Modular SoC carrier architecture

Abstract

The invention discloses a modular SoC (System on Chip) carrier board architecture. The modularized SoC support plate framework comprises a support plate and a plurality of SoC calculation modules, a bottom plate is detachably arranged on the carrier plate, and the bottom plate is used for being electrically connected with an upper-layer system; the SoC calculation modules are arranged on the bottom plate, and each SoC calculation module comprises a calculation unit and a storage unit; wherein the bottom plate is provided with different plugging interfaces corresponding to the computing unit and the storage unit, so that both the computing unit and the storage unit are detachably connected with the bottom plate, and the computing unit in each SoC computing module accesses the storage unit through the bottom plate. According to the technical scheme, the computing unit and the storage unit are detachably connected with the bottom plate, so that when the computing unit or the storage unit breaks down or needs to be upgraded, the computing unit or the storage unit can be independently replaced, the maintenance efficiency and flexibility of the system are improved, and the maintenance cost is further reduced.

Description

Technical Field

[0001] The present application relates to the technical field of SoC array servers, and in particular to a modular SoC carrier board architecture. Background Art

[0002] With the rapid development of technologies such as cloud computing, big data, and artificial intelligence, data centers are placing higher demands on server computing performance, storage capacity, and operational efficiency. Traditional SoC (System-on-Chip) array server architectures integrate computing units (SoCs) and storage units (such as SSDs) directly on the motherboard, creating a tightly coupled hardware structure. This architecture was widely used in early designs due to its advantages, such as high integration and low signal transmission latency. However, its inherent flaws have gradually become a key bottleneck restricting data center performance improvements. For example, in traditional architectures, the SoC and storage units are rigidly connected to the motherboard via soldering or fixed interfaces. When an SoC fails due to a fault, the entire motherboard must be replaced because the faulty component cannot be replaced individually. Furthermore, the update cycles of SoC and storage technologies are out of sync. The tightly coupled architecture forces enterprises to upgrade both components simultaneously, increasing costs.

[0003] In the prior art, for example, a patent application with application number “202410117274.2” proposes a SoC array server chassis, which includes multiple computing node modules arranged in an array, and connects to the upper system (such as a backplane) through multiple computing node modules to achieve higher computing density. However, its purpose is that the more computing node modules are set, the more dispersed the computing units can be. In this way, when a SoC computing unit fails and needs to be replaced, only the corresponding computing node module needs to be replaced without affecting the normal operation of other modules. The fewer computing units that need to be interrupted, the less workload is required for business migration in advance, and the smaller the granularity of SoC computing module fault maintenance. However, this solution still does not solve the problem of individual maintenance of the SoC computing unit on the computing node module, and the module still needs to be replaced as a whole; and it does not involve the problem of optimizing the coupling relationship between the computing unit and the storage unit. How to upgrade computing power or storage capacity still faces challenges. Summary of the Invention

[0004] The present application provides a modular SoC carrier board architecture, which aims to solve the problem in the prior art that the setting relationship between computing units and storage units cannot adapt to the needs of technological development.

[0005] To achieve the above objectives, the present application proposes a modular SoC carrier board architecture. The modular SoC carrier board architecture includes:

[0006] A carrier board, on which a bottom plate is detachably provided, and the bottom plate is used to be electrically connected to the upper system;

[0007] There are multiple SoC computing modules and they are arranged on the baseboard. Each SoC computing module includes a computing unit and a storage unit.

[0008] Among them, different plug-in interfaces are provided on the base plate corresponding to the computing unit and the storage unit, so that the computing unit and the storage unit are both detachably connected to the base plate, and the computing unit in each SoC computing module accesses the storage unit through the base plate.

[0009] In some embodiments, a PCle interface is provided on the baseboard corresponding to the computing unit, and an M.2 interface is provided on the baseboard corresponding to the storage unit.

[0010] In some embodiments, the base plate is a double-sided circuit board, and the SoC computing modules are disposed on two opposite sides of the base plate.

