Production forming device for environment-friendly lead-free soldering tin bar for welding electronic components

Abstract

The invention relates to the technical field of metal casting, in particular to an environment-friendly lead-free soldering tin bar production forming device for electronic component welding, which comprises a mold body, the upper end and the lower end of the mold body are connected with a smelting assembly and a discharging assembly, and the interior of the mold body is hermetically connected with a mold drum with a cavity and is in transmission with a first driving assembly. A mold main body is provided with a melt runner and a discharge chute, a demolding assembly is arranged in a rotary drum, vibration and cooling assemblies are arranged on end covers at two ends, a negative pressure assembly is arranged on the main body, and all the assemblies are arranged along the rotating direction of the rotary drum. According to the device, closed injection is achieved through the annular cavity of the mold rotary drum, welding flux oxidation is reduced, and the production period is effectively shortened through multi-station synchronous parallel operation. Before material injection, the negative pressure assembly exhausts cavity gas, negative pressure material suction is achieved, and air holes are reduced; the vibration assembly refines grains and improves the welding strength and toughness; the cooling assembly is accurate in temperature control, welding flux is prevented from being quenched and cracked, it is ensured that the soldering tin bar is smooth in appearance and uniform in internal structure, the oxidation problem of a traditional technology is solved, and high-precision forming and efficient production are achieved.

Description

Technical Field

[0001] The invention relates to the technical field of metal casting, and in particular to a production and molding device for environmentally friendly lead-free solder bars for welding electronic components. Background Art

[0002] With the rapid development of the electronic information industry, electronic components are rapidly evolving towards higher density and miniaturization. In cutting-edge fields such as chip packaging and micro-electromechanical systems, the spacing between solder joints continues to shrink, placing increasingly stringent demands on the precision and reliability of soldering materials. Environmentally friendly lead-free solder has become the mainstream choice for soldering electronic components. However, its production technology faces numerous challenges, particularly the serious deficiencies in molding accuracy and production efficiency exposed by traditional continuous casting equipment, which have become a major obstacle to industry development.

[0003] Currently, traditional continuous casting equipment uses fixed molds with simple cooling channel designs. This makes it impossible to ensure a uniform temperature distribution during the solder solidification process, resulting in complex internal stresses within the solder bar. This internal stress can easily cause internal defects such as shrinkage cavities and cracks, seriously affecting the structural integrity of the solder bar. Furthermore, traditional gravity injection methods are unable to effectively expel air from the mold cavity, resulting in a high number of pores within the solder bar, reducing the material's density and uniformity. Furthermore, the open injection environment increases the risk of solder oxidation. Oxide scale mixes with the solder, forming hard spots that seriously threaten the safety of precision components such as chip pins during the soldering process and significantly reduce product yields.

[0004] Furthermore, the traditional equipment's step-by-step "injection-cooling-demolding" process lengthens the production cycle for a single solder bar. Time is wasted in each transition, making efficient, continuous production difficult. This low-capacity operation model cannot meet the automated production line's demand for rapid, high-volume solder bar supply.

[0005] Therefore, how to achieve high-precision forming of solder bars, uniform composition control, and efficient continuous production, while effectively solving the oxidation problem in traditional processes, has become a core task in promoting the advancement of environmentally friendly lead-free solder technology, and is also a key problem that technical personnel in this field urgently need to overcome. Summary of the Invention

[0006] In order to achieve high-precision forming, uniform composition control and efficient continuous production of solder bars, while effectively solving the oxidation problem in traditional processes, the present application provides an environmentally friendly lead-free solder bar production and forming device for welding electronic components.

[0007] The present application provides an environmentally friendly lead-free solder bar production and molding device for electronic component welding, which adopts the following technical solutions: A device for producing and molding environmentally friendly lead-free solder bars for welding electronic components comprises a mold body, wherein the upper end of the mold body is connected to a melting assembly, and the lower end of the mold body is connected to a discharge assembly; a mold drum is sealedly connected to the interior of the mold body, and a plurality of annularly evenly distributed cavities are defined on the outer surface of the mold drum, and the mold drum is drivingly connected to a first drive assembly; a melt flow channel is defined at the top of the mold body and is sealedly connected to the melting assembly, wherein the melt flow channel passes through the inner side wall of the mold body and is connected to one of the cavities located in the horizontal direction; a discharge chute is defined at the bottom of the mold body, wherein the discharge chute is connected to the vertical cavity, and a demolding assembly is provided inside the mold drum corresponding to the discharge chute; a front end cover and a rear end cover are fixedly and sealedly installed at both ends of the mold body, and a vibration assembly and a cooling assembly are installed on the front end cover and the rear end cover corresponding to the mold drum; a negative pressure assembly is installed on the mold body, and the negative pressure assembly, the melting assembly, the cooling assembly, and the discharge assembly are sequentially arranged on the mold body along the rotation direction of the mold drum.

[0008] Furthermore, the smelting component includes a smelting kettle, an electromagnetic induction heating coil is installed on the outside of the smelting kettle, a kettle cover is fixedly and sealedly installed on the top of the smelting kettle, a limiting sleeve is installed in the center of the kettle cover, a driving shaft that penetrates into the smelting kettle is slidably connected to the limiting sleeve, a limiting groove is provided on the driving shaft, the limiting groove is spirally arranged, and both ends of the limiting groove are provided with annular grooves that are smoothly transitioned and connected, a limiting pin is installed on the limiting sleeve corresponding to the limiting groove, a valve ball is installed at the bottom of the driving shaft, a guide pipe is fixedly and sealedly installed on the bottom of the smelting kettle corresponding to the molten material flow channel, a discharge port corresponding to the valve ball is provided on the bottom surface of the smelting kettle, and the discharge port is connected to the guide pipe, a feed hopper that is sealed and connected to the smelting kettle is fixedly installed on the kettle cover, a second drive assembly that is transmission-connected to the driving shaft is installed on the kettle cover, and a stirring frame is fixedly installed on the driving shaft inside the smelting kettle.

