Addition type organic silicon pouring sealant composition and preparation method thereof

Abstract

The invention relates to an addition type organic silicon pouring sealant composition. The addition type organic silicon pouring sealant composition is prepared by compounding vinyl silicone oil, hydrogen-containing silicone oil, spherical aluminum oxide, flaky boron nitride and modified silicon carbide, vinyl-terminated fluorine-containing siloxane is introduced into the modified silicon carbide, and a siloxane chain segment of the vinyl-terminated fluorine-containing siloxane has polarity similar to that of vinyl silicone oil and hydrogen-containing silicone oil, so that the modified silicon carbide, the vinyl silicone oil, the hydrogen-containing silicone oil and other components have excellent compatibility and stability, and the mechanical property of the organic silicon pouring sealant composition is remarkably improved; the introduction of the fluorine chain segment can reduce the surface energy of the pouring sealant, inhibit water molecule permeation on the surface of the pouring sealant, and improve the hydrophobic effect of the pouring sealant, thereby significantly improving the hydrolysis resistance and waterproof performance.

Description

Technical Field

[0001] The present invention relates to the technical field of polymer materials, in particular to an addition-type organosilicon potting adhesive composition and a preparation method thereof. Background Art

[0002] With the rapid development of electronic devices, their integration levels continue to increase, and their power density continues to rise, resulting in a dramatic increase in heat generated during operation. Failure to dissipate this heat promptly and effectively can lead to elevated temperatures in electronic components, impacting their performance and service life, and in severe cases, even causing equipment failure. Silicone potting compounds, due to their excellent insulation, weather resistance, and chemical stability, have become a common material for heat dissipation and protection in electronic devices.

[0003] However, existing silicone potting compounds face numerous technical bottlenecks in practical applications: Insufficient thermal conductivity: Currently, silicone potting compounds on the market generally have low thermal conductivity, typically less than 1.5 W / m·K. This low thermal conductivity makes them unable to meet the efficient heat dissipation requirements of high-power electronic equipment, making it difficult to quickly conduct heat away, resulting in localized overheating of electronic components; Poor interfacial adhesion: The interfacial adhesion to the surface of electronic components is weak, with a shear strength typically less than 0.5 MPa. During long-term operation of the equipment, debonding can easily occur between the potting compound and the electronic components due to temperature fluctuations, vibration, and other factors, affecting the potting compound's protective and heat dissipation effects; Limited process performance: The conventional method for improving thermal conductivity is to fill the silicone potting compound with a high proportion of metal powder, but this practice dramatically increases the viscosity of the silicone potting compound system, resulting in poor fluidity and difficulty in achieving uniform potting in complex electronic component structures. This significantly degrades processability, reducing production efficiency and product quality; Poor interfacial compatibility: In existing technologies, the interfacial compatibility between thermally conductive fillers and the silicone matrix is ​​poor. This causes the filler to be unevenly dispersed in the matrix and easily agglomerated, which not only affects the mechanical properties of the potting compound, such as tensile strength and flexibility, but also reduces the effect of improving its thermal conductivity. There are disadvantages to thickening methods: traditional thickening methods, such as adding silane coupling agents, have limited effects on improving the shear strength of the potting compound, and will have a negative impact on the storage stability of the potting compound, shorten its shelf life, and increase the company's storage and use costs.

[0004] In summary, there is an urgent need to develop a new technical solution to solve the problems existing in the existing technology and meet the needs of the current market. Summary of the Invention

[0005] Therefore, it is necessary to provide an addition-type silicone potting compound that combines high thermal conductivity (thermal conductivity ≥ 2.5 W / m·K), high bond strength (shear strength ≥ 2.0 MPa), and excellent processability. Specifically, it aims to overcome the shortcomings of existing technologies by ensuring good fluidity to meet the heat dissipation and protection requirements of high-power, highly integrated electronic devices, thereby improving the reliability and service life of electronic devices.

