Modular system for optical assembly and connection techniques

Abstract

The invention relates to a low-light-level machine system (10) and a manufacturing method thereof. The invention relates to a glimmer-machine system (10) comprising: at least two carrier elements (40, 50), each carrier element (40, 50) having at least one connecting element (20, 30), each connecting element (20, 30) having at least one self-centering engagement element (300, 310, 320, 330) or being designed as a self-centering engagement element (300, 310, 320, 330), the engagement elements (300, 310, 320, 330) cooperating with each other in order to mechanically connect the carrier elements (40, 50) to each other by means of the engagement elements (300, 310, 320, 330); and at least two optical components (60, 70), where each optical component (60, 70) is fastened to one of the carrier elements (40, 50), where each optical component (60, 70) has at least one optical coupling site (80, 90), where the at least one optical coupling site (80, 90) comprises a beam shaping element (100, 110) created by a three-dimensional structuring method, and where the beam shaping element (100, 110) comprises at least one optical coupling site (80, 90). At least one optical coupling site (80, 90) there is an optical connection of the optical component (60, 70). In a glimmer-machine system (10), within an acceptable submicron-order tolerance range, micro-optical components can be precisely positioned and / or adjusted with a high degree of design freedom to provide personalized functionality in this manner.

Description

Technical Field

[0001] The present invention belongs to the field of photonics and micro-optics, and relates to a micro-opto-mechanical system and a method for manufacturing the same. The micro-opto-mechanical system is preferably used as a modular system for optical assembly and connection technology. Background Art

[0002] Optical mechanical systems and their manufacturing methods are well known in the prior art. In the macroscopic range, optical benches or optical tables are widely used in various fields, and they have a high degree of functional versatility due to their large number of available optical components and easy adjustment.

[0003] However, this does not allow for straightforward scaling to the microscopic scale range. Due to their tiny size, micro-optomechanical systems are typically developed and manufactured for a single, specific application. Subsequent fine-tuning is often costly. Currently, there is no solution for producing micro-optomechanical systems at microscopic scales without lengthy development, as is the case with assembling optical systems on an optical bench. The handling of microscopic components is crucial here, particularly because their functionality relies on extremely small tolerances. These components are difficult to position or adjust within acceptable submicron tolerances, making existing micro-optomechanical systems generally incapable of being adapted for other applications.

[0004] U. Wallrabe and J. Mohr, co-authored "Modular Microoptical Systems for Sensors and Telecommunication," published in "Sensors Update" (2003), Vol. 12, No. 1, pp. 143-174. The article describes microfiber coupling and the assembly of components such as receivers or spectrometers.

[0005] A. Gerlach, P. Ziegler, and J. Mohr, “Assembly of hybrid integrated micro-optical modules using passive alignment with LIGA mounting elements and adhesive bonding techniques,” Microsystemtechnologies, Vol. 7, No. 1, pp. 27-31, 2001, describe the components as an example of a system designed for a single application that cannot be easily modified or adapted to other needs.

[0006] S. Schüle, U. Hollenbach, J. Mohr, J. Li, and P. Vorreau, “Modular integration of microactuators and micro-optical benches,” published in the 2008 SPIE conference Micro-Optics 2008, pages 11–22, describe a method for assembling an interferometer using the LIGA process, in which several optical components are assembled into a system.

[0007] Kanty Rabenorosoa, Cedric Clevy, Sylwester Bargiel, Jean-Philippe Mascaro, Philippe Lutz, and Christophe Gorecki, “Modular and reconfigurable 3D micro-optical benches: concept, validation, and characterization,” International Manufacturing Science and Engineering Conference (2011), pp. 479–485, and S. Bargiel, K. Rabenorosoa, C. Clevy, C. Gorecki, and P. Lutz, “Towards micro-assembly of hybrid MOEMS components on a reconfigurable silicon free-space micro-optical bench,” Journal of Micromechanics and Microengineering, vol. 20, no. 4, p. 045012, describe a retention system for adjustable micro-optical components with mechanical guides that can be aligned along the optical axis.

[0008] Tobias N. Ackermann, Jordi Vila-Planas, Xavier Munoz-Berbel, Erica Alvarez-Conde, Daniel Kopp, Hans Zappe, and Andreu Llobera, “A toolbox for fast and simple assembly of a photonic lab on a chip,” CLEO: Science and Innovations (Optica Publishing Group, 2016), SWIG.3, describe how to modularly assemble microfluidic systems for optical research.

[0009] Pentti Karioja, Kimmo Keränen, Mikko Karppinen, Kari Kautio, Veli Heikkinen, Markku Lahti, Jyrki Ollila, Jukka Tapani, Mäkinen, Kari Kataja, Jarkko Tuominen, Tuomo Jaakola, Sang Hyun Park, Pentti Korhonen, Teemu Alajoki, Antti Tanskanen, Jaakko Lenkkeri, and Juhani Heilala, “LTCC toolbox for photonics integration,” published in the 2006 CICMT exhibition, IMAPS / ACerS IntT Conf, and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, pages 25–27, describe the construction of micro-optomechanical systems made of multilayer-coated glass-ceramic plates with integrated micro-optical components.

[0010] Norbert Keil, Crispin Zawadzki, Ziyang Zhang, Jin Wang, Nelson Mettbach, Norbert Grote, and Martin Schell, “Polymer PLC as an optical integration bench,” published in the Optica Publishing Group’s Optical Fiber Communication Conference (2011), page OWM1, describe methods for fabricating micro-optomechanical systems for beam splitting using thin-film components and waveguide-retaining grooves. Moritz Kleinert, Davidde Felipe, Crispin Zawadzki, Walter Brinker, and Jung Han Choi, “Photonic integrated devices and functions on hybrid polymer platform,” published in the SPIE 2017 Physics and Simulation of Optoelectronic Devices XXV, pages 220-230, further extend this approach using thin-film technology.

[0011] Yasuhiko Aoki, Toshio Kato, Rogerio Jun Mizuno, and Kenichi Iga, “Micro-optical bench for alignment-free optical coupling,” Applied Optics, Vol. 38, No. 6, pp. 963–965, 1999, describe possible approaches to coupling micro-optical components or systems.

[0012] Ulrich K. Gengenbach, “Automatic assembly of micro-optical components,” SPIE Microrobotics: Components and Applications (1996), pp. 141–150, describes the problems associated with automatic alignment of micro-optical components.

[0013] Carmelo Scarcella, Kamil Gradkowski, Lee Carroll, Jun-Su Lee, Matthieu Duperron, Daivid Fowler, and Peter O'Brien co-authored "Pluggable single-mode fiber-array-to-PIC coupling using microlenses," published in IEEE Photonics Technology Letters (2017), Vol. 29, No. 22, pp. 1943-1946. The paper exploits the positioning precision of Lego bricks to optically couple two components.

[0014] Patent document DE3219399C2 discloses an optical assembly arranged along an optical axis by a rod. For this reason, the rod system is used as a holding and guiding mechanism, but cannot be applied in the form described above within the micrometer range.

[0015] Patent document DE 198 20 524 A1 discloses micro-optical components that are mounted on a circuit board with a hole pattern using latches. To achieve this, each micro-optical component is manufactured separately from a retaining mechanism and fastened to the circuit board with the hole pattern. Positioning and adjustment are limited by the hole pattern grid. Furthermore, the micro-optical components must be manually mounted on the carrier plate.

[0016] Patent document US2003 / 0231835A1 discloses a feasible solution for securing and aligning a micro-optical assembly along the optical axis on a micro-optical bench. This solution is based on a slender mounting base for receiving the micro-optical assembly. Here, the outer curved surface of the mounting base is designed as a negative shape, inversely shaped to the outer contour of the optical assembly, allowing the micro-optical assembly to be positioned on the mounting base through mating.

[0017] Patent document DE102005050274A1 discloses a beam-guiding coupling device for optical systems, which facilitates unidirectional or bidirectional beam transfer between optical systems via a connecting device and a mechanical centering mechanism. The connecting device incorporates a magnetic coupling mechanism within the coupling region to achieve the coupling connection. The centering mechanism is configured and arranged on the opposing optical systems to be coupled, enabling automatic centering of the beam guidance under magnetic attraction.

[0018] Patent document WO2013 / 010634A1 discloses an optoelectronic module in which optoelectronic components (particularly chips) are attached to a two-dimensional carrier. This chip-on-board (CBO) module is an electrical assembly comprising at least one carrier and at least one unpackaged semiconductor component mounted on the carrier. Regarding optical coupling, the document describes how to fabricate and attach lenses for light incoupling and outcoupling.

[0019] Patent document DE 10 2016 221 464 A1 discloses a system having optical components and positioning and fixing them on a common base plate. Summary of the Invention

[0020] In view of this, an object of the present invention is to provide a micro-optical machine system and a manufacturing method thereof, which can at least partially overcome the disadvantages and limitations of the prior art.

[0021] In particular, the present invention aims to provide a method for manufacturing a micro-optomechanical system, by means of which micro-optical components can be positioned and / or adjusted as precisely as possible within acceptable submicron tolerances and with a high degree of design freedom, thereby providing the micro-optomechanical system with the most personalized functionality possible. Ideally, the individual components of the micro-optomechanical system can be replicated in three-dimensional structuring methods, preferably in parallel and in large quantities.

[0022] The solution of the present invention for achieving the above-mentioned object is a micro-optical machine system and a method for manufacturing the same having the features described in the independent claims. Advantageous improvements that can be realized individually or in any combination are described in the dependent claims and the following.

[0023] In a first aspect, the present invention relates to a micro-optical machine system, comprising: - at least two support elements, wherein each support element has at least one connecting element, wherein each connecting element is provided with at least one self-centering coupling element or is designed as a self-centering coupling element, wherein the coupling elements cooperate with one another in order to mechanically connect the support elements to one another via the coupling element; and - at least two optical components, wherein each optical component is fastened to one of the carrier elements, wherein each optical component has at least one optical coupling site, wherein at least one optical coupling site comprises at least one beam shaping element created by a three-dimensional structuring method, and wherein an optical connection of the optical components exists at the at least one optical coupling site.

[0024] According to the present invention, at least two single modules are interconnected to form the micro-optical mechanical system, which can be expanded arbitrarily by connecting at least one additional module. Here, the term "module" refers to a smallest device that cannot be further disassembled into smaller devices, otherwise the predetermined function of interconnecting at least two single modules (especially splicing or serial connection) will be lost. Each module includes a carrier element having at least one connecting element. To this end, the carrier element can have only one connecting element or preferably have two, four or more connecting elements. The term "connecting element" refers to a micromechanical element configured to establish a mechanical connection with other carrier elements that are also equipped with connecting elements.

