Wafer bearing table and chemical mechanical polishing equipment

Abstract

The embodiment of the invention provides a wafer bearing table and chemical mechanical polishing equipment. The wafer bearing platform comprises a platform used for placing a workpiece; the swing shaft is fixedly connected to the platform; the swinging shaft is connected to the supporting mechanism and the base in a swinging mode and is provided with a containing hole, the supporting mechanism is arranged in the containing hole, and when the swinging shaft swings along with the platform, the supporting mechanism can provide axial buffering support for the swinging shaft; and the elastic mechanism is arranged between the platform and the base and is used for deforming when the platform swings so as to adaptively support the platform. In the swinging process of the platform, due to the fact that the supporting mechanism moves in the axial direction of the containing hole all the time, the platform is effectively positioned, deviation of the axis is prevented, and therefore the stability of the platform in the polishing operation is guaranteed.

Description

[0001] This application is a divisional case of the invention patent with application number 202411873999.0 filed on December 19, 2024, and named “Wafer carrier and chemical mechanical polishing equipment”. Technical Field

[0002] The embodiments of the present application relate to the field of semiconductor processing, and in particular to a wafer carrier and chemical mechanical polishing equipment. Background Art

[0003] Polishing is a crucial process in semiconductor processing. During chemical mechanical polishing, the platform is a crucial interface for the polishing head to pick up and place workpieces (such as wafers). During this process, the platform must adaptively swing according to the polishing head's tilt and must not rotate about its axis.

[0004] Currently, in the related art, when the polishing head is tilted and pressed down during the process of picking up and placing the workpiece, the center of the carrying platform will shift, making the operation unreliable. In addition, the carrying platform will rotate around the axis, causing the position of the carrying platform to shift. Summary of the Invention

[0005] In view of this, embodiments of the present application provide a wafer carrier and a chemical mechanical polishing device to at least partially solve the above-mentioned problems.

[0006] According to the first aspect of the embodiment of the present application, a wafer carrier is provided, which includes: a platform for placing a workpiece; a swing shaft fixedly connected to the platform; a support mechanism, the swing shaft being swingably connected to the support mechanism, and a base having a receiving hole, the support mechanism being arranged in the receiving hole, and the support mechanism can provide axial buffering support for the swing shaft when the platform swings; an elastic mechanism being arranged between the platform and the base, and being used to deform when the platform swings to adaptively support the platform.

[0007] Furthermore, in the above-mentioned wafer carrier, the supporting mechanism includes: a swing support member, which is movably arranged in the accommodating hole along the axial direction of the accommodating hole, and the swing shaft is swingably connected to the swing support member; an elastic support member, which is arranged in the accommodating hole, and the swing support member is pressed against the elastic support member, and the elastic support member is used to deform when the swing support member moves axially along the accommodating hole, so as to provide buffering support to the swing support member.

[0008] Furthermore, in the above-mentioned wafer carrier, the swing support member includes: a support seat, which is movably arranged in the accommodating hole along the axial direction of the accommodating hole and is pressed against the elastic support member; a support body, which is swingably arranged on the support seat, and the support body is provided with a first mounting hole, and the swing axis is arranged in the first mounting hole.

[0009] Furthermore, in the above-mentioned wafer carrier, the support seat is provided with a second mounting hole having a spherical inner surface; the support body has a spherical outer surface, the support body is arranged in the second mounting hole, and the spherical outer surface is adapted to the spherical inner surface so that the support body and the support seat are swingably connected.

[0010] Furthermore, in the above-mentioned wafer supporting platform, the swing support member is an angular bearing; the swing shaft is arranged on the inner ring of the angular bearing, and the outer ring of the angular bearing is pressed against the elastic support member.

[0011] Furthermore, the wafer carrying platform further includes: a bearing pressure plate, which is pressed onto the outer ring of the angular bearing and connected to the base.

[0012] Furthermore, in the above-mentioned wafer carrier, the elastic support member includes: a first support, connected to the base and covering the accommodating hole of the base; a first elastic member, placed in the accommodating hole and connected to the first support, and the swing support member is pressed against the first elastic member.

[0013] Furthermore, in the above-mentioned wafer carrier, at least two columns are formed on the surface of the first support placed in the accommodating hole; there are at least two first elastic members and they are mounted on the columns in a one-to-one correspondence; the elastic support member also includes: a pressure plate, the pressure plate is provided with through holes corresponding to the positions of each of the columns, the columns are passed through the through holes to press the pressure plate and the first elastic member, and the swing support member is pressed against the pressure plate.

