A double-sided packaging structure and a preparation method thereof

Abstract

The application provides a double-sided packaging structure and a preparation method thereof, and relates to the technical field of chip packaging. The double-sided packaging structure comprises a plastic packaging body, a substrate is arranged in the plastic packaging body, a first chip and a second chip are arranged on the upper and lower sides of the substrate respectively, one side of the first chip is connected with a first heat dissipation plate through a first heat-conducting adhesive layer, the first heat dissipation plate is exposed to the plastic packaging body on the side away from the first chip and forms a first heat dissipation surface, one side of the second chip is connected with a second heat dissipation plate through a second heat-conducting adhesive layer, and the second heat dissipation plate is exposed to the plastic packaging body on the side away from the second chip and forms a second heat dissipation surface. In the application, the first heat dissipation plate and the second heat dissipation plate are arranged, so that the heat dissipation area of the double-sided packaging structure is increased, the heat dissipation performance of the whole double-sided packaging structure is greatly enhanced, the service life of the chip is prolonged, and the stability of the chip in operation is improved.

Description

Technical Field

[0001] This invention relates to the field of chip packaging technology, and in particular to a double-sided packaging structure and its preparation method. Background Technology

[0002] Double-sided packaging refers to packaging a chip on both the front and back sides of a single substrate, thereby achieving higher integration and functionality. This structure typically includes multiple chips, controllers, and electronic components, which are respectively positioned on both sides of the substrate and electrically connected and packaged through different connection methods.

[0003] Chinese Patent CN215731655U discloses a double-sided packaging structure, including a substrate, a chip, a molding compound, and multiple anti-warping components. The chip is mounted on opposite sides of the substrate; the molding compound covers the opposite sides of the substrate and encapsulates the chip; multiple anti-warping components are mounted on opposite sides of the substrate and encapsulated within the molding compound to balance the weight of the chip on the substrate and the thermal stress of the packaging structure. By incorporating anti-warping components embedded in the molding compound, the balance of the chip's weight on the substrate and the mitigation of thermal stress on the packaging structure effectively reduce and suppress warping deformation of the packaging structure in the direction perpendicular to the substrate, thereby improving the stability and reliability of the packaging structure.

[0004] In the above double-sided packaging structure, although the anti-warping component embedded in the plastic encapsulation layer can enhance the heat dissipation of the chip, the heat dissipation area of ​​the anti-warping component is small, which affects the overall heat dissipation performance. Summary of the Invention

[0005] This invention provides a double-sided packaging structure and its preparation method to solve the technical problem that the heat dissipation area of ​​current double-sided packaging structures is small, which affects the overall heat dissipation performance.

[0006] To solve the above-mentioned technical problems, the present invention discloses a double-sided packaging structure, including: a molding compound, a substrate disposed within the molding compound, a first chip and a second chip respectively disposed on the upper and lower sides of the substrate, one side of the first chip being connected to a first heat sink through a first thermally conductive adhesive layer, the side of the first heat sink away from the first chip being exposed in the molding compound and forming a first heat dissipation surface, and one side of the second chip being connected to a second heat sink through a second thermally conductive adhesive layer, the side of the second heat sink away from the second chip being exposed in the molding compound and forming a second heat dissipation surface.

[0007] Preferably, a plurality of heat-conducting tapes are provided between the first heat sink and the second heat sink, and the plurality of heat-conducting tapes are symmetrically arranged on the left and right sides of the substrate. The heat-conducting tapes include a first heat transfer section, a second heat transfer section and a third heat transfer section from top to bottom.

[0008] Preferably, one end of the first heat transfer section is fixedly connected to the bottom wall of the first heat sink, and the other end of the first heat transfer section extends into the connecting hole. The connecting hole is located in the second heat sink. The longitudinal section of the connecting hole is in the shape of an isosceles trapezoid. The length of the upper end of the connecting hole is greater than the length of the lower end of the connecting hole. The lower end of the first heat transfer section is adapted to the inner wall of the connecting hole.

[0009] Preferably, a second heat transfer section is provided at the end of the first heat transfer section away from the first heat sink plate. The second heat transfer section is perpendicular to the first heat transfer section and is located in a positioning groove. The positioning groove is located on the bottom wall of the second heat sink plate, and one end of the positioning groove is connected to the connecting hole.

[0010] Preferably, a third heat transfer section is provided at the end of the second heat transfer section away from the first heat transfer section. The third heat transfer section is perpendicular to the second heat transfer section and is disposed in a limiting groove. The limiting groove is disposed on the side wall of the second heat sink. One end of the limiting groove is connected to the positioning groove. The third heat transfer section includes a connecting end and a snap-fit ​​end. The connecting end is connected to one end of the second heat transfer section, and the other end of the connecting end is connected to the snap-fit ​​end. The snap-fit ​​end is in the shape of an isosceles triangle. The length of the snap-fit ​​end near the connecting end is greater than the length of the connecting end. The inner wall of the limiting groove is adapted to the third heat transfer section.

