwinding action of the reel 2 and finally completing the transmission of the material on the Clip reel 2.

[0022] However, in existing technical applications, when the speed of the clip reel 2 is too high or the material drawing speed is too slow, the continuously output linear clip material is likely to sag. To prevent the material strip from sagging excessively, a conventional practice is to set a limiting structure below it, such as a tray or support roller. However, such a structure usually maintains rigid contact with the material strip, which has significant disadvantages. On the one hand, contact friction can easily cause material wear, affecting quality; On the other hand, components such as trays are prone to accumulating foreign matter such as dust and metal shavings. When they come into contact with the Clip material, they will cause material contamination. The consequence is that after welding, it is easy to have problems with loose adhesion, or residual metal foreign matter in the welding area will cause the risk of product short circuit.

[0023] Therefore, in this embodiment, in order to prevent the linear material from being damaged by friction during the conveying process, a non-contact support mechanism 5 is provided below the conveying path of the Clip linear material to support and limit the material in a non-contact manner.

[0024] Specifically, such as Figure 1-Figure 3As shown, the non-contact support mechanism 5 includes a base plate 501, a base frame 502, a fixing frame 503, and an air-floating support assembly 504, wherein the base plate 501 is mounted on the side of the fixing base 1, and its mounting orientation is kept perpendicular to the fixing base 1. The base frame 502 is fixedly mounted on the upper surface of the base plate 501, and is mainly composed of a bottom plate 521, a fixing frame 522, and a support rod 523. The bottom plate 521 is directly and rigidly connected to the top of the base plate 501, and the fixing frame 522 is firmly set above the bottom plate 521. The bottom end of the support rod 523 is fixed to the top of the fixing frame 522, and the top end extends upward to be connected to the fixing frame 503. The fixing frame 503 is located directly below the clip linear material and is fixed to the top of the support rod 523. It is suspended above the base plate 501 by the base frame 502 through the support rod 523. Its specific structure includes two fixing rods 531. The two fixing rods 531 are arranged parallel to each other along the conveying direction of the clip material. A plurality of mounting rods 532 are fixed to the upper surface of the two fixing rods 531 in an array equidistantly along the length direction of the fixing rods 531. When viewed from above, the mounting rods 532 and the fixing rods 531 intersect perpendicularly to each other, forming an orthogonal grid structure. The length direction of each mounting rod 532 is perpendicular to the conveying direction. There are multiple air-floating support assemblies 504, and the multiple air-floating support assemblies 504 are respectively installed and fixed on each mounting rod 532. The air-floating support assembly 504 is specifically configured as an air-floating support structure, which generates an upward supporting force toward the Clip linear material to achieve non-contact support. Since the mounting rods 532 are arrayed along the conveying direction, the air-floating support assemblies 504 are also arranged equidistantly along the conveying direction of the Clip material.

[0025] The base frame 502 elevates the fixed frame 503 and the air-floating support assembly 504 thereon to a certain height so that they are suspended above the base plate 501 , thereby providing a concealed and orderly arrangement space in the base plate 501 area for the joint portion 8 connecting pipelines required by the air-floating support assembly 504 .

[0026] More specifically, the air floating support assembly 504 includes a mounting block 541, a nozzle 542, and a droop monitoring unit 543, wherein the mounting block 541 is rigidly fixed to the outer wall of the mounting rod 532, and the nozzle 542 is integrally installed on the mounting block 541, and the nozzle of the nozzle 542 is vertically facing upward. The nozzle 542 continuously ejects high-speed airflow upward, and then the vertical upward airflow generated by the nozzle 542 forms a stable air film layer on the bottom surface of the Clip material, and the dynamic pressure effect generated by the air film layer is used to achieve non-contact support for the linear material.

[0027] It should be noted that a plurality of air nozzles 542 are arranged at equal intervals along the width direction of the material strip, thereby covering the material strip in the width direction of the material strip.

[0028] Therefore, during operation, air can be supplied to the nozzle 542 through external air supply equipment, and the air flotation support of the nozzle 542 can achieve zero-contact wear prevention and eliminate surface damage of the material caused by mechanical friction, such as scratches, electrostatic breakdown, etc.

