Temperature control circuit and temperature control method

Abstract

The invention discloses a temperature control circuit and a temperature control method. The temperature control circuit comprises a signal acquisition module, a main control module, a signal processing module and a temperature control part, the signal acquisition module is electrically connected with the signal processing module, the main control module is electrically connected with the signal processing module, and the signal processing module is electrically connected with the temperature control part; the signal acquisition module is used for acquiring a voltage signal of a controlled system in real time; the main control module is used for calculating a control quantity based on the voltage signal and generating a modulation waveform based on the control quantity; and the signal processing module is used for driving a temperature control piece based on the modulation waveform and acquiring a temperature control feedback signal to complete temperature control. According to the invention, by determining the temperature control mode and collecting the voltage signal of the controlled system in real time, the control quantity is calculated and the modulation waveform is generated, so that the temperature control piece is driven to realize closed-loop temperature control.

Description

Technical Field

[0001] The present invention relates to the technical field of temperature control, and in particular to a temperature control circuit and a temperature control method. Background Art

[0002] Currently, temperature controllers are widely used in industrial control and scientific research experiments. They primarily collect temperature information from the controlled object through external temperature sensors (such as thermocouples and RTDs), generate a regulation strategy using internal PID control or other intelligent control algorithms, and output control signals in the form of relay switches or linear analog currents to drive external power modules or heating devices to achieve temperature regulation. Traditional temperature controllers have significant limitations in specific scientific research scenarios. First, their output signal format is monotonous and lacks the ability to flexibly control parameters such as the heating signal frequency and waveform, making them difficult to meet the needs of experiments with specialized heating methods. For example, in electromagnetic sensitivity experiments, such as optically pumped magnetic resonance magnetometers, the magnetic field generated by the heating signal can interfere with experimental results, necessitating interference suppression methods such as high-frequency heating. Traditional temperature controllers cannot directly generate a modulated signal of a specific frequency. Instead, their output signal is typically used as an external modulation source, coupled with a function signal generator and power amplifier module to achieve the desired heating method. This results in a complex system architecture and low integration. Second, control methods such as intermittent heating suffer from large temperature fluctuations and low regulation accuracy, making it difficult to achieve highly stable thermal field control. Furthermore, existing temperature control systems are often not optimized for electromagnetic compatibility, making them susceptible to electromagnetic interference and affecting the accuracy of experimental data. Therefore, with the increasing demand for higher control accuracy, signal flexibility, and system integration in temperature control systems, traditional temperature controllers urgently need to be upgraded in terms of functional structure and control methods to adapt to the temperature control needs of complex experimental environments.

[0003] Existing temperature controllers typically consist of multiple discrete devices, including a temperature controller, function signal generator, and power amplifier module. This results in a complex and bulky system structure, making compact integration difficult. Temperature control is highly dependent on the performance of the function signal generator. Fluctuations in its frequency stability and modulation accuracy can lead to reduced temperature control accuracy, or even the inability to achieve precise zero-output control. Summary of the Invention

[0004] The present invention provides a temperature control circuit and a temperature control method to improve the accuracy and flexibility of temperature control.

[0005] In order to solve the above technical problems, the present invention provides a temperature control circuit, comprising: a signal acquisition module, a main control module, a signal processing module and a temperature control component;

[0006] The signal acquisition module is electrically connected to the signal processing module, the main control module is electrically connected to the signal processing module, and the signal processing module is electrically connected to the temperature control component;

[0007] The signal acquisition module is used to collect the voltage signal of the controlled system in real time;

[0008] The main control module is used to calculate the control amount based on the voltage signal and generate a modulation waveform based on the control amount;

[0009] The signal processing module is used to drive the temperature control component based on the modulation waveform and obtain a temperature control feedback signal to complete temperature control.

[0010] The present invention integrates signal acquisition, main control, signal processing, and temperature control modules to create a highly integrated temperature control system. This structure reduces the traditional system's reliance on discrete devices, significantly simplifies system wiring and debugging, and improves device miniaturization and system stability.

[0011] Furthermore, the signal acquisition module includes a voltage acquisition module, a current acquisition module and an ADC module;

[0012] The voltage acquisition module includes a current limiting module, a first filtering module and a first protection module; the input end of the first current limiting module is electrically connected to the input end of the voltage acquisition module, the output end of the first current limiting module is electrically connected to the output end of the first filtering module, the output end of the first filtering module is electrically connected to the input end of the first protection module, the output end of the first protection module is electrically connected to the output end of the voltage acquisition module, and the output end of the first protection module is electrically connected to the input end of the ADC module;

[0013] The current acquisition module includes a current conversion module, a second filtering module and a second protection module; the input end of the current conversion module is electrically connected to the input end of the current acquisition module; the output end of the current conversion module is electrically connected to the output end of the second filtering module, the output end of the second filtering module is electrically connected to the input end of the second protection module, the output end of the second protection module is electrically connected to the output end of the voltage acquisition module, and the output end of the second protection module is electrically connected to the input end of the ADC module.

[0014] The signal acquisition module in this invention has dual-channel voltage and current acquisition capabilities, and integrates current limiting, filtering, and protection measures. It works with the ADC module to achieve high-precision data acquisition. This structure improves the system's anti-interference ability and operational reliability, ensures the accuracy of signal input, and provides a stable data foundation for subsequent control.

[0015] Furthermore, the signal processing module also includes a power amplification module and a thermal management module;

[0016] The input end of the power amplifier module is electrically connected to the output end of the main control module, the output end of the power amplifier module is electrically connected to the input end of the thermal management module, and the output end of the thermal management module is electrically connected to the temperature control component.

[0017] The signal processing module of the present invention includes a power amplification and thermal management unit, which can perform power amplification processing on the modulated waveform and accurately control the heat output of the heating element, thereby improving the system heating efficiency while controlling thermal disturbances, significantly improving temperature control accuracy and thermal field uniformity.

[0018] Furthermore, the signal processing module includes an external signal input module;

[0019] The input end of the external signal input module is electrically connected to the controlled system, and the output end of the external signal input module is electrically connected to the main control system.

[0020] The signal processing module of the present invention further integrates an external signal input module to achieve communication between the controlled system and the main control system, so that the system supports external signal collaborative regulation, improves the scalability and openness of the system, and helps to build a modular and networked intelligent temperature control platform.

[0021] Furthermore, the main control module includes a filtering module and a multiplication DAC module;

[0022] The input end of the filtering module is electrically connected to the input end of the main control module, the output end of the filtering module is electrically connected to the first input end of the multiplication DAC module, the second input end of the multiplication DAC module is electrically connected to the output end of the external signal input module, and the output end of the multiplication DAC module is electrically connected to the output end of the main control module.

[0023] The main control module of the present invention realizes filtering processing and proportional adjustment output of the control signal through the combined action of the filtering module and the multiplication DAC module, thereby ensuring the accuracy and frequency stability of the modulation waveform, and further enhancing the flexible generation and rapid response capabilities of the temperature control system to the modulation signal.

