Substrate transfer robot, substrate processing system, and control method of substrate transfer robot

Abstract

The invention relates to a substrate transfer robot, a substrate processing system, and a control method of the substrate transfer robot. The substrate transfer robot includes: a hand configured to support a substrate in a horizontal posture; an advancing and retreating unit and a linear moving unit that move the hand in the horizontal direction; and a robot control unit. The robot control unit supports a substrate on which a liquid film is formed on the upper surface of the substrate with a hand, acquires a first range of acceleration / deceleration for moving the hand in accordance with the state of the liquid film, and moves the hand within the first range of acceleration / deceleration by means of at least one of the advancing and retreating unit and the linear moving unit.

Description

Technical Field

[0001] The present invention relates to a substrate transfer robot that transfers substrates in a horizontal position, a substrate processing system including the substrate transfer robot, and a control method for the substrate transfer robot. Examples of substrates include semiconductor substrates, FPD (Flat Panel Display) substrates, photomask glass substrates, optical disc substrates, magnetic disk substrates, ceramic substrates, and solar cell substrates. Examples of FPDs include liquid crystal displays and organic EL (electroluminescence) displays. Background Art

[0002] The substrate processing system is equipped with a transfer arm (substrate transfer robot) for transferring substrates (see, for example, Japanese Patent Publication Nos. 2011-161521 and 2012-121680). The transfer arm has a fork (hand) that can move forward and backward. The fork has four holding claws to hold the substrate at four locations around its periphery. Each of the four holding claws is equipped with four strain sensors (strain gauges). The strain sensors detect the amount of deformation of the holding claws when a load is applied from above.

[0003] Japanese Patent Application Laid-Open No. 04-152654 discloses a wafer processing arm capable of measuring the load applied to a wafer support using a total of four load detection elements. Japanese Patent Application Laid-Open No. 2000-012430 discloses a substrate coating device comprising three lift pins for raising and lowering a substrate, and a weighing mechanism for measuring the weight of the substrate, the three lift pins, and a processing liquid while the substrate is elevated by the three lift pins. Furthermore, Japanese Patent Application Laid-Open No. 2016-217804 discloses a multi-axis tactile sensor.

[0004] Japanese Patent Application Laid-Open No. 2024-001576 discloses a substrate processing apparatus (substrate processing system) that employs both batch and single-wafer processing methods (a so-called hybrid method). The batch method processes multiple substrates simultaneously in a vertical position. The single-wafer method processes a single substrate W in a horizontal position. Summary of the Invention

[0005] [Problems to be solved by the invention]

[0006] In the substrate processing system disclosed in Japanese Patent Application Laid-Open No. 2024-001576, if the substrate dries out after processing in the batch processing unit before processing in the single-wafer processing unit, there is a concern that the pattern formed on the substrate may collapse. Therefore, to prevent the substrate from drying out, the substrate is transported in a horizontal position with liquid on the upper surface of the substrate where the pattern is formed. However, if the liquid on the upper surface of the substrate spills during transport, there is a concern that the substrate may dry out, which is undesirable.

[0007] The present invention has been made in view of such circumstances, and an object of the present invention is to provide a substrate transfer robot, a substrate processing system, and a control method for the substrate transfer robot that can prevent liquid from spilling from the upper surface of a substrate during transfer.

[0008] [Technical means to solve the problem]

[0009] To achieve this object, the present invention employs the following configuration. Specifically, the present invention provides a substrate transfer robot for transferring a substrate, comprising: a hand for supporting a substrate in a horizontal position; a moving unit for moving the hand in a horizontal direction; and a control unit; wherein the control unit supports the substrate with a liquid film formed on the upper surface of the substrate with the hand; obtains a first range of acceleration and deceleration for moving the hand corresponding to the state of the liquid film; and moves the hand within the first range of acceleration and deceleration via the moving unit.

[0010] According to the substrate transfer robot of the present invention, a first range of acceleration and deceleration for moving the hand is determined according to the state of the liquid film. The hand moves within the first range of acceleration and deceleration. This prevents liquid from spilling from the upper surface of the substrate during transfer.

[0011] Furthermore, preferably, the substrate transfer robot further comprises: a detection unit that detects a state of the liquid film; and the control unit obtains a first range of the acceleration / deceleration for moving the hand corresponding to the state of the liquid film detected by the detection unit.

[0012] The substrate transport robot includes a detection unit that detects the state of the liquid film. Therefore, the control unit can acquire a first range of acceleration and deceleration that takes into account the actual state of the liquid film detected by the detection unit. This improves the accuracy of the first range of acceleration and deceleration.

[0013] Furthermore, preferably, in the substrate transport robot, the detection unit is a weight sensor provided on the hand and measuring weight; and the control unit obtains the range of acceleration and deceleration for moving the hand corresponding to the weight of the liquid film measured by the weight sensor.

[0014] The substrate transport robot includes a weight sensor as a detection unit for detecting the state of the liquid film. The weight sensor is mounted on the hand. Therefore, the control unit can determine a first range of acceleration and deceleration that takes into account the weight of the liquid film measured by the weight sensor. Furthermore, the weight sensor is relatively small and inexpensive. Therefore, even if the weight sensor is mounted on the hand, the hand is unlikely to become larger. Consequently, space and cost issues are unlikely to arise.

[0015] In the substrate transport robot, one example of the hand includes a hand body; and a plurality of contact portions provided on the upper surface of the hand body and supporting the peripheral edge of the substrate; and one example of the weight sensor is provided between any one of the plurality of contact portions and the hand body. The plurality of contact portions support the peripheral edge of the substrate. Therefore, the weight sensor can measure the weight at any one of the plurality of contact portions. Furthermore, based on the weight measured at the position, a first range of acceleration and deceleration can be obtained.

[0016] In addition, preferably, in the substrate transport robot, the first range of the acceleration / deceleration is an allowable range of the acceleration / deceleration that is narrower than a limit range of the acceleration / deceleration in which liquid will not spill from the substrate due to the movement of the liquid of the liquid film; and the control unit monitors the weight change of the liquid moving on the upper surface of the substrate in the measuring position of the weight sensor based on the weight value measured by the weight sensor during the movement of the hand, and controls the acceleration / deceleration of the hand in a manner so that the weight change falls within the change range corresponding to the allowable range of the acceleration / deceleration.

[0017] The limit range of acceleration and deceleration is a range in which liquid will not spill from the substrate. In addition, the permissible range of acceleration and deceleration is a range narrower than the limit range. Therefore, as long as the acceleration and deceleration is within the permissible range, liquid will not spill. However, there are cases where the relationship between the permissible range and the variation range changes due to certain reasons. In this case, the possibility of liquid spilling increases. In this case, the variation range can also be used as a threshold value, and when the weight variation deviates, the weight variation can be adjusted so that it falls within the variation range. Therefore, liquid spilling can be prevented.

[0018] Furthermore, in the substrate transport robot, the control unit preferably acquires a first range of acceleration and deceleration for moving the hand, corresponding to the state of the liquid film and the type of substrate. The first range of acceleration and deceleration for moving the hand is acquired in accordance with the type of substrate and the state of the liquid film. The hand moves within the first range of acceleration and deceleration. This prevents liquid from spilling from the upper surface of the substrate during transport.

[0019] Furthermore, in the substrate transport robot, preferably, the substrate type includes wettability of the substrate W. The first range of acceleration and deceleration is a range that takes wettability of the substrate W into consideration, thereby improving the accuracy of the permissible range of acceleration and deceleration.

[0020] Furthermore, in the substrate transfer robot, the control unit preferably uses a lookup table to obtain the first range of acceleration and deceleration for moving the hand corresponding to the state of the liquid film and the type of the substrate. The first range of acceleration and deceleration can be easily obtained using the lookup table.

[0021] In addition, preferably, the substrate transport robot further comprises: a detection unit for detecting the state of the liquid film; and a storage unit for storing a plurality of relationship data that are different in the state of the liquid film; and each of the plurality of relationship data has a relationship expression between the state change of the liquid film and the acceleration / deceleration, and a first range of the acceleration / deceleration in the relationship expression; when the control unit moves the hand at an acceleration / deceleration preset by the moving unit, the detection unit detects the state change of the liquid film, and by comparing the preset acceleration / deceleration and the detected state change of the liquid film with the relationship expression of each of the plurality of relationship data, one relationship data having the best relationship expression is extracted from the plurality of relationship data, and the first range of the acceleration / deceleration possessed by the one relationship data is obtained.

[0022] For example, even if the conditions regarding the type of substrate are insufficient, it is possible to obtain optimal (approximate) relationship data from a plurality of existing relationship data, thereby obtaining the first range of acceleration and deceleration included in the relationship data.

[0023] In addition, preferably, the substrate transport robot further includes: a rotating unit that rotates the hand around a vertical axis; and the control unit obtains a second range of rotational acceleration and deceleration corresponding to the state of the liquid film for rotating the hand, and rotates the hand within the second range through the rotating unit.

[0024] According to the substrate transfer robot of the present invention, a second range of rotational acceleration / deceleration for rotating the hand is obtained according to the state of the liquid film, and the hand is moved within the second range of rotational acceleration / deceleration. Therefore, it is possible to prevent liquid from spilling from the upper surface of the substrate during transfer (particularly rotation).

[0025] Furthermore, a substrate processing system of the present invention is characterized in that it processes a substrate and includes the substrate transfer robot.

[0026] In addition, the control method of the substrate transport robot of the present invention is characterized in that it transports the substrate, and the substrate transport robot comprises: a hand for carrying the substrate in a horizontal position; and a moving part for moving the hand in a horizontal direction; and the control method comprises: a supporting process for supporting the substrate with a liquid film formed on the upper surface of the substrate by the hand; a range acquisition process for acquiring a first range of acceleration and deceleration for the movement of the hand corresponding to the state of the liquid film; and a hand moving process for moving the hand within the first range of acceleration and deceleration by the moving part.

[0027] [Effects of the Invention]

[0028] According to the substrate transfer robot, substrate processing system, and substrate transfer robot control method of the present invention, it is possible to prevent liquid from spilling from the upper surface of the substrate during transfer. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Although several embodiments currently considered suitable are shown in the drawings for the purpose of illustrating the invention, it should be understood that the invention is not limited to the structures and measures shown in the drawings.

[0030] Figure 1 It is a plan view showing the schematic structure of the substrate processing system of Example 1.

[0031] Figures 2A to 2C It is a side view for explaining the structure and operation of the substrate processing mechanism and the first posture conversion mechanism.

[0032] Figure 3 It is a top view of the second posture conversion mechanism.

[0033] Figure 4 It means from Figure 3 A longitudinal sectional view of the rotary chuck when viewed along arrow Q.

[0034] Figure 5 It is a side view showing a schematic configuration of a substrate transfer robot.

