Damping finger adjusting method and device, and wafer flatness detection device and method

Abstract

The invention relates to a damping finger adjusting method and device and a wafer flatness detection method and device, a damping finger is used for damping and buffering a wafer in the wafer flatness detection process, and the damping finger adjusting method is used for adjusting the motion state of the damping finger. The damping finger adjusting method comprises the following steps: fixing a wafer and a damping finger on a carrying table, and enabling the wafer and the damping finger to be kept in the same plane; external force is applied to the free end of the damping finger, so that the damping finger rotates around the fixed end of the damping finger by a preset angle in the direction away from the wafer; after the external force is removed, the free end of the damping finger rebounds towards the direction close to the wafer; obtaining wafer morphology information corresponding to different motion states of the damping finger; and selecting parameter information of the damping finger corresponding to the wafer morphology information with the best stability in the obtained multiple pieces of wafer morphology information, and taking the parameter information as adjustment standard parameter information of the damping finger.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor product detection, and in particular to a damping finger adjustment method and device, and a wafer flatness detection device and method. Background Art

[0002] With the continuous optimization of semiconductor wafer manufacturing processes, requirements for wafer topography are becoming increasingly stringent. The WS2+ (Fizeau interferometer) is a high-precision device and a crucial tool for inspecting wafer topography and flatness. However, due to its high precision, the device is susceptible to external vibrations. Therefore, the WS2+ incorporates internal vibration damping devices to counteract the effects of external vibrations on inspection data. The Damping Finger is one such damping device.

[0003] The Damping Finger works by repeatedly tapping a spring to dampen vibrations on the wafer surface. Because the Damping Finger is a frequently moving component within the device, the initial position and state of the spring become unstable with increasing movement, necessitating periodic adjustments. Adjustments require rotational adjustments to the initial position based on the current hardware state. Currently, the adjustment standard is not fixed, and data verification is required after each fine-tuning. This high frequency of adjustments and data verifications often results in a time consumption exceeding 8 hours, resulting in low efficiency. Summary of the Invention

[0004] In order to solve the above technical problems, the present invention provides a damping finger adjustment method and device, and a wafer flatness detection device and method to solve the problem of frequent damping finger adjustment and low efficiency.

[0005] To achieve the above-mentioned objectives, the technical solution adopted in an embodiment of the present invention is: a method for adjusting a damping finger, wherein the damping finger is used to provide shock absorption and buffering for a wafer during wafer flatness testing. The method for adjusting the damping finger is used to adjust the motion state of the damping finger, and the method for adjusting the damping finger comprises the following steps:

[0006] Fixing the wafer and the damping finger on a carrier so that the wafer and the damping finger remain in the same plane;

[0007] Applying an external force to the free end of the damping finger so that the damping finger rotates around its fixed end and in a direction away from the wafer by a preset angle;

[0008] After the external force is removed, the free end of the damping finger rebounds toward the wafer;

[0009] Acquiring wafer morphology information corresponding to different motion states of the damping finger;

[0010] The parameter information of the damping finger corresponding to the wafer topography information with the best stability among the plurality of wafer topography information obtained is selected, and the parameter information is used as the adjustment standard parameter information of the damping finger.

[0011] Optionally, before obtaining the wafer morphology information of the free end of the damping finger moving in the direction close to the wafer and bouncing back different times after first contacting the wafer, it also includes obtaining the motion state of the damping finger and making the motion state of the damping finger meet the preset conditions, and the preset conditions include: after the external force is removed, the free end of the damping finger rebounds in the direction close to the wafer and can contact the wafer.

[0012] Optionally, the preset condition includes: after the external force is removed, the free end of the damping finger rebounds in a direction close to the wafer, and does not stop moving after contacting the wafer.

[0013] Optionally, the preset condition includes: after the external force is removed, the free end of the damping finger rebounds in a direction close to the wafer, can contact the wafer, and rotates in the opposite direction again, but will not move endlessly.