[0011] Preferably, the method further includes a method for preparing the above-mentioned double-sided packaging structure, comprising the following steps:

[0012] Provide a substrate;

[0013] The first chip is mounted on one side of the substrate;

[0014] A first thermally conductive adhesive layer is disposed on the surface of a first chip, and a first heat sink is mounted on the first thermally conductive adhesive layer to obtain a first assembly.

[0015] The first assembly is flipped 180° and the second chip is mounted on the substrate;

[0016] A second thermally conductive adhesive layer is deposited on the surface of the second chip, and a second heat sink is press-fitted onto the second thermally conductive adhesive layer to obtain a second assembly.

[0017] The second assembly is encapsulated to obtain a finished product with a double-sided encapsulated structure.

[0018] Preferably, a pressing device is used to press the second heat sink onto the second thermally conductive adhesive layer. The pressing device includes a pressing plate with a plurality of pressing holes. A fixing component is installed in each pressing hole to fix the first assembly. A support plate is installed on the rear side of the pressing plate, and a driving mechanism is installed on the front side of the support plate. A moving plate is installed at the output end of the driving mechanism. A plurality of pressing columns are installed at the lower end of the moving plate, and each pressing column corresponds to a pressing hole. A pressing plate is installed at the lower end of the pressing column, and a pressing component is installed on the lower surface of the pressing plate.

[0019] Preferably, the fixing component includes a housing, which is located at the center of the press-fit hole. A through hole is provided at the top of the housing, and a support column is slidably arranged in the through hole. A support plate is provided at the upper end of the support column. The support plate is used to support the first heat dissipation plate. The lower end of the support plate extends into the housing and is provided with a first elastic element. The lower end of the first elastic element is connected to the bottom wall of the housing.

[0020] Preferably, adjusting rods are symmetrically arranged on both sides of the support column. The upper surface of the adjusting rod is slidably connected to the inner wall of the housing. One end of the adjusting rod is connected to the lower end of the support column by a pull rope. The other end of the adjusting rod extends to the outside of the housing and is provided with a telescopic mechanism. A clamping plate is provided at the output end of the telescopic mechanism. The clamping plate is perpendicular to the adjusting rod. A second elastic element is provided between the telescopic mechanism and the housing.

[0021] Preferably, the upper end of the clamping plate is higher than the upper surface of the second heat sink plate.

[0022] The technical solution of this invention has the following advantages: This invention provides a double-sided packaging structure and its preparation method, relating to the field of chip packaging technology. The double-sided packaging structure includes a molding compound, a substrate disposed within the molding compound, and a first chip and a second chip respectively disposed on the upper and lower sides of the substrate. One side of the first chip is connected to a first heat sink through a first thermally conductive adhesive layer. The side of the first heat sink away from the first chip is exposed in the molding compound and forms a first heat dissipation surface. One side of the second chip is connected to a second heat sink through a second thermally conductive adhesive layer. The side of the second heat sink away from the second chip is exposed in the molding compound and forms a second heat dissipation surface. In this invention, by setting the first heat sink and the second heat sink, the heat dissipation area of ​​the double-sided packaging structure can be increased, thereby significantly enhancing the overall heat dissipation performance of the double-sided packaging structure, extending the chip's lifespan, and improving the stability of chip operation.

[0023] Other features and advantages of the invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of the invention may be realized and obtained by means of the means particularly pointed out in the written description and the accompanying drawings.

[0024] The technical solution of the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. Attached Figure Description

[0025] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used in conjunction with embodiments of the invention to explain the invention and do not constitute a limitation thereof. In the drawings:

[0026] Figure 1 This is a schematic diagram of the overall structure of a double-sided packaging structure according to the present invention;

[0027] Figure 2 This is a bottom view of a double-sided packaging structure according to the present invention;

[0028] Figure 3 This is a schematic diagram of the first heat sink in this invention;

[0029] Figure 4 For the present invention Figure 1 A partial structural cross-sectional view at point AA;

[0030] Figure 5 For the present invention Figure 1 Partial structural cross-sectional view at point BB;

[0031] Figure 6 This is a schematic diagram of the press-fitting device in the double-sided packaging structure preparation method of the present invention;

[0032] Figure 7 For the present invention Figure 6 Enlarged view of the structure at point C;

[0033] Figure 8 For the present invention Figure 7 Enlarged view of the structure at point D;

[0034] Figure 9 For the present invention Figure 8 Enlarged view of the structure at point E in the middle.