[0025] Here, the term "joining element" refers to a micromechanical element contained in the connecting element, which is capable of establishing a mechanical connection with other modules, thereby defining the position and relative positioning of the interconnected modules with respect to each other. The joining elements are designed to cooperate with each other so that the supporting elements can be mechanically connected to each other through the joining elements. In a particularly preferred design, the joining elements can be mechanically connected to each other in a form-fitting manner through the form fit achieved thereby. The connecting elements can be configured in particular as self-aligning joining elements that are matched to each other and preferably identical to each other, which are connected in series and / or stacked in a planar manner; however, other types of mechanical connections between two modules can also be envisaged. For this purpose, the same type or different types of joining elements can be used respectively. The joining elements can be designed in particular to cooperate with each other so that they can be structurally embedded in each other, in particular as identical pairs and / or as plug and socket forms.

[0026] According to the present invention, the coupling element is designed as a self-centering coupling element. The term "self-centering" refers to the geometric properties of the coupling element that allow it to mechanically connect one module to another along a predetermined mechanical axis. To this end, the self-centering coupling element can be configured to cause the position and orientation of another coupling element to be attached to it to change, for example, by sliding and / or rotating, until the desired mechanical connection is established along the predetermined mechanical axis. Additionally, tapered transitions and / or undercuts in the coupling element can restrict movement in at least one undercut direction, thereby fixing the defined position and orientation of the interconnected modules. This type of mechanical connection allows rotational and translational degrees of freedom to be restricted from a number of initial positions and orientations, preferably resulting in a statically defined final position with fewer degrees of freedom than the initial position. In particular, in the statically defined final position, all degrees of freedom can be restricted to limits that disallow further translational or rotational movement. However, selected rotational and / or translational degrees of freedom can also be permitted. This approach enhances the modularity of the micro-optical machine system of the present invention. In particular, the use of coupling elements of the same predetermined shape allows for a clear definition of at least one optical axis, in particular an optical axis passing through the optical coupling point between modules of the same or different sizes and shapes. However, depending on the function of the participating modules (in particular, depending on the respective optical configuration of the respective modules), it may be advantageous to correspondingly modify the shape and size of the participating modules, in particular the carrier element and the coupling elements it contains. These modifications may in particular relate to the type, number, alignment, and / or orientation of the optical components and their associated optical coupling points. Alternatively or additionally, such modifications may involve the design of at least one stop or marking, wherein preferably at least one vertical ramp, at least one step, or at least one common surface serves as a stop, and the marking may in particular include a measurement mark. Further details regarding the at least one stop or marking are provided below.

[0027] In certain embodiments, the micro-optical mechanical system may further include at least one additional carrier element, to which no optical components are fastened and which does not include any beam shaping elements. The at least one additional carrier element may preferably serve as a placeholder to establish a desired spacing between at least two modules and / or at least two optical components. In particular, it may be preferable to provide space for attaching at least one additional component (preferably an additional optical component) on a surface extending beyond the bottom surface of the at least one carrier element. To bridge this spacing, a collimated beam may preferably be used. However, other designs for the at least one additional carrier element are also contemplated.

[0028] Due to the precise arrangement of the supporting elements relative to one another, the modules can be equipped with optical components that are positioned and oriented in alignment with one another, allowing optical coupling between the individual modules via light transmission. The term "positioning" refers to the arrangement of the components at a specific location in three-dimensional space, while the term "orientation" refers to the orientation of the components within that location in three-dimensional space. For simplicity, electromagnetic radiation is often referred to simply as "light," but its wavelength is not limited to the wavelength λ within the visible range (λ = 400nm to 800nm) and encompasses any type of electromagnetic radiation that can be guided in an optical waveguide. This includes, in addition to electromagnetic radiation within the visible range, electromagnetic radiation in the ultraviolet range (λ = 10nm to 400nm), infrared range (λ = 800nm ​​to 1mm), terahertz or millimeter wave range (λ = 30μm to 3mm or λ = 1mm to 1cm), and microwave range (λ = 1mm to 1m). Depending on the wavelength selected, optical components may differ in composition and / or mode of operation, even if they have the same function. Unless otherwise stated, the values ​​given below (especially for structure dimensions or performance parameters of the 3D microstructuring method, in particular resolution or accuracy) refer to an arrangement configured for a vacuum operating wavelength λ ≈ 1.5 μm. For other operating wavelengths, the values ​​given may be scaled to the wavelength, taking into account, in particular, the refractive index of the materials used.

[0029] The term "optical component" refers to a structure on a component or individual components for emitting, transmitting, receiving, detecting, and / or manipulating light, while the term "optomechanical system" refers to the arrangement of at least two optical components on at least two supporting components. Preferably, each optical component used within the scope of the present invention is selected from the following group: glass optical fibers, in particular single-mode or multimode optical fibers made of organic or inorganic materials; integrated optical chips, in particular photodiodes, linear or planar photodiode arrays, CCD arrays, or image sensors, in particular based on semiconductors (preferably silicon or III-V compound semiconductors) or dielectric materials (preferably glass, silicon dioxide, silicon nitride, or polymers); bolometers; lasers, in particular vertical-cavity surface-emitting lasers (VCSELs) or edge-emitting lasers; superluminescent diodes; optical circuit boards; free-space optical elements, in particular lenses, beam splitters, isolators, mirrors, or diffraction gratings. Other optical components are also contemplated. The optical components may preferably include optical waveguides with low refractive index contrast, in particular based on glass, or optical waveguides with medium or high refractive index contrast, in particular based on semiconductors or dielectric materials. Light incoupling or outcoupling can preferably occur at the edge or surface of an optical component, in particular the edge of an edge-emitting laser, a chip edge, or a facet of a waveguide-based system; alternatively, it can occur on the surface of a surface-emitting laser or a surface-illuminated photodiode, or on the surface of a waveguide-based chip with at least one light coupling site, in particular comprising a grating coupler or a light deflecting element. However, other types of light incoupling or outcoupling are also conceivable.

[0030] The term "optical waveguide" refers to any arrangement configured to guide electromagnetic waves, in particular within the wavelength range given above. This preferably encompasses single optical waveguides, branched optical waveguides, polarization filters, polarization beam splitters, polarization converters, tapered waveguides, directional couplers, couplers based on multimode interference (MMI), waveguide networks, and waveguide-based components, possibly in combination with micro-optical elements such as lenses, mirrors, or prisms. However, other types of optical waveguides are also conceivable. In this case, for example in the case of optical waveguides based on photonic band gaps or photonic crystals, the guidance of electromagnetic waves in the optical waveguide can be achieved, in particular, by total internal reflection at optical interfaces or by multiple reflections at periodically arranged elements. In more complex optical waveguides, such as so-called "subwavelength grating waveguides" (SWG for short), the waveguide principle is based on an effective increase in the refractive index in the core region of the waveguide. In contrast to light propagation in free space, guiding light through optical waveguides is based on the principle that the lateral divergence of light propagating in an optical waveguide is suppressed or, in the case of converging or diverging optical waveguides, controlled by a continuous interaction of the light with a dielectric interface. This allows axial light guidance within an elongated region in the direction of propagation, with the axial extension ratio of the light-filled region preferably being greater than 3, particularly preferably greater than 5, and even more preferably greater than 10 or 20. In addition to at least one optical waveguide, the optical component may also have further optical structures, in particular, selected from at least one refractive, diffractive, and / or reflective optical element, such as at least one lens or mirror, which is configured to additionally modify the propagation of electromagnetic radiation in the optical component.

[0031] In a preferred embodiment, for a vacuum operating wavelength of approximately 1.5 μm, the layer thickness of the optical waveguide deposited onto one of the optical components or one of the carrier elements can preferably be 10 nm to 1000 nm, particularly preferably 30 nm to 500 nm, and in particular 50 nm to 300 nm. This allows, in particular, the creation of at least one optical waveguide with a deviation of less than 1000 nm, particularly preferably less than 500 nm, and in particular less than 100 nm. The resolution of the three-dimensional structuring method can preferably be better than 3 μm, particularly preferably better than 1 μm, and in particular better than 500 nm. In particular, for replication achieved using the three-dimensional structuring method, the resolution can deviate from the original form to be replicated by less than 3%, particularly preferably less than 2%, and in particular less than 1%, due to misalignments and / or tolerances in the fabrication process. These values ​​relate to the fabrication of the optical waveguide for a vacuum operating wavelength of approximately 1.5 μm. For other operating frequencies, the dimensions of the at least one optical waveguide and the accuracy and resolution requirements of the three-dimensional structuring method used for its fabrication can be scaled accordingly, optionally taking into account the refractive index of the material used.

[0032] Each module of the micro-optical mechanical system of the present invention also includes at least one optical component fastened to an associated supporting element. To this end, the supporting element may have at least one receiving element for receiving at least one component to be received, in particular an optical component and / or an electronic component to be received. The term "receiving element" refers to a micromechanical element that is configured to establish a mechanical connection between the element and at least one component to be received, in particular to establish a mechanical connection between at least one supporting element and at least one optical component and / or an electronic component, and to establish a mechanical connection between at least one supporting element and at least one supporting layer, between at least two supporting layers, or between at least one supporting layer and at least one optical component and / or an electronic component. Here, the mechanical connection may in particular involve planar concatenation and / or stacking. To this end, in a preferred design, at least one stop may be used, wherein preferably at least one vertical ramp or at least one step or at least one shared surface is used as a stop, in particular for limiting the vertical position or horizontal position between the element and at least one component to be received. Alternatively or additionally, the carrier element may include at least one component incorporated into the carrier element volume and / or directly attached to the carrier element surface, which component may be designed, in particular, as a beam shaping element and / or a receiving element and / or a positioning element. The term "electronic component" herein refers to an independent component configured to transmit and / or manipulate electrical power. The present invention is particularly suitable for electronic components selected from the group consisting of conductive traces, electronic chips, integrated circuits, voltage sources, resistors, capacitors, inductors, diodes, transistors, or sensors; however, at least one other electronic component may also be used.

