Cast aluminum liquid cooling automobile charging module based on semiconductor refrigeration

Abstract

The invention relates to the technical field of charging piles, and discloses a cast aluminum liquid cooling automobile charging module based on semiconductor refrigeration, which comprises a charging pile and a charging gun connected with the charging pile, a power supply unit and a liquid cooling circulation unit are arranged in the charging pile, and the charging gun is connected with the charging pile through a soft connecting pipe. A wire harness connected with the charging gun is arranged in the soft connecting pipe, one end of the wire harness is connected with the power supply unit, the other end of the wire harness is connected with the charging gun, a liquid cooling circulating pipeline assembly is further arranged in the soft connecting pipe, and the liquid cooling circulating pipeline assembly is connected with a semiconductor composite refrigeration unit arranged at the head of the charging gun. The new energy vehicle charging system has the beneficial effects that the power supply unit is used for converting electric energy, a new energy vehicle can be charged through the charging gun, the liquid cooling circulation unit is used for circulating a liquid cooling medium, the power supply unit and the charging gun can be electrically connected through the wire harness, the new energy vehicle is charged, and a control signal lamp is transmitted; cooling can be accelerated through liquid cooling and semiconductor refrigeration, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of new energy vehicle charging equipment, and in particular to a cast aluminum liquid-cooled vehicle charging module based on semiconductor refrigeration. Background Art

[0002] Charging piles serve as "gas stations" for new energy vehicles. To meet the demand for "fast charging", the output power continues to increase. With the evolution trend of miniaturization and integration, the heat flux density of the charging system has increased significantly, and the system safety faces major challenges.

[0003] The existing mainstream solution generally uses liquid cooling to dissipate heat from high-power charging connectors. The plug of the charging gun head is designed with a heat conduction module with an internal flow channel. The plug is cooled by introducing the cooling medium into the heat conduction module. The power cable is cooled through the liquid inlet and outlet pipes connecting the heat conduction module to the external cold source.

[0004] However, the above-mentioned solution for heat dissipation still has the problem of low heat dissipation efficiency. Summary of the Invention

[0005] The main inventive concept of this application is as follows: liquid cooling is combined with semiconductor refrigeration. Liquid cooling can cool the wiring harness and the charging plug. At the same time, semiconductor refrigeration is combined to accelerate heat conduction, thereby improving heat dissipation efficiency.

[0006] To this end, the present application provides a cast aluminum liquid-cooled automobile charging module based on semiconductor refrigeration, which is characterized in that it includes a charging pile and a charging gun connected to the charging pile, the charging pile is provided with a power supply unit and a liquid cooling circulation unit, the charging gun and the charging pile are connected by a soft connecting pipe, the soft connecting pipe is provided with a wiring harness connected to the charging gun, one end of the wiring harness is connected to the power supply unit, and the other end is connected to the charging gun, the soft connecting pipe is also provided with a liquid cooling circulation pipe assembly, and the liquid cooling circulation pipe assembly is connected to the semiconductor composite refrigeration unit arranged at the head of the charging gun.

[0007] By adopting the above technical solution: the power supply unit is used to convert electrical energy, and the new energy vehicle can be charged through the charging gun. The liquid cooling circulation unit is used to circulate the liquid cooling medium. The wiring harness can electrically connect the power supply unit and the charging gun to charge the new energy vehicle and transmit the control signal light. Liquid cooling and semiconductor refrigeration can accelerate the cooling and improve the heat dissipation efficiency.

[0008] Optionally, the charging gun includes a shell and a charging plug, the charging plug is embedded in the shell, and the semiconductor composite refrigeration unit is arranged between the charging plug and the shell.

[0009] By adopting the above technical solution, the heat of the charging plug can be promptly dissipated through the semiconductor composite refrigeration unit to prevent the charging plug from overheating.

[0010] Optionally, the semiconductor composite refrigeration unit includes a cast aluminum liquid cooling element fixed between the housing and the charging plug and a semiconductor refrigeration array arrayed inside the cast aluminum liquid cooling element.

[0011] By adopting the above technical solution: the cast aluminum liquid cooling part and the semiconductor refrigeration array arrayed inside the cast aluminum liquid cooling part can efficiently transfer heat and prevent the charging plug from overheating and causing damage.

[0012] Optionally, the cast aluminum liquid cooling component includes a cast aluminum integrated liquid cooling base plate fixed inside the shell, and the cast aluminum integrated liquid cooling base plate has a liquid cooling medium cavity inside.

[0013] By adopting the above technical solution: the cast aluminum integrated liquid cooling base plate is used for circulating liquid cooling medium and for array installation of semiconductor refrigeration components, and the two cooperate to achieve efficient heat dissipation.

