Electronic structural component with vapor chamber structure and manufacturing method

Abstract

The invention relates to an electronic structural member with a vapor chamber structure and a manufacturing method, the electronic structural member comprises an electronic structural member body, an evaporation working medium groove is directly and integrally formed on at least part of the electronic structural member body, and at least one condensation plate is arranged on the evaporation working medium groove. And at least one working medium cavity is formed between the evaporation working medium groove and the condensation plate, and a liquid absorption core is arranged in the working medium cavity. The electronic structural member has the advantages that the working medium cavity with the built-in liquid absorption core is directly and integrally formed on the electronic structural member body, interface contact thermal resistance caused by a split type design is eliminated, the heat transfer efficiency is remarkably improved, meanwhile, distributed evaporation working medium grooves are allowed to be arranged in different areas of the structural member, and therefore the electronic structural member is adaptive to multi-heat-source or non-uniform heat flow distribution; local overheating is effectively avoided, and meanwhile the overall size is reduced.

Description

Technical Field

[0001] The present invention belongs to the field of digital accessories, and in particular relates to an electronic structural component with a temperature equalizing plate structure and a manufacturing method thereof. Background Art

[0002] In recent years, electronic components have increasingly shown a trend of miniaturization and high power consumption. How to solve the problem of performance degradation of electronic components due to high heat generation has attracted widespread attention. Among them, heat pipe two-phase cooling equipment has become an efficient heat transfer device due to the large thermal conductivity generated by phase change. The heat spreader is composed of a sealed container, a capillary structure and a working fluid. To ensure that the heat spreader has efficient heat exchange performance, the outer shell is usually made of a material with high thermal conductivity, and a liquid wick is attached around the inner wall. To meet the pressure resistance requirements, some heat spreaders are designed with solid columns, sintered columns or liquid wicks attached to the outer surface of the solid column to form a sintered ring. When heat is applied to the bottom of the heat spreader, the liquid evaporates as the heat increases, and the vapor rises to the top of the container to produce condensation, and relies on the liquid wick to return to the evaporation surface to form a cycle.

[0003] In the existing technology, the temperature vapor chamber and heating element of electronic components usually adopt a split design. Its single evaporator-single condenser structure is difficult to adapt to multiple heat sources or non-uniform heat flow distribution scenarios, which can easily lead to local overheating. At the same time, the solution of connecting multiple independent temperature vapor chambers in series / parallel on the heating element requires complex piping connections, which not only increases additional interface thermal resistance but also increases the system volume. Summary of the Invention

[0004] The purpose of the present invention is to address the above-mentioned problems and provide an electronic structural component with a temperature distribution plate structure and a manufacturing method thereof that can solve the above-mentioned technical problems.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions: An electronic structural component with a temperature equalizing plate structure includes an electronic structural component body, an evaporation working fluid groove directly and integrally formed on at least a portion of the electronic structural component body, at least one condensation plate is provided on the evaporation working fluid groove, and at least one working fluid cavity is formed between the evaporation working fluid groove and the condensation plate, and a liquid absorption core is provided in the working fluid cavity.

[0006] Furthermore, two working medium cavities connected in parallel or in series are formed between the evaporating working medium tank and the condensing plate.

[0007] Furthermore, there are two evaporation working medium tanks and two condensation plates, each evaporation working medium tank is paired with one condensation plate, and the working medium chambers are formed between the two, and the working medium chambers are connected in parallel.

[0008] Furthermore, there are two evaporation working medium tanks and one condensation plate, and two working medium chambers connected in series are formed between the two evaporation working medium tanks and the condensation plate.

[0009] Furthermore, the two working medium chambers connected in series are connected via a through-hole area, and the through-hole area is provided on the condensation plate or on at least a portion of the electronic structural component body.

[0010] Furthermore, the absorbent core is a capillary structure absorbent core, and the capillary density or thickness of the capillary structure absorbent core changes in a gradient along at least one direction.

[0011] Furthermore, the inner surface of the condensation plate is provided with a hydrophilic / hydrophobic matrix.

[0012] Furthermore, a heat dissipation structure is provided on the outer surface of the condensation plate, and the heat dissipation structure includes at least one of heat dissipation fins, microchannels and thermoelectric cooling modules.

