Bonding head, bonding device, bonding method and storage medium

Abstract

The invention provides a bonding head, a bonding device, a bonding method and a storage medium. The bonding head comprises a transmission mechanism, an elastic mechanism and a measuring mechanism. The elastic mechanism comprises an elastic unit and an adsorption unit which are connected with each other, the elastic unit is used for driving the adsorption unit to generate displacement under pressure, and the adsorption unit is used for adsorbing the substrate and driving the substrate to generate displacement; the transmission mechanism can transmit the pressure to the elastic unit and can collect the magnitude of the force; the measuring mechanism comprises a first displacement sensor and a second displacement sensor, the first displacement sensor is used for collecting displacement data of the substrate in the direction perpendicular to the thickness direction of the substrate, and the second displacement sensor is used for collecting displacement data of the substrate in the thickness direction of the substrate. According to the scheme, the resultant force can be accurately controlled, and the upper substrate, the lower substrate and the motion table are prevented from being damaged due to overlarge applied force, so that the bonding quality is improved; and meanwhile, the displacement deviation of the bonding head can be accurately detected and compensated, so that high-precision bonding is carried out.

Description

Technical Field

[0001] The present application relates to the field of semiconductor packaging technology, and in particular to a bonding head, a bonding device, a bonding method and a storage medium. Background Art

[0002] With the development of semiconductor technology, the chip packaging process has placed increasingly higher demands on the accuracy of chip bonding. During the chip packaging process, a transmission mechanism is often required to drive the entire bonding head to move in the vertical direction in order to achieve bonding between the upper substrate adsorbed by the upper bonding head and the lower substrate supported by the lower moving table. During the bonding operation, the displacement accuracy of the bonding head greatly affects the bonding accuracy. In addition, both chips and silicon wafers are fragile, and in practice, it is impossible to well identify and control the magnitude of the applied bonding force, resulting in damage to the chips and silicon wafers, and even damage to the moving table, thereby affecting the bonding yield. Therefore, how to improve bonding accuracy and bonding yield is a technical problem that needs to be solved urgently. Summary of the Invention

[0003] The embodiments of the present application provide a bonding head, a bonding device, a bonding method and a storage medium, which can accurately control the bonding force and can detect and compensate for the displacement deviation of the bonding head with high precision, thereby improving the bonding accuracy and yield.

[0004] In a first aspect, the present application provides a bonding head, comprising:

[0005] The elastic mechanism includes an elastic unit and an adsorption unit connected to each other, wherein the elastic unit is used to drive the adsorption unit to generate displacement when subjected to pressure, and the adsorption unit is used to adsorb the substrate and drive the substrate to generate displacement;

[0006] The transmission mechanism includes a motor, a first transmission unit, and a second transmission unit, wherein the first transmission unit is connected to the motor and the second transmission unit respectively, and the motor drives the first transmission unit to drive the second transmission unit. The second transmission unit transmits pressure to the elastic unit, so that the elastic unit drives the adsorption unit to generate displacement; the second transmission unit includes a force sensor, which is used to detect the force applied to the substrate;

[0007] The measuring mechanism includes a first displacement sensor and a second displacement sensor, wherein the first displacement sensor is used to collect displacement data of the substrate in a direction perpendicular to its thickness, and the second displacement sensor is used to collect displacement data of the substrate in the thickness direction.

[0008] Furthermore, the second transmission unit also includes a bracket and a pressure head; the bracket is connected to the first transmission unit and the force sensor respectively; the pressure head is connected to the force sensor and the elastic unit respectively; the force sensor is located between the bracket and the pressure head; the pressure head has a hemispherical structure on the side close to the elastic unit, and the hemispherical structure abuts against the elastic unit.

[0009] Furthermore, the elastic unit includes a connecting unit and an elastic member; the adsorption unit is connected to the elastic member via the connecting unit.

[0010] Furthermore, when there are multiple elastic parts, the connecting unit includes multiple connecting parts and multiple support plates; the support plates are hollow structures; each support plate is located on one side of each elastic part close to the adsorption unit and supports the elastic part; multiple elastic parts are connected and fixed to the connecting unit along the thickness direction of the substrate; the number of support plates corresponds to the number of elastic parts.

[0011] Furthermore, when the number of the elastic members is one, the connecting unit includes a plurality of connecting members and a support plate; the support plate is a hollow structure; the support plate is located on the side of the elastic member close to the adsorption unit and supports the elastic member; the elastic member is connected and fixed to the connecting unit along the thickness direction of the substrate.