[0011] In some embodiments, the computing unit is a SoC computing core board, and the storage unit includes an SSD and an HDD.

[0012] In some embodiments, each of the SoC computing modules further includes a heat sink, which is attached to the computing unit and includes a plurality of heat sinks arranged at intervals.

[0013] In some embodiments, the carrier includes a pull-out head and side panels extending oppositely from each other on both sides of the pull-out head, the bottom plate is disposed between the two side panels, and the SoC computing modules on the bottom plate are arranged at intervals along the extension direction of the side panels;

[0014] Wherein, a plug connector is provided on a side of the bottom plate away from the pull-out head, and the plug connector corresponds to the PCle interface in the upper system.

[0015] In some embodiments, ventilation holes are provided at the end of the pulling head, and the gaps between the plurality of heat sinks form an air duct, and the extension direction of the air duct corresponds to the arrangement of the ventilation holes.

[0016] In some embodiments, the base plate is relatively disposed in the middle of the carrier plate so that the installed SoC computing module does not exceed the overall thickness range of the carrier plate.

[0017] In some embodiments, the two oppositely arranged side panels extend relative to each other to form a support plate, a positioning column and a first locking hole are provided on the support plate, and a positioning hole corresponding to the positioning column and a second locking hole corresponding to the first locking hole are provided on the bottom plate.

[0018] In some embodiments, the carrier board is used to connect to a server chassis; wherein a pull-out structure for performing a pull-out connection with the server chassis is provided on the carrier board.

[0019] The technical solution of the present application proposes a modular SoC carrier board architecture. The modular SoC carrier board architecture includes a carrier board and multiple SoC computing modules; a baseboard is detachably provided on the carrier board, and the baseboard is used to be electrically connected to the upper system; the SoC computing modules are arranged on the baseboard, and each SoC computing module includes a computing unit and a storage unit; wherein, different plug-in interfaces are provided on the baseboard corresponding to the computing unit and the storage unit, so that the computing unit and the storage unit are both detachably connected to the baseboard, and the computing unit in each SoC computing module can access the storage unit through the baseboard. The technical solution of the present application, because the computing unit and the storage unit are both detachably connected to the baseboard, further, when the computing unit or the storage unit fails or needs to be upgraded, they can be replaced separately, thereby improving the maintenance efficiency and flexibility of the system and further reducing maintenance costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. Those skilled in the art can also derive other drawings based on these drawings without inventive work, among which:

[0021] Figure 1 This is a schematic diagram of the decomposed structure of a modular SoC carrier board architecture according to an embodiment of the present application;

[0022] Figure 2 This is a schematic diagram of the assembly structure of a modular SoC carrier board architecture according to an embodiment of the present application. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0024] It should be noted that, unless otherwise specified or limited, all directional indications in the embodiments of the present application (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0025] It should also be noted that, unless otherwise specified or limited, when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or there may be an intermediate element. When an element is referred to as being “connected to” another element, it may be directly connected to the other element or there may be an intermediate element.

[0026] In addition, unless otherwise specified or limited, the descriptions of "first", "second", etc. in this application are for descriptive purposes only and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of such features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the fact that they can be implemented by ordinary technicians in this field. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0027] See Figure 1 and Figure 2 As shown, the present application proposes a modular SoC carrier board architecture 100. The modular SoC carrier board architecture 100 includes a carrier board 10 and multiple SoC computing modules 20. A base plate 30 is detachably provided on the carrier board 10, and the base plate 30 is used to electrically connect to the upper system; the SoC computing modules 20 are provided on the base plate 30, and each SoC computing module 20 includes a computing unit (not shown in the drawings) and a storage unit (not shown in the drawings); wherein, different plug-in interfaces 310 are provided on the base plate 30 corresponding to the computing unit and the storage unit, so that both the computing unit and the storage unit are detachably connected to the base plate 30, and the computing unit in each SoC computing module 20 accesses the storage unit through the base plate 30.

