Flash lamp module and electronic equipment

Abstract

The invention relates to a flash lamp module and electronic equipment. The flash lamp module comprises a heat dissipation plate and a flash lamp assembly. The heat dissipation plate comprises a shell, a capillary structure and a cooling medium, the capillary structure and the cooling medium are arranged in the shell, the shell is provided with an evaporation area and a condensation area, and the heat dissipation plate is configured in the mode that the cooling medium can absorb heat and evaporate in the evaporation area and release heat and condense in the condensation area; the capillary structure is used for guiding the cooling medium condensed in the condensation area to the evaporation area. The flash lamp assembly is arranged on the shell and corresponds to the evaporation area. According to the flash lamp module, the heat dissipation efficiency of the flash lamp module can be effectively improved, the service life of the flash lamp module is prolonged, the performance stability of the flash lamp module is improved, and meanwhile the size of the flash lamp module is not prone to being increased.

Description

Technical Field

[0001] The present application relates to the technical field of terminal devices, and in particular to a flash module and electronic equipment. Background Art

[0002] Smartphones, tablets, e-readers, and other electronic devices are typically equipped with flash modules, which emit light to enable flashlight mode to assist the user with lighting, or to enable fill light or flash mode to supplement the light for shooting and improve the quality of the shot. With the increasing demand for brightness in flashlight mode on electronic devices and the increasing demand for shooting effects in low-light environments, the demand for flash brightness is also increasing. However, as the brightness of the flash increases, the temperature rise rate accelerates. Traditional flash modules are unable to meet the heat dissipation requirements of the flash, affecting the lifespan and performance stability of the flash. Summary of the Invention

[0003] The embodiments of the present application provide a flash module and an electronic device to solve the problem that traditional flash modules are difficult to meet the heat dissipation requirements of the flash.

[0004] A flashlight module, comprising:

[0005] A heat sink comprising a housing, a capillary structure, and a cooling medium, wherein the capillary structure and the cooling medium are disposed within the housing, the housing having an evaporation zone and a condensation zone, the heat sink being configured such that: the cooling medium can absorb heat and evaporate in the evaporation zone, and release heat and condense in the condensation zone; the capillary structure is configured to guide the cooling medium condensed in the condensation zone to the evaporation zone; and

[0006] The flash lamp assembly is arranged on the housing and corresponds to the evaporation area.

[0007] An electronic device includes the above-mentioned flash module.

[0008] The aforementioned flash module utilizes a heat sink to dissipate heat from the flash assembly. The cooling medium absorbs heat generated by the flash assembly in the evaporation zone, evaporating as it flows. The cooling medium then flows to the condensation zone, releasing heat and condensing, where it is then guided by the capillary structure back to the evaporation zone to absorb the heat generated by the flash assembly. This phase-change method effectively improves the flash module's heat dissipation efficiency, extending its lifespan and performance stability. It also minimizes the size of the flash module, facilitating its miniaturization. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0010] Figure 1 Schematic diagram of the structure of electronic equipment in some embodiments.

[0011] Figure 2 FIG. 4 is a cross-sectional diagram of a flash module disposed on a carrier in some embodiments.

[0012] Figure 3 Schematic cross-sectional view of a heat dissipation plate in some embodiments.

[0013] Figure 4 FIG. 4 is a schematic cross-sectional view of the heat dissipation plate along another direction in some embodiments.

[0014] Figure 5 Schematic cross-sectional view of a flash module disposed on a carrier in some other embodiments.

[0015] Figure 6 Schematic diagram of other components of the electronic device in some embodiments.

[0016] Reference numerals:

[0017] 10. Electronic device; 11. Housing; 12. Camera module; 13. Carrier; 131. First surface; 132. Second surface; 20. Flash module; 21. Flash assembly; 211. Flash device; 212. First circuit board; 22. Heat sink; 221. Housing; 2211. First housing portion; 2212. Second housing portion; 222. Capillary structure. DETAILED DESCRIPTION

[0018] To facilitate understanding of the present application, the present application will be described more fully below with reference to the accompanying drawings. The accompanying drawings illustrate preferred embodiments of the present application. However, the present application may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the disclosure of the present application.