[0006] One object of the present invention is to provide an addition-type organosilicon potting compound composition comprising the following components in parts by weight:

[0007]

[0008] Wherein, the modified silicon carbide is the product of the reaction of silicon carbide and KH570, which is obtained by reacting with modified cellulose and vinyl-terminated fluorinated siloxane;

[0009] The modified cellulose is obtained by reacting cellulose with vinyltrimethoxysilane.

[0010] Specifically, the surface energy of modified silicon carbide is adjusted to 45-50 mJ / m 2 , and the surface energy of spherical alumina and flake boron nitride is adjusted to 45mJ / m 2 and 40mJ / m 2 , and vinyl silicone oil surface energy 40-45mJ / m 2 Matching, surface energy gradient difference ≤ 5mJ / m 2 , which can ensure that the filler is evenly dispersed in the silicone oil and avoid phase separation.

[0011] Furthermore, the viscosity of the vinyl silicone oil is 50-500 mPa·s.

[0012] Specifically, the viscosity of the vinyl silicone oil helps to ensure the fluidity and operability of the potting compound during processing, while providing active groups for the subsequent cross-linking and curing reaction.

[0013] Specifically, the catalyst can efficiently catalyze the addition reaction of vinyl silicone oil and hydrogen-containing silicone oil, control the curing speed and degree of curing, and ensure that the potting compound is smoothly cured under the specified process conditions.

[0014] Furthermore, the particle size of the spherical alumina is 5-20 μm.

[0015] Furthermore, the thickness of the flake boron nitride is 80-120 nm.

[0016] Specifically, spherical alumina has good fluidity and bulk density, can form a relatively stable heat conduction path within the matrix, and has relatively little effect on the viscosity of the potting compound system.

[0017] Specifically, the diameter-to-thickness ratio of the flake boron nitride is greater than 20, and its flake structure helps to overlap with each other in the matrix to form a two-dimensional thermal conductive network, which synergizes with the spherical alumina to further improve the thermal conductivity of the potting compound.

[0018] Specifically, modified silicon carbide can improve the compatibility of silicon carbide with the organosilicon matrix, allowing it to be better dispersed in the matrix, filling the gaps between spherical alumina and flaky boron nitride, and improving the thermal conductive network structure.

[0019] Furthermore, the catalyst is selected from one or more of a platinum complex, a rhodium complex or a palladium complex.

[0020] Specifically, under the action of a catalyst, the active hydrogen in the hydrogenated silicone oil reacts with the vinyl silicone oil to crosslink and cure the potting compound, forming a three-dimensional network structure with certain strength and performance.

[0021] Furthermore, the silane coupling agent is selected from one or more of KH560, KH792, KH570, and titanate coupling agents.

[0022] Specifically, a combination of multiple silane coupling agents can react with the hydroxyl groups on the filler surface, while its organic functional groups react with the silicone matrix; the titanate coupling agent enhances the interfacial bonding between the filler and the matrix and reduces the viscosity of the system through chemical bonding with the filler surface and physical entanglement with the silicone matrix.

[0023] Preferably, the tackifier is selected from epoxy silicone oil.

[0024] Specifically, the epoxy groups in epoxy silicone oil can react with the active groups on the surface of the silicone matrix and filler to further enhance the interfacial adhesion, while producing a synergistic effect with the platinum catalytic system to significantly improve the shear strength of the potting compound.

[0025] The present invention also provides a method for preparing the addition-type organosilicon potting adhesive composition, which comprises the following steps:

[0026] S1, adding silicon carbide and KH570 into a solvent, mixing, heating and reacting to obtain an intermediate product;

[0027] S2, mixing cellulose and vinyltrimethoxysilane, heating and reacting to obtain modified cellulose;

[0028] S3. Under the protection of an inert gas, the intermediate product, modified cellulose, and vinyl-terminated fluorinated silicone are added to a solvent and mixed, and heated to react under the action of an initiator to obtain modified silicon carbide;

[0029] S4. Evenly mix the modified silicon carbide with other ingredients, and grind them to obtain an addition-type organosilicon potting compound.