[0014] Furthermore, in the above-mentioned wafer carrier, the accommodating hole is a stepped hole, and the stepped hole includes a first accommodating hole close to the platform and a second accommodating hole away from the platform, and the diameter of the first accommodating hole is smaller than the diameter of the second accommodating hole; the swing support member is placed in the first accommodating hole; and the elastic support member is partially placed in the second accommodating hole.

[0015] Furthermore, in the above-mentioned wafer supporting platform, the first elastic member is any one of a spring, a spring sheet, and an elastic column.

[0016] Furthermore, the above-mentioned wafer carrier platform also includes: a limit pin, fixedly connected to the base; a swing member, the platform is swingably connected to the swing member, the swing member is provided with a cylindrical hole, the limit pin is partially placed in the cylindrical hole, and the swing member can move along the limit pin when the platform swings.

[0017] Furthermore, in the above-mentioned wafer supporting platform, the swing member includes: a mounting seat fixedly connected to the platform; and a swing body, the swing body being swingably disposed on the mounting seat, and the swing body is provided with the columnar hole.

[0018] Furthermore, in the above-mentioned wafer carrier, the mounting seat is provided with a third mounting hole having a spherical inner surface; the swing body has a spherical outer surface, the swing body is arranged in the third mounting hole, and the spherical outer surface is adapted to the spherical inner surface so that the swing body and the mounting seat are swingably connected.

[0019] Furthermore, in the above-mentioned wafer supporting platform, the swinging member is an angular bearing; the limiting pin is arranged on the inner ring of the angular bearing, and the outer ring of the angular bearing is fixedly connected to the platform.

[0020] Furthermore, in the above-mentioned wafer supporting platform, the elastic mechanism includes: an annular airbag, which is arranged between the platform and the base; and an inflation joint, which is connected to the annular airbag and is used to fill gas into the annular airbag.

[0021] Furthermore, in the above-mentioned wafer supporting platform, an annular groove is provided on the surface of the base close to the platform, and the annular airbag is partially embedded in the annular groove.

[0022] Furthermore, in the wafer carrier, the base is provided with an inflation hole, the inflation connector is provided through the inflation hole, and one end of the inflation connector is connected to the annular airbag, while the other end extends out of the base for connection to an inflation device. The elastic mechanism also includes an annular pressure ring connected to the base, which presses the inflation interface of the annular airbag to the base to form a seal.

[0023] Furthermore, in the above-mentioned wafer carrying platform, the elastic mechanism includes: at least two elastic members, which are placed between the platform and the base and distributed along the circumference with the axis of the platform as the center.

[0024] Furthermore, in the above-mentioned wafer supporting platform, the elastic member is at least one of a spring, an elastic column, and a rubber column.

[0025] According to the second aspect of the embodiment of the present application, a chemical mechanical polishing device is provided, which includes: a polishing disk, a carrying head, a dressing device and a liquid supply device, and also includes any one of the wafer carrying platforms described above, the wafer carrying platform is arranged on one side of the polishing disk, and the carrying head is configured to receive the wafer from the wafer carrying platform or transfer the wafer to the wafer carrying platform.

[0026] In this embodiment, when the platform is subjected to downward pressure, this downward force is transmitted to the support mechanism via the swing shaft. As the downward force acts, the support mechanism moves downward, compressing the elastic mechanism. When the downward pressure is removed, the elastic mechanism, with its inherent resilience, returns the platform to its original position, while the support mechanism simultaneously moves upward. This process allows the support mechanism to move up and down within the base's receiving hole, thus achieving axial cushioning and ensuring that the platform's axial center position does not shift as it absorbs and releases downward force.

[0027] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The above and other objects, features and advantages of the present application will become more apparent by describing in more detail exemplary embodiments of the present application in conjunction with the accompanying drawings, wherein the same reference numerals generally represent the same components in the exemplary embodiments of the present application.

[0029] Figure 1 This is a schematic diagram of the axial cross-sectional structure of the wafer carrier proposed in an embodiment of the present application;

[0030] Figure 2 This is another schematic diagram of an axial cross-sectional structure of the wafer carrier proposed in an embodiment of the present application;

[0031] Figure 3 A schematic diagram of the three-dimensional structure of the wafer carrier proposed in an embodiment of the present application;

[0032] Figure 4 A schematic diagram of a partial three-dimensional structure of a wafer carrier proposed in an embodiment of the present application;

[0033] Figure 5 This is another schematic diagram of the three-dimensional structure of the wafer carrier proposed in an embodiment of the present application;

[0034] Figure 6 A schematic diagram of the three-dimensional structure of the elastic mechanism in the wafer carrier proposed in an embodiment of the present application;