[0028] In the technical solution of the present application, the carrier board 10 serves as the basic support platform of the entire architecture, on which a base plate 30 is detachably provided, which facilitates the replacement and upgrading of the base plate 30. The base plate 30 serves as the installation platform for the SoC computing module 20, and provides an electrical connection interface with the computing unit and the storage unit. Furthermore, different plug-in interfaces 310 are provided on the base plate 30 corresponding to the computing unit and the storage unit to realize independent and detachable connection of the computing unit and the storage unit. Among them, each SoC computing module 20 includes a computing unit and a storage unit, the computing unit is responsible for data processing, and the storage unit is responsible for data storage. Each SoC computing module 20 can be independently installed on the base plate 30, and communicate with the upper system through the base plate 30.

[0029] In summary, the technical solution of the present application realizes the rapid replacement of faulty modules and reduces maintenance costs and time by designing the computing unit and storage unit as independent detachable modules; and users can flexibly add or remove the SoC computing module 20 according to actual needs to expand computing power or storage capacity.

[0030] Furthermore, the computing units and storage units in the SoC computing module 20 of the present invention are designed to correspond one to one (i.e., each computing unit is equipped with a dedicated storage unit), allowing the computing unit to directly access the storage unit to which it is bound, thus avoiding contention and latency for cross-module or shared storage. Furthermore, the binding relationship between each computing unit and the storage unit enables multiple modules to execute tasks in parallel without interfering with each other, thus avoiding bandwidth contention.

[0031] In some embodiments, a PCle interface is provided on the baseboard 30 corresponding to the computing unit, and an M.2 interface is provided on the baseboard 30 corresponding to the storage unit.

[0032] It is understandable that PCIe (Peripheral Component Interconnect Express) is a high-speed serial computer expansion bus standard that provides extremely high data transfer rates and low latency, and is suitable for connecting high-performance computing units. Through the PCIe interface, the computing unit can achieve high-speed data transmission with the baseboard 30 and other modules to meet the needs of high-performance computing. M.2 is a new generation interface standard tailored for Ultrabooks. It is compact and supports multiple protocols (such as SATA, PCIe, NVMe, etc.), and can connect to various high-performance storage devices such as SSDs (solid-state drives). The M.2 interface not only provides a higher data transfer rate, but also has good scalability and compatibility.

[0033] Furthermore, the provision of PCIe and M.2 interfaces enables high-speed, stable data transmission between the computing unit and the storage unit, thereby improving overall system performance. Furthermore, by providing separate PCIe and M.2 interfaces for the computing unit and storage unit, independent connection and interoperability between the modules are achieved, further enhancing the flexibility of the modular design. Users can flexibly select and configure different computing units and storage units according to actual needs.

[0034] Furthermore, the computing unit is a SoC computing core board, which integrates multiple functions such as CPU, GPU, memory, and I / O interface on a single chip, which can reduce the number of components, reduce power consumption and heat dissipation requirements, and improve the stability and reliability of the system. The storage units that match it include SSD and HDD. Among them, SSD has extremely high read and write speeds, which can significantly improve the response speed and operating efficiency of the system. Although HDD has a larger storage capacity than SSD, it is suitable for storing large amounts of infrequently accessed data. SSD further includes consumer-grade SSD and enterprise-grade SSD. In comparison, consumer-grade SSD has a greater cost advantage than enterprise-grade SSD, and its performance is sufficient to meet the needs of most application scenarios. Therefore, the storage unit in this architecture is preferably a consumer-grade SSD.

[0035] In some embodiments, the base plate 30 is a double-sided circuit board, and the SoC computing modules 20 are disposed on two opposite sides of the base plate 30 .

[0036] In this embodiment, space is effectively utilized by deploying SoC computing modules 20 on both sides of the baseboard 30. For example, a double-sided design can place four SoC computing modules 20 on each side of the baseboard 30, for a total of eight modules on a single baseboard 30. This significantly improves computing density and system performance.

