Discrete device aging real-time monitoring system, storage medium and computer equipment
By adding monitoring points and communication interfaces to the aging board, combined with the STM32F103 microcontroller and OLED display, real-time monitoring of component status and failure warning during high-temperature aging are achieved, solving the problem of opaque status in traditional aging tests and improving the reliability and efficiency of product development.
Patent Information
- Application Number
- CN202510835519.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-20
- Publication Date
- 2025-09-19
AI Technical Summary
Traditional aging tests are unable to monitor the status of components in real time during high-temperature aging, resulting in extended product development cycles and reduced reliability, and are unable to provide real-time reliability support data.
A real-time monitoring system for the burn-in of discrete devices was designed, including a burn-in board, a single-station burn-in monitoring board, and a single-station current and voltage acquisition module. Leakage current information and gate dynamic voltage signals were transmitted through a communication interface. An STM32F103 single-chip microcomputer was used for signal acquisition and processing. The voltage and current data were displayed in real time on an OLED display. Indicators and alarms were set to provide failure warnings.
It realizes the real-time visualization of the status of components during high-temperature aging, provides failure warning function, improves the reliability and efficiency of product development, and meets the needs of military equipment.
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Figure CN120669086A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of electronic component detection, and in particular to a discrete device aging real-time monitoring system, a storage medium and a computer device. Background Art
[0002] Burn-in is a commonly used engineering method to eliminate prematurely failing products and improve system reliability. By applying a certain amount of electrical stress to components over an extended period, the combined effects of electrical and thermal stress accelerate various physical and chemical reactions within the components, exposing potential defects early and eliminating prematurely failing products.
[0003] As electronic components continue to evolve toward higher integration, enhanced functionality, and lower power consumption, the functional requirements placed on burn-in boards for certain specialized devices are also increasing. These specialized devices, often used in military equipment, often must withstand increased mechanical, thermal, humidity, and electromagnetic environmental stresses, making the reliability of these electronic components crucial.
[0004] Traditional burn-in tests can only obtain results through electrical testing after high-temperature aging. It is impossible to monitor the output status of components in real time during the high-temperature aging test, and it is impossible to provide reliability support data to scientific researchers in real time. This can easily lead to deviations in the direction of product reliability development and improvement, lengthening the product development cycle and reducing reliability. Therefore, real-time visualization of the data of each device during the high-temperature aging test is extremely important.
[0005] In order to solve the problem that the existing technology cannot perform real-time dynamic monitoring of fixed-frequency, high-voltage, and high-power square wave signals, the Chinese invention patent with application number 202211665000.4 discloses "A dynamic aging system for PWM power amplifiers". The display module in this system uses the LED on and off method to display whether the collected PWM power amplifier output frequency is within the sampling frequency range, and it is impossible to display the aging data of each device in real time. Summary of the Invention
[0006] The present invention provides a low-cost, high-efficiency discrete device aging real-time monitoring system, storage medium and computer equipment, which can solve at least one of the above technical problems.
[0007] In order to solve the above technical problems, the present invention adopts the following technical solutions:
[0008] A discrete device burn-in real-time monitoring system includes an burn-in board, a single-station burn-in monitoring board, and a single-station current and voltage acquisition module;
[0009] There are multiple aging stations distributed at intervals on the aging board, and the single-station aging monitoring board is interconnected with the aging board via communication wires. There are multiple aging monitoring stations distributed at intervals on the single-station aging monitoring board, and each of the aging monitoring stations corresponds to each of the aging stations one by one. Under aging conditions, the aging board is placed in the aging high-temperature box, and the single-station aging monitoring board is placed outside the aging high-temperature box. The single-station current and voltage acquisition module is built into the single-station aging monitoring board for collecting current and voltage signals of the aging monitoring stations.
[0010] Furthermore, the aging plate and the single-station aging monitoring plate are respectively provided with communication interfaces, and the two communication interfaces are connected via the communication wire.
[0011] Furthermore, the high temperature of the aging environment is lower than the melting point of the solder joints of the circuit board.
[0012] Furthermore, the aging monitoring station is provided with a display screen, an indicator light and an alarm. The display screen is used to display relevant information data of the corresponding device of the monitoring station in real time. The indicator light is used to display or switch the color of the lamp body to mark whether the corresponding device of the monitoring station has failed or not. The alarm is used to trigger an alarm response in real time when the corresponding device of the monitoring station fails.
