Copper surface treatment device for processing integrated circuit board

Abstract

The invention relates to the technical field of circuit board production, and discloses a copper surface treatment device for integrated circuit board processing, the copper surface treatment device comprises a hoisting device, a hanger mechanism and a treatment tank mechanism, the treatment tank mechanism comprises a pickling tank, an activation tank and an electroplating tank, and the pickling tank and the electroplating tank are both internally provided with circulating flushing mechanisms; the rack assembly comprises a plurality of slot units, each slot unit comprises a supporting frame and a placing frame, the supporting frame is U-shaped, the placing frame is L-shaped, grooves are formed in the two edges of the L-shaped placing frame, and efficient cleaning of the surface and holes of the circuit board is achieved through cooperation of the circulating flushing mechanism and the corrugated plate; the cleaning efficiency before acid pickling and electroplating is remarkably improved, meanwhile, in the electroplating process, ion distribution can be more uniform through disturbance of the corrugated plate and the flow stabilizing effect of the circulating flushing mechanism, hydrogen bubbles are effectively prevented from being formed, and therefore the electroplating quality is guaranteed.

Description

Technical Field

[0001] The invention relates to the technical field of circuit board production, in particular to a copper surface processing device for processing integrated circuit boards. Background Art

[0002] An integrated circuit board (IC) is a circuit board that integrates complex circuits onto a small resin substrate, combining the characteristics of both an FPC and a PCB. With the rapid advancement of electronic technology, the electronic circuits on PCBs are becoming increasingly sophisticated, making their processing more challenging. In IC production, copper surface treatment is a critical step in ensuring circuit performance and reliability. Consequently, the requirements for copper surface treatment on PCBs are becoming increasingly stringent.

[0003] The copper surface on a circuit board is easily oxidized, and the resulting oxide layer reduces electrical conductivity and solderability. Therefore, a protective layer needs to be electroplated on the copper surface. Currently, the most commonly used method for protecting copper surface circuits on circuit boards is to tin them. During the processing, the copper surface is easily contaminated with impurities such as dust and oil, which can easily affect the adhesion and electrical properties of the subsequent coating, thereby affecting the subsequent tinning operation. Existing circuit boards are usually immersed in an acidic solution to remove oil and dust from the surface of the circuit board before tinning. Similarly, when electrotinning is performed on the circuit board, the circuit board is immersed in a tinning solution and then electroplated. This immersion method cannot effectively remove oil and dust, and bubbles are easily generated on the surface of the circuit board during electrotinning. If the bubbles are not removed in time, it can easily lead to problems with the quality of the tinning. Summary of the Invention

[0004] The present invention aims to provide a copper surface treatment device for processing integrated circuit boards, so as to solve the problems of poor treatment effect and low treatment efficiency of the copper surface of existing circuit boards.

[0005] The present invention is achieved through the following technical solutions: A copper surface treatment device for processing integrated circuit boards, comprising a hoisting device, a hanging rack mechanism, and a treatment tank mechanism, wherein the treatment tank mechanism comprises a pickling tank, an activation tank, and an electroplating tank, wherein the pickling tank and the electroplating tank are both provided with a circulating flushing mechanism; The rack assembly includes a plurality of slot units, each of which includes a support frame and a placement frame. The support frame is U-shaped, and the placement frame is L-shaped. Grooves are provided on two sides of the L-shaped placement frame. A plating clamp, an insulating sealing strip and a U-shaped clamp are provided in the groove of the placement rack. The insulating sealing strip is U-shaped. Two electroplating clamps are placed at both ends of the insulating sealing strip and fixed to the ends of the insulating sealing strip. The two electroplating clamps are also fixed at both ends of the U-shaped clamp.

[0006] During electroplating, the plating clip is electrically connected to the negative electrode, and the contact between the insulating sealing strip and the circuit board can isolate the plating clip from the external ion solution, thereby preventing the plating clip itself from being electroplated and affecting its own conductivity.

