Gluing system and method of bonding plate for slice gluing process

Abstract

The invention discloses a gluing system and method for a bonding plate in a slice gluing procedure, and belongs to the technical field of silicon rods. The gluing system comprises a plasma processing assembly, a gluing assembly and a bonding assembly; the plasma processing assembly comprises a plasma spray head; the plasma spray head is used for carrying out plasma treatment on the surface, facing the plasma spray head, of the bonding plate, so that a polarity area is formed on the surface of the bonding plate; the gluing assembly is used for gluing the surface of the polar region; and the bonding assembly is used for pressing the silicon rod on the glued polarity area, so that the bonding plate is bonded with the silicon rod. According to the silicon rod slicing device, the firmness in the bonding process is guaranteed, and the problem that when a silicon rod is sliced, due to the fact that the bonding force between the silicon rod and the bonding plate is insufficient after direct gluing, the bonding plate and the silicon rod are separated and fall off easily is solved.

Description

Technical Field

[0001] The present application belongs to the technical field of silicon rod cutting, and specifically relates to a gluing system and method for an adhesive plate used in a slicing and gluing process. Background Art

[0002] Silicon ingots are a crucial raw material in the photovoltaic industry. Slicing involves cutting the square ingot into individual wafers. During the slicing process, the ingot is bonded to a bonding sheet on the opposite side of the ingot. This allows the cutting equipment to cut directly through the ingot, all the way to the bonding sheet. Using the bonding sheet as a cutting consumable ensures a complete cut while protecting the wafer support beneath the ingot.

[0003] Currently, the primary method for bonding silicon ingot slicing adhesive sheets is to directly apply glue to the sheet surface before bonding. The adhesive sheet is a material used to support and secure the silicon ingot, typically made of a synthetic resin such as polyimide or polyester. A sticky substance is applied to the sheet surface to enhance adhesion to the silicon ingot. The glued sheet is then aligned with the silicon ingot and pressed together to form a single piece. The silicon ingot is then sliced ​​downward from its top until it reaches the adhesive sheet.

[0004] However, due to the increase in the size of silicon rods in production requirements, the bonding force between the silicon rods and the adhesive plate is insufficient after direct glue coating, which easily causes the adhesive plate and the silicon rods to fall off. Summary of the Invention

[0005] The present application aims to provide a system and method for applying glue to an adhesive plate used in a slicing and gluing process, which at least solves the problem of insufficient bonding force between the silicon rod and the adhesive plate after direct gluing during silicon rod slicing, which easily causes the adhesive plate to separate and fall off from the silicon rod.

[0006] In a first aspect, an embodiment of the present application discloses a gluing system for a bonding plate used in a slicing and gluing process, the gluing system comprising a plasma processing component, a gluing component, and a bonding component;

[0007] The plasma processing assembly includes a plasma shower head;

[0008] The plasma shower head is used to perform plasma treatment on the surface of the bonding plate facing the plasma shower head, so as to form a polar area on the surface of the bonding plate;

[0009] The glue coating component is used to apply glue on the surface of the polar area;

[0010] The bonding assembly is used to press the silicon rod onto the polar region coated with glue, so that the bonding plate is bonded to the silicon rod.

[0011] Optionally, the plasma processing assembly further includes a cooling device and a temperature sensor;

[0012] The temperature sensor is used to detect the local temperature of the polar region, and the cooling device is used to cool the polar region so that the temperature of the polar region is maintained within a preset temperature threshold range.

[0013] Optionally, the gluing system further includes a grinding component; the grinding component is used to grind the surface of the adhesive plate to increase the roughness of the surface of the adhesive plate.

[0014] Optionally, there are multiple plasma shower heads, and the multiple plasma shower heads are arranged in parallel;

[0015] Each of the plasma shower heads comprises a height adjuster, and the height adjuster is used to adjust the distance between each of the plasma shower heads and the surface of the bonding plate;

[0016] Each of the plasma spray heads includes an azimuth adjuster, and the azimuth adjuster is used to adjust the position of each of the plasma spray heads above the surface of the bonding plate.

[0017] Optionally, the gluing system further includes a conveyor belt, which sequentially connects the plasma treatment component, the gluing component and the bonding component, and is used to transport the bonding plate, and sequentially transports the bonding plate to the plasma treatment component, the gluing component and the bonding component.

[0018] In a second aspect, the present application also discloses a method for applying glue to an adhesive sheet used in a slicing and gluing process, the method comprising:

[0019] performing plasma treatment on the surface of the bonding plate by a plasma nozzle of a plasma treatment assembly so as to form a polar region on the surface of the bonding plate;

[0020] Applying glue on the surface of the polar area by a glue coating component;

[0021] The silicon rod is pressed onto the glue-coated polar area through the bonding assembly, so that the bonding plate is bonded to the silicon rod.

[0022] Optionally, the bonding plate surface includes a first surface and a second surface disposed opposite to each other, and the plasma treatment of the bonding plate surface by a plasma nozzle of a plasma treatment assembly to form a polar region on the surface includes:

[0023] Plasma treatment is performed on the first surface and the second surface respectively, so that a first polarity region is formed on the first surface and a second polarity region is formed on the second surface; the first surface is the surface of the bonding plate used to bond the silicon rod; the first polarity region is used to bond to the silicon rod; and the second polarity region is used to bond to the crystal tray.

[0024] The step of applying glue on the surface of the polar region by using a glue applying component comprises:

[0025] Applying glue on the surface of the first polar region by a glue applying component;

[0026] The method of pressing the silicon rod onto the polar region coated with glue by the bonding assembly so that the bonding plate and the silicon rod are bonded includes:

[0027] Pressing the silicon rod into the first polarity region so that the bonding plate is bonded to the silicon rod through the first polarity region;

[0028] The method further comprises:

[0029] The wafer tray is pressed on the second polarity region, so that the wafer tray is bonded to the bonding plate through the second polarity region.

[0030] Optionally, before performing plasma treatment on the surface of the bonding plate by a plasma nozzle of a plasma treatment assembly to form a polar region on the surface of the bonding plate, the method further includes:

[0031] grinding the surface of the adhesive plate by a grinding device to increase the roughness of the surface of the adhesive plate;

[0032] Wipe the surface of the adhesive plate to make the surface of the adhesive plate clean.

[0033] Optionally, the method further includes:

[0034] During the plasma treatment, the surface of the bonding plate is cooled so that the local temperature of the surface of the bonding plate is maintained within a preset temperature threshold range.