[0019] As used herein, "electronic device" refers to a device that can receive and / or send communication signals, including but not limited to a device that is connected via any one or more of the following connection methods:

[0020] (1) Connection via a wired line, such as Public Switched Telephone Networks (PSTN), Digital Subscriber Line (DSL), digital cable, or direct cable connection;

[0021] (2) Via wireless interfaces, such as cellular networks, wireless local area networks (WLAN), digital television networks such as DVB-H networks, satellite networks, and AM-FM broadcast transmitters.

[0022] An electronic device configured to communicate via a wireless interface may be referred to as a "mobile terminal". Examples of mobile terminals include, but are not limited to, the following electronic devices:

[0023] (1) Satellite phone or cellular phone;

[0024] (2) Personal Communications System (PCS) terminals that combine cellular radiotelephones with data processing, fax, and data communications capabilities;

[0025] (3) Radiotelephone, pager, Internet / Intranet access, Web browser, notepad, calendar, Personal Digital Assistant (PDA) equipped with a Global Positioning System (GPS) receiver;

[0026] (4) conventional laptop and / or palmtop receivers;

[0027] (5) Conventional laptop and / or handheld radio telephone transceivers, etc.

[0028] See Figure 1 and Figure 2 , Figure 1 shows a schematic structural diagram of an electronic device 10 in some embodiments of the present application, Figure 2 The schematic diagram of the structure of a flash module 20 in some embodiments of the present application is shown. The flash module 20 provided in the present application includes a flash assembly 21 capable of emitting light for illumination or fill lighting. The flash module 20 can be used in an electronic device 10, including but not limited to terminal devices such as smartphones, tablet computers, and e-readers. In the embodiments of the present application, a smartphone is used as an example.

[0029] The electronic device 10 may include a housing 11 and a display panel (not shown in the figure). The display panel is arranged on the housing 11 and is surrounded by the housing 11 to form a receiving space. The flash module 20 may be arranged in the receiving space and exposed to the side of the housing 11 facing away from the display panel through a hole structure provided in the housing 11. The light emitted by the flash assembly 21 can be emitted from the housing 11 through the hole structure provided in the housing 11 to illuminate or fill in the space on the side of the housing 11 facing away from the display panel. The flash module 20 may also include a protective lens provided on the light-emitting side of the flash assembly 21. The protective lens includes but is not limited to any suitable glass lens, plastic lens or other light-transmitting lens. The protective lens is provided at the hole structure of the housing 11. The protective lens is used to provide sealing protection for the flash assembly 21 and can allow light emitted by the flash assembly 21 to pass through.

[0030] The electronic device 10 may be provided with a flash module 20 to have a flashlight mode. When the electronic device 10 is in the flashlight mode, the flash assembly 21 emits light to assist the user in lighting, which is conducive to enriching the functions of the electronic device 10 and improving the user experience.

[0031] The electronic device 10 may also include a camera module 12, which is arranged in the receiving space and exposed on the side of the outer shell 11 facing away from the display panel. The camera module 12 may include a lens and an image sensor arranged on the light-emitting side of the lens. The lens can collect light from the side of the outer shell 11 facing away from the display panel and transmit the light to the image sensor so that the camera module 12 can obtain an image of the side of the outer shell 11 facing away from the display panel.

[0032] When the electronic device 10 includes a camera module 12, the electronic device 10 is equipped with a flash module 20 to provide a fill light mode and a flash mode. In fill light mode, the flash assembly 21 is constantly on to provide fill light for video capture, real-time preview in low-light environments, or scenes requiring a continuous and stable light source, thereby improving the quality of the shot. In flash mode, the flash assembly 21 is used to emit light to provide fill light for the moment the photo is frozen, thereby improving the quality of the shot.

[0033] In some embodiments, the flash assembly 21 includes a flash device 211 and a first circuit board 212. The flash device 211 serves as the light-emitting portion of the flash assembly 21 and includes, but is not limited to, any suitable light source such as a light-emitting diode (LED). The first circuit board 212 is a flexible circuit board. The flash device 211 is disposed on and electrically connected to the first circuit board 212. The first circuit board 212 is used to electrically connect to components such as the main board, sub-board, or control chip in the electronic device 10 to provide power and control for the flash device 211.