[0035] Figure 7 A schematic diagram of a partial three-dimensional structure of a wafer carrier proposed in an embodiment of the present application;

[0036] Figure 8 This is another schematic diagram of the three-dimensional structure of the wafer carrier proposed in an embodiment of the present application;

[0037] Reference numerals:

[0038] Platform 100; fastening screw 110; swing shaft 200; shoulder 210; nut 220; support mechanism 300; swing support member 310; support seat 311; pressing plate 311a; screw 311b; support body 312; elastic support member 320; first support seat 321; column 321a; first elastic member 322; pressure plate 323; base 400; accommodating hole 410; second accommodating hole 411; elastic mechanism 500; annular airbag 510; inflation connector 520; annular pressure ring 530; limit pin 600; swing member 700; mounting seat 710; mounting seat pressure plate 711; swing body 720. DETAILED DESCRIPTION

[0039] The preferred embodiments of the present application will be described in more detail below with reference to the accompanying drawings. Although the preferred embodiments of the present application are shown in the accompanying drawings, it should be understood that the present application can be implemented in various forms and should not be limited by the embodiments described herein. Instead, these embodiments are provided to make the present application more thorough and complete, and to fully convey the scope of the present application to those skilled in the art.

[0040] The terms used in this application are for the purpose of describing specific embodiments only and are not intended to limit this application. As used in this application and the appended claims, the singular forms "a," "an," "the," and "the" are intended to include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the term "and / or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

[0041] It should be understood that although the terms "first", "second", "third", etc. may be used in this application to describe various components, these components should not be limited to these terms. These terms are only used to distinguish components of the same type from each other. For example, without departing from the scope of this application, the first component may also be referred to as the second component, and similarly, the second component may also be referred to as the first component. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, "plurality" means two or more, unless otherwise clearly and specifically defined.

[0042] In the description of this application, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0043] Unless otherwise expressly specified or limited, terms such as "mounted," "connected," "connect," and "fixed" should be interpreted broadly. For example, they may refer to fixed or detachable connections, or integration; mechanical or electrical connections; direct or indirect connections through an intermediary; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0044] In chemical mechanical polishing, the carrier platform is a crucial interface for the polishing head to pick up and place workpieces (e.g., wafers). During this process, the carrier platform must adaptively swing according to the polishing head's tilt and not rotate about its axis. Currently, the carrier platform in related technologies, when the polishing head tilts and presses down during the process, can cause the center of the carrier platform to shift, making operation unreliable. Furthermore, the carrier platform can rotate about its axis, causing the carrier platform's position to shift.

[0045] In response to the above problems, an embodiment of the present application provides a wafer carrier, which can solve the problem of center offset of the carrier platform.

[0046] The technical solutions of the embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0047] See also Figures 1 to 3 According to one embodiment of the present application, a wafer carrying platform includes a platform 100 , a swing shaft 200 , a supporting mechanism 300 , a base 400 and an elastic mechanism 500 .

[0048] The platform 100 is used to place a workpiece, such as a wafer to be polished, etc. In a specific implementation, the platform 100 may be circular.

[0049] The swing shaft 200 is fixedly connected to the platform 100. When the polishing head applies an inclined downward pressure to the platform 100, causing the platform 100 to swing, the swing shaft 200 can swing synchronously with the platform 100. In a specific implementation, the platform 100 can be provided with a groove, and the upper end of the swing shaft 200 (relative to the upper end) can be provided with a groove. Figure 1The platform 100 and the swing shaft 200 can be fixedly connected, for example, by fastening screws 110 (see Figure 2 、 3 ) is connected to the swing shaft 200, or is welded, riveted, etc., or can be a detachable connection, such as a key connection, etc. This embodiment does not limit the specific connection form.

[0050] The swing shaft 200 is swingably connected to the support mechanism 300. When the platform 100 swings, the swing shaft 200 swings along with the platform 100 relative to the support mechanism 300. The base 400 defines a receiving hole 410, into which the support mechanism 300 is mounted. Furthermore, the support mechanism 300 provides axial cushioning support for the swing shaft 200 as the platform 100 swings, allowing the swing shaft 200 to move axially.

[0051] In this embodiment, the platform 100 is placed above the base 400 (relative to Figure 1 The elastic mechanism 500 is disposed between the platform 100 and the base 400 and is used to deform when the platform 100 swings to adaptively support the platform 100. The elastic mechanism 500 will deform accordingly with the swing of the platform 100 and will always be in contact with the lower end surface of the platform 100 (relative to the lower end surface of the platform 100). Figure 1 (as for the state shown) in contact to support the platform 100.