[0035] In the diagram: 1. Molded enclosure; 2. Substrate; 3. First chip; 4. Second chip; 5. First thermally conductive adhesive layer; 6. First heat sink; 7. Second thermally conductive adhesive layer; 8. Second heat sink; 9. Heat transfer tape; 10. First heat transfer section; 11. Second heat transfer section; 12. Third heat transfer section; 13. Connecting hole; 14. Positioning groove; 15. Restricting groove; 16. Pressing plate; 17. Pressing hole; 18. Support plate; 19. Moving plate; 20. Pressure column; 21. Pressure plate; 22. Housing; 23. Support column; 24. Support plate; 25. 26. First elastic element; 27. Adjusting rod; 28. Pull rope; 29. ​​Telescopic mechanism; 30. Clamping plate; 31. Second elastic element; 32. Fixed plate; 33. First swing plate; 34. Mounting plate; 35. Spring rod; 36. Second swing plate; 37. Mounting bracket; 38. Pressure roller; 39. Fixed block; 40. First rotating drum; 41. Drive rod; 42. Connecting spring; 43. Spiral groove; 44. Drive column; 45. First magnetic strip; 46. Second rotating drum; 47. Second magnetic strip; 48. Sliding block; 49. Positioning plate; 40. Positioning hole. Detailed Implementation

[0036] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are for illustration and explanation only and are not intended to limit the present invention.

[0037] Furthermore, in this invention, the use of terms such as "first" and "second" is for descriptive purposes only and does not specifically refer to any order or sequence, nor is it intended to limit the invention. They are merely used to distinguish components or operations described using the same technical terms and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions and features of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If a combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0038] Example 1:

[0039] This invention provides a double-sided packaging structure, such as... Figures 1-5 As shown, it includes: a molding compound 1, a substrate 2 disposed inside the molding compound 1, a first chip 3 and a second chip 4 disposed on the upper and lower sides of the substrate 2 respectively, one side of the first chip 3 is connected to a first heat sink 6 through a first thermally conductive adhesive layer 5, the side of the first heat sink 6 away from the first chip 3 is exposed in the molding compound 1 and forms a first heat dissipation surface, and one side of the second chip 4 is connected to a second heat sink 8 through a second thermally conductive adhesive layer 7, the side of the second heat sink 8 away from the second chip 4 is exposed in the molding compound 1 and forms a second heat dissipation surface.

[0040] The working principle and beneficial effects of the above technical solution are as follows: A first chip 3 and a second chip 4 are respectively installed on the upper and lower sides of the substrate 2. Several first chips 3 and second chips 4 can be provided to improve the integration. A first thermally conductive adhesive layer 5 is provided on the side of the first chip 3 away from the substrate 2, and a first heat sink 6 is bonded to it through the first thermally conductive adhesive layer 5. The area of ​​the first heat sink 6 is larger than the area of ​​the first chip 3. The heat generated by the first chip 3 can be transferred to the first heat sink 6 and dissipated through the first heat dissipation surface to achieve heat dissipation of the first chip 3. A second thermally conductive adhesive layer 7 is provided on the side of the second chip 4 away from the substrate 2, and a second heat sink 8 is bonded to it through the second thermally conductive adhesive layer 7. The area of ​​the second heat sink 8 is larger than the area of ​​the second chip 4. The heat generated by the second chip 4 can be transferred to the second heat sink 8 and dissipated through the second heat dissipation surface to achieve heat dissipation of the second chip 4. By setting the first heat sink 6 and the second heat sink 8, the heat dissipation area of ​​the double-sided packaging structure can be increased, thereby greatly enhancing the overall heat dissipation performance of the double-sided packaging structure, extending the chip's lifespan, and improving the stability of chip operation.

[0041] Example 2:

[0042] Based on the above embodiment 1, as follows Figures 2-5As shown, a plurality of heat conduction plates 9 are provided between the first heat sink 6 and the second heat sink 8. The plurality of heat conduction plates 9 are symmetrically arranged on the left and right sides of the substrate 2. The heat conduction plates 9 include a first heat transfer section 10, a second heat transfer section 11 and a third heat transfer section 12 from top to bottom.

[0043] One end of the first heat transfer section 10 is fixedly connected to the bottom wall of the first heat sink 6, and the other end of the first heat transfer section 10 extends into the connecting hole 13. The connecting hole 13 is located in the second heat sink 8. The longitudinal section of the connecting hole 13 is in the shape of an isosceles trapezoid. The length of the upper end of the connecting hole 13 is greater than the length of the lower end of the connecting hole 13. The lower end of the first heat transfer section 10 is adapted to the inner wall of the connecting hole 13.

[0044] The second heat transfer section 11 is provided at the end of the first heat transfer section 10 away from the first heat sink 6. The second heat transfer section 11 is perpendicular to the first heat transfer section 10. The second heat transfer section 11 is located in the positioning groove 14. The positioning groove 14 is located on the bottom wall of the second heat sink 8. One end of the positioning groove 14 is connected to the connecting hole 13.