[0024] In a second aspect, the present invention provides a temperature control method for controlling a temperature control circuit, comprising:

[0025] Determining a temperature control mode based on the type of the controlled system, and controlling the signal acquisition module to acquire a voltage signal of the controlled system in real time based on the temperature control mode;

[0026] Calculating a control quantity based on a main control module and the voltage signal, and generating a modulation waveform based on the control quantity;

[0027] The signal processing module is controlled based on the modulation waveform to drive the temperature control component, and a temperature control feedback signal is obtained to complete temperature control.

[0028] This method determines the temperature control mode and collects the voltage signal of the controlled system in real time to calculate the control variable and generate a modulation waveform, thereby driving the temperature control component to achieve closed-loop temperature control. This method integrates the concepts of temperature feedback, adaptive control, and waveform modulation. This method not only improves the real-time and accuracy of temperature control, but also enhances the system's adaptability to complex temperature control requirements, making it suitable for scientific research scenarios requiring high stability and flexibility.

[0029] Furthermore, the temperature control mode includes an internal control mode. When the temperature control mode is the internal control mode, the real-time acquisition of the voltage signal of the controlled system based on the temperature control mode includes:

[0030] presetting a heating waveform, waveform frequency, and target temperature based on the internal control mode;

[0031] The signal acquisition module is controlled to acquire the voltage signal of the controlled system in real time based on the heating waveform, the waveform frequency and the target temperature.

[0032] By presetting the heating waveform, waveform frequency, and target temperature, this method enables targeted acquisition of the controlled system's voltage signal, providing fundamental data for control variable calculations. This method supports programmable settings for built-in modulation parameters, making the temperature control system highly customizable, simplifying experimental workflows, and effectively meeting the requirements for high-frequency heating and interference suppression in electromagnetically sensitive experiments.

[0033] Furthermore, the calculating of the control quantity based on the main control module and the voltage signal, and generating the modulation waveform based on the control quantity, includes:

[0034] amplifying the first voltage signal to obtain a first differential signal, and digitizing the first differential signal to obtain a digital signal;

[0035] Based on the digital signal and a preset control algorithm, a first heating ratio is obtained, and a modulation waveform is generated based on the first heating ratio.

[0036] This invention uses differential amplification and digital processing to perform high-precision conversion of voltage signals. Based on the digital signal and control algorithm, it determines the heating ratio and generates a modulation waveform, enabling precise control of heating intensity and rhythm. This improves the temperature control system's signal processing capabilities and dynamic response performance, reduces temperature fluctuations, and enhances temperature field stability.

[0037] Furthermore, the temperature control mode includes an external control mode, and the external control mode includes an external single-ended voltage acquisition mode, a differential voltage acquisition mode, and a current acquisition mode. When the temperature control mode is the external control mode, the real-time acquisition of the voltage signal of the controlled system based on the temperature control mode includes:

[0038] The signal acquisition module is controlled to acquire an external signal based on the external control mode, and a second voltage signal is acquired based on the external signal and a preset resistance component.

[0039] The present invention obtains a current signal through an external control mode, and realizes voltage signal conversion in combination with a preset resistor, so that temperature control can be performed based on the current signal, thereby improving the applicable scenarios of the method.

[0040] Furthermore, the calculating of the control quantity based on the main control module and the voltage signal, and generating the modulation waveform based on the control quantity, includes:

[0041] performing differential processing on the second voltage signal to obtain a second differential signal;

[0042] A second heating ratio is obtained based on the second differential signal and a preset control algorithm, and a modulation waveform is generated based on the second heating ratio, a preset heating waveform, and a preset waveform frequency.

[0043] The present invention performs differential processing and control algorithm calculation on the external voltage signal, and then generates a modulation signal according to the modulation waveform parameters, so that it also has waveform adaptation and adjustment capabilities in the external control mode, thereby improving the overall intelligence level of temperature control and cross-platform collaborative performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] Figure 1 A schematic flow chart of a temperature control method provided in an embodiment of the present invention;

[0045] Figure 2 A schematic structural diagram of a temperature control circuit provided by an embodiment of the present invention;

[0046] Figure 3 A circuit diagram of a signal acquisition module provided by an embodiment of the present invention;

[0047] Figure 4 A structural diagram of a multiplying DAC module provided by an embodiment of the present invention;

[0048] Figure 5 A schematic structural diagram of a power amplifier module provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0049] The following embodiments of the present invention are described in further detail with reference to the accompanying drawings and examples. The following examples are used to illustrate the present invention but are not intended to limit the scope of the present invention.

[0050] The terms "first," "second," and the like in the specification, claims, and drawings of this application are used to distinguish between different objects, not to describe a particular order. Furthermore, the terms "including," "having," and any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or apparatus comprising a series of steps or elements is not limited to the listed steps or elements, but may optionally include steps or elements not listed, or may optionally include other steps or elements inherent to the process, method, product, or apparatus.

[0051] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0052] Example 1

[0053] Please refer to Figure 1 , Figure 1 A schematic structural diagram of a temperature control circuit provided by an embodiment of the present invention.

[0054] An embodiment of the present invention provides a temperature control circuit, comprising: a signal acquisition module, a main control module, a signal processing module and a temperature control component;

[0055] The signal acquisition module is electrically connected to the signal processing module, the main control module is electrically connected to the signal processing module, and the signal processing module is electrically connected to the temperature control component;

[0056] The signal acquisition module is used to collect the voltage signal of the controlled system in real time;

[0057] The main control module is used to calculate the control amount based on the voltage signal and generate a modulation waveform based on the control amount;

[0058] The signal processing module is used to drive the temperature control component based on the modulation waveform and obtain a temperature control feedback signal to complete temperature control.

[0059] In this embodiment, a temperature control circuit comprises a signal acquisition module, a main control module, a signal processing module, and a temperature control unit. The signal acquisition module is electrically connected to the signal processing module and is used to collect voltage signals from the controlled system in real time based on the temperature control mode selected by the user on the touch screen. The circuit further comprises a voltage acquisition module, a current acquisition module, and an ADC module.

[0060] In this embodiment, the signal acquisition module includes a voltage acquisition module, a current acquisition module and an ADC module;

[0061] The voltage acquisition module includes a current limiting module, a first filtering module and a first protection module; the input end of the first current limiting module is electrically connected to the input end of the voltage acquisition module, the output end of the first current limiting module is electrically connected to the output end of the first filtering module, the output end of the first filtering module is electrically connected to the input end of the first protection module, the output end of the first protection module is electrically connected to the output end of the voltage acquisition module, and the output end of the first protection module is electrically connected to the input end of the ADC module;

[0062] The current acquisition module includes a current conversion module, a second filtering module and a second protection module; the input end of the current conversion module is electrically connected to the input end of the current acquisition module; the output end of the current conversion module is electrically connected to the output end of the second filtering module, the output end of the second filtering module is electrically connected to the input end of the second protection module, the output end of the second protection module is electrically connected to the output end of the voltage acquisition module, and the output end of the second protection module is electrically connected to the input end of the ADC module.

