Component optimization method for chemical nickel plating solution of ceramic substrate

Abstract

The invention relates to the technical field of material science, and discloses a ceramic substrate chemical nickel plating solution component optimization method, which comprises the following steps: analyzing a target ratio combination of key variables to establish an initial nickel plating solution of a nickel plating solution, and plating a preset ceramic substrate by using the initial nickel plating solution to obtain a ceramic substrate chemical nickel plating solution. Recording the current PH value of the initial nickel plating solution in the plating process; analyzing a PH value adjusting parameter of the initial nickel plating solution, and marking a comprehensive life score of the initial nickel plating solution under the PH value adjusting parameter so as to determine a failure node of the initial nickel plating solution; plating of the initial nickel plating solution on the ceramic substrate is achieved, the nickel-plated ceramic substrate is obtained, the critical load of the nickel-plated ceramic substrate during plating layer stripping is identified so as to determine the binding force of the nickel-plated ceramic substrate, and the conductivity and corrosion resistance of the nickel-plated ceramic substrate are analyzed; and outputting component optimization parameters of the initial nickel plating solution, and performing component optimization of the nickel plating solution based on the component optimization parameters. According to the method, the optimization effect of nickel plating solution components can be improved.

Description

Technical Field

[0001] The invention relates to a method for optimizing the composition of a chemical nickel plating solution for a ceramic substrate, and belongs to the technical field of material science. Background Art

[0002] Chemical nickel plating solution composition optimization refers to the process of improving the quality, performance and production efficiency of the coating by adjusting and improving the various components and their concentration ratios in the chemical nickel plating solution. Through scientific and reasonable optimization, a coating with better quality, better performance, higher production efficiency and more environmental friendliness can be obtained, thereby bringing significant economic and social benefits.

[0003] Traditional optimization of electroless nickel plating solution composition relies primarily on empirical experience and single-factor experiments. This involves varying the concentration of a single component while keeping the other components constant, observing changes in coating performance, and ultimately determining the optimal range for that component. This approach is cumbersome and time-consuming, and it struggles to account for the interactions between multiple factors, resulting in poor optimization results for nickel plating solution composition. Summary of the Invention

[0004] The invention provides a method for optimizing the composition of a chemical nickel plating solution for a ceramic substrate, the main purpose of which is to improve the optimization effect of the composition of the nickel plating solution.

[0005] To achieve the above objectives, the present invention provides a method for optimizing the composition of a chemical nickel plating solution for ceramic substrates, comprising:

[0006] Defining a basic formula for a nickel plating solution, determining key variables of the basic formula, wherein the key variables include nickel salt concentration, reducing agent concentration, complexing agent concentration, and pH value, and establishing orthogonal parameters of the key variables to construct an index curve for the nickel plating solution;

[0007] Analyzing the target ratio combination of the key variables through the index curve to establish an initial nickel plating solution of the nickel plating solution, plating a preset ceramic substrate using the initial nickel plating solution, and recording the current pH value of the initial nickel plating solution during the plating process;

[0008] Analyzing the pH adjustment parameters of the initial nickel plating solution using a preset automatic titration algorithm according to the current pH value, and marking a comprehensive life score of the initial nickel plating solution under the pH adjustment parameters to determine a failure node of the initial nickel plating solution;

[0009] Based on the failure node and the pH value adjustment parameter, plating the ceramic substrate with the initial nickel plating solution to obtain a nickel-plated ceramic substrate, identifying a critical load of the nickel-plated ceramic substrate at which the plating layer peels off to determine the bonding force of the nickel-plated ceramic substrate, and analyzing the conductivity and corrosion resistance of the nickel-plated ceramic substrate;

[0010] Based on the bonding force, the conductivity, and the corrosion resistance, a trained nickel plating solution composition optimization model is used to output composition optimization parameters of the initial nickel plating solution, and composition optimization of the nickel plating solution is performed based on the composition optimization parameters.

[0011] Optionally, constructing an index curve of the nickel plating solution includes:

[0012] Determining orthogonal test data corresponding to orthogonal parameters of the nickel plating solution;

[0013] Defining performance indicators of the nickel plating solution;

[0014] Analyzing the sequence values ​​of the performance indicators according to the orthogonal test data;

[0015] defining a sequence node of the nickel plating solution;

[0016] An index curve of the nickel plating solution is constructed according to the sequence nodes and the sequence values.

[0017] Optionally, analyzing the target ratio combination of the key variables through the indicator curve includes:

[0018] constructing an interaction response surface of the indicator curve;

[0019] Mark the extreme points of the interaction response surface;

[0020] Defining a performance indicator weight of a performance indicator corresponding to the indicator curve;

[0021] Analyzing a multi-objective compromise solution of the performance indicator according to the extreme value points and the performance indicator weights;

[0022] The target ratio combination of the key variables is determined through the multi-objective compromise solution.

[0023] Optionally, analyzing the pH adjustment parameters of the initial nickel plating solution using a preset automatic titration algorithm based on the current pH value includes:

[0024] Calculating a pH error of the initial nickel plating solution during the plating process based on the pH value corresponding to the initial nickel plating solution and the current pH value;

[0025] Analyzing the positive and negative values ​​of the pH error value to determine the pH regulator of the initial nickel plating solution;

[0026] Calculating the titration flow rate of the pH regulator using the automatic titration algorithm according to the pH error value;

[0027] The pH adjustment parameter of the initial nickel plating solution is determined by the pH adjuster and the titration flow rate.

