A micro heat dissipation structure for computer chips

Abstract

This invention relates to the field of chip heat dissipation technology and discloses a miniature heat dissipation structure for computer chips, including a base, a cavity fixedly connected to the top of the base, and a partition fixedly connected to the end of the cavity away from the base. Addressing the problem that ions can easily damage chips, this invention incorporates a voltage instrument and a rubber membrane inside the device. When the voltage instrument generates adsorption or repulsion, the rubber membrane slides up and down. The upward-moving rubber membrane draws air from inside the cavity into a sealed space. Subsequently, the rubber membrane moves down again, compressing the gas in the sealed space, creating high pressure, and finally expelling it outwards, completing the air-blowing process. Through the application of these components, the device achieves a bladeless, flat design while effectively dissipating heat and preventing the impact of ions on the chip through the design of compressing air with the rubber membrane.

Description

Technical Field

[0001] This invention relates to the field of chip heat dissipation equipment technology, specifically a miniature heat dissipation structure for computer chips. Background Technology

[0002] Computer system integrated circuits (ICS) are core components of computers. During use, ICS require miniature heat dissipation devices. These miniature heat dissipation devices are fanless and have a chip-based active heat dissipation structure. They mainly consist of a grille and a wire. They require a high-voltage but very low-current power supply. When powered on, the power supply applies a high voltage to the wire, creating a high-voltage electric field between the two metal electrodes. At this time, oxygen molecules in the air will ionize into positively charged cations. Driven by the electric field, this will drive the surrounding air to form a stable airflow.

[0003] However, the above method uses the piezoelectric effect for blowing, which results in the blown air containing ions. This causes dust to accumulate in the air, and the internal ions can damage the chip. To address these issues, the following solution is proposed. Summary of the Invention

[0004] To address the aforementioned technical problems, this invention provides a miniature heat dissipation structure for computer chips, comprising a base, a cavity fixedly connected to the top of the base, and a partition fixedly connected to the end of the cavity away from the base, and further comprising:

[0005] The support mechanism is fixedly connected to the inner wall of the cavity. It pressurizes and discharges the air inside the cavity to complete the air discharge.

[0006] The pressure mechanism is fixedly connected to the inner wall of the support mechanism, and draws air from outside the cavity into the cavity.

[0007] A sealing mechanism is installed on the inner wall of the support structure to adaptively seal the support structure.

[0008] Before use, the device is fixed in the required position by the base. The support mechanism forces the pressure mechanism to operate and causes the gas inside the cavity to be ejected outward. During this sliding process, the sealing mechanism will adaptively block the inside of the support mechanism.

[0009] A voltage instrument is fixedly connected to the inner wall of the partition.

[0010] Preferably, the support mechanism includes:

[0011] The flow components are located on both sides of the cavity via flow parts.

[0012] The fluid component includes an air inlet located on the side wall of the cavity, and a fixed bracket is provided at the end of the cavity away from the air inlet;

[0013] The pressure application assembly is fixedly connected to the inner wall of the cavity via a seal;

[0014] The sealing components include a sealing plate 1 fixedly connected to the inner wall of the cavity, and a sealing plate 2 fixedly connected to the inner wall of the cavity;

[0015] During operation of the pressure mechanism and the support mechanism, external air enters the inner wall of the cavity through the air inlet, and the pressure mechanism compresses the air inside the cavity, which is then discharged outward from the air outlet.

[0016] Preferably, the pressure mechanism includes:

[0017] The pressure-bearing component is fixedly connected to the side wall of the sealing plate by a compression member;

[0018] The compression component includes a rubber diaphragm fixedly connected to one side wall of the sealing plate, the side wall of the rubber diaphragm being fixedly connected to the side wall of the sealing plate, and the side wall of the rubber diaphragm being fixedly connected to the inner wall of the cavity.

[0019] The intake assembly is fixedly connected to the side wall of the pressure-bearing assembly;

[0020] The rubber diaphragm and surrounding accessories are sealed and fixed. When the rubber diaphragm slides up and down, it can compress the air between sealing plate one and sealing plate two.

[0021] Preferably, the blocking mechanism includes:

[0022] A blocking component is slidably disposed on the inner wall of a sealing plate.

[0023] The exhaust assembly is slidably disposed on the inner wall of the sealing plate 2;

[0024] When the voltage instrument is powered on, it will repeatedly generate electrostatic adsorption and electrostatic repulsion, forcing the pressure-bearing component to move the rubber diaphragm up and down.

