Electronic module assembly, manufacturing method thereof and electronic equipment

Abstract

The invention discloses an electronic module assembly, a manufacturing method thereof and electronic equipment, and relates to the technical field of electronic devices. An electronic component on the substrate; the connector is positioned between the substrate and the electronic element and is used for electrically connecting the substrate and the electronic element; the connector comprises an elastic terminal; the first end part of the elastic terminal is in contact with the substrate, and the second end part is in contact with the electronic element; and the detachable structural member is positioned at the periphery of the connector and is used for penetrating through the substrate and fixing the substrate and the electronic element. In this way, a welding process depended in traditional electronic connection is omitted, the assembly assembling process is more efficient and safer, the first end of the elastic terminal can be in stable and reliable electrical contact with the substrate and the second end of the elastic terminal can be in stable and reliable electrical contact with the electronic element all the time under the fastening effect of the detachable structural part, and the reliability of the assembly is improved. The connection performance and the working stability of the whole assembly are ensured, and the later maintenance of the assembly and the replacement of parts become more convenient and efficient.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic devices, and in particular to an electronic module assembly, a manufacturing method thereof, and an electronic device. Background Art

[0002] Connectors are electromechanical components that enable circuits to connect and disconnect. In traditional electronic products, connectors for electronic components on circuit boards are typically soldered to the board via solder balls at the bottom, with elastic pins at the top contacting the chip, enabling signal transmission from the electronic component to the board. However, the continuous vibration of electronic products after powering on can easily cause poor contact between the metal springs, resulting in short circuits. Furthermore, poor soldering quality at the bottom solder balls can lead to insufficient solder joint strength, making them susceptible to signal loss under external forces. Summary of the Invention

[0003] The present invention provides an electronic module assembly and a manufacturing method thereof, and an electronic device, which can achieve stable contact and eliminate the need for a welding process.

[0004] The present invention provides an electronic module assembly, comprising: substrate; electronic components located on the substrate; A connector located between the substrate and the electronic component and used to electrically connect the substrate and the electronic component; the connector includes a spring terminal; The first end of the elastic terminal contacts the substrate, and the second end contacts the electronic component; A detachable structural member is located around the connector and is used to penetrate the substrate to fix the substrate and the electronic component.

[0005] The present invention also provides a method for manufacturing an electronic module assembly, comprising: aligning the first end portion of the elastic terminal of the connector with the contact point of the substrate; Placing an electronic component at a preset position on the substrate so that a contact point of the electronic component is aligned with the second end of the elastic terminal to form an electrical path; The detachable structural member is passed through the fixing hole on the substrate, and the substrate and the electronic component are fixed.

[0006] The present invention also provides an electronic device comprising the above-mentioned electronic module assembly.

[0007] The electronic module assembly provided by the present invention completely eliminates the welding process relied upon in traditional electronic connections by combining a detachable structural member with an elastic terminal. This not only saves the equipment investment and technical threshold required for welding, but also fundamentally avoids the risks of cold solder joints, leaky solder joints, and damage to the substrate and electronic components caused by high welding temperatures, making the assembly process more efficient and safer. Moreover, under the tightening action of the structural member, the first end of the elastic terminal can always maintain stable and reliable electrical contact with the substrate, and the second end can always maintain stable and reliable electrical contact with the electronic component, ensuring the overall connection performance and working stability of the assembly. When the connector fails and requires maintenance, there is no need to perform a complex and easily damaged desoldering operation like a traditional welded connector. Instead, the connector can be quickly removed and replaced by disassembling the detachable structural member, which greatly reduces the maintenance difficulty and operational risks, shortens the maintenance cycle, and makes the subsequent maintenance and replacement of components of the assembly more convenient and efficient, further improving the practicality of the entire electronic module assembly.

[0008] In addition, the present invention also provides a corresponding manufacturing method and electronic equipment for the electronic module assembly, which has the same or corresponding technical features as the above-mentioned electronic module assembly and has the same effects as above. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] In order to more clearly illustrate the embodiments of the present invention, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0010] Figure 1 A schematic diagram of the structure of an electronic module assembly provided in an embodiment of the present invention; Figure 2 One of the structural diagrams of the elastic terminal provided by an embodiment of the present invention; Figure 3 A second structural diagram of the elastic terminal provided by an embodiment of the present invention; Figure 4 The third structural diagram of the elastic terminal provided by the embodiment of the present invention; Figure 5 A fourth structural diagram of the elastic terminal provided by an embodiment of the present invention; Figure 6 A fifth structural diagram of the elastic terminal provided in an embodiment of the present invention; Figure 7 A sixth structural diagram of the elastic terminal provided by an embodiment of the present invention; Figure 8 The seventh structural diagram of the elastic terminal provided by the embodiment of the present invention; Figure 9 The eighth structural diagram of the elastic terminal provided by the embodiment of the present invention; Figure 10 A flow chart of a method for manufacturing an electronic module assembly provided in an embodiment of the present invention.