[0028] Optionally, the calculating the titration flow rate of the pH regulator using the automatic titration algorithm according to the pH error value includes:

[0029] Determining gain parameters of the automatic titration algorithm, wherein the gain parameters include proportional gain, integral gain, and differential gain;

[0030] Based on the gain parameter and the pH error value, the titration flow rate of the pH regulator is calculated using the automatic titration algorithm, wherein the automatic titration algorithm:

[0031]

[0032] Where, u(t) represents the titration flow rate of the pH regulator at time t, R p represents the proportional gain, e(t) represents the pH error value at time t, R i Indicates the integral gain, R d represents the differential gain, represents the error accumulation value, represents the error conversion rate, dt represents the time differential, and d represents the differential operator.

[0033] Optionally, the marking of the comprehensive life score of the initial nickel plating solution under the pH adjustment parameter includes:

[0034] Obtaining plating rate data and solution transmittance data of the initial nickel plating solution under the pH value adjustment parameters;

[0035] Calculating the plating rate attenuation rate of the initial nickel plating solution based on the plating rate data;

[0036] Analyzing the transmittance of the initial nickel plating solution based on the solution transmittance data;

[0037] Determining the conversion turbidity of the initial nickel plating solution by the light transmittance;

[0038] Combined with the plating rate attenuation rate and the conversion turbidity, the comprehensive life score of the initial nickel plating solution under the pH value adjustment parameters is analyzed.

[0039] Optionally, analyzing the comprehensive life score of the initial nickel plating solution under the pH adjustment parameters by combining the plating rate attenuation rate and the conversion turbidity includes:

[0040] defining the plating rate attenuation rate and the attenuation rate weight and the conversion turbidity weight of the plating rate attenuation rate;

[0041] marking the failed turbidity and the ideal turbidity of the converted turbidity;

[0042] Based on the plating rate decay rate, the conversion turbidity, the decay rate weight, the conversion turbidity weight, the failure turbidity, and the ideal turbidity, the comprehensive life score of the initial nickel plating solution is calculated using the following formula:

[0043]

[0044] Where S represents the comprehensive life score of the initial nickel plating solution, V represents the plating rate attenuation rate, ω1 represents the attenuation rate weight, D represents the conversion turbidity, and D min Indicates ideal turbidity, D max represents the failure turbidity, and ω2 represents the conversion turbidity weight.

[0045] Optionally, identifying the critical load of the nickel-plated ceramic substrate at which the coating peels off includes:

[0046] Establishing the coating peeling load condition of the nickel-plated ceramic substrate;

[0047] constructing a load-displacement curve under the coating peeling load condition;

[0048] Marking the sudden change point of the load-displacement curve;

[0049] The load at the mutation point is recorded as the critical load of the nickel-plated ceramic substrate when the coating peels off.

[0050] Optionally, analyzing the conductivity and corrosion resistance of the nickel-plated ceramic substrate includes:

[0051] A four-probe tester configured with the nickel-plated ceramic substrate;

[0052] Lightly pressing the surface of the nickel-plated ceramic substrate with four corresponding probes of the four-probe tester vertically to analyze the contact uniformity coefficient between the four probes and the nickel-plated ceramic substrate;

[0053] applying a constant current to the nickel-plated ceramic substrate using the four-probe tester according to the contact uniformity coefficient, and recording the voltage of the nickel-plated ceramic substrate;

[0054] calculating the conductivity of the nickel-plated ceramic substrate based on the constant current and the voltage;

[0055] Identifying a surface condition of a coating of the nickel-plated ceramic substrate;

[0056] Placing the nickel-plated ceramic substrate in a preset salt spray chamber to record the rust area ratio of the nickel-plated ceramic substrate;

[0057] The corrosion resistance of the nickel-plated ceramic substrate is determined based on the rust area ratio.

[0058] Optionally, determining the corrosion resistance of the nickel-plated ceramic substrate based on the rust area ratio includes:

[0059] Determine the corrosion resistance grade of the rusted area ratio;

[0060] identifying a corroded area of ​​the nickel-plated ceramic substrate;

[0061] defining a corrosion weight of the corrosion area;

[0062] Calculating the corrosion coefficient of the nickel-plated ceramic substrate based on the corrosion weight and the corrosion area ratio;

[0063] Based on the corrosion coefficient, the corrosion resistance of the nickel-plated ceramic substrate is determined.

[0064] In order to solve the above problem, the present invention further provides an electronic device, comprising:

[0065] at least one processor; and,

[0066] a memory communicatively connected to the at least one processor; wherein,

[0067] The memory stores instructions that can be executed by the at least one processor, and the instructions are executed by the at least one processor to implement the above-mentioned method for optimizing the composition of chemical nickel plating solution for ceramic substrates.

[0068] In order to solve the above problems, the present invention also provides a computer-readable storage medium, which stores at least one instruction. The at least one instruction is executed by a processor in an electronic device to implement the above-mentioned method for optimizing the composition of chemical nickel plating solution for ceramic substrates.

