Printed board drilling quality control method and system

Abstract

The invention discloses a printed board drilling quality control method and system, and relates to the technical field of printed boards, in quality detection of each processing hole, an actual aperture is determined based on aperture detection of the processing hole, and a first processing grade of the processing hole is determined according to the actual aperture, a theoretical aperture and a hole processing program; the overall consideration of the actual hole diameter, the theoretical hole diameter and the hole machining program is compatible, and the accuracy of the first machining level of the machined hole is guaranteed. Therefore, the shape of the inner side wall of the machining hole shows the surface quality of the inner side wall; according to the method, the quality grade of the processing hole is determined based on the inner side wall form of the processing hole and the first processing grade of the processing hole, the drilling quality distribution diagram of the printed board is determined according to the quality grade of each processing hole and the position of each processing hole, and overall consideration of the inner side wall form of the processing hole and the first processing grade of the processing hole is introduced. And the precise control of the quality grade of the machined hole is ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of printed circuit boards, and in particular to a printed circuit board drilling quality control method and system. Background Art

[0002] With the development of science and technology, printed circuit boards need to be drilled during the processing process to form processing holes of the printed circuit boards. The processing holes serve as positioning holes and have certain requirements on the accuracy of the processing holes. At the same time, the positional accuracy between multiple processing holes must also be considered. In the existing technology, the quality grade of the printed circuit board is evaluated, and the apertures of multiple processing holes are collected. The quality grade of the processing holes is determined based on the apertures of the multiple processing holes, and a single control is performed along the dimension of the aperture. It is impossible to achieve precise control of the quality grade of the existing processing holes. Summary of the Invention

[0003] The purpose of the present invention is to overcome the deficiencies of the prior art and to provide a method and system for controlling the quality of printed circuit board drilling.

[0004] An embodiment of the present invention provides a method for controlling the quality of drilling holes in a printed circuit board, comprising: determining the position of each processed hole based on a surface image of the printed circuit board and previous drilling information; determining a theoretical aperture and a hole processing program based on the traceability of the position of each processed hole, wherein each processed hole corresponds to a hole processing program; in the quality inspection of each processed hole, determining the actual aperture based on the aperture inspection of the processed hole, and determining a first processing grade of the processed hole based on the actual aperture, the theoretical aperture and the hole processing program; collecting an inner wall image of the processed hole, determining the inner wall morphology of the processed hole based on the inner wall image, wherein the inner wall morphology of the processed hole presents the surface quality of the inner wall; determining the quality grade of the processed hole based on the inner wall morphology of the processed hole and the first processing grade of the processed hole, and determining a drilling quality distribution map of the printed circuit board based on the quality grade of each processed hole and the position of each processed hole.

[0005] An embodiment of the present invention provides a printed circuit board drilling quality control system, which is applied to the above-mentioned printed circuit board drilling quality control method. The printed circuit board drilling quality control system includes: Position module, used to determine the position of each processing hole based on the surface image of the printed circuit board and previous drilling information; The traceability module is used to determine the theoretical hole diameter and hole processing program based on the traceability of the position of each processing hole. Each processing hole corresponds to a hole processing program. A machining quality grade module is used to determine the actual hole diameter based on the hole diameter detection of each machined hole in the quality inspection of each machined hole, and to determine the first machining grade of the machined hole according to the actual hole diameter, the theoretical hole diameter and the hole machining program; an acquisition module, for acquiring an image of the inner wall of the machined hole, and determining a shape of the inner wall of the machined hole according to the image of the inner wall, wherein the shape of the inner wall of the machined hole represents a surface quality of the inner wall; The drilling quality distribution map module is used to determine the quality level of the processed holes based on the inner side wall shape of the processed holes and the first processing level of the processed holes, and to determine the drilling quality distribution map of the printed circuit board according to the quality level of each processed hole and the position of each processed hole.

[0006] Compared with the prior art, the present invention has the following beneficial effects: In an embodiment of the present invention, through the method in the embodiment of the present invention, the position of each processing hole is determined according to the surface image of the printed circuit board and the previous drilling information; the theoretical aperture and the hole processing program are determined according to the tracing of the position of each processing hole, and each processing hole corresponds to a hole processing program; in the quality inspection of each processing hole, the actual aperture is determined based on the aperture inspection of the processing hole, and the first processing level of the processing hole is determined according to the actual aperture, the theoretical aperture and the hole processing program, which is compatible with the overall consideration of the actual aperture, the theoretical aperture and the hole processing program, and ensures the accuracy of the first processing level of the processing hole.

[0007] Therefore, an image of the inner wall of the processed hole is collected, and the inner wall morphology of the processed hole is determined based on the inner wall image. The inner wall morphology of the processed hole presents the surface quality of the inner wall. The quality grade of the processed hole is determined based on the inner wall morphology of the processed hole and the first processing grade of the processed hole. The drilling quality distribution map of the printed circuit board is determined according to the quality grade of each processed hole and the position of each processed hole. The overall consideration of the inner wall morphology of the processed hole and the first processing grade of the processed hole is introduced to ensure the precise control of the quality grade of the processed hole, and thus ensure the accuracy of the drilling quality distribution map of the printed circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 1 is a flow chart of a method for controlling the quality of printed circuit board drilling in an embodiment of the present invention; Figure 2 1 is a flow chart of step S11 in the printed circuit board drilling quality control method in an embodiment of the present invention; Figure 3 1 is a flow chart of step S12 in the printed circuit board drilling quality control method in an embodiment of the present invention; Figure 4 1 is a flow chart of step S13 in the printed circuit board drilling quality control method in an embodiment of the present invention; Figure 5 1 is a flow chart of step S14 in the printed circuit board drilling quality control method in an embodiment of the present invention; Figure 6 1 is a flow chart of step S15 in the printed circuit board drilling quality control method in an embodiment of the present invention; Figure 7 Schematic diagram of the structure of the printed circuit board drilling quality control system in an embodiment of the present invention. DETAILED DESCRIPTION

[0009] The technical solutions in the embodiments of the present invention will be described clearly and completely below with reference to the accompanying drawings in the embodiments of the present invention.

[0010] See also Figures 1 to 7 A printed circuit board drilling quality control method is applied to the printed circuit board drilling quality control scenario of a built-in induction cooker; the printed circuit board drilling quality control method includes: Step S11: determining the position of each processing hole according to the surface image of the printed circuit board and previous drilling information; Step S12: determining the theoretical hole diameter and hole processing program based on the traceability of the positions of the various processed holes, with each processed hole corresponding to a hole processing program; Step S13: in the quality inspection of each processed hole, the actual hole diameter is determined based on the hole diameter inspection of the processed hole, and the first processing grade of the processed hole is determined according to the actual hole diameter, the theoretical hole diameter and the hole processing program; Step S14: collecting an image of the inner wall of the processed hole, and determining the inner wall morphology of the processed hole according to the inner wall image, wherein the inner wall morphology of the processed hole represents the surface quality of the inner wall; Step S15: determining the quality grade of the processed holes based on the inner sidewall shape of the processed holes and the first processing grade of the processed holes, and determining a drilling quality distribution map of the printed circuit board according to the quality grade of each processed hole and the position of each processed hole; refer to Figure 2 ,In step S11, the position of each processing hole is determined based on the surface image of the printed circuit board and the previous drilling information; In the specific implementation process of the present invention, the specific steps are: S111: After the printed circuit board is cleaned, the printed circuit board is transferred to a position directly below the camera. The camera captures the printed circuit board to capture a surface image of the printed circuit board. A plurality of processing holes are determined based on hole position recognition in the surface image of the printed circuit board. S112: Constructing a corresponding coordinate system for the printed circuit board, marking the coordinates of the plurality of processing holes in the coordinate system, generating actual coordinates of the plurality of processing holes, and determining corresponding previous drilling information based on the actual coordinates of the plurality of processing holes and the printed circuit board processing database; S113: determining the working coordinates of the plurality of processing holes based on the analysis of the previous drilling information, and determining the positions of the respective processing holes if the working coordinates of the plurality of processing holes coincide with the actual coordinates of the plurality of processing holes.