[0035] Figure 6 It is a top view showing the hand.

[0036] Figure 7A This is a top view used to illustrate the movement of liquid during the hand's backward movement. Figure 7B It is a diagram showing the detection waveforms of four weight sensors.

[0037] Figure 8A This is a top view used to illustrate the movement of liquid during the rotation of the hand. Figure 8B It is a diagram showing the detection waveforms of four weight sensors.

[0038] Figure 9AThis is a top view used to illustrate the movement of liquid during the forward movement of the hand. Figure 9B It is a diagram showing the detection waveforms of four weight sensors.

[0039] Figure 10 This is a diagram for explaining the relationship between one of the acceleration / deceleration and the rotational acceleration / deceleration and the amount of change in the weight of the liquid.

[0040] Figure 11 This is a diagram showing an example of a comparison table.

[0041] Figure 12 This is a diagram showing an example of the relationship between the acceleration and deceleration and the weight change of the liquid in the case of a hydrophilic substrate.

[0042] Figure 13 This is a diagram showing an example of the relationship between the acceleration and deceleration and the weight change of the liquid in the case of a hydrophobic substrate.

[0043] Figure 14 This is a flowchart for explaining the operation of the substrate processing system.

[0044] Figures 15A to 15C It is a side view for explaining the operation of the second posture conversion mechanism.

[0045] Figures 16A to 16C It is a side view for explaining the operation of the second posture conversion mechanism.

[0046] Figure 17 This is a flowchart for explaining the operation of the substrate transfer robot.

[0047] Figure 18 It is a top view for explaining the operation of the substrate transfer robot.

[0048] Figure 19 This is a detection waveform of the weight sensor used to illustrate the operation of the substrate transfer robot in the second embodiment.

[0049] Figure 20A is a side view of a camera for explaining a detection unit as a modified example. Figure 20B 1 and 2 are diagrams showing an entire image of a substrate showing a liquid film state and four images of interest.

[0050] Figure 21 It is a side view of a film thickness gauge for explaining a detection portion as a modified example.

[0051] Figure 22 It is a diagram for explaining a method of obtaining the permissible range of acceleration and deceleration according to a modified example. DETAILED DESCRIPTION

[0052] The present invention is described below with reference to various embodiments.

[0053] [Example 1]

[0054] Hereinafter, Embodiment 1 of the present invention will be described with reference to the accompanying drawings. Figure 1 It is a plan view showing a schematic configuration of the substrate processing system 1 according to the first embodiment.

[0055] In this specification, for convenience, the direction in which the transfer block 19 and the processing block 21 are arranged is referred to as the "front-back direction X". The front-back direction X is horizontal. The direction in the front-back direction X, for example, from the processing block 21 toward the transfer block 19, is referred to as the "front". The direction opposite to the front is referred to as the "rear". The horizontal direction perpendicular to the front-back direction X is referred to as the "width direction Y". One direction of the "width direction Y" is appropriately referred to as the "right". The direction opposite to the right is referred to as the "left". The direction perpendicular to the horizontal direction is referred to as the "vertical direction Z". In each figure, for reference, front, back, right, left, top, and bottom are appropriately indicated.

[0056] <1. Configuration of substrate processing system>

[0057] refer to Figure 1 The substrate processing system 1 processes substrates W. For example, the substrate processing system 1 performs chemical treatment, cleaning, and drying on the substrates W. The substrate processing system 1 can perform both batch processing, processing multiple substrates W at once (e.g., 25 or 50 substrates), and single-wafer processing, processing multiple substrates W one by one. Therefore, the substrate processing system 1 is called a hybrid substrate processing system. In this embodiment, a case of processing 25 substrates W at once is described.

[0058] The substrate processing system 1 includes a stocker 2, a batch processing apparatus 3, a relay apparatus 5, and a single-wafer processing apparatus 7. The batch processing apparatus 3 processes multiple substrates W at once. The single-wafer processing apparatus 7 processes multiple substrates W one by one. The single-wafer processing apparatus 7 is located to the right of the batch processing apparatus 3 and spaced apart from the batch processing apparatus 3. The relay apparatus 5 connects the batch processing apparatus 3 and the single-wafer processing apparatus 7.

[0059] <2. Stacker>

[0060] The stocker 2 accommodates at least one carrier C. The stocker 2 is located in front of the batch processing apparatus 3. The carrier C stores multiple (e.g., 25) substrates W arranged at predetermined intervals (e.g., 10 mm) in a horizontal position. A FOUP (Front Opening Unify Pod) is used as the carrier C, but is not limited to this. The substrate W is, for example, a disc-shaped substrate with a diameter of 300 mm.

[0061] The stocker 2 includes, for example, two loading ports 9 , at least one storage rack 11 , and a carrier transport robot 13 . The carriers C are placed on the storage rack 11 .

[0062] The carrier transport robot 13 transports carriers C between the two load ports 9, the storage rack 11, and the loading rack 17 described later. The carrier transport robot 13 includes, for example, a holding portion 15 that holds a protrusion provided on the upper surface of the carrier C. The carrier transport robot 13 can move the holding portion 15 in the horizontal direction (front-back direction X and width direction Y) and the vertical direction Z. The carrier transport robot 13 is driven by one or more motors.

[0063] <3. Batch Processing Device>

[0064] The batch processing apparatus 3 includes a loading rack 17, a transfer block 19, a processing block 21, and a batch transfer area R1. The loading rack 17 is located adjacent to the front of the transfer block 19. The processing block 21 is located behind the transfer block 19 across a posture change area R2 (described later). The batch transfer area R1 extends rearward from the transfer block 19. The batch transfer area R1 is adjacent to the left of the transfer block 19, the processing block 21, and the posture change area R2.

[0065] <3-1. Transfer Block>

[0066] The transfer block 19 includes a substrate handling mechanism (robot) HTR and a first posture conversion mechanism 23. The substrate handling mechanism HTR is located behind the carrier 17. The substrate handling mechanism HTR transfers a plurality of substrates (e.g., 25) in a horizontal position between the carrier C mounted on the carrier 17 and the first posture conversion mechanism 23.

[0067] refer to Figures 2A to 2C The substrate processing mechanism HTR includes a plurality of (for example, 25) hands 25. Each hand 25 holds one substrate W. Figures 2A to 2C For the sake of convenience in illustration, the substrate handling mechanism HTR includes three hands 25. A pair of horizontal holding portions 31B and a pair of vertical holding portions 31C, described later, hold three substrates W. A pushing member 33A, described later, holds three substrates W.

[0068] The substrate processing mechanism HTR further includes a hand support unit 26, an advance / retract unit 27, and an elevating / rotating unit 29. The hand support unit 26 supports the plurality of hands 25. The advance / retract unit 27 advances and retracts the plurality of hands 25 via the hand support unit 26. The elevating / rotating unit 29 rotates the advance / retract unit 27 about a vertical axis AX1 to change the orientation of the hands 25. The advance / retract unit 27 and the elevating / rotating unit 29 each include a motor.

[0069] The first posture conversion mechanism 23 includes a posture conversion unit 31 and a pushing mechanism 33. The substrate processing mechanism HTR, the posture conversion unit 31, and the pushing mechanism 33 are arranged in this order on the left. The posture conversion unit 31 converts the plurality of substrates W received from the substrate processing mechanism HTR from a horizontal posture to a vertical posture.

[0070] like Figure 2A As shown, the posture conversion unit 31 includes a support table 31A, a pair of horizontal holding units 31B, a pair of vertical holding units 31C, and a rotational drive unit 31D. The pair of horizontal holding units 31B and the pair of vertical holding units 31C are mounted on the support table 31A. When the substrates W are in a horizontal posture, the pair of horizontal holding units 31B contacts the lower surface of each substrate W and supports the substrate W from below. Furthermore, when the substrates W are in a vertical posture, the pair of vertical holding units 31C hold the substrates W. The rotational drive unit 31D rotates the support table 31A around the horizontal axis AX2.

[0071] like Figure 2C As shown, the pushing mechanism 33 includes a pushing member 33A, an elevating and rotating unit 33B, a horizontal moving unit 33C, and a rail 33D. The pushing member 33A holds the lower portion of each of a plurality of substrates W (e.g., 25 or 50 substrates) that have been converted to a vertical posture by the posture conversion unit 31. The elevating and rotating unit 33B elevates the pushing member 33A in the vertical direction Z. Furthermore, the elevating and rotating unit 33B rotates the pushing member 33A about the vertical axis AX3. This allows the device surface of the substrate W, indicated by reference numeral DR1, to be oriented in any direction.

[0072] The horizontal moving unit 33C moves the pushing member 33A and the lifting and rotating unit 33B horizontally along the rail 33D. The rail 33D extends in the width direction Y. The rotation drive unit 31D, the lifting and rotating unit 33B, and the horizontal moving unit 33C each include a motor.

[0073] Here, the operation of the first posture conversion mechanism 23 will be described. Figure 2A . The posture conversion unit 31 receives 25 substrates W from the substrate processing mechanism HTR. The device surface of each substrate W faces upward. In addition, the device surface of the substrate W is the surface on which the electronic circuit is formed, and also includes the surface in the middle of forming the electronic circuit. The device surface is also called the "front surface" or "main surface". In addition, the back surface of the substrate W refers to the surface on which no electronic circuit is formed. The surface opposite to the device surface is the back surface.

[0074] refer to Figure 2B The rotation drive section 31D of the posture conversion section 31 rotates the pair of horizontal holding sections 31B and the like by 90 degrees around the horizontal axis AX2, thereby converting the 25 substrates W from the horizontal posture to the vertical posture.

[0075] refer to Figure 2CThe pushing mechanism 33 then raises the pushing member 33A to receive the 25 substrates W from the posture conversion unit 31. The pushing member 33A holds the 25 substrates W. The pushing mechanism 33 then moves the pushing member 33A holding the 25 substrates W along the rail 33D to a substrate transfer position PP below a chuck 37 (described later) of the first batch transfer robot WTR1 (described later).

[0076] <3-2. Processing Block>

[0077] refer to Figure 1 The processing block 21 includes a plurality (e.g., four) of batch processing tanks BT1 to BT4 and a batch drying unit 35. The four batch processing tanks BT1 to BT4 and the batch drying unit 35 are arranged along the front-to-back direction X extending from the batch processing apparatus 3. Each of the four batch processing tanks BT1 to BT4 performs immersion processing on a plurality (e.g., 25 or 50) of substrates W at a time. The four batch processing tanks BT1 to BT4 each store a processing solution (e.g., a chemical solution or pure water) used to immerse the plurality of substrates W.

[0078] The four batch processing tanks BT1 to BT4 are composed of, for example, two chemical processing tanks BT1 and BT2 and two cleaning tanks BT3 and BT4. The number of batch processing tanks is not limited to four; it can be one or more. The arrangement and function of the four batch processing tanks BT1 to BT4 are not limited.

