Magnetic suspension controller, thermal management method and thermal management system

Abstract

The invention provides a magnetic suspension controller, a thermal management method and a thermal management system, and relates to the technical field of magnetic suspension control equipment. The controller comprises a case and an alarm device; temperature sensors are arranged on the heat dissipation elements in the case; the plurality of ventilation areas are arranged on the case, and shielding devices are arranged at the positions of the plurality of ventilation areas; the heat dissipation device is arranged on the case, and a vibration sensor is arranged on the heat dissipation device; the method comprises the following steps: acquiring temperature data and vibration data of each area in real time through a temperature sensor array arranged in a case; the temperature data and the vibration data are combined for calculation to judge the thermal anomaly level; adjusting a shielding device and a heat dissipation device according to the abnormal level; the system comprises a temperature sensor, a vibration sensor and an embedded MCU. And the alarm device is connected with the embedded MCU. According to the technical scheme, the heat dissipation condition in the case can be adjusted according to needs, and it can be guaranteed that energy consumption is reduced on the premise that heat dissipation of the case is guaranteed.

Description

Technical Field

[0001] The present invention relates to the technical field of magnetic suspension control equipment, and in particular to a magnetic suspension controller, a thermal management method and a thermal management system. Background Art

[0002] Molecular pumps use high-speed rotating rotors to transfer momentum to gas molecules, giving them a directional velocity, which is then compressed and driven toward the exhaust port. They then work with a foreline pump to create a vacuum environment. They are widely used in high-precision fields such as semiconductor manufacturing, scientific research, and aerospace.

[0003] When using a molecular pump, it needs to be equipped with a controller to work together. The controller controls the operation of the molecular pump. During use, since multiple components are set inside the controller (such as a magnetron plate and a motor control module, etc.), the internal temperature of the controller will increase with use. In the existing technology, although a heat dissipation component is set on the controller housing, the heat dissipation component will start at the same time as the controller. In this way, when the internal temperature of the controller does not need to be cooled or when the internal temperature of the controller is not high, the heat dissipation component is still in operation, which invisibly causes energy waste. Summary of the Invention

[0004] The object of the present invention is to provide a magnetic levitation controller, a thermal management method and a thermal management system, which can solve the above-mentioned technical problems.

[0005] The present invention provides a magnetic suspension controller, comprising: A chassis, used for fixing to the outside, and provided with an alarm device; The magnetic control board, the motor control module, the switch module and the DC power supply are all arranged in the chassis, and temperature sensors are arranged on the magnetic control board, the motor control module, the switch module and the DC power supply; Several ventilation areas are provided on the chassis, and shielding devices are provided at the positions of the several ventilation areas to adjust the opening rate of the ventilation areas through the shielding devices; The heat dissipation device is arranged on the chassis and communicated with the interior of the chassis, and a vibration sensor is arranged on the heat dissipation device.

[0006] As a further technical solution, the shielding device includes: A plurality of shielding pieces, one end of which is rotatably connected to the inside of the chassis and the other end is arranged in the card slot; The driving device is arranged in the chassis and is connected to the plurality of shielding sheets through a driving plate.

[0007] As a further technical solution, a gear is provided at the other end of each of the shielding sheets, and the gear is disposed in the slot.

[0008] As a further technical solution, the driving plate is provided with latching teeth, which are adapted to the gear.

[0009] The present invention also proposes a thermal management method for controlling a magnetic levitation controller, comprising the following steps: The temperature data of each area is collected in real time through the temperature sensor array arranged on the magnetic control board, motor control module, switch module and DC power supply in the chassis; Monitor the mechanical vibration amplitude and frequency inside the chassis through vibration sensors; Calculate the temperature change rate and compare it with the preset threshold, and combine it with the vibration data to determine the thermal anomaly level. The temperature change rate is ΔT / Δt; Dynamically adjust the shielding device according to the abnormality level, and adjust the opening of the ventilation area, the speed of the heat dissipation device and the alarm mode of the alarm device through the shielding device; When the temperature exceeds the safety threshold or the vibration continues to be abnormal, the system is triggered to reduce load and start the backup cooling module.

