Heat dissipation device, electronic assembly and vehicle

Abstract

The invention relates to a heat dissipation device, an electronic assembly and a vehicle, the heat dissipation device comprises a shell, a phase change medium and a capillary flow guide structure, and the shell is internally provided with a cavity; the phase change medium is located in the cavity, and the phase change medium and part of the cavity wall of the cavity are arranged in a spaced mode; one end of the capillary flow guide structure is connected with the heat dissipation wall of the cavity, and the other end of the capillary flow guide structure is infiltrated in the phase change medium and can guide the phase change medium towards the heat dissipation wall of the cavity. According to the heat dissipation device, the electronic assembly and the vehicle, after the heat dissipation device is connected with the power device, and the heat dissipation device and the heat dissipation wall of the cavity are located on the same side relative to the heat dissipation device, it can be guaranteed that the power device has a good heat dissipation effect; in addition, the overall structure after the power device and the heat dissipation device are connected can support more installation angles and installation modes, and the overall structure after the power device and the heat dissipation device are connected is supported to change the direction in the working process.

Description

Technical Field

[0001] The present application belongs to the technical field of heat dissipation of power devices, and specifically relates to a heat dissipation device, an electronic component and a vehicle. Background Art

[0002] In current motor controllers, power device heat dissipation is typically achieved through heat transfer via a heat sink. Since heat generated by power devices is typically transferred upward, after assembly with a heat sink, the power device must remain at the bottom of the heat sink to facilitate heat transfer between the device and the liquid phase-change material within the heat sink. This results in a single location relative to the heat sink. Summary of the Invention

[0003] The object of the present invention is to provide a heat dissipation device, an electronic component and a vehicle. After the heat dissipation device is connected to the power device and the heat dissipation wall of the cavity is located on the same side relative to the heat dissipation device, it can not only ensure that the power device has a good heat dissipation effect, but also enable the overall structure after the power device and the heat dissipation device are connected to support more installation angles and installation forms, and support the overall structure after the power device and the heat dissipation device are connected to change direction during operation.

[0004] A first aspect of the present invention discloses a heat dissipation device, which includes a shell, a liquid phase change medium and a capillary guide structure, wherein a cavity is provided in the shell; the phase change medium is located in the cavity and is spaced apart from part of the cavity wall; one end of the capillary guide structure is connected to the heat dissipation wall of the cavity, and the other end of the capillary guide structure is immersed in the phase change medium and can guide the phase change medium toward the heat dissipation wall of the cavity.

[0005] In an exemplary embodiment, the capillary guide structure includes a plurality of capillaries, which are spaced apart from each other and are all connected to the heat dissipation wall of the cavity.

[0006] In an exemplary embodiment, the cross section of the capillary tube is a triangular ring.

[0007] In an exemplary embodiment, the heat dissipation device also includes a plurality of diffusion parts connected to the heat dissipation wall of the cavity, and a diffusion groove is provided between each of the diffusion parts; the capillary guide structure is connected to the heat dissipation wall of the cavity through the diffusion parts and is arranged corresponding to the diffusion groove.

[0008] In an exemplary embodiment, in a direction from the capillary guide structure toward the heat dissipation wall of the cavity: the cross-section of the diffusion portion gradually decreases.

[0009] In an exemplary embodiment, the heat dissipation device also includes a plurality of first heat dissipation tubes and a plurality of second heat dissipation tubes connected to the side circumference of the shell and located outside the cavity, and the plurality of first heat dissipation tubes and the plurality of second heat dissipation tubes are symmetrically arranged on two opposite sides of the side circumference about the center of the shell; both ends of the plurality of first heat dissipation tubes are connected to the cavity; both ends of the plurality of second heat dissipation tubes are connected to the cavity; wherein, both ends of the first heat dissipation tube and both ends of the second heat dissipation tube have a height difference.

[0010] In an exemplary embodiment, the total volume of the multiple first heat dissipation tubes is a; the total volume of the multiple second heat dissipation tubes is b; the total volume of the cavity is c; and the volume of the phase change medium is d; wherein, the relationship between the total volume of the multiple first heat dissipation tubes, the total volume of the multiple second heat dissipation tubes, the total volume of the cavity, and the volume of the phase change medium is: a / 2+b / 2+c≥d.