[0013] A method for manufacturing an electronic structural component with a temperature-vaporizing plate structure, using the electronic structural component with a temperature-vaporizing plate structure, the manufacturing method comprises the following steps: S1. An evaporation medium tank is directly and integrally formed on at least a portion of the electronic structural component body; S2, fixing the prefabricated liquid wick to the evaporation working medium tank; S3, fixing the condensation plate to the notch of the evaporation working medium tank, and leaving at least one unclosed opening between the notch of the condensation plate and the evaporation working medium tank; S4, injecting the working medium into the evaporation working medium tank from the unclosed opening, and then evacuating the working medium tank. When the vacuum value reaches a predetermined value, the unclosed opening is closed in a vacuum environment, thereby obtaining the electronic structural component with the temperature distribution plate structure.

[0014] Furthermore, in S1, a capillary structure is provided at the bottom of the evaporating working medium tank; and the capillary density of the capillary structure changes gradually from the heat source area to the cold source area.

[0015] Compared with the existing technology, the advantages of this application are: by directly forming an evaporation working fluid tank on the electronic structural part body and covering the condensation plate to form a working fluid cavity with a built-in liquid absorption core, a high degree of integration of the temperature equalizing plate evaporation structure and the heat source carrying body is achieved, which not only completely eliminates the interface contact thermal resistance brought by the split design, but also significantly improves the heat transfer efficiency; this integrated design allows the flexible setting of distributed evaporation working fluid tanks in different areas of the structural part body, thereby adapting to multiple heat sources or non-uniform heat flow distribution, effectively avoiding local overheating; at the same time, it eliminates external pipes and additional mechanical connections, greatly simplifies the system structure, and reduces the overall volume. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a diagram of the assembled finished product of the heat spreader structure of the present invention; Figure 2 for Figure 1 A diagram showing the explosion of the medium temperature plate structure; Figure 3 Figure 2 shows the assembled finished product of the heat spreader structure of the present invention; Figure 4 for Figure 3 Figure 2: Schematic diagram of explosion of the medium temperature plate structure; Figure 5 for Figure 3 Three schematic diagrams of the explosion of the medium temperature plate structure; Figure 6 Four exploded diagrams illustrating the assembly of the heat spreader structure of the present invention; Figure 7 Schematic diagram of the working medium flow direction in the through-area of ​​the temperature homogenizing plate structure of the present invention; Figure 8 A schematic diagram of a wire diameter layout of the capillary wick of the present invention; Figure 9 FIG2 is a schematic diagram of a wire diameter layout of the capillary wick of the present invention; Figure 10 Three diagrams showing a linear layout of the capillary wick of the present invention; Figure 11 Four diagrams are provided to illustrate a wire diameter layout of the capillary wick of the present invention.

[0017] In the figure, the woven mesh core 1, the capillary weft 11, the capillary warp 12, the electronic structural part body 2, the evaporation working medium groove 21, the condensation plate 3, the working medium cavity 4, the liquid absorption core 5, the through area 6, the evaporation section S1, the condensation section S2, and the long-distance condensation direction Y. DETAILED DESCRIPTION

[0018] The present invention will be further described in detail below with reference to the accompanying drawings and examples. It will be understood that the specific embodiments described herein are intended only to illustrate the present invention and are not intended to limit the present invention. It should also be noted that, for ease of description, the accompanying drawings only illustrate portions relevant to the present invention, not all structures.

[0019] In the description of the present invention, unless otherwise expressly specified or limited, the terms "connected," "connected," and "fixed" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention in specific circumstances.

[0020] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Furthermore, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0021] In the description of this embodiment, terms such as "upper," "lower," "right," and "left" are used to refer to positions or locations based on those shown in the accompanying drawings. These terms are intended solely to facilitate description and simplify operation, and are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first" and "second" are used solely for descriptive purposes and have no special meaning.

[0022] Example 1

[0023] like Figure 1-Figure 2 As shown, the surface of the electronic structural component body 2 has a temperature-equalizing plate structure. Specifically, regarding the specific structure of the temperature-equalizing plate, an evaporation working fluid groove 21 is directly integrally formed on at least a portion of the electronic structural component body 2, and at least one condensation plate 3 is provided on the evaporation working fluid groove 21. At the same time, at least one working fluid cavity 4 is formed between the evaporation working fluid groove 21 and the condensation plate 3, and a liquid wick 5 is also provided within the working fluid cavity 4. The liquid wick 5 is a capillary structure liquid wick, and the capillary density or thickness of the capillary structure liquid wick changes gradually from the heat source area to the cold source area. A hydrophilic / hydrophobic matrix is ​​provided on the inner surface of the condensation plate 3. Furthermore, regarding the definition of the electronic structural component body 2, the electronic structural component body 2 is the outer shell of the electronic structural component or an electronic component (heating element, etc.) with a shell inside.