[0035] In summary, in the embodiments of the present application, the surface of the adhesive sheet is plasma treated to form a polar region with a smaller polar angle on the surface. Glue is then applied to the surface of the polar region, utilizing the stronger affinity between the polar region and the glue to improve the bonding strength between the adhesive sheet and the silicon rod, thereby ensuring the bonding performance between the silicon rod and the adhesive sheet. Thus, the method based on the embodiments of the present application solves the problem of the adhesive sheet and the silicon rod easily separating and falling off due to insufficient bonding strength between the silicon rod and the adhesive sheet after direct glue application during silicon rod slicing. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In the attached figure:

[0037] Figure 1 Schematic diagram of the structure of the gluing system for the adhesive plate used in the slicing and gluing process provided by an embodiment of the present application;

[0038] Figure 2 This is a schematic diagram of a plasma treatment process of a gluing system for a bonding plate used in a slicing and gluing process provided by an embodiment of the present application;

[0039] Figure 3 Schematic diagram of a grinding assembly of a gluing system for an adhesive plate used in a slicing and gluing process provided by an embodiment of the present application;

[0040] Figure 4 Schematic diagram of a grinding assembly of another gluing system for an adhesive plate used in a slicing and gluing process provided by an embodiment of the present application;

[0041] Figure 5 Schematic diagram of a plasma processing component and a gluing component of a gluing system for a bonding plate used in a slicing and gluing process provided by an embodiment of the present application, in a situation where two workstations are provided;

[0042] Figure 6 This is a structural schematic diagram of a plasma processing component and a gluing component of a gluing system for a bonding plate used in a slicing and gluing process provided by an embodiment of the present application, with the plasma processing component and the gluing component being located at one station;

[0043] Figure 7 This is a schematic diagram of a plasma processing component and a gluing component of a gluing system for an adhesive plate used in a slicing and gluing process provided by an embodiment of the present application, with the plasma processing component and the gluing component being located at one station;

[0044] Figure 8 This is a flow chart of a method for gluing an adhesive plate used in a slicing and gluing process provided by an embodiment of the present application;

[0045] Figure 9 Schematic diagram of the bonding process of the bonding plate, the silicon rod and the wafer support in the gluing method of the bonding plate used in the slicing gluing process provided by an embodiment of the present application;

[0046] Figure 10 This is a schematic diagram of test experimental data provided by an embodiment of the present application;

[0047] Figure 11 This is a schematic diagram of another test experimental data provided in an embodiment of the present application.

[0048] Among them: 1-plasma treatment component; 11-plasma nozzle; 110-organic pollutants; 111-polar groups; 2-glue coating component; 3-bonding component; 4-bonding plate; 41-first surface; 42-second surface; 5-silicon rod; 6-crystal support; 7-conveyor belt. DETAILED DESCRIPTION

[0049] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0050] The terms "first," "second," and the like in the specification and claims of this application are used to distinguish similar objects, and are not used to describe a specific order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, so that the embodiments of this application can be implemented in an order other than that illustrated or described herein, and that the objects distinguished by "first," "second," and the like are generally of the same type, and do not limit the number of objects; for example, the first object can be one or more. In addition, the term "and / or" in the specification and claims refers to at least one of the connected objects, and the character " / " generally indicates that the objects connected are in an "or" relationship.

[0051] In the description of this application, it should be understood that the terms "center", "left", "right", "inside", "outside", "circumferential", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or adhesive plate referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on this application.

[0052] In the description of this application, it should be noted that, unless otherwise specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they can refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; and internal connections between two adhesive sheets. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0053] like Figure 1 As shown, this application provides a gluing system for bonding plates used in a slicing and gluing process. The gluing system includes a plasma treatment component 1, a gluing component 2, and a bonding component 3.

[0054] The plasma processing assembly 1 includes a plasma shower head 11;

[0055] The plasma shower head 11 is used to perform plasma treatment on the surface of the adhesive sheet 4 facing the plasma shower head 11 so as to form a polar area on the surface of the adhesive sheet 4;

[0056] The glue coating component 2 is used for coating glue on the surface of the polar area;

[0057] The bonding assembly 3 is used to press the silicon rod 5 onto the polar region coated with glue, so that the bonding plate 4 and the silicon rod 5 are bonded.

[0058] In the embodiment of the present application, the bonding plate 4 is a carrier for fixing the silicon rod, and the silicon rod 5 is a material used to manufacture silicon wafers. The surface of the bonding plate needs to be coated with glue to achieve adhesion with the silicon rod. Plasma treatment is a technology that uses high-energy plasma to change the surface properties of a material, such as Figure 2 As shown, the process of plasma treatment of the bonding plate 4 using a plasma flow of air or ozone is shown. Figure 2 The black circles represent organic pollutants 110, and the white circles represent polar groups 111 in the plasma, such as oxygen atoms in the embodiment of the present application. The plasma in the plasma flow activates the surface of the adhesive plate, that is, polar groups 111 are formed on the surface of the material, mainly to form organic groups such as carbonyl, carboxyl, and hydroxyl. These polar groups have a positive effect on hydrophilicity and are used to replace weak groups. In this way, since a variety of hydrophilic active group layers are formed on the material surface of the adhesive plate 4, the contact angle of the material surface is reduced. Through this process, the polarity of the adhesive plate surface is increased, thereby improving the adhesion of the glue, and the plasma nozzle 11 is a device that can generate and spray plasma. The glue coating component 2 is a device that can apply glue to the surface of the adhesive plate. There are many ways to apply glue, such as producing glue by extruding the nozzle. The purpose of gluing is to form a strong bonding layer between the adhesive plate 4 and the silicon rod 5. The bonding assembly 3 is a device that can press the silicon rod 5 onto the bonding plate 4. There are many bonding methods, such as mechanical pressing or manual pressing.

[0059] The purpose of this embodiment is to provide a gluing system for an adhesive plate used in a slicing and gluing process. The system can achieve efficient, stable and reliable bonding between the adhesive plate and the silicon rod through three steps: plasma treatment, gluing and bonding.

[0060] In summary, in the embodiments of the present application, the surface of the adhesive sheet is plasma treated to form a polar region with a smaller polar angle on the surface. Glue is then applied to the surface of the polar region, utilizing the stronger affinity between the polar region and the glue to improve the bonding strength between the adhesive sheet and the silicon rod, thereby ensuring the bonding performance between the silicon rod and the adhesive sheet. Thus, the method based on the embodiments of the present application solves the problem of the adhesive sheet and the silicon rod easily separating and falling off due to insufficient bonding strength between the silicon rod and the adhesive sheet after direct glue application during silicon rod slicing.

[0061] Optionally, the plasma treatment component further includes a cooling device and a temperature sensor;

[0062] The temperature sensor is used to detect the local temperature of the polar region, and the cooling device is used to cool the polar region so that the temperature of the polar region is maintained within a preset temperature threshold range.

[0063] In some embodiments of the present application, if plasma treatment is directly applied to the adhesive sheet, the high temperature of the plasma may cause thermal damage or deformation to the adhesive sheet surface. Therefore, a cooling device is required to cool the adhesive sheet surface to maintain a low temperature to ensure the quality and dimensional stability of the adhesive sheet. The temperature threshold range refers to the maximum and minimum temperature range that the adhesive sheet surface can withstand. Different adhesive sheet materials have different temperature threshold ranges, which are generally determined based on the thermal deformation temperature or glass transition temperature of the adhesive sheet. The provision of a temperature sensor ensures that the cooling device effectively cools the adhesive sheet surface.

[0064] Optionally, the gluing system further includes a grinding component; the grinding component is used to grind the surface of the bonding plate to increase the roughness of the surface of the bonding plate.