[0014] Optionally, obtaining the wafer morphology information corresponding to different motion states of the damping finger specifically includes: obtaining the wafer morphology information under different rebound times of the damping finger.

[0015] Optionally, the movement conversion of the damping finger corresponding to the wafer morphology information with the best stability among the multiple wafer morphology information obtained is that after the external force is removed, the optimal number of times the damping finger can contact the wafer and bounce back is 1-7 times.

[0016] Optionally, before applying external force to the free end of the damping finger, the method further includes the following steps:

[0017] The carrier is rotated so that a preset angle exists between the plane where the wafer and the damping fingers are located and the horizontal plane.

[0018] Optionally, the preset angle is 10-20 degrees.

[0019] Optionally, in an initial state, the extension direction of the damping fingers is parallel to the tangent direction of the wafer.

[0020] Optionally, in an initial state, there is a gap between the damping finger and the wafer.

[0021] An embodiment of the present invention further provides a damping finger adjustment device, comprising:

[0022] A carrier, used to carry and fix the wafer and the damping fingers, wherein the carrier is a hollow structure so as to expose the central area of ​​the wafer when fixing the wafer;

[0023] The moving structure is used to control one side of the platform to rise so that a preset angle is formed between the platform and the horizontal plane.

[0024] An embodiment of the present invention further provides a wafer flatness detection device, comprising:

[0025] The damping finger adjustment device is used to adjust the motion state of the damping finger;

[0026] The wafer morphology information acquisition device is used to acquire the morphology information of the wafer to detect the flatness of the wafer.

[0027] An embodiment of the present invention further provides a wafer flatness detection method, which is applied to the above-mentioned wafer flatness detection device, and includes the following steps:

[0028] Adjusting the motion state of the damping finger by the above-mentioned adjustment method of the damping finger;

[0029] placing the wafer vertically;

[0030] Obtain wafer topography information to detect wafer flatness.

[0031] The beneficial effects of the present invention are as follows: an embodiment of the present invention provides a damping finger adjustment method, which is used to adjust the state of the damping finger before detecting the flatness of the wafer, obtain standard parameter information of the damping finger, and directly adjust the damping finger according to the standard parameter information without the need for multiple verifications, thereby improving the adjustment efficiency of the damping finger, ensuring the stability of the motion state of the damping finger, and thus ensuring the stability of the wafer morphology data, and improving the accuracy of wafer flatness detection. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 Schematic diagram showing the damping finger;

[0033] Figure 2 Schematic diagram showing the contact between the damping finger and the wafer;

[0034] Figure 3 Schematic diagram showing the motion state of the damped finger;

[0035] Figure 4 Schematic diagram showing wafer morphology obtained by damping fingers corresponding to different states;

[0036] Figure 5 A flowchart showing the adjustment method of the damping finger. DETAILED DESCRIPTION

[0037] To make the purpose, technical solutions, and advantages of the embodiments of the present disclosure more clear, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0038] Unless otherwise defined, the technical or scientific terms used in this disclosure should have the usual meanings understood by people with ordinary skills in the field to which this disclosure belongs. The words "first", "second" and similar words used in this disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, words such as "one", "an" or "the" do not indicate a quantity limitation, but rather indicate the existence of at least one. Words such as "include" or "comprise" mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Words such as "connect" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0039] As used in the embodiments of the present disclosure, the terms "parallel," "perpendicular," and "identical" include the strict sense of "parallel," "perpendicular," and "identical," as well as "approximately parallel," "approximately perpendicular," and "approximately identical" with respect to a certain tolerance, which, taking into account the tolerances associated with the measurement of a particular quantity (e.g., limitations of the measurement system), means within an acceptable range of deviation for a particular value as determined by one of ordinary skill in the art. For example, "approximately" can mean within one or more standard deviations, or within 3% or 5% of the stated value.