[0045] A third heat transfer section 12 is provided at the end of the second heat transfer section 11 away from the first heat transfer section 10. The third heat transfer section 12 is perpendicular to the second heat transfer section 11 and is located in a limiting groove 15. The limiting groove 15 is located on the side wall of the second heat sink 8. One end of the limiting groove 15 is connected to the positioning groove 14. The third heat transfer section 12 includes a connecting end and a snap-fit ​​end. The connecting end is connected to one end of the second heat transfer section 11, and the other end of the connecting end is connected to the snap-fit ​​end. The snap-fit ​​end is in the shape of an isosceles triangle. The length of the snap-fit ​​end near the connecting end is greater than the length of the connecting end. The inner wall of the limiting groove 15 is adapted to the third heat transfer section 12.

[0046] The working principle and beneficial effects of the above technical solution are as follows: Several heat conduction tapes 9 are arranged between the first heat sink 6 and the second heat sink 8. These heat conduction tapes 9 enable heat transfer between the first heat sink 6 and the second heat sink 8. When the heat of the first chip 3 is higher than that of the second chip 4, the heat absorbed by the first heat sink 6 can be transferred to the second heat sink 8 through the heat conduction tapes 9, accelerating heat dissipation, improving heat dissipation efficiency, preventing heat accumulation in the first chip 3, and avoiding performance degradation or malfunction of the first chip 3 due to overheating. Furthermore, by setting multiple heat conduction tapes 9, heat can be transferred between the first heat sink 6 and the second heat sink 8. The heat transfer tapes are evenly distributed to avoid localized overheating or underheating, helping to maintain temperature consistency within the double-sided packaging structure and extending the lifespan of the first chip 3 and the second chip 4. At least four heat transfer tapes 9 are provided, each located at one of the four corners of the first heat sink 6. Each heat transfer tape 9 includes a first heat transfer band, a second heat transfer band, and a third heat transfer band. One end of the first heat transfer section 10 is fixedly connected to the bottom wall of the first heat sink 6, and the other end extends into the connecting hole 13. Since the connecting hole 13 is an isosceles trapezoid, and the end of the first heat transfer section 10 is fitted to the inner wall of the connecting hole 13, therefore… When the first heat transfer segment 10 contacts the connecting hole 13, the second heat sink 8 cannot move closer to the second chip 4. To prevent the gap between the second heat sink 8 and the second chip 4 from being too small, the second heat transfer segment 11 is bent and inserted into the positioning groove 14. The positioning groove 14 positions the second heat transfer segment 11 and prevents it from shifting. The third heat transfer segment 12 is perpendicular to the second heat transfer segment 11. The snap-fit ​​end of the third heat transfer segment 12 is inserted into the limiting groove 15. Since the snap-fit ​​end is an isosceles triangle, the length of the end of the snap-fit ​​end near the connecting end is greater than the length of the connecting end. Therefore, the third heat transfer segment 12 cannot be inserted into the limiting groove 15. The third heat transfer section 12 cannot be dislodged from the limiting groove 15 due to the internal sliding mechanism and the encapsulation of the plastic body 1. This enhances the reliability of the connection between the first heat sink 6 and the second heat sink 8, prevents the first heat sink 6 and the second heat sink 8 from separating from the plastic body 1, ensures the heat dissipation performance of the double-sided encapsulation structure, extends the service life, and ensures that the maximum width of the snap-fit ​​end is less than the minimum width of the connection hole 13, so that the snap-fit ​​end can pass smoothly through the connection hole 13. Furthermore, the guide action on both sides of the snap-fit ​​end facilitates alignment and is conducive to the rapid installation of the second heat sink 8. Compared with the traditional welding method, this improves the installation efficiency and reliability.

[0047] Example 3:

[0048] Based on Example 2, this embodiment of the invention also provides a method for preparing a double-sided packaging structure, which includes the following steps:

[0049] Provide a substrate 2;

[0050] The first chip 3 is mounted on one side of the substrate 2;

[0051] A first thermally conductive adhesive layer 5 is disposed on the surface of the first chip 3, and a first heat sink 6 is mounted on the first thermally conductive adhesive layer 5 to obtain a first assembly.

[0052] The first assembly is flipped 180° and the second chip 4 is mounted on the substrate 2;

[0053] A second thermally conductive adhesive layer 7 is disposed on the surface of the second chip 4, and a second heat sink 8 is press-fitted onto the second thermally conductive adhesive layer 7 to obtain the second assembly.

[0054] The second assembly is encapsulated to obtain a finished product with a double-sided encapsulated structure.