[0063] Please refer to Figure 3 , Figure 3 A circuit diagram of a signal acquisition module provided by an embodiment of the present invention.

[0064] In this embodiment, the voltage acquisition module includes a current limiting module, a first filtering module and a first protection module. The input end of the current limiting module is electrically connected to the external voltage input end, and the output end is connected to the filtering module. The output of the filtering module is connected to the protection module, and the output of the protection module is simultaneously connected to the output ends of the ADC module and the signal acquisition module; the current acquisition module includes a current conversion module, a second filtering module and a second protection module. The input end of the current conversion module is electrically connected to the external current input end, and the output end is connected to the second filtering module. The output of the second filtering module is connected to the second protection module, and the output of the second protection module is simultaneously connected to the output ends of the ADC module and the signal acquisition module.

[0065] In this embodiment, if Figure 3The ADC (ADS101 x) has four signal inputs, which can be grouped into two differential signal inputs: AIN0 and AIN1; and AIN2 and AIN3. When using a standard 0-10mA / 4-20mA linear current input, short terminals 1 and 2 and connect the signal input through terminals 1 and 3. Current will flow through R200 / R201 (1kΩ), and the voltage across the resistors will be input to the ADC for differential acquisition. For differential input, leave the terminals open and directly connect the signal to terminals 1 and 3. Select differential voltage input mode through the interactive interface for differential acquisition. For single-ended input, connect the signal directly to terminals 1 or 3, and connect the ground wire to terminal 4. This instrument supports reading external voltage (two differential or four single-ended) and current signals (two channels).

[0066] In this embodiment, the voltage acquisition module uses the ADS101x series ADC chip (U21) as its core, implementing four-channel signal acquisition. The input interface features two 4-pin connectors (P21 and P22). Pin 1 of P21 / P22 is connected to the ADC analog input pins AIN0 / AIN2 via 1kΩ sampling resistors (R200 / R202 corresponding to P21-1, and R207 / R203 corresponding to P22-1), forming the positive input terminal for the current signal and the positive terminal for the differential signal. IN4148 diodes (D201 / D205, etc.) are connected in parallel to provide bidirectional +5V / GND clamping protection. 470kΩ bias resistors (R206 / R209) and 0.1μF filter capacitors (C201 / C205, etc.) are connected to ground. P21 / P22 pin 2: Can be shorted to pin 1 to form a current loop. When connected independently, it connects to the AIN1 / AIN3 pin via a 1kΩ resistor (R201 / R203 corresponding to P21-3) with the same protection circuit configuration. P21 / P22 pin 3: Connects directly to ground (GND) and serves as the reference ground for single-ended signals.

[0067] In this embodiment, the ADC chip peripheral circuit includes:

[0068] Power supply system: Connect the VDD pin to a +5V power supply, and configure a three-stage decoupling network with 47μF electrolytic capacitors (C207 / C208) and 0.1μF ceramic capacitors (C203 / C204 / C209).

[0069] Communication interface: SCL / SDA pins are connected to +5V power supply through 1kΩ pull-up resistors (R208 / R207);

[0070] Address configuration: ADR pin ground (GND) fixed device address;

[0071] Function pin: ALT / READY remains unconnected;

[0072] In this embodiment, each analog input is equipped with an ESD protection device (such as E201) and a parallel RC filter network (0.1μF capacitor + 470kΩ resistor). All signal lines are equipped with bidirectional transient voltage suppression (IN4148 diodes D201-D208 forming a clamp array). This topology implements 0-20mA current conversion through a sampling resistor (1kΩ). Using a connector shorting configuration, it supports three signal input modes: current input mode (1-2 shorted), differential voltage mode (1-3 differential input), and single-ended mode (1 or 3 to 4 grounded). Precision hierarchical filtering and multiple protection circuits ensure measurement accuracy and reliability.

[0073] In this embodiment, the signal acquisition module includes a voltage acquisition submodule and a current acquisition submodule. Both modules share the same front-end circuitry, but the signal flow differs slightly depending on the operating mode. If the user selects internal control mode, no jumpers are required. Connect the voltage to be measured directly to pins 1 or 3 of the P21 interface (corresponding to the AINx input of the ADS101 x), and connect the ground wire to pin 4. The input signal is first current-limited by R200 (1kΩ) before entering the node. This node is slightly pulled down to ground by R204 (470kΩ) to prevent floating. Furthermore, C201 / C202 (each 0.1μF) and R200 form a low-pass filter to remove high-frequency interference. The filtered analog signal then passes through the ±5V clamp network formed by D201–D204 (IN4148) for overvoltage protection. ESD protection is provided by the EZ201 ESD diode before being fed into the AIN0 / AIN1 differential inputs of the ADS101 x for 16-bit digital sampling.

[0074] In this embodiment, if the user selects external control mode, a shorting cap is inserted between pins 1 and 2 of P21, forcing the external 0–10mA or 4–20mA current signal to flow through R200 (1kΩ). This current is directly converted to a 0–20mV or 4–20mV voltage by the current-limiting resistor. It then flows through the same set of cascaded filtering and protection circuits, including R204, C201 / C202, D201–D204, and EZ201, before reaching the AINx differential inputs of the ADS101 x. In this mode, the ADC reads the differential voltage across R200. By inserting or removing the shorting cap on P21 (or P22) and switching between "voltage" and "current" acquisition modes in software, the same front-end hardware can be used to flexibly acquire voltage / differential voltage and current signals.

[0075] In this embodiment, the main control module includes a filtering module and a multiplication DAC module;

[0076] The input end of the filtering module is electrically connected to the input end of the main control module, the output end of the filtering module is electrically connected to the first input end of the multiplication DAC module, the second input end of the multiplication DAC module is electrically connected to the output end of the external signal input module, and the output end of the multiplication DAC module is electrically connected to the output end of the main control module.

[0077] In this embodiment, the main control module consists of a filtering module and a multiplication DAC module. The input of the filtering module directly receives the original waveform signal (FLT_WAV_IN) from the PA5 pin of the STM32 single-chip microcomputer control core board. This signal first enters the non-inverting amplifier terminal of the operational amplifier U22A. At the same time, the precision reference voltage VREF25 generated by REF5025 is buffered by U22B and sent to the inverting amplifier terminal of U22A to achieve automatic cancellation of the DC bias of the original signal. The DC-deducted signal output by U22A is then sent to the programmable filter MAX264 for bandpass / lowpass filtering to remove high-frequency noise and stray components. The filtered waveform (FLT_WAV_OUT) serves as the output of the filtering module. The first input of the multiplication DAC module uses the FLT_WAV_OUT signal buffered by U32A as the reference input and is fed into the REF pin of the DAC8811. Simultaneously, the master MCU outputs three control signals (DAC_CLK, DAC_SDI, and DAC_CS) to the DAC8811 via the SPI bus, enabling it to precisely amplitude-modulate the input waveform according to the ratio of the preset digital code to the reference voltage. The amplitude-modulated waveform generated by the DAC8811 after internal multiplication is the output of the multiplication DAC module, which serves directly as the final output signal of the master module for use by the downstream power amplifier circuit. Through this connection and signal flow, the master module is able to highly integrate the digital control quantity generated within the MCU with the pre-set basic waveform, effectively achieving real-time modulation of the heating signal amplitude.