[0011] In an embodiment of the present application, after the printed circuit board is cleaned, the printed circuit board is transferred to the bottom of the camera, and the surface image of the printed circuit board is collected based on the camera's shooting of the printed circuit board. Multiple processing holes are determined based on the hole position recognition of the surface image of the printed circuit board. The surface image of the printed circuit board is introduced to ensure the preliminary recognition of multiple processing holes.

[0012] At this time, remove dirt, grease, dust and other impurities from the surface of the printed circuit board to ensure that the camera can capture clear and undisturbed images; optionally, use a dedicated cleaning agent or ultrasonic cleaning machine to clean the printed circuit board; after cleaning, wipe the surface of the printed circuit board dry with a clean cloth or air gun.

[0013] Place the cleaned PCB within the camera's field of view to capture the surface image. Use a robotic arm, conveyor, or manual means to smoothly transfer the PCB directly under the camera. Ensure the PCB is fixed and does not move so the camera can capture the image accurately. Simultaneously, use the camera to capture the PCB surface, capturing an image containing hole location information. Start the camera and adjust the focus and exposure to ensure a clear image. Pay attention to lighting conditions to avoid reflections or shadows that may affect image quality. Save the captured image for later processing.

[0014] The location of the processing hole is identified in the captured image; at this time, the image is processed using an image recognition algorithm (such as template matching, edge detection, machine learning, etc.); the image recognition algorithm analyzes the pixel information in the image and identifies features that match the preset hole template, thereby determining the location of the processing hole.

[0015] Specifically, consider a printed circuit board (PCB) with dozens of through-holes for mounting electronic components. To ensure the accurate positioning of these through-holes, an ultrasonic cleaner is used to clean the PCB to remove surface dirt and grease. After cleaning, the PCB is wiped dry with a clean cloth. The cleaned PCB is placed at the end of a robotic arm, which automatically transfers the PCB to a position directly below the camera. This ensures that the PCB is fixed in place and will not move due to vibration or airflow.

[0016] Start the camera, adjust the focus and exposure to ensure a clear image; photograph the surface of the printed circuit board and save the image; use an image recognition algorithm to process the captured image; the algorithm will identify features in the image that match the preset hole template to determine the location of each processing hole; for example, the algorithm will identify circular or elliptical areas in the image, which are the locations of the processing holes. Through this process, the location of each processing hole on the printed circuit board is accurately determined, providing a basis for subsequent drilling operations, which helps to ensure the accuracy and consistency of drilling and improve the quality and reliability of the printed circuit board.

[0017] Furthermore, a corresponding coordinate system is constructed for the printed circuit board. In this coordinate system, the coordinates of multiple processing holes are marked, and the actual coordinates of the multiple processing holes are generated. The corresponding previous drilling information is determined based on the actual coordinates of the multiple processing holes and the processing database of the printed circuit board. This is compatible with the overall consideration of the actual coordinates of the multiple processing holes and the processing database of the printed circuit board, ensuring the accuracy of the corresponding previous drilling information.

[0018] At this time, in order to uniformly describe the positions of each processing hole on the printed circuit board, a coordinate system needs to be established. At the same time, a corner of the printed circuit board is usually selected as the origin, and two mutually perpendicular sides are used as the X-axis and Y-axis to construct a rectangular coordinate system. The unit of the coordinate system is millimeter (mm) or inch (inch), which is determined according to actual needs.

[0019] In the established coordinate system, a unique coordinate value is assigned to each machined hole. At this point, the position of each machined hole in the coordinate system is marked according to the established coordinate system, and its coordinate value is recorded. The coordinate value is usually expressed in the form of (X, Y), where X represents the horizontal coordinate and Y represents the vertical coordinate. The coordinate value of each machined hole is recorded in a certain format (such as a table, text file, etc.) to form a list of the actual coordinates of the machined holes. The list should include information such as the machined hole number and coordinate value.

[0020] Specifically, assume there is a printed circuit board with 10 processing holes distributed on it. The positions of the processing holes have been determined according to step S111, and their actual coordinates have been recorded. Now, it is necessary to retrieve the corresponding previous drilling information from the processing database based on these coordinates. The lower left corner of the printed circuit board is selected as the origin, the horizontal rightward direction is the X axis, and the vertical upward direction is the Y axis to construct a rectangular coordinate system. Through the image recognition algorithm, the position of each processing hole in the coordinate system is determined, and their coordinate values ​​are recorded. For example, the coordinates of the first processing hole are (10, 20), the coordinates of the second processing hole are (15, 25), and so on. The recorded coordinate values ​​are organized into a table as a list of the actual coordinates of the processing holes. The table contains information such as the processing hole number, X coordinate, and Y coordinate.

[0021] Using the actual coordinates of the processed hole, the corresponding previous drilling information is retrieved from the printed circuit board's processing database. At this time, the processing database usually contains detailed information on previous drillings, such as hole size, hole depth, processing parameters, etc. By comparing the actual coordinates with the records in the database, the previous drilling information that matches the current processed hole is found. If the records in the database are stored based on coordinates, then this step is completed through simple coordinate matching. If the records are stored in other ways (such as hole position number, board number, etc.), it is necessary to first convert or query based on this information, and then find the corresponding previous drilling information.

[0022] Specifically, the machining database is opened and a search is performed based on the actual coordinates of the machining holes. For example, for the first machining hole (10, 20), a matching record is found in the database, which shows that a drill with a diameter of 3 mm and a hole depth of 1.5 mm was used in the previous machining of the hole, with machining parameters of specific rotation speed and feed rate. The same method is used to find the corresponding previous drilling information for other machining holes. Through this process, the corresponding previous drilling information is retrieved from the machining database based on the actual coordinates of the machining hole, providing an important reference for subsequent operations.

[0023] Therefore, the working coordinates of multiple processing holes are determined based on the analysis of previous drilling information. If the working coordinates of multiple processing holes coincide with the actual coordinates of multiple processing holes, the positions of each processing hole are determined, thereby ensuring the accuracy of the positions of each processing hole.

[0024] At this point, the past drilling information retrieved from the processing database contains a variety of data, such as design coordinates, historical processing deviations, the type of drill used, etc. The purpose of this step is to parse this information and extract information that is directly related to the current processing hole position determination; optionally, for each processing hole, the design coordinates (i.e., the theoretical position where the hole should be drilled) and any deviation information that affects the actual drilling position (such as deviations caused by machine errors, material deformation, etc.) are extracted from its corresponding past drilling information. This information is usually expressed in numerical form and stored in specific fields of the database.

[0025] Based on the parsed previous drilling information, the working coordinates of each machined hole in the current machining process are calculated; the working coordinates are the coordinates that should be used during actual drilling after taking various factors (such as machine accuracy, material properties, etc.) into account; optionally, for each machined hole, its design coordinates are combined with the extracted deviation information to calculate the working coordinates.

[0026] Specifically, suppose there is a printed circuit board with five machining holes distributed on it. The actual coordinates of the machining holes have been determined according to the previous steps, and the corresponding historical drilling information has been retrieved from the machining database. For the first machining hole, the design coordinates extracted from the database are (20, 30), and the historical machining deviation is ±0.1mm, which means that when actually drilling, the position of the hole is within ±0.1mm of the design coordinates. Taking into account the machine accuracy and material properties, it is decided to use the design coordinates as the working coordinates, but take the deviation range into consideration. Therefore, for the first machining hole, the determined working coordinates are still (20, 30), but a deviation of ±0.1mm is allowed.

[0027] Verify that the work coordinates are consistent with the actual coordinates or are within an acceptable deviation range to ensure the accuracy of the drill hole location. At this point, the work coordinates of each machined hole are compared with its actual coordinates determined in the above steps. If the two completely coincide or the deviation is within the predetermined tolerance range, the position of the machined hole is considered to have been accurately determined. If the deviation is outside the tolerance range, it is necessary to re-evaluate the machining parameters, adjust the machine settings, or take other corrective measures. After confirming that the working coordinates are consistent with the actual coordinates, the position of each processed hole is formally determined to provide accurate positioning information for subsequent drilling operations; optionally, for processed holes that meet the deviation requirements, their working coordinates (or actual coordinates, if the two are consistent) are recorded as the final position information in the processing plan or machine control system. This position information will be used to guide the operation of the drilling equipment to ensure that each processed hole can be drilled accurately.

