Interposer electronic module for semiconductor interposer process and manufacturing method thereof

Abstract

The present invention relates to an interposer electronic module for a semiconductor interposer process and a method of manufacturing the same, the interposer electronic module comprising a silicon substrate, a resin layer and at least one pin, the silicon substrate using a silicon material as a substrate, having a certain thickness and comprising at least two surfaces, the adhesive resin layer is uniformly distributed and combined on the surface of the silicon substrate and has an adhesive layer thickness, and the invention also relates to a manufacturing method of the interposer electronic module. According to the interposer electronic module and the manufacturing method, the loss rate in the production process can be greatly reduced, the production efficiency and the yield can be improved, and the effect of saving the production cost can be achieved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor production and manufacturing, and in particular to an interposer electronic module used in a semiconductor interposer process and a manufacturing method thereof. Background Art

[0002] The demand for ever-increasing semiconductor speeds and continued size reductions has driven the development of increasingly sophisticated processes. As processes continue to advance to 3nm and 2nm, existing packaging processes are increasingly unable to meet these demands. Consequently, the market has begun to adopt the Chip-on-Wafer-on-Substrate (CoWoS) packaging technology, which can be broken down into two aspects: "CoW" and "WoS." CoW (Chip-on-Wafer) refers to stacking chips, while WoS (Wafer-on-Substrate) stacks chips on a substrate. CoWoS essentially stacks chips and packages them on a substrate.

[0003] Among them, the mainstream 2.5D packaging is the packaging technology promoted by TSMC, which is well-known to everyone. It places semiconductor chips on an interposer in a horizontal stacking manner, and finally connects them to the underlying substrate through a packaging process, allowing multiple chips to be packaged together to achieve the effect of small package size, low power consumption, and few pins.

[0004] Among the current packaging technologies, the technical methods related to the interposer are shown in Figures 13 to Figure 17 As shown, first, Figure 13A 、 Figure 13B As shown, a film F is attached to the bottom of a pin positioning mold D, and a preformed pin P is placed in the pin positioning mold D so that the bottom of the pin P passes through the pin positioning mold D and is fixed with the aforementioned film F. Subsequently, a metal plate T to be fixed is prepared, and solder S is plated one by one on the surface of the metal plate T to be fixed with the pin P. Subsequently, the aforementioned pin positioning mold D is turned over so that the pin P contacts the metal plate T and the pin P contacts the solder S. After the solder S is melted and fused with the pin P at a high temperature during reflow, the pin P is fixedly connected to the solder S. After that, the aforementioned film F and the pin positioning mold D are removed, and the production of the interposer is completed. Finally, it is cut according to the required size to form an interposer module that needs to be stacked on the substrate.

[0005] During the production process of the interposer module, the contact area between the pins and the solder is extremely small, and the solder coating thickness is insufficient to support the pins. During the reflow and high-temperature baking process, the pins may be offset, bent, tilted or deformed due to solder offset, or poor contact with the solder, which may result in the pins being unable to very stably fix the metal plate on the surface. Subsequently, when stacked on the substrate, short circuits or empty solder joints with other components may occur. Since all processes are very meticulous, just a slight error may cause the entire device to be scrapped or unusable. In order to improve the yield and save production costs, the inventors have proposed corresponding solutions to solve the difficulties of existing interposer modules in production. Summary of the Invention

[0006] In order to solve the above-mentioned problems in the production of interposer modules, the present invention provides an interposer electronic module for semiconductor interposer manufacturing process, which includes

[0007] A silicon substrate, which uses silicon material as a base and has a thickness and a first surface;

[0008] a resin layer uniformly distributed and bonded to the first surface of the silicon substrate, having a layer thickness and including a working surface, wherein the resin layer is made of a thermosetting synthetic resin;

[0009] At least one pin is made of a metal conductive material and is combined with the working surface of the resin layer. The pin is protruded from the working surface of the resin layer to define a connection height.

[0010] Preferably, in the interposer electronic module for semiconductor interposer manufacturing process, the interposer electronic module may be provided with a plurality of pins, and the connection heights of the pins are the same.

[0011] Preferably, in the interposer electronic module for semiconductor interposer manufacturing process, one end of the at least one pin contacts the first surface of the silicon substrate.