[0014] Optionally, the cast aluminum integrated liquid cooling base plate is connected to a first liquid cooling pipe and a second liquid cooling pipe, and a plurality of branch pipes are connected between the first liquid cooling pipe and the second liquid cooling pipe, and the plurality of branch pipes are wound around the charging plug.

[0015] By adopting the above technical solution: the front section of the charging plug can be quickly cooled by the first liquid cooling tube, the second liquid cooling tube and the multiple branch tubes wound around the charging plug, thereby improving the heat dissipation efficiency.

[0016] Optionally, the charging plug is embedded in the shell, a heat-conducting substrate is provided between the end of the charging plug and the outside, the cold end of the semiconductor refrigeration array is fixed inside the heat-conducting substrate, and the hot end is embedded in the cast aluminum integrated liquid cooling substrate.

[0017] By adopting the above technical solution: the cold end transfers heat to the hot end, the hot end is embedded in the cast aluminum integrated liquid cooling base plate and dissipates heat through the liquid cooling medium, and the wiring harness also includes power lines that supply power to the semiconductor array.

[0018] Optionally, a plurality of heat-conducting base columns for fixing the semiconductor refrigeration array are provided at one end of the cast aluminum integrated liquid-cooling base plate facing the heat-conducting base plate, and the heat-conducting base columns are embedded in the cast aluminum integrated liquid-cooling base plate.

[0019] By adopting the above technical solution, heat can be conducted through the heat-conducting base column and the semiconductor refrigeration component can be fixed.

[0020] Optionally, the heat-conducting base column is located on one end of the inner side of the cast aluminum integrated liquid-cooling base plate and is connected to a heat-conducting fin.

[0021] Optionally, the heat conducting fins are arranged to be inclined upward.

[0022] By adopting the above technical solution: by arranging heat-conducting fins, the heat-conducting fins are tilted upward to face the liquid cooling medium, thereby further improving the heat conduction efficiency.

[0023] Optionally, the liquid cooling circulation pipe assembly includes a liquid inlet pipe and a liquid outlet pipe connected to the liquid cooling medium cavity, the liquid inlet pipe and the liquid outlet pipe are connected to the liquid cooling circulation unit, and the liquid inlet pipe and the liquid outlet pipe are staggered and wound around the outer periphery of the wiring harness.

[0024] By adopting the above technical solution, the wiring harness can be cooled in a coordinated manner to improve the overall cooling efficiency.

[0025] The working principle and beneficial effects of this application are: 1. The power supply unit of this application is used to convert electrical energy and can charge new energy vehicles through a charging gun. The liquid cooling circulation unit is used to circulate liquid cooling medium. The wiring harness can electrically connect the power supply unit with the charging gun to charge the new energy vehicle and transmit control signal lights. Liquid cooling and semiconductor refrigeration can accelerate cooling and improve heat dissipation efficiency.

[0026] 2. The present application uses the first liquid cooling tube, the second liquid cooling tube, and multiple branch tubes wound around the charging plug to quickly cool the front section of the charging plug, thereby improving heat dissipation efficiency.

[0027] 3. This application can also collaboratively dissipate heat for the wiring harness, thereby improving the overall heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The present application will be further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0029] Figure 1 This is a schematic diagram of the overall structure of an embodiment of the present application; Figure 2 This is a schematic structural diagram of a charging gun according to an embodiment of the present application; Figure 3 For the embodiment of this application Figure 2 A in the middle is an enlarged structural diagram; The various features in the drawings are marked as follows: 100. Charging pile; 200. Charging gun; 210. Housing; 220. Charging plug; 300. Power supply unit; 400. Liquid cooling circulation unit; 500. Soft connecting pipe; 600. Wiring harness; 700. Liquid cooling circulation pipe assembly; 710. Liquid inlet pipe; 720. Liquid outlet pipe; 800. Semiconductor composite refrigeration unit; 810. Cast aluminum liquid cooling part; 811. Cast aluminum integrated liquid cooling base plate; 812. Liquid cooling medium cavity; 820. Semiconductor refrigeration array; 830. First liquid cooling pipe; 840. Second liquid cooling pipe; 850. Branch pipe; 860. Thermal conductive base plate; 870. Thermal conductive base column; 880. Thermal conductive fin. DETAILED DESCRIPTION

[0030] The following will be combined with the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of the present invention.

[0031] The main inventive concept of this embodiment is as follows: liquid cooling is combined with semiconductor cooling. Liquid cooling can cool the wiring harness 600 and the charging plug 220. At the same time, semiconductor cooling is combined to accelerate heat conduction, thereby improving heat dissipation efficiency.

