Glue uniformizing device for semiconductor wafer processing

Abstract

The invention discloses a semiconductor wafer processing glue uniformizing device, which comprises a box body, a plurality of adsorption assemblies, a centering positioning mechanism, a wafer transmission mechanism and a glue dripping mechanism, and is characterized in that the interior of the box body is rotatably connected with a rotary table, and the plurality of adsorption assemblies are arranged on the upper surface of the rotary table in an annular array; the centering positioning mechanism is arranged on the rotary table; a support is arranged on one side of the box body, a supporting shaft is rotationally connected to the support, and two first connecting plates are fixedly arranged on the supporting shaft; the wafer transmission mechanism is connected with one of the first connecting plates, the wafer transmission mechanism comprises a supporting plate, a driving assembly and a plurality of grabbing assemblies, and the supporting plate is connected with the first connecting plates; the driving assembly is arranged on the lower surface of the supporting plate; the multiple grabbing assemblies are connected with the driving assembly. And the glue dripping mechanism is connected with the other first connecting plate. Therefore, centering positioning is carried out in the wafer taking and placing process, it is ensured that the wafer is placed in the center of the rotary table, the positioning precision is improved, and then the uniformity of photoresist on the surface of the wafer is improved.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor wafer processing, and in particular to a semiconductor wafer processing adhesive dispensing device. Background Art

[0002] In semiconductor manufacturing, coating is a critical step in the front-end process of photolithography. Its purpose is to evenly coat the surface of the silicon wafer with a uniform layer of photoresist. The uniformity of the coating directly affects the accuracy of subsequent processes such as photolithography, development, and etching, ultimately determining chip performance and yield.

[0003] At present, the relevant technology places the wafer on the rotating suction cup of the photoresist spreader and uses a nozzle to drip a certain amount of photoresist to the center of the wafer. The rotating suction cup then drives the wafer to rotate at a low speed (500-1500rpm), and uses centrifugal force to initially spread the photoresist from the center to the outside, covering the entire wafer surface. The rotation speed is then rapidly increased to a high speed (usually 2000-8000rpm, depending on the viscosity of the photoresist, the required thickness and process requirements) to shake off excess photoresist, achieve uniformity and control the final thickness. At the same time, the solvent begins to evaporate.

[0004] To improve photoresist coating efficiency and reduce manual intervention and contamination risks, modern photoresist coating equipment generally uses automated robots for wafer loading and unloading. These robots are responsible for picking up wafers from an input carrier, placing them on a rotating table, and retrieving them after coating is complete. However, vibrations from the robot's equipment, as well as slight deformation or wear of its components caused by prolonged use, can cause slight tilt or offset when gripping and releasing the wafer, affecting the uniformity of the photoresist coating on the wafer surface. Summary of the Invention

[0005] The present application aims to solve one of the technical problems in the related art at least to a certain extent.

[0006] To this end, one purpose of this application is to propose a semiconductor wafer processing photoresist uniformity device, which performs centering during the wafer placement process to ensure that the wafer is placed in the center of the turntable, improve positioning accuracy, and thereby improve the uniformity of the photoresist on the wafer surface.

[0007] To achieve the above-mentioned objectives, the first embodiment of the present application proposes a semiconductor wafer processing glue spreading device, comprising a box body, multiple adsorption components, a centering positioning mechanism, a wafer transmission mechanism and a glue dripping mechanism, wherein the interior of the box body is rotatably connected to a turntable, and multiple adsorption components are arranged in a circular array on the upper surface of the turntable; the centering positioning mechanism is arranged on the turntable; a bracket is provided on one side of the box body, and a support shaft is rotatably connected to the bracket, and two first connecting plates are fixed on the support shaft, and the two first connecting plates are perpendicular to each other; the wafer transmission mechanism is connected to one of the first connecting plates, and the wafer transmission mechanism includes a support plate, a drive component and multiple grabbing components, wherein the support plate is connected to the first connecting plate; the drive component is arranged on the lower surface of the support plate; multiple grabbing components are respectively connected to the drive component; and the glue dripping mechanism is connected to another first connecting plate.

[0008] In addition, the semiconductor wafer processing adhesive dispensing device proposed in the present application may also have the following additional technical features:

[0009] In one embodiment of the present application, the centering positioning mechanism includes a rotating shaft, a full gear and multiple centering components, wherein the rotating shaft is rotatably arranged at the center of the turntable; the full gear is arranged on the rotating shaft; and the multiple centering components are evenly distributed around the full gear.