[0065] In the embodiments of this application, the grinding assembly is a device that rubs the surface of the adhesive sheet, using various abrasives and methods. The purpose of grinding is to increase the surface roughness of the adhesive sheet, thereby increasing the surface contact area and improving the adhesion of the adhesive. This enhanced adhesion further ensures the bonding stress between the adhesive sheet and the silicon rod.

[0066] The purpose of this embodiment is to provide an optional component of the glue coating system, which can polish the surface of the bonding plate before plasma treatment to increase the contact area between the bonding plate and the glue.

[0067] Optional, such as Figure 3 、 Figure 4 As shown, the grinding assembly includes a sandblasting head 81 or a grinding end surface 82. The sandblasting head 81 is used to spray abrasives, and the grinding end surface 82 is a rough surface.

[0068] In the embodiment of the present application, the sandblasting head 81 is a device capable of ejecting abrasive at high speeds. Various abrasives can be used, such as silicon carbide and aluminum oxide. The function of the sandblasting head 81 is to polish the surface of the adhesive sheet 4 through the impact and friction of the abrasive, thereby increasing the surface roughness. The polishing end face 82 is a device with a roughened surface. Various materials, such as metal, a grinding wheel, or sandpaper, can be used. Through contact and friction between the polishing end face and the surface of the adhesive sheet 4, the surface roughness of the adhesive sheet is polished, thereby increasing the surface roughness.

[0069] This embodiment provides an optional grinding assembly that can be used to grind the bonding plate surface using either a sandblasting head or a grinding end surface, depending on different needs and conditions. This improves grinding efficiency and flexibility, and can accommodate different bonding plate materials and specifications.

[0070] Optional, such as Figure 1 As shown, there are multiple plasma nozzles 11, and the multiple plasma nozzles 11 are arranged in parallel; each plasma nozzle includes a height adjuster, which is used to adjust the distance between each plasma nozzle and the surface of the bonding plate; each plasma nozzle includes an azimuth adjuster, which is used to adjust the position of each plasma nozzle above the surface of the bonding plate.

[0071] In the embodiment of the present application, a plasma jet, such as an air or ozone plasma jet, can be ejected through the plasma jet head 11. The plasma jet head 11 is used to perform a plasma treatment on the surface of the adhesive sheet. After the plasma jet is ejected, the corresponding portion of the surface of the adhesive sheet will generate polarity, which can improve the adhesion of the adhesive to the adhesive sheet surface.

[0072] In the embodiments of this application, the number of plasma showerheads refers to the number of plasma showerheads installed in the plasma processing assembly. Because the number of plasma showerheads affects the surface area and efficiency of the plasma on the bonding sheet, it should generally be determined based on the width of the bonding sheet and the processing requirements. This embodiment utilizes multiple plasma showerheads arranged in parallel within the plasma processing assembly to enhance the effectiveness and efficiency of the plasma processing.

[0073] In the embodiments of the present application, a height adjuster is a device capable of adjusting the distance between the plasma nozzle and the surface of the adhesive sheet. This can be achieved using various mechanical or electronic methods, such as a screw or servo motor. The purpose of the height adjuster is to ensure an optimal distance between the plasma nozzle and the surface of the adhesive sheet to achieve the best plasma treatment effect.

[0074] In the embodiments of the present application, the position adjuster is a device capable of adjusting the position of the plasma shower head above the bonding sheet surface. This can be achieved using various mechanical or electronic methods, such as slide rails or omnidirectional robotic arms. The purpose of the position adjuster is to ensure that the position of the plasma shower head above the bonding sheet can be adjusted so that the plasma shower head can perform plasma treatment in all directions on the bonding sheet surface.

[0075] It should be emphasized that in the embodiments of the present application, corresponding to the height adjuster and azimuth adjuster set for the plasma nozzle, according to actual production conditions, a structure with an azimuth adjustment function having the same or similar function as the azimuth adjuster provided in the embodiments of the present application can also be set on the gluing component to achieve adjustment of the relative position of the gluing component and the surface of the adhesive plate.

[0076] Optional, such as Figure 1 As shown, the gluing system also includes a conveyor belt 7, which sequentially connects the plasma treatment component 1, the gluing component 2 and the bonding component 3. The conveyor belt is used to transport the bonding plate 4 and transport the bonding plate 4 to the plasma treatment component 1, the gluing component 2 and the bonding component 3 in sequence.

[0077] In the embodiment of the present application, different materials and structures can be used, such as metal chains, rubber belts, etc. to make the conveyor belt 7. The function of the conveyor belt 7 is to realize the automatic transmission of the bonding plates to improve production efficiency and reduce manual operations.

[0078] This embodiment provides an optional component for the gluing system, which sequentially feeds the bonding sheet into the plasma processing assembly 1, the gluing assembly 2, and the bonding assembly 3 to complete the gluing and bonding process of the bonding sheet 4. This component can address the errors and instabilities associated with manual handling and docking of the bonding sheet 4, thereby improving the quality and efficiency of silicon ingot slicing.

[0079] like Figure 1 、 Figure 5 As shown, in a combination of the above optional implementations, the plasma processing component 1 and the gluing component 2 in the gluing system for the adhesive plate used in the slicing gluing process in the embodiment of the present application are designed as two different workstation units. Figure 5 As shown, after the adhesive sheet 4 is placed on the conveyor belt 7, the adhesive sheet 4 passes through the conveyor belt 7 as shown in FIG. Figure 5 As shown in the direction of the arrow, it passes through the plasma processing component 1 and the glue coating component 2 in sequence.

[0080] like Figure 5 、 Figure 6 As shown, in a combination of the above optional implementations, the plasma processing component 1 and the gluing component 2 in the adhesive plate gluing system for the slicing gluing process in the embodiment of the present application can be designed as a workstation unit. Figure 7 As shown, after the adhesive sheet 4 is placed on the conveyor belt 7, the adhesive sheet 4 passes through the plasma treatment component 1 and the glue coating component 2 in sequence through the conveyor belt 7 as shown by the arrow direction in the figure. Figure 1 、 Figure 5 The workstation unit shown or Figure 5 、 Figure 6 After the workstations shown, the conveyor belt temporarily stops. Each specific workstation then performs corresponding processing on the adhesive sheet 4 conveyed below according to its own function, such as plasma treatment of the adhesive sheet by plasma treatment assembly 1 or gluing of the adhesive sheet by gluing assembly 2. Once the entire process is completed, the conveyor belt 7 continues to move to deliver the adhesive sheet 4 to the subsequent workstations. During the processing of the adhesive sheet 4, each workstation can also utilize the height adjuster and orientation adjuster provided in the embodiments of the present application to fully process the surface of the adhesive sheet.

[0081] In summary, in the embodiments of the present application, the surface of the adhesive sheet is plasma treated to form a polar region with a smaller polar angle on the surface. Glue is then applied to the surface of the polar region, utilizing the stronger affinity between the polar region and the glue to improve the bonding strength between the adhesive sheet and the silicon rod, thereby ensuring the bonding performance between the silicon rod and the adhesive sheet. Thus, the method based on the embodiments of the present application solves the problem of the adhesive sheet and the silicon rod easily separating and falling off due to insufficient bonding strength between the silicon rod and the adhesive sheet after direct glue application during silicon rod slicing.

