Cavity packaging structure and manufacturing method thereof

Abstract

The invention provides a cavity packaging structure and a manufacturing method thereof. The cavity packaging structure comprises a substrate; the upper cover is arranged on the upper surface of the substrate and forms a sealed cavity with the substrate; the chip is positioned in the cavity and is arranged on the upper surface of the substrate; and the liquid cooling pipeline is arranged in the cavity and used for introducing cooling liquid, a part of area of the liquid cooling pipeline is bent towards the substrate to serve as a first cooling part, and the lower surface of the first cooling part is connected with the upper surface of the chip. Heat on the upper surface of the chip is conducted to the first cooling part, and then heat dissipation is achieved through flowing of cooling liquid in the liquid cooling pipeline. The liquid cooling pipeline is not a linear pipeline but a bent pipeline, so that the tube pass of the cooling liquid in the liquid cooling pipeline is increased, the standing time of the cooling liquid in the cavity is long, the heat exchange time is prolonged, more heat generated by the chip can be taken away in unit time, and the heat dissipation performance of the cavity packaging structure is greatly improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor packaging, and in particular to a cavity packaging structure and a manufacturing method thereof. Background Art

[0002] In the field of modern electronic technology, as various electronic products develop towards high performance and miniaturization, the application of high-power cavity chips has become more and more extensive. The power density of high-power cavity chips can reach 50-500W / cm 2 During operation, a large amount of heat is generated and highly concentrated, which can easily cause localized temperature rise. If this heat is not promptly and effectively dissipated, the chip temperature will continue to rise, which will seriously affect product performance, such as reduced signal transmission stability, slower computing speed, and in extreme cases, even complete product failure.

[0003] To address the heat dissipation challenges of high-power cavity chips, some high-end electronic products are using innovative water cooling systems. These systems utilize internally integrated sealed water channels to create a circulating heat dissipation path within the electronic product, while externally driven micro-pipes transfer heat to the device for dissipation. However, these water cooling systems also have significant drawbacks.

[0004] Figure 1 This is a schematic diagram of the packaging structure of an existing internally integrated sealed circulating water system. Figure 1 The concave upper cover 100 is inverted onto the flange base plate 110. The upper cover 100 and the flange base plate 110 form a cavity 120. The chip 130 is located in the cavity 120 and is disposed on the upper surface of the flange base plate 110. A coolant micro-channel 140 is formed in the upper cover 100 and is sealed with coolant to cool the package structure.

[0005] Figure 1 In the packaging structure of the internal integrated sealed circulating water system shown, the sealed circulating water system is integrated inside the product cover 100. Although it can enhance the temperature control ability of the outer shell area, its heat dissipation effect is limited to the surface structure of the product and it is difficult to effectively act on key components such as the core heat-generating chip. The overall heat dissipation efficiency is not significant.

[0006] Figure 2 This is a schematic diagram of the packaging structure of an existing micro-pipeline system using external drive. Figure 2The concave upper cover 200 is inverted onto the flange base plate 210. The upper cover 200 and the flange base plate 210 form a cavity 220. The chip 230 is located in the cavity 220 and is disposed on the upper surface of the flange base plate 210. A coolant micro-channel 240 is formed in the upper cover 200. The coolant inlet and coolant outlet of the coolant micro-channel 240 are connected to an external drive device. The external drive device drives the coolant to continuously circulate in the coolant micro-channel 240 to cool the package structure. Figure 3 This is a schematic diagram of another existing packaging structure using an externally driven micro-pipeline system. Figure 3 The concave upper cover 300 is inverted onto the flange base plate 310. The upper cover 300 and the flange base plate 310 form a cavity 320. The chip 330 is located in the cavity 320 and disposed on the upper surface of the flange base plate 310. The heat transfer medium 350 covers the surface of the chip 330. Coolant micro-channels 340 are formed within the heat transfer medium 350. The coolant inlet and outlet of the coolant micro-channels 340 are connected to an external drive device. The external drive device drives the coolant to continuously circulate within the coolant micro-channels 340 to cool the package structure.

[0007] Figure 2 and Figure 3 In the packaging structure of the externally driven micro-pipe system shown, the cross-sectional area and flow channel length of the coolant micro-pipe are strictly restricted due to the compact packaging specifications of electronic products. As a result, the residence time of the coolant in the coolant micro-pipe is too short, and the heat exchange completed per unit time cannot meet the heat dissipation requirements of high-power devices, ultimately causing the heat conduction efficiency to be significantly lower than the theoretical expected value.

[0008] Therefore, how to improve the heat dissipation performance of the cavity packaging structure has become one of the current research focuses. Summary of the Invention

[0009] The technical problem to be solved by the present invention is to provide a cavity packaging structure and a manufacturing method thereof, which can improve the heat dissipation performance of the cavity packaging structure.

[0010] In order to solve the above problems, the present invention provides a cavity packaging structure, comprising: a substrate; an upper cover, arranged on the upper surface of the substrate and forming a sealed cavity with the substrate; a chip, located in the cavity and arranged on the upper surface of the substrate; a liquid cooling pipeline, arranged in the cavity and used to pass cooling liquid, a partial area of ​​the liquid cooling pipeline is bent toward the substrate to serve as a first cooling part, and the lower surface of the first cooling part is connected to the upper surface of the chip.

[0011] In a specific embodiment, the first cooling portion has one or more bending regions, and the lower surface of each bending region is connected to the upper surface of the chip.

[0012] In a specific embodiment, the distance between the lower surface of the bending region and the upper surface of the substrate is the same.

[0013] In a specific embodiment, the distances between the lower surface of the bending region and the upper surface of the substrate are different.

[0014] In a specific embodiment, a thermally conductive adhesive layer is provided on the upper surface of the chip, and the lower surface of the first cooling part is buried in the thermally conductive adhesive layer.

[0015] In a specific embodiment, another portion of the liquid cooling pipeline is also bent toward the substrate to serve as a second cooling portion, and a lower surface of the second cooling portion is connected to the upper surface of the substrate.

[0016] In a specific embodiment, the second cooling portion has one or more bending regions, and the lower surface of each bending region is connected to the upper surface of the substrate.

[0017] In a specific embodiment, a thermally conductive adhesive layer is provided on the upper surface of the substrate, and the lower surface of the second cooling part is embedded in the thermally conductive adhesive layer.

[0018] In a specific embodiment, another portion of the liquid cooling pipeline is also bent toward the substrate to serve as a third cooling portion, and the third cooling portion is suspended above the substrate.

[0019] In a specific embodiment, the chip is electrically connected to the substrate through wires, and the third cooling portion is suspended above the wires.

[0020] In a specific embodiment, the liquid cooling pipeline has alternately arranged areas bent toward the substrate and areas bent toward the upper cover.

[0021] In a specific embodiment, at least a portion of the liquid cooling pipeline in the area bent toward the upper cover is in contact with the inner top surface of the upper cover.

[0022] In a specific embodiment, at least a portion of the area where the liquid cooling pipeline is bent toward the upper cover is fixed to the inner top surface of the upper cover through a thermally conductive adhesive layer.

[0023] In a specific embodiment, the liquid cooling pipeline includes a liquid inlet end and a liquid outlet end, the liquid inlet end passes through the top or side wall of the cavity, and the liquid outlet end passes through the top or side wall of the cavity.

[0024] In a specific embodiment, the liquid inlet and the liquid outlet are both fixed to the top or side wall of the cavity via an adhesive layer.

[0025] In a specific embodiment, the substrate includes a base and a first annular shell arranged on the upper surface of the base, the liquid inlet end and the liquid outlet end of the liquid cooling pipeline are arranged on the upper surface of the first annular shell, and the upper cover is buckled on the upper surface of the first annular shell and the liquid inlet end and the liquid outlet end of the liquid cooling pipeline to form the cavity.

[0026] In a specific embodiment, the liquid inlet and the liquid outlet are both fixed to the upper surface of the first annular shell and the upper cover through an adhesive layer.