[0069] Compared with the problems described in the background technology, firstly, by systematically defining the basic formula and determining key variables such as nickel salt, reducing agent, chelating agent concentration and pH value, and then using orthogonal experimental design to construct the index curve, it is possible to efficiently and scientifically explore the influence of various factors on the coating performance. This method avoids the blindness and inefficiency of the traditional trial and error method, greatly shortens the experimental cycle, and at the same time ensures the comprehensiveness and representativeness of the experimental data, laying a solid foundation for subsequent optimization. Secondly, the method introduces the online monitoring and automatic titration algorithm of pH value to achieve precise control of the dynamic changes of the pH value of the plating solution, which not only ensures the stability of the chemical environment of the plating solution during the plating process, thereby improving the uniformity and consistency of the coating quality, but also accurately predicts the failure node of the plating solution by analyzing the relationship between the pH adjustment parameters and the comprehensive life score, which makes the production process more Controllable, effectively avoids the coating defects caused by plating solution aging, improves production efficiency and product qualification rate, more importantly, the method combines the evaluation of coating performance (bonding force, conductivity, corrosion resistance) with advanced machine learning optimization model, through the accurate measurement of actual nickel-plated ceramic substrate performance, not only obtains performance data reflecting real application needs, but also utilizes the trained model to reversely deduce the composition optimization parameters that can further improve performance, this data-driven optimization method, can comprehensively consider multiple performance indicators, find the best balance point between performance and cost, avoid the other performance sacrifices that may be brought about by single indicator optimization, and finally, by executing composition optimization, the overall quality of nickel-plated ceramic substrate can be significantly improved, enhance its application reliability and competitiveness in the fields of electronics, electricity, etc., and realize the continuous improvement of process and the upgrading of products. Therefore, the present invention can improve the optimization effect of nickel plating solution composition. BRIEF DESCRIPTION OF THE DRAWINGS

[0070] Figure 1 A schematic flow chart of a method for optimizing the composition of a chemical nickel plating solution for ceramic substrates according to one embodiment of the present invention;

[0071] Figure 2 A schematic diagram of failure node analysis of a method for optimizing the composition of a chemical nickel plating solution for ceramic substrates provided in one embodiment of the present invention;

[0072] The purpose, features and advantages of the present invention will be further described with reference to the accompanying drawings and in conjunction with the embodiments. DETAILED DESCRIPTION

[0073] It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0074] The present embodiment provides a method for optimizing the composition of a chemical nickel plating solution for ceramic substrates. The method can be performed by at least one of electronic devices, such as a server or a terminal, that can be configured to perform the method provided by the present embodiment. In other words, the method can be performed by software or hardware installed on a terminal or server device. The server includes, but is not limited to, a single server, a server cluster, a cloud server, or a cloud server cluster.

[0075] Example 1:

[0076] Reference Figure 1 FIG. 1 is a flow chart of a method for optimizing the composition of a chemical nickel plating solution for ceramic substrates according to an embodiment of the present invention. In this embodiment, the method for optimizing the composition of a chemical nickel plating solution for ceramic substrates includes:

[0077] S1. Define a basic formula of a nickel plating solution, determine key variables of the basic formula, wherein the key variables include nickel salt concentration, reducing agent concentration, complexing agent concentration, and pH value, and establish orthogonal parameters of the key variables to construct an index curve for the nickel plating solution.

[0078] It should be explained that the nickel plating solution refers to a chemical solution used to deposit a nickel coating on the surface of a ceramic substrate. This solution, through a chemical reduction reaction, reduces nickel ions to metallic nickel in the absence of an external current and deposits it on the substrate. The basic formula refers to the initial components of the nickel plating solution. For example, the basic formula includes a nickel salt (nickel sulfate, 10-30 g / L) as a nickel ion source; a reducing agent (sodium hypophosphite, 15-40 g / L) for reducing nickel ions; a complexing agent (lactic acid, 10-30 mL / L) or sodium citrate, 10-25 g / L) for stabilizing nickel ions and regulating the deposition rate; a buffer (sodium acetate, 5-20 g / L) to maintain the solution pH between 4.5 and 6.0; an accelerator (succinic acid, 1-5 g / L) or sodium fluoride, 0.1-1 g / L, to increase the plating rate; and a stabilizer (thiourea, 0.1-10 mg / L) or lead ions, 0.1-5 mg / L, to inhibit spontaneous decomposition of the solution.

[0079] The present invention determines the key variables of the basic formula, accurately identifying these variables and their optimized ranges, providing reliable input for subsequent machine learning models. Specifically, the nickel salt concentration refers to the nickel ion content in the solution, the reducing agent concentration refers to the reducing agent content in the solution, the complexing agent concentration refers to the complexing agent content in the solution, and the pH value refers to a measure of the solution's acidity or alkalinity.

[0080] The present invention establishes orthogonal parameters for the key variables to construct an index curve for the nickel plating solution. This systematically establishes orthogonal parameters for the key variables of the nickel plating solution and the index curve, laying a data foundation for intelligent optimization. The orthogonal parameters refer to the value range of each key variable, and the index curve refers to a curve drawn from experimental data that reflects the relationship between the key variables and the coating performance index.

[0081] In detail, the construction of the index curve of the nickel plating solution includes:

[0082] Determining orthogonal test data corresponding to orthogonal parameters of the nickel plating solution;

[0083] Defining performance indicators of the nickel plating solution;

[0084] Analyzing the sequence values ​​of the performance indicators according to the orthogonal test data;

[0085] defining a sequence node of the nickel plating solution;

[0086] An index curve of the nickel plating solution is constructed according to the sequence nodes and the sequence values.