[0040] In addition, in this document, unless otherwise defined, the terms "substantially," "essentially," "approximately," and "about" are used to describe and explain small variations. When used in connection with an event or circumstance, these terms can encompass situations where the event or circumstance occurs exactly, as well as situations where the event or circumstance occurs approximately. For example, when used in connection with a numerical value, these terms can include a range of variation of less than or equal to 10% of the numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, less than or equal to ±0.05%. The term "substantially coplanar" can refer to two surfaces being aligned along the same plane within the micrometer range, for example, within 40 μm, 30 μm, 20 μm, 10 μm, or 1 μm.

[0041] Figure 1 The figure is a schematic diagram of a damping finger in the related art. The damping finger 1 includes a bar-shaped body 11 and a damping portion 12 fixedly connected to one end of the bar-shaped body 11. The bar-shaped body 11 is provided with a fixing hole 111 at the fixed end away from the damping portion 12. The fixing hole cooperates with a fixing screw to fix the bar-shaped body 11 in a preset position. A spring is provided in the fixed end so that the bar-shaped body 11 can reciprocate around the fixed end (rotate in a plane parallel to the wafer surface, refer to Figure 2 ), so that the damping part 12 rotates to contact the side of the wafer multiple times to reduce the vibration of the wafer.

[0042] The instability of the Damping Finger has a significant impact on the data detected by the WS2+ (Fizeau interferometer) device, especially the stability of the wafer's nanotopography (NT) data. When the damping finger is unstable, the wafer's nanotopography (NT) data will fluctuate significantly. The stability of the damping finger will have a significant impact on product testing, yield, etc.

[0043] Because the damping finger is a frequently moving component within the device, the initial position and state of its spring become unstable with increasing movement frequency, necessitating periodic adjustment. Adjustment requires rotating the damping finger to its initial position based on the current hardware state. Currently, there are no fixed standards for adjusting the damping finger, and data verification is required after each fine-tuning. This frequent adjustment of the damping finger requires a high number of data verifications, resulting in a long process, typically exceeding 8 hours, and low efficiency.

[0044] refer to Figure 1-Figure 5To address the above-mentioned issues, an embodiment of the present invention provides a method for adjusting a damping finger 1. The damping finger 1 is used to provide shock absorption and buffering for the wafer 2 during the flatness detection process of the wafer 2. The method for adjusting the damping finger 1 is used to adjust the motion state of the damping finger 1. The method for adjusting the damping finger 1 includes the following steps:

[0045] Fixing the wafer 2 and the damping finger 1 on the carrier 3 so that the wafer 2 and the damping finger 1 remain in the same plane;

[0046] Applying an external force to the free end of the damping finger 1 so that the damping finger 1 rotates around its fixed end and in a direction away from the wafer 2 by a preset angle;

[0047] After the external force is removed, the free end of the damping finger 1 rebounds toward the wafer 2;

[0048] Acquiring topography information of the wafer 2 corresponding to different motion states of the damping finger 1;

[0049] The parameter information of the damping finger 1 corresponding to the wafer 2 profile information with the best stability among the multiple wafer 2 profile information obtained is selected, and the parameter information is used as the adjustment standard parameter information of the damping finger 1.

[0050] refer to Figure 1 and Figure 2 The damping finger 1 is a bar structure with a built-in spring, so that after the fixed end of the damping finger 1 is fixed, the damping finger 1 can rotate around its fixed end and rebound under the action of the spring, and move repeatedly multiple times, multiple times contacting the wafer 2 to tap the wafer 2 multiple times, so as to play a shock-absorbing and buffering role on the wafer 2, thereby suppressing the vibration of the surface of the wafer 2 and improving the stability of the surface morphology data of the wafer 2.

[0051] When the damping finger 1 is in the initial state, the fixed end of the damping finger 1 is fixed on the carrier 3 and is located on one side of the wafer 2. The damping finger 1 and the wafer 2 are in the same plane, and the extension direction of the damping finger 1 is parallel to the tangent direction of the wafer 2.