[0009] Furthermore, the second drive assembly includes a mounting sleeve, which is fixedly mounted on the kettle cover, a transmission sleeve rotatably connected inside the mounting sleeve, an axially arranged spline groove is provided inside the transmission sleeve, and spline teeth corresponding to the spline groove are provided on the driving shaft, a driven gear is fixedly mounted on the outer side of the transmission sleeve, a second motor is fixedly mounted on the kettle cover, a driving gear is fixedly mounted on the output shaft of the second motor, and the driving gear is meshed with the driven gear.

[0010] Furthermore, the discharging assembly includes a discharging base, which is fixedly installed on the bottom surface of the mold body corresponding to the discharging trough, and an active transmission shaft and a driven transmission shaft are installed on the discharging base, an active transmission roller is installed on the active transmission shaft, and a driven transmission roller is installed on the driven transmission shaft, and conveyor belts are installed on the active transmission roller and the driven transmission roller, and a discharging port is obliquely provided on the discharging base corresponding to the output end of the conveyor belt; the active transmission shaft passes through one end of the discharging base and is transmission-connected to a third drive assembly.

[0011] Furthermore, the third drive assembly includes a third motor, a third driving pulley is fixedly installed on the output shaft of the third motor, a third driven pulley is fixedly installed on one end of the active transmission shaft passing through the discharging base, and a third transmission belt is connected between the third driving pulley and the third driven pulley.

[0012] Furthermore, the first driving assembly includes a first motor, and a first driving pulley is fixedly mounted on the driving shaft of the first motor; the front end cover and the rear end cover are rotatably connected to a driving shaft that passes through the mold drum, a first driven pulley is fixedly mounted on the driving shaft, a first transmission belt is connected for transmission between the first driven pulley and the first driving pulley, a driving gear is fixedly mounted on the driving shaft, a support shaft is fixedly mounted on the front end cover and the rear end cover, a transmission gear is rotatably connected to the support shaft, an inner gear ring is embedded in the inner side surface of the mold drum, and the transmission gear is meshed with the driving gear and the inner gear ring for transmission at the same time.

[0013] Furthermore, the demolding assembly includes a push block, a push block installation cavity is opened on the bottom surface of the mold cavity facing the center of the mold drum, the push block is sealingly and slidingly connected inside the push block installation cavity, a push rod is fixedly installed on the push block toward the center of the mold drum and passes through the side wall of the mold drum, a first magnetic block is fixedly installed on the push rod, a reset spring is abutted and connected between the first magnetic block and the inner wall of the mold drum, a second magnetic block is fixedly installed at the position of the mold drum corresponding to the discharge trough, and the second magnetic block and the first magnetic block repel each other.

[0014] Furthermore, the vibration assembly includes a vibrator, and a plurality of first mounting holes evenly distributed in an annular manner are opened on the front end cover close to one end of the mold drum, and the vibrator is fixedly installed inside the first mounting hole, and the vibrating part of the vibrator can slide against the end of the mold drum; a plurality of second mounting holes evenly distributed in an annular manner are opened on the rear end cover close to one end of the mold drum, and an abutment spring is fixedly installed inside the second mounting hole, and an abutment ball is fixedly welded to the end of the abutment spring away from the rear end cover, and the abutment ball can also slide against the end of the mold drum.

[0015] Furthermore, the cooling assembly includes a refrigerator, which contains a cooling medium. A cooling medium input pipe and a delivery pump are fixedly connected to the refrigerator, and a cooling medium output pipe is fixedly installed on the delivery pump; cooling channels are opened on the mold drum corresponding to the two adjacent cavities, and a number of delivery channels equidistantly distributed in a semicircular shape are opened on the front cover and the rear cover corresponding to the two ends of the cooling channels, and the delivery channels are correspondingly sealed with the cooling medium input pipe and the cooling medium output pipe.

[0016] Furthermore, the negative pressure component includes a negative pressure pump, and a negative pressure adsorption channel is opened on the mold body. The negative pressure adsorption channel passes through the side wall of the mold body and is connected to one of the cavities that will be connected to the melt flow channel. A negative pressure tube connected to the negative pressure adsorption channel is fixedly and sealedly installed on the mold body, and the negative pressure tube is connected to the negative pressure pump.

[0017] Beneficial effects achieved: This application utilizes the annular cavity set on the mold drum to not only achieve closed injection during the production and molding process, greatly reducing the oxidation loss of solder, but also realize multi-station parallel operation, allowing the injection, cooling, demolding and other processes to be carried out simultaneously, greatly shortening the production cycle, and meeting the needs of large-scale industrial production. At the same time, before injection, the use of a negative pressure component can effectively remove the gas in the cavity, which not only can achieve negative pressure suction during injection, but also reduce the internal pores of the solder bar; and, the vibration component can also refine the grains and improve the solder structure, thereby improving the welding strength and toughness; in addition, through precise temperature control of the cooling component, it can also avoid cracks in the solder due to rapid cooling, ensuring the flatness of the solder bar appearance and uniform internal structure. It achieves high-precision molding, uniform composition control and efficient continuous production of solder bars, and also effectively solves the oxidation problem in traditional processes. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the present application.

[0019] Figure 2 It is a schematic diagram of the structural decomposition of an embodiment of the present application.

[0020] Figure 3 This is a first internal structure schematic diagram of an embodiment of the present application.

[0021] Figure 4 This is a partial structural decomposition diagram of a smelting component in an embodiment of the present application.

[0022] Figure 5 This is a second internal structure schematic diagram of an embodiment of the present application.

[0023] Figure 6 This is a third internal structure diagram of an embodiment of the present application.

[0024] Figure 7 This is a schematic diagram of the structural decomposition of the cooling component in one embodiment of the present application.

[0025] Figure 8 This is a fourth internal structure diagram of an embodiment of the present application.

[0026] Figure 9 This is a schematic diagram of the installation structure of the negative pressure component in one embodiment of the present application.

