Full-automatic prism laminating equipment for mini LED

Abstract

The invention discloses full-automatic prism laminating equipment for a mini LED. The full-automatic prism laminating equipment comprises a lower rack, a mounting substrate, a material taking and laminating transverse moving module, a mini LED plate limiting barrier strip mechanism, a mini LED plate material taking and laminating counterpoint lifting module, a mini LED plate counterpoint platform module, a mini LED plate adsorption module, a mini LED plate CCD camera positioning module, a prism jig positioning module and a discharging and transplanting module. The positioning device has the advantages that stepless adjustment of the barrier strip is achieved through a sliding pair of the T-shaped rail groove and the sliding block, a 90-degree bending structure and plum blossom rotary knobs are matched for fastening, a square positioning area capable of being rapidly reconstructed is formed, mini LED plates of different sizes are covered, rapid positioning of the full-size mini LED plates can be achieved, the positioning precision is high, the adjusting efficiency is high, and the clamp does not need to be replaced; a high-precision miniature vertical guide rail and a pressure sensor are integrated in the adsorption module, dynamic buffering is provided through a compression spring, and attachment impact and bubbles are eliminated in combination with vacuum negative pressure adsorption and jacking release of a jacking column.

Description

Technical Field

[0001] The present invention relates to the field of miniLED display technology, and specifically to a fully automatic prism bonding device for miniLED. Background Art

[0002] With the rapid development of display technology, MiniLED backlight technology, thanks to its high brightness, high contrast, local dimming capabilities, and more mature mass production process compared to MicroLED, has been widely used in high-end TVs, monitors, laptops, and automotive displays. MiniLED backlight modules typically consist of a light panel composed of thousands of MiniLED chips and a prismatic optical film (or lens film) for light diffusion and guidance. High-precision, high-efficiency, and damage-free fully automated bonding between the light panel and the prismatic optical film is a critical process step in ensuring the optical performance and product yield of the backlight module.

[0003] The current process of bonding MiniLED light panels and prisms faces multiple challenges: First, MiniLED chips are tiny (usually 100 to 300 microns), and the pads are dense and fragile, requiring extremely high positioning accuracy for bonding (generally ≤±10 microns). Any slight offset or impact will cause optical interference or even chip damage. Second, MiniLED backlight modules come in a variety of sizes (from wearable devices of several inches to TVs of tens of inches), and traditional fixed fixtures need to be replaced frequently, significantly reducing equipment utilization and production flexibility. Third, the surface microstructure of the prism optical film is fine and the material is soft. When it is directly bonded to the hard MiniLED light panel, the uneven contact pressure can easily cause bubbles, indentations, or scratches on the optical film, seriously affecting optical uniformity and product yield.

[0004] It also has the following defects:

[0005] Low changeover efficiency: Customized blocks or special tooling are used to adapt to light panels of different sizes. The replacement process is time-consuming and requires manual intervention, which is inconsistent with the flexible production trend of intelligent manufacturing. Summary of the Invention

[0006] (1) Technical problems solved

[0007] In response to the shortcomings of the existing technology, the present invention provides a fully automatic prism bonding equipment for miniLED, which has the advantages of rapid positioning of full-size miniLED boards, high positioning accuracy, high adjustment efficiency, no need to replace fixtures, and elimination of bonding impact and bubbles, thereby solving the problems existing in the existing technology.

[0008] (2) Technical solution

[0009] To achieve the above objectives, the present invention provides the following technical solutions: a fully automatic prism bonding device for miniLEDs, comprising a lower frame, a mounting base plate, a material bonding transverse movement module, a miniLED board limiting block mechanism, a miniLED board material bonding alignment lifting module, a miniLED board alignment platform module, a miniLED board adsorption module, a miniLED board CCD camera positioning module, a prism fixture positioning module, and a material blanking and transplanting module, characterized in that: the lower frame is fixedly arranged on the equipment installation ground, serving as the basic support structure of the entire equipment;

[0010] The mounting base plate is rigidly mounted above the lower frame to form the main working platform of the equipment;

[0011] The material picking and laminating transverse movement module is slidably arranged on the mounting base plate, and is used to carry the relevant modules to move in the horizontal direction;

[0012] The miniLED board limiting bar mechanism is fixedly arranged on the upper surface of the mounting substrate near the left side, and is used to accurately locate and constrain the edge position of the miniLED board to be attached;

[0013] The miniLED board limit bar mechanism includes a base with a recessed track groove formed on the base. At least two sets of sliders are movably connected in the track groove. The top of the slider is fixedly connected to a block bar. The block bar is bent and threaded with a fastener. The bottom end of the fastener abuts the top surface of the miniLED board limit bar mechanism.

[0014] The miniLED board pick-up and lamination alignment lifting module is rigidly fixed on the moving part of the pick-up and lamination transverse movement module and is configured to drive the components thereon to perform precise vertical movement;

[0015] The miniLED board alignment platform module is rigidly fixed to the upper output end of the miniLED board material placement and alignment lifting module, and is used to carry and drive the miniLED board to perform high-precision micro-alignment in the X, Y directions and rotational degrees of freedom;

[0016] The miniLED board adsorption module is rigidly fixedly mounted on the lower working surface of the miniLED board alignment platform module and is configured to generate a controllable adsorption force to pick up, firmly attach and safely release the miniLED board;

[0017] The miniLED board CCD camera positioning module is set in the space below the mounting base plate based on the principle of machine vision. Its optical collection end passes through the mounting base plate upwards to perform high-resolution image acquisition and precise positioning of the miniLED board located under the miniLED board adsorption module;

[0018] The prism fixture positioning module is fixedly arranged on the upper surface of the mounting substrate near the right side, and is used to fix, position and carry the prism to be bonded or the prism pre-assembled fixture;

[0019] The blanking and transplanting module is arranged on the periphery of the right side of the overall structure of the equipment and is equipped with a driving device for grabbing the miniLED board product with completed prism bonding from the prism jig positioning module area and transferring it to the downstream workstation or collection area.

[0020] Preferably, in the miniLED board limiting baffle mechanism, the cross-sectional shape of the track groove is T-shaped, the inner angle of the baffle is ninety degrees, the baffle is movably connected to the surface of the base, the position of the baffle on the surface of the base can be infinitely adjusted, the baffles together enclose a square area, and the fastener is specifically a plum blossom knob with a threaded head.

[0021] Preferably, the miniLED board material lamination and alignment lifting module specifically includes a first module mounting base plate, a high-precision guide rail, a lifting drive motor, a first high-precision grinding screw and a first connecting plate;

[0022] Wherein, the first module mounting base is fixedly arranged vertically on one side of the moving part of the material taking and laminating transverse moving module;

[0023] The high-precision guide rail is rigidly fixed vertically on one side of the first module mounting base plate;

[0024] The lifting drive motor is fixedly mounted on the top of the first module mounting base;

[0025] The first high-precision ground screw is coaxially connected to the lower end of the output shaft of the lifting drive motor through a coupling and is arranged vertically, and its screw nut portion is tightly connected to the first connecting plate;

[0026] The first connecting plate is slidably matched with the high-precision guide rail through a slider. When the lifting drive motor drives the first high-precision grinding screw to rotate, the first connecting plate is driven to perform precise lifting motion along the high-precision guide rail.