[0012] Furthermore, the elastic member includes an elastic member body and a plurality of elastic arms; the plurality of elastic arms are distributed in a diagonal symmetrical manner or in a regular cross symmetrical manner; and the plurality of elastic arms are connected to the inner edge of the elastic member body.

[0013] Furthermore, an arch structure is provided on the elastic arm.

[0014] Furthermore, the adsorption unit includes a suction cup adapter plate and a suction cup, one side of the suction cup adapter plate is connected to the elastic unit, and the other side is connected to the suction cup; the first displacement sensor is used to detect the displacement of the adsorption unit in a direction perpendicular to the thickness of the substrate.

[0015] Furthermore, the second displacement sensor is fixedly mounted on the second transmission unit; the second displacement sensor includes a grating scale body and a grating scale reading head, and is used to detect the displacement of the adsorption unit in the thickness direction of the substrate.

[0016] In a second aspect, the present application provides a bonding device, comprising:

[0017] The bonding head as described in any of the above embodiments is used to absorb the upper substrate and drive the upper substrate to move;

[0018] A moving platform, used for carrying the lower substrate and driving the lower substrate to move;

[0019] A control module is used to control the bonding head and the motion stage.

[0020] In a third aspect, the present application proposes a bonding method, comprising the following steps:

[0021] driving the bonding head in the bonding device to move along the thickness direction of the upper substrate;

[0022] Acquiring displacement data of the upper substrate in a direction perpendicular to its thickness, displacement data of the upper substrate in its thickness direction, and bonding force data;

[0023] Adjusting the movement of the bonding head and the motion stage and the magnitude of the bonding force until bonding conditions are met according to the acquired displacement data of the upper substrate in a direction perpendicular to the thickness thereof, the displacement data of the upper substrate in the thickness thereof, and the bonding force data;

[0024] Bonding of the upper substrate to the lower substrate is performed.

[0025] In a fourth aspect, the present application proposes a storage medium on which computer instructions are stored, and when the instructions are executed by a processor, the steps of the above-mentioned bonding method are implemented.

[0026] The present application can achieve the following beneficial effects: through the bonding head proposed in the embodiment of the present application, the vertical displacement deviation caused by the backlash between the external thread of the screw and the internal thread of the transmission nut in the structure of the first transmission unit itself can be accurately detected and compensated. At the same time, the horizontal displacement caused by the gap between the linear guide and the slider in the structure of the first transmission unit itself when the bonding head is displaced in the vertical direction can be detected and compensated with high precision. In addition, through the force sensor in the transmission mechanism, the magnitude of the bonding force can be accurately controlled, thereby avoiding excessive pressure and damaging the upper and lower substrates, the suction cup or the lower moving table, thereby improving the bonding quality. Therefore, through the bonding head proposed in the embodiment of the present application, high-precision bonding of the upper and lower substrates can be achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] To more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present application. Those skilled in the art can also derive other drawings based on these drawings without inventive effort.

[0028] In order to more completely understand the present application and its beneficial effects, the following description will be given in conjunction with the accompanying drawings, wherein the same drawing numbers represent the same parts in the following description.

[0029] Figure 1 A schematic front view of the structure of a bonding head provided in an embodiment of the present application;

[0030] Figure 2 A schematic side view of a bonding head provided in an embodiment of the present application;

[0031] Figure 3 A cross-sectional view of a first embodiment of the elastic unit provided in this application;

[0032] Figure 4 A cross-sectional view of a second embodiment of the elastic unit provided in this application;

[0033] Figure 5 A schematic structural diagram of a first embodiment of the elastic member provided in this application;

[0034] Figure 6 A schematic structural diagram of a second embodiment of the elastic member provided in this application;

[0035] Figure 7 This is a schematic structural diagram of a third embodiment of the elastic member provided in this application;

[0036] Figure 8 A schematic flow chart of a bonding method provided in an embodiment of the present application.

