Liquid cooling plate

Abstract

The invention, which relates to the technical field of the heat dissipation apparatus, discloses a liquid cooling plate comprising a body, a circuit board, a first flow path and a second flow path. A liquid inlet and a liquid outlet are formed in the peripheral edge of the body, and the circuit board is arranged on one side of the body in the vertical direction and used for being connected with a heat consumption device. One end of the first flow path is communicated with the liquid inlet, the other end of the first flow path is arranged in the middle of the body, the liquid inlet is used for injecting a cooling working medium into the first flow path, the second flow path is rotationally arranged, one end of the second flow path is communicated with the liquid outlet, and the other end of the second flow path is communicated with the other end of the first flow path in series; the liquid outlet is used for the cooling working medium absorbing the heat of the circuit board to flow out. At least part of the second flow channel and the first flow channel are staggered, and the first flow channel and the second flow channel at the relatively staggered positions are opposite in flow direction. Therefore, the overall temperature of the body is uniform, the temperature difference between the cooling working medium inlet and the cooling working medium outlet is effectively reduced, and then the problem that a high-heat-consumption device is damaged due to local overheating is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation devices, and in particular to a liquid cooling plate. Background Art

[0002] With the continuous development of electronic devices, their integration is becoming increasingly dense, and the power density of electronic components is also increasing. This leads to a large amount of heat generated during operation. If this heat cannot be dissipated promptly and effectively, the electronic equipment will overheat, affecting its performance and service life, and even causing damage. Therefore, effective heat dissipation from electronic devices has become a critical component in electronic device design. Liquid cooling technology, due to its advantages such as high heat dissipation efficiency and low noise, is widely used to dissipate heat from high-heat-consuming electronic devices. As the core component of the liquid cooling system, the design of the liquid cold plate directly affects the heat dissipation effect.

[0003] Currently, most common liquid cooling plates on the market use a serpentine flow channel design. The coolant enters from the liquid inlet, flows through the serpentine flow channel, and flows out from the liquid outlet, absorbing the heat generated by the electronic equipment during the flow process. The flow channel design of liquid cooling plates in the existing technology is often relatively simple, making it difficult to optimize and adjust the distribution of heat sources at different locations on the circuit board, and unable to achieve precise cooling of hot spots. At the same time, the temperature difference between the cooling medium inlet and the cooling medium outlet is large, and the cooling of the liquid cooling plate is uneven. If high-heat consumption devices are arranged downstream of the flow channel, abnormal heat dissipation may occur, causing device failure and damage. Summary of the Invention

[0004] The present invention aims to solve one of the existing technical problems. To this end, the main purpose of the present invention is to propose a liquid cooling plate, which aims to increase the uniformity of temperature distribution, reduce the temperature difference between the inlet and outlet of the cooling medium, and thus reduce local overheating damage to high heat consumption devices.

[0005] To achieve the above-mentioned objectives, the present invention provides a liquid cooling plate, comprising a body, a liquid inlet and a liquid outlet being provided on the outer circumference of the body, a first flow path and a second flow path being formed inside the body, the first flow path being arranged in a multi-layer spiral arrangement along the circumference of the body toward the middle of the body, one end of the first flow path being connected to the liquid inlet, and the other end being arranged in the middle of the body, the liquid inlet being used to inject a cooling medium into the first flow path, the second flow path being arranged in a multi-layer spiral arrangement along the circumference of the body toward the middle of the body, one end of the second flow path being connected to the liquid outlet, and the other end being connected in series with the other end of the first flow path, the liquid outlet being used to allow the cooling medium to flow out after absorbing heat from the circuit board;

[0006] A circuit board is provided on one side of the main body in the vertical direction and is used for connecting a heat dissipation device;

[0007] The second flow channel is at least partially staggered with the first flow channel, and the first flow channel and the second flow channel at the relatively staggered position have opposite flow directions.

[0008] In one embodiment, the first flow path includes at least a plurality of first flow channels extending laterally and a plurality of second flow channels extending longitudinally, and the first flow channels and the second flow channels are connected in sequence;

[0009] The second flow path includes at least a plurality of transversely extending third flow channels and a plurality of longitudinally extending fourth flow channels, the third flow channels and the fourth flow channels are sequentially connected, and at least one third flow channel is disposed between two adjacent first flow channels in the first flow path, and at least one fourth flow channel is disposed between two adjacent second flow channels in the second flow path;

[0010] The third flow channel has a flow direction opposite to that of the adjacent first flow channel, and the fourth flow channel has a flow direction opposite to that of the adjacent second flow channel.