[0055] The working principle and beneficial effects of the above technical solution are as follows: A substrate 2 is provided; a first chip 3 is mounted on one side of the substrate 2, which can be mounted on the side of the substrate 2 by surface mounting or flip-chip mounting; then, thermally conductive adhesive is applied to the surface of the first chip 3 to form a first thermally conductive adhesive layer 5, and a first heat sink 6 is mounted on the first thermally conductive adhesive layer 5 to form a first assembly; then the first assembly is flipped 180°, a second chip 4 is mounted on the substrate 2, and thermally conductive adhesive is applied to the surface of the second chip 4 to form a second thermally conductive adhesive layer 7, and a second heat sink 8 is pressed onto the second thermally conductive adhesive layer 7 to form a second assembly; finally, the second assembly is encapsulated to obtain a double-sided packaged structure. Since the area of ​​the first heat sink 6 is larger than the area of ​​the first chip 3, and the area of ​​the second heat sink 8 is larger than the area of ​​the second chip 4, the heat dissipation area of ​​the double-sided packaged structure can be increased, thereby greatly enhancing the overall heat dissipation performance of the double-sided packaged structure, extending the chip's lifespan, and improving the stability of chip operation. The first thermally conductive adhesive layer 5 and the second thermally conductive adhesive layer 7 can both be made of thermally conductive silicone, which allows the heat of the first chip 3 and the second chip 4 to be quickly dissipated.

[0056] Example 4:

[0057] Based on Example 3, such as Figures 4-9 As shown, a press-fitting device is used to press the second heat sink 8 onto the second thermally conductive adhesive layer 7. The press-fitting device includes a press-fitting plate 16, which has a plurality of press-fitting holes 17. A fixing component is installed in the press-fitting holes 17 to fix the first assembly. A support plate 18 is installed on the rear side of the press-fitting plate 16, and a drive mechanism is installed on the front side of the support plate 18. A moving plate 19 is installed at the output end of the drive mechanism. A plurality of pressure columns 20 are installed at the lower end of the moving plate 19. Each pressure column 20 corresponds to one of the press-fitting holes 17. A pressure plate 21 is installed at the lower end of the pressure column 20, and a press-fitting component is installed on the lower surface of the pressure plate 21.

[0058] The working principle and beneficial effects of the above technical solution are as follows: When installing the second heat sink 8, in order to improve the reliability of the connection between the first heat sink 6 and the second heat sink 8, the second heat sink 8 is pressed onto the second thermally conductive adhesive layer 7 by a pressing device. Specifically, the first assembly is first flipped over, with the first heat sink 6 of the first assembly facing down. Then, the second chip 4 is installed on the substrate 2, and the second thermally conductive adhesive layer 7 is prepared on the surface of the second chip 4. After the second thermally conductive adhesive layer 7 is prepared, the connection hole 13 of the second heat sink 8 is aligned with the heat transfer cable 9 and placed on the second thermally conductive adhesive layer 7. Then, the second chip 4 is placed on the substrate 2. The first assembly of the two heat sinks 8 is placed into the pressing hole 17 and fixed by the fixing component. The drive mechanism is started. The drive mechanism can be an electric push rod. The drive mechanism can drive the moving plate 19 to move downward. The moving plate 19 drives the pressure column 20 to move downward. The pressure column 20 drives the pressure plate 21 into the pressing hole 17. The pressing component presses down, causing the heat conduction cable 9 to bend. The second heat transfer section 11 of the heat conduction cable 9 is pressed into the positioning groove 14, and the third heat transfer section 12 is pressed into the limiting groove 15. The pressing is completed to obtain the second assembly. Finally, after plastic sealing, the double-sided encapsulated structure product can be obtained.

[0059] Example 5:

[0060] Based on Example 3, such as Figure 7 As shown, the fixing assembly includes a housing 22, which is located at the center of the press-fit hole 17. A through hole is provided at the top of the housing 22, and a support column 23 is slidably arranged in the through hole. A support plate 24 is provided at the upper end of the support column 23. The support plate 24 is used to support the first heat dissipation plate 6. The lower end of the support plate 24 extends into the housing 22 and is provided with a first elastic element 25. The lower end of the first elastic element 25 is connected to the bottom wall of the housing 22.

[0061] Adjusting rods 26 are symmetrically arranged on both sides of the support column 23. The upper surface of the adjusting rod 26 is slidably connected to the inner wall of the housing 22. One end of the adjusting rod 26 is connected to the lower end of the support column 23 through a pull rope 27. The other end of the adjusting rod 26 extends to the outside of the housing 22 and is provided with a telescopic mechanism 28. A clamping plate 29 is provided at the output end of the telescopic mechanism 28. The clamping plate 29 is perpendicular to the adjusting rod 26. A second elastic element 30 is provided between the telescopic mechanism 28 and the housing 22.

[0062] The upper end of the clamping plate 29 is higher than the upper surface of the second heat sink 8.

