Crack tip stress intensity factor determination method, device, equipment and medium

Abstract

The invention discloses a crack tip stress intensity factor determination method and device, equipment and a medium, and the method comprises the steps: obtaining a standard test component containing a through crack, and collecting a stress component value and a strain component value of a monitoring point in a preset area around the crack tip in the standard test component; processing the stress component value and the strain component value of the monitoring point by adopting path-independent integration to obtain a target integral value corresponding to the standard test component; and determining a stress intensity factor of the crack tip according to the target integral value and the elastic modulus corresponding to the standard test component. According to the technical scheme provided by the embodiment of the invention, the crack tip stress intensity factor can be simply and quickly determined in the actual engineering component test process, and the operation difficulty is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of fracture mechanics, and in particular to a method, device, equipment and medium for determining a crack tip stress intensity factor. Background Art

[0002] Currently, large engineering structures inevitably develop various microscopic and macroscopic defects during the welding process. Under the action of various alternating loads during operation, defects at the weld toe, where stress concentration is severe, can easily develop into surface cracks with a shape close to a semi-ellipse. Under the action of continuous external loads, surface cracks will continue to expand and penetrate the steel plate to form through-cracks. Due to the large amount of redundancy in engineering structures, the appearance of surface cracks or even through-cracks does not necessarily mean the destruction of the cracked area. When the crack length reaches a certain size, it will cause structural failure. To predict the crack propagation length in a structure, it is necessary to know the crack propagation parameters. The crack propagation parameters of through-cracks are related to the crack tip stress intensity factor and the crack growth rate. The crack tip stress intensity factor is one of the main factors driving fatigue crack growth. The stress intensity factor is a very important mechanical parameter for residual strength safety assessment, life estimation, failure analysis, and fracture toughness measurement of materials.

[0003] With the rapid development of computer technology, the finite element method (FEM) has been widely used in engineering due to its powerful simulation and numerical calculation capabilities. In particular, it can directly use the calculated values ​​of the FEM node force or displacement near the crack tip to infer the stress intensity factor at the crack tip. However, these methods are still in the numerical realm, and it is still difficult to apply them to monitor the stress intensity factor at the crack tip during actual testing. Summary of the Invention

[0004] The present invention provides a method, device, equipment and medium for determining the stress intensity factor at the crack tip, which can simply and quickly determine the stress intensity factor at the crack tip during actual engineering component testing, thereby reducing operational difficulty.

[0005] According to one aspect of the present invention, a method for determining a crack tip stress intensity factor is provided, the method comprising:

[0006] Obtaining a standard test component containing a through-crack, and collecting stress component values ​​and strain component values ​​of monitoring points in a preset area around the crack tip in the standard test component;

[0007] Using path-independent integration, the stress component value and the strain component value of the monitoring point are processed to obtain a target integral value corresponding to the standard test component;

[0008] The stress intensity factor at the crack tip is determined according to the target integral value and elastic modulus corresponding to the standard test component.

[0009] Optionally, before obtaining a standard test component containing a through-crack, the following steps may also be included:

[0010] Obtaining a preset component reference specification; the component reference specification includes structural geometric parameters and material parameters corresponding to the crack tip;

[0011] According to the component reference specifications, standard test components are processed.

[0012] Optionally, processing a standard test component according to the component reference specification includes:

[0013] Designing a compact tensile specimen according to the component reference specification, and determining a loading force based on the size of the compact tensile specimen;

[0014] Processing a standard test component according to the size of the compact tensile test piece;

[0015] The standard test component is loaded according to the loading parameters and the loading force in the component reference specification.

[0016] Optionally, in the standard test component, collecting stress component values ​​and strain component values ​​of monitoring points in a preset area around the crack tip includes:

[0017] In the standard test component, a rectangular area centered at the crack tip is selected as the stress monitoring area;

[0018] The four vertices of the stress monitoring area are used as monitoring points, and the stress component value and the strain component value of each monitoring point are collected.

[0019] Optionally, a triaxial strain gauge is pre-attached to each monitoring point to collect stress component values ​​and strain component values ​​of each monitoring point, including:

[0020] The stress component value and the strain component value of the corresponding monitoring point are collected respectively through each of the three-axis strain gauges.