[0034] In some embodiments, the flash module 20 further includes a heat sink 22 . The first circuit board 212 is disposed on the heat sink 22 . The heat sink 22 can absorb heat generated by the flash device 211 to dissipate heat for the flash device 211 .

[0035] Combine Figure 3 and Figure 4 As shown, in some embodiments, the heat sink 22 includes a housing 221, a capillary structure 222, and a cooling medium. The capillary structure 222 and the cooling medium are disposed within the housing 221. The housing 221 has an evaporation zone and a condensation zone. The heat sink 22 is configured such that the cooling medium absorbs heat and evaporates in the evaporation zone, and releases heat and condenses in the condensation zone. The capillary structure 222 is configured to guide the condensed cooling medium in the condensation zone to the evaporation zone. The flash assembly 21 is disposed on the housing 221 and corresponds to the evaporation zone.

[0036] It is understood that the heat sink 22 is used to dissipate heat from the heat sink. The portion of the housing 221 that receives the flash lamp device 211 forms an evaporation zone, and the portion of the housing 221 outside the flash lamp device 211 can be considered a condensation zone. During operation of the flash lamp device 211, heat generated by the flash lamp device 211 is transferred to the evaporation zone of the housing 221 via the first circuit board 212, causing the temperature of the evaporation zone to be higher than that of the condensation zone. The cooling medium may include, but is not limited to, any suitable fluid, such as water or oil. The cooling medium in the evaporation zone absorbs heat transferred from the flash lamp device 211 to the housing 221 and evaporates. The evaporated gaseous cooling medium then flows from the evaporation zone to the condensation zone within the housing 221, where it releases heat and condenses to reform into a liquid cooling medium. The capillary structure 222 is capable of guiding the liquid cooling medium from the condensation zone to the evaporation zone through capillary action, allowing the liquid cooling medium to return to the evaporation zone to absorb heat and evaporate, thereby achieving cooling medium circulation and continuously absorbing heat and cooling the flash lamp device 211.

[0037] exist Figure 4 In the illustrated embodiment, region A schematically represents the evaporation zone. The orthographic projection of the flash lamp device 211 on the housing 221 falls within region A. The portion outside region A can be considered the condensation zone. Direction B, which is the direction from the evaporation zone to the condensation zone, can be understood as the flow direction of the gaseous cooling medium. Direction C, which is the direction from the condensation zone to the evaporation zone, can be understood as the flow direction of the liquid cooling medium within the capillary structure 222.

[0038] The flash module 20 utilizes a heat sink 22 to dissipate heat from the flash assembly 21. The cooling medium absorbs heat generated by the flash assembly 21 in the evaporation zone and evaporates. The cooling medium then flows to the condensation zone, releasing heat and condensing. The cooling medium is then guided by the capillary structure 222 to the evaporation zone to absorb the heat generated by the flash assembly 21. Using a phase change method to dissipate heat from the diffuser lamp assembly effectively improves the heat dissipation efficiency of the flash module 20, thereby extending the lifespan and performance stability of the flash assembly 21. Furthermore, the cooling medium is less likely to increase the size of the flash module 20, thereby facilitating the miniaturization of the flash module 20 and facilitating its integration into the electronic device 10.

[0039] refer to Figure 2 As shown, in some embodiments, the first circuit board 212 is disposed on and attached to the housing 221, and the flash device 211 is disposed on a side of the first circuit board 212 facing away from the housing 221. The electronic device 10 further includes a carrier 13 disposed within the housing 11, and the flash module 20 is disposed within the housing 11. The heat sink 22 is disposed on the carrier 13 on a side of the housing 221 facing away from the flash assembly 21. With this arrangement, the heat sink 22 not only dissipates heat for the flash device 211, but also serves as a supporting structure for the first circuit board 212, providing structural support and protection for the flexible first circuit board 212. This facilitates the installation of the flash module 20 on the carrier 13, reduces the risk of damage to the first circuit board 212, and improves the structural reliability of the flash module 20.