[0011] Among them, 1 is a substrate, 2 is an electronic component, 3 is an elastic terminal, 4 is a detachable structural component, 5 is a first metal layer, 6 is a second metal layer, 11 is a first soldering pad, and 21 is a second soldering pad. DETAILED DESCRIPTION

[0012] Connectors are electromechanical components that connect conductors (wires) to mating components, completing circuits. Their use simplifies design and production processes, increases flexibility, and reduces production and maintenance costs, leading to their widespread adoption across various industries. Socket connectors for chips on circuit boards are essential components in electronic products. These include sockets for central processing units (CPUs), graphics processing units (GPUs), flash memory, and memory connectors. These connectors are typically soldered to the circuit board using solder balls at the bottom end. Flexible pins are located at the top end, and the chip is installed in the socket, contacting the flexible pins to facilitate signal transmission from the chip to the circuit board. However, these connectors have drawbacks: Continuous vibration after powering on an electronic product can easily cause poor contact between the metal springs and cause circuit breakage; poor soldering quality on the terminal pins can lead to insufficient solder joint strength, making them susceptible to signal interruption due to external forces; and traditional sockets are soldered together, so if a terminal breaks or a pin collapses, the socket or even the entire circuit board must be replaced. To address these technical issues, the present invention provides an electronic module assembly.

[0013] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.

[0014] It should be noted that, in the description of the present invention, the terms "comprises," "includes," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, method, article, or apparatus comprising a series of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus. The terms "first," "second," etc., in the present invention are used to distinguish similar objects, and are not used to describe a particular order or precedence.

[0015] In order to enable those skilled in the art to better understand the solutions of the present invention, the present invention is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0016] An embodiment of the present invention provides an electronic module assembly. Figure 1 A schematic diagram of the structure of the electronic module assembly provided in an embodiment of the present invention is shown in FIG. Figure 1 As shown, the electronic module assembly includes: substrate1; an electronic component 2 located on a substrate 1; A connector located between the substrate 1 and the electronic component 2 and used to electrically connect the substrate 1 and the electronic component 2; the connector includes a spring terminal 3; The first end of the elastic terminal 3 contacts the substrate 1 , and the second end contacts the electronic component 2 ; A detachable structural member 4 is located around the connector and is used to penetrate the substrate 1 to fix the substrate 1 and the electronic component 2.

[0017] In the electronic module assembly provided by the embodiment of the present invention, by combining a detachable structural member 4 with an elastic terminal 3, the welding process relied upon in traditional electronic connections is completely eliminated. This not only saves the equipment investment and technical threshold required for welding, but also fundamentally avoids the risk of cold solder joints, leaky solder joints, and damage to the substrate 1 and electronic components 2 caused by high welding temperatures, making the assembly process more efficient and safer. Moreover, under the tightening action of the structural member, the first end of the elastic terminal 3 can always maintain stable and reliable electrical contact with the substrate 1, and the second end can always maintain stable and reliable electrical contact with the electronic components 2, ensuring the overall connection performance and operational stability of the assembly. When the connector fails and requires maintenance, there is no need to perform a complex and easily damaged desoldering operation like a traditional soldered connector. Instead, the connector can be quickly removed and replaced by disassembling the detachable structural member 4. This significantly reduces the maintenance difficulty and operational risks, shortens the maintenance cycle, and makes the subsequent maintenance and component replacement of the assembly more convenient and efficient, further improving the practicality of the entire electronic module assembly.

[0018] It should be noted that substrate 1 can be a printed circuit board (PCB), which not only provides stable mechanical support for the entire assembly, but also features prefabricated conductive traces on its surface that serve as the basic carrier for electrical signal transmission. Electronic component 2 can be a chip (such as a computing chip or memory chip). A connector plays a crucial role in the electrical connection between substrate 1 and electronic component 2, acting as a signal bridge. The connector's core conductive component is the elastic terminal 3, which possesses inherent elastic properties and generates continuous contact pressure through deformation. This ensures that the first end closely adheres to the conductive area on substrate 1's surface and the second end stably contacts the pad of electronic component 2, enabling reliable current and signal transmission between the two and preventing functional failures caused by poor contact. The elastic terminal 3 can be further secured with a plastic housing. In addition, the detachable structural member 4 (such as a screw, a snap-on fixing column, etc.) that passes through the substrate 1 is an assembly fixture of the component. It can fix the substrate 1, the electronic component 2, and the elastic terminal 3 together from a mechanical level: on the one hand, through continuous tightening force, the elastic terminal 3 always maintains sufficient contact pressure, further ensuring the stability of the electrical connection; on the other hand, the detachable design also provides convenience for later maintenance. If there is a problem with the electronic component 2 or the connector, there is no need to destroy the entire component. You only need to disassemble the detachable structural member 4 to replace the faulty component separately, taking into account both assembly reliability and maintenance flexibility.

