Heat dissipation cooling box for computer hardware

Abstract

The invention belongs to the technical field of computer heat dissipation, and particularly relates to a heat dissipation cooling box for computer hardware, which comprises a case and a box door, the case and the box door are detachably mounted and connected, a mounting rack is slidably arranged in the case, a phase change material container is mounted below the mounting rack, heat dissipation windows are arranged on two opposite side walls of the box body, and the phase change material container is mounted below the mounting rack. Fan boxes are installed on the two opposite side walls of the box body, anti-blocking ventilation and heat dissipation mechanisms are installed in the fan boxes, and each anti-blocking ventilation and heat dissipation mechanism comprises an upper brush plate and a lower brush plate; heat is stored and released through the phase change material container, the temperature in the box is balanced, an anti-blocking ventilation heat dissipation mechanism of the fan box cleans and brushes a heat dissipation window to guarantee air circulation, and in addition, through the synergistic effect of the heat dissipation fins, the high-heat-conduction copper container, the heat conduction silica gel pad and other assemblies, the overall heat dissipation efficiency is remarkably improved.

Description

Technical Field

[0001] The invention belongs to the technical field of computer heat dissipation, and in particular relates to a heat dissipation and cooling box for computer hardware. Background Art

[0002] With the rapid development of computer technology, the performance of computer hardware continues to improve, and the heat generated during operation is also increasing. Excessive temperatures can seriously affect the operational stability and service life of computer hardware, and may even cause hardware failure. Therefore, an efficient cooling system is crucial to ensure the normal operation of computer hardware.

[0003] At present, common computer hardware cooling methods include air cooling and liquid cooling. Air cooling removes heat through forced convection by fans, but it is prone to dust accumulation and clogging of the heat dissipation channel, resulting in reduced heat dissipation efficiency. Although liquid cooling has a better heat dissipation effect, it has disadvantages such as complex structure, high cost and risk of liquid leakage. In addition, traditional heat dissipation methods can often only achieve one-way heat transfer and cannot effectively store and reuse heat. Therefore, the development of a computer hardware heat dissipation and cooling box that can not only dissipate heat efficiently, but also prevent dust clogging and has heat storage and release functions has become an urgent problem to be solved in the current field of computer hardware heat dissipation. Summary of the Invention

[0004] In order to solve the above problems, the present invention provides a heat dissipation and cooling box for computer hardware, which realizes the storage and release of heat through a phase change material container to balance the temperature inside the box. The anti-blocking ventilation and heat dissipation mechanism of the fan box cleans the heat dissipation window to ensure air circulation. In addition, the heat dissipation fins, high thermal conductivity copper container and thermal conductive silicone pad and other components work together to significantly improve the overall heat dissipation efficiency.

[0005] In order to achieve the above functions, the technical solution adopted by the present invention is as follows: a heat dissipation and cooling box for computer hardware, comprising a chassis and a door, wherein the chassis and the door are detachably connected, a mounting rack is slidingly provided in the chassis, a phase change material container is installed below the mounting rack, when the computer hardware installed on the mounting rack generates heat, the phase change material in the phase change material container absorbs the heat and changes from solid to liquid, thereby realizing rapid storage of heat, and when the temperature inside the box drops, the phase change material in the phase change material container solidifies from liquid to solid, releasing the stored heat, and the two opposite side walls of the box are both A heat dissipation window is provided, and fan boxes are installed on the two opposite side walls of the box body. An anti-blocking ventilation and heat dissipation mechanism is installed in the fan box to accelerate the outward circulation of hot air in the box; the anti-blocking ventilation and heat dissipation mechanism includes an upper brush plate and a lower brush plate, and slide rails are installed on the inner wall of the fan box. The slide rails are longitudinally arranged in two groups and are respectively located on both sides of the heat dissipation window. The upper brush plate spans the heat dissipation window and the two ends are respectively slidably connected to the two sets of slide rails. The lower brush plate spans the heat dissipation window and the two ends are respectively slidably connected to the two sets of slide rails. Soft brushes are evenly arranged on the surface of the upper brush plate and the lower brush plate facing the heat dissipation window.