[0052] After the wafer 2 and the damping finger 1 are pre-processed as described above, an external force is applied to the damping finger 1 so that the free end of the damping finger 1 can move to a first position in a direction away from the wafer 2 and in a direction parallel to the surface of the wafer 2. Figure 3 is a schematic diagram of the movement state of the damping finger 1 under the action of external force, Figure 3The arrow in the figure indicates the direction of movement of the damping finger 1 under the action of an external force. After the external force is removed, the damping finger 1 can repeatedly move between the initial position and the first position under the elastic force of the damping finger 1's own spring. After the external force is removed, the wafer 2 morphology information corresponding to the different movement states of the damping finger 1 is obtained; the parameter information of the damping finger 1 corresponding to the wafer 2 morphology information with the best stability among the multiple pieces of wafer 2 morphology information obtained is selected, and this parameter information is used as the standard parameter information for adjusting the damping finger 1. The acquisition of the standard parameter information for adjusting the damping finger 1 can improve the efficiency of adjusting the movement state of the damping finger 1. When the damping finger 1 becomes unstable, it can be adjusted with reference to the standard parameter information without the need for re-verification, which is quick and efficient.

[0053] In an exemplary embodiment, before obtaining wafer 2 topography information of the free end of the damping finger 1 moving toward the wafer 2 and then rebounding a different number of times after initial contact with the wafer 2, the method further includes obtaining the motion state of the damping finger 1 and ensuring that the motion state of the damping finger 1 satisfies a predetermined condition. The predetermined condition includes: after the external force is removed, the free end of the damping finger 1 rebounds toward the wafer 2 and contacts the wafer 2. The function of the damping finger 1 is to reduce shock to the wafer 2; therefore, the damping finger 1 must be able to contact the wafer 2 upon rebound. If the damping finger 1 fails to contact the wafer 2 upon rebound, the parameters of the damping finger 1 may need to be adjusted, such as adjusting the initial position information of the damping finger 1 to reduce the distance between the damping finger 1 and the wafer 2 in the initial state of the damping finger 1. In some embodiments, the damping finger 1 may be in contact with the side surface of the wafer 2 in the initial state, but this is not limited to this. In some embodiments, the external force applied to the damping finger 1 may be increased (ie, the initial rotation angle of the damping finger 1 is increased) so that the damping finger 1 can contact the side surface of the wafer 2 when rebounding.

[0054] In an exemplary embodiment, the preset condition includes: after the external force is removed, the free end of the damping finger 1 rebounds in a direction close to the wafer 2 and does not stop moving after contacting the wafer 2.

[0055] When performing a flatness test on the wafer 2, the damping finger 1 is required to contact the wafer 2 multiple times during the test process to suppress vibrations on the surface of the wafer 2 and ensure the stability of the acquired surface topography data of the wafer 2. Therefore, after the external force is removed, the damping finger 1, under the elastic action of the spring, moves toward the wafer 2 and, after the first contact with the wafer 2, needs to be able to rebound again to move away from the wafer 2. If the damping finger 1 moves toward the wafer 2 and stops moving after the first contact with the wafer 2, the parameter information of the damping finger 1 needs to be adjusted, for example, by increasing the force applied to the damping finger 1 or reducing the distance between the damping finger 1 and the wafer 2 in the initial state.

[0056] In an exemplary embodiment, the preset conditions include: after the external force is removed, the free end of the damping finger 1 rebounds toward the wafer 2, contacts the wafer 2, and rotates in the opposite direction again, but does not move endlessly.

[0057] If the damping fingers 1 experience excessive back-and-forth motion, i.e., the frequency of contact between the damping fingers 1 and the wafer 2 is too high, the fluctuation of the topography data of the wafer 2 may increase. Therefore, it is necessary to control the number of rebounds of the damping fingers 1 within a preset range after the external force is removed. In some embodiments, if the damping fingers 1 experience excessive rebounds after the external force is removed, the force applied to the damping fingers 1 or the initial distance between the damping fingers 1 and the wafer 2 can be reduced to minimize the rebounds.