[0011] In an exemplary embodiment, the housing is provided with an insulating heat dissipation plate, and the insulating heat dissipation plate is located between the top of the housing and the power device.

[0012] A second aspect of the present invention discloses an electronic component, comprising a power device and the above-mentioned heat dissipation device, wherein the power device is connected to the heat dissipation device and is located on top of the heat dissipation device.

[0013] A third aspect of the present invention discloses a vehicle, comprising a vehicle body and the above-mentioned electronic component, wherein the electronic component is connected to the vehicle body.

[0014] The solution of the present invention has the following beneficial effects:

[0015] In the present invention, when the power device is connected to the heat sink and is located on the same side of the heat sink as the heat sink wall of the cavity (which may be the top wall, bottom wall or side wall of the cavity, and specifically changes accordingly with the rotation of the heat sink), if the power device rotates with the heat sink until the power device is directly above the heat sink (that is, the liquid phase change medium is located below the power device), the liquid phase change medium below the power device can be guided toward the heat sink wall of the cavity by the capillary guide structure, thereby dissipating the heat of the power device; if the power device rotates with the heat sink until the power device is located below the heat sink (that is, the liquid phase change medium is located above the power device), the power device can be cooled directly by the phase change medium under the action of gravity; if the power device rotates with the heat sink to an inclined state, the liquid phase change medium can also dissipate the heat of the power device under the action of gravity or the action of the capillary guide structure.

[0016] In summary, after the power device is connected to the heat sink and is located on the same side of the heat sink as the heat sink wall of the cavity, the whole formed by the power device and the heat sink can support more installation angles and installation forms, and also support the change of direction of the whole formed by the power device and the heat sink during operation.

[0017] It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The accompanying drawings herein are incorporated into and constitute a part of the specification, illustrate embodiments consistent with the present application, and together with the specification, are used to explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without inventive effort. Among them, the drawings herein are used to illustrate the inventive concept of the present application and are not completely equivalent to the structure of the actual product protected by the present application.

[0019] Figure 1 FIG2 shows a front view of the heat dissipation device in an embodiment of the present invention.

[0020] Figure 2 An embodiment of the present invention is shown Figure 1 Schematic diagram of the cross-sectional structure of the heat dissipation device along the section line AA.

[0021] Figure 3 An embodiment of the present invention is shown Figure 2 Schematic diagram of the enlarged structure of the heat dissipation device I in FIG.

[0022] Figure 4 An embodiment of the present invention is shown Figure 1 Schematic diagram of the cross-sectional structure of the heat dissipation device along the cross-sectional line BB.

[0023] Figure 5 An embodiment of the present invention is shown Figure 2 Schematic diagram of the enlarged structure of the heat dissipation device II.

[0024] Description of reference numerals:

[0025] 10. Heat dissipation device; 11. Housing; 12. Capillary tube; 13. Diffusion portion; 14. First heat dissipation pipe; 15. Second heat dissipation pipe; 16. Insulating heat dissipation plate; 101. Cavity; 102. Diffusion groove; 20. Power device. DETAILED DESCRIPTION

[0026] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this application will be thorough and complete and will fully convey the concepts of the example embodiments to those skilled in the art.

[0027] In addition, described feature, structure or characteristic can be combined in one or more embodiments in any suitable manner.In the following description, many specific details are provided so as to provide a full understanding of the embodiments of the present application. However, it will be appreciated by those skilled in the art that the technical scheme of the present application can be put into practice without one or more of the specific details, or other methods, components, devices, steps etc. can be adopted. In other cases, known methods, devices, implementations or operations are not shown or described in detail to avoid blurring the various aspects of the application.

[0028] The present application is further described below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the technical features involved in the various embodiments of the present application described below can be combined with each other as long as they do not conflict with each other. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present application, and should not be understood as limiting the present application.