[0029] Considering that in actual operation, when the Clip material falls, in order to make timely adjustments, it is necessary to monitor the falling situation of the Clip material in real time, so that when it falls, it can be handled in time; In this embodiment, if Figures 1-6 As shown, a droop monitoring portion 543 is provided to monitor the material when it is drooping. The droop monitoring portion 543 includes a trigger ring 5431 and an inductive trigger member 5432. A connecting pipe 10 is provided below the nozzle head 542, and the interior of the connecting pipe 10 is vertically connected to the inner cavity of the nozzle head 542. The connecting pipe 10 is longitudinally inserted into the interior of the mounting block 541, and its terminal end passes through the mounting block 541 and extends to the bottom of the mounting block 541. The end of the connecting pipe 10 located below the mounting block 541 is provided with a connecting supply. The joint portion 8 of the gas equipment hose conduit has a trigger ring 5431 fixedly sleeved on the outer wall of the connecting pipe 10 above the mounting block 541. A sensing trigger member 5432 is embedded in the upper end face of the mounting block 541. The sensing surface of the sensing trigger member 5432 is located below the trigger ring 5431 and has a preset adjustable safety distance from the trigger ring 5431. The sensing trigger member 5432 is used to monitor the downward movement of the trigger ring 5431, thereby feedback the downward movement of the air injection head 542 and the connecting pipe 10. It should be noted that the trigger ring 5431 is configured to be threadedly connected to the connecting tube 10, and the axial height position of the trigger ring 5431 can be adjusted by rotating the trigger ring 5431 to achieve the purpose of adjusting the distance between the trigger ring 5431 and the inductive trigger member 5432, and correcting the sensor trigger threshold through mechanical displacement compensation.

[0030] In addition, if Figure 5 and Figure 6 As shown, a sliding hole 6 is longitudinally opened inside the mounting block 541, and the sliding hole 6 passes through the top and bottom surfaces of the mounting block 541. A linear bearing 7 is installed inside the sliding hole 6, and the connecting tube 10 is slidably inserted into the bearing hole of the linear bearing 7, thereby reducing the friction resistance of the axial movement of the connecting tube 10 through the structure of the linear bearing 7.

[0031] In addition, if Figure 4As shown, a support plate 11 is fixedly provided on one side of the upper end surface of the mounting block 541. The support plate 11 is set in an inverted L shape, specifically including a vertical plate 111 and a horizontal plate 112. The vertical plate 111 is fixed on the upper end surface of the mounting block 541, and the horizontal plate 112 is fixed on the side of the top of the vertical plate 111 facing the connecting pipe 10. It is horizontally suspended above the top surface of the mounting block 541, and a clearance hole 113 is opened up and down inside the horizontal plate 112. The connecting pipe 10 passes through the clearance hole 113, and the inner diameter of the clearance hole 113 is large. The outer diameter of the connecting pipe 10 is reduced, thereby reducing the friction interference of the longitudinal movement of the connecting pipe 10. The outer wall of the connecting pipe 10 above the horizontal plate 112 is fixedly sleeved with an abutment ring 13. A support spring 12 is provided between the abutment ring 13 and the horizontal plate 112. The support spring 12 is sleeved on the outside of the connecting pipe 10 and supports the connecting pipe 10 upward through the support spring 12. The trigger ring 5431 is located between the horizontal plate 112 and the top surface of the mounting block 541, and the trigger ring 5431 is maintained in a normally suspended position by the spring tension. It should be noted that the induction trigger 5432 supports two types of sensor deployments, namely contact sensors or proximity switches. The contact sensor is triggered based on a mechanical contact pressure threshold and realizes signal conversion through physical displacement conduction, while the proximity switch realizes non-contact distance detection based on electromagnetic and capacitive field effects and triggers the signal through field strength changes. Regardless of which sensor is used, under normal circumstances, the trigger ring 5431 has a safe distance from the sensor sensing surface. In this embodiment, a proximity switch can be selected.

