Adhesive force testing device

Abstract

The invention provides an adhesive force testing device, which is characterized in that the device comprises a rack, and a slide glass mechanism, a scribing feeding mechanism, a rotation input mechanism and a transmission mechanism which are arranged on the rack, the slide glass disc is fixed on a first shaft of the transmission mechanism and is arranged to rotate along with the rotation of the first shaft; the scribing feeding mechanism comprises a scribing needle and a compression shaft, the scribing needle is used for scribing the surface of the object to be measured, the scribing needle is arranged at the first end of the compression shaft, and the scribing needle and the compression shaft are arranged to linearly move along the radial direction of the slide glass disc under the driving of the transmission mechanism; and the transmission mechanism is coupled with the slide tray and the scribing feeding mechanism and is arranged to transmit the rotary motion input from the rotary input mechanism to the slide tray and the scribing feeding mechanism.

Description

Technical Field

[0001] The present disclosure relates to the technical field of integrated circuit manufacturing, and more particularly, to an adhesion testing device. Background Art

[0002] In the surface acoustic wave filter manufacturing process and vacuum thin film deposition process, the adhesion test of the coating layer on the wafer surface is usually involved. There are currently two main methods in the industry for testing the adhesion of the coating layer on the wafer surface. The first method is the scratch method, which uses a customized scratching needle to scratch the surface of the coated wafer until the coating layer peels off, and indirectly estimates the adhesion of the coating layer by the scratching force when the coating layer peels off. The second method is the sticking method, which tests the adhesion between the coating layer and the wafer substrate by manually tearing off the film with tapes of different viscosities. However, regardless of which method is used, the current adhesion test methods are mostly manual operations, and each link requires manual measurement, which introduces a large amount of manual errors and affects the measurement accuracy. In addition, the current adhesion test device also has shortcomings such as complex structure and difficult operation. Therefore, there is a need for an adhesion test device and related methods with a simple structure, easy and efficient operation, and high measurement accuracy. Summary of the Invention

[0003] An embodiment of the present disclosure provides an adhesion testing device, characterized in that the device includes: a frame and a carrier mechanism, a scribing and feeding mechanism, a rotating input mechanism and a transmission mechanism installed on the frame, wherein the carrier mechanism includes a carrier plate for placing the object to be tested, the carrier plate is fixed on the first axis of the transmission mechanism and is configured to rotate with the rotation of the first axis; the scribing and feeding mechanism includes a marking needle and a compression shaft, the marking needle is used to mark the surface of the object to be tested, the marking needle is arranged at the first end of the compression shaft, the marking needle and the compression shaft are configured to perform linear motion along the radial direction of the carrier plate under the drive of the transmission mechanism; the transmission mechanism is coupled to the carrier plate and the scribing and feeding mechanism, and is configured to transmit the rotational motion input from the rotating input mechanism to the carrier plate and the scribing and feeding mechanism.

[0004] According to an embodiment of the present disclosure, one or more limiters are provided on the upper surface of the wafer carrier, and the one or more limiters respectively correspond to the sizes of one or more objects to be measured.

[0005] According to an embodiment of the present disclosure, the carrier mechanism also includes a first pressure device and a pressure plate, wherein the first pressure device is coupled to the upper surface of the pressure plate; the pressure plate is arranged directly above the carrier disc, and is configured to be separated from the upper surface of the carrier disc in a raised state and to press the object to be measured against the upper surface of the carrier disc with a first pressure in a pressed state and to rotate with the rotation of the carrier disc, wherein the first pressure is provided by adjusting the first pressure device.

[0006] According to an embodiment of the present disclosure, the film carrier mechanism also includes a handle and a pressure plate shaft, the handle is coupled to the first end of the pressure plate shaft through a rolling bearing, so that the handle and the pressure plate shaft can rotate independently of each other; the second end of the pressure plate shaft is coupled to the first pressure device; and the film carrier mechanism also includes a lifting and pressing limit structure, the lifting and pressing limit structure is fixed on the frame and is provided with a lifting position groove and a pressing position groove, wherein, when the handle is placed in the lifting position groove, the pressure plate is in the lifting state; and when the handle is placed in the pressing position groove, the pressure plate is in the pressing state.

[0007] According to an embodiment of the present disclosure, a compression adjustment ring is further provided at the connection between the pressure plate shaft and the first pressure device, so as to adjust the compression of the first pressure device.