[0037] See Figure 2 As shown, in some embodiments, each SoC computing module 20 further includes a heat sink 21, the heat sink 21 is attached to the computing unit, and the heat sink 21 includes a plurality of heat sinks arranged at intervals.

[0038] As can be appreciated, in the modular SoC carrier architecture 100, each SoC computing module 20 is responsible for executing high-intensity computing tasks, which generates a large amount of heat. If this heat cannot be dissipated promptly, the computing unit temperature will rise, further affecting its performance, stability, and lifespan. Therefore, a heat sink 21 is provided in the SoC computing module 20.

[0039] When setting up the heat sink 21, it needs to fit closely to the computing unit portion to ensure that it can effectively absorb and conduct heat. This can be achieved, for example, through thermal grease, a heat sink pad, or direct metal contact to reduce thermal resistance and improve heat dissipation efficiency. In this embodiment, the heat sink 21 includes a plurality of spaced-apart heat sinks, which increase the heat dissipation area and allow heat to be dissipated to the surrounding environment more quickly.

[0040] In some embodiments, the carrier board 10 is used to connect to a server chassis. Specifically, the carrier board 10 is provided with a pull-out structure that allows for a pull-out connection with the server chassis. This allows the carrier board 10 and the SoC computing module 20 thereon to be easily inserted into and removed from the server chassis, thereby improving the maintainability and scalability of the system. This pull-out structure typically includes one or more guide rails, sliders, or similar mechanical components to guide the carrier board 10 smoothly into and out of the chassis. This is a common structure in the art and will not be described in detail here.

[0041] In a further embodiment, Figure 1 The carrier 10 includes a pull-out head 11 and side panels 12 extending relative to each other on both sides of the pull-out head 11. The pull-out head 11 is usually designed with a shape and texture that is easy to hold so that the user can easily pull out or insert the carrier 10. Similarly, a plug-in switch can be provided on the pull-out head 11 to control the locking and unlocking states of the carrier 10 by the plug-in switch, making it convenient for the carrier 10 to exit or enter the chassis. The side panels 12 not only provide structural support for the carrier 10, but also play a role in protecting the SoC computing module 20. Usually, the side panels 12 and the housing are equipped with pull-out guide rails and sliders to achieve guidance. In addition, a base plate 30 is provided between the two side panels 12. The SoC computing modules 20 on the base plate 30 are arranged at intervals along the extension direction of the side panels 12. A plug connector 311 is provided on the side of the side panel 12 away from the pull-out head 11. The plug connector 311 corresponds to the PCle interface in the upper system. In this way, when the carrier board 10 is inserted into the server chassis, the plug connector 311 will be accurately inserted into the PCle interface, realizing the electrical connection between the carrier board 10 and the upper system, ensuring the stability and high speed of data transmission, and meeting the needs of high-performance computing.

[0042] See Figure 2 As shown, in some embodiments, a ventilation hole 111 is provided at the end of the pulling head 11 , and the gaps between the plurality of heat sinks form an air duct, and the extension direction of the air duct corresponds to the arrangement of the ventilation hole 111 .

[0043] In this embodiment, the ventilation holes 111 are designed to form a smooth airflow path between the ventilation holes 111 and the ventilation mesh on the chassis after the carrier board 10 is installed on the chassis, promoting air circulation. Furthermore, the gaps between the heat sinks form a parallel air duct network, allowing airflow between the ventilation holes 111 and the ventilation mesh to directly enter the core heat dissipation area, thereby achieving more efficient heat dissipation and effectively reducing the operating temperature of the SoC computing module 20.