[0079] Two chemical treatment tanks, BT1 and BT2, each perform chemical etching. A phosphoric acid solution, for example, is used as the chemical solution. A chemical dispensing pipe (not shown) is installed at the bottom of each chemical treatment tank. Each chemical treatment tank, BT1, stores the chemical solution supplied from the chemical dispensing pipe.

[0080] The two cleaning tanks BT3 and BT4 each perform a cleaning process to rinse chemical liquid adhering to the plurality of substrates W with a cleaning liquid (rinsing liquid). Pure water, such as deionized water (DIW), is used as the cleaning liquid. The cleaning tanks BT3 and BT4 each store pure water supplied from a pure water discharge pipe (not shown).

[0081] Four lifts LF1 to LF4 are installed in each of the four batch processing tanks BT1 to BT4. For example, lift LF1 holds 25 substrates W in a vertical position aligned along the width direction Y. Lift LF1 can hold these 25 substrates W in a vertical position while immersing them in the chemical solution within the batch processing tank BT1. Lift LF1 raises and lowers multiple substrates W between a processing position within the batch processing tank BT1 and a transfer position above the batch processing tank BT1. The other three lifts LF2 to LF4 are constructed similarly to lift LF1.

[0082] The batch drying section 35 dries multiple substrates W at once. This section is used, for example, when the single-wafer processing unit 7 cannot be used. The batch drying section 35 is located between the transfer block 19 and the four batch processing tanks BT1 to BT4. The batch drying section 35 includes an elevator LF7. The batch drying section 35 dries the substrates by supplying an organic solvent (e.g., isopropyl alcohol) to the substrates W in a reduced-pressure environment or by using centrifugal force to remove liquid components from the surfaces of the substrates W.

[0083] <3-3. Batch transfer area>

[0084] The batch transfer area R1 includes a first batch transfer robot WTR1. The first batch transfer robot WTR1 transfers a plurality of substrates W in a vertical position between the first posture conversion mechanism 23 (including the push mechanism 33), four elevators LF1 to LF4, the relay device 5 (the second posture conversion mechanism 43 described later), and the elevator LF7 of the batch drying section 35.

[0085] The first batch transfer robot WTR1 includes a chuck 37 and a guide rail 39. The chuck 37 includes two chuck members 41 and 42. The two chuck members 41 and 42 each extend in the width direction Y. The two chuck members 41 and 42 have, for example, 25 pairs of holding grooves to hold 25 substrates W. The first batch transfer robot WTR1 opens and closes the two chuck members 41 and 42. The guide rail 39 extends in the front-back direction X. The first batch transfer robot WTR1 moves the chuck 37 along the guide rail 39. The first batch transfer robot WTR1 is driven by a motor.

[0086] <4. Relay Device (Interface Device)>

[0087] The relay apparatus 5 converts the plurality of substrates W processed in either of the two chemical processing tanks BT1 and BT2 from a vertical posture to a horizontal posture, and delivers the plurality of substrates W converted to the horizontal posture to the single wafer processing apparatus 7 .

[0088] like Figure 1 As shown, the relay device 5 includes a posture conversion area R2 and a relay area R3 arranged along the width direction Y. The relay area R3 extends rightward from the posture conversion area R2. In the front-to-back direction X, the posture conversion area R2 is located between the first posture conversion mechanism 23 of the transfer block 19 and the four batch processing tanks BT1 to BT4 of the processing block 21. Furthermore, the left portion of the relay area R3 is located between the transfer block 19 and the processing block 21.

[0089] <4-1. Second Posture Conversion Mechanism>

[0090] The posture conversion region R2 includes a second posture conversion mechanism 43. Figure 1As shown, the second posture conversion mechanism 43 includes a standby tank 45 , a standby lifter LF9 , a second batch transfer robot WTR2 , a posture conversion tank 47 , and a posture conversion unit 49 .

[0091] Figure 3 : is a top view of the second posture conversion mechanism 43. Figure 3 In FIG, a pair of chuck members 57 and 58 of the second batch transfer robot WTR2 are shown in a cross-sectional view. In addition, a pair of chuck members 65 and 66 of the posture conversion unit 49 are shown in a cross-sectional view. Figure 3 In FIG, for convenience of illustration, the standby lifter LF9 holds three substrates W. In addition, the chuck 52 of the second batch transfer robot WTR2 also holds three substrates W.

[0092] The standby tank 45 stores an immersion liquid for immersing the plurality of substrates W. Pure water (eg, DIW) is used as the immersion liquid and is supplied from a pure water discharge pipe (not shown).

[0093] The standby elevator LF9 receives multiple (e.g., 25) substrates W from the first batch transfer robot WTR1 and holds the multiple substrates W in a vertical position. The standby elevator LF9 includes, for example, three support members 51 extending in the width direction Y. Each of the three support members 51 includes multiple holding grooves aligned in the width direction Y for holding the multiple substrates W.

[0094] The second batch transfer robot WTR2 transfers multiple (e.g., 25) substrates W between the standby elevator LF9 and the rotary chuck 61 of the posture conversion unit 49. The second batch transfer robot WTR2 includes a chuck 52 and a drive mechanism 54. The chuck 52 is movable in the width direction Y and can be opened and closed in the front-back direction X. The chuck 52 includes a pair of chuck members 57 and 58. Each pair of chuck members 57 and 58 includes multiple (e.g., 25) pairs of holding grooves 59 and 60. Each pair of holding grooves 59 and 60 faces each other.

[0095] The drive mechanism 54 moves the chuck 52 in the width direction Y. In addition, the drive mechanism 54 opens and closes the chuck 52 by moving the chuck 52 (chuck members 57, 58) in the front-back direction X. Figure 3 In the embodiment, the chuck 52 is in a closed state. The driving mechanism 54 includes, for example, at least one of an electric motor and an air cylinder.

[0096] The position conversion tank 47 stores an immersion liquid for immersing the plurality of substrates W. Pure water (e.g., DIW) is used as the immersion liquid. Pure water is supplied from a pure water discharge pipe (not shown). The position conversion tank 47 is located to the right of the standby tank 45 in the width direction Y.

[0097] The posture conversion unit 49 converts a plurality of (eg, 25) substrates W from a vertical posture to a horizontal posture in the immersion liquid stored in the posture conversion tank 47. The posture conversion unit 49 includes a spin chuck 61 and a driving unit 63.

[0098] The spin chuck 61 holds a plurality of (for example, 25) substrates W. The spin chuck 61 includes a pair of chuck members 65 and 66. Figure 4 As shown, a pair of chuck members 65, 66 includes multiple pairs (e.g., 25 pairs) of holding grooves 67, 68. The spin chuck 61 (chuck members 65, 66) can be opened and closed along a horizontal axis AX4 extending in the front-back direction X. Therefore, when the spin chuck 61 is in the closed state, the spin chuck 61 can hold multiple substrates W using the multiple pairs of holding grooves 67, 68. Figure 4 It means from Figure 3 The front view of the rotating chuck 61 when viewed from the arrow Q. Figure 3 、 Figure 4 In the figure, the spin chuck 61 is in the open state. In addition, for the convenience of illustration, the spin chuck 61 holds three substrates W.

[0099] The spin chuck 61 is rotatable about a horizontal axis AX4. The drive unit 63 of the posture conversion unit 49 rotates the spin chuck 61 about the horizontal axis AX4. This causes the plurality of substrates W held by the spin chuck 61 to be converted from a vertical posture to a horizontal posture. The drive unit 63 also opens and closes the spin chuck 61 (chuck members 65 and 66). Furthermore, the drive unit 63 raises and lowers the spin chuck 61. The drive unit 63 includes, for example, at least one of a motor and an air cylinder.

[0100] <4-2. Substrate Transport Robot>

[0101] refer to Figure 1 、 Figure 5 The relay region R3 includes a substrate transfer robot 71 that transfers a substrate W and a substrate placement portion PS1 (shelf) that places the substrate W. The substrate transfer robot 71 corresponds to the substrate transfer robot of the present invention.

[0102] Here, we will briefly describe the key features of this embodiment. In the substrate processing system 1, after processing in at least one of the batch processing tanks BT1 to BT4, and before processing in the single-wafer processing chambers SW1 and SW2 of the single-wafer processing apparatus 7, if the substrate W dries out, there is a concern that the pattern formed on the substrate W may collapse. Therefore, to prevent the substrate W from drying out, the substrate W is transported in a horizontal position with liquid (a liquid film) on the upper surface of the substrate W where the pattern is formed. If the liquid on the upper surface of the substrate W spills during transport, for example, the substrate W may dry out, which is undesirable. Therefore, this embodiment prevents liquid from spilling from the upper surface of the substrate W during transport.

[0103] <4-2-1. Overall structure of substrate transport robot>

[0104] The substrate transport robot 71 includes a hand 73, an advance / retract portion 75, a rotation portion 77, and a linear motion portion 79. The hand 73 supports a single substrate W in a horizontal position. The hand 73 includes a hand body 83 and a hand support portion 85. The hand support portion 85 is connected to the base end of the hand body 83. Details of the hand 73 will be described later.

[0105] The advance / retract unit 75 moves the hand 73 forward and backward. Specifically, the advance / retract unit 75 moves the hand 73 horizontally. The advance / retract unit 75 includes, for example, a motor M1, a threaded shaft 87, and a guide rail 89. The threaded shaft 87 extends linearly in an arbitrary horizontal direction. The guide rail 89 extends parallel to the threaded shaft 87. The hand support 85 is guided by the guide rail 89 in the direction in which the guide rail 89 extends.

[0106] The threaded shaft 87 meshes with the internal threaded portion 85A of the hand support 85. One end of the threaded shaft 87 is connected to the output shaft M1A of the motor M1. The motor M1 rotates the threaded shaft 87 in the forward direction about its axis, thereby advancing the hand 73. Furthermore, the motor M1 rotates the threaded shaft 87 in the reverse direction about its axis, thereby retracting the hand 73.

[0107] The rotating unit 77 rotates the hand 73 and the advancing and retreating unit 75 around the vertical axis AX5. This allows the directions of the hand 73 and the advancing and retreating unit 75 to be changed. The rotating unit 77 includes, for example, a motor M2.

[0108] The linear motion unit 79 moves the hand 73, the advancing and retreating unit 75, and the rotating unit 77 in the width direction Y (horizontally). The linear motion unit 79 includes, for example, a motor M3, a threaded shaft 91, a guide rail 93, and a slider 95. The threaded shaft 91 and the guide rail 93 extend in the width direction Y. The slider 95 is connected to the rotating unit 77. The slider 95 is guided by the guide rail 93 in the width direction Y along which the guide rail 93 extends.