[0032] During operation, when the Clip material is stably suspended, the dynamic pressure of the air film layer is balanced, the force on the nozzle head 542 is balanced, the trigger ring 5431 and the inductive trigger part 5432 maintain a safe distance, and no signal is output. When the Clip material falls, the air gap between the nozzle hole of the nozzle head 542 and the material is sharply reduced. According to the law of conservation of flow and Bernoulli's equation, the air flow velocity in this narrow gap increases sharply, resulting in an increase in local dynamic pressure and a sharp drop in static pressure. A significant low-pressure area is formed below the nozzle head 542, which is connected to the upper connecting pipe. 10 and the relative high pressure in the inner cavity of the nozzle 542 form a strong downward pressure difference. The downward pressure differential force overcomes the resistance of the system and drives the nozzle 542 and the connected connecting pipe 10 to move downward, and the trigger ring 5431 moves downward synchronously, contacting or entering the effective detection area of ​​the inductive trigger member 5432. When the inductive trigger member 5432 is a contact type, the trigger ring 5431 compresses the support spring 12 until the trigger ring 5431 mechanically presses the sensor. When the inductive trigger member 5432 is a proximity switch, the field strength distortion triggers a digital signal.

[0033] A limiting structure is also provided at one end of the connecting tube 10 at the bottom of the mounting block 541. After the material strip resumes normal suspension, the supporting spring 12 causes the connecting tube 10 to reset and move upward, and the limiting structure can be used to limit the reset movement of the connecting tube 10. In addition, if Figure 1 As shown, the induction trigger 5432 and the reel 2 drive motor 3 are both connected to the central controller 9 to form a closed-loop safety protection system. The control strategy is that when the output signal of the induction trigger 5432 jumps, the central controller 9 immediately sends an instruction to the drive motor 3 to stop the drive motor 3 or reduce the unwinding speed of the reel 2. At this time, the working position in operation continues to pull the Clip material to keep a constant tension on the entire section of material, thereby eliminating the falling tendency and restoring a stable suspension state.

[0034] It should be noted that in this embodiment, in order to achieve a stable air supply for the non-contact air flotation conveying system of Clip materials in semiconductor packaging, a complete integrated compressed air treatment system is required. Its power source uses an oil-free air compressor and is equipped with a dryer to prevent water from entering the air flow. In addition, an air filter is used to ensure that the cleanliness of the jet air flow meets the standards.

[0035] The principle of the present invention is as follows: During the unwinding process of the reel 2, the air supply system of the bottom non-contact support mechanism 5 outputs clean and dry airflow, which is ejected vertically upward through the nozzle 542 to form a stable air film layer on the bottom surface of the Clip copper strip. The non-contact support of the strip is achieved through the airflow dynamic pressure, which completely avoids the risk of pollution and wear caused by rigid contact. Under normal equilibrium, when the strip is normally suspended, the dynamic pressure of the air film is balanced to balance the force of the nozzle 542. The threaded adjustable trigger ring 5431 fixed to the connecting pipe 10 maintains a preset safety distance from the inductive trigger part 5432. When the strip sags and the air gap is reduced, the Bernoulli effect triggers a sudden drop in local static pressure, generating a downward pressure differential force, which drives the nozzle 542, the connecting pipe 10, and the trigger ring 5431 components to overcome friction and move downward. When the inductive trigger part 5432 is contact type, and the trigger ring 5431 compresses the support spring 12 until the trigger ring 5431 mechanically presses the sensor. When the inductive trigger part 5432 is a proximity switch, the trigger ring 5431 moves down into the effective detection area of ​​the proximity switch and outputs a signal. The central controller 9 collects the jump signal of the inductive trigger part 5432 in real time. The central controller 9 immediately sends an instruction to the drive motor 3 to stop the drive motor 3 or reduce the unwinding speed of the reel 2. At this time, the working position in operation continues to pull the Clip material to keep a constant tension for the entire section of material, thereby eliminating the falling trend and restoring a stable suspended state. After the material belt resumes normal suspension, the trigger ring 5431 moves up and resets through the action of the support spring 12, and maintains a safe distance from the inductive trigger part 5432 again.