[0087] Wherein, the orthogonal test data refers to the data obtained after the experiment is carried out by orthogonal experimental design.These data include the specific value of key variables (such as nickel salt concentration, reducing agent concentration, complexing agent concentration and pH value) in each group of experiments, and the measurement result of corresponding coating performance index (such as coating thickness, hardness, bonding strength, corrosion resistance, etc.), and the performance index refers to the quantitative parameter for evaluating nickel plating solution performance. In the optimization of chemical nickel plating solution composition, performance index generally includes but is not limited to the indexes such as coating thickness, coating hardness, bonding strength, and the sequence value refers to the specific numerical value corresponding to each performance index in the orthogonal test data. For example, the numerical values ​​such as coating thickness, hardness, bonding strength measured in each group of experiments, the sequence node refers to the specific value point of each key variable in the orthogonal test data, and the index curve refers to the curve drawn by orthogonal test data, reflecting the relationship between key variables and coating performance index.

[0088] Optionally, constructing the index curve of the nickel plating solution according to the sequence nodes and the sequence values ​​can be achieved by using a curve fitting technology.

[0089] S2. Analyze the target ratio combination of the key variables through the index curve to establish an initial nickel plating solution of the nickel plating solution, and use the initial nickel plating solution to plate a preset ceramic substrate to record the current pH value of the initial nickel plating solution during the plating process.

[0090] The present invention analyzes the target ratio combination of the key variables through the index curve to determine the target ratio of the key variables, taking into account both efficiency and reliability.

[0091] In detail, analyzing the target ratio combination of the key variables through the index curve includes:

[0092] constructing an interaction response surface of the indicator curve;

[0093] Mark the extreme points of the interaction response surface;

[0094] Defining a performance indicator weight of a performance indicator corresponding to the indicator curve;

[0095] Analyzing a multi-objective compromise solution of the performance indicator according to the extreme value points and the performance indicator weights;

[0096] The target ratio combination of the key variables is determined through the multi-objective compromise solution.

[0097] Among them, the interaction response surface refers to the relationship surface between the performance indicators (such as coating thickness, hardness, bonding strength, corrosion resistance, etc.) obtained when considering the interaction between two or more key variables (such as nickel salt concentration, reducing agent concentration, complexing agent concentration and pH value) in an orthogonal experiment or a response surface method experiment and these variables. The extreme point refers to the point on the interaction response surface where the performance indicator reaches the maximum or minimum value. The performance indicator weight refers to the importance of different performance indicators to the performance of the final product. The multi-objective compromise solution refers to a solution that meets the requirements of all performance indicators by weighing and compromising while considering the requirements of multiple performance indicators in a multi-objective optimization problem. The target ratio combination refers to the optimal value combination of key variables determined according to the multi-objective compromise solution.

[0098] Optionally, the multi-objective compromise solution of the performance indicator analyzed according to the extreme value points and the performance indicator weights can be calculated by defining the ideal solution and the inferior solution of the performance indicator through the TOPSIS method formula.

[0099] It should be explained that the initial nickel plating solution of the nickel plating solution is established, and the initial nickel plating solution refers to a component combination of the nickel plating solution constructed according to a target ratio combination of key variables.

[0100] In the present invention, the initial nickel plating solution is used to plate a predetermined ceramic substrate, and the current pH value of the initial nickel plating solution during the plating process is recorded to obtain pH data of the plating process, thereby determining the pH stability of the initial nickel plating solution during the plating process. The current pH value refers to the real-time pH value of the initial nickel plating solution during the plating process.

[0101] S3. Analyze the pH adjustment parameters of the initial nickel plating solution using a preset automatic titration algorithm based on the current pH value, and mark the comprehensive life score of the initial nickel plating solution under the pH adjustment parameters to determine the failure node of the initial nickel plating solution.

[0102] The present invention analyzes the pH adjustment parameters of the initial nickel plating solution using a preset automatic titration algorithm based on the current pH value, and can intelligently infer the type of regulator and addition parameters required to maintain or adjust the pH, thereby achieving self-regulation of the pH value of the initial nickel plating solution.

[0103] In detail, the pH adjustment parameters of the initial nickel plating solution are analyzed by using a preset automatic titration algorithm based on the current pH value, including:

[0104] Calculating a pH error of the initial nickel plating solution during the plating process based on the pH value corresponding to the initial nickel plating solution and the current pH value;

[0105] Analyzing the positive and negative values ​​of the pH error value to determine the pH regulator of the initial nickel plating solution;

[0106] Calculating the titration flow rate of the pH regulator using the automatic titration algorithm according to the pH error value;

[0107] The pH adjustment parameter of the initial nickel plating solution is determined by the pH adjuster and the titration flow rate.

[0108] Among them, the pH error value refers to a quantitative indicator measuring the degree to which the current pH value of the nickel plating solution deviates from the target (ideal) pH value, the pH adjuster refers to a chemical substance used to change the pH value of the nickel plating solution, the titration flow rate refers to the rate at which the pH adjuster is added to the nickel plating solution, and the pH adjustment parameter refers to a series of specific settings or instructions required to adjust the pH value of the initial nickel plating solution to the target value (or maintain stability), including the titration flow rate and the pH adjuster.