[0029] Combine Figures 1 to 5 As shown, this embodiment provides a heat dissipation device 10. The heat dissipation device 10 is used to dissipate heat from a power device 20.

[0030] It should be understood that power devices 20 (power semiconductor devices) are core components in the field of power electronics, primarily used to process electrical energy and capable of handling high voltages and high currents. Typical functions include power conversion, amplification, switching, rectification, and inversion, and they are widely used in fields such as renewable energy generation and ultra-high voltage transmission systems. Common power devices 20 include thyristors (SCRs) and insulated gate bipolar transistors (IGBTs).

[0031] In this embodiment, the power device 20 is specifically applied in a motor controller of a vehicle.

[0032] Figure 2 An embodiment of the present invention is shown Figure 1 The cross-sectional structure diagram of the heat dissipation device along the cross-sectional line AA, combined with Figure 2 As shown, the heat dissipation device 10 includes a housing 11 , and a cavity 101 is defined in the housing 11 . The cavity 101 is used to store a phase change medium (not shown).

[0033] For example, the housing 11 may be a square structure.

[0034] In an exemplary embodiment of the present application, heat sink 10 further includes a phase-change medium. The phase-change medium is located within cavity 101 and spaced apart from a portion of the cavity wall of cavity 101 to leave space for the phase-change medium to convert from gas to liquid. When heat sink 10 is not dissipating heat from power device 20, the phase-change medium is in a liquid state.

[0035] It should be understood that phase change media can be divided into organic and inorganic phase change materials. Acetone, ethanol, or other solutions with a boiling point between 50°C and 90°C are commonly used. The process by which the phase change medium changes its physical properties is called a phase change, during which the phase change material absorbs or releases a large amount of latent heat.

[0036] In an exemplary embodiment of the present application, the heat dissipation device 10 also includes a capillary guide structure, one end of which is connected to the heat dissipation wall of the cavity 101, and the other end of which is immersed in the phase change medium and can guide the phase change medium toward the heat dissipation wall of the cavity 101.

[0037] It should be understood that the heat dissipation wall may be a top wall, a bottom wall or a side wall of the cavity 101 , and specifically changes accordingly with the rotation of the heat dissipation device 10 .

[0038] For example, when the power device 20 is connected to the heat sink 10, the power device 20 and the heat sink 10 are rotated as a whole until the power device 20 is located below the heat sink 10, and the heat sink wall is the bottom wall of the cavity 101; when the power device 20 and the heat sink 10 are rotated as a whole until the power device 20 is located above the heat sink 10, the heat sink wall is the top wall of the cavity 101, and so on.

[0039] In the present invention, when the power device 20 is connected to the heat sink 10 and is located on the same side as the heat dissipation wall of the cavity 101, if the power device 20 rotates along with the heat sink 10 until the power device 20 is located directly above the heat sink 10 (that is, the liquid phase change medium is located below the power device 20), the liquid phase change medium below the power device 20 can be guided toward the heat dissipation wall of the cavity 101 through the capillary guide structure, thereby dissipating the heat of the power device 20; if the power device 20 rotates along with the heat sink 10 until the power device 20 is located below the heat sink 10 (that is, the liquid phase change medium is located above the power device 20), the power device 20 can be cooled directly through the phase change medium under the action of gravity; if the power device 20 rotates to an inclined state along with the heat sink 10, the liquid phase change medium can also dissipate heat for the power device 20 under the action of gravity or the action of the capillary guide structure.

[0040] In an exemplary embodiment of the present application, the capillary guide structure is made of fabric or glass. Of course, in other exemplary embodiments, the capillary guide structure may also be made of quartz, polytetrafluoroethylene, or metal.

[0041] Combine Figure 2 and Figure 4 As shown, the capillary guide structure includes a plurality of capillaries 12 , which are spaced apart from each other and connected to the heat dissipation wall of the cavity 101 , thereby being able to guide the phase change medium to various locations of the heat dissipation wall of the cavity 101 .

[0042] In an exemplary embodiment of the present application, the intervals between the capillaries 12 in the plurality of capillaries 12 are equal.