[0030] Specifically, the present invention utilizes a three-roll mill to grind the mixed material, controlling the grinding gap to ≤50μm. This milling process further refines filler particles, breaking up filler agglomerates and achieving a more uniform and finer dispersion of the filler within the matrix, thereby improving the potting compound's performance consistency.

[0031] Specifically, the potting glue of the present invention can also be cured in a step-by-step heating method during use; specifically, curing at 80-90°C for 1-2 hours to initially cross-link the potting glue; then heating to 120-130°C for curing for 0.5-1 hour to accelerate the cross-linking reaction; and finally heating to 150-160°C for curing for 0.5-1 hour to ensure that the potting glue is completely cured to form a three-dimensional network structure with stable performance.

[0032] Furthermore, in step S1, the temperature of the heating reaction is 60-160°C.

[0033] Furthermore, in step S2, the temperature of the heating reaction is 50-60°C.

[0034] Furthermore, in step S3, the temperature of the heating reaction is 75-85°C.

[0035] The present invention has the following beneficial effects:

[0036] The addition-type organic silicone potting adhesive composition of the present invention is compounded with vinyl silicone oil, hydrogenated silicone oil, spherical alumina, flaky boron nitride and modified silicon carbide; first, the silicon carbide is treated with KH570 silane coupling agent to introduce unsaturated double bonds into the silicon carbide; cellulose is reacted with vinyltrimethoxysilane to obtain modified cellulose; then the modified silicon carbide, modified cellulose and fluorinated silicone are mixed and reacted under the action of an initiator, thereby introducing cellulose and vinyl-terminated fluorinated silicone into the modified silicon carbide. On the one hand, because the modified silicon carbide incorporates vinyl-terminated fluorinated siloxane, its siloxane segments possess similar polarity to vinyl silicone oil and hydrogenated silicone oil, resulting in excellent compatibility and stability between the modified silicon carbide and components such as vinyl silicone oil and hydrogenated silicone oil, significantly improving the mechanical properties of the silicone potting compound. The introduction of fluorinated segments effectively modulates the surface energy of the potting compound, inhibiting water molecule penetration on the surface and enhancing its hydrophobicity, thereby significantly enhancing its hydrolysis resistance and water resistance. On the other hand, the cellulose segments form a network-like cross-linked structure within the silicone potting compound, effectively securing a large amount of fillers such as spherical alumina and flake boron nitride through physical entanglement and hydrogen bonding, inhibiting their aggregation and facilitating their uniform dispersion within the silicone potting compound, significantly improving its strength and thermal conductivity. DETAILED DESCRIPTION

[0037] In order to more clearly illustrate the technical solutions of the present invention, the following examples are given. Unless otherwise stated, the raw materials, reactions and post-processing methods mentioned in the examples are common raw materials on the market and technical methods well known to those skilled in the art.

[0038] The terms "preferred," "preferably," "more preferred," and the like, used herein, refer to embodiments of the invention that may provide certain benefits under certain circumstances. However, other embodiments may also be preferred under the same or other circumstances. Furthermore, the recitation of one or more preferred embodiments does not imply that other embodiments are not useful, nor is it intended to exclude other embodiments from the scope of the invention.

[0039] It should be understood that, except in any operating examples, or where otherwise indicated, all numbers expressing, for example, quantities of ingredients used in the specification and claims are to be understood as being modified in all instances by the term "about." Accordingly, unless indicated to the contrary, the numerical parameters set forth in the following specification and appended claims are approximations that may vary depending upon the desired properties to be obtained by the present invention.

[0040] Vinyl silicone oil was purchased from Shandong Dayi, brand DY-V401-350.

[0041] Hydrogenated silicone oil was purchased from Shandong Dayi, brand DY-H212T.

[0042] The spherical alumina includes 5 μm spherical alumina and 20 μm spherical alumina, and the mass ratio of the two is 6:4.

[0043] Flake boron nitride, average particle size 15μm (diameter-to-thickness ratio ≥ 50), thickness controlled at 80-120nm.