[0058] It should be noted that in order to ensure that the damping finger 1 has a shock-absorbing effect on the wafer 2, the damping finger 1 needs to be able to contact the side of the wafer 2 when moving from the first position toward the direction close to the wafer 2, and the contact force between the damping finger 1 and the wafer 2 cannot be too large, so as to avoid not only failing to have a shock-absorbing effect on the wafer 2, but also increasing the vibration of the wafer 2. Preferably, when the damping finger 1 moves and rebounds in the direction close to the wafer 2, the damping finger 1 just contacts the side of the wafer 2 to suppress the vibration of the wafer surface, but will not cause the position of the wafer to be offset, let alone damage the wafer. At this time, the force applied by the damping finger 1 to the wafer is a threshold value. For example, the threshold value can be zero, that is, the force applied to the side of the wafer 2 is zero.

[0059] In an exemplary embodiment, obtaining the topography information of the wafer 2 corresponding to different motion states of the damping finger 1 specifically includes: obtaining the topography information of the wafer 2 under different rebound times of the damping finger 1 .

[0060] After the external force is removed, the damping finger 1 rebounds in the direction close to the wafer 2. After the damping finger 1 contacts the wafer 2 for the first time, it needs to be able to bounce again and cannot stop moving. After the external force is removed, the damping finger 1 repeatedly moves in the direction close to the wafer 2 and in the direction away from the wafer 2. The number of movements cannot be too many. According to data verification, after the external force is removed, the number of times the damping finger 1 contacts the wafer 2 and bounces is too few or too many, which will increase the volatility of the surface morphology data of the wafer 2. In some embodiments, the current damping finger 1 can be judged by obtaining the surface morphology data of the wafer 2 during the adjustment of the damping finger 1. Whether the motion state of finger 1 meets the requirements, in order to find the optimal number of times that the damping finger 1 can contact the wafer 2 and bounce back again after the external force is removed, multiple tests can be performed to obtain multiple surface morphology data of wafer 2 under different motion states of the damping finger 1, and analyze them. For example, the surface morphology data of wafer 2 can be obtained when the damping finger 1 contacts the wafer 2 and rebounds zero times after the external force is removed, the surface morphology data of wafer 2 can be obtained when the damping finger 1 contacts the wafer 2 and rebounds more than 7 times after the external force is removed, the surface morphology data of wafer 2 can be obtained when the damping finger 1 contacts the wafer 2 and rebounds zero times after the external force is removed, and the surface morphology data of wafer 2 can be obtained when the damping finger 1 contacts the wafer 2 and rebounds zero times after the external force is removed. Figure 4 ,from Figure 4 It can be seen that when the number of rebounds from damping finger 1 contacting wafer 2 after the external force is removed is zero, or when the number of rebounds from damping finger 1 contacting wafer 2 exceeds 7, the surface topography data of wafer 2 fluctuates greatly, even exceeding the allowable data limit. When the number of rebounds from damping finger 1 contacting wafer 2 after the external force is removed is between 1 and 7, the surface topography data of wafer 2 is relatively stable. Figure 4 In the figure, the yellow straight line UCL and the light blue straight line LCL are the preset upper and lower limits of the wafer morphology data, respectively. The dark blue curve △ represents the wafer morphology data (such as surface flatness) obtained by simulation. It can be seen from the dark blue curve △ that after the external force is removed, when the number of rebounds of the damping finger 1 contacting the wafer 2 is 1-7 times, the dark blue curve is relatively stable.

[0061] In summary, the motion state of the damping finger 1 corresponding to the wafer 2 topography information with the best stability among the multiple wafer 2 topography information obtained is that, after the external force is removed, the optimal number of times the damping finger 1 can contact the wafer 2 and bounce back is 1-7. The parameter information of the damping finger 1 corresponding to the optimal number of times the damping finger 1 can contact the wafer 2 and bounce back after the external force is removed, which is 1-7, can be used as standard parameter information. This standard parameter information includes information about the initial position of the damping finger 1, the magnitude of the initial external force applied to the damping finger 1, and other information.