[0032] Reference 1- Figure 3 This embodiment provides a cast aluminum liquid-cooled automobile charging module based on semiconductor refrigeration, including a charging pile 100 and a charging gun 200 connected to the charging pile 100. The charging pile 100 is provided with a power supply unit 300 and a liquid cooling circulation unit 400. The charging gun 200 is connected to the charging pile 100 through a soft connecting pipe 500. The soft connecting pipe 500 is provided with a wiring harness 600 connected to the charging gun 200. One end of the wiring harness 600 is connected to the power supply unit 300, and the other end is connected to the charging gun 200. The soft connecting pipe 500 is also provided with a liquid cooling circulation pipe assembly 700, and the liquid cooling circulation pipe assembly 700 is connected to the semiconductor composite refrigeration unit 800 arranged at the head of the charging gun 200.

[0033] The basic principle of this embodiment is as follows: the power supply unit 300 is used to convert electrical energy, and the new energy vehicle can be charged through the charging gun 200. The liquid cooling circulation unit 400 is used to circulate the liquid cooling medium. The wiring harness 600 can electrically connect the power supply unit 300 with the charging gun 200 to charge the new energy vehicle and transmit control signal lights. Liquid cooling and semiconductor refrigeration can accelerate cooling and improve heat dissipation efficiency.

[0034] In this embodiment, the charging gun 200 includes a housing 210 and a charging plug 220. The charging plug 220 is embedded in the housing 210, and the semiconductor composite refrigeration unit 800 is disposed between the charging plug 220 and the housing 210. The semiconductor composite refrigeration unit 800 can promptly dissipate heat from the charging plug 220 to prevent overheating.

[0035] In this embodiment, the semiconductor composite refrigeration unit 800 includes a cast aluminum liquid cooling element 810 fixed between the housing 210 and the charging plug 220 and a semiconductor cooling array 820 arrayed inside the cast aluminum liquid cooling element 810; the cast aluminum liquid cooling element 810 and the semiconductor cooling array 820 arrayed inside the cast aluminum liquid cooling element 810 can efficiently transfer heat to prevent the charging plug 220 from overheating and causing damage.

[0036] In this embodiment, the cast aluminum liquid cooling component 810 includes a cast aluminum integrated liquid cooling substrate 811 fixed inside the shell 210, and the cast aluminum integrated liquid cooling substrate 811 has a liquid cooling medium cavity 812 inside; the cast aluminum integrated liquid cooling substrate 811 is used for circulating liquid cooling medium and for array installation of semiconductor refrigeration components, and the two cooperate to achieve efficient heat dissipation.

[0037] In this embodiment, the cast aluminum integrated liquid-cooling base plate 811 is connected to a first liquid-cooling tube 830 and a second liquid-cooling tube 840, and a plurality of branch tubes 850 are connected between the first liquid-cooling tube 830 and the second liquid-cooling tube 840, and the plurality of branch tubes 850 are wound around the charging plug 220; through the first liquid-cooling tube 830 and the second liquid-cooling tube 840 and the plurality of branch tubes 850 wound around the charging plug 220, the front section of the charging plug 220 can be quickly cooled, thereby improving the heat dissipation efficiency.

[0038] In this embodiment, the charging plug 220 is embedded in the interior of the housing 210, and a heat-conducting substrate 860 is provided between the end of the charging plug 220 and the outside. The cold end of the semiconductor refrigeration array 820 is fixed inside the heat-conducting substrate 860, and the hot end is embedded in the cast aluminum integrated liquid-cooling substrate 811; the cold end transfers heat to the hot end, and the hot end is embedded in the cast aluminum integrated liquid-cooling substrate 811 to dissipate heat through a liquid cooling medium. The wiring harness 600 also includes a power line for supplying power to the semiconductor array.

[0039] In this embodiment, a plurality of heat-conducting base columns 870 for fixing the semiconductor refrigeration array 820 are provided on one end of the cast aluminum integrated liquid-cooling substrate 811 facing the heat-conducting substrate 860, and the heat-conducting base columns 870 are embedded in the cast aluminum integrated liquid-cooling substrate 811; the heat-conducting base columns 870 can conduct heat and fix the semiconductor refrigeration components.

[0040] In this embodiment, the heat-conducting base column 870 is located on the inner end of the cast aluminum integrated liquid-cooling base plate 811 and is connected to a heat-conducting fin 880; the heat-conducting fin 880 is arranged to be tilted upward; by setting the heat-conducting fin 880, the heat-conducting fin 880 can be tilted upward to face the liquid cooling medium, thereby further improving the heat conduction efficiency.