[0008] According to an embodiment of the present disclosure, the scribing feed mechanism also includes a compression track, the upper surface of which is fixed on the frame, and the lower surface of which is set as an inclined surface relative to the plane where the pressure plate is located, and contacts the second end of the compression shaft; and a second pressure device is also provided in the compression shaft, and the second pressure device is configured to perform axial compression along the compression shaft and provide a linearly increasing scribing force to the scribing needle when the compression shaft moves linearly along the radial direction of the carrier disc toward the center of the carrier disc.

[0009] According to an embodiment of the present disclosure, the transmission mechanism includes a first transmission device and a second transmission device, wherein the first transmission device is coupled to the carrier disc through the first shaft, and is configured to transmit the rotational motion input from the rotation input mechanism to the carrier disc so that the carrier disc rotates; and the second transmission device is coupled to the scoring feed mechanism, and is configured to transmit the rotational motion input from the rotation input mechanism to the scoring feed mechanism so that the scoring needle and the compression shaft perform the linear motion.

[0010] According to an embodiment of the present disclosure, the scoring feed mechanism also includes a ball screw and a sliding mechanism, wherein the compression shaft is arranged on the sliding mechanism, and the sliding mechanism is sleeved on the ball screw; the ball screw is horizontally arranged and coupled to the second transmission device, and the ball screw is configured to convert the rotational motion transmitted from the second transmission device into linear motion of the sliding mechanism in the horizontal direction.

[0011] According to an embodiment of the present disclosure, the second transmission device includes a first transmission wheel, a first transmission belt and a second transmission wheel, wherein the first transmission wheel is fixed on the central axis of the rotation input mechanism and is configured to rotate with the rotation of the central axis, the second transmission wheel is fixed at one end of the ball screw, and the first transmission wheel and the second transmission wheel are coupled by the first transmission belt.

[0012] According to an embodiment of the present disclosure, a rotational speed ratio between the first transmission wheel and the second transmission wheel is set to 1:1.

[0013] According to an embodiment of the present disclosure, the first transmission device includes a first bevel gear, a second bevel gear, a third transmission wheel, a second transmission belt and a fourth transmission wheel, wherein the first bevel gear is fixed on the central axis of the rotation input mechanism and is configured to rotate with the rotation of the central axis; the second bevel gear is vertically engaged with the first bevel gear; the third transmission wheel is coupled to the second bevel gear through a second shaft, and is configured to rotate with the rotation of the second bevel gear; the fourth transmission wheel is coupled to the carrier disc through the first shaft; and the third transmission wheel and the fourth transmission wheel are coupled through the second transmission belt.

[0014] According to an embodiment of the present disclosure, the rotation input mechanism includes a handwheel and a central shaft, wherein the handwheel is fixed on the central shaft, and when the handwheel is rotated, the central shaft is driven to rotate.

[0015] According to an embodiment of the present disclosure, the object to be tested is a wafer.

[0016] According to an embodiment of the present disclosure, the first pressure device is a spring.

[0017] According to an embodiment of the present disclosure, the second pressure device is a spring.

[0018] An embodiment of the present disclosure provides an adhesion testing method, comprising: placing an object to be tested on a wafer carrier so that the object to be tested can rotate synchronously with the rotation of the wafer carrier; scratching the surface of the object to be tested with a first scratching force using a scratching needle, wherein the scratching needle moves linearly from the edge of the object to be tested along the radial direction of the wafer carrier toward the center of the wafer carrier while the wafer carrier rotates until the coating layer on the surface of the object to be tested begins to separate from the object to be tested, wherein the first scratching force increases linearly with the linear motion; measuring the length of the scratch generated by the scratching on the surface of the object to be tested; and determining the adhesion of the coating layer on the surface of the object to be tested based on the scratch length.

[0019] The embodiments of the present disclosure provide an adhesion testing device and related methods with a simple structure, easy and efficient operation, and high measurement accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The above and other aspects, features and advantages of certain embodiments of the present disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings, in which:

[0021] Figure 1 1 shows a schematic structural diagram of an adhesion testing device 100 according to an embodiment of the present disclosure;

[0022] Figure 2a and Figure 2b 1 shows a schematic structural diagram of a film carrier mechanism 102 of an adhesion testing device 100 according to an embodiment of the present disclosure;

[0023] Figure 3 1 shows a schematic structural diagram of the scribing and feeding mechanism 103 of the adhesion testing device 100 according to an embodiment of the present disclosure;

[0024] Figure 4 shows a schematic structural diagram of the transmission mechanism 104 and the rotation input mechanism 105 of the adhesion testing device 100 according to an embodiment of the present disclosure; and

