Wafer trimming method, system and device
By setting sampling points and interpolation points on the edge of the wafer and performing height reference and interpolation calculations, the problem of low wafer trimming quality is solved, the continuity of the grinding wheel trajectory and the improvement of the trimming effect are achieved, and the close bonding between wafers and the stability of the thinning process are ensured.
CN120696880APending Publication Date: 2025-09-26ZHEJIANG JINGSHENG MECHANICAL & ELECTRICAL CO LTD +2
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Patent Information
- Application Number
- CN202511001356.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-21
- Publication Date
- 2025-09-26
AI Technical Summary
Technical Problem
In the existing technology, the quality of wafer trimming is low, resulting in loose bonding between wafers, affecting the stability of the thinning process and product quality.
Method used
By setting multiple sampling points and interpolation points around the wafer edge, interpolation calculation is performed based on the height reference and the height of the sampling points to determine the grinding wheel feed position, thereby achieving the continuity of the grinding wheel trajectory and improving the trimming quality.
Benefits of technology
The quality of wafer trimming is improved, the possibility of wafer edge collapse and debris is reduced, and the stability of subsequent thinning processes and product yield are ensured.
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Figure CN120696880A_ABST
Abstract
The invention relates to the technical field of semiconductor processing, in particular to a wafer trimming method, system and device, and the method comprises the steps: measuring the height of a rotary table, and determining a height reference; the wafer is arranged on a rotary table, a plurality of sampling points are arranged in the circumferential direction of the edge of the wafer, and the height of the sampling points on the upper surface of the wafer at the sampling points is measured based on the height reference; a plurality of interpolation points are arranged between adjacent sampling points, and the heights of the interpolation points are determined based on the heights of the sampling points of the adjacent sampling points; and based on the sampling point height, the interpolation point height and the target step groove depth, the actual feeding position of the grinding wheel is determined. The technical effect of improving the wafer trimming quality is achieved.
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