[0041] In this embodiment, the liquid cooling circulation pipe assembly 700 includes a liquid inlet pipe 710 and a liquid outlet pipe 720 connected to the liquid cooling medium cavity 812. The liquid inlet pipe 710 and the liquid outlet pipe 720 are connected to the liquid cooling circulation unit 400. The liquid inlet pipe 710 and the liquid outlet pipe 720 are staggered around the outer periphery of the wiring harness 600. They can synergistically dissipate heat for the wiring harness 600 to improve the overall heat dissipation efficiency.

[0042] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. Cast aluminum liquid-cooled automobile charging module based on semiconductor refrigeration, characterized in that: The invention comprises a charging pile (100) and a charging gun (200) connected to the charging pile (100), wherein a power supply unit (300) and a liquid cooling circulation unit (400) are provided inside the charging pile (100), and the charging gun (200) and the charging pile (100) are connected via a soft connecting pipe (500), wherein a wiring harness (600) connected to the charging gun (200) is provided inside the soft connecting pipe (500), wherein one end of the wiring harness (600) is connected to the power supply unit (300) and the other end is connected to the charging gun (200), and a liquid cooling circulation pipe assembly (700) is further provided inside the soft connecting pipe (500), and the liquid cooling circulation pipe assembly (700) is connected to a semiconductor composite refrigeration unit (800) provided at the head of the charging gun (200).

2. The cast aluminum liquid-cooled automobile charging module based on semiconductor refrigeration according to claim 1 is characterized in that: The charging gun (200) comprises a housing (210) and a charging plug (220), wherein the charging plug (220) is embedded in the housing (210), and the semiconductor composite refrigeration unit (800) is arranged between the charging plug (220) and the housing (210).

3. The cast aluminum liquid-cooled automobile charging module based on semiconductor refrigeration according to claim 2, characterized in that: The semiconductor composite refrigeration unit (800) comprises a cast aluminum liquid cooling component (810) fixed between a housing (210) and a charging plug (220), and a semiconductor refrigeration array (820) arrayed inside the cast aluminum liquid cooling component (810).

4. The cast aluminum liquid-cooled automobile charging module based on semiconductor refrigeration according to claim 3 is characterized in that: The cast aluminum liquid cooling component (810) comprises a cast aluminum integrated liquid cooling base plate (811) fixed inside the housing (210), and a liquid cooling medium cavity (812) is provided inside the cast aluminum integrated liquid cooling base plate (811).

5. The cast aluminum liquid-cooled automobile charging module based on semiconductor refrigeration according to claim 4 is characterized in that: The cast aluminum integrated liquid cooling base plate (811) is connected to a first liquid cooling pipe (830) and a second liquid cooling pipe (840), and a plurality of branch pipes (850) are connected between the first liquid cooling pipe (830) and the second liquid cooling pipe (840), and the plurality of branch pipes (850) are wound around the charging plug (220).

6. The cast aluminum liquid-cooled automobile charging module based on semiconductor refrigeration according to claim 5 is characterized in that: The charging plug (220) is embedded in the housing (210); a heat-conducting substrate (860) is provided between the end of the charging plug (220) and the outside; the cold end of the semiconductor refrigeration array (820) is fixed inside the heat-conducting substrate (860); and the hot end is embedded in the cast aluminum integrated liquid cooling substrate (811).

7. The cast aluminum liquid-cooled automobile charging module based on semiconductor refrigeration according to claim 6 is characterized in that: A plurality of heat-conducting base columns (870) for fixing the semiconductor refrigeration array (820) are provided at one end of the cast aluminum integrated liquid-cooling base plate (811) facing the heat-conducting base plate (860), and the heat-conducting base columns (870) are embedded in the cast aluminum integrated liquid-cooling base plate (811).

8. The semiconductor refrigeration-based cast aluminum liquid-cooled automobile charging module according to claim 7, characterized in that: The heat-conducting base column (870) is located on the inner side of the cast aluminum integrated liquid cooling base plate (811), and one end thereof is connected to a heat-conducting fin (880).

9. The cast aluminum liquid-cooled automobile charging module based on semiconductor refrigeration according to claim 8, characterized in that: The heat-conducting fins (880) are arranged to be inclined upward.

10. The cast aluminum liquid-cooled automobile charging module based on semiconductor refrigeration according to any one of claims 4 to 9, characterized in that: The liquid cooling circulation pipe assembly (700) comprises a liquid inlet pipe (710) and a liquid outlet pipe (720) connected to the liquid cooling medium cavity (812); the liquid inlet pipe (710) and the liquid outlet pipe (720) are connected to the liquid cooling circulation unit (400); and the liquid inlet pipe (710) and the liquid outlet pipe (720) are staggered and wound around the outer periphery of the wiring harness (600).

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