[0010] In one embodiment of the present application, the centering component includes an incomplete gear, a second connecting plate, a connecting rod and a roller body, wherein the incomplete gear is rotatably arranged above the turntable through a connecting shaft, and the incomplete gear is meshed and connected with the complete gear; the two ends of the second connecting plate are respectively connected to the incomplete gear and the connecting rod; and the roller body is rotatably arranged on the top of the connecting rod.

[0011] In one embodiment of the present application, the adsorption assembly includes an electric push rod and a vacuum suction cup, wherein the electric push rod is arranged on the turntable, and the output end of the electric push rod is connected to the vacuum suction cup.

[0012] In one embodiment of the present application, the driving assembly includes a driving member, a rotating plate, a central shaft and a push rod, wherein the driving member and the central shaft are both arranged on the lower surface of the support plate; one end of the push rod is connected to the central shaft, and the other end of the push rod is connected to the output end of the driving member; the rotating plate is arranged on the central shaft.

[0013] In one embodiment of the present application, the grabbing assembly includes a third connecting plate, a grabbing plate, a guide rail and a slider, wherein the guide rail is arranged on the lower surface of the support plate; the slider is slidingly connected to the guide rail; the grabbing plate is connected to the slider; and the two ends of the third connecting plate are respectively connected to the rotating plate and the grabbing plate.

[0014] In one embodiment of the present application, the glue dripping mechanism includes a support frame, a slide module, a skateboard and a dripping gun, wherein the support frame is arranged at the end of the first connecting plate, and a slide groove is provided on the support frame; the slide module is arranged on the support frame, and a slide is slidably connected to the slide module; one end of the skateboard is connected to the slide, and the other end of the skateboard is connected to the dripping gun through the slide groove.

[0015] Compared with the prior art, the present invention has at least the following beneficial effects: the driving assembly can simultaneously drive multiple grasping assemblies to move centrifugally and centrifugally to grasp and release the wafer in a centered manner, and then the wafer is centered again using the centered positioning mechanism to ensure that the wafer is placed in the center of the turntable, thereby improving the positioning accuracy and thereby improving the uniformity of the photoresist on the wafer surface.

[0016] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the following description of the embodiments in conjunction with the accompanying drawings, in which:

[0018] Figure 1 This is a structural diagram of a semiconductor wafer processing adhesive dispensing device according to an embodiment of the present application;

[0019] Figure 2 This is a structural schematic diagram of a centering positioning mechanism in a semiconductor wafer processing adhesive dispensing device according to an embodiment of the present application;

[0020] Figure 3 This is a structural schematic diagram of a wafer transfer mechanism in a semiconductor wafer processing adhesive dispensing device according to an embodiment of the present application;

[0021] Figure 4 This is a structural diagram of a grabbing assembly in a semiconductor wafer processing adhesive dispensing device according to an embodiment of the present application;

[0022] Figure 5 This is a structural schematic diagram of a glue dripping mechanism in a semiconductor wafer processing glue spreading device according to an embodiment of the present application.

[0023] As shown in the figure: 1. Box body; 2. Adsorption component; 3. Centering positioning mechanism; 4. Wafer transfer mechanism; 5. Glue dripping mechanism; 6. Turntable; 7. Bracket; 8. Support shaft; 9. First connecting plate; 21. Electric push rod; 22. Vacuum suction cup; 31. Rotating shaft; 32. Complete gear; 33. Centering component; 331. Incomplete gear; 332. Second connecting plate; 333. Connecting rod; 334. Roller body; 41. Support plate; 42. Drive component; 43. Grabbing component; 421. Drive member; 422. Turntable; 423. Center shaft; 424. Push rod; 431. Third connecting plate; 432. Grabbing plate; 433. Guide rail; 434. Slider; 51. Support frame; 52. Slide module; 53. Slide plate; 54. Dropping gun. DETAILED DESCRIPTION

[0024] The embodiments of the present application are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present application and are not to be construed as limiting the present application. On the contrary, the embodiments of the present application include all variations, modifications, and equivalents that fall within the spirit and scope of the appended claims.

[0025] The following describes a semiconductor wafer processing adhesive dispensing device according to an embodiment of the present application with reference to the accompanying drawings.

[0026] like Figures 1 to 4 As shown, the semiconductor wafer processing glue dispensing device of the embodiment of the present application may include a box body 1, multiple adsorption components 2, a centering positioning mechanism 3, a wafer conveying mechanism 4 and a glue dispensing mechanism 5.

