Carrier suitable for wafer baking process and use method thereof

Abstract

The invention provides a carrier suitable for a wafer baking process, which enables the carrier to be transferred into an oven through automatic equipment and to be in reliable butt joint with a crown block system after being transported out of the oven, so that the carrier can be suitable for the wafer baking process. The base mechanism comprises a bottom plate and a standard forklift groove which is formed in the lower portion and protrudes downwards; the top plate mechanism comprises a top plate and a mushroom head butt joint assembly at the top; and at least two groups of enclosure frames, each group of enclosure frames comprises a back plate and a plurality of laminates, the plurality of laminates are arranged at intervals in the height direction of each group of back plate, and the height between the laminates is used for placing wafers with corresponding sizes; a plurality of enclosure frames are arranged on the upper surface of the bottom plate in a surrounding mode, layer plates, with the same height, of the enclosure frames form wafer clamping grooves, a front wafer feeding area is formed after the enclosure frames are arranged in a surrounding mode, a gap is reserved between every two adjacent enclosure frames, the top plate covers an upper area formed by the enclosure frames, and the mushroom head butt joint assembly protrudes out of the top plate.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer baking and transportation, and specifically to a carrier suitable for a wafer baking process. The present invention also provides a method for using the carrier. Background Art

[0002] During the baking process of semiconductor technology, wafers need to undergo stress relief in a high-temperature oven. Existing ovens rely on manual operation: operators need to wear protective equipment to enter the high-temperature environment to take and place the ovens, which leads to low efficiency, high safety risks, and high wafer breakage rates due to fatigue. In addition, existing ovens lack standardized mechanical interfaces and cannot be adapted to the gripping mechanisms of automated handling equipment, forcing the automated production line to be interrupted at this stage. Therefore, there is an urgent need to develop a carrier capable of automated transfer operations, so that the carrier can be suitable for the wafer baking process and automatically transferred between various workstations, thereby improving production efficiency, reducing safety risks, and increasing the yield of wafers. Summary of the Invention

[0003] In response to the above problems, the present invention provides a carrier suitable for the wafer baking process, which allows the carrier to be transferred into the oven through automated equipment, and reliably docked with the overhead crane system after being transported out of the oven, so that the carrier can be suitable for the wafer baking process and automatically transferred at each workstation, thereby improving production efficiency, reducing safety hazards, and improving the yield of wafers.

[0004] A carrier suitable for a wafer baking process, characterized in that it comprises:

[0005] A base structure comprising a bottom plate and a downwardly convex standard forklift slot below;

[0006] A top plate mechanism, comprising a top plate and a mushroom head docking assembly at the top;

[0007] and at least two sets of frames, each set of frames including a back plate and a plurality of layer plates, each set of back plates being arranged in a height direction with a plurality of layer plates spaced apart, the height between the layer plates being used to accommodate wafers of corresponding sizes;

[0008] The upper surface of the base plate is surrounded by a plurality of frames, and the layers of the same height of the plurality of frames form wafer slots. After the plurality of frames are surrounded, a front wafer feeding area is formed, and a gap is left between adjacent frames. The top plate cover is installed on the upper area formed by the plurality of frames, and the mushroom head docking assembly is arranged to protrude from the top plate.

[0009] It is further characterized by:

[0010] Each back plate is provided with multiple rows of heat dissipation holes from top to bottom, which ensure heat dissipation and a relatively light weight of the entire carrier;

[0011] There are three groups of surrounding frames, and the bottom plate and top plate are both circular plate-frame structures. The left, right and rear positions of the bottom plate and top plate are respectively fixed to the back plates of the corresponding surrounding frames;

[0012] The corresponding arc edges of the bottom plate and the top plate are respectively fixed to the bottom end and the upper end of the back plate at corresponding positions;

[0013] The rear portion of the bottom plate and the top plate is a concave plane area, which ensures that after the carrier is pushed into the oven, it has a reliable positioning stop edge;

[0014] A downwardly convex standard forklift slot is provided at the center of the surface area of ​​the bottom plate, and the front portion of the standard forklift slot is empty to ensure that the forklift rod can be securely inserted into the positioning groove of the standard forklift slot;

[0015] The bottom plate is also provided with a downward convex positioning column to prevent inclination measurement;

[0016] The lower part of the bottom plate is also surrounded by three groups of support frames, and each group of support frames is arranged at an interval of 120 degrees;

[0017] The mushroom head docking assembly has a square structure. The four sides of the top panel of the mushroom head docking assembly have limiting teeth with different numbers and positions in at least one case, thereby preventing mis-grabbing. The height frame of the mushroom head docking assembly is provided with a through slot running through the front and back positions. The top panel, height frame, and top plate are combined to form an I-shaped design, which ensures strength while achieving rapid heat dissipation.