[0027] In a specific embodiment, the base is a flange base, and the substrate also includes a second annular shell arranged on the edge of the upper surface of the flange base, the pins are arranged on the upper surface of the second annular shell, the first annular shell is arranged on the upper surface of the second annular shell and the upper surface of the pins, and a partial area of ​​the pins is located in the cavity, and the chip is electrically connected to the pins through leads.

[0028] In a specific embodiment, the first annular shell is fixed to the upper surface of the second annular shell and the upper surface of the pin through an adhesive layer.

[0029] In a specific embodiment, the chip is flip-chip or face-down mounted on the upper surface of the substrate.

[0030] The present invention also provides a method for manufacturing a cavity packaging structure, comprising: providing a substrate; arranging a chip on the upper surface of the substrate; arranging a liquid cooling pipeline, wherein the liquid cooling pipeline is used to pass cooling liquid, and a partial area of ​​the liquid cooling pipeline is bent toward the substrate to serve as a first cooling part, and the lower surface of the first cooling part is connected to the upper surface of the chip; arranging an upper cover, wherein the upper cover is arranged on the upper surface of the substrate and forms a sealed cavity with the substrate, and the chip and the liquid cooling pipeline are located in the cavity.

[0031] In a specific embodiment, the step of providing a substrate further includes: providing a base; setting a first annular shell on the upper surface of the base; the step of setting a liquid cooling pipeline further includes: setting the liquid inlet end and the liquid outlet end of the liquid cooling pipeline on the upper surface of the first annular shell; the step of setting an upper cover further includes: buckling the upper cover on the upper surface of the first annular shell and the liquid inlet end and the liquid outlet end of the liquid cooling pipeline to form a sealed cavity.

[0032] In a specific embodiment, before the step of setting the liquid cooling pipeline, it also includes: forming an adhesive material layer on the upper surface of the first annular shell; the step of setting the liquid cooling pipeline further includes: the liquid inlet end and the liquid outlet end of the liquid cooling pipeline are buried in the adhesive material layer; after the step of setting the upper cover, the adhesive material layer is solidified to form an adhesive layer.

[0033] In a specific embodiment, before the step of setting a first annular shell on the upper surface of the base, the step further includes: setting a second annular shell on the upper surface of the base, and setting pins on the upper surface of the second annular shell, the first annular shell is set on the upper surface of the second annular shell and the upper surface of the pins, and a partial area of ​​the pins is located within the range surrounded by the first annular shell; the step of setting a chip on the upper surface of the substrate further includes: mounting the chip upright on the upper surface of the base, and the chip is electrically connected to the pins through leads.

[0034] In a specific embodiment, the step of disposing a second annular shell on the upper surface of the base further includes: fixing the second annular shell to the upper surface of the base via an adhesive layer.

[0035] In a specific embodiment, the first cooling portion has one or more bending areas, and the step of providing a liquid cooling pipeline further includes: the lower surface of each bending area is connected to the upper surface of the chip.

[0036] In a specific embodiment, the step of setting up the liquid cooling pipeline also includes: setting a thermal conductive adhesive material layer on the upper surface of the chip; the step of setting up the liquid cooling pipeline further includes: the lower surface of the first cooling part of the liquid cooling pipeline is buried in the thermal conductive adhesive material layer; and the thermal conductive adhesive material layer is solidified to form a thermal conductive adhesive layer.

[0037] In a specific embodiment, another portion of the liquid cooling pipeline is also bent toward the substrate to serve as a second cooling portion, and the step of providing the liquid cooling pipeline further includes: a lower surface of the second cooling portion is connected to an upper surface of the substrate.

[0038] In a specific embodiment, the second cooling portion has one or more bending areas, and the step of providing a liquid cooling pipeline further includes: the lower surface of each of the bending areas is connected to the upper surface of the substrate.

[0039] In a specific embodiment, before the step of setting up the liquid cooling pipeline, it also includes: setting a thermal conductive adhesive material layer on the upper surface of the substrate; the step of setting up the liquid cooling pipeline further includes: the lower surface of each of the bending areas of the second cooling part is buried in the thermal conductive adhesive material layer; and the thermal conductive adhesive material layer is solidified to form a thermal conductive adhesive layer.

[0040] In a specific embodiment, another portion of the liquid cooling pipeline is also bent toward the substrate to serve as a third cooling portion, and the step of providing the liquid cooling pipeline further includes: the third cooling portion is suspended above the substrate.

[0041] In a specific embodiment, in the step of setting a chip on the upper surface of the substrate, the chip is set upright on the upper surface of the substrate and electrically connected to the substrate through leads; the step of setting a liquid cooling pipeline further includes: the third cooling part is suspended above the leads.

[0042] In a specific embodiment, the liquid cooling pipeline has alternatingly arranged areas bent toward the substrate and areas bent toward the upper cover, and the step of setting the upper cover further includes: at least a portion of the areas of the liquid cooling pipeline bent toward the upper cover is in contact with the inner top surface of the upper cover.

[0043] In a specific embodiment, the liquid cooling pipeline has alternatingly arranged areas that bend toward the substrate and areas that bend toward the upper cover, and the step of setting the upper cover further includes: forming a thermally conductive adhesive material layer on the inner top surface of the upper cover; buckling the upper cover on the base, and burying at least part of the area of ​​the liquid cooling pipeline that bends toward the upper cover in the thermally conductive adhesive material layer; and curing the thermally conductive adhesive material layer to form a thermally conductive adhesive layer.

[0044] In the cavity packaging structure and its manufacturing method provided in a specific embodiment of the present invention, a portion of the liquid cooling pipe is bent toward the substrate to serve as a first cooling portion. The lower surface of the first cooling portion is connected to the upper surface of the chip, so that heat from the upper surface of the chip is transferred to the first cooling portion, and then heat is dissipated through the flow of coolant in the liquid cooling pipe. The liquid cooling pipe is not a straight pipe, but a curved pipe. This increases the length of the coolant within the liquid cooling pipe, prolongs the coolant's residence time within the cavity, and prolongs the heat exchange time. It can remove more heat generated by the chip per unit time, greatly improving the heat dissipation performance of the cavity packaging structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] To more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly describes the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention, and those skilled in the art can derive other drawings based on these drawings without inventive effort.

[0046] Figure 1 This is a schematic diagram of the packaging structure of an existing internally integrated sealed circulating waterway system;

[0047] Figure 2It is a schematic diagram of a packaging structure of an existing micro-pipeline system using an external drive;

[0048] Figure 3 It is a schematic diagram of another existing packaging structure of a micro-pipeline system using an external drive;

[0049] Figure 4 is a schematic diagram of a first specific embodiment of the cavity packaging structure of the present invention;

[0050] Figure 5 is a schematic diagram of a second specific embodiment of the cavity packaging structure of the present invention;

[0051] Figure 6 is a schematic diagram of a third specific embodiment of the cavity packaging structure of the present invention;

[0052] Figure 7 is a schematic diagram of a fourth specific embodiment of the cavity packaging structure of the present invention;

[0053] Figure 8 is a schematic diagram of a fifth specific embodiment of the cavity packaging structure of the present invention;

[0054] Figure 9 is a schematic diagram of a sixth specific embodiment of the cavity packaging structure of the present invention;

[0055] Figure 10 is a schematic diagram of a seventh specific embodiment of the cavity packaging structure of the present invention;

[0056] Figure 11 is a schematic diagram of an eighth specific embodiment of the cavity packaging structure of the present invention;

[0057] Figure 12 It is a schematic diagram of the steps of a first specific embodiment of a method for manufacturing a cavity packaging structure of the present invention;

[0058] Figure 13 is a schematic diagram of providing a substrate in a first specific embodiment of the method for manufacturing a cavity packaging structure of the present invention;

[0059] Figure 14 is a schematic diagram of providing a substrate in a first specific embodiment of the method for manufacturing a cavity packaging structure of the present invention;

[0060] Figure 15 2 is a schematic diagram of arranging a chip on the upper surface of the substrate in a first specific embodiment of the method for manufacturing a cavity packaging structure of the present invention;

[0061] Figure 16 It is a schematic diagram of providing a liquid cooling pipeline in the first specific embodiment of the method for manufacturing the cavity packaging structure of the present invention;

[0062] Figure 17 It is a schematic diagram of providing an upper cover in the first specific embodiment of the method for manufacturing the cavity packaging structure of the present invention. DETAILED DESCRIPTION

[0063] The specific embodiments of the cavity packaging structure and the manufacturing method thereof provided by the present invention are described in detail below with reference to the accompanying drawings.