[0028] Specifically, the working coordinates (20, 30) of the first machined hole were compared with the actual coordinates (assumed to be (20.05, 30.02)). Since the deviation between the actual coordinates and the working coordinates is within the range of ±0.1mm, the position of the hole is considered accurate. Based on the above comparison results, the position of the first machined hole is officially determined to be (20, 30) (or the actual coordinates, if the system allows more precise values). The positions of other machined holes are also determined in the same way. Through this process, the position of each machined hole is ensured to be accurate, providing reliable positioning information for subsequent drilling operations.

[0029] In one embodiment of the present application, assume that there is a printed circuit board with five machined holes. The actual coordinates of these holes have been determined according to the previous steps, and the corresponding previous drilling information has been retrieved from the machining database. Now, it is necessary to determine the working coordinates of each machined hole based on this information and verify whether they coincide with the actual coordinates. A coincidence matching table is introduced, as shown in Table 1: Table 1 Coincidence matching table

[0030] refer to Figure 3 In step S12, the theoretical hole diameter and hole processing program are determined according to the traceability of the positions of the various processing holes, and each processing hole corresponds to a hole processing program; In the specific implementation process of the present invention, the specific steps are: S121: The positions of each processing hole are collected, and the corresponding hole processing program is determined based on the matching of the positions of each processing hole with the processing database of the printed circuit board. At this time, the processing process of each processing hole is presented based on the corresponding hole processing program; S122: Analyze the hole machining program, determine the tool path data of each hole during the hole machining process based on the analysis of the hole machining program, and determine the theoretical hole diameter based on the traversal of the tool path data. At this point, the hole machining program is further controlled, and the machining quality of the machined hole is controlled based on the dimensions of the hole machining program. At the same time, the tool path data presents the hole machining process of the machined hole. In an embodiment of the present application, the position of each processing hole is collected, and the corresponding hole processing program is determined based on the matching of the position of each processing hole and the processing database of the printed circuit board. At this time, the processing process of each processing hole is presented based on the corresponding hole processing program, which is compatible with the overall consideration of the matching of the position of each processing hole and the processing database of the printed circuit board, thereby ensuring the accuracy of the corresponding hole processing program.

[0031] At this point, the positions of each processing hole are collected and matched with the processing database of the printed circuit board; the processing database usually contains preset processing programs for processing holes of different types and locations. These programs include key parameters such as drilling depth, rotation speed, feed rate, and any special processing instructions required; the matching process usually involves comparing the position data with the records in the database to find the most matching processing program.

[0032] Optionally, access the printed circuit board processing database to ensure that the database is up to date and contains all necessary processing programs; compare the collected processing hole position data with the records in the database to find the most matching processing program; if there is no exact matching record in the database, it is necessary to adjust according to the closest match or the preset default program; record the matching results and prepare to apply the selected processing program to the subsequent processing process.

[0033] Specifically, suppose there is a printed circuit board with 10 machined holes distributed on it. The positions of these holes have been collected by high-precision measurement equipment and recorded in a data file. Now, it is necessary to determine the appropriate machining program for these holes. Use a 3D scanner to scan the printed circuit board to obtain the precise position data of each machined hole. The position data is recorded in a data file, including the X, Y coordinates (and Z coordinate) of each hole.

[0034] The system accesses the printed circuit board's machining database, which contains preset machining programs for different hole locations and types. The collected location data is compared with the records in the database to find the best matching machining program for each hole. For example, for the hole at location (X1, Y1), the matching machining program found in the database specifies drilling with a 3mm diameter drill bit at 2000 rpm and a feed rate of 0.1mm / rev. The matching results, including the corresponding machining program for each hole, are recorded. This information is then transmitted to the machining equipment in preparation for subsequent drilling operations. This process ensures that each hole is accurately machined according to the predetermined machining program, thereby improving machining quality and efficiency.

[0035] Furthermore, the hole machining program is analyzed, and the tool feed data of each machining hole during the hole machining process is determined based on the analysis of the hole machining program, and the theoretical hole diameter is determined based on the traversal of the tool feed data. At this time, the hole machining program is further controlled, and the machining quality of the machining hole is controlled based on the dimensions of the hole machining program. At the same time, the tool feed data presents the hole machining process of the machining hole.

[0036] At this point, the machining program for each machining hole is analyzed in depth; the machining program is usually composed of a series of instructions, which describe in detail how the drilling equipment should operate during the machining process; the purpose of parsing the machining program is to extract the key machining parameters and steps for use in subsequent steps; the parsing process involves reading and understanding the machining program code line by line, which requires the operator to have relevant programming and machining knowledge; in addition, when parsing, attention should be paid to any special instructions or conditional statements in the machining program, which have a significant impact on the machining process.

[0037] Optionally, use dedicated machining program parsing software or tools to open and read the machining program for each machining hole; analyze the machining program code line by line to extract key machining parameters, such as drill diameter, rotation speed, feed rate, drilling depth, etc.; pay attention to identify any special instructions or conditional statements in the machining program and understand their impact on the machining process; record the parsed machining parameters and steps in a data management system or file for use in subsequent steps.

[0038] Tool path data refers to the detailed path and parameters of the drill's movement during the machining process. After parsing the machining program, the tool path data for each machined hole is determined based on the extracted machining parameters and steps. Tool path data typically includes information such as the drill's starting position, movement path, dwell time at each position, and final position. The process of determining tool path data requires the use of specialized software tools for simulation and calculation to ensure the accuracy and reliability of the data. In addition, the performance limitations of the machining equipment and safety factors in the machining process must also be considered.

[0039] Optionally, use machining simulation software or tools to generate toolpath data for each machining hole based on the parsed machining parameters and steps; verify the accuracy and rationality of the toolpath data to ensure that they meet the requirements of the machining equipment and the safety standards of the machining process; and record the toolpath data in a data management system or file for use in subsequent steps.

[0040] After determining the cutting data, the theoretical aperture is calculated by traversing these data; the theoretical aperture refers to the diameter of the hole calculated based on the cutting data and parameters such as the drill diameter; the purpose of calculating the theoretical aperture is to ensure that the processed hole meets the design requirements; at the same time, in this step, the hole processing program needs to be further controlled to ensure the processing quality; control measures include verifying the rationality of the processing program, monitoring abnormal conditions during the processing, and timely adjusting the processing parameters, etc. These control measures are aimed at controlling the processing quality of the processed holes from the dimension of the hole processing program.

[0041] Optionally, use specialized calculation tools or software to calculate the theoretical aperture of each machined hole based on tool feed data, drill diameter and other parameters; compare the calculated theoretical aperture with the design requirements to ensure that they are consistent or within an acceptable deviation range; further control the hole machining program, including verifying the rationality of the program, monitoring the machining process, and timely adjusting the machining parameters; record the control results and any necessary adjustment measures for subsequent analysis and improvement.

[0042] Specifically, suppose there is a machining hole whose machining program specifies the use of a 4mm diameter drill, a rotation speed of 3000rpm, a feed rate of 0.15mm / rev, and a drilling depth of 10mm; parse the machining program, open the machining program file, read and analyze the code line by line; extract the key machining parameters: drill diameter 4mm, rotation speed 3000rpm, feed rate 0.15mm / rev, drilling depth 10m.

[0043] Using machining simulation software, tool path data is generated based on the extracted machining parameters. The tool path data includes: the path the drill moves from the starting position to the drilling position, the time it stays at each position (determined by the rotational speed and feed rate), and the movement path after the drilling reaches the specified depth.

[0044] Calculate the theoretical hole diameter based on the tool feed data and the drill diameter: Since the drill diameter is 4mm and no hole expansion operation is performed, the theoretical hole diameter is also 4mm; compare the calculated theoretical hole diameter with the design requirements (assuming the design requirements are 4mm±0.1mm) to confirm that they are consistent; further control the machining program, including verifying the rationality of the program, monitoring the drill wear during the machining process, and timely adjusting the feed speed to cope with changes in material hardness; record the control results and adjustment measures for subsequent analysis and improvement of the machining process.