[0109] The screw shaft 91 is engaged with the internal thread portion 95A of the slider 95. One end of the screw shaft 91 is connected to the output shaft M3A of the motor M3. The motor M3 rotates the screw shaft 91 in the positive direction around the axis. As a result, the hand 73, the advance and retreat portion 75 and the rotation portion 77 advance. Figure 1 In the process, for example, the hand 73 moves toward the posture conversion unit 49. In addition, the motor M1 rotates the screw shaft 87 in the reverse direction around the axis. As a result, the hand 73 moves backward. Figure 1 In the process, for example, the hand 73 moves toward the substrate placement portion PS1 side.

[0110] <4-2-2. Detailed Structure of the Hand>

[0111] refer to Figure 5 、 Figure 6 . Figure 6 1 is a plan view showing the hand 73. The hand 73 further includes a plurality of (eg, four) contact portions 97A, 97B, 97C, and 97D and a plurality of (eg, four) weight sensors SA, SB, SC, and SD.

[0112] like Figure 6 As shown, the hand body 83 is formed in a U-shape or a Y-shape. Specifically, the hand body 83 includes a palm portion 101 and two fingers 103 and 104. Both fingers 103 and 104 are formed to extend from the palm portion 101 in a predetermined horizontal direction HD1. The finger portion 103 is arranged apart from the finger portion 104.

[0113] Four contact portions 97A to 97D are provided on the upper surface of the hand body 83. Each of the four contact portions 97A to 97D supports the outer edge of the substrate W. In other words, the substrate W is placed on the four contact portions 97A to 97D. Each of the four contact portions 97A to 97D contacts the lower surface of the horizontally positioned substrate W, not the side surfaces. Two contact portions 97A and 97C are provided on the upper surface of the finger 103. Contact portion 97A is located closer to the end of the finger 103 than contact portion 97C. Two contact portions 97B and 97D are provided on the upper surface of the finger 104. Contact portion 97B is located closer to the end of the finger 104 than contact portion 97D.

[0114] The four weight sensors SA, SB, SC, and SD are provided on the hand body 83 so as to correspond to the four contact parts 97A, 97B, 97C, and 97D, respectively. In other words, the four weight sensors SA, SB, SC, and SD are provided between the four contact parts 97A, 97B, 97C, and 97D and the hand body 83, respectively. Figure 5 As shown, weight sensor SB is located on the lower side or lower surface of contact portion 97B. Furthermore, weight sensor SD is located on the lower side or lower surface of contact portion 97D. Weight sensors SA and SC are also located similarly to weight sensor SB (SD). The four weight sensors SA to SD can also be embedded in hand body 83.

[0115] Each of the four weight sensors SA through SD is a multi-axis tactile sensor (force sensor), such as a 6-axis or 3-axis tactile sensor. However, a single-axis (Z-axis) load cell (tactile sensor) may also be used. Furthermore, a 6-axis tactile sensor is capable of measuring 3-axis forces (Fx, Fy, Fz) and 3-axis moments (Mx, My, Mz). The tactile sensor's detection method may be, for example, a resistive type, but is not limited to this.

[0116] Four weight sensors SA-SD measure the weight of the substrate W and the liquid film formed on its upper surface. For example, the four weight values ​​(weight data) JA, JB, JC, and JD measured by the four weight sensors SA-SD are transmitted to the robot control unit 111. The robot control unit 111 calculates, for example, the total value of the four weight data JA, JB, JC, and JD. This allows the robot control unit 111 to determine the combined weight of the substrate W and the liquid film formed on its upper surface. Furthermore, the robot control unit 111 can determine the amount of liquid film (volume in milliliters) based on the weight of the liquid film after subtracting the weight of the substrate W.

[0117] Furthermore, while the substrate W supported by the hand 73 is being transported, the liquid of the liquid film formed on the upper surface of the substrate W moves. As a result, the four weight values ​​JA to JD of the four weight sensors SA to SD change, respectively.

[0118] <4-2-3. Robot Control Unit>

[0119] The substrate transport robot 71 includes a robot control unit 111 and a storage unit 113. The robot control unit 111 is communicatively connected to the main control unit 180 described later. The robot control unit 111 controls the various components of the substrate transport robot 71. The robot control unit 111 includes one or more processors such as a central processing unit (CPU). The storage unit 113 includes at least one of a ROM (Read-Only Memory), a RAM (Random-Access Memory), and a hard disk. The storage unit 113 stores computer programs required for controlling the various components of the substrate transport robot 71. In addition, information on the type (e.g., wettability) of each substrate W stored in the carrier C is stored in at least one of the storage unit 113 and the storage unit 181 described later.

[0120] <4-2-4. Obtaining the Permissible Range of Acceleration and Deceleration and Rotation Acceleration and Deceleration>

[0121] First, refer to Figure 7A 、 Figure 7B 、 Figure 8A 、 Figure 8B 、 Figure 9A 、 Figure 9B , and the movement of the liquid and the detection waveforms of the four weight sensors SA~SD are explained. Figure 7A 、 Figure 8A 、 Figure 9A In the process, a liquid film is formed on the upper surface of the substrate W held by the hand 73.

[0122] refer to Figure 7A 、 Figure 7B. The advance and retreat portion 75 or the linear moving portion 79 moves the hand 73 backward. In this case, in the acceleration area, the liquid tends to move toward the weight sensors SA, SB. Therefore, the weight values ​​JA, JB measured by the weight sensors SA, SB, respectively, increase. In contrast, the weight values ​​JC, JD measured by the weight sensors SC, SD, respectively, decrease. In addition, in the deceleration area, the liquid tends to move toward the weight sensors SC, SD. Therefore, the weight values ​​JA, JB measured by the weight sensors SA, SB decrease. In contrast, the weight values ​​JC, JD measured by the weight sensors SC, SD increase. In addition, in Figure 7A 、 Figure 7B , the rotating portion 77 does not rotate the hand 73 around the vertical axis AX5.

[0123] refer to Figure 8A 、 Figure 8B . The rotating part 77 rotates the hand 73 counterclockwise around the vertical axis AX5. In this case, in the acceleration area, the liquid tends to move toward the weight sensors SA and SC. In addition, due to the increase in centrifugal force, the liquid tends to move toward the weight sensor SA compared to the weight sensor SC. Therefore, the weight values ​​JA and JC measured by the weight sensors SA and SC increase. In addition, the weight value JA (weight change) is greater than the weight value JC. In contrast, the weight values ​​JB and JD measured by the weight sensors SB and SD decrease. In addition, the weight value JD (weight change) is smaller than the weight value JB.

[0124] Furthermore, in the deceleration area, the liquid tends to move toward the weight sensors SB and SD. Furthermore, since the centrifugal force decreases, the liquid tends to move toward the weight sensor SD compared to the weight sensor SB. Therefore, the weight values ​​JA and JC measured by the weight sensors SA and SC decrease. Furthermore, the rate of decrease of the weight value JA (weight change) is greater than the weight value JC. In contrast, the weight values ​​JB and JD measured by the weight sensors SB and SD increase. Furthermore, the rate of increase of the weight value JD (weight change) is greater than the weight value JB. Furthermore, in Figure 8A 、 Figure 8B In the embodiment, neither the advancing and retreating portion 75 nor the linear moving portion 79 moves the hand 73 .

[0125] refer to Figure 9A 、 Figure 9B. The advance and retreat portion 75 or the linear moving portion 79 moves the hand 73 forward. In this case, in the acceleration area, the liquid tends to move toward the weight sensors SC, SD side. Therefore, the weight values ​​JC, JD measured by the weight sensors SC, SD increase. In contrast, the weight values ​​JA, JB measured by the weight sensors SA, SB decrease. In addition, in the deceleration area, the liquid tends to move toward the weight sensors SA, SB side. Therefore, the weight values ​​JA, JB measured by the weight sensors SA, SB increase. In contrast, the weight values ​​JC, JD measured by the weight sensors SC, SD decrease. In addition, in Figure 9A 、 Figure 9B , the rotating portion 77 does not rotate the hand 73 around the vertical axis AX5.

[0126] In this manner, by at least one of the movement and rotation of the hand 73 , the liquid of the liquid film formed on the upper surface of the substrate W is moved, and the weight change of the liquid can be monitored by the four weight sensors SA to SD.

[0127] Therefore, the robot controller 111 supports the substrate W, with a liquid film formed on its upper surface, with the hand 73 and measures the weight of the liquid film using four weight sensors SA to SD. Furthermore, the amount of the liquid film (liquid volume) can be determined based on the weight of the liquid film. The robot controller 111 then determines the permissible range RA of acceleration and deceleration for moving the hand 73, based on the type of substrate W and the measured weight of the liquid film. The robot controller 111 then moves the hand 73 within the permissible range RA of acceleration and deceleration using the forward / retractable portion 75 or the linear motion portion 79.

[0128] refer to Figure 10 The allowable range RA of acceleration and deceleration is a range narrower than the limit range LRA of acceleration and deceleration. The limit range LRA of acceleration and deceleration is a limit range within which liquid will not spill from the substrate W due to the movement of the liquid in the liquid film. As long as it is within the limit range LRA of acceleration and deceleration and there is no difference from the actual range, liquid will not spill. The limit range LRA of acceleration and deceleration is set in advance by conducting experiments, etc. For example, the limit range LRA is set by measuring the weight value (weight change) of liquid spilled from the substrate W due to the movement of the liquid in the liquid film using four weight sensors SA to SD.

[0129] The limit range LRA is the acceleration (positive acceleration) (m / s 2 ; meters per second) and the limit value of deceleration (negative acceleration) (m / s 2 The permissible range RA of acceleration and deceleration is also the range of permissible values ​​of acceleration and deceleration. The permissible range RA is also set in advance.

[0130] In addition, if Figure 10As shown, the acceleration / deceleration limit range LRA corresponds to the liquid weight change limit range LRB (N; Newton). If one of the four weight sensors SA to SD measures a weight change that deviates from the limit range LRB, the liquid spills from the substrate W. In addition, the acceleration / deceleration allowable range RA corresponds to the liquid weight change allowable range RB. Figure 10 In the equation, the weight change is the weight change relative to the weight of the liquid film at rest. Therefore, when the weight change is 0 (zero), it means that the measured weight is the same as the weight at rest.

[0131] The robot controller 111 also obtains an allowable range RC of rotation acceleration and deceleration for rotating the hand 73, where the allowable range RC corresponds to the type of substrate W and the measured weight of the liquid film. The robot controller 111 then rotates the hand 73 within the allowable range RC using the rotating unit 77.