[0064] Figure 4 This is a schematic diagram of the first specific embodiment of the cavity packaging structure of the present invention, please refer to Figure 4 The cavity packaging structure includes: a substrate 400; an upper cover 410, which is arranged on the upper surface of the substrate 400 and forms a sealed cavity 420 with the substrate 400; a chip, which is located in the cavity 420 and is arranged on the upper surface of the substrate 400; a liquid cooling pipeline 440, which is arranged in the cavity 420 and is used to pass cooling liquid. A partial area of ​​the liquid cooling pipeline 440 is bent toward the substrate 400 to serve as a first cooling part 441, and the lower surface of the first cooling part 441 is connected to the upper surface of the chip.

[0065] The substrate 400 can adopt an existing ceramic substrate, a lead frame, a laminated substrate, an MIS (Molded Interconnect System) plastic-encapsulated interconnect substrate or a redistribution stacking layer, etc. The substrate 400 includes an upper surface and a lower surface that are relatively distributed. A circuit layer (not shown in the drawings) is provided in the substrate 400 for realizing the transmission and distribution of electrical signals. In some specific embodiments, a plurality of lead solder balls electrically connected to the circuit layer are provided on the lower surface of the substrate 400. The lead solder balls not only provide electrical connection but also play a role of mechanical support. In some specific embodiments, a plurality of solder pads electrically connected to the circuit layer are provided on the upper surface of the substrate 400. The chip is electrically connected to the solder pads to realize the transmission of electrical signals between the chip and the substrate 400.

[0066] In some embodiments, see Figure 4The substrate 400 includes a base 401 and a first annular housing 402 disposed on the upper surface of the base 401. The liquid inlet 444 and liquid outlet 445 of the liquid cooling pipe 440 are disposed on the upper surface of the first annular housing 402. The upper cover 410 is fastened to the upper surface of the first annular housing 402 and the liquid inlet 444 and liquid outlet 445 of the liquid cooling pipe 440 to form the cavity 420. In one specific embodiment, the cavity packaging structure is a clip flat package (CFP). The base 401 can be a flange base. The flange base is used to support the chip and form a sealed cavity 420 between the upper cover 410. The flange base is also used to dissipate heat from the chip.

[0067] In some specific embodiments, the liquid inlet 444 and the liquid outlet 445 are secured to the upper surface of the first annular housing 402 and the upper cover 410 via an adhesive layer (not shown in the drawings) to enhance structural stability. For example, in one specific embodiment, the upper cover 410 has a groove on its surface facing the first annular housing 402. The adhesive layer is disposed within the groove and on the upper surface of the first annular housing 402. The liquid inlet 444 and the liquid outlet 445 are disposed within the groove and secured to the upper surface of the first annular housing 402 and the upper cover 410 via the adhesive layer (not shown in the drawings). The adhesive layer not only secures the liquid inlet and outlet but also acts as a seal to form the sealed cavity 420. In other specific embodiments, a groove may be provided on the upper surface of the first annular housing 402, and the adhesive layer may be provided in the groove and on the surface of the upper cover 410 facing the first annular housing 402. The liquid inlet and the liquid outlet may be provided in the groove and fixed to the upper surface of the first annular housing 402 and the upper cover 410 via the adhesive layer. In still other specific embodiments, the groove may be provided on both the upper surface of the first annular housing 402 and the surface of the upper cover 410 facing the first annular housing 402. A portion of the liquid inlet and the liquid outlet may be provided in the groove on the upper surface of the first annular housing 402, and the other portion may be provided in the groove on the surface of the upper cover 410 facing the first annular housing 402.

[0068] In some embodiments, Figure 4As shown, the substrate further includes a second annular housing 403 disposed on the edge of the upper surface of the flange base. Pins 450 are disposed on the upper surface of the second annular housing 403. The first annular housing 402 is disposed on the upper surface of the second annular housing 403 and the upper surface of the pins 450. Partial areas of the pins 450 are located within the cavity 420. The chip is electrically connected to the pins 450 via leads 433. In the cavity packaging structure, the first annular housing 402 exposes both ends of the pins 450, so that one end of the pins 450 is located within the cavity 420 for electrical connection to the chip's leads 433, and the other end is located outside the cavity 420 for electrical connection to external devices.

[0069] In some embodiments, the first annular housing 402 is fixed to the upper surface of the second annular housing 403 and the upper surface of the pin 450 via an adhesive layer (not shown in the drawings). The adhesive layer not only fixes the first annular housing 402 but also acts as a seal to form a sealed cavity 420.

[0070] Further, in some specific embodiments, please refer to Figure 5 , which is a schematic diagram of a second embodiment of the cavity packaging structure of the present invention. In this embodiment, the substrate 400 does not include the second annular shell 403 and the pin 450. Specifically, in the second embodiment, the substrate 400 includes a base 401 and a first annular shell 402 disposed on the upper surface of the base 401. The liquid inlet end 444 and the liquid outlet end 445 of the liquid cooling pipeline 440 are disposed on the upper surface of the first annular shell 402. The upper cover 410 is buckled onto the upper surface of the first annular shell 402 and the liquid inlet end 444 and the liquid outlet end 445 of the liquid cooling pipeline 440 to form the cavity 420. Furthermore, in one embodiment, the liquid inlet end 444 and the liquid outlet end 445 are both fixed to the upper surface of the first annular shell 402 and the upper cover 410 via an adhesive layer.

[0071] The upper cover 410 has a concave configuration and is inverted on the upper surface of the substrate 400, and is enclosed with the substrate 400 to form a sealed cavity 420. This concave design not only provides sufficient installation space for the chips and other electronic components, but also enhances the mechanical stability and sealing of the overall structure through the close fit between the side walls of the upper cover 410 and the substrate 400. The upper cover 410 is used to form the cavity 420 with the substrate 400, and is also used for heat dissipation of the packaging structure. The side walls of the upper cover 410 are fixedly connected to the upper surface of the substrate 400 through an adhesive layer. The adhesive layer is usually made of a material with high thermal conductivity and a certain degree of elasticity, such as epoxy resin or silicone, to ensure a firm connection between the upper cover 410 and the substrate 400, while being able to relieve stress caused by differences in thermal expansion coefficients. The upper cover 410 can be a metal cover, a ceramic cover, a composite material cover, a graphite cover, etc. Upper covers 410 made of different materials have different advantages and uses and can meet diverse application needs. For example, in some embodiments, the upper cover 410 can be made of non-metallic materials, such as a ceramic cover, a composite material cover, or a graphite cover, to prevent the upper cover 410 from affecting the radio frequency signals emitted by the chip. In a first embodiment, the upper cover 410 is a ceramic cover, so that the cavity packaging structure is a clip flat package.

[0072] The cavity packaging structure of the present invention includes one or more chips, which are located in the cavity 420 and are flip-chip or face-down mounted on the upper surface of the substrate 400 .

[0073] In some specific embodiments, the cavity packaging structure of the present invention includes one or more chips mounted on the upper surface of the substrate 400. For example, Figure 4 As shown, in a first specific embodiment, the cavity packaging structure of the present invention includes three chips, namely a first chip 430, a second chip 431 and a third chip 432. The first chip 430, the second chip 431 and the third chip 432 are all arranged upright on the upper surface of the substrate 400. As an example, the first chip 430 includes an upper surface and a lower surface arranged opposite to each other. A functional area (not marked in the drawings) is provided on the upper surface of the first chip 430. The functional area is electrically connected to the pins 450 of the substrate 400 and the functional area on the upper surface of the second chip 431 through a lead 433. The lead 433 can be a gold wire, a silver wire, a copper wire, an aluminum wire or an alloy wire. The lower surface of the first chip 430 is attached to the upper surface of the substrate 400 through an adhesive layer to achieve mechanical fixing and thermal conduction connection. The heat on the lower surface of the first chip 430 can be conducted to the substrate 400 through the adhesive layer, which is beneficial to the heat dissipation of the first chip 430.