[0024] The notch of the evaporation working fluid groove 21 is airtightly packaged with the condensation plate 3 through a sealing connection structure, together forming a closed steam chamber; the working fluid chamber 4 is filled with a predetermined amount of liquid working fluid; the liquid absorption core 5 covers or fills the inner wall surface of the evaporation working fluid groove 21 and extends to the inner surface area of ​​the condensation plate 3 through a capillary structure.

[0025] During operation, the liquid working medium in the heat-generating area of ​​the electronic structural component body 2 absorbs heat in the evaporating working medium groove 21, undergoing a phase change and evaporating into vapor. Driven by the pressure differential within the working medium chamber 4, the vapor diffuses to the cooler area of ​​the condensing plate 3. On the inner surface of the condensing plate 3, the vapor releases latent heat and condenses into liquid. The condensed liquid working medium is driven by the capillary force generated by the wick 5 and flows back to the evaporating working medium groove 21, completing a cycle. This continuous phase change cycle of the working medium enables efficient heat transfer and diffusion from the heat source area of ​​the electronic structural component body 2 to the condensing plate 3 area.

[0026] Specifically, two or more parallel or series working medium chambers 4 are formed between the evaporating working medium tank 21 and the condensing plate 3, such as Figure 3-Figure 6 As shown, specifically in this embodiment, two evaporation working medium tanks 21 are used as an example, as follows: 1. There are two evaporation working medium tanks 21 and two condensation plates 3. Each evaporation working medium tank 21 is paired with a condensation plate 3, and a working medium chamber 4 is formed between the two. The working medium chambers 4 are connected in parallel, that is, the cavities of the two working medium chambers 4 are independent of each other.

[0027] Second, there are two evaporation working medium slots 21 and one condenser plate 3, forming two serially connected working medium chambers 4 between the two evaporation working medium slots 21 and the condenser plate 3. The two serially connected working medium chambers 4 are connected by a through-hole 6, which is provided on the condenser plate 3 or on at least a portion of the electronic structural component body 2.

[0028] In this embodiment, two evaporation working medium tanks 21 are used as an example. There are two typical structural configurations as follows: 1. Parallel dual-cavity structure: Structural Features: There are two evaporation working fluid tanks 21 and two condensation plates 3. Each evaporation working fluid tank 21 is paired with a condensation plate 3, forming an independent working fluid chamber 4 between them. That is, the first evaporation working fluid tank 21 and the first condensation plate 3 form a first working fluid chamber 4, and the second evaporation working fluid tank 21 and the second condensation plate 3 form a second working fluid chamber 4. The two working fluid chambers 4 are physically isolated from each other in terms of space and vapor / liquid passages, and are independent and connected in parallel.

[0029] Working principle and advantages: Each independent working fluid cavity 4 contains its own evaporation zone, condensation zone, wick 5 and working fluid circulation path. The two cavities each independently operate their internal phase change heat transfer cycle. This structure is particularly suitable for situations where there are two independent heating areas on the electronic structural component body 2 that are physically separated and have uneven heat density distribution. Each working fluid cavity 4 can specifically serve the heating area below it, achieving independent heat dissipation in different zones. At the same time, this parallel structure has the advantage of redundant backup. Even if one of the working fluid cavities 4 fails for some reason (such as leakage), the other can continue to work, thereby improving the reliability of the heat dissipation system.

[0030] 2. Series duplex cavity structure: Structural features: There are two evaporation working fluid grooves 21 and one condensation plate 3. Two working fluid chambers 4 are formed in series between the two evaporation working fluid grooves 21 and the shared condensation plate 3. Specifically, the first evaporation working fluid groove 21 and a part of the area of ​​the condensation plate 3 form a first working fluid chamber 4, and the second evaporation working fluid groove 21 and another part of the area of ​​the condensation plate 3 form a second working fluid chamber 4. The two working fluid chambers 4 in series are connected to each other through a through-hole area 6. The through-hole area 6 can be arranged inside or on the surface of the condensation plate 3, for example, a connecting channel is machined on the surface of the condensation plate, or it can be arranged on at least a part of the electronic structural component body 2, for example, a groove or channel connecting the two evaporation working fluid grooves is machined on the body, and is covered and sealed by the upper condensation plate to form a through-hole channel.