[0033] In a preferred design, the size and shape of the receiving element may correspond to the same specifications as the joining element. At least one receiving element may preferably be designed as a self-centering receiving element, which is particularly adaptable to at least one component to be received, particularly at least one optical component and / or electronic component to be received. After completing the reception, the at least one receiving element may be connected to the at least one component to be received in a detachable or non-detachable manner. The reception may be completed as a planar series connection and / or stacking manner. In a specific design, at least one receiving element may be designed with at least one undercut structure, particularly for connecting at least one component to be received with the receiving element in a detachable or non-detachable manner. In a specific design, an optical component that is not fastened to the relevant supporting element by at least one receiving element may preferably be created on and / or in the supporting element by a three-dimensional structuring method. Alternatively or additionally, an optical component that is not fastened to the relevant supporting element by at least one receiving element may be made together with the supporting element by a three-dimensional structuring method, preferably integrating the optical component into the volume of the supporting element in only a single step. In this design, these elements can be designed as three-dimensional interconnected structures, replicated with shape memory materials and / or created by three-dimensional structuring methods. However, other element creation methods are also conceivable.

[0034] In another specific embodiment, at least one optical component can be used as a built-in optical component, which is positioned and / or oriented by a preferably tapered retaining mechanism arranged on or at a carrier element. The retaining mechanism can, in particular, have an undercut structure. A receiving element on the carrier element can be aligned with the at least one optical component in such a way that it connects the associated module along the optical axis to the other module to be connected, thereby achieving the desired optical coupling.

[0035] In another specific embodiment, particularly for use in the fields of medical technology or biosensing, the micro-optomechanical system (preferably at least one carrier element) can include at least one flow-guiding component, which can be equipped with a receiving element. The module can be designed to allow at least one component (particularly an optical and / or electronic component) to be placed in the light path, thereby manipulating and / or guiding incident light, coupling it into at least one component, and / or detecting changes in transmission. Many other applications are also conceivable, particularly in the field of data transmission.

[0036] In another specific embodiment, the micro-optical mechanical system (preferably at least one carrier element) may include at least one thermoelectric component, in particular a heating element or a Peltier element.

[0037] In a preferred embodiment, the micro-optical mechanical system can include at least one material that is thermally stable or at least thermally load-resistant, preferably up to temperatures of 350° C., particularly preferably up to 200° C., and particularly preferably up to 100° C. In the configuration of the components of the micro-optical mechanical system, thermal expansion of materials with different coefficients of expansion can be taken into account, in particular to compensate for thermally induced tolerance variations, preferably by means of at least one elastically adjustable receiving element and / or positioning element, preferably in the form of a clamping element.

[0038] According to the present invention, each optical component has at least one optical coupling site. The term "optical coupling site" refers to a spatial location where an optical connection is established between two optical components (which may be referred to as a "light-emitting component" and a "light-receiving component" based on the optical path). In this regard, an optical coupling site is configured to interconnect the two optical components via an optical axis created by at least two interconnected optical components, thereby optically coupling modules that each include one of the two interconnected optical components.

[0039] In the micro-optomechanical system of the present invention, at least one of the optical coupling sites includes a beam shaping element created using a three-dimensional structuring method. The beam shaping element is configured to manipulate light so as to couple light from the optical structure of the first module into the second module. The terms "first," "second," and so on are used herein to describe elements and do not imply a sequence, importance, or temporal relationship, nor do they exclude the presence of other similar elements. Furthermore, "three-dimensional structuring method" refers to a microlithographic method for creating three-dimensional microstructures. Particularly suitable three-dimensional structuring methods for the present invention are selected from: 3D microprinting methods, particularly stereolithography (SLA), two-photon polymerization (2PP or TPP), fused deposition modeling (FDM), or projection microstereolithography (PSL); replication methods, particularly thermoforming, microinjection molding, or three-dimensional replication methods utilizing a shape memory effect; etching methods, or deposition methods. The shape memory effect can be utilized during fabrication and / or in subsequent method steps, primarily to restore the original shape and position after minor deformation or subsequent damage.

[0040] At least one additional component or subcomponent can also be created by at least one microlithographic method, in particular by the three-dimensional structuring method described herein. The module is preferably replicable in a polymer, particularly preferably in a shape memory polymer. When using a thermoplastic shape memory polymer, a single-connected three-dimensional structure with an undercut structure can be replicated, just as an elastic mold is combined with a liquid UV photoresist. For manufacturing by a three-dimensional structuring method, a replicable design can preferably be selected. In order to reduce post-processing, assembly tolerances and joining tolerances and shorten the manufacturing process, it may be advantageous to integrate as many optical structural functions and components as possible into the carrier element and manufacture them together with the carrier element using a unified method.

[0041] In a specific embodiment, in the three-dimensional structuring method, the residual carrier layer on which the part to be replicated is located can preferably be removed, whereby in particular the carrier elements have the same height and thus the same optical axis position. To this end, the residual carrier layer can preferably be removed by a method selected from cutting, etching or dissolution, preferably in an inverted manner, in order to obtain better accessibility. Alternatively, the residual carrier layer can be kept at a defined height, whereby in particular the carrier elements and / or the carrier surface have the same height and thus the same optical axis position. It may be advantageous here to remove the residual carrier layer at at least one edge of one of the carrier elements. Preferably, the carrier element and / or the carrier surface and / or the connecting element and / or the receiving element can be designed to have an at least partially straight edge, which edge should preferably be as accessible as possible.

[0042] Here, the optical component is mounted on and / or at and / or in at least two support elements, such that an optical connection of the optical component exists at at least one optical coupling point. To this end, at least one beam shaping element, together with at least one coupling element of the support element of the first module, is optically coupled to at least one matching coupling element of the support element of the second module, at least one optical component, and optionally a beam shaping element. The optical path of the optical connection can, in particular, have the following sections: i. A beam expansion section characterized by a progressively increasing beam diameter within this section. The beam expansion section can utilize the natural divergence of the light field emerging from the optical component and / or modulate the light field using sub-elements of the beam shaping element. In particular, the divergence can be enhanced using concave lenses, convex mirrors, or diffractive elements fabricated using three-dimensional structuring methods. Another beam expansion approach may involve fabricating an optical waveguide to initially reduce the mode field diameter. The beam is then propagated outside the optical component in free space, thereby achieving a high degree of divergence. The beam divergence and / or far-field virtual beam extension in the beam expansion section can preferably be at most 6°, particularly preferably at most 15°, and especially at most 30°, both defined as the half-angle (light intensity is measured at 13.5% of the peak intensity).

[0043] ii. A collimated section, characterized by only slight variations in the beam diameter within this section. Collimating optical components, such as concave mirrors or convex lenses, are preferably used in the transition region between the beam expansion section and the expanded collimated section. This section may, for example, form a beam waist. The "beam waist" can be located approximately at the plane of the phase front of a Gaussian or quasi-Gaussian beam. For a wavelength of 1550 nm, the beam waist size (i.e., beam waist diameter) can preferably be 5 μm to 100 μm, particularly preferably 10 μm to 80 μm, and especially 15 μm to 50 μm. The associated beam divergence (measured in half-angle) can be derived from the general formula for Gaussian beams and is preferably at most 12°, particularly preferably at most 6°, and in particular at most 4°. These values ​​may vary accordingly for wavelengths above and below 1550 nm. The light field distribution created by the beam shaping element should preferably correspond as closely as possible to the in-coupling light field distribution of one of the optical components.

[0044] iii. Beam convergence section, characterized by further decrease of the beam diameter in this section. The design of the beam convergence section can be similar to the measures described in point i for the beam expansion section.

[0045] In a specific embodiment of the micro-optical machine system according to the present invention, at least one of the support elements (preferably all participating support elements) can be fastened to at least one support level, preferably to exactly one support level. To this end, at least one support level can be configured to further position and / or orient individual modules or interconnected modules (also known as a "module group"). For positioning and / or orientation, a receiving element, particularly a tapered receiving element, can be used, which may have at least one undercut, particularly for securing the module. The receiving element can be designed to allow movement of the support element on the support level and / or movement of the support level on another support level, preferably in one-dimensional translation. Adjacent modules and / or modules on the support level can be arranged flat or vertically tilted 180°. Positioning and receiving elements for arranging the modules can be provided on the top side of the modules and / or module group and / or at least one support level. In this embodiment, the bottom side of at least one support element, or the top side of at least one tilted support element in the case of inversion, and the top side of at least one support level can preferably be at the same height. This allows for a defined height reference for the optical axis used to connect the modules. For example, if the optical axis in the optical assembly exhibits a height offset due to additional support surfaces or height differences between support elements or support surfaces, this height offset can be compensated for by adjusting the module height, adjusting the optical assembly height, arranging the beam shaping elements, support elements, retaining mechanisms, and / or platforms at different heights, and / or by using at least one additional support surface. The support surface can include a predefined support element for attaching the at least one additional support surface, which preferably functions as a coupling element. Furthermore, positioning and / or support elements can also serve to protect the optical components and / or act as spacers for the optical components.

[0046] In certain embodiments, at least one of the engaging element and / or the receiving element can be designed as a positioning element and / or include at least one positioning element. During the fabrication of the micro-optical system, this positioning element can be configured to bring the assembled component into its final position as directly as possible. Specifically, a predetermined positioning element is provided, and the final position is achieved through rotational and / or translational movement. This allows the three-dimensional, highly precisely defined final position of each module in the micro-optical system to be adjusted as precisely as possible to a desired positioning tolerance level, in particular a 1 dB positioning tolerance level. The term "1 dB positioning tolerance" describes the threshold for a 1 dB coupling loss between two optical components, which is attributed to the alignment accuracy of the optical coupling point, in particular with respect to lateral deviations of the beam profile, lateral deviations relative to the optical coupling point, angular deviations and / or alignment errors, absorption losses, reflection losses, and scattering losses (in particular due to Rayleigh scattering). The alignment accuracy is derived from the sum of all tolerance-related individual deviations, typically including manufacturing tolerances, assembly tolerances, and environmental tolerances (in particular due to vibration or magnetism, or ambient temperature, humidity, or air pressure). The minimum beam diameter at the optical coupling point between the two optical components may preferably be twice, particularly preferably five times, and especially more than ten times the alignment accuracy. Here, the beam diameter at the optical coupling point between the two optical components may preferably be 1 μm to 10 mm, particularly preferably 5 μm to 1 mm, more preferably 10 μm to 200 μm, and especially 15 μm to 100 μm. The term "beam diameter" refers to the diameter of the area measured perpendicular to the propagation direction of the beam, where the light intensity is greater than 1 / e 2 , i.e., greater than 13.5% of the peak intensity typically occurring on the optical axis. Alternatively, the term "beam diameter" may refer to the Full Width at Half Maximum (FWHM) or four times the standard deviation of the intensity distribution (D4σ beam width). For example, for a 50μm beam diameter, the required alignment accuracy of the optical coupling point is at least 25μm, particularly preferably at least 10μm, and in particular at least 5μm. The purpose and / or application environment of the optical component may also be taken into account, in particular thermal expansion when using materials with different thermal expansion coefficients. The mechanical positioning tolerance of the connecting element can be derived from the 1dB positioning tolerance. The term "tolerance" refers to the deviation between the actual state and the target state or the deviation between the actual parameter and the target parameter. Deviations in shape and position may occur due to manufacturing and assembly. Here, the term "tolerance" refers to the tolerance chain of each node in the product development chain, resulting from the sum of all manufacturing tolerances and assembly tolerances that have occurred in time and space. These deviations may result in a difference between the actual position of the optical axis and / or optical coupling site and the target position under the condition of the lowest possible transmission loss.