[0074] In some specific embodiments, the cavity packaging structure of the present invention includes one or more flip-chip chips disposed on the upper surface of the substrate 400. For example, see Figure 5 In a second embodiment, the cavity package structure of the present invention includes a fourth chip 530, which is flip-chip mounted on the upper surface of the substrate 400. Specifically, the fourth chip 530 includes an upper surface and a lower surface disposed opposite each other. A functional area (not shown in the drawings) is disposed on the lower surface of the fourth chip 530. The functional area is electrically connected to the circuit layer within the substrate 400 via conductive bumps 534.

[0075] In some specific embodiments, the cavity packaging structure of the present invention includes a plurality of chips, wherein a portion of the chips are flip-chip mounted on the upper surface of the substrate 400, and another portion of the chips are mounted face-up on the upper surface of the substrate 400. Figure 6 As shown, it is a schematic diagram of the third specific embodiment of the cavity packaging structure of the present invention. In the third specific embodiment, the cavity packaging structure of the present invention includes a fifth chip 630 and a sixth chip 631. The fifth chip 630 is arranged upright on the upper surface of the substrate 400, and the functional area of ​​the fifth chip 630 is away from the substrate 400 and is electrically connected to the substrate 400 through a lead 633. The sixth chip 631 is arranged inverted on the upper surface of the substrate 400, and the functional area of ​​the sixth chip 631 is facing the substrate 400, and is electrically connected to the substrate 400 through a conductive bump 634.

[0076] The liquid cooling line 440 is arranged in the cavity 420, and the interior of the liquid cooling line 440 is hollow for passing a cooling liquid. The liquid cooling line 440 is formed by a material with high thermal conductivity. In some specific embodiments, the material with high thermal conductivity includes a metal (such as copper, aluminum, gold, nickel, steel or stainless steel). The cooling liquid can be deionized water, an alcohol-based solution, a fluorinated liquid (hydrofluoroether), mineral oil or silicone oil. The cooling liquid flows in the liquid cooling line 440 to achieve heat dissipation. Specifically, when it is necessary to dissipate heat from the packaging structure, the liquid cooling line 440 is connected to an external pipeline, and the external pipeline is connected to a driving structure such as a pump. The pump continuously pumps the cooling liquid into the liquid cooling line 440 from the inlet end of the liquid cooling line 440 through the external pipeline. The cooling liquid performs heat exchange in the liquid cooling line 440 and then flows out from the outlet end of the liquid cooling line 440. After the heat in the outflowing coolant is released, the coolant can be pumped back into the liquid cooling pipeline 440 by the pump for circulation.

[0077] Part of the liquid cooling line 440 is bent toward the substrate 400 to serve as a first cooling portion 441. The lower surface of the first cooling portion 441 is connected to the upper surface of the chip. Heat from the upper surface of the chip can be transferred to the first cooling portion 441 and heat-exchanged with the coolant within the liquid cooling line 440, thereby dissipating heat from the upper surface of the chip. The liquid cooling line is not a straight line, but rather a curved line. This increases the length of the coolant within the liquid cooling line 440, allowing the coolant to remain within the cavity 420 for a longer period of time, extending the heat exchange time and allowing it to remove more heat generated by the chip per unit time.

[0078] As an example, the lower surface of the first cooling unit 441 is connected to the upper surface of the first chip 430. Heat from the upper surface of the first chip 430 can be transferred to the first cooling unit 441 and exchanged with the coolant in the liquid cooling pipe 440 to dissipate heat from the upper surface of the first chip 430.

[0079] The first cooling portion 441 may be connected to the upper surface of the chip via a thermally conductive adhesive layer, or may be in direct contact with the upper surface of the chip.

[0080] For the chip mounted on the substrate 400, in order to prevent the first cooling portion 441 from contacting the front surface of the chip and affecting the functional area of ​​the front surface of the chip, the first cooling portion 441 is connected to the upper surface of the chip through a thermal conductive adhesive layer. Figure 4 As shown, the first chip 430 is mounted on the upper surface of the substrate 400. To prevent the first cooling portion 441 from contacting the first chip 430 and affecting the functional area on the front of the first chip 430, a thermally conductive adhesive layer 900 is provided on the upper surface of the first chip 430, and the lower surface of the first cooling portion 441 is embedded in the thermally conductive adhesive layer 900. The lower surface of the first cooling portion 441 is connected to the upper surface of the first chip 430 via the thermally conductive adhesive layer 900. Heat from the upper surface of the first chip 430 is directly transferred to the thermally conductive adhesive layer 900, and then transferred to the lower surface of the first cooling portion 441 through the thermally conductive adhesive layer 900. Heat is then exchanged with the coolant in the liquid cooling pipe 440 to dissipate heat from the upper surface of the first chip 430.

[0081] The thermally conductive adhesive layer 900 has a high thermal conductivity, increases the heat transfer area, and reduces the contact thermal resistance between the chip and the first cooling portion 441, thereby improving the heat transfer efficiency between the chip and the first cooling portion 441. Furthermore, the lower surface of the first cooling portion 441 is connected to the upper surface of the chip. The thermally conductive adhesive layer 900 also secures the first cooling portion 441 to the chip, preventing misalignment of the first cooling portion 441 and forming a compact and stable heat transfer structure. The thermally conductive adhesive layer 900 is typically composed of a composite of a highly thermally conductive filler (such as a metal oxide, carbon nanomaterial, or metal powder) and a polymer matrix, resulting in significantly higher thermal conductivity than conventional adhesives.

[0082] For a chip flip-mounted on the substrate 400, in order to increase the contact area between the first cooling portion 441 and the back surface of the chip, the first cooling portion 441 is directly connected to the upper surface of the chip. Figure 5 As shown, the fourth chip 530 is flip-chip mounted on the upper surface of the substrate 400. To increase the contact area between the first cooling portion 441 and the back of the fourth chip 530, the lower surface of the first cooling portion 441 directly contacts the back of the fourth chip 530. Heat from the upper surface of the fourth chip 530 is directly transferred to the lower surface of the first cooling portion 441, where it then exchanges heat with the coolant in the liquid cooling circuit 440, thereby dissipating heat from the upper surface of the fourth chip 530.

[0083] In some specific embodiments, for a chip flip-mounted on the substrate 400, the first cooling portion 441 may also be connected to the upper surface of the chip via a thermally conductive adhesive layer to form a compact and stable heat conduction structure. Figure 6 As shown, the sixth chip 631 is flip-chip mounted on the upper surface of the substrate 400, and its upper surface (i.e., the back side of the sixth chip 361) is connected to the first cooling part 441 through a thermally conductive adhesive layer 930. The first cooling part 441 and the sixth chip 631 are fixed by the thermally conductive adhesive layer 930 to avoid misalignment of the first cooling part 441, thereby forming a tight and stable heat conduction structure and taking into account heat transfer.

[0084] In one embodiment, the first cooling portion 441 has one or more bending regions, the bottom surface of each bending region being connected to the top surface of the chip. The number of bending regions can be set based on the number of chips within the cavity packaging structure and the area of ​​the top surface of the chip available for heat dissipation, thereby improving heat conduction efficiency.

[0085] Specifically, if the number of the chips in the cavity packaging structure is multiple, such as Figure 4As shown, the cavity packaging structure includes three chips, namely a first chip 430, a second chip 431, and a third chip 432. Therefore, at least three bending regions need to be provided to connect to different chips respectively. If the area of ​​the first chip 430 that can be used for heat dissipation is relatively small, only one bending region can be provided to connect to the upper surface of the first chip 430. If the area of ​​the upper surface of the second chip 431 and the upper surface of the third chip 432 that can be used for heat dissipation is relatively large, multiple bending regions can be provided to connect to the upper surfaces of the second chip 431 and the upper surfaces of the third chip 432.