[0052] In this embodiment, when platform 100 is subjected to tilting downward force, this downward force is transmitted to support mechanism 300 via swing shaft 200, which provides axial buffering support for swing shaft 200. Simultaneously, elastic mechanism 500 deforms under this downward force to adaptively support platform 100. When the downward force is removed, elastic mechanism 500, relying on its rebound force, returns platform 100 to its original position. Thus, during the swinging process of platform 100, support mechanism 300 provides axial buffering support for swing shaft 200, thereby ensuring that the axial position of platform 100 does not shift during the process of receiving and releasing downward force.

[0053] It can be seen that in this embodiment, during the swinging process of the platform 100, since the support mechanism 300 can always provide axial buffer support, the support mechanism 300 can always effectively position the platform 100 to prevent the axis from shifting, thereby ensuring the stability and reliability of the platform 100 during the polishing operation.

[0054] In some embodiments, see Figure 1The support mechanism 300 includes a swing support member 310 and an elastic support member 320. The swing support member 310 is movably disposed within the receiving hole 410 along the axial direction of the receiving hole 410, and the swing shaft 200 is swingably connected to the swing support member 310. When the platform 100 and the swing shaft 200 swing together relative to the swing support member 310, the swing support member 310 is driven to move axially within the receiving hole 410.

[0055] The elastic support member 320 is disposed in the receiving hole 410 and is placed below the swing support member 310 (relative to the Figure 1 In the state shown in FIG, the swing support member 310 is pressed against the elastic support member 320. The elastic support member 320 is used to deform when the swing support member 310 moves axially along the receiving hole 410 to provide buffer support for the swing support member 310.

[0056] In this embodiment, when the swing support member 310 moves downward, downward pressure is applied to the elastic support member 320, causing it to compress. This compression absorbs and mitigates impact loads caused by swinging or external loads, reducing damage to the swing support member 310. When the swing support member 310 moves upward, the elastic support member 320 rebounds to its uncompressed state. This rebound force helps the swing support member 310 return to its initial position, maintaining the dynamic balance of the system. Because the elastic support member 320 provides continuous support and cushioning during the upward and downward movement of the swing support member 310, the reliability and durability of the entire support structure are improved, ensuring stable operation even under frequent swinging and load changes.

[0057] In some embodiments, the accommodating hole 410 may be a stepped hole comprising a first accommodating hole (not shown) located near the platform 100 and a second accommodating hole 411 located away from the platform 100. Both the first accommodating hole 411 and the second accommodating hole 411 are cylindrical holes, and accordingly, the swing shaft 200 is a cylindrical shaft; the diameter of the first accommodating hole is smaller than the diameter of the second accommodating hole 411. The swing support member 310 is disposed within the first accommodating hole and is movable along the axial direction of the first accommodating hole. The elastic support member 320 is partially disposed within the second accommodating hole 411.

[0058] In some embodiments, see Figure 1 、 Figure 2 and Figure 4 The swing support member 310 includes a support base 311 and a support body 312. The support base 311 is movably disposed in the accommodating hole 410 along the axial direction of the accommodating hole 410 and is in pressure contact with the elastic support member 320. The support body 312 is swingably disposed on the support base 311 and defines a first mounting hole. The swing shaft 200 is disposed in the first mounting hole.

[0059] In a specific implementation, the support body 312 is provided with a first mounting hole along the axial direction. The first mounting hole can be a through hole and is adapted to the swing shaft 200. The swing shaft 200 is passed through the through hole. In addition, a shoulder 210 is formed on the lower end surface of the swing shaft 200 away from the platform 100. The shoulder 210 and the lower end surface of the support body 312 (relative to the Figure 1 and Figure 2 The swing shaft 200 is pressed against the support member 312 (as shown in the state shown). The upper end surface of the swing shaft 200 near the platform 100 is formed with an external thread, and the nut 220 is connected to the swing shaft 200 via the external thread. The shoulder 210 limits the swing shaft 200. The swing shaft 200 is fixed to the support body 312 by the shoulder 210 and the nut 220. The swing shaft 200 can swing relative to the support base 311 along with the support body 312. The end surface of the support base 311 away from the platform 100 is pressed against the elastic support member 320, and the pressing plate 311a is pressed against the end surface of the support base 311 near the platform 100. The pressing plate 311a is connected to the base 400 via a screw 311b.