[0043] Further, Figure 3 An embodiment of the present invention is shown Figure 2 The enlarged structural diagram of the heat dissipation device I in the figure is as follows: Figure 4 An embodiment of the present invention is shown Figure 1 The cross-sectional structure diagram of the heat dissipation device along the cross-sectional line BB, combined with Figure 3 and Figure 4 As shown, the heat dissipation device 10 further includes a plurality of diffusion parts 13 connected to the heat dissipation wall of the cavity 101 , and diffusion grooves 102 are provided between each diffusion part 13 .

[0044] For example, multiple diffusion portions 13 are arranged in N rows and M columns on the heat dissipation wall of the cavity 101. The diffusion trenches 102 include first trenches between two adjacent rows of diffusion portions 13 and second trenches between two adjacent columns of diffusion portions 13. Each first trench is connected to each second trench, thereby forming the diffusion trenches 102.

[0045] Furthermore, the capillary guide structure is connected to the heat dissipation wall of the cavity 101 through the diffusion portion 13 and is arranged corresponding to the diffusion groove 102 .

[0046] In an exemplary embodiment of the present application, after the capillary guide structure is connected to the heat dissipation wall of the cavity 101 through the diffusion portion 13 and is arranged corresponding to the diffusion groove 102, the diffusion portion 13 can separate the capillary guide structure from the heat dissipation wall of the cavity 101, thereby facilitating the capillary guide structure to guide the liquid phase change medium out of the capillary guide structure to enter the diffusion groove 102.

[0047] For example, when the capillary guide structure is a capillary tube 12, and the capillary tube 12 is connected to the diffusion portion 13, the capillary pores in the capillary tube 12 (the capillary pores are used to guide the phase change medium) are arranged corresponding to the diffusion groove 102, and the capillary pores are connected to the diffusion groove 102. When the capillary tube 12 guides the phase change medium through the diffusion groove 102 to the heat dissipation wall, the diffusion portion 13 separates the capillary tube 12 from the heat dissipation wall of the cavity 101, thereby preventing the capillary pores of the capillary tube 12 from being blocked by the heat dissipation wall of the cavity 101.

[0048] In an exemplary embodiment of the present application, Figure 4 and Figure 5 As shown, the capillary pores of the capillary tube 12 are also arranged corresponding to a portion of the diffuser 13. The material of the diffuser 13 also has a certain capillary effect. In this case, the capillary tube 12 can guide the liquid phase change medium to the diffuser 13 through the capillary effect, and then guide the liquid phase change medium to the heat dissipation wall through the diffuser 13.

[0049] For example, the diffusion portion 13 may be formed of materials such as fabric.

[0050] In an exemplary embodiment of the present application, Figure 3 As shown, the cross-section of the diffusion portion 13 gradually decreases from the capillary guide structure toward the heat dissipation wall of the cavity 101, so that the shape of the first groove or the second groove corresponding to two adjacent rows or columns of diffusion portions 13 is a trapezoidal groove that is narrow at the bottom and wide at the top (narrow on the side close to the capillary guide structure and wide on the side close to the heat dissipation wall), thereby having a certain capillary effect to better guide the phase change medium to the heat dissipation wall of the cavity 101.

[0051] In an exemplary embodiment of the present application, Figures 2 to 5 As shown, each capillary tube 12 of the capillary guide structure can guide the phase change medium to the corresponding diffusion portion 13 and diffusion groove 102 through the capillary effect, and then disperse the phase change medium to various areas of the heat dissipation wall of the cavity 101, so as to improve the uniformity of the phase change medium in the heat dissipation wall of the cavity 101.

[0052] In an exemplary embodiment of the present application, the cross section of the capillary tube 12 is a triangular ring.

[0053] Of course, in other exemplary embodiments, the cross section of the capillary tube 12 may be a circular ring or a rectangular ring.

[0054] It should be understood that compared to capillary tubes 12 having other cross-sectional shapes (e.g., circular or rectangular rings, particularly circular rings), the triangular ring cross-sectional shape of capillary tube 12, due to its sharp internal angles, can produce a stronger capillary effect when the liquid can wet the tube wall, primarily manifested in a higher capillary rise height. This is because the triangular ring cross-sectional shape utilizes the "corner effect" of its geometric shape to amplify the capillary force, making it superior to cross-sectional shapes lacking such sharp corners (e.g., circular) in terms of liquid lifting capacity.