[0007] In a possible design, the support frame includes two columns, and connecting bars are fixed at both ends of each column, and multiple slot units are connected and fixed by the connecting bars.

[0008] In one possible design, the circulating flushing mechanism includes a partition cabin, a dividing guide plate, a porous partition and a circulating pump. A porous partition is fixed in the partition cabin, and the partition cabin is divided into two upper and lower cavities by the porous partition. The cavity below the partition cabin is connected to the circulating pump through a pipeline, and a plurality of through holes are evenly distributed on the plane of the porous partition.

[0009] In a possible design, a placement area for a hanger mechanism is provided above the compartment, a plurality of circuit boards are placed on the hanger mechanism, a corrugated plate is provided between two adjacent circuit boards, and the cross section of the corrugated plate is wavy.

[0010] In one possible design, a plurality of corrugated plates are provided above the partition cabin, and a plurality of dividing guide plates are fixed above the porous partition plates in the partition cabin. The dividing guide plates are used to further divide the steady flow generated from the porous partition plates and to guide the divided steady flow into between two adjacent corrugated plates.

[0011] Through the mutual cooperation of multiple corrugated plates and the circulating flushing mechanism, the surface of each circuit board can be subjected to the impact of the same flow rate and the same liquid fluctuation. During the cleaning before electroplating, it can be ensured that the surface of each circuit board can be better cleaned. During electroplating, it can be ensured that the ionic liquid output from each circuit board has the same flow rate, thereby ensuring that the plating on each circuit board is uniform.

[0012] In a possible design, each of the corrugated plates is fixed on the same connecting shaft, and the connecting shaft is driven by a crank slider mechanism.

[0013] In a possible design, a filter layer is provided at the inlet of the circulation pump, the outlet of the circulation pump is connected to one end of a water outlet pipe, and the other end of the water outlet pipe is connected to the cavity below the porous partition.

[0014] In one possible design, the lifting device includes a hanger and a lifting device. A horizontal beam is provided at the top of the hanger, and the lifting device moves on the beam, so that the lifting device can move in the area above the pickling tank, activation tank and electroplating tank through the beam. The lifting device includes a retractable telescopic arm and a brake-clamping claw.

[0015] Compared with the prior art, the present invention has the following advantages and beneficial effects: The present invention realizes efficient cleaning of the surface and holes of the circuit board through the cooperation of the circulating flushing mechanism and the corrugated plate, significantly improving the cleaning efficiency before pickling and electroplating. At the same time, during the electroplating process, the disturbance of the corrugated plate and the stabilizing effect of the circulating flushing mechanism can make the ion distribution more uniform, effectively preventing the formation of hydrogen bubbles, thereby ensuring the quality of electroplating. The design of the electroplating clamp and the insulating sealing strip not only ensures the conductivity of the electroplating clamp, but also prevents it from being electroplated, thereby extending its service life. The provision of the side baffle and the filter layer optimizes the flow of liquid, prevents particulate matter from scratching the surface of the circuit board, and further improves the processing accuracy and product quality. The overall device realizes efficient and uniform processing of the copper surface of the circuit board through the synergistic effect of its various parts. It is particularly suitable for large-scale production and can significantly improve production efficiency and product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The drawings described herein are used to provide a further understanding of the embodiments of the present invention, constitute a part of this application, and do not constitute a limitation of the embodiments of the present invention. In the drawings: Figure 1 It is a structural schematic diagram of the present invention; Figure 2 It is a structural schematic diagram of a single treatment pool in the present invention; Figure 3 Schematic diagram of the structure of the porous partition in the present invention; Figure 4 3D schematic diagram of a single treatment tank in the present invention; Figure 5 It is a structural schematic diagram of the hanging bracket mechanism in the present invention; Figure 6 Schematic diagram of the structure of the slot unit in the present invention; Figure 7 It is a cross-sectional schematic diagram of the groove of the placement rack in the present invention.