[0025] Figure 5 A schematic diagram of an adhesion testing method 500 according to an embodiment of the present disclosure is shown. DETAILED DESCRIPTION

[0026] Before proceeding with the detailed description below, it may be helpful to set forth the definitions of certain words and phrases used throughout this patent document. The terms "couple," "connect," and their derivatives refer to any direct or indirect communication or connection between two or more elements, regardless of whether those elements are in physical contact with each other. The terms "transmit," "receive," and "communicate," and their derivatives, encompass both direct and indirect communication. The terms "include," "comprise," and their derivatives, mean including, but not limited to. The term "or" is inclusive, meaning and / or. The phrases "associated with," "corresponding to," and their derivatives, mean including, included within, interconnected, containing, contained within, connected or connected with, coupled or coupled with, communicate with, cooperate with, intertwine, juxtapose, approach, bind or bind with, have, have an attribute of, have a relationship with, or have a relationship with, etc. The term "controller" refers to any device, system, or portion thereof that controls at least one operation. Such a controller may be implemented using hardware, or a combination of hardware and software and / or firmware. The functionality associated with any particular controller may be centralized or distributed, whether local or remote. The phrase "at least one of," when used with a list of items, means that different combinations of one or more of the listed items may be used, and only one of the items in the list may be needed. For example, "at least one of A, B, and C" includes any of the following combinations: A, B, C, A and B, A and C, B and C, and A, B, and C.

[0027] The term "fixed" and its derivatives refer to any direct or indirect fixation between two or more elements, regardless of whether those elements are in physical contact with each other. For example, "element A is fixed to element B" may mean that element A is directly fixed to element B and is in contact with element B. It may also mean that element A is indirectly fixed to element B through any other intermediate members or structures, in which case element A may not be in direct contact with element B.

[0028] Definitions for other specific words and phrases are provided throughout this patent document. Those of ordinary skill in the art should understand that in many, if not most instances, such definitions apply to prior and future uses of such defined words and phrases.

[0029] In this patent document, the application combination of modules and the division level of submodules are only for illustration. Without departing from the scope of the present disclosure, the application combination of modules and the division level of submodules can have different ways. The embodiments of the present disclosure can be implemented in different forms and should not be interpreted as being limited to the embodiments set forth herein. On the contrary, these embodiments are provided to make this disclosure thorough and complete and to fully convey exemplary implementation methods to those skilled in the art. The embodiments of the present disclosure can be combined to form additional embodiments.

[0030] The present disclosure will be described in detail below with reference to exemplary embodiments of the present disclosure. However, the present disclosure is not limited to the embodiments described herein and may be implemented in many different forms. The described embodiments are intended only to make the present disclosure thorough and complete and to fully convey the concepts of the present disclosure to those skilled in the art. The features of the various described embodiments may be combined or replaced with each other unless expressly excluded or should be excluded based on the context.

[0031] In this disclosure, the singular form of an element may refer to its plural form, and the plural form of an element may also refer to its singular form. For example, "element" or "an element" may refer to "at least one element", "one or more elements" or "a plurality of elements".

[0032] Figure 1 FIG. 1 shows a structural schematic diagram of an adhesion testing device 100 according to an embodiment of the present disclosure.

[0033] like Figure 1 As shown, the adhesion testing device 100 according to an embodiment of the present disclosure may include a frame 101 and a film carrier mechanism 102 , a scribing and feeding mechanism 103 , a rotation input mechanism 105 and a transmission mechanism 104 installed on the frame 101 .

[0034] The frame 101 can be used to support and / or fix the components of the testing device 100. The carrier mechanism 102 can be used to carry the object to be tested. The scoring and feeding mechanism 103 can include a scoring needle and can be used to score the surface of the object to be tested. The rotation input mechanism 105 can be used to input the driving force required for the test process into the adhesion testing device 100, for example, by inputting it in the form of a rotational motion. The transmission mechanism 104 can be used to transmit the driving force input from the rotation input mechanism 105 to the carrier mechanism 102 and the scoring and feeding mechanism 103, etc., respectively, so as to perform the test operation. The various components of the adhesion testing device 100 will be further described in detail below in conjunction with the accompanying drawings.

[0035] Figure 2a and Figure 2b FIG. 1 is a schematic structural diagram of a film carrier mechanism 102 of an adhesion testing device 100 according to an embodiment of the present disclosure.

[0036] like Figure 2a As shown, the slide mechanism 102 may include a slide tray 201 for placing the object to be measured. In some embodiments, the slide tray 201 may be fixed to the first shaft 210 of the transmission mechanism 104 and may be configured to rotate along with the rotation of the first shaft 210.

