Die bonding device and method capable of adjusting light absorptivity and light transmittance

Abstract

The invention provides a die bonding device and method capable of adjusting light absorptivity and light transmittance. The device comprises a first die bonding head, a second die bonding head, a plurality of first gratings and a plurality of second gratings. The first die bonding head is light-permeable. The second die bonding head is arranged below the first die bonding head and is light-permeable. The plurality of first gratings are arranged at the bottom of the first die bonding head, and a plurality of gaps are formed among the plurality of first gratings. The plurality of second gratings are arranged on the top of the second die bonding head and a plurality of gaps are formed among the plurality of second gratings. Wherein the alignment degree of the plurality of first gratings and the plurality of second gratings is adjusted by moving the first die bonding head and / or the second die bonding head, so that the light absorption rate and the light transmittance of the die bonding device are adjusted, and the effect of adjusting different degrees of temperature rise between the die bonding device and the crystal grains is achieved.

Description

Technical Field

[0001] The present invention relates to a die-bonding device and method, in particular to a die-bonding device and method capable of adjusting light absorption rate and light transmittance. Background Art

[0002] The die bonding process is a crucial step in semiconductor back-end packaging. One method of die bonding is to heat and pressurize the die.

[0003] The conventional die bonding method includes the following steps: a light-transmissive die bonding device absorbs a die and places the die on a substrate; and a light source projects a light toward the die bonding device. The light penetrates the die bonding device and irradiates the die to heat the die, thereby fixing the die on the substrate.

[0004] However, the light absorption rate and light transmittance of the conventional die bonding device are fixed, and the intensity of light irradiating the die cannot be adjusted, resulting in that the temperature increase effect of the die bonding device and the die cannot be adjusted. Summary of the Invention

[0005] The main purpose of the present invention is to provide a die-bonding device and method with adjustable light absorptivity and light transmittance, which can adjust the different degrees of temperature rise effects between the die-bonding device and the die.

[0006] In order to achieve the aforementioned objectives, the present invention provides a die-bonding device capable of adjusting light absorption rate and light transmittance, comprising a first die-bonding head, a second die-bonding head, a plurality of first gratings, and a plurality of second gratings. The first die-bonding head is light-transmissive. The second die-bonding head is disposed below the first die-bonding head and is light-transmissive. The plurality of first gratings are disposed at the bottom of the first die-bonding head and form a plurality of gaps between each other. The plurality of second gratings are disposed at the top of the second die-bonding head and form a plurality of gaps between each other. The light absorption rate and light transmittance of the die-bonding device are adjusted by adjusting the degree of alignment between the plurality of first gratings and the plurality of second gratings by moving the first die-bonding head and / or the second die-bonding head.

[0007] In some embodiments, when the plurality of first gratings are completely aligned with the plurality of second gratings, the plurality of gaps between the plurality of first gratings are completely aligned with the plurality of gaps between the plurality of second gratings.

[0008] In some embodiments, when the plurality of first gratings are partially aligned with the plurality of second gratings, the plurality of slits between the plurality of first gratings are partially aligned with the plurality of slits between the plurality of second gratings.

[0009] In some embodiments, the first die-bonding head and the second die-bonding head are made of iron-free glass or quartz.

[0010] To achieve the aforementioned objectives, the present invention provides a die-bonding method capable of adjusting light absorptivity and light transmittance, comprising the following steps: a die-bonding device sucks a die and places the die on a substrate; adjusting the alignment of a plurality of first gratings at the bottom of the first die-bonding head and a plurality of second gratings at the top of the second die-bonding head by moving a first light-transmitting die-bonding head of the die-bonding device and / or a second light-transmitting die-bonding head of the die-bonding device to adjust the light absorptivity and light transmittance of the die-bonding device; and a light source projects a light beam toward the die-bonding device, wherein a portion of the light beam is absorbed only by the plurality of first gratings or by both the plurality of first gratings and the plurality of second gratings, and a portion of the light beam fully or partially penetrates through a plurality of gaps between the plurality of first gratings and a plurality of gaps between the plurality of second gratings and irradiates the die to heat the die, thereby fixing the die to the substrate.