[0047] For this purpose, preferably, a positioning element can be used, the shape of which is produced together with the optical component, and which is designed to position the optical component in the form of a stop by points, lines and / or surfaces created on, at or in the optical component, or by existing points, lines and / or surfaces, so that the optical component can be precisely positioned while maintaining the required positioning tolerances. The shape can be produced by a method selected from the group consisting of forming methods (such as etching, deep etching or cutting, etc.) or from the group consisting of casting methods, in which the points, lines and / or surfaces can be predetermined. However, it is also conceivable to use at least one other forming production method. Here, the design of the optical structure can be matched to the positioning and / or orientation of the components to be joined, in particular when there is a preferred orientation for the positioning and / or orientation. In particular, the components to be joined can be positioned upright or inverted.

[0048] The interconnected supporting elements, the supporting elements and at least one supporting layer, and / or at least two supporting layers can be removably connected to each other while maintaining their shape and function, thereby facilitating subsequent use of the micro-optical machine system. Alternatively, the interconnected supporting elements, the supporting elements and at least one supporting layer, and / or at least two supporting layers can be non-removably connected to each other while maintaining their shape and function, depending on the configuration and use of the micro-optical machine system, in order to achieve a particularly stable micro-optical machine system.

[0049] The function of a module or module group can depend in particular on the respective optical configuration. Preferably, the module dimensions adapted thereto can deviate from the preferred standard dimensions, ie less than 100 cm 2 , particularly preferably at most 20 cm 2 , particularly preferably at most 5 cm 2 , especially up to 2 cm 2, as long as the optical axes of the two interconnected modules are aligned. In a preferred design, the outer edges may form right angles; alternatively, the outer edges may form angles other than 90°. In specific designs, individual modules may deviate from the preferred rectangular shape, with the longest planar side preferably equal to or an integer multiple of the shortest planar side. This can be achieved, particularly when two modules are connected at a defined angle, by deviating from the base shape of the carrier element, preferably in the form of a triangle, trapezoid, parallelogram, or a combination thereof. Furthermore, the module size may be increased or decreased, depending on expansion or contraction of the module during fabrication, particularly due to overexposure during DLP (Digital Light Processing) printing, the minimum writing unit size determined by voxels during 2PP (Two Photon Polymerization) printing, or material shrinkage effects. The optical assembly is mounted on the carrier element via at least one receiving element to achieve optical coupling by combining at least one coupling element of the carrier element of the first module with a matching coupling element and at least one beam shaping element of the second module. The module dimensions may deviate from the preferred standard dimensions as long as the optical coupling site between two modules is well defined via the mutual engagement of the engagement elements.

[0050] In another embodiment, a single module, a module group, or the entire micro-optical mechanical system can be filled with a solid, optically transparent medium, in particular to protect the micro-optical mechanical system or parts thereof from external influences, prevent mechanical displacement or deformation of aligned components, facilitate operation, create a refractive index contrast, form an additional coupling point for mounting at least one additional component, increase transmittance, or prevent back reflection or unintended outcoupling. The term "transparent" here refers to the optical property of a material that allows electromagnetic waves to pass through with minimal material absorption. The material absorption of the material is preferably less than 10 dB / mm, more preferably less than 5 dB / mm, and even more preferably less than 2 dB / mm or 1 dB / mm.

[0051] In another specific embodiment of the micro-optical mechanical system according to the present invention, at least one carrier element and / or at least one carrier surface can preferably be provided with at least one metal layer, which is designed as at least one conductive trace. The at least one conductive trace can, in particular, be configured for electrical contacting at least one optical component. To this end, the at least one conductive trace can itself be connected to at least one optical component, at least one electronic component, and / or at least one external interface (preferably designed as a contact pad and preferably configured to supply electrical energy and / or transmit information) in the form of at least one bond, preferably at least one wire bond. Two carrier elements, two carrier surfaces, or a carrier element and a carrier surface can be connected to each other in the form of a bond, preferably a wire bond. However, other designs of the at least one conductive trace are also conceivable. The conductive trace can be formed using a mask. Preferably, an adhesion layer can be applied first, preferably comprising a metal with good adhesion, in particular chromium, followed by a starting layer for subsequent electroplating, preferably comprising a metal with good conductivity, in particular gold. For electroplating, the conductive traces can be deposited in a plating bath to the desired layer thickness, which depends, among other things, on the cross-section of the conductive traces, the applied current intensity, and the voltage. Alternatively or additionally, the conductive traces can be applied directly to the carrier element or carrier layer using a microstructuring method, preferably micro laser sintering.

[0052] In another embodiment, at least one carrier element and / or carrier surface may have a clearance and / or opening to provide access to the optical assembly, optical components, and / or electrical components. The clearance and / or opening may be designed to ensure contactless assembly of the components to be joined, and / or at least one carrier element and / or carrier surface may only be partially supported. This embodiment may also include a mounting element on the top side of at least one carrier element to enable inverted mounting of the components and / or to provide access from the bottom.

[0053] The present invention's micro-optical machine system is similar to the patent document DE102016221464A1 (especially Figure 22 ) is that the ambient medium in the latter is mainly used to reduce the refractive index contrast or adjust the precise spacing between optical components. Figure 22In the embodiment, the two chips are provided with beam shaping elements embedded in the ambient medium, while the alignment structure shown is directly located in the ambient medium that completely encloses the optical component. In contrast, no ambient medium is required in the micro-optical system of the present invention. In the micro-optical system of the present invention, each supporting element is provided with a connecting element, which in turn has a self-centering coupling element or is designed as a self-centering coupling element. By combining connecting elements (also designed as coupling elements) that match each other, it is possible to determine the final posture based solely on the shape, and to reach the final posture solely through the coupling process of the two supporting elements. In contrast, the alignment structure illustrated in DE102016221464A1 is not a coupling element, and it is neither possible to easily hold the subsystem in place nor to obtain a statically determined final posture. Finally, in the micro-optical system of the present invention, there is no need to fix the optical component to a common base plate, because the positioning of the supporting element can be automatically obtained through the coupling process of the self-centering coupling element placed on the supporting element.

[0054] In another aspect, the present invention relates to a method for manufacturing a micro-optomechanical system, the method comprising the following steps: (a) providing at least two load-bearing elements, wherein each load-bearing element has at least one connecting element, wherein each connecting element has at least one self-centering engagement element, wherein the engagement elements cooperate with one another to mechanically connect the load-bearing elements to one another via the engagement elements; (b) providing at least two optical components, wherein each optical component has at least one optical coupling site; (c) creating at least one beam shaping element at at least one light coupling site by a three-dimensional structuring method; (d) securing each optical component to one of the carrier elements; and (e) Mechanically connecting the carrier elements by means of self-aligning engagement elements that mate with each other to establish an optical coupling of the optical component at at least one optical coupling point.

[0055] According to the present invention, steps (a) to (e) are preferably performed in the order given, but a different order may be used, in particular, step (d) may be performed before step (c). In addition, whether described herein or not, the steps may also be performed at least partially simultaneously and / or independently of other steps.

[0056] For details on the method for manufacturing the micro-optical machine system of the present invention, please refer to the remaining description of the micro-optical machine system. The specific design scheme described herein can also be obtained using the method of the present invention.

[0057] The terms "having," "including," or "comprising" or any grammatical variations thereof are used herein in a non-exclusive manner. Accordingly, these terms may refer to the absence of any features other than the feature introduced by the term, or the presence of one or more additional features. For example, the expression "A has B," "A includes B," or "A contains B" may refer to the absence of any elements other than B in A (i.e., A consists solely of B), or the presence of one or more additional elements in A in addition to B (e.g., element C, elements C and D, or even more elements).

[0058] It should also be noted that the terms "at least one," "one or more," and their grammatical variations, when used in conjunction with one or more elements or features, are intended to indicate that the elements or features may be in the singular or plural form, and are generally only used when first mentioned (e.g., when the feature or element is first cited). Subsequent references to the element or feature generally do not require the use of "at least one" or "one or more," but this does not limit the singular or plural form of the element / feature.

[0059] In addition, when the terms "preferably", "in particular", "for example" or similar terms are used in conjunction with optional features, they do not limit alternative implementations. The features introduced by such terms are optional features, and there is no intention to limit the scope of protection of the claims (especially the independent claims) through these features. It should be understood by those skilled in the art that the present invention may also be implemented by other design solutions. Similarly, the features introduced in "in an embodiment of the present invention" or "in an embodiment of the present invention" also refer to optional features and should not limit the scope of protection of alternative design solutions or independent claims. In addition, whether the above-mentioned guiding statements are optional features or non-optional features themselves, they do not affect the feasibility of arbitrarily combining the features introduced thereby with other features.

[0060] Invention Advantages The micro-optomechanical system described herein relates to a modular arrangement of micro-optical and micro-mechanical components, preferably capable of being created at least in part by a three-dimensional structuring method of a simply connected three-dimensional structure. A "single connected three-dimensional structure" is defined as a structure that, taking into account manufacturing-related variations, does not include any closed hollow bodies, ring-like structures, or tunnel structures, particularly within the region through which light passes.

[0061] Each module here consists of two parts: a carrier element, which can be connected to at least one other carrier element via at least one connecting element; and an optical component, which, in particular, has at least one optical waveguide and may include at least one receiving element for receiving, positioning, and orienting at least one other optical component. The micro-optical mechanical system can be configured, in particular, to transmit and manipulate light between different optical components. The functionality and efficiency of the at least two connected modules in the micro-optical mechanical system depend significantly on the positioning tolerances of the carrier elements (including the optical components fastened thereto) that together form the respective modules.

[0062] To achieve optimal functionality and efficiency in a micro-optical system consisting of a large number of modules, each module must have sufficiently small individual tolerances to counteract the effects of tolerance chains. In this context, the tolerance chain specifically includes manufacturing and assembly-related variations as the sum of all assumed uncertainties, primarily including the manufacturing tolerances of the carrier elements (including their joining elements), the joining tolerances of the connections between the carrier elements, the manufacturing tolerances of the optical components, and / or the positioning tolerances of the optical components relative to the respective carrier elements to which they are fastened.