[0062] In an exemplary embodiment, before applying external force to the free end of the damping finger 1, the following steps are further included:

[0063] The stage 3 is rotated so that a preset angle exists between the plane where the wafer 2 and the damping finger 1 are located and the horizontal plane.

[0064] In an exemplary embodiment, the preset angle is 10-20 degrees.

[0065] When testing the flatness of wafer 2, wafer 2 is placed vertically, and the damping finger 1 and wafer 2 are located in the same plane. Then, the damping finger 1 will be affected by its own gravity. In order to improve the accuracy of adjusting the standard parameter information of the damping finger 1, the carrier 3 is rotated by a preset angle so that the damping finger 1 has a certain gravity and will not cause damage to the wafer 2 during the adjustment process.

[0066] In an exemplary embodiment, in an initial state, the extension direction of the damping finger 1 is parallel to the tangent direction of the wafer 2 .

[0067] In an exemplary embodiment, in the initial state, a gap exists between the damping fingers 1 and the wafer 2. This is not a limitation, and as long as the motion state of the damping fingers 1 ensures that the acquired surface topography data of the wafer 2 is relatively stable, the damping fingers 1 and the wafer 2 may be in contact in the initial state.

[0068] The embodiment of the present invention further provides a damping finger 1 adjustment device, comprising:

[0069] The carrier 3 is used to carry and fix the wafer 2 and the damping finger 1. The carrier 3 is a hollow structure so that the central area of ​​the wafer 2 is exposed when the wafer 2 is fixed;

[0070] The moving structure is used to control one side of the platform 3 to rise so that there is a preset angle between the platform 3 and the horizontal plane.

[0071] The moving structure may include a cylinder, which contacts the edge of the platform 3 to achieve the tilting setting of the platform 3.

[0072] In an exemplary embodiment, the damping finger 1 adjustment device further includes a Fizeau interferometer to obtain topography data of the wafer 2 surface.

[0073] An embodiment of the present invention further provides a wafer 2 flatness detection device, comprising:

[0074] The aforementioned damping finger 1 adjustment device is used to adjust the motion state of the damping finger 1;

[0075] The wafer 2 topography information acquisition device is used to acquire the topography information of the wafer 2 to detect the flatness of the wafer 2.

[0076] In an exemplary embodiment, the wafer 2 topography information acquisition device may be a Fizeau interferometer, but is not limited thereto.

[0077] An embodiment of the present invention further provides a wafer 2 flatness detection method, which is applied to the above-mentioned wafer 2 flatness detection device, and includes the following steps:

[0078] The motion state of the damping finger 1 is adjusted by the above-mentioned adjustment method of the damping finger 1;

[0079] Placing the wafer 2 vertically;

[0080] The topography information of the wafer 2 is obtained to detect the flatness of the wafer 2 .

[0081] The principle of the Fizeau interferometer for detecting planar optical components is as follows: Light emitted from a laser light source passes through an optical system such as a collimator and a beam expander, and is incident on a test mirror and a reference mirror in parallel. Part of the light is reflected by the reference mirror to form a base reference light; another part of the light passes through the reference mirror and is reflected by the test mirror to form a test light. The interference pattern formed by the reference wavefront and the test wavefront is finally imaged onto a CCD (charge-coupled device) through an imaging system. The interferometer detects the phase information of the optical component to be measured, that is, the height deviation of the optical component surface:

[0082]

[0083] Where h represents the height deviation of the optical element surface being tested. is the phase, and λ is the test wavelength.

[0084] There are a few points to note:

[0085] (1) The drawings of the embodiments of the present disclosure only relate to the structures related to the embodiments of the present disclosure. Other structures may refer to conventional designs.

[0086] (2) For the sake of clarity, the thickness of layers or regions in the drawings used to describe the embodiments of the present disclosure are exaggerated or reduced, i.e., these drawings are not drawn to scale. It is understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "under" another element, the element may be "directly" "on" or "under" the other element or intervening elements may be present.

[0087] (3) In the absence of conflict, the embodiments of the present disclosure and the features therein may be combined with each other to form new embodiments.