[0027] Explanation of reference numerals: 100, frame; 101, mold body; 102, mold drum; 103, cavity; 104, melt flow channel; 105, discharge chute; 106, front cover; 107, rear cover; 200, smelting assembly; 201, smelting kettle; 202, electromagnetic induction heating coil; 203, kettle cover; 204, limiting sleeve; 205, driving shaft; 206, limiting groove; 207, annular groove; 208, limiting pin; 209, valve ball; 210, guide pipe; 211, discharge port; 212, installation 213, transmission sleeve; 214, spline groove; 215, spline teeth; 216, driven gear; 217, second motor; 218, feed hopper; 219, driving gear; 220, stirring frame; 221, sliding sleeve; 222, tightening spring; 300, discharge assembly; 301, discharge base; 302, driving transmission shaft; 303, driven transmission shaft; 304, driving transmission roller; 305, driven transmission roller; 306, conveyor belt; 307, discharge port; 308, third driven pulley; 309, third motor Machine; 310, third driving pulley; 311, third transmission belt; 400, first driving assembly; 401, first motor; 402, first driving pulley; 403, driving shaft; 404, first driven pulley; 405, first transmission belt; 406, driving gear; 407, supporting shaft; 408, transmission gear; 409, inner ring gear; 500, demoulding assembly; 501, push block; 502, push block mounting cavity; 503, push rod; 504, first magnetic block; 505, return spring; 506, second magnetic block ; 600, vibration component; 601, vibrator; 602, first mounting hole; 603, second mounting hole; 604, abutment spring; 605, abutment ball; 700, cooling component; 701, refrigerator; 702, cooling medium input pipe; 703, delivery pump; 704, cooling medium output pipe; 705, cooling channel; 706, delivery channel; 707, first series pipe; 708, second series pipe; 800, negative pressure component; 801, negative pressure pump; 802, negative pressure adsorption channel; 803, negative pressure pipe. DETAILED DESCRIPTION

[0028] The following is combined with Figures 1 to 9 This application is described in further detail.

[0029] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," "outer," and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended only to facilitate the description of the present invention and simplify the description. They do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0030] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0031] The embodiment of the present application discloses a device for producing and forming environmentally friendly lead-free solder bars for welding electronic components.

[0032] Please refer to Figures 1 to 9In one embodiment of the present application, a device for producing and molding environmentally friendly lead-free solder bars for welding electronic components includes a frame 100, on which a mold body 101 is fixedly mounted. A melting assembly 200 is fixedly mounted on the frame 100 at the upper end of the mold body 101, and a discharge assembly 300 is fixedly mounted on the frame 100 at the lower end of the mold body 101. A mold drum 102 is sealedly connected to the interior of the mold body 101, and a plurality of annularly evenly distributed cavities 103 are formed on the outer surface of the mold drum 102. A first drive assembly 400 is installed on the frame 100 in a transmission connection with the mold drum 102. A melt flow channel 104 is formed at the top of the mold body 101 and is sealed and connected to the melting assembly 200. The melt flow channel 104 passes through the inner side wall of the mold body 101 and is connected to a cavity 103 located in the horizontal direction. The bottom of the mold body 101 is provided with a discharge chute 105, which connects to the discharge assembly 300. The discharge chute 105 extends through the inner wall of the mold body 101 and communicates with the vertically positioned mold cavity 103. A demolding assembly 500 is installed within the mold drum 102, corresponding to the discharge chute 105. A front end cover 106 and a rear end cover 107 are fixedly and sealedly mounted at both ends of the mold body 101, which are sealed and rotatably connected to the ends of the mold drum 102. A vibration assembly 600 and a cooling assembly 700 are mounted on the front and rear ends of the mold drum 102, corresponding to the mold drum 102. A negative pressure assembly 800 is installed on the mold body 101. The negative pressure assembly 800, the melting assembly 200, the cooling assembly 700, and the discharge assembly 300 are arranged sequentially on the mold body 101 along the rotation direction of the mold drum 102.

[0033] During operation, the present application uses the frame 100 as support, and realizes the continuous molding of environmentally friendly lead-free solder bars through the coordinated operation of various components. After the smelting component 200 heats and melts the lead-free solder, the first drive component 400 drives the mold drum 102 to rotate, and the cavity 103 rotates accordingly. First, it passes through the negative pressure component 800, which removes the air in the cavity 103 to prevent the generation of bubbles; then it passes through the melt flow channel 104, which injects the molten lead-free solder into the cavity 103 on the outer side of the mold drum 102 from which the air has been extracted. At this time, the cavity 103 is in a horizontal position. As the mold drum 102 continues to rotate, the cavity 103 injected with lead-free solder will pass through the cooling component 700, which will cool and solidify the solder. When cavity 103 rotates to a vertically downward position, demolding assembly 500 ejects the formed solder bars from inside mold drum 102, where they fall through discharge chute 105 and are collected by discharge assembly 300. Simultaneously, vibration assembly 600 vibrates mold drum 102 during operation, refining the solder grains and improving molding quality. Each assembly operates in a streamlined manner along the drum's rotational direction, and the continuous rotation of mold drum 102 enables automated mass production of solder bars.

[0034] Please refer to Figures 1 to 9 In a specific embodiment of the present application, the smelting assembly 200 includes a smelting kettle 201, which is fixedly mounted on the frame 100. An electromagnetic induction heating coil 202 is mounted on the outside of the smelting kettle 201. A kettle cover 203 is fixedly and sealedly mounted on the top of the smelting kettle 201. A limiting sleeve 204 is mounted at the center of the kettle cover 203. A driving shaft 205 that penetrates the interior of the smelting kettle 201 is slidably connected to the limiting sleeve 204. The driving shaft 205 is provided with a limiting groove 206, which is arranged in a spiral shape. Both ends of the limiting groove 206 are provided with an annular groove 207 that is smoothly connected. A limit pin 208 is installed on the limit sleeve 204 corresponding to the limit groove 206, a valve ball 209 is installed at the bottom of the driving shaft 205, and a guide tube 210 is fixedly and sealedly installed at the bottom of the smelting kettle 201 corresponding to the melt flow channel 104. A discharge port 211 corresponding to the valve ball 209 is opened on the bottom surface of the smelting kettle 201, and the discharge port 211 is connected to the guide tube 210. A feed hopper 218 sealed and connected to the smelting kettle 201 is fixedly installed on the kettle cover 203, and a second drive assembly transmission-connected to the driving shaft 205 is installed on the kettle cover 203. A stirring frame 220 is fixedly installed on the driving shaft 205 inside the smelting kettle 201.