[0082] Applicable to the adhesive plate gluing system for the slicing gluing process provided in this application, the embodiment of this application also discloses a gluing method for the adhesive plate for the slicing gluing process, such as Figure 8 As shown, the method includes the following steps:

[0083] In step 101 , a plasma treatment is performed on the surface of the bonding plate by using a plasma nozzle of a plasma treatment assembly to form a polar region on the surface of the bonding plate.

[0084] In the embodiments of this application, plasma treatment is a technique that uses high-energy plasma to modify the surface properties of a material, increasing its polarity and activity, thereby improving the wetting and adhesion properties of the adhesive. For example, for thermoplastic engineering plastics that are not conducive to bonding, such as polypropylene and polyethylene, plasma treatment can form polar regions containing polar groups such as oxygen and nitrogen on their surfaces, increasing their surface energy and thus enhancing compatibility with the adhesive.

[0085] This embodiment utilizes a plasma treatment assembly's plasma nozzle to plasma-treat the adhesive sheet surface, creating polar regions on the sheet surface. This improves the bonding performance between the adhesive and the silicon rod. This embodiment is applicable to various adhesive sheet materials, particularly difficult-to-bond thermoplastic engineering plastics. It effectively addresses issues such as low polarity, low activity, and low wettability on the sheet surface, improving bond strength and ultimately extending the sheet's service life and reliability.

[0086] Step 102: Apply glue on the surface of the polar area using a glue coating component.

[0087] In the embodiments of the present application, the gluing assembly is a device that evenly applies adhesive to the surface of the bonding plate. Various gluing methods can be used, such as spot gluing, line gluing, and surface gluing. The gluing assembly forms a film of adhesive on the surface of the bonding plate to ensure the bonding area and strength between the bonding plate and the silicon rod. Depending on the adhesive type and bonding requirements, the gluing assembly can use either a single-component or two-component adhesive, as well as different gluing parameters, such as glue volume, glue speed, and glue pressure.

[0088] This embodiment utilizes a glue coating assembly to apply glue to the polar region surface, forming a film of adhesive thereon, thereby improving the bonding performance between the adhesive sheet and the silicon rod. This embodiment is applicable to various adhesives, particularly those that require chemical reaction or physical crosslinking with the adhesive sheet surface, such as two-component epoxies and polyurethanes. This embodiment effectively controls the thickness and uniformity of the adhesive film, preventing excessive thickness or thinness, bubbles, and other defects caused by insufficient uniformity, thereby ensuring the quality and performance of the adhesive film.

[0089] Step 103 : Press the silicon rod onto the glue-coated polar area through the bonding assembly, so that the bonding plate and the silicon rod are bonded.

[0090] In an embodiment of the present application, a bonding assembly is a device that can tightly bond a silicon rod to an adhesive plate, and different bonding methods can be used. For example, a robotic arm with a suction cup can be used to place the silicon rod on the bonding plate for mechanical pressing, or the silicon rod can be placed on the silicon rod for pressing by manual handling. The function of the bonding assembly is to form a uniform, sealed, and firm bonding layer between the bonding plate and the silicon rod to prevent the silicon rod from falling off or shifting during the slicing process. The bonding assembly can be selected and used according to the size and shape of different bonding plates and silicon rods to ensure the accuracy and consistency of the bonding.

[0091] This embodiment functions by pressing the silicon rod onto the adhesive-coated polar region through the adhesive assembly, thereby bonding the adhesive plate to the silicon rod. This embodiment is applicable to various silicon rods, particularly those requiring slicing, such as single crystal silicon and polycrystalline silicon. This embodiment effectively ensures the quality and stability of the bond between the silicon rod and the adhesive plate, preventing damage or waste to the silicon rod, and increasing its utilization and value.

[0092] In summary, in the embodiments of the present application, the surface of the adhesive sheet is plasma treated to form a polar region with a smaller polar angle on the surface. Glue is then applied to the surface of the polar region, utilizing the stronger affinity between the polar region and the glue to improve the bonding strength between the adhesive sheet and the silicon rod, thereby ensuring the bonding performance between the silicon rod and the adhesive sheet. Thus, the method based on the embodiments of the present application solves the problem of the adhesive sheet and the silicon rod easily separating and falling off due to insufficient bonding strength between the silicon rod and the adhesive sheet after direct glue application during silicon rod slicing.

[0093] Optional, such as Figure 1 、 Figure 9 As shown, Figure 9 The double arrow in the figure indicates the bonding direction of the bonding plate 4, the silicon rod 5, and the wafer support 6. The bonding plate surface includes a first surface 41 and a second surface 42 disposed opposite to each other. In order to perform plasma treatment on the bonding plate surface by the plasma nozzle of the plasma treatment assembly to form a polar region on the surface, step 101 includes:

[0094] Sub-step 1011, plasma treatment is performed on the first surface 41 and the second surface 42 respectively, so that a first polarity region is formed on the first surface and a second polarity region is formed on the second surface; the first surface 41 is the surface of the bonding plate for bonding the silicon rod 5; the first polarity region is used for bonding to the silicon rod 5; the second polarity region is used for bonding to the crystal support 6.

[0095] In the embodiments of the present application, the first surface 41 and the second surface 42 of the bonding plate 4 refer to two opposing planes of the bonding plate. The first surface 41 is the surface for bonding to the silicon rod 5, and the second surface 42 is the surface for bonding to the wafer tray 6. Plasma treatment is a method of modifying the surface of a material using high-energy plasma, which can increase the polarity of the material surface and thus enhance the bonding properties of the material surface. A plasma nozzle is a device that can generate and spray plasma, which can be used to perform targeted plasma treatment on the surface of the bonding plate.

[0096] This embodiment utilizes plasma treatment of the surface of the bonding plate 4 using the plasma nozzle 11 of the plasma treatment assembly 1, thereby forming a polar region on the surface. This embodiment is applicable to various bonding plate materials. It effectively increases the polarity of the bonding plate surface, making it more susceptible to chemical reaction or physical adsorption with the adhesive, thereby increasing the bond strength and durability between the bonding plate, the silicon rod 5, and the wafer support 6.

[0097] In order to apply glue on the surface of the polar area by the glue applying component, step 102 includes:

[0098] Sub-step 1021 : applying glue on the surface of the first polarity region by the glue applying component 2 .

[0099] In the embodiment of the present application, the function of the adhesive coating assembly 2 is to form an adhesive film on the first surface 42 of the adhesive plate to increase the bonding area and bonding strength between the adhesive plate 4 and the silicon rod 5. The adhesive coating assembly 2 can use a single-component or two-component adhesive, and can also use different adhesive coating parameters, such as adhesive volume, adhesive speed, and adhesive pressure, depending on the adhesive type and bonding requirements.

[0100] The purpose of this embodiment is to apply glue to the surface of the first polar region through the glue coating component to form a layer of glue film on the polar region, thereby improving the bonding performance between the adhesive plate and the silicon rod. This embodiment can be applied to various adhesives.