[0012] The present invention further provides a method for manufacturing an interposer electronic module for a semiconductor interposer process, which comprises:

[0013] The silicon substrate bonding step is to coat the film with a resin layer and fix the silicon substrate on the resin layer to form a working block;

[0014] A pin positioning step, positioning each pin in a pin positioning mold;

[0015] The module installation step involves moving the work block to a pin positioning mold with pins for alignment and positioning, and moving the work block so that the resin layer of the silicon substrate is bonded to the corresponding pins; and

[0016] In the module assembly step, after the above steps are completed, the silicon substrate is pressed with a pressing plate, and the working block combined with each pin is heated to the curing temperature of the resin layer, and then cured to form an intermediate layer electronic module.

[0017] Preferably, in the method for manufacturing an interposer electronic module for a semiconductor interposer process, in the silicon substrate adhering step, the silicon substrate is cut into the working blocks according to the size to be cut.

[0018] Preferably, as described above, the method for manufacturing an interposer electronic module for a semiconductor interposer process, wherein, in the module assembly step, the top of each pin passes through the resin layer, and some pins can touch the surface where the silicon substrate and the resin layer are bonded.

[0019] The present invention further provides a method for preparing the interposer electronic module, comprising:

[0020] Silicon substrate adhesion step, coating the surface of the silicon substrate to form a resin layer;

[0021] A pin positioning step, positioning each pin in a pin positioning mold;

[0022] A module installation step comprises aligning and positioning a pin positioning mold with each pin on the silicon substrate, and moving the pin positioning mold so that the resin layer of the silicon substrate is bonded to the corresponding pins; and

[0023] In the module assembly step, after the above steps are completed, the pin positioning mold is pressed with a pressing plate, and the silicon substrate combined with each pin is heated to the curing temperature of the resin layer, and then cured to form an intermediate layer electronic module.

[0024] Preferably, as described above, the method for manufacturing an interposer electronic module for a semiconductor interposer process, wherein, in the module assembly step, the top of each pin can pass through the resin layer, and some pins can touch the surface where the silicon substrate and the resin layer are bonded.

[0025] Preferably, in the method for manufacturing an interposer electronic module for a semiconductor interposer process, in the module assembly step, the silicon substrate of the interposer electronic module is cut and shaped according to a size to be cut.

[0026] The interposer electronic module and its manufacturing method of the present invention successfully overcome the following difficulties in existing production technologies:

[0027] 1. The pins of the interposer electronic module of the present invention are connected to the silicon substrate through a resin layer of (thickness description). The resin layer is first formed on the surface of the silicon substrate, and then the resin layer and the pins are fixed and leveled by hot pressing. In the interposer electronic module manufactured in this way, the surface of the silicon substrate and the resin layer will not have the problem of uneven coating thickness or insufficient thickness. The pins can also be coated with the resin layer bonded to the surface of the silicon substrate, so that the pins are more firmly connected to the surface of the silicon substrate.

[0028] 2. The manufacturing method of the present invention can reduce the shortcomings of uneven solder coating or insufficient thickness during the production process. When the resin layer is coated on the silicon substrate in advance and pressed down to the pins, the pins are densely distributed and the resin layer coating area is large, so the pressure on each pin is the same without any difference in weight. As a result, when the pins and the resin layer are bonded, the bending or deformation of the pins is greatly reduced, and the strength of the connection between each pin and the resin layer is also high, which can greatly reduce the scrap rate in the production process.

[0029] 3. The manufacturing method of the present invention can also be applied to pins with small spacing, small diameter and longer pins, because the process of plating tin and flux on the silicon substrate is eliminated, and the resin layer can accommodate longer, denser and smaller diameter pins, thereby improving production efficiency and precision. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 Schematic diagram of the structure of the interposer electronic module.

[0031] Figure 2A It is a top view schematic diagram of coating a resin layer on the adhesive film during the silicon substrate bonding step.

[0032] Figure 2B It is a front view schematic diagram of coating a resin layer on the adhesive film during the silicon substrate bonding step.

[0033] Figure 3A It is a schematic top view of adhering a resin layer to a silicon substrate in the silicon substrate adhering step.

[0034] Figure 3B It is a front view schematic diagram of adhering a resin layer to a silicon substrate in the silicon substrate adhering step.

[0035] Figure 4A It is a top view schematic diagram of cutting the silicon substrate into working blocks during the bonding step.

[0036] Figure 4B It is a front view schematic diagram of the silicon substrate being cut into working blocks during the bonding step.

[0037] Figure 5A This is a top-down diagram of the pin placement in the pin positioning step.

[0038] Figure 5B Front view diagram of the pin placement in the Pin Positioning step.