[0027] Preferably, the miniLED board alignment platform module specifically includes a second module mounting base plate, a plurality of high-precision micro guide rails, an X-axis adjustment drive motor, a second high-precision grinding screw, a Y-axis adjustment drive motor, a rotating bearing seat and a second connecting plate;

[0028] Wherein, the second module mounting base is rigidly fixed vertically on one side of the first connecting plate;

[0029] A plurality of high-precision micro guide rails are fixedly mounted on the bottom of the second module mounting base plate and arranged along a specific direction;

[0030] The X-axis adjustment drive motor and the Y-axis adjustment drive motor are both fixedly arranged at the bottom of the second module mounting base plate;

[0031] The second high-precision grinding screw is respectively connected to the output ends of the corresponding X-direction adjustment drive motor and the Y-direction adjustment drive motor through a coupling;

[0032] The plurality of rotating bearing seats are respectively slidably engaged with the high-precision micro guide rails through sliders and are fastened to the screw nut portions on the corresponding second high-precision ground screws, so that the X / Y adjustment drive motor can drive the rotating bearing seats to precisely move along the high-precision micro guide rails in their respective corresponding directions;

[0033] The second connecting plate is rotatably connected to one side of the multiple rotating bearing seats through its four corners or specific positions. Specifically, the rotating connection point is located in the corner area of ​​the side of the rotating bearing seat away from its own rotation center. The coordinated movement or differential movement of the multiple rotating bearing seats in the X / Y direction drives the second connecting plate to achieve two-dimensional translation and small rotational movement within the plane.

[0034] Preferably, the miniLED board adsorption module specifically includes two third module mounting base plates, an adsorption cavity, an adsorption cavity plate sealing plate, a high-precision micro vertical guide rail, a pressure sensor, a compression spring, a linear bearing, a negative pressure air inlet, and a vacuum pressure digital display;

[0035] One of the third module mounting base plates is rigidly fixedly mounted on the bottom center area of ​​the second connecting plate;

[0036] The high-precision micro vertical guide rail is arranged between the two third module mounting base plates so that they can slide relative to each other in the vertical direction;

[0037] The two third module mounting bases cooperate with each other to enclose and form the sealed adsorption cavity;

[0038] The adsorption chamber plate cover is fixed to the bottom of the adsorption chamber to form a working adsorption plane;

[0039] The pressure sensor, compression spring and linear bearing are all set between the two third module mounting bases and arranged around the high-precision micro vertical guide rail. The pressure sensor is used to detect the fitting pressure, the compression spring provides buffering and reset force, and the linear bearing assists in guiding.

[0040] The negative pressure air inlet is opened through the surface of the third module mounting base plate and is used to connect to an external vacuum generating device to provide controllable negative pressure into the adsorption chamber;

[0041] The vacuum pressure digital display meter is fixedly mounted on one side of one of the third module mounting base plates, and its detection end is connected to the adsorption cavity for real-time monitoring and display of the vacuum pressure value in the cavity.

[0042] The basic working steps of this device are: after positioning with a high-precision CCD camera, the position is corrected and then fitted through a high-precision alignment platform. The use includes the following steps:

[0043] Step 1: First, manually or robotically place the miniLED board to be bonded on the miniLED board limit bar mechanism, and let the miniLED board material picking, bonding and positioning lifting module descend to absorb the miniLED board to be bonded.

[0044] Step 2: Move the material picking and pasting transverse movement module to the top of the miniLED board CCD camera positioning module for positioning.

[0045] Step 3: After the positioning is completed, the position of the miniLED board is corrected by the miniLED board alignment platform module, and at the same time, the material picking and pasting transverse movement module is moved to the top of the prism fixture positioning module to complete the pasting.

[0046] Step 4: Finally, the laminating miniLED board is transported by the material laminating transverse movement module and placed on the platform above the material unloading and transplanting module.

[0047] The core design of this device is: adaptive limit bar mechanism: the sliding pair of the T-shaped track groove and the slider realizes infinite adjustment of the bar, combined with the 90° bending structure and plum blossom knob fastening to form a square positioning area that can be quickly reconstructed to cover miniLED boards of different sizes.

[0048] Double-layer buffer adsorption system: Integrating high-precision micro vertical guide rails and pressure sensors in the adsorption module, providing dynamic buffering through compression springs, combining vacuum negative pressure adsorption with top column lifting and release to eliminate fitting impact and bubbles.

[0049] Preferably, in the adsorption cavity, several small anti-static non-constant suction nozzles and / or large anti-static non-constant suction nozzles for contacting and adsorbing the miniLED board are provided on the bottom surface of the adsorption cavity plate sealing plate; at the same time, inside the adsorption cavity and above the adsorption cavity plate sealing plate, several miniLED board top columns are rigidly fixedly installed, and the lower end of the miniLED board top column can be pushed down through the corresponding hole position on the adsorption cavity plate sealing plate when the negative pressure is released, so as to assist in lifting and releasing the adsorbed miniLED board.

[0050] The system components of this device include: basic frame: the lower frame is fixed to the ground, and the installation base plate is rigidly connected to the top of the lower frame to form the main working platform.

[0051] Feeder positioning area: The miniLED board stop bar mechanism is installed on the left side of the mounting base. As shown in the figure, the base is machined with a T-shaped track groove, into which two sets of sliders slide. The stop bar is a bent metal strip that is locked to the base surface with a torx knob. Adjusting the position of the stop bar creates a square positioning area with a side length of -mm.

[0052] Retrieving and conveying system: The retrieving and laminating transverse module (driven by a linear motor) is slidably mounted on the mounting base, carrying the lifting module. The lifting module drives the first connecting plate to move vertically along the high-precision guide rail via the first high-precision ground screw.

[0053] Precision alignment system:

[0054] The alignment platform module is fixed to the top of the lifting module. The bottom of the second module's mounting base is equipped with two sets of high-precision micro-guide rails. The X- and Y-axis adjustment drive motors drive the rotating bearing block through a second high-precision ground screw. The four corners of the second connecting plate are eccentrically hinged to the bearing block, achieving micro-motion in three degrees of freedom (X, Y, and θ) (±2mm displacement, ±0.5° rotation).

[0055] Adsorption module: installed below the alignment platform module, including: the upper third module mounting base is fixed to the second connecting plate; the lower third module mounting base is connected to the upper part through a high-precision micro vertical guide rail; the double bottom plates enclose the adsorption cavity, and the bottom seals the adsorption cavity plate; the negative pressure air inlet is connected to the vacuum pump, and the vacuum pressure digital display monitors the cavity pressure; the suction nozzle is embedded in the bottom surface of the sealing plate, and the top column is located in the upper part of the cavity; the pressure sensor, compression spring and linear bearing are distributed between the double plates to provide 10-50N buffering force.

[0056] Vision Positioning System: The miniLED board CCD camera positioning module is installed below the mounting base. The CCD camera and light source are fixed to a Y-axis slide. This slide is driven by a third high-precision ground lead screw along a high-precision guide rail, enabling bidirectional X / Y adjustment within ±mm. The optical axis is aligned with a pre-set through-hole on the mounting base.

[0057] Lamination and unloading area: The prism fixture positioning module is located on the right side of the mounting base, and the unloading and transferring module is located at the right end of the equipment, equipped with pneumatic grippers to transfer the finished products.

[0058] Preferably, the miniLED board CCD camera positioning module specifically includes a fourth module mounting base plate, a CCD camera, an X-axis adjustment drive motor, a CCD light source, a third high-precision grinding screw, a Y-axis adjustment drive motor and a high-precision guide rail;

[0059] The fourth module mounting base plate is fixedly installed in the space below the mounting base plate;

[0060] The high-precision guide rail is fixedly arranged on the fourth module mounting base plate and extends along the X direction;

[0061] The X-axis adjustment drive motor is fixedly mounted on one end of the fourth module mounting base;

[0062] The third high-precision grinding screw is connected to the output end of the X-direction adjustment drive motor through a coupling and is arranged along the X direction;

[0063] At least one sliding seat is slidably matched with the high-precision guide rail through a slider, and is threadedly connected to the third high-precision ground screw through a screw nut to form an X-axis adjustment slide;

[0064] Another high-precision guide rail is fixedly arranged on the sliding seat of the X-direction adjustment slide and extends along the Y direction;

[0065] The Y-axis adjustment drive motor is fixedly mounted on the sliding seat of the X-axis adjustment slide;

[0066] Another third high-precision grinding screw is connected to the output end of the Y-direction adjustment drive motor through a coupling and is arranged along the Y direction;

[0067] The other sliding seat is slidably matched with the high-precision guide rail in the Y direction through the slider, and is threadedly connected with the third high-precision ground screw in the Y direction through the screw nut to form a Y-direction adjustment slide;

[0068] The CCD camera and CCD light source are rigidly fixed on the sliding seat of the Y-axis adjustment slide. The X-axis adjustment drive motor and the Y-axis adjustment drive motor cooperate to drive the CCD camera and the CCD light source to perform high-precision closed-loop position adjustment in a two-dimensional plane, so that the optical axis of the CCD camera is aligned with and passes through the preset through-hole area on the mounting substrate to perform image acquisition and positioning of the target above.