[0019] Furthermore, in a specific implementation, in the above-mentioned electronic module assembly provided in the embodiment of the present invention, if Figure 1 As shown, a first contact portion is provided at the end of the first end of the elastic terminal 3; a first pad 11 is provided on the side of the substrate 1 facing the electronic component 2; the first contact portion is in contact with the first pad 11; a second contact portion is provided at the end of the second end of the elastic terminal 3; a second pad 21 is provided on the side of the electronic component 2 facing the substrate 1; and the second contact portion is in contact with the second pad 21.

[0020] In practice, a first contact portion can be provided at the end of the first end of the elastic terminal 3. A first pad 11 for signal and current transmission is prefabricated on the surface of the substrate 1 facing the electronic component 2. The first contact portion directly contacts the first pad 11, forming a conductive path between the elastic terminal 3 and the substrate 1. Similarly, a second contact portion can be provided at the end of the second end of the elastic terminal 3. A second pad 21 is correspondingly provided on the surface of the electronic component 2 facing the substrate 1. The second contact portion directly contacts the second pad 21, forming a conductive connection between the elastic terminal 3 and the electronic component 2. This targeted adaptation of the contact portion and the pad significantly improves contact accuracy and fit, avoiding problems such as signal attenuation and current instability caused by misalignment or insufficient contact area, and ensuring the reliability of the electrical connection between the substrate 1 and the electronic component 2. Furthermore, combined with the elastic properties of the elastic terminal 3, the contact portion can generate consistent and appropriate contact pressure with the pad. Even if the component undergoes slight deformation due to vibration or temperature changes during use, the elastic compensation can maintain stable contact, reducing the risk of poor contact.

[0021] It should be noted that the structure and form of the elastic terminal 3 of the present invention can be implemented in a variety of ways, which are described below.

[0022] In one embodiment, in a specific implementation, in the above-mentioned electronic module assembly provided in an embodiment of the present invention, the first contact portion can be a first arc-shaped structure formed by bending inward at the end of the first end of the elastic terminal 3; the second contact portion can be a second arc-shaped structure formed by bending inward at the end of the second end of the elastic terminal 3; the first arc structure and the second arc structure are independent of each other or intersecting with each other.

[0023] In implementation, in the contact structure design of the elastic terminal 3, the first contact portion can be formed by bending the end of the first end portion of the elastic terminal 3 toward the inside of the terminal itself, and finally forming a first arc-shaped structure with a certain curvature; the second contact portion adopts the same inward bending process to process the second arc-shaped structure at the end of the second end portion of the elastic terminal 3.

[0024] Figure 2 This is one of the structural diagrams of the elastic terminal provided by the embodiment of the present invention. Figure 2 As shown, the end of the first end of the elastic terminal 3 is bent inward to form a first arc structure; the end of the second end of the elastic terminal 3 is bent inward to form a second arc structure; the first arc structure and the second arc structure are independent of each other, that is, the first arc structure and the second arc structure each maintain a complete arc and do not interfere with each other, and respectively correspond to the first pad 11 of the substrate 1 and the second pad 21 of the electronic component 2.

[0025] Figure 3This is a second structural diagram of the elastic terminal provided by an embodiment of the present invention. Figure 3 As shown, the end of the first end of the elastic terminal 3 is bent inward to form a first arc structure; the end of the second end of the elastic terminal 3 is bent inward to form a second arc structure; the first arc structure and the second arc structure are in a mutually intersecting form, that is, the first arc structure and the second arc structure form a cross layout in space, and the contact position and pressure distribution are further optimized through the staggered crossing.

[0026] The first and second arc structures formed by the inward bending of the present invention, whether independent or intersecting, can rely on the elastic properties of the arc surface to form a tight and cushioned contact with the substrate 1, the first solder pad 11, and the second solder pad 21 of the electronic component 2. If they are independent, the first and second arc structures each correspond to a dedicated solder pad without spatial interference, making it easy to detect the conduction state separately. During later maintenance, contact problems can be specifically checked, and the detachable structural parts are used to improve maintenance efficiency. If they are intersecting, the first and second arc structures form a mutually supporting structure on the inner side of the terminal, which can enhance the overall rigidity of the elastic terminal 3, reduce structural deviation caused by external impact, and further improve long-term reliability. The inward bending design can also avoid interference between the outer side of the terminal and surrounding components, adapting to compact installation space.