[0086] If the number of the chips in the cavity packaging structure is one, Figure 5 As shown, the cavity packaging structure includes a chip, namely the fourth chip 530, and the area of ​​the upper surface of the fourth chip 530 that can be used for heat dissipation is large, so multiple bending areas can be set to connect with the fourth chip 530 to improve heat conduction efficiency.

[0087] When the first cooling portion 441 has multiple bending regions, the distances between the lower surfaces of the bending regions and the upper surface of the substrate 400 are the same or different to accommodate chips of different heights or types. Figure 4 As shown, the cavity packaging structure includes three chips, wherein the first chip 430 and the third chip 432 are at a smaller distance from the substrate 400, and the second chip 431 is at a larger distance from the substrate 400. Then, the distance between the bending area corresponding to the first chip 430 and the third chip 432 and the substrate 400 is smaller than the distance between the bending area corresponding to the second chip 431 and the substrate 400, so as to adapt to chips of different heights.

[0088] When the same chip is connected to multiple bending regions, the distances between the lower surfaces of the multiple bending regions and the upper surface of the substrate 400 are the same. Figure 5 As shown, the fourth chip 530 is connected to multiple bending areas, the back of the fourth chip 530 is flat, and the distance between each area and the substrate 400 is the same, then the distance between the lower surface of the multiple bending areas and the upper surface of the substrate 400 is the same, so as to adapt to the fourth chip 530 and improve the heat conduction efficiency.

[0089] In some specific embodiments, another portion of the liquid cooling pipe is also bent toward the substrate to serve as a second cooling portion, and the lower surface of the second cooling portion is connected to the upper surface of the substrate. Figure 7As shown, it is a schematic diagram of the fourth specific embodiment of the cavity packaging structure of the present invention. In the fourth specific embodiment, the gap between the first chip 430 and the second chip 431 is large, and another part of the liquid cooling pipeline 440 is also bent toward the substrate 400 to serve as a second cooling part 442. At the gap between the first chip 430 and the second chip 431, the lower surface of the second cooling part 442 is connected to the upper surface of the substrate 400. The heat of the lower surface of the chip is conducted to the substrate, and then conducted to the second cooling part 442 through the substrate 400, and then heat exchanged with the coolant located in the liquid cooling pipeline 440 to achieve heat dissipation of the lower surface of the chip.

[0090] The second cooling portion 442 may be connected to the upper surface of the substrate 400 via a thermally conductive adhesive layer, or may be in direct contact with the upper surface of the substrate 400 .

[0091] As an example, Figure 7 As shown, a thermally conductive adhesive layer 910 is provided on the upper surface of the substrate 400, and the lower surface of the second cooling portion 442 is embedded in the thermally conductive adhesive layer 910. The second cooling portion 442 is connected to the upper surface of the substrate 400 through the thermally conductive adhesive layer 910 to prevent the second cooling portion 442 from contacting the substrate 400 and affecting the functional areas on the surface of the substrate 400. Heat from the lower surface of the chip is transferred to the substrate 400, then through the substrate 400 to the thermally conductive adhesive layer 910, and then through the thermally conductive adhesive layer 910 to the second cooling portion 442. Heat is then exchanged with the coolant in the liquid cooling pipe 440 to dissipate heat from the lower surface of the chip. The thermally conductive adhesive layer 910 can increase the heat conduction area and reduce the contact thermal resistance between the substrate 400 and the second cooling part 442, thereby improving the heat conduction efficiency between the substrate 400 and the second cooling part 442; and the lower surface of the second cooling part 442 is connected to the upper surface of the substrate 400, and the second cooling part 442 can also be fixed to the substrate 400 through the thermally conductive adhesive layer 910, thereby avoiding misalignment of the second cooling part 442 and forming a tight and stable heat conduction structure.

[0092] As an example, Figure 8 As shown, it is a schematic diagram of the fifth specific embodiment of the cavity packaging structure of the present invention. In the fifth specific embodiment, the lower surface of the second cooling part 442 is in direct contact with the upper surface of the substrate 400, and the heat on the upper surface of the substrate 400 is directly conducted to the lower surface of the second cooling part 442, and then heat is exchanged with the coolant located in the liquid cooling pipeline 440, thereby realizing heat dissipation of the lower surface of the chip.

[0093] In some specific embodiments, the second cooling portion has one or more bending regions, and the lower surface of each bending region is connected to the upper surface of the substrate. The number of bending regions can be set according to the size of the upper surface area of ​​the substrate 400 to improve the heat conduction efficiency. As an example, Figure 7 As shown, the second cooling portion 442 has a bending area; Figure 8 As shown, the second cooling portion 442 has a plurality of bending regions, and the plurality of bending regions are all connected to the upper surface of the substrate 400 .

[0094] In some specific embodiments, another portion of the liquid cooling pipe 440 is also bent toward the substrate 400 to serve as a third cooling portion 443. The third cooling portion 443 is suspended above the substrate 400 to increase the cooling liquid pipe length within the limited volume of the cavity 420, thereby increasing the residence time of the cooling liquid inside the cavity 420, thereby taking away more heat generated by the chip per unit time and improving the heat dissipation performance. As an example, Figure 4 As shown, in the area outside the first cooling portion 441 and the second cooling portion 442, another portion of the liquid cooling pipe 440 bends toward the substrate 400 to serve as a third cooling portion 443. The third cooling portion 443 is suspended above the substrate 400 and serves as a heat conduction structure for the cavity 420. Heat from the cavity 420 can be transferred to the lower surface of the third cooling portion 443, where it then exchanges heat with the coolant in the liquid cooling pipe 440, thereby dissipating heat from the upper surface of the substrate 400.

[0095] In a specific embodiment, in order to prevent the liquid cooling pipe 440 from contacting the structure in the cavity 420 and affecting its performance, the third cooling portion 443 does not contact the structure in the cavity 420. Figure 4 As shown, the third cooling portion 443 is suspended above the lead 433 of the first chip 430 to avoid the lead 433 , thereby preventing the third cooling portion 443 from affecting the performance of the lead 433 .

[0096] If the volume of the cavity 420 is relatively small, the liquid cooling pipe 440 may only form the first cooling portion 441. If the volume of the cavity 420 is relatively large, the second cooling portion 442 or the third cooling portion 443 may be formed. Figure 9 As shown, it is a schematic diagram of the sixth specific embodiment of the cavity packaging structure of the present invention. In this specific embodiment, the liquid cooling pipeline 440 is bent toward the substrate 400 only above the fifth chip 530, and these bent areas constitute the first cooling part 441.

[0097] In some specific embodiments, the liquid cooling pipe 440 has alternating regions that bend toward the substrate 400 and regions that bend toward the upper cover 410. Specifically, the liquid cooling pipe 440 has a serpentine configuration to increase its length within the limited volume of the cavity 420. Compared to a straight pipe, the coolant in the liquid cooling pipe 440 of the present invention has a longer pipe path within the same volume of the cavity 420, resulting in a longer residence time within the cavity 420 and a prolonged heat exchange time. This allows the coolant to remove more heat generated by the chip per unit time, thereby improving heat dissipation performance.

[0098] In some embodiments, Figure 4 As shown, at least a portion of the area where the liquid cooling pipe 440 bends toward the upper cover 410 is in contact with the inner top surface of the upper cover 410, so that the heat of the liquid cooling pipe 440 can be conducted to the upper cover 410, and then dissipated through the upper cover 410, further improving the heat dissipation performance of the cavity packaging structure. Figure 4 shown.