[0013] Furthermore, the single-station current and voltage acquisition module includes an MCU single-chip computer minimum system circuit and a relay control circuit. In the MCU single-chip computer minimum system circuit, the single-chip computer establishes a communication connection with the display screen via the IIC interface to display voltage and current readings. In the relay control circuit, when the current or voltage exceeds a preset threshold, the CPU promptly sends a disconnect signal to the relay to cut off the circuit to protect the system safety.
[0014] Furthermore, the aging board and the single-station aging monitoring board are both provided with power supply and signal input ports.
[0015] A computer-readable storage medium stores a computer program. When the computer program is executed by a processor, the processor implements the above-mentioned discrete device aging real-time monitoring system.
[0016] A computer device includes a memory and a processor, wherein the memory stores a computer program, and when the computer program is executed by the processor, the processor implements the above-mentioned discrete device aging real-time monitoring system.
[0017] The beneficial effects of the present invention are embodied in:
[0018] In order to solve the problem of opaque status of various devices on traditional burn-in boards during high-temperature burn-in, the present invention provides a low-cost, high-efficiency single-station discrete device burn-in real-time monitoring system. The burn-in board is redesigned and modified according to the functions of electronic components, newly added single-station monitoring points and communication interface channel functions. The leakage current information, gate dynamic voltage and other signals are transmitted to the burn-in monitoring board through the communication interface to complete the initial stage goals of the monitoring task. The PCB is re-wired and laid out through Altium Designer to complete the transformation and upgrade of the burn-in board. Specifically, multiple (even up to 25 or more) monitoring bits and corresponding display bits are added, and the STM32F103 microcontroller is combined with relevant circuit modules for signal acquisition and processing. It communicates with the 0.96-inch OLED display screen through the IIC interface. It can display the voltage and leakage current data of each device being aged in real time, and has the functions of early warning and automatic marking of the location of failed devices. It helps to discover performance degradation or failure problems that may occur in electronic components during long-term aging, provide strong data support for product improvement and failure analysis, safeguard production safety, and meet the increasing demand for military equipment and future equipment development trends. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] The drawings described herein are used to provide further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute improper limitations on the present application.
[0020] Figure 1 Schematic diagram of the overall structure of the monitoring system according to an embodiment of the present invention.
[0021] Figure 2 It is a structural block diagram of a computer device according to an embodiment of the present invention.
[0022] The components in the accompanying drawings are marked as follows: 1. Aging board; 2. Single-station aging monitoring board; 3. Single-station current and voltage acquisition module; 4. Aging station; 5. Aging monitoring station; 6. Communication wire; 7. Communication interface; 8. Display screen; 9. Indicator light; 10. Alarm; 11. Power and signal input port. DETAILED DESCRIPTION
[0023] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. In the absence of conflict, the embodiments in this application and the features in the embodiments can be combined with each other. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.
[0024] It should be noted that the meaning of "and / or" appearing throughout the text includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions in which both A and B are satisfied. In addition, "multiple" refers to more than two. In addition, the technical solutions between the various embodiments can be combined with each other, but this must be based on the fact that ordinary technicians in this field can implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.
[0025] See also Figure 1 , an embodiment of the present invention provides a discrete device burn-in real-time monitoring system, comprising an burn-in board 1, a single-station burn-in monitoring board 2, and a single-station current and voltage acquisition module 3;
[0026] There are multiple aging stations 4 distributed at intervals on the aging board 1, and the single-station aging monitoring board 2 is interconnected with the aging board 1 via a communication wire 6. There are multiple aging monitoring stations 5 distributed at intervals on the single-station aging monitoring board 2, and each of the aging monitoring stations 5 corresponds one-to-one to each of the aging stations 4. Under aging conditions, the aging board 1 is placed in an aging high-temperature box, and the single-station aging monitoring board 3 is placed outside the aging high-temperature box. The single-station current and voltage acquisition module 3 is built into the single-station aging monitoring board 2, and is used to collect current and voltage signals of the aging monitoring station 5.
[0027] See also Figure 1 In this embodiment, the aging plate 1 and the single-station aging monitoring plate 2 are respectively provided with a communication interface 7 , and the two communication interfaces 7 are connected via the communication wire 6 .
[0028] In this application, the communication interface 7 can use the 57 series wire-bonding type CN-50P communication interface, and the communication interface 7 matches the communication channel of the single-station aging monitoring board 2 to ensure that the signals (such as leakage current information, gate dynamic voltage, etc.) between the aging board 1 and the single-station aging monitoring board 2 can interact stably.