[0006] As a preferred technical solution of the present invention, the anti-blocking ventilation and heat dissipation mechanism also includes a gear, an upper rack and a lower rack. The gear is rotatably installed on the inner wall of the fan box, and the upper rack and the lower rack are both longitudinally slidably installed on the inner wall of the fan box. The upper rack and the lower rack are respectively engaged with the two sides of the gear, and the top end of the upper rack is fixedly connected to the upper brush plate, and the bottom end of the lower rack is fixedly connected to the lower brush plate.

[0007] As a preferred technical solution of the present invention, a drive motor is fixedly installed in the fan box, a fan blade is installed at the output end of the drive motor, and a transmission belt is wound between the output end of the drive motor and the rotating shaft of the gear.

[0008] As a preferred technical solution of the present invention, heat dissipation fins are installed in the chassis, and the heat dissipation fin array is vertically welded to the surface of the phase change material container.

[0009] As a preferred technical solution of the present invention, the phase change material container is made of high thermal conductivity copper material, and the interior of the phase change material container is filled with an organic phase change material with a melting point of 45°C.

[0010] Compared with the prior art, the present invention adopts the above structure to achieve the following beneficial effects:

[0011] 1. The phase change material container installed in the chassis absorbs heat and changes from solid to liquid when the computer hardware generates heat, realizing rapid heat storage and preventing the hardware temperature from rising sharply. When the temperature inside the chassis drops, the phase change material solidifies from liquid to solid, releasing the stored heat, effectively balancing the temperature inside the chassis, improving heat dissipation efficiency and realizing rational use of heat.

[0012] 2. The anti-blocking ventilation and heat dissipation mechanism in the fan box drives the upper and lower brush plates to slide back and forth on the slide rails through gears. The holes on the heat dissipation window are cleaned with a soft brush, which can effectively prevent dust from clogging the heat dissipation window, ensure the efficiency of hot air in the box to circulate to the outside, and reduce the problem of heat dissipation performance degradation caused by dust accumulation.

[0013] 3. The heat sink fin array installed in the chassis is vertically welded to the surface of the phase change material container, which greatly increases the heat dissipation area and accelerates heat exchange with the air. The phase change material container is made of high thermal conductivity copper material, which further improves the heat conduction efficiency. The thermal conductive silicone pad covering the surface of the mounting frame can fit closely with the computer hardware to ensure that heat is effectively transferred to the phase change material container. The synergistic effect of multiple aspects significantly enhances the overall heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic diagram of the overall structure of a heat dissipation and cooling box for computer hardware proposed by the present invention;

[0015] Figure 2 This is a schematic diagram of the internal structure of a heat dissipation and cooling box for computer hardware proposed by the present invention;

[0016] Figure 3 This is a schematic diagram of the internal structure of a heat dissipation and cooling box for computer hardware and a fan box proposed by the present invention. Figure 1 ;

[0017] Figure 4 This is a schematic diagram of the internal structure of a heat dissipation and cooling box for computer hardware and a fan box proposed by the present invention. Figure 2 ;

[0018] Figure 5 This is a schematic diagram of the internal structure of a fan box for heat dissipation and cooling box for computer hardware proposed by the present invention;

[0019] Figure 6 for Figure 5 A partial enlarged view of point A in the middle.

[0020] Among them, 1. chassis, 2. cabinet door, 3. mounting frame, 4. phase change material container, 5. heat dissipation window, 6. fan box, 7. anti-blocking ventilation and heat dissipation mechanism, 71. upper brush plate, 72. lower brush plate, 73. slide rail, 74. gear, 75. upper rack, 76. lower rack, 77. drive motor, 78. fan blades, 79. transmission belt, 8. heat dissipation fins, 9. ventilation holes. DETAILED DESCRIPTION

[0021] The technical solution of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0022] In the description of the present invention, it should be noted that the terms "center," "up," "down," "left," "right," "vertical," "horizontal," "inside," "outside," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended only to facilitate the description of the present invention and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be construed as limiting the present invention. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The present invention will be further described below in conjunction with the accompanying drawings.