[0044] The silicon carbide powder comprises 50-200 nm silicon carbide powder and 2-5 μm silicon carbide powder, with a mass ratio of 1:3.

[0045] Catalyst, platinum catalyst, purchased from Guangzhou Tuoli, brand Pt-vts-c.

[0046] Silane coupling agent, KH560 silane coupling agent and KH570 silane coupling agent, the mass ratio is 40:60.

[0047] The tackifier, epoxy silicone oil, was purchased from Hubei Yamade Biopharmaceutical Co., Ltd., brand YDE-8814.

[0048] Vinyl terminated fluorosilicone, vinyl terminated dimethylmethyl-3,3,3-trifluoropropyl (siloxanes and polysiloxanes), CAS: 68951-98-4, were purchased from Henan Qinpeng Technology Co., Ltd.

[0049] BPO, benzoyl peroxide.

[0050] Cellulose powder, C823054, was purchased from Maclean.

[0051] The test method for performance testing is as follows:

[0052] Percolation threshold test: By measuring the thermal conductivity of a composition of spherical alumina, flake boron nitride and modified silicon carbide at different contents, a "thermal conductivity-filler concentration" curve is drawn. The concentration corresponding to the sudden change point of the curve slope is the threshold.

[0053] Thermal conductivity test: Refer to the hot plate method in GB 3399-1982, Test method for thermal conductivity of plastics; use a laser thermal conductivity meter to test the thermal conductivity of each sample.

[0054] Volume resistivity test: refer to GB / T 15022.2-2017 Article 5.17; add silica gel to a paint tray with a diameter of Φ100mm to make a paint sheet with a thickness of 1mm, and use a high resistance meter (range ≥10 17 Ω) or insulation resistance tester.

[0055] Shear strength test: Refer to GB / T 7124 "Determination of tensile shear strength of adhesives"; aluminum sheets are coated with thermally conductive potting adhesive to make shear strength test samples (lap length and thickness are in accordance with the standard, and the required overlap length is 12.5mm).

[0056] Viscosity test: measured at 25°C using a rotational viscometer.

[0057] Temperature stability test: The potting compound is cycled 1000 times at a temperature of -55°C to 200°C, and the thermal conductivity of the potting compound after the cycle is tested, and its thermal conductivity retention rate is calculated.

[0058] Preparation Example

[0059] The content of fillers (spherical alumina, flake boron nitride, and modified silicon carbide) in the addition-type silicone potting composition was optimized, and preparation examples were set up for testing. The thermal conductivity and critical percolation threshold of the preparation examples were also tested.

[0060] The contents and test results of the spherical aluminum oxide, flaky boron nitride and modified silicon carbide are shown in Tables 1 and 2.

[0061] Table 1 Contents of spherical alumina, flake boron nitride and modified silicon carbide in Preparation Examples 1-5

[0062]

[0063] Table 2 Performance test results of Preparation Examples 1-5

[0064]

[0065]

[0066] As can be seen from Tables 1 and 2, the percolation threshold of Preparation Example 1 dropped to 45 vol%, while the thermal conductivity of Preparation Example 3 reached 7.8 W / m·K, verifying the synergistic effect between spherical alumina, flake boron nitride, and modified silicon carbide.

[0067] Example 1

[0068] An addition-type organosilicon potting compound composition comprises the following components in parts by weight:

[0069]

[0070] The preparation method of the above-mentioned addition-type organosilicon potting compound comprises the following steps:

[0071] S1. Using deionized water as solvent, mix silicon carbide powder and KH570, stir at 60°C for 4 hours, and centrifuge to obtain an intermediate product;

[0072] The mass ratio of the silicon carbide powder to KH570 is 1:5;

[0073] S2, using methanol as solvent, mixing cellulose and vinyltrimethoxysilane, and reacting at 50°C for 24 hours to obtain modified cellulose;

[0074] The mass ratio of cellulose to vinyltrimethoxysilane is 2:1;

[0075] S3. Under the protection of nitrogen, using toluene as solvent, the intermediate product, modified cellulose and vinyl-terminated fluorosiloxane are blended, and heated to 85° C. for 4 h under the action of BPO to obtain modified silicon carbide;

[0076] The mass ratio of the intermediate product, modified cellulose, vinyl-terminated fluorosilicone and BPO is 1:3:5:0.05;

[0077] S4-1. Mix the modified silicon carbide with other ingredients, stir evenly at 60° C. under a vacuum environment of -0.095 MPa, and grind the mixture with a three-roll mill for 3 hours to obtain an addition-type silicone potting compound.