[0101] In order to press the silicon rod 5 onto the glue-coated polar area through the bonding assembly 3 so that the bonding plate 4 is bonded to the silicon rod, step 103 includes:

[0102] Sub-step 1031 : Press the silicon rod 5 into the first polarity region so that the bonding plate is bonded to the silicon rod through the first polarity region.

[0103] In the embodiment of the present application, the bonding assembly 3 is used to form a uniform, sealed, and secure bond between the first surface 41 of the bonding sheet and the silicon rod 5, thereby preventing the silicon rod from falling or shifting during the slicing process. The bonding assembly 3 can be configured using a suitable bonding mold based on the size and shape of the bonding sheet 4 and silicon rod 5 to ensure precise and consistent bonding.

[0104] The function of this embodiment is to press the silicon rod 5 onto the first polarity region after the glue is applied through the adhesive assembly 3 so that the adhesive plate 4 and the silicon rod 5 are bonded.

[0105] like Figure 10 1 and 2 show the test data of the shear strength of two different adhesives formed after being treated by the method provided in the embodiment of the present application and compared with the shear strength of steel sheets.

[0106] It can be seen that after the method provided in the examples of the present application is used, the shear strength is significantly increased.

[0107] During the process of following sub-steps 1011, 1021, and 1031, the method further includes:

[0108] Step 104 : Press the wafer tray 6 into the second polarity region, so that the wafer tray 6 is bonded to the bonding plate 4 through the second polarity region.

[0109] In the embodiments of the present application, the crystal tray 6 is a device used to secure the adhesive plate to the cutting machine and can be made of metal, plastic, glass, or other materials. The function of the crystal tray 6 is to hold the silicon rods and facilitate the transfer and storage of the adhesive plate and silicon rods, while the function of the adhesive plate 4 is to protect the crystal tray 6 from damage during the cutting process. The side of the crystal tray 6 that contacts the second surface 42 is coated with an adhesive to achieve relative fixation between the crystal tray 6 and the adhesive plate 4. The crystal tray 6 can be selected and used according to the size and shape of the adhesive plate 4 and the cutting machine to ensure that the crystal tray 6 is compatible with the adhesive plate 4 and the cutting machine.

[0110] This embodiment functions by pressing the wafer tray 6 against the second polarity region before bonding the adhesive plate 4 to the silicon ingot 5. This allows the wafer tray 6 to adhere to the adhesive plate 4 via the second polarity region. This embodiment is applicable to a variety of wafer tray materials, particularly those that exhibit good adhesion to adhesives, such as aluminum and copper. This embodiment effectively ensures the quality and stability of the bond between the wafer tray 6 and the adhesive plate 4, preventing the wafer tray 6 from falling or shifting during cutting or transport, and ensuring cutting accuracy and efficiency. This embodiment offers simple procedures, convenient operation, and high efficiency, making it suitable for large-scale industrial production.

[0111] It should be emphasized that although the bonding process is usually carried out in the following order: first, the second polarity region is treated, then the second polarity region after the adhesive treatment is bonded to the wafer tray 6, and then the first polarity region is treated, and then the first polarity region after the adhesive treatment is bonded to the silicon rod 5, the bonding method provided in the embodiment of the application should not be limited to the above order, that is, the first polarity region and the second polarity region can also be glued and bonded in the order of sequential or simultaneous application.

[0112] like Figure 11 The data shown are the shear strength data obtained from the steel sheet test experiment based on the bottom glue after being processed using the method provided in the embodiment of the present application.

[0113] It can be seen that after the method provided in the examples of the present application is used, the shear strength is significantly increased.

[0114] Optionally, before performing plasma treatment on the surface of the bonding plate by a plasma nozzle of the plasma treatment assembly to form a polar region on the surface of the bonding plate, the method further includes the following steps:

[0115] Step 105 : grinding the surface of the adhesive plate by a grinding device to increase the roughness of the surface of the adhesive plate.

[0116] In the embodiments of the present application, a grinding device is a device capable of grinding, polishing, and waxing the surface of an adhesive sheet. Various grinding methods can be used, such as sandblasting, sanding discs, and grinding wheels. The purpose of the grinding device is to increase the roughness of the adhesive sheet surface, thereby increasing the surface area of ​​the adhesive sheet and improving the adhesive performance of the adhesive sheet. The grinding device can select and use appropriate grinding parameters, such as grinding pressure, grinding speed, and grinding time, based on the different adhesive sheet materials and grinding requirements.

[0117] This embodiment utilizes a plasma treatment assembly's plasma nozzle to perform plasma treatment on the adhesive sheet surface. This treatment, prior to forming a polar region on the adhesive sheet surface, is preceded by a polishing device to increase the surface roughness of the adhesive sheet. This embodiment is applicable to a variety of adhesive sheet materials, particularly those that are inherently smooth or difficult to bond with adhesives, such as glass, ceramics, and metals. This embodiment effectively increases the surface roughness of the adhesive sheet, making it more conducive to plasma interaction and thereby increasing the polarity of the adhesive sheet surface.

[0118] Step 106: Wipe the surface of the adhesive plate to make the surface of the adhesive plate clean.

[0119] In the embodiments of this application, wiping the adhesive plate surface is performed to remove impurities such as dust, oil, and water stains. Various wiping tools, such as paper towels, cotton cloth, and non-woven fabrics, can be used for wiping. The purpose of wiping the adhesive plate surface is to improve its cleanliness, thereby enhancing the bonding performance between the adhesive plate surface and the adhesive or wafer support. Wiping the adhesive plate surface can be performed using a suitable wiping agent, such as alcohol, acetic acid, or a degreaser, depending on the adhesive plate material and the wiping requirements.

[0120] This embodiment utilizes a polishing device to polish the surface of an adhesive sheet, increasing its roughness. The surface is then cleaned with a cloth dipped in a cleaning agent to ensure a clean surface. This embodiment is suitable for various adhesive sheet materials, particularly those prone to dust or oil accumulation, such as glass, ceramics, and metals. This embodiment effectively removes impurities from the adhesive sheet surface, making it more receptive to plasma or adhesive interaction, thereby increasing the polarity of the adhesive sheet surface.

[0121] Optionally, during the plasma treatment, the surface of the bonding plate is cooled so that the local temperature of the surface of the bonding plate is maintained within a preset temperature threshold range.

[0122] In some embodiments of the present application, direct plasma treatment of the adhesive sheet can cause thermal damage or deformation to the sheet surface due to the high temperature of the plasma. Therefore, the sheet surface must be cooled to maintain a low temperature to ensure the quality and dimensional stability of the sheet. The temperature threshold range refers to the maximum and minimum temperature range that the sheet surface can withstand. Different sheet materials have different temperature threshold ranges, and these ranges are generally determined based on the sheet's heat deformation temperature or glass transition temperature.

[0123] Through the embodiments of the present application, the surface of the adhesive plate can be cooled to avoid thermal damage or deformation of the surface of the adhesive plate, thereby ensuring the quality and dimensional stability of the adhesive plate.