[0044] See Figure 1As shown, in some embodiments, to accommodate the installation of SoC computing modules 20 on both sides of the base plate 30, the base plate 30 is positioned relatively centrally in the carrier 10, freeing up space for the installation of the SoC computing modules 20 on both sides. Furthermore, after the SoC computing modules 20 are installed on opposite sides of the base plate 30, the SoC computing modules 20 on both sides do not exceed the overall thickness range of the carrier 10. This avoids installation difficulties caused by excessive module thickness, ensures a compact overall structure of the carrier 10, facilitates efficient operation within a limited space, and improves heat dissipation, ensuring stable system operation.

[0045] In the specific installation structure of the base plate 30, two opposing side plates 12 extend relative to each other to form a support plate 121. Positioning posts 123 and first locking holes 122 are provided on the support plate 121. Furthermore, positioning holes 313 corresponding to the positioning posts 123 and second locking holes 312 corresponding to the first locking holes 122 are provided on the base plate 30. Thus, the precise fit between the positioning holes 313 and the locking holes ensures that the carrier plate 10 is securely positioned within the chassis, preventing poor contact due to vibration or movement, and further improving the reliability and service life of the system.

[0046] The above description is only a partial or preferred embodiment of the present application. Neither the text nor the drawings can limit the scope of protection of the present application. Any equivalent structural transformation made by using the contents of the present application specification and drawings under the overall concept of the present application, or direct / indirect application in other related technical fields, is included in the scope of protection of the present application.

Claims

1. A modular SoC carrier board architecture, characterized in that: include: A carrier board, on which a bottom plate is detachably provided, and the bottom plate is used to be electrically connected to the upper system; There are multiple SoC computing modules and they are arranged on the baseboard. Each SoC computing module includes a computing unit and a storage unit. Among them, different plug-in interfaces are provided on the base plate corresponding to the computing unit and the storage unit, so that the computing unit and the storage unit are both detachably connected to the base plate, and the computing unit in each SoC computing module accesses the storage unit through the base plate.

2. The modular SoC carrier board architecture according to claim 1, characterized in that: The base plate is provided with a PCle interface corresponding to the computing unit, and the base plate is provided with an M.2 interface corresponding to the storage unit.

3. The modular SoC carrier board architecture according to claim 2, characterized in that: The base plate is a double-sided circuit board, and the SoC computing modules are arranged on two opposite sides of the base plate.

4. The modular SoC carrier board architecture according to claim 3, characterized in that: The computing unit is a SoC computing core board, and the storage unit includes an SSD and an HDD.

5. The modular SoC carrier board architecture according to any one of claims 1 to 4, characterized in that: Each of the SoC computing modules further includes a radiator, which is attached to the computing unit and includes a plurality of heat sinks arranged at intervals.

6. The modular SoC carrier board architecture according to claim 5, characterized in that: The carrier includes a pull-out head and side panels extending opposite to each other on both sides of the pull-out head, the bottom plate is disposed between the two side panels, and the SoC computing modules on the bottom plate are arranged at intervals along the extension direction of the side panels; Wherein, a plug connector is provided on a side of the bottom plate away from the pull-out head, and the plug connector corresponds to the PCle interface in the upper system.

7. The modular SoC carrier board architecture according to claim 6, characterized in that: The end of the pull-out head is provided with a ventilation hole, and the gaps between the plurality of heat sinks form an air duct, and the extension direction of the air duct corresponds to the arrangement of the ventilation hole.

8. The modular SoC carrier board architecture according to claim 6, wherein: The bottom plate is relatively arranged in the middle of the carrier plate so that the installed SoC computing module does not exceed the overall thickness range of the carrier plate.

9. The modular SoC carrier board architecture according to claim 8, characterized in that: The two oppositely arranged side plates extend relative to each other to form a support plate, on which a positioning column and a first locking hole are provided, and on the bottom plate a positioning hole corresponding to the positioning column and a second locking hole corresponding to the first locking hole.

10. The modular SoC carrier board architecture according to claim 9, characterized in that: The carrier board is used to connect to the server chassis; wherein, a pull-out structure is provided on the carrier board for pull-out connection with the server chassis.

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