[0132] The permissible range RC of rotational acceleration / deceleration is narrower than the limit range LRC of rotational acceleration / deceleration. The limit range LRC of rotational acceleration / deceleration is a limit range within which liquid will not spill from the substrate W due to the movement of the liquid film. The limit range LRC of rotational acceleration / deceleration is set in advance by conducting experiments, etc. The limit range LRC is the rotational acceleration (positive rotational acceleration or positive angular acceleration) (rad / s 2 ; radians per second) and the limit value of rotational deceleration (negative rotational acceleration or negative angular acceleration) (rad / s 2 The permissible range RC of the rotational acceleration / deceleration is also the range of the permissible value of the rotational acceleration and the permissible value of the rotational deceleration. The permissible range RC is also preset.

[0133] Furthermore, the limit range LRC of the rotation acceleration / deceleration corresponds to the limit range LRD of the weight change of the liquid. Furthermore, the permissible range RC of the acceleration / deceleration corresponds to the permissible range RD of the weight change of the liquid. Figure 10 The data showing the relationship between the rotation acceleration / deceleration and the weight change amount shown are prepared separately from the data showing the relationship between the acceleration / deceleration and the weight change amount.

[0134] Figure 11 This diagram shows an example of a lookup table LUT. The lookup table LUT is stored in at least one of the storage unit 113 and the storage unit 181 described later. The robot control unit 111 uses the lookup table LUT to obtain, for example, the permissible range RA for acceleration / deceleration, the permissible range RC for rotational acceleration / deceleration, and the permissible ranges RB and RD for weight variation corresponding to the type of substrate W and the measured weight of the liquid film.

[0135] exist Figure 11In the above, the type of substrate W includes any one of the wettability of the substrate W, the warp of the substrate W (e.g., umbrella-shaped or bowl-shaped), and the diameter of the substrate W (e.g., 300 mm). The wettability of the substrate W refers to, for example, whether the substrate W is hydrophilic or hydrophobic. For example, Figure 11 The substrate WA shown is a hydrophilic substrate, and the substrate WB is a hydrophobic substrate. Wettability is expressed as a contact angle. The weight of the liquid film is, for example, the sum of the weights JA to JD measured by four weight sensors SA to SD. For example, weights JU1, JU2, and JU3 are assigned to substrates WA, WB, and WC, respectively.

[0136] Figure 12 This diagram illustrates an example of the relationship between acceleration and deceleration and the weight change of the liquid for a hydrophilic substrate WA. With a hydrophilic substrate WA, the entire upper surface of the substrate W can be covered with a relatively small amount of liquid (e.g., DIW). Therefore, liquid spillage does not occur until a significant weight change occurs. Figure 13 This diagram illustrates an example of the relationship between acceleration and deceleration and the weight change of the liquid for a hydrophobic substrate WB. For a hydrophobic substrate WB, a relatively large amount of liquid (e.g., DIW) is required to cover the entire top surface of the substrate W. Therefore, even a small weight change can cause liquid spillage.

[0137] The permissible range RA of acceleration / deceleration corresponds to the first range of the present invention. The permissible range RB of weight change corresponds to the change range of the present invention. The permissible range RC of rotation acceleration / deceleration corresponds to the second range of the present invention.

[0138] <5. Single-chip processing device>

[0139] refer to Figure 1 The single-wafer processing apparatus 7 performs predetermined single-wafer processing on each of the plurality of substrates W received from the relay apparatus 5 .

[0140] The wafer processing device 7 includes a carrier block 121 and a processing block 123. The carrier block 121 includes, for example, four carriers 125 and a carrier robot IR. The four carriers 125 are arranged along the width direction Y. The four carriers 125 are arranged in front of the carrier robot IR. Carriers C are placed on each carrier 125.

[0141] The carrier robot IR transfers substrates W between four carriers C placed on four mounting racks 125 and a substrate mounting portion PS2 described later. The carrier robot IR includes a hand 127, a multi-jointed arm 129, and an elevating stage 131. The hand 127 holds one substrate W in a horizontal position.

[0142] The multi-jointed arm 129 moves the hand 127 horizontally and changes the orientation of the hand 127. The distal end of the multi-jointed arm 129 is connected to the hand 127, and the proximal end of the multi-jointed arm 129 is connected to a lifting platform 131. The lifting platform 131 raises and lowers the hand 127 via the multi-jointed arm 129. The multi-jointed arm 129 and the lifting platform 131 are each equipped with, for example, a motor.

[0143] The processing block 123 is adjacent to the rear of the carrier block 121. The processing block 123 includes a substrate transfer area R4 and, for example, four towers TW1 to TW4. The substrate transfer area R4 extends rearward (in the front-to-back direction X) from the carrier block 121. Two towers TW1 and TW2 are located along the substrate transfer area R4. Furthermore, two towers TW3 and TW4 are also located along the substrate transfer area R4. The two towers TW1 and TW2 are positioned opposite the two towers TW3 and TW4, sandwiching the substrate transfer area R4.

[0144] Tower TW1 includes, for example, three single-wafer processing chambers SW1 arranged along the vertical direction Z. Tower TW3 includes, for example, two single-wafer processing chambers SW1 arranged along the vertical direction Z. In tower TW3, a substrate placement unit PS1 of a relay device 5 is arranged between the two single-wafer processing chambers SW1 arranged along the vertical direction Z. The two towers TW2 and TW4 each include, for example, three single-wafer processing chambers SW2 arranged along the vertical direction Z. Each of the eleven single-wafer processing chambers SW1 and SW2 processes horizontally positioned substrates W one by one.

[0145] The number of single-wafer processing chambers SW1 and SW2 is not limited to 11. The number of single-wafer processing chambers SW1 is not limited to 5, and may be 1 or more. The number of single-wafer processing chambers SW2 is not limited to 6, and may be 1 or more.

[0146] Each single-wafer processing chamber SW1 includes, for example, a holding and rotating unit 141 and a nozzle 143. The holding and rotating unit 141 includes a spin chuck that holds a substrate W in a horizontal position and a motor that rotates the spin chuck about a vertical axis passing through the center of the substrate W. The nozzle 143 supplies a processing liquid to the upper surface of the substrate W held by the holding and rotating unit 141. The processing liquids used include, for example, pure water (e.g., DIW) and IPA (isopropyl alcohol). After each single-wafer processing chamber SW1 cleans the substrate W with pure water, a film of IPA is formed on the upper surface of the substrate W.

[0147] The single-wafer processing chamber SW2 performs a drying process using, for example, a supercritical fluid. Carbon dioxide, for example, is used as the fluid. When the carbon dioxide fluid is used, a supercritical state can be achieved at a critical temperature of 31°C and a critical pressure of 7.38 MPa. This supercritical fluid drying process prevents pattern collapse on the substrate W.

[0148] Each single-wafer processing chamber SW2 includes a chamber body (container) 145, a support tray 147, and a lid. The chamber body 145 includes a processing space within it, an opening for inserting substrates W into the processing space, a supply port, and an exhaust port. The substrates W are supported by the support tray 147 and stored in the processing space. The lid seals the opening of the chamber body 145. For example, each single-wafer processing chamber SW2 sets a fluid to a supercritical state and supplies the supercritical fluid from the supply port into the processing space within the chamber body 145. The supercritical fluid supplied to the processing space dries each substrate W.

[0149] The substrate transfer region R4 includes a central robot CR1 and a substrate placement portion PS2 (shelf). The substrate placement portion PS2 is disposed between the carrier robot IR and the central robot CR1. One or more substrates W are placed on the substrate placement portion PS2.

[0150] The central robot CR1 transports a single substrate W in a horizontal position, for example, between the substrate loading stations PS1 and PS2 and the eleven single-wafer processing chambers SW1 and SW2. The central robot CR1 includes, for example, two hands 151 and 152, a forward and backward movement unit 153, a lifting and rotating unit 155, and a linear motion unit 157. Each of the two hands 151 and 152 holds a single substrate W in a horizontal position. Hand 151 supports a substrate W with a liquid film formed on its upper surface. Hand 152 supports a substrate W after a drying process. Hand 152 is positioned higher than hand 151. This prevents liquid from spilling from a substrate W held by hand 151 from adhering to the upper surface of the substrate W supported by hand 152.

[0151] The advance / retract unit 153 independently advances and retracts the two hands 151 and 152. The lifting and rotating unit 155 raises and lowers the two hands 151 and 152 and the advance / retract unit 153. Furthermore, the lifting and rotating unit 155 rotates the two hands 151 and 152 and the advance / retract unit 153 about a vertical axis AX7 to change the orientation of the two hands 151 and 152. The advance / retract unit 153 and the lifting and rotating unit 155 include, for example, a motor. The linear motion unit 157 moves the two hands 151 and 152, the advance / retract unit 153, and the lift / retract unit 155 in the front-to-back direction X. The linear motion unit 157 includes, for example, a guide rail, a slider, and a motor.

[0152] The processing block 123 also includes two substrate transport robots CR2 and CR3. The first substrate transport robot CR2 is located between the two towers TW1 and TW2. Furthermore, the second substrate transport robot CR3 is located between the two towers TW3 and TW4. Each substrate transport robot CR2 or CR3 transports a substrate W with a liquid film (e.g., an IPA film) formed on its upper surface from the single-wafer processing chamber SW1 to the single-wafer processing chamber SW2. Like the central robot CR1, each substrate transport robot CR2 or CR3 includes a hand 151, a forward and backward movement unit 153, and a lifting and rotating unit 155. Furthermore, the lifting and rotating unit 155 of each substrate transport robot CR2 or CR3 rotates the hand 151 and other components about a vertical axis AX8.

[0153] <6. Control Unit>

[0154] The substrate processing system 1 includes a main control unit 180 and a storage unit 181. The main control unit 180 controls the various components of the substrate processing system 1. The main control unit 180 includes one or more processors, such as a central processing unit (CPU). The storage unit 181 includes at least one of a ROM (Read-Only Memory), a RAM (Random-Access Memory), and a hard disk. The storage unit 181 stores computer programs required to control the various components of the substrate processing system 1. The robot control unit 111 or the main control unit 180 corresponds to the control unit of the present invention. The storage unit 113 or the storage unit 181 corresponds to the storage unit of the present invention.

[0155] <7. Operation of Substrate Processing System>

[0156] Next, refer to Figure 14 The operation of the substrate processing system 1 will be described with reference to the flowchart of FIG.

[0157] [Step S01] Transferring a substrate from a carrier

[0158] refer to Figure 1 An external transfer robot (not shown) transfers the carrier C to the load port 9. The carrier transfer robot 13 of the stocker 2 transfers the carrier C from the load port 9 to the mounting rack 17. The carrier C contains, for example, 25 substrates W before processing.

[0159] Then, the substrate processing mechanism HTR of the batch processing apparatus 3 removes 25 substrates W from the carrier C placed on the loading rack 17 and transfers the 25 substrates W to the posture conversion unit 31. Then, the carrier transfer robot 13 transfers the empty carrier C after removing the 25 substrates W from the loading rack 17 to the load port 9. The external transfer robot transfers the empty carrier C from the load port 9 to any one of the four loading racks 125.