[0124] Preferably, the bonding force between the bonding plate surface and the silicon rod does not exceed 10.7 MPa; and within 2 hours after the bonding plate surface is subjected to plasma treatment, the contact angle of the bonding plate surface does not exceed 3°.

[0125] Table 1 shows the contact angle data obtained from a specific experimental case within the data range disclosed in this application, wherein plate A and plate B are synthetic resin plates provided by the manufacturer, and plate B, relative to plate A, further comprises a hydrophilic additive component.

[0126] Table 1

[0127]

[0128] Table 1 shows that the changes in contact angle after different treatment times indicate that the sooner the adhesive is applied after plasma treatment, the better. From 0 to 2 hours, the contact angle changes slightly and is relatively small. From 2 to 4 hours, the contact angle gradually increases. From 4 to 24 hours, the contact angle begins to rise significantly. Therefore, based on these experimental results, adhesive application and bonding must be completed within 4 hours. Considering factors such as temperature and air quality, the most preferred time range in this embodiment is 2 hours.

[0129] Specifically, within 2 hours after the surface of the adhesive sheet is subjected to plasma treatment, the contact angle of the surface of the adhesive sheet may be 1°, 1.5°, 2°, 2.5°, 3°, or other values.

[0130] Table 2 shows the shear strength data between the bonding plate and the silicon rod obtained in a specific experimental case within the data range disclosed in this application.

[0131] Table 2

[0132]

[0133] Table 3 shows the shear strength data between the bonding plate and the wafer support obtained in a specific experimental case within the data range disclosed in this application.

[0134] Table 3

[0135]

[0136] As can be seen from Tables 2 and 3, the changes in surface contact angle after different treatment times indicate that the sooner the adhesive is applied after plasma treatment, the better. From 0 to 2 hours, the shear strength of the adhesive is relatively small, with relatively low values. From 2 to 4 hours, the shear strength gradually increases to a relatively high value. From 4 to 24 hours, the shear strength begins to decline significantly. Therefore, based on these experimental results, adhesive application and bonding must be completed within 4 hours. Considering factors such as temperature and air quality, the most preferred time range in this embodiment is 2 hours.

[0137] Specifically, the bonding force between the bonding plate surface and the silicon rod may be 10.1 MPa, 10.2 MPa, 10.4 MPa, 9.3 MPa, 9.1 MPa, 9.0 MPa or other numbers.

[0138] In the embodiments of the present application, adhesion refers to the bonding strength between the adhesive plate and the silicon rod, which can be measured using methods such as a tensile test or a shear test. The magnitude of the adhesion reflects the bonding quality and durability between the adhesive plate and the silicon rod, with greater adhesion indicating better bonding performance. The contact angle refers to the angle between a droplet on the surface of the adhesive plate and the surface of the adhesive plate, which can be measured using an instrument such as a contact angle meter. The magnitude of the contact angle reflects the wettability and polarity of the adhesive plate surface, with smaller contact angles indicating better bonding results.

[0139] The purpose of this embodiment is to ensure optimal bonding performance between the adhesive plate and the silicon rod by setting the preferred ranges for the bonding force and contact angle of the adhesive plate surface when bonding to the silicon rod. This embodiment is applicable to a variety of adhesive plate and silicon rod materials and specifications, particularly those with high bonding performance requirements, such as high-purity single crystal silicon and large-diameter silicon rods. Adhesion force and contact angle within the preferred ranges provided by this embodiment can effectively avoid problems such as weak bonding due to too low adhesion force, excessive bonding due to too high adhesion force, poor wetting due to too large a contact angle, or excessively thin adhesive film due to too small a contact angle, thereby ensuring the quality and stability of the bonding between the adhesive plate and the silicon rod.

[0140] It should be emphasized that the improved bonding strength between the adhesive plate and the silicon rods in this application does not affect the degumming process in the subsequent process, because the degumming process is a process in which the glue absorbs water, expands, softens, and ages. The difficulty of degumming is largely related to the physical and chemical factors of the glue itself and the degumming medium itself, such as temperature or the type of glue-washing agent. It is not the case that the stronger the bond, the harder it is to degumming. If the degumming conditions are appropriate, even the strongest bond will be easy to degumming. Therefore, this application does not have the problem of negative effects on subsequent processes due to the improved bonding strength between the adhesive plate and the silicon rods.

[0141] Preferably, in order to perform plasma treatment on the surface of the bonding plate by the plasma nozzle of the plasma treatment assembly, step 101 includes the following sub-steps:

[0142] Sub-step 1012: spraying plasma on the bonding plate through a plasma nozzle.

[0143] When plasma is sprayed on the bonding plate by the plasma nozzle, the speed of the plasma nozzle in the first preset direction is 50mm / s-100mm / s, the distance between the plasma nozzle and the surface of the bonding plate is 5mm-15mm, and the plasma power when spraying plasma is 260W-800W; the first preset direction is the length direction of the bonding plate. The specific first preset direction can be referred to Figure 9 The X direction in .

[0144] In the embodiments of the present application, the travel speed of the plasma nozzle refers to the speed at which the plasma nozzle moves relative to the surface of the adhesive plate. The magnitude of the travel speed affects the time and range of the plasma's action on the surface of the adhesive plate, and should generally be determined based on the material and size of the adhesive plate. The distance of the plasma nozzle refers to the vertical distance between the plasma nozzle and the surface of the adhesive plate. The magnitude of the distance affects the intensity and uniformity of the plasma's action on the surface of the adhesive plate, and should generally be determined based on the flatness and roughness of the adhesive plate. Plasma power refers to the power of the plasma generated by the plasma nozzle. The magnitude of the power affects the temperature and density of the plasma, and should generally be determined based on the thermal stability and polarity requirements of the adhesive plate. The first preset direction is the length direction of the adhesive plate, which can generally be a direction parallel to, perpendicular to, or at any other angle to the axis of symmetry of the adhesive plate. The choice of the preset direction affects the coverage and distribution of the plasma on the surface of the adhesive plate, and should generally be determined based on the shape of the adhesive plate and the bonding area.

[0145] The purpose and significance of this embodiment is to optimize the plasma treatment effect of the plasma showerhead on the adhesive sheet surface by setting parameters such as the plasma showerhead's speed, distance, power, and preset direction. This embodiment is applicable to a variety of adhesive sheets and plasma treatment conditions, particularly those requiring high polarity and roughness of the adhesive sheet surface, such as high-purity single crystal silicon and large-diameter silicon rods. This embodiment effectively controls the plasma showerhead parameters within a reasonable range, preventing the plasma from exceeding the adhesive sheet's tolerance, leading to denaturation and thus compromising the plasma treatment effect.

[0146] Preferably, in various methods of the present application, the temperature threshold range is 25°C-35°C.

[0147] In this application, the temperature threshold range refers to the permissible temperature range of the adhesive sheet surface during plasma treatment. This temperature threshold range affects the thermal stability and thermal stress of the adhesive sheet surface and is generally determined based on the material and structure of the adhesive sheet. Generally speaking, since the plasma treatment range is localized, the local temperature variation of the adhesive sheet should also be comparable to room temperature.