[0011] In some embodiments, the step of adjusting the light absorption rate and light transmittance of the die-bonding device further includes: when the multiple first gratings are completely aligned with the multiple second gratings, the multiple gaps between the multiple first gratings are completely aligned with the multiple gaps between the multiple second gratings; wherein, the step of fixing the die on the substrate further includes: part of the light is only absorbed by the multiple first gratings, and part of the light completely penetrates the multiple gaps between the multiple first gratings and the multiple gaps between the multiple second gratings.

[0012] In some embodiments, the step of adjusting the light absorption rate and light transmittance of the die-bonding device further includes: when the multiple first gratings are partially aligned with the multiple second gratings, the multiple gaps between the multiple first gratings are partially aligned with the multiple gaps between the multiple second gratings; wherein, the step of fixing the die on the substrate further includes: part of the light is simultaneously absorbed by the multiple first gratings and the multiple second gratings, and part of the light partially penetrates through the multiple gaps between the multiple first gratings and the multiple gaps between the multiple second gratings.

[0013] In some embodiments, the first die-bonding head and the second die-bonding head are made of iron-free glass or quartz.

[0014] The effectiveness of the present invention lies in that the present invention can adjust the alignment degree of the multiple first gratings and the multiple second gratings by moving the first bonding head and / or the second bonding head to adjust the light absorption rate and transmittance of the bonding device, thereby achieving the effect of adjusting the different degrees of temperature rise between the bonding device and the grains. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 Schematic diagram of a die-bonding device capable of adjusting light absorptivity and light transmittance according to the present invention.

[0016] Figure 2 The present invention is a flow chart of a die-bonding method capable of adjusting light absorptivity and light transmittance.

[0017] Figure 3 3 is a schematic diagram of step S10 of the die bonding method capable of adjusting light absorptivity and light transmittance of the present invention.

[0018] Figure 4 3 is a schematic diagram of step S20 of the die bonding method capable of adjusting light absorptivity and light transmittance of the present invention.

[0019] Figure 5 3 is a schematic diagram of step S30 of the die bonding method capable of adjusting light absorptivity and light transmittance of the present invention.

[0020] Description of reference numerals:

[0021] 1: Die bonding device;

[0022] 2: grain;

[0023] 3:Substrate;

[0024] 4: light source;

[0025] 10: first die bonding head;

[0026] 20: second die bonding head;

[0027] 30: first grating;

[0028] 31: gap;

[0029] 40: second grating;

[0030] 41: Gap. DETAILED DESCRIPTION

[0031] The following is a more detailed description of the embodiments of the present invention with reference to the drawings and component symbols, so that those skilled in the art can implement the invention accordingly after studying this specification.

[0032] Figure 1 Schematic diagram of the crystal bonding device 1 with adjustable light absorption and transmittance according to the present invention. Figure 1 As shown, the present invention provides a die-bonding device 1 with adjustable light absorption and transmittance, comprising a first die-bonding head 10, a second die-bonding head 20, a plurality of first gratings 30, and a plurality of second gratings 40. The first die-bonding head 10 is light-transmissive. The second die-bonding head 20 is disposed below the first die-bonding head 10 and is also light-transmissive. The plurality of first gratings 30 are disposed at the bottom of the first die-bonding head 10 and form a plurality of gaps 31 between them. The plurality of second gratings 40 are disposed at the top of the plurality of second die-bonding heads 20 and form a plurality of gaps 41 between them.

[0033] Figure 2 The present invention is a flow chart of a die-bonding method capable of adjusting light absorptivity and light transmittance. Figure 3 3 is a schematic diagram of step S10 of the die bonding method capable of adjusting light absorptivity and light transmittance of the present invention. Figure 4 3 is a schematic diagram of step S20 of the die bonding method capable of adjusting light absorptivity and light transmittance of the present invention. Figure 5 Schematic diagram of step S30 of the die bonding method with adjustable light absorptivity and light transmittance of the present invention. The present invention provides a die bonding method with adjustable light absorptivity and light transmittance, comprising the following steps:

[0034] Step S10, as Figure 2 and Figure 3 As shown, a die bonding device 1 absorbs a die 2 and places the die 2 on a substrate 3 . Figure 3 The substrate 3 shown is a die. In some embodiments, the substrate 3 may also be a wafer.