[0109] Furthermore, the step of calculating the titration flow rate of the pH regulator using the automatic titration algorithm according to the pH error value comprises:

[0110] Determining gain parameters of the automatic titration algorithm, wherein the gain parameters include proportional gain, integral gain, and differential gain;

[0111] Based on the gain parameter and the pH error value, the titration flow rate of the pH regulator is calculated using the automatic titration algorithm, wherein the automatic titration algorithm:

[0112]

[0113] Where, u(t) represents the titration flow rate of the pH regulator at time t, R p represents the proportional gain, e(t) represents the pH error value at time t, R i Indicates the integral gain, R d represents the differential gain, represents the error accumulation value, represents the error conversion rate, dt represents the time differential, and d represents the differential operator.

[0114] Among them, the proportional gain refers to the response strength of the controller output to the current error, the integral gain refers to the response strength of the controller output to the accumulated amount of error over time, and the differential gain refers to the response strength of the controller output to the rate of change of the error. The automatic titration algorithm calculates a control signal, i.e., the titration flow rate of the pH regulator, based on the gain parameters and the pH error value. The error accumulation value represents the cumulative sum of the pH error value over time t from the start of the control process to the current time t. The error conversion rate refers to the rate at which the pH error value changes over time.

[0115] The present invention marks the comprehensive life score of the initial nickel plating solution under the pH value adjustment parameter to determine whether the initial nickel plating solution is invalid, thereby improving the plating effect.

[0116] In detail, the marking of the comprehensive life score of the initial nickel plating solution under the pH adjustment parameters includes:

[0117] Obtaining plating rate data and solution transmittance data of the initial nickel plating solution under the pH value adjustment parameters;

[0118] Calculating the plating rate attenuation rate of the initial nickel plating solution based on the plating rate data;

[0119] Analyzing the transmittance of the initial nickel plating solution based on the solution transmittance data;

[0120] Determining the conversion turbidity of the initial nickel plating solution by the light transmittance;

[0121] Combined with the plating rate attenuation rate and the conversion turbidity, the comprehensive life score of the initial nickel plating solution under the pH value adjustment parameters is analyzed.

[0122] Among them, the plating rate data refers to the thickness of the nickel layer deposited on the substrate per unit time when plating is performed using the initial nickel plating solution under the control of the pH adjustment parameters, the solution transmittance data refers to the percentage of light of a specific wavelength (usually visible light range, such as 436nm, 546nm, 577nm, etc.) allowed to pass through the nickel plating solution, the plating rate decay rate refers to the rate at which the plating rate decreases over time, the transmittance refers to the degree to which the solution allows light to pass through, the conversion turbidity refers to the turbidity of the solution, and the comprehensive life score refers to the length of time that the nickel plating solution can maintain its process performance (such as coating quality, plating rate, stability, etc.) to acceptable standards.

[0123] Optionally, the plating rate data and solution transmittance data of the initial nickel plating solution under the pH value adjustment parameters are obtained, wherein the plating rate data can be obtained by regularly interrupting the electroplating process, measuring the thickness of the nickel layer deposited at different time points (such as using a thickness gauge) or calculating the mass of the deposited nickel (such as by electroplating electricity calculation or peeling weighing), and wherein the solution transmittance data is analyzed by measuring the absorbance of the solution at a specific wavelength using a spectrophotometer.

[0124] Furthermore, the combination of the plating rate attenuation rate and the conversion turbidity to analyze the comprehensive life score of the initial nickel plating solution under the pH adjustment parameter includes:

[0125] defining the plating rate attenuation rate and the attenuation rate weight and the conversion turbidity weight of the plating rate attenuation rate;

[0126] marking the failed turbidity and the ideal turbidity of the converted turbidity;

[0127] Based on the plating rate decay rate, the conversion turbidity, the decay rate weight, the conversion turbidity weight, the failure turbidity, and the ideal turbidity, the comprehensive life score of the initial nickel plating solution is calculated using the following formula:

[0128]

[0129] Where S represents the comprehensive life score of the initial nickel plating solution, V represents the plating rate attenuation rate, ω1 represents the attenuation rate weight, D represents the conversion turbidity, and D min Indicates ideal turbidity, D max represents the failure turbidity, and ω2 represents the conversion turbidity weight.

[0130] Among them, the decay rate weight refers to the relative importance of the plating rate decay rate in determining the comprehensive life score, the conversion turbidity weight refers to the relative importance of the conversion turbidity in determining the comprehensive life score, the failure turbidity is the maximum allowable turbidity value when the turbidity of the nickel plating solution reaches an unacceptable level, and the solution is considered to have failed or can no longer be used, and the ideal turbidity refers to the turbidity value of the nickel plating solution in the optimal working state or initial state.

[0131] Figure 2 Schematic diagram of failure point analysis for a method for optimizing the composition of electroless nickel plating solutions for ceramic substrates, according to one embodiment of the present invention. The present invention determines the failure point of the initial nickel plating solution as a critical state at which the solution fails to meet process requirements due to performance degradation and requires replacement or regeneration. Specifically, the failure point is determined when the initial nickel plating solution's comprehensive lifespan score is less than a preset effective lifespan.

[0132] S4. Based on the failure node and the pH adjustment parameter, plating the ceramic substrate with the initial nickel plating solution to obtain a nickel-plated ceramic substrate, identifying a critical load of the nickel-plated ceramic substrate at which the plating layer peels off, determining the bonding strength of the nickel-plated ceramic substrate, and analyzing the conductivity and corrosion resistance of the nickel-plated ceramic substrate.