[0063] The working principle and beneficial effects of the above technical solution are as follows: The first heat sink 6 of the first assembly is placed downwards on the support plate 24. The support plate 24 moves downwards under the gravity of the first assembly. The support plate 24 drives the support column 23 to slide downwards in the through hole, and the first elastic element 25 is compressed. At the same time, the support column 23 drives the adjusting rod 26 to slide closer to the support column 23 through the pull rope 27. The adjusting rod 26 drives the telescopic mechanism 28 to move closer to the shell 22, and the second elastic element 30 is compressed. The telescopic mechanism 28 drives the clamping plate 29 to move closer to the first heat sink 6. The first assembly moves and gradually contacts the outer side of the first heat sink 6. The clamping plates 29 on both sides keep the first assembly in the center of the pressing hole 17, which facilitates the pressing of the assembly and improves the consistency of pressing. The first elastic element 25 and the second elastic element 30 can both be return springs. The telescopic mechanism 28 can be an electric telescopic rod. The telescopic mechanism 28 can drive the clamping plate 29 to move up and down, so that the clamping plate 29 can adapt to different first assemblies and can keep the height of the clamping plate 29 higher than the upper surface of the second heat sink 8 at all times, preventing the second heat sink 8 from shifting during the pressing process.

[0064] Example 6:

[0065] Based on Example 5, such as Figure 8 As shown, the pressing assembly includes two fixed plates 31, which are symmetrically arranged on the lower surface of the pressure plate 21. A first swing plate 32 is arranged on the side of the fixed plate 31 near the clamping plate 29. One end of the first swing plate 32 is hinged to the side wall of the fixed plate 31, and the other end of the first swing plate 32 is hinged to the upper side wall of the mounting plate 33. A spring rod 34 is arranged between the first swing plate 32 and the pressure plate 21. One end of the spring rod 34 is hinged to the lower surface of the pressure plate 21, and the other end of the spring rod 34 is hinged to the side wall of the first swing plate 32. A second swing plate 35 is arranged below the first swing plate 32, and the second swing plate 35 is parallel to the first swing plate 32. One end of the second swing plate 35 is hinged to the side wall of the fixed plate 31, and the other end of the second swing plate 35 is hinged to the lower side wall of the mounting plate 33. Mounting frames 36 are symmetrically arranged on the front and rear sides of the mounting plate 33, and pressure rollers 37 are rotatably arranged inside the mounting frames 36.

[0066] The working principle and beneficial effects of the above technical solution are as follows: During pressing, as the pressure plate 21 moves downward, the pressure roller 37 corresponding to the heat conduction tape 9 gradually contacts the upper surface of the second heat dissipation plate 8. Then, the pressure plate 21 continues to move downward, the first swing plate 32 and the second swing plate 35 rotate, the spring rod 34 is compressed, and the pressure roller 37 rolls along the upper surface of the second heat dissipation plate 8 towards the clamping plate 29. When the pressure roller 37 contacts the second heat transfer section 11 of the heat conduction tape 9, the pressure roller 37 can press the second heat transfer section 11 into the positioning groove 14. When the pressure roller 37 rolls to the outside of the second heat dissipation plate 8, as the pressure plate 21 continues to press down, the pressure roller... 37 can press the third heat transfer section 12 into the limiting groove 15, restricting the movement of the third heat transfer section 12, thereby completing the pressing of the second heat sink 8. The third heat transfer section 12 cannot slide in the limiting groove 15, and under the encapsulation of the encapsulation body 1, the third heat transfer section 12 cannot come out of the limiting groove 15, thereby enhancing the reliability of the connection between the first heat sink 6 and the second heat sink 8, and preventing the first heat sink 6, the second heat sink 8 and the encapsulation body 1 from separating. The first heat sink 6, the second heat sink 8 and the heat conduction tape 9 are made of the same heat conduction material, which improves the heat dissipation performance of the double-sided encapsulation structure and extends its service life.

[0067] Example 7:

[0068] Based on Example 6, such as Figure 8 , Figure 9 As shown, two fixing blocks 38 are provided on the side of the clamping plate 29 away from the second heat sink 8. A first rotating cylinder 39 is rotatably arranged between the two fixing blocks 38. The first rotating cylinder 39 is parallel to the clamping plate 29. A drive rod 40 is provided inside the first rotating cylinder 39. The lower end of the drive rod 40 is connected to the upper surface of the lower fixing block 38 through a connecting spring 41. The upper end of the drive rod 40 passes through the upper fixing block 38 and extends above the fixing block 38. The drive rod 40 and the upper fixing block 38 are slidably connected at the point of penetration. A spiral groove 42 is provided on the inner wall of the first rotating cylinder 39 along the axial direction of the first rotating cylinder 39. A drive column 43 is provided on the side wall of the drive rod 40. One end of the drive column 43 extends into the spiral groove 42. The outer wall of the first rotating cylinder 39... Several first mounting slots are provided, and a first magnetic strip 44 is installed in each first mounting slot. A second rotating cylinder 45 is rotatably installed outside the first rotating cylinder 39. Several second mounting slots are provided on the inner wall of the second rotating cylinder 45, and a second magnetic strip 46 is installed in each second mounting slot. The magnetic poles of the second magnetic strip 46 and the first magnetic strip 44 are opposite on the side they are close to each other. The upper and lower ends of the outer wall of the second rotating cylinder 45 are provided with external threads with opposite directions. The upper and lower ends of the second rotating cylinder 45 are respectively threaded to a sliding block 47. A positioning plate 48 is provided on the side of the sliding block 47 near the clamping plate 29. A positioning hole 49 corresponding to the positioning plate 48 is provided in the clamping plate 29. The end of the positioning plate 48 away from the sliding block 47 passes through the positioning hole 49 and extends to the inner side of the clamping plate 29.