[0069] The lower frame is made of high-strength square tube welding and gantry milling to ensure that the strength and structure are stable and the precision meets the requirements. The installation base plate is made of high-strength alloy material, which can be steel, aluminum alloy, iron and some other alloy materials. It is not specified here. It serves as the base for the installation of the entire equipment module to further improve the stability of the equipment. The material picking and laminating transverse movement module is driven by a high-precision and fast motor module, which can be a servo motor, stepper motor, linear motor and some other AC motors. It is not specified here. The miniLED board limit bar mechanism is fully compatible with various sizes of miniLED boards. The bar material can be PEEK, POM, Bakelite, glass Fiber, aluminum alloy, steel and some other metal alloy materials, the material is not specified here, the miniLED board material picking and pasting positioning lifting module transmission mode can be screw drive, belt drive, linear motor drive, the material is not specified here, the drive mode is motor drive, which can be servo motor, stepper motor, linear motor and some other AC motors, which is not specified here, the lifting guide adopts high-precision heavy preload guide rail for guidance, the miniLED board alignment platform module adopts N (N≥1) motor drives to correct the X, Y and rotation angle positions, and the position correction accuracy can reach ±1um, which can be servo motor, stepper motor, voice coil motor , brushless motors and some other AC motors, are not uniquely specified here. The miniLED board adsorption module adopts an upper and lower adsorption plate with a buffered adsorption cavity and an adsorption design. The adsorption cavity uses N (N≥1) anti-static traceless nozzles, which are compatible with various sizes of miniLED board adsorption. A top column is installed in the adsorption cavity to ensure that it can be fully fitted during the bonding process without bubbles. The negative pressure adsorption is equipped with a vacuum pressure gauge. The negative pressure value is fed back at all times during the adsorption of the miniLED board to prevent the adsorption force from being too large and causing damage to the miniLED board. If the adsorption force is too small, the miniLED board will move and affect the bonding accuracy. A compression spring and a pressure sensor are provided between the two plates. , ensuring that the miniLED board will not be crushed during the downward pressure and adsorption process, the sensor provides the current pressure value in real time and instant feedback, and the upper and lower buffers use high-precision micro vertical guide rails as guides to ensure that the position accuracy of the miniLED board remains unchanged during the upper and lower buffering processes. The miniLED board CCD camera positioning module uses N (N≥1) to simultaneously position a miniLED board. When using multi-camera positioning, each camera can automatically adjust the XY direction, and can be quickly changed for miniLED boards of different sizes. The prism fixture positioning module is a purchased module and will not be described in detail in this part. The unloading and transplanting module transports the product to the unloading position through the motion module.

[0070] (3) Beneficial effects

[0071] Compared with the prior art, the present invention provides a fully automatic prism bonding device for miniLED, which has the following beneficial effects:

[0072] This fully automatic prism bonding equipment for miniLEDs is designed with an adaptive limit bar mechanism: the sliding pair of the T-shaped track groove and the slider enables infinite adjustment of the bar. Combined with the 90° bending structure and the plum blossom knob fastening, a square positioning area that can be quickly reconfigured is formed to cover miniLED boards of different sizes. This allows for rapid positioning of miniLED boards of all sizes with high positioning accuracy and adjustment efficiency, without the need to replace the fixture.

[0073] This equipment has a double-layer buffer adsorption system: high-precision micro vertical guide rails and pressure sensors are integrated in the adsorption module, dynamic buffering is provided by compression springs, and vacuum negative pressure adsorption and top column lifting and release are combined to eliminate fitting impact and bubbles. BRIEF DESCRIPTION OF THE DRAWINGS

[0074] Figure 1 This is a schematic diagram of the structure of a fully automatic prism bonding device for miniLEDs proposed by the present invention;

[0075] Figure 2 This is a schematic diagram of the structure of the miniLED board material collection, lamination, alignment and lifting module in the present invention;

[0076] Figure 3 This is a schematic structural diagram of the miniLED board alignment platform module in the present invention;

[0077] Figure 4 This is a schematic structural diagram of the miniLED board adsorption module of the present invention;

[0078] Figure 5 This is a schematic diagram of the structure of the nozzle of the miniLED board adsorption module in the present invention;

[0079] Figure 6 This is a structural diagram of the miniLED board CCD camera positioning module in the present invention;

[0080] Figure 7 This is a schematic diagram of the structure of the miniLED board limiting block mechanism in the present invention.

[0081] In the figure: 1-lower frame, 2-mounting base plate, 3-material picking and pasting transverse movement module, 4-miniLED board limiting block bar mechanism, 41-track groove, 42-slider, 43-block bar, 44-fastener, 45-base, 5-miniLED board picking and pasting alignment lifting module, 51-first module mounting base, 52-first high-precision grinding screw, 53-high-precision guide rail, 54-first connecting plate, 55-lifting drive motor, 6-miniLED board alignment platform module, 61-second module mounting base, 62-high-precision micro guide rail, 63-X-axis adjustment drive motor, 64-second high-precision grinding screw, 65-Y-axis adjustment drive motor, 66-rotating bearing seat, 67-second connecting plate, 7-miniLED Plate adsorption module, 71-third module mounting base plate, 72-adsorption chamber, 73-adsorption chamber plate sealing plate, 74-high-precision micro vertical guide rail, 75-pressure sensor, 76-compression spring, 77-linear bearing, 78-negative pressure air inlet, 79-vacuum pressure digital display, 731-small anti-static non-constant suction nozzle, 732-large anti-static non-constant suction nozzle, 733-miniLED board top column, 8-miniLED board CCD camera positioning module, 81-fourth module mounting base plate, 82-CCD camera, 83-X-axis adjustment drive motor, 84-CCD light source, 85-third high-precision grinding screw, 86-Y-axis adjustment drive motor, 87-high-precision guide rail, 9-prism fixture positioning module, 10-unloading and transplanting module. DETAILED DESCRIPTION

[0082] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0083] See also Figure 1-7 A fully automatic prism bonding device for miniLED includes a lower frame 1, a mounting substrate 2, a material bonding transverse movement module 3, a miniLED board limiting block mechanism 4, a miniLED board material bonding alignment lifting module 5, a miniLED board alignment platform module 6, a miniLED board adsorption module 7, a miniLED board CCD camera positioning module 8, a prism fixture positioning module 9, and a material blanking and transplanting module 10. The device is characterized in that the lower frame 1 is fixedly arranged on the equipment installation ground as the basic support structure of the entire equipment;

[0084] The mounting base plate 2 is rigidly mounted above the lower frame 1, forming the main working platform of the equipment;

[0085] The material picking and laminating transverse movement module 3 is slidably arranged on the mounting base plate 2, and is used to carry the relevant modules to move in the horizontal direction;

[0086] The miniLED board limiting bar mechanism 4 is fixedly arranged on the upper surface of the mounting substrate 2 near the left side, and is used to accurately locate and constrain the edge position of the miniLED board to be attached;

[0087] The miniLED board limit bar mechanism 4 includes a base 45 with a recessed track groove 41 formed therein. At least two sets of sliders 42 are movably connected to the track groove 41. The tops of the sliders 42 are fixedly connected to a block bar 43. The block bar 43 is bent and threaded with a fastener 44. The bottom end of the fastener 44 abuts against the top surface of the miniLED board limit bar mechanism 4.