[0040] In some embodiments, the positive projection of the flash assembly 21 on the heat sink 22 falls on the heat sink 22, so that the heat sink 22 has a larger area to provide effective heat dissipation for the flash device 211, while providing effective structural support and protection for the first circuit board 212, thereby improving the heat dissipation performance and structural reliability of the flash module 20.

[0041] In some embodiments, electronic device 10 includes a mainboard (not shown), which may be a printed circuit board (PCB) with integrated components such as resistors and chips. Carrier 13 is a rigid PCB and may be a small board of electronic device 10. Carrier 13 is disposed outside the mainboard, with the orthographic projections of the mainboard and carrier 13 on housing 11 offset from each other. This arrangement, by locating flashlight module 20 on the small board of electronic device 10, allows for more flexible placement of flashlight module 20, reduces the number of components on the mainboard, compresses the mainboard area, and optimizes the structural layout of electronic device 10, thereby facilitating a miniaturized design of electronic device 10.

[0042] In some embodiments, the electronic device 10 further includes a second circuit board (not shown), which is a flexible circuit board, and a carrier 13 is provided on the second circuit board to abut the second circuit board against the housing 11. That is to say, the carrier 13 can be a pressure plate bracket used to position and fix the second circuit board in the electronic device 10. The second circuit board can be an extension circuit of the flash module 20, and the second circuit board can be electrically connected to the first circuit board 212. The second circuit board can also be a circuit board of other functional modules in the electronic device 10, which is not limited in this application. Using the pressure plate bracket in the electronic device 10 as the carrier 13 of the flash module 20 is conducive to simplifying the structure of the electronic device 10, improving the structural compactness and space utilization efficiency of the electronic device 10, and thus facilitating the miniaturization design of the electronic device 10.

[0043] refer to Figure 5 As shown, in some embodiments, the carrier 13 includes an intersecting first surface 131 and a second surface 132. That is, the carrier 13 forms a corner between the first surface 131 and the second surface 132. The corner of the carrier 13 can be arranged corresponding to the corner of the housing 11 of the electronic device 10, or can adapt to the corner formed by different component arrangements within the housing 11. The housing 221 of the heat sink 22 includes a first housing portion 2211 and a second housing portion 2212. The first housing portion 2211 and the second housing portion 2212 are connected and extend in intersecting directions. The angle between the extension directions of the first housing portion 2211 and the second housing portion 2212 is adapted to the angle between the first surface 131 and the second surface 132. In some embodiments, the first surface 131 is perpendicular to the second surface 132, and the extension direction of the first housing portion 2211 is perpendicular to the extension direction of the second housing portion 2212.

[0044] The first housing portion 2211 is disposed on the first surface 131, and the second housing portion 2212 is disposed on the second surface 132. With this arrangement, when the carrier 13 is configured with a corner to accommodate the components within the housing 11 or the electronic device 10, the housing 221 of the flash module 20 can also accommodate the corner of the carrier 13. This allows the flash module 20 to be installed by fully utilizing the space within the carrier 13, thereby improving the structural compactness and space utilization efficiency of the electronic device 10 and thereby reducing the space occupied by the electronic device 10.

[0045] In some embodiments, the portion of the first circuit board 212 provided with the flash device 211 is provided on one of the first surface 131 and the second surface 132, and the portion of the first circuit board 212 is provided on the other of the first surface 131 and the second surface 132. In other words, the portion of the first circuit board 212 provided with the flash device 211 is provided on one of the first housing portion 2211 and the second housing portion 2212, and the first circuit board 212 extends through the boundary between the first housing portion 2211 and the second housing portion 2212 to the other of the first housing portion 2211 and the second housing portion 2212. Figure 5 In the illustrated embodiment, taking the example of a case where the portion of the first circuit board 212 provided with the flash device 211 is disposed on the first surface 131, and the orthographic projection of the flash device 211 on the housing 221 falls on the first surface 131, a portion of the first circuit board 212 extends onto the second surface 132. This arrangement allows the structure of the flash assembly 21 to adapt to the corners of the housing 221 and the carrier 13, without affecting the illumination and fill-light functions of the flash device 211. It also improves the structural compactness and space utilization efficiency of the electronic device 10, thereby facilitating a miniaturized design of the electronic device 10.