[0063] The micro-optomechanical system proposed according to the present invention is preferably used as a modular system for optical assembly and connection technology and is preferably manufactured from preassembled modules that combine the positioning function of an optical table with the optical function of the optical components arranged thereon. This allows the positioning and / or adjustment of optical components on a microscopic scale within acceptable submicron tolerances. To this end, the relative positions of the optical components relative to each other are predetermined and preferably movable only along the optical axis, and particularly preferably immutable. To this end, a standardized basis is required on which the optical components can be designed with a certain spacing from each other. By connecting different optical components in series, micro-optomechanical systems with a variety of different functions can be produced. To this end, predefined joining elements are used to define the positioning and orientation of the carrier element, and thus the positioning and orientation of the optical components fastened thereto. In addition, the use of three-dimensional microstructuring methods allows the production of functionally related structures with extremely high precision in terms of shape and function while maintaining a high degree of design freedom. In addition, in the case of singly connected structures, the modules can preferably be replicated in parallel in batches using the three-dimensional structuring method.

[0064] The prior art has yet to reveal a micro-optomechanical system that offers reciprocal and universal functionality in positioning and orientation, similar to optical benches or tables at macroscopic scales. Simply scaling down from the macroscopic scale is impossible, particularly because microscopic components are difficult to manipulate, position, orient, and fine-tune. Consequently, micro-optomechanical systems have until now required individual development, fabrication, and assembly for each specific application.

[0065] The present invention differs from patent document DE102016221464A1 in particular in that the latter discloses neither any predefined optical coupling points nor discrete mechanical connections for positioning optical components relative to one another. Furthermore, the document does not propose any prefabricated, preassembled units that complement each other, particularly when configured for simple connection (particularly serial, snap-on, or plug-in connection). Similarly, it is not possible to produce a predefined, particularly three-dimensional, micro-optomechanical structure (including its supporting elements) in a single method step. Furthermore, direct connection between the beam shaping element and the optical component is not mandatory.

[0066] In contrast, the present invention proposes a highly versatile platform with predefined mechanical interfaces and matching optical coupling points, enabling mutual centering and alignment. To date, there are no standards for optical coupling between various optical components. The proposed technical solution allows for the assembly of micro-optical machine systems with the highest precision in the submicron range through simple serial, snap-on, or plug-in connections.

[0067] Furthermore, the choice of shape memory materials can achieve a "self-healing" effect in the micro-optomechanical system or individual modules. This material selection, combined with a single-connected structure, also allows for the parallel production of modules in batches using a three-dimensional structuring method, especially when the optical axis is perpendicular to the demolding direction. BRIEF DESCRIPTION OF THE DRAWINGS

[0068] Further details and features of the present invention are described below in detail in the description of preferred embodiments, in particular in conjunction with the dependent claims. The various features can be implemented individually or in combination. The present invention is not limited to these embodiments. These embodiments are schematically illustrated in the following figures. Identical reference numerals in the figures indicate identical or functionally identical elements or elements with corresponding functions. In the figures: Figure 1 A schematic top view of a micro-optical machine system according to an embodiment of the present invention is shown ( Figure 1 a and Figure 1 b) and side view schematic ( Figure 1 c); Figure 2 shows a schematic perspective view of a possible optical configuration as an embodiment of a module according to the present invention; Figure 3 shows a perspective schematic diagram of a preferred embodiment of a module comprising a self-centering receiving element configured to receive a cylindrical object; Figure 4 A schematic top view of another embodiment of a micro-optical machine system according to the present invention is shown; Figure 5 A schematic top view of another embodiment of a micro-optical machine system according to the present invention is shown; Figure 6A schematic perspective view of an embodiment showing the application of a module, not yet equipped with optical components, to a carrier layer; Figure 7 A schematic perspective view showing an embodiment of a self-centering engagement element on a load-bearing element of a module; Figure 8 A cross-sectional detail view of two joined elements is shown; Figure 9 Two perspective schematic diagrams showing another embodiment of a module according to the present invention; Figure 10 Shown Figure 9 a is a detailed perspective diagram of the embodiment shown; Figure 11 Two perspective schematic diagrams showing another embodiment of a module according to the present invention; Figure 12 Four schematic diagrams showing the modular principle with different positioning optical axes; FIG13 shows three schematic diagrams of another embodiment of a module according to the present invention, including a top view ( Figure 13a and Figure 13b ) and perspective diagrams ( Figure 13c ); FIG14 shows three schematic diagrams, one of which is a schematic diagram of an embodiment of a replication module after the replication process ( Figure 14a ), and on the other hand a perspective schematic diagram of a processing device for removing the residual carrier layer ( Figure 14b ) and cross-sectional diagram ( Figure 14c ); Figure 15 shows a schematic embodiment of a module having a carrier element configured to receive three assemblies; Figure 16 shows a schematic embodiment of a module for optically coupling two optical components; FIG17 shows a perspective view of a schematic embodiment of a micro-opto-mechanical system for coupling two chips ( Figure 17a )and Figure 17a A schematic perspective view of an embodiment of the module shown ( Figure 17b ); Figure 18 A schematic top view of another embodiment of a micro-optical machine system according to the present invention is shown; Figure 19 shows a schematic cross-sectional view of an optical element positioned in an engagement device; Figure 20 shows a top view of a schematic embodiment of a micro-optical system; Figure 21 Shown Figure 13aThe schematically shown micro-optical system is schematically extended by a spatially separated carrier unit and has further beam shaping elements; Figure 22 A schematic perspective view showing an optical arrangement as a module embodiment; and Figure 23 Different views of another exemplary embodiment of a micro-optical system are shown. DETAILED DESCRIPTION

[0069] Figure 1 A schematic top view of a micro-optical machine system 10 according to an embodiment of the present invention is shown ( Figure 1 a and Figure 1 b) and side view schematic ( Figure 1 c). Figure 1 In b, two different modules 150, 160 are shown as separate units, such as Figure 1 As shown in FIG. 1 , these two modules can be assembled to form the desired micro-optical machine system 10. The two modules 150 and 160 each include an optical assembly 60 and 70, wherein each optical assembly 60 and 70 is fastened to one of the supporting elements 40 and 50, wherein each optical assembly 60 and 70 has an optical coupling site 80 and 90. The optical assembly 70 is attached to the platform 35, and the platform 35 is height-compensated so that the optical axis 140 is aligned with the optical coupling sites 80 and 90. Figure 1 a. The two modules 150 and 160 can be optically coupled to each other at an optical coupling point 604 between the two modules 150 and 160 on the optical axis 140 via the optical coupling points 80 and 90 between the beam shaping elements 100 and 110. In this embodiment, the optical coupling is achieved by a collimated light beam 120 having a defined beam diameter 121.

[0070] According to the present invention, by connecting, snapping, or plugging two modules 150, 160 in series along the optical axis 140, the optical coupling 604 can be automatically adjusted. This is because each supporting element 40, 50 has a connecting element 20, 30, wherein each connecting element 20, 30 has a self-centering coupling element. Here, the coupling elements of each module 150, 160 cooperate with each other so that the supporting elements 40, 50 can be mechanically connected to each other in a detachable or non-detachable manner. Figure 1 a and Figure 1 As shown schematically in FIG. b, the joining elements are structurally interlocked. Figure 1 As shown in FIG. c , the modules 150 and 160 of the micro-optical machine system 10 of the present invention are also arranged on the common supporting surface 130 .

[0071] Figure 2A perspective schematic diagram of an optical arrangement as a possible embodiment of modules 166, 167, and 168 is shown. This figure shows the optical coupling within modules 166, 167, and 168, namely the optical coupling of an assembled single-mode optical fiber 61 with an assembled second single-mode optical fiber 71, each with a diameter of 125 μm. Glass optical fibers 61 and 71 are introduced as optical components 60 and 70 into two self-centering receiving elements 161 and 162, which are implemented as clamping devices. At least one beam shaping element is located between the two self-centering receiving elements 161 and 162. The beam shaping element is located between the two self-centering receiving elements 161 and 162. Figure 2 a is implemented as a single optical lens 101a, Figure 2 b is implemented as a lens system consisting of two optical lenses 101b and 102b. Figure 2 c is a lens system composed of three optical lenses 101c, 102c, and 103c. The optical lenses 101a, 101b, 101c, 102b, 102c, and 103c and the supporting elements 161 and 162 shown in FIG.

[0072] Figure 3 A schematic perspective view of a preferred embodiment of a module 150 is shown, comprising a self-centering receiving element 161, which is particularly configured to receive a cylindrical optical component 60, preferably a glass optical fiber 61. Figure 2 The optical structure of the module 150 includes a receiving device 161 and a glass optical fiber 61, which is implemented as a single receiving device 161 for the glass optical fiber 61. Figure 3 In the embodiment, it is only used to connect single-mode optical fibers 60 and 61.

[0073] Figure 4 A schematic top view of another embodiment of the micro-optical machine system 10 according to the present invention is shown. This embodiment includes three carrier elements 170, 180, 190, each of which is attached with at least one optical component 171, 181, 191, and each of which has a beam shaping element 172, 182, 192, wherein an optical connection between two optical components 171, 181, 191 exists at the optical coupling sites 170a, 170b, 180a, 190a, respectively. The carrier elements 180, 190 are mechanically connected to the carrier element 170 via matching and identical connecting elements 20, 30, respectively. The carrier elements 170, 180, 190 are also provided with another identical connecting element 20, 30, by which another carrier element can be coupled to one of the carrier elements 170, 180, 190. Figure 4It can be seen that the dimensions of the carrier element 170 differ from the dimensions and shapes of the carrier elements 180, 190, which are all embodied in a preferred standard size and shape. Alternatively or additionally, the carrier elements 170, 180, 190 can also be configured with different horizontal or vertical geometries (not shown) so that the preferred optical axes 140 of the modules 170, 190 can be angled relative to each other in the horizontal plane. Figure 4 The schematically shown micro-optical mechanical system 10 includes beam shaping elements 195a, 195b, which are designed here as light deflection elements, i.e., as deflection element 195a within the beam shaping element or as deflection element 195b outside the beam shaping element; however, other embodiments of the beam shaping elements 195a and 195 are also conceivable. In this case, the optical component 171 is designed to be insertable in the optical path of the optical axis 140.