[0088] The miniLED board pick-up and lamination alignment lifting module 5 is rigidly fixed on the moving part of the pick-up and lamination transverse movement module 3 and is configured to drive the components thereon to perform precise vertical movement;

[0089] The miniLED board alignment platform module 6 is rigidly fixed to the upper output end of the miniLED board material placement and alignment lifting module 5, and is used to carry and drive the miniLED board to perform high-precision micro-alignment in the X, Y directions and rotational degrees of freedom;

[0090] The miniLED board adsorption module 7 is rigidly fixed on the lower working surface of the miniLED board alignment platform module 6 and is configured to generate a controllable adsorption force to pick up, firmly attach and safely release the miniLED board;

[0091] The miniLED board CCD camera positioning module 8 is set in the space below the mounting substrate 2 based on the principle of machine vision. Its optical collection end passes upward through the mounting substrate 2 and is used to perform high-resolution image acquisition and precise positioning of the miniLED board located under the miniLED board adsorption module 7;

[0092] The prism fixture positioning module 9 is fixedly arranged on the upper surface of the mounting substrate 2 near the right side, and is used to fix, position and carry the prism to be bonded or the prism pre-assembled fixture;

[0093] The blanking and transplanting module 10 is arranged on the periphery of the right side of the overall structure of the equipment and is equipped with a driving device for grabbing the miniLED board product with completed prism bonding from the prism fixture positioning module 9 area and transferring it to the downstream station or collection area.

[0094] When in use, in the miniLED board limiting baffle mechanism 4, the cross-sectional shape of the track groove 41 is T-shaped, the inner angle of the baffle 43 is ninety degrees, the baffle 43 is movably connected to the surface of the base 45, and the position of the baffle 43 on the surface of the base 45 can be infinitely adjusted. The baffles 43 together enclose a square area, and the fastener 44 is specifically a plum blossom knob with a threaded head.

[0095] The miniLED board material lamination and alignment lifting module 5 specifically includes a first module mounting base 51, a high-precision guide rail 53, a lifting drive motor 55, a first high-precision grinding screw 52 and a first connecting plate 54;

[0096] The first module mounting base plate 51 is vertically fixed on one side of the moving component of the material taking and laminating transverse moving module 3;

[0097] The high-precision guide rail 53 is rigidly fixed vertically on one side of the first module mounting base plate 51;

[0098] The lifting drive motor 55 is fixedly mounted on the top of the first module mounting base 51;

[0099] The first high-precision ground screw 52 is coaxially connected to the lower end of the output shaft of the lifting drive motor 55 through a coupling and is arranged vertically, and its screw nut portion is tightly connected to the first connecting plate 54;

[0100] The first connecting plate 54 is slidably engaged with the high-precision guide rail 53 via a slider. When the lifting drive motor 55 drives the first high-precision grinding screw 52 to rotate, the first connecting plate 54 is driven to perform precise lifting motion along the high-precision guide rail 53 .

[0101] The miniLED board alignment platform module 6 specifically includes a second module mounting base 61, a plurality of high-precision micro guide rails 62, an X-axis adjustment drive motor 63, a second high-precision grinding screw 64, a Y-axis adjustment drive motor 65, a rotating bearing seat 66, and a second connecting plate 67;

[0102] The second module mounting base plate 61 is vertically and rigidly fixed on one side of the first connecting plate 54;

[0103] A plurality of high-precision micro guide rails 62 are fixedly mounted on the bottom of the second module mounting base plate 61 and arranged along a specific direction;

[0104] The X-axis adjustment drive motor 63 and the Y-axis adjustment drive motor 65 are both fixedly mounted on the bottom of the second module mounting base 61;

[0105] The second high-precision grinding screw 64 is connected to the output ends of the corresponding X-direction adjustment drive motor 63 and the Y-direction adjustment drive motor 65 through couplings;

[0106] Multiple rotating bearing blocks 66 are respectively slidably engaged with the high-precision micro guide rails 62 via sliders and are fastened to the screw nut portions of the corresponding second high-precision ground screws 64, so that the X / Y adjustment drive motors 63, 65 can drive the rotating bearing blocks 66 to precisely move along the high-precision micro guide rails 62 in their respective corresponding directions;

[0107] The second connecting plate 67 is rotatably connected to one side of multiple rotating bearing seats 66 through its four corners or specific positions. Specifically, the rotating connection point is located in the corner area of ​​the side of the rotating bearing seat 66 away from its own rotation center. The coordinated movement or differential movement of the multiple rotating bearing seats 66 in the X / Y direction drives the second connecting plate 67 to achieve two-dimensional translation and small rotational movement within the plane.

[0108] The miniLED board adsorption module 7 specifically includes two third module mounting base plates 71, an adsorption cavity 72, an adsorption cavity plate sealing plate 73, a high-precision miniature vertical guide rail 74, a pressure sensor 75, a compression spring 76, a linear bearing 77, a negative pressure air inlet 78, and a vacuum pressure digital display 79;

[0109] One of the third module mounting base plates 71 is rigidly fixed to the bottom center area of ​​the second connecting plate 67;

[0110] A high-precision micro vertical guide rail 74 is provided between the two third module mounting base plates 71 so that they can slide relative to each other in the vertical direction;

[0111] The two third module mounting base plates 71 cooperate with each other to enclose and form a sealed adsorption cavity 72;

[0112] The adsorption chamber plate sealing plate 73 covers and is fixed to the bottom of the adsorption chamber 72 to form a working adsorption plane;

[0113] The pressure sensor 75, compression spring 76 and linear bearing 77 are all set between the two third module mounting base plates 71 and arranged around the high-precision micro vertical guide rail 74. The pressure sensor 75 is used to detect the fitting pressure, the compression spring 76 provides buffering and reset force, and the linear bearing 77 assists in guiding;

[0114] A negative pressure air inlet 78 is provided through the surface of the third module mounting base plate 71 and is used to connect to an external vacuum generating device to provide a controllable negative pressure into the adsorption chamber 72;

[0115] The vacuum pressure digital display 79 is fixedly mounted on one side of one of the third module mounting base plates 71 , and its detection end is connected to the adsorption cavity 72 for real-time monitoring and display of the vacuum pressure value in the cavity.

[0116] In the adsorption cavity 72, a number of small anti-static non-constant suction nozzles 731 and / or large anti-static non-constant suction nozzles 732 for contacting and adsorbing the miniLED board are provided on the bottom surface of the adsorption cavity plate sealing plate 73; at the same time, a number of miniLED board top columns 733 are rigidly fixed inside the adsorption cavity 72 and above the adsorption cavity plate sealing plate 73. The lower end of the miniLED board top column 733 can be pushed down through the corresponding hole on the adsorption cavity plate sealing plate 73 when the negative pressure is released, so as to assist in lifting and releasing the adsorbed miniLED board.

[0117] The miniLED board CCD camera positioning module 8 specifically includes a fourth module mounting base 81, a CCD camera 82, an X-axis adjustment drive motor 83, a CCD light source 84, a third high-precision grinding screw 85, a Y-axis adjustment drive motor 86, and a high-precision guide rail 87;

[0118] The fourth module mounting base plate 81 is fixedly installed in the space below the mounting base plate 2;

[0119] The high-precision guide rail 87 is fixedly mounted on the fourth module mounting base 81 and extends along the X direction;

[0120] The X-axis adjustment drive motor 83 is fixedly mounted on one end of the fourth module mounting base 81;

[0121] The third high-precision grinding screw 85 is connected to the output end of the X-direction adjustment drive motor 83 through a coupling and is arranged along the X direction;

[0122] At least one sliding seat is slidably matched with the high-precision guide rail 87 through a slider, and is threadedly connected to the third high-precision ground screw 85 through a screw nut to form an X-axis adjustment slide;

[0123] Another high-precision guide rail 87 is fixedly arranged on the sliding seat of the X-direction adjustment slide and extends along the Y direction;

[0124] The Y-axis adjustment drive motor 86 is fixedly mounted on the sliding seat of the X-axis adjustment slide;

[0125] Another third high-precision grinding screw 85 is connected to the output end of the Y-direction adjustment drive motor 86 through a coupling and is arranged along the Y direction;

[0126] The other sliding seat is slidably matched with the high-precision guide rail 87 in the Y direction through the slider, and is threadedly connected to the third high-precision ground screw 85 in the Y direction through the screw nut, forming a Y-direction adjustment slide;

[0127] The CCD camera 82 and the CCD light source 84 are rigidly fixed on the sliding seat of the Y-axis adjustment slide. The X-axis adjustment drive motor 83 and the Y-axis adjustment drive motor 86 cooperate to drive the CCD camera 82 and the CCD light source 84 to perform high-precision closed-loop position adjustment in a two-dimensional plane, so that the optical axis of the CCD camera 82 is aligned with and passes through the preset through-hole area on the mounting substrate 2 to perform image capture and positioning of the target above.