[0021] Optionally, path-independent integration is used to process the stress component value and the strain component value of the monitoring point to obtain a target integral value corresponding to the standard test component, including:

[0022] determining a plurality of integration paths in the stress monitoring region;

[0023] Determining the integral value corresponding to each integral path according to the stress component value and the strain component value of each monitoring point;

[0024] The integral values ​​corresponding to all integral paths are summed to obtain the target integral value corresponding to the standard test component.

[0025] Optionally, determining a plurality of integral paths in the stress monitoring region includes:

[0026] Each rectangular side in the stress monitoring area is divided into two integral paths; the stress monitoring area corresponds to eight integral paths, and each monitoring point corresponds to two integral paths.

[0027] According to another aspect of the present invention, a device for determining a crack tip stress intensity factor is provided, the device comprising:

[0028] A component acquisition module is used to obtain a standard test component containing a through crack, and collect stress component values ​​and strain component values ​​of monitoring points in a preset area around the crack tip in the standard test component;

[0029] an integration module, configured to process the stress component value and the strain component value of the monitoring point using path-independent integration to obtain a target integral value corresponding to the standard test component;

[0030] The intensity factor determination module is used to determine the stress intensity factor of the crack tip according to the target integral value and elastic modulus corresponding to the standard test component.

[0031] According to another aspect of the present invention, an electronic device is provided, comprising:

[0032] at least one processor; and

[0033] a memory communicatively connected to the at least one processor; wherein,

[0034] The memory stores a computer program executable by the at least one processor. The computer program is executed by the at least one processor to enable the at least one processor to perform the crack tip stress intensity factor determination method according to any embodiment of the present invention.

[0035] According to another aspect of the present invention, a computer-readable storage medium is provided, wherein the computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a processor to implement the method for determining the crack tip stress intensity factor according to any embodiment of the present invention when executed.

[0036] The technical solution provided by the embodiment of the present invention obtains a standard test component containing a through crack, collects the stress component values ​​and strain component values ​​of monitoring points in a preset area around the crack tip in the standard test component, and processes the stress component values ​​and strain component values ​​of the monitoring points using path-independent integration to obtain a target integral value corresponding to the standard test component. According to the target integral value and elastic modulus corresponding to the standard test component, a technical means is used to determine the stress intensity factor of the crack tip. This method provides a method with low operating difficulty and can simply and quickly determine the stress intensity factor of the crack tip, which can be effectively applied in the actual engineering component testing process.

[0037] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present invention, nor is it intended to limit the scope of the present invention. Other features of the present invention will become readily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0039] Figure 1 is a flow chart of a method for determining a crack tip stress intensity factor according to an embodiment of the present invention;

[0040] Figure 2 is a flow chart of another method for determining a crack tip stress intensity factor according to an embodiment of the present invention;

[0041] Figure 3a is a schematic diagram of a compact tensile specimen provided according to an embodiment of the present invention;

[0042] Figure 3b This is a schematic diagram of loading a standard test component provided according to an embodiment of the present invention;

[0043] Figure 3c is a schematic diagram of a stress monitoring area and an integration path provided according to an embodiment of the present invention;

[0044] Figure 3d is a schematic diagram of the arrangement of a strain gauge provided according to an embodiment of the present invention;

[0045] Figure 4 1 is a schematic structural diagram of a device for determining a crack tip stress intensity factor according to an embodiment of the present invention;

[0046] Figure 5It is a structural schematic diagram of an electronic device for implementing the method for determining the crack tip stress intensity factor according to an embodiment of the present invention. DETAILED DESCRIPTION

[0047] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.

[0048] It should be noted that the terms "first", "second", etc. in the description and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0049] Figure 1 This is a flow chart of a method for determining a crack tip stress intensity factor provided by an embodiment of the present invention. This embodiment is applicable to determining the stress intensity factor of a crack tip in an engineering structure. The method can be performed by a crack tip stress intensity factor determination device, which can be implemented in the form of hardware and / or software and can be configured in an electronic device. Figure 1 As shown, the method includes:

[0050] Step 110: Obtain a standard test component containing a through crack, and collect stress component values ​​and strain component values ​​of monitoring points in a preset area around the crack tip in the standard test component.