[0035] Step S20, as Figure 2 and Figure 4 As shown, the alignment between the plurality of first gratings 30 and the plurality of second gratings 40 is adjusted by moving the first die-bonding head 10 and / or the second die-bonding head 20 to adjust the light absorption rate and light transmittance of the die-bonding device 1 .

[0036] Step S30, as Figure 2 and Figure 5 As shown, a light source 4 projects a light toward the die-bonding device 1, part of the light is absorbed only by the multiple first gratings 30 or absorbed by the multiple first gratings 30 and the multiple second gratings 40 at the same time, and part of the light completely or partially penetrates the multiple gaps 31 between the multiple first gratings 30 and the multiple gaps 41 between the multiple second gratings 40 and irradiates the die 2 to heat the die 2, so that the die 2 is fixed on the substrate 3.

[0037] Specifically, step S20, as Figure 4 As shown in the left figure, when the plurality of first gratings 30 and the plurality of second gratings 40 are completely aligned, the plurality of gaps 31 between the plurality of first gratings 30 are completely aligned with the plurality of gaps 41 between the plurality of second gratings 40; step S30, as shown Figure 5As shown on the left of the figure, part of the light is only absorbed by the multiple first gratings 30, and part of the light completely penetrates the multiple gaps 31 between the multiple first gratings 30 and the multiple gaps 41 between the multiple second gratings 40. In other words, the multiple first gratings 30 completely cover the multiple second gratings 40, and the multiple second gratings 40 are not exposed at all in the multiple gaps 31 between the multiple first gratings 30, so only the multiple first gratings 30 can absorb light, and the multiple second gratings 40 cannot absorb light at all, so that the first crystal-bonding device 1 has a low light absorption rate. At the same time, the multiple gaps 31 between the multiple first gratings 30 and the multiple gaps 41 between the multiple second gratings 40 can allow a large amount of light to pass through, so that the first crystal-bonding device 1 has a high light transmittance. Therefore, as shown in Figure 5 As shown in the left figure, the die bonding device 1 absorbs less light, generates less heat, and has a smaller temperature rise; in contrast, the die 2 absorbs more light, generates more heat, and has a larger temperature rise.

[0038] Specifically, if Figure 4 As shown in the right figure, when the plurality of first gratings 30 are partially aligned with the plurality of second gratings 40, the plurality of gaps 31 between the plurality of first gratings 30 are partially aligned with the plurality of gaps 41 between the plurality of second gratings 40; step S30, as shown Figure 5 As shown in the right figure, part of the light is absorbed by the multiple first gratings 30 and the multiple second gratings 40 at the same time, and part of the light partially penetrates the multiple gaps 31 between the multiple first gratings 30 and the multiple gaps 41 between the multiple second gratings 40. In other words, the multiple first gratings 30 partially cover the multiple second gratings 40, and the multiple second gratings 40 are partially exposed to the multiple gaps 31 between the multiple first gratings 30, so not only the multiple first gratings 30 can absorb light, but the exposed parts of the multiple second gratings 40 can also absorb light, so that the first solid crystal device 1 has a high light absorption rate. At the same time, the multiple gaps 31 between the multiple first gratings 30 and the multiple gaps 41 between the multiple second gratings 40 can only allow a small amount of light to penetrate, so that the first solid crystal device 1 has a low light transmittance. Therefore, as Figure 5 As shown in the right figure, the die bonding device 1 absorbs more light, generates more heat, and has a larger temperature rise; in contrast, the die 2 absorbs less light, generates less heat, and has a smaller temperature rise.

[0039] In a preferred embodiment, the first die-bonding head 10 and the second die-bonding head 20 are made of iron-free glass or quartz. However, the present invention is not limited thereto, and any light-transmissive material can be used as the material of the first die-bonding head 10 and the second die-bonding head 20 of the present invention.