[0039] Figure 6A A top-down diagram showing the positioning of the work block and pins during module installation.

[0040] Figure 6B This is a front view diagram showing the positioning of the work block and pins during the module installation steps.

[0041] Figure 7A This is a top view of the working block and pin pressing in the module assembly step.

[0042] Figure 7B This is a front view schematic diagram of the working block and pin pressing in the module assembly step.

[0043] Figure 8A This is a top-down diagram of the baking and fixing of the working blocks and pins during the module assembly step.

[0044] Figure 8B This is a front view schematic diagram of the baking fixation of the working blocks and pins in the module assembly step.

[0045] Figure 9A FIG1 is a top view of attaching a film to a pin positioning mold to fix the pins in the pin positioning step according to another embodiment.

[0046] Figure 9B It is a front view schematic diagram of affixing a film to a pin positioning mold to fix the pins in the pin positioning step according to another embodiment.

[0047] Figure 9C FIG. 1 is a front view schematically showing a step of coating a resin layer on a silicon substrate during a silicon substrate bonding step according to another embodiment.

[0048] Figure 10A FIG1 is a top view schematically showing the positioning of pins and a silicon substrate during a module installation step according to another embodiment.

[0049] Figure 10B It is a front view schematic diagram of the positioning of pins and silicon substrate in the module installation step according to another embodiment.

[0050] Figure 11 This is a front view schematic diagram of another embodiment of the module assembly step in which the adhesive film is torn off after the pins are bonded to the silicon substrate.

[0051] Figure 12 FIG. 4 is a structural diagram of an electronic module on an intermediate layer according to another embodiment.

[0052] Figure 13A It is a top view schematic diagram of the pin positioning on the pin positioning mold in the prior art.

[0053] Figure 13B It is a front view schematic diagram of the pin positioning on the pin positioning mold in the prior art.

[0054] Figure 14 It is a front view schematic diagram of the solder connection between the pin and the metal plate in the prior art.

[0055] Figure 15 It is a front view schematic diagram of tearing off the adhesive film after the pins are connected to the metal plate in the prior art.

[0056] Figure 16 It is a structural diagram of an electronic module in the prior art.

[0057] Figure 17 It is an enlarged schematic diagram of the structure of an electronic module in the prior art.

[0058]

Explanation of symbols

[0059] M interposer electronic module

[0060] 11 Silicon substrate

[0061] 110 Surface

[0062] 12 Resin layer

[0063] 121 working surface

[0064] 13 pins

[0065] 14 mold cavities

[0066] T adhesive layer thickness

[0067] L Connection height

[0068] F film

[0069] B job block

[0070] D pin positioning mold

[0071] LD working height

[0072] P pressure plate

[0073] T Metal Sheet

[0074] S solder DETAILED DESCRIPTION

[0075] The present invention is an interposer electronic module for semiconductor interposer manufacturing process and a manufacturing method thereof, such as Figure 1As shown, the interposer electronic module M includes a silicon substrate 11, a resin layer 12 and at least one pin 13. The silicon substrate 11 uses silicon material as a base and has a certain thickness and includes at least two surfaces 110. The resin layer 12 is evenly distributed and bonded to one of the surfaces 110 of the silicon substrate and has a resin layer thickness T. The resin layer thickness T is at least 25 to 200 μm and includes a working surface 121. The resin layer 12 uses a thermosetting synthetic resin and has a certain viscosity (viscosity single Position range), preferably, the present invention uses epoxy resin as the main material of the resin layer 12, and other thermosetting epoxy-based polymers can also be used. The at least one pin 13 is a metal conductive material and penetrates the working surface 121 of the resin layer 12 and contacts the silicon substrate surface 110 at one end. The at least one pin 13 is made of copper and is defined as a connection height L protruding from the surface of the resin layer. Preferably, one or more pins 13 can be provided in the intermediate layer electronic module M, and the connection height L of each pin 13 is the same.

[0076] like Figures 2A to 8B As shown, in a first embodiment of the present invention, a method for manufacturing an interposer electronic module M for a semiconductor interposer process is disclosed, which includes a silicon substrate bonding step, a pin positioning step, a module mounting step, and a module assembly step.

[0077] like Figure 2A 、 2B As shown, the substrate adhesion step includes first providing a film F, the area and size of the film F are selected according to user requirements, and evenly coating the adhesive on the film F where the silicon substrate 11 is to be adhered, so that the adhesive is evenly spread on the film F to form an adhesive adhesive layer 12. The adhesive is made of a thermosetting synthetic resin and has a certain viscosity. Preferably, the present invention uses epoxy resin as the main material of the adhesive layer 12, and other thermosetting epoxy-based polymers can also be used. The present invention is not limited here.