[0035] During operation, lead-free solder raw material is fed into the smelting kettle 201 through the feed hopper 218, and the lead-free solder in the smelting kettle 201 is heated to a molten state by the electromagnetic induction heating coil 202. The second drive assembly then drives the driving shaft 205 to rotate in the forward direction. During the forward rotation of the driving shaft 205, the stop pin 208 cooperates with the spiral stop groove 206, causing the stop pin 208 to enter the annular groove 207 located at the upper end of the stop groove 206. As a result, the driving shaft 205 moves downward to its limit position, thereby sealing the valve ball 209 at the bottom of the driving shaft 205 in the discharge port 211. Simultaneously, the stirring frame 220 on the driving shaft 205 stirs the molten material to ensure uniform composition. When the lead-free solder heated to a molten state in the smelting kettle 201 needs to be injected into the melt flow channel 104, the second driving component drives the driving shaft 205 to rotate in the opposite direction. When the driving shaft 205 rotates in the opposite direction, due to the cooperation between the limit pin 208 and the spiral limit groove 206, the limit pin 208 enters the annular groove 207 at the lower end of the limit groove 206. Therefore, the driving shaft 205 will move upward to the limit position, so that the valve ball 209 at the bottom of the driving shaft 205 can open the discharge port 211, and the lead-free solder will enter the guide tube 210 through the discharge port 211, and then enter the melt flow channel 104 from the guide tube 210. The lead-free solder entering the melt flow channel 104 will be injected one by one into the cavity 103 on the rotating mold drum 102.

[0036] Please refer to Figures 1 to 9 In a specific embodiment of the present application, the second drive assembly includes a mounting sleeve 212, which is fixedly mounted on the kettle cover 203. A transmission sleeve 213 is rotatably connected to the interior of the mounting sleeve 212. An axially arranged spline groove 214 is provided inside the transmission sleeve 213, and spline teeth 215 are provided on the driving shaft 205 corresponding to the spline groove 214. A driven gear 216 is fixedly mounted on the outer side of the transmission sleeve 213, a second motor 217 is fixedly mounted on the kettle cover 203, and a driving gear 219 is fixedly mounted on the output shaft of the second motor 217, and the driving gear 219 is meshed with the driven gear 216.

[0037] During operation, the second drive assembly realizes the combined action of rotation and axial movement of the driving shaft 205 through spline transmission. The second motor 217 drives the driving gear 219 to rotate, and the driving gear 219 drives the driven gear 216 and the transmission sleeve 213 fixed thereto to rotate. The spline groove 214 in the transmission sleeve 213 cooperates with the spline teeth 215 on the driving shaft 205, so that the rotational movement of the transmission sleeve 213 is transmitted to the driving shaft 205. At the same time, the spiral limiting groove 206 on the driving shaft 205 interacts with the limiting pin 208 on the limiting sleeve 204, converting the rotational movement of the driving shaft 205 into axial reciprocating motion. This combined movement enables the valve ball 209 at the bottom of the driving shaft 205 to rotate and stir the molten material, and to reliably open and close the discharge port 211, thereby realizing the quantitative delivery and uniform stirring of the molten solder.

[0038] Please refer to Figures 1 to 9 In a specific embodiment of the present application, a sliding sleeve 221 is slidably connected between the driving shaft 205 and the valve ball 209, and a tightening spring 222 is installed inside the sliding sleeve 221, and the tightening spring 222 is abutted against the ends of the driving shaft 205 and the valve ball 209.

[0039] During operation, the driving shaft 205 and the valve ball 209 are slidably connected via the sliding sleeve 221. The internal tensioning spring 222 of the sliding sleeve 221 maintains an elastic connection between the driving shaft 205 and the valve ball 209. When the driving shaft 205 moves to the lower limit position under the action of the limit pin 208 and the spiral limit groove 206, the valve ball 209 is prevented from rigidly impacting the discharge port 211. The sliding sleeve 221 can slide relative to the driving shaft 205, and the tensioning spring 222 absorbs the impact during movement through elastic deformation, ensuring a sealed contact between the valve ball 209 and the discharge port 211, so that the valve ball 209 fits tightly against the discharge port 211. At the same time, when the driving shaft 205 drives the stirring frame 220 to rotate and stir the molten material, the valve ball 209 remains stable under the action of the tensioning spring 222, avoiding seal failure caused by impact or vibration of the molten material.

[0040] Please refer to Figures 1 to 9In one embodiment of the present application, the discharge assembly 300 includes a discharge base 301, which is fixedly mounted on the bottom surface of the mold body 101 corresponding to the discharge trough 105. A driving transmission shaft 302 and a driven transmission shaft 303 are mounted on the discharge base 301. A driving transmission roller 304 is mounted on the driving transmission shaft 302, and a driven transmission roller 305 is mounted on the driven transmission shaft 303. A conveyor belt 306 is mounted on the driving transmission roller 304 and the driven transmission roller 305. A discharge port 307 extending to the outside of the frame 100 is obliquely provided at the output end of the discharge base 301 corresponding to the output end of the conveyor belt 306. One end of the driving transmission shaft 302, which passes through the discharge base 301, is transmission-connected to a third drive assembly.

[0041] During operation, the discharge assembly 300, supported by the discharge base 301, rotates the active conveyor shaft 302 via the third drive assembly. The active conveyor roller 304 on the active conveyor shaft 302 rotates accordingly, driving the driven conveyor shaft 303 and driven conveyor roller 305 to operate synchronously via the conveyor belt 306. When the mold cavity 103 of the mold drum 102 rotates to a vertically downward position, the demolding assembly 500 ejects the formed solder bars, which fall onto the conveyor belt 306. The conveyor belt 306 transports the solder bars to the obliquely positioned discharge port 307, where they eventually slide out of the frame 100 for collection. The conveyor belt 306's speed can be adjusted by the third drive assembly to match the rotational speed of the mold drum 102, ensuring smooth conveyance and preventing accumulation of the solder bars.