[0078] In this embodiment, the filtering module includes a signal DC offset cancellation and filtering circuit.

[0079] In this embodiment, the DC offset cancellation layer (input signal) is connected to the non-inverting input of operational amplifier U22A, while the reference voltage is precisely output to the inverting input via a buffer. This design innovatively aligns the reference voltages of the microcontroller and main control board through hardware circuitry (voltage range 2.6V to 3.2V, as calibrated by the resistor network shown), achieving direct cancellation of the DC component and eliminating voltage level deviations between systems (typical input signal range ±2.5Vpp).

[0080] In this embodiment, in the filtering circuit, the debiased signal is input into the programmable filter, and the chip supports dynamic configuration of the cutoff frequency.

[0081] In this embodiment, the module also integrates a GPIO expansion chip (addressed via the SPM_ADDR address pin), expands multiple control interfaces such as CNC_P2351-CNC_P2356, and enhances the main control system's ability to dynamically adjust and control filtering parameters.

[0082] Please refer to Figure 4 , Figure 4 A structural diagram of a multiplying DAC module provided by an embodiment of the present invention.

[0083] In this embodiment, the filtered signal is input into U32A for buffering and then into U31, which is the reference voltage terminal of DAC8811. The DAC is controlled by three signals: DAC_CLK, DAC_SDI, and DAC_CS. The output signal is the product of the DAC power supply voltage, the reference voltage, and the ratio of the set value to the full amplitude value, thereby realizing amplitude modulation of the signal.

[0084] In this embodiment, the multiplication DAC module uses the DAC8811 (U31) as its core and combines it with the dual op amp LF353D (U32) to implement current-voltage conversion and signal conditioning. The peripheral circuits of the core DAC chip (U31) include:

[0085] Power supply system: VDD (pin 4) connects to the +5VA analog power supply, with C301 (0.1μF) and C302 (0.1μF) connected in parallel to form a high-frequency decoupling network. GND (pin 11) connects directly to analog ground, with C304 (0.1μF) connecting to ground for enhanced stability. Reference voltage VREF (pin 7) connects to an external +1VA reference source (labeled 3.33V in the figure) and is protected by current limiting via R306 (220Ω).

[0086] Digital Control Interface: Connect DAC_CLK (clock signal) to pin 2 (SCLK) via R307 (220Ω) in series with a resistor to suppress signal reflections. Connect DAC_SDI (data input) to pin 3 (SDIN) via R308 (220Ω) in series with a resistor. Connect DAC_CS (chip select signal) to pin 1 (active-low CS) via R309 (220Ω) in series with a resistor.

[0087] Analog signal path: The current output IOUT (pin 10) is connected to the inverting input of op amp U32A (pin 2). The complementary output IOUTB (pin 9) is connected to ground (AGND) in a unipolar configuration.

[0088] In the operational amplifier signal conditioning circuit (U32), U32A (current-to-voltage conversion) receives the DAC output current at its inverting input (pin 2), which is converted into a voltage signal via feedback resistor R304 (10KΩ). The pre-filter signal FLT_WAV_OUT is input to the non-inverting input (pin 3), which is filtered by R302 (10KΩ) and the damping capacitor C303 (0.1μF). The output (pin 1) is transmitted to U32B via R305 (10KΩ). U32B (buffer and level shifter) connects its inverting input (pin 6) to R304 and the U32A output, while its non-inverting input (pin 5) is connected to the reference voltage +1VA via R303 (10KΩ). The output (pin 7) generates a ±1.67Vrms (5.25Vpp) level signal, which is output to the power amplifier board via the P11 interface.

[0089] In this embodiment, the +5VA power branch: C301 / C302 (0.1μF) is grounded nearby to filter out high-frequency noise. The ±7VA power branches (not directly connected in the figure) are redundant.

[0090] In this embodiment, the analog ground AGND is independently wired, and the digital control signal is isolated by a 220Ω resistor before being connected to the DAC chip. The reference voltage +1VA is current-limited by R306 (220Ω) to prevent interference on the DAC reference pin.

[0091] In this embodiment, the DAC output achieves precise current-to-voltage conversion (gain: -10kΩ×Iout) through R304. C303 suppresses op amp oscillation, and R305 balances the input impedance.

[0092] In this embodiment, a +1VA bias voltage is injected into the in-phase terminal to make the output of U32B symmetrically offset around zero level to meet the subsequent power amplification requirements.

[0093] In this embodiment, all digital control lines are connected through 220Ω series resistors to suppress ringing effects;

[0094] In this embodiment, multiple layers of decoupling capacitors cover the entire power network (0.1 μF capacitance × 4), cutting off high-frequency noise paths.

[0095] In this embodiment, the module uses a DAC8811 to convert digital signals to analog currents. After conditioning (current-to-voltage conversion + level shifting) with a two-stage LF353D op amp, the module outputs a clean signal with a dynamic range of 5.25Vpp. The input signal, FLT_WAV_OUT, undergoes impedance matching (R302) and filtering (C303) before being fed into the DAC pre-stage. The digital control interface (DAC_CLK / SDI / CS) directly drives the core chip via resistor isolation. A hierarchical power supply and independent grounding ensure conversion accuracy.

[0096] In this embodiment, the main control module is electrically connected to the signal processing module, and is used to calculate the control quantity and generate a modulated waveform based on the voltage / current digital signal sent by the signal acquisition module; its interior is composed of a filtering module and a multiplication DAC module, the input end of the filtering module is electrically connected to the input end of the main control module, and the output end is connected to the input end of the multiplication DAC module, and the output end of the multiplication DAC module serves as the output of the main control module. The digital control quantity, together with the preset waveform and waveform frequency, are applied to the multiplication DAC through the SPI or I^2C interface, and an analog heating signal with a proportionally modulated amplitude is output.

[0097] In this embodiment, the main control module also includes a circuit board power management module. The circuit board receives power inputs from ±15V and ground, generates ±9V through the three-terminal regulator 78 / 79M05, and then generates a more stable ±5V through the 1A, 36V, low-noise, high-PSRR, low-dropout regulator TPS7A47 / 30 with an enable function. These two voltages are used to power all analog components on the circuit board. Simultaneously, another +15V voltage is generated through the switching regulator LT1767 to +5V, and then through the linear regulator LM1117 to +3.3V. This power supply is used to power the digital components on the circuit board.

[0098] In this embodiment, the signal processing module includes a power amplification module and a thermal management module;

[0099] The input end of the power amplifier module is electrically connected to the output end of the multiplication DAC module, the output end of the power amplifier module is electrically connected to the input end of the thermal management module, and the output end of the thermal management module is electrically connected to the temperature control component.