[0037] In some embodiments, as Figure 2bAs shown, the upper surface of the wafer carrier 201 may be provided with a limiter 211. The limiter 211 may be an annular groove or a snap ring structure provided on the upper surface of the wafer carrier 201, which may correspond to a specific size of the object to be tested, so that the object to be tested with the specific size can be firmly supported by the wafer carrier 201 without relative sliding during the test. Figure 2b Only one limiter 211 is shown in the figure. It should be understood that according to the embodiment of the present disclosure, one or more limiters corresponding to one or more specific sizes can also be set on the carrier plate 201, and this is not limited herein.

[0038] In some embodiments, the slide carrier mechanism 102 may further include a first pressure device 203 and a pressure plate 202. Figure 2a As shown, the first pressure device 203 can be coupled to the upper surface of the pressure plate 202. The pressure plate 202 can be arranged directly above the wafer carrier 201 and can be configured to be separated from the upper surface of the wafer carrier 201 in a raised state and to press the object to be measured against the upper surface of the wafer carrier 201 with a first pressure in a pressed state and to rotate with the rotation of the wafer carrier 201.

[0039] For example, in some embodiments, the pressure plate 202 can be placed in a raised state to place the object to be measured on the slide plate 201. Then, the pressure plate 202 can be placed in a pressed state to press the object to be measured against the upper surface of the slide plate 201. In this case, when the slide plate 201 rotates, the pressure plate 202 and the object to be measured can rotate along with the rotation of the slide plate 201. Here, the first pressure can be provided by the first pressure device 203, and the magnitude of the first pressure can be adjusted by adjusting the first pressure device 203, thereby ensuring that the object to be measured is fixed relative to the slide plate 201 without being crushed or damaged by compression.

[0040] In some embodiments, the first pressure device 203 can be a spring whose rebound force is (linearly) proportional to the compression amount. In other embodiments, the first pressure device 203 can also be a hydraulic press, an air compressor, or any other device made of any other elastic material whose rebound force is proportional to the compression amount.

[0041] In some embodiments, the slide mechanism 102 may further include a handle 208 and a platen shaft 205. The handle 208 may be coupled to a first end (e.g., the upper end) of the platen shaft 205 via a rolling bearing 209, thereby enabling the handle 208 and the platen shaft 205 to rotate independently of each other. A second end (e.g., the lower end) of the platen shaft 205 may be coupled to the first pressure device 203.

[0042] In some embodiments, the slide carrier mechanism 102 may further include a lifting and pressing limit structure 207. The lifting and pressing limit structure 207 may be fixed to the frame 101 and may be provided with a lifting position groove and a pressing position groove. When the handle 208 is placed in the lifting position groove, the pressure plate 202 may be in the lifting position as described above. When the handle 208 is placed in the pressing position groove, the pressure plate 202 may be in the pressing position as described above.

[0043] In some embodiments, a compression adjustment ring 204 may be provided at the connection between the pressure plate shaft 205 and the first pressure device 203 to adjust the initial compression of the first pressure device 203. For example, the compression adjustment ring 204 may be configured to be sleeved on the pressure plate shaft 205 and to move axially along the pressure plate shaft 205 when rotated, thereby compressing the first pressure device 203 to varying degrees, so that the first pressure device 203 can have correspondingly different initial compressions.

[0044] like Figure 2a As shown, the frame 101 may be provided with an opening, and the opening may be provided with a sliding bearing 206. The platen shaft 205 of the slide carrier mechanism 102 may pass through the opening and be coupled to the frame 101 via the sliding bearing 206, so that the platen shaft 205 can be supported by the frame 101 and can rotate flexibly.

[0045] Figure 3 FIG. 1 is a structural schematic diagram of the scribing and feeding mechanism 103 of the adhesion testing device 100 according to an embodiment of the present disclosure.

[0046] like Figure 3 As shown, the scribing feed mechanism 103 may include a scribing needle 301 and a compression shaft 302. The scribing needle 301 can be used to scribble the surface of the object to be measured, thereby generating scratches on the surface of the object to be measured and implementing an adhesion test of the coating layer on the surface of the object to be measured. The scribing needle 301 can be arranged at a first end (e.g., toward the lower end) of the compression shaft 302. The scribing needle 301 can be customized by a special material. The scribing needle 301 and the compression shaft 302 are configured to perform linear motion along the radial direction of the carrier disc 201 under the drive of the transmission mechanism 104.