[0133] It should be explained that the nickel-plated ceramic substrate refers to a composite material in which a layer of nickel metal is deposited on the surface of a substrate made of ceramic material through processes such as electroplating.

[0134] The critical load of the nickel-plated ceramic substrate at which the coating peels off is identified by the present invention and can serve as a basis for subsequent bonding strength analysis of the nickel-plated ceramic substrate.

[0135] In detail, the identification of the critical load of the nickel-plated ceramic substrate at which the coating peels off includes:

[0136] Establishing the coating peeling load condition of the nickel-plated ceramic substrate;

[0137] constructing a load-displacement curve under the coating peeling load condition;

[0138] Marking the sudden change point of the load-displacement curve;

[0139] The load at the mutation point is recorded as the critical load of the nickel-plated ceramic substrate when the coating peels off.

[0140] Among them, the coating peeling load condition refers to the specific loading method and parameters set to induce or test the peeling of the nickel plating from the ceramic substrate. The load-displacement curve refers to a graph that records the relationship between the load (Load) acting on the sample and the overall displacement (Displacement) generated by the sample in real time during the application of the coating peeling load condition. The mutation point refers to the point on the load-displacement curve where the load value or curve slope changes significantly and suddenly. The critical load refers to the load value on the load-displacement curve corresponding to the mutation point.

[0141] Optionally, the load-displacement curve under the coating peeling load condition is automatically recorded by a universal testing machine or other equipment. The horizontal axis generally represents the displacement (usually the elongation, compression or distance moved by the loading point of the nickel-plated ceramic substrate), and the vertical axis represents the corresponding load value.

[0142] It should be explained that the bonding force refers to the strength of the interface bonding between the nickel plating layer and the ceramic substrate. Specifically, the bonding force can be calculated by calculating the effective contact interface between the nickel plating layer and the ceramic substrate and dividing the critical load by the effective contact interface.

[0143] The present invention analyzes the conductivity and corrosion resistance of the nickel-plated ceramic substrate to further analyze the performance of the nickel-plated ceramic substrate and provide a basis for subsequent formula optimization.

[0144] In detail, the analysis of the conductivity and corrosion resistance of the nickel-plated ceramic substrate includes:

[0145] A four-probe tester configured with the nickel-plated ceramic substrate;

[0146] Lightly pressing the surface of the nickel-plated ceramic substrate with four corresponding probes of the four-probe tester vertically to analyze the contact uniformity coefficient between the four probes and the nickel-plated ceramic substrate;

[0147] applying a constant current to the nickel-plated ceramic substrate using the four-probe tester according to the contact uniformity coefficient, and recording the voltage of the nickel-plated ceramic substrate;

[0148] calculating the conductivity of the nickel-plated ceramic substrate based on the constant current and the voltage;

[0149] Identifying a surface condition of a coating of the nickel-plated ceramic substrate;

[0150] Placing the nickel-plated ceramic substrate in a preset salt spray chamber to record the rust area ratio of the nickel-plated ceramic substrate;

[0151] The corrosion resistance of the nickel-plated ceramic substrate is determined based on the rust area ratio.

[0152] Among them, the four-probe tester refers to an instrument used to measure the resistivity of conductive films, thin layers or semiconductor materials, the contact uniformity coefficient refers to an indicator describing the contact condition between the four-probe tester and the surface of the nickel-plated ceramic substrate, the constant current refers to the current value stably output by the four-probe tester and of constant magnitude, the voltage refers to the potential difference between two points on the sample surface measured by the two probes (voltage probes) inside the four-probe tester after a constant current is passed through, the conductivity refers to the ability of the material to conduct current, the surface state of the coating refers to the macroscopic and microscopic appearance characteristics of the surface of the nickel-plated layer, the salt spray chamber refers to a chamber used to simulate a corrosive atmospheric environment containing salt (usually sodium chloride), the rust area ratio refers to the percentage of the area of ​​rust (or corrosion) on the sample surface after the salt spray test is completed to the total surface area of ​​the sample, and the corrosion resistance refers to the ability of the material to resist corrosion.

[0153] Optionally, the identification of the surface state of the coating of the nickel-plated ceramic substrate can be obtained by taking pictures with a 200× microscope.

[0154] Optionally, the calculation of the conductivity of the nickel-plated ceramic substrate based on the constant current and the voltage may be performed by calculating the resistance of the nickel-plated ceramic substrate using the constant current and the voltage. The lower the calculated resistance, the better the conductivity.

[0155] Furthermore, determining the corrosion resistance of the nickel-plated ceramic substrate based on the rust area ratio includes:

[0156] Determine the corrosion resistance grade of the rusted area ratio;

[0157] identifying a corroded area of ​​the nickel-plated ceramic substrate;

[0158] defining a corrosion weight of the corrosion area;

[0159] Calculating the corrosion coefficient of the nickel-plated ceramic substrate based on the corrosion weight and the corrosion area ratio;

[0160] Based on the corrosion coefficient, the corrosion resistance of the nickel-plated ceramic substrate is determined.

[0161] Among them, the corrosion resistance grade refers to the grade divided according to the size of the proportion of the rust area in accordance with predetermined standards or specifications. The corrosion area refers to the specific location and range of actual rust (or corrosion) on the surface of the nickel-plated ceramic substrate after the salt spray test. The corrosion weight refers to the importance of different corrosion areas. The corrosion coefficient refers to a coefficient that combines the area ratio of corrosion (corrosion area ratio) and the location importance of these corrosion areas (corrosion weight) to obtain a more comprehensive quantification of the corrosion resistance of the coating.