[0029] See also Figure 1 In this embodiment, the high temperature of the aging environment is lower than the melting point of the solder joints of the circuit board.
[0030] In this application, the high temperature of the aging environment is set to no more than 130 degrees. Under normal circumstances, the melting point of each circuit board solder joint is 200 degrees. Therefore, under the aging working condition, when the aging board 1 is placed in the high temperature box for aging, the pin solder joints of the circuit board are prevented from failing due to high temperature.
[0031] See also Figure 1In this embodiment, the aging monitoring station 5 is provided with a display screen 8, an indicator light 9 and an alarm 10. The display screen 8 is used to display the relevant information data of the device corresponding to the monitoring station in real time. The indicator light 9 is used to display or switch the light body color to mark whether the device corresponding to the monitoring station has failed or not. The alarm 10 is used to trigger an alarm response in real time when the device corresponding to the monitoring station fails.
[0032] The types and models of the components in this application are not particularly limited. However, to consider design costs and design effects, the display screen 8 is preferably an OLED display screen, which can be set to 0.96 inches. The indicator light 9 is preferably an LED light. The alarm 10 is preferably a buzzer. In this way, a complete failure warning system is constructed at each of the burn-in monitoring stations 5 to achieve monitoring and protection functions.
[0033] See also Figure 1 In this embodiment, the single-station current and voltage acquisition module 3 includes an MCU single-chip minimum system circuit and a relay control circuit. In the MCU single-chip minimum system circuit, the single-chip establishes a communication connection with the display screen 8 via the IIC interface to display the voltage and current readings. In the relay control circuit, when the current or voltage exceeds the preset threshold, the CPU promptly sends a disconnect signal to the relay to cut off the circuit to protect the system safety. After the fault is eliminated, the power supply can be restored by connecting the relay through the reset button.
[0034] In this application, the single-station current and voltage acquisition module 3 collects analog quantities to provide support for subsequent data processing. It mainly includes the hardware design and software implementation of the system. The core is to use a single-chip microcomputer combined with related circuit modules for signal acquisition and processing. The MCU single-chip microcomputer minimum system circuit serves as the foundation of the entire monitoring system, ensuring that the single-chip microcomputer can operate stably, including crystal oscillator circuits, reset circuits, etc. Through these basic circuits, the system can obtain a stable clock signal and reliable system restart.
[0035] An embedded STM32F103 microcontroller (MCU) is preferred as the main controller. The STM32F103 MCU has multiple ADC channels that can be used to acquire voltage and current signals. The ADC converts the analog signals into digital values for subsequent processing by the MCU. Voltage measurement typically involves directly sampling the processed voltage through the ADC, while current measurement involves a key component: the sampling resistor. When current flows through the sampling resistor, a voltage drop is generated across it. This voltage is proportional to the current. With a known resistance value, Ohm's law (V = I * R) can be used to calculate the current flowing. Therefore, the ADC measures this voltage drop, and the STM32F103 MCU calculates the corresponding current value.
[0036] The STM32F103 microcontroller acts as the IIC master, sending commands and displaying data to the OLED display. This clearly displays voltage and current values, providing an intuitive interface. In addition to hardware configuration, the design also requires corresponding software programs to control the STM32F103 microcontroller's execution of tasks. This includes initializing the ADC and IIC interface, setting up an interrupt service routine to read ADC data in real time, and processing and displaying the data on the OLED screen. Furthermore, to improve system stability and accuracy, filtering is required to eliminate noise and fluctuations. Combining ADC and OLED display technology provides a practical single-station current and voltage acquisition module 3 for the burn-in board 1.
[0037] See also Figure 1 In this embodiment, the aging board 1 and the single-station aging monitoring board 2 are both provided with a power supply and signal input port 11 for inputting and triggering different signal sources to perform corresponding functions.
[0038] An embodiment of the present invention further provides a computer-readable storage medium storing a computer program. When the computer program is executed by a processor, the processor implements the above-mentioned discrete device aging real-time monitoring system.
[0039] See also Figure 2 An embodiment of the present invention further provides a computer device, including a memory and a processor, wherein the memory stores a computer program, and when the computer program is executed by the processor, the processor implements the above-mentioned discrete device aging real-time monitoring system.
[0040] An embodiment of the present invention further provides a computer program product comprising instructions, which, when executed on a computer, enables the computer to implement the above-mentioned discrete device aging real-time monitoring system.