[0069] The working principle and beneficial effects of the above technical solution are as follows: A distance sensor is set at the end of the positioning plate 48 away from the sliding block 47. The two positioning plates 48 are located on the upper and lower sides of the second heat sink 8, respectively. The distance sensor can detect the distance between the positioning plate 48 and the second heat sink 8, and activate the telescopic mechanism 28. The telescopic mechanism 28 can drive the clamping plate 29 to move up and down, thereby driving the fixed block 38 to move up and down. When the distances between the two positioning plates 48 and the second heat sink 8 are the same, the telescopic mechanism 28 is closed, and then the drive mechanism is activated. The pressure plate 21 gradually contacts the upper end of the drive rod 40. When the pressure plate 21 contacts the upper end of the drive rod 40, the pressure roller 37 has not yet contacted the upper surface of the second heat sink 8. At this time, As the pressure plate 21 moves downward, the drive rod 40 slides vertically downward within the upper fixed block 38. The drive rod 40 drives the drive column 43 to move downward, compressing the connecting spring 41. The drive column 43 slides in connection with the inner wall of the spiral groove 42. When the drive column 43 moves downward, it can drive the first rotating drum 39 to rotate between the two fixed blocks 38 through its cooperation with the spiral groove 42. The first rotating drum 39 then drives the second rotating drum 45 to rotate synchronously through the magnetic force of the first magnetic strip 44 and the second magnetic strip 46. When the second rotating drum 45 rotates, the two sliding blocks 47 move towards each other, thereby driving the two positioning plates 48 to move towards the second heat sink 8 until the positioning plates 48 contact the second heat sink 8. At this time, the second heat sink 8 is clamped between the two positioning plates 48. As the pressure plate 21 continues to press down, the pressure roller 37 contacts the surface of the second heat sink 8 and gradually presses the second heat transfer section 11 into the positioning groove 14 and the third heat transfer section 12 into the limiting groove 15. During the pressing process, the pressure plate 21 drives the drive rod 40 to continue sliding downward, but the positioning plate 48 contacts the second heat sink 8, the first magnetic strip 44 cannot continue to drive the second magnetic strip 46 to move synchronously, the second rotating drum 45 cannot continue to rotate, and the first rotating drum 39 rotates inside the second rotating drum 45. At this time, the pressure of the two positioning plates 48 on the second heat sink 8 does not exceed the preset pressure range, avoiding damage to the second heat sink 8, and at the same time... The two positioning plates 48 are able to adapt to the second heat sink 8 of different thicknesses, and the pressure on different second heat sink 8 will not exceed the preset pressure range, ensuring the consistency and reliability of the press-fitting of the second heat sink 8. In addition, during the rolling pressing process of the pressure roller 37, the upper and lower positioning plates 48 can fix the second heat sink 8 at the preset height, keeping the second heat sink 8 stable. It will not cause damage to the first chip 3 and the second chip 4 due to excessive pressure from the pressure roller 37, nor will it cause the first thermally conductive adhesive layer 5 and the second thermally conductive adhesive layer 7 to be squeezed and overflow, thus ensuring the thermal conductivity of the first thermally conductive adhesive layer 5 and the second thermally conductive adhesive layer 7 and enhancing the overall heat dissipation performance of the double-sided packaging structure.

[0070] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0071] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0072] Although embodiments of the present invention have been disclosed above, they are not limited to the applications listed in the specification and embodiments. They can be applied to various fields suitable for the present invention. Other modifications can be easily made by those skilled in the art. Therefore, without departing from the general concept defined by the claims and their equivalents, the present invention is not limited to the specific details and illustrations shown and described herein.