[0023] like Figures 1-6 As shown, the present invention provides a heat dissipation and cooling box for computer hardware, including a chassis 1 and a door 2. The chassis 1 and the door 2 are detachably connected. Ventilation holes 9 are evenly opened on the top and bottom of the chassis 1. The top vents 9 are used to discharge hot air, and the bottom vents 9 are used to inhale cold air. A mounting bracket 3 is slidingly provided inside the chassis 1. The surface of the mounting bracket 3 is covered with a thermally conductive silicone pad, which can fit the computer hardware tightly to ensure effective heat conduction. A phase change material container 4 is installed under the mounting bracket 3. The phase change material container 4 is made of high thermal conductivity copper material and is filled with an organic phase change material with a melting point of 45°C. The computer hardware installed on the mounting bracket 3 When the computer hardware generates heat, the phase change material in the phase change material container 4 absorbs the heat and changes from solid to liquid, thereby realizing rapid storage of heat. When the temperature inside the box drops, the phase change material in the phase change material container 4 solidifies from liquid to solid, releasing the stored heat. The chassis 1 is equipped with heat dissipation fins 8. The heat dissipation fins 8 are arrayed and welded vertically on the surface of the phase change material container 4 to increase the heat dissipation area and accelerate heat exchange with the air. Heat dissipation windows 5 are provided on the two opposite side walls of the box, and fan boxes 6 are installed on the two opposite side walls of the box. The fan box 6 is equipped with an anti-blocking ventilation and heat dissipation mechanism 7 to accelerate the outward flow of hot air in the box.

[0024] like Figure 3-Figure 6 As shown, the anti-blocking ventilation and heat dissipation mechanism 7 includes an upper brush plate 71 and a lower brush plate 72. Slide rails 73 are installed on the inner wall of the fan box 6. The slide rails 73 are longitudinally arranged in two groups and are respectively located on both sides of the heat dissipation window 5. The upper brush plate 71 spans the heat dissipation window 5 and its two ends are slidably connected to the two groups of slide rails 73. The lower brush plate 72 spans the heat dissipation window 5 and its two ends are slidably connected to the two groups of slide rails 73. Soft brushes are evenly arranged on the surface of the upper brush plate 71 and the lower brush plate 72 facing the heat dissipation window 5. When the upper brush plate 71 and the lower brush plate 72 slide up and down on the slide rails 73, the holes on the heat dissipation window 5 are cleaned to prevent dust from clogging the holes in the heat dissipation window 5 and affecting the circulation of hot air in the box to the outside. Efficiency; the anti-blocking ventilation and heat dissipation mechanism 7 also includes a gear 74, an upper rack 75 and a lower rack 76. The gear 74 is rotatably mounted on the inner side wall of the fan box 6. The upper rack 75 and the lower rack 76 are both longitudinally slidably mounted on the inner side wall of the fan box 6. The upper rack 75 and the lower rack 76 are respectively meshed with the two sides of the gear 74. The top of the upper rack 75 is fixedly connected to the upper brush plate 71, and the bottom end of the lower rack 76 is fixedly connected to the lower brush plate 72. The reciprocating rotation of the gear 74 drives the upper rack 75 and the lower rack 76 to move back and forth, so that the upper rack 75 and the lower rack 76 respectively drive the upper brush plate 71 and the lower brush plate 72 to slide back and forth on the slide rail 73 to clean the holes in the heat dissipation window 5.

[0025] like Figure 5-Figure 6 As shown, a drive motor 77 is fixedly installed in the fan box 6, and a fan blade 78 is installed at the output end of the drive motor 77. A transmission belt 79 is arranged between the output end of the drive motor 77 and the rotating shaft of the gear 74. The drive motor 77 drives the fan blade 78 to rotate, and at the same time, the drive motor 77 drives the gear 74 to rotate through the transmission belt 79.