[0088] It will be understood that the above embodiments are merely exemplary embodiments for illustrating the principles of the present invention, and the present invention is not limited thereto. Those skilled in the art will appreciate that various modifications and improvements can be made without departing from the spirit and substance of the present invention, and such modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A method for adjusting a damping finger, characterized in that: The damping finger is used to reduce vibration and buffer the wafer during the wafer flatness detection process. The adjustment method of the damping finger is used to adjust the motion state of the damping finger. The adjustment method of the damping finger includes the following steps: Fixing the wafer and the damping finger on a carrier so that the wafer and the damping finger remain in the same plane; Applying an external force to the free end of the damping finger so that the damping finger rotates around its fixed end and in a direction away from the wafer by a preset angle; After the external force is removed, the free end of the damping finger rebounds toward the wafer; Acquiring wafer morphology information corresponding to different motion states of the damping finger; The parameter information of the damping finger corresponding to the wafer topography information with the best stability among the plurality of wafer topography information obtained is selected, and the parameter information is used as the adjustment standard parameter information of the damping finger.

2. The method for adjusting the damping finger according to claim 1, characterized in that: Before obtaining the wafer morphology information of the free end of the damping finger moving in the direction close to the wafer and bouncing back different times after first contacting the wafer, it also includes obtaining the motion state of the damping finger and making the motion state of the damping finger meet preset conditions. The preset conditions include: after the external force is removed, the free end of the damping finger rebounds in the direction close to the wafer and can contact the wafer.

3. The method for adjusting the damping finger according to claim 2, characterized in that: The preset condition includes: after the external force is removed, the free end of the damping finger rebounds in a direction close to the wafer and does not stop moving after contacting the wafer.

4. The method for adjusting the damping finger according to claim 2, characterized in that: The preset condition includes: after the external force is removed, the free end of the damping finger rebounds in a direction close to the wafer, can contact the wafer, and rotates in the opposite direction again, but will not move endlessly.

5. The method for adjusting the damping finger according to claim 4, characterized in that: Acquiring the wafer morphology information corresponding to different motion states of the damping finger specifically includes: acquiring the wafer morphology information under different rebound times of the damping finger.

6. The method for adjusting the damping finger according to claim 5, characterized in that: The motion state of the damping finger corresponding to the wafer topography information with the best stability among the multiple wafer topography information obtained is that after the external force is removed, the optimal number of times the damping finger can contact the wafer and bounce again is 1-7 times.

7. The method for adjusting the damping finger according to claim 1, characterized in that: Before applying external force to the free end of the damping finger, the method further includes the following steps: The carrier is rotated so that a preset angle exists between the plane where the wafer and the damping fingers are located and the horizontal plane.

8. The method for adjusting the damping finger according to claim 7, characterized in that: The preset angle is 10-20 degrees.

9. The method for adjusting the damping finger according to claim 1, characterized in that: In an initial state, the extension direction of the damping fingers is parallel to the tangential direction of the wafer.

10. The method for adjusting the damping finger according to claim 1, characterized in that: In an initial state, there is a gap between the damping fingers and the wafer.

11. A damping finger adjustment device, characterized in that: include: A carrier, used to carry and fix the wafer and the damping fingers, wherein the carrier is a hollow structure so as to expose the central area of ​​the wafer when fixing the wafer; The moving structure is used to control one side of the platform to rise so that a preset angle is formed between the platform and the horizontal plane.

12. A wafer flatness detection device, characterized in that: include: The damping finger adjustment device according to claim 11 is used to adjust the motion state of the damping finger; The wafer morphology information acquisition device is used to acquire the morphology information of the wafer to detect the flatness of the wafer.

13. A wafer flatness detection method, applied to the wafer flatness detection device according to claim 12, characterized in that: The following steps are involved: Adjusting the motion state of the damping finger by the damping finger adjustment method according to any one of claims 1 to 9; placing the wafer vertically; Obtain wafer topography information to detect wafer flatness.

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