[0025] Preferably, the flow assembly includes a mounting bracket fixedly connected to the inner wall of the air outlet;

[0026] The gas ejected from the air outlet will then be ejected outward through the fixed frame.

[0027] Preferably, the pressure-applying component includes a receiving plate fixedly connected to the side wall of the fixing frame, and a plurality of arc-shaped plates are fixedly connected to the outer wall of the receiving plate;

[0028] The airflow outside the air outlet will come into contact with the curved surfaces of several curved plates, and eventually flow towards the position above the receiving plate.

[0029] Preferably, the pressure-bearing component includes a metal sheet fixedly connected to the center of the rubber diaphragm, and a fixing rod is fixedly connected to the bottom of the metal sheet;

[0030] When the voltage instrument is running, it will rapidly generate either repulsive or adsorbent forces, and quickly switch between adsorbent and repulsive forces, causing the metal sheet to carry the rubber membrane up and down.

[0031] Preferably, the air intake assembly includes a support rod fixedly connected to the outer wall of the fixed rod, an air intake hole is provided on the side wall of the sealing plate, and a sliding groove is provided on the inner wall of the air intake hole;

[0032] Specifically, when the blocking component moves down the sealing plate to the lowest point, it will completely block the outer wall of the air intake hole. When the blocking component reaches the highest position, the lowest position of the blocking component and the lowest position of the air intake hole will form an air intake gap.

[0033] Preferably, the blocking assembly includes a sliding baffle that is slidably connected to the inner wall of the sealing plate, a protruding baffle that is fixedly connected to the bottom of the sliding baffle, and the side wall of the support rod that is fixedly connected to the side wall of the sliding baffle.

[0034] When the sliding baffle moves to its highest position, a gap will be formed between the protruding baffle and the air intake hole.

[0035] The present invention has the following beneficial effects:

[0036] (1) In view of the problem that electro-ions can easily damage chips, the present invention provides a voltage instrument and a rubber membrane inside the device. When the voltage instrument generates an adsorption or repulsion force, the rubber membrane will slide up and down. The upward-moving rubber membrane will draw air from the cavity and enter the sealed space. Then the rubber membrane moves down again, squeezing the gas in the sealed space to form high pressure, and finally discharges it outward to complete the blowing process. Through the application of the above components, the device can meet the requirements of the bladeless flat design, and at the same time, through the design of squeezing the air by squeezing the rubber membrane, it can effectively dissipate heat and avoid the influence of electro-ions on the chip.

[0037] (2) The present invention utilizes the sliding characteristics of the rubber membrane to set up a pressure mechanism and a sealing mechanism inside the device. After the support rod moves to the highest position, a gap appears between the protruding baffle and the air inlet hole, and gas flows in. At this time, the sliding baffle two will completely block the outer wall of the air outlet hole. Through the design of the above components, when air enters the sealed space, the heat emitted by the chip enters the sealed space through the gap between the sliding baffle two and the air outlet hole, and the heat emitted by the chip is drawn in, causing the phenomenon of hot air backflow, which affects the heat dissipation effect.

[0038] (3) The present invention utilizes the characteristics of the sliding baffle 2 and the sliding baffle 1 moving up and down. The sliding baffle 1 will only have an air intake gap between the protruding baffle and the air intake hole when it reaches the highest position. At other times, the sliding baffle 1 will block the air intake hole. The sliding baffle 2 will only have an exhaust gap between it and the air outlet hole when it moves down to the lowest position. Through the application of the above components, the rubber membrane will squeeze the air inside the sealed space when it does not reach the lowest position, thereby increasing the speed at which the air is ejected outward and improving the heat dissipation efficiency.

[0039] (4) In this invention, the high-pressure gas is sprayed out from the air outlet and flows along the inner wall of the receiving plate. During this process, the airflow will contact the arc surfaces of several arc plates and cause the airflow to flow along the outer wall of the voltage instrument towards the chip position. The airflow is affected by the differentiation of multiple arc plates and will be directly in front of the chip. Through the application of the above components, the conventional air outlet and the equipment are not at the same level. This causes the gas sprayed from the air outlet to first contact the hot air around the chip, and then the airflow carries the heat to the other end. During this process, the temperature of the air is close to the temperature emitted by the chip, making it difficult for the airflow to dissipate heat to the subsequent areas of the chip. Attached Figure Description

[0040] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0041] Figure 1 This is a cross-sectional view of the overall structure of the present invention;

[0042] Figure 2 This is a schematic diagram of the overall structure of the present invention;

[0043] Figure 3 This is a schematic diagram of the flow component of the present invention;

[0044] Figure 4 This is a schematic diagram of the pressure application component of the present invention;

[0045] Figure 5 For the present invention Figure 4 Enlarged view of point A in the middle;

[0046] Figure 6 This is a cross-sectional schematic diagram of the air intake assembly of the present invention;

[0047] Figure 7 For the present invention Figure 6 Enlarged view of point B in the middle;

[0048] Figure 8 For the present invention Figure 6 Enlarged diagram of point C in the middle.