[0051] In this embodiment, the standard test component can be pre-processed according to the reference specification of the engineering component. The standard test component contains through cracks, such as linear through cracks or branched through cracks, etc. This embodiment does not limit this.

[0052] Specifically, after obtaining the standard test component, the stress component values ​​and strain component values ​​of multiple monitoring points in a preset area around the crack tip can be collected through a preset stress sensor.

[0053] Step 120 : Using path-independent integration, process the stress component value and the strain component value of the monitoring point to obtain a target integral value corresponding to the standard test component.

[0054] In this embodiment, the path-independent integral can be understood as an integral result that depends solely on the starting and ending points, and is independent of the integral path. Specifically, the predetermined region around the crack tip can be divided into multiple integral paths based on the locations of the monitoring points. The stress and strain component values ​​corresponding to each integral path and each monitoring point are then integrated to obtain an integral value corresponding to each integral path. Finally, the integral values ​​corresponding to all integral paths are summed to obtain a target integral value corresponding to the standard test component.

[0055] The advantage of this setting is that the stress singularity problem at the crack tip can be avoided by using path-independent integration to process the stress component values ​​and strain component values ​​of the monitoring point.

[0056] Step 130: Determine the stress intensity factor at the crack tip according to the target integral value and elastic modulus corresponding to the standard test component.

[0057] In this embodiment, the elastic modulus is used to characterize the ability of the standard test component to resist deformation in the elastic deformation stage. Specifically, the elastic modulus E corresponding to the standard test component can be determined according to the ratio of the stress component value to the strain component value within the elastic range at the monitoring point. Finally, the stress intensity factor K at the crack tip is determined according to the following formula: I :

[0058]

[0059] Where I is the target integral value corresponding to the standard test component.

[0060] The technical solution provided by the embodiment of the present invention obtains a standard test component containing a through crack, collects the stress component values ​​and strain component values ​​of monitoring points in a preset area around the crack tip in the standard test component, and processes the stress component values ​​and strain component values ​​of the monitoring points using path-independent integration to obtain a target integral value corresponding to the standard test component. According to the target integral value and elastic modulus corresponding to the standard test component, a technical means is used to determine the stress intensity factor of the crack tip. This method provides a method with low operating difficulty and can simply and quickly determine the stress intensity factor of the crack tip, which can be effectively applied in the actual engineering component testing process.

[0061] Figure 2 A flowchart of another method for determining the crack tip stress intensity factor provided by an embodiment of the present invention is shown in FIG. Figure 2 As shown, the method includes:

[0062] Step 210: Obtain a preset component reference specification; the component reference specification includes structural geometric parameters and material parameters corresponding to the crack tip.

[0063] Step 220: Processing a standard test component according to the component reference specification.

[0064] In one implementation of this embodiment, a standard test component is processed according to the component reference specification, including: designing a compact tensile specimen according to the component reference specification, and determining the loading force according to the size of the compact tensile specimen; processing the standard test component according to the size of the compact tensile specimen; and loading the standard test component according to the loading parameters and the loading force in the component reference specification.

[0065] Step 230: Obtain the standard test component, and select a rectangular area centered at the crack tip in the standard test component as a stress monitoring area.

[0066] In this step, a rectangular area may be set with the crack tip as the center as the stress monitoring area. The center does not specifically refer to the centroid of the rectangular area, as long as the stress monitoring area can include the crack tip.

[0067] Step 240: Use the four vertices of the stress monitoring area as monitoring points, and collect stress component values ​​and strain component values ​​of the corresponding monitoring points through the three-axis strain gauges.

[0068] In this embodiment, the four vertices of the stress monitoring area can be used as monitoring points, and the stress component values ​​and strain component values ​​at each of the monitoring points are collected. To improve the accuracy of the collected results, this embodiment proposes a method of collecting the monitoring point values ​​using triaxial strain gauges, wherein each monitoring point is pre-attached with a triaxial strain gauge.

[0069] In this step, the distance between each monitoring point can be 20mm. The specific value can be adjusted according to the actual situation, and this embodiment does not limit this. The strain gauge on each monitoring point can collect the stress component value or strain component value of the corresponding position, including σ xx (normal stress in the x-direction), σ yy (normal stress in the y direction), τ xy (shear stress acting in the xy plane), ε xx (x-direction normal strain), ε yy (positive strain in the y direction), γ xy (shear strain acting in the xy plane).