[0017] The reference numerals represent: 1-hanger, 2-lifting device, 3-treatment tank mechanism, 301-pickling tank, 302-activation tank, 303-electroplating tank, 4-corrugated plate, 5-dividing guide plate, 6-porous partition, 601-through hole, 7-fixed seat, 8-filter layer, 9-circulating pump, 10-circuit board, 11-connecting shaft, 12-end baffle, 13-dividing cabin, 14-outlet pipe, 15-connecting bar, 16-rectangular groove, 17-placing rack, 1701-electroplating clamp, 1702-insulating sealing strip, 1703-U-shaped clip, 1704-positioning abutment block, 18-support frame, 19-side baffle. DETAILED DESCRIPTION

[0018] In order to make the objectives, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with examples and drawings. The exemplary embodiments of the present invention and their descriptions are only used to explain the present invention and are not intended to limit the present invention.

[0019] Examples, such as Figures 1 to 7 As shown, a copper surface treatment device for integrated circuit board processing includes a hoisting device, a hanging rack mechanism, and a treatment tank mechanism 3. The treatment tank mechanism 3 includes a pickling tank 301, an activation tank 302, and an electroplating tank 303. The pickling tank 301 and the electroplating tank 303 are both equipped with a circulating flushing mechanism. The transfer of the circuit board 10 between the three tanks is completed by the hoisting device. When in use, multiple circuit boards 10 are placed on the hanging rack mechanism. The hanging rack assembly includes multiple slot units, and the slot unit includes a support rack 18 and a placement rack 17. The support rack 18 is U-shaped, and the placement rack 17 is L-shaped. Grooves are provided on the two sides of the L-shaped placement rack 17. After the two sides of the circuit board 10 are placed in the two grooves on the placement rack 17, it can be ensured that the circuit board 10 will not fall off easily after being placed on the placement rack 17.

[0020] In this embodiment, the lifting device includes a hanger 1 and a lifting device 2. A horizontal beam is provided at the top of the hanger 1, and the lifting device 2 moves on the beam, so that the lifting device 2 can move in the upper area of ​​the pickling tank 301, the activation tank 302 and the electroplating tank 303 through the beam. The lifting device 2 includes a retractable telescopic arm and a brake-clamping claw, and the lifting and lowering of the clamped object on the claw is controlled by the telescopic arm.

[0021] Advantageously, a plating clamp 1701, an insulating sealing strip 1702 and a U-shaped clamp 1703 are provided in the groove of the placement rack 17. The insulating sealing strip 1702 is U-shaped, and the two electroplating clamps 1701 are placed at both ends of the insulating sealing strip 1702 and fixed to the end of the insulating sealing strip 1702. The two electroplating clamps 1701 are also fixed to the two ends of the U-shaped clamp 1703. When the circuit board 10 is inserted between the two electroplating clamps 1701, under the action of the U-shaped clamp 1703, the two electroplating clamps 1701 clamp the circuit board 10. When electroplating is performed, the electroplating clamp 1701 is electrically connected to the negative pole, and the contact between the insulating sealing strip 1702 and the circuit board 10 can isolate the electroplating clamp 1701 from the external ionic solution, thereby preventing the electroplating clamp 1701 itself from being electroplated and affecting the conductivity of the electroplating clamp 1701 itself.

[0022] At the same time, through the above method, after the circuit board 10 is installed on the hanger mechanism, it can be directly placed into each pool for processing together with the hanger structure. There is no need to disassemble the circuit board back and forth when processing in different pools, thereby reducing the tediousness of circuit board processing and making the processing of the circuit board 10 more convenient and quick.

[0023] In this embodiment, the support frame 18 includes two columns, each of which is fixed with a connecting strip 15 at both ends, and multiple slot units are connected and fixed by the connecting strip 15. Rectangular grooves 16 are provided on the two columns. In order to concentrate the flow of liquid between the two circuit boards 10, side baffles 19 are further provided between adjacent slot units. The side baffles 19 cooperate with the rectangular grooves 16 to close the two ends of the corrugated plate 4 to ensure that the liquid around the circuit board 10 has sufficient fluidity.