[0011] In one embodiment, the first flow path further includes at least a plurality of first bending segments, the first bending segments being disposed at the connection between the first flow channel and the second flow channel, and the second flow path further includes at least a plurality of second bending segments, the second bending segments being disposed at the connection between the third flow channel and the fourth flow channel, and at least part of the second bending segments being disposed between two adjacent first bending segments;

[0012] And / or, the first flow path also includes a third bending section, which is arranged at the other end of the first flow path, and the second flow path also includes a fourth bending section, which is arranged at the other end of the second flow path, and the third bending section and the fourth bending section are connected.

[0013] In one embodiment, the inner wall surface of the first flow path is formed with at least one first protrusion along its radial direction; and / or,

[0014] At least one second protrusion is formed on the inner wall surface of the second flow path along its radial direction.

[0015] In one embodiment, the width of the first flow channel and / or the width of the second flow channel is adjustable, so as to be adjusted according to the position of the heat source emitted by the circuit board.

[0016] In one embodiment, the liquid cooling plate further includes a transition heat sink, which is disposed between the circuit board and the body to transfer heat from the circuit board to the body.

[0017] In one embodiment, the liquid cooling plate further includes: a phase change device, including a phase change material, wherein the phase change material is arranged between the circuit board and the main body in the up-down direction and / or the phase change material is arranged on the side of the main body facing away from the circuit board in the up-down direction, so as to absorb or release heat during the phase change process.

[0018] In one embodiment, the phase change material is a solid-solid phase change material, a solid-liquid phase change material, or a solid-gas phase change material.

[0019] In one embodiment, the phase change device includes a sparse tooth section, a gas-liquid separation section, and a dense tooth section arranged in a direction gradually away from the circuit board;

[0020] The phase change device further includes a plurality of fins, which are spaced apart in the sparse-tooth section and the dense-tooth section, and the fin density of the dense-tooth section is greater than that of the sparse-tooth section.

[0021] In one embodiment, the liquid cooling plate further comprises:

[0022] A first cover plate is provided to cover one end of the body in an up-down direction;

[0023] The second cover plate is arranged to cover the other end of the body in an up-down direction.

[0024] In the technical solution of the present invention, heat dissipating components on the circuit board generate heat and transfer it to the main body. A coolant enters through the liquid inlet, flows through the first flow path toward the middle of the main body, absorbs the heat transferred by the main body, and gradually heats up. The coolant then enters the second flow path, continues to absorb heat, and finally flows out through the liquid outlet. It should be noted that the coolant in the second flow path is higher in temperature than the first flow path. By staggering the spiraling first and second flow paths to form a double-circular series structure, and with the first and second flow paths at the staggered positions flowing in opposite directions, the coolant flows in opposite directions in adjacent flow paths within the liquid cooling plate. This ensures that all parts of the main body are filled with the two flow paths with alternating high and low temperatures, resulting in a relatively uniform temperature across the main body. This countercurrent design further improves heat exchange efficiency, effectively reducing the temperature difference between the coolant inlet and outlet, and thereby alleviating the problem of localized overheating and damage to high-heat dissipating components. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0026] Figure 1A schematic top view of the structure of an embodiment of the liquid cooling plate provided by the present invention;

[0027] Figure 2 for Figure 1 Schematic diagram of the front view structure of the liquid cooling plate;

[0028] Figure 3 for Figure 1 A schematic diagram of the front view of the structure in which the phase change device is arranged on the other side of the body.

[0029] Description of Figure Numbers:

[0030] 100. Liquid cooling plate; 1. Main body; 2. Liquid inlet; 3. Liquid outlet; 4. First flow path; 41. First flow channel; 42. Second flow channel; 43. First bending section; 44. Third bending section; 5. Second flow path; 51. Third flow channel; 52. Fourth flow channel; 53. Second bending section; 54. Fourth bending section; 6. Circuit board; 7. Heat dissipation device; 8. Transition heat sink; 9. Phase change device; 10. First cover plate; 11. Second cover plate.

[0031] The functional features and advantages of the present invention will be further described with reference to the accompanying drawings in conjunction with the embodiments. DETAILED DESCRIPTION

[0032] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0033] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications will also change accordingly.