[0047] In some embodiments, the scribing feed mechanism 103 may further include a compression track 303. The upper surface of the compression track 303 may be fixed to the frame 101, and the lower surface of the compression track 303 may be fixed to the frame 101. Figure 3 The inclined surface shown is provided relative to the plane of the pressure plate 202 and / or the carrier plate 201 and can contact the second end (e.g., the upward end) of the compression shaft 302. In some embodiments, the contact can be achieved by a sliding bearing.

[0048] In some embodiments, the compression shaft 302 may further be provided with a second pressure device 304. The second pressure device 304 may be configured to be constrained (or squeezed) by the linear increase of the compression track 303 when the compression shaft 302 moves (horizontally) linearly toward the center of the wafer carrier 201 along the radial direction of the wafer carrier 201, thereby performing axial compression along the compression shaft 302 and providing a linearly increasing scribing force to the stylus 301.

[0049] The inclination angle of the lower surface of the compression track 303 can be flexibly set depending on the desired linear rate of change of the scoring force.

[0050] In some embodiments, the second pressure device 304 can be a spring configured such that the rebound force is linearly proportional to the compression amount. In other embodiments, the second pressure device 304 can also be a hydraulic device, an air compressor, or any other device made of any other elastic material such that the rebound force is linearly proportional to the compression amount.

[0051] Figure 4 FIG. 1 is a schematic structural diagram of a transmission mechanism 104 and a rotation input mechanism 105 of an adhesion testing device 100 according to an embodiment of the present disclosure.

[0052] like Figure 4 As shown, the transmission mechanism 104 can be coupled to the carrier plate 201 and the scribing feed mechanism 103, and can be configured to transmit the rotational motion input from the rotation input mechanism 105 to the carrier plate 201 and the scribing feed mechanism 103.

[0053] In some embodiments, the transmission mechanism 104 may include a first transmission device 401 and a second transmission device 402 .

[0054] The first transmission device 401 can be coupled to the carrier disc 201 through the first shaft 210, and can be configured to transmit the rotational motion input from the rotation input mechanism 105 to the carrier disc 201 to rotate the carrier disc 201.

[0055] The second transmission device 402 can be coupled to the scoring feed mechanism 103, and can be configured to transmit the rotational motion input from the rotation input mechanism 105 to the scoring feed mechanism 103, so that the scoring needle 301 and the compression shaft 302 can perform linear motion along the radial direction of the carrier disk 201.

[0056] In some embodiments, as Figure 3 As shown, the scribing feed mechanism 103 may further include a ball screw 305 and a sliding mechanism 306. The compression shaft 302 may be disposed on the sliding mechanism 306 and may perform linear motion along with the sliding mechanism 306. The sliding mechanism 306 may be sleeved on the ball screw 305 and may slide or perform linear motion along the ball screw 305.

[0057] like Figure 3 or Figure 4 As shown, the ball screw 305 can be arranged horizontally (e.g., its axial direction can be in a horizontal plane) or its axial direction can be in the same plane as the carrier plate 201. The ball screw 305 can be coupled to the second transmission device 402. The ball screw 305 can be configured to convert the rotational motion input from the second transmission device 402 into a linear motion of the sliding mechanism 306 in a horizontal direction.

[0058] In some embodiments, as Figure 4 As shown, the second transmission device 402 may include a first transmission wheel 411 , a first transmission belt 412 , and a second transmission wheel 413 .

[0059] The first transmission wheel 411 can be fixed to the central shaft 420 of the rotation input mechanism 105 and can be configured to rotate with the rotation of the central shaft 420. The second transmission wheel 413 can be fixed (e.g., directly or through a corresponding intermediate member) to one end of the ball screw 305. The first transmission wheel 411 and the second transmission wheel 413 can be coupled via a first transmission belt 412, so that the rotation of the first transmission wheel 411 can be transmitted to the second transmission wheel 413 via the first transmission belt 412. Thus, the rotational motion input from the rotation input mechanism 105 can be transmitted to the ball screw 305 via the first transmission wheel 411, the first transmission belt 412, and the second transmission wheel 413, and converted into sliding or linear motion of the sliding mechanism 306 in the axial direction of the ball screw 305, thereby allowing the stylus 301 and the compression shaft 302 to perform linear motion along the radial direction of the carrier plate 201 as the sliding mechanism 306 moves.