[0018] The center of the top panel is provided with a concave tapered alignment hole, which facilitates physical docking;

[0019] The entire vehicle is made of high-strength lightweight materials, which reduces weight while ensuring structural strength. At the same time, it undergoes special processing to improve wear resistance and heat dissipation efficiency.

[0020] A method for using a carrier suitable for a wafer baking process, characterized in that it comprises the following steps:

[0021] S1. The fully automatic wafer guide machine places the wafer in the corresponding wafer slot;

[0022] S2. Use automated handling equipment to move the carrier and wafers to the oven through a standard forklift slot;

[0023] S3. After the process in the oven is completed, the automated handling equipment moves the carrier and the wafer to the designated workstation through the standard forklift slot;

[0024] S4. The clamping structure of the overhead crane docks with the mushroom head docking assembly of the oven, driving the carrier and the wafer to be transferred to other processing stations.

[0025] After adopting the present invention, the fully automatic wafer guide machine for taking up the wafer places the wafer in the corresponding wafer slot; then the carrier together with the wafer is transported to the oven through the standard forklift slot by the automated handling equipment; after the process in the oven is completed, the automated handling equipment transports the carrier together with the wafer to the designated workstation through the standard forklift slot; the clamping structure of the overhead crane docks with the mushroom head docking assembly of the oven, driving the carrier together with the wafer to be transported to the remaining processing stations, which enables the carrier to be transported into the oven through the automated equipment, and reliably docked with the overhead crane system after being transported out of the oven, so that the carrier can be suitable for the wafer baking process and automatically transported at each workstation, thereby improving production efficiency, reducing safety hazards, and improving the yield of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 The three-dimensional carrier of the present invention Figure 1 ;

[0027] Figure 2 The three-dimensional carrier of the present invention Figure 2 ;

[0028] Figure 3 is a side view of the carrier of the present invention;

[0029] The names corresponding to the serial numbers in the figure are as follows:

[0030] Concave plane area 1;

[0031] Base mechanism 10, bottom plate 11, standard forklift slot 12, positioning column 13, support frame 14 top plate mechanism 20, top plate 21, mushroom head docking assembly 22, top panel 221, limiting teeth 2211, tapered profile alignment holes 2212, height frame 222, through slot 2221, frame 30, back plate 31, layer plate 32, wafer card slot 33, heat dissipation hole 34, front wafer feeding area 40. DETAILED DESCRIPTION

[0032] A carrier suitable for wafer baking process, see Figure 1-Figure 3 , which includes a base mechanism 10, a top plate mechanism 20, and at least two sets of surrounding frames 30;

[0033] The base mechanism 10 includes a bottom plate 11 and a downwardly convex standard forklift slot 12 below;

[0034] The top plate mechanism 20 includes a top plate 21 and a mushroom head docking assembly 22 at the top;

[0035] Each set of frames 30 includes a back plate 31 and a plurality of layer plates 32. A plurality of layer plates 32 are arranged at intervals in the height direction of each set of back plates 31. The height between the layer plates 32 is used to place wafers of corresponding sizes.

[0036] The upper surface of the base plate 11 is surrounded by a plurality of frames 30 , and the layers 32 of the same height of the plurality of frames 30 form a wafer slot 33 . After the plurality of frames 30 are surrounded, a front wafer feeding area 40 is formed. There is a gap between adjacent frames 30 . The top plate 21 is covered on the upper area formed by the plurality of frames 30 , and the mushroom head docking assembly 22 is provided on the top plate 21 so as to protrude.

[0037] In a specific embodiment, there are three sets of frames 30, and the bottom plate 11 and the top plate 21 are both circular plate-frame structures. The left, right, and rear positions of the bottom plate 11 and the top plate 21 are respectively fixed to the back plates 31 of the corresponding frames 30;

[0038] Each back plate 31 is provided with a plurality of rows of heat dissipation holes 34 arranged from top to bottom, which ensure heat dissipation and keep the weight of the entire carrier relatively light.

[0039] The corresponding arc edges of the bottom plate 11 and the top plate 21 are fixed to the bottom end and the top end of the back plate 31 at corresponding positions respectively;

[0040] The rear portion of the bottom plate 11 and the top plate 21 is a concave plane area 1, which ensures that after the carrier is pushed into the oven, it has a reliable positioning stop edge;

[0041] A downwardly convex standard forklift groove 12 is provided at the center of the surface of the bottom plate 11. The front portion of the standard forklift groove 12 is empty to ensure that the forklift rod is securely inserted into the positioning groove of the standard forklift groove 12.