[0100] Please refer to Figure 5 , Figure 5 A schematic structural diagram of a power amplifier module provided in an embodiment of the present invention.

[0101] In this embodiment, the signal is connected to P13 and undergoes two stages of precision amplification. These two stages of amplification use the multiplexed precision op amp OPA2182. Two sets of four-position dip switches are used to select the peripheral resistors for the two stages of amplification, respectively, to achieve a total of 16 amplification ratio options. Finally, the AC signal is sent to the high-current power amplifier OPA549 for power amplification. The signal is then output to the instrument output. At the same time, the voltage is limited to ±18V in the circuit to prevent damage to the subsequent circuit. At the same time, the 8th pin of the OPA549 is used to limit the output current of the OPA549. Therefore, an I2C-compatible DAC chip DAC081C081 is placed on this pin for programmable current limiting adjustment. The main innovation: Compared with the existing mature OPA549 module, a dual-channel multiplexed precision op amp is selected as the front stage, and a dip switch is used to select the peripheral resistor configuration to achieve 16 adjustable fixed amplification gears, which is more convenient for setting the signal output amplitude. At the same time, compared with the mature OPA549 module, this circuit uses DAC (U13 in the figure) to regulate the maximum output current of the OPA549, realizing program-controlled maximum current limit, which can be adjusted according to the parameters of the heating device (the relevant adjustments have also been incorporated into the human-machine interface, and the output voltage amplitude, maximum current limit and other parameters can be set through the touch screen).

[0102] In this embodiment, the power amplifier module adopts a three-stage architecture design of front-stage precision amplification, post-stage buffer drive and power output stage, realizes 16-speed gain adjustment through a DIP switch resistor network, and integrates a programmable current limiting function.

[0103] In this embodiment, the pre-stage precision amplifier circuit (dual-channel OPA2182) includes: a signal input interface, the signal is connected through the P13 port, and is input into the first-stage operational amplifier U1A (OPA2182) after voltage matching through resistors R101-R104 (labeled value 1kΩ-30kΩ).

[0104] In this embodiment, the first-stage gain selection is as follows: the non-inverting terminal of U1A is connected in series with R105-R108 (1kΩ-7.5kΩ), and the inverting terminal is grounded via R110-R113 (2.5kΩ-24kΩ).

[0105] Four DIP switches are connected across R105-R108 / R110-R113 to form a 4-bit resistor matrix that supports 16 gain combinations.

[0106] In this embodiment, the second-stage gain adjustment: U1A's output is transmitted to the second-stage op amp U1B (OPA2182) via R114-R117 (5kΩ-30kΩ). A second set of DIP switches controls the R118-R121 (6kΩ-32kΩ) feedback network to achieve independent adjustment of the gain G_2.

[0107] In this embodiment, the inter-stage connecting capacitors C101 - C104 (10 μF - 50 μF) block the DC component to ensure pure AC amplification.

[0108] In this embodiment, the post-stage driver and power amplifier (OPA549) and the output of U1 B in the driver stage buffer are fed into the non-inverting input terminal (pin 3) of the power amplifier U2 (OPA549) through the current limiting of R201 (1kΩ).

[0109] Power stage output: U2 inverting terminal (pin 2) is grounded via resistor R202 (1kΩ), forming a unity gain buffer.

[0110] The output terminal (pin 7) is connected in series with a fuse resistor R25 (1Ω) to the OUTPUT port to provide overcurrent protection.

[0111] In this embodiment, the ±18V power input is bidirectionally clamped by diodes D101 / D102 (SOD package) to limit the operating voltage range. A TVS diode (not labeled in the figure) is connected in parallel to GND at the output to suppress transient high voltages.

[0112] In this embodiment, the current limiting logic of the programmable current limiting system (DAC081C081) is to connect U2 pin 8 (I_LIMIT) to the output end of the DAC chip U13 (DAC081C081), and set the OPA549 peak current (0-10A) by adjusting the DAC output voltage (0-5V).

[0113] In this embodiment, the DAC control interface:

[0114] The SCL / SDA pin is pulled up to +3.3V via resistors R210 / R211 (1kΩ) and connected to I 2 C bus.

[0115] The VDD pin is powered by +3.3V and connected in parallel with decoupling capacitors C105 / C106 (0.1μF).

[0116] In this embodiment, the power filter network: the main power supply ±18V input is configured with four-stage filtering:

[0117] Level 1: electrolytic capacitors C107-C110 (3300μF / 35V×4);

[0118] Secondary: ceramic capacitors C111-C114 (0.1μF×4);

[0119] Stage 3: LC filter L101 / L102 series magnetic beads;

[0120] In this embodiment, the heat sink of U2 is connected to GND, and the temperature is monitored via R212 (10kΩ) and sent to the main ADC. A PTC resettable fuse (labeled F101) is connected in series with the output.

[0121] In this embodiment, the front-stage dual OPA2182 is paired with eight sets of precision resistors (R105-R121) and two sets of 4-bit DIP switches to achieve 16 fixed gain combinations (typically ranging from 0.5× to 100×).

[0122] In this embodiment, DAC081 C081 converts digital instructions (touch screen settings) into 0-5V analog quantities to control the peak output current of OPA549 in real time to avoid load overcurrent damage.

[0123] In this embodiment, ripple is suppressed by quadruple power supply filtering (total capacitance > 13,000 μF); multi-level voltage / current / temperature protection (D101 / D102+F101+R212) ensures long-term full-load operation.

[0124] In this embodiment, input signal → P13 → [R101-R104] → U1A (gain G1) → [C101-C104] → U1B (gain G2) → [R201] → U2 (power amplifier) ​​→ [R25] → OUTPUT.

[0125] In this embodiment, the problem of insufficient flexibility of traditional power amplifiers is solved through modular gain selection and programmable current limiting mechanism. 2 C+dip switch) is deeply integrated with human-machine interaction, significantly improving the reliability and controllability of applications such as industrial heating devices.

[0126] In this embodiment, the signal processing module further includes an external signal input module;

[0127] The input end of the external signal input module is electrically connected to the controlled system, and the output end of the external signal input module is electrically connected to the main control system.

[0128] In this embodiment, the 4-channel ADC chip ADS1015 is used as the core to realize the acquisition of external signals such as voltage and current. Figure 3In the ADS101 x chip shown, P21 and P22 each represent a pair of two-channel inputs, with identical structures. For voltage input, using P21 as an example, connect a single-ended voltage signal to the corresponding binding post on pins 1 or 3, or connect a differential voltage signal to pins 1 and 3 to form a differential input, then select differential voltage input in the software. For current input, short-circuit binding posts 1 and 2 and connect the signal input from pins 1 and 3. Current will flow through R200 / R201 (1kΩ), and the voltage across the resistors will be fed into the ADC for differential acquisition. In this case, select current mode.