[0049] The attached diagram lists the components represented by each number as follows:

[0050] In the diagram: 1. Support mechanism; 11. Flow assembly; 12. Pressurizing assembly; 13. Base; 14. Cavity; 15. Partition; 111. Air inlet; 112. Air outlet; 113. Fixing frame; 121. Sealing plate one; 122. Sealing plate two; 123. Receiving plate; 124. Arc plate; 125. Voltage instrument; 21. Pressure-bearing assembly; 22. Air intake assembly; 211. Rubber diaphragm; 212. Metal sheet; 213. Fixing rod; 221. Support rod; 222. Air inlet hole; 223. Sliding groove one; 3. Blocking mechanism; 31. Blocking assembly; 32. Exhaust assembly; 311. Sliding baffle one; 312. Protruding baffle; 321. Air outlet hole; 322. Sliding baffle two; 323. Sliding groove two. Detailed Implementation

[0051] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0052] Example 1, please refer to Figures 1-6 This invention relates to a miniature heat dissipation structure for computer chips, comprising a base 13, a cavity 14 fixedly connected to the top of the base 13, and a partition 15 fixedly connected to the end of the cavity 14 away from the base 13, and further comprising:

[0053] Support mechanism 1 is fixedly connected to the inner wall of cavity 14. By pressurizing and releasing the air inside cavity 14, air discharge is completed.

[0054] The pressure mechanism is fixedly connected to the inner wall of the support mechanism 1, and draws air from outside the cavity 14 into the cavity 14.

[0055] The sealing mechanism 3 is installed on the inner wall of the support mechanism 1 and is used to adaptively seal the support mechanism 1.

[0056] Before use, the device is fixed in the required position by the base 13. The support mechanism 1 forces the pressure mechanism to operate and causes the gas inside the cavity 14 to be ejected outward. During this sliding process, the sealing mechanism 3 will adaptively block the inside of the support mechanism 1.

[0057] A voltage instrument 125 is fixedly connected to the inner wall of the partition 15;

[0058] Before use, fix the base 13 directly above the chip, and then turn on the power to the voltage instrument 125. This allows the voltage instrument 125 to quickly switch between generating adsorption and repulsion forces. The specific model of the voltage instrument 125 is: EMCO Q series miniature high voltage generator, such as Q50-5.

[0059] Supporting mechanism 1 includes:

[0060] The flow assembly 11 is provided on both sides of the cavity 14 via a flow element;

[0061] The fluid component includes an air inlet 111 opened on the side wall of the cavity 14, and a fixing frame 113 is provided at the end of the cavity 14 away from the air inlet 111.

[0062] Pressure application assembly 12 is fixedly connected to the inner wall of cavity 14 by a sealing element;

[0063] The sealing element includes a sealing plate 121 fixedly connected to the inner wall of the cavity 14, and a sealing plate 122 fixedly connected to the inner wall of the cavity 14.

[0064] During operation of the pressure mechanism and the support mechanism 1, external air enters the inner wall of the cavity 14 through the air inlet 111, and the pressure mechanism compresses the air inside the cavity 14, which is then discharged outward from the air outlet 112.

[0065] Pressure mechanisms include:

[0066] The pressure-bearing component 21 is fixedly connected to the side wall of the sealing plate 121 via a compression member;

[0067] The compression component includes a rubber diaphragm 211 fixedly connected to the side wall of the sealing plate 121. The side wall of the rubber diaphragm 211 is fixedly connected to the side wall of the sealing plate 122 and the side wall of the cavity 14.

[0068] To address the issue of ions easily damaging chips, a voltage instrument 125 and a rubber membrane 211 are installed inside the device. When the voltage instrument 125 generates an adsorption or repulsion force, the rubber membrane 211 will slide up and down. The upward-moving rubber membrane 211 will draw air from inside the cavity 14 into the sealed space. Subsequently, the rubber membrane 211 will move down again, compressing the gas in the sealed space to form high pressure, which will eventually be discharged outward, completing the blowing process. Through the application of the above components, the device can meet the requirements of a bladeless flat design, and by compressing the air through the rubber membrane 211, it can effectively dissipate heat while avoiding the impact of ions on the chip.