[0099] Figure 10 This is a schematic diagram of the seventh specific embodiment of the cavity packaging structure of the present invention, please refer to Figure 10 In this specific embodiment, at least a portion of the area where the liquid cooling pipe 440 bends toward the upper cover 410 is secured to the inner top surface of the upper cover 410 via a thermally conductive adhesive layer 920. The thermally conductive adhesive layer 920 has a high thermal conductivity and can increase the heat conduction area between the liquid cooling pipe 440 and the upper cover 410, thereby reducing the contact thermal resistance between the liquid cooling pipe 440 and the upper cover 410 and improving the heat conduction efficiency between the liquid cooling pipe 440 and the upper cover 410. Furthermore, the liquid cooling pipe 440 is secured to the inner top surface of the upper cover 410 via the thermally conductive adhesive layer 920, preventing displacement of the liquid cooling pipe 440 and forming a compact and stable heat conduction structure.

[0100] In some specific embodiments, the liquid cooling line 440 includes a liquid inlet end 444 and a liquid outlet end 445 . The liquid inlet end 444 passes through the top or side wall of the cavity 420 , and the liquid outlet end 445 passes through the top or side wall of the cavity 420 .

[0101] As an example, Figure 4As shown, the liquid inlet end 444 penetrates the side wall of the cavity 420, and the liquid outlet end 445 penetrates the side wall of the cavity 420. Specifically, the substrate 400 includes a base 401, a second annular housing 403 disposed on the edge of the upper surface of the base 401, a first annular housing 402 disposed on the upper surface of the second annular housing 403, and an upper cover 410 disposed on the upper surface of the first annular housing 402. The side wall of the cavity 420 is formed by the second annular housing 403, the first annular housing 402, and the upper cover 410. The liquid inlet end 444 and the liquid outlet end 445 of the liquid cooling pipeline 440 are arranged on the upper surface of the first annular shell 402, and the upper cover 410 is buckled on the upper surface of the first annular shell 402 and the liquid inlet end 444 and the liquid outlet end 445 of the liquid cooling pipeline 440, that is, the liquid inlet end 444 passes through the side wall of the cavity 420, and the liquid outlet end 445 passes through the side wall of the cavity 420.

[0102] As an example, Figure 11 , which is a schematic diagram of an eighth embodiment of the cavity packaging structure of the present invention. In this embodiment, the liquid inlet port 444 passes through the top of the cavity 420, and the liquid outlet port 445 passes through the top of the cavity 420. Specifically, the upper cover 410 has a through hole, the liquid inlet port 444 passes through the top of the upper cover 410, and the liquid outlet port 445 passes through the top of the upper cover 410. In other embodiments, one of the liquid inlet port 444 and the liquid outlet port 445 passes through the top of the upper cover 410, and the other passes through the side wall of the upper cover 410.

[0103] In some specific embodiments, the liquid inlet port 444 and the liquid outlet port 445 are fixed to the sidewall of the cavity 420 via an adhesive layer to increase structural stability.

[0104] The cavity packaging structure of the present invention improves the heat dissipation performance of the cavity packaging structure through the provision of the liquid cooling pipeline.

[0105] Based on the same inventive concept, the present invention also provides a method for manufacturing the aforementioned cavity packaging structure. Figure 12As shown, it is a schematic diagram of the steps of the first specific embodiment of the manufacturing method of the cavity packaging structure of the present invention, and the manufacturing method includes: step S100, providing a substrate; step S110, arranging a chip on the upper surface of the substrate; step S120, setting a liquid cooling pipeline, the liquid cooling pipeline is used to pass cooling liquid, and a part of the liquid cooling pipeline is bent toward the substrate to serve as a first cooling part, and the lower surface of the first cooling part is connected to the upper surface of the chip; step S130, setting an upper cover, the upper cover is arranged on the upper surface of the substrate, and forms a sealed cavity with the substrate, and the chip and the liquid cooling pipeline are located in the cavity.

[0106] In a method for manufacturing a cavity packaging structure provided by a specific embodiment of the present invention, a portion of the liquid cooling pipe is bent toward the substrate to serve as a first cooling portion. The lower surface of the first cooling portion is connected to the upper surface of the chip, allowing heat from the upper surface of the chip to be transferred to the first cooling portion, thereby dissipating heat through the flow of coolant within the liquid cooling pipe. The liquid cooling pipe is not a straight pipe, but rather a curved pipe. This increases the length of the coolant within the pipe, prolongs the coolant's residence time within the cavity, and extends the heat exchange time. This allows more heat generated by the chip to be removed per unit time, significantly improving the heat dissipation performance of the cavity packaging structure.

[0107] Figures 13 to 17 It is a process flow chart of a first specific embodiment of the method for manufacturing a cavity packaging structure of the present invention.

[0108] See also Figure 12 、 Figure 13 and Figure 14 , step S100, providing a substrate 10.

[0109] In one embodiment, the step of providing the substrate 10 further includes:

[0110] See also Figure 13 , providing a base 11. In this embodiment, the base 11 is a flange base. The flange base is used to support the chip and form a sealed cavity 21 between the flange base and the upper cover 20. On the other hand, the flange base is also used for heat dissipation of the chip.

[0111] See also Figure 14 A first annular shell 12 is provided on the upper surface of the base 11 .

[0112] In a specific embodiment, before the step of setting the first annular shell 12 on the upper surface of the base 11, the step also includes: setting a second annular shell 13 on the upper surface of the base 11, and setting a pin 14 on the upper surface of the second annular shell 13, the first annular shell 12 is set on the upper surface of the second annular shell 13 and the upper surface of the pin 14, and a partial area of ​​the pin 14 is located within the range surrounded by the first annular shell 12.

[0113] In one embodiment, the step of disposing the second annular housing 13 on the upper surface of the substrate 11 further includes: fixing the second annular housing 13 to the upper surface of the substrate 11 via an adhesive layer. The first annular housing 12 and the second annular housing 13 may both be ceramic rings. The pins 14 may be fixed to the upper surface of the second annular housing 13. The first annular housing 12 may be fixed to the upper surfaces of the second annular housing 13 and the pins 14 via an adhesive layer.

[0114] In other specific embodiments, the first annular housing 12 may be directly disposed on the substrate, such as Figure 5 shown.

[0115] At this point, the substrate 10 is formed.

[0116] See also Figure 12 and Figure 15 In step S110, a chip is placed on the upper surface of the substrate 10. In this step, one or more chips may be placed on the substrate 10, and the chips may be placed face-up or flip-chip on the base 11.

[0117] Specifically, a chip is provided on the upper surface of the substrate 11. Figure 15 As shown in the figure, in this embodiment, three chips are arranged on the substrate 11, namely a first chip 30, a second chip 31 and a third chip 32. The first chip 30, the second chip 31 and the third chip 32 are all arranged upright on the substrate 11 and are connected to the pins 14 through leads 33, or the chips are interconnected. In other embodiments, the chips are arranged flip-chip on the substrate and are electrically connected to the substrate through conductive bumps, such as Figure 5 In some further embodiments, a portion of the chips are flip-chip mounted on the upper surface of the substrate, and another portion of the chips are mounted face-up on the upper surface of the substrate, as shown. Figure 6 shown.

[0118] See also Figure 12 and Figure 16In step S120, a liquid cooling pipe 40 is provided, wherein the liquid cooling pipe 40 is used to pass cooling liquid, and a portion of the liquid cooling pipe 40 is bent toward the substrate 10 to serve as a first cooling portion 41, and the lower surface of the first cooling portion 41 is connected to the upper surface of the chip.

[0119] In some specific embodiments, the first cooling unit 41 is connected to the upper surface of the chip via a thermally conductive adhesive layer 90. Prior to installing the liquid cooling line 40, the method includes: installing a thermally conductive adhesive layer on the upper surface of the chip. During the installation of the liquid cooling line 40, the lower surface of the first cooling unit 41 is embedded in the thermally conductive adhesive layer. After installing the liquid cooling line 40, the thermally conductive adhesive layer 90 may be cured. In other specific embodiments, the thermally conductive adhesive layer may also be cured after installing the upper cover 20.