[0045] refer to Figure 4 In step S13, in the quality inspection of each processed hole, the actual hole diameter is determined based on the hole diameter inspection of the processed hole, and the first processing grade of the processed hole is determined according to the actual hole diameter, the theoretical hole diameter and the hole processing program; In the specific implementation process of the present invention, the specific steps are: S131: Performing quality inspection on each processed hole, and determining the corresponding actual hole diameter based on the hole diameter inspection of the processed hole by the hole inspection tool. In this case, the hole inspection tool is a measurement tool dedicated to inspecting the processed holes and can measure the hole diameter along the inner side of the processed hole; S132: Generate a tool path for the hole according to the hole machining program, determine multiple tool nodes according to the tool path and the actual hole diameter, and determine the quality level of the hole machining program according to the multiple tool nodes and the corresponding tool data. S133: Determine a hole diameter difference according to the actual hole diameter and the theoretical hole diameter, and determine a first machining grade of the machined hole according to a mapping relationship between the hole diameter difference, the quality grade of the hole machining program, and the machining grade.

[0046] In an embodiment of the present application, quality inspection is performed on each processed hole, and the corresponding actual hole diameter is determined based on the hole diameter detection of the processed hole by the hole detection tool. At this time, the hole detection tool serves as a measuring tool dedicated to detecting the processed holes, and can perform hole diameter measurement along the inner side of the processed hole, introducing the actual hole diameter.

[0047] At this point, select appropriate hole detection tools, such as an internal micrometer, internal diameter gauge, or coordinate measuring machine, to ensure that the tool's accuracy and measurement range meet the requirements of the machined hole. Calibrate the hole detection tool to ensure the accuracy of its measurement results. Ensure a stable measurement environment to avoid the impact of environmental factors such as temperature and humidity on the measurement results. Prepare necessary auxiliary tools, such as measuring brackets and positioning blocks, to accurately position the hole detection tool on the machined hole.

[0048] Measure along the inside of the machined hole with the hole inspection tool, ensuring full contact between the tool and the hole wall during the measurement process to obtain accurate aperture data. Depending on the type of measuring tool, multiple measurements need to be performed and the average value taken to improve the reliability of the measurement results. The actual aperture data obtained from the measurement should be recorded in the quality inspection report for subsequent analysis and evaluation. Ensure that the recorded data is accurate, including information such as the measurement date, measurement personnel, and measurement tool.

[0049] Specifically, assume there is a printed circuit board (PCB) containing a machined hole with a diameter of 10mm. Quality inspection is required to determine its actual hole diameter. An internal micrometer is selected as the measuring tool, with a measuring range of 0-25mm and an accuracy of 0.01mm. The internal micrometer is calibrated to ensure the accuracy of its measurement results. At the same time, the measurement environment is set up and the measurement is performed at room temperature to avoid the influence of temperature changes on the measurement results. A measuring bracket is used to stably position the internal micrometer on the machined hole.

[0050] Gently insert the probe of the internal micrometer into the machined hole, ensuring that the probe is in full contact with the hole wall; rotate the probe of the internal micrometer to make multiple measurements along the inside of the machined hole, and record the data of each measurement; take the average value of multiple measurements as the actual aperture data of the machined hole; at the same time, record the measured actual aperture data in the quality inspection report, for example: "Machinery hole diameter: 10.02mm (average value)"; record the measurement date, measurement personnel, measurement tools and other information for subsequent analysis and evaluation; through the above steps, the quality inspection of the machined hole was successfully carried out, and its actual aperture was determined to be 10.02mm. This data is of great significance for evaluating machining accuracy, adjusting machining technology and ensuring product quality.

[0051] Furthermore, a tool path for the machining hole is generated according to the hole machining program, and multiple tool nodes are determined according to the tool path for the machining hole and the actual hole diameter. The quality level of the hole machining program is determined according to the multiple tool nodes and the corresponding tool data, which is compatible with the overall consideration of the tool path for the machining hole and the actual hole diameter, and ensures the accuracy of multiple tool nodes.

[0052] At this point, the hole processing program is analyzed in detail. The hole processing program usually contains key information such as the drill's starting position, movement trajectory, feed speed, and rotation speed. CAM (computer-aided manufacturing) software or dedicated processing simulation tools are used to simulate the drill's tool path based on the analyzed program information. This path intuitively shows the movement process of the drill in the processing hole.

[0053] Specifically, suppose there is a machining hole with a diameter of 12mm. Its hole machining program has been determined. Now it is necessary to generate a tool path based on the program, and determine the tool nodes and quality level; parse the hole machining program, which instructs the drill bit to start from the (X0, Y0) position and drill to the (X1, Y1, Z-10) position at a speed of 2000rpm and a feed rate of 0.1mm / rev, where Z-10 indicates a drilling depth of 10mm; use CAM software to simulate and generate a tool path, which shows the drill bit moving in a straight line from the starting point to the drilling position, and then drilling downward along the Z-axis direction to the specified depth.

[0054] On the generated tool path, several key positions are selected as tool nodes. These nodes usually include starting points, turning points, end points, etc., which are crucial for evaluating the machining process. For each tool node, its position coordinates, feed speed, rotation speed and other tool data are recorded. These data are the basis for subsequent evaluation of the machining quality level.

[0055] Specifically, select the starting point (X0, Y0, Z0), the turning point (that is, the point where drilling starts. Since drilling is done directly downward here, the turning point and the starting point coincide with each other on the XY plane, but differ on the Z axis), and the end point (X1, Y1, Z-10) as the tool nodes on the tool path; record the position coordinates, feed rate, rotation speed and other tool data of each node; for example, the starting point data is (X0, Y0, Z0, 2000rpm, 0.1mm / rev); the end point data is (X1, Y1, Z-10, 2000rpm, 0mm / rev. Note that the feed rate is zero at the end point).

[0056] The actual measured aperture data is compared with the node data on the tool path to analyze whether there is any deviation; based on the comparison results, the accuracy and stability of the machining process are evaluated; for example, if the actual aperture deviates slightly from the theoretical aperture, and the tool path data changes smoothly between nodes, it indicates that the machining accuracy and stability are high; based on the evaluation results, combined with the preset quality grade standards (such as grade A, grade B, grade C, etc.), a quality grade is determined for the hole machining program, which reflects the quality status of the machining process.

[0057] Specifically, the actual measured aperture of the processed hole is 11.98mm, which has a small deviation from the theoretical aperture of 12mm; by comparing the tool feed data with the node information, it is found that the feed speed and rotation speed remain stable between each node without abnormal fluctuations; according to the evaluation results, combined with the preset quality grade standards (such as Grade A: aperture deviation ≤±0.05mm, the processing process is smooth; Grade B: aperture deviation ≤±0.1mm, the processing process is basically smooth; Grade C: aperture deviation >±0.1mm or the processing process is unstable), the quality grade of the hole processing program is determined to be Grade A; through the above steps, the tool path is successfully generated according to the hole processing program, the tool feed nodes are determined, and the quality grade of the hole processing program is evaluated. This evaluation result is of great significance for guiding subsequent processing operations, optimizing processing programs and ensuring product quality.

[0058] Therefore, the aperture difference is determined based on the actual aperture and the theoretical aperture, and the first processing grade of the processed hole is determined based on the aperture difference, the quality grade of the hole processing program and the mapping relationship of the processing grade. The aperture difference, the quality grade of the hole processing program and the mapping relationship of the processing grade are fully considered, and the overall consideration of the actual aperture, theoretical aperture and hole processing program is compatible, thereby ensuring the accuracy of the first processing grade of the processed hole.

[0059] At this time, the actual aperture data of the processed hole is obtained from the quality inspection report, and the theoretical aperture data is obtained from the design drawing or processing procedure; the actual aperture is compared with the theoretical aperture, and the aperture difference is calculated. This difference reflects the degree of aperture deviation during the processing process.

[0060] Depends on the hole machining program quality level assessed in the previous step (such as S132); the hole machining program quality level is a comprehensive evaluation result based on the tool path, tool nodes and corresponding tool data; confirming the quality level of the hole machining program, such as A, B or C, will serve as an important factor in the subsequent assessment of the machining level.