[0027] The interior of the box body 1 is rotatably connected to a turntable 6 , a plurality of adsorption components 2 are arranged in a circular array on the upper surface of the turntable 6 , and a centering positioning mechanism 3 is arranged on the turntable 6 .

[0028] It should be noted that the box body 1 is a hollow cavity structure with an upper opening, the turntable 6 is arranged horizontally, and the turntable 6 is connected to an external motor. The motor can drive the turntable 6 to rotate. The rotation speed of the turntable 6 can be precisely controlled by the controller to ensure that the photoresist can be evenly spread on the surface of the wafer.

[0029] Furthermore, three adsorption components 2 can be provided and arranged in an equilateral triangle. The adsorption components 2 can stably adsorb the wafer and can also adjust the height of the wafer as needed.

[0030] In the embodiment of the present application, the centering positioning mechanism 3 can ensure that the center of the wafer and the center of the turntable 6 are on the same vertical line, which is conducive to the uniform dispersion of the photoresist and ensures the uniform thickness of the photoresist.

[0031] A bracket 7 is provided on one side of the box body 1 , and a support shaft 8 is rotatably connected to the bracket 7 . Two first connecting plates 9 are fixedly provided on the support shaft 8 , and the two first connecting plates 9 are perpendicular to each other.

[0032] It should be noted that the bracket 7 is a U-shaped plate structure, and the bracket 7 supports the support shaft 8. One end of the support shaft 8 is connected to an external drive motor, and the motor can drive the support shaft 8 to rotate 90 degrees.

[0033] The wafer transfer mechanism 4 is connected to one of the first connecting plates 9. The wafer transfer mechanism 4 includes a support plate 41, a drive component 42 and multiple grabbing components 43, wherein the support plate 41 is connected to the first connecting plate 9; the drive component 42 is arranged on the lower surface of the support plate 41; multiple grabbing components 43 are respectively connected to the drive component 42; and the glue dripping mechanism 5 is connected to the other first connecting plate 9.

[0034] In an embodiment of the present application, three grasping components 43 may be provided. When the driving component 42 is started, the grasping component 43 can move toward the center of the support plate 41 or away from the center of the support plate 41 to facilitate the grasping and releasing of the wafer. At the same time, it can also ensure that during the process of conveying the wafer, the wafer can be centered below the support plate 41.

[0035] Furthermore, the glue dripping mechanism 5 can drip the photoresist liquid into the center of the wafer, and the dripping volume can be precisely controlled by the controller.

[0036] In one embodiment of the present application, Figure 2 As shown, the centering positioning mechanism 3 includes a rotating shaft 31, a full gear 32 and multiple centering components 33, wherein the rotating shaft 31 is rotatably set at the center of the turntable 6; the full gear 32 is set on the rotating shaft 31; and multiple centering components 33 are evenly distributed around the full gear 32.

[0037] It should be noted that there can be three centering components 33, and they are arranged in a circular array. One end of the rotating shaft 31 is connected to an external drive motor, which can drive the full gear 32 to rotate a certain angle through the motor, thereby adjusting the position of the centering component 33.

[0038] Further, if Figure 2 As shown, the centering component 33 includes an incomplete gear 331, a second connecting plate 332, a connecting rod 333 and a roller body 334, wherein the incomplete gear 331 is rotatably set above the turntable 6 through a connecting shaft, and the incomplete gear 331 is meshed and connected with the complete gear 32; the two ends of the second connecting plate 332 are respectively connected to the incomplete gear 331 and the connecting rod 333; the roller body 334 is rotatably set on the top of the connecting rod 333.

[0039] In an embodiment of the present application, the roller body 334 may be made of an elastic material so as not to damage the wafer when the wafer is centered.

[0040] Furthermore, when the complete gear 32 rotates, in cooperation with the incomplete gear 331 , it drives the second connecting plate 332 , the connecting rod 333 and the roller 334 to rotate a certain angle, so that the roller 334 moves close to the edge of the wafer, thereby centering the wafer.

[0041] In one embodiment of the present application, Figure 2 As shown, the adsorption assembly 2 includes an electric push rod 21 and a vacuum suction cup 22 , wherein the electric push rod 21 is arranged on the turntable 6 , and the output end of the electric push rod 21 is connected to the vacuum suction cup 22 .

[0042] In an embodiment of the present application, the electric push rod 21 can adjust the height of the vacuum suction cup 22, so as to facilitate the pickup or placement of the wafer from the vacuum suction cup 22, and when the wafer is higher than the roller body 334, by driving the full gear 32 to rotate, the roller body 334 can be hidden under the wafer, and in the process of spreading the photoresist on the wafer surface, the photoresist will not contaminate the roller body 334.