[0162] S5. Based on the bonding force, the conductivity, and the corrosion resistance, use the trained nickel plating solution composition optimization model to output composition optimization parameters of the initial nickel plating solution, and perform composition optimization of the nickel plating solution based on the composition optimization parameters.

[0163] The present invention uses a trained nickel plating solution composition optimization model to output the composition optimization parameters of the initial nickel plating solution based on the binding force, the electrical conductivity, and the corrosion resistance. The trained nickel plating solution composition optimization model can be systematically used to output the composition optimization parameters of the initial nickel plating solution based on performance indicators such as binding force, electrical conductivity, and corrosion resistance, thereby guiding the solution configuration and process optimization in actual production. Wherein, the composition optimization parameters refer to the optimized values ​​of nickel salt concentration, reducing agent concentration, complexing agent concentration, and pH value. Wherein, the nickel plating solution composition optimization model refers to a model that optimizes the composition of the initial nickel plating solution through the binding force, the electrical conductivity, and the corrosion resistance. In detail, the nickel plating solution composition optimization model can be obtained by training the input features (composition, parameters) and output labels (performance indicators) of the nickel plating solution using a neural network.

[0164] First, by systematically defining the basic formula and determining key variables such as nickel salt, reducing agent, chelating agent concentration and pH value, and then using orthogonal experimental design to construct index curves, we can efficiently and scientifically explore the influence of various factors on the performance of the coating. This method avoids the blindness and inefficiency of the traditional trial and error method, greatly shortens the experimental cycle, and ensures the comprehensiveness and representativeness of the experimental data, laying a solid foundation for subsequent optimization. Secondly, this method introduces pH online monitoring and automatic titration algorithms to achieve precise control of the dynamic changes in the pH value of the plating solution. This not only ensures the stability of the chemical environment of the plating solution during the plating process, thereby improving the uniformity and consistency of the coating quality, but also accurately predicts the failure node of the plating solution by analyzing the relationship between the pH adjustment parameters and the comprehensive life score, which makes the production process more controllable and effectively avoids Eliminate the coating defects caused by plating solution aging, improve production efficiency and product qualification rate, more importantly, the method combines the evaluation of coating performance (bonding force, conductivity, corrosion resistance) with advanced machine learning optimization model, through the accurate measurement of the actual nickel-plated ceramic substrate performance, not only obtain the performance data reflecting the real application needs, but also use the trained model to reversely deduce the component optimization parameters that can further improve performance, this data-driven optimization method can comprehensively consider multiple performance indicators, find the best balance between performance and cost, avoid the other performance sacrifices that may be caused by single indicator optimization, and finally, by performing component optimization, the overall quality of nickel-plated ceramic substrate can be significantly improved, enhance its application reliability and competitiveness in the fields of electronics, electricity, etc., and achieve continuous improvement of process and upgrading of products. Therefore, the present invention can improve the optimization effect of nickel plating solution components.

Claims

1. A method for optimizing the composition of a ceramic substrate chemical nickel plating solution, characterized in that: The method comprises: Defining a basic formula for a nickel plating solution, determining key variables of the basic formula, wherein the key variables include nickel salt concentration, reducing agent concentration, complexing agent concentration, and pH value, and establishing orthogonal parameters of the key variables to construct an index curve for the nickel plating solution; Analyzing the target ratio combination of the key variables through the index curve to establish an initial nickel plating solution of the nickel plating solution, plating a preset ceramic substrate using the initial nickel plating solution, and recording the current pH value of the initial nickel plating solution during the plating process; Analyzing the pH adjustment parameters of the initial nickel plating solution using a preset automatic titration algorithm according to the current pH value, and marking a comprehensive life score of the initial nickel plating solution under the pH adjustment parameters to determine a failure node of the initial nickel plating solution; Based on the failure node and the pH value adjustment parameter, plating the ceramic substrate with the initial nickel plating solution to obtain a nickel-plated ceramic substrate, identifying a critical load of the nickel-plated ceramic substrate at which the plating layer peels off to determine the bonding force of the nickel-plated ceramic substrate, and analyzing the conductivity and corrosion resistance of the nickel-plated ceramic substrate; Based on the bonding force, the conductivity, and the corrosion resistance, a trained nickel plating solution composition optimization model is used to output composition optimization parameters of the initial nickel plating solution, and composition optimization of the nickel plating solution is performed based on the composition optimization parameters.

2. The method for optimizing the composition of a chemical nickel plating solution for ceramic substrates according to claim 1, wherein: The constructing of the index curve of the nickel plating solution comprises: Determining orthogonal test data corresponding to orthogonal parameters of the nickel plating solution; Defining performance indicators of the nickel plating solution; Analyzing the sequence values ​​of the performance indicators according to the orthogonal test data; defining a sequence node of the nickel plating solution; An index curve of the nickel plating solution is constructed according to the sequence nodes and the sequence values.

3. The method for optimizing the composition of a chemical nickel plating solution for ceramic substrates according to claim 2, wherein: Analyzing the target ratio combination of the key variables through the index curve includes: constructing an interaction response surface of the indicator curve; Mark the extreme points of the interaction response surface; Defining a performance indicator weight of a performance indicator corresponding to the indicator curve; Analyzing a multi-objective compromise solution of the performance indicator according to the extreme value points and the performance indicator weights; The target ratio combination of the key variables is determined through the multi-objective compromise solution.