[0027] Furthermore, in a specific implementation, in the above-mentioned electronic module assembly provided in an embodiment of the present invention, the first arc structure and the second arc structure can both be single arc structures; or; the first arc structure and the second arc structure can both be at least two continuous arc structures; when the first arc structure and the second arc structure are both at least two continuous arc structures, and the first arc structure and the second arc structure are in a mutually intersecting form, the arc structure at the end of the first arc structure and the arc structure at the end of the second arc structure intersect with each other.

[0028] Figure 4 This is a third structural diagram of the elastic terminal provided by an embodiment of the present invention. Figure 4 As shown, in a mutually independent state, the first arc-shaped structure and the second arc-shaped structure are both two continuous arc-shaped structures.

[0029] Figure 5 This is a fourth structural diagram of the elastic terminal provided by an embodiment of the present invention. Figure 5 As shown, in the mutually intersecting form, the first arc-shaped structure and the second arc-shaped structure are both two continuous arc-shaped structures.

[0030] In implementation, the first arc-shaped structure and the second arc-shaped structure can be flexibly designed as a single arc (corresponding to a single contact) or at least two continuous arcs (corresponding to double contacts or multiple contacts). Figure 2 and Figure 3All correspond to single contacts. Figure 4 and Figure 5 Both correspond to double contacts. When a single arc structure is adopted, the single contact design can form a precise and stable single-point contact with the pad through the elastic deformation of the arc surface. It has a simple structure and low manufacturing cost, and is suitable for scenarios with moderate requirements for contact reliability and limited installation space. When at least two continuous arc structures are adopted, the layout of double contacts or multiple contacts can form redundant contacts. Even if a certain contact has poor contact due to wear or stains, the other contacts can still maintain a conductive path, greatly improving the stability of the electrical connection between the substrate 1 and the electronic component 2. When the two are at least two continuous arc structures and intersect with each other, the design of only the end arc crossing can not only enhance the overall rigidity of the terminal and reduce the displacement caused by external impact with the help of the cross structure, but also ensure contact stability through multiple contacts, while taking into account both structural stability and connection reliability.

[0031] In another embodiment, in a specific implementation, in the above-mentioned electronic module assembly provided in an embodiment of the present invention, the first contact portion can be a third arc structure formed by bending outward at the end of the first end of the elastic terminal 3; the second contact portion can be a fourth arc structure formed by bending outward at the end of the second end of the elastic terminal 3; the third arc structure and the fourth arc structure are independent of each other or intersecting with each other.

[0032] In implementation, in the contact structure design of the elastic terminal 3, the first contact portion can be formed by bending the end of the first end of the elastic terminal 3 toward the outside of the terminal, and finally forming a third arc structure with a certain curvature; the second contact portion adopts the same outward bending process to process a fourth arc structure at the end of the second end of the elastic terminal 3.

[0033] Figure 6 This is a fifth structural diagram of the elastic terminal provided by the embodiment of the present invention. Figure 6 As shown, the end of the first end of the elastic terminal 3 is bent outward to form a third arc structure; the end of the second end of the elastic terminal 3 is bent outward to form a fourth arc structure; the third arc structure and the fourth arc structure are independent of each other, that is, the third arc structure and the fourth arc structure each maintain a complete arc and do not interfere with each other, and respectively correspond to the first pad 11 of the substrate 1 and the second pad 21 of the electronic component 2.

[0034] Figure 7 This is a sixth structural diagram of the elastic terminal provided by an embodiment of the present invention. Figure 7As shown, the end of the first end of the elastic terminal 3 is bent outward to form a third arc structure; the end of the second end of the elastic terminal 3 is bent outward to form a fourth arc structure; the third arc structure and the fourth arc structure are in a mutually intersecting form, that is, the third arc structure and the fourth arc structure form a cross layout in space, and the contact position and pressure distribution are further optimized through the staggered crossing.

[0035] The third arc structure and the fourth arc structure formed by outward bending of the present invention, in an independent form, the arc does not need to occupy the inner space of the terminal, and can reserve more design margins for the terminal body. It is especially suitable for scenarios where the distance between the substrate 1 and the electronic component 2 is small, reducing the probability of interference with surrounding components, and the independent arc corresponds to a dedicated solder pad, which is convenient for separate detection and maintenance, thereby improving connection reliability; in the cross form, the arcs cross in space to form a mutually supporting mechanical structure, making the terminal structure more stable, and can effectively resist the displacement caused by vibration and impact, thereby extending the service life. However, it should be noted that the antenna effect will be greater than the independent form. However, the cross design can optimize the distribution of contact points and achieve a compact layout in a limited space.

[0036] Furthermore, in a specific implementation, in the above-mentioned electronic module assembly provided in an embodiment of the present invention, the third arc structure and the fourth arc structure can both be a single arc structure; or; the third arc structure and the fourth arc structure can both be at least two continuous arc structures; when the third arc structure and the fourth arc structure are both at least two continuous arc structures, and the third arc structure and the fourth arc structure are in a mutually intersecting form, the arc structure at the end of the third arc structure and the arc structure at the end of the fourth arc structure intersect with each other.