[0070] Step 250: Determine multiple integral paths in the stress monitoring area, and determine the integral value corresponding to each integral path according to the stress component value and the strain component value of each monitoring point.

[0071] In one implementation of this embodiment, multiple integral paths are determined in the stress monitoring area, including: dividing each rectangular side in the stress monitoring area into two integral paths; the stress monitoring area corresponds to eight integral paths, and each monitoring point corresponds to two integral paths.

[0072] In a specific embodiment, the integral value corresponding to each integral path can be determined by the following formula:

[0073]

[0074] Where Γ is a curve around the crack tip (i.e., the integral path), T x 、T y is the force component acting on the unit length of the integrating loop, where:

[0075]

[0076] Where m and n are the components of the normal unit vector outside the integration loop; ds is the length of the integration arc; ω = ∫(σ xx dε xx +σ yy dε yy +τ xy dγ xy );u x ,u y is the displacement component.

[0077] The method provided in this embodiment can be applied to plane stress problems. For plane stress problems, the strain energy density can be expressed as:

[0078]

[0079] T x 、T y The form after replacing it with the above component values ​​is:

[0080]

[0081] Step 260: sum the integral values ​​corresponding to all integral paths to obtain a target integral value corresponding to the standard test component.

[0082] Step 270: Determine the stress intensity factor at the crack tip according to the target integral value and elastic modulus corresponding to the standard test component.

[0083] The technical solution provided by the embodiment of the present invention obtains a component reference specification, processes a standard test component according to the component reference specification, selects a rectangular area centered on the crack tip in the standard test component as a stress monitoring area, and uses the four vertices of the stress monitoring area as monitoring points. The stress component values ​​and strain component values ​​of the corresponding monitoring points are respectively collected through each three-dimensional strain gauge, and multiple integral paths are determined in the stress monitoring area. According to the stress component value and strain component value of each monitoring point, the integral value corresponding to each integral path is determined, and the integral values ​​corresponding to all integral paths are summed to obtain a target integral value corresponding to the standard test component. According to the target integral value and elastic modulus corresponding to the standard test component, the stress intensity factor of the crack tip is determined. This technical means can simply and quickly determine the stress intensity factor of the crack tip in the actual engineering component test process, reducing the difficulty of operation.

[0084] Based on the above embodiment, this embodiment further provides a preferred implementation of a method for determining a crack tip stress intensity factor, including:

[0085] Step 1: Determine the size of the standard test component and design the load according to the specifications;

[0086] Figure 3a is a schematic diagram of a compact tensile specimen provided in this embodiment, such as Figure 3a As shown in the figure, a compact tensile specimen with an initial through crack can be designed according to the reference specification. The specimen thickness is 10 mm, W is 80 mm, and the material is common steel with a density of ρ = 7.85 × 10 9 kg / m 3 , elastic modulus E = 2.06 × 10 5 MPa, Poisson's ratio is 0.3. The total loading force designed by the reference specification is 18000N. The loading conditions of the actual test are as follows Figure 3b As shown, the load is evenly applied to the upper half of the loading hole on the component, while the lower half of the loading hole is constrained.

[0087] Step 2: Obtain the stress component and strain component values ​​near the crack tip;

[0088] According to the component size designed in step 1, a standard test component is manufactured and four triaxial strain gauges are glued to the Figure 3c The distance between the four vertices of the stress monitoring area is 20 mm. Figure 3d The three-axis strain gauge is attached to the top position of the stress monitoring area. The three-axis strain gauge is connected to the data acquisition device to collect the stress component value and strain component value during the test. The standard test component is tested by the testing machine according to Figure 3b The stress and strain component values ​​measured by the four triaxial strain gauges around the crack tip are shown in Table 1.

[0089] Table 1

[0090]

[0091] Step 3: Substitute the above component values ​​into the formula to determine the stress intensity factor at the crack tip;

[0092] In this embodiment, if Figure 3c As shown, the integral paths (path 1, path 2, path 3, path 4, path 5, path 6, path 7 and path 8) surround the crack tip counterclockwise. In order to quickly determine the stress intensity factor, this embodiment divides the integral path into 8 parts. The stress component values ​​and strain component values ​​of the integral points on paths 1 and 2 are approximated to the stress component values ​​and strain component values ​​at the position of measuring point 1. Similarly, the stress component values ​​and strain component values ​​of the integral points on the paths in the other three regions are approximated to the stress component values ​​and strain component values ​​at the positions of the other three measuring points. The integral values ​​obtained for each path are added together to finally obtain the target integral value I, and the stress intensity factor K at the crack tip is determined using the target integral value I and the elastic modulus E. I , as shown in Table 2.