[0010] As a further technical solution, the temperature change rate is calculated using a sliding time window algorithm with a window length of 30-120 seconds, and the temperature change rate threshold is divided into three levels: Primary warning: ΔT / Δt≥5℃ / min; Intermediate warning: ΔT / Δt ≥ 10℃ / min; Emergency warning: ΔT / Δt≥15℃ / min.

[0011] As a further technical solution, the adjustment strategy of the shielding device includes: According to the temperature field reconstruction results, the opening of the shielding device on different sides is controlled differentially. The opening of the shielding device corresponding to the first area is increased to 1.2-2 times the opening of the second area. The opening of the shielding device is linked to the speed of the heat dissipation device, and the relationship is satisfied: the speed of the heat dissipation device = the basic speed + 0.5 × the opening of the shielding device (%).

[0012] As a further technical solution, it also includes: historical data learning function: By recording the correlation data of temperature, vibration and heat dissipation adjustment parameters, the neural network model is trained; Predict the temperature change trend in the next 5 minutes and adjust the opening of the shielding device and the speed of the heat dissipation device in advance.

[0013] The present invention also proposes a thermal management system using the thermal management method, comprising: Contains at least 4 temperature sensors and 1 vibration sensor; the chassis is equipped with several ventilation areas; Embedded MCU, built-in temperature field reconstruction algorithm and PID speed control logic, and connected to 4 temperature sensors and vibration sensors; The alarm device is connected to the embedded MCU.

[0014] As a further technical solution, the temperature sensor uses a PT100 thin film patch sensor, which is installed within 5mm of the surface of the heating element and eliminates noise interference.

[0015] The technical solution of the present invention is to provide temperature sensors on the magnetic control plate, motor control module, switch module and DC power supply in the chassis, and to provide a heat dissipation device on the chassis; at the same time, a ventilation area is opened on the chassis, and a shielding device is provided in the ventilation area; the temperature condition in the chassis is obtained by obtaining data from the temperature sensor, and the shielding device is adjusted according to the temperature condition, and the chassis is cooled after the heat dissipation device is started; and in the use stage, if the temperature in the chassis is not high, the heat dissipation device can be stopped or the heat dissipation device speed can be reduced; the opening of the ventilation area is adjusted only by adjusting the shielding device, and air flow is performed through the ventilation area and the interior of the chassis to cool down; In addition, the thermal management method of the present invention can compare the temperature sensor data and determine abnormal conditions in the chassis, and adjust the heat dissipation device or issue an alarm based on the abnormal conditions; Compared with the prior art, the technical solution of the present invention can adjust the heat dissipation in the chassis as needed, and can ensure that energy consumption is reduced under the premise of ensuring the heat dissipation of the chassis. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the specific embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0017] Figure 1 A three-dimensional diagram of a magnetic levitation controller according to the present invention from one angle; Figure 2 This is a three-dimensional diagram of a magnetic levitation controller of the present invention from another angle; Figure 3 This is a structural diagram of a magnetic levitation controller according to the present invention; Figure 4 for Figure 3 Cross-sectional view of the AA section; Figure 5 This is a schematic structural diagram of the shielding device of the present invention at one angle; Figure 6is a flow chart of the thermal management method of the present invention; Figure 7 This is a structural block diagram of the thermal management system in the present invention.

[0018] Description of reference numerals: 100-chassis; 200-magnetic control board; 300-motor control module; 400-switch module; 500-DC power supply; 601-first temperature sensor; 602-second temperature sensor; 603-third temperature sensor; 604-fourth temperature sensor; 700-ventilation area; 800-shielding device; 801-shielding piece; 802-driving device; 803-driving board; 804-gear; 805-grip; 806-slot; 900-heat dissipation device; 1000-vibration sensor; 2000-MCU; 3000-alarm device. DETAILED DESCRIPTION

[0019] The following will clearly and completely describe the technical solutions of the present invention in conjunction with the embodiments. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0020] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like to indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operate in a specific direction, and therefore should not be understood as limiting the present invention.