[0128] Example 1: The lower frame 1 is made of high-strength square tube welding and gantry milling to ensure that the strength and structural stability and precision meet the requirements. The mounting base plate 2 is made of high-strength alloy material, which can be steel, aluminum alloy, iron and some other alloy materials. It is not specified here. It serves as the base for the installation of the entire equipment module to further improve the stability of the equipment. The material picking and laminating transverse movement module 3 is driven by a high-precision and fast motor module, which can be a servo motor, stepper motor, linear motor and some other AC motors. It is not specified here. The miniLED board limit bar mechanism 4 is fully compatible with various sizes of miniLED boards. The bar material can be PEEK, POM, Bakelite, fiberglass, aluminum alloy, steel and some other metal alloy materials, the material is not uniquely specified here, the miniLED board material picking and pasting positioning lifting module 5 transmission mode can be screw drive, belt drive, linear motor drive, the material is not uniquely specified here, the drive mode is motor drive, which can be servo motor, stepper motor, linear motor and some other AC motors, which is not uniquely specified here, the lifting guide adopts high-precision heavy preload guide rail for guidance, the miniLED board alignment platform module 6 adopts N (N≥1) motor drives to correct the X, Y and rotation angle positions, and the position correction accuracy can reach ±1um, which can be servo motor, stepper motor, voice coil motor Machine, brushless motor and some other AC motors, not the only one specified here, the miniLED board adsorption module 7 adopts the upper and lower adsorption plates with buffer type and adsorption cavity adsorption design, the adsorption cavity uses N (N ≥ 1) anti-static traceless nozzles, which are compatible with various sizes of miniLED board adsorption, and the adsorption cavity is installed with a top column to ensure that it can be fully fitted during the bonding process without bubbles. The negative pressure adsorption is equipped with a vacuum pressure gauge, and the negative pressure value is fed back at all times during the adsorption of the miniLED board to prevent the adsorption force from being too large and causing damage to the miniLED board. If the adsorption force is too small, the miniLED board will move and affect the bonding accuracy. A compression spring 76 and a pressure sensor 7 are provided between the two plates. 5. Ensure that the miniLED board will not be crushed during the downward pressure and adsorption process. The sensor provides the current pressure value in real time and instant feedback. The upper and lower buffers use high-precision micro vertical guide rails as guides to ensure that the position accuracy of the miniLED board remains unchanged during the upper and lower buffering processes. The miniLED board CCD camera positioning module 8 uses N (N≥1) cameras to simultaneously position a miniLED board. When using multi-camera positioning, each camera can automatically adjust the XY direction. It can be quickly changed for miniLED boards of different sizes. The prism fixture positioning module 9 is a purchased module and will not be described in detail here. The unloading and transplanting module 10 transports the product to the unloading position through the motion module.

[0129] Example 2: Overall Equipment Layout and Infrastructure: The equipment is securely placed on the cleanroom floor, with core components mounted on lower frame 1. Lower frame 1 is constructed from highly rigid welded steel with a rust- and anti-static treatment. Mounting base 2, a 40mm-thick, precision-ground granite platform, is rigidly secured to the top of lower frame 1 with high-strength bolts, providing a base mounting surface and vibration isolation platform for subsequent functional modules.

[0130] Left area - feeding positioning: The miniLED board limiting bar mechanism 4 is fixedly installed on the upper surface of the mounting substrate 2 near the left side.

[0131] Middle Section - Transport and Positioning: The pick-and-place transverse module 3 is positioned along the length (typically the X-axis) of the mounting base 2. This module utilizes a high-precision linear motor drive system with a grating scale for closed-loop feedback, achieving a repeatability of ±1 micron. It houses key moving components.

[0132] Lower part - visual positioning: In the space below the mounting base 2, the miniLED board CCD camera positioning module 8 is fixedly installed. Its lens assembly and light source extend upward, and the optical axis is precisely aligned with the two pre-opened light holes on the mounting base 2.

[0133] Right Area - Lamination and Unloading: A prism fixture positioning module 9 is fixedly installed on the right side of the upper surface of the mounting base 2. A separate unloading and transfer module 10 is installed on the right side of the overall equipment structure, with its starting end aligned with the material removal position of the prism fixture positioning module 9.

[0134] MiniLED board limit bar mechanism 4:

[0135] This mechanism is the starting point of the entire equipment material flow. Its core is a rectangular base 45, and a T-shaped track groove 41 is precisely milled on the top surface of the base 45. The length of the groove is parallel to the reference edge to be fitted later. Two sets of sliders 42 are embedded in the T-shaped track groove 41 and can slide linearly along the groove. A baffle 43 of a specific height is fixed vertically on the top of each set of sliders 42. The baffle 43 is a high-hardness stainless steel bar with an L-shaped cross-section (i.e., a 90° bend), and its vertical part is used to limit the edge of the miniLED board. At the horizontally bent end of each baffle 43, a threaded hole is opened, and a fastener 44 is installed. The fastener 44 adopts a plum blossom knob with a winged handle, which is convenient for quick and easy operation with bare hands. The bottom of the knob is pressed tightly against the top surface of the base 45. By loosening the plum blossom knob 44, the two stop bars 43 can be independently and infinitely adjusted along the track groove 41 on the base 45, changing the distance between them (for example, continuously adjustable within a range of 50mm to 300mm), thereby enclosing a square (or rectangular) positioning area to accommodate miniLED bare wafers of different sizes (e.g., 2 inches to 12 inches). After adjustment, tighten the knob 44 to securely lock the position.

[0136] MiniLED board material collection and lamination alignment lifting module 5:

[0137] This module is the core of achieving vertical movement. Its first module mounting base 51 is fixedly connected to the side of the movable slide of the material-feeding transverse module 3 through a rigid flange. On the mounting surface of the first module mounting base 51, two parallel high-precision guide rails 53 (for example, H-grade linear guide rails) are vertically installed. The lifting drive motor 55 uses a high-resolution servo motor and is firmly installed on the top of the first module mounting base 51. The output shaft of the motor is directly connected to the upper end of the first high-precision ground screw 52 (for example, a C5-grade ball screw) through a high-rigidity zero-backlash coupling. The screw 52 extends vertically downward. The first connecting plate 54 slides with the high-precision guide rail 53 through the slider on its back, and at the same time engages with the first high-precision ground screw 52 through the screw nut inside it. When the lifting drive motor 55 is running, the screw 52 rotates, driving the first connecting plate 54 to perform precise lifting and lowering motion along the high-precision guide rail 53 (stroke, for example, 50-100mm), driving the entire alignment platform and adsorption module thereon to move up and down, and the speed can be precisely controlled.

