Chip winding high-frequency inductor

Abstract

The invention discloses a chip winding high-frequency inductor, and relates to the technical field of inductors, the chip winding high-frequency inductor comprises a magnetic core and a coil wound on the magnetic core, the two ends of the magnetic core are fixedly connected with connecting seats, the bottom of each connecting seat is fixedly provided with a welding block, the two ends of the coil are fixedly connected with the corresponding welding blocks respectively, and the welding blocks are fixedly connected with the magnetic core. According to the invention, through the arrangement of the extrusion ball and the damping parts, when the shell is strongly impacted, the extrusion ball can be used as multi-stage damping, and when the extrusion ball is extruded, the damping parts can be used as multi-stage damping; according to the inductor, the contact area between the extrusion ball and the connecting base and the contact area between the extrusion ball and the shell are increased, meanwhile, the gas distribution area in the extrusion ball is wider, the damping performance is further improved, and the technical problem that when an existing inductor is rigidly connected with a board circuit, the impact resistance is poor is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of inductors, and in particular to a chip-type wound high-frequency inductor. Background Art

[0002] Chip-wound high-frequency inductors are suitable for high-frequency circuits. They are primarily formed by winding a wire around a magnetic core to form a coil. The core is typically made of magnetic materials such as ferrite, silicon steel sheet, and nickel-zinc ferrite. These materials enhance the magnetic field generated by the coil, thereby improving the performance of the inductor. Chip-wound high-frequency inductors have good solderability and heat resistance, making them suitable for general welding and reflow soldering.

[0003] When assembling an inductor on a circuit board using a placement machine, the solder paste or solder is first heated on the pad of the circuit board, and then the solder end of the inductor is placed against the pad. However, the contact area between the solder end and the solder paste or solder on the pad is small, resulting in a low degree of connection between the solder end of the inductor and the pad of the circuit board. Therefore, the solder liquid needs to be blown to the bottom end of the inductor little by little or moved by other means to ensure the stability of the weld. This not only increases the difficulty and complexity of welding, but also increases the labor intensity of workers, is time-consuming and labor-intensive, resulting in low processing efficiency. When large-scale production is carried out, it is easy to cause delays in the construction period.

[0004] During actual use, it was found that although the suction piece and the suction chamber cooperate to suck the soldering liquid, so that the soldering liquid is concentrated to the bottom of the soldering block and is in close contact with the uneven bottom of the soldering block, the shock absorber cannot push the soldering liquid. When the suction piece sucks, it will do a lot of useless work, first sucking out a large amount of air, and then sucking the soldering liquid after it is at a certain distance from the soldering liquid. As a result, some of the soldering liquid cannot be sucked to the bottom of the soldering block, resulting in the problem of the connection still being unstable.

[0005] After assembly, the coil is not fixed properly. When it moves on the magnetic core, it will wear the insulation layer on the outside of the coil, which may cause damage to the coil. In addition, during assembly, the end of the existing inductor away from the circuit board is usually fixed to the casing by a rigid connection. When subjected to strong vibration or impact of the casing, due to the lack of buffering and shock absorption, the inductor can easily move on the circuit board or even fall off, or cause cracks in the welding point between the inductor and the circuit board, thereby causing damage to the machine. Summary of the Invention

[0006] The object of the present invention is to provide a chip-type wound high-frequency inductor to solve the technical problem of weak impact resistance when the existing inductor is rigidly connected to the board circuit as mentioned in the background art.

[0007] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: a chip-type wound high-frequency inductor, comprising a magnetic core and a coil wound thereon, wherein both ends of the magnetic core are fixedly connected to a connecting seat, a welding block is fixed at the bottom of each connecting seat, and both ends of the coil are fixedly connected to the corresponding welding block, respectively. A suction piece is slidably provided in each connecting seat, and a slidable shock-absorbing piece is provided on each connecting seat. A hollow squeezing ball is fixedly connected to the top of the connecting seat. When the connecting seat is connected to the circuit board, the suction piece sucks the welding liquid to the welding block so that the welding liquid is in full contact with the welding block. When the suction piece sucks the welding liquid, the shock-absorbing piece can move to the bottom, so that the shock-absorbing piece wraps and protects the welding point.

[0008] Preferably, each of the connecting seats is provided with two pneumatic telescopic rods, and the corresponding two pneumatic telescopic rods are connected to the interior of the corresponding extrusion ball through a connecting pipe, and the extended ends of the pneumatic telescopic rods are fixedly connected to the corresponding shock absorbers.