[0042] The bottom plate 11 is also provided with a downwardly convex positioning column 13 to prevent inclination;

[0043] Three groups of support frames 14 are also arranged around the lower part of the bottom plate 11, and each group of support frames 14 is arranged at intervals of 120 degrees;

[0044] The mushroom-head docking assembly 22 has a square structure. The four sides of the top panel 221 of the mushroom-head docking assembly 22 have limiting teeth 2211 of different numbers and positions in at least one case, thereby preventing mis-grabbing. The height frame 222 of the mushroom-head docking assembly 22 is provided with a through slot 2221 extending through the front and back positions. The top panel 221, the height frame 222, and the top plate 21 are combined to form an I-shaped design, which ensures strength while providing rapid heat dissipation.

[0045] The center of the top panel 221 is provided with a concave tapered alignment hole 2212, which facilitates physical docking;

[0046] The entire vehicle is made of high-strength and lightweight aluminum alloy, which reduces weight while ensuring structural strength. At the same time, it undergoes special processing to improve wear resistance and heat dissipation efficiency.

[0047] A method for using a carrier suitable for a wafer baking process comprises the following steps:

[0048] S1. The fully automatic wafer guide machine places the wafer in the corresponding wafer slot;

[0049] S2. Use automated handling equipment to move the carrier and wafers to the oven through a standard forklift slot;

[0050] S3. After the process in the oven is completed, the automated handling equipment moves the carrier and the wafer to the designated workstation through the standard forklift slot;

[0051] S4. The clamping structure of the overhead crane docks with the mushroom head docking assembly of the oven, driving the carrier and the wafer to be transferred to other processing stations.

[0052] It allows the carrier to be transferred into the oven through automated equipment, and reliably docked with the overhead crane system after being transported out of the oven, making the carrier suitable for the wafer baking process and automatically transferred at each workstation, thereby improving production efficiency, reducing safety hazards, and increasing the yield of wafers.

[0053] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be included therein. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

[0054] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. A carrier suitable for a wafer baking process, characterized in that: It includes: A base structure comprising a bottom plate and a downwardly convex standard forklift slot below; A top plate mechanism, comprising a top plate and a mushroom head docking assembly at the top; and at least two sets of frames, each set of frames including a back plate and a plurality of layer plates, each set of back plates being arranged in a height direction with a plurality of layer plates spaced apart, the height between the layer plates being used to accommodate wafers of corresponding sizes; The upper surface of the base plate is surrounded by a plurality of frames, and the layers of the same height of the plurality of frames form wafer slots. After the plurality of frames are surrounded, a front wafer feeding area is formed, and a gap is left between adjacent frames. The top plate cover is installed on the upper area formed by the plurality of frames, and the mushroom head docking assembly is arranged to protrude from the top plate.

2. The carrier suitable for a wafer baking process according to claim 1, characterized in that: Each back plate is provided with a plurality of rows of heat dissipation holes from top to bottom.

3. The carrier suitable for a wafer baking process according to claim 1, characterized in that: There are three groups of surrounding frames, and both the bottom plate and the top plate are circular plate-frame structures. The left, right and rear positions of the bottom plate and the top plate are respectively fixedly connected to the back plates of the corresponding surrounding frames.

4. The carrier suitable for a wafer baking process according to claim 3, characterized in that: The corresponding arc edges of the bottom plate and the top plate are respectively fixed to the bottom end and the upper end of the back plate at corresponding positions.

5. The carrier suitable for a wafer baking process according to claim 4, characterized in that: The rear portions of the bottom plate and the top plate are concave plane areas.

6. The carrier suitable for a wafer baking process according to claim 1, characterized in that: A downwardly convex standard forklift groove is provided at the center of the surface area of ​​the bottom plate, and the front portion of the standard forklift groove is empty.

7. The carrier suitable for a wafer baking process according to claim 6, characterized in that: The bottom plate is also provided with a downwardly convex positioning column; Three groups of support frames are arranged around the lower part of the bottom plate, and each group of support frames is arranged at an interval of 120 degrees.

8. The carrier suitable for a wafer baking process according to claim 1, characterized in that: The mushroom head docking assembly is a square structure, and the four sides of the top panel of the mushroom head docking assembly have limiting teeth with at least one different number and position, thereby preventing wrong grasping. The height frame of the mushroom head docking assembly is provided with a through groove running through the front and rear positions, and the top panel, height frame, and top plate are combined to form an I-shaped design.

9. The carrier suitable for a wafer baking process according to claim 8, characterized in that: A concave tapered alignment hole is provided at the center of the top panel.

10. A method for using the carrier according to any one of claims 1 to 9 for a wafer baking process, characterized in that: It includes the following steps: S1. The fully automatic wafer guide machine places the wafer in the corresponding wafer slot; S2. Use automated handling equipment to move the carrier and wafers to the oven through a standard forklift slot; S3. After the process in the oven is completed, the automated handling equipment moves the carrier and the wafer to the designated workstation through the standard forklift slot; S4. The clamping structure of the overhead crane docks with the mushroom head docking assembly of the oven, driving the carrier and the wafer to be transferred to other processing stations.

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