[0160] [Step S02] Vertical Posture Conversion

[0161] Then, the posture conversion unit 31 converts the 25 substrates W from the horizontal posture to the vertical posture (refer to Figure 2A 、 Figure 2B The pushing mechanism 33 receives 25 substrates W in a vertical posture from the posture conversion unit 31, and transports the 25 substrates W to the substrate transfer position PP (reference Figure 2C ).

[0162] [Step S03] Batch processing

[0163] refer to Figure 1 The first batch transfer robot WTR1 receives 25 substrates W in a vertical position from the push mechanism 33 and transfers the 25 substrates W to one of the two chemical solution treatment tanks BT1 and BT2. For example, the lifter LF1 receives the 25 substrates W in a vertical position from the first batch transfer robot WTR1 above the chemical solution treatment tank BT1 and immerses the 25 substrates W in the phosphoric acid solution (chemical solution) stored in the chemical solution treatment tank BT1. In this way, the chemical solution treatment is performed on the 25 substrates W at once. In addition, when the lifter LF2 receives 25 substrates W from the first batch transfer robot WTR1, the same chemical solution treatment is also performed.

[0164] Then, the elevator LF1 lifts 25 substrates W from the phosphoric acid solution. The first batch transfer robot WTR1 receives the 25 substrates W from the elevator LF1 and transfers them to one of the two cleaning tanks BT3 and BT4. For example, the elevator LF3 receives the 25 substrates W from the first batch transfer robot WTR1 above the cleaning tank BT3 and immerses the 25 substrates W in the pure water (e.g., DIW) stored in the cleaning tank BT3. This removes the phosphoric acid solution from each substrate W. Furthermore, the 25 substrates W are cleaned together. Furthermore, when the elevator LF4 receives the 25 substrates W from the first batch transfer robot WTR1, the same cleaning process is also performed.

[0165] Then, the lifter LF3 lifts 25 substrates W from the pure water. The first batch transfer robot WTR1 receives the 25 substrates W from the lifter LF3 and transfers the 25 substrates W to the posture change region R2 of the relay 5. Each substrate W is wet.

[0166] [Step S04] Horizontal Posture Transformation

[0167] Then, the standby lift LF9 receives 25 substrates W in a vertical posture from the first lot transfer robot WTR1 above the standby tank 45. Figure 15AAs shown, the standby elevator LF9 immerses 25 substrates W in pure water (eg, DIW) stored in the standby tank 45. At this time, the chuck 52 of the second lot transfer robot WTR2 is in the open state.

[0168] refer to Figure 15B Thereafter, the standby elevator LF9 raises the 25 substrates W to a position higher than the chuck 52. This lifts the 25 substrates W from the pure water in the standby tank 45. The second batch transfer robot WTR2 then closes the chuck 52. This allows the chuck 52 to hold the 25 substrates W.

[0169] refer to Figure 15C Then, the standby elevator LF9 lowers the 25 substrates W. This allows the chuck 52 to receive the 25 substrates W from the standby elevator LF9. The second batch transfer robot WTR2 then moves the chuck 52 holding the 25 substrates W from above the standby tank 45 to above the posture conversion tank 47 (that is, below the rotary chuck 61 of the posture conversion unit 49). At this time, the rotary chuck 61 is in the open position.

[0170] refer to Figure 16A Then, the posture conversion unit 49 lowers the spin chuck 61, positioning the 25 substrates W in the vertical posture between the pair of chuck members 65 and 66. The posture conversion unit 49 then closes the spin chuck 61. As a result, the spin chuck 61 holds the 25 substrates W held by the chuck 52.

[0171] refer to Figure 16B Then, the second batch transfer robot WTR2 opens the chuck 52 to release the 25 substrates W. Then, the second batch transfer robot WTR2 moves the opened chuck 52 from above the posture conversion tank 47 to above the standby tank 45 .

[0172] Next, the posture conversion unit 49 lowers the spin chuck 61 holding the 25 substrates W in the vertical posture. This immerses the 25 substrates W in pure water (e.g., DIW) stored in the posture conversion tank 47. The posture conversion unit 49 then rotates the spin chuck 61 90 degrees around the horizontal axis AX4 in the pure water, converting the 25 substrates W from the vertical posture to the horizontal posture. In the horizontal posture, the device surface of each substrate W faces upward.

[0173] refer to Figure 16C Next, the posture conversion unit 49 raises the spin chuck 61, for example, to lift the substrate W at the highest position from the pure water. At this point, the substrate W at the highest position scoops up pure water with its upper surface while being lifted from the pure water. As a result, a liquid film (pure water film) is formed on the upper surface of the substrate W.

[0174] [Step S05] Transporting the substrate on which the liquid film is formed

[0175] In the relay region R3 of the relay device 5 , the substrate transport robot 71 transports the substrate W having a liquid film formed on the upper surface. Figure 17 This is a flowchart showing the details of conveying the substrate W in step S05.

[0176] [Step S51] Supporting the substrate on which the liquid film is formed

[0177] refer to Figure 1 、 Figure 18 First, the linear moving portion 79 of the substrate transport robot 71 moves the hand 73 and the like that do not support the substrate W to the position PT1 on the side of the posture conversion portion 49. In addition, the distal end of the hand 73 (hand 73) faces the posture conversion portion 49. Then, the advancing and retreating portion 75 moves the hand 73 forward ( Figure 18 As a result, the hand 73 contacts the posture conversion unit 49, and Figure 16C As shown by the two-dot chain line, hand 73 moves below substrate W at the highest position. Position changer 49 slightly lowers spin chuck 61. As a result, substrate W at the highest position rests on the upper surfaces of four contact portions 97A to 97D of hand 73. In the following description, substrate W at the highest position is referred to as "substrate W."

[0178] Thus, the substrate transport robot 71 supports the substrate W with the liquid film (pure water film) formed on the upper surface of the substrate W with the hand 73 . In this case, the substrate W is not supported by the spin chuck 61 but only by the hand 73 .

[0179] [Step S52] Measure the weight of the liquid film

[0180] Hand 73 is provided with four weight sensors SA to SD, corresponding to the four contact portions 97A to 97D. The weight of the liquid film is measured by the four weight sensors SA to SD. The four weight values ​​JA to JD output by the four weight sensors SA to SD are transmitted to the robot control unit 111. The robot control unit 111 calculates the weight of the liquid film based on, for example, the sum of the four weight values ​​JA to JD.

[0181] Specifically, the four weight values ​​JA to JD measured by the four weight sensors SA to SD include the weight of the liquid film and the weight of the substrate W. Therefore, for example, the weight of a dummy substrate identical to (of substantially the same shape and material as) the substrate W being transported by the hand 73 is first measured, and the weight of the substrate W is stored in at least one of the storage unit 113 and the storage unit 181. The weight of the dummy substrate is then subtracted from the weight of the substrate W on which the liquid film is formed. This allows the weight of the liquid film to be obtained.

[0182] [Step S53] Obtaining the permissible range of acceleration and deceleration

[0183] like Figure 11 As shown in FIG, the robot control unit 111 obtains the permissible range RA of acceleration and deceleration and the permissible range RC of rotational acceleration for the movement of the hand 73 according to the measured weight of the liquid film and the type of the substrate W. Figure 11 In the lookup table LUT, for example, the permissible range RA6 of acceleration / deceleration and the permissible range RC6 of rotational acceleration are obtained based on the weight JU3 of the substrate WB and the liquid film.

[0184] [Step S54] Hand Movement

[0185] The robot control unit 111 moves the hand 73 within the permissible range RA of acceleration and deceleration using the forward and backward movement unit 75 or the linear movement unit 79. Furthermore, the robot control unit 111 rotates the hand 73 within the permissible range RC of rotational acceleration and deceleration using the rotation unit 77. A specific operation example will now be described.

[0186] refer to Figure 18 The current state is that the hand 73 receives the posture conversion unit 49 and supports the substrate W on which the liquid film is formed. Therefore, next, the advancing and retreating unit 75 moves the hand 73 supporting the substrate W backward ( Figure 18 Here, the advancing and retreating portion 75 causes the hand 73 to retreat within the permissible range RA of acceleration and deceleration. Thus, during the retreating movement of the hand 73, it is possible to prevent the liquid from spilling from the substrate W. In addition, the permissible range RA of acceleration and deceleration corresponds to the permissible range RB of weight variation. Figure 7B , the detection waveforms of the four weight sensors SA to SD fall within the allowable range RB.

[0187] After the hand 73 is retracted, the rotating portion 77 rotates the hand 73 supporting the substrate W 180 degrees counterclockwise around the vertical axis AX5. Figure 18 Arrow AR3). As a result, the direction of the hand 73 is changed from the posture conversion unit 49 to the substrate placement unit PS1. Here, the rotation unit 77 rotates the hand 73 180 degrees within the permissible range RC of the rotation acceleration and deceleration. As a result, during the rotation action (direction change action) of the hand 73, it is possible to prevent the liquid from spilling from the substrate W. In addition, the permissible range RC of the rotation acceleration and deceleration corresponds to the permissible range RD of the weight change amount. Therefore, in Figure 8B , the detection waveforms of the four weight sensors SA to SD fall within the allowable range RD.

[0188] After the direction of the hand 73 is changed to the substrate mounting portion PS1, the linear moving portion 79 moves the hand 73 supporting the substrate W, the advancing and retreating portion 75, and the rotating portion 77 from the position PT1 on the posture conversion portion 49 side to the position PT2 on the substrate mounting portion PS1 side ( Figure 18Here, similarly, the linear moving portion 79 moves the hand 73 within the permissible range RA of acceleration and deceleration. Figure 9B , the detection waveforms of the four weight sensors SA to SD fall within the allowable range RB of the weight change.

[0189] After the hand 73 and the like are moved to the position PT2, the advancing and retreating portion 75 advances the hand 73 supporting the substrate W so as to move the hand 73 upward from the substrate mounting portion PS1 ( Figure 18 Here, the advance and retreat unit 75 makes the hand 73 advance within the permissible range RA of acceleration and deceleration. Figure 9B , the detection waveforms of the four weight sensors SA to SD fall within the allowable range RB of the weight change.

[0190] After the hand 73 is advanced above the substrate mounting portion PS1, the three lift pins PN (refer to Figure 18 ) is raised by a motor. As a result, the three lift pins PN receive the substrate W from the hand 73 while supporting the lower surface of the substrate W with the liquid film formed thereon. The substrate transport robot 71 then retracts the hand 73, which is no longer supporting the substrate W. The substrate transport robot 71 then transports the remaining 24 substrates W one by one to the substrate mounting portion PS1. Furthermore, a liquid film is formed on the upper surfaces of the transported substrates W.