[0009] Preferably, a collecting member is fixedly connected to the outer side wall of the bottom of each shock-absorbing member, and when the collecting member comes into contact with the soldering liquid, it pushes the soldering liquid to move toward the soldering block.

[0010] Preferably, a suction cavity is provided in each of the connecting seats, the suction piece is slidably arranged in the suction cavity, a plurality of suction grooves are provided on the welding block, and the suction piece can extend out of the corresponding suction grooves.

[0011] Preferably, each of the suction chambers is connected to the interior of the corresponding squeezing ball through a corresponding connecting tube.

[0012] Preferably, the opposite ends of the two connecting seats are slidably connected to a clamping piece, and the clamping piece is fixedly connected to a contact piece on one side close to the coil. The inner wall of the contact piece is provided with a plurality of limiting grooves consistent with the shape of the coil, and the coil can be inserted into the limiting grooves.

[0013] Preferably, a pneumatic groove is provided in each of the connecting seats, and an extrusion block is slidably provided in each of the pneumatic grooves.

[0014] Preferably, a side of the extrusion block close to the clamping member is inclined, and the inclined portion of the extrusion block is slidably connected to the clamping member.

[0015] Preferably, each of the pneumatic grooves is communicated with the interior of the corresponding extrusion ball through a vent pipe, and an elastic member is provided between the end of the extrusion block away from the clamping member and the pneumatic groove.

[0016] Preferably, a protective member is provided at the position where the coil is fixed to the corresponding welding block, and the suction member is slidably connected to the protective member.

[0017] The beneficial effects of the present invention are:

[0018] 1. By cooperating with each other through the provided suction piece, suction chamber and shock-absorbing piece, the soldering liquid can be moved to the position of the soldering block during welding, so that the soldering joint is tight and firm, and loose soldering is prevented. While moving the soldering liquid, the shock-absorbing piece is moved to the soldering joint to prevent the soldering liquid from overflowing, resulting in insufficient contact between the soldering liquid and the soldering block and loose soldering, thereby achieving a better welding effect; by the provided collecting piece and the shock-absorbing piece being fixedly connected, a closed space can be formed between the collecting piece and the circuit board when the soldering liquid is sucked, so that the suction piece and the suction groove only suck the gas and soldering liquid in the space, so that the soldering liquid can flow more to the bottom of the soldering block, thereby achieving a tight connection between the inductor and the circuit board, and ensuring the stability of the soldering joint.

[0019] 2. The provided clamping parts, contact parts and limiting grooves can limit the coil, thereby preventing the insulation layer of the outer wall from being worn when the coil moves. The provided squeezing balls and shock absorbers can be used as multi-stage shock absorption when the shell is subjected to strong impact. First, the shock absorber can absorb shock at the welding point, and the squeezing ball can prevent the rigid connection between the shell and the inductor from being directly damaged when subjected to strong impact. At the same time, the rough setting of the outer wall of the squeezing ball can prevent relative movement between the inductor and the shell. When the squeezing ball is squeezed, the contact area between the squeezing ball and the connecting seat and between the squeezing ball and the shell is increased, further improving the position stability of the inductor. At the same time, the gas distribution area in the squeezing ball is wider, further improving the shock absorption performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0021] Figure 2 It is a schematic diagram of the full-section main plane structure of the present invention.

[0022] Figure 3 For the present invention Figure 2 Enlarged view of point A in the middle.

[0023] Figure 4 Schematic diagram of the connection relationship between the squeezing ball and the connecting pipe, etc. of the present invention.

[0024] Figure 5 This is an exploded view of the welding block, suction piece and protective piece in the present invention.

[0025] Figure 6 This is an exploded view of the contact member and the clamping member in the present invention.

[0026] The reference numerals are: 1, magnetic core; 2, coil; 3, connecting seat; 301, welding block; 302, shock absorber; 303, squeezing ball; 304, pneumatic telescopic rod; 305, connecting pipe; 306, collecting part;

[0027] 4. Suction member; 401. Suction chamber; 402. Suction groove; 403. Connecting pipe; 404. Protective member; 5. Clamping member; 501. Contact member; 502. Limiting groove; 503. Pneumatic groove; 504. Extrusion block; 505. Ventilation pipe; 506. Elastic member. DETAILED DESCRIPTION

[0028] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0029] Example 1

[0030] Chip-wound high-frequency inductors are suitable for high-frequency circuits. They are mainly made by winding a wire around a magnetic core 1 to form a coil 2. The magnetic core 1 is usually made of magnetic materials such as ferrite, silicon steel sheet, nickel-zinc ferrite, etc. These materials can enhance the magnetic field generated by the coil 2, thereby improving the performance of the inductor. Chip-wound high-frequency inductors have good solderability and heat resistance, and are suitable for general welding and reflow soldering.