[0129] In this embodiment, the signal processing module is electrically connected to the temperature control component and is used to drive the temperature control component based on the modulated waveform input by the main control module and obtain the temperature control feedback signal to achieve closed-loop control. It internally includes a power amplifier module, an external signal input module, and a thermal management module. The input of the power amplifier module is electrically connected to the output of the multiplication DAC module. The power amplifier module transmits the modulated signal through a two-stage precision op amp and an OPA549 power amplifier before outputting it. The output is connected to the input of the thermal management module. The thermal management module, composed of a 51 single-chip microcontroller and a DS18B20, drives a fan to dissipate heat from the power amplifier and provides feedback on the cooling status to the main control module. The signal processing module also includes an external signal input module, whose input is electrically connected to the controlled system and can collect 4–20mA / 0–10mA external temperature control signals and transmit them to the main control module to meet the signal reading requirements in the external temperature control mode. The temperature control component includes the actuator that actually drives the heating or cooling device.

[0130] This embodiment provides a complete temperature control method and corresponding temperature control circuit. This circuit consists of a signal acquisition module, a main control module, a signal processing module, and a temperature control unit. First, the signal acquisition module is responsible for real-time acquisition of the voltage signal of the controlled system based on the temperature control mode (internal control mode or external control mode) selected by the user on the touch screen interface.

[0131] In this embodiment, when in internal control mode, the user presets the heating waveform, waveform frequency, and target temperature in the interface, and the system immediately starts temperature measurement of the PT100 sensor: the PT100 is connected to the Wheatstone bridge, and the generated first voltage signal enters the fully differential amplifier OPA862 after multi-stage amplification (INA105 / INA106 instrumentation amplifier + OPA2182 precision amplifier), converts the single-ended signal into a differential signal, and is digitized by the 16-bit true differential ADC ADS8867. The digital signal read by the main control microcontroller is calculated through the model predictive control (MPC) or PID algorithm to obtain the first heating ratio P1, and based on P1, the preset waveform, and the preset frequency, the basic waveform is output through the DAC triggered by the on-chip TIM+DMA. The multiplication DAC (DAC8811) then performs amplitude modulated modulation on the basic waveform according to P1 to generate a modulated waveform.

[0132] In this embodiment, if in external control mode, the 4–20mA or 0–10mA output signal of the external temperature controller is connected to the signal acquisition module, and is converted into a second voltage signal after the short-circuit cap (so that the current passes through the 1kΩ resistor R200). The second differential signal is collected by Δ-ΣADCADS1015 in a differential or single-ended manner to form the second differential signal. The main control microcontroller calculates the second heating ratio P2 based on the second differential signal and the preset control algorithm, and also generates a basic waveform through the on-chip TIM+DMA DAC. The multiplication DAC performs amplitude modulation on the basic waveform according to P2 to obtain the modulated waveform.

[0133] In this embodiment, the main control module includes a filtering module for DC offset cancellation and filtering (op amps U22A / U22B jointly deduct the reference VREF25 from the FLT_WAV_IN output of the on-chip DAC and send it to the programmable filter MAX264, outputting FLT_WAV_OUT) and a multiplication DAC module (U32A buffers FLT_WAV_OUT and sends it to the DAC8811 REF terminal. DAC_CLK, DAC_SDI, and DAC_CS are controlled by the MCU via SPI, generating an amplitude modulated waveform in the form of VREF25×digital code×FLT_WAV_OUT). Its output terminal is the output of the main control module. The signal processing module includes a power amplifier module and a thermal management module, and an external signal input module is added when external temperature control is realized: after the power amplifier module receives the multiplication DAC output, the signal first passes through the two-stage selectable gain precision op amp OPA2182 (the peripheral feedback resistor is selected by two sets of four-position dip switches, with a total of 16 magnifications), and then the high-power OPA549 performs the final power amplification. At the same time, the 8th pin of OPA549 is compatible with I 2 C's DAC081 C081 implements programmed current limiting; the amplified signal is output to the temperature control component (such as a heater or other actuator) and implements voltage limiting protection within the ±18V range.

[0134] In this embodiment, the thermal management module consists of a 51 single-chip microcontroller and a DS18B20. The DS18B20 reports the power amplifier board temperature, which the 51 single-chip microcontroller uses to generate a PWM signal to control the fan speed and ensure heat dissipation. In external temperature control mode, the external signal input module receives the current output of the controlled system and provides a digitized voltage signal to the main control module. The temperature control unit, acting as an execution unit, is electrically connected to the power amplifier module to achieve direct heating of the controlled object.

[0135] In this embodiment, the present invention obtains the voltage signal after voltage or current conversion in real time through the signal acquisition module, the main control module quickly calculates the control quantity and generates a modulation waveform, the signal processing module accurately amplifies and manages heat dissipation, and finally drives the temperature control component to complete high-precision, low-latency temperature closed-loop control.

[0136] See also Figure 1 , Figure 1 1 is a flow chart of a temperature control method provided in an embodiment of the present invention. The embodiment of the present invention provides a temperature control method, including steps 101 to 103, as follows:

[0137] Step 101: determining a temperature control mode, and collecting a voltage signal of a controlled system in real time based on the temperature control mode;

[0138] Step 102: Calculating a control variable based on a main control module and the voltage signal, and generating a modulation waveform based on the control variable;

[0139] Step 103: driving the temperature control component based on the modulation waveform, and obtaining a temperature control feedback signal to complete temperature control.

[0140] In this embodiment, there are two temperature control modes, namely internal temperature control and external temperature control. When the instrument is started, it is necessary to select and determine the temperature control mode.

[0141] In this embodiment, the temperature control mode is determined and the voltage signal of the controlled system is collected in real time to calculate the control variable and generate a modulation waveform, thereby driving the temperature control component to achieve closed-loop temperature control. This method combines the concepts of temperature feedback, adaptive control, and waveform modulation. It not only improves the real-time and accuracy of temperature control, but also enhances the system's adaptability to complex temperature control requirements, making it suitable for scientific research scenarios requiring high stability and flexibility.

[0142] In this embodiment, the temperature control mode includes an internal control mode. When the temperature control mode is the internal control mode, the real-time acquisition of the voltage signal of the controlled system based on the temperature control mode includes:

[0143] presetting a heating waveform, waveform frequency, and target temperature based on the internal control mode;

[0144] The signal acquisition module is controlled to acquire the voltage signal of the controlled system in real time based on the heating waveform, the waveform frequency and the target temperature.

[0145] In this example, by presetting the heating waveform, waveform frequency, and target temperature, targeted acquisition of the controlled system's voltage signal is achieved, providing basic data for control variable calculation. This method supports programmable settings for built-in modulation parameters, making the temperature control system highly customizable, simplifying the experimental process, and effectively meeting the requirements of electromagnetic sensitivity experiments for high-frequency heating and interference suppression.