[0138] MiniLED board alignment platform module 6:

[0139] This is the key mechanism for achieving micron-level position correction. The second module mounting base plate 61 is rigidly fixed to the side of the first connecting plate 54 of the lifting module 5 by bolts. On the lower plane (working surface) of the second module mounting base plate 61, two high-precision micro guide rails 62 arranged along the X direction and two high-precision micro guide rails 62 arranged along the Y direction (such as micro linear slides) are arranged. The X-direction adjustment drive motor 63 (small precision servo motor) and the Y-direction adjustment drive motor 65 (another small precision servo motor) are respectively fixedly mounted at corresponding positions at the bottom of the second module mounting base plate 61. Through their respective couplings, each motor (63, 65) drives a second high-precision ground screw 64 (micro ball screw). The screw nut of each screw 64 is fixedly connected to the bottom of a rotating bearing seat 66. The bottom surface of each rotating bearing seat 66 is slidably matched with the high-precision micro guide rail 62 in the corresponding direction through a slider. Therefore, by controlling the X-direction adjustment drive motor 63 or the Y-direction adjustment drive motor 65, the respective rotating bearing seats 66 can be driven to perform micro-movements in the X or Y direction along their guide rails (for example, a stroke of ±2mm). A set of precision ball joint structures are provided on the upper ends of the sides of the four rotating bearing seats 66 (one at each corner). The four corners of the second connecting plate 67 (usually a rigid flat plate) are rotatably connected to the hinge points on the sides of the corresponding rotating bearing seats 66 through ball joints. The key is that these rotating connection points are all set at positions close to the outer edges of the rotating bearing seats 66, away from the rotation axis of the center. By controlling the coordinated or differentiated small displacements of the four rotating bearing seats 66 in the X and Y directions, the second connecting plate 67 can be driven to perform precise X and Y direction translations and small angle (for example, ±0.5°) rotations (Theta degrees of freedom) around the Z axis (perpendicular to the axis of the platform) within its plane, thereby achieving submicron motion accuracy for position correction.

[0140] miniLED board adsorption module 7:

[0141] This module is responsible for safely and non-destructively placing and removing miniLED boards and providing a bonding buffer. The module includes two main third-module mounting base plates 71 (upper and lower). The upper third-module mounting base plate 71 is rigidly fixed to the bottom center of the second connecting plate 67 of the alignment platform module 6 by bolts. The lower third-module mounting base plate 71 is connected to the upper plate by three sets (at least) of high-precision micro-vertical guide rails 74 (such as precision micro-shaft bushings), ensuring that the lower plate can slide up and down in the vertical direction with minimal, low friction. The upper and lower third-module mounting base plates 71 together enclose an internal cavity, forming a sealed adsorption chamber 72. The bottom of the adsorption chamber 72 (i.e., the bottom surface of the lower third-module mounting base plate 71) is installed with an adsorption chamber plate sealing plate 73. This is a plate with a precisely flat surface (usually polished) and a specific opening structure, which serves as the adsorption working surface and the execution surface for the final bonding. Between the upper and lower third module mounting base plates 71, the core buffer components are arranged around a high-precision micro vertical guide rail 74: a number of pressure sensors 75 (such as patch force sensors) are used to monitor the downward contact force of the adsorption module in real time; a number of evenly distributed compression springs 76 provide a preset reverse buffer force; and a linear bearing 77 assists in maintaining precise vertical guidance and sharing lateral forces. A negative pressure air inlet 78 is opened on the side wall of the lower third module mounting base plate 71 and is connected to an external vacuum generator via an air pipe. A vacuum pressure digital display 79 is also installed on the lower third module mounting base plate 71. Its sensor extends into the adsorption cavity 72 to display and monitor the vacuum level in the cavity in real time.

[0142] Inside the adsorption chamber 72, an array of suction nozzles is mounted on the bottom surface of the adsorption chamber plate seal 73 (i.e., the side that contacts the miniLED board). Small, anti-static, non-permanent nozzles 731 are used for adsorption in areas with dense circuitry or prone to warping, while larger, anti-static, non-permanent nozzles 732 are used for areas requiring greater suction force. Multiple (e.g., four) miniLED board support posts 733 are also fixedly mounted within the adsorption chamber 72, above the adsorption chamber plate seal 73. The upper ends of these posts 733 are fixed to the bottom of the third module mounting base 71 above. Their lower ends are smooth cylinders that extend below corresponding through-holes in the adsorption chamber plate seal 73. To release the bonded miniLED board, the vacuum pressure is turned off, and a slight external force (such as a spring or active lifting mechanism) is applied to slightly raise the adsorption chamber plate seal 73. The lower ends of the posts 733 then protrude from the through-holes, pushing the miniLED board upward and assisting in its separation from the nozzles, achieving damage-free demolding. The buffer system composed of the pressure sensor 75 and the compression spring 76 ensures that the pressure applied to the miniLED board and the prism film during the bonding process is controllable and gentle (usually settable within the range of 10-50N), avoiding crushing the chip or generating bubbles.

[0143] MiniLED board CCD camera positioning module 8:

[0144] This module provides precise optical positioning. Its fourth module mounting base plate 81 is securely mounted on the equipment chassis below the mounting base plate 2. Two parallel high-precision guide rails 87 (precision linear guides) are fixedly mounted on the fourth module mounting base plate 81, with the direction defined as the X-axis. An X-axis adjustment drive motor 83 (high-precision servo motor) is mounted at one end of the base plate 81 and drives a horizontal third high-precision ground screw 85 (precision ball screw) via a coupling, arranged along the X-axis. A sliding seat (X-axis slide) slides with the X-axis high-precision guide rail 87 through a slider at its bottom and engages with the X-axis third high-precision ground screw 85 through a nut inside. Driven by the X-axis adjustment drive motor 83, the entire slide can be precisely translated and positioned along the X-axis (e.g., ±20mm travel). Two parallel high-precision guide rails 87, perpendicular to the X-axis (i.e., the Y-axis), are fixedly mounted on the top platform of this X-axis slide. A Y-axis adjustment drive motor 86 (a high-precision servo motor of the same type) is also mounted on one end of the X-axis slide platform. Motor 86 drives a second, horizontal, third-degree high-precision ground screw 85 arranged along the Y-axis via a coupling. Another sliding seat (Y-axis slide) slides with these Y-axis high-precision guide rails 87 via a slider and engages with the third-degree high-precision ground screw 85 via its internal nut, enabling precise translation in the Y-axis. A CCD camera 82 (a high-resolution industrial camera with a lens of appropriate focal length) and a CCD light source 84 (such as a coaxial or annular LED cold light source) are ultimately rigidly fixed to the top of the Y-axis slide. Through the coordinated control of the X-axis adjustment drive motor 83 and the Y-axis adjustment drive motor 86, in conjunction with their respective third high-precision grinding screw 85 and high-precision guide rail 87 to form a precise positioning system, the CCD camera 82 and the light source 84 can be driven in a high-precision closed-loop manner to move in a two-dimensional plane, so that their optical axis is always precisely aligned with the light hole on the mounting substrate 2, thereby performing high-resolution image acquisition, feature point recognition and position calculation on the miniLED board located above it and grasped by the adsorption module 7, and the error is usually at the sub-pixel level.

[0145] Accessibility module implementation:

[0146] Prism fixture positioning module 9: Installed on a precision platform to the right of mounting base plate 2, this module features precise positioning pins and a vacuum suction surface. It is used to quickly and accurately secure specialized fixtures containing prismatic optical films or other optical structures (such as pre-installed diffusers and reflectors), ensuring a stable position for the object being bonded.

[0147] Unloading and Transferring Module 10: Located on the right side of the machine, it can utilize a linear module coupled with a small, high-precision robotic arm (such as a SCARA robot) or a belt / chain coupled with a pick-and-place mechanism. Its function is to remove finished miniLED modules (with prism film composites) from the prism jig positioning module 9 and transport them to downstream curing, inspection, or packaging stations. Its starting docking platform is precisely aligned with the discharge position of the prism jig positioning module 9.

[0148] Equipment workflow:

[0149] Initial positioning of loading materials: The operator or upstream robot places a miniLED bare die to be bonded onto the base 45 of the miniLED board positioning bar mechanism 4, within the positioning area enclosed by two infinitely adjusted and locked bars 43. The vertical portion of the bars 43 ensures that the board is initially positioned in the predetermined area.