[0031] When assembling an inductor on a circuit board using a placement machine, the solder paste or solder is first heated on the pad of the circuit board, and then the solder end of the inductor is placed against the pad. However, the contact area between the solder end and the solder paste or solder on the pad is small, resulting in a low degree of connection between the solder end of the inductor and the pad of the circuit board. Therefore, the solder liquid needs to be blown to the bottom end of the inductor little by little or moved by other means to ensure the stability of the weld. This not only increases the difficulty and complexity of welding, but also increases the labor intensity of workers, is time-consuming and labor-intensive, resulting in low processing efficiency. When large-scale production is carried out, it is easy to cause delays in the construction period.

[0032] To solve the above technical problems, please refer to Figures 1 to 6As shown, a chip-type wound high-frequency inductor according to an embodiment of the present invention includes a magnetic core 1 and a coil 2 wound thereon, wherein both ends of the magnetic core 1 are fixedly connected to a connecting seat 3, a welding block 301 is fixed to the bottom of each connecting seat 3, and both ends of the coil 2 are fixedly connected to the corresponding welding block 301, a suction piece 4 is slidably provided in each connecting seat 3, a slidable shock absorber 302 is provided on each connecting seat 3, and a hollow squeezing ball 303 is fixedly connected to the top of the connecting seat 3. When the connecting seat 3 is connected to the circuit board, the suction piece 4 sucks the soldering liquid to the welding block 301, so that the soldering liquid is in full contact with the welding block 301. When the suction piece 4 sucks the soldering liquid, the shock absorber 302 can move to the bottom, so that the shock absorber 302 wraps the welding position for protection. Two pneumatic telescopic rods 304 are provided on the connecting seat 3, and the corresponding two pneumatic telescopic rods 304 are connected to the corresponding squeezing ball 303 through a connecting pipe 305. The extended end of the pneumatic telescopic rod 304 is fixedly connected to the corresponding shock absorber 302. A suction chamber 401 is provided in each of the connecting seats 3, and the suction member 4 is slidably arranged in the suction chamber 401. A plurality of suction grooves 402 are provided on the welding block 301, and the suction member 4 can extend out of the corresponding suction groove 402. Each of the suction chambers 401 is connected to the corresponding squeezing ball 303 through a corresponding connecting pipe 403. A protective member 404 is provided at a fixed position between the coil 2 and the corresponding welding block 301, and the suction member 4 is slidably connected to the protective member 404.

[0033] During use, the solder on the circuit board is first molten, and then the solder block 301 of the inductor is moved toward the solder. The suction piece 4 first contacts the solder liquid. After contacting the solder liquid, the suction piece 4 begins to move in the suction chamber 401 in the direction away from the solder liquid, causing the suction piece 4 and the connecting seat 3 to move relative to each other, thereby causing the part of the suction chamber 401 located at the bottom of the suction piece 4 to be in a negative pressure state, and the solder liquid is sucked through the solder block 301 and the suction groove 402. Since there is air between the solder block 301 and the circuit board, the air is first sucked to a certain extent. A plurality of contact rods corresponding to the suction grooves 402 are provided on the suction piece 4. The diameter of the contact rods is smaller than the diameter of the suction grooves 402 to prevent the solder liquid from being sucked to a higher position and unable to make close contact with the bottom of the solder block 301.

[0034] After the suction member 4 and the connecting seat 3 move relative to each other for a certain distance, the suction chamber 401 located at the bottom of the suction member 4 begins to suck the solder liquid through the suction groove 402, and draws the solder liquid to the bottom position of the solder block 301, so that the solder liquid is gathered in the bottom area of ​​the solder block 301. Figure 5 It can be seen that the bottom of the solder block 301 has an irregular concave-convex distribution, which enables the soldering liquid to fully flow at the bottom of the solder block 301, thereby making the soldering liquid fully contact with the solder block 301, making the soldering point stable and firm.