[0055] Furthermore, a rough structure (not shown) may be provided on the inner wall of the capillary tube 12 to increase the roughness of the capillary tube 12 and thereby enhance the capillary effect.

[0056] For example, the rough structure may be a prism or pyramid structure protruding from the inner wall of the capillary 12 .

[0057] In an exemplary embodiment of the present application, Figure 1 and Figure 4 As shown, the heat dissipation device 10 further includes a plurality of first heat dissipation tubes 14 and a plurality of second heat dissipation tubes 15 connected to the side circumference of the housing 11 and located outside the cavity 101. Both ends of the plurality of first heat dissipation tubes 14 are in communication with the cavity 101; both ends of the plurality of second heat dissipation tubes 15 are in communication with the cavity 101. The plurality of first heat dissipation tubes 14 and the plurality of second heat dissipation tubes 15 are symmetrically arranged on two opposite sides of the side circumference about the center of the housing 11.

[0058] The two opposite sides of the side surface refer to two opposite side surfaces along the width direction or thickness direction of the housing 11. In addition, the top and bottom of the housing 11 are arranged opposite to each other along the height direction of the housing 11, and the top and bottom of the cavity 101 are arranged opposite to each other along the height direction of the housing 11.

[0059] For example, the heat dissipation device 10 includes six first heat dissipation tubes 14, and the four first heat dissipation tubes 14 are evenly distributed in an array (for example, 2 rows and 3 columns) on the left side of the shell 11; the heat dissipation device 10 includes six second heat dissipation tubes 15, and the four second heat dissipation tubes 15 are evenly distributed in an array (for example, 2 rows and 3 columns) on the right side of the shell 11.

[0060] It should be understood that when both ends of the first heat pipe 14 are connected to the cavity 101, the phase change medium can flow from the cavity 101 through one end of the first heat pipe 14 into the first heat pipe 14 and flow back into the cavity 101 from the other end of the first heat pipe 14. When both ends of the second heat pipe 15 are connected to the cavity 101, the phase change medium can flow from the cavity 101 through one end of the second heat pipe 15 into the second heat pipe 15 and flow back into the cavity 101 from the other end of the second heat pipe 15. The function of the first heat pipe 14 and the second heat pipe 15 is to release the heat carried by the gaseous phase change medium to the outside of the entire heat dissipation device 10.

[0061] In the present invention, the heat sink 10 operates as follows: when the heat sink 10 is not dissipating heat, the phase-change medium is in a liquid state. When the heat sink 10 is used to dissipate heat from the power device 20, the heat generated by the power device 20 is transferred to the top of the housing 11, where it undergoes heat exchange with the liquid phase-change medium directed to the heat dissipation wall of the cavity 101. After absorbing the large amount of heat generated by the power device 20, the phase-change medium transforms from liquid to gas. Finally, the gaseous phase-change medium, cooled by the first and second heat pipes 14 and 15, transforms back into a liquid state, releasing heat.

[0062] Furthermore, the two ends (inlet and outlet) of the first heat dissipation pipe 14 communicating with the cavity 101 have a height difference (generally the inlet is higher than the outlet) to ensure that the liquefied phase change medium can return to the bottom of the cavity 101 by gravity.

[0063] In an exemplary embodiment of the present application, the first heat dissipation pipe 14 and the second heat dissipation pipe 15 are both arc-shaped pipes, which can better rely on gravity to return to the bottom of the cavity 101 compared to heat dissipation pipes of other shapes.

[0064] In an exemplary embodiment of the present application, to ensure that the phase-change medium can convert between liquid and gas, the phase-change medium cannot completely fill the cavity 101, the first heat dissipation tube 14, and the second heat dissipation tube 15. Therefore, when the total volume of the plurality of first heat dissipation tubes 14 is a, the total volume of the plurality of second heat dissipation tubes 15 is b, the total volume of the cavity 101 is c, and the volume of the phase-change medium is d, the relationship between the total volume of the plurality of first heat dissipation tubes 14, the total volume of the plurality of second heat dissipation tubes 15, the total volume of the cavity 101, and the volume of the phase-change medium is: a / 2 + b / 2 + c ≥ d.