[0078] like Figure 3A 、 3B As shown, after the resin layer 12 is formed on the adhesive film F, the silicon substrate 11 is placed at the position where the silicon substrate 11 is to be adhered, so that the silicon substrate 11 is flatly attached to the surface of the resin layer 12, and the silicon substrate 11 and the resin layer 12 are in a state of adhesion. During this substrate adhesion step, the adhesion between the silicon substrate 11 and the resin layer 12 is greater than the adhesion between the resin layer 12 and the adhesive film F, so that when the silicon substrate 11 is subsequently separated, the resin layer 12 can adhere to the bottom surface of the silicon substrate 11 and detach from the adhesive film F.

[0079] like Figure 4A 、 4BAs shown, the silicon substrate 11 is then cut according to the size to be cut. The cutting operation uses a die cutter to cut a large area into the size to be formed in one go to meet the requirements of subsequent operations. The parts after each cut are collectively referred to as operation blocks B.

[0080] like Figure 5A 、 5B As shown, the pin positioning step includes providing a pin positioning mold D and a plurality of pins 13, wherein the pin positioning mold D includes a plurality of mold cavities 14 for pin positioning, each mold cavity 14 is arranged according to the position where the pin 13 is to be positioned and distributed on the pin positioning mold D, and the size of each mold cavity 14, including the depth / diameter size, is designed according to user requirements. For example, when the pin diameter is 100 μm and the length is 400 μm, the mold cavity diameter must be at least 10-15% larger than the pin, that is, about 110-115 μm, so that the pin can be placed, and the mold cavity depth is slightly longer than the pin length. 1 / 4 to 3 / 5 of the degree, which is approximately 100 to 240 μm. The aforementioned dimensions are only estimates, and the specific design is still based on the design drawings. The pins 13 are manually or mechanically arranged in each mold cavity 14, and after each pin 13 is arranged in the corresponding mold cavity, each pin will partially protrude from the surface of the pin positioning mold. The length of each pin protruding from the surface of the pin positioning mold is defined as the operating height LD. The pin positioning step and the substrate bonding step can be performed at the same time, or one after the other, and there is no order requirement between the two steps.

[0081] like Figure 6A 、 6B As shown, the module installation step includes, after completing the above two steps, manually or mechanically moving the working blocks B to be combined with the corresponding plurality of pins 13. When each working block B is moved, since the silicon substrate 11 and the resin layer 12 have been preliminarily fixed, and the adhesion between the resin layer 12 and the film F is relatively weak, when each working block B moves toward the pin positioning mold D, the resin layer 12 will easily separate from the film F and finally move to the top of the pin positioning mold D where the pins 13 are placed for positioning. After the positioning is completed, the position of each working block B is moved downward so that each working block B is joined with the corresponding pins 13 to be combined. Since the pins 13 are evenly distributed on the pin positioning mold D, when the resin layer 12 of each working block B is joined with the pins 13, the resin layer 12 can sink due to gravity and cover the top of each pin 13 or the position above the working height LD of each pin 13.

[0082] like Figure 7A 、 7BAs shown in 8A and 8B, the module assembly steps include: after the above-mentioned process is completed, each working block B is respectively positioned corresponding to each pin 13 to be joined, and pressure is applied downward through the pressure plate P. The amount of pressure depends on the number and size of the pins 13. When each working block B continues to move downward under the influence of the gravity of the pressure plate P, the top of each pin 13 may pass through the resin layer 12 until it hits the surface where the silicon substrate 11 and the resin layer 12 are bonded, so that each pin 13 can appropriately penetrate into the resin layer 12. When the working height LD of each pin 13 may be different in length, some pins 13 may not necessarily touch the surface of the silicon substrate 11, but can penetrate into the resin layer 12, so that the resin layer 12 firmly covers each pin 13. In this way, the pins 13 can be leveled outside the resin layer 12, overcoming the problem of different working heights LD of each pin 13.

[0083] During this module assembly step, each operation block B may be moved multiple times according to production requirements. The pin positioning molds D moved to different positions may be equipped with different pin 13 configurations and combined with positions in different blocks. It is also possible that the pins may be combined with pins having various operation heights LD according to different requirements. The present invention is not limited to this.