[0061] Specifically, suppose there is a machined hole with a theoretical diameter of 15 mm. After quality inspection, the actual diameter is 14.96 mm. Furthermore, based on the evaluation in the previous step ( S132 ), the quality grade of the hole machining program is A. The actual diameter is 14.96 mm; the theoretical diameter is 15 mm; and the diameter difference is 14.96 mm - 15 mm = -0.04 mm (the negative sign indicates that the actual diameter is smaller than the theoretical diameter). Based on the evaluation results in the previous step, the quality grade of the hole machining program is A.

[0062] The first processing level of the processed hole is introduced. At this time, a set of processing level mapping relationships is established in advance. This relationship corresponds the hole diameter difference, the hole processing program quality level and the processing level. This mapping relationship is usually formulated based on industry standards, corporate specifications or historical experience; the first processing level of the processed hole is determined based on the calculated hole diameter difference, the assessed hole processing program quality level, and the established mapping relationship; the assessed processing level is recorded in the quality inspection report and serves as the basis for subsequent processing operations, quality control and process improvement.

[0063] Specifically, assume that there is a set of processing grade mapping relationships as follows: when the aperture difference is within ±0.05mm and the quality grade of the hole processing program is A, it is evaluated as the first processing grade "excellent"; when the aperture difference is within ±0.1mm and the quality grade of the hole processing program is B, it is evaluated as the first processing grade "good"; other cases are evaluated as the first processing grade "qualified" or lower; according to the above mapping relationship, since the aperture difference is -0.04mm (within ±0.05mm) and the quality grade of the hole processing program is A, the first processing grade of the processed hole is evaluated as "excellent"; through the above steps, the first processing grade of the processed hole is successfully determined based on the aperture difference, the quality grade of the hole processing program and the processing grade mapping relationship. This evaluation result is of great significance for guiding subsequent processing operations, quality control and process improvement.

[0064] Specifically, the theoretical aperture is 10 mm, the actual aperture is 9.98 mm, the aperture difference is 9.98 mm - 10 mm = -0.02 mm, and the hole machining program quality level is A. The machining level mapping relationship table is collected, as shown in Table 2: Table 2 Processing level mapping relationship table

[0065] According to the processing grade mapping table, the hole diameter difference is within ±0.05, and the hole processing program quality grade is A, so the processing grade is "excellent".

[0066] refer to Figure 5 In step S14, an image of the inner wall of the processed hole is collected, and the shape of the inner wall of the processed hole is determined according to the image of the inner wall. The shape of the inner wall of the processed hole represents the surface quality of the inner wall. In the specific implementation process of the present invention, the specific steps are: S141: determining a shooting route of the camera relative to the machining hole according to the axis of the machining hole, the actual aperture of the machining hole, and the shooting range of the camera, shooting in an inclined direction and moving in a circular motion along the shooting route to capture multiple internal images of the machining hole; S142: Determining an inner sidewall image of the processed hole based on a synthesis of multiple internal images of the processed hole; and determining multiple sidewall surface features based on recognition of the inner sidewall image. S143: Determine the inner sidewall shape of the processed hole according to the shapes of the multiple sidewall surface features, the spatial positions of the multiple sidewall surface features and the aperture of the processed hole. The inner sidewall shape of the processed hole includes a primary smooth shape, a secondary smooth shape and a tertiary smooth shape.

[0067] In an embodiment of the present application, the shooting route of the camera relative to the machining hole is determined based on the axis of the machining hole, the actual aperture of the machining hole and the shooting range of the camera. The camera shoots in an inclined direction and moves in a circle along the shooting route to collect multiple internal images of the machining hole, which is compatible with the overall consideration of the axis of the machining hole, the actual aperture of the machining hole and the shooting range of the camera, and ensures the accuracy of the shooting route of the camera relative to the machining hole.

[0068] At this time, the axis of the machined hole is the center line of the hole, which is usually determined based on the design drawings or positioning information during the machining process; in actual operation, precision measuring tools (such as laser centering instruments, three-coordinate measuring machines, etc.) are required to accurately measure and mark the position of the axis.

[0069] Use appropriate measuring tools (such as an inside micrometer, inside diameter gauge, optical measuring instrument, etc.) to measure the actual aperture of the machined hole. Ensure that the measurement is accurate, as the aperture size will directly affect the camera's shooting range and shooting route planning. At the same time, the camera's shooting range is determined by factors such as its lens focal length, sensor size, and pixel density. When selecting a camera, ensure that its shooting range can cover the interior of the machined hole, and consider the impact of shooting angle and lighting conditions on image quality.

[0070] Furthermore, the camera's shooting route is planned based on the axis of the processed hole, the actual aperture and the camera's shooting range; the camera should shoot in an inclined direction to better capture the details inside the processed hole; the shooting route should move along a circular path to ensure that multiple images inside the processed hole can be captured and cover the entire inner wall; at the same time, according to the shooting route planning and actual shooting conditions, the camera's focal length, exposure time, white balance and other parameters are adjusted to ensure that the image is clear, the brightness is moderate, and the color is true to facilitate subsequent image processing and feature recognition.

[0071] Specifically, assume there is a machined hole with a defined axis and an actual aperture of 20 mm. An industrial camera with a resolution of 1920x1080 pixels and a lens focal length of 8 mm is selected, with a shooting range of approximately 25 mm in diameter (the actual shooting range may be slightly different due to lens distortion and shooting angle).

[0072] In order to capture multiple images of the interior of the processed hole, a shooting route was planned; the camera started from one side of the processed hole, shot at an angle of approximately 30 degrees, and moved along a circular path; during the shooting process, it was ensured that the camera was always aligned with the axis of the processed hole, and parameters such as focal length and exposure time were adjusted to obtain a clear image.

[0073] Through this shooting route, multiple images of the inside of the machined hole were successfully captured. These images cover the entire inner wall and contain sufficient detailed information for subsequent processing and analysis. These images will be used to synthesize the inner wall image of the machined hole and identify multiple sidewall surface features to further evaluate the quality of the machined hole.

[0074] Furthermore, the inner sidewall image of the processed hole is determined based on the synthesis of multiple internal images of the processed hole; multiple sidewall surface features are determined based on the recognition of the inner sidewall image, multiple sidewall surface features are introduced, and the multiple sidewall surface features are precisely controlled.

[0075] At this point, the multiple internal images collected are aligned; since the camera moves along a circular path, there is a certain amount of overlapping area between each image; image registration technology is used to find these overlapping areas and accurately align the images together; based on the alignment, the multiple images are stitched together into a complete inner wall image, which usually involves image fusion technology to ensure a smooth transition at the stitching point and avoid obvious seams or ghosting; due to the influence of shooting angle and lens distortion, the stitched image needs to be further corrected to restore its true geometric shape and size.

[0076] Specifically, it is assumed that a set of images of the inside of the processed hole have been collected through step S141, which cover the entire inner wall and contain some obvious scratches and pits; in the process of synthesizing the inner wall image, the image registration technology is first used to find the overlapping areas between the images and accurately align them together; then, the image stitching algorithm is used to stitch these images into a complete inner wall image; during the stitching process, special attention is paid to the smooth transition between images to avoid obvious seams.

[0077] Before identifying features, images usually need to be preprocessed, including denoising, contrast enhancement, sharpening and other operations to improve feature visibility and recognition accuracy; image processing algorithms (such as edge detection, texture analysis, morphological processing, etc.) are used to extract features in the image, which include scratches, pits, rust, cracks, etc.; the extracted features are classified and labeled for subsequent analysis and evaluation, which is achieved through machine learning algorithms (such as support vector machines, neural networks, etc.) or rule-based methods.

[0078] Specifically, the stitched images were preprocessed, including denoising and contrast enhancement, to improve the visibility of scratches and pits. Then, an edge detection algorithm was used to extract feature edges in the image, and a morphological processing algorithm was used to further refine and segment the features. The extracted features were classified and labeled. Based on the shape and size of the features, they were divided into two categories: scratches and pits, and marked on the image. These marks will be used for subsequent analysis and evaluation to help understand the quality status of the processed holes. Through this process, not only a complete image of the inner sidewall of the processed hole was obtained, but also multiple sidewall surface features were successfully identified. This information has important guiding significance for the subsequent quality evaluation and improvement of the processed holes.