[0037] Figure 8 This is the seventh structural diagram of the elastic terminal provided by the embodiment of the present invention. Figure 8 As shown, in a mutually independent state, the third arc-shaped structure and the fourth arc-shaped structure are both two continuous arc-shaped structures.

[0038] Figure 9 This is the eighth structural diagram of the elastic terminal provided by the embodiment of the present invention. Figure 9 As shown, in the mutually intersecting form, the third arc-shaped structure and the fourth arc-shaped structure are both two continuous arc-shaped structures.

[0039] In implementation, the third arc-shaped structure and the fourth arc-shaped structure can also be flexibly designed as a single arc (corresponding to a single contact) or at least two continuous arcs (corresponding to double contacts or multiple contacts). Figure 6 and Figure 7 All correspond to single contacts. Figure 8 and Figure 9Both correspond to double contacts. The single-contact design of a single arc structure, the outward-convex arc can form a natural fit contact with the pad, without occupying the inner space of the terminal, adapting to the compact layout with a small distance between the substrate 1 and the electronic component 2. At the same time, the elasticity of the arc can buffer the contact fluctuations caused by vibration, ensuring the basic connection stability. When at least two continuous arc structures are adopted, the double-contact or multi-contact design can disperse the contact pressure and current load, avoid overheating or excessive wear of a single contact due to excessive current, extend the service life of the terminal, and multiple contacts can reduce the probability of poor contact, which is suitable for high current transmission or high-frequency signal transmission scenarios. When the two are at least two continuous arc structures and intersect with each other, the structure in which only the end arc crosses can not only use the cross shape to improve the overall stability of the terminal and resist external impact, but also enhance contact reliability through multiple contacts. At the same time, the outward-bending design can reduce interference with surrounding components, and the limited design of the end arc crossing can also reduce the antenna effect caused by excessive arc crossing while ensuring structural stability, balancing connection performance, structural stability and spatial adaptability.

[0040] It should be noted that the elastic terminals 3 can all be made of a metal material with strong elasticity, such as a copper-nickel alloy, which can ensure sufficient contact pressure after repeated pressing and rebound, ensuring connection stability. In the structural design of the elastic terminal 3, although it can make the terminal fit more closely with the corresponding interface, it helps to reduce contact resistance and reduce energy loss in signal transmission (this is particularly critical for high-frequency signal transmission), it will cause the terminal's ability to resist external forces to decrease, making it prone to deformation or even breakage, affecting mechanical stability and service life; when the bending angle is too large, although it can enhance the mechanical strength of the terminal, it may reduce the contact area and increase contact resistance, thereby affecting the current or signal transmission quality. Therefore, in order to balance contact performance and mechanical strength, the bending angle range at the end of the first end and the end of the second end of the elastic terminal 3 in the present invention can be set to within 40 degrees. This range can not only meet the anti-plugging requirements, but also significantly reduce the probability of terminal collapse. In addition, the bending radius directly affects the material fluidity and structural integrity; when the radius is too small (such as R / t<2, R is the radius, t is the thickness of the elastic terminal 3), the material elongation exceeds the extension limit, and problems such as wall thinning and cracking are prone to occur, significantly weakening the tensile strength; on the contrary, if the radius is too large (such as R / t>5), it will cause material accumulation in the bending area, resulting in unnecessary wrinkles or loosening, affecting the terminal insertion force and long-term reliability. Therefore, the bending radius of the present invention can be set to a range of three to five times the thickness of the elastic terminal 3, and the material here can be selected from soft materials such as copper alloy. If the elastic terminal 3 uses a highly elastic material such as beryllium copper, the radius can be appropriately reduced to improve space utilization.

[0041] Furthermore, in a specific implementation, in the above-mentioned electronic module assembly provided in the embodiment of the present invention, if Figure 1As shown, it can also include: a first metal layer 5 located on the side of the electronic component 2 away from the substrate 1; the size of the first metal layer 5 is larger than the size of the electronic component 2; a second metal layer 6 located on the side of the substrate 1 away from the electronic component 2; the size of the second metal layer 6 is larger than the size of the electronic component 2; a detachable structural member 4 is used to penetrate the first metal layer 5, the second metal layer 6 and the substrate 1 and fix the first metal layer 5 and the second metal layer 6.