[0042] Please refer to Figures 1 to 9 In a specific embodiment of the present application, the third driving assembly includes a third motor 309, a third driving pulley 310 is fixedly installed on the output shaft of the third motor 309, a third driven pulley 308 is fixedly installed on one end of the driving transmission shaft 302 passing through the discharge base 301, and a third transmission belt 311 is connected between the third driving pulley 310 and the third driven pulley 308.

[0043] During operation, the third drive assembly provides power to the discharge assembly via a belt drive mechanism. When the third motor 309 is activated, the third driving pulley 310 on its output shaft begins to rotate, driving the third driven pulley 308 via the third transmission belt 311. This in turn synchronizes the active transmission shaft 302 and the active transmission roller 304, ultimately driving the conveyor belt 306 in a circular motion. This transmission method allows the transmission speed of the conveyor belt 306 to be adjusted by replacing the third driving pulley 310 or the third driven pulley 308 with different diameters. Furthermore, the speed of the third motor 309 can be adjusted to achieve stepless speed change, ensuring that the operating speed of the conveyor belt 306 matches the rotation rhythm of the mold drum 102, allowing the formed solder bars to be smoothly and orderly discharged from the discharge port 307.

[0044] Please refer to Figures 1 to 9 In a specific embodiment of the present application, the first drive assembly 400 includes a first motor 401, which is fixedly mounted on the frame 100. A first driving pulley 402 is fixedly mounted on the driving shaft of the first motor 401. A driving shaft 403 that passes through the mold drum 102 is rotatably connected to the front cover 106 and the rear cover 107. A first driven pulley 404 is fixedly mounted on the driving shaft 403. A first transmission belt 405 is connected between the first driven pulley 404 and the first driving pulley 402. A driving gear 406 is fixedly mounted on the driving shaft 403. A support shaft 407 is fixedly mounted on the front cover 106 and the rear cover 107. A transmission gear 408 is rotatably connected to the support shaft 407. An inner gear ring 409 is embedded in the inner side surface of the mold drum 102. The transmission gear 408 meshes with both the driving gear 406 and the inner gear ring 409 for transmission.

[0045] During operation, the first drive assembly 400 rotates the mold drum 102 via a multi-stage gear transmission. After the first motor 401 is started, the first driving pulley 402 on its output shaft drives the first driven pulley 404 via the first transmission belt 405, causing the drive shaft 403 to rotate synchronously. The driving gear 406 on the drive shaft 403 rotates accordingly and engages with the transmission gear 408 on the support shaft 407, transmitting power to the transmission gear 408. The transmission gear 408 simultaneously engages with the inner gear ring 409 on the inner side of the mold drum 102, thereby driving the mold drum 102 to rotate about its own axis. This multi-stage gear transmission achieves smooth and precise rotation of the mold drum 102, allowing the mold cavity 103 on its outer side to sequentially pass through the melt flow channel 104, the discharge chute 105, and other workstations, completing the continuous molding of the solder bars.

[0046] Please refer to Figures 1 to 9 In a specific embodiment of the present application, the demolding assembly 500 includes a push block 501, and a push block installation cavity 502 is opened on the bottom surface of the mold cavity 103 facing the center of the mold drum 102. The push block 501 is sealed and slidably connected inside the push block installation cavity 502. A push rod 503 that passes through the side wall of the mold drum 102 is fixedly installed on the push block 501 toward the center of the mold drum 102, and a first magnetic block 504 is fixedly installed on the push rod 503. A return spring 505 is abutted and connected between the first magnetic block 504 and the inner wall of the mold drum 102. A second magnetic block 506 is fixedly installed at a position corresponding to the discharge trough 105 inside the mold drum 102, and the second magnetic block 506 and the first magnetic block 504 repel each other.

[0047] During operation, when the mold drum 102 rotates to the discharge chute 105, the second magnetic block 506 inside the mold drum 102 gradually approaches the first magnetic block 504 on the push rod 503. Because the two repel each other, the repulsive force pushes the push rod 503 outward, causing the push block 501 to extend from the push block mounting cavity 502 and eject the solder bar formed in the cavity. At this point, the solder bar falls into the discharge assembly through the discharge chute 105. When the mold drum 102 continues to rotate away from this position, the return spring 505 pushes the first magnetic block 504 back to its original position, causing the push block 501 to retract into the mounting cavity in preparation for the next demolding operation. The entire process utilizes the combination of magnetic drive and spring return to automate the demolding action.

[0048] In a specific embodiment of the present application, the first magnetic block 504 and the second magnetic block 506 are both made of permanent magnets, such as neodymium iron boron permanent magnets. Neodymium iron boron permanent magnets have extremely high magnetic energy product and coercive force, can provide stable and strong repulsive force, ensure that the demolding action is reliably triggered, and magnetic force attenuation is not likely to occur even after long-term use, which can ensure long-term and stable operation of the demolding component.

[0049] Please refer to Figures 1 to 9 In a specific embodiment of the present application, the vibration assembly 600 includes a vibrator 601. A plurality of annularly evenly distributed first mounting holes 602 are defined on the end of the front cover 106 near the mold drum 102. The vibrator 601 is fixedly mounted within the first mounting holes 602, and the vibrating portion of the vibrator 601 can slidably abut the end of the mold drum 102. A plurality of annularly evenly distributed second mounting holes 603 are defined on the end of the rear cover 107 near the mold drum 102. Abutment springs 604 are fixedly mounted within the second mounting holes 603. An abutment ball 605 is fixedly welded to the end of the abutment spring 604 away from the rear cover 107. The abutment ball 605 can also slidably abut the end of the mold drum 102.