[0060] In some embodiments, the speed ratio of the first transmission wheel 411 to the second transmission wheel 413 can be set to 1:1. In other embodiments, depending on the desired configuration, the speed ratio of the first transmission wheel 411 to the second transmission wheel 413 can also be set to any other ratio, for example, 1:2, 2:1, etc.

[0061] In some embodiments, as Figure 4 As shown, the first transmission device 401 may include a first bevel gear 417 , a second bevel gear 418 , a third transmission wheel 414 , a second transmission belt 415 and a fourth transmission wheel 416 .

[0062] The first bevel gear 417 can be fixed to the central shaft 420 of the rotation input mechanism 105 and can be configured to rotate with the rotation of the central shaft 420. The second bevel gear 418 can mesh with the first bevel gear 417 perpendicularly (e.g., at a 90-degree angle to each other) to change the direction of the rotational motion. The third transmission wheel 414 can be coupled to the second bevel gear 418 via a second shaft 421 and can be configured to rotate with the rotation of the second bevel gear 418.

[0063] The fourth transmission wheel 416 can be coupled to the wafer carrier 201 via the first shaft 210. The third transmission wheel 414 and the fourth transmission wheel 416 can be coupled via the second transmission belt 415. Thus, the rotational motion input from the rotation input mechanism 105 can be transmitted to the second bevel gear 418 via the first bevel gear 417, and then transmitted to the wafer carrier 201 via the second shaft 421, the third transmission wheel 414, the second transmission belt 415, the fourth transmission wheel 416, and the first shaft 210, so that the wafer carrier 201 can rotate in response to the rotational motion input from the central shaft 420 of the rotation input mechanism 105.

[0064] Similarly, the speed ratio of the third transmission wheel 414 and the fourth transmission wheel 416 can also be set to 1:1. In other embodiments, depending on the desired configuration, the speed ratio of the third transmission wheel 414 and the fourth transmission wheel 416 can also be set to any other ratio (e.g., 1:2, 2:1, etc.), and the speed ratio of the first bevel gear 417 and the second bevel gear 418 can also be set to any other ratio (e.g., 1:1, 1:2, 2:1, etc.), which is not limited herein.

[0065] In some embodiments, as Figure 4 As shown, the rotation input mechanism 105 may include a handwheel 431 and a central shaft 420. The handwheel 431 may be fixed to the central shaft 420, and when the handwheel 431 is rotated, the central shaft 420 may be driven to rotate. In some embodiments, the rotation input mechanism 105 may also provide rotational input electrically. In this case, the rotational input may be provided directly, for example, by a motor, without manually rotating the handwheel 431. It should be understood that the handwheel 431 can provide rotational motion in both clockwise and counterclockwise directions, thereby causing the carrier plate 201 to rotate clockwise or counterclockwise, and / or causing the stylus 301 to move toward or away from the center of the carrier plate 201. With this arrangement, when the rotation input mechanism 105 provides rotational input, the stylus 301 and the carrier plate 201 can move in conjunction according to a predetermined configuration, thereby providing simpler and more efficient operation and more accurate measurement.

[0066] In some embodiments, the object to be tested described herein may be a wafer or chip. In other embodiments, the object to be tested described herein may also be any other device to be tested that requires measuring the adhesion of a surface coating.

[0067] As described above, the embodiments of the present disclosure provide a novel adhesion testing device 100 for testing adhesion using a scratch method. Taking the adhesion test of the coating layer on the surface of a wafer as an example, using the adhesion testing device 100, the stylus can make a circular scratching motion on the wafer to create scratches (due to the rotation of the carrier plate and the radial linear motion of the stylus along the carrier plate, the trajectory of the stylus is essentially spiral). During this process, the pressure of the stylus increases linearly until the coating layer peels off or begins to separate from the wafer, and the adhesion of the coating is determined or estimated by the length of the scratch. The peeling of the coating layer or the beginning of its separation from the wafer can be detected by manual observation or by providing an electronic detection device in the stylus (for example, a friction detection device that can detect sudden changes in friction).

[0068] In some embodiments, the stylus pressure of the adhesion testing apparatus 100 can be designed to have a linear relationship with the circular motion displacement of the stylus 301 on the wafer, thereby providing a more accurate estimation of adhesion. For example, by adjusting one or more of the second pressure device 304, the inclination angle of the inclined surface of the compression track 303, the speed ratio of the first transmission wheel 411 to the second transmission wheel 413, the speed ratio of the third transmission wheel 414 to the fourth transmission wheel 416, and the speed ratio of the first bevel gear 417 to the second bevel gear 418, the stylus pressure of the stylus 301 can be linearly increased by ΔF each time the stylus 301 moves 1 mm along the radial direction of the wafer carrier 201 toward the center of the wafer carrier 201, and the wafer carrier 201 rotates exactly one revolution (360 degrees) during this process. In this example, assuming that the initial pressure when the stylus is at the edge of the wafer is F0, if peeling of the coating layer is observed and the scratch on the wafer is exactly 2 circles (spiral), it can be known that the stylus pressure at this time is F0+2*ΔF, and the adhesion can be estimated or determined based on the stylus pressure at this time.