[0060] In another specific implementation, the swing shaft 200 and the support body 312 can be threadedly connected, that is, an internal thread is formed in the first mounting hole, and an external thread is formed on the swing shaft 200. The swing shaft 200 is fixed in the first mounting hole by threaded connection, and the swing shaft 200 and the support body 312 can also be an interference fit. Of course, the swing shaft 200 can also be fixedly connected to the support body 312 by welding or other methods. This embodiment does not limit the specific connection form.

[0061] The support body 312 is swingably mounted on the support base 311. In one embodiment, the support base 311 defines a second mounting hole having a spherical inner surface, and the support body 312 has a spherical outer surface. The support body 312 is mounted in the second mounting hole, and the spherical outer surface and the spherical inner surface are adapted to each other so that the support body 312 can swing relative to the support base 311.

[0062] In some embodiments, the swing support member 310 may be a spherical bearing, with the swing shaft 200 disposed on the inner ring of the spherical bearing, and the outer ring of the spherical bearing being press-fitted to the elastic support member 320. In a specific implementation, a bearing pressure plate (not shown) may be press-fitted to the outer ring of the spherical bearing, and the bearing pressure plate may be connected to the base 400 via screws.

[0063] In this embodiment, the cooperation between the inner ring of the spherical bearing and the swing shaft 200 can ensure the precise positioning of the axis, prevent deviation during the swinging process, and thus ensure the swing accuracy of the platform 100.

[0064] In some embodiments, see Figures 1 to 6The elastic support member 320 includes: a first support 321 and a first elastic member 322. The first support 321 is connected to the lower end surface of the base 400 (relative to the Figure 1 The first elastic member 322 is placed in the accommodating hole 410 and connected to the first support 321 , and the swing support member 310 is pressed against the first elastic member 322 .

[0065] In one specific implementation, the receiving hole 410 is a through hole extending through the base 400, and the first support 321 covers the receiving hole 410. The first elastic member 322 can be an elastic element such as rubber, a spring, a spring, an elastic column, an airbag, or the like. There can be at least two first elastic members 322, evenly distributed circumferentially around the axis of the swing shaft 200. The first elastic member 322 can also be an annular body coaxially disposed with the swing shaft 200.

[0066] In some embodiments, see Figures 1 to 6 The first elastic member 322 is a spring, and the elastic support member 320 further includes a pressure plate 323. The surface of the first support 321 placed in the accommodating hole 410 is formed with at least two columns 321a. There are at least two first elastic members 322, which are sleeved on the columns 321a in a one-to-one correspondence. The pressure plate 323 has holes corresponding to the positions of the columns 321a. The columns 321a are inserted into the holes so that the pressure plate 323 and the first elastic member 322 are pressed together. The swing support member 310 is pressed together with the pressure plate 323. When the swing support member 310 moves axially, the pressure plate 323 compresses the first elastic member 322, so that the first elastic member 322 absorbs and alleviates the displacement.

[0067] In this embodiment, when the support seat 311 is subjected to downward pressure, the first elastic member 322 is compressed by the pressure plate 323, so that the support seat 311 moves up and down in the accommodating hole 410 of the base 400, achieving axial buffering and keeping the axial position of the platform 100 from shifting.

[0068] In some embodiments, the platform 100 is a circular table, the swing shaft 200 is a cylindrical shaft, the base 400 is a cylinder, and the swing shaft 200, the platform 100, the base 400 and the accommodating hole 410 are coaxially arranged, which makes it easier to align and install the components during assembly and maintenance, reducing assembly errors. In addition, during the swinging process, the rotation center of the platform 100 is easier to keep consistent with the axis of the swing shaft 200, thereby reducing eccentric vibration and improving the stability and reliability of the entire structure.

[0069] The supporting platform in the related technology also rotates around the axis when the polishing head presses down to pick up the workpiece. When the polishing machine applies an inclined downward pressure to it, the supporting platform rotates around the axis and the position shifts, which in turn affects the polishing machine's removal of workpieces.

[0070] Based on this, see Figure 1 and Figure 7 In some embodiments, the platform 100 may further include: a limit pin 600 and a swing member 700. The limit pin 600 is fixedly connected to the base 400; the platform 100 is swingably connected to the swing member 700, and the swing member 700 has a cylindrical hole. The limit pin 600 is partially placed in the cylindrical hole. When the platform 100 swings, the swing member 700 can move up and down along the limit pin 600 (relative to the Figure 1 (as shown) moves.

[0071] In one specific implementation, the top of the stop pin 600 can be spherical or conical to reduce friction and wear during the vertical movement of the swing member 700. This prevents excessive clearance between the cylindrical hole and the stop pin 600 during the swinging of the swing member 700, thereby maintaining the stability of the platform 100. Specifically, the cylindrical hole of the swing member 700 can be adapted to the diameter of the stop pin 600 to prevent shaking during the vertical movement of the swing member 700.