[0050] During operation, the vibration assembly 600 applies bidirectional vibration to the mold drum 102 through the front cover 106 and the rear cover 107. When the mold drum 102 rotates, the vibrator 601 on the front cover 106 is activated, and its vibrating portion directly abuts the end of the mold drum 102, transmitting high-frequency vibration to the mold drum 102 and the liquid solder in the cavity. At the same time, the abutment spring 604 on the rear cover 107 applies elastic pressure to the other end of the mold drum 102 through the abutment ball 605, allowing the mold drum 102 to maintain a stable axial position during vibration and enhancing the vibration transmission effect. When the mold cavity 103 rotates to the cooling area, the vibration promotes the flow and crystallization of the liquid solder, refining the grain structure. When the mold cavity 103 rotates to the discharge position, the vibration also assists in demolding and reduces the adhesion of the solder bar to the cavity.

[0051] In one embodiment of the present application, vibrator 601 is an ultrasonic vibrator. Its operating principle is to convert high-frequency electrical signals into mechanical vibrations through the inverse piezoelectric effect of piezoelectric ceramics, generating ultrasonic vibration energy of 20-40 kHz. This vibration energy is transmitted to the mold drum 102 via the vibrating element, where it acts on the liquid solder within the mold cavity. During the solder solidification process, the ultrasonic cavitation effect generates countless tiny cavitation bubbles in the liquid solder. The localized high temperature, high pressure, and micro-jets generated when these bubbles rupture effectively break up growing grains, refine the grains, and improve the mechanical properties of the solder bar. Simultaneously, the acoustic streaming effect promotes uniform solder flow, reducing defects such as component segregation and porosity. Furthermore, ultrasonic vibrations can reduce adhesion between the solder and the cavity wall, aiding demolding, and improving the surface quality of the solder bar. This ultrasonic vibrator features stable vibration frequency, adjustable energy, and easy control. It can precisely adapt to different process requirements, ensuring solder bar forming quality while improving production efficiency.

[0052] Please refer to Figures 1 to 9 In one embodiment of the present application, the cooling assembly 700 includes a refrigerator 701 fixedly mounted on the frame 100. A cooling medium is contained within the refrigerator 701. A cooling medium inlet pipe 702 and a delivery pump 703 are fixedly connected to the refrigerator 701. A cooling medium outlet pipe 704 is fixedly mounted on the delivery pump 703. Cooling channels 705 are defined on the mold drum 102, corresponding to locations between two adjacent cavities 103. Several delivery channels 706 are equidistantly spaced in a semicircular pattern, corresponding to both ends of the cooling channels 705, on the front and rear covers 106 and 107, respectively. The delivery channels 706 are sealedly connected to the cooling medium inlet pipe 702 and the cooling medium outlet pipe 704, respectively.

[0053] During operation, the cooling assembly 700 precisely controls the temperature of the mold drum 102 by circulating a cooling medium. The refrigerator 701 prepares the low-temperature cooling medium, and the delivery pump 703 presses the cooling medium into the delivery channel 706 of the front cover 106 via the cooling medium delivery pipe 704. As the mold drum 102 rotates, the cooling medium flows into the cooling channels 705 of the mold drum 102 when the cooling channels 705 on the mold drum 102 align and connect with the delivery channels 706 on the front and rear covers 106 and 107. After absorbing heat from the liquid solder in the mold cavity 103, the cooling medium flows through the delivery channel 706 of the rear cover 107 and returns to the cooling medium inlet pipe 702, where it is cooled back down in the refrigerator 701, forming a closed loop. As the mold drum 102 rotates, the cooling channels 705 rotate synchronously with the mold cavity 103, continuously providing gradient cooling to the solder and ensuring uniform solidification within the cavity.

[0054] Please refer to Figures 1 to 9In a specific embodiment of the present application, the number of conveying channels 706 provided on the front end cover 106 and the rear end cover 107 is set to an even number, and two adjacent conveying channels 706 on the rear end cover 107 are sealedly connected to the first series pipe 707 at one end away from the mold drum 102, the conveying channel 706 on the front end cover 106 closest to the melt flow channel 104 is sealedly connected to the cooling medium input pipe 702, and the conveying channel 706 on the front end cover 106 closest to the discharge trough 105 is sealedly connected to the cooling medium output pipe 704, and the other two adjacent conveying channels 706 between the conveying channel 706 closest to the melt flow channel 104 and the conveying channel 706 closest to the discharge trough 105 are sealedly connected to the second series pipe 708 at one end away from the mold drum 102, and the first series pipe 707 and the second series pipe 708 connect the cooling channels 705 in series in the cooling assembly 700 in a direction from close to the discharge trough 105 to close to the melt flow channel 104.

[0055] During the work process, Figure 8 As shown, when the cooling channel 705 on the mold drum 102 is aligned and connected with the delivery channel 706 on the front cover 106 and the rear cover 107, the delivery pump 703 will press the cooling medium into the delivery channel 706 of the front cover 106 through the cooling medium output pipe 704, and the cooling medium will flow from the direction close to the discharge trough 105 to the direction close to the melt flow channel 104, thereby realizing step-by-step temperature control cooling of the cavity 103 inside the mold drum 102. Through the layout of the series pipes, the cooling medium flows through the cooling channel in sequence, forming a temperature gradient from the discharge trough to the melt flow channel. The cavity close to the discharge trough first contacts the low-temperature cooling medium, and the solder solidifies quickly to form a shell. As the temperature of the cooling medium gradually increases, the cavity close to the melt flow channel cools slowly, reducing the internal stress caused by the temperature difference, avoiding defects such as cracks and shrinkage holes in the solder bar, and improving the molding quality.

[0056] In a specific embodiment of the present application, temperature sensors are installed on the first series pipe 707 and the second series pipe 708 as well as the cooling medium input pipe 702 and the cooling medium output pipe 704. The temperature sensors are electrically connected to the control system of the refrigerator 701 and the delivery pump 703.

[0057] During operation, a closed-loop temperature control system is formed by installing temperature sensors on the first series pipe 707, the second series pipe 708, the cooling medium input pipe 702, and the cooling medium output pipe 704, and electrically connecting these sensors to the control system of the refrigerator 701 and the delivery pump 703. The temperature sensors collect the temperature data of the cooling medium in each pipe in real time and transmit the signal to the control system. The control system dynamically adjusts the cooling power of the refrigerator 701 and the flow rate of the delivery pump 703 based on the preset temperature curve. When it is detected that the cooling medium temperature deviates from the set value, the system automatically adjusts: if the temperature is too high, the cooling is enhanced and the flow rate is increased; if the temperature is too low, the cooling intensity is reduced or the flow rate is reduced, thereby achieving gradient temperature control from the discharge trough to the melt flow channel.