[0069] The following further describes exemplary operating steps for performing an adhesion test on a wafer coating layer using the adhesion testing apparatus 100 according to an embodiment of the present disclosure.

[0070] Step 1: Load the wafer: Rotate the handwheel to move the stylus outside the wafer carrier. Lift the platen handle and place the wafer into the wafer slot on the carrier. Press the handle down and rotate it until it engages the groove in the retaining structure.

[0071] Step 2: Move the needle to the initial position: lift the needle and rotate the handwheel to move the needle to the edge of the wafer, and then lower the needle.

[0072] Step 3: Scribe: Turn the handwheel. The wafer rotates with the carrier plate, and the stylus moves from the edge of the wafer toward the center, leaving a spiral scratch on the wafer. Stop when the scratch begins to peel.

[0073] Step 4: Evaluate adhesion: Measure the number of scratch circles, i.e., the scratch length, to evaluate the relative size of the adhesion.

[0074] Next, Figure 5 A schematic diagram of an adhesion testing method 500 according to an embodiment of the present disclosure is shown.

[0075] like Figure 5 As shown, the adhesion testing method 500 according to the embodiment of the present disclosure may include: in step S501, placing the object to be tested on a wafer carrier so that the object to be tested can rotate synchronously with the rotation of the wafer carrier; in step S502, scratching the surface of the object to be tested with a first scratching force using a stylus. The stylus may move linearly from the edge of the object to be tested along the radial direction of the wafer carrier toward the center of the wafer carrier while the wafer carrier rotates, until the coating layer on the surface of the object to be tested begins to separate from the object to be tested. The first scratching force may increase linearly with the linear motion; in step S503, measuring the length of the scratch generated by the scratching on the surface of the object to be tested; and in step S504, determining the adhesion of the coating layer on the surface of the object to be tested based on the scratch length.

[0076] It should be understood that the adhesion testing method 500 according to the embodiment of the present disclosure may also include any other operating steps or methods of the adhesion testing device 100, which are not limited herein.

[0077] The block diagrams of circuits, devices, apparatuses, equipment, and systems described in this disclosure are intended only as illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As will be appreciated by those skilled in the art, these circuits, devices, apparatuses, equipment, and systems may be connected, arranged, or configured in any manner as long as the desired purpose is achieved.

[0078] Although the present disclosure has been described with exemplary embodiments, various changes and modifications may be suggested to one skilled in the art. It is intended that the present disclosure encompass such changes and modifications as fall within the scope of the appended claims.

[0079] Nothing in this disclosure should be construed as implying that any particular element, step, or function is an essential element that must be included in the claims scope. The scope of the patented subject matter is defined solely by the claims.

[0080] Exemplary embodiments of the present disclosure have been disclosed herein, and although specific terms are employed, they are used and interpreted in a general and descriptive sense only and not for purposes of limitation. In some cases, features, characteristics, and / or elements described in conjunction with a particular embodiment may be used alone or in combination with features, characteristics, and / or elements described in conjunction with other embodiments, unless otherwise indicated. Therefore, it will be understood by those skilled in the art that various changes in form and detail may be made to the present disclosure without departing from the spirit and scope of the claims.

Claims

1. An adhesion testing device, characterized in that: The device comprises: A frame and a film loading mechanism, a scribing feeding mechanism, a rotating input mechanism and a transmission mechanism installed on the frame, wherein: The slide mechanism includes a slide tray for placing the object to be measured, wherein the slide tray is fixed to the first shaft of the transmission mechanism and is configured to rotate with the rotation of the first shaft; The scribing feeding mechanism includes a scribing needle and a compression shaft, the scribing needle is used to scribble the surface of the object to be measured, the scribing needle is arranged at a first end of the compression shaft, and the scribing needle and the compression shaft are configured to move linearly along the radial direction of the carrier disc under the drive of the transmission mechanism; The transmission mechanism is coupled to the carrier plate and the scribing and feeding mechanism, and is configured to transmit the rotational motion input from the rotation input mechanism to the carrier plate and the scribing and feeding mechanism.