[0072] In this embodiment, when the platform 100 swings relative to the swing member 700, the swing member 700 moves up and down relative to the limit pin 600. The limit pin 600 limits the position of the swing member 700 and the platform 100. The interaction between the limit pin 600 and the swing member 700 effectively limits the rotational movement of the platform 100, ensuring that the platform 100 does not rotate unnecessary about its center during the swing process. In addition, the cooperation between the limit pin 600 and the swing member 700 also reduces the radial deviation of the platform 100 during the swing process, ensuring that the platform 100 always maintains its preset motion trajectory during the swing process, and ensuring the positional stability of the platform 100 during the polishing machine's loading and unloading of workpieces.

[0073] In some embodiments, see Figure 1 The swing member 700 may include a mounting base 710 and a swing body 720. The mounting base 710 is fixedly connected to the platform 100, and the swing body 720 is swingably disposed on the mounting base 710. The swing body 720 is provided with a columnar hole.

[0074] In a specific implementation, a stepped hole is opened on the surface of the platform 100 close to the base 400, and the mounting seat 710 is clamped in the stepped hole. The mounting seat pressure plate 711 is pressed on the mounting seat 710 and connected to the platform 100, and the mounting seat 710 is limited by the mounting seat pressure plate 711. The top of the limiting pin 600 ( Figure 1 The upper end shown in the figure is placed in the step hole and a gap is left between the platform 100 to avoid friction with the limit pin 600 when the platform 100 swings.

[0075] In a specific implementation, the mounting seat 710 is provided with a third mounting hole having an inner surface of a spherical body or an arcuate body, the swinging body 720 has an outer surface of a spherical body or an arcuate body, the swinging body 720 is arranged in the third mounting hole, and the outer surface is adapted to the spherical inner surface so that the swinging body 720 and the mounting seat 710 are swingably connected.

[0076] In some embodiments, the swing member 700 is a spherical bearing, the limiting pin 600 is disposed on the inner ring of the spherical bearing, and the outer ring of the spherical bearing is fixedly connected to the platform 100. Specifically, the outer ring of the spherical bearing can be fixed to the platform 100 by pressing the bearing pressure plate against the outer ring of the spherical bearing, thereby limiting the position of the spherical bearing.

[0077] In this embodiment, the spherical bearing is a standardized mechanical component that is easy to maintain and replace. In addition, the interaction between the inner ring of the spherical bearing and the swing member 700 effectively limits the rotational movement of the platform 100, ensuring that the platform 100 does not produce unnecessary rotation around its center during the swinging process. At the same time, the platform 100 will not produce radial deviation, thereby maintaining the stability of the platform 100.

[0078] In some embodiments, see Figure 1 、 Figure 2 、 Figures 6 to 8 The elastic mechanism 500 may include: an annular airbag 510 and an inflation connector 520. The annular airbag 510 is disposed between the platform 100 and the base 400; the inflation connector 520 is connected to the annular airbag 510 and is used to inflate the annular airbag 510 with gas.

[0079] In this embodiment, the platform 100 is supported by the annular airbag 510 . The annular airbag 510 can evenly distribute the weight of the platform 100 and provide stable support for the platform 100 .

[0080] In this embodiment, an annular airbag 510 is provided under the platform 100. When the annular airbag 510 is inflated, the platform 100 remains horizontal without pressure; when the polishing head is pressed down with a certain deviation angle, the platform 100 tilts accordingly, and the annular airbag 510 can be compressed without affecting the swing of the platform 100, thereby ensuring that the platform 100 and the polishing head fit together.

[0081] In a specific implementation, the annular airbag 510 can be positioned near the edges of the platform 100 and base 400. The annular airbag 510 can be made of an elastic material, such as a wear-resistant, pressure-resistant, and tensile-resistant rubber material that can withstand the mechanical stress and temperature fluctuations during operation. Alternatively, it can be made of a non-elastic material, such as polytetrafluoroethylene. The inflation connector 520 can be a quick-connect connector to facilitate rapid inflation and deflation by the operator. The inflation connector 520 should have good sealing properties to prevent gas leakage.

[0082] In this embodiment, when the platform 100 swings, the annular airbag 510 deforms with the swing of the platform 100. This deformation not only absorbs and disperses the impact and vibration generated by the swinging of the platform 100, thereby reducing damage to the platform 100, but also provides a gentle support function, ensuring the stability of the platform 100 during the swinging process. In addition, due to the deformability of the annular airbag 510, it can adapt to the posture adjustment requirements of the platform 100 in different working environments, increasing the flexibility and adaptability of the system. At the same time, it also has excellent energy absorption properties, providing protection against accidental collisions of the platform 100 and improving the safety performance of the entire device.