[0040] In a preferred embodiment, the light source 4 can be an infrared heater or a laser heater. However, the present invention is not limited thereto, and any device capable of projecting light can be used as the light source 4 of the present invention.

[0041] In summary, the present invention can adjust the alignment degree of the multiple first gratings 30 and the multiple second gratings 40 by moving the first die bonding head 10 and / or the second die bonding head 20 to adjust the light absorption rate and transmittance of the die bonding device 1, thereby achieving the effect of adjusting the different degrees of temperature increase between the die bonding device 1 and the die 2.

[0042] The above description is only used to explain the preferred embodiments of the present invention and is not intended to limit the present invention in any form. Therefore, any modifications or changes made to the present invention under the same inventive spirit should still be included in the scope of protection intended by the present invention.

Claims

1. A die-bonding device capable of adjusting light absorption and transmittance, characterized in that: include: a first die-bonding head, which is light-transmissive; a second die-bonding head, disposed below the first die-bonding head and light-transmissive; A plurality of first gratings are disposed at the bottom of the first die-bonding head and form a plurality of gaps between each other; as well as A plurality of second gratings are disposed on the top of the second die-bonding head and form a plurality of gaps between each other; The alignment degree between the plurality of first gratings and the plurality of second gratings is adjusted by moving the first die-bonding head and / or the second die-bonding head, so as to adjust the light absorption rate and light transmittance of the die-bonding device.

2. The die-bonding device with adjustable light absorption and transmittance according to claim 1, characterized in that: When the plurality of first gratings are completely aligned with the plurality of second gratings, the plurality of gaps between the plurality of first gratings are completely aligned with the plurality of gaps between the plurality of second gratings.

3. The die-bonding device with adjustable light absorption and transmittance according to claim 1, characterized in that: When the plurality of first gratings are partially aligned with the plurality of second gratings, the plurality of gaps between the plurality of first gratings are partially aligned with the plurality of gaps between the plurality of second gratings.

4. The die-bonding device with adjustable light absorption and transmittance according to claim 1, characterized in that: The first die-bonding head and the second die-bonding head are made of iron-free glass or quartz.

5. A die bonding method capable of adjusting light absorption rate and light transmittance, characterized in that: The following steps are involved: A die bonding device absorbs a die and places the die on a substrate; Adjusting the alignment of the plurality of first gratings on the bottom of the first die-bonding head and the plurality of second gratings on the top of the second die-bonding head by moving a light-transmissive first die-bonding head of the die-bonding device and / or a light-transmissive second die-bonding head of the die-bonding device to adjust the light absorption rate and light transmittance of the die-bonding device; as well as A light source projects a light toward the die-bonding device. Part of the light is absorbed only by the first gratings or by both the first gratings and the second gratings. Part of the light fully or partially penetrates through the gaps between the first gratings and the gaps between the second gratings and irradiates the die to heat the die, thereby fixing the die on the substrate.

6. The die bonding method capable of adjusting light absorption rate and light transmittance according to claim 5, characterized in that: The step of adjusting the light absorption rate and light transmittance of the die bonding device further includes: When the plurality of first gratings are completely aligned with the plurality of second gratings, the plurality of gaps between the plurality of first gratings are completely aligned with the plurality of gaps between the plurality of second gratings; The step of fixing the die on the substrate further includes: part of the light is only absorbed by the first gratings, and part of the light completely penetrates the gaps between the first gratings and the gaps between the second gratings.

7. The die bonding method capable of adjusting light absorption rate and light transmittance according to claim 5, characterized in that: The step of adjusting the light absorption rate and light transmittance of the die bonding device further includes: When the plurality of first gratings are partially aligned with the plurality of second gratings, the plurality of gaps between the plurality of first gratings are partially aligned with the plurality of gaps between the plurality of second gratings; The step of fixing the die on the substrate further includes: part of the light is absorbed by the first gratings and the second gratings at the same time, and part of the light partially penetrates the gaps between the first gratings and the gaps between the second gratings.

8. The die bonding method capable of adjusting light absorption rate and light transmittance according to claim 5, characterized in that: The first die-bonding head and the second die-bonding head are made of iron-free glass or quartz.

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