[0024] In this embodiment, the circulating flushing mechanism includes a partition cabin 13, a dividing guide plate 5, a porous partition 6 and a circulating pump 9. A porous partition 6 is fixedly installed in the partition cabin 13. The partition cabin 13 is divided into two upper and lower cavities by the porous partition 6. The cavity below the partition cabin 13 is connected to the circulating pump 9 through a pipeline. A plurality of through holes 601 are evenly distributed on the plane of the porous partition 6. The circulating pump 9 pumps liquid into the cavity below the porous partition 6 for pressurization. The water in the cavity below the porous partition 6 enters the top of the porous partition 6 through the through holes 601 on the porous partition 6. The liquid flow rate and water pressure difference at each through hole 601 are almost the same, thereby forming a stable flow area in the partition cabin 13 through the porous partition 6.

[0025] Furthermore, a placement area for a hanging mechanism is provided above the compartment 13, and multiple circuit boards 10 are placed on the hanging mechanism. A corrugated plate 4 is provided between two adjacent circuit boards 10, and the cross-section of the corrugated plate 4 is wavy. When the flowing liquid flows into between the corrugated plate 4 and the circuit board 10, the liquid will produce certain fluctuations. The fluctuating liquid can make the tin ions around the circuit board 10 evenly distributed during electroplating, and can also promptly clean up the hydrogen generated on the surface of the circuit board 10, thereby having a good cleaning effect on the surface of the circuit board 10, and can also achieve a more thorough cleaning of the surface of the circuit board 10 and the holes between the circuit board 10 during the cleaning process before electroplating.

[0026] Advantageously, a plurality of corrugated plates 4 are provided above the partition cabin 13, and a plurality of dividing guide plates 5 are fixed above the porous partition plate 6 in the partition cabin 13. The dividing guide plates 5 are used to further divide the steady flow generated from the porous partition plate 6 and introduce the divided steady flow into between two adjacent corrugated plates 4, thereby completing the flushing of the surface of each circuit board 10 and making the kinetic energy of the fluid in the partition cabin 13 better applied to the designated working area.

[0027] It should be noted that when the circulating flushing mechanism is installed in the pickling tank 301, it can quickly flush the surfaces of multiple circuit boards 10, making the surfaces of the circuit boards 10 cleaner and more efficient than conventional flushing. Furthermore, if the circuit boards 10 have holes, the fluid disturbance caused by the corrugated plate 4 can further clean the holes, achieving a better cleaning effect than conventional immersion methods. The circulating flushing mechanism in the electroplating tank 303 firstly distributes the tin ions in the electroplating tank 303 more evenly through the twisting of the liquid. Furthermore, the fluid disturbance caused by the corrugated plate 4 can also promptly remove hydrogen generated on the circuit boards 10 during electroplating, preventing hydrogen from accumulating into bubbles on the circuit boards 10 and thus affecting the quality of the electroplated tin.

[0028] Furthermore, in order to enhance the turbulence effect brought by the corrugated plate 4, each of the corrugated plates 4 is fixed on the same connecting shaft 11, and the connecting shaft 11 is driven by a crank slider mechanism to slide up and down. The connecting shaft 11 then drives each corrugated plate 4 to slide up and down, thereby further improving the electroplating quality and the cleaning effect before electroplating.

[0029] Through the mutual cooperation of multiple corrugated plates 4 and the circulating flushing mechanism, the surface of each circuit board 10 can be subjected to the same flow rate and the same liquid fluctuation. During the cleaning before electroplating, it can be ensured that the surface of each circuit board 10 can be better cleaned. During electroplating, it can be ensured that the ionic liquid output from each circuit board 10 has the same flow rate, thereby ensuring that the coating on each circuit board 10 is uniform.