[0093] Table 2

[0094]

[0095] K in Table 2 I The method provided in this embodiment is used to determine that K I Determined by existing component reference specifications. The data in Table 2 show that the error between the crack tip stress intensity factor determined in this embodiment and the crack tip stress intensity factor in the specification is within a reasonable range, ensuring accuracy while improving determination efficiency and reducing operational difficulty.

[0096] Figure 4 A schematic diagram of a device for determining a crack tip stress intensity factor according to an embodiment of the present invention is provided. The device is applied to electronic equipment, such as Figure 4 As shown, the apparatus includes: a component acquisition module 410 , an integration module 420 and an intensity factor determination module 430 .

[0097] The component acquisition module 410 is used to obtain a standard test component containing a through crack, and collect stress component values ​​and strain component values ​​of monitoring points in a preset area around the crack tip in the standard test component;

[0098] An integration module 420 is configured to process the stress component value and the strain component value of the monitoring point using path-independent integration to obtain a target integral value corresponding to the standard test component;

[0099] The intensity factor determination module 430 is configured to determine the stress intensity factor at the crack tip according to the target integral value and elastic modulus corresponding to the standard test component.

[0100] The technical solution provided by the embodiment of the present invention obtains a standard test component containing a through crack, collects the stress component values ​​and strain component values ​​of monitoring points in a preset area around the crack tip in the standard test component, and processes the stress component values ​​and strain component values ​​of the monitoring points using path-independent integration to obtain a target integral value corresponding to the standard test component. According to the target integral value and elastic modulus corresponding to the standard test component, a technical means is used to determine the stress intensity factor of the crack tip. This method provides a method with low operating difficulty and can simply and quickly determine the stress intensity factor of the crack tip, which can be effectively applied in the actual engineering component testing process.

[0101] Based on the above embodiment, the device further includes:

[0102] A specification acquisition module is used to obtain a preset component reference specification; the component reference specification includes structural geometric parameters and material parameters corresponding to the crack tip;

[0103] The component processing module is used to process and obtain standard test components according to the component reference specifications.

[0104] The component processing module includes:

[0105] a loading force determination unit, configured to design a compact tensile specimen according to the component reference specification and determine a loading force according to a size of the compact tensile specimen;

[0106] The component loading unit is used to process a standard test component according to the size of the compact tensile specimen, and load the standard test component according to the loading parameters and the loading force in the component reference specification.

[0107] The component acquisition module 410 includes:

[0108] A region selection unit is used to select a rectangular region centered on the crack tip in the standard test component as a stress monitoring region;

[0109] a numerical value acquisition unit, configured to use the four vertices of the stress monitoring area as monitoring points and to acquire the stress component value and the strain component value of each of the monitoring points;

[0110] The strain gauge acquisition unit is used to respectively collect the stress component value and the strain component value of the corresponding monitoring point through each three-dimensional strain gauge; wherein, each monitoring point is pre-attached with a three-dimensional strain gauge.

[0111] The integration module 420 includes:

[0112] an integral path determining unit, configured to determine a plurality of integral paths in the stress monitoring area;

[0113] an integral value determining unit, configured to determine an integral value corresponding to each integral path according to the stress component value and the strain component value of each monitoring point; and summing the integral values ​​corresponding to all integral paths to obtain a target integral value corresponding to the standard test component;

[0114] The path division unit is used to divide each rectangular side in the stress monitoring area into two integral paths; the stress monitoring area corresponds to eight integral paths, and each monitoring point corresponds to two integral paths.

[0115] The above device can execute the methods provided by all the above embodiments of the present invention, and has the corresponding functional modules and beneficial effects of executing the above methods. For technical details not fully described in the embodiments of the present invention, please refer to the methods provided by all the above embodiments of the present invention.