[0074] Figure 5 The figure shows a top view of another embodiment of a micro-optical machine system 10 according to the present invention, which includes two carrier elements 180 and 196. An edge-emitting laser chip (Distributed Feedback Laser; DFB) 210 is attached to the carrier element 180 via a receiving element (not shown), but two conductive traces 200 and 205 configured for electrical contact of the micro-optical machine system 10 are also present on the carrier element 196. Alternatively (not shown), a surface-emitting laser chip can be used, which is arranged tilted or coupled out through a lens to output a light beam parallel to the module surface. Figure 4 As shown, electrical connections in the form of wire bonds 201 , 202 are provided between the conductive traces 200 , 205 and contact pads 211 , 212 configured for electrical contacting of the laser chip 210 .

[0075] Figure 6 Three schematic diagrams are shown of an embodiment in which a module 1202 without any optical components is attached to a carrier layer 130. Here, the carrier layer 130 is configured to attach the module 1202 to the carrier layer 130 by means of self-centering receiving elements 221, 222, 223, 224, 225, while the module 1202 has matching receiving elements 230, 231. To this end, Figure 6 The supporting element schematically shown in a comprises two elements 221, i.e. a supporting element having horizontal freedom in one direction, Figure 6 b includes two elements 222 and 223, i.e., connecting elements with two one-dimensional degrees of freedom in two directions. Figure 6c includes elements 224 and 225, i.e., receiving elements with one-dimensional freedom in one direction and with a stop, which are suitable for positioning, orienting, and fixing the module 1202 relative to the support layer 130. Here, fixing may include fastening the module 1202 to the support layer 130 in a detachable or non-detachable manner. In addition, Figure 6 The schematically shown support layer 130 is equipped with connection elements 250, 260 for attaching further support layers to the support layer 130. Preferably, several modules can be placed on the support layer 130. The modules 1202 fastened to the support layer 130 can in turn have connection elements connected to at least one further support layer (not shown).

[0076] Figure 7 A schematic perspective view of an embodiment of a self-centering engagement element 300 , 310 , 320 , 330 on a carrier element 40 , 50 of a module is shown. Figure 7 The illustrated joining elements 300, 310, 320, and 330 preferably appear in pairs, serving as a connection between the joining element and the receiving portion provided therefor on one or each side of the module. However, other embodiments (not shown), particularly those in which the elements are arranged in a repeated arrangement, are also contemplated. Furthermore, the positioning bevel 1108 in the form of an assembly ramp or step may also represent an embodiment of a joining element.

[0077] Figure 7 Figure a shows a self-centering joining element 300, which is implemented with a tapered vertical shape. This notably serves both vertical and horizontal positioning functions and facilitates separation from the remaining support layer during three-dimensional structuring, thanks to the continuous edge created on its underside (representing the cutting edge separating the module from the remaining support layer). Furthermore, when the shapes of the receiving element and the connecting element 300 are mutually inverted, a vertical undercut defines a height stop, thereby adjusting the height of the support element to be joined.

[0078] Figure 7 Figure b shows a self-centering joint element 310 with a so-called "2.5-dimensional" structure. The joint element 310 shown here comprises a one-sided, paired arrangement of receiving elements 311 and 312. Compared to a single joint element, this arrangement better compensates for horizontal angular errors between two interconnected, oppositely oriented modules. This number can be increased arbitrarily. In the 2.5-dimensional embodiment, the bottom surface can serve as a height-limiting stop.

[0079] Figure 7 c shows another self-centering joint element 320 , whose additional undercut structure is configured to combine with the joint element 300 or 310 to allow the load-bearing element of the module to be combined with another matching joint element in the vertical direction to prevent displacement.

[0080] Figure 7Figure d shows another self-centering joint element 330, whose double-undercut structure prevents the module's load-bearing elements from both vertical displacement and horizontal separation between the two joined units. The opposing structure (not shown) can be opened upward to allow the receiving element to be introduced into the connecting element from top to bottom.

[0081] Figure 8 Detailed cross-sectional view of two joining elements is shown, in particular for connecting two support elements 331, 332. Alternatively, Figure 8 The connection of optical and / or electronic components to a carrier element and / or carrier surface can be illustrated. Separated by a centerline, the figure shows two different embodiments, one on the left and one on the right. Positioning transverse to the joining direction is defined by plug-and-socket structures 333 and 334. Here, structure 333 is implemented as a pyramidal or triangular structure, and structure 334 is implemented as a cylindrical structure; however, other shapes are also conceivable. Positioning in the joining direction is defined by the position of mechanically pressed structural surfaces 339. To this end, two undercut surface structures 336 and 338 are used in the joining direction. Surface structures 336 and 338 are preferably designed to elastically and / or elastoplastically stretch and / or extend and / or expand outward from the centerline during the joining process and lock into their undercut final position. Surface structure 336 is designed with a smooth transition, thereby facilitating detachable connection. In contrast, surface structure 337 has sharp undercut edges, which enhance support stability but make disassembly more difficult. The larger the angle 337 is set, the sharper the undercut structure of the structural surface 335 relative to the structural surface 339 is, and thus the more stable the support is and the more difficult it is to disassemble.

[0082] Figure 9A perspective view of an embodiment of chip-integrated modules 420 and 430 is shown. An optical assembly, comprising a laser chip 401, a receiving element 402, a holding element 503, and beam shaping elements 404a and 404b, is located on a carrier element 421. During assembly, the laser chip 401 is positioned and inserted into the holding element 503 and the receiving element 402, after which fine-tuning of the laser chip 401 is possible. For positioning, defined edges and planes are introduced on or in the surface of the laser chip 401. Matching plane stops on the carrier element 421 are then attached for mechanical positioning, thereby enabling precise positioning of the laser chip 401 in translation and rotation. The surfaces for positioning the laser chip 401 are co-molded with the laser chip 401 and are implemented in the form of deep etching with vertical, smooth edges. The coupling elements 405 and 406 of the carrier element 421 allow for precise connection of additional modules, particularly the carrier element, by means of bonding. This defines the optical axis for coupling between the two modules. In this embodiment, the optical axis can be defined and aligned accordingly by the beam shaping elements 404a, 404b and the optical coupling points formed thereby. Here, the beam shaping elements 404a, 404b manipulate light to couple it into further optical components in the coupled module. Alternatively (not shown), at least one marking on the carrier element 421 can be used to position and align the laser chip 401. Outside the deeply etched area, the laser chip 401 has a rough, undefined saw edge 408, which, due to its unclear geometry and flatness, cannot be used as an alignment surface.

[0083] Figure 9 a shows an embodiment of a module 420 , on which a lens is created as a beam-shaping element 404 a on the laser chip 401 by means of microlithographic structuring methods.

[0084] Figure 9 b shows an embodiment of module 430, in which a lens in the form of a singly connected three-dimensional structure serves as beam-shaping element 404b. This structure is co-formed with the volume of carrier element 421 as part of the optical assembly through three-dimensional structuring methods (particularly through replication). The lens is designed so that it contacts the light outcoupling site of an edge-emitting laser chip (Distributed Feedback Laser, DFB). Alternatively (not shown), a surface-emitting laser chip can be used, either tilted or coupled through a lens to output a beam parallel to the module surface. Furthermore, the gap between laser chip 401 and the lens can be filled with another transparent material.

[0085] Figure 10 Shown Figure 9A perspective view of a portion 440 of a, including the receiving element 402, the holding member 503, the laser chip 401, and the beam shaping element 404a. The surfaces of the receiving element 402 and the holding member 503 perform the technical function of a receiving element in the form of a mechanical stop. The two contact each other to form a pair and position the laser chip 401. The deep-etched mating surface on the laser chip 401 serves as a mechanical stop for the receiving element 403, co-molded with it, and forms a defined surface. Outside the deeply etched area, the laser chip 401 has a rough, ill-defined sawn edge 408, which cannot be used as a positioning surface due to its unclear geometry and flatness. The holding member 503 holds the laser chip 401 in place at a certain angle 407 and presses it vertically downward into the position defined by the positioning element, preventing the laser chip 401 from loosening, tilting, twisting, or shifting.

[0086] Similar to Figure 9 b, Figure 11 a shows a perspective view of an embodiment of a chip integrated module 450. An optical structure including a laser chip 501, a receiving element 504, a pressing member 506 and a beam shaping element 404b is present on the carrier element 421. Figure 9 a. The laser chip 501 is mounted upside down, facing the upper side of the carrier element 421. In addition, the laser chip 501 is attached to the platform 505 to define the height of the optical axis. Figure 11 a shows a similar Figure 9 Another embodiment of the invention is provided in which a lens as the beam-shaping element 404b can be created together with the carrier element 421 and the volume of the optical assembly and / or directly on the laser chip 501 by microlithographic methods. Preferably, the laser chip 501 is designed such that its contact points are located on the underside of the laser chip 501 and are accessible from above, in particular when supported in an inverted manner.

[0087] Figure 11 b shows Figure 11 Figure a shows a perspective view of the optical assembly of the carrier element 421, prior to assembly of the laser chip 501, as a chip-free chip holding module 460. The optical assembly includes receiving elements 504 and 509, a holding member 506, a platform 505, and a beam shaping element 404b. It can also be seen that the carrier element 421 and the platform 505 have openings 502, providing access to the assembly from the underside of the laser chip 501. Furthermore, the optical assembly may include a clearance opening 410 to facilitate free beam transmission and enable contactless assembly.

[0088] Figure 12A schematic top view of a micro-optical machine system is shown, comprising individual modules 600a, 600b, and 600c of varying sizes, and a module assembly 600d comprising five interconnected individual modules. The support elements 311 and 312 of the carrier element are repeated with equal spacing, allowing the micro-optical machine system to be expanded by connecting additional modules (particularly additional carrier elements). The aforementioned 1 dB positioning tolerance defines the optical axis 140 of the individual module optical coupling 604, allowing at least two modules to be precisely matched to each other through their respective optical configurations and connected to each other through bonding. The position and orientation of the optical axis 140 depends on the respective optical configurations of the two modules to be matched.

[0089] Figure 13a FIG. 1 shows a top view of an exemplary embodiment of a micro-optical system 10 including a carrier element 196 and a chip module 702 a. Figure 5 Conductive traces 200, 205 made of a conductive material are located on the carrier element 196 and are electrically connected to contact points 211, 212 of the laser chip 210 via wire bonds 201, 202. The laser chip module 702a includes an edge-emitting laser chip held in a retaining mechanism (not shown) and a receiving element 161 for the optical waveguides 60, 61. In this embodiment, the monolithic module 150 for receiving the glass fibers 60, 61 is not required for bonding. Instead, it is directly integrated into the carrier element 180, eliminating bonding tolerances and improving positioning accuracy and coupling efficiency. The beam shaping element 100 at the output end of the laser chip 210 is printed directly onto its surface and shaped so that the light coupled out of the laser chip 210 is directly focused as a non-collimated beam 120b and coupled directly into the glass fibers 60, 61. This embodiment can be supplemented and / or expanded by one or more additional lenses.