4. The method for optimizing the composition of a chemical nickel plating solution for ceramic substrates according to claim 3, wherein: The step of analyzing the pH adjustment parameters of the initial nickel plating solution using a preset automatic titration algorithm based on the current pH value includes: Calculating a pH error of the initial nickel plating solution during the plating process based on the pH value corresponding to the initial nickel plating solution and the current pH value; Analyzing the positive and negative values ​​of the pH error value to determine the pH regulator of the initial nickel plating solution; Calculating the titration flow rate of the pH regulator using the automatic titration algorithm according to the pH error value; The pH adjustment parameter of the initial nickel plating solution is determined by the pH adjuster and the titration flow rate.

5. The method for optimizing the composition of a chemical nickel plating solution for ceramic substrates according to claim 4, wherein: The step of calculating the titration flow rate of the pH regulator using the automatic titration algorithm according to the pH error value comprises: Determining gain parameters of the automatic titration algorithm, wherein the gain parameters include proportional gain, integral gain, and differential gain; Based on the gain parameter and the pH error value, the titration flow rate of the pH regulator is calculated using the automatic titration algorithm, wherein the automatic titration algorithm: Where, u(t) represents the titration flow rate of the pH regulator at time t, R p represents the proportional gain, e(t) represents the pH error value at time t, R i Indicates the integral gain, R d represents the differential gain, represents the error accumulation value, represents the error conversion rate, dt represents the time differential, and d represents the differential operator.

6. The method for optimizing the composition of a chemical nickel plating solution for ceramic substrates according to claim 5, wherein: The marking indicates a comprehensive lifespan score of the initial nickel plating solution under the pH adjustment parameters, including: Obtaining plating rate data and solution transmittance data of the initial nickel plating solution under the pH value adjustment parameters; Calculating the plating rate attenuation rate of the initial nickel plating solution based on the plating rate data; Analyzing the transmittance of the initial nickel plating solution based on the solution transmittance data; Determining the conversion turbidity of the initial nickel plating solution by the light transmittance; Combined with the plating rate attenuation rate and the conversion turbidity, the comprehensive life score of the initial nickel plating solution under the pH value adjustment parameters is analyzed.

7. The method for optimizing the composition of a chemical nickel plating solution for ceramic substrates according to claim 6, wherein: The step of analyzing the comprehensive lifespan score of the initial nickel plating solution under the pH adjustment parameters by combining the plating rate attenuation rate and the conversion turbidity includes: defining the plating rate attenuation rate and the attenuation rate weight and the conversion turbidity weight of the plating rate attenuation rate; marking the failed turbidity and the ideal turbidity of the converted turbidity; Based on the plating rate decay rate, the conversion turbidity, the decay rate weight, the conversion turbidity weight, the failure turbidity, and the ideal turbidity, the comprehensive life score of the initial nickel plating solution is calculated using the following formula: Where S represents the comprehensive life score of the initial nickel plating solution, V represents the plating rate attenuation rate, ω1 represents the attenuation rate weight, D represents the conversion turbidity, and D min Indicates ideal turbidity, D max represents the failure turbidity, and ω2 represents the conversion turbidity weight.

8. The method for optimizing the composition of a chemical nickel plating solution for ceramic substrates according to claim 7, wherein: The identifying of the critical load of the nickel-plated ceramic substrate at which the coating peels off comprises: Establishing the coating peeling load condition of the nickel-plated ceramic substrate; constructing a load-displacement curve under the coating peeling load condition; Marking the sudden change point of the load-displacement curve; The load at the mutation point is recorded as the critical load of the nickel-plated ceramic substrate when the coating peels off.

9. The method for optimizing the composition of a chemical nickel plating solution for ceramic substrates according to claim 8, wherein: The analysis of the conductivity and corrosion resistance of the nickel-plated ceramic substrate comprises: A four-probe tester configured with the nickel-plated ceramic substrate; Lightly pressing the surface of the nickel-plated ceramic substrate with four corresponding probes of the four-probe tester vertically to analyze the contact uniformity coefficient between the four probes and the nickel-plated ceramic substrate; applying a constant current to the nickel-plated ceramic substrate using the four-probe tester according to the contact uniformity coefficient, and recording the voltage of the nickel-plated ceramic substrate; calculating the conductivity of the nickel-plated ceramic substrate based on the constant current and the voltage; Identifying a surface condition of a coating of the nickel-plated ceramic substrate; Placing the nickel-plated ceramic substrate in a preset salt spray chamber to record the rust area ratio of the nickel-plated ceramic substrate; The corrosion resistance of the nickel-plated ceramic substrate is determined based on the rust area ratio.

10. The method for optimizing the composition of a chemical nickel plating solution for ceramic substrates according to claim 9, wherein: Determining the corrosion resistance of the nickel-plated ceramic substrate based on the rust area ratio includes: Determine the corrosion resistance grade of the rusted area ratio; identifying a corroded area of ​​the nickel-plated ceramic substrate; defining a corrosion weight of the corrosion area; Calculating the corrosion coefficient of the nickel-plated ceramic substrate based on the corrosion weight and the corrosion area ratio; Based on the corrosion coefficient, the corrosion resistance of the nickel-plated ceramic substrate is determined.

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