[0036] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be included therein. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

Claims

1. A non-contact conveying device for clips of semiconductor packages, comprising a fixing seat (1), a reel (2) and a driving motor (3), wherein the reel (2) is mounted on one side of the fixing seat (1) and driven by the driving motor (3) to unwind the clip tape, characterized in that: It also includes a non-contact support mechanism (5) provided below the Clip material belt conveying path, which includes a base plate (501), a base frame (502), a fixing frame (503) and an air-floating support assembly (504); The air-floating support assembly (504) includes a plurality of nozzles (542) for spraying air toward the bottom surface of the Clip material strip to form a non-contact supporting air film layer, and a droop monitoring unit (543). The nozzles (542) are mounted on the fixing frame (503) via a mounting block (541) with the nozzle facing upward. The droop monitoring unit (543) indirectly monitors the drooping of the material strip by sensing the displacement of the nozzles (542) and outputs a signal. The droop monitoring unit (543) feeds back the nozzle (542) displacement signal to the central controller (9) in real time, and the controller directly instructs the drive motor (3) to adjust the speed.

2. The non-contact transfer device for semiconductor package clips according to claim 1, wherein: The fixing frame (503) is composed of two fixing rods (531) parallel to the conveying direction and a plurality of mounting rods (532) perpendicularly intersecting the fixing rods (531) to form an orthogonal grid structure, and the nozzles (542) are arranged equidistantly along the conveying length direction of the material belt to form a distributed air-floating support surface.

3. The non-contact transfer device for semiconductor package clips according to claim 1, wherein: The bottom of the nozzle (542) is connected to a connecting pipe (10), which is in communication with the inner cavity of the nozzle (542), and the connecting pipe (10) is longitudinally slidably arranged in the mounting block (541).

4. The non-contact transfer device for semiconductor package clips according to claim 3, wherein: A linear bearing (7) is built into the internal sliding hole (6) of the mounting block (541), and the connecting pipe (10) is longitudinally reciprocatingly slidably inserted therein.

5. The non-contact transfer device for semiconductor package clips according to claim 4, wherein: The droop monitoring portion (543) comprises a trigger ring (5431) and an inductive trigger member (5432); the trigger ring (5431) is fixed to the outer wall of the connecting pipe (10); the inductive trigger member (5432) is located below the trigger ring (5431), and a preset safety distance is provided between the trigger ring (5431) and the inductive trigger member (5432).

6. The non-contact transfer device for semiconductor package clips according to claim 5, wherein: A support plate (11) is fixed on the top of the mounting block (541), and the support plate (11) includes a vertical plate (111) and a horizontal plate (112). The vertical plate (111) is fixed to the top surface of the mounting block (541), and the horizontal plate (112) is suspended above the mounting block (541) and is provided with a clearance hole (113) for the connecting pipe (10) to pass through. The connecting pipe (10) is externally sleeved with a support spring (12), and its two ends respectively abut against the top surface of the horizontal plate (112) and the bottom surface of the abutting ring (13) fixed to the connecting pipe (10).

7. The non-contact transfer device for semiconductor package clips according to claim 6, wherein: The central controller (9) executes a closed-loop control strategy configured such that when the trigger ring (5431) moves downward and triggers the induction trigger member (5432), the central controller (9) executes the speed regulation of the drive motor (3).

8. The non-contact transfer device for semiconductor package clips according to claim 1, wherein: The base plate (501) is vertically fixed to the side of the fixing seat (1), and the base frame (502) is installed above the base plate (501) and lifts the fixing frame (503) through the support rod (523), so that a pipeline layout space is formed between the fixing frame (503) and the base plate (501).

9. The non-contact transfer device for semiconductor package clips according to claim 2, wherein: The length direction of the mounting rod (532) is perpendicular to the conveying direction, and the nozzles (542) are arranged in an array with equal spacing to cover the width of the material strip.

10. The non-contact transfer device for semiconductor package clips according to claim 5, wherein: The trigger ring (5431) is threadedly connected to the connecting pipe (10).

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