[0069] The intake assembly 22 is fixedly connected to the side wall of the pressure-bearing assembly 21;

[0070] The rubber diaphragm 211 is sealed and fixed to the surrounding accessories. When the rubber diaphragm 211 slides up and down, it can compress the air between the sealing plate 121 and the sealing plate 122.

[0071] Blocking mechanism 3 includes:

[0072] Blocking component 31 is slidably disposed on the inner wall of sealing plate 121;

[0073] Exhaust assembly 32 is slidably disposed on the inner wall of sealing plate 122;

[0074] When the voltage instrument 125 is powered on, it will generate electrostatic adsorption and electrostatic repulsion, which will force the pressure-bearing component 21 to drive the rubber diaphragm 211 to swing up and down.

[0075] Example 2, please refer to Figures 2-8 The present invention is a miniature heat dissipation structure for computer chips. Based on Example 1, the flow component 11 includes a fixing bracket 113 fixedly connected to the inner wall of the air outlet 112.

[0076] The gas ejected from the air outlet 112 will be ejected outward through the mounting bracket 113.

[0077] The pressure application component 12 includes a support plate 123 fixedly connected to the side wall of the fixed frame 113, and a plurality of arc-shaped plates 124 are fixedly connected to the outer wall of the support plate 123.

[0078] The airflow outside the air outlet 112 will come into contact with the curved surfaces of several curved plates 124 and eventually flow towards the position above the receiving plate 123.

[0079] After the high-pressure gas is ejected from the air outlet 112, it will flow along the inner wall of the receiving plate 123. During this process, the airflow will come into contact with the arc surfaces of several arc plates 124, causing the airflow to flow along the outer wall of the voltage instrument 125 towards the chip position. Due to the influence of the multiple arc plates 124, the airflow will be directly in front of the chip. By using the above components, the conventional air outlet 112 is avoided from being at the same level as the equipment. This would cause the gas ejected from the air outlet 112 to first come into contact with the hot air around the chip, and then the airflow would carry the heat to the other end. During this process, the temperature of the air is close to the temperature emitted by the chip, making it difficult for the airflow to dissipate heat to the subsequent areas of the chip.

[0080] The pressure-bearing component 21 includes a metal sheet 212 fixedly connected to the center of the rubber diaphragm 211, and a fixing rod 213 fixedly connected to the bottom of the metal sheet 212;

[0081] When the voltage instrument 125 is running, it will quickly generate a repulsive force or an adsorption force, and quickly switch between the adsorption force and the repulsive force, so that the metal sheet 212 carries the rubber membrane 211 and moves up and down.

[0082] The air intake assembly 22 includes a support rod 221 fixedly connected to the outer wall of the fixed rod 213, an air intake hole 222 is provided on the side wall of the sealing plate 121, and a sliding groove 223 is provided on the inner wall of the air intake hole 222.

[0083] When the blocking component 31 moves down along the sealing plate 121 to the lowest point, it will completely block the outer wall of the air intake hole 222. When the blocking component 31 reaches the highest position, the lowest position of the blocking component 31 and the lowest position of the air intake hole 222 will form an air intake gap.

[0084] The blocking assembly 31 includes a sliding baffle 311 slidably connected to the inner wall of the sealing plate 121, a protruding baffle 312 fixedly connected to the bottom of the sliding baffle 311, and the side wall of the support rod 221 fixedly connected to the side wall of the sliding baffle 311.

[0085] When the sliding baffle 311 moves to its highest position, a gap will be formed between the protruding baffle 312 and the air intake hole 222.

[0086] The exhaust assembly 32 includes an exhaust hole 321 opened on the side wall of the sealing plate 2 122, a sliding baffle 2 322 slidably connected to the inner wall of the sealing plate 2 122, a sliding groove 2 323 opened on the inner wall of the exhaust hole 321, and a support rod 221 whose end away from the sliding baffle 1 311 is fixedly connected to the side wall of the sliding baffle 2 322.