[0058] Please refer to Figures 1 to 9 In a specific embodiment of the present application, the negative pressure component 800 includes a negative pressure pump 801, which is fixedly installed on the frame 100. A negative pressure adsorption channel 802 is opened on the mold body 101. The negative pressure adsorption channel 802 passes through the side wall of the mold body 101 and is connected to a cavity 103 that will be connected to the melt flow channel 104. A negative pressure tube 803 connected to the negative pressure adsorption channel 802 is fixedly and sealedly installed on the mold body 101, and the negative pressure tube 803 is connected to the negative pressure pump 801.

[0059] During operation, the negative pressure component 800 creates a negative pressure environment in the mold cavity through the negative pressure pump 801 to remove air and impurities. When the mold drum 102 rotates to the point where the cavity 103 to be injected is about to be aligned with the melt flow channel 104, the negative pressure pump 801 starts and evacuates the interior of the cavity 103 through the negative pressure tube 803 and the negative pressure adsorption channel 802, creating a negative pressure state. At the same time, the air, residual flux volatiles, or tiny impurities in the cavity are extracted by the negative pressure pump 801 to prevent them from mixing into the solder and forming defects. When the mold drum 102 rotates to the point where the cavity 103 to be injected is aligned with the melt flow channel 104, the molten solder flows more smoothly into the cavity 103 due to the pressure difference between the external atmospheric pressure and the negative pressure of the cavity.

[0060] The implementation principle of the device for producing and forming environmentally friendly lead-free solder bars for welding electronic components in the embodiment of the present application is as follows: This application uses the frame 100 as its support foundation and constructs a fully automated production system for "melting-injection-cooling-molding-demolding" through modular integration and dynamic coordination of various functional components. Specifically, the melting component 200 achieves solder melting and quantitative delivery through electromagnetic induction heating and a screw-limited valve ball 209. It cooperates with the negative pressure component 800 to remove air from the cavity before injection, utilizing the pressure difference to enhance the solder filling effect. The mold drum 102 rotates at a constant speed under the multi-stage gear drive of the first drive component 400, causing the cavity 103 to sequentially pass through vacuuming, injection, cooling, and demolding stations. The cooling component 700 uses a circulating cooling medium to gradiently control the solder temperature. The ultrasonic vibration of the vibration component 600 refines the grains and assists in demolding. Finally, the discharge component 300 completes the collection of the solder bars. The entire system achieves high-precision, high-efficiency, and continuous production of environmentally friendly lead-free solder bars through the multi-field coupling of mechanical transmission, temperature control, vibration assistance, and negative pressure assistance. At the same time, the modular design improves the equipment's maintenance convenience and process adaptability.

[0061] The above are all preferred embodiments of the present application, and are not intended to limit the scope of protection of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.

Claims

1. A device for producing and molding environmentally friendly lead-free solder bars for welding electronic components, characterized by: The invention comprises a mold body (101), wherein the upper end of the mold body (101) is connected to a smelting component (200), and the lower end of the mold body (101) is connected to a discharge component (300); the mold body (101) is sealedly connected to a mold drum (102) inside, and a plurality of annular uniformly distributed cavities (103) are provided on the outer surface of the mold drum (102), and the mold drum (102) is transmission-connected to a first drive component (400); a melt flow channel (104) is provided on the top of the mold body (101) and is sealed and connected to the smelting component (200), and the melt flow channel (104) passes through the inner side wall of the mold body (101) and is connected to one of the cavities (103) located in the horizontal direction; a discharge trough (105) is provided at the bottom of the mold body (101), The discharge chute (105) is communicated with the mold cavity (103) located in the vertical direction, and a demoulding assembly (500) is provided inside the mold drum (102) corresponding to the discharge chute (105); a front end cover (106) and a rear end cover (107) are fixedly and sealedly installed at both ends of the mold body (101), and a vibration assembly (600) and a cooling assembly (700) are installed on the front end cover (106) and the rear end cover (107) corresponding to the mold drum (102); a negative pressure assembly (800) is installed on the mold body (101), and the negative pressure assembly (800), the smelting assembly (200), the cooling assembly (700), and the discharge assembly (300) are sequentially arranged on the mold body (101) along the rotation direction of the mold drum (102).

2. The device for producing and forming environmentally friendly lead-free solder bars for electronic component welding according to claim 1, characterized in that: The smelting component (200) comprises a smelting kettle (201), an electromagnetic induction heating coil (202) is installed on the outside of the smelting kettle (201), a kettle cover (203) is fixedly and sealedly installed on the top of the smelting kettle (201), a limiting sleeve (204) is installed in the center of the kettle cover (203), a driving shaft (205) that penetrates the inside of the smelting kettle (201) is slidably connected inside the limiting sleeve (204), a limiting groove (206) is provided on the driving shaft (205), the limiting groove (206) is arranged in a spiral shape, both ends of the limiting groove (206) are provided with annular grooves (207) that are smoothly connected, and a limiting sleeve (204) is installed corresponding to the limiting groove (206). Pin (208), a valve ball (209) is installed at the bottom of the driving shaft (205), a guide tube (210) is fixedly and sealedly installed at the bottom of the smelting kettle (201) corresponding to the molten material flow channel (104), a discharge port (211) corresponding to the valve ball (209) is opened on the bottom surface of the smelting kettle (201), and the discharge port (211) is connected to the guide tube (210), a feed hopper (218) sealed and connected to the smelting kettle (201) is fixedly installed on the kettle cover (203), a second driving component connected to the driving shaft (205) is installed on the kettle cover (203), and a stirring frame (220) is fixedly installed on the driving shaft (205) inside the smelting kettle (201).