[0042] In practice, a first metal layer 5, located on the side of the electronic component 2 facing away from the substrate 1 and larger than the electronic component 2, and a second metal layer 6, located on the side of the substrate 1 facing away from the electronic component 2 and also larger than the electronic component 2, in conjunction with a detachable structural member 4 extending through the three, form a stable bidirectional clamping structure. Because both metal layers are larger than the electronic component 2, the structural member's tightening force is evenly distributed across the metal layer surfaces, preventing localized pressure concentration from causing deformation or damage to the electronic component 2 or substrate 1. Furthermore, the structure effectively resists external shock and vibration to which the assembly is subjected during transportation, installation, or use, reduces relative displacement between the electronic component 2 and substrate 1, and further ensures stable contact of the elastic terminal 3. Furthermore, the first metal layer 5 and the second metal layer 6 serve as heat dissipation carriers, shielding them from external electromagnetic interference to a certain extent, or reducing the impact of electromagnetic radiation generated by the electronic component 2 on the outside world. In addition, the design of the detachable structural part 4 retains the convenience of maintenance. When it is necessary to inspect or replace the electronic components 2, connectors and other parts, it is only necessary to disassemble the structural part to separate the first metal layer 5 and the substrate 1. The operation is simple and will not cause destructive damage to the metal layer, substrate 1 and electronic components 2, taking into account the long-term stability of the components and the flexibility of subsequent maintenance.

[0043] Furthermore, in a specific implementation, in the above-mentioned electronic module assembly provided in an embodiment of the present invention, the detachable structural component 4 may include a screw and a nut; the screw is used to penetrate the first metal layer 5, the second metal layer 6 and the substrate 1; the nut is used to clamp and fix the first metal layer 5 and the second metal layer 6 by applying an axial pre-tightening force through engagement with the thread of the screw, so as to fix the substrate 1 and the electronic component 2.

[0044] It should be noted that axial preload refers to the clamping force applied to the connected components along the screw's axis by tightening the nut in a threaded connection (such as a screw and nut). In practice, the detachable structural member 4 utilizes a screw and nut combination design, where the screw penetrates the first metal layer 5, the second metal layer 6, and the substrate 1. The nut applies an axial preload through threaded engagement with the screw, firmly clamping the first metal layer 5 and the second metal layer 6. This, in turn, creates a stable, bidirectional clamping of the substrate 1 and the electronic component 2 through the two metal layers. This not only ensures the relative position of the substrate 1 and the electronic component 2 is fixed, preventing displacement caused by vibration and impact, but also ensures that the contact area of ​​the elastic terminal 3 maintains sufficient and uniform contact pressure with the corresponding pad, effectively reducing contact resistance and ensuring a stable electrical connection. Furthermore, the screw and nut threaded connection offers reliable fastening, and the preload can be precisely adjusted as needed, preventing loosening due to insufficient preload and preventing damage to the substrate 1, the electronic component 2, or the metal layers due to excessive preload.

[0045] Through the description of the above implementation methods, those skilled in the art can clearly understand that the method according to the above embodiment can be implemented by means of software plus the necessary general hardware platform, and of course it can also be implemented by hardware, but in many cases the former is a better implementation method.

[0046] An embodiment of the present invention also provides a method for manufacturing an electronic module assembly. Figure 10 Flowchart of the method for manufacturing an electronic module assembly provided by an embodiment of the present invention. Figure 10 As shown, the manufacturing method of the electronic module assembly may include: S1. Align the first end of the elastic terminal of the connector with the contact point of the substrate.

[0047] It should be noted that before executing step S1, the following steps may also be performed: cleaning the substrate to remove surface oil, impurities, or oxide layers, ensuring that functional areas such as pads and fixing holes on the substrate are clean and have good conductivity. Checking the integrity of the pins or contact points of the electronic components to confirm their compatibility with the connector (such as pin spacing, contact method, etc.). Preparing the connector and elastic terminals to ensure that the first end (the end that contacts the substrate) and the second end (the end that contacts the electronic component) of the elastic terminals are intact and that their elastic properties meet design requirements (such as bending angle, rebound coefficient, etc.). Preparing detachable structural parts (such as screws, clips, locating pins, etc.) and confirming that their dimensions match the fixing holes on the substrate and electronic components.

[0048] When executing step S1, the first end of the elastic terminal of the connector can be aligned with the corresponding pad on the substrate according to the design position. Through elastic contact (using the elastic force of the terminal itself to fit), the first end of the elastic terminal and the substrate are stably electrically connected.

[0049] S2. Placing the electronic component at a preset position on the substrate so that the contact point of the electronic component is aligned with the second end of the elastic terminal to form an electrical path.

[0050] During step S2, the electronic component is placed at a predetermined position on the substrate, aligning the contact point (e.g., solder pad) of the electronic component with the second end of the connector's flexible terminal. By applying appropriate pressure (or leveraging the terminal's elastic self-adhesion), the second end of the flexible terminal is brought into close contact with the contact point of the electronic component, forming an electrical path. At this point, the flexible terminal must maintain a certain degree of elastic deformation to accommodate minor displacements during assembly or use, ensuring continuous electrical contact. The flexible terminal can be further secured with a plastic housing.