[0046] In some embodiments, the thermal conductivity of the heat sink 22 is greater than 2000 W / mK. Since the heat sink 22 dissipates heat to the flash device 211 through the phase change of the cooling medium, the heat dissipation performance of the heat sink 22 on the flash device 211 can be effectively improved, so that the thermal conductivity of the heat sink 22 can reach greater than 2000 W / mK. Compared with the thermal conductivity of the traditional steel plate of approximately 14 W / mK, it can effectively improve the heat dissipation performance of the flash module 20, thereby improving the service life and performance stability of the flash device 211.

[0047] In some embodiments, the thickness of the shell 221 is greater than or equal to 0.03 mm, for example, it can be 0.03 mm, 0.05 mm, 0.07 mm, etc., so that while the flash device 211 is cooled by the heat sink 22, the structural strength of the heat sink 22 can be improved, so that the heat sink 22 can provide effective structural support and protection for the flash assembly 21, thereby improving the structural reliability of the flash module 20.

[0048] In some embodiments, the overall thickness of the heat sink 22, for example, the distance between the surface of the housing 221 facing the flash device 211 and the surface of the housing 221 facing away from the flash device 211, is greater than or equal to 0.15 mm, and may be, for example, 0.15 mm, 0.21 mm, 0.32 mm, etc. This increases the internal space of the heat sink 22, allowing sufficient space within the housing 221 to accommodate the cooling medium and the capillary structure 222, thereby improving the heat dissipation performance of the heat sink 22.

[0049] In some embodiments, the shell 221 is a vacuum environment, which makes the cooling medium conduct faster in the shell 221, which is beneficial to improving the heat dissipation performance of the heat sink 22. The shell 221 can also isolate the internal cooling medium and the capillary structure 222 from the external air to maintain the internal and external pressure difference.

[0050] In some embodiments, the material of the housing 221 includes, but is not limited to, stainless steel, copper, copper alloy, aluminum, or aluminum alloy. Using high-strength stainless steel can improve the structural reliability of the heat sink 22. The housing 221 can be formed using processes such as etching and stamping, and welded using methods such as diffusion welding and laser welding. The capillary structure 222 can include, but is not limited to, copper mesh, stainless steel mesh, sintered copper powder, or grooves provided within the housing 221.

[0051] refer to Figure 6 , Figure 6 This is a schematic diagram of the structure of an electronic device 10 provided in an embodiment of the present application. The electronic device 10 may include a radio frequency (RF) circuit 501, a memory 502 including one or more computer-readable storage media, an input unit 503, a display unit 504, a sensor 505, an audio circuit 506, a wireless fidelity (WiFi) module 507, a processor 508 including one or more processing cores, and a power supply 509. It will be understood by those skilled in the art that Figure 6 The structure of the electronic device 10 shown in the figure does not constitute a limitation to the electronic device 10, and the electronic device 10 may include more or fewer components than shown in the figure, or combine certain components, or arrange the components differently.

[0052] The RF circuit 501 can be used to send and receive information, or receive and send signals during a call. Specifically, it receives downlink information from the base station and forwards it to one or more processors 508 for processing. It also sends uplink data to the base station. Typically, the RF circuit 501 includes, but is not limited to, an antenna, at least one amplifier, a tuner, one or more oscillators, a Subscriber Identity Module (SIM) card, a transceiver, a coupler, a low-noise amplifier (LNA), a duplexer, and the like. Furthermore, the RF circuit 501 can communicate with the network and other devices via wireless communication. This wireless communication can utilize any communication standard or protocol, including but not limited to Global System for Mobile Communications (GSM), General Packet Radio Service (GPRS), Code Division Multiple Access (CDMA), Wideband Code Division Multiple Access (WCDMA), Long Term Evolution (LTE), email, Short Message Service (SMS), and the like.