[0021] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the said features. In the description of the present invention, "multiple" means two or more, unless otherwise clearly and specifically defined. In addition, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be a communication between the two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

[0022] like Figure 1-5 As shown, the present invention provides a magnetic levitation controller, including a chassis; The chassis 100 is used to be fixed to the outside, and is fixed to the external rack through the chassis 100 during the use stage; in addition, an alarm device 3000 is provided on the chassis 100; the alarm device 3000 is used to alarm when an abnormal state inside the chassis 100 occurs; The magnetron plate 200, the motor control module 300, the switch module 400, and the DC power supply 500 are all disposed within the chassis 100; and temperature sensors are disposed on the magnetron plate 200, the motor control module 300, the switch module 400, and the DC power supply 500. Specifically, the temperature sensors are disposed on the magnetron plate 200, the motor control module 300, the switch module 400, and the DC power supply 500, respectively. During the use phase, the temperature sensors are used to obtain the temperatures of the magnetron plate 200, the motor control module 300, the switch module 400, and the DC power supply 500 during use. Several ventilation areas 700 are provided on the chassis 100, and shielding devices 800 are provided at the positions of the several ventilation areas 700. The shielding devices 800 are used to adjust the opening ratio of the ventilation areas 700. In the present invention, ventilation areas 700 are provided on all four sides of the chassis 100, and shielding devices 800 are provided at each ventilation area 700. The shielding devices 800 can be adjusted individually for each ventilation area 700 as needed to ensure that the opening degrees of different ventilation areas 700 are different. The heat dissipation device 900 is arranged on the chassis 100 and is connected to the interior of the chassis 100, and a vibration sensor 1000 is arranged on the heat dissipation device 900; the heat dissipation device 900 can generate gas flow inside the chassis 100, thereby reducing the internal temperature of the chassis 100; and when the heat dissipation device 900 is working, since it will adjust the speed as needed, the vibration it generates when the speed increases or decreases is different; the vibration condition of the heat dissipation device 900 is then obtained through the vibration sensor 1000 so that the heat dissipation device 900 can be adjusted.

[0023] The technical solution of the present invention is to provide temperature sensors on the magnetron plate 200, motor control module 300, switch module 400 and DC power supply 500 in the chassis 100, and provide a heat dissipation device 900 on the chassis; at the same time, a ventilation area 700 is opened on the chassis, and a shielding device 800 is provided in the ventilation area 700; the temperature condition in the chassis 100 is obtained by obtaining data from the temperature sensor, and the shielding device 800 is adjusted according to the temperature condition, and the chassis 100 is cooled after the heat dissipation device 900 is started; and in the use stage, if the temperature in the chassis 100 is not high, the heat dissipation device 900 can be stopped or the speed of the heat dissipation device 900 can be reduced; the opening of the ventilation area 700 is adjusted only by adjusting the shielding device 800, and gas flow cooling is performed through the ventilation area 700 and the inside of the chassis 100.

[0024] like Figure 4 As shown, the shielding device 800 includes a plurality of shielding sheets 801 and a driving device 802, and one end of the plurality of shielding sheets 801 is rotatably connected to the inside of the chassis 100. Specifically, a rotating block is provided in the chassis 100, and one end of the plurality of shielding sheets 801 is inserted into the rotating block and can rotate in the rotating block; the other end of the shielding sheet 801 is provided in the card slot 806; the driving device 802 is provided in the chassis 100 and is connected to the plurality of shielding sheets 801 through the driving plate 803; in the use stage, the driving device 802 pushes the driving plate 803 to perform a linear motion, and the plurality of shielding sheets 801 are rotated under the drive of the driving plate 803, and the angles of the plurality of shielding sheets 801 are changed during the rotation process; thereby completing the opening adjustment of the ventilation area 700.