[0051] S3. Insert the detachable structural member through the fixing hole on the substrate and fix the substrate and the electronic components.

[0052] During step S3, insert a detachable structural member (such as a screw) through the fixing hole on the substrate. Mechanically secure the substrate and electronic components to the structural member according to the designed torque or assembly requirements to prevent relative displacement between them under conditions such as vibration and shock, while also ensuring that the electrical connection of the elastic terminals is not affected (allowing space for elastic deformation of the terminals). After securing, check the overall stability to ensure there is no looseness or skew, and that the structural member does not compress the elastic terminals.

[0053] In the manufacturing method of the electronic module assembly provided in the embodiment of the present invention, the electronic module assembly can be manufactured by executing the above steps, completely eliminating the welding process relied on in traditional electronic connections. This not only saves the equipment investment and technical threshold required for welding, but also fundamentally avoids the risks of cold solder joints, leaky solder joints, and damage to the substrate and electronic components caused by high welding temperatures, making the assembly process more efficient and safer. Moreover, under the tightening action of the structural member, the first end of the elastic terminal can always maintain stable and reliable electrical contact with the substrate and the second end with the electronic component, ensuring the overall connection performance and working stability of the assembly. When the connector fails and needs maintenance, there is no need to perform a complex and easily damaged desoldering operation like a traditional welded connector. Instead, the connector can be quickly removed and replaced by disassembling the detachable structural member, which greatly reduces the maintenance difficulty and operational risks, shortens the maintenance cycle, and makes the subsequent maintenance and replacement of components of the assembly more convenient and efficient, further improving the practicality of the entire electronic module assembly.

[0054] Since the embodiments of the manufacturing method of the electronic module assembly correspond to the embodiments of the electronic module assembly, the description of the features of the embodiments corresponding to the manufacturing method of the electronic module assembly can be found in the relevant description of the embodiments corresponding to the electronic module assembly, and will not be repeated here. The invention also has the same beneficial effects as the aforementioned electronic module assembly.

[0055] Furthermore, in a specific implementation, in the manufacturing method of the above-mentioned electronic module assembly provided in an embodiment of the present invention, the side of the substrate facing the electronic component has a first solder pad; step S1 aligns the first end of the elastic terminal of the connector with the contact point of the substrate, which may specifically include: forming a first contact portion at the end of the first end of the elastic terminal; aligning the first contact portion with the contact point of the substrate so that the first contact portion contacts the first solder pad.

[0056] Correspondingly, the side of the electronic component facing the substrate has a second solder pad; step S2 places the electronic component at a preset position on the substrate so that the contact point of the electronic component is aligned with the second end of the elastic terminal, which may specifically include: forming a second contact portion at the end of the second end of the elastic terminal, placing the electronic component at a preset position on the substrate so that the second contact portion contacts the second solder pad.

[0057] In one embodiment, during specific implementation, in the manufacturing method of the above-mentioned electronic module assembly provided in an embodiment of the present invention, a first contact portion is formed at the end of the first end portion of the elastic terminal, which can specifically include: bending inward at the end of the first end portion of the elastic terminal to form a first arc structure to obtain the first contact portion.

[0058] Accordingly, forming the second contact portion at the end of the second end of the elastic terminal may specifically include: bending the end of the second end of the elastic terminal inwardly to form a second arc-shaped structure to obtain the second contact portion; the first arc-shaped structure and the second arc-shaped structure are independent of each other or intersecting with each other. The first arc-shaped structure and the second arc-shaped structure are each a single arc-shaped structure; or the first arc-shaped structure and the second arc-shaped structure are each at least two continuous arc-shaped structures; when the first arc-shaped structure and the second arc-shaped structure are each at least two continuous arc-shaped structures and the first arc-shaped structure and the second arc-shaped structure are intersecting with each other, the arc-shaped structure at the end of the first arc-shaped structure and the arc-shaped structure at the end of the second arc-shaped structure intersect with each other.

[0059] In another embodiment, during specific implementation, in the manufacturing method of the above-mentioned electronic module assembly provided in an embodiment of the present invention, a first contact portion is formed at the end of the first end portion of the elastic terminal, which can specifically include: bending outward at the end of the first end portion of the elastic terminal to form a third arc structure to obtain the first contact portion.