[0065] Preferably, when the phase change medium is filled in the cavity 101 and the heat dissipation device 10 is not dissipating heat, at least a portion of the multiple first heat dissipation tubes 14 and the multiple second heat dissipation tubes 15 on the left and right sides of the shell 11 (specifically, the first heat dissipation tubes 14 and the second heat dissipation tubes 15 closest to the top of the shell) will not be filled with the phase change medium, so that the vaporized phase change medium enters the first heat dissipation tubes 14 and the second heat dissipation tubes 15 to release heat, and is converted into liquid phase change medium and then flows into the cavity 101.

[0066] Combine Figure 2 and Figure 3 As shown, the housing 11 is provided with an insulating heat dissipation plate 16 . The insulating heat dissipation plate 16 is located on the top of the housing 11 and is used to contact the power device 20 .

[0067] It should be understood that when the power device 20 is installed on the insulating heat sink 16 and begins to generate a large amount of heat, the insulating heat sink 16 not only isolates the current between the power device 20 and the heat sink 10, but also plays a good heat conduction role, thereby transferring the heat to the heat dissipation wall of the cavity 101 to facilitate the phase change medium to absorb heat.

[0068] In an exemplary embodiment of the present application, the housing 11 includes a top plate, a bottom plate, and a middle frame connected between the top plate and the bottom plate, wherein the cavity 101 is located between the top plate, the bottom plate, and the middle frame.

[0069] It should be understood that the insulating heat dissipation plate 16 is a partial structure of the housing 11 , that is, the insulating heat dissipation plate 16 may be the top plate of the housing 11 .

[0070] For example, the insulating heat dissipation plate 16 may be a ceramic plate, or an insulating heat dissipation plate 16 formed of other insulating and heat-dissipating materials.

[0071] In the present invention, when the power device 20 is connected to the heat sink 10 and is located on the same side as the heat dissipation wall of the cavity 101, if the power device 20 rotates with the heat sink 10 until it is directly above the heat sink 10 (i.e., the liquid phase-change medium is located below the power device 20), the phase-change medium will accumulate at the bottom of the entire cavity 101 due to gravity. The heat generated by the power device 20 will be transferred from top to bottom to the heat dissipation wall of the cavity 101 under the heat conduction of the insulating heat sink 16. Under the action of the capillary principle, the phase-change medium will climb upward along the capillary guide structure and be guided to the multiple diffusion portions 13 and the diffusion grooves 102, and then diffuse to the heat dissipation wall of the entire cavity 101. At this time, the phase-change medium absorbs a large amount of heat and transforms from liquid to gas. Then, under the cooling of the first heat pipe 14 and the second heat pipe 15, the gaseous phase-change medium will release heat and return to liquid form to the bottom of the cavity 101.

[0072] If the power device 20 rotates along with the heat sink 10 until the power device 20 is located directly below the heat sink 10 (i.e., the liquid phase change medium is located above the power device 20), the phase change medium will gather at the bottom of the entire cavity 101 due to gravity. Therefore, the phase change medium can directly absorb the heat emitted by the power device 20, thereby achieving the effect of cooling the power device 20.

[0073] If the power device rotates along with the heat sink until the power device is located below the heat sink (that is, the liquid phase change medium is located above the power device), the power device can be cooled directly through the phase change medium under the action of gravity. If the power device rotates along with the heat sink to an inclined state, the liquid phase change medium can also dissipate heat for the power device under the action of gravity or the action of the capillary guide structure.

[0074] In summary, after the power device is connected to the heat sink and is located on the same side of the heat sink as the heat sink wall of the cavity, the whole formed by the power device and the heat sink can support more installation angles and installation forms, and also support the change of direction of the whole formed by the power device and the heat sink during operation.