[0041] It should be noted that those skilled in the art will understand that all or part of the steps implemented in the embodiments of the present invention can be implemented in whole or in part by software, hardware, firmware, or any combination thereof. When implemented using hardware, it can be implemented in whole or in part in the form of purchased standard parts or modified parts. When implemented using software, it can be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, the process or function described in the embodiments of the present application is generated in whole or in part. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another computer-readable storage medium. For example, the computer instructions can be transmitted from one website, computer, server, or data center to another website, computer, server, or data center via a wired (e.g., coaxial cable, optical fiber, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) method. The computer-readable storage medium can be any available medium that can be accessed by a computer or a data storage device such as a server or data center that includes one or more available media integrated therein. The available medium may be a magnetic medium (eg, a floppy disk, a hard disk, a magnetic tape), an optical medium (eg, a DVD), or a semiconductor medium (eg, a solid state disk (SSD)).
[0042] In summary, the present invention solves the problem of opaque device states during high-temperature aging on traditional burn-in boards, and provides a real-time monitoring system for the burn-in of discrete devices. The burn-in board is redesigned and reconstructed based on the functions of electronic components, newly added single-station monitoring points, and communication interface channel functions. Signals such as leakage current information and gate dynamic voltage are transmitted to the burn-in monitoring board through the communication interface, completing the initial stage goals of the monitoring task. The PCB is re-routed and laid out using Altium Designer to complete the transformation and upgrade of the burn-in board.
[0043] It should be understood that the examples and implementation methods described herein are for illustrative purposes only and are not intended to limit the present invention. Those skilled in the art may make various modifications or changes based on them. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.
Claims
1. A real-time monitoring system for discrete device aging, characterized in that: It comprises an aging board (1), a single-station aging monitoring board (2) and a single-station current and voltage acquisition module (3); A plurality of aging stations (4) are spaced apart on the aging board (1), the single-station aging monitoring board (2) is interconnected with the aging board (1) via a communication line (6), a plurality of aging monitoring stations (5) are spaced apart on the single-station aging monitoring board (2), each of the aging monitoring stations (5) corresponds one-to-one to each of the aging stations (4), and under aging conditions, the aging board (1) is placed in an aging high-temperature box, the single-station aging monitoring board (3) is placed outside the aging high-temperature box, and the single-station current and voltage acquisition module (3) is built into the single-station aging monitoring board (2) for acquiring current and voltage signals of the aging monitoring stations (5).
2. The real-time monitoring system for discrete device aging according to claim 1, wherein: The aging plate (1) and the single-station aging monitoring plate (2) are respectively provided with a communication interface (7), and the two communication interfaces (7) are connected via the communication wire (6).
3. The real-time monitoring system for discrete device aging according to claim 1, wherein: The high temperature of the aging environment is lower than the melting point of the circuit board solder joints.
4. The real-time monitoring system for discrete device aging according to claim 1, wherein: The aging monitoring station (5) is provided with a display screen (8), an indicator light (9) and an alarm (10). The display screen (8) is used to display relevant information data of the corresponding device of the monitoring station in real time. The indicator light (9) is used to display or switch the color of the lamp body to mark whether the corresponding device of the monitoring station has failed. The alarm (10) is used to trigger an alarm response in real time when the corresponding device of the monitoring station has failed.
5. The real-time monitoring system for discrete device aging according to claim 4, wherein: The single-station current and voltage acquisition module (3) comprises an MCU single-chip computer minimum system circuit and a relay control circuit. In the MCU single-chip computer minimum system circuit, the single-chip computer establishes a communication connection with the display screen (8) via an IIC interface to display voltage and current readings. In the relay control circuit, when the current or voltage exceeds a preset threshold, the CPU promptly sends a disconnect signal to the relay to cut off the circuit to protect system safety.
6. The real-time monitoring system for discrete device aging according to claim 1, wherein: The aging plate (1) and the single-station aging monitoring plate (2) are both provided with power supply and signal input ports (11).
7. A computer-readable storage medium, characterized in that A computer program is stored, and when the computer program is executed by a processor, the processor implements the discrete device aging real-time monitoring system according to any one of claims 1 to 6.
8. A computer device, characterized in that: The system comprises a memory and a processor, wherein the memory stores a computer program, and when the computer program is executed by the processor, the processor implements the discrete device aging real-time monitoring system according to any one of claims 1 to 6.
Citation Information
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