[0090] Figure 13b FIG. 1 shows a top view of another exemplary embodiment of a micro-optical system 10 including a carrier element 196 and a chip module 702 b. Figure 13a , the beam shaping element 710 is integrated into the volume of the chip module 702b and co-replicated therewith.

[0091] Figure 13c FIG. 1 shows a perspective view of another exemplary embodiment of the micro-optical system 10 including a carrier element 196, a chip carrier module 180 and a fiber holding module 150. Figure 13aThe fiber holding module 150 is implemented separately and bonded to the chip carrier module 180. Furthermore, the entire micro-optical mechanical system 10 is filled with a material 709. This material 709 shields the micro-optical mechanical system 10 from the outside, secures the components, and reduces losses in the optical path between the optical components and / or beam shaping components. Furthermore, this filling can be implemented (not shown) to facilitate attachment to existing equipment or systems.

[0092] Figure 14a A schematic perspective view of a preferred embodiment of a module 150 is shown, comprising a self-centering receiving element 161, which is particularly configured to receive a cylindrical optical component 60, preferably a glass optical fiber 61. The module 150 is attached to a residual carrier layer 801 created during the replication process, which must be removed to achieve the defined height of the module 150 so that the optical axes can be aligned vertically with a 1 dB positioning tolerance.

[0093] Figure 14b A schematic diagram shows a holding mechanism 809 for removing the residual carrier layer 801 created during the replication process. To ensure efficient optical coupling, the module height must remain constant relative to the optical axis, and therefore the carrier elements must have a certain height tolerance while maintaining a 1 dB positioning tolerance. To ensure this, the residual carrier layer 801 must be removed accordingly. To this end, the module containing the residual carrier layer 801 can be placed upside down in the mechanism 809, where it can be accessed and removed from above. When assembling the replicated module upside down, it is necessary to ensure that the optical assembly 805 is not damaged. Therefore, recessed relief openings 803 are provided in these areas, so that the module can only rest against specially designed edges on its exterior. Openings 806 in the edge areas of the holding mechanism allow the module to be sucked in from below and held in place, preventing it from shifting during processing. To achieve negative pressure distribution, a recessed cavity on the underside of the holding mechanism 809 serves as a distribution cavity 807. For more precise module positioning, positioning elements, particularly in the form of reversed openings or bosses in the form of receiving elements 808, can be machined into the holding mechanism 809. In the embodiment shown in this figure, the upper side of the holding mechanism 809 is regarded as the height to be adjusted and represents the lower side of the module. The residual supporting layer 801 needs to be abraded to this height. The three-dimensional structuring method can preferably use hot pressing or micro injection molding. Here, the orifice for the adsorption module must be connected to the flat surface on the upper side of the supporting element so that the vacuum can be maintained. This makes it impossible to set the optical mechanical structure in the outer edge area of ​​the supporting element. In micro injection molding or hot pressing, so-called gate flash may remain due to process factors. It is preferable to use cutting, cutting or abrasion methods to remove the gate flash, especially in the form of the residual supporting layer 801. Alternatively, a residual supporting layer of a limited height (not shown) can be taken over by the target mold, and a platform can be formed in this way.

[0094] Figure 14c A schematic cross-sectional view of a mechanism 809 for reprocessing and removing the residual carrier layer 801 is shown. This figure shows a replication module 804 on the residual carrier layer 801 and an optical assembly 805 on the residual carrier layer 801. The optical assembly 805 is positioned within a relief opening 803, providing non-contact support for the optical assembly 805. To ensure stable support during processing, the module is held in place by negative pressure. This negative pressure reaches the module's edge regions via orifices or openings 806 in a distribution chamber 807, providing secure support for the module. Subsequently, the residual carrier layer 801 can be removed to a defined height.

[0095] Figure 15 The schematic embodiment of a module 910 having a carrier element 900 is shown. The carrier element 900 is configured to receive three components, preferably two optical waveguides in the form of glass fibers 60 and 61 received by two receiving elements 161. Another component, in particular a filter or a microfluidic chip, can be mounted in the receiving element 901 on its optical axis. Due to its shape, the receiving element 901 can perform additional beam shaping or beam steering functions, preferably beam expansion and / or focusing and / or beam deflection. In addition, the module may also include further beam shaping elements. All receiving elements may also have positioning and fixing functions. Similarly, the receiving element 901 can be implemented with degrees of freedom, in particular limited or unidirectional degrees of freedom, so that one or more assembled components can be moved.

[0096] Figure 16 A schematic embodiment of a module 920 for optically coupling two optical components is shown. The optical assembly comprises a support element 161, an optical component in the form of a lens system 1002 (including a doublet), and a further optical component 1004, only partially co-molded in a single step with a carrier element 1000. Due to the high aspect ratio of the lenses in lens system 1002, these lenses cannot be replicated, and for structural reasons, additional support structures 1003 are required between the lenses of lens system 1002. This results in a three-dimensional, rather than simply connected, shape for lens system 1002. Consequently, carrier element 1000 is preferably co-molded with support element 161 and a support element (not shown) of optical component 1004, with lens system 1002 subsequently being created through another microstructuring process. Markings (not shown) may also be used on the surface of carrier element 1000 to facilitate orientation during the subsequent microstructuring process; these markings are typically implemented in the form of a cross.

[0097] Figure 17aA perspective view shows a schematic embodiment of a micro-optical mechanical system 10 for coupling two chips 1100. The optical assembly of module 1110 includes a holding mechanism 1101 for an inverted support system, a pre-positioning element 1102 for each chip 1100 (in the form of a ramp with an incline for pre-positioning each chip 1100 toward its target final position and rotational angle, thereby enabling each chip 1100 to be pushed into its final position), a presser 1103 with an inclined receiving surface 1104 for sliding each chip 1100 into place, a receiving element 1105, and measurement markings 1109. The receiving element 1105 in the lower region of the optical assembly forms a contact surface for locating a deeply etched edge site on each chip 1100 so that it can be horizontally positioned and pressed down into place or held in place by the presser 1103. The optical assembly is designed so that the optical axes 140 of the two chips 1100 are aligned. The introduction bevel can be used in particular to realize a positioning movement with one or more defined final poses. Furthermore, the figure shows connecting elements 311 , 312 .

[0098] Figure 17b Shown Figure 17a A perspective view of an exemplary embodiment of module 1110 is shown. Figure 17a This figure shows only the module 1110 without the chip 1100. The optical assembly includes a holding mechanism 1101 for the inverted support system, a pre-positioning element 1102 for each chip 1100 (in the form of a ramp with an inclination for pre-positioning the chip 1100 toward its target final position and rotational angle, thereby pushing each chip 1100 into its final position), a presser 1103 with an inclined receiving ramp 1104 (for sliding the chip 1100 into), a receiving element 1105, and measurement markings 1109. Using the ramp-shaped pre-positioning element 1102, each chip 110 to be assembled can be slid and / or assembled and / or press-fitted into its defined final position, preferably via the receiving ramp. Furthermore, this figure shows a connecting element for connecting to another module in the form of a positioning ramp 1108, connecting elements 311 and 312, and a measurement marking 1109 in the form of a line. Furthermore, the module 1110 has an opening 1106 on the underside to provide access to the chip 1100 , for example for passing an optical fiber 1107 .

[0099] Figure 18A schematic top view of another embodiment of a micro-optical mechanical system 10 according to the present invention is shown, comprising four carrier elements 190, 1201, 1204, and 1205. An edge-emitting laser chip 210 is attached to carrier element 190 via a support element (not shown), but no optical components are present on carrier element 1201; this module serves as a placeholder or spacer. Optical element 1203 is arranged on carrier element 1204. Here, a beam shaping element 100 formed on laser chip 210 collimates the light beam along optical axis 140 until it focuses the light beam onto module 1205, thereby coupling the light beam into an optical component attached to module 1205, such as a photodiode 1208. Optical element 1203 comprises two beam shaping elements 1206, which are attached to a holding mechanism and can be configured to compensate for differences in refractive indices of optical component 1203 to achieve collimation or act as a filter.

[0100] Figure 19 A schematic cross-sectional view of a laser chip mounted on a carrier element 40, 50 is shown. The figure shows a cross section of a laser chip 401, 1100, used as an optical component, which has a rough, undefined sawn edge 1301 that cannot be used for positioning. Furthermore, the figure shows the chip itself, which has been smoothed, preferably by deep etching. This removes the volume designated 1302 and forms a receiving element 403 (in the form of a mechanical stop) in the form of a defined edge or surface. The laser chip 401, 1100 is positioned against this receiving element 403 by abutting against positioning elements 1105, 1310.

[0101] Figure 20 14 shows a schematic top view of the micro-optical system 10 including the carrier elements 702a, 1405. Figure 13a On the laser chip module 702a, there is an edge-emitting laser chip 210 in a holding mechanism (not shown), along with a receiving element 161 and introduced optical waveguides 60 and 61. On the carrier element 1405, there is the receiving element 161 and introduced optical waveguides 60 and 61, a beam shaping element 710 introduced into the volume of the chip module 1405, and an optical component 1208. Light from the laser chip 210 is directly focused as a non-collimated beam 120b via the beam shaping element 100 and coupled into the glass optical fibers 60 and 61. At the output end, the light is coupled into the optical component 1208 via the beam shaping element 710.

[0102] Figure 21 Shown Figure 13aSchematically illustrated is a micro-optical system 10, wherein a spatially separated carrier unit 1408 is schematically expanded and a further beam-shaping element 710 is distinguished, which couples a collimated light beam into the optical components 60, 61 designed as optical waveguides. Module 1408 comprises a receiving element 161 and the incoming optical waveguides 60, 61, on which a beam-shaping element 1406 is arranged. The beam-shaping element 1406 collimates the light emitted from the optical components 60, 61 designed as optical waveguides and couples it into the optical component 1208 via the further beam-shaping element 100.

[0103] Figure 22 a shows a perspective schematic diagram of an optical arrangement as an embodiment of module 1510. The supporting elements include a beam splitter 1505, which splits a light beam 1502 into a horizontal component 1503 and a vertical component 1530, and a light deflection element 1506, which deflects the vertical light beam into a horizontal direction 1504 in order to create an additional light-guiding plane.