[0078] S4-2. Heat the addition-type silicone potting adhesive composition to 80°C and cure for 1 hour to achieve initial crosslinking of the potting adhesive. Then heat it to 120°C and cure for 0.5 hour to accelerate the crosslinking reaction. Finally, heat it to 150°C and cure for 0.5 hour to obtain the cured silicone potting adhesive for testing.

[0079] Example 2

[0080] An addition-type organosilicon potting compound composition comprises the following components in parts by weight:

[0081]

[0082] The preparation method of the above-mentioned addition-type organosilicon potting compound comprises the following steps:

[0083] S1. Using deionized water as solvent, mix silicon carbide powder and KH570, stir at 60°C for 4 hours, and centrifuge to obtain an intermediate product;

[0084] The mass ratio of the silicon carbide powder to KH570 is 1:5;

[0085] S2, using methanol as solvent, mixing cellulose and vinyltrimethoxysilane, and reacting at 50°C for 24 hours to obtain modified cellulose;

[0086] The mass ratio of cellulose to vinyltrimethoxysilane is 2:1;

[0087] S3. Under the protection of nitrogen, using toluene as solvent, the intermediate product, modified cellulose and vinyl-terminated fluorosiloxane are blended, and heated to 85° C. for 4 h under the action of BPO to obtain modified silicon carbide;

[0088] The mass ratio of the intermediate product, modified cellulose, vinyl-terminated fluorosilicone and BPO is 1:3:5:0.05;

[0089] S4-1. Mix the modified silicon carbide with other ingredients, stir evenly at 60° C. under a vacuum environment of -0.095 MPa, and grind the mixture with a three-roll mill for 3 hours to obtain an addition-type silicone potting compound.

[0090] S4-2. Heat the addition-type silicone potting adhesive composition to 80°C and cure for 1 hour to achieve initial crosslinking of the potting adhesive. Then heat it to 120°C and cure for 0.5 hour to accelerate the crosslinking reaction. Finally, heat it to 150°C and cure for 0.5 hour to obtain the cured silicone potting adhesive for testing.

[0091] Example 3

[0092] An addition-type organosilicon potting compound composition comprises the following components in parts by weight:

[0093]

[0094] The preparation method of the above-mentioned addition-type organosilicon potting compound comprises the following steps:

[0095] S1. Using deionized water as solvent, mix silicon carbide powder and KH570, stir at 60°C for 4 hours, and centrifuge to obtain an intermediate product;

[0096] The mass ratio of the silicon carbide powder to KH570 is 1:5;

[0097] S2, using methanol as solvent, mixing cellulose and vinyltrimethoxysilane, and reacting at 50°C for 24 hours to obtain modified cellulose;

[0098] The mass ratio of cellulose to vinyltrimethoxysilane is 2:1;

[0099] S3. Under the protection of nitrogen, using toluene as solvent, the intermediate product, modified cellulose and vinyl-terminated fluorosiloxane are blended, and heated to 85° C. for 4 h under the action of BPO to obtain modified silicon carbide;

[0100] The mass ratio of the intermediate product, modified cellulose, vinyl-terminated fluorosilicone and BPO is 1:3:5:0.05;

[0101] S4-1. Mix the modified silicon carbide with other ingredients, stir evenly at 60° C. under a vacuum environment of -0.095 MPa, and grind the mixture with a three-roll mill for 3 hours to obtain an addition-type silicone potting compound.