[0053] Memory 502 can be used to store applications and data. Applications stored in memory 502 contain executable code. Applications can be organized into various functional modules. Processor 508 executes various functional applications and processes data by running applications stored in memory 502. Memory 502 may primarily include a program storage area and a data storage area. The program storage area may store an operating system and at least one application required for a function (such as sound playback or image playback). The data storage area may store data generated during the use of electronic device 10 (such as audio data and a phone book). Memory 502 may also include high-speed random access memory and non-volatile memory, such as at least one disk storage device, flash memory device, or other volatile solid-state storage device. Accordingly, memory 502 may also include a memory controller to provide access to memory 502 by processor 508 and input unit 503.

[0054] The input unit 503 can be used to receive input digital or character information, or user profile information (such as a fingerprint), as well as generate keyboard, mouse, joystick, optical, or trackball signal input related to user settings and function control. Specifically, in one embodiment, the input unit 503 may include a touch-sensitive surface and other input devices. A touch-sensitive surface, also known as a touch display or touchpad, can detect user touch operations on or near it (e.g., operations performed on or near the touch-sensitive surface using a finger, stylus, or any other suitable object or accessory) and activate corresponding connected devices according to a pre-set program. Optionally, the touch-sensitive surface can include a touch detection device and a touch controller. The touch detection device detects the user's touch position and detects signals generated by the touch operation, transmitting these signals to the touch controller. The touch controller receives the touch information from the touch detection device, converts it into touch point coordinates, and then transmits it to the processor 508. The touch controller can also receive and execute commands from the processor 508.

[0055] The display unit 504 can be used to display information input by the user or information provided to the user, as well as various graphical user interfaces of the electronic device 10, which can be composed of graphics, text, icons, videos, and any combination thereof. The display unit 504 may include a display panel. Optionally, the display panel can be configured in the form of a liquid crystal display (LCD), an organic light-emitting diode (OLED), or the like. Furthermore, the touch-sensitive surface may cover the display panel, and when the touch-sensitive surface detects a touch operation on or near it, it is transmitted to the processor 508 to determine the type of touch event, and then the processor 508 provides corresponding visual output on the display panel according to the type of touch event. Although in Figure 6 In the embodiment, the touch-sensitive surface and the display panel are used as two independent components to realize input and output functions, but in some embodiments, the touch-sensitive surface and the display panel can be integrated to realize input and output functions.

[0056] The electronic device 10 may also include at least one sensor 505, such as a light sensor, a motion sensor, and other sensors. Specifically, the light sensor may include an ambient light sensor and a proximity sensor, wherein the ambient light sensor may adjust the brightness of the display panel according to the brightness of the ambient light, and the proximity sensor may turn off the display panel and / or backlight when the electronic device 10 is moved to the ear. As a type of motion sensor, the gravity acceleration sensor can detect the magnitude of acceleration in all directions (generally three axes), and can detect the magnitude and direction of gravity when stationary. It can be used for applications that recognize the posture of the mobile phone (such as switching between horizontal and vertical screens, related games, magnetometer posture calibration), vibration recognition related functions (such as pedometer, tapping), etc.; as for other sensors that the electronic device 10 can also be configured with, such as gyroscopes, barometers, hygrometers, thermometers, infrared sensors, etc., they will not be described in detail here.

[0057] The audio circuit 506 can provide an audio interface between the user and the electronic device 10 via a speaker and microphone. The audio circuit 506 can convert received audio data into electrical signals, transmit them to the speaker, and then convert them into sound signals for output. The microphone, on the other hand, converts collected sound signals into electrical signals, which are received by the audio circuit 506 and converted into audio data. The audio data is then processed by the processor 508 and then transmitted to, for example, another electronic device 10 via the RF circuit 501. Alternatively, the audio data can be output to the memory 502 for further processing. The audio circuit 506 may also include an earphone jack to provide communication between an external earphone and the electronic device 10.

[0058] Wireless Fidelity (WiFi) is a short-range wireless transmission technology. The electronic device 10 can help users send and receive emails, browse web pages, and access streaming media through the wireless fidelity module 507. It provides users with wireless broadband Internet access. Figure 6 The Wi-Fi module 507 is shown, but it is understandable that it is not an essential component of the electronic device 10 and can be omitted as needed without changing the essence of the invention.