[0146] In this embodiment, the step of calculating a control variable based on the main control module and the voltage signal, and generating a modulation waveform based on the control variable includes:

[0147] amplifying the first voltage signal to obtain a first differential signal, and digitizing the first differential signal to obtain a digital signal;

[0148] Based on the digital signal and a preset control algorithm, a first heating ratio is obtained, and a modulation waveform is generated based on the first heating ratio.

[0149] In this embodiment, after the instrument is started, the user selects the "internal temperature control" mode through the touchscreen interface and pre-sets the desired heating waveform (such as a sine wave, triangle wave, or square wave), waveform frequency, and target temperature. The system then immediately monitors the voltage signal collected by the controlled object (PT100 sensor) in real time. The process involves first connecting the PT100 to a Wheatstone bridge circuit, amplifying the first voltage signal output by the bridge using a precision instrumentation amplifier to obtain a first differential signal. This signal is then further processed by a fully differential operational amplifier and fed into a 16-bit true differential ADC for digitization, yielding a precise digital signal. The main control MCU calculates a first heating ratio based on this digital signal and a pre-set control algorithm (such as model predictive control or PID algorithm). Based on this ratio and the previously preset heating waveform and waveform frequency, a corresponding modulation waveform is generated. Finally, the modulation waveform is amplitude-adjusted by a multiplying DAC, then fed into a two-stage selectable gain operational amplifier (with a fixed gain setting set by a dip switch) and an OPA549 high-current power amplifier for power amplification. The signal is then output to the heater, rapidly bringing the controlled object temperature toward the target value.

[0150] In this embodiment, after the instrument is powered on, the "Internal Temperature Control" mode is selected on the touchscreen interface. The sensor is then connected based on the type of PT100 sensor being used. For a two-wire PT100, the ground wire must be shorted to one of the wires and both wires must be plugged into the designated terminals. For a three-wire PT100, all three wires can be directly plugged into the corresponding connectors. Once connected, the user selects the desired heating waveform (such as sine, triangle, or square), sets the waveform frequency, and enters the target temperature. The system excites the PT100 sensor via a bridge. The weak temperature-dependent voltage output by the bridge is initially amplified by a precision amplifier stage, then converted to a differential signal by a fully differential amplifier. Finally, a 16-bit true differential ADC converts the analog voltage into a digital temperature value, which is then read by the main control board. The main control MCU then calculates the required initial heating power ratio using an MPC (or PID) algorithm and transmits this control variable to a multiplying DAC. Simultaneously, the MCU optimizes the TIM+DMA parameters based on the selected frequency and generates the basic waveform using the on-chip DAC. After receiving the control variable, the multiplying DAC amplitude modulates the fundamental wave output by the on-chip DAC to generate a corresponding modulated analog signal. This signal then enters a two-stage pre-stage precision op amp with selectable gain (a DIP switch selects a fixed gain), is amplified by the OPA549 high-current power amplifier, and is output to the instrument's heating port to drive the heating plate. During the heating process, the ADC continuously samples the PT100 temperature value. The MCU updates the control variable in real time based on the latest temperature data, and the multiplying DAC dynamically adjusts the waveform amplitude, forming a closed-loop feedback loop, thereby achieving high-precision and high-response temperature control.

[0151] In this embodiment, differential amplification and digital processing are used to perform high-precision conversion of voltage signals. Based on the digital signal and control algorithm, the heating ratio is obtained, and a modulation waveform is generated to achieve precise control of the heating intensity and rhythm. This improves the temperature control system's signal processing capabilities and dynamic response performance, reduces temperature fluctuations, and improves temperature field stability.

[0152] In this embodiment, the temperature control mode includes an external control mode, which includes an external single-ended voltage acquisition mode, a differential voltage acquisition mode, and a current acquisition mode. When the temperature control mode is the external control mode, the real-time acquisition of the voltage signal of the controlled system based on the temperature control mode includes:

[0153] The signal acquisition module is controlled to acquire an external signal based on the external control mode, and a second voltage signal is acquired based on the external signal and a preset resistance component.

[0154] In this embodiment, a current signal is acquired through an external control mode, and a voltage signal conversion is achieved in combination with a preset resistor, so that temperature control can be performed based on the current signal, thereby improving the applicable scenarios of the method.

[0155] In this embodiment, the step of calculating a control variable based on the main control module and the voltage signal, and generating a modulation waveform based on the control variable includes:

[0156] performing differential processing on the second voltage signal to obtain a second differential signal;

[0157] A second heating ratio is obtained based on the second differential signal and a preset control algorithm, and a modulation waveform is generated based on the second heating ratio, a preset heating waveform, and a preset waveform frequency.

[0158] In this embodiment, when the instrument enters external temperature control mode, the system first activates the external temperature control mode through the touch screen interface. The user then connects the 4–20mA (or 0–10mA) current signal from the external temperature controller to the instrument's external signal input terminal. During the wiring process, the designated terminal must be short-circuited so that the external current flows through the onboard preset resistor (R = 1kΩ). This converts the external current signal into a corresponding second voltage signal (V2 = I_ext × 1kΩ). This second voltage signal is fed into a four-channel Δ-Σ ADC (ADS1015) for differential (or single-ended) acquisition. The ADC digitizes the output of a second differential signal, which is read by the main control MCU. The MCU calculates the second differential signal based on a preset digital temperature control algorithm (such as PID or MPC) to obtain the second heating ratio P2. The system then uses the on-chip timer and DMA to drive the built-in DAC to generate the base waveform signal based on the second heating ratio P2 and the heating waveform (such as a sine wave, square wave, or triangle wave) and waveform frequency f0 pre-set by the user on the interface. The multiplication DAC then amplitude modulates the base waveform according to the ratio P2 to generate the final modulated waveform. This modulated waveform is fed into the power amplifier module, amplified by multiple op amps, and output to the heating device through the OPA549 power amplifier, achieving closed-loop temperature control.

[0159] In this embodiment, by performing differential processing and control algorithm calculation on the external voltage signal, and then generating a modulation signal according to the modulation waveform parameters, the waveform adaptation and adjustment capabilities are also possessed in the external control mode, thereby improving the overall intelligence level of temperature control and cross-platform collaborative performance.

[0160] In an embodiment of the present invention, a temperature control device is further provided, including a processor, a memory, and a computer program stored in the memory and configured to be executed by the processor. When the processor executes the computer program, the above-mentioned temperature control method is implemented.

[0161] In an embodiment of the present invention, a computer-readable storage medium is further provided. The computer-readable storage medium includes a stored computer program. When the computer program is executed, the device where the computer-readable storage medium is located is controlled to execute the above-mentioned temperature control method.

[0162] For example, a computer program can be divided into one or more modules, one or more of which are stored in a memory and executed by a processor to implement the present invention. One or more modules can be a series of computer program instruction segments capable of performing specific functions, and the instruction segments are used to describe the execution process of the computer program in the temperature control device.