[0102] S4-2. Heat the addition-type silicone potting adhesive composition to 80°C and cure for 1 hour to achieve initial crosslinking of the potting adhesive. Then heat it to 120°C and cure for 0.5 hour to accelerate the crosslinking reaction. Finally, heat it to 150°C and cure for 0.5 hour to obtain the cured silicone potting adhesive for testing.

[0103] Example 4

[0104] An addition-type organosilicon potting compound composition comprises the following components in parts by weight:

[0105]

[0106]

[0107] The preparation method of the above-mentioned addition-type organosilicon potting compound comprises the following steps:

[0108] S1. Using deionized water as solvent, mix silicon carbide powder and KH570, stir at 60°C for 4 hours, and centrifuge to obtain an intermediate product;

[0109] The mass ratio of the silicon carbide powder to KH570 is 1:5;

[0110] S2, using methanol as solvent, mixing cellulose and vinyltrimethoxysilane, and reacting at 50°C for 24 hours to obtain modified cellulose;

[0111] The mass ratio of cellulose to vinyltrimethoxysilane is 2:1;

[0112] S3. Under the protection of nitrogen, using toluene as solvent, the intermediate product, modified cellulose and vinyl-terminated fluorosiloxane are blended, and heated to 85° C. for 4 h under the action of BPO to obtain modified silicon carbide;

[0113] The mass ratio of the intermediate product, modified cellulose, vinyl-terminated fluorosilicone and BPO is 1:3:5:0.05;

[0114] S4-1. Mix the modified silicon carbide with other ingredients, stir evenly at 60° C. under a vacuum environment of -0.095 MPa, and grind the mixture with a three-roll mill for 3 hours to obtain an addition-type silicone potting compound.

[0115] S4-2. Heat the addition-type silicone potting adhesive composition to 80°C and cure for 1 hour to achieve initial crosslinking of the potting adhesive. Then heat it to 120°C and cure for 0.5 hour to accelerate the crosslinking reaction. Finally, heat it to 150°C and cure for 0.5 hour to obtain the cured silicone potting adhesive for testing.

[0116] Example 5

[0117] An addition-type organosilicon potting compound composition comprises the following components in parts by weight:

[0118]

[0119] The preparation method of the above-mentioned addition-type organosilicon potting compound comprises the following steps:

[0120] S1. Using deionized water as solvent, mix silicon carbide powder and KH570, stir at 60°C for 4 hours, and centrifuge to obtain an intermediate product;

[0121] The mass ratio of the silicon carbide powder to KH570 is 1:5;

[0122] S2, using methanol as solvent, mixing cellulose and vinyltrimethoxysilane, and reacting at 50°C for 24 hours to obtain modified cellulose;

[0123] The mass ratio of cellulose to vinyltrimethoxysilane is 2:1;

[0124] S3. Under the protection of nitrogen, using toluene as solvent, the intermediate product, modified cellulose and vinyl-terminated fluorosiloxane are blended, and heated to 85° C. for 4 h under the action of BPO to obtain modified silicon carbide;

[0125] The mass ratio of the intermediate product, modified cellulose, vinyl-terminated fluorosilicone and BPO is 1:3:5:0.05;

[0126] S4-1. Mix the modified silicon carbide with other ingredients, stir evenly at 60° C. under a vacuum environment of -0.095 MPa, and grind the mixture with a three-roll mill for 3 hours to obtain an addition-type silicone potting compound.

[0127] S4-2. Heat the addition-type silicone potting adhesive composition to 80°C and cure for 1 hour to achieve initial crosslinking of the potting adhesive. Then heat it to 120°C and cure for 0.5 hour to accelerate the crosslinking reaction. Finally, heat it to 150°C and cure for 0.5 hour to obtain the cured silicone potting adhesive for testing.

[0128] Comparative Example 1

[0129] A silicone potting compound composition is disclosed. The difference between this comparative example and Example 1 is that in step S2, an equal mass of vinyltrimethoxysilane is used to replace the vinyl-terminated fluorinated siloxane, and the other components and preparation methods are the same.