[0043] In one embodiment of the present application, Figure 3 and Figure 4 As shown, the driving assembly 42 includes a driving member 421, a rotating plate 422, a central shaft 423 and a push rod 424, wherein the driving member 421 and the central shaft 423 are both arranged on the lower surface of the support plate 41; one end of the push rod 424 is connected to the central shaft 423, and the other end of the push rod 424 is connected to the output end of the driving member 421; the rotating plate 422 is arranged on the central shaft 423.

[0044] It should be noted that the driving member 42 can be a pneumatic rod, and the driving member 421 can drive the central shaft 423 and the rotating plate 422 to rotate a certain angle, thereby adjusting the position of the grabbing assembly 43.

[0045] Further, if Figure 3 As shown, the grabbing assembly 43 includes a third connecting plate 431, a grabbing plate 432, a guide rail 433 and a slider 434, wherein the guide rail 433 is arranged on the lower surface of the support plate 41; the slider 434 is slidingly connected to the guide rail 433; the grabbing plate 432 is connected to the slider 434; and the two ends of the third connecting plate 431 are respectively connected to the rotating plate 422 and the grabbing plate 432.

[0046] It should be noted that the extension line of the guide rail 433 passes through the center of the support plate 41. The guide rail 433 and the slider 434 can guide the moving direction of the grabbing plate 432. The grabbing plate 432 is a U-shaped plate. The grabbing plate 432 can grab or release the wafer and ensure that the wafer is centered during the grabbing or releasing process.

[0047] In one embodiment of the present application, Figure 1 and Figure 5 As shown, the glue dripping mechanism 5 includes a support frame 51, a slide module 52, a slide plate 53 and a dripping gun 54, wherein the support frame 51 is arranged at the end of the first connecting plate 9, and a slide groove is provided on the support frame 51; the slide module 52 is arranged on the support frame 51, and a slide is slidably connected to the slide module 52; one end of the slide plate 53 is connected to the slide, and the other end of the slide plate 53 is connected to the dripping gun 54 through the slide groove.

[0048] It should be noted that a glue box and a liquid pump are provided on the upper surface of the bracket 7, and the liquid inlet of the liquid pump is connected to the glue box, and the liquid outlet of the liquid pump is connected to the dropper gun 54 through a conduit, so that the photoresist can be transported to the center of the wafer.

[0049] Furthermore, the slide module 52 can adjust the height of the dropper gun 54 so that the dropper gun 54 can extend into the interior of the box 1, ensuring that the bottom of the dropper gun 54 is close to the center of the wafer to avoid glue deviation due to distance difference.

[0050] Specifically, when the support plate 41 is located directly above the wafer, the relevant personnel control the drive component 42 to start, so that the multiple grabbing components 43 move toward the center of the wafer, and finally the grabbing plate 432 is inserted above and below the wafer, and then the support shaft 8 can be controlled to rotate 90 degrees. At this time, the grabbing plate 432 drives the wafer to rotate above the vacuum suction cup 22, and then the relevant personnel control the electric push rod 21 to start, and the electric push rod 21 drives the vacuum suction cup 22 to rise, and the vacuum suction cup 22 fits with the lower surface of the wafer. By controlling the grabbing plates 432 to move away from each other and separate from the wafer, the support shaft 8 is controlled to rotate in the opposite direction, the wafer transfer mechanism 4 is reset, and at the same time the glue dripping mechanism 5 rotates to directly above the wafer.

[0051] Then, the relevant personnel control the vacuum chuck 22 to move downward to drive the wafer into the interior of the box 1. Then, the centering component 33 is used to ensure that the wafer is centered and the wafer is stably sucked by the vacuum chuck 22. At this time, the wafer is adjusted again and moved upward. When the wafer is higher than the roller body 334, the gear 32 is controlled to rotate, driving the centering component 33 to rotate and hiding the roller body 334 under the wafer, thereby preventing the wafer from rotating and throwing the photoresist onto the roller body 334.

[0052] Finally, the relevant personnel control the slide module 52 to start, and the slide module 52 drives the dropper gun 54 to move downward. When the bottom of the dropper gun 54 is close to the wafer, the liquid pump can be turned on to transport the glue into the dropper gun 54, and finally drip it to the center of the wafer. Then the dropper gun 54 is reset, and the turntable 6 first rotates at a low speed, using centrifugal force to spread the photoresist from the center to the outside, covering the entire wafer surface, and then rotates at a high speed to get rid of excess photoresist to achieve uniformity.