[0079] Therefore, the inner side wall shape of the processed hole is determined according to the shape of multiple side wall surface features, the spatial positions of multiple side wall surface features and the aperture of the processed hole. The inner side wall shape of the processed hole includes a primary smooth shape, a secondary smooth shape and a tertiary smooth shape, which is compatible with the overall consideration of the shape of multiple side wall surface features, the spatial positions of multiple side wall surface features and the aperture of the processed hole, thereby ensuring the accuracy of the inner side wall shape of the processed hole.

[0080] At this time, the multiple sidewall surface features identified in step S142 are morphologically classified; common feature morphologies include scratches, pits, rust, cracks, etc.; each feature morphology has its own specific shape, size and distribution pattern; in order to more accurately evaluate the impact of the feature on the smoothness of the inner sidewall, the feature morphology is quantified; for example, the length, width and depth of the scratches, the diameter and depth of the pits, etc. are measured.

[0081] On the image of the inner wall of the machined hole, mark the specific location of each feature, which is achieved through a coordinate system or image annotation tools; analyze the spatial distribution of the features on the inner wall; for example, count the number, density, and degree of clustering of features to understand their overall distribution pattern on the inner wall.

[0082] Consider the effect of the aperture size of the machined hole on the inner wall morphology. Generally speaking, the larger the aperture, the easier it is to observe and evaluate the features on the inner wall. However, the smaller the aperture, the higher the resolution and more precise measurement technology are required to capture and quantify the features. Based on the comprehensive information of feature morphology, spatial position and aperture size, the inner wall morphology of the machined hole is evaluated, which usually involves one or more evaluation criteria or indicators, such as smoothness, roughness, number of defects, etc.

[0083] Based on the evaluation results, the inner wall morphology of the machined hole is divided into different levels. In this example, the levels include primary smooth morphology, secondary smooth morphology, and tertiary smooth morphology. Each level corresponds to a different combination of feature morphology, spatial position, and hole size. Each level is described and defined in detail to facilitate subsequent analysis and reporting. For example, primary smooth morphology refers to a situation with almost no visible features or defects on the inner wall; secondary smooth morphology refers to the presence of a small number of tiny or shallow features; and tertiary smooth morphology refers to the presence of obvious or severe features or defects.

[0084] Specifically, it is assumed that multiple sidewall surface features on the inner sidewall of the processed hole, including scratches and pits, have been identified and marked through step S142; now, the inner sidewall morphological grade of the processed hole will be determined based on the morphology, spatial position and aperture size of these features; the scratches and pits are morphologically classified and quantified; scratches usually appear as long and thin lines, while pits appear as circular depressions; the length, width and depth of the scratches, as well as the diameter and depth of the pits are measured, and this information is recorded.

[0085] Next, the specific location of each feature was marked on the inner wall image, and their spatial distribution on the inner wall was analyzed. It was found that the scratches and pits were mainly distributed in the middle and lower areas of the machined hole, and their number was relatively small and the density was low. Considering the aperture size of the machined hole is 20mm, this size is considered large enough to make the features on the inner wall easy to observe and evaluate. Therefore, no adjustment was made to the evaluation results due to the aperture size.

[0086] Finally, the inner wall morphology of the machined hole was evaluated by integrating information on characteristic morphology, spatial position, and aperture size. Since the number of scratches and pits was small and evenly distributed, and no serious defects such as obvious cracks or rust were observed, the inner wall morphology of the machined hole was considered to be a secondary smooth morphology. This evaluation result has important guiding significance for subsequent analysis and improvement of machined hole quality. For example, if the smoothness of the machined hole needs to be further improved, more refined processing technology or stricter quality control measures can be adopted to reduce the number and size of scratches and pits.

[0087] In one embodiment of the present application, an inner sidewall morphology grade matching table is pre-established based on the morphology, spatial position, and aperture size of the sidewall surface features, and different feature combinations are mapped to inner sidewall morphology grades. The inner sidewall morphology grade matching table is shown in Table 3: Table 3. Matching table of inner wall morphology grades

[0088] Assume that there is a machined hole with a diameter of 15 mm. Three slight scratches are observed on the inner wall, which are evenly distributed. According to the inner wall morphology grade matching table, the inner wall morphology of the machined hole is determined to be a first-level smooth morphology.

[0089] refer to Figure 6 In step S15, the quality grade of the processed holes is determined based on the inner sidewall shape of the processed holes and the first processing grade of the processed holes, and the drilling quality distribution map of the printed circuit board is determined according to the quality grade of each processed hole and the position of each processed hole; In the specific implementation process of the present invention, the specific steps are: S151: Determining hole processing requirements of the printed circuit board based on the traceability of the printed circuit board, and determining a first processing quality parameter according to the inner sidewall shape of the processed hole and the hole processing requirements; S152: Determine a second machining quality parameter according to the first machining level of the machined hole and the machining requirements of the hole; determine the quality level of the machined hole based on a mapping relationship among the first machining quality parameter, the second machining quality parameter, and the quality level; S153: Determine the drilling quality information of each processed hole based on the quality grade and position of each processed hole, and present the drilling quality information of each processed hole in the coordinate system corresponding to the printed circuit board to gradually generate a drilling quality distribution map of the printed circuit board. At the same time, determine the quality grade of the printed circuit board based on the quality grade of each processed hole, the processing position of each processed hole and the mapping relationship of the printed circuit board.

[0090] In an embodiment of the present application, the hole processing requirements of the printed circuit board are determined based on the traceability of the printed circuit board, and the first processing quality parameter is determined according to the inner side wall morphology of the processed hole and the hole processing requirements, which is compatible with the overall consideration of the inner side wall morphology of the processed hole and the hole processing requirements, and ensures the accuracy of the first processing quality parameter.

[0091] At this time, collect relevant traceability information of the printed circuit board, which includes but is not limited to design drawings, material specifications, production process flow, customer requirements, etc.; extract specific processing requirements for the holes from the traceability information. These requirements involve the hole diameter, depth, position accuracy, shape tolerance, inner wall roughness, hole wall material removal and other aspects; integrate the extracted requirements together to form a clear and specific list of hole processing requirements, which will serve as the benchmark for subsequent processing and quality assessment.

[0092] Optionally, assume there is a printed circuit board used to manufacture high-precision electronic equipment; extract the following hole processing requirements from the design drawings and material specifications: hole diameter: 0.5mm ± 0.01mm (diameter tolerance is ±0.01mm); hole depth: 1.2mm ± 0.05mm (depth tolerance is ±0.05mm); position accuracy: the deviation from the design position does not exceed 0.02mm; inner wall roughness: Ra ≤ 0.4μm (arithmetic mean roughness does not exceed 0.4 microns).

[0093] The inner wall morphology information of the processed hole is obtained through detection methods (such as microscopic observation and laser scanning). This information includes the roughness, roundness, waviness, etc. of the inner wall. The evaluated inner wall morphology information is compared with the previously extracted hole processing requirements. The purpose of this step is to find out which parameters meet the requirements and which parameters do not meet the standards. Based on the comparison results, the first processing quality parameters are determined. These parameters will directly reflect the quality status of the processed hole and will be used for subsequent quality evaluation and improvement.

[0094] Optionally, after obtaining the inner wall morphology information of the processed hole, it was found that: the actual measured value of the hole diameter was between 0.495mm and 0.505mm, which met the requirement of 0.5mm ± 0.01mm; the actual measured value of the hole depth was between 1.18mm and 1.22mm, which met the requirement of 1.2mm ± 0.05mm; the actual deviation of the position accuracy was 0.015mm, which met the requirement of not more than 0.02mm; however, the actual measured value of the inner wall roughness was Ra = 0.45μm, which slightly exceeded the requirement of Ra ≤ 0.4μm; therefore, the first processing quality parameter determined was: the hole diameter, hole depth, and position accuracy all met the standards, but the inner wall roughness did not meet the standards. This information will be used for subsequent quality analysis and the formulation of improvement measures.

[0095] Furthermore, the second processing quality parameter is determined according to the first processing level of the processed hole and the processing requirements of the hole; the quality level of the processed hole is determined based on the mapping relationship among the first processing quality parameter, the second processing quality parameter and the quality level, which is compatible with the overall consideration of the mapping relationship among the first processing quality parameter, the second processing quality parameter and the quality level, and ensures the accuracy of the quality level of the processed hole.