[0163] The temperature control device may be a computing device such as a desktop computer, laptop, PDA, or cloud server. The temperature control device may include, but is not limited to, a processor, a memory, and a display. Those skilled in the art will appreciate that the aforementioned components are merely examples of temperature control devices and do not constitute a limitation of the temperature control device. The temperature control device may include more or fewer components, or a combination of certain components, or different components. For example, the temperature control device may also include input / output devices, network access devices, buses, and the like.

[0164] The processor may be a central processing unit (CPU), other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA), other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor may be a microprocessor or any conventional processor. The processor is the control center of the temperature control device and connects the various parts of the entire temperature control device using various interfaces and lines.

[0165] The memory can be used to store computer programs and / or modules. The processor implements various functions of the temperature control device by running or executing the computer programs and / or modules stored in the memory and accessing the data stored in the memory. The memory can mainly include a program storage area and a data storage area. The program storage area can store an operating system and at least one application required for a function (such as a sound playback function, a text conversion function, etc.); the data storage area can store data generated based on the use of the mobile phone (such as audio data, text message data, etc.). In addition, the memory can include high-speed random access memory and non-volatile memory, such as a hard disk, internal memory, a plug-in hard disk, a smart media card (SMC), a secure digital (SD) card, a flash card, at least one disk storage device, a flash memory device, or other volatile solid-state storage device.

[0166] Wherein, if the module based on temperature control is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the present invention implements all or part of the process in the above-mentioned embodiment method, and can also be completed by instructing the relevant hardware through a computer program. The computer program can be stored in a computer-readable storage medium. When the computer program is executed by the processor, it can implement the steps of the above-mentioned various method embodiments. Wherein, the computer program includes computer program code, and the computer program code can be in source code form, object code form, executable file or some intermediate form. The computer-readable medium may include: any entity or device capable of carrying computer program code, recording medium, USB flash drive, mobile hard disk, magnetic disk, optical disk, computer memory, read-only memory (ROM), random access memory (RAM), electric carrier signal, telecommunication signal and software distribution medium, etc. Those skilled in the art can understand and implement it without paying creative work.

[0167] The specific embodiments described above further illustrate the objectives, technical solutions, and beneficial effects of the present invention. It should be understood that the above descriptions are merely specific embodiments of the present invention and are not intended to limit the scope of protection of the present invention. In particular, it should be noted that any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included within the scope of protection of the present invention for those skilled in the art.

Claims

1. A temperature control circuit, characterized in that: include: Signal acquisition module, main control module, signal processing module and temperature control unit; The signal acquisition module is electrically connected to the signal processing module, the main control module is electrically connected to the signal processing module, and the signal processing module is electrically connected to the temperature control component; The signal acquisition module is used to collect the voltage signal of the controlled system in real time; The main control module is used to calculate the control amount based on the voltage signal and generate a modulation waveform based on the control amount; The signal processing module is used to drive the temperature control component based on the modulation waveform and obtain a temperature control feedback signal to complete temperature control.

2. A temperature control circuit according to claim 1, characterized in that: The signal acquisition module includes a voltage acquisition module, a current acquisition module and an ADC module; The voltage acquisition module includes a current limiting module, a first filtering module and a first protection module; the input end of the first current limiting module is electrically connected to the input end of the voltage acquisition module, the output end of the first current limiting module is electrically connected to the output end of the first filtering module, the output end of the first filtering module is electrically connected to the input end of the first protection module, the output end of the first protection module is electrically connected to the output end of the voltage acquisition module, and the output end of the first protection module is electrically connected to the input end of the ADC module; The current acquisition module includes a current conversion module, a second filtering module and a second protection module; the input end of the current conversion module is electrically connected to the input end of the current acquisition module; the output end of the current conversion module is electrically connected to the output end of the second filtering module, the output end of the second filtering module is electrically connected to the input end of the second protection module, the output end of the second protection module is electrically connected to the output end of the voltage acquisition module, and the output end of the second protection module is electrically connected to the input end of the ADC module.

3. A temperature control circuit according to claim 2, characterized in that: The signal processing module also includes a power amplification module and a thermal management module; The input end of the power amplifier module is electrically connected to the output end of the main control module, the output end of the power amplifier module is electrically connected to the input end of the thermal management module, and the output end of the thermal management module is electrically connected to the temperature control component.

4. A temperature control circuit as claimed in claim 3, characterized in that: The signal processing module includes an external signal input module; The input end of the external signal input module is electrically connected to the controlled system, and the output end of the external signal input module is electrically connected to the main control system.

5. A temperature control circuit as claimed in claim 4, characterized in that: The main control module includes a filtering module and a multiplication DAC module; The input end of the filtering module is electrically connected to the input end of the main control module, the output end of the filtering module is electrically connected to the first input end of the multiplication DAC module, the second input end of the multiplication DAC module is electrically connected to the output end of the external signal input module, and the output end of the multiplication DAC module is electrically connected to the output end of the main control module.

6. A temperature control method, characterized in that: A temperature control circuit for controlling a temperature control circuit according to any one of claims 1 to 5, comprising: Determining a temperature control mode based on the type of the controlled system, and controlling the signal acquisition module to acquire a voltage signal of the controlled system in real time based on the temperature control mode; Calculating a control quantity based on a main control module and the voltage signal, and generating a modulation waveform based on the control quantity; The signal processing module is controlled based on the modulation waveform to drive the temperature control component, and a temperature control feedback signal is obtained to complete temperature control.

7. A temperature control method according to claim 6, characterized in that: The temperature control mode includes an internal control mode. When the temperature control mode is the internal control mode, the real-time acquisition of the voltage signal of the controlled system based on the temperature control mode includes: presetting a heating waveform, waveform frequency, and target temperature based on the internal control mode; The signal acquisition module is controlled to acquire the voltage signal of the controlled system in real time based on the heating waveform, the waveform frequency and the target temperature.

8. A temperature control method according to claim 7, characterized in that: The calculating of the control amount based on the main control module and the voltage signal, and generating the modulation waveform based on the control amount, includes: amplifying the first voltage signal to obtain a first differential signal, and digitizing the first differential signal to obtain a digital signal; Based on the digital signal and a preset control algorithm, a first heating ratio is obtained, and a modulation waveform is generated based on the first heating ratio.

9. A temperature control method according to claim 6, characterized in that: The temperature control mode includes an external control mode, which includes an external single-ended voltage acquisition mode, a differential voltage acquisition mode, and a current acquisition mode. When the temperature control mode is the external control mode, the real-time acquisition of the voltage signal of the controlled system based on the temperature control mode includes: The signal acquisition module is controlled to acquire an external signal based on the external control mode, and a second voltage signal is acquired based on the external signal and a preset resistance component.

10. A temperature control method according to claim 9, characterized in that: The calculating of the control amount based on the main control module and the voltage signal, and generating the modulation waveform based on the control amount, includes: performing differential processing on the second voltage signal to obtain a second differential signal; A second heating ratio is obtained based on the second differential signal and a preset control algorithm, and a modulation waveform is generated based on the second heating ratio, a preset heating waveform, and a preset waveform frequency.

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