[0037] Description of reference numerals:

[0038] 100-transmission mechanism; 1-motor; 2-first transmission unit; 21-linear guide; 22-slider; 23-ball screw; 3-second transmission unit; 31-bracket; 32-force sensor; 33-pressing head; 331-hemispherical structure;

[0039] 200-elastic mechanism; 4-elastic unit; 41-connecting unit; 411-first connecting member; 412-second connecting member; 413-third connecting member; 414-first supporting plate; 415-second supporting plate; 42-elastic member; 421-elastic member body; 422-elastic arm; 423-through hole; 424-arch structure; 5-adsorption unit; 51-suction cup adapter plate; 52-suction cup; 6-support outer frame;

[0040] 300- measuring mechanism; 7- first displacement sensor; 8- second displacement sensor; 81- grating scale body; 82- grating scale reading head. DETAILED DESCRIPTION

[0041] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0042] In the description of this application, it should be noted that, unless otherwise specified or limited, the term "and / or" herein is merely a description of an association relationship between associated objects, indicating that three possible relationships exist. For example, "A and / or B" can represent: A exists alone, A and B exist simultaneously, and B exists alone. Furthermore, the character " / " herein, unless otherwise specified, generally indicates that the associated objects are in an "or" relationship.

[0043] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply the existence of any such actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or device comprising the element.

[0044] The following describes a bonding head, a bonding device, a bonding method and a storage medium provided by the present application in conjunction with the accompanying drawings.

[0045] See Figure 1 As shown, the embodiment of the present application provides a bonding head including: a transmission mechanism 100 , an elastic mechanism 200 and a measuring mechanism 300 .

[0046] The transmission mechanism 100 includes a motor 1, a first transmission unit 2, and a second transmission unit 3. The motor 1 is connected to the first transmission unit 2, which is in turn connected to the second transmission unit 3. The first transmission unit 2 is located between the motor 1 and the second transmission unit 3. The second transmission unit 3 includes a force sensor 32, which can measure the bonding force during the substrate bonding process in real time.

[0047] The elastic mechanism 200 includes an elastic unit 4 and an adsorption unit 5 connected to each other. The elastic unit 4 is used to drive the adsorption unit 5 to generate displacement when subjected to pressure, and the adsorption unit 5 is used to adsorb the substrate and drive the substrate to generate displacement.

[0048] The measuring mechanism 300 includes a first displacement sensor 7 and a second displacement sensor 8. The first displacement sensor 7 is used to collect displacement data of the substrate in a direction perpendicular to the thickness of the substrate (i.e., the horizontal direction, which in this application includes the X and Y directions). The second displacement sensor 8 is used to collect displacement data of the substrate in the direction of the thickness of the substrate (i.e., the vertical direction, which in this application refers to the Z direction; the X, Y, and Z directions are mutually perpendicular).

[0049] In some embodiments, motor 1 drives first transmission unit 2, which in turn drives second transmission unit 3. Second transmission unit 3 transmits pressure to elastic unit 4, causing elastic unit 4 to drive adsorption unit 5 to displace. It should be noted that adsorption unit 5 adsorbs the substrate, so the displacement of adsorption unit 5 is considered representative of the displacement of the substrate.

[0050] In some embodiments, a control module and a motion stage for supporting and moving the other substrate (the lower substrate) are provided independently of the bond head structure. The control module is in communication with the transmission mechanism 100, the elastic mechanism 200, the measurement mechanism 300, and the motion stage in the bond head.

[0051] In some embodiments, in the process of gradually moving the bonding head closer to the moving table in the vertical direction until the bonding operation is completed, since there is an unremovable gap in the structure of the first transmission unit 2 in the transmission mechanism 100 itself, when the transmission mechanism 100 drives the substrate to move in the vertical direction, on the one hand, it causes inaccurate vertical displacement, and on the other hand, it inevitably causes horizontal deviation, resulting in inaccurate bonding position between the substrate adsorbed by the bonding head (upper substrate) and the other substrate (lower substrate) placed on the moving table, affecting the bonding accuracy. Since the bonding accuracy is related to the circuit conductivity between the two substrates, the bonding accuracy directly affects the final bonding yield and bonding quality.

[0052] To address the aforementioned technical issues, in an embodiment of the present application, a first displacement sensor 7 detects the horizontal displacement data of the substrate and transmits it to a control module. The control module generates a control instruction based on the displacement data and transmits the control instruction to a motion stage. The motion stage executes the control instruction to control its own movement, thereby driving the lower substrate to move, thereby compensating for horizontal positional offsets. This allows the upper substrate to be precisely aligned with the lower substrate or the area to be bonded within the lower substrate, ensuring bonding accuracy. Specifically, two first displacement sensors 7 are provided, one for collecting displacement data of the substrate in the X direction, and the other for collecting displacement data of the substrate in the Y direction. For example, if the first displacement sensor 7 detects a displacement data of 0.05 mm in the X direction, the control instruction will cause the motion stage to move 0.05 mm in the X direction. For another example, if the first displacement sensor 7 detects a displacement data of 0.04 mm in the Y direction, the control instruction will cause the motion stage to move 0.04 mm in the Y direction. Furthermore, depending on specific needs, only one first displacement sensor 7 may be used.