[0096] At this time, according to the actual situation of the processed holes (such as dimensional accuracy, shape accuracy, surface quality, etc.), they are divided into different processing grades. These grades are usually set based on industry standards, customer requirements or internal corporate standards; looking back at the hole processing requirements determined previously, these requirements involve multiple aspects of the hole, such as dimensional tolerance, position accuracy, inner wall roughness, etc.; at the same time, the second processing quality parameters are introduced, and the second processing quality parameters are determined according to the first processing grade and processing requirements of the processed holes. Combined with the first processing grade and processing requirements, the quality evaluation indicators of the processed holes are further refined to form the second processing quality parameters; the second processing quality parameters include more specific dimensional tolerance range, shape tolerance range, surface quality grade, etc.

[0097] Alternatively, assume there is a printed circuit board with a processed hole. Based on the previous evaluation, the hole is classified as the first processing grade "Grade A", which means its overall processing quality is high. Reviewing the processing requirements, it is found that: the hole diameter requirement is Φ1.0mm ± 0.02mm; the hole position accuracy requirement is ±0.05mm; and the inner wall roughness requirement is Ra ≤ 0.8μm. Based on this information, the second processing quality parameter was determined: the actual measured value of the hole diameter should be between Φ0.98mm and Φ1.02mm; the actual deviation of the hole position accuracy should not exceed ±0.05mm; and the actual measured value of the inner wall roughness should not exceed Ra 0.8μm.

[0098] A set of quality grade mapping relationships is established in advance, and the first processing quality parameters and the second processing quality parameters are corresponded to different quality grades, which include "excellent", "good", "qualified", "unqualified", etc.; the actually measured first processing quality parameters and the second processing quality parameters are compared with the mapping relationship to determine the quality grade of the processed hole.

[0099] Optionally, after actual measurement, it was found that: the actual measured value of the aperture is Φ0.995mm, which meets the requirement of Φ0.98mm to Φ1.02mm; the actual deviation of the hole position accuracy is 0.03mm, which meets the requirement of ±0.05mm; the actual measured value of the inner wall roughness is Ra 0.6μm, which meets the requirement of Ra ≤ 0.8μm.

[0100] According to the pre-established quality grade mapping relationship: if all parameters meet or exceed the requirements, the quality grade of the machined hole is "excellent"; if some parameters deviate slightly but are still acceptable, the quality grade is "good"; if the parameter deviation is large but still within the usage range, the quality grade is "qualified"; if the parameters seriously do not meet the requirements, the quality grade is "unqualified"; therefore, in this example, since all parameters meet or exceed the requirements, the quality grade of the machined hole is judged to be "excellent".

[0101] Therefore, the drilling quality information of each processed hole is determined based on the quality grade and position of each processed hole, and the drilling quality information of each processed hole is presented in the coordinate system corresponding to the printed circuit board, so as to gradually generate the drilling quality distribution map of the printed circuit board. At the same time, the quality grade of the printed circuit board is determined according to the quality grade of each processed hole, the processing position of each processed hole and the mapping relationship of the printed circuit board, and the overall consideration of the inner side wall shape of the processed hole and the first processing grade of the processed hole is introduced to ensure the precise control of the quality grade of the processed hole, thereby ensuring the accuracy of the drilling quality distribution map of the printed circuit board.

[0102] At this point, the quality grade information of all processed holes is summarized. This information usually comes from the previous evaluation step, such as the quality grade determined in S152. The position information of all processed holes on the printed circuit board is integrated. This information usually comes from the design drawings or positioning records during the manufacturing process. Combined with the quality grade and position information, detailed drilling quality information is determined for each processed hole. This information includes key parameters such as quality grade, hole diameter, hole depth, position accuracy, and inner wall roughness.

[0103] Alternatively, assume there is a printed circuit board with 10 processed holes distributed on it. After the previous evaluation steps, the quality level and location information of each hole are obtained as shown below: Hole 1: location (X1, Y1), quality level "excellent"; Hole 2: location (X2, Y2), quality level "good"; ... Hole 10: Position (X10, Y10), quality level "acceptable".

[0104] Based on the design drawings or actual dimensions of the printed circuit board, a two-dimensional or three-dimensional coordinate system is established. This coordinate system will be used to represent the location of the processed holes. The drilling quality information of each processed hole (such as quality grade, key parameters, etc.) is presented in the coordinate system in the form of graphics or text. Usually, different quality grades are represented by different colors or icons for intuitive identification. Based on the presented information, a drilling quality distribution map of the printed circuit board is gradually generated. This map will clearly show the quality status of each processed hole and the overall quality distribution.

[0105] Optionally, use a two-dimensional coordinate system to represent the position of the processing holes on the printed circuit board; in this coordinate system, the X-axis and Y-axis represent the width and length of the printed circuit board respectively; then, draw a mark point for each processing hole, and use different colors to represent it according to its quality level: "Excellent" level is represented by green; "Good" level is represented by yellow; "Qualified" level is represented by orange; (assuming there is also an "Unqualified" level, it is represented by red) Finally, a drilling quality distribution map is generated, which clearly shows the position and quality level of the 10 processing holes.

[0106] Statistics on the quality grade distribution of all processed holes on the printed circuit board will help to understand the overall quality level; analyze the impact of the location of the processed holes on the quality of the printed circuit board; for example, if the quality of holes in key positions is poor, it will have a greater impact on the performance of the printed circuit board; based on the results of comprehensive quality grade statistics and position impact analysis, determine the quality grade of the printed circuit board according to pre-set judgment criteria or rules.

[0107] Optionally, in the example, there are 10 processed holes on the printed circuit board, of which 8 holes have a quality grade of "excellent" and 2 holes have a quality grade of "good"; there are no holes with an "unqualified" grade; considering that the positions of these holes on the printed circuit board are relatively evenly distributed and there are no quality problems with holes in key positions, the quality grade of this printed circuit board is judged to be "excellent"; of course, this judgment standard may be adjusted depending on the actual application scenario.

[0108] In one embodiment of the present application, the quality grade of each processed hole is recorded, such as "excellent", "good", "qualified", or "unqualified". The precise location information of the processed hole on the printed circuit board is integrated, usually expressed as (X, Y) coordinates. A processing hole matching table is collected, and the processing hole matching table is shown in Table 4: Table 4 Processing hole matching table

[0109] Use drawing software (such as Excel, AutoCAD, etc.) to create a coordinate system; mark the location and quality level of each machined hole in the coordinate system based on the data in the matching table; adjust the marking style (such as color and size) to distinguish different quality levels; and finally generate a clear drilling quality distribution map.

[0110] Based on the application scenario and customer needs of the printed circuit board, a weight value is set for each quality grade; for example, the "excellent" grade is set as the highest weight, and the "unqualified" grade is set as the lowest weight; the score of each processed hole is calculated based on its quality grade and corresponding weight value; then, the scores of all processed holes are added together to obtain the total score of the printed circuit board; the quality grade of the printed circuit board is determined based on the total score and pre-set judgment criteria (such as the correspondence between the score range and the quality grade).

[0111] At this time, assuming there are 5 machined holes, the score calculation table is shown in Table 5: Table 5 Score calculation table

[0112] Total score calculation: 4 + 3 + 2 + 4 + 3 = 16; assuming the judgment criteria are: total score ≥ 15, quality grade is "A"; 10 ≤ total score < 15, quality grade is "B"; total score < 10, quality grade is "C"; based on the calculated total score of 16, the quality grade of this printed circuit board is determined to be "A"; this method comprehensively considers the quality grade and position information of each processed hole, as well as the overall quality level of the printed circuit board, so as to more accurately determine the quality grade of the printed circuit board.

[0113] See also Figure 7 , Figure 7 Schematic diagram of the structure of the printed circuit board drilling quality control system in an embodiment of the present invention; the printed circuit board drilling quality control system includes: Position module 21, used to determine the position of each processing hole based on the surface image of the printed circuit board and previous drilling information; The traceability module 22 is used to determine the theoretical hole diameter and hole processing program based on the traceability of the position of each processing hole, and each processing hole corresponds to a hole processing program; A machining quality grade module 23 is configured to determine the actual hole diameter based on the hole diameter detection of each machined hole during the quality detection of each machined hole, and determine the first machining grade of the machined hole according to the actual hole diameter, the theoretical hole diameter and the hole machining program; An acquisition module 24 is configured to acquire an image of the inner wall of the machined hole and determine the inner wall morphology of the machined hole based on the inner wall image. The inner wall morphology of the machined hole represents the surface quality of the inner wall. The drilling quality distribution diagram module 25 is used to determine the quality level of the processed holes based on the inner sidewall shape of the processed holes and the first processing level of the processed holes, and to determine the drilling quality distribution diagram of the printed circuit board according to the quality level of each processed hole and the position of each processed hole.