[0025] like Figure 5 As shown, the other ends of several shielding plates 801 are each provided with a gear 804; the gear 804 is arranged in the slot 806; a tooth 805 is provided on the driving plate 803, and the tooth 805 is adapted to the gear 804; in this way, when the driving plate 803 is driven to move in a straight line by the driving device 802, the gear 804 can be driven to rotate in the slot 806 at the same time by the driving plate 803; and the angle of the shielding plate 801 is proportional to the travel distance of the driving plate 803; in this way, when adjusting the angle of the shielding plate 801, the moving distance of the driving plate 803 is adjusted by the driving device 802, so as to complete the angle adjustment of several shielding plates 801.

[0026] like Figure 6 As shown, the present invention also proposes a thermal management method for controlling a magnetic levitation controller, comprising the following steps: Through the temperature sensor array arranged on the magnetron plate 200, motor control module 300, switch module 400 and DC power supply 500 in the chassis 100, the temperature data of each area is collected in real time; the mechanical vibration amplitude and frequency inside the chassis 100 are monitored by the vibration sensor 1000; the temperature change rate is calculated and compared with the preset threshold, and the thermal anomaly level is determined in combination with the vibration data; wherein, the temperature change rate is ΔT / Δt; the shielding device 800 is dynamically adjusted according to the anomaly level, and the opening of the ventilation area 700, the speed of the heat dissipation device 900 and the alarm mode of the alarm device 3000 are adjusted through the shielding device 800; when the temperature exceeds the safety threshold or the vibration continues to be abnormal, the system is triggered to reduce load and start the backup heat dissipation module.

[0027] It should be noted that, in the present invention, the positions of the magnetron plate 200, the motor control module 300, the switch module 400 and the DC power supply 500 can be divided into four areas, the position of the magnetron plate 200 is the left side temperature, the switch module 400 is the right side temperature, the position of the motor control module 300 is the bottom surface temperature, and the position of the DC power supply 500 is the top surface temperature; when measuring by the sensor, it also means that the four surfaces of the chassis 100 are measured; in addition, a spare heat dissipation module is also provided in the present invention, and the spare heat dissipation module is provided on the heat dissipation plate of the magnetron plate 200; the preferred spare heat dissipation module is a semiconductor refrigeration plate.

[0028] Specifically, a PT100 thin film temperature sensor is provided on the magnetron plate 200; the sensor is directly attached to the heat sink of the magnetron plate 200; and thermal grease is filled between the temperature sensor and the heat sink, wherein the thermal conductivity of the thermal grease is ≥3W / m·K; in addition, the PT100 thin film patch sensor is installed within 5mm of the heat sink surface, and Kalman filtering is performed to eliminate noise interference; the motor control module 300 is provided with an infrared temperature measurement module, and the infrared temperature measurement module has a range of -20~150℃ and an accuracy of ±0.5℃; the switch module 400 includes an IGBT module, wherein each bridge arm of the IGBT module is configured with 2 NTC sensors; and a K-type thermocouple is mounted on the surface of the DC power supply 500.

[0029] The vibration sensor 1000 includes a MEMS accelerometer, an eddy current displacement sensor and a piezoelectric accelerometer. During use, the MEMS accelerometer, the eddy current displacement sensor and the piezoelectric accelerometer can be used to obtain the mechanical vibration amplitude and frequency of the heat sink 900 and the chassis 100; wherein, the MEMS accelerometer can be set adjacent to the heat sink 900 to obtain corresponding data of the location of the heat sink 900.