[0060] Accordingly, forming the second contact portion at the end of the second end of the elastic terminal may specifically include: bending the end of the second end of the elastic terminal outward to form a fourth arc-shaped structure to obtain the second contact portion; the first arc-shaped structure and the second arc-shaped structure are independent of each other or intersecting with each other. The third arc-shaped structure and the fourth arc-shaped structure are each a single arc-shaped structure; or the third arc-shaped structure and the fourth arc-shaped structure are each at least two continuous arc-shaped structures; when the third arc-shaped structure and the fourth arc-shaped structure are each at least two continuous arc-shaped structures and the third arc-shaped structure and the fourth arc-shaped structure are intersecting with each other, the arc-shaped structure at the end of the third arc-shaped structure and the arc-shaped structure at the end of the fourth arc-shaped structure intersect with each other.

[0061] Based on the same inventive concept, an embodiment of the present invention further provides an electronic device including the aforementioned electronic module assembly. Since the principles of solving the problem of the electronic device are similar to those of the aforementioned electronic module assembly, the implementation of the electronic device can refer to the implementation of the aforementioned electronic module assembly, and the repeated parts will not be repeated here.

[0062] The electronic module assembly, its manufacturing method, and electronic equipment provided by the present invention are introduced in detail above. Specific examples are used herein to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present invention, several improvements and modifications can be made to the present invention, and these improvements and modifications also fall within the scope of protection of the present invention.

Claims

1. An electronic module assembly, characterized in that: include: substrate; electronic components located on the substrate; A connector located between the substrate and the electronic component and used to electrically connect the substrate and the electronic component; the connector includes a spring terminal; The first end of the elastic terminal contacts the substrate, and the second end contacts the electronic component; A detachable structural member is located around the connector and is used to penetrate the substrate to fix the substrate and the electronic component.

2. The electronic module assembly according to claim 1, wherein: A first contact portion is provided at the tail end of the first end portion of the elastic terminal; The substrate has a first pad on a side facing the electronic component; The first contact portion is in contact with the first pad; A second contact portion is provided at the tail end of the second end portion of the elastic terminal; The electronic component has a second pad on a side facing the substrate; The second contact portion contacts the second pad.

3. The electronic module assembly according to claim 2, characterized in that The first contact portion is a first arc-shaped structure formed by bending inward at the tail end of the first end portion of the elastic terminal; The second contact portion is a second arc-shaped structure formed by bending inward at the tail end of the second end portion of the elastic terminal; The first arc-shaped structure and the second arc-shaped structure are independent of each other or intersecting with each other.

4. The electronic module assembly according to claim 3, characterized in that The first arc-shaped structure and the second arc-shaped structure are both single arc-shaped structures; or the first arc-shaped structure and the second arc-shaped structure are both at least two continuous arc-shaped structures; When the first arc structure and the second arc structure are both at least two continuous arc structures, and the first arc structure and the second arc structure are in a mutually intersecting form, the arc structure at the end of the first arc structure and the arc structure at the end of the second arc structure intersect with each other.

5. The electronic module assembly according to claim 2, characterized in that: The first contact portion is a third arc-shaped structure formed by bending outward at the tail end of the first end portion of the elastic terminal; The second contact portion is a fourth arc-shaped structure formed by bending outward at the tail end of the second end portion of the elastic terminal; The third arc-shaped structure and the fourth arc-shaped structure are independent of each other or intersecting with each other.

6. The electronic module assembly according to claim 5, characterized in that: The third arc structure and the fourth arc structure are both single arc structures; or the third arc structure and the fourth arc structure are both at least two continuous arc structures; When the third arc structure and the fourth arc structure are both at least two continuous arc structures, and the third arc structure and the fourth arc structure are in a mutually intersecting form, the arc structure at the end of the third arc structure and the arc structure at the end of the fourth arc structure intersect with each other.

7. The electronic module assembly according to claim 1, wherein: Also includes: a first metal layer located on a side of the electronic component away from the substrate; the first metal layer having a size larger than that of the electronic component; a second metal layer located on a side of the substrate away from the electronic component; the second metal layer having a size larger than that of the electronic component; The detachable structural component is used to penetrate the first metal layer, the second metal layer and the substrate and fix the first metal layer and the second metal layer.

8. The electronic module assembly according to claim 7, characterized in that: The detachable structural member includes screws and nuts; The screw is used to penetrate the first metal layer, the second metal layer and the substrate; The nut is used to apply an axial pre-tightening force to clamp and fix the first metal layer and the second metal layer by engaging with the thread of the screw, so as to fix the substrate and the electronic component.

9. A method for manufacturing an electronic module assembly according to any one of claims 1 to 8, characterized in that: include: aligning the first end portion of the elastic terminal of the connector with the contact point of the substrate; Placing an electronic component at a preset position on the substrate so that a contact point of the electronic component is aligned with the second end of the elastic terminal to form an electrical path; The detachable structural member is passed through the fixing hole on the substrate, and the substrate and the electronic component are fixed.

10. An electronic device, characterized in that: The electronic module assembly comprises the electronic module assembly according to any one of claims 1 to 8.

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