[0114] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

Claims

1. A printed circuit board drilling quality control method, characterized in that: include: Determine the location of each processing hole based on the surface image of the printed circuit board and previous drilling information; The theoretical hole diameter and hole processing program are determined based on the traceability of the position of each processing hole. Each processing hole corresponds to a hole processing program. In the quality inspection of each processed hole, the actual hole diameter is determined based on the hole diameter inspection of the processed hole, and the first processing grade of the processed hole is determined according to the actual hole diameter, the theoretical hole diameter and the hole processing program; An image of the inner wall of the processed hole is collected, and the inner wall shape of the processed hole is determined based on the inner wall image. The inner wall shape of the processed hole represents the surface quality of the inner wall. The quality grade of the processed holes is determined based on the inner sidewall shape of the processed holes and the first processing grade of the processed holes, and the drilling quality distribution map of the printed circuit board is determined according to the quality grade of each processed hole and the position of each processed hole.

2. The printed circuit board drilling quality control method according to claim 1, characterized in that: The method of determining the position of each processing hole according to the surface image of the printed circuit board and the previous drilling information includes: After the printed circuit board is cleaned, it is transferred to the bottom of the camera. The camera captures the surface image of the printed circuit board and identifies the hole positions in the surface image of the printed circuit board to determine the number of processing holes. Constructing a corresponding coordinate system for the printed circuit board, marking the coordinates of multiple processing holes in the coordinate system, and generating the actual coordinates of the multiple processing holes, and determining the corresponding previous drilling information based on the actual coordinates of the multiple processing holes and the printed circuit board processing database; The working coordinates of the plurality of processing holes are determined based on the analysis of the previous drilling information. If the working coordinates of the plurality of processing holes coincide with the actual coordinates of the plurality of processing holes, the positions of the respective processing holes are determined.

3. The printed circuit board drilling quality control method according to claim 1, characterized in that: The theoretical hole diameter and hole processing program are determined based on the traceability of the positions of the various processed holes. Each processed hole corresponds to a hole processing program, including: The positions of each processing hole are collected, and the corresponding hole processing program is determined based on the matching of the positions of each processing hole and the processing database of the printed circuit board. At this time, the processing process of each processing hole is presented based on the corresponding hole processing program; The hole machining program is analyzed, and the tool feed data of each machining hole during the hole machining process is determined based on the analysis of the hole machining program. The theoretical hole diameter is determined based on the traversal of the tool feed data. At this time, the hole machining program is further controlled, and the machining quality of the machining hole is controlled based on the dimensions of the hole machining program. At the same time, the tool feed data presents the hole machining process of the machining hole.

4. The printed circuit board drilling quality control method according to claim 1, characterized in that: In the quality inspection of each processed hole, the actual hole diameter is determined based on the hole diameter inspection of the processed hole, and the first processing grade of the processed hole is determined according to the actual hole diameter, the theoretical hole diameter and the hole processing program, including: The quality of each processed hole is inspected, and the corresponding actual hole diameter is determined based on the hole diameter detection of the processed hole by the hole detection tool. At this time, the hole detection tool serves as a measuring tool dedicated to detecting the processed holes and can measure the hole diameter along the inner side of the processed hole.

5. The printed circuit board drilling quality control method according to claim 4, characterized in that: In the quality inspection of each processed hole, the actual hole diameter is determined based on the hole diameter inspection of the processed hole, and the first processing grade of the processed hole is determined according to the actual hole diameter, the theoretical hole diameter and the hole processing program, further comprising: Generate the tool path of the processing hole according to the hole processing program, determine multiple tool nodes according to the tool path of the processing hole and the actual hole diameter, and determine the quality level of the hole processing program according to the multiple tool nodes and the corresponding tool data. The aperture difference is determined according to the actual aperture and the theoretical aperture, and the first machining grade of the machined hole is determined according to the aperture difference, the quality grade of the hole machining program and the mapping relationship of the machining grades.

6. The printed circuit board drilling quality control method according to claim 1, characterized in that: The collecting of the inner wall image of the processed hole and determining the inner wall shape of the processed hole according to the inner wall image, wherein the inner wall shape of the processed hole presents the surface quality of the inner wall, comprises: The shooting route of the camera relative to the processing hole is determined according to the axis of the processing hole, the actual aperture of the processing hole and the shooting range of the camera. The camera shoots in an inclined direction and moves in a circle along the shooting route to collect multiple internal images of the processing hole.

7. The printed circuit board drilling quality control method according to claim 6, characterized in that: The collecting of the inner wall image of the processed hole and determining the inner wall shape of the processed hole according to the inner wall image, wherein the inner wall shape of the processed hole represents the surface quality of the inner wall, further comprises: Determining an inner sidewall image of the processed hole based on a synthesis of multiple internal images of the processed hole; determining multiple sidewall surface features based on recognition of the inner sidewall image; The inner sidewall shape of the processed hole is determined according to the shapes of multiple sidewall surface features, the spatial positions of multiple sidewall surface features and the aperture of the processed hole. The inner sidewall shape of the processed hole includes a primary smooth shape, a secondary smooth shape and a tertiary smooth shape.

8. The printed circuit board drilling quality control method according to claim 1, characterized in that: The method of determining the quality grade of the processed holes based on the inner sidewall shape of the processed holes and the first processing grade of the processed holes, and determining the drilling quality distribution map of the printed circuit board according to the quality grade of each processed hole and the position of each processed hole, includes: Determining hole processing requirements of the printed circuit board based on traceability of the printed circuit board, and determining a first processing quality parameter based on the inner sidewall shape of the processed hole and the hole processing requirements; The second machining quality parameter is determined according to the first machining level of the machined hole and the machining requirements of the hole; and the quality level of the machined hole is determined based on the mapping relationship among the first machining quality parameter, the second machining quality parameter and the quality level.

9. The printed circuit board drilling quality control method according to claim 8, characterized in that: The method further includes determining the quality grade of the processed holes based on the inner sidewall shape of the processed holes and the first processing grade of the processed holes, and determining the drilling quality distribution map of the printed circuit board according to the quality grade of each processed hole and the position of each processed hole. Based on the quality grade and position of each processed hole, the drilling quality information of each processed hole is determined, and the drilling quality information of each processed hole is presented in the coordinate system corresponding to the printed circuit board to gradually generate a drilling quality distribution map of the printed circuit board. At the same time, the quality grade of the printed circuit board is determined according to the mapping relationship between the quality grade of each processed hole, the processing position of each processed hole and the printed circuit board.

10. A printed circuit board drilling quality control system, characterized in that: The printed circuit board drilling quality control system is applied to the printed circuit board drilling quality control method according to any one of claims 1 to 9, and the printed circuit board drilling quality control system includes: Position module, used to determine the position of each processing hole based on the surface image of the printed circuit board and previous drilling information; The traceability module is used to determine the theoretical hole diameter and hole processing program based on the traceability of the position of each processing hole. Each processing hole corresponds to a hole processing program. A machining quality grade module is used to determine the actual hole diameter based on the hole diameter detection of each machined hole in the quality inspection of each machined hole, and to determine the first machining grade of the machined hole according to the actual hole diameter, the theoretical hole diameter and the hole machining program; an acquisition module, for acquiring an image of the inner wall of the machined hole, and determining a shape of the inner wall of the machined hole according to the image of the inner wall, wherein the shape of the inner wall of the machined hole represents a surface quality of the inner wall; The drilling quality distribution map module is used to determine the quality level of the processed holes based on the inner side wall shape of the processed holes and the first processing level of the processed holes, and to determine the drilling quality distribution map of the printed circuit board according to the quality level of each processed hole and the position of each processed hole.

Images