[0130] Comparative Example 2

[0131] A silicone potting compound composition is disclosed. The difference between this comparative example and Example 1 is that step S2 is removed, that is, in step S3, only vinyl-terminated fluorinated siloxane is used to react with the intermediate product. Other components and preparation methods are the same.

[0132] Comparative Example 3

[0133] A silicone potting compound composition is disclosed. The difference between this comparative example and Example 1 is that silicon carbide of equal mass is used to replace the modified silicon carbide, and the other components and preparation methods are the same.

[0134] Test Example 1

[0135] Mechanical properties tests were performed on the organosilicon potting adhesive compositions prepared in Example 1 and Comparative Examples 1-3.

[0136] The test results are shown in Table 3.

[0137] Table 3 Performance test results of potting glue of Example 1 and Comparative Examples 1-3

[0138]

[0139]

[0140] It can be concluded from Table 3 that the potting compound of the present invention has better thermal conductivity and mechanical properties than those of Comparative Examples 1-3.

[0141] Test Example 2

[0142] The temperature stability test was performed on the organosilicon potting adhesive compositions prepared in Example 1 and Comparative Examples 1-3.

[0143] The test results are shown in Table 4.

[0144] Table 4 Temperature stability test results of potting compound of Example 1 and Comparative Examples 1-3

[0145] performance Example 1 Comparative Example 1 Comparative Example 2 Comparative Example 3 Thermal conductivity retention rate (%) 96 91 87 85

[0146] As can be seen from Table 4, the thermal conductivity retention rate of the system of Example 1 of the present invention is 96%, which is higher than the retention rates of the potting compounds of Comparative Examples 1-3.

[0147] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations that come within the meaning and range of equivalents of the claims be embraced therein.

[0148] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. An addition-type silicone potting compound, characterized in that: The composition includes the following components in parts by weight: Wherein, the modified silicon carbide is the product of the reaction of silicon carbide and KH570, which is obtained by reacting with modified cellulose and vinyl-terminated fluorinated silicone; The modified cellulose is obtained by reacting cellulose with vinyltrimethoxysilane.

2. The addition-type organosilicon potting composition according to claim 1, characterized in that: The viscosity of the vinyl silicone oil is 50-500 mPa·s.

3. The addition-type organosilicon potting composition according to claim 1, characterized in that: The particle size of the spherical alumina is 5-20 μm.

4. The addition-type organosilicon potting composition according to claim 1, characterized in that: The thickness of the boron nitride flakes is 80-120 nm.

5. The addition-type organosilicon potting composition according to claim 1, characterized in that: The catalyst is selected from one or more of a platinum complex, a rhodium complex or a palladium complex.

6. The addition-type organosilicon potting composition according to claim 1, characterized in that: The silane coupling agent is selected from one or more of KH560, KH792, KH570 and titanate coupling agents.

7. The method for preparing the addition-type organosilicon potting composition according to any one of claims 1 to 6, characterized in that: The preparation method of the addition-type organic silicone potting compound comprises the following steps: S1, adding silicon carbide and KH570 into a solvent, mixing, heating and reacting to obtain an intermediate product; S2, mixing cellulose and vinyltrimethoxysilane, heating and reacting to obtain modified cellulose; S3. Under the protection of an inert gas, the intermediate product, modified cellulose, and vinyl-terminated fluorinated silicone are added to a solvent and mixed, and heated to react under the action of an initiator to obtain modified silicon carbide; S4. Evenly mix the modified silicon carbide with other ingredients, and grind them to obtain an addition-type organosilicon potting compound.

8. The method for preparing the addition-type organosilicon potting composition according to claim 7, characterized in that: In step S1, the temperature of the heating reaction is 60-160°C.

9. The method for preparing the addition-type organosilicon potting composition according to claim 7, characterized in that: In step S2, the temperature of the heating reaction is 50-60°C.

10. The method for preparing the addition-type organosilicon potting composition according to claim 7, characterized in that: In step S3, the temperature of the heating reaction is 75-85°C.

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