[0031] Working principle and advantages: The two working fluid cavities 4 are connected in the steam space and / or liquid return path through the through-hole area 6, forming a continuous, overall heat transfer circuit with a shared condensation area. Steam can be generated in the two evaporation working fluid grooves 21 and diffuse and condense together to the condensation plate 3; the condensate can be returned across the cavity through the through-hole wick structure or through the through-hole area 6. This structure is particularly suitable when the heat source distribution range on the electronic structural component body 2 is long and the coverage of a single evaporation groove is insufficient. The series structure helps to promote thermal balance between the two evaporation areas, making the surface temperature of the entire temperature plate more uniform, especially when the heat loads of the two evaporation sources are different, the working fluid can flow in the cavity to redistribute a certain amount of heat. In addition, sharing a condensation plate 3 can simplify the structure and may reduce manufacturing costs.

[0032] Regardless of whether a parallel or series structure is adopted, the interior of each working medium chamber 4 follows the aforementioned basic principle of phase change heat transfer of evaporation-condensation-capillary reflux.

[0033] In order to dissipate the heat collected by the condensing plate 3 to the external environment (such as air) more efficiently, a special heat dissipation structure is provided on the outer surface of the condensing plate 3 (i.e., the surface facing away from the working medium chamber 4). The heat dissipation structure includes but is not limited to at least one of the following: Heat dissipation fins: A series of heat dissipation fins with high thermal conductivity (such as aluminum, copper, or their alloys) are directly extended or attached to the outer surface of the condenser plate 3. The fin configuration can be designed as straight ribs, pin ribs, fins, or fin column arrays. Their shape, density, height, and thickness are optimized based on heat dissipation requirements (such as space constraints and wind resistance requirements).

[0034] Working Principle and Advantages: The core function of the heat sink fins is to significantly increase the effective contact surface area between the condenser plate 3 and the ambient fluid. When air (natural convection or forced fan drive) flows through the gaps between the fins, heat is efficiently transferred to the air through convection heat transfer.

[0035] Microchannels: Microchannels are etched, machined, or molded onto the exterior or interior of the condenser plate 3. Driven by a pump, cooling fluid flows through the microchannels. Direct contact between the fluid and the channel walls creates forced convection heat transfer, rapidly removing heat from the condenser plate 3.

[0036] Thermoelectric cooling module: A thermoelectric cooling module is thermally coupled to the outer surface of the condenser plate 3. By adjusting the magnitude and direction of the input current, high-precision and rapid dynamic control of the temperature of the electronic structure body 2 can be achieved.

[0037] Example 2

[0038] The structure and principle of this embodiment are basically the same as those of the first embodiment. The difference lies in that, for the electronic structural component with a temperature vapor chamber structure in the first embodiment, this embodiment describes a method for manufacturing the electronic structural component with a temperature vapor chamber structure.

[0039] S1. An evaporation working medium groove 21 is directly integrally formed on at least a portion of the electronic structural component body 2. Through precision machining, etching, die-casting and other processes, the evaporation working medium groove 21 is directly formed in the target area of ​​the electronic structural component body 2 to ensure a seamless connection between the two. At the same time, a capillary structure with a capillary density that changes gradually from the heat source area to the cold source area is simultaneously formed at the bottom of the groove.

[0040] S2. Fix the prefabricated wick 5 to the evaporation working medium tank 21; precisely place the prefabricated wick 5 with the corresponding capillary density gradient characteristics in the capillary structure area at the bottom of the evaporation working medium tank 21, and achieve a firm fixed connection through processes such as welding or mechanical pressing.

[0041] S3. Fix the condensation plate 3 to the notch of the evaporation working medium tank 21, and reserve at least one unclosed opening between the condensation plate 3 and the notch of the evaporation working medium tank 21; specifically, align the condensation plate 3 with a hydrophilic / hydrophobic matrix on the inner surface and cover it on the notch of the evaporation working medium tank 21, and use a sealing connection technology to fix and seal it along the edge, but at least one small unclosed opening must be deliberately reserved as a channel for subsequent working medium filling and vacuuming.

[0042] S4, injecting the working medium into the evaporation working medium tank 21 from the unclosed port, and then evacuating the working medium tank 21. When the vacuum value reaches a predetermined value, the unclosed port is closed in the vacuum environment, thereby obtaining an electronic structural component with a temperature distribution plate structure.