[0053] In the embodiment of the present application, the second displacement sensor 8 is used to collect vertical displacement data of the substrate and transmit this displacement data to the control module. Based on this displacement data, the control module can compensate for the vertical displacement deviation of the transmission mechanism 100. If the displacement data is less than the preset displacement, the transmission mechanism 100 can be controlled to further move the bond head downward in the vertical direction until the preset displacement is met, and vice versa. By providing the second displacement sensor 8, the transmission mechanism 100 accurately completes the preset displacement and drives the substrate to accurately complete the preset displacement, thereby achieving precise bonding control and ensuring bonding accuracy.

[0054] In some embodiments, the force sensor 32 in the second transmission unit 3 can collect the bond force during the bonding process in real time and send the bond force data to the control module. The control module adjusts the vertical force of the transmission mechanism 100 according to the bond force, thereby accurately controlling the bond force, preventing damage to the upper substrate, lower substrate, or motion stage due to excessive bond force, and preventing failure of the bonding operation due to insufficient bond force. The provision of a force sensor improves the bonding yield and bonding quality.

[0055] Based on the above embodiments, the bonding head of the present application can accurately control the magnitude of the bonding force; at the same time, it can eliminate the influence caused by the gap in the structure of the first transmission unit 2 itself in the transmission mechanism 100, and can timely detect and compensate for the displacement deviation in the vertical direction and the offset in the horizontal direction of the bonding head, thereby greatly improving the substrate bonding accuracy and bonding quality.

[0056] In some embodiments, see Figure 1 and Figure 2 As shown, the first transmission unit 2 includes a ball screw 23 and a linear guide assembly, and the linear guide assembly includes a linear guide 21 and a slider 22.

[0057] The second transmission unit 3 further includes a bracket 31 and a pressure head 33. The slider 22 of the first transmission unit 2 is connected to the bracket 31, which is connected to a force sensor 32, which is connected to the pressure head 33, which is connected to the elastic unit 4. The force sensor 32 is located between the bracket 31 and the pressure head 33.

[0058] Motor 1 is used to generate power to drive the ball screw 23, linear guide assembly, bracket 31, force sensor 32, and indenter 33 of the first transmission unit 2 in the vertical direction. In the embodiment of the present application, motor 1 can be a servo motor or a stepper motor. An encoder is installed within motor 1, which, together with the vertically mounted second displacement sensor 8, forms a closed-loop control system to ensure the vertical displacement accuracy of the adsorption unit 5 and the substrate.

[0059] It should be noted that, in actual working conditions, there is an unremovable backlash between the external thread of the ball screw 23 in the first transmission unit 2 and the internal thread of the transmission nut (not shown), which causes an error (or deviation) between the actual displacement of the substrate in the vertical direction and the preset displacement. Based on this, the present application adjusts the displacement of the transmission mechanism 100 in the vertical direction according to the displacement data of the substrate in the vertical direction collected by the second displacement sensor 8 to compensate for the position deviation of the substrate in the vertical direction. Specifically, the second displacement sensor 8 includes a grating ruler body 81 and a grating ruler reading head 82. The grating ruler body 81 is mounted on the bracket 31 of the second transmission unit 3 in the transmission mechanism 100. The encoder of the motor 1, the grating ruler body 81, and the grating ruler reading head 82 form a closed-loop control system, which collects the displacement data of the second transmission unit 3 in the vertical direction in real time as the displacement data of the substrate in the vertical direction, and then can perform high-precision detection and compensation for the displacement of the substrate in the vertical direction, thereby ensuring the displacement accuracy of the substrate in the vertical direction.

[0060] Furthermore, in actual working conditions, due to the unremovable gap between the linear guide rail 21 and the slider 22 in the first transmission unit 2, the transmission mechanism 100 inevitably causes the substrate to move in the horizontal direction when driving the substrate to move in the vertical direction. Based on this, the present application can promptly detect the horizontal displacement of the substrate based on the horizontal displacement offset data of the substrate collected by the first displacement sensor 7, thereby accurately compensating for the horizontal displacement offset of the upper substrate by adjusting the position of the motion stage (and the lower substrate on the motion stage).