[0059] The processor 508 is the control center of the electronic device 10. It connects the various components of the electronic device 10 using various interfaces and circuits. By running or executing applications stored in the memory 502 and accessing data stored in the memory 502, it performs various functions of the electronic device 10 and processes data, thereby providing overall monitoring of the electronic device 10. Optionally, the processor 508 may include one or more processing cores. Preferably, the processor 508 may integrate an application processor and a modem processor, wherein the application processor primarily processes the operating system, user interface, and application programs, while the modem processor primarily handles wireless communications. It is understood that the modem processor may not be integrated into the processor 508.

[0060] The electronic device 10 also includes a power supply 509 for supplying power to various components. Preferably, the power supply 509 can be logically connected to the processor 508 via a power management system, thereby enabling the power management system to manage charging, discharging, and power consumption. The power supply 509 can also include one or more DC or AC power supplies, a recharging system, a power failure detection circuit, a power converter or inverter, a power status indicator, and other arbitrary components.

[0061] although Figure 6 Not shown, the electronic device 10 may further include a Bluetooth module, etc., which will not be described in detail here. In specific implementation, the above modules can be implemented as independent entities, or can be arbitrarily combined and implemented as the same or several entities. The specific implementation of the above modules can be referred to the previous method embodiment, which will not be described in detail here.

[0062] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0063] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A flashlight module, characterized in that: include: A heat sink comprising a housing, a capillary structure, and a cooling medium, wherein the capillary structure and the cooling medium are disposed within the housing, the housing having an evaporation zone and a condensation zone, the heat sink being configured such that: the cooling medium can absorb heat and evaporate in the evaporation zone, and release heat and condense in the condensation zone; the capillary structure is configured to guide the cooling medium condensed in the condensation zone to the evaporation zone; and The flash lamp assembly is arranged on the housing and corresponds to the evaporation area.

2. The flash module according to claim 1, wherein: The flash assembly includes a flash device and a first circuit board. The first circuit board is a flexible circuit board. The flash device is arranged on the first circuit board and electrically connected to the first circuit board. The first circuit board is arranged on the housing and adheres to the housing.

3. The flash module according to claim 2, wherein: The shell includes a first shell portion and a second shell portion, the first shell portion and the second shell portion are connected and their extension directions intersect, the part of the first circuit board where the flash device is provided is provided on one of the first shell portion and the second shell portion, and the first circuit board extends to the other of the first shell portion and the second shell portion through the junction of the first shell portion and the second shell portion.

4. The flash module according to claim 1, wherein: The orthographic projections of the flash lamp assembly on the heat sink all fall onto the heat sink.

5. The flash module according to claim 1, wherein: The thermal conductivity of the heat sink is greater than 2000 W / mK; The thickness of the shell is greater than or equal to 0.03 mm; The thickness of the heat dissipation plate is greater than or equal to 0.15 mm.

6. An electronic device, characterized in that: The invention comprises a flash module as described in any one of claims 1 to 5.

7. The electronic device according to claim 6, wherein: The electronic device comprises a housing and a carrier arranged in the housing. The flash module is arranged in the housing. The heat dissipation plate is arranged on the carrier at a side facing away from the flash assembly.

8. The electronic device according to claim 7, wherein: The electronic device comprises a mainboard, the carrier is a hard circuit board, and the orthographic projections of the mainboard and the carrier on the housing are offset.

9. The electronic device according to claim 7, wherein: The electronic device includes a second circuit board, which is a flexible circuit board. The carrier is arranged on the second circuit board to abut the second circuit board against the housing.

10. The electronic device according to claim 9, characterized in that The carrier includes a first surface and a second surface that intersect each other. The shell of the heat dissipation plate includes a first shell portion and a second shell portion. The first shell portion and the second shell portion are connected and their extension directions intersect each other. The first shell portion is arranged on the first surface, and the second shell portion is arranged on the second surface.

11. The electronic device according to claim 10, characterized in that The flash assembly includes a flash device and a first circuit board, wherein the first circuit board is a flexible circuit board, the flash device is arranged on the first circuit board and electrically connected to the first circuit board, the portion of the first circuit board where the flash device is arranged is arranged on one of the first surface and the second surface, and the portion of the first circuit board is arranged on the other of the first surface and the second surface.

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