[0043] Example 3

[0044] The structure and principle of this embodiment are basically the same as those of the first embodiment. The difference lies in that, with respect to the electronic structural component with a temperature distribution plate structure in the first embodiment, this embodiment describes the specific structure of the liquid wick.

[0045] The capillary wick comprises at least one layer of a woven mesh core 1 formed by a plurality of capillary weft threads 11 and a plurality of capillary warp threads 12. The density or diameter of the capillary weft threads 11 varies continuously or in steps along one direction (e.g., the width of the wick), and the density or diameter of the capillary warp threads 12 varies continuously or in steps along another direction angularly distributed with respect to the first direction (e.g., the long-distance condensation direction Y of the wick). In this embodiment, one direction is defined as the direction perpendicular to the heat source diffusion direction, and another direction is defined as the direction from the evaporation section S1 to the condensation section S2.

[0046] Generally speaking, smaller internal pores result in better capillary properties, while larger internal pores minimize resistance to liquid flow and result in higher permeability. However, considering that wick structures made from a single porous medium struggle to simultaneously achieve both superior capillary properties and high permeability, in order to improve the overall hydraulic performance (capillary pressure and permeability) of the wick structure, the characteristics of different wick structures can be combined. This can be achieved by combining two or more single porous media to create a new wick structure, known as a composite wick structure.

[0047] like Figure 8 and Figure 9As shown, the density of several capillary weft threads 11 gradually changes from sparse to dense along a direction (e.g., radially) from the center of the woven mesh core 1 toward the sides, and / or their thread diameter gradually changes from coarse to fine along the same direction. The core of this dual gradient design, from sparse / coarse in the center to dense / fine on the sides, is to actively construct a capillary force gradient field directionally directed from the center to the edges: the capillary force in the central region is relatively weak, while the capillary suction force in the edge regions is significantly enhanced due to the increased number of capillary channels and reduced pore size. Its core advantage lies in optimizing the radial distribution of liquid on the evaporation surface—guiding the liquid to diffuse from the center to the edges, thereby expanding the effective evaporation area, improving temperature uniformity, and particularly helping to mitigate the risk of localized drying in the central high heat flux density area; in the condensation section S2, it can enhance the convergence of condensate at the edges. This radial capillary force gradient works orthogonally with the capillary force gradient formed by the meridians in the long-distance condensation direction Y (or another direction) to form a two-dimensional optimized capillary transport network, which significantly improves the performance of the phase change heat transfer device in terms of liquid distribution uniformity, anti-drying ability and overall thermal performance. It is particularly suitable for application scenarios where the heat source is located directly below the center.

[0048] The density of several capillary meridians 12 gradually changes from dense to sparse along another direction (the long-distance condensation direction Y, i.e., the direction from evaporation section S1 to condensation section S2), and / or the diameter of several capillary meridians 12 gradually changes from thin to thick along the same direction. This design aims to create a gradient field along the long-distance condensation direction Y, in which the capillary suction force decreases from evaporation section S1 to condensation section S2. In the evaporation section S1, the high-density / fine-diameter meridians provide strong capillary force; in the condensation section S2, the low-density / thick-diameter meridians form larger pores, preferentially reducing liquid return resistance and improving liquid circulation efficiency. This capillary force gradient in the long-distance condensation direction Y (strong in evaporation section S1 → weak in condensation section S2) works orthogonally with the capillary force gradient (weak in the center → strong at the edge) created by the aforementioned weft lines in the radial direction. The long-distance condensation direction Y gradient dominates the working fluid circulation (liquid flows back from condensation section S2 to evaporation section S1), while the radial gradient optimizes liquid film uniformity and condensate convergence at the edge of the evaporation section S1. This bidirectional non-uniform woven structure matches the non-uniform heat flux density and significantly improves the device's anti-drying ability.

[0049] As a multiple choice, the distribution mode of the capillary weft threads 11 and the capillary warp threads 12 in this embodiment can also be the same as Figure 11 The non-orthogonal braid shown (i.e., the braid angle θ is not 90°) allows for precise control of the braid angle θ to independently adjust the capillary suction strength and transport resistance of the working fluid along the warp or weft directions, achieving more refined capillary force field customization and further optimizing wick performance.