[0150] Descending to retrieve the miniLED board: The miniLED board assembly and alignment lift module 5 is activated. The lift drive motor 55, via the first high-precision ground screw 52, ​​drives the first connecting plate 54 (driving the entire alignment platform 6 and the adsorption module 7) downward until the adsorption chamber plate seal 73 at the bottom of the adsorption module 7 approaches the miniLED board. At this point, negative pressure is activated, applying a vacuum to the adsorption chamber 72 through the negative pressure air inlet 78. The small anti-static non-permanent suction nozzle 731 and the large anti-static non-permanent suction nozzle 732 securely grasp the miniLED board. Simultaneously, the miniLED board top post 73 is retracted (above the adsorption chamber plate seal 73).

[0151] Horizontal movement to the positioning area: The material picking and laminating horizontal movement module 3 receives the instruction and moves along the X direction to transport the entire adsorption module 7 and the alignment platform 6 assembly adsorbing the miniLED board to the light hole area above the miniLED board CCD camera positioning module 8.

[0152] CCD camera positioning: CCD camera 82 and CCD light source 84 are activated. Under the control of positioning module 8, the X-axis adjustment drive motor 83 and Y-axis adjustment drive motor 86 are driven to fine-tune the position of CCD camera 82 as necessary to capture a clear image of a specific location on the miniLED board (e.g., a corner or a pre-set edge marker). Image processing algorithms (such as template matching and centroid positioning) are used to accurately calculate the deviation (ΔX, ΔY, Δθ) of the current miniLED board relative to the target position in the X, Y, and Theta (angle) directions.

[0153] Correction of the alignment platform: The obtained deviation data is transmitted to the control system of the alignment platform module 6. The miniLED board alignment platform module 6 precisely controls the operation of its X-axis adjustment drive motor 63, Y-axis adjustment drive motor 65, and the corresponding second high-precision grinding screw 64 based on the ΔX, ΔY, and Δθ values. By driving the four rotating bearing blocks 66 to perform tiny, precise displacements (which may include displacement in only the X or Y direction, or differential displacement to compensate for angles), the second connecting plate 67 of the support adsorption module 7 (i.e., grasping the miniLED board) ultimately undergoes precise, minute translation and rotation (at very small angles), correcting the position and angle of the miniLED board in real time to achieve the set target position (accuracy of ±1μm).

[0154] Lateral movement to the bonding position & cushioned bonding: After correction is complete, the material removal and bonding lateral movement module 3 is activated again, transporting the precisely positioned miniLED panel assembly to the right area, positioning it directly above the prism jig secured by the prism jig positioning module 9. The lifting module 5 then begins to drive the adsorption module 7 downward. During the descent, the third module mounting base plate 71 (with plate) below the adsorption module 7 first contacts the prism film. As the descent continues, the pressure sensor 75 begins to detect contact pressure. The compression spring 76 positioned between the upper and lower plates is gradually compressed, providing a buffer and absorbing impact energy, ensuring that the bonding pressure rises gently and smoothly to the set value (e.g., 20N). Meanwhile, vacuum bonding maintains the flatness of the miniLED panel. Linear bearings 77 and high-precision micro-vertical guide rails 74 ensure vertical movement of the lower plate. The pressure sensor 75 provides real-time feedback throughout the entire process, and the control system dynamically adjusts the lifting speed or final position accordingly to ensure precise and controllable bonding pressure and minimize air bubbles and damage. The bonding process is complete.

[0155] De-adsorption & Lift Release: After lamination is complete, the vacuum pressure applied to the adsorption module 7 is turned off. Under certain designs (active lift release) or natural gravity, the miniLED board top post 733 within the adsorption chamber 72 may be triggered or moved downward by the rising adsorption module 7. Its lower end passes through the hole in the adsorption chamber cover 73 and gently presses against the back of the miniLED board, helping it to release from the suction nozzle. At this point, the lifting module 5 slowly lifts the adsorption module 7.

[0156] Finished Product Unloading: The material-collecting and laminating transverse movement module 3 moves the suction module 7 to the top of the material receiving platform of the unloading and transfer module 10. The suction module 7 slowly descends to the appropriate height above the receiving platform (no need to release it at this point, as it is free of material). Next, the unloading and transfer module 10 activates, and its end effector (such as a vacuum suction cup or gripper) grabs the finished miniLED module just bonded to the prism fixture positioning module 9, removes it, and sends it to the next process. This completes the lamination cycle.

[0157] In summary, the fully automatic prism bonding equipment for miniLEDs is designed with an adaptive limit bar mechanism: the sliding pair of the T-shaped track groove 41 and the slider 42 realizes the infinite adjustment of the bar 43. Combined with the 90° bending structure and the plum blossom knob fastening, a square positioning area that can be quickly reconfigured is formed to cover miniLED boards of different sizes. It can realize the rapid positioning of full-size miniLED boards with high positioning accuracy and high adjustment efficiency without the need to replace the fixture;

[0158] This device has a double-layer buffer adsorption system: a high-precision micro vertical guide rail 74 and a pressure sensor 75 are integrated in the adsorption module 7, dynamic buffering is provided by a compression spring 76, and vacuum negative pressure adsorption and the lifting and release of the top column 733 are combined to eliminate the impact and bubbles of fitting.

[0159] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprising a" does not exclude the presence of additional identical elements in the process, method, article, or device comprising the element.

[0160] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A fully automatic prism laminating device for miniLED, comprising a lower frame (1), a mounting base plate (2), a material laminating and lateral shifting module (3), a miniLED board limiting block mechanism (4), a miniLED board material laminating and aligning lifting module (5), a miniLED board aligning platform module (6), a miniLED board adsorption module (7), a miniLED board CCD camera positioning module (8), a prism fixture positioning module (9), and a material blanking and transplanting module (10), characterized in that: The lower frame (1) is fixedly arranged on the equipment installation ground and serves as the basic supporting structure of the entire equipment; The mounting base plate (2) is rigidly mounted above the lower frame (1) to form the main working platform of the equipment; The material picking and laminating transverse movement module (3) is slidably arranged on the mounting base plate (2) and is used to carry the relevant modules to move in the horizontal direction; The miniLED board limiting block mechanism (4) is fixedly arranged on the upper surface of the mounting substrate (2) at a position close to the left side, and is used to accurately locate and constrain the edge position of the miniLED board to be bonded; The miniLED board position-limiting block mechanism (4) includes a base (45), a recessed track groove (41) is provided on the base (45), at least two groups of sliders (42) are movably connected in the track groove (41), the top of the slider (42) is fixedly connected with a block bar (43), the block bar (43) is bent, a fastener (44) is threadedly connected to the block bar (43), and the bottom end of the fastener (44) abuts against the top surface of the miniLED board position-limiting block mechanism (4); the miniLED board material-taking and laminating alignment lifting module (5) is rigidly fixedly mounted on the moving part of the material-taking and laminating transverse movement module (3), and is configured to drive the components thereon to perform precise vertical movement; The miniLED board alignment platform module (6) is rigidly fixedly mounted on the upper output end of the miniLED board material taking and laminating alignment lifting module (5), and is used to carry and drive the miniLED board to perform high-precision micro-alignment in the X, Y directions and rotational degrees of freedom; The miniLED board adsorption module (7) is rigidly fixedly mounted on the lower working surface of the miniLED board alignment platform module (6), and is configured to generate a controllable adsorption force to pick up, firmly attach and safely release the miniLED board; The miniLED board CCD camera positioning module (8) is arranged in the space below the mounting substrate (2) based on the principle of machine vision, and its optical collection end passes upward through the mounting substrate (2) to perform high-resolution image collection and precise positioning of the miniLED board located under the miniLED board adsorption module (7); The prism fixture positioning module (9) is fixedly arranged on the upper surface of the mounting substrate (2) at a position close to the right side, and is used to fix, position and carry the prism to be bonded or the prism pre-installed fixture; The blanking and transferring module (10) is arranged on the periphery of the right side of the overall structure of the equipment and is equipped with a driving device for grabbing the miniLED board product with completed prism bonding from the prism fixture positioning module (9) area and transferring it to a downstream station or collection area.