[0075] This embodiment further provides an electronic component, including a power device 20 and the heat dissipation device 10 of the above embodiment. The power device 20 is connected to the heat dissipation device 10 and is located on the same side as the heat dissipation wall of the cavity 101 .

[0076] This embodiment also provides a vehicle, including a vehicle body and the above-mentioned electronic component, wherein the electronic component is connected to the vehicle body.

[0077] Regarding other structures of the vehicle, please refer to the existing technology and will not be described here in detail.

[0078] In this application, unless otherwise specified or limited, terms such as "assembly" and "connection" should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, or indirect connection through an intermediate medium; internal communication between two components, or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0079] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, features defined as "first" or "second" may explicitly or implicitly include one or more of the features. "Multiple" means two or more, unless otherwise clearly and specifically defined. And the descriptions of terms such as "some embodiments" and "exemplarily" mean that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application.

[0080] The illustrative descriptions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. In addition, those skilled in the art may combine and integrate different embodiments or examples described in this specification, as well as features of different embodiments or examples, unless they are mutually inconsistent.

[0081] Although the embodiments of the present application have been shown and described above, it should be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application. Therefore, any changes or modifications made in accordance with the claims and description of the present application should fall within the scope of the patent covered by this application.

Claims

1. A heat dissipation device, characterized in that: include: a housing, wherein a cavity is provided in the housing; a liquid phase-change medium, the phase-change medium being located in the cavity and spaced apart from a portion of the cavity wall; A capillary guide structure, one end of which is connected to the heat dissipation wall of the cavity, and the other end of which is immersed in the phase change medium and can guide the phase change medium toward the heat dissipation wall of the cavity.

2. The heat dissipation device according to claim 1, characterized in that: The capillary guide structure includes a plurality of capillaries, which are spaced apart from each other and are all connected to the heat dissipation wall of the cavity.

3. The heat dissipation device according to claim 2, characterized in that: The cross section of the capillary is a triangular ring.

4. The heat dissipation device according to claim 1, wherein: The heat dissipation device further comprises a plurality of diffusion parts connected to the heat dissipation wall of the cavity, and diffusion grooves are provided between each of the diffusion parts; The capillary guide structure is connected to the heat dissipation wall of the cavity through the diffusion portion and is arranged corresponding to the diffusion groove.

5. The heat dissipation device according to claim 4, characterized in that: In a direction from the capillary guide structure toward the heat dissipation wall of the cavity: the cross section of the diffusion portion gradually decreases.

6. The heat dissipation device according to claim 1, characterized in that: The heat dissipation device further includes a plurality of first heat dissipation tubes and a plurality of second heat dissipation tubes connected to the side circumferential surface of the shell and located outside the cavity, wherein the plurality of first heat dissipation tubes and the plurality of second heat dissipation tubes are symmetrically arranged on two opposite sides of the side circumferential surface with respect to the center of the shell; Both ends of the plurality of first heat dissipation pipes are in communication with the cavity; both ends of the plurality of second heat dissipation pipes are in communication with the cavity; Wherein, both ends of the first heat dissipation tube and both ends of the second heat dissipation tube have a height difference.

7. The heat dissipation device according to claim 6, characterized in that: The total volume of the plurality of first heat dissipation pipes is a; the total volume of the plurality of second heat dissipation pipes is b; the total volume of the cavity is c; and the volume of the phase change medium is d; The relationship among the total volume of the plurality of first heat dissipation tubes, the total volume of the plurality of second heat dissipation tubes, the total volume of the cavity and the volume of the phase change medium is: a / 2+b / 2+c≥d.

8. The heat dissipation device according to claim 1, wherein: The housing is provided with an insulating heat dissipation plate, and the insulating heat dissipation plate is located between the housing and the power device.

9. An electronic component, characterized in that: The heat dissipation device comprises a power device and the heat dissipation device according to any one of claims 1 to 8, wherein the power device is connected to the heat dissipation device.

10. A vehicle, characterized in that: The vehicle comprises a vehicle body and the electronic component according to claim 9, wherein the electronic component is connected to the vehicle body.

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