[0120] In some specific embodiments, the liquid inlet end 44 and the liquid outlet end 45 of the liquid cooling pipe 40 are disposed on the upper surface of the first annular outer shell 12. Before disposing the liquid cooling pipe 40, the step further includes forming an adhesive layer on the upper surface of the first annular outer shell 12. The step further includes embedding the liquid inlet end 44 and the liquid outlet end 45 of the liquid cooling pipe 40 in the adhesive layer. After disposing the liquid cooling pipe 40, the adhesive layer is cured to form an adhesive layer. In other specific embodiments, the thermally conductive adhesive layer may also be cured after disposing the upper cover 20.

[0121] In some specific embodiments, the first cooling portion 41 has one or more bending areas, and the step of setting up the liquid cooling pipeline 40 further includes: the lower surface of each bending area is connected to the upper surface of the chip. The number of the bending areas can be set according to the number of the chips in the cavity packaging structure and the area of ​​the area on the upper surface of the chip that can be used for heat dissipation to improve the heat conduction efficiency. When the first cooling portion 41 has multiple bending areas, the distance between the lower surface of the bending area and the upper surface of the substrate 10 is the same or different to adapt to chips of different heights or different types. When the same chip is connected to multiple bending areas, the distance between the lower surfaces of the multiple bending areas and the upper surface of the substrate 10 is the same to match the same chip.

[0122] In some specific embodiments, another portion of the liquid cooling pipe 40 is also bent toward the substrate 10 to serve as a second cooling portion. Figure 7As shown. The step of providing the liquid cooling pipe 40 further includes: connecting the lower surface of the second cooling portion to the upper surface of the substrate 10. In some specific embodiments, the second cooling portion has one or more bending regions, and the step of providing the liquid cooling pipe 40 further includes: connecting the lower surface of each bending region to the upper surface of the substrate 10.

[0123] In some embodiments, the second cooling unit is connected to the upper surface of the substrate 10 via a thermally conductive adhesive layer. Prior to installing the liquid cooling pipe 40, the method includes: installing a thermally conductive adhesive layer on the upper surface of the substrate 10. The step of installing the liquid cooling pipe 40 further includes: embedding the lower surface of each of the curved regions of the second cooling unit in the thermally conductive adhesive layer. After installing the liquid cooling pipe 40, the adhesive layer is cured to form an adhesive layer. In other embodiments, the thermally conductive adhesive layer may also be cured after installing the upper cover 20.

[0124] In some embodiments, a further portion of the liquid cooling pipe 40 is bent toward the substrate to serve as a third cooling portion 43. The step of providing the liquid cooling pipe 40 further includes suspending the third cooling portion 43 above the substrate 10. In some embodiments, during the step of providing the chip on the upper surface of the substrate 10, the chip is placed upright on the upper surface of the substrate 10 and electrically connected to the substrate 10 via leads. The step of providing the liquid cooling pipe 40 further includes suspending the third cooling portion 43 above the leads.

[0125] See also Figure 12 and Figure 17 In step S130 , an upper cover 20 is provided. The upper cover 20 is provided on the upper surface of the substrate 10 and forms a sealed cavity 21 with the substrate 10 . The chip and the liquid cooling pipeline 40 are located in the cavity 21 .

[0126] The upper cover 20 has a concave configuration and is inverted on the upper surface of the substrate 10. It forms a sealed cavity 21 with the substrate 10. This concave design not only provides ample installation space for the chips and other electronic components, but also enhances the mechanical stability and sealing of the overall structure through the close fit between the side walls of the upper cover 20 and the substrate 10.

[0127] In one specific embodiment, the upper cover 20 is fastened to the upper surface of the first annular housing 12 and the liquid inlet end 44 and liquid outlet end 45 of the liquid cooling pipe 40 to form a sealed cavity 21. The upper cover 20 is secured to the upper surface of the first annular housing 12 via an adhesive layer. Prior to installing the upper cover 20, the method further includes: forming an adhesive layer on the upper surface of the first annular housing 12, embedding the liquid inlet end 44 and liquid outlet end 45 of the liquid cooling pipe 40 in the adhesive layer, and connecting the upper cover 20 to the first annular housing 12 via the adhesive layer. After installing the upper cover 20, the adhesive layer is cured to form an adhesive layer.

[0128] In some specific embodiments, the liquid cooling pipe 40 has alternatingly arranged areas that bend toward the substrate 10 and areas that bend toward the upper cover 20, and the step of setting the upper cover 20 further includes: forming a thermal conductive adhesive material layer on the inner top surface of the upper cover 20; buckling the upper cover 20 on the base 11, and at least part of the area of ​​the liquid cooling pipe 40 that bends toward the upper cover 20 is buried in the thermal conductive adhesive material layer; and curing the thermal conductive adhesive material layer to form a thermal conductive adhesive layer 90.

[0129] In other specific embodiments, the liquid cooling pipe 40 has alternatingly arranged areas bent toward the substrate 10 and areas bent toward the upper cover 20, and the step of setting the upper cover 20 further includes: at least a portion of the area of ​​the liquid cooling pipe 40 bent toward the upper cover 20 is in contact with the inner top surface of the upper cover 20.

[0130] In some specific embodiments, after the step of setting the upper cover 20, the thermal conductive adhesive material layer on the upper surface of the chip and the upper surface of the substrate 10, and the adhesive material layer on the upper surface of the first annular shell 12 can be simultaneously cured when the thermal conductive adhesive material layer on the top surface of the upper cover 20 is cured.

[0131] The manufacturing method of the cavity packaging structure of the present invention improves the heat dissipation performance of the cavity packaging structure by disposing the liquid cooling pipeline.

[0132] It should be noted that the terms "including," "having," and their variations, as used in this document, are intended to cover non-exclusive inclusions. Terms such as "first," "second," and the like are used to distinguish similar items and are not necessarily used to describe a specific order or precedence, unless the context clearly indicates otherwise. Such usage should be understood to be interchangeable where appropriate. The term "one or more" may be used to describe a feature, structure, or characteristic in the singular, or in the plural, depending at least in part on the context, to describe a feature, structure, or combination of features. The term "based on" should be understood as not necessarily intended to express an exclusive set of factors, but may alternatively, also depending at least in part on the context, allow for the presence of other factors that are not necessarily explicitly described. Furthermore, the embodiments of the present invention and the features therein may be combined with one another, unless there is a conflict. Furthermore, descriptions of well-known components and technologies have been omitted from the above description to avoid unnecessary confusion regarding the concepts of the present invention. In each of the above embodiments, each embodiment focuses on its differences from the other embodiments, and reference may be made to the same or similar parts between the embodiments.

[0133] The above description is only a preferred embodiment of the present invention. It should be pointed out that ordinary technicians in this technical field can make several improvements and modifications without departing from the principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A cavity packaging structure, characterized in that: include: substrate; An upper cover is provided on the upper surface of the substrate and forms a sealed cavity with the substrate; a chip, located in the cavity and arranged on the upper surface of the substrate; A liquid cooling pipeline is provided in the cavity for introducing cooling liquid. Part of the liquid cooling pipeline is bent toward the substrate to serve as a first cooling part. The lower surface of the first cooling part is connected to the upper surface of the chip.

2. The cavity packaging structure according to claim 1, characterized in that: The first cooling portion has one or more bending areas, and the lower surface of each bending area is connected to the upper surface of the chip.

3. The cavity packaging structure according to claim 2, characterized in that: The lower surface of the bending area is at the same distance from the upper surface of the substrate.

4. The cavity packaging structure according to claim 2, characterized in that: The distances between the lower surface of the bending area and the upper surface of the substrate are different.

5. The cavity packaging structure according to claim 1, wherein: A heat-conducting adhesive layer is provided on the upper surface of the chip, and the lower surface of the first cooling part is buried in the heat-conducting adhesive layer.

6. The cavity packaging structure according to claim 1, characterized in that: Another portion of the liquid cooling pipeline is also bent toward the substrate to serve as a second cooling portion, and a lower surface of the second cooling portion is connected to the upper surface of the substrate.

7. The cavity packaging structure according to claim 6, characterized in that: The second cooling portion has one or more bending areas, and the lower surface of each bending area is connected to the upper surface of the substrate.

8. The cavity packaging structure according to claim 6, wherein: A heat-conducting adhesive layer is provided on the upper surface of the substrate, and the lower surface of the second cooling part is buried in the heat-conducting adhesive layer.