[0035] When the suction member 4 moves relative to the connecting seat 3, the suction member 4 squeezes the gas in the upper part of the suction chamber 401, so that the gas in the upper part of the suction chamber 401 is discharged into the pneumatic telescopic rod 304 after passing through the connecting pipe 403, the squeezing ball 303 and the connecting pipe 305, so that the pneumatic telescopic rod 304 extends and drives the corresponding shock absorber 302 to move toward the bottom, so that the shock absorber 302 wraps and protects the welding point to prevent the welding liquid from overflowing, resulting in insufficient contact between the welding liquid and the welding point of the welding block 301, resulting in a loose connection. The shock absorber 302 is made of high-temperature resistant flexible material and will not fail under the action of high-temperature welding liquid. The pneumatic telescopic rod 304 is a prior art and will not be described in detail here.

[0036] During the movement of the suction piece 4, the connection between the protective piece 404 and the suction piece 4 can ensure sealing and prevent the coil 2 from wearing out within the range of movement of the suction piece 4. At the same time, the coil 2 is made of an outer wall insulating material such as enameled wire, and leakage will not occur. The specific technology will not be described in detail here.

[0037] By cooperating with each other, the provided suction member 4, the suction chamber 401 and the shock-absorbing member 302 can move the welding liquid toward the position of the welding block 301 during welding, thereby making the welding joint tight and firm, and preventing the occurrence of loose welding. While moving the welding liquid, the shock-absorbing member 302 is moved toward the welding joint to prevent the welding liquid from overflowing, resulting in insufficient contact between the welding liquid and the welding block 301 and loose welding, thereby achieving a better welding effect.

[0038] Example 2

[0039] In actual use, it was found that although the suction piece 4 and the suction chamber 401 cooperate to suck the soldering liquid, so that the soldering liquid is concentrated to the bottom of the soldering block 301 and is in close contact with the uneven bottom of the soldering block 301, but because the shock absorber 302 cannot push the soldering liquid, the suction piece 4 will do a lot of useless work when sucking, and will first suck a large amount of air, and will not be able to suck the soldering liquid until it is a certain distance away from the soldering liquid. Therefore, part of the soldering liquid cannot be sucked to the bottom of the soldering block 301, resulting in the problem that the connection is still not firm.

[0040] In order to solve the above technical problems, based on the above embodiments, please refer to Figures 1 to 6 As shown, the adopted technical solution includes a shock absorber 302, and the outer side wall of the bottom of each shock absorber 302 is fixedly connected to a collecting member 306. When the collecting member 306 contacts the soldering liquid, it pushes the soldering liquid to move toward the soldering block 301.

[0041] During use, while the shock absorber 302 moves toward the welding position to prevent the soldering liquid from overflowing, the shock absorber 302 drives the collecting member 306 to move toward the welding position. The collecting member 306 contacts the circuit board before the shock absorber 302. The collecting member 306 is made of flexible and high-temperature resistant material and will not fail under the action of high-temperature soldering liquid. The collecting member 306 deforms and pushes the soldering liquid to the bottom of the soldering block 301. At the same time, a relatively sealed space is formed between the collecting member 306, the circuit board, and the connecting seat 3, so that the suction member 4 only extracts from this space, thereby reducing the probability of the suction member 4 doing useless work and increasing the probability of the soldering liquid being moved to the bottom of the soldering block 301, so that the soldering liquid is fully contacted with the bottom of the soldering block 301. Subsequently, after the shock absorber 302 contacts the circuit board, the soldering liquid is completely extracted to the bottom of the soldering block 301.

[0042] Since the bottom of the welding block 301 is uneven, please refer to the drawings in the specification for details. Figure 5 As shown, a plurality of dovetail grooves arranged vertically and horizontally are provided at the bottom of the solder block 301, thereby forming an uneven bottom of the solder block 301, so that the solder liquid can be interlocked with the dovetail grooves on the solder block 301 after cooling, thereby improving the connection stability and reliability between the solder liquid and the solder block 301.

[0043] By fixing the collecting member 306 to the shock absorbing member 302, a closed space can be formed between the collecting member 306 and the circuit board when the soldering liquid is sucked, so that the suction member 4 and the suction groove 402 only suck the gas and soldering liquid in the space, so that more soldering liquid can flow to the bottom of the soldering block 301, thereby achieving a close connection between the inductor and the circuit board and ensuring the stability of the soldering point.