[0148] This embodiment sets the temperature threshold between 25°C and 35°C to ensure that the bonding plate surface does not overheat or deform during plasma treatment. This embodiment is applicable to various bonding plate materials, particularly those that are temperature-sensitive or susceptible to thermal deformation, such as plastics, glass, and ceramics.

[0149] Preferably, in order to apply glue on the surface of the polar region by the glue applying component, step 102 includes the following sub-steps:

[0150] Sub-step 1022, when applying glue on the surface of the polar area by the glue applying component, adjust the direction of the glue applying component so that the track formed by the glue applied on the polar area is Z-shaped or S-shaped.

[0151] When applying glue on the surface of the polar region by the glue applying component, the speed of the glue applying component in the second preset direction is 5 mm / s-10 mm / s, and the mass of the glue is 50 g to 80 g;

[0152] The second preset direction is the relative movement direction of the glue-applying component and the adhesive plate;

[0153] The glue is a two-liquid mixed hardening glue, and the ratio of the two-liquid mixed hardening glue is 1:1 to 1:1.2;

[0154] The polar region is a circle with a radius of 5 mm to 15 mm.

[0155] In the embodiments of the present application, the direction of the glue application assembly refers to the relative movement direction between the glue application assembly nozzle and the adhesive sheet surface. The speed of the glue application assembly in the second predetermined direction affects the distribution and shape of the glue on the adhesive sheet surface and is generally determined based on the shape of the adhesive sheet and the bonding area. The glue trajectory refers to the line or pattern formed by the glue on the adhesive sheet surface, which can generally be a straight line, a broken line, a curved line, a wavy line, etc. The shape of the trajectory affects the coverage and uniformity of the glue on the adhesive sheet surface and is generally determined based on the adhesive sheet material and bonding requirements. The speed of the glue application assembly refers to the speed at which the glue application assembly moves on the adhesive sheet surface. The speed affects the time and range of glue application on the adhesive sheet surface and is generally determined based on the size of the adhesive sheet and the bonding area. The mass of the glue refers to the total amount of glue sprayed by the glue application assembly on the adhesive sheet surface. The mass affects the thickness and density of the glue on the adhesive sheet surface and is generally determined based on the thickness of the adhesive sheet and the bonding strength. The second preset direction refers to the relative movement direction between the glue coating component and the adhesive plate, which can generally be a direction parallel to, perpendicular to, or at any other angle to the axis of symmetry of the adhesive plate. The choice of the preset direction affects the distribution and direction of the glue on the surface of the adhesive plate, and should generally be determined according to the shape of the adhesive plate and the bonding area. The glue is a two-liquid mixed hardening glue, which refers to an adhesive that hardens by a chemical reaction after mixing two different liquid components, and can generally be epoxy resin, polyurethane, etc. The ratio of the two-liquid mixed hardening glue refers to the mass ratio or volume ratio of the two liquid components. The size of the ratio affects the viscosity and hardening speed of the glue, and should generally be determined according to the material of the adhesive plate and the bonding time. The polar area is generally circular or elliptical, etc. The shape and size of the polar area affect the bonding area and bonding strength between the adhesive plate and the silicon rod.

[0156] The purpose and significance of this embodiment is to improve the bonding performance between the adhesive sheet and the silicon rod by adjusting the direction of the adhesive coating component so that the applied adhesive forms a Z-shaped or S-shaped trajectory on the polar region. This embodiment is applicable to various adhesive coating components and adhesive types, especially those with high requirements for adhesive distribution and shape, such as two-component epoxy resins and polyurethanes. This embodiment can effectively control parameters such as the direction of the adhesive coating component, the speed of travel, the quality and proportion of the adhesive, etc., to maintain them within a reasonable range, thereby affecting the adhesive coating effect.

[0157] In an embodiment of the present application, the polar region is circular, and the radius of the circle does not exceed 3 cm. In a preferred embodiment, the radius of the polar region needs to be controlled between 5 mm and 15 mm. At this time, the optimal gluing effect can be achieved by controlling the mass of the glue solution between 50 g and 80 g.

[0158] Tables 4 and 5 provide two specific experimental results based on the method disclosed in this application, as well as related parameter information.

[0159] Table 4 shows the chip drop rate and edge defect ratio obtained in a specific experimental case within the data range disclosed in this application. In the experiment in Table 4, it is set to cut G12 silicon rods with a thickness of 130 microns. The plasma treatment process is: power: 500W; nozzle height: 10mm; nozzle speed: 60mm / s; glue coating process: glue coating amount: 60g; glue coating speed: 8mm / s; AB glue ratio: 1:1; the bonding board is selected as the bonding board, and plasma treatment is performed on both sides. The mass production average value is collected as the comparison group data. The test is carried out 3 times, with an average value of 10 cuts each time.

[0160] Table 4

[0161] comparison group Test 1# Test 2# Test 3# Contact angle / ° 83 0 0 0 Percentage of film dropouts / % 23％ 4.50％ 4.30％ 3.90％ Edge defects / % 0.45％ 0.32％ 0.37％ 0.29％

[0162] Table 5 shows the chip drop rate and edge defect ratio obtained in another specific experimental case within the data range disclosed in this application. In the experiment in Table 5, the setting is to cut M10 silicon rods with a thickness of 110 microns. The plasma treatment process is: power: 600W; nozzle height: 10mm; nozzle speed: 50mm / s; glue coating process: glue coating amount: 50g; glue coating speed: 9mm / s; AB glue ratio: 1:1; the bonding board is selected as the bonding board, and plasma treatment is performed on both sides. The mass production average value is collected as the comparison group data. The test is carried out 3 times, with an average value of 10 cuts each time.

[0163] Table 5

[0164] comparison group Test 1# Test 2# Test 3# Contact angle / ° 81 0 0 0 Percentage of film dropouts / % 18％ 2.80％ 3.10％ 3.30％ Edge defects / % 0.38％ 0.23％ 0.29％ 0.28％

[0165] From the experiments in Tables 4 and 5, it can be seen that compared with the control group, both for square silicon rods and chamfered silicon rods, the chip drop ratio and edge defect rate are significantly reduced after the method provided by the present application.

[0166] Preferably, the bonding plate is made of thermoplastic engineering plastic (Acrylonitrile-butadiene-styrene, ABS), which contains 25% to 35% acrylonitrile, 25% to 30% butadiene, and 40% to 50% styrene.

[0167] ABS is a plastic that softens when heated and hardens when cooled, allowing for repeated processing and recycling. ABS has the advantages of good mechanical properties, wear resistance, corrosion resistance, and heat resistance.

[0168] The ABS ratio provided in this embodiment is a preferred embodiment of the silicon rod bonding process related to this application.

[0169] Preferably, the interval between plasma treatment of the bonding plate surface by the plasma nozzle of the plasma treatment assembly to form a polar area on the bonding plate surface and pressing the silicon rod onto the glue-coated polar area by the bonding assembly is no more than 2 hours.

[0170] In the embodiments of the present application, the interval time refers to the time difference between two events. The size of the interval time affects the polarity change of the bonding plate surface and the hardening of the glue, and should generally be determined according to the material of the bonding plate and the type of glue.