[0030] During the use phase, the temperature of the magnetron plate 200, the motor control module 300, the switch module 400 and the DC power supply 500 is detected in real time; and the vibration sensor 1000 data is obtained at the same time as the temperature detection; the obtained temperature data is compared with the threshold, and the thermal anomaly level is determined in combination with the vibration data; specifically, the temperature change rate is calculated using a sliding time window algorithm with a window length of 30-120 seconds, and the temperature change rate threshold is divided into three levels: primary warning: ΔT / Δt ≥ 5°C / min; intermediate warning: ΔT / Δt ≥ 10°C / min; emergency warning: ΔT / Δt ≥ 15°C / min; The shielding device 800 is adjusted according to the calculated results; specifically, the adjustment strategy of the shielding device 800 includes: according to the temperature field reconstruction results, the opening of the shielding device 800 on different sides is differentially controlled, and the opening of the shielding device 800 corresponding to the first area is increased to 1.2-2 times that of the second area; the opening of the shielding device 800 is linked to the speed of the heat dissipation device 900, and the relationship is satisfied: the speed of the heat dissipation device 900 = the basic speed + 0.5 × the opening of the shielding device 800 (%). Embodiment 1:

[0031] For example, the temperature field reconstruction data (temperature data of the four surfaces of the chassis 100) shows: the average temperature of the left side is 68°C; the average temperature of the right side is 52°C; the average temperature of the top surface is 60°C; and the average temperature of the bottom surface is 55°C. Set the base magnification to 1.2 (select the minimum opening difference between the first area shielding device 800 and the second area shielding device 800); set the maximum allowable temperature difference T_max to 20°C; and set the adjustment coefficient to 0.8 (map the temperature difference to the magnification range of 1.2 to 2.0). When the temperature difference ΔT=0°C, the opening ratio is 1.2; when ΔT=20°C, the opening ratio is 2.0; the initial opening of the shielding device 800 is set to 30%; the temperature difference calculation is performed based on the temperature field reconstruction data in the present invention: Left side: The temperature difference between the high temperature zone and the low temperature zone is ΔT=68-52=16℃; Opening ratio: 1.2+ (16 / 20) 0.8=1.84 times; left opening: 30%×1.84≈55%; Right side: The right side is the lowest temperature, and the opening is maintained at the benchmark 30%; Top surface: The temperature difference between the high temperature zone and the low temperature zone is ΔT=60-52=8℃; Opening ratio: 1.2+ (8 / 20) 0.8=1.52; Top opening: 30% 1.52≈46%; Bottom: The temperature difference between the high temperature zone and the low temperature zone is ΔT=55-52=3℃; Opening ratio: 1.2+ (3 / 20) 0.8=1.32; bottom opening 30% 1.32≈40%; Set the base speed: 60°C corresponds to 1000 rpm; according to the relationship: heat sink 900 speed = base speed + 0.5 × shielding device 800 opening (%), it can be obtained: Actual speed: 1000+0.5×[(55+46+40) / 3]=1023rpm; The shielding device 800 and the heat dissipation device 900 are adjusted based on the above calculation results to meet the usage requirements. As usage increases, the temperature detected by the temperature sensor will change accordingly, and corresponding adjustments need to be made in a timely manner based on the changed results. In addition, taking the left side as an example, data collection is performed in chronological order as shown in Table 1: Table 1 Temperature sensor data collection table in Example 1

[0032] Set Δt=60s; ΔT changes to 68-45=13℃; then ΔT / Δt=13℃≥10℃ / min; activate the intermediate warning. Example 2:

[0033] For example, the temperature field reconstruction data (temperature data of the four surfaces of the chassis 100) shows: the average temperature of the left side is 82°C; the average temperature of the right side is 63°C; the average temperature of the top surface is 71°C; and the average temperature of the bottom surface is 70°C. Set the base magnification to 1.2 (select the minimum opening difference between the first area shielding device 800 and the second area shielding device 800); set the maximum allowable temperature difference T_max to 20°C; and set the adjustment coefficient to 0.8 (map the temperature difference to the magnification range of 1.2 to 2.0). When the temperature difference ΔT=0°C, the opening ratio is 1.2; when ΔT=20°C, the opening ratio is 2.0; the initial opening of the shielding device 800 is set to 30%; the temperature difference calculation is performed based on the temperature field reconstruction data in the present invention: Left side: The temperature difference between the high temperature zone and the low temperature zone is ΔT=82-63=19℃; Opening ratio: 1.2+ (19 / 20) 0.8=1.96 times; left opening: 30%×1.96≈60%; Right side: The right side is the lowest temperature, and the opening is maintained at the benchmark 30%; Top surface: The temperature difference between the high temperature zone and the low temperature zone is ΔT=71-63=8℃; Opening ratio: 1.2+ (8 / 20) 0.8=1.52; Top opening: 30% 1.52≈46%; Bottom: The temperature difference between the high temperature zone and the low temperature zone is ΔT = 70-63 = 7°C; Opening ratio: 1.2+ (7 / 20) 0.8=1.48; bottom opening 30% 1.48≈45%; Set the base speed: 60°C corresponds to 1000 rpm. According to the relationship: heat sink 900 speed = base speed + 0.5 × shielding device 800 opening (%), it can be obtained: Actual speed: 1000+0.5×[(60+46+45) / 3]=1025rpm.

[0034] In addition, taking the left side as an example, data collection is performed in chronological order as shown in Table 2: Table 2 Temperature sensor data collection table in Example 2

[0035] Set Δt=60s, t=60s to t=120s; ΔT changes to 68-52=16℃; then ΔT / Δt=16℃≥15℃ / min; activate emergency warning.

[0036] In addition, the present invention also includes a historical data learning function. Specifically, by recording the associated data of temperature, vibration and heat dissipation adjustment parameters, and extracting features from the recorded data; building an LSTM model architecture through the extracted features, and training through multiple sets of collected data to complete the final model verification; using a rolling prediction algorithm to obtain the latest 30 sets of data; and combining the 30 sets of data obtained to predict future temperatures; based on the predicted future temperatures, calculating the opening of the shielding device 800 and the speed of the heat dissipation device 900; adjusting the opening of the shielding device 800 and the speed of the heat dissipation device 900 in advance; to cope with future temperature changes.

[0037] like Figure 7 As shown, the present invention also proposes a thermal management system using a thermal management method, comprising: The invention comprises at least four temperature sensors and one vibration sensor 1000; a plurality of ventilation areas 700 are provided on the chassis 100; specifically, temperature sensors are provided on the magnetron plate 200, the motor control module 300, the switch module 400 and the DC power supply 500, wherein a first temperature sensor 601 is provided on the magnetron plate 200, a second temperature sensor 602 is provided on the motor control module 300, a third temperature sensor 603 is provided on the switch module 400, and a fourth temperature sensor 604 is provided on the DC power supply 500; a vibration sensor 1000 is provided at a position adjacent to the heat dissipation device 900; an embedded MCU has a built-in temperature field reconstruction algorithm and PID speed regulation logic, and is connected to the four temperature sensors and the vibration sensor 1000; data acquired by the four temperature sensors and the vibration sensor 1000 are transmitted to the MCU, and corresponding control data are obtained after calculation in the MCU, and the control data are respectively sent to the shielding device 800 and the heat dissipation device 900, and the shielding device 800 and the heat dissipation device 900 are adjusted so that the adjusted shielding device 800 and the heat dissipation device 900 can meet the optimal use state of the detected temperature.

[0038] Of course, an alarm device 3000 is also provided in the chassis 100, and the alarm device 3000 is connected to the embedded MCU; after calculation by the MCU, primary warning, intermediate warning or emergency warning data can be obtained, and an alarm is issued according to the calculated level data; but it is necessary to ensure that the alarm information generated by the alarm device 3000 for different levels of warnings is also different, so as to ensure that the user can obtain the warning level according to the prompt content of the alarm device 3000; in the present invention, the alarm device 3000 is preferably a buzzer; during primary warning, the buzzer can repeat the alarm once; during intermediate warning, the buzzer can repeat the alarm twice each time; during emergency warning, the buzzer continues to sound to alarm; of course, the light and buzzer can also be set to alarm at the same time as needed; the specific details are subject to actual conditions, and the present invention will not be further explained.