[0084] like Figure 8A 、 8B As shown, after completing the above steps, the adhesive layer 12 of each operation block B has been combined with the pins 13 to be combined, that is, the pre-formed interposer electronic modules M have been completed in batches. Each interposer electronic module M includes a silicon substrate 11, an adhesive layer 12 and at least one pin 13. At this time, each interposer electronic module M is placed in an oven and baked at 165 to 180 degrees for about 2 to 6 hours. Because each adhesive layer 12 is a thermosetting resin, it reaches the curing transformation temperature point when heated, and can then strengthen and fix each pin 13 and the silicon substrate 11. Finally, the adhesive layer 12 has been fixed and the formed interposer electronic module M can be obtained. Because the composition of the adhesive layer is cured and irreversible after heating, each pin has better reliability in the fixed state.

[0085] In the above process, the process of cutting into work blocks can also be arranged in the module assembly step or the silicon substrate bonding step according to needs. That is, the previous process is all done with the entire silicon substrate and multiple pins, and the final finished product cutting is carried out before or after the final baking and fixing process is completed. The same effect can also be achieved. The present invention is not limited here.

[0086] like Figures 9A to 12As shown, in the second embodiment of the present invention, another method for manufacturing an interposer electronic module for a semiconductor interposer process is disclosed, which is roughly similar to the manufacturing method of the first embodiment, wherein the main difference is that the order of each process is different. The differences are explained below.

[0087] like Figure 9A 、 9B As shown in Figure 9C, first, in the substrate adhesion step A, it is not necessary to adhere the adhesive film on the surface of the silicon substrate 11. The silicon substrate 11 is placed flat, and then the resin layer 12 is coated on the surface of the silicon substrate 11. In the pin positioning step A, the adhesive film F is first adhered to the bottom of the pin positioning mold D, and then the plurality of pins 13 are placed in the pin positioning mold D respectively, and the bottom of each pin 13 is adhered to the adhesive film F.

[0088] like Figure 10A 、 Figure 10B As shown, in the module installation step A, the pin positioning mold D and each pin 13 are moved. The pin positioning mold D is turned over manually or mechanically, and each pin 13 is fixed with a film F to prevent each pin 13 from being separated from the pin positioning mold D. Finally, the pin positioning mold D is moved so that each pin 13 faces the silicon substrate 11 coated with the resin layer 12, so that each pin 13 is inserted into the resin layer 12.

[0089] like Figure 11 、 Figure 12 As shown, finally, in the module assembly step, the pin positioning mold D, each pin 13, the resin layer 12 and the silicon substrate 11 are subjected to downward pressure through the pressing plate P, and are placed in an oven for baking to reach the curing transformation temperature of the resin layer 12, so that each pin 13 and the resin layer 12 are cured and shaped, and finally the film F and the pin positioning mold D are removed to form a pre-formed intermediate layer electronic module M, and finally cut as required to form a plurality of intermediate layer electronic modules M described in the present invention.

[0090] Although the second embodiment of the present invention is similar to the background technology, it can actually overcome the defect of the existing reflow that makes it difficult for the solder to connect to the substrate through the provision of the resin layer 12, and solve the problem of different operating heights LD of each pin, thus breaking through the defects of the existing technology.

[0091] The present invention successfully overcomes the following difficulties in existing production technologies through the interposer electronic module and its manufacturing method:

[0092] 1. The pins 13 of the interposer electronic module M of the present invention are connected to the silicon substrate 11 through a resin layer 12 of (thickness description). The resin layer 12 is first formed on the surface of the silicon substrate 11, and then the resin layer 12 and the pins 13 are fixed by hot pressing. In the interposer electronic module M manufactured in this way, the surface of the silicon substrate 11 and the resin layer 12 will not have the problem of uneven coating thickness or insufficient thickness. Each pin 13 can also be coated by the resin layer 12 bonded to the surface of the silicon substrate 11, so that the pin 13 is more firmly connected to the surface of the silicon substrate 11.

[0093] 2. The manufacturing method of the present invention can reduce the shortcomings of the prior art in the production process due to uneven solder coating or insufficient thickness. When the resin layer 12 is coated on the silicon substrate 11 in advance and pressed down on the pins 13, because the pins 13 are densely distributed and the coating area of ​​the resin layer 12 is large, the pressure on each pin 13 is the same, and there is no difference in weight. As a result, when the pins 13 and the resin layer 12 are bonded, the bending, deformation or tilting of the pins 13 is greatly reduced, and the strength of the connection between each pin 13 and the resin layer 12 is also high, which can greatly reduce the scrap rate in the production process.