[0034] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features specified as "first" and "second" may explicitly or implicitly include at least one of such features. In addition, the technical solutions between the various embodiments can be combined with each other, but this must be based on the fact that ordinary technicians in this field can implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0035] Existing liquid cold plate flow channel designs are often relatively simple, making it difficult to optimize and adjust the heat source distribution at different locations on the circuit board, and thus unable to achieve precise cooling of hot spots. Furthermore, the large temperature difference between the coolant inlet and outlet leads to uneven heat dissipation in the liquid cold plate. If high-heat-consuming devices are located downstream of the flow channel, heat dissipation may be abnormal, leading to device failure and damage.

[0036] In view of this, the present invention proposes a liquid cooling plate, wherein: Figures 1 to 3 This is a schematic structural diagram of the liquid cooling plate provided by the present invention.

[0037] See also Figure 1 and Figure 2 In one embodiment of the present invention, a liquid cooling plate 100 includes a body 1 and a circuit board 6. A liquid inlet 2 and a liquid outlet 3 are provided on the outer periphery of the body 1 for the entry and exit of a cooling medium. A first flow path 4 and a second flow path 5 are formed within the body 1. The first flow path 4 is disposed within the body 1 and spirals in multiple layers along the circumference of the body 1, extending toward the center of the body 1. One end of the first flow path 4 is connected to the liquid inlet 2, and the other end is disposed in the center of the body 1. The liquid inlet 2 is used to inject cooling medium into the first flow path 4. The second flow path 5 is also disposed within the body 1 and spirals in multiple layers along the circumference of the body 1, extending toward the center of the body 1. One end of the second flow path 5 is connected to the liquid outlet 3, and the other end is connected in series with the other end of the first flow path 4. The liquid outlet 3 is used to allow the cooling medium to flow out after absorbing heat from the circuit board 6. The circuit board 6 is disposed on one side of the body 1, vertically, for connection to a heat dissipating device 7. The second flow channel 42 is at least partially staggered with the first flow channel 41 , and the flow directions of the first flow channel 41 and the second flow channel 42 at the relatively staggered position are opposite.

[0038] It should be noted that the present invention does not limit the specific positions of the liquid inlet 2 and the liquid outlet 3, and they can be set according to the actual needs of liquid inlet and outlet; they can be set on two opposite sides along the horizontal or vertical sides of the body 1. In this embodiment, in order to facilitate more parts of the first flow channel 41 and the second flow channel 42 to be intertwined with each other, the liquid inlet 2 and the liquid outlet 3 are set at both ends of the same side of the body 1.

[0039] In addition, the cooling medium can be water, ethylene glycol aqueous solution, fluorinated liquid, etc., and a suitable cooling medium can be selected according to the actual application scenario and temperature requirements. The flow rate of the cooling medium can be adjusted according to the heat load, usually 0.5-5 liters / minute. The main body 1 can be made of materials with good thermal conductivity such as aluminum alloy, stainless steel or copper to ensure that heat can be efficiently transferred from the circuit board 6 to the cooling medium. The thickness of the main body 1 can be designed according to the actual application requirements, and the thickness of the main body 1 is usually 10-50 mm. The circuit board 6 can be a printed circuit board 6 used in various types of electronic equipment, such as a computer motherboard, a server motherboard, a graphics processor board, etc. The heat dissipation device 7 can be an electronic component with high heat generation, such as a CPU, GPU, ASIC chip, etc.

[0040] In the technical solution of the present invention, the heat dissipating device 7 on the circuit board 6 generates heat and transfers it to the body 1. The cooling medium enters through the liquid inlet 2, flows through the first flow path 4 to the middle of the body 1, absorbs the heat transferred by the body 1, and gradually heats up. The cooling medium then enters the second flow path 5, continues to absorb heat, and finally flows out of the liquid outlet 3. It should be noted that the cooling medium in the second flow path 5 is higher in temperature than the first flow path 4. By staggering the spiraling first and second flow paths 4, 5 to form a double-circular series structure, and with the first flow channels 41 and second flow channels 42 at the staggered positions flowing in opposite directions, the cooling medium flows in opposite directions in adjacent flow paths in the liquid cooling plate 100. This ensures that all parts of the body 1 are filled with the two flow paths with alternating high and low temperatures, resulting in a relatively uniform temperature across the body 1. This counter-flow design further improves heat exchange efficiency, effectively reducing the temperature difference between the cooling medium inlet and outlet, and thereby alleviating the problem of local overheating and damage to the high-heat dissipating device 7.