[0039] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A magnetic levitation controller, characterized in that: include: A chassis (100) is used for fixing to the outside; and an alarm device (3000) is provided on the chassis (100); The magnetron plate (200), the motor control module (300), the switch module (400) and the DC power supply (500) are all arranged in the chassis (100); and temperature sensors are all arranged on the magnetron plate (200), the motor control module (300), the switch module (400) and the DC power supply (500); A plurality of ventilation areas (700) are provided on the chassis (100), and shielding devices (800) are provided at the positions of the plurality of ventilation areas (700), and the opening rate of the ventilation areas (700) is adjusted by the shielding devices (800); The shielding device (800) comprises: a plurality of shielding pieces (801), one end of each of which is rotatably connected to the interior of the chassis (100), and the other end of each of which is disposed in a slot (806); a driving device (802), which is disposed in the chassis (100) and connected to the plurality of shielding pieces (801) via a driving plate (803); The heat dissipation device (900) is arranged on the chassis (100) and is in communication with the interior of the chassis (100), and a vibration sensor (1000) is arranged on the heat dissipation device (900).

2. The magnetic levitation controller according to claim 1, characterized in that: The other ends of the plurality of shielding sheets (801) are each provided with a gear (804); the gear (804) is arranged in a slot (806).

3. The magnetic levitation controller according to claim 2, characterized in that: The driving plate (803) is provided with a latching tooth (805), and the latching tooth (805) is adapted to the gear (804).

4. A thermal management method for controlling the magnetic levitation controller according to any one of claims 1 to 3, characterized in that: The steps include: The temperature data of each area is collected in real time through the temperature sensor array arranged on the magnetic control board, motor control module, switch module and DC power supply in the chassis; Monitor the mechanical vibration amplitude and frequency inside the chassis through vibration sensors; Calculate the temperature change rate and compare it with the preset threshold, and combine it with the vibration data to determine the thermal anomaly level; the temperature change rate is ΔT / Δt; Dynamically adjust the shielding device according to the abnormality level, and adjust the opening of the ventilation area, the speed of the heat dissipation device and the alarm mode of the alarm device through the shielding device; When the temperature exceeds the safety threshold or the vibration continues to be abnormal, the system is triggered to reduce load and start the backup cooling module.

5. The thermal management method according to claim 4, characterized in that: The temperature change rate is calculated using a sliding time window algorithm with a window length of 30-120 seconds, and the temperature change rate threshold is divided into three levels: Primary warning: ΔT / Δt≥5℃ / min; Intermediate warning: ΔT / Δt ≥ 10℃ / min; Emergency warning: ΔT / Δt≥15℃ / min.

6. The thermal management method according to claim 4, characterized in that: The adjustment strategy of the shielding device includes: Based on the temperature field reconstruction results, the opening of the shielding device on different sides is controlled differentially. The opening of the shielding device corresponding to the first area is increased to 1.2-2 times that of the second area. The opening of the shielding device is linked to the speed of the heat dissipation device, and the relationship is satisfied: the speed of the heat dissipation device = the basic speed + 0.5 × the opening of the shielding device (%).

7. The thermal management method according to claim 4, characterized in that: Also includes: Historical data learning function: By recording the correlation data of temperature, vibration and heat dissipation adjustment parameters, the neural network model is trained; Predict the temperature change trend in the next 5 minutes and adjust the opening of the shielding device and the speed of the heat dissipation device in advance.

8. A thermal management system using the thermal management method according to any one of claims 4 to 7, characterized in that: include: Contains at least 4 temperature sensors and 1 vibration sensor; the chassis is equipped with several ventilation areas; Embedded MCU, built-in temperature field reconstruction algorithm and PID speed control logic, and connected to 4 temperature sensors and vibration sensors; The alarm device is connected to the embedded MCU.

9. The thermal management system according to claim 8, characterized in that: The temperature sensor adopts PT100 thin film patch sensor, which is installed within 5mm of the surface of the heating element and eliminates noise interference.

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