[0061] In some embodiments, see Figure 1 、 Figure 2 As shown, the bonding head further includes a supporting outer frame 6 , which supports the transmission mechanism 100 , the elastic mechanism 200 , and the measuring mechanism 300 in the bonding head.

[0062] In some embodiments, see Figure 3 As shown, the pressure head 33 is formed with a hemispherical structure 331 on one side close to the elastic unit 4, and the hemispherical structure 331 abuts against the elastic unit 4. The pressure is transmitted to the elastic unit 4 via the hemispherical structure 331 of the pressure head 33, so that the elastic unit 4 produces elastic deformation in the vertical direction, driving the adsorption unit 5 (and the substrate) to produce displacement in the vertical direction. Through the synergistic effect of the hemispherical structure 331 and the elastic unit 4 below it, on the one hand, the transmission effect can be prevented from being stuck, and on the other hand, the pressure distribution on the contact surface of the two can be made more uniform, which helps to reduce local stress concentration and reduce the risk of damage to the substrate. Furthermore, due to the symmetrical characteristics of the hemispherical structure 331, it is beneficial for the substrate to remain horizontal during the vertical movement.

[0063] In some embodiments, see Figure 3 As shown ( Figure 3 (The suction unit 5 is not shown.) The elastic unit 4 includes a connecting unit 41 and an elastic member 42. The suction unit 5 is connected to the elastic member 42 via the connecting unit 41. The number of elastic members 42 can be single or multiple. The connecting unit 41 and the elastic member 42 can be connected and fixed by fasteners (e.g., screws).

[0064] Among them, see Figure 3As shown, when there are two elastic members 42, the structure of the elastic unit 4 is as follows. The two elastic members 42 are arranged vertically relative to each other. The connecting members in the connecting unit 41 include a first connecting member 411, a second connecting member 412, and a third connecting member 413. The support plate in the connecting unit 41 includes a first support plate 414 and a second support plate 415. The first connecting member 411 is vertically connected to the hemispherical structure 331 of the pressure head 33 and the elastic member 42 farther from the adsorption unit 5 (i.e., the elastic member 42 located above). The third connecting member 413 is vertically connected to the elastic member 42 closer to the adsorption unit 5 (i.e., the elastic member 42 located below) and the adsorption unit 5. The second connecting member 412 is disposed between the two elastic members 42 and is connected to the two elastic members 42. The first support plate 414 and the second support plate 415 are hollow structures. The first support plate 414 is used to support the upper elastic member 42, and the second support plate 415 is used to support the lower elastic member 42. The number of support plates corresponds to the number of elastic members 42. By providing two elastic members 42, the pressure transmitted from above can be distributed more evenly. On the one hand, this reduces the risk of a single elastic member 42 being damaged by excessive stress, thereby improving the stability of the bond head. On the other hand, it makes the force applied to the substrate surface more uniform, thereby improving the bonding quality. In addition, by providing two elastic members 42, the overall rigidity of the elastic members can be increased, reducing the possibility of the substrate shifting horizontally due to vertical movement. Furthermore, the two elastic members 42 can have different stiffnesses. By combining elastic members 42 with different stiffnesses, a wider elastic range can be achieved to meet different mechanical requirements. In addition, it is understood that the number of elastic members is not limited to this and can be specifically selected according to actual needs.

[0065] In some embodiments, see Figure 4 As shown ( Figure 4 (The adsorption unit 5 is not shown.) When the number of elastic members 42 is one, the structure of the elastic unit 4 is as follows. The connecting members in the connecting unit 41 include a first connecting member 411 and a third connecting member 413. The support plate in the connecting unit 41 includes a first support plate 414. The first support plate 414 is a hollow structure. The first connecting member 411 is vertically connected to the hemispherical structure 331 of the pressure head 33 and the elastic member 42. The third connecting member 413 is vertically connected to the elastic member 42 and the adsorption unit 5. By providing a single elastic member 42, the volume of the bonding head can be reduced.