2. The fully automatic prism bonding device for miniLED according to claim 1, characterized in that: In the miniLED board limiting baffle mechanism (4), the cross-sectional shape of the track groove (41) is T-shaped, the inner angle of the baffle (43) is ninety degrees, the baffle (43) is movably connected to the surface of the base (45), the position of the baffle (43) on the surface of the base (45) can be infinitely adjusted, the baffles (43) together enclose a square area, and the fastener (44) is specifically a plum blossom knob with a threaded head.

3. The fully automatic prism bonding device for miniLED according to claim 1, characterized in that: The miniLED board material taking, laminating and positioning lifting module (5) specifically comprises a first module mounting base plate (51), a high-precision guide rail (53), a lifting drive motor (55), a first high-precision grinding screw (52) and a first connecting plate (54); Wherein, the first module mounting base plate (51) is fixedly arranged vertically on one side of the moving part of the material taking and laminating transverse moving module (3); The high-precision guide rail (53) is rigidly fixedly mounted vertically on a side elevation of the first module mounting base plate (51); The lifting drive motor (55) is fixedly mounted on the top of the first module mounting base plate (51); The first high-precision grinding screw (52) is coaxially connected to the lower end of the output shaft of the lifting drive motor (55) through a coupling and is arranged vertically, and its screw nut portion is tightly connected to the first connecting plate (54); The first connecting plate (54) is slidably matched with the high-precision guide rail (53) through a slider. When the lifting drive motor (55) drives the first high-precision grinding screw (52) to rotate, the first connecting plate (54) is driven to perform precise lifting motion along the high-precision guide rail (53).

4. The fully automatic prism bonding device for miniLED according to claim 1, characterized in that: The miniLED board alignment platform module (6) specifically includes a second module mounting base plate (61), a plurality of high-precision micro guide rails (62), an X-axis adjustment drive motor (63), a second high-precision grinding screw (64), a Y-axis adjustment drive motor (65), a rotating bearing seat (66) and a second connecting plate (67); Wherein, the second module mounting base plate (61) is rigidly fixedly mounted on one side of the first connecting plate (54) in the vertical direction; A plurality of high-precision micro guide rails (62) are fixedly mounted on the bottom of the second module mounting base plate (61) and arranged along a specific direction; The X-direction adjustment drive motor (63) and the Y-direction adjustment drive motor (65) are both fixedly arranged at the bottom of the second module mounting base plate (61); The second high-precision grinding screw (64) is connected to the output ends of the corresponding X-direction adjustment drive motor (63) and the Y-direction adjustment drive motor (65) through a coupling; A plurality of rotating bearing seats (66) are respectively slidably matched with the high-precision micro guide rail (62) through sliders, and are fastened to the screw nut portion on the corresponding second high-precision grinding screw (64), so that the X / Y direction adjustment drive motor (63), (65) can drive the rotating bearing seat (66) to move precisely in the respective corresponding directions along the high-precision micro guide rail (62); The second connecting plate (67) is rotatably connected to one side of the multiple rotating bearing seats (66) through its four corners or specific positions. Specifically, the rotation connection point is located in the corner area of ​​the side of the rotating bearing seat (66) away from its own rotation center. The coordinated movement or differential movement of the multiple rotating bearing seats (66) in the X / Y direction drives the second connecting plate (67) to achieve two-dimensional translation and small rotational movement in the plane.

5. The fully automatic prism bonding device for miniLED according to claim 1, characterized in that: The miniLED board adsorption module (7) specifically includes two third module mounting base plates (71), an adsorption cavity (72), an adsorption cavity plate sealing plate (73), a high-precision micro vertical guide rail (74), a pressure sensor (75), a compression spring (76), a linear bearing (77), a negative pressure air inlet (78) and a vacuum pressure digital display (79); One of the third module mounting base plates (71) is rigidly fixedly mounted on the bottom center area of ​​the second connecting plate (67); The high-precision micro vertical guide rail (74) is arranged between the two third module mounting base plates (71) so that they can slide relative to each other in the vertical direction; The two third module mounting base plates (71) cooperate with each other to enclose and form the sealed adsorption cavity (72); The adsorption cavity plate sealing plate (73) covers and is fixed to the bottom of the adsorption cavity (72) to form a working adsorption plane; The pressure sensor (75), compression spring (76) and linear bearing (77) are all arranged between the two third module mounting base plates (71) and are arranged around the high-precision micro vertical guide rail (74). The pressure sensor (75) is used to detect the fitting pressure, the compression spring (76) provides buffering and reset force, and the linear bearing (77) assists in guiding. The negative pressure air inlet (78) is opened through the surface of the third module mounting base plate (71) and is used to connect to an external vacuum generating device to provide controllable negative pressure into the adsorption cavity (72); The vacuum pressure digital display (79) is fixedly mounted on one side of one of the third module mounting base plates (71), and its detection end is connected to the adsorption cavity (72) for real-time monitoring and display of the vacuum pressure value in the cavity.

6. The fully automatic prism bonding device for miniLED according to claim 1, characterized in that: In the adsorption cavity (72), a plurality of small anti-static non-constant suction nozzles (731) and / or large anti-static non-constant suction nozzles (732) for contacting and adsorbing the miniLED board are provided on the bottom surface of the adsorption cavity plate sealing plate (73); at the same time, a plurality of miniLED board top columns (733) are rigidly fixedly installed inside the adsorption cavity (72) and above the adsorption cavity plate sealing plate (73), and the lower ends of the miniLED board top columns (733) can be pushed down through the corresponding holes on the adsorption cavity plate sealing plate (73) when the negative pressure is released, so as to assist in lifting and releasing the adsorbed miniLED board.

7. The fully automatic prism bonding device for miniLED according to claim 1, characterized in that: The miniLED board CCD camera positioning module (8) specifically includes a fourth module mounting base plate (81), a CCD camera (82), an X-direction adjustment drive motor (83), a CCD light source (84), a third high-precision grinding screw (85), a Y-direction adjustment drive motor (86) and a high-precision guide rail (87); The fourth module mounting base plate (81) is fixedly mounted in the space below the mounting base plate (2); The high-precision guide rail (87) is fixedly arranged on the fourth module mounting base (81) and extends along the X direction; The X-direction adjustment drive motor (83) is fixedly mounted on one end of the fourth module mounting base plate (81); The third high-precision grinding screw (85) is connected to the output end of the X-direction adjustment drive motor (83) through a coupling and is arranged along the X direction; At least one sliding seat is slidably matched with the high-precision guide rail (87) through a slider, and is threadedly connected with the third high-precision grinding screw (85) through a screw nut to form an X-axis adjustment slide; Another high-precision guide rail (87) is fixedly arranged on the sliding seat of the X-direction adjustment slide and extends along the Y direction; The Y-direction adjustment drive motor (86) is fixedly mounted on the sliding seat of the X-direction adjustment slide; Another third high-precision grinding screw (85) is connected to the output end of the Y-direction adjustment drive motor (86) through a coupling and is arranged along the Y direction; Another sliding seat is slidably matched with the high-precision guide rail (87) in the Y direction through a slider, and is threadedly connected with the third high-precision grinding screw (85) in the Y direction through a screw nut to form a Y-direction adjustment slide; The CCD camera (82) and the CCD light source (84) are rigidly fixedly mounted on the sliding seat of the Y-axis adjustment slide, and the X-axis adjustment drive motor (83) and the Y-axis adjustment drive motor (86) cooperatively drive the CCD camera (82) and the CCD light source (84) to perform high-precision closed-loop position adjustment in a two-dimensional plane, so that the optical axis of the CCD camera (82) is aligned with and passes through a preset through-hole area on the mounting substrate (2), thereby performing image acquisition and positioning of an upper target.

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