[0191] [Step S06] First single-chip processing

[0192] refer to Figure 1 The central robot CR1 of the single-wafer processing device 7 receives the substrate W with the liquid film formed thereon from the substrate loading portion PS1 using the hand 151 and transports the substrate W to any one of the five single-wafer processing chambers SW1 of the two towers TW1 and TW3. The holding and rotating portion 141 of each single-wafer processing chamber SW1 holds the substrate W with the device surface facing upward in a horizontal position and rotates it. In addition, each single-wafer processing chamber SW1 supplies pure water from the nozzle 143 to the device surface (upper surface) of the rotating substrate W, and then supplies IPA from the nozzle 143 to the device surface. As a result, the pure water on the upper surface of the substrate W is replaced with IPA.

[0193] [Step S07] Second single-chip processing

[0194] The first substrate transport robot CR2 receives a substrate W with a liquid film (IPA film) formed thereon from any of the three single-wafer processing chambers SW1 of the tower TW1 using its hand 151. The first substrate transport robot CR2 then transports the substrate W to any of the three single-wafer processing chambers SW2 of the tower TW2.

[0195] Furthermore, the second substrate transport robot CR3 receives a substrate W on which a liquid film (IPA film) is formed from one of the two single-wafer processing chambers SW1 of the tower TW3 using the hand 151. The second substrate transport robot CR3 then transports the substrate W to one of the three single-wafer processing chambers SW2 of the tower TW4.

[0196] Each single wafer processing chamber SW2 performs a drying process on one substrate W using carbon dioxide in a supercritical state (supercritical fluid). The drying process using the supercritical fluid prevents pattern collapse on the device surface of the substrate W.

[0197] [Step S08] Transferring the substrate to the carrier

[0198] The central robot CR1 receives a dried substrate W from any of the six single-wafer processing chambers SW2 using its hand 152 and transfers the substrate W to the substrate mounting portion PS2. 25 dried substrates W are sequentially transferred to the substrate mounting portion PS2.

[0199] The transfer robot IR uses the hand 127 to transfer the substrate W placed on the substrate placement portion PS2 to the carrier C placed on the mounting rack 125. When the 25 dried substrates W are transferred to the carrier C, an external transfer robot (not shown) transfers the carrier C from the mounting rack 125 to the next destination.

[0200] According to this embodiment, the allowable range RA of acceleration and deceleration used to move the hand 73 is determined based on the type of substrate W and the weight of the liquid film (the state of the liquid film). The hand 73 moves within this allowable range RA. This prevents liquid from spilling from the upper surface of the substrate W during transport. Furthermore, because the allowable range RA of acceleration and deceleration takes into account the wettability of the substrate W, the accuracy of the allowable range RA can be improved. Furthermore, the allowable range RA of acceleration and deceleration can be easily determined using a lookup table (LUT).

[0201] The substrate transport robot is equipped with four weight sensors SA-SD as detectors for detecting the state of the liquid film. These sensors are installed on the hand 73. Therefore, the robot control unit 111 can determine the permissible range RA for acceleration and deceleration, taking into account the actual weight of the liquid film measured by the four weight sensors SA-SD. Furthermore, the four weight sensors SA-SD are relatively small and inexpensive. Therefore, even with the four weight sensors SA-SD installed on the hand 73, the hand 73 is unlikely to become larger. Consequently, space and cost issues are unlikely to arise.

[0202] Furthermore, according to this embodiment, an allowable range RC of rotational acceleration / deceleration for rotating the hand 73 is determined according to the type of substrate W and the weight of the liquid film (the state of the liquid film). The hand 73 rotates within this allowable range RC of rotational acceleration / deceleration. This prevents liquid from spilling from the upper surface of the substrate W during transport (particularly rotation).

[0203] [Example 2]

[0204] Next, a second embodiment of the present invention will be described with reference to the drawings. Explanations overlapping with those of the first embodiment will be omitted.

[0205] In the first embodiment, even if, for example, the weight change rate of the liquid measured by the weight sensor SA exceeds the allowable range RB during the horizontal movement of the hand 73, the substrate transport robot 71 does not perform any special processing. In contrast, in the second embodiment, if the weight change rate of the liquid exceeds the allowable range RB, the acceleration and deceleration of the hand 73 during transport (movement) is controlled (adjusted) so that the weight change rate of the liquid falls within the allowable range RB.

[0206] During the movement of the hand 73, the robot control unit 111 monitors the four weight changes of the liquid moving on the upper surface of the substrate W at the measurement positions of the four weight sensors SA-SD based on the four weight values ​​JA-JD measured by the four weight sensors SA-SD. If any of the four weight changes deviates from the allowable range RB of weight change corresponding to the allowable range RA of acceleration / deceleration, the robot control unit 111 reduces the absolute value of the acceleration / deceleration of the hand 73 so that the weight change falls within the allowable range RB.

[0207] For example, suppose that Figure 19 In the acceleration region, the liquid deflects toward the weight sensor SA, and the weight change of the weight value JA measured by the weight sensor SA may exceed the allowable range RB. In this case, the acceleration (absolute value) is reduced so that the weight change of the weight value JA falls within the allowable range RB ( Figure 19 As a result, the weight change of the weight value JA falls within the allowable range RB, and the possibility of liquid spillage is reduced.

[0208] Similarly, while the hand 73 is rotating about the vertical axis AX5, the robot control unit 111 monitors four weight changes of the liquid moving on the upper surface of the substrate W at the measurement positions of the weight sensors SA-SD based on the four weight values ​​JA-JD measured by the four weight sensors SA-SD. If any of the four weight changes deviates from the allowable range RD of weight change corresponding to the allowable range RC of rotational acceleration / deceleration, the robot control unit 111 reduces the absolute value of the rotational acceleration / deceleration so that the weight change falls within the allowable range RD.

[0209] The effect of this embodiment is described below. As long as the acceleration and deceleration is within the permissible range RA, liquid spillage will not occur. However, the relationship between the permissible range RA and the permissible range RB of the weight change may change due to certain reasons. In this case, the possibility of liquid spillage increases. In this case, the permissible range RB of the weight change can also be used as a threshold value. When the weight change deviates, control (adjustment) is performed in such a way that the weight change falls within the permissible range RB. Therefore, liquid spillage can be prevented.

[0210] The present invention is not limited to the above-described embodiment, and can be implemented with modifications as follows.

[0211] (1) In each of the above embodiments, the central robot CR1 and at least one of the two substrate transfer robots CR2 and CR3 may also be configured similarly to the substrate transfer robot 71 that prevents liquid from spilling from the substrate W. In this case, the central robot CR1 and at least one of the two substrate transfer robots CR2 and CR3 configured similarly to the substrate transfer robot 71 correspond to the substrate transfer robot of the present invention.

[0212] In this variation, for example, hand 151 is Figure 6 As shown in FIG. 7 , the hand 151 is equipped with four weight sensors SA to SD. The main control unit 180 determines the permissible range RA of acceleration and deceleration for moving the hand 151, depending on the type of substrate W and the measured weight of the liquid film. The main control unit 180 then moves the hand 151 within the permissible range RA of acceleration and deceleration, for example, using the advance / retract unit 153 or the linear motion unit 157.

[0213] (2) In each of the above-mentioned embodiments and variation (1), the substrate transport robot 71 is provided with four weight sensors SA to SD for measuring the weight of the liquid film as a detection unit for detecting the state of the liquid film. In this regard, the substrate transport robot 71 may also be provided with a camera 185 as a detection unit in place of the four weight sensors SA to SD. Figure 20A As shown, for example, the camera 185 captures the entire liquid film formed on the upper surface of the substrate W supported by the hand 73 from above the substrate W. Thus, the image is obtained as shown in FIG. Figure 20B The entire image ZG of the liquid film is shown. The entire image ZG of the liquid film is transmitted to the robot control unit 111.

[0214] The robot control unit 111 can also obtain a corresponding value corresponding to the weight or amount of the liquid film (liquid volume) based on the pixel values ​​representing the density of the liquid film reflected in the overall image ZG. Furthermore, the robot control unit 111 can also obtain, for example, an allowable range RA of acceleration and deceleration for moving the hand 73 corresponding to the type of substrate W and the obtained corresponding value.

[0215] In addition, the camera 185 can also be moved together with the hand 73. Thus, the robot control unit 111 can also monitor the four interest areas INT1, INT2, INT3, and INT4 of the overall image ZG based on the overall image ZG captured by the camera 185 during the movement of the hand 73 (refer to FIG. Figure 20B ). Furthermore, when any one of the four corresponding value changes deviates from the variation range corresponding to the permissible range RA of acceleration / deceleration, the robot control unit 111 reduces the absolute value of the acceleration / deceleration of the hand 73 so that the variation falls within the variation range.

[0216] (3) In the above-described embodiments and variations, the substrate transport robot 71 includes weight sensors SA to SD for measuring the weight of the liquid film as a detection unit for detecting the state of the liquid film. In this regard, the substrate transport robot 71 may include a film thickness gauge 187 as a detection unit in place of the four weight sensors SA to SD.

[0217] As the film thickness gauge 187, a non-contact film thickness gauge using, for example, laser is used. Figure 21 As shown, for example, the film thickness gauge 187 measures the film thickness of a liquid film formed on the upper surface of the substrate W supported by the hand 73 at a predetermined position from above the substrate W. The film thickness is transmitted to the robot control unit 111. The robot control unit 111 determines the acceleration and deceleration range for moving the hand 73 according to the measured film thickness of the liquid film and the type of substrate W.

[0218] (4) In each of the above embodiments and variations, the robot control unit 111 uses Figure 11 The lookup table LUT shown in the figure obtains the permissible range RA of acceleration / deceleration for moving the hand 73, corresponding to the type of substrate W and the measured weight of the liquid film. In this regard, the robot control unit 111 can also obtain the permissible range RA of acceleration / deceleration and the permissible range RC of rotational acceleration / deceleration without using the lookup table LUT.

[0219] For example, the robot control unit 111 obtains the permissible range RA of acceleration and deceleration as follows. Figure 22As shown, the storage unit 113 or the storage unit 181 stores a plurality of relationship data DT that differ depending on the combination of the type of substrate W and the weight of the liquid film. Each relationship data DT includes a relationship expression EX between the weight change of the liquid film (the state change of the liquid film) and the acceleration / deceleration, an allowable range RA of the acceleration / deceleration in the relationship expression EX, and an allowable range RB of the weight change.

[0220] The robot controller 111 supports the substrate W on which the liquid film is formed with the hand 73. The robot controller 111 then uses the four weight sensors SA to SD to measure four weight values ​​JA to JD. Alternatively, the robot controller 111 can determine the weight of the liquid film based on the four measured weight values ​​JA to JD. Furthermore, when the hand 73 is moved at a preset acceleration / deceleration rate AC1 by the forward / retractable portion 75 or the linear motion portion 79, the robot controller 111 uses the four weight sensors SA to SD to measure the weight change CM1 of the four liquid films.