[0066] In some embodiments, see Figure 5As shown, the elastic member 42 includes an elastic member body 421 and a plurality of elastic arms 422, and the plurality of elastic arms 422 are connected to the inner edge of the elastic member body 421. The plurality of elastic arms 422 are symmetrically distributed along the diagonal line, and the intersection of the plurality of elastic arms 422 converges at the geometric center of the elastic member 42, which is also the intersection of the diagonals. At this time, the length of each elastic arm is longer, so that the force required to deform it is relatively reduced, which is conducive to the bonding action. At the same time, the plurality of elastic arms 422 are symmetrically distributed, so that the force on the surface of the elastic member 42 is more uniform, thereby making the force transmitted to the substrate more uniform. The elastic arm 422 is subjected to the pressure of the pressure head 33 and produces elastic deformation in the vertical direction. A through hole 423 is provided at the center of the elastic member 42, which is fixed to the connecting unit 41 via the through hole 423.

[0067] In some embodiments, see Figure 6 As shown, the elastic member 42 includes an elastic member body 421 and a plurality of elastic arms 422, which are connected to the inner edge of the elastic member body 421. The plurality of elastic arms 422 are distributed in a right cross-symmetrical pattern, and the intersection of the plurality of elastic arms 422 converges at the geometric center of the elastic member 42, which is also the intersection of the cross. The advantage of this type of elastic member is that the manufacturing process is simple and easy to process. In this embodiment, the elastic member 42 also has a through hole (omitted from the figure) for fixed connection with the connecting unit, which will not be described in detail here.

[0068] In some embodiments, see Figure 7 As shown, based on the second embodiment of the elastic member described above, an arch structure 424 is provided on the elastic arm 422. By providing the arch structure 424, the length of the elastic arm 422 is increased while the overall size of the elastic member 42 remains unchanged, thereby enhancing the elastic force of the elastic arm 422, thereby being able to drive the substrate to move over a wider range, which is beneficial for bonding. In this embodiment, the elastic member 42 also has a through hole (omitted from the figure) for fixed connection with the connecting unit, which will not be described in detail here. It should be noted that, based on the first embodiment of the elastic member described above, an arch structure can also be provided on its elastic arm.

[0069] In some embodiments, see Figure 1 As shown, the suction unit 5 includes a suction cup adapter plate 51 and a suction cup 52. The suction cup adapter plate 51 is connected to the third connecting member 413 and is located below the third connecting member 413. The suction cup adapter plate 51 is used to drive the suction cup 52 to move, and the suction cup 52 is used to adsorb the substrate and drive the substrate to move.

[0070] In some embodiments, see Figure 1As shown, the first displacement sensor 7 is arranged around the suction cup adapter plate 51 through a bracket plate (not shown) to collect the displacement data of the suction cup adapter plate 51 in the horizontal direction as the displacement data of the substrate in the horizontal direction.

[0071] In the embodiments of the present application, the upper and lower substrates may be chips and wafers, respectively, but it should be noted that the lower substrate may also be a chip or a PCB. In addition, the embodiments of the present application are not limited to the accompanying drawings, and also include combinations of the above embodiments.

[0072] The present application provides a bonding device, comprising:

[0073] The bonding head as described in any of the above embodiments is used to absorb the upper substrate and drive the upper substrate to move;

[0074] A moving platform, used for carrying the lower substrate and driving the lower substrate to move;

[0075] The control module is used to control the movement of the bonding head and the motion stage.

[0076] This application embodiment proposes a bonding method, see Figure 8 As shown, including:

[0077] S101: driving the bonding head in the above-mentioned bonding device to move along the thickness direction of the upper substrate;

[0078] S102: Acquire displacement data of the upper substrate in a direction perpendicular to its thickness, displacement data of the upper substrate in its thickness direction, and bonding force data;

[0079] S103: adjusting the movement of the bonding head and the motion stage and the magnitude of the bonding force according to the acquired displacement data of the upper substrate in a direction perpendicular to the thickness thereof, the displacement data of the upper substrate in the thickness thereof, and the bonding force data until bonding requirements are met;

[0080] S104: Bonding the upper substrate and the lower substrate.

[0081] An embodiment of the present application provides a storage medium on which computer instructions are stored. When the instructions are executed by a processor, the steps described in the above-mentioned bonding method are implemented.

[0082] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0083] The embodiments, implementation methods and related technical features of the present application can be combined and replaced with each other without conflict.

[0084] The above are merely preferred embodiments of the present application and do not constitute any form of limitation to the present application. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present application without departing from the content of the technical solution of the present application are still within the scope of the technical solution of the present application.