[0026] During specific use, when the temperature inside the chassis 1 rises, the drive motor 77 starts to work. On the one hand, the output end of the drive motor 77 drives the fan blades 78 to rotate, accelerating the hot air in the box to circulate outward through the heat dissipation window 5. On the other hand, the transmission belt 79 wound between the output end of the drive motor 77 and the rotating shaft of the gear 74 starts to transmit, driving the gear 74 to rotate. The reciprocating rotation of the gear 74 drives the upper rack 75 and the lower rack 76 meshed therewith to move back and forth. The upper rack 75 drives the upper brush plate 71 and the lower rack 76 to drive the lower brush plate 72 to slide up and down on the slide rail 73. The soft brushes on the upper brush plate 71 and the lower rack 76 clean the holes on the heat dissipation window 5 to prevent dust from clogging.

[0027] At the same time, the heat generated by the computer hardware is conducted to the phase change material container 4. The phase change material absorbs the heat and changes from solid to liquid to store the heat. The heat dissipation fins 8 in the chassis 1 increase the heat dissipation area, accelerate the heat exchange with the air, and assist in heat dissipation. When the temperature inside the chassis drops, the phase change material in the phase change material container 4 solidifies from liquid to solid, releasing the stored heat and balancing the temperature inside the chassis.

[0028] The present invention and its embodiments are described above. This description is not restrictive. The drawings show only one embodiment of the present invention, and the actual structure is not limited thereto. In short, if a person skilled in the art is inspired by this and, without departing from the purpose of the present invention, designs structures and embodiments similar to this technical solution without inventiveness, they shall fall within the scope of protection of the present invention.

Claims

1. A heat dissipation and cooling box for computer hardware, comprising a case (1) and a case door (2), wherein the case (1) and the case door (2) are detachably connected, and a mounting frame (3) is slidably provided in the case (1), characterized in that: A phase change material container (4) is installed below the mounting frame (3), and heat dissipation windows (5) are provided on both opposite side walls of the box body. A fan box (6) is installed on both opposite side walls of the box body. An anti-blocking ventilation and heat dissipation mechanism (7) is installed in the fan box (6) to accelerate the outward circulation of hot air in the box body; the anti-blocking ventilation and heat dissipation mechanism (7) comprises an upper brush plate (71) and a lower brush plate (72); a slide rail (73) is installed on the inner side wall of the fan box (6); the slide rail (73) is longitudinally arranged in two groups and is respectively located on both sides of the heat dissipation window (5); the upper brush plate (71) spans the heat dissipation window (5) and its two ends are respectively slidably connected to the two groups of slide rails (73); the lower brush plate (72) spans the heat dissipation window (5) and its two ends are respectively slidably connected to the two groups of slide rails (73); soft brushes are evenly arranged on the surface of the upper brush plate (71) and the lower brush plate (72) facing the heat dissipation window (5).

2. A heat dissipation and cooling box for computer hardware according to claim 1, characterized in that: The anti-blocking ventilation and heat dissipation mechanism (7) further comprises a gear (74), an upper rack (75) and a lower rack (76); the gear (74) is rotatably mounted on the inner side wall of the fan box (6); the upper rack (75) and the lower rack (76) are both longitudinally slidably mounted on the inner side wall of the fan box (6); the upper rack (75) and the lower rack (76) are respectively engaged with both sides of the gear (74); the top end of the upper rack (75) is fixedly connected to the upper brush plate (71); and the bottom end of the lower rack (76) is fixedly connected to the lower brush plate (72).

3. The heat dissipation and cooling box for computer hardware according to claim 2, characterized in that: A drive motor (77) is fixedly installed in the fan box (6), a fan blade (78) is installed at the output end of the drive motor (77), and a transmission belt (79) is wound between the output end of the drive motor (77) and the rotating shaft of the gear (74).

4. The heat dissipation and cooling box for computer hardware according to claim 1, characterized in that: Heat dissipation fins (8) are installed in the chassis (1), and the heat dissipation fin (8) array is vertically welded to the surface of the phase change material container (4).

5. The heat dissipation and cooling box for computer hardware according to claim 1, characterized in that: The phase change material container (4) is made of a high thermal conductivity copper material, and the interior of the phase change material container (4) is filled with an organic phase change material having a melting point of 45°C.

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