[0087] When the voltage instrument 125 generates an adsorption force, it forces the metal sheet 212 to move the central part of the rubber membrane 211 upwards synchronously. Since a sealed space is formed between the rubber membrane 211 and the sealing plates 121 and 122, the rubber membrane 211 moves the support rod 221 upwards synchronously via the fixing rod 213. At this time, the support rod 221 moves the sliding baffles 311 and 322 upwards synchronously. When the sliding baffle 311 reaches its highest position, the air entering the cavity 14 from the air inlet 111 enters the bottom of the rubber membrane 211 through the gap between the protruding baffle 312 and the air inlet 222, presenting a shape like... Figure 7 The state shown;

[0088] When the rubber diaphragm 211 slides up and down, the support rod 221 will drive the sliding baffle 2 322 and the sliding baffle 1 311 to slide up and down synchronously.

[0089] The voltage instrument 125 will generate a repulsive force again, causing the metal sheet 212 to slide downwards again. At this time, the rubber diaphragm 211 will compress the air inside the sealed space. After the support rod 221 slides down a short distance, the protruding baffle 312 will first block the air inlet 222. The sliding baffle 322 has not yet left the range of the air outlet 321. At this time, the air in the sealed space will change towards high pressure as the rubber diaphragm 211 moves downwards. When the rubber diaphragm 211 reaches the lowest position, the top of the sliding baffle 322 and the top of the air outlet 321 will form an exhaust gap. The high-pressure air in the sealed space will be discharged outwards through the exhaust gap.

[0090] One specific application of this embodiment is as follows: Before use, the base 13 is fixed directly above the chip, and then the power supply of the voltage instrument 125 is turned on. This allows the voltage instrument 125 to quickly switch between generating adsorption and repulsion forces. The specific model of the voltage instrument 125 is: a miniature high-voltage generator EMCO Q series, such as Q50-5;

[0091] When the voltage instrument 125 generates an adsorption force, it forces the metal sheet 212 to move the central part of the rubber membrane 211 upwards synchronously. Since a sealed space is formed between the rubber membrane 211 and the sealing plates 121 and 122, the rubber membrane 211 moves the support rod 221 upwards synchronously via the fixing rod 213. At this time, the support rod 221 moves the sliding baffles 311 and 322 upwards synchronously. When the sliding baffle 311 reaches its highest position, the air entering the cavity 14 from the air inlet 111 enters the bottom of the rubber membrane 211 through the gap between the protruding baffle 312 and the air inlet 222, presenting a shape like... Figure 7 As shown in the diagram; then the voltage instrument 125 will generate a repulsive force again, causing the metal sheet 212 to slide downwards again. At this time, the rubber diaphragm 211 will squeeze the air inside the sealed space, and after the support rod 221 slides down a short distance, the protruding baffle 312 will first block the air inlet hole 222, while the sliding baffle 222 has not yet left the range of the air outlet hole 321. At this time, the air in the sealed space will change towards high pressure as the rubber diaphragm 211 moves downwards, and when the rubber diaphragm 211 reaches the lowest position, the top of the sliding baffle 222 and the top of the air outlet hole 321 will form an exhaust gap, and the high pressure air in the sealed space will be discharged outwards through the exhaust gap;

[0092] The air discharged outward will flow along the inner wall of the receiving plate 123, and during this process, the airflow will contact the arc surfaces of several arc plates 124, causing the airflow to flow along the outer wall of the voltage instrument 125 toward the chip position.