[0171] The interval time provided in this embodiment is a preferred embodiment of the silicon rod bonding process related to this application. It ensures that the polarity of the bonding plate surface does not decrease due to excessive time, and that the adhesive does not fully cure due to too short a time. This embodiment effectively controls the interval time within a reasonable range, avoiding excessively long intervals that could lead to a decrease in the polarity of the bonding plate surface, or excessively short intervals that could lead to incomplete curing of the adhesive, thereby affecting the bonding quality and stability between the bonding plate and the silicon rod.

[0172] Preferably, during the implementation of step 105, the abrasive sprayed by the sandblasting head is silicon carbide (SiC) particles, the mesh size of the silicon carbide particles is 100-120 mesh, and the abrasive spraying speed is 20m / s to 30m / s; after the roughness of the bonding plate surface increases, the roughness of the bonding plate surface is a frosted pit diameter of 0.1-1mm and a frosted pit depth of 0.05-0.1mm.

[0173] Specifically, the jetting speed of the abrasive can be 20 m / s, 25 m / s, 30 m / s or other numbers.

[0174] In one embodiment of the present application, sandblasting is used to increase the surface roughness of the adhesive sheet and enhance surface adhesion. Sandblasting uses a variety of abrasives, such as corundum, glass beads, ceramic beads, and steel shot. Different abrasives have different effects on the surface, and the appropriate abrasive should generally be selected based on the properties and requirements of the material being processed.

[0175] The abrasive and abrasive parameters provided in this embodiment are a preferred embodiment of the silicon rod bonding process related to this application. The purpose of this embodiment is to sandblast the surface of the bonding plate by using silicon carbide particles as sandblasting abrasive to improve the surface roughness and adhesion of the bonding plate.

[0176] In the examples of this application, roughness refers to the unevenness of the machined surface, with small peaks and valleys, reflecting the surface's microscopic geometric shape errors. The smaller the roughness, the smoother the surface. Roughness can be measured using methods such as stylus testing, light sectioning, or interferometry. Keeping the roughness of the adhesive sheet within a reasonable range can further effectively improve the bonding performance between the adhesive sheet and the silicon rod after adhesive application.

[0177] In summary, in the embodiments of the present application, the surface of the adhesive sheet is plasma treated to form a polar region with a smaller polar angle on the surface. Glue is then applied to the surface of the polar region, utilizing the stronger affinity between the polar region and the glue to improve the bonding strength between the adhesive sheet and the silicon rod, thereby ensuring the bonding performance between the silicon rod and the adhesive sheet. Thus, the method based on the embodiments of the present application solves the problem of the adhesive sheet and the silicon rod easily separating and falling off due to insufficient bonding strength between the silicon rod and the adhesive sheet after direct glue application during silicon rod slicing.

[0178] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a specific feature, structure, material, or characteristic described in conjunction with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, illustrative uses of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0179] Although the embodiments of the present application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and purpose of the present application, and the scope of the present application is defined by the claims and their equivalents. Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the application disclosed herein. The present application is intended to encompass any variations, uses or adaptations of the present application, which follow the general principles of the present application and include common knowledge or customary technical means in the art that are not disclosed in the present disclosure. The description and examples are intended to be exemplary only, and the true scope and spirit of the present application are indicated by the claims below.

[0180] It should be understood that the present application is not limited to the exact structures described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.

Claims

1. A gluing system for adhesive sheets used in a slicing and gluing process, characterized in that: The gluing system includes a plasma treatment component, a gluing component and a bonding component; The plasma processing assembly includes a plasma shower head; The plasma shower head is used to perform plasma treatment on the surface of the bonding plate facing the plasma shower head, so as to form a polar area on the surface of the bonding plate; The glue coating component is used to apply glue on the surface of the polar area; The bonding assembly is used to press the silicon rod onto the polar region coated with glue, so that the bonding plate is bonded to the silicon rod.

2. The gluing system according to claim 1, characterized in that: The plasma processing assembly also includes a cooling device and a temperature sensor; The temperature sensor is used to detect the local temperature of the polar region, and the cooling device is used to cool the polar region so that the temperature of the polar region is maintained within a preset temperature threshold range.

3. The gluing system according to claim 1, characterized in that: The gluing system further includes a grinding component; the grinding component is used to grind the surface of the bonding plate to increase the roughness of the surface of the bonding plate.

4. The gluing system according to claim 1, wherein: There are multiple plasma shower heads, and the multiple plasma shower heads are arranged in parallel; Each of the plasma shower heads comprises a height adjuster, and the height adjuster is used to adjust the distance between each of the plasma shower heads and the surface of the bonding plate; Each of the plasma spray heads includes an azimuth adjuster, and the azimuth adjuster is used to adjust the position of each of the plasma spray heads above the surface of the bonding plate.

5. The gluing system according to claim 1, characterized in that: The gluing system also includes a conveyor belt, which sequentially connects the plasma processing component, the gluing component and the bonding component. The conveyor belt is used to transport the bonding plate and sequentially transport the bonding plate to the plasma processing component, the gluing component and the bonding component.

6. A method for gluing adhesive sheets used in a slicing and gluing process, characterized in that: The method comprises: performing plasma treatment on the surface of the bonding plate by a plasma nozzle of a plasma treatment assembly so as to form a polar region on the surface of the bonding plate; Applying glue on the surface of the polar area by a glue coating component; The silicon rod is pressed onto the glue-coated polar area through the bonding assembly, so that the bonding plate is bonded to the silicon rod.

7. The gluing method according to claim 6, wherein: The bonding plate surface includes a first surface and a second surface disposed opposite to each other, and the plasma treatment is performed on the bonding plate surface by a plasma nozzle of a plasma treatment assembly to form a polar region on the surface, including: Plasma treatment is performed on the first surface and the second surface respectively, so that a first polarity region is formed on the first surface and a second polarity region is formed on the second surface; the first surface is the surface of the bonding plate used to bond the silicon rod; the first polarity region is used to bond to the silicon rod; and the second polarity region is used to bond to the crystal tray.

8. The gluing method according to claim 6, wherein: Before performing plasma treatment on the surface of the bonding sheet by a plasma shower head of a plasma treatment assembly so as to form a polar region on the surface of the bonding sheet, the method further includes: grinding the surface of the adhesive plate by a grinding device to increase the roughness of the surface of the adhesive plate; Wipe the surface of the adhesive plate to make the surface of the adhesive plate clean.

9. The gluing method according to claim 6, wherein: The plasma treatment of the bonding plate surface by the plasma nozzle of the plasma treatment assembly includes: spraying plasma on the bonding plate through the plasma nozzle; When plasma is sprayed on the adhesive plate by the plasma nozzle, the travel speed of the plasma nozzle in the first preset direction is 50mm / s-100mm / s, the distance between the plasma nozzle and the surface of the adhesive plate is 5mm-15mm, and the plasma power when spraying plasma is 260W-800W; the first preset direction is the length direction of the adhesive plate.

10. The gluing method according to claim 6, wherein: The method further comprises: During the plasma treatment, the surface of the bonding plate is cooled so that the local temperature of the surface of the bonding plate is maintained within a preset temperature threshold range.

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