[0050] The woven mesh core 1 comprises several layers stacked together, with the mesh openings of two adjacent layers arranged in any of a variety of configurations: aligned, offset, or partially aligned and partially offset. A hydrophilic material layer is also applied to the surface of the woven mesh core 1 along its thickness. This significantly increases the total number of capillary channels and specific surface area per unit area, generating a stronger capillary suction force through the synergistic effect of interlayer pores. Furthermore, the multilayer structure supports each other, significantly improving the overall stiffness and compression deformation resistance of the absorbent core, ensuring a stable pore structure under high thermal loads or external pressure.

[0051] At the same time, the distribution methods between meshes have their own advantages: Aligned distribution: Forms vertical capillary channels with good penetration, which is conducive to the rapid transport of liquid in the thickness direction.

[0052] Staggered distribution: The adjacent layers of mesh are staggered to form a more complex three-dimensional interconnected pore network, which increases the tortuosity of the capillary path, effectively improving the lateral liquid diffusion capacity and liquid retention capacity, while enhancing the compressive strength of the structure.

[0053] Mixed distribution: Alignment or staggered design is used in specific areas to achieve localized fine-grained control of capillary performance.

[0054] The specific embodiments described herein are merely illustrative of the spirit of the present invention. Persons skilled in the art may make various modifications, additions, or substitutions to the described specific embodiments without departing from the spirit of the present invention or exceeding the scope of the appended claims.

Claims

1. An electronic structural component with a temperature distribution plate structure, comprising an electronic structural component body (2), characterized in that: An evaporation working medium groove (21) is directly and integrally formed on at least a portion of the electronic structural component body (2), at least one condensation plate (3) is provided on the evaporation working medium groove (21), and at least one working medium cavity (4) is formed between the evaporation working medium groove (21) and the condensation plate (3), and a liquid absorption core (5) is provided in the working medium cavity (4).

2. The electronic structural component with a temperature distribution plate structure according to claim 1, characterized in that: Two parallel or series-connected working medium cavities (4) are formed between the evaporating working medium tank (21) and the condensing plate (3).

3. The electronic structural component with a temperature vapor chamber structure according to claim 2, wherein: There are two evaporation working medium slots (21) and two condensation plates (3), each evaporation working medium slot (21) is paired with one condensation plate (3), and the working medium chamber (4) is formed between the two, and the working medium chambers (4) are connected in parallel.

4. The electronic structural component with a temperature distribution plate structure according to claim 2, characterized in that: There are two evaporation working medium slots (21) and one condensation plate (3), and two working medium chambers (4) connected in series are formed between the two evaporation working medium slots (21) and the condensation plate (3).

5. The electronic structural component with a temperature distribution plate structure according to claim 2 or 4, characterized in that: The two working medium chambers (4) connected in series are communicated via a through-region (6), and the through-region (6) is provided on the condensation plate (3) or on at least a portion of the electronic structural component body (2).

6. The electronic structural component with a temperature vapor chamber structure according to claim 1, characterized in that: The absorbent core (5) is a capillary structure absorbent core, and the capillary density or thickness of the capillary structure absorbent core changes in a gradient along at least one direction.

7. The electronic structural component with a temperature vapor chamber structure according to claim 1, characterized in that: The inner surface of the condensation plate (3) is provided with a hydrophilic / hydrophobic matrix.

8. The electronic structural component with a temperature vapor chamber structure according to claim 1, wherein: The outer surface of the condensation plate (3) is provided with a heat dissipation structure, and the heat dissipation structure comprises at least one of heat dissipation fins, microchannels and a thermoelectric refrigeration module.

9. A method for manufacturing an electronic structural component with a temperature vapor chamber structure, using the electronic structural component with a temperature vapor chamber structure according to any one of claims 1 to 8, characterized in that: The manufacturing method comprises the following steps: S1. An evaporation working medium tank (21) is directly and integrally formed on at least a portion of the electronic structural component body (2); S2, fixing the prefabricated liquid wick (5) to the evaporation working medium tank (21); S3, fixing the condensation plate (3) to the notch of the evaporation working medium tank (21), and leaving at least one unclosed opening in the notches of the condensation plate (3) and the evaporation working medium tank (21); S4, injecting the working medium into the evaporation working medium tank (21) from the unclosed opening, and then performing a vacuum treatment. When the vacuum value reaches a predetermined value, the unclosed opening is closed in a vacuum environment, thereby obtaining the electronic structural component with the temperature equalizing plate structure.

10. The manufacturing method according to claim 9, characterized in that: In S1, a capillary structure is provided at the bottom of the evaporating working medium tank (21); and the capillary density of the capillary structure changes in a gradient from the heat source area to the cold source area.

Images