[0116] Figure 5 A schematic diagram of the structure of an electronic device 10 that can be used to implement an embodiment of the present invention is shown. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital processing, cellular phones, smart phones, wearable devices (such as helmets, glasses, watches, etc.) and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the present invention described and / or claimed herein.

[0117] like Figure 5 As shown, the electronic device 10 includes at least one processor 11 and a memory, such as a read-only memory (ROM) 12, a random access memory (RAM) 13, etc., which is communicatively connected to the at least one processor 11. The memory stores a computer program that can be executed by the at least one processor. The processor 11 can perform various appropriate actions and processes according to the computer program stored in the read-only memory (ROM) 12 or the computer program loaded from the storage unit 18 into the random access memory (RAM) 13. Various programs and data required for the operation of the electronic device 10 can also be stored in the RAM 13. The processor 11, ROM 12, and RAM 13 are connected to each other via a bus 14. An input / output (I / O) interface 15 is also connected to the bus 14.

[0118] Multiple components in the electronic device 10 are connected to the I / O interface 15, including an input unit 16, such as a keyboard, a mouse, etc.; an output unit 17, such as various types of displays, speakers, etc.; a storage unit 18, such as a magnetic disk, an optical disk, etc.; and a communication unit 19, such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 19 allows the electronic device 10 to exchange information / data with other devices via a computer network such as the Internet and / or various telecommunication networks.

[0119] The processor 11 can be any general-purpose and / or specialized processing component with processing and computing capabilities. Some examples of the processor 11 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various specialized artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, a digital signal processor (DSP), and any suitable processor, controller, microcontroller, etc. The processor 11 executes the various methods and processes described above, such as the crack tip stress intensity factor determination method.

[0120] In some embodiments, the crack tip stress intensity factor determination method may be implemented as a computer program tangibly embodied in a computer-readable storage medium, such as the storage unit 18. In some embodiments, part or all of the computer program may be loaded and / or installed on the electronic device 10 via the ROM 12 and / or the communication unit 19. When the computer program is loaded into the RAM 13 and executed by the processor 11, one or more steps of the crack tip stress intensity factor determination method described above may be performed. Alternatively, in other embodiments, the processor 11 may be configured to execute the crack tip stress intensity factor determination method in any other appropriate manner (e.g., via firmware).

[0121] Various embodiments of the systems and techniques described herein can be implemented in digital electronic circuit systems, integrated circuit systems, field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), system-on-chip systems (SOCs), programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various embodiments can include being implemented in one or more computer programs that are executable and / or interpreted on a programmable system that includes at least one programmable processor, which can be a special purpose or general purpose programmable processor that can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit data and instructions to the storage system, the at least one input device, and the at least one output device.

[0122] Computer programs for implementing the methods of the present invention may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, such that when the computer program is executed by the processor, the functions / operations specified in the flowcharts and / or block diagrams are implemented. The computer program may be executed entirely on the machine, partially on the machine, as a stand-alone software package, partially on the machine and partially on a remote machine, or entirely on a remote machine or server.

[0123] In the context of the present invention, computer-readable storage media can be tangible media that can contain or store a computer program for use with an instruction execution system, device or equipment or used in combination with an instruction execution system, device or equipment. Computer-readable storage media can include but are not limited to electronic, magnetic, optical, electromagnetic, infrared or semiconductor systems, devices or equipment, or any suitable combination of the foregoing. Alternatively, computer-readable storage media can be machine-readable signal media. More specific examples of machine-readable storage media can include electrical connections based on one or more lines, portable computer disks, hard disks, random access memories (RAM), read-only memories (ROM), erasable programmable read-only memories (EPROM or flash memory), optical fibers, portable compact disk read-only memories (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination of the foregoing.

[0124] To provide interaction with a user, the systems and techniques described herein can be implemented on an electronic device having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and pointing device (e.g., a mouse or trackball) through which the user can provide input to the electronic device. Other types of devices can also be used to provide interaction with the user; for example, the feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including acoustic input, voice input, or tactile input).

[0125] The systems and techniques described herein can be implemented in a computing system that includes back-end components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes front-end components (e.g., a user computer with a graphical user interface or web browser through which a user can interact with implementations of the systems and techniques described herein), or a computing system that includes any combination of such back-end components, middleware components, or front-end components. The components of the system can be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: a local area network (LAN), a wide area network (WAN), a blockchain network, and the Internet.