[0083] Continue to see Figure 1 and Figure 2 In some embodiments, an annular groove (not shown) is provided on the surface of the base 400 close to the platform 100 , and the annular airbag 510 is partially embedded in the annular groove to better fix and position the annular airbag 510 .

[0084] See also Figure 8 In some embodiments, the elastic mechanism 500 further includes an annular pressure ring 530. The base 400 defines an inflation hole, through which the inflation connector 520 extends. One end of the inflation connector 520 communicates with the annular airbag 510, while the other end of the inflation connector 520 extends from the base 400 for connection to an inflation device. The annular pressure ring 530 is connected to the base 400 and presses the inflation interface of the annular airbag 510 against the base 400 to form a seal.

[0085] In specific implementation, the annular pressure ring 530 can be set inside the annular airbag 510 or outside the annular airbag 510. The annular pressure ring 530 can be locked on the base 400 by screws, and the opening below the annular airbag 510 can be pressed against the base 400 to form a seal.

[0086] In this embodiment, the inflation connector 520 is connected to the annular airbag 510 and inflated therein. After inflation, the annular airbag 510 swells, pushing the platform 100 to be horizontal, and can be compressed in any direction by the platform 100 to achieve cushioning.

[0087] In other embodiments, the elastic mechanism 500 includes: at least two elastic members (not shown in the figure), which are placed between the platform 100 and the base 400 and distributed in a circle with the axis of the platform 100 as the center.

[0088] In specific implementation, the elastic member can be any one of a spring, an elastic column, a rubber column, and an airbag, or a combination of two or more. The elastic member can be evenly distributed along the circumference of the platform 100 with the axis of the platform 100 as the center.

[0089] In this embodiment, when the platform 100 swings, the elastic parts placed at the inclined downward position of the platform 100 are compressed, and the elastic parts placed at other positions of the platform 100 are stretched, so as to always provide buffering support to the platform 100 during the swinging process of the platform 100 and absorb the swinging energy and impact.

[0090] In this embodiment, when platform 100 swings and tilts in a certain direction, the elastic members located at the tilted downward pressure points are compressed. Through their internal deformation, these elastic members effectively absorb some of the energy and impact generated by the swinging of platform 100. Simultaneously, elastic members located elsewhere on platform 100 are stretched due to the tilting of platform 100. These stretching elastic members provide additional support, ensuring that platform 100 receives a uniform and stable cushioning effect throughout the entire swinging process.

[0091] It can be seen that the platform 100 of the embodiment of the present application is always buffered and supported by the elastic parts during the swinging process, effectively absorbing and dispersing the swinging energy and impact, thereby improving the dynamic performance and working efficiency of the entire system.

[0092] It can be seen that in the present application, when the platform 100 swings, the platform 100 and the swing shaft 200 swing integrally relative to the support mechanism 300. At the same time, the support mechanism 300 moves up and down in the accommodating hole 410 of the base 400 to limit the axis of the platform 100; at the same time, the swing member 700 also swings synchronously with the platform 100, and the swing member 700 moves up and down relative to the limit pin 600; since the limit pin 600 is fixed to the base 400, the swing member 700 can only move up and down relative to the limit pin 600, that is, it moves axially along the platform 100, and the swing member 700 cannot move radially or circumferentially along the platform 100, so the platform 100 cannot rotate, thereby avoiding the platform 100 from rotating around the center of the circle during the swinging process.

[0093] The present application also provides a chemical mechanical polishing apparatus, which may include: a polishing plate, a carrier head, a trimming device, a liquid supply device, and any of the above-mentioned wafer carriers, wherein the wafer carrier is disposed on one side of the polishing plate, and the carrier head is configured to receive a wafer from the wafer carrier or transfer a wafer to the wafer carrier. Specifically, a polishing pad may be disposed on the upper surface of the polishing plate, and the polishing pad rotates together with the polishing plate; a horizontally movable carrier head is disposed above the polishing pad, and the bottom of the carrier head attracts the wafer to be polished; the liquid supply device may be disposed above the polishing pad to spread the polishing liquid on the surface of the polishing pad; the trimming device swings around a fixed point, and the trimming head disposed thereon rotates and applies a downward load to trim the surface of the polishing pad. The wafer carrier may be horizontally adjacent to one side of the polishing plate, and the carrier head may transfer a wafer from the wafer carrier to the polishing pad, or the carrier head may place a polished wafer on the wafer carrier, waiting for a wafer transfer device such as a robot or other transfer device to transfer the polished wafer to the next process.