[0030] Advantageously, a filter layer 8 is provided at the inlet of the circulation pump 9, and the outlet of the circulation pump 9 is connected to one end of the water outlet pipe 14, and the other end of the water outlet pipe 14 is connected to the cavity below the porous partition 6. The filter layer 8 can filter the liquid in the compartment 13 to prevent solid particles flushed from the circuit board 10 from entering the cavity below the porous partition 6, and to avoid particles being sprayed out from the through hole 601 and scratching the surface of the circuit board 10 when entering the circuit board 10.

[0031] The specific implementation methods described above further illustrate the objectives, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above description is only a specific implementation method of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A copper surface processing device for processing integrated circuit boards, comprising a hoisting device, a hanging rack mechanism and a processing tank mechanism (3), characterized in that: The treatment tank mechanism (3) comprises a pickling tank (301), an activation tank (302) and an electroplating tank (303), and a circulating flushing mechanism is provided in both the pickling tank (301) and the electroplating tank (303); The rack assembly includes a plurality of slot units, and the slot units include a support frame (18) and a placement frame (17), the support frame (18) is U-shaped, and the placement frame (17) is L-shaped, and grooves are provided on two sides of the L-shaped placement frame (17); An electroplating clamp (1701), an insulating sealing strip (1702) and a U-shaped clip (1703) are provided at the groove of the placement rack (17); the insulating sealing strip (1702) is U-shaped; two electroplating clamps (1701) are placed at both ends of the insulating sealing strip (1702) and fixed to the end of the insulating sealing strip (1702); and the two electroplating clamps (1701) are also fixed to both ends of the U-shaped clip (1703).

2. The copper surface treatment device for integrated circuit board processing according to claim 1, characterized in that: The support frame (18) comprises two columns, and a connecting bar (15) is fixed at both ends of each column, and a plurality of slot units are connected and fixed via the connecting bar (15).

3. The copper surface treatment device for integrated circuit board processing according to claim 2, characterized in that: The circulating flushing mechanism comprises a partition cabin (13), a dividing guide plate (5), a porous partition plate (6) and a circulating pump (9); the porous partition plate (6) is fixedly provided in the partition cabin (13); the partition cabin (13) is divided into two upper and lower cavities by the porous partition plate (6); the cavity below the partition cabin (13) is connected to the circulating pump (9) through a pipeline; a plurality of through holes (601) are evenly distributed on the plane of the porous partition plate (6).

4. The copper surface treatment device for integrated circuit board processing according to claim 3, characterized in that: A placement area for a hanger mechanism is provided above the compartment (13), a plurality of circuit boards (10) are placed on the hanger mechanism, a corrugated plate (4) is provided between two adjacent circuit boards (10), and the cross section of the corrugated plate (4) is wavy.

5. The copper surface treatment device for integrated circuit board processing according to claim 3, characterized in that: A plurality of corrugated plates (4) are provided above the partition cabin (13), and a plurality of dividing guide plates (5) are fixed above the porous partition plate (6) in the partition cabin (13). The dividing guide plates (5) are used to further divide the steady flow generated from the porous partition plate (6) and to guide the divided steady flow into between two adjacent corrugated plates (4).

6. The copper surface treatment device for integrated circuit board processing according to claim 5, characterized in that: Each of the corrugated plates (4) is fixed on the same connecting shaft (11), and the connecting shaft (11) is driven by a crank slider mechanism.

7. The copper surface treatment device for integrated circuit board processing according to claim 2, characterized in that: A filter layer (8) is provided at the inlet of the circulation pump (9), and the outlet of the circulation pump (9) is connected to one end of a water outlet pipe (14), and the other end of the water outlet pipe (14) is connected to the cavity below the porous partition (6).

8. The copper surface treatment device for integrated circuit board processing according to claim 1, characterized in that: The hoisting device comprises a hanger (1) and a lifting device (2), wherein a horizontal crossbeam is provided at the top of the hanger (1), and the lifting device (2) moves on the crossbeam, so that the lifting device (2) can move above the pickling tank (301), the activation tank (302) and the electroplating tank (303) through the crossbeam, and the lifting device (2) comprises a retractable telescopic arm and a clamping claw that can be braked and clamped.

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