[0093] The preferred embodiments of the present invention disclosed above are merely illustrative of the invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the invention to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to better understand and utilize the invention. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. A miniature heat dissipation structure for a computer chip, comprising a base (13), a cavity (14) fixedly connected to the top of the base (13), and a partition (15) fixedly connected to one end of the cavity (14) away from the base (13); characterized in that, Also includes: Support mechanism (1), which is fixedly connected to the inner wall of cavity (14) for pressurizing and discharging the air inside cavity (14) to complete air discharge; Pressure mechanism, which is fixedly connected to the inner wall of the support mechanism (1), is used to draw air from outside the cavity (14) into the cavity (14); A sealing mechanism (3) is provided on the inner wall of the support mechanism (1) for adaptively sealing the support mechanism (1); Before use, the device is fixed in the required position by the base (13), the support mechanism (1) forces the pressure mechanism to run, and the gas inside the cavity (14) is ejected outward. During this process, the sealing mechanism (3) will adaptively block the inside of the support mechanism (1). A voltage instrument (125) is fixedly connected to the inner wall of the partition (15); The support mechanism (1) includes: A flow assembly (11) is provided on both sides of the cavity (14) via a flow element; The fluid component includes an air inlet (111) opened on the side wall of the cavity (14), and a fixing frame (113) is opened at the end of the cavity (14) away from the air inlet (111). Pressure application assembly (12), which is fixedly connected to the inner wall of cavity (14) by a sealing element; The sealing element includes a sealing plate one (121) fixedly connected to the inner wall of the cavity (14), and a sealing plate two (122) fixedly connected to the inner wall of the cavity (14). When the pressure mechanism and the support mechanism (1) are running, external air enters the inner wall of the cavity (14) through the air inlet (111), and the pressure mechanism squeezes the air inside the cavity (14) and finally discharges it outward from the air outlet (112). The pressure mechanism includes: The pressure-bearing component (21) is fixedly connected to the side wall of the sealing plate (121) by a compression member; The compression component includes a rubber membrane (211) fixedly connected to the side wall of the sealing plate one (121), the side wall of the rubber membrane (211) is fixedly connected to the side wall of the sealing plate two (122), and the side wall of the rubber membrane (211) is fixedly connected to the inner wall of the cavity (14). An intake assembly (22) is fixedly connected to the side wall of the pressure-bearing assembly (21); The rubber diaphragm (211) and the surrounding accessories are in a sealed and fixed state. When the rubber diaphragm (211) slides up and down, it can compress the air between the sealing plate one (121) and the sealing plate two (122). The blocking mechanism (3) includes: A blocking component (31) is slidably disposed on the inner wall of a sealing plate (121); An exhaust assembly (32) is slidably disposed on the inner wall of the sealing plate (122); When the voltage instrument (125) is powered on, it will generate electrostatic adsorption and electrostatic repulsion, which will force the pressure component (21) to drive the rubber diaphragm (211) to swing up and down.

2. The miniature heat dissipation structure for a computer chip according to claim 1, characterized in that: The circulation component (11) includes a fixing bracket (113) fixedly connected to the inner wall of the air outlet (112). The gas ejected from the air outlet (112) will be ejected outward through the fixed frame (113).

3. A miniature heat dissipation structure for a computer chip according to claim 2, characterized in that: The pressure application component (12) includes a support plate (123) fixedly connected to the side wall of the fixing frame (113), and a plurality of arc-shaped plates (124) are fixedly connected to the outer wall of the support plate (123). The airflow outside the air outlet (112) will come into contact with the arc surfaces of several arc plates (124) and eventually flow to the position above the receiving plate (123).

4. A miniature heat dissipation structure for a computer chip according to claim 3, characterized in that: The pressure-bearing component (21) includes a metal sheet (212) fixedly connected to the center of the rubber diaphragm (211), and a fixing rod (213) is fixedly connected to the bottom of the metal sheet (212). When the voltage instrument (125) is running, it will quickly generate a repulsive force or an adsorption force, and quickly switch between the adsorption force and the repulsive force, so that the metal sheet (212) carries the rubber membrane (211) up and down.

5. A miniature heat dissipation structure for a computer chip according to claim 4, characterized in that: The air intake assembly (22) includes a support rod (221) fixedly connected to the outer wall of the fixed rod (213), and an air intake hole (222) is provided on the side wall of the sealing plate (121), and a sliding groove (223) is provided on the inner wall of the air intake hole (222). When the blocking component (31) moves down along the sealing plate (121) to the lowest point, it will completely block the outer wall of the air inlet hole (222). When the blocking component (31) reaches the highest position, the lowest position of the blocking component (31) and the lowest position of the air inlet hole (222) will form an air inlet gap.

6. A miniature heat dissipation structure for a computer chip according to claim 5, characterized in that: The blocking assembly (31) includes a sliding baffle (311) slidably connected to the inner wall of the sealing plate (121), and a protruding baffle (312) is fixedly connected to the bottom of the sliding baffle (311). The side wall of the support rod (221) is fixedly connected to the side wall of the sliding baffle (311). When the sliding baffle (311) moves to its highest position, a gap will be formed between the protruding baffle (312) and the air inlet (222).

7. A miniature heat dissipation structure for a computer chip according to claim 6, characterized in that: The exhaust assembly (32) includes an exhaust hole (321) opened on the side wall of the sealing plate two (122), a sliding baffle two (322) is slidably connected to the inner wall of the sealing plate two (122), a sliding groove two (323) is opened on the inner wall of the exhaust hole (321), and the end of the support rod (221) away from the sliding baffle one (311) is fixedly connected to the side wall of the sliding baffle two (322); When the rubber membrane (211) slides up and down, the support rod (221) will drive the sliding baffle two (322) and the sliding baffle one (311) to slide up and down synchronously.

Images