[0094] Among them, the specific implementation process of the wafer carrier can be found in the above description, and this embodiment will not be repeated here.

[0095] Since the wafer carrier has the above-mentioned effects, the chemical mechanical polishing equipment having the wafer carrier also has corresponding technical effects.

[0096] In summary, the embodiment of the present application maintains the platform 100 level through the elastic mechanism 500, which can be compressed and buffered when swung downward; the overall downward pressure buffering of the platform 100 is achieved through the support mechanism 300, ensuring that the axial position of the platform 100 is not offset; and the platform 100 is prevented from rotating around the axis through the restriction of the limit pin 600 and the swing member 700.

[0097] Obviously, those skilled in the art may make various changes and modifications to this application without departing from the spirit and scope of this application. Thus, if these modifications and variations of this application fall within the scope of the claims of this application and their equivalents, this application is intended to include these modifications and variations.

Claims

1. A wafer carrier, characterized in that: include: The platform is used to place the workpiece, and its center is fixedly connected to the swing axis; A base with a receiving hole in the center; A support mechanism is provided in the accommodating hole, and the swing shaft is swingably connected to the support mechanism; the support mechanism includes a swing support member and an elastic support member that are press-connected with each other, the swing support member is movable along the axial direction of the accommodating hole, and the elastic support member is used to deform when the swing support member moves axially along the accommodating hole, so as to provide buffer support for the swing support member; the swing support member includes a support seat and a support body, the swing shaft is provided in a first mounting hole of the support body; the support seat is provided with a second mounting hole having a spherical inner surface, and the support body has a spherical outer surface adapted to the second mounting hole, so as to be swingably connected to the support seat; A limit pin fixedly connected to the base and a swinging member swingably connected to the platform; the swinging member includes a swinging body and a mounting seat fixedly connected to the platform, the limit pin portion being disposed within a cylindrical hole of the swinging body, and the swinging member being movable along the limit pin when the platform swings; the mounting seat being provided with a third mounting hole having a spherical inner surface, the swinging body having a spherical outer surface adapted to fit within the third mounting hole, so as to be swingably connected to the mounting seat; The elastic mechanism includes an annular airbag disposed between the platform and the base, wherein the annular airbag is deformable as the platform swings; when the annular airbag is inflated, the annular airbag bulges to push the platform to a horizontal position; When the polishing head is pressed down with a deviation angle, the platform is tilted accordingly, and the annular airbag can be compressed to make the platform and the polishing head fit together.

2. The wafer carrier according to claim 1, wherein: The elastic mechanism comprises: The inflation connector is connected to the annular airbag and is used to inflate gas into the annular airbag.

3. The wafer carrier according to claim 1, wherein: The annular airbag is arranged at positions near the edges of the platform and the base.

4. The wafer carrier according to claim 1, wherein: An annular groove is provided on the surface of the base close to the platform, and the annular airbag is partially embedded in the annular groove.

5. The wafer carrier according to claim 2, wherein: The base is provided with an inflation hole, the inflation connector is provided through the inflation hole, and one end of the inflation connector is connected to the annular airbag, and the other end extends out of the base for connection with the inflation device; The elastic mechanism further comprises an annular pressure ring connected to the base, wherein the annular pressure ring presses the inflation interface of the annular airbag to the base to form a seal.

6. The wafer carrier according to claim 1, wherein: The elastic mechanism comprises: At least two elastic members are placed between the platform and the base and are distributed along a circumference with the axis of the platform as the center.

7. The wafer carrier according to claim 1, wherein: The elastic support member comprises: a first support connected to the base and covering the receiving hole of the base; The first elastic member is placed in the accommodating hole and connected to the first support. The swing support member is pressed against the first elastic member.

8. The wafer carrier according to claim 7, characterized in that: The surface of the first support placed in the receiving hole is formed with at least two columns; There are at least two first elastic members, which are sleeved on the pillars in a one-to-one correspondence; The elastic support member also includes: a pressure plate, which has holes corresponding to the positions of the columns. The columns are inserted into the holes to press the pressure plate against the first elastic member, and the swing support member is pressed against the pressure plate.

9. A chemical mechanical polishing device, characterized in that: include: The polishing plate, the carrying head, the dressing device and the liquid supply device also include a wafer carrying platform as described in any one of claims 1 to 8, wherein the wafer carrying platform is arranged on one side of the polishing plate, and the carrying head is configured to receive the wafer from the wafer carrying platform or transfer the wafer to the wafer carrying platform.

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