3. The device for producing and forming environmentally friendly lead-free solder bars for electronic component welding according to claim 2, characterized in that: The second drive assembly comprises a mounting sleeve (212), the mounting sleeve (212) being fixedly mounted on the kettle cover (203), a transmission sleeve (213) being rotatably connected thereto inside the mounting sleeve (212), an axially arranged spline groove (214) being provided inside the transmission sleeve (213), spline teeth (215) being provided on the driving shaft (205) corresponding to the spline groove (214), a driven gear (216) being fixedly mounted on the outer side of the transmission sleeve (213), a second motor (217) being fixedly mounted on the kettle cover (203), a driving gear (219) being fixedly mounted on the output shaft of the second motor (217), and the driving gear (219) being meshed with the driven gear (216).

4. The device for producing and forming environmentally friendly lead-free solder bars for electronic component welding according to claim 1, characterized in that: The discharging assembly (300) includes a discharging base (301), the discharging base (301) is fixedly mounted on the bottom surface of the mold body (101) corresponding to the discharging trough (105), an active transmission shaft (302) and a passive transmission shaft (303) are mounted on the discharging base (301), an active transmission roller (304) is mounted on the active transmission shaft (302), a passive transmission roller (305) is mounted on the passive transmission shaft (303), a conveyor belt (306) is mounted on the active transmission roller (304) and the passive transmission roller (305), a discharging port (307) is obliquely arranged on the output end of the discharging base (301) corresponding to the output end of the conveyor belt (306); one end of the active transmission shaft (302) passing through the discharging base (301) is transmission-connected to a third driving assembly.

5. The device for producing and forming environmentally friendly lead-free solder bars for electronic component welding according to claim 4, characterized in that: The third driving assembly includes a third motor (309), a third driving pulley (310) is fixedly mounted on the output shaft of the third motor (309), a third driven pulley (308) is fixedly mounted on one end of the driving transmission shaft (302) passing through the discharge base (301), and a third transmission belt (311) is connected between the third driving pulley (310) and the third driven pulley (308).

6. The device for producing and forming environmentally friendly lead-free solder bars for electronic component welding according to claim 1, characterized in that: The first driving assembly (400) includes a first motor (401), a first driving pulley (402) is fixedly mounted on the driving shaft of the first motor (401); a driving shaft (403) that passes through the mold drum (102) is rotatably connected to the front end cover (106) and the rear end cover (107), a first driven pulley (404) is fixedly mounted on the driving shaft (403), and a transmission connection is formed between the first driven pulley (404) and the first driving pulley (402). A first transmission belt (405) is connected, a driving gear (406) is fixedly mounted on the driving shaft (403), a support shaft (407) is fixedly mounted on the front end cover (106) and the rear end cover (107), a transmission gear (408) is rotatably connected to the support shaft (407), an inner gear ring (409) is embedded on the inner side surface of the mold rotating cylinder (102), and the transmission gear (408) is meshed with the driving gear (406) and the inner gear ring (409) for transmission.

7. The device for producing and forming environmentally friendly lead-free solder bars for electronic component welding according to claim 1, characterized in that: The demoulding assembly (500) includes a push block (501), a push block installation cavity (502) is opened on the bottom surface of the mold cavity (103) facing the center of the mold rotating cylinder (102), the push block (501) is sealingly and slidably connected to the inside of the push block installation cavity (502), a push rod (503) is fixedly installed on the push block (501) in the direction toward the center of the mold rotating cylinder (102) and passes through the side wall of the mold rotating cylinder (102), a first magnetic block (504) is fixedly installed on the push rod (503), a return spring (505) is abutted and connected between the first magnetic block (504) and the inner side wall of the mold rotating cylinder (102), a second magnetic block (506) is fixedly installed at a position corresponding to the discharge trough (105) inside the mold rotating cylinder (102), and the second magnetic block (506) and the first magnetic block (504) repel each other.

8. The device for producing and forming environmentally friendly lead-free solder bars for electronic component welding according to claim 1, characterized in that: The vibration assembly (600) includes a vibrator (601), and a plurality of first mounting holes (602) uniformly distributed in an annular manner are provided on the front end cover (106) at one end close to the mold rotating cylinder (102). The vibrator (601) is fixedly installed inside the first mounting hole (602), and the vibrating portion of the vibrator (601) can slidably abut against the end of the mold rotating cylinder (102); a plurality of second mounting holes (603) uniformly distributed in an annular manner are provided on the rear end cover (107) at one end close to the mold rotating cylinder (102), and an abutting spring (604) is fixedly installed inside the second mounting hole (603). An abutting ball (605) is fixedly welded to the end of the abutting spring (604) away from the rear end cover (107), and the abutting ball (605) can also slidably abut against the end of the mold rotating cylinder (102).

9. The device for producing and forming environmentally friendly lead-free solder bars for electronic component welding according to claim 1, characterized in that: The cooling assembly (700) includes a refrigerator (701), wherein a cooling medium is contained inside the refrigerator (701), a cooling medium input pipe (702) and a delivery pump (703) are fixedly connected to the refrigerator (701), and a cooling medium output pipe (704) is fixedly installed on the delivery pump (703); cooling channels (705) are respectively provided on the mold drum (102) between two adjacent cavities (103), and a plurality of delivery channels (706) equidistantly distributed in a semicircular shape are respectively provided on the front cover (106) and the rear cover (107) at both ends of the cooling channels (705), and the delivery channels (706) are correspondingly sealed with the cooling medium input pipe (702) and the cooling medium output pipe (704).

10. The device for producing and forming environmentally friendly lead-free solder bars for electronic component welding according to claim 1, characterized in that: The negative pressure component (800) includes a negative pressure pump (801), a negative pressure adsorption channel (802) is provided on the mold body (101), the negative pressure adsorption channel (802) passes through the side wall of the mold body (101) and is connected to one of the mold cavities (103) that will be connected to the melt flow channel (104), and a negative pressure tube (803) connected to the negative pressure adsorption channel (802) is fixedly and sealedly installed on the mold body (101), and the negative pressure tube (803) is connected to the negative pressure pump (801).

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