[0041] In addition, the staggered arrangement means that the spiral second flow channels 42 are inserted between the first flow channels 41 and connected at the middle of the body 1 , so that the second flow channels 42 at the staggered position are located between two adjacent first flow channels 41 .

[0042] Specifically, in one embodiment of the present invention, the first flow path 4 includes at least a plurality of transversely extending first flow channels 41 and a plurality of longitudinally extending second flow channels 42, and the first flow channels 41 and the second flow channels 42 are connected in sequence. The second flow path 5 includes at least a plurality of transversely extending third flow channels 51 and a plurality of longitudinally extending fourth flow channels 52, and the third flow channels 51 and the fourth flow channels 52 are connected in sequence, and at least one third flow channel 51 is arranged between two adjacent first flow channels 41 in the first flow path 4, and at least one fourth flow channel 52 is arranged between two adjacent second flow channels 42 in the second flow path 5. The third flow channel 51 flows in opposite directions to the adjacent first flow channels 41, and the fourth flow channel 52 flows in opposite directions to the adjacent second flow channels 42. In this way, the third flow channel 51 is arranged between two adjacent first flow channels 41 in the first flow path 4, and the fourth flow channel 52 is arranged between two adjacent second flow channels 42 in the second flow path 5. This staggered arrangement design allows the cooling medium to more evenly cover the entire liquid cooling plate 100, avoiding the occurrence of hot spots. At the same time, the third flow channel 51 flows in the opposite direction to the adjacent first flow channel 41, and the fourth flow channel 52 flows in the opposite direction to the adjacent second flow channel 42. This countercurrent design can further improve the heat exchange efficiency, so that the first flow channel 4 and the second flow channel 5 are more evenly distributed throughout the entire body 1, and the number of parts where the first flow channel 4 and the second flow channel 5 intersect with each other increases, further increasing the uniformity of temperature distribution.

[0043] More specifically, in one embodiment of the present invention, the first flow path 4 further includes at least a plurality of first bend sections 43, which are disposed at the junction of the first flow channel 41 and the second flow channel 42. The second flow path 5 further includes at least a plurality of second bend sections 53, which are disposed at the junction of the third flow channel 51 and the fourth flow channel 52, with at least some of the second bend sections 53 disposed between two adjacent first bend sections 43. Thus, by providing bend sections at the junctions of the transversely and longitudinally extending flow channels, the flow channel distribution at the corners of the body 1 is increased while avoiding the liquid outlet 3 and the liquid inlet 2, further improving the uniformity of temperature distribution.

[0044] The first flow path 4 also includes a third bend section 44, which is disposed at the other end of the first flow path 41. The second flow path 5 also includes a fourth bend section 54, which is disposed at the other end of the second flow path 42, and the third bend section 44 and the fourth bend section 54 are connected. It can be understood that the middle portion of the body 1 is typically where the circuit board 6 generates the most heat. By disposing the third bend section 44 and the fourth bend section 54 in the middle, the heat exchange efficiency in the middle portion is improved and local overheating is prevented. Specifically, in this embodiment, the third bend section 44 and the fourth bend section 54 are arranged in a U-shape, thereby increasing the flow rate in the middle portion and, in turn, the heat exchange efficiency.

[0045] In one embodiment of the present invention, at least one first protrusion is formed on the inner wall surface of the first flow path 4 along its radial direction, and at least one second protrusion is formed on the inner wall surface of the second flow path 5 along its radial direction. The first protrusion on the inner wall surface of the first flow path 4 and the second protrusion on the inner wall surface of the second flow path 5 can increase fluid disturbance, break the boundary layer, and improve heat exchange efficiency. These protrusions can be of various shapes, such as hemispherical, triangular, rectangular, etc., with a height of usually 0.5-2 mm and a spacing of usually 5-20 mm. This design of protrusions of different shapes and sizes can produce different fluid disturbance effects under different flow rates and flow directions, further optimizing heat exchange efficiency. Hemispherical protrusions can reduce fluid resistance and are suitable for high flow rate conditions; triangular protrusions can produce stronger fluid disturbance and are suitable for low flow rate conditions.