[0044] Example 3

[0045] Although the above embodiment solves the problem of close contact between the soldering liquid and the solder block 301, it cannot prevent the wear of the coil 2 on the magnetic core 1. After the assembly is completed, the coil 2 is not fixed. After moving on the magnetic core 1, it will wear the external insulation layer. The technology of setting the insulation layer on the outside of the coil 2 is existing technology, which may cause damage to the coil 2. In addition, during assembly, the end of the existing inductor away from the circuit board is usually fixed to the shell by a rigid connection. When subjected to strong vibration or impact of the shell, due to the lack of buffering and shock-absorbing components, the inductor is likely to move on the circuit board or even fall off, thereby causing damage to the circuit board.

[0046] In order to solve the above technical problems, based on the above embodiments, please refer to Figures 1 to 6As shown, the adopted technical solution includes a connecting seat 3, and the opposite ends of the two connecting seats 3 are slidably connected with a clamping member 5. The clamping member 5 is fixedly connected to the side of the coil 2, and a plurality of limiting grooves 502 consistent with the shape of the coil 2 are provided on the inner wall of the contact member 501. The coil 2 is spirally distributed as a whole, and the coil 2 can be inserted into the limiting groove 502. A pneumatic groove 503 is provided in each of the connecting seats 3, and an extrusion block 504 is slidably provided in each of the pneumatic grooves 503. The side of the extrusion block 504 close to the clamping member 5 is inclined, and the inclined part of the extrusion block 504 is slidably connected to the clamping member 5. Each of the pneumatic grooves 503 is connected to the interior of the corresponding extrusion ball 303 through a vent pipe 505. An elastic member 506 is provided between the end of the extrusion block 504 away from the clamping member 5 and the pneumatic groove 503.

[0047] In actual use, when the inductor is welded to the circuit board and needs to be installed in the housing, the end of the circuit board away from the inductor is first fixed to the housing and other components. After the fixing is completed, another housing or component is used to cover the end of the circuit board close to the inductor. When covering, the later installed housing or component squeezes the squeezing ball 303 on the connecting seat 3. Since the squeezing ball 303 is made of elastic and high-temperature resistant material, the gas in the squeezing ball 303 begins to be discharged into the pneumatic groove 503 through the vent pipe 505, causing the air pressure in the pneumatic groove 503 to increase. The force is strong, so that the extrusion block 504 moves toward the direction of the clamping member 5 and pushes the clamping member 5 to move downward. At the same time, the elastic member 506 is stretched, and the clamping member 5 and the connecting seat 3 are connected by a keyway sliding connection, which is not shown in the figure, so that the clamping member 5 drives the contact member 501 and the limiting groove 502 to move toward the direction of the coil 2, so that the coil 2 is located in the corresponding limiting groove 502. The contact member 501 is made of flexible material and the clamping member 5 is made of hard material, which facilitates the movement of the clamping member 5, avoids uneven movement on both sides, and fixes the coil 2.

[0048] Due to the elastic member 506 , when the suction member 4 squeezes the suction chamber 401 , the internal gas is effectively discharged into the pneumatic telescopic rod 304 , and then the pneumatic telescopic rod 304 is extended before it can act on the pneumatic groove 503 and the squeezing block 504 .

[0049] When the shell contacts the squeezing ball 303, the squeezing ball 303 is deformed. The surface of the squeezing ball 303 is set to be a rough surface, which can form a damping connection with the shell. Therefore, when subjected to impact, it can delay or even prevent the position change between the inductor and the circuit board, and prevent cracks or splits in the weld. At the same time, the squeezing ball 303 is made of elastic material. When subjected to strong impact or shock, the squeezing ball 303 can serve as a buffer between the shell, the circuit board and the inductor, and the shock absorber 302 can serve as a buffer between the circuit board and the inductor. Therefore, when subjected to impact, the squeezing ball 303 will undergo a certain deformation, thereby greatly reducing the impact force. When vibration occurs at the weld between the inductor and the circuit board, the vibration can be transmitted to the shock absorber 302 and the squeezing ball 303, thereby reducing the damage to the weld between the inductor and the circuit board caused by vibration and impact. At the same time, a rigid connection between the shell and the inductor at the end away from the circuit board is prevented, thereby improving the stability and shock resistance of the inductor, and preventing damage to the circuit board and the inductor.