2. The device according to claim 1, characterized in that One or more stoppers are provided on the upper surface of the wafer carrier, and the one or more stoppers respectively correspond to the sizes of one or more objects to be measured.

3. The device according to claim 1, characterized in that The slide carrier mechanism further comprises a first pressure device and a pressure plate, wherein: The first pressure device is coupled to the upper surface of the pressure plate; The pressure plate is arranged directly above the carrier plate, and is configured to be separated from the upper surface of the carrier plate in a raised state and to press the object to be measured against the upper surface of the carrier plate with a first pressure in a pressed state and to rotate with the rotation of the carrier plate, wherein the first pressure is provided by adjusting the first pressure device.

4. The device according to claim 3, characterized in that The slide carrier mechanism further includes a handle and a pressure plate shaft, wherein the handle is coupled to the first end of the pressure plate shaft via a rolling bearing, so that the handle and the pressure plate shaft can rotate independently of each other; The second end of the pressure plate shaft is coupled to the first pressure device; and The slide carrier mechanism also includes a lifting and pressing limit structure, which is fixed on the frame and is provided with a lifting position groove and a pressing position groove, wherein when the handle is placed in the lifting position groove, the pressure plate is in the lifting state; and when the handle is placed in the pressing position groove, the pressure plate is in the pressing state.

5. The device according to claim 4, characterized in that A compression adjustment ring is further provided at the connection between the pressure plate shaft and the first pressure device for adjusting the compression of the first pressure device.

6. The device according to claim 1, characterized in that The scoring feed mechanism further includes a compression track, the upper surface of which is fixed to the frame, and the lower surface of which is arranged as an inclined surface relative to the plane where the pressure plate is located and contacts the second end of the compression shaft; and A second pressure device is also provided in the compression shaft, and the second pressure device is configured to perform axial compression along the compression shaft and provide a linearly increasing scratching force to the scratching needle when the compression shaft moves linearly along the radial direction of the wafer carrier disc toward the center of the wafer carrier disc.

7. The device according to claim 1, characterized in that The transmission mechanism includes a first transmission device and a second transmission device, wherein: The first transmission device is coupled to the carrier plate through the first shaft and is configured to transmit the rotational motion input from the rotation input mechanism to the carrier plate to rotate the carrier plate; and The second transmission device is coupled to the scribing feed mechanism and is configured to transmit the rotational motion input from the rotation input mechanism to the scribing feed mechanism so as to cause the scribing needle and the compression shaft to perform the linear motion.

8. The device according to claim 7, characterized in that The scribing feeding mechanism also includes a ball screw and a sliding mechanism, wherein: The compression shaft is arranged on the sliding mechanism, and the sliding mechanism is sleeved on the ball screw; The ball screw is horizontally arranged and coupled to the second transmission device, and the ball screw is configured to convert the rotational motion input from the second transmission device into the linear motion of the sliding mechanism in the horizontal direction.

9. The device according to claim 8, characterized in that The second transmission device includes a first transmission wheel, a first transmission belt and a second transmission wheel, wherein: The first transmission wheel is fixed on the central axis of the rotation input mechanism and is configured to rotate with the rotation of the central axis. The second transmission wheel is fixed to one end of the ball screw, and the first transmission wheel and the second transmission wheel are coupled by the first transmission belt.

10. The device according to claim 9, characterized in that The speed ratio of the first transmission wheel and the second transmission wheel is set to 1:

1.

11. The device according to claim 7, characterized in that The first transmission device includes a first bevel gear, a second bevel gear, a third transmission wheel, a second transmission belt and a fourth transmission wheel, wherein: The first bevel gear is fixed to the central shaft of the rotation input mechanism and is configured to rotate with the rotation of the central shaft; The second bevel gear is vertically engaged with the first bevel gear; The third transmission wheel is coupled to the second bevel gear via a second shaft and is configured to rotate along with the rotation of the second bevel gear; The fourth transmission wheel is coupled to the carrier plate through the first shaft; and The third transmission wheel and the fourth transmission wheel are coupled via the second transmission belt.

12. The device according to claim 1, characterized in that The rotation input mechanism includes a hand wheel and a central shaft, wherein the hand wheel is fixed on the central shaft, and when the hand wheel is rotated, the central shaft is driven to rotate.

13. The device according to claim 1, characterized in that The object to be tested is a wafer.

14. The device according to claim 3, characterized in that The first pressure device is a spring.

15. The device according to claim 6, characterized in that The second pressure device is a spring.

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