[0046] Furthermore, in one embodiment of the present invention, the widths of the first and second flow channels 41 and 42 are adjustable, allowing adjustments based on the location of the heat source emitted by the circuit board 6. This adjustable design allows the liquid cooling plate 100 to be optimized for circuit boards 6 with varying heat source distributions, improving cooling efficiency. For example, if the heat source is concentrated in the center of the circuit board 6, the width of the flow channel in the central area can be increased, while the width of the flow channel in the edge areas can be reduced to improve cooling efficiency in the central area. The flow channel width can typically be adjusted within a range of 1-10 mm.

[0047] In one embodiment of the present invention, the liquid cooling plate 100 of this embodiment further includes a transition heat sink 8, which is disposed between the circuit board 6 and the main body 1 to transfer heat from the circuit board 6 to the main body 1. The transition heat sink 8 can be made of a material with good thermal conductivity, such as copper (thermal conductivity of approximately 400W / (m·K)) or aluminum (thermal conductivity of approximately 237W / (m·K)). The thickness of the transition heat sink 8 is generally 1-5 mm, and the surface can be polished to reduce contact thermal resistance. Specifically, the transition heat sink 8 is made of pure copper material with a thickness of 3 mm, and the surface is polished to a surface roughness Ra value of less than 0.8μm. Thermal conductive silicone grease is applied between the transition heat sink 8 and the circuit board 6, with a thermal conductivity of 5W / (m·K) and a thickness of 0.1 mm. This design of a transition heat sink 8 with high thermal conductivity can ensure that heat can be efficiently transferred from the circuit board 6 to the main body 1, reducing thermal resistance and improving cooling efficiency. The thermal conductivity of pure copper material is about 400W / (m·K), which is much higher than other common metal materials.

[0048] See also Figure 2 and Figure 3In one embodiment of the present invention, the liquid cold plate 100 further includes a phase change device 9, which comprises a phase change material. The phase change material is vertically disposed between the circuit board 6 and the main body 1 and / or vertically disposed on the side of the main body 1 facing away from the circuit board 6, to absorb or release heat during the phase change process. The phase change material can be a solid-solid phase change material, a solid-liquid phase change material, or a solid-gas phase change material. The appropriate phase change material is selected based on the actual application scenario and temperature requirements. For example, for electronic devices that need to operate within the 40-60°C range, a phase change material with a phase change temperature within this range, such as paraffin or hydrated salt, can be selected. The thickness of the phase change material is typically 2-10 mm. In this embodiment, the phase change material is a paraffin-based solid-liquid phase change material with a phase change temperature of 50°C, a latent heat of phase change of 200 J / g, and a thickness of 5 mm. The phase change material is vertically disposed between the circuit board 6 and the main body 1 and sealed by the aluminum package body 1. This phase change material design can begin to change phase when the temperature of the circuit board 6 reaches 50°C, absorbing a large amount of heat and preventing the temperature of the circuit board 6 from continuing to rise. When the temperature of the circuit board 6 drops, the phase change material releases heat to maintain a stable temperature and reduce the impact of temperature fluctuations on electronic components.

[0049] In one embodiment of the present invention, the phase change device 9 includes a sparse tooth section, a gas-liquid separation section, and a dense tooth section arranged in a direction gradually away from the circuit board 6. The phase change device 9 also includes a plurality of fins, and the plurality of fins are spaced apart in the sparse tooth section and the dense tooth section, and the fin density of the dense tooth section is greater than that of the sparse tooth section. This design can optimize the heat transfer efficiency during the phase change process and ensure that the phase change material can fully absorb or release heat. Specifically, the fin spacing of the sparse tooth section is larger, typically 5-10 mm, and the fin spacing of the dense tooth section is smaller, typically 1-3 mm. This design can be optimized according to the heat transfer characteristics of the phase change material at different stages to improve the phase change efficiency.

[0050] In one embodiment of the present invention, the liquid cooling plate 100 further includes a first cover plate 10 and a second cover plate 11. The first cover plate 10 is vertically arranged to cover one end of the main body 1, and the second cover plate 11 is vertically arranged to cover the other end of the main body 1. The cover plates seal the main body 1 to prevent leakage of the coolant and also facilitate assembly and maintenance of the liquid cooling plate 100. A gasket or sealant can be used to seal the cover plate and the main body 1 to prevent leakage of the coolant.