[0126] A computing system may include clients and servers. The clients and servers are typically remote from each other and typically interact via a communication network. This client-server relationship arises through computer programs running on the respective computers, creating a client-server relationship. The server may be a cloud server, also known as a cloud computing server or cloud host. This server is a hosting product within the cloud computing service ecosystem that addresses the management difficulties and limited scalability of traditional physical hosting and VPS services.

[0127] It should be understood that the various forms of the processes shown above can be used to reorder, add, or delete steps. For example, the steps described in the present invention can be performed in parallel, sequentially, or in a different order, as long as the desired results of the technical solution of the present invention can be achieved. This is not limited herein.

[0128] The above specific embodiments do not limit the scope of protection of the present invention. Those skilled in the art will appreciate that various modifications, combinations, sub-combinations, and substitutions may be made based on design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention are intended to be included within the scope of protection of the present invention.

Claims

1. A method for determining a crack tip stress intensity factor, characterized in that: The method comprises: Obtaining a standard test component containing a through-crack, and collecting stress component values ​​and strain component values ​​of monitoring points in a preset area around the crack tip in the standard test component; Using path-independent integration, the stress component value and the strain component value of the monitoring point are processed to obtain a target integral value corresponding to the standard test component; The stress intensity factor at the crack tip is determined according to the target integral value and elastic modulus corresponding to the standard test component.

2. The method according to claim 1, characterized in that Before obtaining a standard test component with a through-crack, it also includes: Obtaining a preset component reference specification; the component reference specification includes structural geometric parameters and material parameters corresponding to the crack tip; According to the component reference specifications, standard test components are processed.

3. The method according to claim 2, characterized in that According to the component reference specifications, standard test components are processed, including: Designing a compact tensile specimen according to the component reference specification, and determining a loading force based on the size of the compact tensile specimen; Processing a standard test component according to the size of the compact tensile test piece; The standard test component is loaded according to the loading parameters and the loading force in the component reference specification.

4. The method according to claim 1, wherein In the standard test component, the stress component values ​​and strain component values ​​of monitoring points in a preset area around the crack tip are collected, including: In the standard test component, a rectangular area centered at the crack tip is selected as the stress monitoring area; The four vertices of the stress monitoring area are used as monitoring points, and the stress component value and the strain component value of each monitoring point are collected.

5. The method according to claim 4, characterized in that A triaxial strain gauge is pre-attached to each monitoring point to collect the stress component value and strain component value of each monitoring point, including: The stress component value and the strain component value of the corresponding monitoring point are collected respectively through each of the three-axis strain gauges.

6. The method according to claim 4, characterized in that The stress component value and the strain component value of the monitoring point are processed by using path-independent integration to obtain the target integral value corresponding to the standard test component, including: determining a plurality of integration paths in the stress monitoring region; Determining the integral value corresponding to each integral path according to the stress component value and the strain component value of each monitoring point; The integral values ​​corresponding to all integral paths are summed to obtain the target integral value corresponding to the standard test component.

7. The method according to claim 6, characterized in that A plurality of integration paths are determined in the stress monitoring region, including: Each rectangular side in the stress monitoring area is divided into two integral paths; the stress monitoring area corresponds to eight integral paths, and each monitoring point corresponds to two integral paths.

8. A device for determining crack tip stress intensity factor, characterized in that: The device comprises: A component acquisition module is used to obtain a standard test component containing a through crack, and collect stress component values ​​and strain component values ​​of monitoring points in a preset area around the crack tip in the standard test component; an integration module, configured to process the stress component value and the strain component value of the monitoring point using path-independent integration to obtain a target integral value corresponding to the standard test component; The intensity factor determination module is used to determine the stress intensity factor of the crack tip according to the target integral value and elastic modulus corresponding to the standard test component.

9. An electronic device, characterized in that: The electronic device comprises: at least one processor; and a memory communicatively connected to the at least one processor; wherein, The memory stores a computer program executable by the at least one processor. The computer program is executed by the at least one processor to enable the at least one processor to perform the crack tip stress intensity factor determination method according to any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that The computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a processor to implement the crack tip stress intensity factor determination method according to any one of claims 1 to 7 when executed.

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