[0104] Figure 22 b shows another perspective view of the optical structure as an embodiment of module 1520. Figure 22 b, In this figure, the light beam is coupled out from the light deflection element 1506 in the second plane as a perpendicular light beam 1511 of the incident light beam 1502.

[0105] Figure 23 A top view of another exemplary embodiment of a micro-optical system 10 is shown ( Figure 23 a) Perspective drawing ( Figure 23 b) Side view ( Figure 23 c) and front view ( Figure 23 d). Here, carrier units 1602, 1603, and 1604 are stacked vertically and direct light vertically to different planes, thereby creating the three-dimensional features of the micro-optical system. To this end, the carrier elements include connecting elements 1605 and 1606, which can be vertically positioned and / or stacked, and a coupling element 1610. Light (particularly the illustrated light beam 1611) can be distributed via a beam splitter 1601 or other beam shaping elements (particularly a light deflection element) and coupled into an optical waveguide (not shown) via a connecting element 161.

[0106] Reference Signs List 10Micro-optical system 20, 30 connecting elements 35.505 platform 40, 50 load-bearing components 60, 70 optical components 61, 71 glass fiber 80, 90 optical coupling sites 100, 110 beam shaping elements Optical lenses 101a, 101b, 101c, 102b, 102c, 103c 120 collimated beam 120b beam 121 Collimated coupled beam diameter 130 load-bearing layer 140 optical axis Modules 150, 160, and 173 161, 162 receiving components 166 fiber-to-fiber single lens coupling module 167 Fiber-to-fiber dual-lens coupling module 168 fiber-to-fiber triple lens coupling module 170, 180, 190, 196 load-bearing components 170a, 170b, 180a, 190a optical coupling sites 171, 181, 191 optical components 172, 182, 192, 195a, 195b beam shaping elements 200, 205 conductive traces 201, 202 wire bonding 210 laser chip 211, 212 contact gaskets 221, 222, 223, 224, 225 connecting elements between the load-bearing element and the load-bearing layer or between the load-bearing layer and the load-bearing layer 230, 231 connecting elements between the load-bearing element and the load-bearing layer or between the load-bearing layers 300, 310, 320, 330 self-centering joint elements 311, 312 connecting elements 331, 332 joint elements 333, 334 plug and socket structure 335 inverted structural surface 336 Implementation plan of undercut joint device with transition 337 non-transition undercut angle (as a non-detachable implementation scheme) 338 Sharp-transition undercut joint device implementation plan 339 outer surface (as a stop for positioning the final posture) 401 laser chip 402 optical structure supporting components 403 mechanical stop form receiving element Lenses printed on 404a chips 404b, 710 lenses replicated together with the carrier element 405, 406 engagement elements 407 Optical assembly pressing parts 408, 1301 uneven surfaces, especially saw edges 410 assembly slot Implementation plan for 420, 430, and 450 chip retention modules 421 load-bearing element implementation plan 440 Chip Retention Module Implementation Details 460 Chipless Chip Retention Module Implementation Plan 501 inverted laser chip 502 module / carrier element opening (underside) 503, 506 optical assembly pressing parts 504, 509 positioning elements (here are stops for the optical structure) 600a, 600b, 600c single module 600d module group Optical coupling points between 604 modules 702a Module implementation scheme with integrated chip and optical fiber and printed lens on the chip Module implementation scheme with integrated chip and optical fiber on 702b module and lens and supporting element molding 709 Materials 710 beam shaping element 801 residual bearing layer 803 optical structure avoidance 805 optical structure 806 (vacuum) opening 807 (vacuum) distribution chamber 808 connecting components 809 holding mechanism 804, 810 Replication module on the residual bearer layer 900 fluid chip integration carrier element 901 component receiving element 910 and 920 module implementation plans 1000 Fiber Optic Coupling Components 1002 lens system 1003 support structure 1004 optical components 1100 (laser) chip 1101 inversion holding mechanism 1102 pre-positioning element 1103 pressing piece 1104 Import Bevel 1105 connecting components 1106 Accessible opening below 1107 Passive Measurement (Glass) Optical Fiber 1108 positioning bevel 1109 measurement mark 1110 (chip retention) module implementation plan 1201 Carrying element without optical structure 1202 Module without optical structure 1203 optical components Implementation plan for 1204 and 1205 bearing elements 1206 beam shaping element 1302 deep etching removal volume 1310 positioning element 1405, 1408 load-bearing components 1406 beam shaping element 1510, 1520 module / optical configuration implementation plan 1505 optical components in the form of beam splitters 1506 Optical component in the form of a light deflecting element 1502, 1503, 1504 horizontal beams 1511, 1530 vertical beam 1601 beam splitter 1602, 1603, 1604 load-bearing units 1605, 1606 connecting elements 1610 Joint Element 1611 beam

Claims

1. A micro-optical machine system (10), comprising: - at least two supporting elements (40, 50), wherein each supporting element (40, 50) has at least one connecting element (20, 30), wherein each connecting element (20, 30) has at least one self-centering joining element (300, 310, 320, 330) or is designed as a self-centering joining element (300, 310, 320, 330), wherein the joining elements (300, 310, 320, 330) cooperate with one another to mechanically connect the supporting elements (40, 50) to one another via the joining elements (300, 310, 320, 330); and - at least two optical assemblies (60, 70), wherein each of said optical assemblies (60, 70) is fastened to one of said carrier elements (40, 50), wherein each of said optical assemblies (60, 70) has at least one optical coupling site (80, 90, 604), wherein at least one of said optical coupling sites (80, 90, 604) comprises at least one beam shaping element (100, 110) created by a three-dimensional structuring method, and wherein at at least one optical coupling site (80, 90, 604) there is an optical connection of said optical assemblies (60, 70).

2. The micro-optical mechanical system (10) according to the preceding claim, wherein At least one optical connection exists between at least two optical coupling sites (80, 90, 604), wherein each of the at least two optical coupling sites (80, 90, 604) includes at least one beam shaping element (100, 110) created by a three-dimensional structuring method.

3. The micro-optical mechanical system (10) according to any one of the preceding claims, wherein: - the engaging elements (300, 310, 320, 330) of the carrier elements (40, 50) are mechanically connected to one another by form fit; and / or - the engaging elements (300, 310, 320, 330) of the connecting elements (20, 30) are designed so that they can structurally engage with each other; and / or The supporting elements (40, 50) are connected to each other in a detachable or non-detachable manner while maintaining their shape and function.

4. The micro-optical mechanical system (10) according to any one of the preceding claims, wherein: At least two supporting elements (40, 50) are connected to each other so that the at least two optical components (60, 70) and the at least one beam shaping element (100, 110) are located on at least one common optical axis (140).

5. The micro-optical mechanical system (10) according to any one of the preceding claims, wherein: At least one of the carrier elements (40, 50) is provided with at least one metal layer as a conductive trace (200).

6. The micro-optical mechanical system (10) according to the preceding claim, wherein - at least one of the supporting elements (40, 50) is fastened to at least one supporting surface (130); and / or - the supporting element (40, 50) and the at least one supporting layer (130) are connected to each other in a detachable or non-detachable manner, or at least two supporting layers (130) are connected to each other in a detachable or non-detachable manner while maintaining shape and function; and / or - The at least one carrier layer (130) is provided with at least one metal layer as a conductive track (200).

7. The micro-optical mechanical system (10) according to any one of the preceding claims, wherein: At least one of the carrier elements (40, 50), at least one optical component (60, 70) fastened to the carrier element (40, 50), and the at least one beam shaping element (100, 110) are coated by an at least partially solid, optically transparent medium.

8. The micro-optical mechanical system (10) according to any one of the preceding claims, comprising at least one first carrier element (170), one second carrier element (180) and one third carrier element (190), wherein: The first supporting element (170) is connected to the second supporting element (180) and to the third supporting element (190) via the connecting elements (20, 30), wherein at least one optical component fastened to the first supporting element (170) has at least one first optical coupling site (170a) and one second optical coupling site (170b), wherein a first optical connection exists between the first optical coupling site (170a) and an optical coupling site (180a) of at least one optical component (181) fastened to the second supporting element (180), and a second optical connection exists between the second optical coupling site (170b) and at least one optical coupling site (190a) of at least one optical component (191) fastened to the third supporting element (190).

9. The micro-optical mechanical system (10) according to any one of the preceding claims, wherein: At least one of the carrier elements (40, 50) has at least one further beam shaping element, which is arranged on the carrier element (40, 50) or on an optical component (60, 70) fastened to the carrier element (40, 50) or is introduced into the carrier element (40, 50) or into an optical component (60, 70) fastened to the carrier element (40, 50).

10. The micro-optical mechanical system (10) according to any one of the preceding claims, further comprising: At least one positioning element is configured to define the position of at least one of the optical components (60, 70) on one of the carrier elements (40, 50) by a substructure, wherein the substructure and at least one of the optical components (60, 70) are manufactured by the same method.

11. The micro-optical mechanical system (10) according to any one of the preceding claims, further comprising: At least one further supporting element, to which no optical component (60, 70) is fastened and which does not include any beam shaping element (100, 110).

12. A method for manufacturing a micro-optical machine system (10), comprising the following steps: (a) providing at least two supporting elements (40, 50), wherein each supporting element (40, 50) has at least one connecting element (20, 30), wherein each connecting element (20, 30) has at least one self-centering engagement element (300, 310, 320, 330) or is designed as a self-centering engagement element (300, 310, 320, 330), wherein the engagement elements (300, 310, 320, 330) cooperate with each other to enable the supporting elements (40, 50) to be mechanically connected to each other via the engagement elements (300, 310, 320, 330); (b) providing at least two optical components (60, 70), wherein each of the optical components (60, 70) has at least one optical coupling site (80, 90, 604); (c) creating at least one beam shaping element (100, 110) at at least one of the light coupling sites (80, 90, 604) by a three-dimensional structuring method; (d) securing each optical assembly (60, 70) to one of the carrier elements (40, 50); and (e) mechanically connecting the carrier elements (40, 50) via self-aligning coupling elements (300, 310, 320, 330) that mate with each other, and establishing optical coupling of the optical components (60, 70) at at least one optical coupling site (80, 90, 604).

13. The method according to the preceding claim, wherein The support elements (40, 50) are mechanically connected by form fit.

14. A method according to any one of the preceding claims, wherein At least one of the supporting elements (40, 50) and / or at least one of the optical components (60, 70) is manufactured by a three-dimensional structuring method.

15. A method according to any one of the preceding claims, wherein At each of at least two light coupling sites (80, 90, 604), at least one beam shaping element (100, 110) is created by the three-dimensional structuring method.

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