9. The cavity packaging structure according to claim 1, wherein: Another portion of the liquid cooling pipeline is also bent toward the substrate to serve as a third cooling portion, and the third cooling portion is suspended above the substrate.

10. The cavity packaging structure according to claim 9, characterized in that: The chip is electrically connected to the substrate through leads, and the third cooling portion is suspended above the leads.

11. The cavity packaging structure according to claim 1, wherein: The liquid cooling pipeline has alternately arranged areas bent toward the substrate and areas bent toward the upper cover.

12. The cavity packaging structure according to claim 11, characterized in that: At least a portion of the liquid cooling pipeline in the area bent toward the upper cover is in contact with the inner top surface of the upper cover.

13. The cavity packaging structure according to claim 11, wherein: At least a portion of the liquid cooling pipeline in the area bent toward the upper cover is fixed to the inner top surface of the upper cover through a thermally conductive adhesive layer.

14. The cavity packaging structure according to claim 1, wherein: The liquid cooling pipeline includes a liquid inlet end and a liquid outlet end. The liquid inlet end passes through the top or side wall of the cavity, and the liquid outlet end passes through the top or side wall of the cavity.

15. The cavity packaging structure according to claim 14, characterized in that: The liquid inlet and the liquid outlet are both fixed on the top or side wall of the cavity through an adhesive layer.

16. The cavity packaging structure according to claim 1, wherein: The substrate includes a base and a first annular shell arranged on the upper surface of the base, the liquid inlet end and the liquid outlet end of the liquid cooling pipeline are arranged on the upper surface of the first annular shell, and the upper cover is buckled on the upper surface of the first annular shell and the liquid inlet end and the liquid outlet end of the liquid cooling pipeline to form the cavity.

17. The cavity packaging structure according to claim 16, characterized in that: The liquid inlet end and the liquid outlet end are both fixed to the upper surface of the first annular shell and the upper cover through an adhesive layer.

18. The cavity packaging structure according to claim 16, wherein: The base is a flange base, and the substrate also includes a second annular shell arranged on the edge of the upper surface of the flange base, the pins are arranged on the upper surface of the second annular shell, the first annular shell is arranged on the upper surface of the second annular shell and the upper surface of the pins, and a partial area of ​​the pins is located in the cavity, and the chip is electrically connected to the pins through leads.

19. The cavity packaging structure according to claim 18, wherein: The first annular shell is fixed to the upper surface of the second annular shell and the upper surface of the pin through an adhesive layer.

20. The cavity packaging structure according to claim 1, wherein: The chip is flip-chip or face-down mounted on the upper surface of the substrate.

21. A method for manufacturing a cavity packaging structure, characterized in that: include: providing a substrate; Arranging a chip on the upper surface of the substrate; A liquid cooling pipeline is provided, wherein the liquid cooling pipeline is used to pass a cooling liquid, and a portion of the liquid cooling pipeline is bent toward the substrate to serve as a first cooling portion, wherein a lower surface of the first cooling portion is connected to an upper surface of the chip; An upper cover is provided, wherein the upper cover is provided on the upper surface of the substrate and forms a sealed cavity with the substrate. The chip and the liquid cooling pipeline are located in the cavity.

22. The method for manufacturing a cavity packaging structure according to claim 21, wherein: The step of providing a substrate further comprises: providing a substrate; A first annular shell is provided on the upper surface of the base; The step of providing a liquid cooling pipeline further includes: providing a liquid inlet end and a liquid outlet end of the liquid cooling pipeline on the upper surface of the first annular housing; The step of setting the upper cover further includes: buckling the upper cover on the upper surface of the first annular shell and the liquid inlet end and the liquid outlet end of the liquid cooling pipeline to form a sealed cavity.

23. The method for manufacturing a cavity packaging structure according to claim 22, wherein: Before the step of setting the liquid cooling pipeline, it also includes: forming an adhesive material layer on the upper surface of the first annular shell; the step of setting the liquid cooling pipeline further includes: the liquid inlet end and the liquid outlet end of the liquid cooling pipeline are buried in the adhesive material layer; after the step of setting the upper cover, the adhesive material layer is solidified to form an adhesive layer.

24. The method for manufacturing a cavity packaging structure according to claim 22, wherein: Before the step of arranging a first annular shell on the upper surface of the base, the step further includes: arranging a second annular shell on the upper surface of the base, and arranging pins on the upper surface of the second annular shell, the first annular shell being arranged on the upper surface of the second annular shell and the upper surface of the pins, and a partial area of ​​the pins being located within the range surrounded by the first annular shell; the step of arranging a chip on the upper surface of the substrate further includes: mounting the chip upright on the upper surface of the base, and electrically connecting the chip to the pins through leads.

25. The method for manufacturing a cavity packaging structure according to claim 24, wherein: The step of arranging a second annular shell on the upper surface of the base further includes: fixing the second annular shell on the upper surface of the base through an adhesive layer.

26. The method for manufacturing a cavity packaging structure according to claim 21, wherein: The first cooling portion has one or more bending areas, and the step of providing a liquid cooling pipeline further includes: the lower surface of each bending area is connected to the upper surface of the chip.

27. The method for manufacturing a cavity packaging structure according to claim 21, wherein: Before the step of setting up the liquid cooling pipeline, it also includes: setting a thermal conductive adhesive material layer on the upper surface of the chip; the step of setting up the liquid cooling pipeline further includes: the lower surface of the first cooling part of the liquid cooling pipeline is buried in the thermal conductive adhesive material layer; and curing the thermal conductive adhesive material layer to form a thermal conductive adhesive layer.

28. The method for manufacturing a cavity packaging structure according to claim 21, wherein: Another part of the liquid cooling pipeline is also bent toward the substrate to serve as a second cooling portion. The step of providing the liquid cooling pipeline further includes: a lower surface of the second cooling portion is connected to an upper surface of the substrate.

29. The method for manufacturing a cavity packaging structure according to claim 28, wherein: The second cooling portion has one or more bending areas, and the step of providing a liquid cooling pipeline further includes: the lower surface of each bending area is connected to the upper surface of the substrate.

30. The method for manufacturing a cavity packaging structure according to claim 28, wherein: Before the step of setting up the liquid cooling pipeline, it also includes: setting a thermal conductive adhesive material layer on the upper surface of the substrate; the step of setting up the liquid cooling pipeline further includes: the lower surface of each of the bending areas of the second cooling part is buried in the thermal conductive adhesive material layer; and curing the thermal conductive adhesive material layer to form a thermal conductive adhesive layer.

31. The method for manufacturing a cavity packaging structure according to claim 21, wherein: Another portion of the liquid cooling pipeline is also bent toward the substrate to serve as a third cooling portion. The step of providing the liquid cooling pipeline further includes: the third cooling portion is suspended above the substrate.

32. The method for manufacturing a cavity packaging structure according to claim 31, wherein: In the step of arranging a chip on the upper surface of the substrate, the chip is arranged upright on the upper surface of the substrate and electrically connected to the substrate through leads; the step of arranging a liquid cooling pipeline further includes: the third cooling part is suspended above the leads.

33. The method for manufacturing a cavity packaging structure according to claim 21, wherein: The liquid cooling pipeline has alternatingly arranged areas bent toward the substrate and areas bent toward the upper cover, and the step of setting the upper cover further includes: at least a portion of the areas of the liquid cooling pipeline bent toward the upper cover is in contact with the inner top surface of the upper cover.

34. The method for manufacturing a cavity packaging structure according to claim 21, wherein: The liquid cooling pipeline has alternatingly arranged areas that bend toward the substrate and areas that bend toward the upper cover. The step of setting the upper cover further includes: forming a thermally conductive adhesive material layer on the inner top surface of the upper cover; buckling the upper cover on the base, and burying at least part of the area of ​​the liquid cooling pipeline that bends toward the upper cover in the thermally conductive adhesive material layer; and curing the thermally conductive adhesive material layer to form a thermally conductive adhesive layer.

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