Claims

1. A double-sided packaging structure, characterized in that, include: A molding compound (1) is provided inside the molding compound (1). A substrate (2) is provided on the upper and lower sides of the substrate (2). A first chip (3) and a second chip (4) are respectively provided on the upper and lower sides. One side of the first chip (3) is connected to a first heat sink (6) through a first thermally conductive adhesive layer (5). The side of the first heat sink (6) away from the first chip (3) is exposed in the molding compound (1) and forms a first heat dissipation surface. One side of the second chip (4) is connected to a second heat sink (8) through a second thermally conductive adhesive layer (7). The side of the second heat sink (8) away from the second chip (4) is exposed in the molding compound (1) and forms a second heat dissipation surface. A plurality of heat conduction heats (9) are provided between the first heat sink (6) and the second heat sink (8). The plurality of heat conduction heats (9) are symmetrically arranged on the left and right sides of the substrate (2). The heat conduction heats (9) include a first heat transfer section (10), a second heat transfer section (11) and a third heat transfer section (12) from top to bottom. One end of the first heat transfer section (10) is fixedly connected to the bottom wall of the first heat sink (6), and the other end of the first heat transfer section (10) extends into the connecting hole (13). The connecting hole (13) is located in the second heat sink (8). The longitudinal section of the connecting hole (13) is in the shape of an isosceles trapezoid. The length of the upper end of the connecting hole (13) is greater than the length of the lower end of the connecting hole (13). The lower end of the first heat transfer section (10) is adapted to the inner wall of the connecting hole (13). A second heat transfer section (11) is provided at the end of the first heat transfer section (10) away from the first heat sink (6). The second heat transfer section (11) is perpendicular to the first heat transfer section (10). The second heat transfer section (11) is located in the positioning groove (14). The positioning groove (14) is located on the bottom wall of the second heat sink (8). One end of the positioning groove (14) is connected to the connecting hole (13). A third heat transfer section (12) is provided at the end of the second heat transfer section (11) away from the first heat transfer section (10). The third heat transfer section (12) is perpendicular to the second heat transfer section (11). The third heat transfer section (12) is located in the limiting groove (15). The limiting groove (15) is located on the side wall of the second heat sink (8). One end of the limiting groove (15) is connected to the positioning groove (14). The third heat transfer section (12) includes a connecting end and a snap-fit ​​end. The connecting end is connected to one end of the second heat transfer section (11). The other end of the connecting end is connected to the snap-fit ​​end. The snap-fit ​​end is in the shape of an isosceles triangle. The length of the snap-fit ​​end near the connecting end is greater than the length of the connecting end. The inner wall of the limiting groove (15) is adapted to the third heat transfer section (12).

2. A method for fabricating a double-sided encapsulation structure, used to fabricate the double-sided encapsulation structure as described in claim 1, characterized in that, Includes the following steps: Provide a substrate (2); A first chip (3) is mounted on one side of the substrate (2); A first thermally conductive adhesive layer (5) is formed on the surface of the first chip (3), and a first heat sink (6) is installed on the first thermally conductive adhesive layer (5) to obtain a first assembly. The first assembly is flipped 180° and the second chip (4) is mounted on the substrate (2); A second thermally conductive adhesive layer (7) is provided on the surface of the second chip (4), and a second heat sink (8) is press-fitted onto the second thermally conductive adhesive layer (7) to obtain the second assembly; The second assembly is encapsulated to obtain a finished product with a double-sided encapsulated structure.

3. The method for preparing a double-sided packaging structure according to claim 2, characterized in that, The second heat sink (8) is pressed onto the second thermally conductive adhesive layer (7) using a press-fitting device. The press-fitting device includes a press-fitting plate (16), which has several press-fitting holes (17). A fixing component is installed in the press-fitting holes (17) to fix the first assembly. A support plate (18) is installed on the rear side of the press-fitting plate (16), and a drive mechanism is installed on the front side of the support plate (18). A moving plate (19) is installed at the output end of the drive mechanism. Several pressure columns (20) are installed at the lower end of the moving plate (19). The pressure columns (20) correspond one-to-one with the press-fitting holes (17). A pressure plate (21) is installed at the lower end of the pressure column (20), and a press-fitting component is installed on the lower surface of the pressure plate (21).

4. The method for preparing a double-sided packaging structure according to claim 3, characterized in that, The fixing component includes a housing (22), which is located at the center of the press-fit hole (17). A through hole is provided at the top of the housing (22), and a support column (23) is slidably arranged in the through hole. A support plate (24) is provided at the upper end of the support column (23). The support plate (24) is used to support the first heat sink (6). The lower end of the support plate (24) extends into the housing (22) and is provided with a first elastic element (25). The lower end of the first elastic element (25) is connected to the bottom wall of the housing (22).

5. The method for preparing a double-sided packaging structure according to claim 4, characterized in that, Adjusting rods (26) are symmetrically arranged on both sides of the support column (23). The upper surface of the adjusting rod (26) is slidably connected to the inner wall of the housing (22). One end of the adjusting rod (26) is connected to the lower end of the support column (23) through a pull rope (27). The other end of the adjusting rod (26) extends to the outside of the housing (22) and is provided with a telescopic mechanism (28). A clamping plate (29) is provided at the output end of the telescopic mechanism (28). The clamping plate (29) is perpendicular to the adjusting rod (26). A second elastic element (30) is provided between the telescopic mechanism (28) and the housing (22).

6. The method for preparing a double-sided packaging structure according to claim 5, characterized in that, The upper end of the clamping plate (29) is higher than the upper surface of the second heat sink (8).

Images