[0050] By providing the clamping member 5, the contact member 501 and the limiting groove 502, the coil 2 can be restricted, thereby preventing the coil 2 from shaking or slightly moving when the circuit board or the machine for installing the circuit board moves, causing the insulating layer of the outer wall of the coil 2 to gradually wear out. By providing the squeezing ball 303 and the shock absorber 302, it can be used as a multi-stage shock absorber when the shell is subjected to a strong impact. First, the shock absorber 302 can dampen the welding point. The squeezing ball 303 can prevent the rigid connection between the shell and the inductor from being directly damaged when hit. At the same time, the rough setting of the outer wall of the squeezing ball 303 can prevent the inductor and the shell from moving relative to each other. When the squeezing ball 303 is squeezed, the contact area between the squeezing ball 303 and the connecting seat 3 and between the squeezing ball 303 and the shell is increased, thereby further improving the position stability of the inductor. At the same time, the gas distribution area in the squeezing ball 303 is wider, thereby further improving the shock absorption performance.

[0051] The above description is only a preferred specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any technician familiar with the technical field, within the technical scope disclosed by the present invention, who makes equivalent replacements or changes based on the technical solution and inventive concept of the present invention, should be covered by the scope of protection of the present invention.

Claims

1. A chip-type wound high-frequency inductor, comprising a magnetic core and a coil wound thereon, wherein both ends of the magnetic core are fixedly connected to a connection seat, characterized in that: A welding block is fixed at the bottom of each connecting seat, and both ends of the coil are fixedly connected to the corresponding welding blocks. A suction piece is slidably provided in each connecting seat, and a slidable shock-absorbing piece is provided on each connecting seat. A hollow squeezing ball is fixedly connected to the top of the connecting seat. When the connecting seat is connected to the circuit board, the suction piece sucks the welding liquid to the welding block so that the welding liquid and the welding block are in full contact. When the suction piece sucks the welding liquid, the shock-absorbing piece can move to the bottom, so that the shock-absorbing piece can wrap and protect the welding point.

2. A chip-type wire-wound high-frequency inductor according to claim 1, characterized in that: Each of the connecting seats is provided with two pneumatic telescopic rods, and the corresponding two pneumatic telescopic rods are connected to the interior of the corresponding extrusion ball through a connecting pipe, and the extended ends of the pneumatic telescopic rods are fixedly connected to the corresponding shock absorbing parts.

3. The chip-type wire-wound high-frequency inductor according to claim 2, characterized in that: The outer side wall of the bottom of each shock-absorbing component is fixedly connected with a collecting component. When the collecting component contacts the soldering liquid, it pushes the soldering liquid to move toward the soldering block.

4. The chip-type wire-wound high-frequency inductor according to claim 3, characterized in that: A suction cavity is provided in each connecting seat, and the suction piece is slidably arranged in the suction cavity. A plurality of suction grooves are provided on the welding block, and the suction piece can extend out of the corresponding suction grooves.

5. The chip-type wire-wound high-frequency inductor according to claim 4, characterized in that: Each of the suction chambers is communicated with the interior of the corresponding squeezing ball through a corresponding connecting tube.

6. The chip-type wire-wound high-frequency inductor according to claim 5, characterized in that: The opposite ends of the two connecting seats are slidably connected to a clamping piece, and the clamping piece is fixedly connected to a contact piece on one side close to the coil. The inner wall of the contact piece is provided with multiple limiting grooves consistent with the shape of the coil, and the coil can be inserted into the limiting grooves.

7. The chip-type wire-wound high-frequency inductor according to claim 6, characterized in that: A pneumatic groove is provided in each of the connecting seats, and an extrusion block is slidably provided in each of the pneumatic grooves.

8. The chip-type wire-wound high-frequency inductor according to claim 7, characterized in that: The side of the extrusion block close to the clamping piece is inclined, and the inclined portion of the extrusion block is slidably connected to the clamping piece.

9. The chip-type wire-wound high-frequency inductor according to claim 8, characterized in that: Each of the pneumatic grooves is communicated with the interior of the corresponding extrusion ball through a vent pipe, and an elastic member is provided between the end of the extrusion block away from the clamping member and the pneumatic groove.

10. The chip-type wire-wound high-frequency inductor according to claim 9, characterized in that: A protective piece is provided at the position where the coil is fixed to the corresponding welding block, and the suction piece is slidably connected to the protective piece.

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