[0051] The above descriptions are merely optional embodiments of the present invention and do not limit the patent scope of the present invention. All equivalent structural transformations made based on the contents of the present invention's description and drawings, or direct / indirect applications in other related technical fields, are included in the patent protection scope of the present invention.

Claims

1. A liquid cooling plate, characterized in that: include: A body, wherein a liquid inlet and a liquid outlet are provided on the outer circumference of the body, and a first flow path and a second flow path are formed inside the body, wherein the first flow path is arranged in a multi-layer spiral arrangement along the circumference of the body toward the middle of the body, one end of the first flow path is connected to the liquid inlet, and the other end is arranged in the middle of the body, the liquid inlet is used to inject a cooling medium into the first flow path, and the second flow path is arranged in a multi-layer spiral arrangement along the circumference of the body toward the middle of the body, one end of the second flow path is connected to the liquid outlet, and the other end is connected in series with the other end of the first flow path, and the liquid outlet is used to allow the cooling medium to flow out after absorbing heat from the circuit board; A circuit board is provided on one side of the main body in the vertical direction and is used for connecting a heat dissipation device; The second flow channel is at least partially staggered with the first flow channel, and the first flow channel and the second flow channel at the relatively staggered position have opposite flow directions.

2. The liquid cooling plate according to claim 1, wherein: The first flow path comprises at least a plurality of first flow channels extending transversely and a plurality of second flow channels extending longitudinally, wherein the first flow channels and the second flow channels are connected in sequence; The second flow path includes at least a plurality of transversely extending third flow channels and a plurality of longitudinally extending fourth flow channels, the third flow channels and the fourth flow channels are sequentially connected, and at least one third flow channel is disposed between two adjacent first flow channels in the first flow path, and at least one fourth flow channel is disposed between two adjacent second flow channels in the second flow path; The third flow channel has a flow direction opposite to that of the adjacent first flow channel, and the fourth flow channel has a flow direction opposite to that of the adjacent second flow channel.

3. The liquid cooling plate according to claim 2, wherein: The first flow path further includes at least a plurality of first bending segments, the first bending segments being arranged at the connection between the first flow channel and the second flow channel, the second flow path further includes at least a plurality of second bending segments, the second bending segments being arranged at the connection between the third flow channel and the fourth flow channel, and at least part of the second bending segments being arranged between two adjacent first bending segments; and / or, The first flow path further includes a third bending section, which is arranged at the other end of the first flow path. The second flow path further includes a fourth bending section, which is arranged at the other end of the second flow path, and the third bending section and the fourth bending section are connected.

4. The liquid cooling plate according to claim 1, wherein: The inner wall surface of the first flow path is formed with at least one first protrusion along its radial direction; and / or, At least one second protrusion is formed on the inner wall surface of the second flow path along its radial direction.

5. The liquid cooling plate according to claim 1, wherein: The first flow channel width is adjustable and / or the second flow channel width is adjustable, and is used to be adjusted according to the position of the heat source emitted by the circuit board.

6. The liquid cooling plate according to claim 1, wherein: The liquid cooling plate further includes a transition heat sink, which is disposed between the circuit board and the body and corresponds to the first flow channel or the second flow channel for transferring heat from the circuit board to the body.

7. The liquid cooling plate according to claim 1, wherein: The liquid cooling plate further comprises: The phase change device includes a phase change material, which is arranged between the circuit board and the body along the vertical direction and / or on the side of the body facing away from the circuit board, so as to absorb or release heat during the phase change process.

8. The liquid cooling plate according to claim 6, wherein: The phase change material is a solid-solid phase change material, a solid-liquid phase change material, or a solid-gas phase change material.

9. The liquid cooling plate according to claim 7, wherein: The phase change device includes a sparse tooth section, a gas-liquid separation section, and a dense tooth section arranged in a direction gradually away from the circuit board; The phase change device further includes a plurality of fins, which are spaced apart in the sparse-tooth section and the dense-tooth section, and the fin density of the dense-tooth section is greater than that of the sparse-tooth section.

10. The liquid cooling plate according to claim 1, wherein: The liquid cooling plate further comprises: A first cover plate is provided to cover one end of the body in an up-down direction; The second cover plate is arranged to cover the other end of the body in an up-down direction.

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