[0094] 3. The manufacturing method of the present invention can also be applied to pins 13 with small spacing, small diameter and longer diameter. Since the existing process requires tinning on the substrate first, and the working spacing required for tinning is relatively large, and if the diameter of each pin 13 is too small, tinning is not easy to fix the pin 13 on the substrate, because the thickness of the tin plating on the pin 13 is limited, and when the length of the pin 13 becomes longer, the pin 13 is prone to tipping over due to gravity or insufficient solder adhesion. In the process of the present invention, because the process of plating tin and flux on the silicon substrate 11 is omitted, the resin layer 12 of the present invention can cover longer, denser and smaller diameter pins 13, thereby improving production efficiency and precision, and ultimately effectively improving overall production capacity and quality.

[0095] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any other manner. Any person skilled in the art may utilize the above-disclosed technical content to modify or modify the present invention into equivalent embodiments. However, any simple modifications, equivalent variations, and modifications to the above embodiments that do not depart from the technical content of the present invention and are based on the technical essence of the present invention remain within the scope of protection of the present invention.

Claims

1. An interposer electronic module for a semiconductor interposer process, characterized in that: include: A silicon substrate, which uses silicon material as a base and has a thickness and a first surface; a resin layer uniformly distributed and bonded to the first surface of the silicon substrate, having a layer thickness and including a working surface, wherein the resin layer is made of a thermosetting synthetic resin; At least one pin is made of a metal conductive material and is combined with the working surface of the resin layer. The pin is protruded from the working surface of the resin layer to define a connection height.

2. The interposer electronic module for semiconductor interposer manufacturing process according to claim 1, wherein: The intermediate layer electronic module may be provided with a plurality of pins, and the connection heights of the pins are the same.

3. The interposer electronic module for semiconductor interposer manufacturing process according to claim 1, wherein: One end of the at least one pin contacts the first surface of the silicon substrate.

4. A method for manufacturing an interposer electronic module for a semiconductor interposer process according to any one of claims 1 to 3, characterized in that: include: The silicon substrate bonding step is to coat the film with a resin layer and fix the silicon substrate on the resin layer to form a working block; A pin positioning step, positioning each pin in a pin positioning mold; The module installation step involves moving the work block to a pin positioning mold with pins for alignment and positioning, and moving the work block so that the resin layer of the silicon substrate is bonded to the corresponding pins; and In the module assembly step, after the above steps are completed, the silicon substrate is pressed with a pressing plate, and the working block combined with each pin is heated to the curing temperature of the resin layer, and then cured to form an intermediate layer electronic module.

5. The method for manufacturing an interposer electronic module for a semiconductor interposer process according to claim 4, wherein: In the silicon substrate adhering step, the silicon substrate is cut into the working blocks according to the size to be cut.

6. The method for manufacturing an interposer electronic module for a semiconductor interposer process according to claim 4, wherein: In the module assembly step, the silicon substrate is cut into the working blocks according to the size to be cut.

7. The method for manufacturing an interposer electronic module for a semiconductor interposer process according to claim 4, wherein: During the module assembly step, the top of each pin passes through the resin layer, and part of the pin can abut against the surface where the silicon substrate and the resin layer are bonded.

8. A method for manufacturing an interposer electronic module for a semiconductor interposer process according to any one of claims 1 to 3, characterized in that: include Silicon substrate adhesion step, coating the surface of the silicon substrate to form a resin layer; A pin positioning step, positioning each pin in a pin positioning mold; A module installation step comprises aligning and positioning a pin positioning mold with each pin on the silicon substrate, and moving the pin positioning mold so that the resin layer of the silicon substrate is bonded to the corresponding pins; and In the module assembly step, after the above steps are completed, the pin positioning mold is pressed with a pressing plate, and the silicon substrate combined with each pin is heated to the curing temperature of the resin layer, and then cured to form an intermediate layer electronic module.

9. The method for manufacturing an interposer electronic module for a semiconductor interposer process according to claim 7, wherein: During the module assembly step, the top of each pin can pass through the resin layer, and part of the pin can touch the surface where the silicon substrate and the resin layer are bonded.

10. The method for manufacturing an interposer electronic module for a semiconductor interposer process according to claim 7, wherein: In the module assembly step, the silicon substrate of the interposer electronic module is cut and shaped according to the size to be cut.

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