[0053] After the glue is evenly distributed, the wafer transfer mechanism 4 rotates to the top of the wafer again, and the distance between the three grabbing plates 432 is sufficient for the wafer to pass through. At this time, the adsorption component 2 is used to lift the wafer to the center of the grabbing plate 432, and the adsorption of the wafer is released. The three grabbing plates 432 move centripetally to surround the wafer, and the adsorption component 2 moves downward and separates from the wafer. At this time, the wafer transfer mechanism 4 places the wafer after glue is distributed on the wafer rack.

[0054] In summary, the semiconductor wafer processing glue spreading device of the embodiment of the present application can simultaneously drive multiple grasping components to move centrifugally and centrifugally through the driving component to grasp and release the wafer in the center, and then use the centering positioning mechanism to center the wafer again to ensure that the wafer is placed in the center of the turntable, improve the positioning accuracy, and thereby improve the uniformity of the photoresist on the wafer surface.

[0055] In the description of this specification, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include at least one of such features. In the description of this application, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0056] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and features of different embodiments or examples without contradiction.

[0057] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and deform the above embodiments within the scope of the present application.

Claims

1. A semiconductor wafer processing adhesive dispensing device, characterized in that: It includes a box, multiple adsorption components, a centering positioning mechanism, a wafer transfer mechanism and a glue dispensing mechanism, among which, The interior of the box is rotatably connected to a turntable, and a plurality of adsorption components are arranged in a circular array on the upper surface of the turntable; The centering positioning mechanism is arranged on the turntable; A bracket is provided on one side of the box body, and a support shaft is rotatably connected to the bracket. Two first connecting plates are fixed on the support shaft, and the two first connecting plates are perpendicular to each other; The wafer transfer mechanism is connected to one of the first connecting plates, and the wafer transfer mechanism includes a support plate, a drive assembly, and a plurality of gripping assemblies, wherein: The support plate is connected to the first connecting plate; The driving assembly is arranged on the lower surface of the support plate; The plurality of grabbing assemblies are respectively connected to the driving assembly; The glue dripping mechanism is connected to another first connecting plate.

2. The semiconductor wafer processing adhesive dispensing device according to claim 1, characterized in that: The centering positioning mechanism includes a rotating shaft, a full gear and a plurality of centering components, wherein: The rotating shaft is rotatably arranged at the center of the turntable; The complete gear is arranged on the rotating shaft; A plurality of centering components are evenly distributed around the full gear.

3. The semiconductor wafer processing adhesive dispensing device according to claim 2, characterized in that: The centering assembly includes an incomplete gear, a second connecting plate, a connecting rod and a roller body, wherein: The incomplete gear is rotatably arranged above the turntable via a connecting shaft, and the incomplete gear is meshed and connected with the complete gear; Two ends of the second connecting plate are respectively connected to the incomplete gear and the connecting rod; The roller is rotatably arranged on the top of the connecting rod.

4. The semiconductor wafer processing adhesive dispensing device according to claim 1, characterized in that: The adsorption assembly includes an electric push rod and a vacuum suction cup, wherein: The electric push rod is arranged on the turntable, and the output end of the electric push rod is connected to the vacuum suction cup.

5. The semiconductor wafer processing adhesive dispensing device according to claim 1, characterized in that: The driving assembly includes a driving member, a rotating plate, a central shaft and a push rod, wherein: The driving member and the central shaft are both arranged on the lower surface of the support plate; One end of the push rod is connected to the central shaft, and the other end of the push rod is connected to the output end of the driving member; The rotating plate is arranged on the central axis.

6. The semiconductor wafer processing adhesive dispensing device according to claim 5, characterized in that: The grab assembly includes a third connecting plate, a grab plate, a guide rail and a slider, wherein: The guide rail is arranged on the lower surface of the support plate; The slider is slidably connected to the guide rail; The grab plate is connected to the slider; Two ends of the third connecting plate are respectively connected to the rotating plate and the grabbing plate.

7. The semiconductor wafer processing adhesive dispensing device according to claim 1, characterized in that: The glue dripping mechanism includes a support frame, a slide module, a slide plate and a dripping gun, wherein: The support frame is arranged at the end of the first connecting plate, and a sliding groove is provided on the support frame; The slide module is arranged on the support frame, and a slide is slidably connected to the slide module; One end of the slide is connected to the slide platform, and the other end of the slide passes through the slide groove and is connected to the drip gun.

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