Claims

1. A bonding head, characterized in that: include: The elastic mechanism includes an elastic unit and an adsorption unit connected to each other, wherein the elastic unit is used to drive the adsorption unit to generate displacement when subjected to pressure, and the adsorption unit is used to adsorb the substrate and drive the substrate to generate displacement; The transmission mechanism includes a motor, a first transmission unit, and a second transmission unit, wherein the first transmission unit is connected to the motor and the second transmission unit respectively, and the motor drives the first transmission unit to drive the second transmission unit. The second transmission unit transmits pressure to the elastic unit, so that the elastic unit drives the adsorption unit to generate displacement; the second transmission unit includes a force sensor, which is used to detect the force applied to the substrate; The measuring mechanism includes a first displacement sensor and a second displacement sensor, wherein the first displacement sensor is used to collect displacement data of the substrate in a direction perpendicular to its thickness, and the second displacement sensor is used to collect displacement data of the substrate in the thickness direction.

2. The bonding head according to claim 1, wherein: The second transmission unit further includes a bracket and a pressure head; The bracket is connected to the first transmission unit and the force sensor respectively; The pressure head is connected to the force sensor and the elastic unit respectively; The force sensor is located between the bracket and the pressure head; The pressure head has a hemispherical structure on a side close to the elastic unit, and the hemispherical structure abuts against the elastic unit.

3. The bonding head according to claim 1, wherein: The elastic unit includes a connecting unit and an elastic member; The adsorption unit is connected to the elastic member via the connection unit.

4. The bonding head according to claim 3, wherein: When the number of the elastic members is multiple, the connecting unit includes multiple connecting members and multiple supporting plates; the supporting plates are hollow structures; Each support plate is located on a side of each elastic member close to the adsorption unit and supports the elastic member; A plurality of elastic members are connected and fixed to the connecting unit along the thickness direction of the substrate; The number of the support plates corresponds to the number of the elastic members.

5. The bonding head according to claim 3, wherein: When the number of the elastic member is one, the connecting unit includes a plurality of connecting members and a supporting plate; the supporting plate is a hollow structure; The support plate is located on a side of the elastic member close to the adsorption unit and supports the elastic member; The elastic member is connected and fixed to the connecting unit along the thickness direction of the substrate.

6. The bonding head according to any one of claims 3 to 5, characterized in that: The elastic member includes an elastic member body and a plurality of elastic arms; The plurality of elastic arms are distributed in a diagonally symmetrical manner or in a cross-symmetrical manner; A plurality of elastic arms are connected to the inner edge of the elastic member body.

7. The bonding head according to claim 6, wherein: The elastic arm is provided with an arch structure.

8. The bonding head according to any one of claims 1 to 5, characterized in that The adsorption unit includes a suction cup adapter plate and a suction cup, one side of the suction cup adapter plate is connected to the elastic unit, and the other side is connected to the suction cup; The first displacement sensor is used to detect the displacement of the adsorption unit in a direction perpendicular to the thickness of the substrate.

9. The bonding head according to any one of claims 1 to 5, characterized in that The second displacement sensor is fixedly mounted on the second transmission unit; The second displacement sensor includes a grating scale body and a grating scale reading head, and is used to detect the displacement of the adsorption unit in the thickness direction of the substrate.

10. A bonding device, characterized in that: The bonding device comprises: The bonding head according to any one of claims 1 to 9, configured to absorb an upper substrate and move the upper substrate; A moving platform, used for carrying the lower substrate and driving the lower substrate to move; A control module is used to control the bonding head and the motion stage.

11. A bonding method, characterized in that: The following steps are involved: driving the bonding head in the bonding device according to claim 10 to move along the thickness direction of the upper substrate; Acquiring displacement data of the upper substrate in a direction perpendicular to its thickness, displacement data of the upper substrate in its thickness direction, and bonding force data; Adjusting the movement of the bonding head and the motion stage and the magnitude of the bonding force until bonding conditions are met according to the acquired displacement data of the upper substrate in a direction perpendicular to the thickness thereof, the displacement data of the upper substrate in the thickness thereof, and the bonding force data; Bonding of the upper substrate to the lower substrate is performed.

12. A storage medium, characterized in that: Computer instructions are stored thereon, and when the instructions are executed by a processor, the steps of the method according to claim 11 are implemented.

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