[0221] The robot control unit 111 then compares the preset acceleration / deceleration AC1 and the measured weight change CM1 of the liquid film with the relationship equations EX of the plurality of relationship data DT. Thus, the robot control unit 111 extracts a single piece of relationship data DT1 with the optimal relationship equation EX from the plurality of relationship data DT. Furthermore, the robot control unit 111 obtains the permissible range RA for acceleration / deceleration and the permissible range RB for weight change for the single piece of relationship data DT1. Similarly, the permissible range RC for rotational acceleration / deceleration and the permissible range RD for weight change are also obtained.

[0222] According to this variation, even if, for example, conditions regarding the type of substrate W are insufficient, it is possible to obtain optimal (approximate) relationship data DT from a plurality of existing relationship data DT, thereby obtaining the permissible range RA for acceleration / deceleration and the permissible range RB for weight change within the relationship data DT. Furthermore, by obtaining multiple weight changes CM1 and CM2 using multiple acceleration / deceleration rates AC1 and AC2, the accuracy of the comparison can be improved.

[0223] (4) In the above-described embodiments and variations, the substrate transport robot 71 cannot raise and lower the hand 73. In this regard, the substrate transport robot 71 may be configured to raise and lower the hand 73.

[0224] (5) In the above-described embodiments and variations, the hand 73 is advanced and retracted by the threaded shaft 87 and the guide rail 89 of the retracting portion 75. In this regard, the hand 73 may be advanced and retracted by a multi-jointed arm in place of the retracting portion 75.

[0225] (6) In the above-described embodiments and variations, the advancing and retreating portion 75 moves the hand 73 when the linear moving portion 79 does not move the hand 73. In this regard, the advancing and retreating portion 75 may move the hand 73 when the linear moving portion 79 moves the hand 73.

[0226] (7) In the above-described embodiments and variations, the rotating portion 77 rotates the hand 73 about the vertical axis AX5 when the advancing / retracting portion 75 and the linear moving portion 79 are not moving the hand 73. In this regard, the rotating portion 77 may rotate the hand 73 about the vertical axis AX5 when at least one of the advancing / retracting portion 75 and the linear moving portion 79 is moving the hand 73.

[0227] (8) In each of the above-described embodiments and variations, the permissible range RA of acceleration / deceleration and the permissible range RC of rotational acceleration / deceleration are ranges corresponding to the type of substrate W and the weight of the liquid film (the state of the liquid film). In this regard, the permissible ranges RA and RC may also be ranges corresponding to the type of liquid, the temperature of the liquid, the type of substrate W, and the weight of the liquid film. Furthermore, the liquid is the liquid of the liquid film formed on the upper surface of the substrate W.

[0228] (9) In the above embodiments and variations, Figure 16C In the posture conversion section 49, the substrate in the horizontal posture is lifted from the pure water, thereby forming a liquid film on the upper surface of the substrate W. In this regard, the liquid film may be formed on the upper surface of the substrate W by supplying pure water in a columnar or mist-like manner from a nozzle to the upper surface of the substrate W.

[0229] For example, the relay area R3 may also have Figure 18 The nozzle NZ is shown by the dotted line. For example, suppose that the wafer processing apparatus 7 stops processing and cannot transport the substrate W supported by the hand 73 moved to position PT2. In this case, the liquid film on the upper surface of the substrate W may evaporate and decrease. Therefore, by supplying pure water to the upper surface of the substrate W from the nozzle NZ, the substrate W can be prevented from drying out.

[0230] (10) In each of the above-described embodiments and variations, the hand 73 includes four weight sensors SA to SD. Thus, weight is measured at four locations on the hand 73. In this regard, the number of weight sensors is not limited to four. In other words, the hand 73 may include at least one weight sensor provided on the hand body 83. Furthermore, for example, one weight sensor may be provided on any one of the four contact portions 97A to 97D. Furthermore, for example, two weight sensors may be provided corresponding to any two of the four contact portions 97A to 97D.

[0231] (11) In each of the aforementioned embodiments and variations, the robot controller 111 obtains the permissible range RA of acceleration and deceleration and the permissible range RC of rotational acceleration and deceleration corresponding to the type of substrate W and the weight of the liquid film measured by the four weight sensors SA to SD. In this regard, for example, if the weight of the liquid film is known to some extent based on the amount (ml) of liquid supplied from the nozzle to the upper surface of the substrate W, the permissible range RA and the like may not take into account the weight of the liquid film measured by the four weight sensors SA to SD. In this case, for example, the robot controller 111 obtains the amount of supplied liquid film or the corresponding weight of the liquid film from the storage unit 113 as the state of the liquid film.

[0232] (12) In each of the above-described embodiments and variations, the robot control unit 111 uses the lookup table LUT to obtain the permissible range RA of acceleration and deceleration for moving the hand 73, etc., corresponding to the type of substrate W and the state of the liquid film. In this regard, the robot control unit 111 may also use the lookup table LUT to obtain the permissible range RA of acceleration and deceleration for moving the hand 73, etc., corresponding to the state of the liquid film.

[0233] (13) In each of the above-described embodiments and variations, the single-wafer processing chamber SW2 uses a supercritical fluid to dry the substrate W. In this regard, the single-wafer processing chamber SW2 may also include the holding and rotating portion 141 and the nozzle 143, similar to the single-wafer processing chamber SW1. In this case, the eleven single-wafer processing chambers SW1 and SW2 supply, for example, pure water and IPA to the substrates W, respectively, and then perform drying (spin drying) of the substrates W.

[0234] The present invention may be embodied in other specific forms without departing from the spirit or essence thereof, and therefore, reference should be made to the appended claims rather than to the foregoing description as indicating the scope of the invention.

[0235] [Explanation of Symbols]

[0236] 1 Substrate processing system

[0237] 71 Substrate transport robot

[0238] 73 hands

[0239] 75 Advance and Retreat

[0240] 77 Rotating unit

[0241] 79 linear motion unit

[0242] SA, SB, SC, SD weight sensors

[0243] JA, JB, JC, JD weight values

[0244] 111 Robot Control Department

[0245] 113 Storage Department

[0246] RA Acceleration / deceleration allowable range

[0247] RB Permissible range of weight change

[0248] Permissible range of RC rotation acceleration and deceleration

[0249] RD Permissible range of weight change

[0250] LUT Comparison Table

[0251] CR1 Center Robot

[0252] CR2, CR3 substrate transport robots

[0253] 151 hands

[0254] 153 Advance and Retreat

[0255] 155 lifting and rotating part

[0256] 157 linear motion unit

[0257] 180 Main control unit

[0258] 181 Storage Department

[0259] 185 Camera

[0260] 187 Film Thickness Gauge

[0261] AX5, AX7, AX8 vertical axis

[0262] DT relational data

[0263] EX relation

[0264] AC1 acceleration and deceleration

[0265] CH1 weight change

[0266] W substrate.

Claims

1. A substrate transport robot, characterized in that It is a substrate transfer robot that transfers substrates and has: a hand supporting said substrate in a horizontal position; a moving part for moving the hand in a horizontal direction; and control unit; and The control unit supporting the substrate with a liquid film formed on the upper surface of the substrate with the hand; obtaining a first range of acceleration and deceleration for moving the hand corresponding to the state of the liquid film; The hand is moved by the moving unit within the first range of acceleration and deceleration.

2. The substrate transfer robot according to claim 1, further comprising: a detection unit for detecting a state of the liquid film; and The control unit A first range of the acceleration / deceleration for moving the hand is acquired according to the state of the liquid film detected by the detection unit.

3. The substrate transfer robot according to claim 2, wherein The detection unit is a weight sensor provided on the hand for measuring the weight; The control unit The range of the acceleration / deceleration for moving the hand is acquired according to the weight of the liquid film measured by the weight sensor.

4. The substrate transfer robot according to claim 3, wherein The hand has: Hand body; and a plurality of contact portions provided on the upper surface of the hand body and supporting the peripheral portion of the substrate; and The weight sensor is provided between any one of the plurality of contact portions and the hand body.

5. The substrate transfer robot according to claim 3, wherein The first range of acceleration and deceleration is the permissible range of acceleration and deceleration narrower than the limit range of acceleration and deceleration within which liquid does not spill from the substrate due to liquid movement of the liquid film; and The control unit monitors a weight change of the liquid moving on the upper surface of the substrate at a measurement position of the weight sensor based on a weight value measured by the weight sensor during movement of the hand. The acceleration / deceleration of the hand is controlled so that the weight change amount falls within the change amount range corresponding to the permissible range of the acceleration / deceleration.

6. The substrate transfer robot according to claim 1, wherein The control unit acquires a first range of the acceleration / deceleration for moving the hand according to the state of the liquid film and the type of substrate.

7. The substrate transfer robot according to claim 6, wherein The type of the substrate includes the wettability of the substrate.

8. The substrate transfer robot according to claim 6, wherein The control unit uses a lookup table to obtain a first range of the acceleration / deceleration for moving the hand corresponding to the state of the liquid film and the type of the substrate.

9. The substrate transfer robot according to claim 1, further comprising: a detection unit for detecting a state of the liquid film; and a storage unit storing a plurality of relationship data that are different depending on the state of the liquid film; and Each of the plurality of relationship data includes a relationship expression between the amount of change in the state of the liquid film and the acceleration / deceleration, and a first range of the acceleration / deceleration in the relationship expression; When the control unit moves the hand at an acceleration or deceleration preset by the moving unit, the detection unit detects the amount of change in the state of the liquid film. By comparing the preset acceleration / deceleration and the detected state change of the liquid film with the relational expression of each of the plurality of relational data, one relational data having the best relational expression is extracted from the plurality of relational data, A first range of the acceleration / deceleration included in the one piece of relationship data is acquired.

10. The substrate transfer robot according to claim 1, further comprising: a rotating portion for rotating the hand around a vertical axis; and The control unit acquires a second range of rotation acceleration / deceleration for rotating the hand according to the state of the liquid film, and rotates the hand within the second range via the rotating unit.

11. A substrate processing system, characterized in that It is a substrate processing system that processes a substrate, and A substrate transfer robot according to any one of claims 1 to 10 is provided.

12. A control method for a substrate transport robot, characterized in that The invention relates to a control method of a substrate transport robot for transporting a substrate, and The substrate transport robot comprises: a hand, placing the substrate in a horizontal position; and A moving part that moves the hand in a horizontal direction; and The control method comprises: a supporting step of supporting the substrate with the hand on which the liquid film is formed; a range acquisition step of acquiring a first range of acceleration and deceleration for movement of the hand corresponding to the state of the liquid film; and The hand moving step is to move the hand within the first range of the acceleration / deceleration by the moving unit.

Images